CN1760092B - Gland of thin board support vessel - Google Patents
Gland of thin board support vessel Download PDFInfo
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- CN1760092B CN1760092B CN 200410085645 CN200410085645A CN1760092B CN 1760092 B CN1760092 B CN 1760092B CN 200410085645 CN200410085645 CN 200410085645 CN 200410085645 A CN200410085645 A CN 200410085645A CN 1760092 B CN1760092 B CN 1760092B
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Abstract
A cover body able to be reliably fixed to the container body, easily cleaned and dried, and to suppress the rotation of semiconductor wafer caused by vibration for plugging the container supported by sheet is disclosed. It is composed of a simple attaching-detaching mechanism, a joint mechanism, a push-out unit, 3 cams, a boss for pressing the cams, and the reinforcing ribs.
Description
Technical field
The present invention relates to the thin plate of holding semiconductor wafer, memory disk, liquid crystal glass base etc., take care of, transport, employed gland of thin board support vessel in the manufacturing step etc.
Background technology
The thin-plate supporting container that thin plates such as holding semiconductor wafer are used for taking care of, transporting is well-known.
This thin-plate supporting container mainly is made of: vessel and the lid that clogs this vessel upper opening.Vessel inside is provided with and is used for supporting the member that thin plates such as semiconductor wafer are used.In this thin-plate supporting container, contaminated for preventing to be housed in thin sheet surface such as its in-to-in semiconductor wafer, must keep in the container cleaning clean when transporting.Therefore, in the container be leak free.In other words, be that lid is fixed on the vessel, make vessel become sealing state.This lid is fixed in the various forms that is configured with on the vessel.
Be transported to the thin-plate supporting container of semiconductor fabrication factory etc., be placed on the manufacturing line and automatically load and unload lid by isolated plant.
Having a kind of corresponding to the lid of this isolated plant is the form that patent documentation 1 is put down in writing.This lid 1 as shown in Figure 2, is made of body 2, cam member 3, latch bar 4 and fulcrum 5.
Cam member 3 is rotating being installed on the body 2.Cam member 3 is provided with cam portion 6.This cam portion 6 is provided with the binding peristome 7 of microscler hole shape.
The base end part of latch bar 4 is provided with S font cam following part 8, and this S font cam following part 8 is embedded in to link catches its action on the peristome 7.
Fulcrum 5 is made of the haunched member of being located on the body 2, is used for supporting latch bar 4.
Constitute according to this,, make to link S font cam following part 8 that peristome 7 captured right-hand the moving in figure and jack-up upward on the one hand on the one hand by the rotation of cam member 3.Thus, latch bar 4 is extended from body 2 on the one hand, is that rotate at the center with fulcrum 5 on the one hand, and the front end of latch bar 4 is pushed up down downwards.
At this moment, the front end of latch bar 4 is embedded in the hole portion of vessel side and pushes up downwards down, thereby with lid top fixing to the vessel side.
(patent documentation 1) Japanese Patent spy opens the 2001-512288 communique
Summary of the invention
But, lid 1 as mentioned above, because the base end part of latch bar 4 be with cam member 3 catch while the jack-up upward that stretches out, make that latch bar 4 can be the formation that the center rotates with fulcrum 5, if change the words of lever principle into, can be with the cardinal extremity of latch bar 4 as the force, front end is a point of action, fulcrum 5 becomes fulcrum.
Under such situation, in order to improve the leakproofness in the vessel, lid 1 brute force is pressed on the vessel, therefore must be in the portion of the hole of vessel side with the powerful roof pressure of the front end of latch bar 4.
For realizing such effect, must improve the intensity of cam member 3 and latch bar 4.This is because the long relation in interval between latch bar 4 leading sections and the fulcrum 5.Under this situation, as long as the front of fulcrum 5 and latch bar 4 is staggered, can not need improve the intensity of cam member 3 and latch bar 4, also can be in the portion of the hole of vessel side with powerful ground of the front end roof pressure of latch bar 4.
But if fulcrum 5 and front are staggered, the distance that just base end part of latch bar 4 must be pushed to is upward elongated, and therefore causes the problem of necessary thickening lid 1 thickness in order to keep this distance of pushing to.
In addition, the lid inside face all is provided with the compressing tablet that compresses wafer usually, compresses supporting of the semiconductor wafer that is contained in the vessel from the top, but when the semiconductor wafer diameter increases, supports the strength of each semiconductor wafer also to need increase.So the antagonistic force from semiconductor wafer that the wafer compressing tablet is born also and then increases.And, under the situation of holding the increase of sheet number of semiconductor wafer, similarly, the antagonistic force from semiconductor wafer is increased.Its result, antagonistic force can make the bending laterally of lid and wafer compressing tablet and the power of compressing of wafer compressing tablet middle body is weakened, and therefore when being communicated to from exterior vibrations, can cause the problem of semiconductor wafer rotation.
The present invention be directed to the problems referred to above point and establish, so the present invention's purpose is: a kind of gland of thin board support vessel is provided, can increase volume and brute force is fixed reliably, even also can prevent the rotation of thin plate in being communicated to the time from exterior vibrations.
The means of dealing with problems
The gland of thin board support vessel of the 1st invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: possess can be easily to the said vesse body be fixed and static solution removes removably simple assembly and disassembling mechanism, this simple assembly and disassembling mechanism, possess: engagement member, can stretch out and be engaged in the said vesse base side; Release member, can stretch out retraction with this engagement member binding; The front cam when utilizing above-mentioned release member to release above-mentioned engagement member, pushes up the front of above-mentioned engagement member on one side; And the base end side cam, when releasing above-mentioned engagement member, with the base end side top of above-mentioned engagement member to another side.
According to above-mentioned formation, when with the release member engagement member being released, the front cam pushes up the front of engagement member on one side, and the base end side cam also pushes up the base end side of engagement member to opposite side simultaneously.So, lid can be fixed on the vessel side.
The gland of thin board support vessel of the 2nd invention, feature are that above-mentioned front cam possesses the front of above-mentioned engagement member is pushed up sidewise inclined-plane in the gland of thin board support vessel of the 1st invention.
According to above-mentioned formation, with the inclined-plane of front cam, the front of engagement member can be pushed up on one side, be bonded on the vessel side.
The gland of thin board support vessel of the 3rd invention, feature are in the gland of thin board support vessel of the 1st or the 2nd invention, and above-mentioned base end side cam possesses the inclined-plane of the base end side of above-mentioned engagement member top to another side.
According to above-mentioned formation, with the inclined-plane of base end side cam, the base end side of engagement member can be pushed up to another side, be bonded on the vessel side.
The gland of thin board support vessel of the 4th invention, feature are in the 1st to the 3rd invention in the arbitrary gland of thin board support vessel, and the front of above-mentioned engagement member wherein is provided with the fulcrum of the rotation of engagement member.
According to above-mentioned formation, engagement member is that the center rotates with the fulcrum.Fulcrum can be with the powerful roof pressure of lid on vessel according to lever principle because be located at the front of engagement member.
The gland of thin board support vessel of the 5th invention, feature are in the 1st to the 4th invention in the arbitrary gland of thin board support vessel, and above-mentioned simple assembly and disassembling mechanism is made as and can freely loads and unloads, and its constituent part also was assembled into and can separately disassembles the while.
According to above-mentioned formation, when cleaning, can dismantle the taking-up of resolving into each constituent part easily, and clean respectively.So, not only all corners can be cleaned up, simultaneously also can be dry rapidly.
The gland of thin board support vessel of the 6th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and can be used for to being contained in the thin plate press part that thin plate is supported in the said vesse body, this thin plate press part has the supporting pieces of mutual alternate configurations.
According to above-mentioned formation, the supporting pieces of configuration alternate with each other can be supported the thin plate surrounding edge.At this moment, replace apical grafting mutually by each supporting pieces on the thin plate surrounding edge, support reliably.
The gland of thin board support vessel of the 7th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have the thin plate press part that is used to support to be contained in the intrinsic thin plate of said vesse, above-mentioned thin plate press part, by two apical grafting sheets with the supporting pieces that alternately sets mutually, support the elasticity of this each apical grafting sheet to support board to form with elasticity, above-mentioned elasticity support board is installed as can be supported between each apical grafting sheet and both sides, simultaneously, elasticity between each apical grafting sheet is supported board, supports each apical grafting sheet with the state that floats a little.
According to above-mentioned formation,, support the apical grafting sheet, so can support thin plate with very not strong strength usually because the elasticity between each apical grafting sheet is supported the state that board floats a little with the distance attachment face.In situation generations such as thin-plate supporting container drop because of carelessness etc., when being subjected to from exterior greater impact, the elasticity between each apical grafting sheet is supported board and aerofoil apical grafting, and supports each apical grafting sheet powerfully.So, can protect thin plate not to be subjected to powerful shock effect.
The gland of thin board support vessel of the 8th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have the lid connecting element, fixing under the state that is installed on the said vesse body from outer side covers.
According to above-mentioned formation, the lid connecting element can be installed in the support lid on the vessel.So, even intense impact such as drop takes place, lid can not leave vessel yet.
The gland of thin board support vessel of the 9th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and be used for being contained in the thin plate press part that the intrinsic thin plate of said vesse is supported, this thin plate press part has most apical grafting sheets that set side by side and distinguish the above-mentioned multi-disc thin plate of direct apical grafting, above-mentioned each apical grafting sheet arranged side by side, form and make the part that is positioned at center side, more to above-mentioned thin plate side protuberance than the part that is positioned at its both sides.
According to above-mentioned formation, set each the apical grafting sheet that more swells than both sides into center side to the thin plate side, can absorb the bending of lid, and support each thin plate with impartial strength.
The gland of thin board support vessel of the 10th invention, feature is in the gland of thin board support vessel of the 9th invention, above-mentioned thin plate press part, possess: a plurality of elasticity support boards that are fixed in the cardinal extremity support sector on the lid inner surface side and supported and support respectively above-mentioned each apical grafting sheet one end by this cardinal extremity support sector, supporting each elasticity of above-mentioned each apical grafting sheet to support board, form and make the above-mentioned apical grafting sheet that is positioned at center side, more to above-mentioned thin plate side protuberance than the above-mentioned apical grafting sheet that is positioned at its both sides.
According to above-mentioned formation, each elasticity is supported board, because in the middle of each the apical grafting sheet that sets side by side, center side more to the supporting of thin plate side protuberance, so can absorb the bending of lid, and is supported each thin plate with the strength of equalization than both sides.
The gland of thin board support vessel of the 11st invention, feature is in the gland of thin board support vessel of the 9th invention, above-mentioned thin plate press part, possess: the cardinal extremity support sector of being fixed in the lid inner surface side, supported and supported respectively a plurality of side elasticity support boards of above-mentioned apical grafting sheet one end by this cardinal extremity support sector, and support above-mentioned each apical grafting sheet other end respectively and apical grafting is supported boards in a plurality of opposite side elasticity of above-mentioned lid inner surface side, supporting each side elasticity of above-mentioned each apical grafting sheet to support board and opposite side elasticity to support board one of them or both, form and make the above-mentioned apical grafting sheet that is positioned at center side, more to above-mentioned thin plate side protuberance than the above-mentioned apical grafting sheet that is positioned at its both sides.
According to above-mentioned formation, because the elasticity of a side supports board or opposite side to support board, in the middle of each the apical grafting sheet that sets side by side, center side is than both sides supporting to thin plate side protuberance more, so can absorb the bending of lid, and support each thin plate with impartial strength.
The gland of thin board support vessel of the 12nd invention, feature is in the gland of thin board support vessel of the 9th invention, above-mentioned thin plate press part, possess: the cardinal extremity support sector of being fixed in the lid inner surface side, supported and supported respectively a plurality of side elasticity support boards of above-mentioned each apical grafting sheet one end by this cardinal extremity support sector, support above-mentioned each apical grafting sheet other end respectively and apical grafting is supported boards in a plurality of opposite side elasticity of above-mentioned lid inner surface side, and be located at above-mentioned lid inner surface side and apical grafting supports board to support the support raised line of board to support this opposite side in above-mentioned opposite side elasticity, above-mentioned support is supported board one of them or both with raised line and opposite side elasticity, form and make the above-mentioned apical grafting sheet that is positioned at center side, more to above-mentioned thin plate side protuberance than the above-mentioned apical grafting sheet that is positioned at its both sides.
According to above-mentioned formation, because support to support board with raised line or opposite side, in the middle of each the apical grafting sheet that sets side by side, center side more to the supporting of thin plate side protuberance, so can absorb the bending of lid, and is supported each thin plate with the strength of equalization than both sides.
The gland of thin board support vessel of the 13rd invention, feature are in the 9th to the 12nd invention in the arbitrary gland of thin board support vessel, and it is 40 °～44 ° vee shape groove that above-mentioned apical grafting sheet has the angle of inclination.
According to above-mentioned formation, because the edge part of thin plate, be embedded in that to have the angle of inclination be 40 °～44 ° vee shape groove, so this vee shape groove can be caught the thin plate edge, support each thin plate more reliably.
The gland of thin board support vessel of the 14th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and be used for being contained in the thin plate press part that thin plate is supported in the said vesse body, this thin plate press part has: two cardinal extremity support sectors, be fixed in the lid inner surface side; The apical grafting sheet is equipped with most also direct apical graftings on this thin plate along above-mentioned thin plate surrounding edge; Two elasticity are supported boards, are supported by above-mentioned each cardinal extremity support sector respectively and can support the external side end of the apical grafting sheet at the two ends in the middle of above-mentioned a plurality of apical grafting sheet; Connect and support board, with each apical grafting sheet of interconnected support between above-mentioned each apical grafting sheet; And, support to use member, prevent to support the displacement of the above-mentioned lid inside face of board to take place, and allow the change on the vertical direction of above-mentioned lid inside face along this connection.
According to above-mentioned formation, in the middle of the multi-disc apical grafting sheet, the external side end of the apical grafting sheet at two ends, support board to support with elasticity, then support board to support between each apical grafting sheet with connecting, simultaneously, support this connection to support board with support with member, and can make each apical grafting sheet support the surrounding edge of thin plate reliably.Especially, between each apical grafting sheet, be to support board to support with the connection of supporting to support with member, along the displacement of lid inside face, support thin plate so can prevent each apical grafting sheet reliably.
The gland of thin board support vessel of the 15th invention, feature are in the gland of thin board support vessel of the 14th invention, and above-mentioned support member possesses and can support above-mentioned each connection to support the support rib of board individually, and it is not subjected to displacement along above-mentioned lid inner face.
According to above-mentioned formation,, along the displacement of lid inner face, support thin plate reliably so can prevent each apical grafting sheet because of with supporting to support to connect the support board with rib.
The gland of thin board support vessel of the 16th invention, feature is in the gland of thin board support vessel of the 14th invention, above-mentioned support member, possesses mosaic process, be used for being embedded in the embedded hole that is located on the above-mentioned connection support board, prevent that above-mentioned connection support board is subjected to displacement along above-mentioned lid inside face, and allow its change on above-mentioned lid inner face vertical direction.
According to above-mentioned formation, mosaic process can be embedded in to be located at and connect in the embedded hole of supporting board, and supports board to support to connecting, so can prevent each apical grafting sheet along the displacement of lid inside face, supports thin plate reliably.
The gland of thin board support vessel of the 17th invention, feature is in the gland of thin board support vessel of the 14th invention, above-mentioned connection supports board to be used for supporting the elastic force of above-mentioned apical grafting sheet, supports that than above-mentioned elasticity board is used for supporting that the elastic force of above-mentioned apical grafting sheet is more powerful.
According to above-mentioned formation, support that because of connecting board is used for supporting that the elastic force of apical grafting sheet is stronger, so can eliminate the difference of elastic force (bearing capacity) between the central portion of thin plate press part and the end, and make the strength that compresses thin plate on the whole can both be average, support thin plate more reliably.
The gland of thin board support vessel of the 18th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and be used for being contained in the thin plate press part that thin plate is supported in the said vesse body, this thin plate press part has the apical grafting sheet of this thin plate of support of the above-mentioned thin plate of direct apical grafting, this apical grafting sheet, have the V word ditch chimeric with the edge part of above-mentioned thin plate, the leaning angle of this V word ditch is set at 20 °-60 °.
According to above-mentioned formation, the V word ditch and the thin plate of above-mentioned apical grafting sheet is chimeric, the edge part incision V word ditch of this thin plate.At this moment, the leaning angle of V word ditch is set at 20 °-60 °, cuts supporting of V word ditch by the edge part of thin plate.And then when the apical grafting sheet was broken away from from thin plate, the thin plate of incision V word ditch was not pulled out level and smooth separation with V word ditch.The leaning angle of V word ditch is set at below 20 °, with the apical grafting sheet when thin plate breaks away from, can make dropping out that thin plate pulls out from V word ditch.The leaning angle of V word ditch is set at 60.Above, make inadequately towards the breach of the thin plate of the V of apical grafting sheet word ditch to produce rotation.The leaning angle of V word ditch is set at 20 °-60 °, can has the rotation that prevents that the breach towards the V of thin plate word ditch from causing concurrently, with the level and smooth effect of separating.
The gland of thin board support vessel of the 19th invention, feature are in the gland of thin board support vessel of the 18th invention, on the above-mentioned V word ditch, have between the bottom of the edge part of this thin plate under the state that the edge part of above-mentioned thin plate is chimeric and this V word ditch and have the gap.
According to above-mentioned formation, the V word ditch and the thin plate of apical grafting sheet are chimeric, the edge part incision V word ditch of this thin plate, at this moment, make and do not come in contact each other that what the dip plane brute force of the edge part of thin plate and V word ditch can be compressed installs owing to have the gap between the bottom of the edge part of thin plate and V word ditch.So, can be by thin plate being cut supporting reliably of V. word ditch.
The gland of thin board support vessel of the 20th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and be used for being contained in the thin plate press part that thin plate is supported in the said vesse body, this thin plate press part has the apical grafting sheet of this thin plate of support of the above-mentioned thin plate of direct apical grafting, this apical grafting sheet, V word ditch with angle of inclination identical with the edge angle of the edge part of above-mentioned thin plate, simultaneously, between the bottom of the edge part of this thin plate under the chimeric state of the edge part of this V word ditch and above-mentioned thin plate and above-mentioned V word ditch, has the gap.
According to above-mentioned formation, the V word ditch and the thin plate of apical grafting sheet are chimeric, and the angle of inclination coupling of the edge angle of the edge part of this thin plate and V word ditch contacts in the large tracts of land scope.At this moment, the gap is feasible not to come in contact each other owing to have between the bottom of the edge part of thin plate and V word ditch, can allow the edge part of thin plate and the dip plane of V word ditch carry out the powerful installation that compresses under the state of contact in the large tracts of land scope.
The gland of thin board support vessel of the 21st invention, feature are that the angle of inclination of the V word ditch of above-mentioned apical grafting sheet is set at 44 ° in the gland of thin board support vessel of the 20th invention.
According to above-mentioned formation, the edge angle is set at 44 ° thin plate, and is chimeric with the V word ditch of apical grafting sheet at angle of inclination that is set at 44 °, mates between the edge part of thin plate and the V word ditch, carries out the powerful installation that compresses under the state of contact with the large tracts of land scope.
The gland of thin board support vessel of the 22nd invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and be used for being contained in the thin plate press part that thin plate is supported in the said vesse body, in the time of with this thin plate of support of the above-mentioned thin plate of this thin plate press part apical grafting, on the central portion that is out of shape laterally because of its antagonistic force, be pre-formed depression, make it possible to offset this distortion towards the said vesse base side.
According to above-mentioned formation,, in this thin plate of support, can absorb its antagonistic force with thin plate press part and thin plate apical grafting by making the central portion of gland of thin board support vessel swell.Antagonistic force when supporting thin plate makes the central portion of gland of thin board support vessel be out of shape laterally, and this bending makes that the central portion of depression becomes smooth state and offsets in advance, can support whole thin plate with average power.
The gland of thin board support vessel of the 23rd invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by: have and be used for being contained in the thin plate press part that thin plate is supported in the said vesse body, in the time of with this thin plate of support of the above-mentioned thin plate of this thin plate press part apical grafting, enhancing flange around will being out of shape laterally because of its antagonistic force, be pre-formed to towards the bending of said vesse base side, make it possible to offset this distortion.
According to above-mentioned formation,, in this thin plate of support, can absorb its antagonistic force with thin plate press part and thin plate apical grafting by the enhancing around the gland of thin board support vessel is carried out pre-determined bending with flange.Antagonistic force when supporting thin plate makes to strengthen and is out of shape laterally with flange, and this distortion is feasible to be pre-formed enhancing for bending becomes rectilinear form with flange and offset, and can support whole thin plate with average power.
The gland of thin board support vessel of the 24th invention, be that inside is accommodated the gland of thin board support vessel that the vessel of the thin-plate supporting container of carrying of multi-disc thin plate clogs, it is characterized by the enhancing that forms around and be shaped with the embedding (insert) that adds reinforcement on the flange.
According to above-mentioned formation, because adding the embedding (insert) that strengthens with member in the enhancing that forms around the gland of thin board support vessel on flange is shaped, in this thin plate of support with thin plate press part and thin plate apical grafting, can resist its antagonistic force, can support whole thin plate with average power.
The invention effect
Describe in detail as above, as use thin-plate supporting container of the present invention, can obtain following effect:
(1) because engagement member is to release with lever principle, so manufacturing line also can be fixed on the vessel reliably with lid is powerful.
(2) because simple assembly and disassembling mechanism can dismantle easily and resolve into each constituent part, each part that can unload taking-up when cleaning cleans respectively, not only all corners can be cleaned up, also can be dry rapidly.
(3) because the supporting pieces that sets alternate with each other has each supporting pieces to replace apical grafting mutually, so can support reliably on the thin plate surrounding edge.
(4) because in the middle of each apical grafting sheet arranged side by side, the ratio that is positioned at center side is positioned at more swelling to the thin plate side of both sides, thus can absorb the bending of lid, and support each thin plate with impartial strength.
(5) because each elasticity is supported board, in the middle of each apical grafting sheet that sets arranged side by side, the ratio that is positioned at center side is positioned at more swelling to the thin plate side of both sides, thus can absorb the bending of lid, and support each thin plate with impartial strength.
(6) because the elasticity of a side supports board or opposite side elasticity to support board, in the middle of each apical grafting sheet that sets arranged side by side, the ratio that is positioned at center side is positioned at more swelling to the thin plate side of both sides, thus can absorb the bending of lid, and support each thin plate with impartial strength.
(7) because support to support board with raised line or opposite side elasticity, in the middle of each apical grafting sheet that sets arranged side by side, the ratio that is positioned at center side is positioned at more swelling to the thin plate side of both sides, thus can absorb the bending of lid, and support each thin plate with impartial strength.
(8) support board because of the connection between each apical grafting sheet, support with member, along the displacement of lid inside face, support thin plate reliably so can prevent each apical grafting sheet by support.
(9) because of to support supporting to connect the support board, along the displacement of lid inside face, support thin plate reliably so can prevent each apical grafting sheet with rib.
(10) connect in the embedded hole of supporting board because of the mosaic process part can be embedded in to be located at, and support board to support,, support thin plate reliably so can prevent each apical grafting sheet along the displacement of lid inside face to connecting.
(11) because of connect supporting board to be used for supporting that the elastic force of apical grafting sheet is stronger, thus the difference of the central portion and the bearing capacity between the end of thin plate press part can be eliminated, and make the strength that compresses thin plate on the whole can both be average, more certain support thin plate.
(12) because the leaning angle of the V word ditch of apical grafting sheet is set at 20 °-60 °, supporting of the edge part incision V word ditch of thin plate prevented the rotation of thin plate.And then, when the apical grafting sheet is broken away from from thin plate, also the thin plate of incision V word ditch can not be pulled out level and smooth separation from V word ditch.So, can support thin plate reliably, simultaneously, be easy to unload lower cover.
(13) owing to have the gap between the bottom of the V word ditch of the edge part of thin plate and apical grafting sheet, when V word ditch and thin plate are chimeric, the bottom of the edge part of thin plate and V word ditch does not come in contact mutually, makes the installation that the dip plane brute force of the edge part of thin plate and V word ditch compresses.So, thin plate is cut the support reliably of V word ditch.
(14) because the apical grafting sheet, have V word ditch with angle of inclination identical with the edge angle of thin plate, simultaneously, between the bottom of the edge part of this thin plate under the chimeric state of the edge part of this V word ditch and above-mentioned thin plate and above-mentioned V word ditch, has the gap, make that the angle of inclination of the edge angle of edge part of thin plate and V word ditch is complementary with contacting than the large tracts of land scope, according to the gap between the bottom of the edge part of thin plate and V word ditch, the installation that the edge part and the V word ditch brute force of thin plate compressed.In other words, though apical grafting sheet being installed on the thin plate of not having that brute force compresses, also on the dip plane that is installed in V word ditch that the edge part brute force of thin plate can be compressed.Consequently, even the thin plate press part also can be supported this thin plate by this thin plate press part reliably with the less strong installation thin plate that compresses, the rotation of the thin plate that causes such as prevent to vibrate.So, needn't strengthen the intensity of lid, promptly use less strong power that lid is installed on the vessel and also can support thin plate reliably.
(15) because the angle of inclination of the V word ditch of apical grafting sheet is set at 44 °, this V word ditch is set at 44 ° thin plate coupling, the installation that the brute force that contacts with bigger areal extent compresses with edge angle.Consequently, even the thin plate press part also can be supported thin plate by this thin plate press part reliably with the less strong installation thin plate that compresses, the rotation of the thin plate that causes such as prevent to vibrate.So,, also can support thin plate reliably, the rotation of the thin plate that causes such as prevent to vibrate even lid is installed on the vessel with less strong compressing.So, needn't strengthen the intensity of lid, promptly use less strong power that lid is installed on the vessel and also can support thin plate reliably.
(16) because the central portion of gland of thin board support vessel depression, offset the distortion of the central portion of the gland of thin board support vessel that the antagonistic force in this thin plate of support of thin plate press part and thin plate apical grafting causes by above-mentioned depression, can enough uniform power support whole thin plate, so the rotation of the thin plate that causes such as can prevent to vibrate.
Enhancing around gland of thin board support vessel with flange to the occasion of above-mentioned vessel side distortion also is, the enhancing that causes by the antagonistic force of having offset to the distortion of above-mentioned vessel side in this thin plate of support of thin plate press part and thin plate apical grafting is with the bending of flange, can enough uniform power support whole thin plate, so the rotation of the thin plate that causes such as can prevent to vibrate.
(17) because the enhancing on every side of body embeds strengthening of (insert) with having added the formation that strengthens with member on the flange, when the thin plate press part is supported thin plate, resist the uniform power of usefulness of its antagonistic force and support whole thin plate, so the rotation of the thin plate that causes such as can prevent to vibrate.
Description of drawings
Fig. 1 uses the part block diagram of lid for the manufacturing line that shows the present invention the 1st embodiment.
Fig. 2 is the side cut away view of the gland of thin board support vessel of demonstration prior art.
Fig. 3 is the block diagram of the thin-plate supporting container of demonstration the present invention the 1st embodiment.
Fig. 4 is for showing the block diagram of thin-plate supporting container when taking off lid of the present invention the 1st embodiment.
Fig. 5 is the block diagram of the lid supporting part of the thin-plate supporting container of demonstration the present invention the 1st embodiment.
Fig. 6 bears the fragmentary cross-sectional view of portion for the lid of the thin-plate supporting container of demonstration the present invention the 1st embodiment.
Fig. 7 uses the top block diagram of lid for the manufacturing line that shows the present invention the 1st embodiment.
Fig. 8 uses the following block diagram of lid for the manufacturing line that shows the present invention the 1st embodiment.
Fig. 9 is the top block diagram of the engagement member of demonstration the present invention the 1st embodiment.
Figure 10 is the following block diagram of the engagement member of demonstration the present invention the 1st embodiment.
Figure 11 is the side cut away view of the engagement member of demonstration the present invention the 1st embodiment.
Figure 12 is the top block diagram of the release member of demonstration the present invention the 1st embodiment.
Figure 13 is the following block diagram of the release member of demonstration the present invention the 1st embodiment.
Figure 14 is the birds-eye view of the release member of demonstration the present invention the 1st embodiment.
Figure 15 is the inner face figure of the release member of demonstration the present invention the 1st embodiment.
The top block diagram that Figure 16 covers for the maintenance that shows the present invention the 1st embodiment.
The following block diagram that Figure 17 covers for the maintenance that shows the present invention the 1st embodiment.
Figure 18 is the top block diagram of the lid casting die of demonstration the present invention the 1st embodiment.
Figure 19 is the following block diagram of the lid casting die of demonstration the present invention the 1st embodiment.
Figure 20 is the lateral plan of the wafer press part of demonstration the present invention the 1st embodiment.
Figure 21 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment.
Figure 22 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment.
Figure 23 is the block diagram of the lid connecting element of demonstration the present invention the 1st embodiment.
Figure 24 (A)～(D) is the mode chart of the simple assembly and disassembling mechanism action of demonstration the present invention the 1st embodiment.
Figure 25 is the lateral plan of the wafer press part of demonstration the present invention the 1st embodiment the 1st variation.
Figure 26 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment the 1st variation.
Figure 27 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment the 1st variation.
Figure 28 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment the 2nd variation.
Figure 29 is the front elevation of the wafer press part of demonstration the present invention the 1st embodiment the 2nd variation.
Figure 30 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment the 3rd variation.
Figure 31 is the significant points section-drawing of the wafer press part of demonstration the present invention the 1st embodiment the 3rd variation.
Figure 32 is the block diagram of the wafer press part of demonstration the present invention the 1st embodiment the 4th variation.
Figure 33 is the front elevation of the wafer press part of demonstration the present invention the 1st embodiment the 4th variation.
Figure 34 is the significant points block diagram of the wafer press part of demonstration the present invention the 2nd embodiment.
Figure 35 is for showing the lid inner face block diagram that comprises the wafer press part of the present invention the 2nd embodiment.
Figure 36 is the part block diagram of the lid inner face that comprises the wafer press part of demonstration the present invention the 2nd embodiment.
Figure 37 is for showing the pith block diagram that unloads surface state in the lid behind the lower wafer press part of the present invention the 2nd embodiment.
Figure 38 is for showing the part block diagram that unloads surface state in the lid behind the lower wafer press part of the present invention the 2nd embodiment.
Figure 39 uses the block diagram of rib profile status for the support that shows the present invention the 2nd embodiment.
Figure 40 is the pith expanded view of the wafer press part of demonstration the present invention the 2nd embodiment.
Figure 41 is the pith expanded view of the apical grafting sheet of the wafer press part of demonstration the present invention the 2nd embodiment.
Figure 42 is the pith expanded view of the apical grafting sheet of the wafer press part of demonstration the present invention the 2nd embodiment.
Figure 43 is the pith section-drawing of the apical grafting sheet of the wafer press part of demonstration the present invention the 2nd embodiment.
Figure 44 is for showing the pith block diagram of the present invention's the 2nd embodiment variation.
Figure 45 is for showing the pith section-drawing of the present invention's the 2nd embodiment variation.
(description of reference numerals)
1 lid
2 bodies
3 cam members
4 latch bar
5 fulcrums
6 cam portions
7 link peristome
8 S font cam following parts
11 thin-plate supporting containers
12 vessels
12A, 12B, 12C, 12D side wall portion
The 12E base plate
The 12F opening
13 thin plate support sectors
14 transport and use lid
15 manufacturing line lids
16 top flanges
17 carrying handles
21 lid carriers
The 21A vertical plate part
The 21B horizontal plate part
The 21C sealed groove
22 tongues
23 first by fitting portion
24 second by fitting portion
26 transportation simple assembly and disassembling mechanisms
30 bodies
31 tongues bear portion
32 simple assembly and disassembling mechanisms
33 recesses
34 openings
36 rotation supporting axis
37 stop parts
37A bears portion
38 engaging claws
39 cardinal extremity downside cams
The 39A inclined-plane
40 front cams
The 40A inclined-plane
The chimeric recess of 40B
42 engagement members
43 release member
44 cam mechanisms
45 keep lid
46 cover plate casting dies
51 connection shafts
52 base end sides slide and connect face
53 cardinal extremity upside cams
The 53A inclined-plane
Lateral sulcus portion on 54
55 fulcrum
The 55A front is slided and is connect face
56 front end fitting portions
57 base end side boards
58 front boards
61 top plate portions
62 keyways
63 rotating cylinder portions
64 slotted hole portions
64A one end
64B the other end
The 64C wall
65 is to close sheet
The 65A jut
66 breach
The projection of 69 roof pressure cams
71 release the member maintaining part
72 engagement member maintaining parts
74 peripheral panels
75 top boards
76 keyholes
78 side plates
The 78A wide width part
The 78B narrow width part
79 top boards
80 support to use projection
81 slits
82 protrusions
82A central uplift sheet
82B left and right sides joint fastener
85 side plates
86 top boards
86A crosswise breach
87 upsides are supported plate
88 downsides are supported plate
The 88A chock
91 wafer press parts
92 cardinal extremity support sectors
93 elasticity are supported board
93A first supports plate
93B second supports plate
94 apical grafting sheets
The 94A first apical grafting sheet
The 94B second apical grafting sheet
96 hornblocks
The 96A dip plane
96B apical grafting face
97 support pawl
100 lid connecting elements
101 support board
102 hook portions
103 mosaic processes
110 cardinal extremity support sectors
111 elasticity are supported board
112 apical grafting sheets
The 112A dip plane
112B apical grafting face
113 support pawl
115 hornblocks
115A apical grafting face
120 semiconductor wafers
121 wafer press parts
122 cardinal extremity support sectors
123 elasticity are supported board
124 apical grafting sheets
124A V-shape embedded grooves
125 connect the support board
The vertical board of 125A, 125B
The horizontal board of 125C
126 support to use rib
127 lids
128 hook-shaped support sectors
129,130 supporting wall portions
131 support to use raised line
133 support plate
134 separate plate
141 down close the hole
142 down close projection
The S gap
The specific embodiment
Below, based on the description of drawings embodiments of the invention.Thin-plate supporting container of the present invention is to use keeping at the thin plate of holding semiconductor wafer, memory disk, liquid crystal glass base etc., transports, the container in the process such as manufacturing line.In addition, be that thin-plate supporting container with the holding semiconductor wafer is that example describes at this.Clog the lid of thin-plate supporting container, be divided into and transport with separately using with lid on lid and the manufacturing line.
The 1st embodiment
The thin-plate supporting container 11 of present embodiment, shown in Fig. 3～8, be by: inside can hold the vessel 12 of multi-disc semiconductor wafer (and not shown), be located at 2 thin plate support sectors 13 being used for supporting to be contained in the in-to-in semiconductor wafer on the two side relative in this vessel 12 respectively from both sides, the carrying of carrying the grasping of thin-plate supporting container 11 time institute with lid 15, with the top flange 16 that wrist was gripped and the worker of Handling device in the factory (and not shown) with hand with lid 14 and manufacturing line of transporting that clogs vessel 12 uses handgrip 17 to be constituted.
Each side wall portion 12A, 12B of vessel 12, the upper end of 12C, 12D as shown in Figure 5 and Figure 6, are provided with and are used for the lid carrier 21 of chimeric lid 4.This lid carrier 21 is that the upper end with vessel 12 is expanded to the size of lid 4 and forms.So, lid 4 can be embedded in the inboard of the vertical plate part 21A of lid carrier 21, and apical grafting is in horizontal plate part 21B, and can be installed on the lid carrier 21.In addition, also be provided with a whole circle sealed groove 21C on the horizontal plate part 21B, be installed on and transport with 22 chimeric inner sealings that make thin-plate supporting container 11 of the tongue on the downside of lid 14 in its entire circumference edge.The medial surface of the vertical plate part 21A in four corners of lid carrier 21 is provided with first by fitting portion 23, is used for the aftermentioned transportation will be fixed on vessel 12 sides with chimeric will the transporting with lid 14 of lid engaging claw (and not shown) of simple assembly and disassembling mechanism 26.This is first by fitting portion 23, is to make vertical plate part 21A cave in into square shape and form, and makes the lid engaging claw can be entrenched in its inside upper surface.
In addition, first establish second by fitting portion 24 near by fitting portion 23 at each.This second is to use on manufacturing line by fitting portion 24.Second by the fitting portion 24 chimeric engagement members 42 that manufacturing line is arranged with the simple assembly and disassembling mechanism 32 of lid 15, and manufacturing line is fixed in vessel 12 sides with lid 15.
Transporting with lid 14 is known lids.This transports with lid 14 and is plate-like, makes its central portion be round barrel shape and upwards arches upward, to avoid touching the top that is contained in the in-to-in semiconductor wafer.
Transport four jiaos that use lid 14, shown in Fig. 3,4, be provided with transportation, can will transport with being fixed on the vessel 12 that lid 14 freely loads and unloads with simple assembly and disassembling mechanism 26.This transportation possesses with simple assembly and disassembling mechanism 26 has the lid engaging claw (and not shown), is by the state that transports with lid 14 peripheral projections.This lid engaging claw forms and can be embedded in first by on the fitting portion 23.
Manufacturing line is with lid 15, is the vessel 12 that transports the thin-plate supporting container 11 that comes to be remained untouched directly to use lid on the manufacturing line in factory.This manufacturing line is goods that are provided with separately respectively with above-mentioned thin-plate supporting container 11 and be placed on ground such as semiconductor fabrication factory with lid 15.Manufacturing line, is made of body 30, cover plate (and not shown) and simple assembly and disassembling mechanism 32 shown in Fig. 7,8 with lid 15.
Manufacturing line is with in the middle of the body 30 of lid 15, on the end than the both sides of length direction (among Fig. 7 be upper left, lower right to both sides), is respectively arranged with the recess 33 that simple assembly and disassembling mechanism 32 can be installed.This recess 33 roughly is rectangle depression with body 30 ends and forms.On the length direction both ends of recess 33 (upper right among Fig. 7, lower left to both ends), be provided with and allow the opening 34 of front end fitting portion 56 turnover of engagement member 42 described later.The position that this opening 34 is set is to be embedded under the state of lid carrier 21 at body 30, can with second position of being mated by fitting portion 24 of lid carrier 21.Recess is separately installed with on 33 bottoms: rotation supporting axis 36, stop part 37, engaging claw 38, cardinal extremity downside cam 39, front cam 40.Recess 33 is equipped with the cover plate that can freely load and unload.Can unload during the simple assembly and disassembling mechanism 32 of this cover plate in recess 33 is located in cleaning.
Engaging claw 38 is the members that are used for cover plate casting die 46 described later is fixed in recess 33 bottoms.Because cover plate casting die 46 is installed in respectively on the length direction both sides of recess 33, is matched with this engaging claw 38 and also respectively installs 6 respectively on than the length direction both sides at recess 33.Engaging claw 38 is the member formations with the L font, can allow the downside of cover plate casting die 46 support that plate 88 is chimeric.
Cardinal extremity downside cam 39 and front cam 40 are the members that constitute cam mechanism 44 described later.In addition, cardinal extremity downside cam 39 and cardinal extremity upside cam 53 described later have constituted when engagement member 42 is released, with the downward base end side cam that pushes of the base end side of engagement member 42.
Cardinal extremity downside cam 39 as Fig. 1 and shown in Figure 7, is the release of following engagement member 42, and is used for its base end side is pushed to (pushing) other side's (below of Fig. 1) member.This cardinal extremity downside cam 39 is located at rotation supporting axis 36 both sides respectively.The side section shape of cardinal extremity downside cam 39 is triangularity roughly, possesses the inclined-plane 39A that makes that the base end side of engagement member 42 can be is up and down arranged.This inclined-plane 39A is finish-machined to minute surface, to reduce and the base end side of engagement member 42 slides and connects friction drag between the face 52.
Be provided with simple assembly and disassembling mechanism 32 in the recess 33.This simple assembly and disassembling mechanism 32 makes manufacturing line can be loaded and unloaded on the device of vessel 12 easily with lid 15.Simple assembly and disassembling mechanism 32, as shown in Figure 1, by engagement member 42, release member 43, cam mechanism 44, keep covering 45 and cover plate casting die 46 constituted.
Base end side slides and to connect face 52, slidably is connected to the inclined-plane 39A of cardinal extremity downside cam 39, is the part that is used for making the base end part up-and-down movement of engagement member 42.This base end side slides and connects face 52, is the base end part downside oblique cutting of engagement member 42 is formed.Base end side slides and to connect face 52, is finish-machined to minute surface, with the friction drag between the inclined-plane 39A that reduces itself and cardinal extremity downside cam 39.In that being slided, this base end side connects under the state of inclined-plane 39A that face 52 slidably is connected to cardinal extremity downside cam 39, by releasing the method for engagement member 42, the base end part of engagement member 42 is compressed downwards, by the method that engagement member 42 is taken in, with the base end part of engagement member 42 jack-up upward.
Cardinal extremity upside cam 53, be with cardinal extremity downside cam 39 together, make the part of the base end part knee-action of engagement member 42.This cardinal extremity upside cam 53 is parts of the acting point in lever principle.In addition, connection shaft 51 is not the acting point as lever principle, and only is the part of accepting length direction strength when engagement member 42 is come in and gone out action.
Cardinal extremity upside cam 53, the base end part that is arranged at engagement member 42 is neighbouring towards the upside place.The side section shape of cardinal extremity upside cam 53 is the triangularity shape roughly, possess can make engagement member 42 base end side up and down inclined-plane 53A and constitute.The inclined-plane 39A of the inclined-plane 53A of this cardinal extremity upside cam 53 and cardinal extremity downside cam 39 is same, is finish-machined to minute surface so that and the maintenance described later projection 69 of covering the roof pressure cam of 45 sides slip.The inclined-plane 53A of cardinal extremity upside cam 53 is set at the inclined-plane 39A almost parallel with cardinal extremity downside cam 39.So, under the state that the inclined-plane 53A of the projection 69 of roof pressure cam and cardinal extremity upside cam 53 slips, when engagement member is released, depress downwards with the base end part of engagement member 42 that makes of the projection 69 roof pressure cardinal extremity upside cams 53 of roof pressure cam.In addition, when engagement member 42 during by income, base end side slides and connects on the inclined-plane 39A that face 52 is pressed on cardinal extremity downside cam 39, and the base end part that makes engagement member 42 is by jack-up upward.
And fulcrum 55 is embedded in the chimeric recess 40B of front cam 40, can this chimeric recess 40B be that the center rotates promptly.
Front end fitting portion 56 stretches out to the outside from the opening 34 of recess 33, be directly be embedded in lid carrier 21 second by the part of fitting portion 24.This front end fitting portion 56 is the point of actions in the lever principle.For make front end fitting portion 56 be embedded in lid carrier 21 second by fitting portion 24 states under, can give full play to ability, so be located at the position very near apart from fulcrum 55.
Base end side board 57 and front board 58 are to support engagement member 42 and be used to the member of allowing that it moves back and forth.
Releasing member 43, is to be linked to engagement member 42 and to be used to make engagement member 42 to stretch out the member of income action.This releases member 43, on the rotatable rotation supporting axis 36 that is installed on recess 33.Release member 43, shown in Fig. 1,7,12～15, by top plate portion 61, keyway 62, rotating cylinder portion 63, slotted hole portion 64 and be to close sheet 65 to be constituted.
Rotating cylinder portion 63 is the members that are used for releasing on the rotatable rotation supporting axis 36 that is installed on recess 33 of member 43.This rotating cylinder portion 63 is located at the central portion of top plate portion 61 downsides.And make keyway 62 be positioned at the center of this rotating cylinder portion 63.
Slotted hole portion 64 is to be used for and will to release the rotation of member 43, is transformed into the part of the discrepancy action of engagement member 42.Slotted hole portion 64 is separately positioned on two places relative with top plate portion 61.One end 64A of this slotted hole portion 64 is near the center of top plate portion 61, and the other end 64B then relatively at a distance, constitutes the part of spiral.The connection shaft 51 of engagement member 42 is with an end 64A of slotted hole portion 64 when chimeric, and engagement member 42 is drawn in, and when the other end 64B was chimeric, 42 of engagement members stretched out.
On the downside of top plate portion 61, be provided with the wall 64C of gentle slope in the middle of the slotted hole portion 64.This wall 64C, on the same height of downside of end 64A of slotted hole portion 64 and top plate portion 61, being set at more will be high more near the other end.This is because will and release the reason that member 43 links reliably with engagement member 42.In other words, the connection shaft 51 of engagement member 42 is chimeric at the other end of slotted hole portion 64 64B and under the state that stretches out, because the base end part of engagement member 42 is pushed downwards, even under the state that this base end part is depressed, connection shaft 51 also can be embedded in slotted hole portion 64 reliably.
The projection 69 of roof pressure cam, apical grafting be in the inclined-plane 53A of cardinal extremity upside cam 53, is to be used for the member the base end part of engagement member 42 depressed along with the release of engagement member 42.The projection 69 of this roof pressure cam is located at maintenance and covers 45 downside.Particularly, be to connect under the state of inclined-plane 39A that face 52 is slidably connected to cardinal extremity downside cam 39 in that the base end side of engagement member 42 is slided, be arranged so that between the inclined-plane 53A of the projection 69 of roof pressure cam and cardinal extremity upside cam 53 and have no on the position of slipping in gap.
Keeping covering 45, is the member that is used for keeping engagement member 42 and releases member 43.Keep covering 45, shown in Figure 16,17, constituted by releasing member maintaining part 71 and engagement member maintaining part 72.
Release member maintaining part 71, be used to support to release the member that member 43 is allowed its rotation simultaneously.This releases member maintaining part 71, is made of peripheral panels 74 and top board 75.The formation that peripheral panels 74 covers the periphery of releasing member 43.75 formation that cover the upside of releasing member 43 of top board.The central portion of top board 75 is provided with and releases the onesize keyhole 76 of keyway 62 of member 43.This keyhole 76 covers under the state of releasing member 43 at top board 75 and the keyway 62 of release member 43 mates.So, engagement member 42 is under the state that takes in, and keyway 62 and keyhole 76 can mate.
Engagement member maintaining part 72 is the members that are used for supporting engagement member 42 under the sort of state that moves back and forth of engagement member 42 allowing.This engagement member maintaining part 72 is located at the left and right sides of releasing member maintaining part 71 respectively.Each engagement member maintaining part 72 is made of side plate 78 and top board 79.
Cover plate casting die 46 shown in Fig. 1,18,19, is to be used for and will to keep covering 45 members that are fixed on the manufacturing line usefulness recess 33 of lid 15.Particularly, two cover plate casting dies 46 hold on engagement member maintaining part 72 respectively, are fixed on the recess 33 and will keep covering 45.This cover plate casting die 46 supports plate 87 and downside to support that plate 88 is constituted by side plate 85, top board 86, upside.
Each side plate 85 covers engagement member 42 the right and lefts respectively, allows the action back and forth of engagement member 42.Top board 86 also covers the upside of engagement member 42 when supporting each side plate 85 integratedly, allow the action back and forth of engagement member 42.Upside is supported plate 87, is the member that holds on the top board 79 that keeps covering 45 engagement member maintaining part 72 from downside.The top board 79 of engagement member maintaining part 72 is to support plate 87 from holding on respectively up and down with the top board 86 and the upside of cover plate casting die 46.Downside is supported plate 88, is to be used for cover plate casting die 46 is fixed in the part of recess 33.Downside supports that plate 88 is provided with three respectively in the bottom of each side plate 85.Each downside is supported plate 88, by being embedded in the mode of the engaging claw 38 that is located on the recess 33, cover plate casting die 46 is fixed on the recess 33.Each downside is supported all to be respectively equipped with chock 88A on the plate 88, so that engaging claw 38 is easier to be chimeric.
Transport the downside of using lid 15 with lid 14 and manufacturing line, shown in Figure 20,21,22, be provided with wafer press part 91 and use as thin plate is fixing.This wafer press part 91 is to be used for holding on the member that is contained in the multi-disc semiconductor wafer in the vessel 12 from upside.Wafer press part 91 supports that by cardinal extremity support sector 92, elasticity board 93 and apical grafting sheet 94 are constituted.
Cardinal extremity support sector 92 is to be used to support elasticity to support the member of board 93 and apical grafting sheet 94.Cardinal extremity support sector 92 form across whole length of wafer press part 91 four jiaos bar-shaped, be fixed in the downside of lid.
Elasticity is supported board 93, is the member that is used for elastomeric support apical grafting sheet 94.Elasticity supports the number that board 93 is set up in parallel suitable with the semiconductor wafer sheet number that is contained in the vessel 12.Each elasticity is supported board 93, is arranged under the state that is listed as in line to be separately fixed in the cardinal extremity support sector 92.Elasticity is supported board 93, bends to first of S font by side view and supports plate 93A and bend to second of U font to support that plate 93B is constituted.First supports the base end part of plate 93A to be fixed in the cardinal extremity support sector 92, and leading section then is fixed on the first apical grafting sheet 94A.Second supports plate 93B, and its base end part supports plate 93A to connect to one by the first apical grafting sheet 94A with first, and leading section then is fixed with the second apical grafting sheet 94B.
Hornblock 96 possesses dip plane 96A and apical grafting face 96B.Dip plane 96A is to form and can open laterally under the state that two hornblocks 96 are installed relative to each other, and semiconductor wafer surrounding edge portion can be inserted easily between two hornblocks 96.Apical grafting face 96B is that formation has the groove of certain fabric width (than the wideer a little amplitude of semiconductor wafer thickness) and forms under the state that two hornblocks 96 are installed relatively.
Supporting pawl 97, is to be used for direct contact semiconductor wafer surrounding edge portion and the member supported.This supports pawl 97, is located at respectively on the apical grafting face 96B of each hornblock 96.Support that pawl 97 is to constitute with longilineal raised line, this supports that pawl 97 alternately is provided in respectively on each relative apical grafting face 96B.Particularly, establish two by apical grafting face 96B two ends one of therein and support pawls 97, then establish a mode of supporting pawl 97, make relative pawl 97 alternate with each other the setting of respectively supporting in another apical grafting face 96B central authorities.Each supports pawl 97 usefulness elastomeric materials to form, and can flexibly support semiconductor wafer surrounding edge portion.Fabric width between two apical grafting face 96B is because only wideer a little than semiconductor wafer thickness, so it is then narrower a little than semiconductor wafer thickness to be equipped on the interval of support pawl 97 front ends on each apical grafting face 96B.Therefore, when semiconductor wafer was respectively supported between the pawl 97 in insertion, each support pawl 97 that the elastomeric material that sets alternate with each other is constituted flattened a little a bit and inserts.So, the support pawl 97 that sets alternate with each other can hold on the surrounding edge portion of semiconductor wafer reliably.
With lid 15 outsides, be provided with lid connecting element 100 as shown in figure 23 at manufacturing line.This lid connecting element 100 is to be used to the member that prevents that manufacturing line from coming off from vessel 12 with lid 15.Lid connecting element 100 by: support that board 101, hook portion 102 and mosaic process 103 are constituted.
Supporting board 101, is the member that is used for supporting hook portion 102 and mosaic process 103.At the both ends of supporting board 101 hook portion 102 is set respectively.Hook the flange of vessel 12 with this hook portion 102.
The thin-plate supporting container 11 of formation as described above, can following illustrated such use:
From vessel 12 takes off manufacturing line with lid 15 when, the breech lock key is embedded in keyway 62 and is rotated.So, can be from the state of Figure 24 (A), rotation is released member 43 and is made engagement member 42 take in gradually.So, the front of the fulcrum 55 of engagement member 42 is slided and is met the inclined-plane 40A that face 55A promptly slidably is connected to front cam 40, shown in Figure 24 (B), (C), (D), front end fitting portion 56 is depressed downwards.At the same time, the base end side of engagement member 42 face that connects 52 that slides slides and is connected to the inclined-plane 39A of cardinal extremity downside cam 39, and with the base end part of engagement member 42 jack-up that makes progress.So, front end fitting portion 56 can be contained in the body 30 fully.And manufacturing line also can take off from vessel 12 with lid 15.
When manufacturing line was installed on vessel 12 with lid 15, mounting production line was embedded in keyway 62 with the breech lock key and is rotated with lid 15 on lid carrier 21.So can be opposite with above-mentioned explanation, engagement member 42 is extruded from body 30.At this moment, the slide inclined-plane 40A that is connected to front cam 40 and of the fulcrum 55 of engagement member 42 with front end fitting portion 56 jack-up upward.And, the inclined-plane 53A of cardinal extremity upside cam 53 also apical grafting in the projection 69 of roof pressure cam, with the base end part of engagement member 42 to pressing down.So, the base end side of engagement member 42 slides and to connect face 52 and can push up downwards along the inclined-plane 39A of cardinal extremity downside cam 39.
On the fulcrum 55 of engagement member 42, the front slip is met face 55A be embedded in chimeric recess 40B, make that engagement member 42 is that the center rotates with chimeric recess 40B.
In the base end part of engagement member 42, base end side slide the face that connects 52 slide be connected to the inclined-plane 39A of cardinal extremity downside cam 39 in, the projection 69 of roof pressure cam also apical grafting and is depressed the base end part of engagement member 42 downwards in the inclined-plane 53A of cardinal extremity upside cam 53.
So, engagement member 42 is a fulcrum with the fulcrum 55 that is embedded in chimeric recess 40B, the performance leverage, front end fitting portion 56 be embedded in lid carrier 21 second by the state of fitting portion 24 under, with manufacturing line with lid 15 to vessel 12 side brute forces depress fixing.
Manufacturing line is being installed under the state of vessel 12 with lid 15, is loading onto lid connecting element 100.Particularly, be flange part with hook portion 102 hook upper container bodies 12.So, can make mosaic process 103 be embedded in keyway 62 and will release member 43 and fix.
In the inside of vessel 12, the surrounding edge portion of semiconductor wafer is embedded in apical grafting sheet 94.In the apical grafting sheet 94, the surrounding edge portion of semiconductor wafer is embedded between the support pawl 97 that sets alternate with each other, support pawl 97 to support reliably with each.
When thin-plate supporting container 11 is subjected to from exterior intense impact, because engagement member 42 can push up manufacturing line to vessel 12, so manufacturing line can not come off from vessel 12 with lid 15 with lid 15 brute forces by lever principle.And, because it is fixing to release member 43 with lid connecting element 100, make engagement member 42 so also can not release member 43 rotations from second situation about being come off by fitting portion 24.
On the other hand, the semiconductor wafer in the thin-plate supporting container 11 because be embedded in the apical grafting sheet 94 of wafer press part 91, and with the support pawl 97 that sets alternate with each other from the both sides support, so semiconductor wafer can not come off from apical grafting sheet 94 yet.And apical grafting sheet 94 so the first support plate 93A and second supports plate 93B to be butted on manufacturing line and to hold on semiconductor wafer with lid 15 downsides with the elasticity of itself, prevents the breakage of semiconductor wafer because support board 93 to support by elasticity.
When cleaning, by the mode that staggers cover plate casting die 46 and take off from engaging claw 38, simple assembly and disassembling mechanism 32, can make engagement member 42, release member 43, cam mechanism 44, keep cover 45 and cover plate casting die 46 all separate, and can clean separately and drying.
As mentioned above, according to thin-plate supporting container 11, can realize following effect:
(1) because utilizes lever principle that engagement member 42 is released, so can brute force and reliably manufacturing line is fixed in vessel 12 with lid 15.
(2) because each constituent part of simple assembly and disassembling mechanism can both decompose easily,, not only the every nook and cranny can be thoroughly cleaned, also drying can be carried out rapidly so when cleaning, each constituent part that unloads can be decomposed.
(3) because support pawl 97 alternate with each other setting, thus respectively support the surrounding edge of 97 pairs of semiconductor wafers of pawl to replace apical grafting respectively, and can support more reliably.
(the 2nd embodiment)
Next, just the present invention the 2nd embodiment describes.Present embodiment is an improvement wafer press part.
Thin-plate supporting container can be because all factors cause vibrations in transporting the way.These vibrations are passed on when semiconductor wafer, and therefore semiconductor wafer may produce rotation, is very disadvantageous.Therefore, in the following time of situation that thin-plate supporting container may shake, can use the wafer press part (thin plate press part) of present embodiment.Based on Figure 34～Figure 43, the wafer press part 121 of present embodiment is described.Additional disclosure, except wafer press part 121, since all same with the thin-plate supporting container 11 of above-mentioned the 1st embodiment, so same member all uses same Reference numeral and omits its explanation.
Cardinal extremity support sector 122 is to be used for two elasticity that direct support is located at wafer press part 121 two ends respectively to support the member of boards 123.Cardinal extremity support sector 122 not only form four jiaos bar-shaped, also cross over the total length (above-below direction of Figure 35) of wafer press part 121 length directions and form.The downside of lid 127 is respectively equipped with two hook-shaped support sectors 128.Cardinal extremity support sector 122 embeds each hook-shaped support sector 128, and is fixed in the lid inner face side.
Elasticity supports that board 123 is to be used for elasticity to support the member of the external side end of apical grafting sheet 124.Two elasticity are supported boards 123, have and are contained in 120 same quantity of number of semiconductor wafer in the vessel 12 and setting arranged side by side.Each elasticity is supported board 123, is individually fixed in cardinal extremity support sector 122 under the state that laterally becomes row side by side.Elasticity is supported board 123 to bend to side view to become the S font and constitute.Two elasticity support the base end part of board 123 to be individually fixed in two cardinal extremity support sectors 122, and its leading section is equipped with apical grafting sheet 124 respectively, and flexibly supports each apical grafting sheet 124.
Apical grafting sheet 124 is direct apical graftings in the member that is used for directly supporting each semiconductor wafer 120 of the surrounding edge portion of each semiconductor wafer 120.One side of each apical grafting sheet 124 is provided with the V-shape embedded grooves 124A as Figure 42 and chimeric semiconductor wafer 120 shown in Figure 43.This embedded grooves 124A becomes two stage V word ditch.First section is to have 124 ° of angles and semi-steep groove.Second section then for having 44 ° of bevelled grooves of angle.So, when semiconductor wafer 120 edge contact to the first section groove, the slope guiding that these semiconductor wafer 120 edges are eased up and enter second section groove is supported semiconductor wafer 120 with this second section groove.The bottom of second section groove forms and the roughly the same wide cut of semiconductor wafer 120 thickness smooth planar.The angle of inclination of this second section groove and the amplitude of bottom, the size at conjunction with semiconductors wafer 120 edges forms.Because the edge of semiconductor wafer 120 is become 44 ° edge angle by rescinded angle, so the angle of inclination of groove also is set at 44 °.And, the width of channel bottom, the also size at conjunction with semiconductors wafer 120 edges and forming.So, second section groove can be caught the edge part of semiconductor wafer 120, and on large tracts of land more contact semiconductor wafer 120 and supporting reliably, also can suppress semiconductor wafer 120 rotations during vibrations.Additional disclosure, second section groove, the edge angle of conjunction with semiconductors wafer 120 and be set at 44 °, but because the relation of apical grafting sheet 124 materials also can be set at narrower angle a little.Particularly, all can in the scope about 40 °～44 ° of being set in of appropriateness according to the difference of elastic force.But because the too narrow words of angle of second section groove, will press from both sides the edge part of dead semiconductor wafer 120, when lifting lid 127, can produce situation about also lifting, so semiconductor wafer 120 is set at the angle that can not press from both sides dead semiconductor wafer 120 together with semiconductor wafer 120.In addition, in the different situation of the angle of bevel of semiconductor wafer 120, perhaps under the situations such as other thin plate outside the semiconductor wafer 120, can cooperate in the scope about 20 °～60 ° of being set in that angle is suitable.
The bottom of embedded grooves 124A, as Figure 40 and shown in Figure 41, be set at along the angle of the outside edge shape of semiconductor wafer 120, just set the tangential direction at the edge, outside of semiconductor wafer 120 for, as aftermentioned, the proportional enhancing of the sinuousness of elastic force and wafer press part 121, thus each apical grafting sheet 124 to push down the strength integral body of semiconductor wafer 120 all very average.In other words, the words that one of them variable quantity of two apical grafting sheets 124 increases, therefore variable quantity strengthens and the elastic force of another apical grafting sheet 124 sides is strengthened and semiconductor wafer 120 is slightly depressed, the elastic force of two apical grafting sheets 124 of relief is balance on the point of same intensity, but so the result make left and right sides automatic compensation become same elastic force.And, under lid 127 is installed on state on the vessel 12, be set near contacting of (the contact A among Figure 41) the substantial middle portion of embedded grooves 124A with the bottom.
Connect supporting board 125, is to be used for two apical grafting sheets 124 are connected to each other and the member supported.Connect and support the both ends of board 125 to be connected in each apical grafting sheet 124 respectively and flexibly to support each apical grafting sheet 124.Connection support board 125 bends to the side and roughly becomes U word shape to form.Particularly, vertical board 125A, 125B and the horizontal board 125C by both sides constituted.Vertically board 125A, 125B are provided in the direction vertical with the inside face of lid 127, each apical grafting sheet 124 of almost completely unbending support.
Laterally board 125C can elastomeric bending.Connect the elasticity of supporting board 125 and support the function of each apical grafting sheet 124, mainly take on by horizontal board 125C.Laterally the two ends of board 125C are under the state that connects vertical board 125A, 125B respectively, set along the direction of the inside face of lid 127.Horizontal board 125C, its central portion are supported with raised line 131 with support described later, are that the center makes its both ends bending with this support with raised line 131.
Laterally the elastic force that distortion took place of board 125C (promptly connecting the elastic force of supporting board 125 to be used for supporting apical grafting sheet 124) is set at than elasticity and supports board 123 to support that the elastic force of apical grafting sheet 124 is stronger.So, the medial extremity of two apical grafting sheets 124 is with stronger elastic force support, and external side end is then with more weak elastic force support.And the bottom of the embedded grooves 124A of two apical grafting sheets 124 as above-mentioned, is to be provided on the tangential direction at edge, outside of semiconductor wafer 120.So, wafer press part 121 is set at the proportional enhancing of amount of movement (shock momentum) along with semiconductor wafer 120 for the bearing capacity of semiconductor wafer 120.In other words, under general state, shown in the solid line among Figure 41, near semiconductor wafer 120 (the contact A among Figure 41) the substantial middle portion of embedded grooves 124A bottom contacts and supports.The words of vibrations take place in semiconductor wafer 120, apical grafting sheet 124 medial extremitys of being supported with the strong elastic power that connects support board 125 change hardly, the external side end of supporting the more weak elastic force of board 123 to support by elasticity then significantly changes, shown in the two point dotted line among Figure 41, it is distolateral that the support of semiconductor wafer 120 (the contact B side among Figure 41) bottom embedded grooves 124A moves to its inboard.So, in the time of the shock momentum of semiconductor wafer 120 less (amount of bow of wafer press part 121 is also less), semiconductor wafer 120 is supported by more weak elastic force with its outside distolateral (the contact A side among Figure 41) contact embedded grooves 124A, when the shock momentum of semiconductor wafer 120 increased (amount of bow of wafer press part 121 also increases), the contact point of semiconductor wafer 120 just moved to inboard distolateral (the contact B side among Figure 41) of embedded grooves 124A and is supported by the elastic force of brute force.And, the inwards distolateral mobile amount of movement of the contact point of semiconductor wafer 120 is big more, add and allly also support big many more of board 123, and elastic force also strengthens more, vibrations that therefore can more efficient inhibition semiconductor wafer 120 than elasticity in power that connect to support board 125.
Supporting with rib 126, is to be used for supporting to connect supporting board 125 to prevent the support member in the displacement on the direction of lid inside face.Support with rib 126, be located at central portion as lid 127 inside faces of Figure 34～shown in Figure 40.Support with rib 126 be made as can whole covering all be furnished with the connection support board 125 of most wafer press parts 121.Particularly, be set at: board 125 whole chimeric length are supported in the connection that the part by the sheet number of the semiconductor wafer 120 that is held can be set up in parallel.Support 129,130 formations with two supporting wall portions of rib 126 usefulness.
Each supporting wall portion 129,130 be arranged in parallel relative to each other.Each supporting wall portion 129,130 is by supporting that plate 133 and separation plate 134 are constituted.
Support that plate 133 is to be used for supporting to connect vertical board 125A, the 125B that supports board 125, make it not to the member of circumferencial direction (left and right directions of Figure 40) displacement of semiconductor wafer 120.Support plate 133 to connect the vertical board 125A that supports board 125, the method for 125B, support apical grafting sheet 124 that it is not subjected to displacement on the circumferencial direction of semiconductor wafer 120 indirectly by directly holding on.
Method by above-mentioned support plate 133 and separation plate 134, can by around (be contained in vessel 12 in the orthogonal directions of circumferencial direction of semiconductor wafer 120) clamp the mode that is connected support board 125 and supports respectively, prevent to take place, and can allow of the change of lid inside face in vertical direction along connecting the displacement of supporting board 125 lid inside face directions.
Support with between two supporting wall portions 129,130 of rib 126, be provided with as Figure 34, Figure 37～support raised line 131 shown in Figure 39.Supporting with raised line 131, is to be used for the member of supporting that board 125 is supported in each connection of direct apical grafting.Particularly, each horizontal board 125C middle body apical grafting that connects support board 125 is supported with raised line 131 in support, but the both ends free bend of horizontal board 125C.Support on the central portion between two the supporting wall portions 129,130 that be arranged in parallel relative to each other, to be made as 129,130 parallel and roughly the same length with supporting wall portion with raised line 131.
Support to become as Figure 38 and shown in Figure 39 with raised line 131.In other words, apical grafting sheet 124 center side of formation (a side of Figure 38) are thicker and both sides (the b side of Figure 38) is thinner, make the apical grafting sheet 124 that is positioned at center side, to swell than the apical grafting sheet 124 that is positioned at both sides towards semiconductor wafer 120 sides.In the present embodiment, arciform being bent to form of whole one-tenth.So, wafer press part 121 is loaded under the state of lid 127, and each connect to support the interval between board 125, as shown in figure 39, is set at the both sides broad and center side is narrower.This supports the concrete size with raised line 131, the suitable setting according to the amount of bow of lid 127.
Supporting why will so form with raised line 131, is according to following reason.As if installing lid 127 under the state that has held multi-disc semiconductor wafer 120 in vessel 12, to lid 127 certain antagonistic force can take place.Be loaded on the wafer press part 121 of lid inside face, because to every chip semiconductor wafer 120 all respectively with certain strength support, so when the enlarged diameter of semiconductor wafer 120 and big more to the bearing capacity of this chip semiconductor wafer 120, perhaps the sheet number is many more, and the antagonistic force of back pressure wafer press part 121 also can be big more.This antagonistic force makes that the lid 127 of loading onto wafer press part 121 is crooked a little laterally.And lid 127 is crooked laterally, supports the strength of semiconductor wafer 120 will weaken at central portion with wafer press part 121 thereupon.In order to eliminate the uneven problem of strength of such support semiconductor wafer 120, be provided with and support with raised line 131.The thicker support of center side can absorb the bending of lid 127 with raised line 131, makes wafer press part 121 to support each semiconductor wafer 120 with the strength of equalization.
The above thin-plate supporting container that constitutes can act on as follows:
Hold in vessel 12 under the state of multi-disc semiconductor wafer 120, install lid 127, wafer press part 121 just is embedded in each semiconductor wafer 120.Particularly, the embedded grooves 124A of each apical grafting sheet 124 can be embedded in the surrounding edge of each semiconductor wafer 120 respectively, the surrounding edge of each semiconductor wafer 120 is directed to the bottom of embedded grooves 124A.At this moment, be embedded under second section state in the groove at the edge part of semiconductor wafer 120, second section groove caught the edge part of semiconductor wafer 120, and can be supported reliably with large tracts of land contact semiconductor wafer 120.Each apical grafting sheet 124 then supports board 123 to support board 125 to support with being connected with elasticity.
Elasticity is supported board 123, under the state that its base end part is supported with the cardinal extremity support sector 122 of being fixed in lid 127 inside faces, comes the external side end of each apical grafting sheet 124 of elastomeric support with its leading section.Connect and support to hold on board 125 under the state of its central portion with rib 126, flexibly support the medial extremity of each apical grafting sheet 124 with its both side ends in support.
And, bend to arciform support with raised line 131, under the state that absorbs lid 127 bendings, support each apical grafting sheet 124.So, each apical grafting sheet 124 promptly can impartial strength be supported each semiconductor wafer 120.
In addition, the medial extremity of each apical grafting sheet 124 is supported that with relatively more powerful elastic force its external side end is then with the elastomeric support of more weak strength.At this moment, each apical grafting sheet 124, state in its embedded grooves 124A bottom along the tangential direction of each semiconductor wafer 120 surrounding edge contacts with each semiconductor wafer 120, simultaneously automatic compensation make the elastic force of two apical grafting sheets 124 become same intensity and make compress semiconductor wafer 120 single-piece strength can both be impartial, the more stable semiconductor wafer 120 that holds on.
In thin-plate supporting container such as transports at state, shake as thin-plate supporting container, then each semiconductor wafer 120 also can shake.And each apical grafting sheet 124 also can shake along with the vibrations of semiconductor wafer 120.
At this moment, shake less situation, because the amplitude of each apical grafting sheet 124 is less, so the contact of semiconductor wafer 120 and apical grafting sheet 124 is in the outside (for example near the contact A among Figure 41), mainly be that elasticity supports that board 123 bends, support it with more weak elastic force.
Shake when strong, the amplitude of each apical grafting sheet 124 is also bigger, but along with apical grafting sheet 124 significantly shakes and makes that the contact of semiconductor wafer 120 and each apical grafting sheet 124 is mobile towards inboard (for example the contact B among Figure 41 near), make the strength that connects 125 effects of support board support that than elasticity board 123 is big corresponding to this amount of movement, elastic force is also strengthened.Therefore, when semiconductor wafer 120 will significantly shake, apical grafting sheet 124 will be restrained the vibrations of semiconductor wafer 120 with the elasticity back pressure of brute force.So, according to the intensity of vibrations, support the strength of semiconductor wafer 120 also to change automatically, and can support semiconductor wafer 120 reliably.
Its result, all semiconductor wafers 120 can both simultaneously for from exterior vibrations, also can be suppressed to Min. with the vibrations of semiconductor wafer 120, and can prevent the rotation of semiconductor wafer 120 with the strength support of equalization.
Variation
(1) in above-mentioned the 1st embodiment, be to support board 93 and apical grafting sheet 94 to constitute wafer press part 91 with cardinal extremity support sector 92, elasticity, and shown in Figure 25,26,27, then support that with cardinal extremity support sector 110, elasticity board 111 and apical grafting sheet 112 are constituted.Elasticity is supported board 111, is the following end of supporting apical grafting sheet 112 of state that base end part is fixed in cardinal extremity support sector 110.And, elasticity is supported formation that board 111 extends with lid 15 downsides at manufacturing line from apical grafting sheet 112 other ends.Dip plane 112A on the apical grafting sheet 112 and the dip plane 96A of apical grafting face 112B and the foregoing description and apical grafting face 96B possess roughly same function.Supporting pawl 113, is alternately respectively to set three relatively respectively.This supports the number of pawl 113, sets according to need.
Such formation also has same purpose, can obtain same effect with the foregoing description.
(2) in above-mentioned the 1st embodiment, wafer press part 91 is to be monolateral support structure, and also for example Figure 28, bilateral support shown in Figure 29 are constructed.Elasticity supports board to be installed as to support between the apical grafting sheet and both sides that simultaneously, the elasticity between each apical grafting sheet is supported board, only leaves each apical grafting sheet of support under the state of gap S with lid 15 downsides at the distance manufacturing line.
So, elasticity between each apical grafting sheet is supported board, only has at the distance attachment face under the state of small distance to hold on the apical grafting sheet very much, therefore normally supports thin plate with very not strong strength.Because of carelessness with situations such as thin-plate supporting container drop, when suffering from exterior powerful impact, the buffering of gap S disappears and makes the elasticity between each apical grafting sheet support the board apical grafting in aerofoil for example, powerful each apical grafting sheet that holds on.The so influence that can protect thin plate not to be hit.
(3) in above-mentioned the 1st embodiment, be with supporting pawl 97 to support semiconductor wafer, also can supporting by hornblock.Shown in Figure 30,31 and the foregoing description same, under the state that two hornblocks 115 are relative, configuration alternate with each other.In other words, two one group of hornblocks that disposes relatively 115 keep the certain intervals distances mutually, and four groups of units are arranged respectively, configuration also alternate with each other simultaneously.And each the apical grafting face 115A in the middle of one group of hornblock 115 is set at respectively and vertical surface is 20 ° tilts and be 4 ° of inclinations.And apical grafting is set at 4 ° of angles in a side of semiconductor wafer.So, the surrounding edge of semiconductor wafer is that the angle of 4 ° of available sides (both sides are 8 °) is seized on both sides by the arms, and does not make semiconductor wafer that just supporting reliably of slip taken place.
In this case, each hornblock also can be arranged to shown in Figure 32,33.This be with based on above-mentioned Figure 28,29 illustrated almost same formations of example, also can bring into play same purpose and effect.
(4) in above-mentioned the 1st embodiment, be the example explanation that is used in the gland of thin board support vessel that uses on the manufacturing line, and also all can use equally taking care of, transport etc. under the situation.These occasions also can be brought into play and the foregoing description same purpose and effect.
(5) in above-mentioned the 1st embodiment, be that to be provided with two simple assembly and disassembling mechanisms 32 on lid 15 at manufacturing line be the example explanation, and, also can establish more than one or three according to conditions such as specifications.
(6) in above-mentioned the 1st embodiment, be that the container that is used in the holding semiconductor wafer with gland of thin board support vessel is that example is illustrated, but be not limited to semiconductor wafer that the container that holds other thin plate also can use equally.This situation is also brought into play and the foregoing description same purpose and effect.
(7) in above-mentioned the 1st embodiment and variation, be as the thin plate casting die of supporting to be contained in the thin plate in the vessel with the wafer press part, be used in the thin-plate supporting container 11 of the foregoing description, but the present invention is not limited to this example, the thin-plate supporting container of other structure also all can use.This situation also can be brought into play and the foregoing description same purpose and effect.
(8) in above-mentioned the 1st embodiment, be that lid connecting element 100 is used in thin-plate supporting container 11, but the present invention is not limited to this example, the thin-plate supporting container of other structure also all can use.This situation also can be brought into play and the foregoing description same purpose and effect.
(9) in above-mentioned the 2nd embodiment, be the apical grafting sheet 124 that is provided with two wafer press parts 121, but also can be provided with more than three.The situation of three above apical grafting sheets 124 is set, between each apical grafting sheet 124, is provided with to connect and supports board 125 and support to use rib 126.This situation also can be brought into play and the foregoing description same purpose and effect.
(10) in above-mentioned the 2nd embodiment, be with supporting to support horizontal board 125C, supporting to use projection but also can establish at horizontal board 125C central portion with raised line 131.Establishing support, support also can establish also and can not establish with raised line 131 with under the situation of projection.Support use projection, be provided with the situation of supporting with raised line 131, apical grafting is in supporting with raised line 131, and do not establishing the situation of supporting to use raised line 131, and then apical grafting is in lid 127 inside faces, to support horizontal board 125C.
Do not establishing the situation of supporting with raised line 131, laterally the support of board 125C central portion as above-mentioned the 2nd embodiment, is set at center side than both sides height with the height of projection.And being provided with the situation of supporting with raised line 131, the support of then setting horizontal board 125C central portion is with projection and support to make its center side than both sides height height with both height sum totals of raised line 131.This situation also can be brought into play and above-mentioned the 2nd embodiment same purpose and effect.
(11) in above-mentioned the 2nd embodiment, the embedded grooves 124A of apical grafting sheet 124 is into the formation of V word shape, but also can be equipped with the supporting pieces that sets alternate with each other to apical grafting sheet 124 as the apical grafting sheet 94 of above-mentioned the 1st embodiment.In other words, the apical grafting sheet 124 of the 2nd embodiment also can constitute with two hornblocks 96 and the support pawl 97 (supporting pieces) that sets alternate with each other as the apical grafting sheet 94 of the 1st embodiment.So, the supporting pieces that sets alternate with each other can be supported semiconductor wafer 120 reliably to the surrounding edge of semiconductor wafer 120 apical grafting alternate with each other.Its result for from exterior vibrations, can be suppressed at the vibrations of semiconductor wafer 120 in the Min., and can also prevent semiconductor wafer 120 rotations reliably.
(12) be used for supporting the formation of the apical grafting sheet 124 of wafer press part 121, be not limited to the 2nd embodiment, also other formation.For example can make the apical grafting sheet 124 that is positioned at center side than being positioned at both sides, more the formation that sets to semiconductor wafer 120 sides protuberance.
For example, also can form elasticity and support board 123, make the apical grafting sheet 124 that is positioned at center side more set to semiconductor wafer 120 sides protuberance than the apical grafting sheet 124 that is positioned at both sides, also can set elasticity and support board 123 or connect one of them or both that support board 125, make the apical grafting sheet 124 that is positioned at center side more swell to semiconductor wafer 120 than the apical grafting sheet 124 that is positioned at both sides.
(13) in above-mentioned the 2nd embodiment, be with supporting to support to connect support board 125, still also can projection supporting with rib 126.Particularly, as shown in figure 44, by be located at that to be connected the embedded hole of supporting on the board 125 141 chimeric, prevent along connecting the displacement of supporting board 125 lid inside faces and allow the mosaic process 142 that it changes on lid inner face vertical direction, support to connect and support board 125.This situation also can be brought into play and above-mentioned the 2nd embodiment same purpose and effect.
(14) among above-mentioned the 2nd embodiment, the bottom of the embedded grooves 124A of the V word shape of apical grafting sheet 124 forms smooth planar, and roughly the same with the thickness of semiconductor wafer 120, but the formation of such as shown in figure 45 bottom is very thin also passable.Particularly, apical grafting sheet 151 has V word ditch 151A, and it has and 44 ° at 44 ° of identical angles of inclination of edge angle of the edge part of semiconductor wafer 152.In addition, this V word shape ditch 151A can also be set at 2 sections angle, perhaps 1 section angle.
The bottom of this V word shape ditch 151A, the temperature of the ratio semiconductor wafer 152 of formation is also thin.So, under the chimeric state of going into V word shape ditch 151A of semiconductor wafer 152, between the bottom of the edge part of this semiconductor wafer 152 and above-mentioned V word ditch 151A, form gap 153, support semiconductor wafer 152 by the dip plane of above-mentioned V word shape ditch 151A.At this moment, because the leaning angle of the V word shape ditch 151A of the edge angle of the edge part of semiconductor wafer 152 and apical grafting sheet 151 all is 44 °, the edge part of semiconductor wafer 152 can contact with bigger area with the dip plane of V word shape ditch 151A.
And, owing between the bottom of the edge part of semiconductor wafer 152 and V word shape ditch 151A, have gap 153, not the edge part of directly supporting semiconductor wafer 152, the result is the embedding V word ditch 151A the edge part V word shape of semiconductor wafer 152.So, the roof pressure with the edge part brute force of semiconductor wafer 152 is installed on the dip plane of V word ditch 151A.
The result is, even the thin plate press part is installed on the semiconductor wafer 152 with less strong compressing, apical grafting sheet 151 that also can enough this thin plate press parts is supported semiconductor wafer 152 reliably, the rotation of the semiconductor wafer 152 that causes such as prevents to vibrate.So, lid is installed on the vessel and also can supports semiconductor wafer 152 reliably with less strong pushing, the rotation of the semiconductor wafer 152 that causes such as prevent to vibrate.So, need not increase the intensity of lid.So, can carry out the automation of the handling labor of lid easily.
In addition, the leaning angle of the V word shape ditch 151A of apical grafting sheet 151 is set at 20 °-60 °, also can obtain and above-mentioned same effect, effect.In the case, semiconductor wafer 152 is embedded in the V word shape ditch 151A of apical grafting sheet 151, and the edge part of this semiconductor wafer 152 embeds among the V word shape ditch 151A.At this moment, V word shape ditch 151A gets leaning angle and is set at 20 °-60 °, can reliably and carry out the support and the loading and unloading of semiconductor wafer 152 easily.In other words, semiconductor wafer 152 is entrenched on the V word shape ditch 151A, the edge part of semiconductor wafer 152 is embedded supporting of V word shape ditch 151A.At this moment, the leaning angle of V word shape ditch 151A is set at more than 60 °, semiconductor wafer 152 causes producing rotation inadequately to the embedding of V word shape ditch 151A.In fact, the experiment that is set at 60 ° from the leaning angle of V word shape ditch 151A be it seems, and is rare because the rotation that the outside vibration of transmitting causes.Leaning angle surpasses 60 °, and the rotation that the outside vibration of transmitting causes just takes place easily.And, with apical grafting sheet 151 when semiconductor wafer 152 breaks away from, also need not embed the semiconductor wafer 152 of V word shape ditch 151A, pull out separation that can be level and smooth from V word shape ditch 151A.At this moment, the leaning angle of V word shape ditch 151A is set in below 20 °, when semiconductor wafer 152 breaks away from, the situation that this semiconductor wafer 152 is taken off that semiconductor wafer 152 is pulled out from V word shape ditch 151A can take place at apical grafting sheet 151.In fact, the experiment that is set at 20 ° from the leaning angle with V word shape ditch 151A it seems, semiconductor wafer 152 is rare pulls out semiconductor wafer 152 from V word shape ditch 151A, and semiconductor wafer 152 is taken off from vessel.Leaning angle is below 20 °, easily the situation of pulling out.
Thus, preferably the leaning angle of V word shape ditch 151A is set at 20 °-60 °.So, can have the rotation that the embedding to V word shape ditch 151A that prevents semiconductor wafer 152 causes concurrently, with the level and smooth effect of separating.
So, when supporting semiconductor wafer 152 reliably, can also carry out the loading and unloading of lid easily, realize the automation of the loading and unloading of lid.
In addition, be set in 20 °-60 °, preferably between the bottom of the V word shape ditch 151A of the edge part of semiconductor wafer 152 and apical grafting sheet 151, the gap be set at the leaning angle of V word shape ditch 151A.In the case, when being entrenched in semiconductor wafer 152 on the V word shape ditch 151A, make the bottom of the edge part of semiconductor wafer 152 and V word shape ditch 151A not come in contact mutually, the dip plane of the edge part of the installation semiconductor wafer 152 that brute force compresses and V word shape ditch 151A is with the support reliably of semiconductor wafer 152 embedding V word shape ditch 151A.And said method also can load and unload easily.
(15) among above-mentioned the 2nd embodiment, the support of lid 127 is supported each semiconductor wafer 120 with the thick bending that absorbs lid 127 of the center side setting of raised line 131, the impartial power of wafer press part 121 usefulness, can also self improve lid 127.
Particularly, the central portion of flat lid 127 is offset the bending that each semiconductor wafer 120 causes to vessel side depression.In other words, when being installed in lid 127 on the vessel, each semiconductor wafer 120, the central portion that makes it of back pressure lid 127 are crooked laterally, in advance the central portion formation of lid 127 are offset this bending to the depression of above-mentioned vessel side.So, when the central portion of lid 127 was crooked laterally, this bending formed smooth state by the absorption of caving in and offsets, and can support all each semiconductor wafers 120 with impartial power by the wafer press part.
The central portion of this lid 127 is to the size of the depression of vessel side, and the condition of exerting oneself or the like such as the different outbreak that causes corresponding to sheet number of semiconductor wafer 120 etc. is set.In addition, the shape of depression also can be corresponding to dome shape, ellipsoid, and the state of the distortion that the antagonistic force of aspherical surface shape etc. etc. causes is supported the suitable setting of state of semiconductor wafer 120 according to the power of their equalization of the enough counteractings of energy.So, power that can enough equalizations is supported all each semiconductor wafers 120, the rotation of the semiconductor wafer 120 that causes such as prevents to vibrate.In addition, in the case, the support of lid 127 is set at both end sides and center side and has same thickness with raised line 131.And the bending of lid 127 with the depression of the central portion of lid 127 with support to absorb with the thickness of raised line 131, can also be adjusted with both of the thickness of raised line 131 depression of the central portion of these lids 127 and support.
Can also make the enhancing flanges flex on every side of lid 127.In other words, the antagonistic force that each semiconductor wafer 120 produces, the distortion that the enhancing that forms around lid 127 causes with flange can also be offset the distortion of this enhancing with flange with being pre-formed to the bending of vessel side.
Thin plate press part apical grafting is in the time of the support semiconductor wafer 120 of semiconductor wafer 120, its antagonistic force makes that also being formed on lid enhancing on every side also is out of shape laterally with flange, by this being strengthened with flange, absorb this distortion laterally in advance to the bending of vessel side.In other words, the enhancing of prebending is offset it with respect to distortion laterally with flange and is formed linearity, supports all each semiconductor wafers 120 with uniform power.Strengthen concrete size with flange, identical with the occasion of the central portion of lid 127, suitable being set to can absorb distortion with its counteracting size and dimension.Can also be with the form that strengthens with the central portion depression of the form of the bending of flange and above-mentioned lid 127, and adjust the form of supporting with the thickness of raised line 131 and carry out suitable combination.
And, can also be shaped at embed (insert) that the enhancing that forms around the lid 127 adds reinforcement on flange.So, increased the intensity that strengthens with flange, can resist the antagonistic force of each semiconductor wafer 120, supported all each semiconductor wafers 120 with uniform power.Also be in the case, can will strengthen with the form that adds the enhancing of reinforcement in the flange, with the form that strengthens with the central portion depression of the form of flanges flex and above-mentioned lid 127, and adjust the form of supporting with the thickness of raised line 131 and carry out suitable combination.
Under these situations, also can obtain the effect same, effect with the various embodiments described above.
Claims (3)
1. gland of thin board support vessel, the gland of thin board support vessel that the vessel of the thin-plate supporting container that content multi-disc thin plate is carried clogs is characterized by:
Possess can be easily to the said vesse body fixes and static solution removes self-mountable ﹠ dismountuble simple assembly and disassembling mechanism; This simple assembly and disassembling mechanism possesses:
Engagement member, it can stretch out and be engaged in the said vesse base side;
Release member, it can stretch out retraction with this engagement member binding;
The front cam, it pushes up the front of above-mentioned engagement member on one side when utilizing above-mentioned release member to release above-mentioned engagement member; And
The base end side cam, its when releasing above-mentioned engagement member, with the base end side top of above-mentioned engagement member to another side;
Above-mentioned front cam possesses above-mentioned engagement member front is pushed up sidewise inclined-plane;
Above-mentioned base end side cam possesses the inclined-plane of above-mentioned engagement member base end side top to another side.
2. gland of thin board support vessel as claimed in claim 1 wherein, is provided with the fulcrum of the rotation of engagement member in above-mentioned engagement member front.
3. as the gland of thin board support vessel of claim 1 or 2, wherein, above-mentioned simple assembly and disassembling mechanism is made as and can freely loads and unloads, and its constituent part also is assembled into and can separately disassembles simultaneously.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410085645 CN1760092B (en) | 2004-10-14 | 2004-10-14 | Gland of thin board support vessel |
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| CN 200410085645 CN1760092B (en) | 2004-10-14 | 2004-10-14 | Gland of thin board support vessel |
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| CN 201010521491 Division CN102001482B (en) | 2004-10-14 | 2004-10-14 | Cover body for thin-plate supporting container |
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| CN1760092B true CN1760092B (en) | 2010-12-22 |
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| US8356713B2 (en) * | 2007-11-09 | 2013-01-22 | Shin-Etsu Polymer Co., Ltd. | Retainer and substrate storage container |
| CN102339777B (en) * | 2010-07-15 | 2013-09-11 | 家登精密工业股份有限公司 | Wafer limiting piece of wafer box |
| CN102569138B (en) * | 2010-12-10 | 2016-05-11 | 台湾积体电路制造股份有限公司 | Wafer case |
| JP6096776B2 (en) * | 2011-08-12 | 2017-03-15 | インテグリス・インコーポレーテッド | Wafer transfer device |
| JP6579933B2 (en) * | 2015-12-09 | 2019-09-25 | 信越ポリマー株式会社 | Substrate storage container |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990014273A1 (en) * | 1989-05-19 | 1990-11-29 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
| US5711427A (en) * | 1996-07-12 | 1998-01-27 | Fluoroware, Inc. | Wafer carrier with door |
| WO1999006305A1 (en) * | 1997-08-01 | 1999-02-11 | Fluoroware, Inc. | Wafer enclosure with door |
| US5931512A (en) * | 1997-07-23 | 1999-08-03 | Industrial Technology Research Institute | Latch mechanism for wafer container |
-
2004
- 2004-10-14 CN CN 200410085645 patent/CN1760092B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990014273A1 (en) * | 1989-05-19 | 1990-11-29 | Asyst Technologies, Inc. | Sealable transportable container having improved latch mechanism |
| US5711427A (en) * | 1996-07-12 | 1998-01-27 | Fluoroware, Inc. | Wafer carrier with door |
| US5931512A (en) * | 1997-07-23 | 1999-08-03 | Industrial Technology Research Institute | Latch mechanism for wafer container |
| WO1999006305A1 (en) * | 1997-08-01 | 1999-02-11 | Fluoroware, Inc. | Wafer enclosure with door |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1760092A (en) | 2006-04-19 |
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Correction item: Inventor (first inventor) Correct: Matsushima Chigira False: Matsushima Chiaki Number: 16 Volume: 22 |
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| CI02 | Correction of invention patent application |
Correction item: Inventor (first inventor) Correct: Matsushima Chigira False: Matsushima Chiaki Number: 16 Volume: 22 |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR ( THE FIRST INVENTOR ); FROM: CHIAKI MATSUSHIMA TO: CHIAKI SONG |
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Free format text: CORRECT: INVENTOR ( THE FIRST INVENTOR ); FROM: CHIAKI MATSUSHIMA TO: CHIAKI SONG |
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Address after: Japan Tokyo East Ikebukuro, Toshima 1-24-1 Patentee after: Future Co., Ltd. Address before: Tokyo, Japan, Japan Patentee before: Future Co., Ltd. |