CN113518539A

CN113518539A - Heat dissipation device and electronic equipment

Info

Publication number: CN113518539A
Application number: CN202110420372.XA
Authority: CN
Inventors: 朱义为; 姜华文
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-04-19
Filing date: 2021-04-19
Publication date: 2021-10-19

Abstract

The application provides a heat dissipation device and an electronic device. The heat dissipating device includes: a base plate; the cover plate assembly comprises a cover plate and a capillary structure, the bottom plate and the cover plate enclose a cavity, the cavity is in a negative pressure state, and the cavity comprises an evaporation section and a condensation section which are oppositely arranged; the capillary structure is positioned in the evaporation section and is arranged close to the cover plate, the thermal resistance of the part of the cover plate component corresponding to the evaporation section is first thermal resistance, the thermal resistance of the part of the cover plate component corresponding to the condensation section is second thermal resistance, and the first thermal resistance is smaller than the second thermal resistance; and the liquid absorbing core is positioned in the cavity and arranged between the capillary structure and the bottom plate, the liquid absorbing core is used for storing a condensation medium, and the condensation medium fills the cavity. The heat dissipation device has high heat dissipation efficiency.

Description

Heat dissipation device and electronic equipment

Technical Field

The application relates to the field of electronics, concretely relates to heat abstractor and electronic equipment.

Background

The vapor chamber is widely applied to electronic equipment for efficient heat transfer to dissipate heat of the electronic equipment, but the conventional vapor chamber has a low heat transfer effect and low heat dissipation efficiency for high-efficiency electronic equipment.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a heat dissipation device having a high heat dissipation efficiency.

The embodiment of the application provides a heat abstractor, it includes:

a base plate;

the cover plate assembly comprises a cover plate and a capillary structure, the bottom plate and the cover plate enclose a cavity, the cavity is in a negative pressure state, and the cavity comprises an evaporation section and a condensation section which are oppositely arranged; the capillary structure is positioned in the evaporation section and is arranged close to the cover plate, the thermal resistance of the part of the cover plate component corresponding to the evaporation section is first thermal resistance, the thermal resistance of the part of the cover plate component corresponding to the condensation section is second thermal resistance, and the first thermal resistance is smaller than the second thermal resistance; and

the wick is located in the cavity, set up in the capillary structure with between the bottom plate, the wick is used for storing the condensation medium, the condensation medium filling part the cavity.

Based on the same inventive concept, a further embodiment of the present application provides an electronic device, which includes:

the heat dissipation device of the embodiment of the application; and

the heat source is arranged on one side, far away from the cover plate, of the bottom plate and is close to the evaporation section.

The heat abstractor of this application embodiment sets up the capillary structure in the position that corresponds the evaporation zone of apron to make heat abstractor's capillary pressure increase, increased the speed of the liquid condensing medium backward flow of condensation zone, thereby make heat abstractor's radiating efficiency increase. In addition, the thermal resistance of the part of the cover plate assembly corresponding to the evaporation section is larger than the thermal resistance of the part of the cover plate assembly corresponding to the condensation section, and the thermal resistance is the second thermal resistance, so that the heat transfer speed of the evaporation section is higher, the liquid condensing medium can be evaporated in the evaporation section more quickly, and the heat dissipation speed of the heat dissipation device is further increased.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view along the P-P direction of the heat dissipation device according to the embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a heat dissipation device according to an embodiment of the present application, taken along the direction Q-Q.

Fig. 4 is a schematic cross-sectional structure diagram of a heat dissipation device according to an embodiment of the present application.

Fig. 5 is a schematic structural view of a capillary structure according to an embodiment of the present application.

Fig. 6 is a schematic structural view of a capillary structure according to yet another embodiment of the present application.

Fig. 7 is a schematic structural view of a capillary structure according to still another embodiment of the present application.

Fig. 8 is a schematic structural view of a capillary structure according to still another embodiment of the present application.

Fig. 9 is a schematic structural view of a capillary structure according to yet another embodiment of the present application.

Fig. 10 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.

Fig. 11 is an exploded schematic view of an electronic device according to an embodiment of the present disclosure.

Description of reference numerals:

100-heat sink 33-capillary structure

10-bottom 331-capillary

11-first groove 332-Rib

20-Chamber 333-capillary

21-evaporation section 3301-convex strip group

22-flow section 35-support

23-condensation section 50-wick

30-cover plate assembly 200-electronic device

31-cover plate 210-heat source

311-second recess

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Referring to fig. 1 to 4, an embodiment of the present invention provides a heat dissipation apparatus 100 including: a base plate 10, a cover plate assembly 30, and a wick 50. The cover plate assembly 30 includes a cover plate 31 and a capillary structure 33, the bottom plate 10 and the cover plate 31 enclose a cavity 20, the cavity 20 is in a negative pressure state (i.e., a vacuum state, in other words, the cavity 20 is a vacuum cavity), and the cavity 20 includes an evaporation section 21 and a condensation section 23 which are oppositely arranged; the capillary structure 33 is located in the evaporation section 21, the capillary structure 33 is arranged close to the cover plate 31, the thermal resistance of the part of the cover plate assembly 30 corresponding to the evaporation section 21 is a first thermal resistance, the thermal resistance of the part of the cover plate assembly 30 corresponding to the condensation section 23 is a second thermal resistance, and the first thermal resistance is smaller than the second thermal resistance; the wick 50 is located in the cavity 20 and disposed between the capillary structure 33 and the bottom plate 10, the wick 50 is used for storing a condensing medium and providing capillary pressure for the liquid flowing from the condensing section 23 to the evaporating section 21, and the condensing medium fills part of the cavity 20.

Optionally, in a direction perpendicular to the stacking direction of the cover plate 31 and the bottom plate 10, a thermal resistance of a portion of the cover plate assembly 30 corresponding to the evaporation section 21 is a first thermal resistance, a thermal resistance of a portion of the cover plate assembly 30 corresponding to the condensation section 23 is a second thermal resistance, and the first thermal resistance is smaller than the second thermal resistance.

Alternatively, the heat sink 100 may be, but not limited to, a Vapor Chamber (VC), a heat pipe, or the like capable of dissipating or transferring heat.

Alternatively, the condensing medium may be, but is not limited to, at least one of water, alcohol, and the like. The condensing medium may undergo a phase change upon absorption or release of heat, such as from a gaseous state to a liquid state, from a liquid state to a gaseous state, and the like. Alternatively, the height of the condensation medium filling is greater than 0.8 of the height of the wick 50 (along the stacking direction of the bottom plate 10 and the cover plate 31) and less than 1.2 of the height of the wick 50 when the heat sink 100 is horizontally placed (i.e. the bottom plate 10 and the cover plate 31 are horizontally placed, and the bottom plate 10 is downward and the cover plate 31 is upward), and specifically, may be, but is not limited to, 0.8, 0.9, 1.1, 1.2, and the like. In one embodiment, the condensation medium fills the wick 50 to a height equal to the height of the condensation medium, i.e., the condensation medium fills the wick 50 just below the condensation medium when the heat dissipation device 100 is horizontally positioned, i.e., the condensation medium fills the entire wick 50.

When the heat dissipation device 100 is used, the position of the side, away from the cover plate 31, of the bottom plate 10, corresponding to the condensation section 23 is close to a heat source, a condensation medium (for example, water) in the evaporation section 21 is heated and then evaporated and gasified to become a gaseous condensation medium (steam), the gaseous condensation medium rapidly flows from the evaporation section 21 to the condensation section 23 to fill the whole cavity 20 (a vacuum cavity between the wick 50 and the cover plate 31) into the condensation section 23, when the gaseous condensation medium contacts a relatively cold region of the condensation section 23, the gaseous condensation medium is condensed to become a liquid condensation medium and releases heat, the condensed liquid condensation medium flows back to the evaporation section 21 from the condensation section 23 under the capillary pressure action of the wick 50 and the capillary structure 33, and the circulation is performed, so that the heat emitted by the heat source is transferred to various positions of the heat dissipation device 100 through the heat dissipation device 100 to dissipate heat.

The heat dissipation device 100 of the embodiment of the present application is provided with the capillary structure 33 at the position of the cover plate 31 corresponding to the evaporation section 21, so that the capillary pressure of the heat dissipation device 100 is increased, the speed of the liquid state condensation medium backflow of the condensation section 23 is increased, and the heat dissipation efficiency of the heat dissipation device 100 is increased. In addition, the thermal resistance of the part of the cover plate assembly 30 corresponding to the evaporation section 21 is greater than the thermal resistance of the part of the cover plate assembly 30 corresponding to the condensation section 23, which is the second thermal resistance, so that the heat transfer speed of the evaporation section 21 is faster, and the liquid-state condensation medium can evaporate in the evaporation section 21 faster, in other words, the speed of heat transfer from the heat source to the evaporation section 21 of the heat dissipation device 100 is increased, and the heat dissipation speed of the heat dissipation device 100 is further increased.

Alternatively, the thickness of the heat sink 100 (i.e., the height in the stacking direction of the cover plate 31 and the base plate 10) may be 0.2mm to 0.5mm, and specifically, may be, but is not limited to, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, and the like.

Optionally, the cavity 20 further includes a flow section 22, and the flow section 22 is located between the evaporation section 21 and the condensation section 23 and connects the evaporation section 21 and the condensation section 23. During heat dissipation, the gaseous condensing medium flows from the evaporation section 21 to the condensation section 23 through the flow section 22 (as shown by arrow a in fig. 4), and the liquid condensing medium flows from the condensation section 23 to the evaporation section 21 through the flow section 22 (as shown by arrow B in fig. 4).

Alternatively, the depth of the cavity 20 (i.e., the height in the stacking direction of the cover plate 31 and the base plate 10) may be 0.12mm to 0.4mm, and specifically, may be, but is not limited to, 0.12mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, and the like.

In some embodiments, the base plate 10 has a first recess 11, and when the base plate 10 is assembled with the cover plate assembly 30, the first recess 11 forms at least part of the cavity 20, in other words, the first recess 11 is the cavity 20, or the first recess 11 is a part of the cavity 20. In other embodiments, the bottom plate 10 may also be a flat plate structure, and the cavity 20 is formed in the cover plate 31. Optionally, the material of the base plate 10 may be copper, aluminum, iron, or other materials with high thermal conductivity or high thermal conductivity, so as to increase the heat dissipation speed of the heat dissipation device 100. Alternatively, the first groove 11 may be formed by an etching process such as laser, and the application is not limited in particular. Alternatively, the depth of the first groove 11 (i.e., the height in the stacking direction of the cover plate 31 and the base plate 10) may be 0.04mm to 0.4mm, and specifically, may be, but is not limited to, 0.04mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, and the like.

In some embodiments, the cover plate 31 has a second groove 311, and when the bottom plate 10 is assembled with the cover plate assembly 30, the second groove 311 forms at least a part of the cavity 20, in other words, the second groove 311 is the cavity 20, or the second groove 311 is a part of the cavity 20. In other embodiments, the cavity 20 may also be formed on the bottom plate 10. Optionally, the material of the cover plate 31 may be copper, aluminum, iron, or other materials with high thermal conductivity or high thermal conductivity, so as to increase the heat dissipation speed of the heat dissipation device 100. Optionally, the second groove 311 may be formed by an etching process such as laser, and the application is not limited in particular. Alternatively, the depth of the second recess 311 (i.e., the height in the stacking direction of the cover plate 31 and the base plate 10) may be 0.04mm to 0.4mm, and specifically, may be, but is not limited to, 0.04mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, and the like.

In the embodiment of fig. 2, the bottom plate 10 has a first groove 11, the cover plate 31 has a second groove 311, and when the bottom plate 10 and the cover plate assembly 30 are assembled, the first groove 11 and the second groove 311 form the cavity 20, in other words, the cavity 20 includes the first groove 11 and the second groove 311.

In some embodiments, the area occupied by the cross section of the capillary structure 33 is 1/10 to 1/2 of the cross section area of the cavity 20 along the stacking direction perpendicular to the direction of the cover plate 31 and the bottom plate 10, so that the cavity 20 has a sufficient amount of vapor when heat is dissipated. When the area occupied by the cross section of the capillary structure 33 is smaller than 1/10 of the cross section of the cavity 20, the capillary pressure increased by the capillary structure 33 is smaller, and the improvement of the heat dissipation efficiency is not obvious; when the area occupied by the cross section of the capillary structure 33 is larger than 1/2 of the cross section area of the cavity 20, the amount of vapor in the cavity 20 is small (the vacuum cavity 20 is too small) during heat dissipation, which affects the evaporation and condensation speed of the condensing medium and the gas flow amount, and reduces the heat dissipation efficiency of the heat dissipation device 100.

Referring to fig. 5 to 9, in some embodiments, the capillary structure 33 has a hydrophilic property, and the capillary structure 33 includes a plurality of capillary holes 331 or a plurality of capillary tubes 333, and the capillary holes or the capillary tubes provide a capillary pressure for the condensing medium to flow from the condensing section 23 to the evaporating section 21. Alternatively, the capillary holes or the capillary tubes may be directly formed in the cover plate 31, or may be formed first and then installed on the wick 50, and located between the cover plate 31 and the wick 50, which is not specifically limited in this application.

Optionally, the material of the cover plate 31 may be, but is not limited to, copper, aluminum, iron, and other materials with higher thermal conductivity or higher thermal conductivity.

Referring to fig. 3, 5 and 6, in some embodiments, the capillary structure 33 includes a plurality of protruding strips 332 disposed at intervals on the cover plate 31, the protruding strips 332 extend along a first direction (as shown by an arrow C in fig. 5), and a groove between two adjacent protruding strips 332 forms the capillary tube 333, wherein the first direction and the arrangement direction of the evaporation section 21 and the condensation section 23 form a preset included angle α (as shown in fig. 3), and the preset included angle is in a range of 0 ° to 30 °. Optionally, the preset included angle may be, but is not limited to, 0 °, 5 °, 10 °, 15 °, 20 °, 25 °, 30 °, and the like. When the preset included angle is 0 °, the first direction is parallel to the arrangement direction of the evaporation section 21 and the condensation section 23, and at this time, the condensing medium of the evaporation section 21 can flow through the grooves formed between the protruding strips 332 more quickly, so that the heat dissipation device 100 has higher heat dissipation speed. When the preset included angle is greater than 30 °, the capillary structure 33 is only partially or even not communicated with the vacuum cavity between the liquid absorption core 50 and the cover plate 31 of the condensation section 23, and the same distance is longer than the groove, so that the flow of the condensation medium is slowed down, and the heat dissipation speed of the heat dissipation device 100 is not improved.

Optionally, the capillary structure 33 and the cover plate 31 are of an integral structure; it is understood that the capillary structure 33 and the cover plate 31 are formed in the same process; it will also be appreciated that the capillary structure 33 is formed by: the plate is etched to form the capillary structure 33 and the second groove 311 on the cover plate 31. In other words, the cover plate 31, the capillary structure 33 and the second recess 311 are formed in the same process. Alternatively, the ribs 332 may be formed of one or more materials of copper, aluminum, iron, and the like.

Referring to fig. 3 and 5, in some embodiments, the plurality of ribs 332 are arranged along the second direction (as shown by an arrow D in fig. 5), each of the ribs 332 extends along the first direction, each of the ribs 332 extends from one end of the evaporation section 21 away from the condensation section 23 to one end of the evaporation section 21 close to the condensation section 23, in other words, each of the ribs 332 extends from one end of the evaporation section 21 to the other end of the evaporation section 21 opposite to the evaporation section 21 along the first direction, in other words, each of the rows includes one rib 332 along the first direction. And when the preset included angle is 0 degree, the second direction is vertical to the first direction.

Optionally, the width d of the protruding strips 332 in the second direction is 10 μm to 200 μm; specifically, it may be, but not limited to, 10 μm, 20 μm, 30 μm, 50 μm, 70 μm, 90 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, or the like. When the width of the protruding strips 332 is less than 10 μm, the requirement on the processing process is high, the processing cost is high, and when the width of the protruding strips 332 is greater than 200 μm, the number of grooves that can be formed is small, the capillary structure 33 has a limited increase in the pressure of the capillary 333 of the heat dissipation device 100, and has a limited improvement in the heat dissipation effect of the heat dissipation device 100.

Alternatively, the spacing s (i.e., the width of the groove in the second direction) between two adjacent convex strips 332 is 10 μm to 100 μm; specifically, it may be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, or the like. When the distance between two adjacent convex strips 332 is smaller than 10 μm, the requirement on the processing process is high, the processing cost is high, in addition, although the pressure of the capillary tube 333 of the capillary structure 33 can be increased, the capillary hole is too small, the permeability is low, the flowing of the liquid condensing medium in the capillary structure is not facilitated, and the heat dissipation effect is influenced, when the distance between two adjacent convex strips 332 is larger than 100 μm, the pressure of the capillary tube 333 generated by the capillary tube 333 formed by the groove between two adjacent convex strips 332 is too small (the capillary effect is small), and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. The term "pitch" in this application refers to the vertical distance between two adjacent ribs 332. Alternatively, the pitch (i.e., the width of the groove in the second direction) between two adjacent convex strips 332 is 70 μm to 80 μm, and specifically, may be, but is not limited to, 70 μm, 72 μm, 75 μm, 78 μm, 80 μm, and the like. When the distance between two adjacent ribs 332 is in this range, the formed grooves have larger capillary 333 pressure, so that the heat dissipation device 100 has better heat dissipation effect.

Optionally, referring to fig. 2, the height h of the protruding strips 332 is 0.08mm to 0.2 mm; specifically, it may be, but not limited to, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc. When the height of the protruding strips 332 is less than 0.08mm, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small, and the amount of vapor formed in the cavity 20 is small during heat dissipation, which affects the evaporation and condensation speed of the condensing medium and the flow amount of the gas, and thus the heat dissipation efficiency of the heat dissipation device 100 is reduced. When the height of the protruding strip 332 is greater than 0.2mm, the thickness of the heat dissipation device 100 is large, which is not beneficial to the miniaturization of the electronic device and affects the user experience. The term "height of the ribs 332" in the present application refers to a height in a direction perpendicular to the stacking direction of the base plate 10 and the lid plate 31.

Referring to fig. 6, in other embodiments, the plurality of ribs 332 includes a plurality of rib groups 3301, the plurality of rib groups 3301 are arranged along the second direction, each rib 332 extends along the first direction, each rib group 3301 includes at least two ribs 332, and the rib 332 in each rib group 3301 is disposed corresponding to a gap between two adjacent ribs 332 in the adjacent rib group 3301 and partially overlaps with the two adjacent ribs 332. Alternatively, each of the rib groups 3301 may include, but is not limited to, two ribs 332, three ribs 332, four ribs 332, five ribs 332, and the like, which is not particularly limited in the present application. In the embodiment of fig. 6, each rib group 3301 includes two ribs 332. Compared with the capillary structure 33 of the embodiment of fig. 5, the grooves (capillaries 333) formed between the convex strip sets 3301 of the capillary structure 33 of the embodiment are communicated with each other, so that the condensed medium can flow not only in the first direction but also in the second direction, and the heat dissipation device 100 has a better heat dissipation effect. In addition, when the area of the heat dissipation device 100 is large (or the area of the evaporation section 21 is large), and the area of the heat source is small, with the structure of the embodiment of fig. 5, the condensing medium flows substantially along the first direction, and the area of both sides of the heat source of the evaporation section 21 is difficult to use, whereas with the structure of the embodiment (the embodiment of fig. 6), the condensing medium can also flow along the second direction, and the area of both sides of the heat source of the evaporation section 21 is fully utilized, so that the heat dissipation device 100 has a better heat dissipation effect.

Alternatively, the pitch s (i.e., the width of the groove in the second direction) between two adjacent ridge groups 3301 is 10 μm to 100 μm; specifically, it may be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, or the like. When the distance between two adjacent rib groups 3301 is smaller than 10 μm, the requirement on the processing process is high, the processing cost is high, in addition, although the pressure of the capillary tube 333 of the capillary structure 33 can be increased, the capillary hole is too small, the permeability is low, which is not beneficial to the flow of the liquid condensing medium in the capillary structure and affects the heat dissipation effect, when the distance between two adjacent rib groups 3301 is larger than 100 μm, the pressure of the capillary tube 333 generated by the capillary tube 333 formed by the groove between two adjacent rib groups 3301 is too small (the capillary effect is smaller), and the improvement of the heat dissipation effect of the heat dissipation device 100 is smaller. The term "pitch" in the present application refers to the vertical distance between two adjacent rib groups 3301. Alternatively, the pitch (i.e., the width of the groove in the second direction) between two adjacent rib groups 3301 may be 70 μm to 80 μm, and specifically, may be, but is not limited to, 70 μm, 72 μm, 75 μm, 78 μm, 80 μm, and the like. When the distance between two adjacent rib groups 3301 is in this range, the grooves formed have a larger capillary 333 pressure, so that the heat dissipation device 100 has a better heat dissipation effect.

As shown in fig. 2, optionally, the height h of the protruding strips 332 is 0.08mm to 0.2 mm; specifically, it may be, but not limited to, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc. When the height of the protruding strips 332 is less than 0.08mm, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small, and the amount of vapor formed in the cavity 20 is small during heat dissipation, which affects the evaporation and condensation speed of the condensing medium and the flow amount of the gas, and thus the heat dissipation efficiency of the heat dissipation device 100 is reduced. When the height of the protruding strip 332 is greater than 0.2mm, the thickness of the heat dissipation device 100 is large, which is not beneficial to the miniaturization of the electronic device and affects the user experience. The term "height of the ribs 332" in the present application refers to a height in a direction perpendicular to the stacking direction of the base plate 10 and the lid plate 31.

Optionally, in the first direction, the length L of each convex strip 332 is 200 μm to 1000 μm; specifically, it may be, but not limited to, 200. mu.m, 300. mu.m, 400. mu.m, 500. mu.m, 600. mu.m, 700. mu.m, 800. mu.m, 900. mu.m, 1000. mu.m, etc. When the ribs 332 are larger than 1000 μm, each rib group 3301 may only be able to hold the next rib 332, and the staggered structure of the ribs 332 in each rib group 3301 cannot be formed, so the heat dissipation effect is equivalent to that of the structure in the embodiment in fig. 5, and the heat dissipation effect is not significantly improved compared to that of the structure in the embodiment in fig. 5. When the length of each rib 332 is less than 200 μm, the crossing length between the ribs 332 in adjacent rib groups 3301 is too short, and the pressure of the formed capillary 333 is small, so that the heat dissipation effect of the heat dissipation device 100 is not significantly improved, in other words, when the length of each rib 332 is too small, the crossing length between each rib 322 and the rib of the adjacent rib group 3301 is short, and the crossing length with the rib of the spaced rib group is long, however, the distance between the spaced rib groups 3301 (for example, the rib group in the first row and the rib group in the third row) is large, and the capillary pressure formed therebetween is small, so that the heat dissipation effect of the heat dissipation device 100 is not significantly improved. Alternatively, the length of each rib 332 may be the same or different, and the present application is not limited in particular.

Optionally, the distance s' between two adjacent ribs 332 in the same rib group 3301 is 1/3 to 1/2 of the length of the rib 332; specifically, the distance between two adjacent ribs 332 in the same rib group 3301 may be, but is not limited to, 1/3, 0.35, 0.4, 0.45, 1/2, etc. of the length of the rib 332. When the distance between two adjacent convex strips 332 in the same convex strip group 3301 is too large, the staggered length of the convex strips 332 in the adjacent convex strip group 3301 is shorter, the pressure of the formed capillary tube 333 is smaller, and the improvement of the heat dissipation effect of the heat dissipation device 100 is not obvious; when the distance between two adjacent convex strips 332 in the same convex strip group 3301 is too small, the flow of the condensing medium along the second direction is affected, and the improvement of the heat dissipation effect of the heat dissipation device 100 is small.

Referring to fig. 7 to 9, optionally, the capillary structure 33 may further include one or more of a particle sintering structure, a foam structure, and a mesh structure.

Referring to fig. 7, in some embodiments, the capillary structure 33 includes a particle sintering structure including a plurality of capillary holes 331 penetrating therethrough, and the diameter of the capillary holes 331 is 10 μm to 100 μm; specifically, it may be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, or the like. When the diameter of the capillary hole 331 is smaller than 10 μm, although the pressure of the capillary tube 333 of the capillary structure 33 can be increased, the capillary hole is too small, the permeability is low, the flowing of the liquid condensing medium in the capillary structure is not facilitated, and the heat dissipation effect is influenced; when the diameter of the capillary hole 331 is larger than 100 μm, the capillary effect is small, and the pressure of the capillary tube 333 generated by the capillary hole 331 is too small, which is small for improving the heat dissipation effect of the heat dissipation device 100. The term "particle sintered structure" refers to a structure formed by sintering particles and having a plurality of capillary holes 331 therethrough.

Optionally, the raw material component of the particulate sintered structure comprises particulates having a diameter of 5 to 50 μm; specifically, it may be, but not limited to, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or the like. When the diameter of the particles is less than 5 μm, although the pressure of the capillary tube 333 of the capillary structure 33 can be increased, the capillary hole 331 of the formed capillary structure 33 is too small, and the permeability is low, which is not favorable for the flow of the liquid condensing medium in the capillary structure and affects the heat dissipation effect; when the diameter of the fine particles is greater than 100 μm, the capillary holes 331 of the capillary structure 33 are too large, and the number of the capillary holes 331 is small, so that the capillary effect is small, and the pressure of the capillary tubes 333 generated by the capillary holes 331 is too small, which results in a small improvement of the heat dissipation effect of the heat dissipation device 100. Alternatively, the particles may comprise one or more materials of copper, aluminum, iron, and the like.

Referring to fig. 8, in some embodiments, the capillary structure 33 includes a foam structure including a plurality of capillary holes 331 therethrough, and the diameter of the capillary holes 331 is 10 μm to 100 μm; specifically, it may be, but not limited to, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, or the like. When the diameter of the capillary hole 331 is smaller than 10 μm, although the pressure of the capillary tube 333 of the capillary structure 33 can be increased, the capillary hole is too small, the permeability is low, the flowing of the liquid condensing medium in the capillary structure is not facilitated, and the heat dissipation effect is influenced; when the diameter of the capillary hole 331 is larger than 100 μm, the capillary effect is small, and the pressure of the capillary tube 333 generated by the capillary hole 331 is too small, which is small for improving the heat dissipation effect of the heat dissipation device 100. Alternatively, the foam structure may be, but is not limited to, copper foam, aluminum foam, iron foam, and the like.

Referring to fig. 9, in some embodiments, the capillary structure 33 includes a mesh structure, the mesh structure includes a plurality of the capillary holes 331, and the mesh structure has a mesh size of 200 to 300 meshes; specifically, it may be, but not limited to, 200 mesh, 210 mesh, 220 mesh, 230 mesh, 240 mesh, 250 mesh, 260 mesh, 270 mesh, 280 mesh, 290 mesh, 300 mesh, etc. When the mesh number is larger than 300 meshes, the capillary structure 33 has a large capillary head, and when the diameter of the wire (e.g., copper wire, aluminum wire, iron wire, etc.) for weaving the mesh structure is too small (e.g., 0.02mm or less), the wire is easily broken and the processing difficulty is large. When the mesh number is smaller than 200 meshes, the capillary effect is small, the pressure of the capillary tube 333 generated by the capillary hole 331 is too small, and the improvement of the heat dissipation effect of the heat dissipation device 100 is small. Alternatively, the mesh structure may be, but is not limited to, a copper mesh, an aluminum mesh, an iron mesh, and the like.

In some embodiments, the capillary structure 33 further comprises nano-scale microstructures (not shown) for increasing the hydrophilicity of the capillary structure 33, so that the liquid condensing medium can flow on the capillary structure 33 and evaporate into a gaseous condensing medium more quickly, and the gaseous condensing medium fills the vacuum portion of the entire cavity 20 more quickly. When the capillary structure 33 includes a plurality of protruding bars 332, the nano-scale microstructures are disposed on the surface of at least one of the protruding bars 332 and the grooves 333; in other words, the nano-scale microstructures may be disposed on the surfaces of the protruding strips 332, the surfaces of the grooves 333, or the surfaces of the protruding strips 332 and the grooves 333. When the capillary structure 33 is a network structure, the nano-scale microstructures are disposed on the surface of the network structure. The term "nanoscale microstructure" refers to a structure having a surface structure with dimensions on the order of nanometers.

Alternatively, the nano-scale microstructures may be formed by: the capillary structure 33 is exposed to 280 to 350 ℃ to form a nano-scale metal oxide on the surface of the capillary structure 33, thereby increasing the hydrophilicity of the capillary structure 33. Optionally, the nano-scale microstructures may also be formed by: a layer of metal such as copper, aluminum, iron, etc. is electroplated on the surface of the capillary structure 33 to form the nano-scale microstructure.

Optionally, when the capillary structure 33 includes the raised strips 332, or the capillary structure 33 is one or more of a particle sintered structure or a mesh structure, the capillary structure 33 also serves to support the cavity 20 and prevent the cover plate 31, the bottom plate 10, or the cover plate 31 and the bottom plate 10 from being depressed at two sides of the cavity 20.

Alternatively, the capillary structure 33 may be any one of the above-mentioned embodiments or a combination of the above-mentioned embodiments, and the specific combination is not specifically limited in this application.

Referring again to fig. 2, in some embodiments, the cover plate assembly 30 further includes a plurality of supporting members 35, the supporting members 35 are located in the cavity 20, the supporting members 35 are disposed adjacent to the capillary structure 33 and are arranged in the cover plate 31 in an array, one end of the supporting members 35 away from the cover plate 31 abuts against the wick 50 or the bottom plate 10, and gaps between the supporting members 35 are communicated with the capillary structure 33. In other words, the plurality of supports 35 are arranged in an array in the flow section 22 and the condensation section 23. The supporting member 35 is used for preventing the cover plate 31, or the bottom plate 10, or the cover plate 31 and the bottom plate 10 from sinking when the heat dissipation device 100 is vacuumized, so as to prevent the vacuum space in the cavity 20 from being reduced, and the amount of the gaseous condensation medium is less when heat dissipation is performed, thereby affecting the heat dissipation efficiency of the heat dissipation device 100. Alternatively, when the base plate 10 is covered by the wick 50, the end of the support 35 remote from the cover plate 31 abuts the wick 50, the base plate 10 not covered by the wick 50, and the end of the support 35 remote from the cover plate 31 abuts the base plate 10.

In the related art, in order to prevent the cover plate 31, the bottom plate 10, or both the cover plate 31 and the bottom plate 10 of the heat sink 100 from being depressed, the vacuum space in the cavity 20 is compressed, and therefore, the support 35 is disposed at the position of the cover plate 31 corresponding to the evaporation section 21, the flow section 22, and the condensation section 23 of the cavity 20. The heat abstractor 100 of this application sets up capillary structure 33 in the position that apron 31 corresponds evaporation zone 21, sets up support piece 35 in the position that apron 31 corresponds flow section 22 and condensation segment 23, make the first thermal resistance of the part that apron subassembly 30 corresponds evaporation zone 21 be less than the second thermal resistance of the part that apron subassembly 30 corresponds flow section 22 and condensation segment 23, in other words, thereby the thermal resistance of the part that this application apron subassembly 30 corresponds evaporation zone 21 is less than the thermal resistance of the evaporation zone 21 that adopts support piece 35 in the relevant design, make the evaporation rate of the liquid condensing medium of evaporation zone 21 faster, and then can be faster with heat transfer to whole heat abstractor 100, in order to dispel the heat, thereby have better radiating effect. In other words, compared to the related design of the supporting member 35, the capillary structure 33 has more heat dissipating solid materials, and dissipates heat more quickly, thereby having better heat dissipating effect. In addition, the capillary structure 33 is not disposed in the flow section 22 and the condensation section 23, and the influence on the flow pressure drop of the vapor in the condensation section 23 is small, so that the pressure of the capillary 333 of the whole heat dissipation device 100 can be greatly improved. Moreover, the capillary structure 33 is disposed at a position of the cover plate 31 corresponding to the evaporation section 21, and the capillary structure 33 and the supporting member 35 are disposed at an interval along the surface of the cover plate 31, so that the heat dissipation effect of the heat dissipation device 100 can be improved without increasing the thickness of the cover plate 31, which is beneficial to the miniaturization and the light weight of the heat dissipation device 100, and is beneficial to the miniaturization and the light weight of the electronic device using the heat dissipation device 100. In addition, when the capillary structure 33 is formed by the grooves between the ribs 332, the ribs 332 and the support 35 can be formed in the same process (obtained by etching), and no additional processing is required, so that the cost of the heat dissipation device 100 is not increased.

Optionally, the height h' of the supporting member 35 is 0.08mm to 0.2mm in the stacking direction of the cover plate 31 and the bottom plate 10; specifically, it may be, but not limited to, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc. When the height of the supporting member 35 is less than 0.08mm, the vacuum cavity formed between the wick 50 and the cover plate 31 is too small, and the amount of vapor formed in the cavity 20 is small during heat dissipation, which affects the evaporation and condensation speed of the condensing medium and the flow amount of the gas, and thus the heat dissipation efficiency of the heat dissipation device 100 is reduced. When the height of the supporting member 35 is greater than 0.2mm, the thickness of the heat dissipation device 100 is large, which is not favorable for miniaturization of the electronic device and affects the user experience.

Optionally, the equivalent circle diameter of the cross section of the support 35 along the stacking direction perpendicular to the direction of the cover plate 31 and the bottom plate 10 is 0.4mm to 1 mm; specifically, it may be, but not limited to, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, etc. When the equivalent circular diameter of the cross section of the supporting member 35 is too small, it is difficult to process, and when the equivalent circular diameter of the cross section of the supporting member 35 is too large, the vacuum chamber formed between the wick 50 and the cover plate 31 is too small, and during heat dissipation, the amount of steam formed in the chamber 20 is small, thereby affecting the evaporation and condensation speed of the condensing medium and the air flow amount, and reducing the heat dissipation efficiency of the heat dissipation apparatus 100. The term "equivalent circular diameter" in this application refers to the cross-section of an irregular geometric figure, the diameter of a circle of equal area.

Optionally, the distance between two adjacent supporting pieces 35 is 1mm to 3 mm; specifically, it may be, but not limited to, 1mm, 1.2mm, 1.5mm, 1.7mm, 2mm, 2.5mm, 3mm, etc.

Alternatively, the height of the supporting member 35 and the thickness of the capillary structure 33 may be the same or different, and the present application is not particularly limited. When the height of the supporting member 35 is equal to the thickness of the capillary structure 33, the supporting member 35 and the capillary structure 33 can better support the cover plate 31 and the bottom plate 10 at both sides of the cavity 20, and better prevent the cover plate 31 and the bottom plate 10 at both sides of the cavity 20 from sinking.

In some embodiments, the wick 50 has a hydrophilic property, the wick 50 extends from the evaporation section 21 to the condensation section 23, and the thickness of the wick 50 is 0.04mm to 0.2mm in the stacking direction of the cover plate 31 and the base plate 10; specifically, it may be, but not limited to, 0.04mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.14mm, 0.16mm, 0.18mm, 0.2mm, etc. If the thickness of the wick 50 is too small, the capillary effect is small, the heat dissipation effect is not good, and if the thickness of the wick 50 is too large, the thickness of the heat dissipation device 100 is increased, which is not favorable for miniaturization of the electronic device and affects the user experience. In other embodiments, the wick 50 covers a portion of the base plate 10 corresponding to the cavity 20.

Alternatively, wick 50 may be one or more of a particulate sintered structure, a foam structure, a mesh structure, or the like. For the detailed description of the particle sintering structure, the foam structure and the mesh structure, reference is made to the description of the corresponding parts of the above embodiments, and the description is not repeated here.

In some embodiments, the wick 50 further comprises nano-scale microstructures that increase the hydrophilicity of the wick 50 to allow better return of the liquid condensing medium from the condensing section 23 to the evaporating section 21. When the wick 50 includes a plurality of ribs 332, the nano-scale microstructures are disposed on a surface of at least one of the ribs 332 and the grooves 333; in other words, the nano-scale microstructures may be disposed on the surfaces of the protruding strips 332, the surfaces of the grooves 333, or the surfaces of the protruding strips 332 and the grooves 333. When the wick 50 is a mesh structure, the nano-scale microstructures are disposed on the surface of the mesh structure.

Alternatively, the nano-scale microstructures may be formed by: the wick 50 is exposed to temperatures of 280 c to 350 c to form nanoscale metal oxides on the surface of the wick 50, thereby increasing the hydrophilicity of the wick 50. Optionally, the nano-scale microstructures may also be formed by: the wick 50 is plated with a layer of metal, such as copper, aluminum, iron, etc., to form the nano-scale microstructure.

Referring to fig. 10 and fig. 11, an embodiment of the present application further provides an electronic device 200, which includes: the heat dissipation device 100 according to the embodiment of the present application; and the heat source 210 is arranged on one side of the bottom plate 10 far away from the cover plate 31 and close to the evaporation section 21.

The electronic device 200 according to the embodiment of the present disclosure may be, but is not limited to, a mobile phone, a tablet computer, a smart watch, a smart bracelet, a desktop computer, a notebook computer, an electronic reader, a game machine, a display, and the like.

Alternatively, the heat source 210 may be, but is not limited to, a processor of an electronic device, a battery, or other components with high power consumption. Alternatively, the processor includes one or more general-purpose processors, wherein a general-purpose processor may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, an ASIC, and so forth. Processors are used to execute various types of digitally stored instructions, such as software or firmware programs stored in memory, which enable computing devices to provide a wide variety of services.

Optionally, the electronic device 200 further includes a display component 230 and a housing component 250, the display component 230 is used for displaying, the housing component 250 is used for supporting and protecting the heat source 210 and the display component 230, the display component 230 and the housing component 250 enclose an accommodating space 201, and the heat source 210 and the heat dissipation apparatus 100 are disposed in the accommodating space 201.

Alternatively, the display module 230 may be, but is not limited to, one or more of a liquid crystal display module, a light emitting diode display module (LED display module), a micro light emitting diode display module (micro LED display module), a sub-millimeter light emitting diode display module (MiniLED display module), an organic light emitting diode display module (OLED display module), and the like.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A heat dissipating device, comprising:

a base plate;

2. The heat dissipation device of claim 1, wherein the capillary structure comprises a plurality of pores or a plurality of capillaries, and the pores or capillaries provide capillary pressure for the condensing medium to flow from the condensing section to the evaporating section.

3. The heat dissipation device of claim 2, wherein the capillary structure comprises a plurality of protruding strips disposed on the cover plate at intervals, the plurality of protruding strips extend along a first direction, and a groove between two adjacent protruding strips forms the capillary tube, wherein the first direction and the arrangement direction of the evaporation section and the condensation section form a preset included angle, and the preset included angle ranges from 0 ° to 30 °.

4. The heat dissipating device of claim 3,

the plurality of convex strips are arranged along a second direction, and each convex strip extends from one end, far away from the condensation section, of the evaporation section to one end, close to the condensation section, of the evaporation section; or,

the plurality of convex strips comprise a plurality of convex strip groups, the plurality of convex strip groups are arranged along the second direction, each convex strip group comprises at least two convex strips, and the convex strip in each convex strip group is arranged corresponding to the gap between two adjacent convex strips in the adjacent convex strip groups and is partially overlapped with the two adjacent convex strips;

wherein the second direction intersects the first direction.

5. The heat dissipating device of claim 4,

when the plurality of convex strips are arranged along a second direction, and each convex strip extends from one end of the evaporation section, which is far away from the condensation section, to one end of the evaporation section, which is close to the condensation section, the width of each convex strip is 10-200 μm, and the distance between every two adjacent convex strips is 10-100 μm; the height of the convex strip is 0.08mm to 0.2 mm;

when the plurality of convex strips comprise a plurality of convex strip groups, the plurality of convex strip groups are arranged along a second direction, each convex strip group comprises at least two convex strips, the convex strips in each convex strip group are arranged corresponding to the gaps between two adjacent convex strips in adjacent convex strip groups and partially overlapped with the two adjacent convex strips, the width of each convex strip is 10 mu m to 200 mu m, and the distance between two adjacent convex strip groups is 10 mu m to 100 mu m along the second direction; the height of the convex strip is 0.08mm to 0.2 mm; along the first direction, the length of each convex strip is 200 to 1000 microns, and the distance between two adjacent convex strips in the same convex strip group is 1/3 to 1/2 of the length of the convex strips.

6. The heat dissipating device of claim 2,

the capillary structure comprises a particle sintering structure, the particle sintering structure comprises a plurality of through pores, the diameter of each pore is 10-100 μm, raw material components of the particle sintering structure comprise particles, and the diameter of each particle is 5-50 μm; or,

the capillary structure comprises a foam structure, the foam structure comprises a plurality of through capillary holes, and the diameter of each capillary hole is 10-100 μm.

7. The heat dissipating device of claim 2, wherein the capillary structure comprises a mesh structure, the mesh structure comprises a plurality of the pores, and the mesh structure has a mesh size of 200-300 meshes.

8. The heat dissipation device of claim 3 or 7, wherein the capillary structure further comprises a nano-scale microstructure for increasing the hydrophilicity of the capillary structure; when the capillary structure comprises a plurality of convex strips, the nano-scale microstructures are arranged on the surface of at least one of the convex strips and the grooves; when the capillary structure is a net structure, the nano-scale microstructures are arranged on the surface of the net structure.

9. The heat dissipating device of any of claims 1-7, wherein the capillary structure has a cross-sectional area that is 1/10 to 1/2 of the cross-sectional area of the cavity in a stacking direction perpendicular to the direction of the cover plate and the base plate.

10. The heat dissipation device of any of claims 1-7, wherein the wick is one or more of a sintered particulate structure, a foam structure, and a mesh structure; the wick extends to the condensation section from the evaporation section, and the thickness of the wick is 0.04mm to 0.2mm along the stacking direction of the cover plate and the bottom plate.

11. The heat dissipating device of any of claims 1-7, wherein the cover assembly further comprises a plurality of supports positioned in the cavity, the plurality of supports being positioned adjacent to the capillary structure and in an array on the cover, wherein an end of the supports distal from the cover abuts the wick or the base plate, and wherein gaps between the plurality of supports communicate with the capillary structure.

12. The heat dissipating device according to claim 11, wherein the height of the supporting member is 0.08mm to 0.2mm in a stacking direction of the cover plate and the bottom plate; the equivalent circle diameter of the cross section of the support piece is 0.4mm to 1mm along the stacking direction vertical to the direction of the cover plate and the bottom plate; the distance between two adjacent support pieces is 1mm to 3 mm.

13. An electronic device, comprising:

the heat dissipating device of any of claims 1-12; and