KR20110128539A - Heat spreader with flat plate and manufacturing method thereof - Google Patents

Heat spreader with flat plate and manufacturing method thereof Download PDF

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Publication number
KR20110128539A
KR20110128539A KR1020100048045A KR20100048045A KR20110128539A KR 20110128539 A KR20110128539 A KR 20110128539A KR 1020100048045 A KR1020100048045 A KR 1020100048045A KR 20100048045 A KR20100048045 A KR 20100048045A KR 20110128539 A KR20110128539 A KR 20110128539A
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South Korea
Prior art keywords
channel
substrate
refrigerant
heat spreader
width
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KR1020100048045A
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Korean (ko)
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KR101205715B1 (en
Inventor
김성진
윤영직
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한국과학기술원
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Priority to KR20100048045A priority Critical patent/KR101205715B1/en
Priority to PCT/KR2011/003717 priority patent/WO2011149216A2/en
Publication of KR20110128539A publication Critical patent/KR20110128539A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution

Abstract

PURPOSE: A heat spreader with flat plate and a manufacturing method thereof are provided that the single-channel closed loop is formed on the thin top of the substrate and the thin film type chiller is constituted. CONSTITUTION: A heat spreader with flat plate and a manufacturing method thereof comprise a first substrate(110), a second substrate(150), a channel(120), and an inlet port(160). It sticks to the substrate and the second substrate is combined. The channel is at least formed among the combined sides of the second substrate and the first substrate in one side into the closed loop shape. The refrigerant is injected through the inlet port into a part of the first substrate or the second substrate to the channel.

Description

Flat heat spreader and its manufacturing method {HEAT SPREADER WITH FLAT PLATE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a flat heat spreader and a method for manufacturing the same, which cools the electronic device by discharging heat generated in the electronic device to the outside.

As the line width of the electronic circuit constituting the semiconductor device becomes smaller, the number of devices per unit area increases. However, with this, the heat dissipation rate per unit area of the semiconductor chip is further increased, and this increase in heat dissipation rate decreases the performance and lifespan of the semiconductor device and ultimately reduces the reliability of the electronic device employing the semiconductor device. . In particular, in the semiconductor device, various parameter values are sensitively changed according to the operating temperature, thereby deteriorating the characteristics of the integrated circuit even more.

As the heat dissipation rate is increased, cooling technologies have been developed a lot, such as fin fan cooling, thermoelectric cooling, water-jet cooling, immersion cooling, Heat pipe cooling.

Generally, computer coolers are mainly concentrated on heat sources such as CPU, VGA card, chips, and boards. Such computer coolers cool heat from heat sources through heat pipes. In the cooling unit, a fin is installed to remove the high temperature heat of the heat source with a fan.

As described above, a heat pipe is used as a heat transfer medium in a conventional computer cooling device. The heat pipe is a round pipe, and absorbs high temperature heat by using latent heat of evaporation of a liquid refrigerant in contact with a heat source. And an evaporation unit for evaporating the refrigerant into a gas phase, a heat insulation unit for forming a refrigerant movement, and a condensation unit for cooling the gaseous refrigerant by a fan to condense it into a liquid phase, and a wick is inserted therein.

The wick includes a screen mesh, a sintered metal, a groove, and the like, and are used differently depending on the purpose and purpose of use. Such a wick causes the refrigerant vapor generated in the evaporator of the heat pipe to move to the condenser by the internal pressure difference, and the refrigerant liquid condensed by the external air cooling in the condenser is evaporated again by capillary force. Let's circulate to wealth.

1 illustrates a cylindrical heat pipe of a general wick structure. The heat pipe 10 includes an inner space 11 through which a gaseous refrigerant moves, and a porous medium 15 having a wick structure through which a liquid phase refrigerant moves.

One of the heat pipes 10 is an evaporator in contact with a heat source, and the other is a condenser for condensing evaporated vapor.

The arrow inside the heat pipe 10 indicates the movement of the refrigerant. The gaseous refrigerant is moved to the condensation unit through the internal space 11, and the gaseous refrigerant introduced into the condensation unit is phase-changed to give a liquid phase. Becomes a refrigerant. The liquid refrigerant soaks into a porous material 15 provided on the inner surface of the heat pipe 10.

The liquid refrigerant that has soaked into the porous medium 15 is moved back to the evaporation part by a capillary action of the porous medium 15.

Such cylindrical heat pipes can be used in ultra-slim electronic products, such as notebook computers, where the heat pipes are pressed to make the cylindrical heat pipes thinner. In addition, it must be bent in order to increase the fan heat transfer area of the condensation unit. However, in the state where the cylindrical heat pipe is pressed and the thickness thereof is not easy to bend, even if it is bent, the wick droop occurs in the inner surface of the pipe, and the shape is physically deformed, so that the smooth refrigerant cannot be moved. The performance of the heat pipe may be degraded.

In addition, when the groove is applied to the ultra-slim heat pipe, there is a problem that the micro-machining of the groove is difficult and the processing cost is high. When the mesh screen is applied to the wick structure of the ultra-slim heat pipe, as the wick layer becomes thinner, the flow pressure drop increases, and the surface tension of the refrigerant is weakened because the pore size is not constant. As a result, the cooling efficiency for the heating element is lowered.

Therefore, the heat pipe used in the conventional computer cooling device is not only difficult to manufacture, but also has a large limitation in the use position and shape thereof, which makes it difficult to use in various forms.

The present invention provides a flat heat spreader and a method for manufacturing the same, wherein a plurality of single capillaries filled with a predetermined amount of refrigerant in a thin substrate are connected to form a closed loop.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the particular embodiments that are described. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, There will be.

Flat heat spreader of the present invention for achieving the above object, the first substrate; A second substrate tightly coupled to the first substrate; A channel formed in the form of a closed loop on at least one of surfaces on which the first and second substrates are coupled; And an injection hole formed to inject a refrigerant into the channel into a portion of the first substrate or the second substrate.

Specifically, the channel is a single channel in the form of a closed loop, the channel is characterized in that the zigzag or spiral form.

The first substrate and the second substrate, at least one evaporator for absorbing heat radiated from the electronic component; And at least one condensation unit formed on the same plane as the evaporation unit and dissipating heat transferred through the refrigerant.

The first substrate and the second substrate is characterized in that the flexible material having elasticity.

The critical diameter (D crit ) of the channel is determined by the following equation, the critical diameter (D crit ) is varied according to the type of refrigerant, the diameter of the channel is about 0.1 to 5.0mm It features.

Equation

Figure pat00001

only,

Figure pat00002
Is the acceleration of gravity,
Figure pat00003
Is the liquid phase density of the refrigerant,
Figure pat00004
Is the gas phase density of the refrigerant,
Figure pat00005
Is the surface tension of the refrigerant.

Another flat heat spreader of the present invention for achieving the above object, the first substrate; A second substrate tightly coupled to the first substrate; A channel formed in the form of a closed loop on at least one of surfaces on which the first and second substrates are coupled; An injection hole formed in a portion of the first substrate or the second substrate; And a refrigerant injected into the channel through the injection hole and alternately positioned in the gas phase and the liquid phase in the channel when heat is generated.

Another flat heat spreader of the present invention for achieving the above object, the first substrate; A second substrate tightly coupled to the first substrate; A channel formed in a closed loop shape on at least one of surfaces joining the first and second substrates, the width of which is varied in a refrigerant moving direction; And an injection hole formed to inject a refrigerant into the channel into a portion of the first substrate or the second substrate.

The channel has a zigzag or spiral shape, and the width of the channel has a wedge shape extending from one side to the other side.

The width of the channel is widened from the evaporator to the condenser side based on the moving direction of the refrigerant, characterized in that the same width from the condenser to the evaporator side.

The width of the channel is different from the width of adjacent channels with respect to the partition wall.

According to one aspect of the present invention, there is provided a method of manufacturing a heat spreader, the method including: forming a channel for storing a refrigerant in at least one of a first substrate and a second substrate in a closed loop shape; Forming an injection hole for injecting a refrigerant into a portion of the first substrate or the second substrate; Injecting a refrigerant through the injection hole after attaching the first substrate and the second substrate to seal the channel; And sealing the injection hole after injecting the refrigerant.

The channel may be formed through a semiconductor etching process.

As described above, in the present invention, a closed channel of a single channel is formed on a thin substrate to form a thin film type cooling device, so that the thickness of the cooling device is thin, so that it is easy to be embedded in an electronic device, and a lot of separate space for the cooling device is provided. There is an advantage that can provide design convenience because it is unnecessary.

In addition, by inserting the thin film type cooling apparatus according to the present invention inserted into the outer cover of the electronic device such as a mobile phone, PDA, smartphone, etc., there is no need for a separate cooling device for the portable electronic device and its installation space, the degree of freedom of design of the electronic device There is an advantage that can increase and also improve the reliability of the performance of the electronic device due to the cooling device.

In addition, as the channel into which the refrigerant is injected is formed on the substrate, the manufacturing of the cooling apparatus is simple, and when the substrate is a flexible material, the cooling apparatus can be mounted on the flexible circuit board, thereby increasing the range of use. have.

1 is a cross-sectional view showing a cylindrical heat pipe of a general wick structure.
2A to 2C are a perspective view, a plan view, and a cross-sectional view showing a flat heat spreader according to an embodiment of the present invention, respectively.
3 is a view illustrating a process of heat absorption and heat dissipation of a refrigerant according to the present invention.
4A and 4B are diagrams for explaining the relationship between the diameter of the channel and the gaseous and liquid refrigerant.
5A and 5B are a plan view and a cross-sectional view showing a flat heat spreader according to another embodiment of the present invention.
6a and 6b are a plan view and a cross-sectional view showing a flat heat spreader according to another embodiment of the present invention.
7a and 7b are a plan view and a cross-sectional view showing a flat heat spreader according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention. Like elements in the figures are denoted by the same reference numerals wherever possible. In addition, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

2A to 2C are a perspective view, a plan view, and a cross-sectional view showing a flat heat spreader according to an embodiment of the present invention, respectively.

As shown in FIG. 2A, the flat heat spreader 100 includes a first substrate 110, a channel 120, a second substrate 150, and a refrigerant inlet 160.

The first substrate 110 and the second substrate 150 are tightly coupled to each other in a pair.

The first substrate 110 and the second substrate 150 are rectangular thin plates, and each of the substrates 110 and 150 is a semiconductor material such as silicon or gallium, a polymer material such as plastic, and a self-assembled single layer film. It can be made of a variety of materials, such as a new material laminated material such as monolayer), a metal material such as copper or aluminum having excellent thermal conductivity and alloy materials thereof, ceramics, and flexible materials having elasticity.

The capillary channel 120 is formed in a closed loop shape on at least one of surfaces on which the first substrate 110 and the second substrate 150 are coupled. The channel 120 may be formed on the first substrate 110 and the second substrate 150 at the same time, but in the embodiment, the channel 120 is formed on the first substrate 110.

The refrigerant inlet 160 is formed to inject a refrigerant into the channel 120 into a portion of the first substrate 110 or the second substrate 150. In the embodiment, the refrigerant inlet 160 is formed on the second substrate 150.

In the above, the refrigerant may be injected about 30% to 60% of the volume of the channel 120. Here, when the amount of refrigerant injected is less than 30%, the amount of heat transfer medium (refrigerant) decreases, and thus the heat transfer efficiency is decreased. When the amount of refrigerant injected is 60% or higher, there is less space left for the refrigerant to pulsate, so the heat transfer efficiency may be decreased. .

Here, a variety of refrigerants may be used, for example, water, ethanol, ammonia, acetone, R-134a, HFC-based refrigerant may be used. In the case of water or ethanol, the heat capacity is large, which is advantageous as a refrigerant material because it can transfer a large amount of heat.

The channel 120 is a single channel in a closed loop form as shown in FIG. 2B and may be configured in a zigzag or spiral form.

As shown in FIG. 2C, the channel 120 is formed as a groove having a predetermined width and height on the first substrate 110, and the channel 120 has a rectangular shape. Of course, the groove of the channel 120 may be formed in a semi-circle shape or a 'Ｖ' shape as needed.

In an embodiment, the thickness t1 of the first substrate 110 is about 1 mm to about 6 mm, the thickness t2 of the second substrate 150 is about 0.5 mm to about 2 mm, and the channel 120 has a width w. It is about 1 mm-5 mm, and the height h is about 0.5 mm-5 mm. Of course, the width and height of the channel 120 may vary as necessary.

In the heat spreader 100 configured as described above, the part in contact with the electronic component becomes the evaporator 101 to absorb heat radiated from the electronic component, and the other side becomes the condenser 105 and is transferred through the refrigerant. Heat is released to the outside. Accordingly, the evaporator 101 may be at least one, and the remaining part except the evaporator 101 becomes the condenser 105.

The heat spreader 100 configured as described above has at least two single channel (capillary channels) having a diameter of about 5 mm or less connected to the inside of the first substrate 110 to form one closed loop. The inside is filled with a certain amount of refrigerant.

The channel 120 as described above may be formed in various ways, such as a semiconductor etching method, a mechanical method or a stacked method may be used.

The etching method is the same as the semiconductor etching method. For example, after cleaning the surface of the first substrate 110 made of a silicon substrate, a photoresist is applied on the first substrate 110. The photoresist is exposed through an exposure process using a predetermined mask. In this case, the photoresist is divided into an exposed portion and an unexposed portion.

A development process is performed to selectively remove the exposed or unexposed portions of the photoresist. Subsequently, the first substrate 110 is etched to a predetermined depth by an etching process using the remaining photoresist pattern as a mask to form a single channel having a closed loop as in the present invention, and then the remaining photoresist is removed. .

In this case, the width of the channel 120 is formed to a size that can effectively generate a capillary force, the height is formed to be lower than the thickness of the first substrate (110). In addition, when the mask used for exposing the photoresist is manufactured in various ways, the channel 120 may be formed in various forms.

The heat spreader 100 configured as described above is somewhat variable in thermal conductivity depending on the size and thickness (usually the smaller the thickness, the smaller the value), but is about 10 5 W / mK. This is superior to the thermal conductivity of aluminum (237 W / mK), copper (401 W / mK) and diamond (2300 W / mK).

3 is a view illustrating a process of heat absorption and heat dissipation of a refrigerant according to the present invention, one side of the channel group being an evaporator, and the other side of the channel group being a condenser.

When heat is applied to the evaporator, the refrigerant in the gas phase located in the evaporator expands according to the endothermic reaction, thereby increasing the pressure. That is, the control volume (c.v.) of the evaporator is expanded by the endothermic reaction.

The gaseous refrigerant in the evaporator at the increased pressure induces a force to push the adjacent liquid refrigerant to the condenser at a lower pressure. In FIG. 3, the second refrigerant located in the evaporator is moved to the condenser by the inspection volume. The test volume moved to the condensation unit radiates heat absorbed to the outside. As a result, the test volume is contracted again.

The refrigerant absorbing heat from the evaporator reaches the condenser and releases heat and returns back to the evaporator along another connected channel. The refrigerant returned to the evaporator again absorbs heat and expands to increase the pressure, which then moves in the opposite direction of the channel to reach the condenser. This process is repeated repeatedly so that the refrigerant flows periodically while pulsating and heat can be continuously transferred between the evaporator and the condenser.

4A and 4B are diagrams for explaining the relationship between the diameter of the channel and the gaseous phase and the liquid refrigerant. When the diameter D of the channel 120 is larger than the critical diameter D crit , as shown in FIG. As a result, a liquid refrigerant and a vapor phase refrigerant exist separately, so that a pulsating action like the present invention does not occur. Here, the diameter (D) includes both the width and height of the channel 120.

However, if the diameter D of the channel 120 is smaller than the critical diameter D crit (meaning the maximum allowable diameter), the liquid phase and the gas phase are alternately present in the channel 120 as shown in FIG. The same action as in FIG. 3 occurs when radiating heat.

Here, the critical diameter D crit of the channel 120 according to the refrigerant is determined by Equation 1 below, and the critical diameter D crit varies according to the type of the refrigerant.

Figure pat00006

here,

Figure pat00007
Is the acceleration of gravity,
Figure pat00008
Is the liquid phase density of the refrigerant,
Figure pat00009
Is the gas phase density of the refrigerant,
Figure pat00010
Is the surface tension of the refrigerant.

Therefore, the critical diameter D of the channel 120 is determined by Equation 1, and the diameter of the actual channel 120 should be smaller than the critical diameter. For example, was the critical diameter (D crit) it is less than 5mm the case of water, for a critical diameter (D crit) of ethanol is set to be smaller than 3mm. In general, refrigerants have a critical diameter (D crit ) in the range of 2 mm to 5 mm.

Figure pat00011
The larger) is, the larger the critical diameter is.

In addition, the minimum diameter of the channel 120 may be in the unit of μm, and when the diameter of the channel 120 is larger than the unit of μm, a pulsating action as shown in FIG. 3 occurs.

5A and 5B are a plan view and a cross-sectional view showing a flat heat spreader according to another embodiment of the present invention. FIG. 5A differs only in the width of the channel 120 when compared to FIG. 2A.

The heat spreader includes a first substrate 110, a second substrate 150, a channel 120, and a refrigerant inlet 160.

The first substrate 110 and the second substrate 150 are tightly coupled to each other in a pair.

The channel 120 is formed in a closed loop shape on at least one of the surfaces where the first substrate 110 and the second substrate 150 are coupled to each other, and the width of the channel 120 varies along the refrigerant moving direction. The channel 120 may be formed on the first substrate 110 and the second substrate 150 at the same time, but in the embodiment, the channel 120 is formed on the first substrate 110.

The refrigerant inlet 160 is formed to inject a refrigerant into the channel 120 into a portion of the first substrate 110 or the second substrate 150.

The channel 120 is a single channel in a closed loop form as shown in FIG. 5A and may be configured in a zigzag or spiral form.

The channel 120 is formed of a groove having a variable width in the first substrate 110, and the width of the channel 120 is a wedge shape extending from one side to the other side.

Here, the width of the channel 120 is configured to widen from the evaporator 101 to the condenser 105 based on the movement direction of the refrigerant, and has the same width from the condenser 105 to the evaporator 101 side. . In the present invention, the reason for varying the width of the channel 120 is that the narrower the pressure is higher than the wider area, the refrigerant is pumped (pumping) from the narrower to the wider the movement of the refrigerant, that is heat transfer Because it is faster than this.

6A and 6B are a plan view and a cross-sectional view showing a flat heat spreader according to another embodiment of the present invention. FIG. 6A is slightly different in width of the channel 120 compared to FIG. 5A.

That is, the width of the channel 120 formed on the first substrate 110 is variable along the moving direction of the refrigerant, and the width of the channel 120 is widened from the evaporator 101 to the condenser 105. It has a wedge shape in which the width of the channel 120 is also widened from the condenser 105 to the evaporator 101 side. As a result, the refrigerant in which the gaseous phase and the liquid phase alternately move while vibrating along the channel 120, and thus the moving speed of the refrigerant becomes faster due to the pressure difference between the evaporator 101 and the condenser 105.

7A and 7B are a plan view and a cross-sectional view showing a flat heat spreader according to another embodiment of the present invention. In the case of FIG. 7A, the width of the channel 120 along the moving direction of the coolant is shown in FIGS. This is not variable, but arbitrary channels are different in width from adjacent channels. That is, the heat spreader is formed with different widths of adjacent channels based on the partition wall.

For example, when the width of the first channel is wide, the second channel adjacent to the first channel is narrower than the first channel, the third channel is wider than the adjacent second channel, and the fourth channel is adjacent to the third channel. It is formed in a way narrower than the channel.

As described above, when heat is applied to one side of the channel group, that is, the evaporator 101, the refrigerant in the gaseous phase located in the evaporator 101 is expanded to increase the pressure. The refrigerant in the gas phase of the evaporator 101 having an increased pressure causes a force to push the adjacent refrigerant in the liquid phase and moves toward the condenser 105 having a low pressure. The refrigerant absorbing heat from the evaporator 101 reaches the condenser 105 to release heat and returns to the evaporator 101 along another connected channel 120.

The refrigerant returned to the evaporator 101 again absorbs heat and expands to increase the pressure to move in the opposite direction of the channel 120 to reach the condenser 105. This process is repeated repeatedly so that the heat may be continuously transferred between the evaporator 101 and the condenser 105 while the refrigerant periodically vibrates.

The heat spreader 100 configured as described above may be manufactured integrally with the cover by being inserted into a cover or case of an electronic device such as a mobile phone, a smart phone, a PDA, a palmtop, a notebook, and the like.

When the heat spreader is incorporated in the cover as described above, the inner surface of the cover contacts the electronic component that generates a lot of heat to form the evaporator 101, and the outer surface of the cover is exposed to the surrounding atmosphere, so the condensation unit 105 ) Is achieved.

As such, when the heat spreader is inserted into the outer cover of the electronic device, the size of the electronic device can be minimized because a separate space for the heat spreader is not required.

In addition, the heat spreader 100 may be fixed to upper and lower ends of a circuit board or an electronic component (for example, a CPU, a communication module, etc.) to cool the electronic component.

On the other hand, when the substrates 110 and 150 of the heat spreader 100 are made of a flexible material, the heat spreader 100 can be attached and used on the upper and lower ends of the flexible circuit board, thereby further widening the use range. .

The present invention has been described with reference to the preferred embodiments, and those skilled in the art to which the present invention pertains to the detailed description of the present invention and other forms of embodiments within the essential technical scope of the present invention. Could be. Here, the essential technical scope of the present invention is shown in the claims, and all differences within the equivalent range will be construed as being included in the present invention.

100: heat spreader 101: evaporator
105: condensation unit 110: first substrate
120: channel 150: second substrate
160: refrigerant inlet

Claims (20)

A first substrate;
A second substrate tightly coupled to the first substrate;
A channel formed in the form of a closed loop on at least one of surfaces on which the first and second substrates are coupled; And
And an injection hole formed to inject a refrigerant into the channel into a portion of the first substrate or the second substrate.
The method of claim 1,
And said channel is a single channel in the form of a closed loop.
The method of claim 1,
And said channel is in a zigzag or spiral form.
The method of claim 1,
The first substrate and the second substrate, at least one evaporator for absorbing heat radiated from the electronic component; And at least one condenser formed on the same plane as the evaporator and dissipating heat transferred through the refrigerant.
The method of claim 1,
The first substrate and the second substrate is a flat heat spreader made of a flexible material having elasticity.
The method of claim 1,
Said channel having the same width.
The method of claim 1,
The channel is a flat heat spreader in which a refrigerant is injected 30% to 60% of the volume of the channel.
The method of claim 1,
The critical diameter (D crit ) of the channel is determined by the following equation, the critical diameter (D crit ) is a flat heat spreader that varies depending on the type of refrigerant.
Equation
Figure pat00012

only,
Figure pat00013
Is the acceleration of gravity,
Figure pat00014
Is the liquid phase density of the refrigerant,
Figure pat00015
Is the gas phase density of the refrigerant,
Figure pat00016
Is the surface tension of the refrigerant.
The method of claim 1,
The diameter of the channel is a flat heat spreader of 0.1 to 5.0mm.
A first substrate;
A second substrate tightly coupled to the first substrate;
A channel formed in the form of a closed loop on at least one of surfaces on which the first and second substrates are coupled;
An injection hole formed in a portion of the first substrate or the second substrate; And
And a refrigerant injected into the channel through the injection hole, the refrigerant being alternately positioned in the gas phase and the liquid phase in the channel when heat is generated.
A first substrate;
A second substrate tightly coupled to the first substrate;
A channel formed in a closed loop shape on at least one of surfaces joining the first and second substrates, the width of which is varied in a refrigerant moving direction; And
And an injection hole formed to inject a refrigerant into the channel into a portion of the first substrate or the second substrate.
The method of claim 11,
And said channel is in a zigzag or spiral form.
The method of claim 11,
The width of the channel is a flat heat spreader having a wedge (wedge) shape widening from one side to the other side.
The method of claim 11,
The width of the channel is wider from the evaporator to the condensation unit side, based on the movement direction of the refrigerant, the flat heat spreader having the same width from the condensation unit side.
The method of claim 11,
And the width of the channel is different from the width of adjacent channels with respect to the partition wall.
Forming a channel for accommodating the refrigerant in at least one of the first substrate and the second substrate in a closed loop shape;
Forming an injection hole for injecting a refrigerant into a portion of the first substrate or the second substrate;
Injecting a refrigerant through the injection hole after attaching the first substrate and the second substrate to seal the channel; And
Sealing the injection hole after the injection of the refrigerant; manufacturing method of a flat heat spreader comprising a.
17. The method of claim 16,
The channel is a method of manufacturing a flat heat spreader is formed of a single channel of the zigzag or spiral form.
17. The method of claim 16,
The width of the channel is a manufacturing method of the flat heat spreader is variable based on the moving direction of the refrigerant.
17. The method of claim 16,
The channel is a method of manufacturing a flat heat spreader is formed through a semiconductor etching process.
17. The method of claim 16,
The channel is a method of manufacturing a flat heat spreader is formed with a width and height of 0.1 to 5.0mm.
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