CN113508454A - micro-LED light-emitting inspection device, inspection device for optical filter used in the device, and micro-LED light-emitting inspection method using the device and incorporated in manufacturing process - Google Patents

micro-LED light-emitting inspection device, inspection device for optical filter used in the device, and micro-LED light-emitting inspection method using the device and incorporated in manufacturing process Download PDF

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CN113508454A
CN113508454A CN202080018056.3A CN202080018056A CN113508454A CN 113508454 A CN113508454 A CN 113508454A CN 202080018056 A CN202080018056 A CN 202080018056A CN 113508454 A CN113508454 A CN 113508454A
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filter
micro led
light
image processing
optical
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CN113508454B (en
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山本茂
番场佳彦
安田雅宏
滨野俊之
田畑让
得居道久
颜颉
上原雅史
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Orbotech Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02Testing optical properties
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14645Colour imagers
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

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Abstract

The invention provides a micro LED light-emitting inspection device for inspecting the quality of a plurality of micro LEDs formed on a wafer at a dot pitch of 0.1mm or less, the micro LED light-emitting inspection device comprises a power supply mechanism, an optical lens, an image pickup device, a digital image processing device, an optical filter, a filter driving mechanism, a control device, etc., and uses the following optical filter, by the measurement control of the light intensities of the optical filter-free and the optical filter-equipped, the emission wavelength of the micro LED can be determined at high speed with a relatively large difference in inspection time, the optical filter is configured such that each of the micro-LEDs to be measured is automatically found and specified from the captured image by the digital image processing device, the light intensity of the micro-LEDs generated from the frame image of the screen is measured in a lump, and the filter transmission light intensity is monotonously increased or monotonously decreased in a predetermined light wavelength band.

Description

micro-LED light-emitting inspection device, inspection device for optical filter used in the device, and micro-LED light-emitting inspection method using the device and incorporated in manufacturing process
Technical Field
The present invention relates to a micro-LED Light emission inspection apparatus for inspecting a plurality of LED chips formed on a wafer in a manufacturing process of a display device using a Light-emitting diode (LED), an inspection apparatus for an optical filter used in the apparatus, and a method for inspecting a micro-LED Light emission using the apparatus incorporated in a manufacturing process.
Background
Among the flat display devices having a high resolution, display devices using TFT (Thin-film transistor) liquid crystal or organic LED technology are being put into practical use, and in addition to these display devices, in recent years, as a self-emitting display device having higher light emission efficiency than the organic LED display device, a display device called a micro LED, which is obtained by arranging a micro LED chip made by using a solid semiconductor technology on a circuit substrate, has been studied.
The micro LED display device is characterized by being mounted with chips having different manufacturing process conditions, for example, chips cut from different wafers or chips cut from different positions spaced apart from each other on the same wafer, which are adjacent to each other and mounted on a substrate.
In a TFT liquid crystal or organic LED display device, since elements affecting the display quality of pixels such as luminance and emission wavelength, such as a switching transistor and a color filter, are directly generated on a display substrate, process conditions such as temperature and solvent concentration of adjacent pixels on a display device are substantially the same, and thus the display device has a property that the boundary such as luminance and emission color is not conspicuous. In contrast, in the micro LED display device, chips generated under different process conditions as described above may be mounted as adjacent pixels, and particularly, when groups having different emission luminances or emission wavelengths are adjacent to each other in a system in which a plurality of chips are collectively mounted in a rectangular group, for example, a defect occurs in which the group boundaries are viewed as uneven.
In order to avoid such a problem, a method of measuring emission luminance or emission wavelength of a chip that has completed in a form capable of emitting light, grouping the chips for each standard, and making a way to prevent the chips mounted on a specific display device from being mixed with different groups is used.
Conventionally, a spectrometer using a diffraction grating has been mainly used for measuring emission wavelengths for binning, and patent documents 1 and 2 describe this. Among them, patent document 2 uses a spectrometer that also uses a CCD (Charge Coupled Device) linear sensor. However, in these methods using a spectrometer, it is considered that the wavelength measurement speed takes about 1ms for each measurement 1 time, for example.
However, the number of LED chips mounted on the micro LED display device is 3,860 × 2,140 in a display device with a resolution of 4K, more than 800 ten thousand of each of RGB (Red Green Blue ), and 0.077mm in dot pitch in a 13.3-inch display device. It is assumed that micro LEDs satisfying a dot pitch of about 0.1mm can form more than 150 ten thousand on a 6-inch wafer. When the luminescence wavelength is measured by the measurement method using the spectrometer, there is a problem that it takes as long as 1500 seconds. Further, if the resolution is 8K, the dot pitch is 0.038mm in a 13.3-inch display device. In this case, 1000 or more ten thousand LED chips are formed on a 6-inch wafer, and when the light emission wavelength is measured by the measurement method of the spectrometer, it takes 10000 seconds.
Further, the micro LED may be mounted with chips generated under different process conditions as adjacent pixels, and it is necessary to further suppress variations that vary depending on the manufacturing conditions and to quickly grasp the manufacturing variation factor.
Background of the invention
Patent document
Patent document 1: japanese patent laid-open No. 63-248141
Patent document 2: japanese patent laid-open No. 63-29758
Disclosure of Invention
[ problems to be solved by the invention ]
The present invention can solve the above-described problems, and an object of the present invention is to provide a micro LED light emission inspection apparatus that allows a plurality of micro LEDs to be formed on a wafer at a dot pitch of 0.1mm or less, with a measurement time that is significantly different from that of the background art, but is only one-tenth or less.
[ means for solving problems ]
The invention provides a high-speed micro LED light emission inspection device for solving the problems. The following description is made.
The invention provides a micro-LED light emission inspection device, which is arranged above a semiconductor substrate, wherein micro-LEDs in rectangular areas occupying the size of 100 mu m square or less, which are separately arranged, are arranged in an array on the surface of the semiconductor substrate, and the micro-LED light emission inspection device comprises:
a power supply mechanism for making the micro LED emit light;
an imaging device having an image sensor for measuring the intensity of the emitted light, the imaging device being disposed opposite to the substrate and having an optical lens;
A digital image processing device for receiving the image signal of the camera device;
an optical filter disposed on an optical path between the micro LED and the optical lens and having a predetermined optical wavelength band;
a filter driving mechanism supporting the optical filter and including a receiving section for a control signal; and
a control device including a transmission unit for a control signal of the filter driving mechanism and a control unit for generating the control signal and executing flow control at the start of a system flow; and is
The optical filter has a filter transmission light intensity which monotonically increases or monotonically decreases in a prescribed light wavelength band including a color wavelength satisfying a design condition,
the control means can selectively control the presence or absence of the optical filter using the filter driving mechanism,
the digital image processing apparatus includes a memory for storing an image data frame generated after receiving the video signal, and includes:
a unit image volume identification unit for identifying a unit image volume of the light emission based on a predetermined criterion from a light intensity pixel map of each pixel on the image data frame, and generating unit image volume map data for the pixel map;
A micro LED identification unit for specifying a plurality of micro LEDs arranged in an array form according to the unit image volume and generating micro LED mapping data for mapping the micro LEDs onto the pixel map; and
and a micro LED inspection unit configured to determine the optical energy intensity of the micro LED by using a predetermined optical energy intensity calculation formula based on the light intensity map on the micro LED map, store the optical energy intensity value in the arrangement without the optical filter out of the optical energy intensities of the micro LED in the memory, and determine the emission wavelength of the micro LED by using a predetermined emission wavelength calculation formula based on the optical energy intensity value of the micro LED in the arrangement with the optical filter and the optical energy intensity value in the arrangement without the optical filter. In this configuration, the digital image processing device automatically finds and specifies each of the micro LEDs to be measured from the captured image, and measures the light intensity of the micro LEDs generated from the frame image in a lump, so that the light emission wavelength of the micro LEDs can be measured at a higher speed than the individual measurement of the conventional CCD line sensor. In the measurement, the digital image processing apparatus having relatively high signal processing speed can capture images of the wafer to be inspected, without an optical filter or with an optical filter, immediately after the wafer is mounted on the imaging screen, and can acquire image frame data for the entire wafer for about 100 seconds in total, that is, about 50 seconds in the case of no optical filter or about 50 seconds in the case of an optical filter. In this way, by automatic image processing after acquiring image frame data, it is possible to realize higher-speed inspection by collectively processing the measurement of the emission wavelengths of the micro LEDs in the entire wafer.
Further, in an additional aspect, the present invention
The predetermined criterion is that a pixel exhibiting a peak luminous energy intensity value with respect to the surroundings is specified as a center portion of the unit image, and a center between center portions of adjacent unit image is set as a rectangular boundary of the unit image. This configuration provides an effect that the identification of the pixel belonging to the unit image body can be determined more easily and quickly.
Further, in an additional aspect, the present invention
A micro LED light emission inspection device is provided, wherein the predetermined criterion is to specify a pixel having a peak light energy intensity value with respect to the surroundings as a center portion of the unit image body, and to determine a rectangular boundary of the unit image body based on a designed interval value of micro LEDs arranged in an array. This configuration provides an effect that the identification of the pixel belonging to the unit image object can be determined more easily and quickly by effectively using the design data.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection device, wherein the predetermined light energy intensity calculation formula is a sum of stepwise light intensities of the pixels included in the micro LED on the light intensity pixel map. This configuration provides an advantage that the sum of stepwise light intensities of pixels included in the micro LED is obtained, and when the micro LED is used in relation to light intensities observed in all pixels, it is possible to smooth disturbance associated with measurement of each pixel.
Further, in an additional aspect, the present invention
There is provided a micro LED light emission inspection device in which the optical filter is calibrated for filter characteristics by a light source of a known wavelength of light, and the micro LED light emission inspection device stores a lookup table made based on the calibration regarding a relationship between the ratio of the light energy intensity value in a configuration without the optical filter to the light energy intensity value in a configuration with the optical filter and the light emission wavelength. This configuration has an effect that the relationship between the variable not expressed as a function and the search value can be provided by the sampling method.
Further, in an additional aspect, the present invention
In the micro LED light emission inspection apparatus, the predetermined light emission wavelength calculation formula for the micro LED is determined by referring to the light emission wavelength corresponding to the measured value of the optical energy intensity ratio by using the lookup table, and adding and proportionally interpolating a median value. This configuration provides an effect that the emission wavelength can be determined with appropriate accuracy even for the median value other than the discrete value.
Further, in an additional aspect, the present invention
Provided is an optical filter inspection device for a micro LED light emission inspection device, characterized by comprising: a substrate having an array-like surface on which reflectors are formed, the reflectors being arranged in substantially the same number and arrangement as the design conditions of the array-like micro LED array to be inspected, at least in a predetermined region;
A light projecting mechanism for reflecting light of the reflector;
a light guide mechanism for the light projection mechanism;
a source of known wavelengths of the light projection light;
an imaging device having an image sensor for measuring the intensity of the emitted light, the imaging device being disposed opposite to the substrate and having an optical lens;
a digital image processing device for receiving the image signal of the camera device;
an optical filter for a micro-LED emission inspection device, disposed between the optical lens and the reflector on a reflected light path of the reflector, and having a predetermined light wavelength band;
a filter driving mechanism supporting the optical filter and including a receiving section for a control signal; and
a control device including a transmission unit for a control signal of the filter driving mechanism and a control unit for generating the control signal and executing flow control at the start of a system flow; and is
The optical filter has a filter transmission light intensity which monotonically increases or monotonically decreases in a prescribed light wavelength band including a color wavelength satisfying a design condition,
the control means can selectively control the presence or absence of the optical filter using the filter driving mechanism,
The digital image processing apparatus includes a memory for storing an image data frame generated after receiving the video signal, and includes:
a unit image volume recognition unit that recognizes the reflected light of the reflector as the light emission of the micro LED, specifies a unit image volume of the light emission from a light intensity pixel map of each pixel on the image data frame based on a predetermined criterion, regards the unit image volume of the reflected light as a unit image volume based on the light emission of the micro LED, and generates unit image volume map data for the pixel map;
a micro LED identification unit for identifying a plurality of the micro LEDs arranged in an array and regarded as the reflector from the unit image, and generating micro LED mapping data for mapping the micro LEDs onto the pixel map; and
and a micro LED inspection unit configured to determine the optical energy intensity of the micro LED by using a predetermined optical energy intensity calculation formula based on the light intensity map on the micro LED map, store the optical energy intensity value in the arrangement without the optical filter out of the optical energy intensities of the micro LED in the memory, and determine the emission wavelength of the micro LED regarded as the light source of the reflected light by using a predetermined emission wavelength calculation formula of the micro LED based on the optical energy intensity value of the micro LED in the arrangement with the optical filter and the optical energy intensity value of the arrangement without the optical filter. This configuration provides an effect that the calibration of the geometric environment optical filter similar to the micro LED can be performed, and the inspection preview can be performed as the inspection target light source simulated as the micro LED even when the design stage is still performed.
Further, in an additional aspect, the present invention
There is provided an optical filter inspection apparatus for a micro LED light emission inspection apparatus, wherein the light projection mechanism for reflected light of the reflector described in the preceding paragraph includes a half mirror disposed between the optical lens and the reflector on a reflected light path of the reflector. With this configuration, an effect is obtained that a more space-saving device is provided.
Further, in an additional aspect, the present invention
There is provided the optical filter inspection device of the preceding paragraph for a micro LED luminescence inspection device of the preceding paragraph, wherein the light guiding mechanism comprises an optical fiber cable. With this configuration, the degree of freedom of component arrangement can be obtained, and waste heat of the light source can be taken into consideration, which contributes to space saving.
Further, in an additional aspect, the present invention
There is provided an optical filter inspection apparatus for a micro LED light emission inspection apparatus described in the foregoing paragraph, wherein the optical filter makes a lookup table based on the calibration completion with respect to a relationship between the ratio of the light energy intensity value in the configuration without the optical filter to the light energy intensity value in the configuration with the optical filter and the light emission wavelength. With this configuration, the target value that cannot be expressed by one function can be determined from the sample value by using the look-up table.
Further, in an additional aspect, the present invention
An optical filter inspection apparatus for a micro-LED light emission inspection apparatus is provided, wherein a look-up table is created in the digital image processing apparatus based on a relationship between the light emission wavelength and a ratio of the light energy intensity value in an arrangement without the optical filter to the light energy intensity value in an arrangement with the optical filter in accordance with the calibration, and the light emission wavelength is determined by adding a median value to the light energy intensity ratio measurement value and proportionally interpolating the median value with reference to the look-up table, with respect to the predetermined light emission wavelength calculation formula for the micro-LED. With this configuration, the target value can be determined with appropriate accuracy even for a variable value that is offset from the sampling value.
Further, in an additional aspect, the present invention
There is provided a micro LED light emission inspection apparatus including the optical filter inspection apparatus for a micro LED light emission inspection apparatus described in the preceding paragraph. With this configuration, the optical filter inspection apparatus for a micro LED light emission inspection apparatus described in the above paragraph can achieve the effect of saving the apparatus arrangement space and the effect of facilitating the apparatus manufacturing management and scheduling, which can be applied integrally with the micro LED light emission inspection apparatus described in the above paragraph.
Further, in an additional aspect, the present invention
There is provided a micro LED lighting inspection apparatus, wherein the digital image processing apparatus further comprises a connection interface to a persistent memory from which the filter characteristics and the look-up table can be received as main data, the memory being stored within the digital image processing apparatus. With this configuration, the look-up table can be provided from the outside and can be shared by a plurality of devices.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection device, wherein the digital image processing device can arrange light with a known light emission wavelength for calibration of the filter characteristics as reference light in the optical field of view of the imaging device. With this configuration, it is possible to perform measurement based on not only the relative ratio of the two measurements but also the reference light, and it is possible to further avoid the disturbance due to the inspection environmental conditions.
Further, in an additional aspect, the present invention
The micro LED light emission inspection device further includes an optical sensor for monitoring the light intensity of the reference light emitter, and the image processing device is configured to receive a signal output from the optical sensor and correct the calibration using the normalized stepwise light intensity of the reference light emitter based on a light intensity monitoring value of the optical sensor. With this configuration, it is possible to obtain not only a relative ratio of two measurements but also a more absolute measurement and grasp the luminance.
Further, in an additional aspect, the present invention
There is provided a micro LED light emission inspection apparatus, wherein the control device of the micro LED light emission inspection apparatus further comprises a receiving unit for a status signal generated by the filter driving mechanism, the control unit of the control device generates a control signal for instructing the filter driving mechanism to select the absence of the filter and can transmit the control signal to the filter driving mechanism, and the control device generates a control signal for instructing the image processing device to start measurement of the light energy intensity value in the arrangement without the optical filter and can transmit the control signal to the image processing device via a control signal transmitting unit,
the control unit of the control device, upon receiving the status signal from the filter driving mechanism or upon receiving an instruction to start inspection, then generates a control signal instructing the image processing device to start measurement of the light energy intensity value in the arrangement without the optical filter, and transmits the control signal to the image processing device via a control signal transmitting unit, and the image processing device has a micro LED reject determination unit that identifies a micro LED showing an abnormal value on micro LED mapping data as a micro LED reject and stores reject flag data for exclusion from a micro LED product. With this configuration, it is possible to determine an abnormal value in advance when performing collective processing from the image data frame by relative evaluation of the micro LEDs on the wafer, and it is particularly advantageous to grasp the wafer boundary region, and it is useful to perform collective processing from the image data frame.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection apparatus, wherein the digital image processing apparatus of the micro LED light emission inspection apparatus includes an external connection path for inputting arrangement design data of the micro LEDs, a data input unit, and a micro LED map boundary determination unit that receives the arrangement design data of the micro LEDs arranged in an array from the data input unit via the external connection path, stores the arrangement design data of the micro LEDs arranged in an array in the memory in the digital image processing apparatus, compares the defective micro LED data with the arrangement design data of the micro LEDs, identifies an end of an arrangement of normal micro LEDs, and updates the micro LED map based thereon. With this configuration, the defective data of the micro LEDs and the arrangement design data of the micro LEDs are organically combined, which contributes to further improvement of the inspection efficiency and the inspection quality.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection device, characterized in that: the micro LEDs are distributed within a predetermined range determined by a predetermined luminous energy intensity characteristic and a predetermined emission wavelength characteristic. The function of the micro LED light emission inspection device of the present invention can be exhibited, that is, various data of the image data frame can be effectively used.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection device, which is characterized by further comprising: and a filter optical axis inclination angle drive mechanism including a reception unit for an inclination angle control signal for controlling inclination of the optical filter with respect to the optical axis of the optical path, wherein the optical filter having the predetermined optical wavelength band is a dielectric thin film optical filter manufactured by using a wavelength longer than a center value of a predetermined wavelength range as a half value of a filter transmittance, and the inclination angle of the optical filter with respect to the optical axis direction is configured to be capable of adjusting the half value of the filter transmittance to the center value of the predetermined wavelength range. With this configuration, the dielectric thin film optical filter can be tilted automatically, and the filter can be used with desired transmission light characteristics.
Further, in an additional aspect, the present invention
There is provided the micro LED light emission inspection device according to the above paragraph, characterized in that: the control unit of the control device of the micro LED light emission inspection device of the present invention generates a control signal for instructing the filter driving means to select a thin film optical filter having a wavelength longer than a center value of a predetermined wavelength range as a half value of a filter transmittance, the filter driving means and the filter optical axis inclination angle driving means and the control device being configured to be capable of bidirectional communication via a 1 st communication network,
The control device and the image processing device are configured to be capable of bidirectional communication via a 2 nd communication network,
the control device is configured to be able to acquire the light intensity of the predetermined unit image from the image processing device via a 2 nd communication network, and the control unit of the control device is configured to be able to generate the tilt angle control signal, and configured to be able to transmit the tilt angle control signal to the filter optical axis tilt angle driving mechanism via the 1 st communication network, and the tilt angle of the optical filter is configured such that a difference from a half value of a filter transmittance at a center value of the predetermined wavelength range with respect to the optical axis direction is within a predetermined threshold value. In this configuration, more specifically, the automatic operation means can be configured in advance, and the optical filter can be adjusted with a desired accuracy, thereby contributing to improvement of the inspection accuracy.
Further, in an additional aspect, the present invention
A micro LED light emission inspection apparatus is provided, wherein smoothing of the stepwise light intensity is performed by moving average between adjacent pixels of the light intensity pixel map. With this configuration, it is possible to obtain an effect of mitigating various disturbances and noise at the time of inspection that occur between pixels.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection device, wherein the light emission wavelength of the micro LEDs overlapped on the micro LEDs is smoothed by moving average between adjacent micro LEDs. With this configuration, it is possible to obtain an effect that the influence of various disturbances and noises occurring between the micro LEDs during inspection can be alleviated.
Further, in an additional aspect, the present invention
Provided is a micro LED light emission inspection device, which is characterized in that: the image pickup section further includes an image sensor tilt angle drive mechanism including a receiving section for an image sensor tilt angle control signal for controlling the image sensor tilt angle with respect to an optical axis of an optical path, and an actuator for focusing, the control device and the image processing device being configured to be capable of communicating via respective communication sections, and the control section of the control device being configured to be capable of generating the image sensor tilt angle control signal and being configured to be capable of transmitting the image sensor tilt angle control signal to the image sensor tilt angle drive mechanism via the communication section,
The control device drives the image sensor optical axis inclination angle drive mechanism and the actuator in the following manner: the light intensity of the light intensity pixel map acquired from the image processing apparatus via the communication unit is adjusted at a predetermined contrast, and focusing is performed by the adjusted stepwise light intensity.
With this configuration, it is possible to obtain an effect that the accuracy of the focus can be adjusted with higher accuracy not only by the actuator for focusing but also by the inclination of the image sensor.
Further, in an additional aspect, the present invention
The image processing device of the micro LED light emission inspection device according to the present invention further includes an image display device, and generates a two-dimensional map of the light intensity characteristics and the emission wavelengths of the plurality of micro LEDs, and displays the two-dimensional map on the image display device. With this configuration, by selecting an important parameter according to the optical characteristics of the micro LED, the two-dimensional map of the light intensity characteristics and the emission wavelength can be visually recognized. According to the embodiment, the effect of overlapping the wafer with the display instead of the observation by the microscope or the observation by the microscope can be obtained.
Further, in an additional aspect, the present invention
The control Unit of the micro LED light emission inspection apparatus of the present invention further includes a CPU (Central Processing Unit) and a memory for controlling the micro LED light emission inspection apparatus, and the filter driving means and the control apparatus are configured to be capable of communicating via a transmission path, and the control apparatus and the image Processing apparatus are configured to be capable of bidirectional communication via a communication path,
the control unit includes a module for executing the following steps: a micro LED lighting step of lighting a micro LED by the power supply mechanism while starting processing by the control unit; and
a first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
The control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
the image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
A step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LED without the optical filter;
the control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
The filter driving mechanism further includes a module for executing a 2 nd filter moving step of placing the optical filter in an optical path upon receiving a signal for placing the optical filter in the optical path from the control unit via the transmission path,
the control unit further includes a module for executing a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal and transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path when the control unit receives the 2 nd imaging start instruction notification while waiting for a 2 nd imaging start instruction which is a final process of the 2 nd filter movement instruction step,
the image processing device also comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
A step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LEDs with the optical filter;
a step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter;
An emission wavelength calculation step of determining, in the micro LED inspection unit, an emission wavelength of the micro LED using a predetermined emission wavelength calculation expression of the micro LED, subsequent to the previous step; and
and a micro LED emission wavelength data output step of outputting the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus, including an external connection path for outputting the micro LED inspection data and a data output unit. With this configuration, it is possible to realize automatic or semi-automatic inspection control of the micro LED light emission inspection device, and to perform inspection at a higher speed.
Further, in an additional aspect, the present invention
The light source of the micro LED light emission inspection device of the present invention is a wavelength light source of a known wavelength including a light wavelength variable mechanism, the micro LED light emission inspection device further includes a CPU and a memory for controlling the micro LED light emission inspection device in the control unit, and is configured to be capable of communicating between the filter driving mechanism and the control device via a transmission path, and to be capable of performing bidirectional communication between the control device and the image processing device via a communication path, and the micro LED light emission inspection device is configured to be capable of performing bidirectional communication between the control device and the image processing device via a communication path
The control unit includes a module for executing the following steps: an optical wavelength initialization step of updating a set value of an optical wavelength of the light source to an initial value by the variable mechanism at the same time as the control unit starts processing;
a calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the updated light source of the known light wavelength by the power supply mechanism;
a first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of receiving a signal for selecting a state where the optical filter is not present in the optical path by the filter driving mechanism via a transmission path between the filter driving mechanism and the control device, removing the optical filter from the optical path,
The control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
the image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
A step subsequent to the above step, in which the unit image volume identification unit identifies the unit image volume of the calibration light source light based on the predetermined criterion by regarding the calibration light source light as light emission of a micro LED based on the light intensity pixel map, generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, and further identifies a calibration light source map as the micro LED map, and the micro LED identification unit generates the micro LED mapping data to be considered as the calibration light source map based on the unit image volume, stores the micro LED mapping data in the memory, and determines the light energy intensity of the micro LED using the predetermined light energy intensity calculation formula based on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement without the optical filter which is regarded as a calibration light source for the micro LED to emit light;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
the filter driving mechanism further comprises a module for executing the following steps: a 2 nd filter movement instruction step of, when the control unit waiting for notification of a 2 nd imaging start instruction receives the 2 nd imaging start instruction subsequent to the above step, generating a signal for arranging the optical filter on an optical path based on the start instruction, transmitting the signal to the filter drive mechanism via the transmission path, and waiting for another process; and
a 2 nd filter moving step of placing the optical filter in an optical path by the filter driving mechanism receiving a signal for placing the optical filter in the optical path from the control unit via the transmission path;
the control unit further includes a module for executing a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal and transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path when the control unit receives the 2 nd imaging start instruction notification while waiting for a 2 nd imaging start instruction which is a final process of the 2 nd filter movement instruction step,
The micro LED luminescence inspection device comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
a step subsequent to the above step, in which the unit image volume recognition unit regards the calibration light source light as light emission of a micro LED based on the light intensity pixel map, specifies a unit image volume of the calibration light source light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further, the micro LED recognition unit generates the micro LED mapping data regarded as the calibration light source mapping based on the unit image volume, stores the micro LED mapping data in the memory, determines the light energy intensity of the micro LED based on the light intensity map on the micro LED map by using the predetermined light energy intensity calculation formula, and measures the light intensity with a filter, storing the filtered light intensity in the memory within the image processing apparatus as the light energy intensity value in the configuration with the optical filter regarded as a calibration light source of the micro LED light emission;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter as the calibration light source from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter from the light energy intensity value of the calibration light source with the arrangement of the optical filter and the light energy intensity value in the arrangement of the micro LED without the optical filter;
a step subsequent to the above step of storing, in the micro LED inspection section, a ratio of the known light source wavelength to the light intensity in the memory;
a light source wavelength updating step of updating a set value of a light wavelength of the light source by a predetermined increment value;
a repetition determination step of checking whether or not the updated light wavelength of the light source exceeds a predetermined boundary value, and if Not (NO), returning to the calibration light source lighting step, and if YES, proceeding to a lookup table creation step; and
A lookup table making step of making a lookup table from a set of a plurality of ratios of the wavelength to the light intensity stored in the memory by the repeating operation, and storing the lookup table in the memory. With this configuration, the lookup table can be automatically or semi-automatically created, the frequency of updating the lookup table can be increased, and more accurate inspection can be realized; and when the device is already programmed on the production line, the downtime of the production line caused by the maintenance of the lookup table can be further shortened.
Further, in an additional aspect, the present invention
An optical filter inspection device for an optical filter according to the present invention is further provided with a CPU and a memory for controlling the optical filter inspection device in the control unit, and is configured to be capable of communicating between the filter driving mechanism and the control device via a transmission path and capable of bidirectional communication between the control device and the image processing device via a communication path, and the optical filter is used in a micro LED light emission inspection device and is configured to be capable of bidirectional communication with the control device via a communication path
The control unit includes a module for executing the following steps: an optical wavelength initialization step of updating a set value of an optical wavelength of the light source to an initial value by the variable mechanism at the same time as the control unit starts processing;
A calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the updated light source of the known light wavelength by the power supply mechanism;
a first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
a step subsequent to the above step, in which the unit image volume recognition unit regards the reflected light from the calibration light source as light emission of a micro LED based on the light intensity pixel map, specifies a unit image volume (referred to as a reflector, the same applies in this paragraph) of the reflected light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further regards a reflector map as the micro LED map, generates the micro LED mapping data regarded as the reflector map based on the unit image, stores the micro LED mapping data in the memory, and determines the light intensity of the micro LED based on the light intensity map on the micro LED map by using the predetermined light intensity calculation formula, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the light energy intensity value in the arrangement without the optical filter, which is regarded as the reflected light of the light emission of the micro LED;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
the filter driving mechanism further comprises a module for executing the following steps: a 2 nd filter movement instruction step of, when the control unit waiting for notification of a 2 nd imaging start instruction receives the 2 nd imaging start instruction subsequent to the above step, generating a signal for arranging the optical filter on an optical path based on the start instruction, transmitting the signal to the filter drive mechanism via the transmission path, and waiting for another process; and
a 2 nd filter moving step in which the filter driving mechanism receives a signal for arranging the optical filter in an optical path from the control unit via the transmission path, and arranges the optical filter in the optical path; and is
The optical filter inspection device comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
A step subsequent to the above step, in which the unit image volume recognition unit regards the reflected light from the calibration light source as light emission of a micro LED based on the light intensity pixel map, specifies a unit image volume (referred to as a reflector, the same applies in this paragraph) of the reflected light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further regards a reflector map as the micro LED map, and in the micro LED recognition unit generates the micro LED mapping data regarded as the reflector map based on the unit image volume, stores the micro LED mapping data in the memory, and determines the light intensity of the micro LED based on the light intensity map on the micro LED map by using the predetermined light intensity calculation formula, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the light energy intensity value in the arrangement with the optical filter regarded as the reflected light of the light emission of the micro LED;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter as the reflected light of the calibration light source from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter from the light energy intensity value of the calibration light source with the arrangement of the optical filter and the light energy intensity value with the arrangement of the optical filter;
a step subsequent to the above step of storing, in the micro LED inspection section, a ratio of the known light source wavelength to the light intensity in the memory;
a light source wavelength updating step of updating a set value of a light wavelength of the light source by a predetermined increment value;
a repeated determination step of checking whether or not the updated light wavelength of the light source exceeds a predetermined boundary value, and if not, returning to the calibration light source lighting step, and if so, entering a lookup table creation step; and
A lookup table making step of making a lookup table from a set of a plurality of ratios of the wavelength to the light intensity stored in the memory by the repeating operation, and storing the lookup table in the memory. With this configuration, even when a substrate imitating a micro LED array is used, the main constituent modules can perform processing in the same manner to inspect the substrate of the micro LED array, thereby achieving an effect of achieving calibration and preview closer to the actual state.
Further, in an additional aspect, the present invention
There is provided a micro LED light emission inspection apparatus, wherein the control unit of the micro LED light emission inspection apparatus described in the above paragraph further includes a CPU and a memory for controlling the micro LED light emission inspection apparatus, and the filter driving mechanism and the control device are configured to be capable of communicating via a transmission path, and the control device and the image processing apparatus are configured to be capable of bidirectional communication via a communication path,
the control unit includes a module for executing the following steps: a micro LED lighting step of lighting a micro LED by the power supply mechanism while starting processing by the control unit; and
A first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
a step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LED without the optical filter;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
the filter driving mechanism further includes a module that executes a 2 nd filter moving step, the 2 nd filter moving step being a step in which the filter driving mechanism receives a signal for arranging the optical filter in an optical path from the control unit via the transmission path, and arranges the optical filter in the optical path;
the control unit further includes a module for executing a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal when the control unit receives the 2 nd imaging start instruction notification while waiting for a 2 nd imaging start instruction which is a final process of the 2 nd filter shift instruction step, and executing the 2 nd imaging start instruction step after transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path,
The micro LED luminescence inspection device comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
a step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LEDs with the optical filter;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter;
a lookup table reference type emission wavelength determination step of determining, in the micro LED inspection unit, an emission wavelength of the micro LED by referring to the lookup table after the above step; and
and a micro LED emission wavelength data output step of outputting the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus, including an external connection path and a data output unit for outputting the arrangement design data of the micro LEDs. With this configuration, the determination of the emission wavelength by the lookup table reference method can be performed by automatic operation or full automatic operation, and higher-speed processing can be realized.
Further, in an additional aspect, the present invention
There is provided a micro LED light emission inspection device, wherein a light source of the micro LED light emission inspection device is a wavelength light source with a known wavelength of light provided with a light wavelength variable mechanism of the light source, the micro LED light emission inspection device is further provided with a CPU and a memory in the control part,
the control unit includes a module for executing the following steps: a center wavelength setting step of updating a set value of the optical wavelength of the light source to a center wavelength of the bandwidth by the variable mechanism at the same time when the control unit starts processing;
a center wavelength light source lighting step of updating the light wavelength of the light source to the center wavelength by the variable mechanism and lighting the wavelength light source of the light wavelength by the power supply mechanism;
a first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification for a first imaging;
The filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
the image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
A step subsequent to the above step, in which the unit image volume identification unit regards the calibration light source light as light emission of a micro LED from the light intensity pixel map, specifies a unit image volume of the calibration light source light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further regards the calibration light source map as the micro LED map, and the micro LED identification unit generates the micro LED mapping data regarded as the calibration light source map from the unit image volume, stores the micro LED mapping data in the memory, and determines the light energy intensity of the micro LED using the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, measuring the intensity of the unfiltered light, storing the intensity of the unfiltered light in the memory within the image processing device as the intensity of the luminous energy in the arrangement of the unfiltered light for the calibration light source illuminant considered as a micro LED;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a subsequent imaging start instruction,
the filter driving mechanism further includes a module that executes a 2 nd filter moving step, the 2 nd filter moving step being a step in which the filter driving mechanism receives a signal for arranging the optical filter in an optical path from the control unit via the transmission path, and arranges the optical filter in the optical path;
the control unit further includes a module for executing a subsequent image capture start instruction step of generating the subsequent image capture start instruction signal when the control unit receives the subsequent image capture start instruction notification while waiting for a subsequent image capture start instruction, and executing the subsequent image capture start instruction step after transmitting the subsequent image capture start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a subsequent imaging step of receiving the video signal from the imaging device when the image processing device receives the subsequent imaging start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing device;
a step subsequent to the above step, in which the unit image volume recognition unit regards the calibration light source light as light emission of micro LEDs from the light intensity pixel map, specifies a unit image volume of the calibration light source light based on a predetermined criterion, further generates the unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further specifies the calibration light source light regarded as light emission of micro LEDs from the unit image volume as micro LEDs, generates the micro LED mapping data mapped onto the pixel map, stores the micro LED mapping data in the memory in the image processing device, and uses the predetermined optical energy intensity calculation formula based on the light intensity map on the micro LED map, determining the luminous energy intensity of the calibration light source illuminant regarded as the micro LED, measuring the light intensity of a filter, and storing the light intensity of the filter in the memory in the image processing device as the luminous energy intensity value in the arrangement of the calibration light source with the optical filter;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter; and
an appropriate filter angle determination step of determining whether or not the ratio of the light intensities is in the vicinity of 0.5 within a predetermined determination range based on a predetermined determination condition,
if the determination condition is negative, a signal for driving a filter angle changing step is generated for the filter optical axis tilt angle driving means, the signal is transmitted to the filter optical axis tilt angle driving means, control is branched to a module for executing the filter angle changing step, the subsequent imaging start instruction notification is transmitted to the control unit via the communication unit, the subsequent imaging start instruction notification is transmitted to the control device, control is returned to the module for executing the subsequent imaging step of the control unit, and the subsequent processing is circulated,
If the determination condition is yes, branching to a step of storing the filter angle in the memory, recording the filter angle, and ending the loop processing;
here, the filter optical axis inclination angle driving mechanism includes a module that executes a step of varying the filter angle in such a manner that the filter angle is varied within a predetermined range. With this configuration, the automatic operation of the filter optical axis inclination angle drive mechanism can realize more precise control of the change in the filter angle, and can realize more precise and shorter-time acquisition and adjustment of the filter transmission wavelength.
Further, in an additional aspect, the present invention
A micro LED light emission inspection device further includes a module which further includes a communication path with a manufacturing process management computer and a manufacturing data input unit, and executes a manufacturing instruction receiving step of receiving a manufacturing instruction including a manufacturing condition from the manufacturing process management computer via the communication path. With this configuration, the manufacturing process management computer can be used integrally with the upstream of the manufacturing process.
Further, in an additional aspect, the present invention
There is provided a micro LED light emission inspection apparatus further comprising a module further comprising a communication path connected to a manufacturing process management computer and a manufacturing data input section, and executing a manufacturing data output step of outputting manufacturing process data including the calibration data and other progress data to the manufacturing process management computer via the communication path. With this configuration, the manufacturing process management computer can be used integrally with the downstream of the manufacturing process.
In an additional aspect, furthermore,
the control device of the micro LED light emission inspection device of the present invention further includes a CPU and a memory for controlling the micro LED light emission inspection device, and is configured such that the filter driving mechanism and the control device can communicate with each other via a transmission path, and the control device and the image processing device can communicate with each other bidirectionally via a communication path, and the control unit of the control device includes a module,
a module that performs a micro LED lighting step of lighting a micro LED by the power supply mechanism;
A module that executes a first filter moving step of generating a signal for selecting a state in which the optical filter is not present in the optical path, and driving the filter driving mechanism via the transmission path so as to select the state in which the optical filter is not present in the optical path;
a module that executes a 1 st imaging start instruction step of receiving a first imaging start instruction notification, generating a 1 st imaging start instruction signal, and starting waiting for a 2 nd filter movement instruction immediately after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path;
a module that executes a 2 nd filter moving step, the 2 nd filter moving step receiving a 2 nd filter moving instruction, generating a signal for arranging a predetermined optical filter in an optical path based on the instruction, and driving the filter driving mechanism via the transmission path so as to arrange the optical filter in the optical path; and
a module that executes a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal and transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path when receiving a 2 nd imaging start instruction notification;
The image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
a step subsequent to the above step, in which the unit image volume recognition unit specifies a unit image volume of the light emission based on the predetermined criterion from the light intensity pixel map, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, the micro LED recognition unit specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and determines the light energy intensity of the micro LEDs by the predetermined light energy intensity calculation formula based on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LED without the optical filter;
A 2 nd image capturing step of receiving the video signal from the image capturing apparatus when receiving the start instruction signal for the 2 nd image capturing via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
a step subsequent to the above step, in which the unit image volume recognition unit specifies a unit image volume of the light emission based on the predetermined criterion from the light intensity pixel map, generates the unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing apparatus, further specifies a plurality of the micro LEDs arranged in an array from the unit image volume, generates the micro LED mapping data mapped to the pixel map, stores the micro LED mapping data in the memory in the image processing apparatus, and determines the light energy intensity of the micro LED by using the predetermined light energy intensity calculation formula on the basis of the light intensity on the light intensity map on the micro LED map, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LEDs with the optical filter;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter;
an emission wavelength calculation step of determining, in the micro LED inspection unit, an emission wavelength of the micro LED using a predetermined emission wavelength calculation expression of the micro LED, subsequent to the previous step; and
and a micro LED emission wavelength data output step of outputting the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing device, including an external connection path for outputting the arrangement product data of the micro LEDs and a data output unit. With this configuration, the CPU and the memory for control are provided, and the configuration of the present invention can be realized by software. The software may be Application software that runs on an operating system that runs using a CPU and a Memory, or may be system software that is incorporated in an operating system that runs on a Memory and is controlled by the CPU, or may be firmware that is incorporated in a ROM (Read Only Memory) that is hardware, or may be software that is configured to be incorporated in an ASIC (Application Specific Integrated Circuit) that is hardware and is logically controlled.
In an additional aspect, furthermore,
provided is a micro LED manufacturing apparatus including the micro LED light emission inspection apparatus of the present invention, characterized in that: the image processing apparatus of the micro LED light emission inspection apparatus of the present invention further includes a manufacturing condition data output unit that converts predetermined data into a predetermined data format from at least one of the micro LED map data including at least one of the substrate whole image, 1 or a plurality of the unit image volume map data, the light intensity characteristic corresponding thereto, the light emission wavelength characteristic, and the range, and outputs the converted data as manufacturing condition data. With this configuration, the following effect can be obtained, which can cooperate with a more close manufacturing process.
In an additional aspect, furthermore,
there is provided a micro LED manufacturing apparatus including the micro LED light emission inspection apparatus according to the present invention described in the above paragraph, characterized in that: the image processing device of the micro LED light emission inspection device of the present invention further outputs the two-dimensional map of the emission wavelength. This configuration can obtain the following effects.
In an additional aspect, furthermore,
The plurality of reflectors arranged on the substrate as a constituent element of the optical filter inspection apparatus used in the micro LED light emission inspection apparatus of the present invention are preferably formed of a metal film containing chromium as a main component. This structure provides a durable and practically effective reflector having a good gloss, further improves inspection quality, and is more economical than noble metal films.
Further, in an additional aspect, the present invention
The invention provides a method for using a micro LED luminescence inspection device incorporated in a full-automatic manufacturing process, the method using the micro LED luminescence inspection device of the invention comprises the following steps:
a product information acquisition stage, which receives the geometric information of the substrate containing the alignment mark information, the geometric information of the micro LED and the geometric information of the micro LED array;
a manufacturing management area setting stage, executed subsequently, for setting a manufacturing management area for identifying and managing local deviations and/or anomalies in product quality on the substrate according to 1 or more of the geometric information;
a notification phase of acceptable inspection, executed subsequently, of notifying, via the network device, a state of acceptable inspection to a line control computer connected through the network device;
A subsequently performed manufacturing information receiving stage that receives micro LED wafer manufacturing information from the line control computer;
carrying the wafer on an inspection table in a wafer carrying stage executed subsequently;
a manufacturing management area mapping stage, executed subsequently, for mapping the manufacturing management area to the substrate by taking an overall image of the substrate by means of an image processing device;
a micro LED mapping stage, wherein the micro LED arranged on the substrate is mapped to an image frame generated in an image processing device through the image processing device;
a micro LED characteristic measuring stage which is executed subsequently, wherein the micro LED chip is lightened and the luminous intensity and the luminous wavelength are measured through the image processing device;
a micro LED clustering step of adding, by the image processing apparatus, category information to the micro LED map information, the category information including an abnormality classification classified by a matrix of the emission intensity and the emission wavelength on the basis of the micro LED characteristics according to a predetermined classification condition, and classifying all the micro LED chips;
a manufacturing process state determination step of identifying a micro LED manufacturing process state for the manufacturing management area by overlaying the micro LED to which the category information is attached on the manufacturing management area map by the image processing apparatus;
A subsequently executed inspection result transmitting stage of transmitting, by the image processing apparatus, the grouping information and the manufacturing process state to the production line control computer via the network apparatus; and
a check end notification phase is subsequently executed to transmit a check end notification to the production line control computer via the network device as a check end state.
With this configuration, variations that vary depending on manufacturing conditions can be further suppressed, and an effect of providing rapid feedback of the variation factor of manufacturing variations to the manufacturing process in time can be obtained.
[ Effect of the invention ]
As described above, the present invention provides a higher-speed micro LED light emission inspection apparatus that can further improve the level of manufacturing management when integrated with a micro LED manufacturing process.
Drawings
Fig. 1 is a physical configuration diagram of a micro LED light emission inspection apparatus 1 according to an embodiment of the present invention.
Fig. 2 is a functional configuration diagram of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 3 is a schematic diagram of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 4 is a graph for explaining a light intensity ratio of the micro LED light emission inspection device according to the embodiment of the present invention.
Fig. 5 is a functional configuration diagram of a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 6 is a schematic flowchart illustrating a control system flowchart of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 7 is a physical configuration diagram of a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 8 is a flowchart illustrating a control system flowchart in the case where the optical wavelength is determined by the lookup table reference method in the micro LED light emission inspection in the variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 9 is a physical configuration diagram of a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 10 is a flowchart illustrating a control system flowchart for calibration for creating a lookup table when a micro LED light emission inspection is performed in the micro LED light emission inspection according to the variation of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 11 is a physical configuration diagram of an optical filter inspection apparatus 101 as an embodiment of an optical filter inspection apparatus used in the micro LED light emission inspection apparatus 1 according to another aspect of the present invention.
Fig. 12 is a functional configuration diagram of an optical filter inspection device 101 as an embodiment of an optical filter inspection device used in the micro LED light emission inspection device 1 according to another aspect of the present invention.
Fig. 13 is a flowchart illustrating a control system flowchart of a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 14 is a physical configuration diagram including a reference light emitter in a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 15 is a physical configuration diagram including an optical sensor in a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 16 is a functional configuration diagram of a defective product determination unit included in a digital image processing apparatus in a modified example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 17 is a functional configuration diagram of a digital image processing apparatus including a data input unit in a variation of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 18 is a physical configuration diagram including a screen display device of a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 19 is a graph showing a range of a two-dimensional map of the light emission wavelength and the light intensity ratio with and without an optical filter in a variation example of the micro LED light emission inspection apparatus 1 according to the embodiment of the present invention.
Fig. 20 is a physical configuration diagram of an embodiment of a micro LED light emission inspection apparatus 500 according to embodiment 2 of the present invention.
Fig. 21 is a functional configuration diagram of an embodiment of a micro LED light emission inspection apparatus 500 according to embodiment 2 of the present invention.
Fig. 22 is a flowchart illustrating a control system flowchart of an embodiment of the micro LED light emission inspection apparatus 500 according to embodiment 2 of the present invention.
Fig. 23 is a schematic front view of an emission wavelength inspection apparatus 600 according to a variation of the emission wavelength inspection apparatus according to embodiment 1 of the present invention.
Fig. 24 is a schematic front view of an emission wavelength inspection device 600 according to embodiment 1 of the present invention, illustrating a filter inserted in an optical path.
Fig. 25 is a graph showing transmittance characteristics of the color filter 50 as the emission wavelength inspection device according to embodiment 1 of the present invention.
Fig. 26 is a schematic front view of an emission wavelength inspection apparatus 700 according to a variation of embodiment 2 of the present invention.
Fig. 27 is a graph showing the influence of the change in the inclination angle of the color filter 56 on the transmittance characteristic in the emission wavelength inspection apparatus 700 according to the variation of embodiment 2 of the present invention.
Fig. 28 is a flowchart of a micro LED emission test using the emission wavelength test apparatus 700 according to the variation of embodiment 2 of the present invention.
Fig. 29 is a schematic perspective view of an emission wavelength inspection apparatus 800 according to a variation of embodiment 1 of the present invention.
Detailed Description
[ embodiment 1 ]
One embodiment of the micro LED light emission inspection apparatus 1 of the present invention is as follows. As shown in the physical configuration block diagram of fig. 1, the micro LED light emission inspection apparatus 1 is a micro LED light emission inspection apparatus having a physical structure including a power supply means 10, an optical lens 20, an imaging device 30, a digital image processing device 40, an optical filter 50, a filter driving means 60, a control device 70, and the like.
More specifically, as shown in the functional configuration diagram illustrated in fig. 2, one embodiment of the micro LED light emission inspection apparatus 1 has the following arrangement configuration: a wafer to be inspected can be mounted on a semiconductor substrate 3, the semiconductor substrate 3 is formed on a surface of the wafer in an array form by arranging micro LEDs 2 in a rectangular region occupying a size of 100 μm or less to be individually separated, and light of a micro LED2 lit by a power feeding mechanism 10 is guided to an imaging device 30 having an image sensor 31 through an optical filter 50 and an optical path of an optical lens 20. For example, the optical filter 50 having a predetermined light wavelength band so as to include red is configured as follows: the image pickup device 30 generates an image signal via the image sensor 31 by light in a predetermined light wavelength band that is selectively transmitted through the optical filter 50 and is arranged on the optical path 21 between the micro LED2 and the optical lens 20. The digital image processing apparatus 40 includes a memory 41, and is configured to receive the video signal from the imaging apparatus 30 via the video signal line 18, generate an image data frame 42 from the video signal, and store the image data frame in the memory 41. The area occupied by the micro LEDs 2 formed throughout the semiconductor substrate 3 can be divisionally stored by a plurality of frames of image data 42.
The optical filter 50 is supported by a filter drive mechanism 60, and the filter drive mechanism 60 includes a receiving unit 62 for receiving a control signal from the control device 70 via a transmission line 88. The control device 70 is configured to selectively control the presence or absence of the optical filter 50 by the filter driving mechanism 60, the control device 70 includes a control unit for generating a control signal for the filter driving mechanism 60, the control unit 71 is configured to be capable of executing system flow starting and flow control, the control unit 71 includes a transmission unit 72 for transmitting the control signal for the filter driving mechanism 60, and is configured to be capable of transmitting the control signal to the filter driving mechanism receiving unit 62 for the control signal provided to the filter driving mechanism 60.
In the digital image processing device 40, the digital light intensity generated from the video signal may have a stepwise light intensity for each pixel in the image data frame 42, and a plurality of image data frames 42 may be stored in the memory 41 in a bundle, but the digital image processing device 40 may be configured to record a light intensity function for each of the x-th and y-th pixels as I (x, y) in an orthogonal coordinate system attached to the image data frame 42 in which the entire semiconductor substrate 3 is imaged as a light intensity pixel map I (x, y) 45. The smoothing of the stepwise light intensities between adjacent pixels of the light intensity pixel map I (x, y)45 may be performed by moving averaging. The digital image processing apparatus 40 is provided with a unit image volume recognition unit 81, and the digital image processing apparatus 40 is configured to identify a unit image volume 80 of a light-emitting body appearing in a screen frame of the digital image processing apparatus 40 based on a predetermined criterion from a light intensity pixel map 45 for each pixel on an image data frame 42, and to identify the unit image volume 81 in the unit image volume recognition unit 80 so as to generate unit image volume map data 46 for the pixel map 43. In the coordinate system on the image data frame 42, the I-th and J-th unit image volumes 80 are specified as the unit image volumes 80 of the coordinates (I, J) in the coordinate system of the unit image volume mapping data 46.
The digital image processing device 40 is provided with a micro LED recognition unit 90, and each of the micro LEDs 2 arranged in an array on the semiconductor substrate 3 is specified by a unit image body 80. The micro LEDs 2 arranged in a grid pattern on the semiconductor substrate 3 are determined based on a predetermined criterion, for example, by specifying a pixel of a light energy intensity value having a peak value with respect to the surroundings on the image frame 42 as the center of the unit image 80 and specifying the center between the center of two adjacent unit image 80 as a rectangular boundary (indicated by symbol B in fig. 3) of the unit image 80 existing between the two, and the unit image recognition unit 81 determines that each unit image 80 corresponds to 9 pixels of, for example, the x1 to x3 and the y1 to y3 in the coordinate system on the image data frame 42; and pixel elements having { I (x1, y1), I (x1, y2), I (x1, y3), I (x2, y1), I (x2, y2), I (x2, y3), I (x3, y1), I (x3, y2), I (x3, y3) }. The micro LED recognition unit 90 is configured to generate data of a micro LED map 44, in which the micro LED map 44 corresponds to micro LEDs 2(I, J) arranged in a matrix of (I, J) in a grid pattern, for example, on the semiconductor substrate 3, and is mapped onto the pixel map 43. As a result, the (I, J) -th micro LED2 corresponds to the unit image volume 80(I, J), and includes pixel values I (x1, y1), I (x1, y2), I (x1, y3), I (x2, y1), I (x2, y2), I (x2, y3), I (x3, y1), I (x3, y2), I (x3, y 3).
The digital image processing apparatus 40 is configured such that a predetermined optical energy intensity calculation formula may be used as an arithmetic logic operation for calculating the light intensity of each micro LED2, and for example, the sum of stepwise light intensities of pixels in the image frame 42 corresponding to the micro LED2 may be employed, where in the above example, Σ { (x1, y1), I (x1, y2), I (x1, y3), I (x2, y1), I (x2, y2), I (x2, y3), I (x3, y1), I (x3, y2), and I (x3, y3) } serve as the light intensities, and the micro LED2 corresponds to the unit image body 80 on the light intensity pixel map 45. The digital image processing device 40 is configured such that the light energy intensity of each micro LED2 corresponding to the unit image 80 determined in this manner is stored in the memory 41 as a light energy intensity value measured by the filter driving mechanism 60 without the optical filter 50 after receiving a control signal from the control device 70.
Similarly, the digital image processing apparatus 40 is configured such that the optical energy intensity of each of the micro LEDs 2 corresponding to the unit image objects 80 is measured after the arrangement of the optical filters 50 is changed by the filter driving mechanism 60, and the optical energy intensity value of the micro LED2 corresponding to the same unit image object 80 is also measured as the optical energy intensity value of the micro LED2 in the arrangement of the optical filters 50.
The digital image processing device 40 is provided with a micro LED inspection unit 100, and a block provided in the micro LED inspection unit 100 is configured to operate a light emission wavelength calculation formula of a predetermined micro LED2 as arithmetic logic, and to search a lookup table 109, which is provided in advance and stored in the memory 41, for example, if an argument is specified, the lookup table 109, and the lookup table 109 is configured to be able to refer to the light emission wavelength of the micro LED2 as a target data value corresponding to the argument. Regarding the independent variable, for example, if a relationship between the light energy intensity value without the arrangement of the optical filter 50 and the light energy intensity value with the arrangement of the optical filter 50 is expressed, in an embodiment, for example, the relationship may be a light energy intensity value with/without the optical filter 50, and in this case, the lookup table 109 may form the relationship between the light energy intensity value in the arrangement without the optical filter 50 and the light energy intensity value in the arrangement with the optical filter 50 and the emission wavelength as the array data.
The look-up table 109 is preferably an optical filter having filter characteristics calibrated using a light source of known wavelength, made based on the calibration regarding the ratio of the light energy intensity value in the configuration without the optical filter to the light energy intensity value in the configuration with the optical filter and the emission wavelength.
Further, in an additional variation, the lookup table 109 is configured such that when the emission wavelength calculation formula of the micro LED2 refers to the emission wavelength corresponding to the measured value of the optical energy intensity ratio, the two reference wavelengths provided by the two independent variables located in the vicinity of the median value are adjusted by proportional interpolation with respect to the median value, and the emission wavelength is determined. The scaled complement may be a linear complement or may be an approximate complement of a quadratic regression line, as long as it fits an appropriate straight or curved line.
[ Effect of embodiment 1 ]
The operation and effect of the present invention according to the embodiment configured as described above will be described with reference to an overview schematic diagram of an embodiment of the present invention shown in fig. 3.
On a semiconductor substrate 3 mounted and fixed on a stage 4 of a micro LED light emission inspection apparatus 1 shown in fig. 3, micro LEDs 2 (hereinafter, also referred to as a micro LED array 2 in the present embodiment) are formed in an array. The micro LED2 is manufactured in a stage where the micro LED can emit light in the micro LED manufacturing process, and then is performed to measure the light intensity, emission wavelength, and the like of the micro LED as the performance of the LED.
In a display device product (not shown) using the micro LED2, a screen panel of the display device is often larger than the semiconductor substrate 3, and in consideration of the utilization efficiency of the LED, the micro LED chips on the semiconductor substrate 3 are once cut off from the semiconductor substrate 3, and then bonded at the time of assembling the display device product. In the case of the micro LED2 incorporated in such a display device, after the micro LED2 is once cut, chips having different manufacturing process conditions may be incorporated into a product of a display device (not shown), such as chips cut from another semiconductor substrate 3 or chips cut from non-adjacent separated portions although cut from the same semiconductor substrate 3.
The micro LEDs 2 of the micro LED light emission inspection apparatus 1 according to the present embodiment can be arranged adjacent to each other when the micro LEDs 2 converging within a predetermined performance range are incorporated into a display device, and the micro LEDs 2 are manufactured on the semiconductor substrate 3 so that the light intensity, emission wavelength, and the like of the micro LEDs 2 are measured as the performance of the LEDs, because the micro LEDs 2 which are individually separated are formed in an array on the surface. In this case, the micro LED light emission inspection apparatus 1 according to the present embodiment can measure the light intensity, the light emission wavelength, and the like of the micro LED2 as the performance of the LED at high speed by the digital image processing apparatus 40. The following description is made in detail.
In the micro LED light emission inspection apparatus 1 shown in fig. 3, when the micro LED2 mounted on the semiconductor substrate 3 fixed on the stage 4 emits light by the power supply means 10, the light emission generates a video signal in the image sensor 31 provided in the imaging apparatus 30, and is captured to the digital image processing apparatus 40 via the control line. In this case, by selecting the optical filter 50 that can be disposed on the optical path between the imaging device 30 and the micro LED2, that is, by selecting the optical filter 50 that selectively issues the video signal of the transmitted light divided for each color of RGB, the light intensity, emission wavelength, and the like of the micro LED2 divided for each color can be measured as the performance of the LED. For example, in the measurement of the red light emission performance, the optical filter 50 is a transmission filter having a wavelength band of light with a color wavelength of 610nm to 650nm, and is designed so that a wavelength range of 610nm to 650nm can be measured with a wavelength of 630nm corresponding to the design condition as the center. The transmission filter of an embodiment is a color absorption filter in which a light absorbing material is mixed in a glass material that becomes a substrate.
The optical filter 50 can enter and exit the optical path by the filter driving mechanism 60, and the filter driving mechanism 60 is controlled by a control signal from the control unit 71 of the control device 70 in the first light intensity and emission wavelength measurement, so that the emission of the micro LED2 can be measured without the optical filter 50.
The measurement of the light intensity and the measurement of the emission wavelength of the micro LED2 in the micro LED light emission inspection apparatus 1 shown in fig. 3 are as follows.
When the video signal is captured by the digital image processing device 40, the digital image processing device 40 associates the light intensity of the image data frame 42 with the portion corresponding to the two-dimensional image data frame arrangement in units of image data frames 42 in units of so-called screens, and stores the light intensity value of each pixel of the screen in the memory means 41 provided in the digital image processing device 40. As the maps corresponding to the two-dimensional map of the screen, a light intensity pixel map 45 that is map data for the purpose of displaying the light intensity value as a whole and a map that displays a coordinate system on the image data frame 42 are created, and are simply referred to as a pixel map 43 in this specification.
When the video signal is captured to the digital image processing device 40, the light intensity pixel map 45 is automatically generated like a video image recorder.
On the other hand, the light intensity pixel map 45 captured to the digital image processing device 40 does not directly correspond to the individual micro LEDs 2 on the semiconductor substrate 3. A plurality of micro LEDs 2 are formed on a wafer at a dot pitch of 0.1mm or less, for example, 150 tens of thousands are formed on a 6-inch semiconductor substrate 3, and 150 ten thousand micro LEDs 2 must be specified instantaneously. Of course, 1 pixel of the two-dimensional picture data frame arrangement does not necessarily correspond to 1 micro LED, and it is preferable that a plurality of pixels correspond to 1 micro LED 2.
In the micro LED light emission inspection apparatus 1 according to the embodiment, a conceptual target of the image unit 81 of the micro LED is introduced into the image data frame 42 based on a prediction that a light emitter having substantially the same shape can be recognized on the image. This concept is particularly suitable for simultaneous measurement of a plurality of micro LEDs formed on a wafer in the same repeating unit at a dot pitch of 0.1mm or less.
In the micro LED light emission inspection apparatus 1, the image unit 81 of the micro LED is specified based on the light intensity of the light intensity pixel map 45 and the geometric information of each pixel based on a predetermined criterion. For example, in one embodiment, this is specified as follows. The predetermined criterion is to specify a pixel exhibiting a peak luminous energy intensity value with respect to the surroundings as the center portion of each of the unit image bodies 80, and to set the center between the center portions of the adjacent unit image bodies 80 as a rectangular boundary with the adjacent unit image body 80 when a certain unit image body 80 is selected. The interval should correspond to, for example, a dot pitch of 0.1mm, depending on design information provided from outside the micro LED light emission inspection apparatus, and a tolerance may also be considered. Such a specific form of the unit image body 80 based on the predetermined criterion brings about an effect of specifying the image unit 81 in which the micro LED is specified at high speed and specifying the region to be occupied by the micro LED concerned more quickly. As described above, the concept of the image unit 81 suitable for introducing the micro LEDs and the predetermined criterion for specifying the image unit 81 based on the screen frame information are particularly useful for providing a micro LED light emission inspection apparatus suitable for inspecting a semiconductor substrate on which the micro LEDs 2 occupying a rectangular region having a size of 100 μm or less are formed in an array on the surface, which is a measurement target and must collectively process 150 or more.
As mentioned above, the inventive concept is defined as: when all the micro LEDs 2 that should be observed in the image data frame 42 are associated with the pixels in the image data frame 42 for each unit image 80 of the specific light-emitting body in the image data frame 42, a micro LED map 44, which is a pixel map 43 for the micro LEDs 2, is generated. With this concept, the micro LEDs 2 on the semiconductor substrate 3 having individual characteristics are conceptualized as the micro LED map 44, so that the operation suitable for the collective processing can be easily performed, and a more efficient memory consumption method can be provided when the pixel values corresponding to the micro LEDs 2 are stored in the memory 41.
One embodiment of the micro LED light emission inspection apparatus 1 of the present invention is characterized in that: the pixel on the light intensity pixel map 45 corresponding to the specified rectangular area belongs to the micro LED, and the light energy intensity emitted from the micro LED is calculated by a predetermined light energy intensity calculation formula based on the light intensity supplied from the pixel. For example, in more detail, the predetermined optical energy intensity calculation formula is a sum of stepwise optical intensities of pixels included in a specific one of the micro LEDs on the optical intensity pixel map 45. Here, the stepwise intensity is a light intensity numerical value obtained by numerically evaluating the light intensity as a stepwise value according to a predetermined contrast, the stepwise may be a linear stepwise shape, the local slope is large in the β function, and the observation point in the region may not be necessarily subjected to the same contribution evaluation, for example, the numerical value in the center portion may be weighted, and when the sum of the stepwise light intensities of the pixels included in the micro LED is used as described above and the light intensities observed in all the pixels related to the LED are used, there is an advantage that the disturbance accompanying the measurement of each pixel can be smoothed, and further, the evaluation method brings about excellent effects as follows: even if it is assumed that light emission from adjacent micro LEDs is mixed, a cancellation effect is provided in which light emitted from the micro LED is regarded as light emitted from the adjacent micro LED, contributing to more accurate evaluation of light emission performance of each micro LED as a whole.
As described above, even if the light emission performance of the micro LED is provided by the function of the light intensity given by each pixel map 43, the light emission wavelength of the micro LED cannot be directly determined. Therefore, a spectrometer has been conventionally used for measuring the emission wavelength of each micro LED. In the conventional emission wavelength measurement system using a spectrometer, it may be necessary to take as long as 10000 seconds even if a linear sensor is used, and the above-described case is consistent with the contents described in the background of the present specification.
In one embodiment of the micro LED light emission inspection apparatus 1 of the present invention, the optical filter 50 is an optical filter in which the filter transmission light intensity monotonously increases or monotonously decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition. An example of an optical filter in which the filter transmission light intensity monotonically increases or monotonically decreases in a predetermined optical wavelength band is the optical filter 50 showing a graph adjacent to the optical filter 50 in fig. 3. The abscissa of the graph represents the wavelength of light, and the ordinate represents the ratio of the light intensity without the optical filter 50 to the light intensity with the optical filter 50. With such an optical filter 50, the emission wavelength of the micro LED can be determined by measuring the two light intensities in the case where there is no optical filter 50 having the light intensity given to each pixel map 43, or in the case where there is an optical filter 50 (hereinafter, referred to as "having/not having an optical filter", or "having/not having an optical filter"), without using a spectrometer when determining the emission wavelength of the micro LED. Accordingly, even if it takes time to switch the arrangement of the optical filters, for example, it is sufficient to perform collective processing by the digital image processing apparatus for the measurement of 150 ten thousand optical filters as the measurement objects, and it is sufficient to capture the video signal by the 150 ten thousand 1-stroke linear sensors or CCD sensors for the memory of the digital image processing apparatus for 50 seconds at most, so that it is possible to perform collective data processing twice for 150 ten thousand measurement objects within 100 seconds, and the evaluation of the light intensity to the extent of the evaluation can be completed instantaneously, and here, even if the arrangement of the optical filters needs 30 seconds to be switched, it does not take 150 seconds for the processing of 150 ten thousand measurement objects. Therefore, the micro LED light emission inspection apparatus 1 of the present invention provides a significant effect that processing requiring 1500 seconds in the background art can realize high-speed processing with a great difference.
Hereinafter, a method of using the optical filter 50 in which the filter transmitted light intensity monotonously increases or monotonously decreases in a predetermined light wavelength band including the color wavelength corresponding to the design condition, that is, the emission wavelength of the micro LED is determined only by measuring the light intensities of the two types of the optical filter 50 absent/optical filter 50 present.
Fig. 4 shows a case where an optical filter 50 in which the filter transmission light intensity monotonously increases is used, unlike the above-described example. It is understood that, in the case of the optical filter 50 having a characteristic in which the light intensity ratio of the optical filter/no optical filter is monotonically increased as shown in fig. 4, when the measurement of the two light intensity ratios of the optical filter/no optical filter is 0.83 as shown in fig. 4, the wavelength 640nm is the center wavelength value corresponding to the vertical axis 0.83 in the graph shown in fig. 4, and the filter transmission light intensity in the graph shown in fig. 4 is 1.0 in the predetermined light wavelength band of 605nm to 655nm, the light intensity ratio in the transparent state is 1.0 in the light wavelength band of 655nm, and the light intensity ratio in the light shielding state is 0 in the light wavelength band of 605 nm. Therefore, the emission wavelength of the micro LED2 can be determined to be 640nm by only measuring the light intensities of the two types of filters 50 and 50. The light emission wavelength determined in this manner may be smoothed between adjacent micro LEDs by moving average. There is an advantage in that the influence of noise is mitigated by the smoothing processing.
As described above, the present inventors have invented that, by using various emission wavelengths in advance and correlating the measurement ratios of the two light intensities with/without the optical filter with the emission wavelengths in a monotonically increasing curve as shown in fig. 4, the emission wavelengths can be uniquely determined based on the correlation based on the measurement ratios of the two light intensities with/without the optical filter. Here, fig. 4 relates the emission wavelength to a monotonically increasing curve, but may relate the emission wavelength to a measurement ratio of two light intensities, i.e., optical filter-free/optical filter-free, to a monotonically decreasing curve instead of the monotonically increasing curve.
The functional configuration of the modified embodiment of the micro LED light emission inspection apparatus 1 of the present invention configured as described above is that, as shown in fig. 5, the control device 70 further includes a CPU86 and a memory 87 used in control flow management which is a component for controlling the micro LED light emission inspection apparatus 1. The control unit 71 can transmit a control signal to the filter driving device via the transmission unit 72 and the transmission path 88. The control device 70 and the digital image processing device are provided with a communication path 89, and are configured to be capable of bidirectional communication via the transmission unit 72. By configuring the control device 70 to be capable of controlling the digital image processing device 40 and the optical filter driving device 60 integrally in this manner, the micro LED light emission inspection device 1 can be automatically operated. The configuration and operation of the embodiment will be described with reference to fig. 6, which is a flowchart S0 showing a control flow so as to straddle constituent elements.
< micro LED Lighting step S1 >
The control proceeds to the micro LED lighting step while starting the processing of the control unit 71 of the control device 70 of the micro LED light emission inspection apparatus 1, and the control unit 71 is configured to light the micro LED by the power supply mechanism 30. When the micro LED lighting step is executed while the process of the control unit 71 is started, the control unit continues to activate the constituent blocks of the filter movement instruction step configured in the control unit 71.
< 1 st Filter movement instruction step S2 >
After the previous step, the control is advanced to the first filter movement instruction step in which the control unit 71 generates a signal for selecting a state in which the optical filter 50 is not present in the optical path 21. Further, after a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, the control unit 71 is configured to immediately start waiting for a start instruction notification of the first image capturing, and in this state, the module process shifts to a start instruction notification waiting state of the first image capturing.
< 1 st Filter moving step S3 >
The filter driving mechanism 60 is configured to execute an initial filter moving step of removing the optical filter 50 from the optical path 21 when receiving a signal for selecting a state where the optical filter 50 is not present in the optical path 21 via the transmission path 88 between the filter driving mechanism 60 and the control device 70.
< 1 st image capturing Start instruction step S4 >, and
when the control unit 71 of the control device 70 receives the start instruction notification of the first image capturing while waiting for the start instruction notification of the first image capturing, which is the final processing of the filter shift instruction step described in the 1 st, the control unit 71 immediately generates the start instruction signal of the 1 st image capturing. The notification of the start instruction of the first image capturing may be configured such that, for example, after the first filter moving step is completed, the filter driving mechanism 60 transmits the status signal, and the control unit 71 receives the status signal, and in addition, a timer is driven in the control unit 71, and if a predetermined time elapses, the notification of the start instruction of the first image capturing is generated. In this case, a timer event is generated after a predetermined time has elapsed, and a start instruction for the first imaging is notified to the control unit 71. When the control returns to the control unit 71, the control unit 71 is configured to wait for the 2 nd filter movement instruction after transmitting the 1 st imaging start instruction signal to the digital image processing apparatus 40 via the communication path 89. After executing a block that starts the start instruction step of the 1 st image capturing, the processing of the block shifts to a 2 nd filter movement instruction waiting state.
< 1 st image capturing step S5 >
The digital image processing device module is configured to: upon receiving the 1 st image capture start instruction signal from the control unit 71 via the communication path 89, the image signal is received from the image capture device 30, a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map 43 on the image data frame 42 stored in the digital image processing device 40 is generated, and the light intensity pixel map is stored in the memory in the digital image processing device, and after this block operation, the control is performed to the unit image body recognition unit 81 following the previous step.
< step S6 > of measuring light intensity without Filter
Following the previous step, the digital image processing device 40 is configured with: the unit image volume recognition unit 81 specifies the unit image volume 80 that emits light from the light intensity pixel map based on a predetermined criterion, generates unit image volume mapping data for the pixel map 43, and stores the unit image volume mapping data in the memory 41 in the digital image processing device 40. Following the module processing of the unit image recognition unit 81, the digital image processing device 40 is configured with: further, in the micro LED identification unit 90, a plurality of micro LEDs 2 arranged in an array are specified from the unit image body 80, and the corresponding micro LEDs 2 are mapped onto the pixel map 43, thereby generating micro LED mapping data 44, which is stored in the memory 41. Then, the digital image processing apparatus 40 is configured by: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula based on the light intensity map on the micro LED map, and the light energy intensity value without the arrangement of the optical filter of the micro LED is stored in the memory 41 in the digital image processing device 40. When the module for measuring the optical intensity without a filter is executed, the control device 70 is configured to execute the process of controlling the measurement of the optical intensity without a filter, following the above step.
< 2 nd Filter movement instruction step S7 >
The control unit 71 module waiting for the 2 nd filter movement instruction is configured to: when receiving the 2 nd filter movement instruction, a signal for disposing the optical filter 50 in the optical path 21 is generated based on the instruction, and the signal is transmitted to the filter driving mechanism 60 via the transmission path 88. After the module is executed, the module is configured to wait for the 2 nd imaging start instruction, and the control unit is directly put into a waiting state.
< 2 nd Filter moving step S8 >
The filter driving mechanism 60 is configured by: the filter driving mechanism 60 receives a signal for disposing the optical filter 50 in the optical path 21 from the control unit 71 via the transmission path 88, and disposes the optical filter 50 in the optical path 21.
< 2 nd imaging start instruction step S9 >, and
the control unit 71 includes: when the 2 nd imaging start instruction notification is received in the 2 nd imaging start instruction waiting state which is the final processing of the 2 nd filter movement instruction step, a 2 nd imaging start instruction signal is generated, and the 2 nd imaging start instruction signal is transmitted to the digital image processing apparatus 40 via the communication path 89. The notification of the 2 nd imaging start instruction may be configured such that, for example, after the 2 nd filter moving step is completed, the filter driving mechanism 60 transmits the state signal and the control unit 71 receives the signal, or may be configured such that a timer is driven in the control unit 71 and the notification of the 2 nd imaging start instruction is generated if a predetermined time has elapsed. After this block operation, the control unit 71 becomes idle and waits for the next task.
< 2 nd image capturing step S10 >
The digital image processing device 40 is configured by: upon receiving the start instruction signal for the 2 nd image capture via the communication path 89, the digital image processing apparatus 40 receives the video signal from the image capture apparatus 30, generates a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map 43 on the image data frame 42, and stores the light intensity pixel map in the memory 41 in the digital image processing apparatus 40, and after this block is operated, controls the processing in the unit video body recognition unit 81.
< step S11 > of measuring light intensity with Filter
In the digital image processing apparatus 40, following the above step, the digital image processing apparatus 40 is configured by: the unit image volume recognition unit 81 specifies the unit image volume 80 emitting light from the light intensity pixel map based on a predetermined criterion, further generates unit image volume mapping data for the pixel map 43, stores the unit image volume mapping data in the memory 41 in the digital image processing device 40, and the micro LED recognition unit 90 specifies a plurality of the micro LEDs arranged in an array from the unit image volume 80, maps the corresponding micro LEDs onto the pixel map 43, generates the micro LED mapping data 44, and stores the micro LED mapping data in the memory. After the module processing, the digital image processing apparatus 40 is configured by: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula based on the light intensity map on the micro LED map, and is stored in the memory 41 in the digital image processing device 40 as the light energy intensity value of the arrangement of the optical filter 50 of the micro LED. After the module processing, the processing of the micro LED inspection section is controlled in the digital image processing device 40.
< calculating the ratio of the light intensity without Filter to the light intensity with Filter S12 >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit, the optical energy intensity value in the arrangement with the optical filter of the micro LED is read from the memory 41 in the digital image processing device 40, the optical energy intensity value in the arrangement without the optical filter 50 corresponding to the micro LED is read from the memory 41 in the digital image processing device 40, and the ratio of the optical intensity without the filter to the optical intensity with the filter is calculated from the optical energy intensity value in the arrangement with the optical filter 50 and the optical energy intensity value in the arrangement without the optical filter 50.
< light emission wavelength calculating step S13 >
Following the previous step, the digital image processing device 40 is configured with: the micro LED inspection unit determines an emission wavelength of the micro LED using a predetermined emission wavelength calculation expression of the micro LED.
< light emission wavelength data output step S14 >
The digital image processing device 40 is configured by: after the above processing is completed and the micro LED emission wavelength data is obtained, the emission wavelength data is outputted from the data output unit 120 to the external connection path via the memory 41 in the digital image processing device 40 from the digital image processing device 40 configured to be capable of outputting the micro LED inspection data and including the external connection path and the data output unit. The external connection path may be a direct transmission path connected to the computer, or may be stored in the persistent memory 76, that is, output to the outside, via the communication unit 110, and the persistent memory 76 is connected to the computer 200 connected via the Network 75 connected via a Local Area Network (LAN). After being stored in the persistent memory 76, the relationship between the plurality of emission wavelengths and the ratio of the light intensity without filter to the light intensity with filter may be configured as a lookup table 109 (not shown in fig. 5), for example.
In one embodiment of the micro LED light emission inspection apparatus 1 according to the present invention, the correlation between the light intensity with/without filter and the emission wavelength is realized by a lookup table 109, and the lookup table 109 is prepared by calibrating a filter by a light source (not shown) having a known light wavelength, and based on the calibration, the relationship between the emission wavelength and the ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter. In one embodiment, the lookup table 109 stores the values (light wavelength, light energy intensity value ratio) indicated by the black dots on the graph in fig. 4. As described above, in one embodiment of the micro LED light emission inspection apparatus 1 according to the present invention, the measurement ratio of the two light intensities of the optical filter/non-optical filter is discretely associated with the emission wavelength at discrete points on the monotonically increasing curve as shown in fig. 4, the emission wavelength can be uniquely determined from the measurement values of the two light intensities of the optical filter/non-optical filter, and the emission wavelength of the micro LED can be determined only by the measurement of the two light intensities of the non-optical filter/non-optical filter, for example, the measurement of 150 thousands of the optical filters as the measurement targets can exhibit an advantageous effect that the overall processing can be performed by the digital image processing apparatus. Since the lookup table 109 stores discrete points (see black dots on the graph of fig. 4), for example, the emission wavelength corresponding to the intensity ratio closest to the measurement ratio of the light intensity can be set as the emission wavelength of the micro LED to be observed.
In one embodiment of the micro LED light emission inspection apparatus 1 according to the present invention, when the median of the registered values in the lookup table 109 (see the relationship between the fluctuation regions between adjacent black dots on the graph of fig. 4 and the value ranges therebetween) is observed and measured, the emission wavelength calculation formula of the micro LED may determine the emission wavelength by adding and proportionally interpolating the median of the measured values of the energy intensity ratio with reference to the emission wavelengths corresponding to the registered values of the adjacent energy intensity ratio in the lookup table 109 based on the registered values of the two points of the measured values of the energy intensity ratio. With this configuration, even if the measured value of the optical energy intensity ratio is not registered, the emission wavelength corresponding to the measured value of the optical energy intensity ratio can be realized with a desired estimation accuracy. The interpolation may be linear interpolation, quadratic curve interpolation, or the like, and may be determined as appropriate according to the relationship between the curve shape and the interval between the registered values.
Further, in the modified embodiment, as shown in the physical configuration diagram of the modified embodiment of fig. 7, the lookup table 109 may receive the filter characteristics and the lookup table 109 as main data from the persistent memory via a connection interface from the digital image processing apparatus 40 to the persistent memory 74, 76, or 79. The connection interface may be a USB (Universal Serial Bus) 74, in which case the look-up table 109 recorded in the USB compatible memory device 74 is read into the memory of the digital image processing device 40. The persistent memory may be the device 76 connected to the server connected to the LAN, and in this case, the connection interface may be the wired LAN connection interface 75, or may be a wireless LAN connection interface (not shown), and in this case, the look-up table 109 stored in another device 76 connected to the network is read into the memory of the digital image processing device 40. The stored source of the lookup table 109 may be stored in a persistent storage device 79, the persistent storage device 79 being connected to a server device 78 provided by a cloud computing service 77 connected to the network. With this configuration, the advantage of efficient operation when using a plurality of micro LED light emission inspection apparatuses 1 can be obtained, and the advantage of being usable in a separate calibration and production system can also be obtained. Further, the lookup table 109 is easily restored from the backup location, which is advantageous in that usability is improved.
A flowchart S100 of a method of referring to the lookup table 9 in an embodiment of the micro LED light emission inspection apparatus 1 according to the present invention will be described with reference to fig. 8, which is a flowchart illustrating the flowchart S100, and the flowchart S100 describes a control flow when the inspection of the micro LED light emission inspection apparatus 1 is performed. Fig. 8 is a control flow in which the emission wavelength calculation step S13 in fig. 6 is replaced with the emission wavelength determination step S15 of the lookup table reference method. In the embodiment shown in fig. 8 with reference to the look-up table 109, as described in the previous paragraph, the look-up table 109 may be received as master data from the persistent memory via a connection interface with the persistent memory 74, 76 or 79, which may be the USB74, and the look-up table 109 recorded in the USB compatible memory device 74 may be read into the memory 41 of the digital image processing device 40. The emission wavelength determining step S15 of the lookup table reference system substituted by the control flow of fig. 8 will be described below.
< step S15 > for specifying emission wavelength by lookup Table reference method
After executing the step S12 of calculating the ratio of the light intensity without filter to the light intensity with filter, the execution flow control proceeds to the micro LED inspection unit 100. The digital image processing device 40 is configured by: in the micro LED inspection section 100, the memory 41 refers to the look-up table 109 to determine the emission wavelength of the micro LED, and after the module is executed, the control of the process shifts to the emission data output step.
Since the other steps are the same as those described in paragraph 0046, the description in this paragraph is limited to the description in paragraph 0046, and overlapping description will be omitted.
In a variation of the micro LED light emission inspection apparatus 1 of the present invention, a light source having a light wavelength varying mechanism is further provided. As shown in fig. 9, the control device 70 includes a CPU86 and a memory 87 used for control flow management that is a component for controlling the micro LED light emission inspection device 1, the control unit 71 is capable of transmitting a control signal to the filter driving device via the transmission unit 72 and the transmission path 88, and a communication path 89 is provided between the control device 70 and the digital image processing device, and is configured to be capable of bidirectional communication via the transmission unit 72, and is configured such that: the control device 70, which is integrally controllable with the digital image processing device 40 and the optical filter driving device 60, enables automatic operation of the micro LED light emission inspection device 1, and the micro LED light emission inspection device 1 further includes a light wavelength varying mechanism 116 as a light source, and a wavelength light source 106 of a known light wavelength, which can communicate with the transmission unit 72 via the control unit 71, for emitting the reference light 6. The purpose of having a light source comprising a light wavelength variable mechanism is: the desired wavelength of light can be selected, the emission wavelength at the desired sampling interval can be selected when creating the look-up table, and even when the ratio of the light intensity without filter to the light intensity with filter changes abruptly as a function of the emission wavelength, the discrete value of the creation of the look-up table can be selected appropriately at the desired sampling interval, or the sampling interval can be selected appropriately at equal divisions, and a wavelength light source of a known wavelength of light can be used for calibration.
As shown in fig. 9, the control device 70 of the micro LED light emission inspection device 1 of the present invention configured as described above includes a CPU86 and a memory 87 used in control flow management which is a component for controlling the micro LED light emission inspection device 1, the control unit 71 is capable of transmitting a control signal to the filter driving device via the transmission unit 72 and the transmission path 88, a communication path 89 is provided between the control device 70 and the digital image processing device, and is configured to be capable of bidirectional communication via the transmission unit 72, and the control device 70 configured to be capable of integrally controlling the digital image processing device 40 and the filter driving device 60 in this manner is configured to be capable of automatically operating the micro LED light emission inspection device 1. The configuration and operation of an embodiment will be described with reference to a schematic diagram 10 in which a control flowchart S200 is drawn across constituent elements.
< optical wavelength initialization step S21 >
At the same time as the control unit 71 of the control device 70 starts processing, control is shifted to the optical wavelength initialization step, and the control unit 71 is configured to: a control signal can be transmitted to the variable mechanism 116 via the transmission unit 72 and the transmission path 88 so that the set value of the light wavelength of the light source 106 is updated to the initial value by the variable mechanism 116. After the transmission, the control moves to the calibration light source lighting step.
< calibrating light Source Lighting step S22 >
The micro LED lighting inspection apparatus 1 is configured by: the calibration light source 106 is remotely illuminated. When the calibration light source lighting step is executed, control is continued to activate the constituent blocks of the filter movement instruction step configured in the control unit 71. The subsequent control and operation of the filter driving mechanism 60 are the same as those described in paragraph 0046.
< 1 st Filter movement instruction step S23 >
After the previous step, the control is shifted to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting a state where the optical filter 50 is not present in the optical path 21. Further, after a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, the control unit 71 is configured to immediately start waiting for a start instruction notification of the first image capturing, and in this state, the module process immediately shifts to a start instruction notification waiting state of the first image capturing.
< 1 st Filter moving step S24 >
The filter driving mechanism 60 is configured to immediately execute an initial filter moving step of removing the optical filter 50 from the optical path 21 when receiving a signal for selecting a state where the optical filter 50 is not present in the optical path 21 via the transmission path 88 between the filter driving mechanism 60 and the control device 70.
< 1 st image capturing Start instruction step S25 >, and
when the control unit 71 of the control device 70 receives the start instruction notification of the first image capturing while waiting for the start instruction notification of the first image capturing, which is the final processing of the filter shift instruction step described in the 1 st, the control unit 71 immediately generates the start instruction signal of the 1 st image capturing. The first imaging start instruction notification may be configured to: after the first filter moving step is completed, the filter driving mechanism 60 transmits the status signal, and the control unit 71 receives the status signal, and in addition, the timer is driven in the control unit 71, and if a predetermined time elapses, a start instruction notification of the first imaging is generated. In this case, a timer event is generated after a predetermined time has elapsed, and a start instruction for the first imaging is notified to the control unit 71. When the control returns to the control unit 71, the control unit 71 is configured to wait for the 2 nd filter movement instruction after transmitting the 1 st imaging start instruction signal to the digital image processing apparatus 40 via the communication path 89. After executing a block that starts the start instruction step of the 1 st image capturing, the processing of the block shifts to a 2 nd filter movement instruction waiting state.
< 1 st image capturing step S26 >
The digital image processing device module is configured to: upon receiving the 1 st image capture start instruction signal from the control unit 71 via the communication path 89, the image signal is received from the image capture device 30, a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map 43 on the image data frame 42 stored in the digital image processing device 40 is generated, and the light intensity pixel map is stored in the memory in the digital image processing device, and after this block operation, the control is performed to the unit image body recognition unit 81 following the previous step.
< step S27 > of measuring light intensity without Filter
Following the previous step, the digital image processing device 40 is configured with: the unit image volume recognition unit 81 regards the calibration light source light as light emission of the micro LEDs from the light intensity pixel map, specifies the unit image volume 80 of the calibration light source light based on a predetermined criterion, generates unit image volume mapping data for the pixel map 43, and stores the unit image volume mapping data in the memory 41 in the digital image processing device 40. Following the module processing of the unit image recognition unit 81, the digital image processing device 40 is configured with: the calibration light source map is regarded as a micro LED map, and the micro LED recognition unit 90 maps the micro LEDs regarded as the calibration light source map from the unit image body 80 onto the pixel map 43 to generate micro LED map data 44, which is stored in the memory 41. Then, the digital image processing apparatus 40 is configured by: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and the light energy intensity value without the arrangement of the optical filter of the calibration light source regarded as the light emission of the micro LED is stored in the memory 41 in the digital image processing device 40. When the module for measuring the optical intensity without a filter is executed, the control device 70 is configured to execute the process of controlling the measurement of the optical intensity without a filter, following the above step.
< 2 nd Filter movement instruction step S28 >
The control unit 71 module waiting for the 2 nd filter movement instruction is configured to: when receiving the 2 nd filter movement instruction, a signal for disposing the optical filter 50 in the optical path 21 is generated based on the instruction, and the signal is transmitted to the filter driving mechanism 60 via the transmission path 88. After the module is executed, the module is configured to wait for a 2 nd imaging start instruction, and the control unit is in a standby state.
< 2 nd Filter moving step S29 >
The filter driving mechanism 60 is configured by: the filter driving mechanism 60 receives a signal for disposing the optical filter 50 in the optical path 21 from the control unit 71 via the transmission path 88, and disposes the optical filter 50 in the optical path 21.
< 2 nd imaging start instruction step S30 >, and
the control unit 71 includes: when the 2 nd imaging start instruction notification is received in the 2 nd imaging start instruction waiting state which is the final processing of the 2 nd filter movement instruction step, a 2 nd imaging start instruction signal is generated, and the 2 nd imaging start instruction signal is transmitted to the digital image processing apparatus 40 via the communication path 89. The notification of the 2 nd imaging start instruction may be configured such that, for example, after the 2 nd filter moving step is completed, the filter driving mechanism 60 transmits the state signal and the control unit 71 receives the signal, or may be configured such that a timer is driven in the control unit 71 and the notification of the 2 nd imaging start instruction is generated if a predetermined time has elapsed. After this block operation, the control unit 71 becomes idle and waits for the next task.
< 2 nd image capturing step S31 >
The digital image processing device 40 is configured by: upon receiving the start instruction signal for the 2 nd image capture via the communication path 89, the digital image processing apparatus 40 receives the video signal from the image capture apparatus 30, generates a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map 43 on the image data frame 42, and stores the light intensity pixel map in the memory 41 in the digital image processing apparatus 40, and after this block is operated, controls the processing in the unit video body recognition unit 81.
< step S32 > of measuring light intensity with Filter
In the digital image processing apparatus 40, following the above step, the digital image processing apparatus 40 is configured by: the unit image volume recognition unit 81 regards the calibration light source light as light emission of the micro LEDs from the light intensity pixel map, specifies the unit image volume 80 of the calibration light source light based on a predetermined criterion, further generates unit image volume mapping data for the pixel map 43, stores the unit image volume mapping data in the memory 41 in the digital image processing device 40, and further generates the micro LED mapping data 44, which is regarded as a calibration light source mapping, from the unit image volume and stores the micro LED mapping data in the memory 41 in the micro LED recognition unit 90. After the module processing, the digital image processing apparatus 40 is configured by: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and is stored in the memory 41 in the digital image processing device 40 as a light energy intensity value having the arrangement of the optical filter 50 which is regarded as a calibration light source for the light emission of the micro LED. After the module processing, the processing of the micro LED inspection section is controlled in the digital image processing device 40.
< calculating the ratio of the light intensity without Filter to the light intensity with Filter S33 >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 40, and the ratio of the light intensity without the filter to the light intensity with the filter is calculated from the light energy intensity value in the arrangement with the optical filter 50 and the light energy intensity value in the arrangement without the optical filter 50. After the module is executed, the process proceeds to the emission wavelength calculation step.
< light emission wavelength calculating step S34 >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit 100, the emission wavelength of the micro LED is determined by using a predetermined emission wavelength calculation expression of the micro LED. After the module is executed, the processing moves to the light source wavelength and light intensity ratio recording step.
< light source wavelength and light intensity ratio recording step S35 >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit 100, a known ratio of the light source wavelength to the light intensity is stored in the memory 41. After the module is executed, the process enters a light source wavelength updating step.
< light source wavelength updating step S36 >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit 100, the setting value of the light wavelength of the light source is updated by a predetermined increment value. After the module is executed, the process proceeds to a decision step for deciding a look-up table completion condition.
< completion determining step S37 >
The digital image processing device 40 is configured to check whether the updated light wavelength of the light source exceeds a predetermined boundary value. After the module is executed, when the module is overtaken, the processing enters a lookup table manufacturing step, and when the module is not overtaken, the processing branches to a wavelength initialization step to initialize the updated optical wavelength.
< lookup Table Generation step S38 >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit 100, a look-up table 109 is created from a set of a plurality of ratios of wavelength to light intensity stored in the memory 41, and stored in the memory 41. After the module is executed, the lookup table 109 is completed and the process ends.
The digital image processing device 40 is preferably configured in modular fashion: after the above processing is completed and the lookup table for determining the emission wavelength of the micro LED is obtained, it is preferable that the emission wavelength data is outputted from the data output unit 120 to the external connection path via the memory 41 in the digital image processing device 40 from the digital image processing device 40 configured to be able to output the lookup table and including the external connection path and the data output unit. The external connection path may be a direct transmission path connected to the computer, or may be stored in the persistent memory 76, that is, output to the outside, via the communication unit 110, and the persistent memory 76 is connected to the computer 200 connected via the Network 75 connected via a Local Area Network (LAN). Or may be configured to be stored in the persistent memory 76 and distributed to a plurality of digital image processing apparatuses 40.
< another form: embodiment of optical filter inspection apparatus 101 for micro LED light emission inspection apparatus 1
In another aspect, the present invention provides an optical filter inspection apparatus for use in the micro LED light emission inspection apparatus 1. This aspect is characterized in that: instead of the semiconductor substrate 3, the substrate 103 is mounted at a position corresponding to the semiconductor substrate 3 of the micro LED light emission inspection apparatus 1, the semiconductor substrate 3 having the micro LEDs 2 in a rectangular region occupying a size of 100 μm or less, which should be individually separated, formed on the surface thereof in an array form so as to adjust the characteristics of the optical filter 50, the substrate 103 having on the surface thereof the reflectors 102 (hereinafter also referred to as a reflector array 102) in an amount substantially equal to the number of the reflectors 102 in at least a predetermined region according to the design conditions of the micro LEDs to be inspected arranged in an array form, and the optical filter inspection apparatus for the micro LED light emission inspection apparatus 1 includes: a light projection mechanism 104 for reflecting light from the reflector 102, a light guide mechanism 105 for the light projection mechanism, and a wavelength-variable light source 106 for projecting light with a known wavelength. The other configurations are the same as those of the embodiment of the micro LED light emission inspection apparatus 1, and the same reference numerals denote the same configurations.
Hereinafter, an embodiment of the optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1 will be described in detail with reference to fig. 11, which is a physical configuration of the optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1. As shown in the physical configuration block diagram of fig. 5, the optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1 partially includes physical configurations such as a light projection mechanism 104, a light guide mechanism 105, a wavelength variable light source 106, an optical lens 20, an imaging apparatus 30, a digital image processing apparatus 140, an optical filter 50, a filter drive mechanism 60, and a control apparatus 170. Here, the same components as those of the micro LED light emission inspection apparatus 1 are denoted by the same reference numerals, and redundant description thereof may be omitted.
More specifically, one embodiment of the optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1 is as follows. As shown in the functional configuration diagram of fig. 12, an optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1 is mounted with a wafer to be inspected having a substrate 103, and the substrate 103 has a surface on which reflectors 102 (hereinafter also referred to as a reflector array 102) are formed in substantially the same number as the design conditions of the micro LEDs to be inspected arranged in an array at least in a predetermined region. The following configuration is formed: the light emission of the wavelength variable light source 106 is adjusted to a predetermined wavelength, and the light reflected by the reflector 102 irradiated by the light projection mechanism 104 passes through the optical path relayed by the light guide mechanism 105, passes through the light projection mechanism 104 again, and is guided to the image pickup device 30 having the image sensor 31 through the optical path passing through the optical filter 50 and the optical lens 20. The optical filter 50 having a predetermined optical wavelength band is configured as follows: the image pickup device 30 generates an image signal via the image sensor 31 by light in a predetermined light wavelength band that is selectively transmitted through the optical filter 50 and is disposed on the reflection light path 121 of the reflector 102 and the optical lens 20. The digital image processing apparatus 140 includes a memory 41, receives a video signal from the imaging apparatus 30, generates an image data frame 42 based on the video signal, and stores the image data frame in the memory 41. Although not shown in the drawings, the area occupied by the reflectors 102 formed on the entire substrate 103 is covered by a plurality of image frames 42.
The optical filter 50 is supported by a filter driving mechanism 60, and the filter driving mechanism 60 has a receiving portion 62 for receiving a control signal from the control device 170. The control device 170 is configured to selectively control the presence or absence of the optical filter 50 by the filter driving mechanism 60, the control device 170 includes a control unit for generating a control signal for the filter driving mechanism 60, the control unit 171 is configured to start a system flow and execute flow control, and the control unit 171 includes a transmission unit 172 for transmitting the control signal for the filter driving mechanism 60 and a filter driving mechanism reception unit 62 for transmitting the control signal for the filter driving mechanism 60.
In the digital image processing device 140, the digital light intensity generated from the video signal has a stepwise light intensity for each pixel in the image data frame 42, and a plurality of image data frames 42 are stored in a memory 41 in a bundle, and the light intensity for each pixel in the image data frame extending over the entire semiconductor substrate 3 is configured as a light intensity pixel map 45.
The digital image processing apparatus 140 is provided with a unit image volume recognition unit 81 configured to identify a unit image volume 80 of a light emitter appearing in a screen frame of the digital image processing apparatus 40 from a light intensity pixel map 45 for each pixel in the image data frame 42 based on a predetermined criterion, and generate unit image volume map data 46 for the pixel map 43.
The digital image processing device 140 is provided with the micro LED recognition unit 90, and the reflector 102 arranged in an array on the substrate 103 is identified with the unit image object 80 as the same as the micro LED2 in the micro LED light emission inspection device 1, considering the reflected light of the reflector 102 as the light emission of the micro LED 2. The micro LED identification unit 90 is configured to identify the micro LEDs 2, which are regarded as a plurality of reflectors 102 arranged in an array form, on the basis of a predetermined criterion for determining the form of the unit image bodies 80, by specifying pixels, which show peak light energy intensity values with respect to the surroundings on the image frame 42, as the center of the unit image bodies 80, and assuming the center between the center portions of two adjacent unit image bodies 80 as the rectangular boundary between the two unit image bodies 80, and to generate data of the micro LED map 48 mapped onto the pixel map 43 in correspondence with the micro LEDs 2, by arranging the reflectors 102 arranged on the substrate 103 in an opposed manner, for example, the same as the micro LED light emission inspection apparatus 1.
The digital image processing device 140 is configured to operate a predetermined optical energy intensity calculation formula as arithmetic logic, and may use, for example, the sum of stepwise light intensities of pixels in the image frame 42 included in the micro LED2 as the light intensity, and the micro LED2 may be regarded as the reflector 102 corresponding to the unit image object 80 on the light intensity pixel map 45. The digital image processing device 140 is configured such that the light energy intensity of each micro LED2 corresponding to the unit image 80 determined in this manner is stored in the memory 41 as a light energy intensity value measured by the filter driving mechanism 60 without an optical filter, in response to a control signal from the control device 70.
Similarly, the digital image processing device 140 is configured such that the light energy intensity of each of the micro LEDs 2 of the reflector 102 regarded as corresponding to the unit image object 80 is measured in the arrangement having the optical filter 50 by the filter driving mechanism 60, and the light energy intensity value corresponding to the unit image object 80 is stored in the memory 41 as the light energy intensity value of the micro LED2 of the reflector 102 regarded as having the arrangement having the optical filter 50.
The digital image processing device 140 is provided with the micro LED inspection unit 100, and here, as arithmetic logic, the digital image processing device is configured to operate a predetermined light emission wavelength calculation formula of the micro LED regarded as the reflector 102, for example, the look-up table 109 is configured in advance and configured on the memory 41, and if an argument is specified, the look-up table 109 is searched by the configuration, and the look-up table 109 is configured to be able to refer to the light emission wavelength of the micro LED2 which is a target data value corresponding to the argument. Regarding the independent variable, for example, the ratio of the light energy intensity value in the configuration without the optical filter to the light energy intensity value in the configuration with the optical filter may be used, and the lookup table 109 is preferably configured to arrange data on the relationship between the ratio of the light energy intensity value in the configuration without the optical filter 50 to the light energy intensity value in the configuration with the optical filter 50 and the emission wavelength. The lookup table 109 may be made based on calibration with respect to the relationship of the ratio of the light energy intensity value in the configuration with the optical filter to the light energy intensity value in the configuration without the optical filter and the emission wavelength using the optical filter 50 whose optical filter characteristic is calibrated by the wavelength variable light source 106 providing a prescribed light wavelength.
Further, in a modified embodiment of the digital image processing device 140, the lookup table 109 is configured such that the emission wavelength calculation formula of the micro LED2 refers to the emission wavelength corresponding to the measured value of the optical energy intensity ratio, and the two reference wavelengths provided by the two independent variables located in the vicinity of the median value are adjusted by proportional interpolation with respect to the median value to determine the emission wavelength.
Regarding the method of configuring the lookup table 109 in the embodiment of the optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1 configured as described above, the flowchart S300 of the control flow will be described with reference to the schematic diagram 13 drawn across the components. The optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1 includes a light wavelength variable mechanism 116 as a light source, and is intended to irradiate the reflector 102 with a variable wavelength light source 106 of a known light wavelength that can communicate with the transmission unit 72 via the control unit 71. As shown in fig. 12, the control device 170 for the optical filter inspection device 101 of the micro LED light emission inspection device 1 configured as described above includes a CPU86 and a memory 87 used for control flow management which is a component for controlling the optical filter inspection device 101, the control unit 171 can transmit a control signal to the filter driving device and the optical wavelength varying mechanism 116 via the transmission unit 172 and the transmission path 88, the control device 70 and the digital image processing device 140 include a communication path 89 therebetween, and are configured to be capable of bidirectional communication via the transmission unit 72, and the control device 170 configured to be capable of integrally controlling the digital image processing device 140 and the filter driving device 60 in this manner can realize automatic operation of the optical filter inspection device 101. The method of performing the optical filter inspection by the collective process using the light sources of the plurality of reflectors modeled by the micro LEDs by the automatic operation will be described in detail below.
< optical wavelength initialization step S321 >
The control unit 171 includes: simultaneously with the start of the processing by the control unit 171 of the control device 170, the control proceeds to the optical wavelength initialization step, and a control signal can be transmitted to the variable mechanism 116 via the transmission unit 172 and the transmission path 88 so that the set value of the optical wavelength of the light source 106 is updated to the initial value by the variable mechanism 116. After the transmission, the control is transferred to the calibration light source lighting step.
< calibrating light Source Lighting step S322 >
The optical filter inspection apparatus 101 includes: the calibration light source 106 is remotely illuminated. When the calibration light source lighting step is executed, control is continued to activate the constituent blocks of the filter movement instruction step configured in the control unit 171. After executing this module, the process proceeds to an initial filter move indication step.
< 1 st Filter movement indicating step S323 >
After the previous step, the control is shifted to the first filter movement instruction step in which the control unit 171 generates a signal for selecting a state in which the optical filter 50 is not present in the optical path 21. Further, after a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, the control unit 171 is configured to immediately start waiting for the notification of the start instruction for the first image capturing, and in this state, the module process immediately shifts to the state of waiting for the notification of the start instruction for the first image capturing.
< 1 st Filter moving step S324 >
The filter driving mechanism 60 is configured to immediately execute an initial filter moving step of removing the optical filter 50 from the optical path 21 when receiving a signal for selecting a state where the optical filter 50 is not present in the optical path 21 via the transmission path 88 between the filter driving mechanism 60 and the control device 170.
< 1 st imaging start instruction step S325 >)
When the control unit 171 of the control device 170 receives the start instruction notification of the first imaging while waiting for the start instruction notification of the first imaging, which is the final processing of the filter shift instruction step described in the 1 st, the control unit 171 immediately generates the start instruction signal of the 1 st imaging. The first imaging start instruction notification may be configured to: after the first filter moving step is completed, the filter driving mechanism 60 transmits the status signal, and the control unit 171 receives the status signal, and in addition, the timer is driven in the control unit 171, and if a predetermined time elapses, a notification of a start instruction for the first imaging is generated. In this case, a timer event is generated after a predetermined time has elapsed, and a start instruction for the first imaging is notified to the control unit 171. When the control returns to the control unit 171, the control unit 171 is configured to wait for the 2 nd filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus 140 via the communication path 89. After executing a block that starts the start instruction step of the 1 st image capturing, the processing of the block shifts to a 2 nd filter movement instruction waiting state.
< 1 st image pickup step S326 >
The digital image processing device module is configured to: upon receiving the 1 st image capture start instruction signal from the control unit 171 via the communication path 89, the image signal is received from the image capture device 30, a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame 42 stored in the digital image processing device 140 is generated, and the light intensity pixel map is stored in the memory 41 in the digital image processing device 140, and after this block operation, the control is performed to the unit image body recognition unit 81 following the previous step.
< Filter-less light intensity measuring step S327 >
Following the previous step, the digital image processing device 140 is configured with: the unit image volume recognition unit 81 regards the reflected light from the calibration light source as light emission of the micro LEDs from the light intensity pixel map, specifies the unit image volume 80 of the reflected light from the calibration light source based on a predetermined criterion, generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory 41 in the digital image processing device 140. After the module processing of the unit image body recognition unit 81, the reflector map is regarded as the micro LED map data 44, and the micro LED recognition unit 90 maps the micro LEDs regarded as the reflector map from the unit image body 80 onto the pixel map to generate the micro LED map data 44, and stores the micro LED map data in the memory 41. Then, the digital image processing apparatus 140 is configured to: the light energy intensity of the micro LED2 is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map 45 on the micro LED map 44, and the light energy intensity value without the arrangement of the optical filter, which is regarded as the reflected light of the reflector 102 that the micro LED emits light, is stored in the memory 41 in the digital image processing device 140. When the module for measuring the light intensity without a filter is executed, the control device 170 is configured to execute a process for controlling the measurement of the light intensity with a filter, following the above step.
< 2 nd Filter movement indicating step S328 >
The control unit 171 module waiting for the 2 nd filter movement instruction is configured to: when receiving the 2 nd filter movement instruction, a signal for disposing the optical filter 50 in the optical path 21 is generated based on the instruction, and the signal is transmitted to the filter driving mechanism 60 via the transmission path 88. After the module is executed, the module is configured to wait for a 2 nd imaging start instruction, and the module is set to a state of waiting for the control unit.
< 2 nd Filter moving step S329 >
The filter driving mechanism 60 is configured by: the filter driving mechanism 60 receives a signal for disposing the optical filter 50 in the optical path 21 from the control unit 171 via the transmission path 88, and disposes the optical filter 50 in the optical path 21.
< 2 nd imaging start instruction step S330 >, and
the control unit 171 includes: when the 2 nd imaging start instruction notification is received in the 2 nd imaging start instruction waiting state which is the final processing of the 2 nd filter movement instruction step, a 2 nd imaging start instruction signal is generated, and the 2 nd imaging start instruction signal is transmitted to the digital image processing apparatus 140 via the communication path 89. The notification of the 2 nd imaging start instruction may be configured such that, for example, after the 2 nd filtering shift step is completed, the filter driving mechanism 60 transmits the status signal and the control unit 171 receives the signal, or may be configured such that a timer is driven in the control unit 171 and the notification of the 2 nd imaging start instruction is generated if a predetermined time elapses. After this block operation, the control unit 171 becomes idle and waits for the next task.
< 2 nd image capturing step S331 >
The digital image processing apparatus 140 is configured to: upon receiving the start instruction signal for the 2 nd image capturing via the communication path 89, the digital image processing device 140 receives the image signal from the image capturing device 30, generates a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame 42, and stores the light intensity pixel map in the memory 41 in the digital image processing device 140, and after this block is operated, the processing proceeds to the unit image body recognition unit 81.
< step S332 > of measuring light intensity with Filter
The digital image processing apparatus 140 is configured by: in the digital image processing device 40, following the above steps, the unit image body recognition unit 81 regards the reflected light from the calibration light source as the light emission of the micro LEDs from the light intensity pixel map, specifies the unit image body 80 of the calibration light source light based on a predetermined criterion, further generates unit image body mapping data for the pixel map, stores the unit image body mapping data in the memory 41 in the digital image processing device 140, and further generates the micro LED mapping data 44, the reflector of which is regarded as a mapping, from the unit image body 80, and stores the micro LED mapping data in the memory 41 in the micro LED recognition unit 90. After the module processing, the digital image processing apparatus 140 is configured to: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and is stored in the memory 41 in the digital image processing device 140 as a light energy intensity value in the arrangement of the optical filter 50 which is regarded as the calibration light source reflected light of the micro LED light emission. After the module processing, the processing of the micro LED inspection section is controlled in the digital image processing device 140.
< calculating the ratio of the light intensity without Filter to the light intensity with Filter S333 >)
Following the above step, the digital image processing apparatus 140 is configured to: in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 140, and the ratio of the light intensity without the filter to the light intensity with the filter is calculated from the light energy intensity value of the light reflected by the calibration light source in the arrangement with the optical filter 50 and the light energy intensity value in the arrangement without the optical filter 50. After the module is executed, the process proceeds to the emission wavelength calculation step.
< step S334 > of calculating emission wavelength
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit 100, the emission wavelength of the micro LED is determined by using a predetermined emission wavelength calculation expression of the micro LED. After the module is executed, the processing moves to the light source wavelength and light intensity ratio recording step.
< light source wavelength and light intensity ratio recording step S335 >
Following the above step, the digital image processing apparatus 140 is configured to: in the micro LED inspection unit 100, a known ratio of the light source wavelength to the light intensity is stored in the memory 41. After the module is executed, the process enters a light source wavelength updating step.
< light Source wavelength updating step S336 >
Following the above step, the digital image processing apparatus 140 is configured to: in the micro LED inspection unit 100, the setting value of the light wavelength of the light source is updated by a predetermined increment value. After the module is executed, the process proceeds to a decision step for deciding a look-up table completion condition.
< completion of decision step S337 >)
The digital image processing device 140 is configured to check whether the updated light wavelength of the light source exceeds a predetermined boundary value. After the module is executed, when the module is overtaken, the processing enters a lookup table manufacturing step, and when the module is not overtaken, the processing branches to a wavelength initialization step to initialize the updated optical wavelength.
< step S338 > of creating lookup Table
Following the above step, the digital image processing apparatus 140 is configured to: in the micro LED inspection unit 100, a look-up table 109 is created from a set of a plurality of ratios of wavelength to light intensity stored in the memory 41, and stored in the memory 41. After the module is executed, the lookup table 109 is completed and the process ends. Further, as described above, the optical filter inspection apparatus 101 for the micro LED light emission inspection apparatus 1 can be provided, which can automatically generate the lookup table 109 even if there are a plurality of reflectors arranged with the same geometric information as that of the micro LEDs.
In the inspection apparatus 101 for an optical filter of the micro LED light emission inspection apparatus 1 according to the above-described embodiment and the modifications thereof, any of the embodiments and the modifications thereof described herein has the following advantages: since the calibration operation having high compatibility with the micro LED light emission inspection apparatus 1 can be performed integrally with the inspection of the micro LED light emission inspection apparatus 1, the optical filter inspection apparatus 101 is preferably incorporated in the micro LED light emission inspection apparatus 1. By this integration, there are the following advantages: this makes it possible to avoid the repeated arrangement of parts, to realize a device arrangement at a lower cost, to perform calibration as needed, to update the look-up table 109 relatively frequently, to perform calibration in the same environment as the measurement of the micro LED2, and to improve inspection accuracy.
In addition, in one aspect of the optical filter inspection apparatus 101 used in the micro LED light emission inspection apparatus 1, instead of the following semiconductor substrate 3, the substrate 103 is mounted at a position corresponding to the semiconductor substrate 3 of the micro LED light emission inspection device 1, the semiconductor substrate 3 is formed with micro LEDs 2 in an array form in a rectangular region occupying a size of 100 μm or less to be separated individually on the surface in order to adjust the characteristics of the optical filter 50, the substrate 103 has on its surface substantially the same number of reflectors 102 (hereinafter also referred to as reflector array 102) as the design conditions of the arrayed micro LEDs to be inspected in at least a predetermined region, thus, there is provided an advantage that various kinds of photometric interferences between the objects arranged in an array can be calibrated under substantially the same conditions, and highly accurate measurement can be expected.
Has the following advantages: calibration can be performed under the same environment as the measurement of the micro LED2, and improvement in inspection accuracy can be expected.
The reflector 102 is preferably made of a metal film, and is preferably made of a metal containing chromium as a main component.
The light projection means 104 is preferably provided with a half mirror between the optical lens 20 and the reflector 102 on the reflected light path of the reflector 102. Since the optical path of the projection light can be overlapped with the optical path of the reflected light from the reflector 102, it is possible to realize a more compact device configuration. The light guide means 105 is preferably an optical fiber. The wavelength-variable light source 106 has an effect of increasing the degree of freedom of arrangement and realizing a more compact device configuration.
< Another embodiment of the micro LED light emission inspection device 1 >
In the above-described embodiment, the filter movement control is performed by the control device 70, but may not necessarily be performed by the control device 70, and may be performed by control independent of the control device 70, or the control device 70 and the digital image processing device 40 may be the control device 47 integrally configured, and preferably, cooperation in control is possible as described above.
In a further modified embodiment, as shown in the physical configuration diagram of fig. 14, the micro LED light emission inspection apparatus 1 is disposed so that the reference light emitter 6 is within the field of view of the optical lens 20, and light having a known emission wavelength for calibrating the filter characteristics may be provided as the reference light. In the present embodiment, the digital image processing apparatus 40 has the following advantages: the calibration can be performed by using the light intensity supplied from the reference light emitter, and the calibration of the filter characteristics can be performed at any time without removing the filter from the filter driving mechanism 60 in a state of being enclosed in the micro LED light emission inspection device 9.
Calibration of optical filter inspection apparatus 101 used in micro LED light emission inspection apparatus 1 in a further modified embodiment, optical filter inspection apparatus 101 is arranged so that reference light emitter 6 is within the field of view of optical lens 20, as in fig. 14, and light of a known emission wavelength for calibrating the filter characteristics may be provided as the reference light. In the present embodiment, the digital image processing apparatus 40 has the following advantages: the calibration can be performed by using the light intensity supplied from the reference light emitter, and the calibration of the filter characteristics can be performed at any time without removing the filter from the filter driving mechanism 60 in a state of being enclosed in the optical filter inspection apparatus 101.
Similarly, in the modified embodiment of the additional micro LED light emission inspection apparatus 1, as shown in the physical configuration diagram of fig. 15, the digital image processing apparatus 40 of the micro LED light emission inspection apparatus 1 further includes the photosensor 7 for monitoring the light intensity of the reference light emitter, and the digital image processing apparatus 40 can correct the calibration by using the stepwise light intensity of the reference light emitter normalized based on the light intensity monitoring value of the photosensor 7 upon receiving the signal output of the photosensor. This constitution has the following advantages: the measurement by the plurality of micro LED light emission inspection devices 1 can be collectively used, or an absolute measurement standard such as measurement of luminance can be introduced by standardization.
Further, in the modified embodiment of the optical filter inspection apparatus 101 used in the additional micro LED light emission inspection apparatus 1, as in fig. 15, the digital image processing apparatus 40 of the optical filter inspection apparatus 101 further includes the optical sensor 7 for monitoring the light intensity of the reference light emitter, and the digital image processing apparatus 40 receives the signal output from the optical sensor and can correct the calibration using the stepwise light intensity of the reference light emitter normalized based on the light intensity monitoring value of the optical sensor 7. This constitution has the following advantages: the measurement by the plurality of optical filter inspection apparatuses 101 can be performed collectively, or an absolute measurement standard such as measurement of brightness can be introduced by normalization.
In still another variation of the micro LED light emission inspection apparatus 1, as shown in the physical configuration diagram of fig. 16, the control device 70 is configured to further include a receiving unit 73 for receiving a status signal generated by the filter driving mechanism 60. The control device 70 is configured to receive a status signal capable of monitoring the progress of the change in the arrangement of the optical filters 50 by the filter driving mechanism 60 via the receiving unit 73, to generate a control signal instructing the filter driving mechanism 60 to select none of the optical filters 50 at an appropriate timing, and to transmit the control signal to the filter driving mechanism 60. On the other hand, the control device 70 is configured to be able to generate a control signal instructing the digital image processing device 40 to start measurement of the light energy intensity value in the arrangement without the optical filter 50, and to be able to transmit the control signal to the digital image processing device via the control signal transmitting unit 72. Further, the digital image processing apparatus 40 is configured with a micro LED defective determination section 1300, and the micro LED defective determination section 1300 recognizes the micro LED2 showing an abnormal value on the micro LED mapping data 44 as a micro LED2 defective and stores defective flag data for excluding from the micro LED2 product. The micro LED light emission inspection apparatus 1 configured as above has the following operational effects. Upon receiving the status signal from the filter driving mechanism 60 or upon receiving an instruction to start the inspection, the control unit 71 of the control device 70 subsequently generates a control signal instructing the digital image processing device 40 to start measurement of the light energy intensity value in the arrangement without the optical filter 50, and transmits the control signal to the digital image processing device 40 via the control signal transmitting unit 72. Upon receiving a control signal instructing to start measurement of the light energy intensity value in the configuration without the optical filter 50, the digital image processing device 40 receives the image data signal, and the digital image processing device 40 generates the micro LED map data 44 as described above. The digital image processing device 40 further identifies the micro LED showing an abnormal value on the micro LED mapping data 44 as a micro LED reject, sets a flag on the micro LED mapping data 44 to exclude from the micro LED product, identifies and saves the flag data. The abnormality determination may be performed by setting an upper limit and a lower limit of a threshold value to be a micro LED that displays a predetermined lower limit luminosity value or less or a micro LED that displays a predetermined upper limit luminosity value or more. These upper and lower luminances can be determined based on the phased positioning of the luminances of a set of micro LEDs, enabling the process of determining outliers by relative evaluation through the aggregate processing from the image data frame 42, where the advantageous effects of the present invention are discovered.
In yet another modified embodiment of the micro LED light emission inspection apparatus 1, as shown in the physical configuration diagram of fig. 17, the digital image processing apparatus includes an external connection path and data input part 140 for inputting the arrangement design data of the micro LEDs, the micro LED map boundary determining part 130 exerts an effect advantageous for improving the accuracy of the subsequent processing, the micro LED map boundary determining unit 130 may receive the arrangement design data of the micro LEDs arranged in an array from the data input unit via the external connection path, store the arrangement design data of the micro LEDs arranged in an array in the memory within the digital image processing apparatus, comparing the unqualified micro LED product data with the arrangement design data of the micro LEDs, identifying the end parts of the array arrangement of the normal micro LEDs and updating the micro LED mapping map range suitable for the product according to the end parts.
Further, in the modified embodiment of the added micro LED light emission inspection apparatus 1, the digital image processing apparatus 40 of the micro LED light emission inspection apparatus 1 further includes an image display device 92 as shown in fig. 18, and is configured to generate a two-dimensional map 93 of light intensity characteristics and emission wavelengths of the plurality of micro LEDs as shown in the range graph of fig. 19 and display the map on the image display device 92. The two-dimensional map of the light intensity characteristics and the emission wavelength is a method suitable for multidimensional analysis of the micro LED, and thereby the emission characteristics of the micro LED can be grasped in more detail.
[ 2 nd embodiment ]
Fig. 20 is a physical configuration diagram of embodiment 2 of a micro LED light emission inspection apparatus 500 according to the present invention. The micro LED light emission inspection apparatus 500 further includes a filter optical axis inclination angle drive mechanism 65. The filter optical axis inclination angle drive mechanism 65 includes a receiving section of an inclination angle control signal for controlling the inclination of the optical filter with respect to the optical axis of the optical path 21. The optical filter 51 having a predetermined optical wavelength band is a dielectric thin film optical filter 51 having a wavelength longer than the center value of a predetermined wavelength range as a half value of the filter transmittance. The filter optical axis inclination angle drive mechanism 65 is configured to be able to adjust the inclination angle of the optical filter with respect to the optical axis direction.
Further, in the variation of embodiment 2, the control unit 71 of the control device 70 of the micro LED light emission inspection device 500 is configured to be able to generate a control signal for instructing the filter driving mechanism 60 to select a thin film optical filter having a wavelength longer than the center value of a predetermined light transmission wavelength band as a half value of the filter transmittance. The wavelength variable light source 106 is configured to be capable of bidirectional communication with the control device 70 via the wavelength variable mechanism 116, and the filter driving mechanism 60 and the filter optical axis inclination angle driving mechanism 65 are configured to be capable of bidirectional communication with the control device 70 via the receiving unit via the 1 st communication network 501. The control device 70 and the digital image processing device 40 are configured to be capable of bidirectional communication via the 2 nd communication network 502. The control device 70 is configured to be able to acquire the light intensity of the predetermined unit image 80 from the digital image processing device 40 via the 2 nd communication network 502. The control unit 71 of the control device 70 is configured to be able to generate a tilt angle control signal and to be able to transmit the tilt angle control signal to the filter optical axis tilt angle driving mechanism 65 via the 1 st communication network 501. The tilt angle of the dielectric thin-film optical filter 51 with respect to the optical axis direction may be configured such that the difference from the half value of the filter transmittance at the center value of the predetermined wavelength range is within a predetermined threshold value. Fig. 16 is a functional block diagram of the micro LED light emission inspection apparatus 500 configured as described above.
Dielectric thin film optical filters are known to change the cut-off wavelength by tilting the angle with respect to the optical path. The wavelength change is such that the state perpendicular to the optical path is set to 0 °, and the cutoff wavelength is shifted in a direction to become shorter as the angle increases. With this property, the following advantageous effects are provided: in the micro LED light emission inspection apparatus 500 having the above-described configuration, when the filter optical axis inclination angle driving mechanism 65 is used to incline the film optical filter, the filter is appropriately inclined with respect to the optical path to control the half-value of the filter so as to correct the characteristic deviation of the optical filter by the rapidly changing wavelength transmission characteristic of the thin film optical filter, whereby the half-value can be set in the middle of the target wavelength measurement range, and the wavelength measurement with high accuracy and good linearity can be realized. Fig. 27 described below shows an example in which the half value is shifted to the right when the filter optical axis inclination angle is inclined by 20 ° from an angle perpendicular to the optical axis. If the tilt angle is set between right angle and 20 deg., the tilt angle at which the half-value wavelength is also shifted proportionally has a continuous relationship with the half-value wavelength. Therefore, if the tilt angle is controlled, the filter half-value wavelength can be controlled in the range of 630nm to 650 nm.
The operation of the micro LED light emission inspection apparatus 500 shown in fig. 20 will be described with reference to the schematic diagram 22 of the flowchart S500 in which the control flow is drawn across the constituent elements.
< center wavelength of light wavelength setting step S521 >
The control unit 71 is configured to control the shift to the center wavelength setting step of the optical wavelength at the same time as the start of the processing of the control unit 71 of the control device 70, and is configured to be able to transmit a control signal to the wavelength variable mechanism 116 via the communication unit 74 and the 1 st communication network 501 so as to update the setting value of the optical wavelength of the wavelength variable light source 106 to the center wavelength of the optical wavelength by the wavelength variable mechanism 116. After the transmission, the control is transferred to the calibration light source lighting step.
< Central wavelength light Source Lighting step S522 >
The micro LED lighting inspection apparatus 500 is configured by: the wavelength variable light source 106 is remotely lit. When the center wavelength light source lighting step is executed, control is continued to activate the constituent blocks of the filter movement instruction step configured in the control unit 71.
< 1 st Filter movement indicating step S523 >)
After the previous step, the control is shifted to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting a state where the optical filter 50 is not present in the optical path 21. Further, the signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control section 71 is configured with: in this state, the module process immediately shifts to a state of waiting for the start instruction notification of the first image capturing.
< step S524 > for moving filter 1
The filter driving mechanism 60 is configured to immediately execute an initial filter moving step of removing the optical filter 50 from the optical path 21 when receiving a signal for selecting a state where the optical filter 50 is not present in the optical path 21 via the 1 st communication network 501 between the filter driving mechanism 60 and the control device 70.
< 1 st image pickup Start instruction step S525 >)
When the control unit 71 of the control device 70 receives the start instruction notification of the first image capturing while waiting for the start instruction notification of the first image capturing, which is the final processing of the filter shift instruction step described in the 1 st, the control unit 71 immediately generates the start instruction signal of the 1 st image capturing. The first imaging start instruction notification may be configured to: after the first filter moving step is completed, the filter driving mechanism 60 transmits the status signal, and the control unit 71 receives the status signal, and in addition, the timer is driven in the control unit 71, and if a predetermined time elapses, a start instruction notification of the first imaging is generated. In this case, a timer event is generated after a predetermined time has elapsed, and a start instruction for the first imaging is notified to the control unit 71. When the control returns to the control section 71, the control section 71 waits for the 2 nd filter movement instruction after transmitting the 1 st image capturing start instruction signal to the digital image processing apparatus 40 via the 2 nd communication network 502. After executing a block that starts the start instruction step of the 1 st image capturing, the processing of the block shifts to a 2 nd filter movement instruction waiting state.
< 1 st image pickup step S526 >
The digital image processing device is configured to: when receiving an instruction signal for starting the 1 st image capture from the control unit 71 via the 2 nd communication network 502, the image signal is received from the image capture device 30, a light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame 42 stored in the digital image processing device 40 is generated, and the light intensity pixel map is stored in the memory in the digital image processing device, and after the block is operated, the control proceeds to the unit image body recognition unit 81.
< step S527 > < measuring light intensity without Filter
Following the previous step, the digital image processing device 40 is configured with: the unit image volume recognition unit 81 regards the calibration light source light as light emission of the micro LEDs from the light intensity pixel map, specifies the unit image volume 80 of the calibration light source light based on a predetermined criterion, generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory 41 in the digital image processing device 40. Following the module processing of the unit image recognition unit 81, the digital image processing device 40 is configured with: the calibration light source map is regarded as a micro LED map, and the micro LED recognition unit 90 maps the micro LEDs regarded as the calibration light source map from the unit image body 80 onto the pixel map to generate micro LED map data 44, which is stored in the memory 41. Subsequently, the digital image processing apparatus 40 is configured by: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity pixel map on the micro LED map, and the light energy intensity value in the arrangement without an optical filter of the calibration light source regarded as the light emission of the micro LED is stored in the memory 41 in the digital image processing device 40. When the module for measuring the optical intensity without a filter is executed, the control device 70 is configured to execute the process of controlling the measurement of the optical intensity without a filter, following the above step.
< 2 nd Filter movement indicating step S528 >)
The control unit 71 module waiting for the 2 nd filter movement instruction is configured to: upon receiving the 2 nd filter movement instruction, a signal for arranging the thin film optical filter 51 on the optical path 21 is generated based on the instruction so as to instruct selection of a thin film optical filter having a wavelength longer than the center value of the predetermined wavelength range as a half value of the filter transmittance, and the signal is transmitted to the filter driving mechanism 60 via the 1 st communication network 501. After the module is executed, the module is configured as a module for waiting for a 2 nd imaging start instruction, and the control unit is in a waiting state.
< 2 nd Filter moving step S529 >
The filter driving mechanism 60 is configured by: the filter driving mechanism 60 receives a signal for disposing the optical filter 50 on the optical path 21 from the control unit 71 via the 1 st communication network 501, and disposes the thin-film optical filter 51 on the optical path 21.
< subsequent imaging Start instruction step S530 >
The control unit 71 is configured to generate a subsequent image capture start instruction signal and transmit the subsequent image capture start instruction signal to the digital image processing apparatus 40 via the 2 nd communication network 502 when receiving the subsequent image capture start instruction notification in the 2 nd image capture start instruction waiting state, which is the final processing of the 2 nd filter shift instruction step. The first and subsequent imaging start instruction notifications may be configured such that, for example, after the 2 nd filter shift step is completed, the filter driving mechanism 60 transmits a status signal thereof, and the control unit 71 receives the signal, or may be configured such that a timer is driven in the control unit 71, and if a predetermined time elapses, the 2 nd imaging start instruction notification is generated, and if a cycle of repeating imaging is entered, the imaging start instruction notification is received from the step of changing the filter angle. After the module operates, the module becomes idle and waits for a start instruction notification of the next image capturing.
< subsequent image pickup step S531 >
The digital image processing device 40 is configured by: upon receiving a start instruction signal for the subsequent image capturing via the 2 nd communication network 502, the digital image processing device 40 receives a video signal from the image capturing device 30, generates a light intensity pixel map in which the stepwise light intensity measured for each pixel is superimposed on a pixel map on the image data frame 42, and controls the processing to the unit video volume recognition unit 81 after the module operates, and stores the light intensity pixel map in the memory 41 in the digital image processing device 40.
< step S532 of measuring light intensity with Filter
In the digital image processing apparatus 40, following the above step, the digital image processing apparatus 40 is configured by: the unit image volume recognition unit 81 regards the calibration light source light as light emission of the micro LEDs from the light intensity pixel map, specifies the unit image volume 80 of the calibration light source light based on a predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory 41 in the digital image processing device 40, and further generates the micro LED mapping data 44, which is regarded as a calibration light source map, from the unit image volume in the micro LED recognition unit 90, and stores the micro LED mapping data in the memory 41. After the module processing, the digital image processing apparatus 40 is configured by: the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and is stored in the memory 41 in the digital image processing device 40 as a light energy intensity value in the arrangement having the thin film optical filter 51 which is regarded as a calibration light source for the light emission of the micro LED. After this block processing, the processing to the micro LED inspection section is controlled in the digital image processing device 40.
< calculation of ratio of light intensity without filter to light intensity with filter S533 >)
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 40, and the ratio of the light intensity without the filter to the light intensity with the filter is calculated from the light energy intensity value in the arrangement with the thin film optical filter 51 in the calibration light source and the light energy intensity value in the arrangement without the optical filter. After the module is executed, the process proceeds to the emission wavelength calculation step.
< step S534 of determining the angle of the adaptive filter >
Following the previous step, the digital image processing device 40 is configured with: in the micro LED inspection unit 100, it is determined whether or not the ratio of the light intensities is in the vicinity of 0.5 within a predetermined determination range, based on a predetermined determination condition. When the ratio of the light intensities is not in the vicinity of 0.5 within the predetermined determination range, the control branches to the step of instructing the filter angle. When the ratio of the light intensities is in the vicinity of 0.5 within a predetermined determination range, the control is branched to the step of recording the filter angle.
< indication of Filter Angle step S535 >)
The digital image processing apparatus 40 and the controller 70 are configured to notify the filter optical axis inclination angle driving mechanism 65 of an instruction to increase the predetermined variation range, for example, by 1 ° via the communication unit 74 of the controller 70, with respect to the filter angle via the 2 nd communication network 502. After the module is executed, the process proceeds to the step of varying the filter angle.
< Change of Filter Angle step S536 >
The filter optical axis inclination angle driving mechanism 65 generates a signal for driving the filter angle changing step, and drives the filter optical axis inclination angle driving mechanism 65. After the angle change is completed, a subsequent image capture start instruction notification signal is generated and transmitted to the digital image processing apparatus 40. After the execution of this block, the processing proceeds to the subsequent image capturing step of the digital image processing apparatus 40. Thereafter, the processes after the image pickup process are repeatedly executed.
< step S537 > recording Filter Angle
After the above step, the micro LED inspection unit 100 stores the filter angle in the memory 41, and the process ends.
With the above configuration and processing, the inclination angle of the thin-film optical filter 51 for having a desired filtering performance with respect to the optical axis direction can be acquired, stored, and reused as a desired inclination angle configured such that the difference from the half value of the filter transmittance at the center value of the predetermined wavelength range converges within a predetermined threshold value. The filter optical axis inclination angle drive mechanism 65 may be configured by, for example, micro-stepping control in which a stepping motor is directly driven, or may be configured by stepping control in which a stepping motor is driven via a reduction gear mechanism, but it is preferable to control the variation range with an angular resolution of about 1 °.
Next, fig. 23 is a schematic front view showing an emission wavelength inspection device 600 according to a variation of the emission wavelength inspection device according to embodiment 1 of the present invention. In the figure, an inspection target substrate 3 as a light emitter is mounted on a stage configured to be horizontally movable, and receives a current supply from a power supply device 10 to emit light from a chip on the surface. The surface state of the inspection target substrate 3 is photographed by the camera 30 through the lens 20. The captured image information is input to an integrally configured image processing and control device 47 (hereinafter simply referred to as a control device 47). The control device 47 controls the filter driving device 60. The color filter 50 is fixed to the filter holder 56, and the filter driving device 60 moves the filter holder 56 and the color filter 50 within the optical path 21 and outside the optical path 21.
Fig. 23 shows the position of the optical filter outside the optical path in the present apparatus.
Fig. 24 shows a case where the optical filter in the present apparatus is inserted into the optical path.
Fig. 25 shows the transmittance characteristics of the color filter 50. The filter 50 is designed to measure a wavelength range of 610 nm to 650 nm centered at a wavelength of 630 nm. For example, assuming that the illuminance measurement value when the measurement object was measured without a filter is 100 and the illuminance measurement value when the color filter 50 was inserted is 74, the ratio is 0.74, and the wavelength of the illuminant measured is 620 nm based on the filter characteristics in fig. 25.
Next, fig. 26 is a schematic front view of an emission wavelength inspection apparatus 700 according to a variation of embodiment 2 of the present invention. The color filter used in the present embodiment is a dielectric thin film optical filter 56. The dielectric thin film optical filter 56 is configured to be capable of having an inclination angle with respect to the optical axis of the optical path 21 by the filter optical axis inclination angle drive mechanism 65. The tilt can be controlled by a stepper motor M driven in microsteps. Here, the dielectric thin film optical filter 56 is known to change the cutoff wavelength by inclining an angle with respect to the optical path. The wavelength change is set to 0 ° in a state perpendicular to the optical path, and when the angle increases, the wavelength change moves in a direction in which the cutoff wavelength becomes shorter. Fig. 27 shows characteristics of the optical filter 56. The optical filter 56 is designed such that the transmittance becomes half value around 650 nm. The filter can be used as a half-value short-circuit optical filter at 630nm by tilting about 20 °. As the characteristics of the optical filter 56, even if the wavelength at which the transmittance becomes the half value is not exactly 650 nm but is, for example, around 660 nm, the half value wavelength can be exactly adjusted to 630nm by further increasing the tilt angle. On the other hand, even if the half-value wavelength is short and is near 640 nm, the filter can be similarly used as a filter with a half value of 630nm by slightly adjusting the tilt angle. As described above, in the present embodiment, a dielectric thin film optical filter having a high transmittance and a drastic change in transmittance in the vicinity of the half value can be used, and even a dielectric thin film optical filter whose manufacture is difficult and half value cannot be accurately controlled can have a large allowable range of the half value setting, so that the filter can be easily manufactured.
Fig. 29 is a schematic perspective view of a micro LED light emission inspection apparatus 800 as a variation of the micro LED light emission inspection apparatus 1 according to the present invention. The micro LED light emission inspection apparatus 800 is characterized by being provided with the wavelength variable light source 106, the control device 70, and the digital image processing device 40. Since the micro LED light emission inspection device of the present invention requires the digital image processing device 40, the area of the extended bottom surface required for the device becomes larger than that of the conventional light emission inspection device. Since the electronic device needs to be cooled, it is preferable to dispose the electronic device so as not to store heat as much as possible. The micro LED light emission inspection apparatus 800 is configured such that one of 4 selective optical filters supported from the left and right sides by supporting the optical filter with high rigidity from the upper side, and supported by a rotary optical filter holder 56 suspended from a bridge spanning the support corresponds to the optical filter 50 pattern, the support 12 is disposed in the base member 14 made of granite such that 2 supports 12 are offset from the center line and directed in the vertical direction, and the digital image processing apparatus 40 is disposed below the base member 14 along the side surface on the opposite side of the offset, and the digital image processing apparatus 40 stores a large volume of image data frames with a width substantially equal to the beam width in parallel to the bridge 13 spanning the support 12. On the other hand, the control device 70 is disposed below the base member 14, which is offset from the center line toward the strut 12 side in the base member 14 with a gap from the digital image processing device 40. The variable wavelength light source 106 is disposed at a position sandwiched between the control device 70 and the digital image processing device 40 so that an optical fiber that outputs light to a side surface in the longitudinal direction facing the lower side of the base member 14 protrudes. The LED lighting power source is disposed in the longitudinal direction so as to face the side surface of the base member substantially in parallel at the side corner portion below the base member 14, which is not on the opposite side of the fiber protruding surface of the variable wavelength light source 106. With this configuration, the main components are disposed below the base member 14 and the digital image processing device 40 is housed below the base member 14 while taking heat dissipation into consideration, thereby achieving a space-saving effect.
Further, in a modified embodiment of the added micro LED light emission inspection apparatus 1, the image processing apparatus 40 of the micro LED light emission inspection apparatus 1 shown in fig. 7 includes a communication unit (not shown in fig. 7), the remote server 97 or the USB memory 74 can receive or store the manufacturing conditions from the micro LED light emission inspection apparatus 1, the image processing apparatus 40 of the micro LED light emission inspection apparatus 1 further includes a manufacturing condition data output unit, and is configured to convert predetermined data into a predetermined data format based on at least one of the micro-LED mapping data 44 or the light intensity characteristics of the micro-LEDs, generate and output the data as manufacturing condition data, the micro LED mapping data 44 includes the entire image of the micro LED semiconductor substrate 3, 1 or more unit image volume mapping data 46, and the light intensity characteristic and the light emission wavelength characteristic corresponding thereto, and at least one of these ranges. Alternatively, in another modified embodiment, the image processing apparatus is configured to be able to further output a two-dimensional map of the emission wavelength and the light intensity ratio in the case where the optical filter is not present. The micro LED light-emission inspection apparatus configured as described above is configured to be able to perform information cooperation from the remote server 97 to the manufacturing process management server in real time, or the USB memory 74 is configured to be able to perform information cooperation to the manufacturing process management server in real time, so that an effect of being able to recognize an abnormality of the manufacturing process as early as possible can be obtained.
A representative process of the micro LED display manufacturing process is as follows.
0) Beginning of the manufacturing process
1) Stage of producing micro LED chips on wafer
2) Stage for measuring illumination and luminous wavelength of each chip in lighting inspection
3) Cutting and grouping stage
4) Stage for mounting chip on display substrate
5) Display lighting inspection phase
6) The manufacturing process is finished
In the modified embodiment shown in fig. 5, the digital image processing device 40 of the micro LED light emission inspection device 1 of the present invention is configured to include the communication unit 110, and the micro LED light emission inspection device 1 is configured to include a communication path for communicating with the manufacturing process management computer 97, for example, and to be capable of inputting manufacturing data and to include a module for executing a manufacturing instruction receiving step for receiving a manufacturing instruction. The image processing apparatus 40 of the micro LED light emission inspection apparatus 1 shown in fig. 5 of the added micro LED light emission inspection apparatus 1 includes a communication unit 110 and a data output unit 120, and the micro LED light emission inspection apparatus 1 further includes a communication path and a manufacturing data output unit connected to a manufacturing process management computer (for example, the servers 200 and 91 may be compatible, and a network connection server not shown may be compatible), and further includes a module for executing a manufacturing data output step of outputting manufacturing process data including calibration data and other inspection progress data to the manufacturing process management computer via the communication path. According to these configurations, in the lighting inspection of the micro LED, the inspection level and the inspection condition required for the product can be grasped in good time, and the cooperation of items to be paid attention to at the time of the inspection can be realized. For example, a micro LED light emission inspection apparatus is provided which can share the necessary amount of each two-dimensional map range of a chip required on a display substrate, the excessive shortage and product defect information at any time, can rapidly grasp the variation factor of the manufacturing variation according to the situation, and can dynamically realize the change of the inspection level and the two-dimensional map range, which contributes to the manufacturing cost and the quality of the display.
In another aspect, the present invention provides a method for inspecting micro LED light emission incorporated in a fully automated manufacturing process. This is explained with reference to the flowchart S1000 of the method shown in fig. 28. The micro LED light emission inspection method incorporated in the fully automatic manufacturing process uses the micro LED light emission inspection apparatus according to the above embodiment, and includes the following steps.
0) Examination start
1) Product information acquisition stage S1001
At this stage, common information of products such as geometric information of the substrate including the alignment mark information, geometric information of the micro LED, and geometric information of the micro LED array is received, and preparation for each product inspection is performed.
2) Manufacturing management area setting step S1002
At this stage, a manufacturing management area for identifying and managing local variations and/or abnormalities in product quality is set on the semiconductor substrate on which the micro LEDs are formed, based on one or more pieces of the geometric information. The manufacturing management area may be set based on a geometrical shape, an area to be managed may be set based on a past inspection state, or a plurality of kinds of manufacturing information such as a temperature and a wind direction in a previous manufacturing stage, and manufacturing instruction information may be set.
3) Notification phase S1003 capable of accepting check
At this stage, the network device notifies the production line control computer of a state in which the production line control computer can be checked. This enables the integration into a fully automated manufacturing process.
4) Manufacturing information receiving stage S1004
At this stage, micro LED wafer manufacturing information is received from the line control computer. The manufacturing information includes substrate geometry information and marks (labels) for positioning.
5) Wafer mounting stage S1005
At this stage, the substrate is mounted on the inspection stage and fixed to the inspection stage by a method such as vacuum suction. When a substrate is mounted, information specifying a manufacturing lot or manufacturing is added, and the substrate is mounted on an inspection stage.
6) Manufacturing management area mapping stage S1006
At this stage, in addition to the method of using the micro LED light emission inspection apparatus according to the above embodiment, the present method provides an additional mapping layer which is a feature of the present method, the mapping layer being a process of imaging an entire image of a substrate by an image processing apparatus and mapping a manufacturing control region onto the substrate. In the mapping, manufacturing management area division information, substrate geometry information, and a mark (label) for positioning are used.
7) Micro LED mapping stage S1007
At this stage, the same examination as in embodiment 1 is performed. The micro LEDs configured on the substrate by the image processing device are mapped onto image frames generated within the image processing device.
8) Micro LED characteristic measuring stage S1008
At this stage, the same examination as in embodiment 1 is performed. The micro LED chip was turned on by an image processing device, and the light emission intensity and the light emission wavelength were measured.
9) Micro LED grouping stage S1009
At this stage, the image processing apparatus assigns, based on the inspected micro LED characteristics, range information of abnormal classification classified by a matrix of the emission intensity and the emission wavelength to the micro LED map information according to a predetermined classification condition, and classifies and groups all the micro LED chips.
10) Manufacturing process state determination stage S1010
At this stage, the image processing apparatus overlays the micro LED to which the inspection result range information is added on the manufacturing management area map, and identifies the manufacturing process state of the micro LED associated with the manufacturing management area.
11) Inspection result transmission stage S1011
At this stage, the grouping information based on the inspection result and the manufacturing process state of each manufacturing management area are transmitted to the line control computer via the network device by the image processing device.
12) Inspection end notification stage S1012
At this stage, an inspection end notification is sent to the line control computer.
13) End of examination
The above method provides an effect of further suppressing variations that vary depending on manufacturing conditions and providing rapid feedback of manufacturing variation factors to the manufacturing process in time.
While the embodiments of the present invention have been described above, the present invention is not limited to the embodiments, and can be implemented by being variously changed within a range not departing from the gist of the present invention. While the present invention has been described in the embodiments described herein, the embodiments are described in considerable detail, and the applicant intends to restrict or limit the scope of the appended claims to such description. Those skilled in the art will appreciate additional advantages and modifications and that elements described in one embodiment may be employed in other embodiments. Therefore, the present invention is not limited in many respects to the specific details, and the various machines and embodiments are shown and described. Accordingly, departures may be made from such details without departing from the spirit or scope of the applicant's general inventive concept.
[ industrial applicability ]
The present invention can be used in the semiconductor manufacturing industry for manufacturing micro LEDs using a micro LED light emission inspection apparatus that inspects a plurality of LED chips generated on a wafer in the manufacturing process of a display device using micro LEDs.
[ description of symbols ]
1 micro LED luminescence inspection device
2 micro LED
3 semiconductor substrate
10 power supply mechanism
15 microscope
18 image signal line
20 optical lens
21 light path
30 image pickup device
31 image sensor
40 digital image processing apparatus
41 memory
42 frame of image data
43 pixel map
44 micro LED map (micro LED mapping data)
45 light intensity pixel map
46 Unit image volume map (Unit image volume map data)
47 mechanism control and digital image processing integrated control device
50 optical filter
51 thin film optical filter
56 Another thin film optical filter
60 Filter drive mechanism (Filter drive device)
62 filter drive mechanism receiving part
65 filter inclination angle change control mechanism
70 control device
71 control part
72 transmitting part
76 network connection storage
80 unit image body
81 Unit image recognition part/Unit image
88 control signal line between control device and filter driving mechanism
90 micro LED identification part
92 picture display device
93 two-dimensional map
97 remote connection server
100 micro LED inspection part
101 optical filter inspection device for micro LED light emission inspection device
110 communication part
120 data output part
130 micro LED map boundary determination unit
140 data input unit
500 micro LED luminescence inspection device
600 chip luminescence inspection device
700 chip light-emitting inspection device
Distance A
B unit image body boundary line
M step motor
S0 control flow chart
S100 control flow chart
S200 control flow chart
S300 control flow chart
S500 control flow chart
And S1000 micro LED luminescence inspection method flow chart.

Claims (36)

1. A micro LED light emission inspection device capable of mounting a semiconductor substrate on which micro LEDs to be individually separated and occupying a rectangular region having a size of 100 [ mu ] m square or less are arrayed and formed on a surface, the micro LED light emission inspection device comprising:
a power supply mechanism for making the micro LED emit light;
an imaging device having an image sensor for measuring the intensity of the emitted light, the imaging device being disposed opposite to the substrate and having an optical lens;
A digital image processing device for receiving the image signal of the camera device;
an optical filter disposed on an optical path between the micro LED and the optical lens and having a predetermined optical wavelength band;
a filter driving mechanism supporting the optical filter and including a receiving section for a control signal; and
a control device including a transmission unit for a control signal of the filter driving mechanism and a control unit for generating the control signal and executing flow control at the start of a system flow; and is
The optical filter has a filter transmission light intensity which monotonically increases or monotonically decreases in a prescribed light wavelength band including a color wavelength satisfying a design condition,
the control means can selectively control the presence or absence of the optical filter using the filter driving mechanism,
the digital image processing apparatus includes a memory for storing an image data frame generated after receiving the video signal, and includes:
a unit image volume identification unit for identifying a unit image volume of the light emission based on a predetermined criterion from a light intensity pixel map of each pixel on the image data frame, and generating unit image volume map data for the pixel map;
A micro LED identification unit for specifying a plurality of micro LEDs arranged in an array form according to the unit image volume and generating micro LED mapping data for mapping the micro LEDs onto the pixel map; and
and a micro LED inspection unit configured to determine the optical energy intensity of the micro LED by using a predetermined optical energy intensity calculation formula based on the light intensity map on the micro LED map, store the optical energy intensity value in the arrangement without the optical filter out of the optical energy intensities of the micro LED in the memory, and determine the emission wavelength of the micro LED by using a predetermined emission wavelength calculation formula based on the optical energy intensity value of the micro LED in the arrangement with the optical filter and the optical energy intensity value in the arrangement without the optical filter.
2. The micro LED luminescence inspection apparatus according to claim 1, wherein the predetermined criterion is that a pixel exhibiting a peak luminous energy intensity value with respect to the surroundings is specified as a center portion of the unit image volume, and a center between adjacent center portions of the unit image volumes is set as a rectangular boundary of the unit image volume.
3. The micro LED light emission inspection apparatus according to claim 1 or 2, wherein the predetermined criterion is that a pixel exhibiting a peak luminous energy intensity value with respect to the surroundings is specified as a center portion of the unit image volume, and a rectangular boundary of the unit image volume is determined based on a designed interval value of the micro LEDs arranged in an array.
4. The micro LED luminescence inspection device of claim 1, wherein the prescribed light energy intensity calculation is a sum of stepwise light intensities of the pixels comprised by the micro LEDs on the light intensity pixel map.
5. The micro LED luminescence inspection apparatus of claim 1, wherein the optical filter calibrates filter characteristics by a light source of a known light wavelength, and the micro LED luminescence inspection apparatus stores a lookup table made based on the calibration with respect to a relationship of the ratio of the light energy intensity value in a configuration without the optical filter to the light energy intensity value in a configuration with the optical filter and the luminescence wavelength.
6. The micro LED luminescence inspection apparatus according to claim 5, wherein the predetermined luminescence wavelength calculation formula for the micro LED is determined by referring to the luminescence wavelength corresponding to the measured value of the luminous energy intensity ratio by the lookup table, and adding and proportionally interpolating a median value.
7. An optical filter inspection apparatus for a micro LED luminescence inspection apparatus, comprising: a substrate having an array-like surface on which reflectors are formed, the reflectors being arranged in substantially the same number and arrangement as the design conditions of the array-like micro LED array to be inspected, at least in a predetermined region;
A light projecting mechanism for reflecting light of the reflector;
a light guide mechanism for the light projection mechanism;
a source of known wavelengths of the light projection light;
an imaging device having an image sensor for measuring the intensity of the emitted light, the imaging device being disposed opposite to the substrate and having an optical lens;
a digital image processing device for receiving the image signal of the camera device;
an optical filter for a micro-LED emission inspection device, disposed between the optical lens and the reflector on a reflected light path of the reflector, and having a predetermined light wavelength band;
a filter driving mechanism supporting the optical filter and including a receiving section for a control signal; and
a control device including a transmission unit for a control signal of the filter driving mechanism and a control unit for generating the control signal and executing flow control at the start of a system flow; and is
The optical filter has a filter transmission light intensity which monotonically increases or monotonically decreases in a prescribed light wavelength band including a color wavelength satisfying a design condition,
the control means can selectively control the presence or absence of the optical filter using the filter driving mechanism,
The digital image processing apparatus includes a memory for storing an image data frame generated after receiving the video signal, and includes:
a unit image volume recognition unit that recognizes the reflected light of the reflector as the light emission of the micro LED, specifies a unit image volume of the light emission from a light intensity pixel map of each pixel on the image data frame based on a predetermined criterion, regards the unit image volume of the reflected light as a unit image volume based on the light emission of the micro LED, and generates unit image volume map data for the pixel map;
a micro LED identification unit for identifying a plurality of the micro LEDs arranged in an array and regarded as the reflector from the unit image, and generating micro LED mapping data for mapping the micro LEDs onto the pixel map; and
and a micro LED inspection unit configured to determine the optical energy intensity of the micro LED by using a predetermined optical energy intensity calculation formula based on the light intensity map on the micro LED map, store the optical energy intensity value in the arrangement without the optical filter out of the optical energy intensities of the micro LED in the memory, and determine the emission wavelength of the micro LED regarded as the light source of the reflected light by using a predetermined emission wavelength calculation formula of the micro LED based on the optical energy intensity value of the micro LED in the arrangement with the optical filter and the optical energy intensity value of the arrangement without the optical filter.
8. The optical filter inspection apparatus according to claim 7, wherein the light projection mechanism for the reflected light of the reflector includes a half mirror disposed between the optical lens and the reflector on the reflected light path of the reflector.
9. The optical filter inspection device for a micro LED luminescence inspection device according to claim 7 or 8, wherein the light guiding mechanism includes a fiber optic cable.
10. The optical filter inspection apparatus for a micro LED luminescence inspection apparatus according to claim 7 or 8, wherein the optical filter makes a lookup table based on the calibration completion with respect to a relationship of the luminescence wavelength and a ratio of the light energy intensity value in a configuration without the optical filter to the light energy intensity value in a configuration with the optical filter.
11. The optical filter inspection apparatus for a micro LED light emission inspection apparatus according to claim 10, wherein the digital image processing apparatus includes a lookup table created based on a relationship between the emission wavelength and a ratio of the light energy intensity value in a configuration without the optical filter to the light energy intensity value in a configuration with the optical filter in the calibration, and the light emission wavelength corresponding to the measured light energy intensity ratio is determined by adding the median value and proportionally interpolating the median value with reference to the lookup table.
12. The micro LED luminescence inspection device according to any one of claims 1 to 6, comprising the optical filter inspection device for a micro LED luminescence inspection device according to any one of claims 7 to 11.
13. The micro LED luminescence inspection device of claim 1 or 6, wherein the digital image processing device further comprises a connection interface to a persistent memory from which the filter characteristics and the look-up table can be received as master data, the memory stored within the digital image processing device.
14. The micro LED luminescence inspection apparatus according to claim 6, 12 or 13, wherein the digital image processing apparatus is capable of providing light of a known luminescence wavelength for calibration of the filter characteristic as reference light within an optical field of view of the imaging apparatus.
15. The micro LED luminescence inspection apparatus according to claim 14, further comprising a photosensor for monitoring a light intensity of the reference illuminant, wherein the image processing device is configured to receive a signal output from the photosensor and to be capable of correcting the calibration using a normalized stepwise light intensity of the reference illuminant according to a light intensity monitoring value of the photosensor.
16. The micro LED light emission inspection apparatus according to claim 1, wherein the control device of the micro LED light emission inspection apparatus further includes a receiving section of a status signal generated by the filter driving mechanism, the control section of the control device generates a control signal instructing the filter driving mechanism to select the absence of the filter and can transmit the control signal to the filter driving mechanism, and the control device generates a control signal instructing the image processing apparatus to start measurement of the light energy intensity value in the configuration without the optical filter and can transmit the control signal to the image processing apparatus via a control signal transmitting section,
the control unit of the control device, upon receiving the status signal from the filter driving mechanism or upon receiving an instruction to start inspection, then generates a control signal instructing the image processing device to start measurement of the light energy intensity value in the arrangement without the optical filter, and transmits the control signal to the image processing device via a control signal transmitting unit, and the image processing device has a micro LED reject determination unit that identifies a micro LED showing an abnormal value on micro LED mapping data as a micro LED reject and stores reject flag data for exclusion from a micro LED product.
17. The micro LED luminescence inspection apparatus of claim 16, wherein the digital image processing apparatus of the micro LED luminescence inspection apparatus comprises an external connection path and a data input section for inputting the arrangement design data of the micro LEDs, and comprises a micro LED map boundary determination section for receiving the arrangement design data of the micro LEDs arranged in an array form from the data input section via the external connection path, storing the arrangement design data of the micro LEDs arranged in an array form in the memory in the digital image processing apparatus, comparing the micro LED reject data with the arrangement design data of the micro LEDs, recognizing the end of the arrangement of normal micro LEDs, and updating the micro LED map accordingly.
18. The micro LED luminescence inspection apparatus according to claim 1, wherein the micro LEDs are allocated within a predetermined range determined according to a predetermined luminous energy intensity characteristic and a predetermined emission wavelength characteristic.
19. The micro LED luminescence inspection apparatus according to claim 1, further comprising: and a filter optical axis inclination angle drive mechanism including a reception unit for an inclination angle control signal for controlling inclination of the optical filter with respect to the optical axis of the optical path, wherein the optical filter having the predetermined optical wavelength band is a dielectric thin film optical filter manufactured by using a wavelength longer than a center value of a predetermined wavelength range as a half value of a filter transmittance, and the inclination angle of the optical filter with respect to the optical axis direction is configured to be capable of adjusting the half value of the filter transmittance to the center value of the predetermined wavelength range.
20. The micro LED luminescence inspection apparatus according to claim 19, wherein the control section of the control apparatus of the micro LED luminescence inspection apparatus according to claim 1 generates a control signal instructing a filter driving mechanism to select a thin film optical filter having a wavelength longer than a center value of a predetermined wavelength range as a half value of a filter transmittance, the filter driving mechanism and the filter optical axis inclination angle driving mechanism and the control apparatus being configured to be capable of bidirectional communication via a 1 st communication network,
the control device and the image processing device are configured to be capable of bidirectional communication via a 2 nd communication network,
the control device is configured to be able to acquire the light intensity of the predetermined unit image from the image processing device via a 2 nd communication network, and the control unit of the control device is configured to be able to generate the tilt angle control signal, and configured to be able to transmit the tilt angle control signal to the filter optical axis tilt angle driving mechanism via the 1 st communication network, and the tilt angle of the optical filter is configured such that a difference from a half value of a filter transmittance at a center value of the predetermined wavelength range with respect to the optical axis direction is within a predetermined threshold value.
21. The micro LED luminescence inspection apparatus of claim 1, wherein the step-wise smoothing of the light intensity is performed by moving average between adjacent pixels of the light intensity pixel map.
22. The micro LED luminescence inspection apparatus according to claim 1, wherein the luminescence wavelength of the micro LEDs superimposed on the micro LEDs is smoothed by moving average between adjacent micro LEDs.
23. The micro LED luminescence inspection apparatus according to claim 1, wherein the image pickup section further comprises an image sensor tilt angle driving mechanism including a receiving section for an image sensor tilt angle control signal for controlling the image sensor tilt angle with respect to the optical axis of the optical path, and an actuator for focusing, the control device and the image processing device are configured to be able to communicate via respective communication sections, and the control section of the control device is configured to be able to generate the image sensor tilt angle control signal and to be able to transmit the image sensor tilt angle control signal to the image sensor tilt angle driving mechanism via the communication section,
The control device drives the image sensor optical axis inclination angle drive mechanism and the actuator in the following manner: the light intensity of the light intensity pixel map acquired from the image processing apparatus via the communication unit is adjusted at a predetermined contrast, and focusing is performed by the adjusted stepwise light intensity.
24. The micro LED lighting inspection apparatus according to claim 1, wherein the image processing apparatus further includes an image display device, and generates a two-dimensional map of the light intensity characteristics and the light emission wavelengths of the plurality of micro LEDs, and displays the map on the image display device.
25. The micro LED light emission inspection apparatus according to claim 1, wherein the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection apparatus, and the filter driving mechanism and the control device are configured to be capable of communicating via a transmission path, and the control device and the image processing apparatus are configured to be capable of bidirectional communication via a communication path,
the control unit includes a module for executing the following steps: a micro LED lighting step of lighting a micro LED by the power supply mechanism while starting processing by the control unit; and
A first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
a step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LED without the optical filter;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
the filter driving mechanism further includes a module for executing a 2 nd filter moving step of placing the optical filter in an optical path upon receiving a signal for placing the optical filter in the optical path from the control unit via the transmission path,
the control unit further includes a module for executing a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal and transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path when the control unit receives the 2 nd imaging start instruction notification while waiting for a 2 nd imaging start instruction which is a final process of the 2 nd filter movement instruction step,
The image processing device also comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
a step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LEDs with the optical filter;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter;
an emission wavelength calculation step of determining, in the micro LED inspection unit, an emission wavelength of the micro LED using a predetermined emission wavelength calculation expression of the micro LED, subsequent to the previous step; and
and a micro LED emission wavelength data output step of outputting the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus, including an external connection path for outputting the micro LED inspection data and a data output unit.
26. The micro LED light emission inspection apparatus according to claim 5 or 6, wherein the light source is a wavelength light source of a known wavelength of light having a light wavelength variable mechanism of the light source, the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection apparatus, the micro LED light emission inspection apparatus is configured to be capable of communicating between the filter driving mechanism and the control apparatus via a transmission path, and is configured to be capable of performing bidirectional communication between the control apparatus and the image processing apparatus via a communication path, and the micro LED light emission inspection apparatus is configured to be capable of performing bidirectional communication between the control apparatus and the image processing apparatus via a transmission path
The control unit includes a module for executing the following steps: an optical wavelength initialization step of updating a set value of an optical wavelength of the light source to an initial value by the variable mechanism at the same time as the control unit starts processing;
a calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the updated light source of the known light wavelength by the power supply mechanism;
a first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of receiving a signal for selecting a state where the optical filter is not present in the optical path by the filter driving mechanism via a transmission path between the filter driving mechanism and the control device, removing the optical filter from the optical path,
The control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
the image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
A step subsequent to the above step, in which the unit image volume identification unit identifies the unit image volume of the calibration light source light based on the predetermined criterion by regarding the calibration light source light as light emission of a micro LED based on the light intensity pixel map, generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, and further identifies a calibration light source map as the micro LED map, and the micro LED identification unit generates the micro LED mapping data to be considered as the calibration light source map based on the unit image volume, stores the micro LED mapping data in the memory, and determines the light energy intensity of the micro LED using the predetermined light energy intensity calculation formula based on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement without the optical filter which is regarded as a calibration light source for the micro LED to emit light;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
the filter driving mechanism further comprises a module for executing the following steps: a 2 nd filter movement instruction step of, when the control unit waiting for notification of a 2 nd imaging start instruction receives the 2 nd imaging start instruction subsequent to the above step, generating a signal for arranging the optical filter on an optical path based on the start instruction, transmitting the signal to the filter drive mechanism via the transmission path, and waiting for another process; and
a 2 nd filter moving step of placing the optical filter in an optical path by the filter driving mechanism receiving a signal for placing the optical filter in the optical path from the control unit via the transmission path;
the control unit further includes a module for executing a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal and transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path when the control unit receives the 2 nd imaging start instruction notification while waiting for a 2 nd imaging start instruction which is a final process of the 2 nd filter movement instruction step,
The micro LED luminescence inspection device comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
a step subsequent to the above step, in which the unit image volume recognition unit regards the calibration light source light as light emission of a micro LED based on the light intensity pixel map, specifies a unit image volume of the calibration light source light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further, the micro LED recognition unit generates the micro LED mapping data regarded as the calibration light source mapping based on the unit image volume, stores the micro LED mapping data in the memory, determines the light energy intensity of the micro LED based on the light intensity map on the micro LED map by using the predetermined light energy intensity calculation formula, and measures the light intensity with a filter, storing the filtered light intensity in the memory within the image processing apparatus as the light energy intensity value in the configuration with the optical filter regarded as a calibration light source of the micro LED light emission;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter as the calibration light source from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter from the light energy intensity value of the calibration light source with the arrangement of the optical filter and the light energy intensity value in the arrangement of the micro LED without the optical filter;
a step subsequent to the above step of storing, in the micro LED inspection section, a ratio of the known light source wavelength to the light intensity in the memory;
a light source wavelength updating step of updating a set value of a light wavelength of the light source by a predetermined increment value;
a repeated determination step of checking whether or not the updated light wavelength of the light source exceeds a predetermined boundary value, and if not, returning to the calibration light source lighting step, and if so, entering a lookup table creation step; and
A lookup table making step of making a lookup table from a set of a plurality of ratios of the wavelength to the light intensity stored in the memory by the repeating operation, and storing the lookup table in the memory.
27. The optical filter inspection apparatus according to claim 10 or 11, wherein the control unit further includes a CPU and a memory for controlling the optical filter inspection apparatus, the optical filter inspection apparatus for an optical filter used in the micro LED light emission inspection apparatus is configured to be capable of communicating between the filter driving mechanism and the control apparatus via a transmission path and to be capable of bidirectional communication between the control apparatus and the image processing apparatus via a communication path, and the control unit is configured to be capable of bidirectional communication with the optical filter inspection apparatus for an optical filter used in the micro LED light emission inspection apparatus
The control unit includes a module for executing the following steps: an optical wavelength initialization step of updating a set value of an optical wavelength of the light source to an initial value by the variable mechanism at the same time as the control unit starts processing;
a calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the updated light source of the known light wavelength by the power supply mechanism;
A first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
the filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
a step subsequent to the above step, in which the unit image volume recognition unit regards the reflected light from the calibration light source as light emission of a micro LED based on the light intensity pixel map, specifies a unit image volume (referred to as a reflector, the same applies in this paragraph) of the reflected light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further regards a reflector map as the micro LED map, generates the micro LED mapping data regarded as the reflector map based on the unit image, stores the micro LED mapping data in the memory, and determines the light intensity of the micro LED based on the light intensity map on the micro LED map by using the predetermined light intensity calculation formula, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the light energy intensity value in the arrangement without the optical filter, which is regarded as the reflected light of the light emission of the micro LED;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
the filter driving mechanism further comprises a module for executing the following steps: a 2 nd filter movement instruction step of, when the control unit waiting for notification of a 2 nd imaging start instruction receives the 2 nd imaging start instruction subsequent to the above step, generating a signal for arranging the optical filter on an optical path based on the start instruction, transmitting the signal to the filter drive mechanism via the transmission path, and waiting for another process; and
a 2 nd filter moving step in which the filter driving mechanism receives a signal for arranging the optical filter in an optical path from the control unit via the transmission path, and arranges the optical filter in the optical path; and is
The optical filter inspection device comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
A step subsequent to the above step, in which the unit image volume recognition unit regards the reflected light from the calibration light source as light emission of a micro LED based on the light intensity pixel map, specifies a unit image volume (referred to as a reflector, the same applies in this paragraph) of the reflected light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further regards a reflector map as the micro LED map, and in the micro LED recognition unit generates the micro LED mapping data regarded as the reflector map based on the unit image volume, stores the micro LED mapping data in the memory, and determines the light intensity of the micro LED based on the light intensity map on the micro LED map by using the predetermined light intensity calculation formula, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the light energy intensity value in the arrangement with the optical filter regarded as the reflected light of the light emission of the micro LED;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter as the reflected light of the calibration light source from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter from the light energy intensity value of the calibration light source with the arrangement of the optical filter and the light energy intensity value with the arrangement of the optical filter;
a step subsequent to the above step of storing, in the micro LED inspection section, a ratio of the known light source wavelength to the light intensity in the memory;
a light source wavelength updating step of updating a set value of a light wavelength of the light source by a predetermined increment value;
a repeated determination step of checking whether or not the updated light wavelength of the light source exceeds a predetermined boundary value, and if not, returning to the calibration light source lighting step, and if so, entering a lookup table creation step; and
A lookup table making step of making a lookup table from a set of a plurality of ratios of the wavelength to the light intensity stored in the memory by the repeating operation, and storing the lookup table in the memory.
28. The micro LED light emission inspection apparatus according to claim 5 or 6, which is applied to claim 5, 6 or 12, wherein the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection apparatus, the filter driving mechanism and the control device are configured to be communicable via a transmission path, and the control device and the image processing apparatus are configured to be communicable bidirectionally via a communication path,
the control unit includes a module for executing the following steps: a micro LED lighting step of lighting a micro LED by the power supply mechanism while starting processing by the control unit; and
a first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification of a first image pickup;
The filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
the image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
A step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LED without the optical filter;
the control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a 2 nd imaging start instruction,
The filter driving mechanism further includes a module that executes a 2 nd filter moving step, the 2 nd filter moving step being a step in which the filter driving mechanism receives a signal for arranging the optical filter in an optical path from the control unit via the transmission path, and arranges the optical filter in the optical path;
the control unit further includes a module for executing a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal when the control unit receives the 2 nd imaging start instruction notification while waiting for a 2 nd imaging start instruction which is a final process of the 2 nd filter shift instruction step, and executing the 2 nd imaging start instruction step after transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path,
the micro LED luminescence inspection device comprises a module for executing the following steps: a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 2 nd image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
A step subsequent to the above step, in which the unit image volume recognition unit specifies the unit image volume of the light emission from the light intensity pixel map based on the predetermined criterion, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, in the micro LED recognition unit, specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and the optical energy intensity of the micro LEDs is determined by the predetermined optical energy intensity calculation formula based on the optical intensity on the light intensity map on the micro LED map, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LEDs with the optical filter;
a step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter;
A lookup table reference type emission wavelength determination step of determining, in the micro LED inspection unit, an emission wavelength of the micro LED by referring to the lookup table after the above step; and
and a micro LED emission wavelength data output step of outputting the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus, including an external connection path and a data output unit for outputting the arrangement design data of the micro LEDs.
29. The micro LED light emission inspection device according to claim 20, wherein the light source of the micro LED light emission inspection device is a wavelength light source having a known light wavelength of a light wavelength variable mechanism of the light source, the micro LED light emission inspection device further includes a CPU and a memory in the control unit,
the control unit includes a module for executing the following steps: a center wavelength setting step of updating a set value of the optical wavelength of the light source to a center wavelength of the bandwidth by the variable mechanism at the same time when the control unit starts processing;
a center wavelength light source lighting step of updating the light wavelength of the light source to the center wavelength by the variable mechanism and lighting the wavelength light source of the light wavelength by the power supply mechanism;
A first filter movement instruction step in which, after the previous step, the control unit generates a signal for selecting a state in which the optical filter is not present in the optical path, and immediately after the signal is transmitted to the filter drive mechanism via the transmission path, the control unit starts waiting for a start instruction notification for a first imaging;
the filter driving mechanism includes a module that executes an initial filter moving step of removing the optical filter from the optical path by the filter driving mechanism receiving a signal for selecting a state where the optical filter is not present in the optical path via a transmission path between the filter driving mechanism and the control device,
the control unit further includes a module for executing a 1 st imaging start instruction step of generating a 1 st imaging start instruction signal by the control unit when the control unit receives a first imaging start instruction notification while waiting for a first imaging start instruction notification, which is a final process of the 1 st imaging filter movement instruction step, and immediately starting waiting for a 2 nd imaging filter movement instruction after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
a step subsequent to the above step, in which the unit image volume identification unit regards the calibration light source light as light emission of a micro LED from the light intensity pixel map, specifies a unit image volume of the calibration light source light based on the predetermined criterion, further generates unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further regards the calibration light source map as the micro LED map, and the micro LED identification unit generates the micro LED mapping data regarded as the calibration light source map from the unit image volume, stores the micro LED mapping data in the memory, and determines the light energy intensity of the micro LED using the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, measuring the intensity of the unfiltered light, storing the intensity of the unfiltered light in the memory within the image processing device as the intensity of the luminous energy in the arrangement of the unfiltered light for the calibration light source illuminant considered as a micro LED;
The control unit further includes a module for executing a 2 nd filter movement instruction step of, when the control unit waiting for the 2 nd filter movement instruction receives the 2 nd filter movement instruction, generating a signal for arranging the optical filter on an optical path based on the instruction, transmitting the signal to the filter driving mechanism via the transmission path, and then waiting for a subsequent imaging start instruction,
the filter driving mechanism further includes a module that executes a 2 nd filter moving step, the 2 nd filter moving step being a step in which the filter driving mechanism receives a signal for arranging the optical filter in an optical path from the control unit via the transmission path, and arranges the optical filter in the optical path;
the control unit further includes a module for executing a subsequent image capture start instruction step of generating the subsequent image capture start instruction signal when the control unit receives the subsequent image capture start instruction notification while waiting for a subsequent image capture start instruction, and executing the subsequent image capture start instruction step after transmitting the subsequent image capture start instruction signal to the image processing apparatus via the communication path,
The image processing device comprises a module for executing the following steps: a subsequent imaging step of receiving the video signal from the imaging device when the image processing device receives the subsequent imaging start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing device;
a step subsequent to the above step, in which the unit image volume recognition unit regards the calibration light source light as light emission of micro LEDs from the light intensity pixel map, specifies a unit image volume of the calibration light source light based on a predetermined criterion, further generates the unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing device, further specifies the calibration light source light regarded as light emission of micro LEDs from the unit image volume as micro LEDs, generates the micro LED mapping data mapped onto the pixel map, stores the micro LED mapping data in the memory in the image processing device, and uses the predetermined optical energy intensity calculation formula based on the light intensity map on the micro LED map, determining the luminous energy intensity of the calibration light source illuminant regarded as the micro LED, measuring the light intensity of a filter, and storing the light intensity of the filter in the memory in the image processing device as the luminous energy intensity value in the arrangement of the calibration light source with the optical filter;
A step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter; and
an appropriate filter angle determination step of determining whether or not the ratio of the light intensities is in the vicinity of 0.5 within a predetermined determination range based on a predetermined determination condition,
if the determination condition is negative, a signal for driving a filter angle changing step is generated for the filter optical axis tilt angle driving means, the signal is transmitted to the filter optical axis tilt angle driving means, control is branched to a module for executing the filter angle changing step, the subsequent imaging start instruction notification is transmitted to the control unit via the communication unit, the subsequent imaging start instruction notification is transmitted to the control device, control is returned to the module for executing the subsequent imaging step of the control unit, and the subsequent processing is circulated,
If the determination condition is yes, branching to a step of storing the filter angle in the memory, recording the filter angle, and ending the loop processing;
here, the filter optical axis inclination angle driving mechanism includes a module that executes a step of varying the filter angle in such a manner that the filter angle is varied within a predetermined range.
30. The micro LED luminescence inspection apparatus according to claim 25, 26, 28 or 29, further comprising a module further comprising a communication path with a manufacturing process management computer and a manufacturing data input unit, and executing a manufacturing instruction receiving step of receiving a manufacturing instruction including a manufacturing condition from the manufacturing process management computer via the communication path.
31. The micro LED luminescence inspection apparatus of any one of claims 25, 26, or 28 to 30, further comprising a module further provided with a communication path connected to a manufacturing process management computer and a manufacturing data input, and performing a manufacturing data output step of outputting manufacturing process data including the calibration data and other progress data to the manufacturing process management computer via the communication path.
32. The micro LED light emission inspection apparatus according to claim 1, wherein the control device further includes a CPU and a memory for controlling the micro LED light emission inspection apparatus, and is configured such that the filter driving mechanism and the control device can communicate with each other via a transmission path, and the control device and the image processing apparatus can communicate with each other bidirectionally via a communication path, and the control unit of the control device includes,
a module that performs a micro LED lighting step of lighting a micro LED by the power supply mechanism;
a module that executes a first filter moving step of generating a signal for selecting a state in which the optical filter is not present in the optical path, and driving the filter driving mechanism via the transmission path so as to select the state in which the optical filter is not present in the optical path;
a module that executes a 1 st imaging start instruction step of receiving a first imaging start instruction notification, generating a 1 st imaging start instruction signal, and starting waiting for a 2 nd filter movement instruction immediately after transmitting the 1 st imaging start instruction signal to the image processing apparatus via the communication path;
A module that executes a 2 nd filter moving step, the 2 nd filter moving step receiving a 2 nd filter moving instruction, generating a signal for arranging a predetermined optical filter in an optical path based on the instruction, and driving the filter driving mechanism via the transmission path so as to arrange the optical filter in the optical path; and
a module that executes a 2 nd imaging start instruction step of generating a 2 nd imaging start instruction signal and transmitting the 2 nd imaging start instruction signal to the image processing apparatus via the communication path when receiving a 2 nd imaging start instruction notification;
the image processing device comprises a module for executing the following steps: a 1 st image capturing step of receiving the video signal from the image capturing apparatus when the image processing apparatus receives the 1 st image capturing start instruction signal via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on the pixel map on the image data frame stored in the image processing apparatus, and storing the light intensity pixel map in the memory in the image processing apparatus; and
A step subsequent to the above step, in which the unit image volume recognition unit specifies a unit image volume of the light emission based on the predetermined criterion from the light intensity pixel map, and further generates unit image volume mapping data for the pixel map, and stores the unit image volume mapping data in the memory in the image processing apparatus, and further, the micro LED recognition unit specifies a plurality of micro LEDs arranged in an array from the unit image volume, and maps the corresponding micro LEDs onto the pixel map, and generates the micro LED mapping data, and stores the micro LED mapping data in the memory, and determines the light energy intensity of the micro LEDs by the predetermined light energy intensity calculation formula based on the light intensity map on the micro LED map, measuring the intensity of light without a filter, and storing the intensity of light without a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LED without the optical filter;
a 2 nd image capturing step of receiving the video signal from the image capturing apparatus when receiving the start instruction signal for the 2 nd image capturing via the communication path, generating the light intensity pixel map in which the stepwise light intensities measured in the respective pixels are superimposed on a pixel map on an image data frame, and storing the light intensity pixel map in the memory in the image processing apparatus;
A step subsequent to the above step, in which the unit image volume recognition unit specifies a unit image volume of the light emission based on the predetermined criterion from the light intensity pixel map, generates the unit image volume mapping data for the pixel map, stores the unit image volume mapping data in the memory in the image processing apparatus, further specifies a plurality of the micro LEDs arranged in an array from the unit image volume, generates the micro LED mapping data mapped to the pixel map, stores the micro LED mapping data in the memory in the image processing apparatus, and determines the light energy intensity of the micro LED by using the predetermined light energy intensity calculation formula on the basis of the light intensity on the light intensity map on the micro LED map, measuring the intensity of light with a filter, and storing the intensity of light with a filter in the memory in the image processing apparatus as the intensity of light energy in the arrangement of the micro LEDs with the optical filter;
a step subsequent to the above step, in which the micro LED inspection unit reads out the light energy intensity value in the arrangement of the micro LED with the optical filter from the memory in the image processing apparatus, reads out the light energy intensity value in the arrangement of the micro LED without the optical filter corresponding to the micro LED from the memory in the image processing apparatus, and calculates a ratio of the light intensity without the filter to the light intensity with the filter based on the light energy intensity value in the arrangement of the optical filter and the light energy intensity value in the arrangement of the optical filter without the optical filter;
An emission wavelength calculation step of determining, in the micro LED inspection unit, an emission wavelength of the micro LED using a predetermined emission wavelength calculation expression of the micro LED, subsequent to the previous step; and
and a micro LED emission wavelength data output step of outputting the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing device, including an external connection path for outputting the arrangement product data of the micro LEDs and a data output unit.
33. A micro LED manufacturing apparatus comprising the micro LED luminescence inspection apparatus according to claim 1, 25 or 32, characterized in that: the image processing apparatus of the micro LED light emission inspection apparatus further includes a manufacturing condition data output unit that converts predetermined data into a predetermined data format from at least one of the micro LED map data including at least one of the substrate whole image, 1 or a plurality of the unit image volume map data, the light intensity characteristic corresponding thereto, the light emission wavelength characteristic, and the range, and outputs the converted data as manufacturing condition data.
34. A micro LED manufacturing apparatus comprising the micro LED luminescence inspection apparatus according to claim 33, characterized in that: the image processing device of the micro LED light emission inspection device further outputs a two-dimensional map of the emission wavelength.
35. The optical filter inspection apparatus for a micro LED luminescence inspection apparatus according to claim 7, wherein the reflector is composed of a metal film containing chromium as a main component.
36. A method for using a micro LED lighting inspection apparatus incorporated in a fully automatic manufacturing process, wherein the micro LED lighting inspection method incorporated in the fully automatic manufacturing process is to use the micro LED lighting inspection apparatus according to claim 1, comprising the steps of:
a product information acquisition stage, which receives the geometric information of the substrate containing the alignment mark information, the geometric information of the micro LED and the geometric information of the micro LED array;
a manufacturing management area setting stage, executed subsequently, for setting a manufacturing management area for identifying and managing local deviations and/or anomalies in product quality on the substrate according to 1 or more of the geometric information;
a notification phase of acceptable inspection, executed subsequently, of notifying, via the network device, a state of acceptable inspection to a line control computer connected through the network device;
A subsequently performed manufacturing information receiving stage that receives micro LED wafer manufacturing information from the line control computer;
carrying the wafer on an inspection table in a wafer carrying stage executed subsequently;
a manufacturing management area mapping stage, executed subsequently, for mapping the manufacturing management area to the substrate by taking an overall image of the substrate by means of an image processing device;
a micro LED mapping stage, wherein the micro LED arranged on the substrate is mapped to an image frame generated in an image processing device through the image processing device;
a micro LED characteristic measuring stage which is executed subsequently, wherein the micro LED chip is lightened and the luminous intensity and the luminous wavelength are measured through the image processing device;
a micro LED clustering step of adding, by the image processing apparatus, category information to the micro LED map information, the category information including an abnormality classification classified by a matrix of the emission intensity and the emission wavelength on the basis of the micro LED characteristics according to a predetermined classification condition, and classifying all the micro LED chips;
a manufacturing process state determination step of identifying a micro LED manufacturing process state for the manufacturing management area by overlaying the micro LED to which the category information is attached on the manufacturing management area map by the image processing apparatus;
A subsequently executed inspection result transmitting stage of transmitting, by the image processing apparatus, the grouping information and the manufacturing process state to the production line control computer via the network apparatus; and
a check end notification phase is subsequently executed to transmit a check end notification to the production line control computer via the network device as a check end state.
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