CN113519031A - 导电性粒子、导电材料以及连接结构体 - Google Patents
导电性粒子、导电材料以及连接结构体 Download PDFInfo
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- CN113519031A CN113519031A CN202080017319.9A CN202080017319A CN113519031A CN 113519031 A CN113519031 A CN 113519031A CN 202080017319 A CN202080017319 A CN 202080017319A CN 113519031 A CN113519031 A CN 113519031A
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Images
Classifications
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
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PCT/JP2020/008458 WO2020175691A1 (ja) | 2019-02-28 | 2020-02-28 | 導電性粒子、導電材料及び接続構造体 |
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KR (1) | KR20210130152A (ko) |
CN (1) | CN113519031B (ko) |
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JP2023146209A (ja) * | 2022-03-29 | 2023-10-12 | デクセリアルズ株式会社 | 接続構造体及びその製造方法 |
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US20020175316A1 (en) * | 2001-03-06 | 2002-11-28 | Fujitsu Limited | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method |
JP2005203319A (ja) * | 2004-01-19 | 2005-07-28 | Sekisui Chem Co Ltd | 被覆導電粒子、異方性導電材料及び導電接続構造体 |
JP2015044987A (ja) * | 2013-08-02 | 2015-03-12 | 積水化学工業株式会社 | 基材粒子、導電性粒子、導電材料及び接続構造体 |
JP2016015312A (ja) * | 2014-06-11 | 2016-01-28 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
JP2016085988A (ja) * | 2014-10-28 | 2016-05-19 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
CN107112072A (zh) * | 2014-11-17 | 2017-08-29 | 积水化学工业株式会社 | 导电性粒子、导电材料及连接结构体 |
Family Cites Families (8)
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JP2004124176A (ja) * | 2002-10-02 | 2004-04-22 | Asahi Glass Co Ltd | 導電性粒子およびその製造方法 |
JP4563110B2 (ja) * | 2004-08-20 | 2010-10-13 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
JP4852311B2 (ja) * | 2006-01-12 | 2012-01-11 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び導電接続構造体 |
JP5074082B2 (ja) * | 2007-04-16 | 2012-11-14 | ソニーケミカル&インフォメーションデバイス株式会社 | 導電性粒子体及びこれを用いた異方性導電接続材料、並びに導電性粒子体の製造方法 |
JP4957695B2 (ja) | 2007-10-02 | 2012-06-20 | 日立化成工業株式会社 | 導電粒子、その製造方法及び絶縁被覆導電粒子の製造方法、並びに異方導電性接着剤フィルム |
JP5457655B2 (ja) * | 2008-09-17 | 2014-04-02 | 積水化学工業株式会社 | 導電性微粒子、異方性導電材料、及び、導電接続構造体 |
JP2013020721A (ja) | 2011-07-07 | 2013-01-31 | Hitachi Chem Co Ltd | 導電粒子 |
CN105513673B (zh) * | 2016-02-03 | 2017-07-07 | 郑州职业技术学院 | 一种导电粒子及其制备方法 |
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- 2020-02-28 JP JP2020538860A patent/JPWO2020175691A1/ja active Pending
- 2020-02-28 WO PCT/JP2020/008458 patent/WO2020175691A1/ja active Application Filing
- 2020-02-28 CN CN202080017319.9A patent/CN113519031B/zh active Active
- 2020-03-02 TW TW109106737A patent/TWI841692B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020175316A1 (en) * | 2001-03-06 | 2002-11-28 | Fujitsu Limited | Conductive particles, conductive composition, electronic device, and electronic device manufacturing method |
JP2005203319A (ja) * | 2004-01-19 | 2005-07-28 | Sekisui Chem Co Ltd | 被覆導電粒子、異方性導電材料及び導電接続構造体 |
JP2015044987A (ja) * | 2013-08-02 | 2015-03-12 | 積水化学工業株式会社 | 基材粒子、導電性粒子、導電材料及び接続構造体 |
JP2016015312A (ja) * | 2014-06-11 | 2016-01-28 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体 |
JP2016085988A (ja) * | 2014-10-28 | 2016-05-19 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
CN107112072A (zh) * | 2014-11-17 | 2017-08-29 | 积水化学工业株式会社 | 导电性粒子、导电材料及连接结构体 |
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JPWO2020175691A1 (ja) | 2021-12-23 |
CN113519031B (zh) | 2024-09-13 |
WO2020175691A1 (ja) | 2020-09-03 |
KR20210130152A (ko) | 2021-10-29 |
TW202044283A (zh) | 2020-12-01 |
TWI841692B (zh) | 2024-05-11 |
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