CN214481964U

CN214481964U - Vapor chamber and electronic apparatus

Info

Publication number: CN214481964U
Application number: CN202120340668.6U
Authority: CN
Inventors: 谢邦星; 许建勇
Original assignee: Nanchang OFilm Display Technology Co Ltd
Current assignee: Jiangxi Xinfei New Material Co ltd; Jiangxi Zhanyao Microelectronics Co ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2021-10-22
Anticipated expiration: 2031-02-05

Abstract

The embodiment of the application discloses a vapor chamber and an electronic device. The soaking plate comprises a first plate body, the first plate body comprises a substrate, a groove and a plurality of bulges arranged on the bottom surface of the groove are formed on the substrate, a plurality of flow channels are formed on the bulges together, the flow channels are in a bent shape along a first direction and a second direction, the first direction is vertical to the second direction, the width range of the flow channels formed between any two adjacent bulges at random is 20-80 um, and the first direction is vertical to the second direction; and the second plate body covers the first plate body. Therefore, in the heat dissipation process, the interaction between the mutual flow channels can be accelerated, and the heat dissipation efficiency of the soaking plate is improved.

Description

Vapor chamber and electronic apparatus

Technical Field

The embodiment of the application relates to the technical field of heat dissipation, in particular to a vapor chamber and an electronic device.

Background

With the technical development of electronic devices such as mobile phones, the performance of the electronic devices is gradually improved, and correspondingly, the amount of heat generated by the electronic devices is increased. In the related art, the electronic equipment adopts the soaking plate to realize heat dissipation, and the soaking plate can change the hot end heat of the electronic equipment from a liquid phase to a gas phase (absorbing heat) through the cooling liquid and transmit the heat to the cold end through the cooling liquid, and then at the cold end the cooling liquid is changed from the gas phase to the liquid phase (releasing heat) when meeting cold, thereby realizing the heat dissipation of the electronic equipment. However, the heat dissipating capability of the soaking plate in the related art is yet to be further improved.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a vapor chamber and an electronic device.

The embodiment of the application provides a soaking plate. The soaking plate comprises a first plate body, the first plate body comprises a substrate, a groove and a plurality of bulges arranged on the bottom surface of the groove are formed on the substrate, a plurality of flow channels are formed on the bulges together, the flow channels are in a bent shape along a first direction and a second direction, the width range of the flow channels formed between any two adjacent bulges at random is 20-80 um, and the first direction is vertical to the second direction; and the second plate body covers the first plate body.

Therefore, in the heat dissipation process, the interaction between the mutual flow channels can be accelerated, and the heat dissipation efficiency of the soaking plate is improved.

In some embodiments, the protrusions are arranged in a row and column, and adjacent protrusions are staggered along the first direction.

Therefore, under the capillary action of the protrusions, the interaction of the flow channels among the protrusions can be greatly improved in the heat dissipation process, and the heat dissipation performance of the vapor chamber is improved.

In some embodiments, the width of the flow channel between any two adjacent projections is equal.

Therefore, when the soaking plate works normally, the width of the flow channel between any two adjacent bulges is equal, so that the speed of the cooling liquid flowing through each flow channel is equal, and the heat dissipation efficiency of the soaking plate is improved.

In some embodiments, the cross-section of the columnar protrusions is a polygon, and the number of sides of the polygon is greater than 4.

Therefore, the flow channel is formed by the plurality of the protrusions with the cross sections of the polygons of which the number of the edges is more than 4, so that the interaction between the cooling liquid and the heat source is more in the heat dissipation process, the protrusions can rapidly transport the cooling liquid to each part of the condensation end and rapidly flow back, and the heat dissipation effect is accelerated.

In some embodiments, the flow channel includes a plurality of first flow channels, and the first flow channels are radially arranged from a middle portion of the groove to an edge portion of the groove.

When the first flow channel is blocked or dried, the cooling medium is supplemented from the first flow channel connected with the first flow channel, and the heat dissipation performance of the vapor chamber is greatly improved.

In some embodiments, the first flow path extends in a curved line along the middle portion toward the edge portion.

So, be the curve form extension first flow channel can accelerate each other the interaction between the arch does benefit to the quick effluvium of heat, and the choked flow is less simultaneously, can promote quick radiating efficiency.

In some embodiments, the flow channel comprises a plurality of second flow channels, the second flow channels in intersecting communication with the first flow channels, the plurality of second flow channels spaced around the intermediate portion.

Therefore, when the first flow channel and/or the second flow channel are blocked or dry, the first flow channel and/or the second flow channel which are connected with each other are supplemented with cooling media, and the heat dissipation performance of the vapor chamber is greatly improved.

In some embodiments, the projection abuts against the second plate body.

Therefore, the heat can be dissipated out through the second plate body by the protrusions, and the heat dissipation capacity of the vapor chamber is improved.

In some embodiments, a support post is provided on the second plate body, and the protrusion abuts against the support post.

In this way, the support column forms a protective action in the cavity to prevent the cavity from deforming due to extrusion.

The embodiment of the application provides an electronic device, which comprises the vapor chamber and a heat source. The heat source is in thermal conductive connection with the soaking plate.

So, the heat of heat source can in time pass through the soaking plate is gone to dispelling the heat all around, finally gives off in the atmosphere, improves electronic equipment's performance to promote user's use and experience.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic sectional view of a soaking plate according to an embodiment of the present application;

fig. 2 is a schematic plan view of a first plate body according to an embodiment of the present application;

fig. 3 is an enlarged schematic view of a portion i of the first plate body of fig. 2 according to an embodiment of the present application;

fig. 4 is a further schematic plan view of the first plate body of an embodiment of the present application;

fig. 5 is an enlarged schematic view of a portion ii of the first plate body of fig. 4 according to an embodiment of the present application;

fig. 6 is a further plan view of the first plate according to an embodiment of the present application;

fig. 7 is a partial schematic view of the first plate body of fig. 6 according to an embodiment of the present application;

fig. 8 is an enlarged schematic view of a portion iii of the first plate body of fig. 7 according to an embodiment of the present application;

fig. 9 is a schematic cross-sectional view of an electronic device according to an embodiment of the present application.

Description of the main element symbols:

the vapor chamber 100, the first plate body 10, the substrate 11, the groove 111, the protrusion 12, the flow channel 121, the first flow channel 1211, the second flow channel 1212, the second plate body 20, the support post 21, the cavity 30, the electronic device 200, and the heat source 40.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, 2 and 3, a soaking plate 100 according to an embodiment of the present invention includes a first plate 10 and a second plate 20. Wherein the first plate body 10 includes a base plate 11 and a protrusion 12. The substrate 11 is formed with a recess 111. A plurality of protrusions 12 are disposed on the bottom surface of the groove 111. The plurality of protrusions 12 collectively form a plurality of flow paths 121, and the flow paths 121 are curved along the first direction Y and the second direction X. The first direction Y is perpendicular to the second direction X. The width a of the partial flow channel 121 formed between any adjacent two projections 12 ranges from 20um to 80um (micrometers).

Specifically, the soaking plate 100 includes a first plate body 10 and a second plate body 20 connected to each other, which together form a cavity 30 when they are covered. Wherein the first plate body 10 and the second plate body 20 can be connected together by bonding or welding, thereby forming the cavity 30. After the cooling fluid is injected, a vacuum may be drawn on the cavity 30 so that the cooling fluid may be in a vacuum environment.

The cavity 30 can store a cooling liquid, and when the cooling liquid undergoes a phase change, the cooling liquid absorbs or releases latent heat of phase change, which is the design principle of the soaking plate 100. Further, the cavity 30 may be in a negative pressure state, and the cavity 30 may prevent the coolant from flowing away and maintain a vacuum negative pressure state. By maintaining the negative pressure state of the cavity 30, the boiling point of the coolant can be reduced, so that the coolant can be more easily evaporated, and the heat dissipation efficiency of the vapor chamber 100 can be improved.

The first plate body 10 may include a base plate 11 and a protrusion 12. The substrate 11 is formed with a recess 111. The substrate 11 may be rectangular or circular. The material of the first plate body 10 may be copper, aluminum, or stainless steel, etc., without limitation. When the first plate 10 is made of a copper material, the protrusions 12 may be formed by etching using a photolithography process, and fine protrusions 12 may be formed by etching the first plate 10, thereby improving the heat dissipation effect of the soaking plate 100.

The bumps 12 may also be formed by sintering a metal wire layer and metal powder together, and the material of the bumps 12 is generally selected from metals with high thermal conductivity, such as copper, aluminum, gold, silver, titanium, and the like. Since the price of gold and silver is too high, copper and aluminum are generally used for the bumps 12 in order to reduce the cost of the vapor chamber 100.

In some embodiments, the substrate 11 and the protrusion 12 may be integrally formed by using the same material. When the heat of the heat source is conducted to the soaking plate 100, the cooling liquid encapsulated in the cavity 30 starts to generate vaporization phenomenon after being heated in the environment of low vacuum degree, absorbs the heat and flows to the cold end, condenses and releases the heat after encountering cold, and returns to the heat source end through the capillary action of the plurality of protrusions 12 on the bottom surface of the groove 111, thereby achieving the purpose of heat dissipation.

Referring to fig. 3, further, the width a of the partial flow channel 121 formed between any two adjacent protrusions 12 ranges from 20um to 80 um. Specifically, the width a can be any value such as 20um, 25um, 30um, 35um, 40um, 45um, 50um, 55um, 60um, 65um, 70um, 75um, 80um, etc.

The plurality of protrusions 12 may be arranged at intervals, and any two adjacent protrusions 12 have an interval therebetween, and the intervals form a plurality of flow channels 121 through which the cooling liquid flows. The plurality of flow paths 121 mainly extend in a first direction Y and a second direction X, which are perpendicular to each other. The plurality of flow channels 121 are all curved, so that interaction between the adjacent protrusions 12 can be accelerated, and the heat dissipation efficiency is improved.

Illustratively, under the capillary action of the protrusions 12, when some of the flow channels 121 are blocked or dry out, the cooling medium is supplemented from the connected flow channels 121, and the heat dissipation performance of the vapor chamber 100 is greatly improved. The width A of the partial flow channel 121 formed between any two adjacent protrusions 12 ranges from 20um to 80um, and the width A between the flow channels 121 is small, so that the capillary pressure of the protrusions 12 is large, cooling liquid can be promoted to rapidly enter the flow channel 121 and dissipate heat, and the heat dissipation efficiency is high. If the width A is less than 20um, the processing difficulty of the bulge 12 is increased, so that the production cost is increased; if the width a is greater than 80um, the capillary effect of the flow channel 121 on the cooling liquid is poor, and the cooling liquid cannot rapidly flow back from the cold end to the hot end, so that the hot end cooling liquid is dried, and the heat dissipation capability of the heat dissipation plate 100 is reduced.

It should be noted that any two adjacent protrusions 12 means that two protrusions 12 are adjacent along the first direction Y, and may also mean that two protrusions 12 are adjacent along the second direction X. Wherein, in two adjacent protrusions 12, two protrusions 12 jointly define a part of the flow channel 121.

Specifically, the second plate 20 covers the first plate 10, and the second plate 20 and the first plate 10 may form a cavity 30 therein. The second plate body 20 has substantially the same characteristics as the first plate body 10. For example, the second plate 20 may also include a base plate and a groove, and the base plate may be rectangular or circular. The substrate can be made of copper, aluminum or stainless steel. The second plate body 20 is different from the first plate body 10 in that a support column 21 is provided on the second plate body 20. In this way, the support posts 21 can provide protection in the cavity 30 to prevent the cavity 30 of the soaking plate 100 from deforming and collapsing.

Referring to fig. 2 and 3, in some embodiments, the protrusions 12 may be arranged in a row, the first direction Y may be a row direction of the protrusions 12, and the second direction X may be a row direction of the protrusions 12. The projections 12 in adjacent rows are staggered in the first direction Y.

Specifically, the protrusions 12 may be arranged in a matrix. For example, the protrusions 12 may be arrayed in a direction of columns in the first direction Y, and the protrusions 12 may be arrayed in a direction of rows in the second direction X, so that the soaking plate 100 can uniformly dissipate heat during heat dissipation, thereby prolonging the service life of the soaking plate 100. Further, the projections 12 in adjacent rows are arranged offset in the first direction Y, and/or the projections 12 in adjacent columns are arranged offset in the second direction X. Thus, under the capillary action of the protrusions 12, the interaction of the flow channels 121 between the protrusions 12 can be greatly improved during the heat dissipation process, thereby improving the heat dissipation performance of the vapor chamber 100.

Referring to fig. 2-5, in some embodiments, the protrusions 12 have a polygonal cross-section with a number of sides greater than 4.

Specifically, the number of the polygonal cross sections of the protrusions 12 arranged in rows and columns is greater than 4, and the cross sections may be regular hexagons, regular octagons, pentagons, and the like, which is not limited herein. Therefore, the flow channel 121 is formed by the plurality of the protrusions 12 with the cross sections being polygons with the number of sides being more than 4, so that the interaction between the cooling liquid and the heat source is more, the protrusions 12 can rapidly transport the cooling liquid to each part of the condensation end and rapidly flow back, and the heat dissipation effect is accelerated.

In some embodiments, the width of the flow channel 121 between any two adjacent protrusions 12 is equal. Adjacent means that two objects are close to each other, but not necessarily in contact with each other. Referring to fig. 3, in the second direction X, the No. 1 protrusion is adjacent to the No. 2 protrusion and the No. 3 protrusion; in the first direction Y, the No. 1 projection is adjacent to the No. 4 projection, the No. 5 projection, the No. 6 projection, and the No. 7 projection. As shown in fig. 3, the width of the flow channel 121 between any two adjacent protrusions 12 is equal, and exemplarily, the width of the flow channel 121 between the No. 1 protrusion and the No. 4 protrusion is equal to the width of the flow channel 121 between the No. 1 protrusion and the No. 2 protrusion.

In this way, when the soaking plate is in normal operation, the width of the flow channels 121 between any two adjacent protrusions 12 is equal, so that the rate of the coolant flowing through each flow channel 121 is equal, thereby improving the heat dissipation efficiency of the soaking plate.

Referring to fig. 6-8, in some embodiments, the flow channel 121 may include a plurality of first flow channels 1211, and the first flow channels 1211 are radially arranged from the middle portion of the groove 111 to the edge portion of the groove 111.

Specifically, the protrusions 12 may be radially arranged from the middle portion of the groove 111 to the edge portion of the groove 111, such that the plurality of first flow passages 1211 between the protrusions 12 are also radially arranged. Each of the outwardly radiating first channels 1211 is connected by the remaining connecting channels 121, and when the first channels 1211 is blocked or dried up, the cooling medium is supplemented from the connected first channels 1211, thereby greatly improving the heat dissipation performance of the vapor chamber 100.

In some embodiments, the first flow passage 1211 extends in a curved line from a middle portion of the groove 111 to an edge portion of the groove 111.

Thus, the first flow channel 1211 extending in a curved shape can accelerate the interaction between the mutually protruded portions 12, thereby facilitating the rapid dissipation of heat, and meanwhile, the flow resistance is small, thereby improving the requirement of rapid heat dissipation.

Referring to fig. 8, in some embodiments, the flow channel 121 may include a plurality of second flow channels 1212, the second flow channels 1212 intersect with the first flow channels 1211, and the plurality of second flow channels 1212 are arranged around the middle portion at intervals.

Specifically, the protrusions 12 may be radially arranged from the middle portion of the groove 111 to the edge portion of the groove 111, and may be arranged around the middle portion of the groove 111 at intervals. Furthermore, the flow channels 121 between the protrusions 12 may include second flow channels 1212 arranged at intervals around the middle portion of the groove 111, and the second flow channels 1212 and the first flow channels 1211 intersect and communicate with each other. Therefore, when the first flow passage 1211 and/or the second flow passage 1212 are blocked or run dry, the cooling medium is supplemented from the connected first flow passage 1211 and/or the connected second flow passage 1212, and the heat dissipation performance of the vapor chamber 100 is greatly improved.

Referring again to fig. 1, in some embodiments, the protrusion 12 may abut against the second plate 20. A support column 21 is arranged on the second plate body 20, and the bulge 12 abuts against the support column 21.

Specifically, the protrusions 12 abut against the second plate body 20, and heat can be dissipated from the second plate body 20 through the capillary action of the protrusions 12, so that the heat dissipation capacity of the whole soaking plate 100 can be improved.

Furthermore, the supporting columns 21 may be distributed on the second plate 20 in an array. In this way, the support post 21 can provide protection in the cavity 30 to prevent the cavity 30 from being deformed by compression. In order to ensure that the support columns 21 can well perform the function of supporting and shaping, the support columns 312 can abut against the second capillary projections 121, so as to ensure the strength of the whole soaking plate 10.

Referring to fig. 9, the present embodiment further provides an electronic apparatus 200, where the electronic apparatus 200 includes a vapor chamber 100 and a heat source 40. The heat source 40 is thermally conductively coupled to the vapor chamber 100.

In the embodiment of the present application, the vapor chamber 100 may be used in the electronic device 200, and the electronic device 200 may be a mobile phone, a tablet computer, a smart wearable device, or the like. The electronic apparatus 200 includes a vapor chamber 100 and a heat source 40, and the heat source 40 may be a processor, a display screen, or the like generating components. The heat source 40 is thermally conductively coupled to the thermal spreader 100 or, alternatively, the heat source 40 can exchange heat with the thermal spreader 100. After the electronic device 200 is used for a long time, the electronic device 200 continuously operates, which may cause the heat source 40 of the electronic device 200 to generate a large amount of heat, and the heat of the heat source 40 may be dissipated to the surroundings through the vapor chamber 100 in time, and finally dissipated to the atmosphere, thereby improving the use performance of the electronic device 200 and improving the use experience of the user.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A vapor chamber, comprising:

the first plate body comprises a substrate, the substrate is provided with a groove and a plurality of bulges arranged on the bottom surface of the groove, the bulges are jointly provided with a plurality of flow channels, the flow channels are in a bent shape along a first direction and a second direction, the width range of the flow channels formed between any two adjacent bulges at random is 20 um-80 um, and the first direction is vertical to the second direction; and

and the second plate body covers the first plate body.

2. The soaking plate according to claim 1, wherein the protrusions are arranged in a matrix, and adjacent protrusions are staggered in the first direction.

3. The soaking plate according to claim 1, wherein the width of the flow channel between any adjacent two of the projections is equal.

4. The soaking plate according to claim 1, wherein the cross section of the protrusions has a polygonal shape, and the number of sides of the polygonal shape is more than 4.

5. The soaking plate according to claim 1, wherein the flow channel comprises a plurality of first flow channels arranged radially from a middle portion of the groove toward an edge portion of the groove.

6. The soaking plate according to claim 5, wherein the first flow channel extends in a curved line along the middle portion toward the edge portion.

7. The vapor chamber of claim 5, wherein the flow channels comprise a plurality of second flow channels in intersecting communication with the first flow channels, the plurality of second flow channels being spaced around the intermediate portion.

8. The soaking plate according to claim 1, wherein the protrusion abuts on the second plate body.

9. The soaking plate according to claim 8, wherein a supporting column is provided on the second plate body, and the protrusion abuts against the supporting column.

10. An electronic device, comprising:

the soaking plate according to any one of claims 1 to 9; and

a heat source in thermally conductive communication with the vapor chamber.