CN113534995B - TDDI chip shared by SPI interfaces - Google Patents
TDDI chip shared by SPI interfaces Download PDFInfo
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- CN113534995B CN113534995B CN202110707109.9A CN202110707109A CN113534995B CN 113534995 B CN113534995 B CN 113534995B CN 202110707109 A CN202110707109 A CN 202110707109A CN 113534995 B CN113534995 B CN 113534995B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04162—Control or interface arrangements specially adapted for digitisers for exchanging data with external devices, e.g. smart pens, via the digitiser sensing hardware
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4004—Coupling between buses
- G06F13/4022—Coupling between buses using switching circuits, e.g. switching matrix, connection or expansion network
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
- G06F13/4286—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus using a handshaking protocol, e.g. RS232C link
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
Abstract
The invention belongs to the technical field of TDDI chips, and particularly relates to a TDDI chip shared by SPI interfaces, which comprises a data selector group, a touch module and a display module, wherein the touch module and the display module are respectively connected with corresponding ports of the data selector group through SPI _ TP and SPI _ DP; the data selector group is connected with an external structure through the SPI. In a TDDI chip integrating a touch module and a display module, the touch module needs to use an SPI interface to interact with an external system main chip, and the system main chip downloads an application file required by the operation of the touch module through the SPI interface; and the display module transmits image data and control commands using the SPI. This application reaches the purpose of touch module and display module timesharing multiplex SPI interface in the TDDI chip through control, has realized the original function of chip promptly so and has also reduced the line quantity of system board level design.
Description
Technical Field
The invention belongs to the technical field of TDDI chips, and particularly relates to a TDDI chip shared by SPI interfaces.
Background
In globalization today, the development of electronic products is also a day-to-day change, and electronic products which are creative and closely related to human life are continuously emerging. Touch screens are connected with many electronic products, and the touch screens comprise display and touch functions.
The touch and display functions of the smart phone are independently controlled by the two chips, and the TDDI is mainly characterized in that the touch chip and the display chip are integrated into a single chip.
The TDDI chip has the following characteristics:
(1) the sensitivity of whole response is promoted, has reduced the display noise, has improved touch-control performance.
(2) The appearance is thinner, and touch sensor is integrated to the display, can make the screen thinner, has satisfied the design demand that electronic product is frivolous.
(3) The cost is reduced, the number of components is reduced for equipment manufacturers, and the overall cost of the system is reduced.
The TDDI chip is used for intelligent wearing equipment, and because the whole area of the intelligent wearing equipment is smaller, fewer pins are connected when the main chip of the system is connected with other peripheral chips, and the better the connection is. In the TDDI chip, the display module and the touch module need to interact with the outside through the SPI interface.
The TDDI chip internally comprises a touch module and a display module. The touch module needs to use an SPI (serial peripheral interface) interface to interact with an external system main chip, and the system main chip can download an application file (App) required by the work of the touch module through the SPI interface; and the display module transmits image data and control commands using the SPI.
In the conventional scheme, the touch module and the display module respectively use one SPI interface, or the touch module downloads an application file (App) by using an I2C interface, as shown in fig. 2.
The simple timing diagram of the SPI protocol is shown below, where CS is a chip select signal, SCLK is a clock signal, SI/SO is a data transmission line, and two-wire SPI (two data transmission lines) is illustrated in the figure, thus requiring 4 pins for external interaction. Some IC designs require four data lines, and a total of 6 pins and external interaction. If the touch module and the display module use one SPI interface respectively to interact with the outside, at least 4 signal lines are added. Therefore, the whole board-level system needs to add a 4-pin connection line, which increases the design complexity, and the basic timing diagram of SPI is shown in fig. 3.
If the touch module uses an I2C module to interact with an external system, although pins are saved, the time cost of communication is increased because the communication speed of the I2C module is lower than the SPI.
Disclosure of Invention
In order to reduce the design complexity of a board-level system while considering the communication speed, the invention provides a common TDDI chip for an SPI interface, and the specific scheme is as follows:
a TDDI chip shared by SPI interfaces comprises a data selector group, a touch module and a display module, wherein the touch module and the display module are respectively connected with a corresponding port of the data selector group through SPI _ TP and SPI _ DP; the data selector group is connected with an external host through the SPI.
Specifically, the system further comprises an or gate, wherein the touch module and the display module are respectively connected with two input ends of the or gate through an SPI _ SEL _ FW pin and an SPI _ SEL _ host pin, an output end of the or gate is connected with a controlled end of a data selector group, the data selector group realizes information interaction with a host through an SPI, and the display module realizes information interaction with the host through an MIPI.
Specifically, the host has a touch display electronic device.
Specifically, the data selector group comprises a first data selector unit A connected with the touch module, a second data selector unit B connected with the display module, and a third data selector C connected with both the touch module and the display module, wherein the first data selector unit A and the second data selector unit B each comprise three selector sub-components; the first data selector unit a comprises a data selector A1, a data selector A2 and a data selector A3, and the second data selector unit B comprises a data selector B1, a data selector B2 and a data selector B3.
Specifically, the Host sends a CS signal, a CLK signal and a DATA signal to corresponding selector subcomponents in the first DATA selector unit a and the second DATA selector unit B through an SPI _ CS interface, an SPI _ CLK interface and an SPI _ DATA interface, respectively, and output ends of all selector subcomponents in the first DATA selector unit a and the second DATA selector unit B are connected to corresponding input ends of the touch module and the display module, respectively; the touch control module and the display module are respectively connected with the input end of a third DATA selector C through a DATA signal output end, and the output signal of the third DATA selector C is connected with an SPI _ DATA pin through a PAD.
Specifically, the other input terminals of the data selector A1 and the data selector B1 input a signal 1'B1, the other input terminals of the data selector A2 and the data selector B2 input a signal 1' B1, and the other ports of the data selector A3 and the data selector B3 input 2'B11 or 4' B1111, respectively.
Specifically, when any one of the touch module or the display module needs to perform a handshake protocol, the other side is informed of the current need, the SPI is used for data access, and the SPI is switched after the handshake is successful;
when SPI _ SEL is 0, the first DATA selector unit a selects a signal transmitted from the Host, the DATA selector B1 and the DATA selector B2 select 1' B1 as an input signal, the DATA selector B3 selects 2' B11 or 4' B1111 as an input signal, and the third DATA selector C selects a signal output from the SPI _ DATA _ O _ TP pin as an output signal;
when SPI _ SEL is 1, the second DATA selector unit B selects a signal transmitted from the Host, DATA selector A1 and DATA selector A2 select 1' B1 as an input signal, DATA selector A3 selects 2' B11 or 4' B1111 as an input signal, and the third DATA selector C selects a signal output from the SPI _ DATA _ O _ DP pin as an output signal.
The invention has the beneficial effects that: in a TDDI chip integrating a touch module and a display module, the touch module needs to use an SPI interface to interact with an external system main chip, and the system main chip downloads an application file (App) required by the touch module through the SPI interface; and the display module transmits image data and control commands using the SPI. The purpose of time-sharing multiplexing SPI interface of touch module and display module in TDDI chip is reached through control to this application, has realized that the original function of chip has also reduced the line quantity of system board level design like this.
Drawings
Fig. 1 is a schematic diagram illustrating that the touch module and the display module share an SPI interface in the present application.
Fig. 2 is a schematic diagram in a conventional scheme.
Fig. 3 is a timing diagram of SPI in the conventional scheme.
Fig. 4 and 5 are connection diagrams of unit modules of a TDDI chip shared by SPI interfaces according to the present invention.
Detailed Description
A TDDI chip shared by SPI interfaces comprises a data selector group, a touch module and a display module, wherein the touch module and the display module are connected with corresponding ports of the data selector group through SPI _ TP and SPI _ DP respectively. The data selector group is connected with an external host through the SPI, and selects when the interface is used by the touch module and when the SPI interface is used by the display module by controlling the data selector group, as shown in fig. 1.
As shown in fig. 4 and 5, specifically, the display device further includes an or gate, where the touch module and the display module are connected to two input ends of the or gate through an SPI _ SEL _ FW pin and an SPI _ SEL _ Host pin, respectively, an output end of the or gate is connected to a controlled end of a data selector group, the data selector group implements information interaction with a Host through an SPI, the display module implements information interaction with the Host through an MIPI, and the MIPI is used for the Host to transmit image data or other control commands to the display module of the TDDI chip, and control whether the touch module uses the SPI interface or the display module uses the SPI interface at present. The touch module and the display module are connected for handshaking. The host is provided with touch display electronic equipment.
The cpu inside the touch module is configurable, and when the cpu is configured that the touch module uses the SPI interface, the cpu needs to handshake with the display module in advance to determine whether the display module uses the SPI interface currently.
Specifically, the data selector group comprises a first data selector unit A connected with the touch module, a second data selector unit B connected with the display module, and a third data selector C connected with both the touch module and the display module, wherein the first data selector unit A and the second data selector unit B each comprise three selector sub-components; the first data selector unit a comprises a data selector A1, a data selector A2 and a data selector A3, and the second data selector unit B comprises a data selector B1, a data selector B2 and a data selector B3.
The Host comprises an SPI _ CS for sending out a control signal, an SPI _ CLK interface and an SPI _ DATA pin for bidirectional signals, wherein the SPI _ DATA pin is 2 lines or 4 lines. Specifically, the Host sends a CS signal, a CLK signal and a DATA signal to corresponding selector subcomponents in the first DATA selector unit a and the second DATA selector unit B through an SPI _ CS interface, an SPI _ CLK interface and an SPI _ DATA interface, respectively, and output ends of all selector subcomponents in the first DATA selector unit a and the second DATA selector unit B are connected to corresponding input ends of the touch module and the display module, respectively; the touch control module and the display module are respectively connected with the input end of a third DATA selector C through a DATA signal output end, and the output signal of the third DATA selector C is connected with an SPI _ DATA pin through a PAD. The other input terminals of the data selectors A1 and B1 input a signal 1'B1, the other input terminals of the data selectors A2 and B2 input a signal 1' B1, and the other ports of the data selectors A3 and B3 input 2'B11 or 4' B1111, respectively.
When the SPI _ TP and the SPI _ DP are switched, the respective SPI signals need to be processed. The SPI protocol has an input signal and an output signal.
When the touch module is selected to use the SPI module to interact with the Host, the SPI signal sent to the display module needs to be set to 1 in the TDDI chip through the data selector group so as to avoid the influence of an external input signal on the interior of the module, and the SPI data of the touch module is output at the moment,
when the display module is selected to use the SPI module to interact with the Host, the SPI signal sent to the touch module needs to be set to 1 through the data selector group in the TDDI chip so as to avoid the influence of an external input signal on the interior of the module, and at the moment, the SPI data of the display module are output.
Specifically, when SPI _ SEL is 0, the first DATA selector unit a selects a signal transmitted from the Host, the DATA selector B1 and the DATA selector B2 select 1' B1 as an input signal, the DATA selector B3 selects 2' B11 or 4' B1111 as an input signal, and the third DATA selector C selects a signal output from the SPI _ DATA _ O _ TP pin as an output signal;
when SPI _ SEL is 1, the second DATA selector unit B selects a signal transmitted from the Host, DATA selector A1 and DATA selector A2 select 1' B1 as an input signal, DATA selector A3 selects 2' B11 or 4' B1111 as an input signal, and the third DATA selector C selects a signal output from the SPI _ DATA _ O _ DP pin as an output signal.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (3)
1. A TDDI chip shared by SPI interfaces is characterized by comprising a data selector group, a touch module and a display module, wherein the touch module and the display module are respectively connected with corresponding ports of the data selector group through SPI _ TP and SPI _ DP; the data selector group is connected with an external host through the SPI;
the Host sends a CS signal, a CLK signal and a DATA signal to corresponding selector sub-components in the first DATA selector unit A and the second DATA selector unit B through an SPI _ CS interface, an SPI _ CLK interface and an SPI _ DATA interface respectively, and the output ends of all the selector sub-components in the first DATA selector unit A and the second DATA selector unit B are connected with the corresponding input ends of the touch module and the display module respectively; the touch control module and the display module are respectively connected with the input end of a third DATA selector C through a DATA signal output end, and the output signal of the third DATA selector C is connected with an SPI _ DATA pin through a PAD;
the data selector group comprises a first data selector unit A connected with the touch module, a second data selector unit B connected with the display module and a third data selector C connected with the touch module and the display module, and the first data selector unit A and the second data selector unit B respectively comprise three selector sub-components; the first data selector unit A comprises a data selector A1, a data selector A2 and a data selector A3, and the second data selector unit B comprises a data selector B1, a data selector B2 and a data selector B3;
the other input terminals of the data selectors A1 and B1 input a signal 1'B1, the other input terminals of the data selectors A2 and B2 input a signal 1' B1, and the other ports of the data selectors A3 and B3 input 2'B11 or 4' B1111, respectively;
when any one of the touch module or the display module needs to carry out a handshake protocol, the other side is informed of the current need, the SPI is used for data access, and the SPI is switched after the handshake is successful;
when SPI _ SEL is 0, the first DATA selector unit a selects a signal transmitted from the Host, the DATA selector B1 and the DATA selector B2 select 1' B1 as an input signal, the DATA selector B3 selects 2' B11 or 4' B1111 as an input signal, and the third DATA selector C selects a signal output from the SPI _ DATA _ O _ TP pin as an output signal;
when SPI _ SEL is 1, the second DATA selector unit B selects a signal transmitted from the Host, the DATA selectors A1 and A2 select 1' B1 as input signals, the DATA selector A3 selects 2' B11 or 4' B1111 as input signals, and the third DATA selector C selects a signal output from the SPI _ DATA _ O _ DP pin as an output signal.
2. The TDDI chip shared by the SPI interfaces of claim 1, further comprising an OR gate, wherein the touch module and the display module are respectively connected with two input ends of the OR gate through an SPI _ SEL _ FW pin and an SPI _ SEL _ host pin, an output end of the OR gate is connected with a controlled end of a data selector group, the data selector group realizes information interaction with a host through an SPI, and the display module realizes information interaction with the host through an MIPI.
3. The TDDI chip shared by SPI interfaces of claim 2, wherein said host has touch display electronics.
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