CN1135200C - Wafer delivery device with door - Google Patents

Wafer delivery device with door Download PDF

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Publication number
CN1135200C
CN1135200C CNB97117184XA CN97117184A CN1135200C CN 1135200 C CN1135200 C CN 1135200C CN B97117184X A CNB97117184X A CN B97117184XA CN 97117184 A CN97117184 A CN 97117184A CN 1135200 C CN1135200 C CN 1135200C
Authority
CN
China
Prior art keywords
door
wafer
container
arm
locking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB97117184XA
Other languages
Chinese (zh)
Other versions
CN1179007A (en
Inventor
D・L・尼塞施
D·L·尼塞施
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of CN1179007A publication Critical patent/CN1179007A/en
Application granted granted Critical
Publication of CN1135200C publication Critical patent/CN1135200C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Closures For Containers (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A wafer container has an open front defined by a door frame and a door sized for the door frame. The door receiving frame has slots on opposite sides and the door utilizes latching portions that extend and retract from the edge portion of the door into and out of the slots for latching and unlatching the door on the door receiving frame. The door also has wafer engaging arms which extend inwardly toward the wafers to secure said wafers when the door is in place. The retractable latching portions and wafer retaining arms are linked to a rotatable cammed member in the interior of the door. The cammed member utilizes cammed surfaces configured to first latch the door and to then extend the wafer retaining arms.

Description

The chip container of band door
Technical field
The present invention relates to a kind of wafer delivery device.Relate in particular to and a kind ofly have lid or goalkeeper's wafer is enclosed in chip container in the container.
Background technology
In order to store and to transport, used the whole bag of tricks that wafer is enclosed in the container.The loam cake or the cover that have used the wafer perpendicular grooves in some containers and made with resilient flexiplast.When using the loam cake connecting wafer, tie up at the last passive cushion block that covers and to be offset.
Semi-conductor industry has developed into the processing diameter greater than 300 millimeters large-scale wafer, and toter and transfer cask also tend to wafer-level is placed.Loading the required bulk container of wafer makes common passive elastic cushion block be difficult to make and use.
Chip container has the front portion of the opening that is formed by the door installing frame and the door that matches with door installing frame size.Both sides relative on the door installing frame have groove, have used lock latch parts on the door, enter groove or come out from groove thereby the door edge partly stretched out or shrinks, Jiang Men and the pinning of Men installing frame or open.Also have the wafer connecting arm on the door, when door puts in place, can inwardly stretch and fixing above-mentioned wafer towards wafer.Contractile lock latch parts and wafer keeping arm all link with the rotatable cam member of door in-to-in, the cam face on the cam member, and its shape at first can be pinned door, secondly can stretch the wafer keeping arm.
Summary of the invention
Advantages and features of the invention are, the maintenance of wafer also is provided except the locking that door is provided.Above-mentioned locking and keep by door knob one simply to rotatablely move providing.
Another advantage of the present invention and being characterised in that, this mechanism is positioned at the inside of door, makes the generation and the distribution of the particle of a mechanism reach minimum.
Another advantage of the present invention and being characterised in that, the locking that door mechanism provides and keep carrying out with suitable order.
Another advantage of the present invention and be characterised in that a ratchet is arranged on the cam face of rotatable cam member can be fixed door at locked position easily and simply, and at connection location fixed wafer keeping arm.
The present invention proposes the chip container of the horizontal axial array mode of a kind of usefulness with the fixing circular wafer of edge part, container comprises a container parts and a door that matches with it, container parts comprises: the front portion of an opening, an osed top left side, an osed top rear side, an osed top right side, an osed top top, an osed top bottom, the inside of an opening and a rectangle doorframe that has the gate seat that door is installed, when door was installed in the above-mentioned doorframe, door knob had locking member to the marginal portion of wafer on the doorframe; The door that matches comprises: a door shell that has with the outside installing component of doorframe bonded assembly; One can be from rotatable of housing exterior rotation; A locking arm that outwards moves is used for being meshed with the locking member of doorframe; A wafer bindiny mechanism, it comprises a wafer connecting arm of can be inwardly and outwards moving, this wafer bindiny mechanism is connected in this rotatable, thereby when rotating for this rotatable, locking member engagement and wafer connecting arm and Waffer edge partial tooth engagement on this locking arm and the doorframe keep wafer motionless like this.
In addition, door has groove on the installing frame, and locking arm has insertion parts, and insertion parts can be inserted in the groove, with above-mentioned door lock on container part.
Door and wafer bindiny mechanism are such formation, make locking arm and Waffer edge partial tooth engagement.
Rotatable is cam member, have one with locking arm ingear locking cam surface.
In the cam face at least one have one thorny, its position can keep the cam follower of locking arm separately motionless when the wafer connecting arm stretches.
This cam member also has a wafer bindiny mechanism ingear wafer and connects cam face.
Wafer bindiny mechanism comprises that also one is rotated the bellcrank connect with door shell, and an end of bellcrank and wafer connecting arm link and the other end and actuator arm link, and this actuator arm vertically moving in shell is converted into the inside motion of wafer connecting arm.
Description of drawings
Fig. 1 is the transparent view of chip container and door.
Fig. 2 is the transparent view of chip container door, and wherein the part of protecgulum is removed, and mechanism is exposed.
Fig. 3 is the transparent view of rotatable cam member.
Fig. 4 is the transparent view of locking arm.
Fig. 5 is the transparent view of wafer connecting arm.
Fig. 6 is the transparent view of wafer connecting arm actuator link rod.
Fig. 7 is the transparent view with back plate bonded assembly bellcrank.
Fig. 8 is the transparent view of wafer connecting bridge.
Fig. 9 is the front elevation of intralamellar part behind the door.
Figure 10 A is the scheme drawing of the door of off position.
Figure 10 B is the scheme drawing of expression wafer connecting arm position.
The scheme drawing of door mechanism when Figure 11 A is the locking arm stretching, extension.
Figure 11 B is the wafer connecting arm with respect to the scheme drawing of the approximated position of connecting wafer not of mechanism position among Figure 11 A.
Figure 12 A is that mechanism's locking arm stretches the scheme drawing that reaches complete locked position.
Figure 12 B is the position corresponding to mechanism among Figure 12 A, and the wafer connecting arm is positioned at the scheme drawing of terminal and connecting wafer.
Figure 13 A is the scheme drawing during the locking arm full extension in the process of Men Zaikai.
Figure 13 B is the position with respect to mechanism among Figure 13 A, and the wafer connecting arm is not connected with wafer and scheme drawing when being in approximated position.
Figure 14 A is the scheme drawing of door when getting back to the fully open position for the wafer mechanism of opening the door.
Figure 14 B is with respect to the mechanism position among Figure 14 A, expresses the wafer connecting arm and keeps and the unconnected state of wafer.
Figure 15 is the front elevation of the door of expression another embodiment of the present invention.
The specific embodiment
Referring to Fig. 1, chip container 20 comprises container part 22 and the door 24 that matches substantially.Container part has some wafer grooves 28, is used for inserting and shifting out on horizontal surface basically wafer W.Groove is formed by wafer guide plate 32 and wafer support 36.Container part has 42, one osed top 46, one osed top right sides 48,44, one osed top rear portions, left side, 40, one osed top tops, front portion and osed top bottom 50 of an opening.Shown in container be positioned on the equipment dividing range 52.
Door 24 places an installing frame 60 and is attached thereto.Doorframe 60 has two pairs of relative frameworks, a pair of vertical member 64 and a pair of horizontal element 68.Vertical framework has a pair of slit or groove 72,74, is used for door being connected and being locked at container part 22.There is rotatable 80 at the door middle body, have one in the recess 84 in protecgulum 86 manually or from fixed handle 81.Protecgulum 86 is parts of door shell 90, and door shell 90 also comprises plate 96 (this figure is not shown) behind an edge part 94 and.The machanical fastener 98 that protecgulum 86 usefulness are suitable carries out fastening.
Fig. 2 is the transparent view of door 20, and protecgulum 86 parts are removed, and door mechanism 100 shows.The individual component of mechanism comprises 110, one wafer connecting arm 112 (see figure 5)s of a rotatable cam member shown in Fig. 3,4,5 and 6, has tied up 113, one locking arms 118 of bellcrank and a wafer connecting arm actuator link rod 120 above it.
Referring to Fig. 2 and 3, rotatable cam member 110 has a pair of locking arm cam path 114 to form cam face 116.Cam path 114 has relative end 121,138, and the one end has the ratchet 122 that the projection by plastics forms.Ratchet 122 becomes pliable and tough flexible after increasing pawl slot 124.Rotatable cam member 110 comprises that also a pair of relative wafer connects cam path 130, forms wafer and connects cam face 132.In a cam face 132, provide a wafer to connect cam path 134 in addition, and become pliable and tough flexible by a near pawl slot 136 of the end 138 connecting cam path 130 at wafer by stretching out.Rotatable cam member has a medium pore 150, is used for to rotatable cam member 110 location and by axle 152 it being installed on the back plate 96 of door.
Referring to Fig. 2 and 4, comprise a coupling part 160 and a pair of spreadable portion 162 in each locking arm 118, comprise a lock portion 164 in the extensible portion 162, its profile can be inserted in the recess or slit 72,74 in the installing frame 60.The axle that each locking arm has also that a general plane part 168 from arm 118 forms or the cam follower 166 of overshooting shape.
Referring to Fig. 5,7,8, each wafer connecting arm 112 comprises bellcrank 113 and rotary surface 176 of a Waffer edge connecting bridge 170, band connection slot 174.Waffer edge connecting bridge 170 is correspondingly formed by Hytrel.
Referring to Fig. 6, show wafer connecting arm actuator link rod 120 and also have a cam follower 196 and hinge 195.
Locking arm 118 is between rotatable cam member 110 and actuator link rod 120.The size of lock portion makes it stretch and shrink in groove 216 in door edge part 94 slidably.Cam follower 166 stretches in the cam follower groove 118 and further extend in the board slot 200 of back.Loam cake is assembled in and forms door shell 90 on the edge part 94.Relatively limited space is used for stablizing and maintaining body 100 between header board and the back plate.
Element is to connect the following manner stack-mounted.Referring to Fig. 2 and 9, on the back plate 96 of door 4 grooves 186 are arranged, be arranged in the angle of rectangle.Back plate has 4 cylindrical pins 190, be arranged in each groove and with the back plate 96 become one.Sell 190 sizes just in bellcrank 113 scopes, bellcrank 113 can be rotated on pin 190.The groove 174 of bellcrank 113 inserts in the hinge 195 by pin 194 and links together with connecting arm actuator link rod 120.Each actuator link rod 120 has cam follower 196 and 132 engagements of wafer connecting arm cam face, and with back plate 96 on recess or groove 200 engagements.This groove is to form in the projection 202 that stretches upwards the rise of header board from the back plate.Equally also have some rotatable cam member strut bars 210, and rotatable cam member 80 is on strut bar 210 from what back plate 96 stretched upwards.Have projection 212 on this strut bar, help to make plate cam spare 110 to be in place.Use groove 186 among the embodiment of Fig. 7, rather than the groove of the general square shape shown in Fig. 2.In addition, pin 190 is positioned at the middle position of groove 186, and the groove side face is different with being positioned among Fig. 2.
Device is operation as follows.Referring to Fig. 2 and a series of accompanying drawings, at first door is placed in the door installing frame 60 in the container part 22 by manual or automated manner from Figure 10 A, 10B to Figure 14 A, 14B.Rotatable cam member anticlockwise direction rotation in the embodiment of Fig. 2, the engagement between locking arm overhead cam push rod 166 and the rotatable cam member overhead cam surface 116 makes locking arm can outwards stretch slidably owing to the special shape of above-mentioned cam path 114.When locking arm 118 outwards stretched, locking member 164 passed in the groove 216 access door installing frames 60 in the groove 72,74 on the vertical framework.Specifically referring to Figure 11 A.This moment, the wafer connecting arm did not stretch.The further rotation of Figure 12 A cam wafer part does not make locking arm 118 be moved further, but the cam follower 196 on the wafer connecting arm actuator link rod 120 is outwards moved, thereby rotate bellcrank 113, the cross motion of actuator link rod 120 is converted into the outside motion of wafer connecting arm 112 towards wafer.Figure 12 B shows the wafer connecting arm and is in terminal position and is positioned at the wafer connection location with respect to door shell.After the cam member conter clockwise rotated 90 ° fully, cam follower 196 and 166 crossed thorny 134 and 122, thereby cam member is locked in position shown in Figure 12 A and the 12B.For opening and move above-mentioned door, clockwise rotate cam member, at first enter position shown in Figure 13 A and the 13B, at this moment wafer connecting arm 112 shrinks from wafer, enter the close position shown in Figure 13 A and the 13B then, this moment, locking arm 118 was also got back the groove from the door installing frame.
Figure 15 shows another embodiment of the present invention, the device that wherein is used for stretching and shrink the device of locking member and be used for mobile wafer attaching parts between close position and terminal position comprises link rod 212 and joint 213, rather than cam face and cam follower.In such layout, rotatable 110 can be by link rod 212 shown in the label of representing with dotted line among the figure 216 the centering locking position at locked position.In the particular topology shown in the figure, rotate approximately 1/8 the time when rotatable 110, locking arm and wafer connecting arm obtain to activate fully.Arrow 219 is expressed the locking arm 118 of full extension and the rotation direction of wafer connecting arm 112 (not shown)s.
Each parts of door mechanism 100 can suitably be made by the carbon fiber polycarbonate, so that stable dissipation characteristic to be provided.The header board of door and back plate can be made by polycarbonate.

Claims (7)

1, the horizontal axial array mode of a kind of usefulness is with the chip container of the fixing circular wafer of edge part, and container comprises a container parts and a door that matches with it, and container parts comprises:
The front portion of an opening, an osed top left side, an osed top rear side, an osed top right side, an osed top top, an osed top bottom, the inside of an opening and a rectangle doorframe that has the gate seat that door is installed, when door was installed in the above-mentioned doorframe, door knob had locking member to the marginal portion of wafer on the doorframe;
The door that matches comprises:
A door shell that has with the outside installing component of doorframe bonded assembly;
One can be from rotatable of housing exterior rotation;
A locking arm that outwards moves is used for being meshed with the locking member of doorframe;
A wafer bindiny mechanism, comprise a wafer connecting arm of can be inwardly and outwards moving, this wafer bindiny mechanism is connected in this rotatable, thereby when rotating for this rotatable, locking member engagement and wafer connecting arm and Waffer edge partial tooth engagement on this locking arm and the doorframe keep wafer motionless like this.
2, container according to claim 1 is characterized in that having groove on the doorframe, and locking arm has insertion parts, and insertion parts can be inserted in the groove, with above-mentioned door lock on container part.
3, container according to claim 1 is characterized in that, door and wafer bindiny mechanism are such formation, make locking arm and Waffer edge partial tooth engagement.
4, container according to claim 1 is characterized in that rotatable is cam member, have one with locking arm ingear locking cam surface.
5, as container as described in the claim 4, it is characterized in that, in the cam face at least one have one thorny, its position can keep the cam follower of locking arm separately motionless when the wafer connecting arm stretches.
6. as container as described in the claim 4, it is characterized in that this cam member also has a wafer bindiny mechanism ingear wafer and connects cam face.
7. as container as described in the claim 6, it is characterized in that, wafer bindiny mechanism also comprises a bellcrank that connects with the door shell rotation, one end of bellcrank and wafer connecting arm link and the other end and actuator arm link, and this actuator arm vertically moving in shell is converted into the inside motion of wafer connecting arm.
CNB97117184XA 1996-07-12 1997-07-12 Wafer delivery device with door Expired - Lifetime CN1135200C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/678,885 US5711427A (en) 1996-07-12 1996-07-12 Wafer carrier with door
US678,885 1996-07-12
US678885 2000-10-03

Publications (2)

Publication Number Publication Date
CN1179007A CN1179007A (en) 1998-04-15
CN1135200C true CN1135200C (en) 2004-01-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB97117184XA Expired - Lifetime CN1135200C (en) 1996-07-12 1997-07-12 Wafer delivery device with door

Country Status (12)

Country Link
US (1) US5711427A (en)
JP (1) JP3280282B2 (en)
KR (1) KR100283960B1 (en)
CN (1) CN1135200C (en)
DE (1) DE19731183C2 (en)
FR (1) FR2750962B1 (en)
GB (1) GB2315261B (en)
HK (1) HK1010279A1 (en)
IT (1) IT1293423B1 (en)
MY (1) MY126374A (en)
NL (1) NL1006528C2 (en)
SG (1) SG50867A1 (en)

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GB9714702D0 (en) 1997-09-17
DE19731183A1 (en) 1998-01-15
NL1006528C2 (en) 1998-01-15
JPH1070184A (en) 1998-03-10
ITTO970605A1 (en) 1999-01-08
US5711427A (en) 1998-01-27
JP3280282B2 (en) 2002-04-30
HK1010279A1 (en) 1999-06-17
FR2750962A1 (en) 1998-01-16
DE19731183C2 (en) 2001-12-06
CN1179007A (en) 1998-04-15
FR2750962B1 (en) 1999-03-05
KR100283960B1 (en) 2001-04-02
GB2315261A (en) 1998-01-28
GB2315261B (en) 2000-04-12
KR980012234A (en) 1998-04-30
IT1293423B1 (en) 1999-03-01
SG50867A1 (en) 1998-07-20
MY126374A (en) 2006-09-29

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