CN115579446A - Light emitting module and light emitting device - Google Patents

Abstract

The application provides a light-emitting module and have its illuminator, this light-emitting module includes: the substrate is provided with a first surface and a second surface which are positioned on two opposite sides, the first surface is provided with the light-emitting chip and the first optical sensor, the light-transmitting protective layer is arranged on the first surface and covers the light-emitting chip and the first optical sensor, the light-transmitting protective layer is used for guiding part of light emitted by the light-emitting chip to the first optical sensor, the first optical sensor is used for detecting the light emitted by the light-emitting chip, and the light-emitting chip is adjusted to emit light according to the result detected by the first optical sensor. The application provides a light emitting module is through setting up the light that each luminescence chip of first optical sensor real-time supervision sent, and each luminescence chip will carry out differentiation adjustment in real time according to the light detection result to guarantee the homogeneity of luminous demonstration.

Description

Light emitting module and light emitting device

Technical Field

The present application belongs to the field of light emitting display technology, and more particularly, to a light emitting module and a light emitting device.

Background

A light-emitting diode (LED) is a semiconductor light source, and the brightness of the LED increases with the increase of the operating current. The light of the mixed blue LED chip, the light of the red LED chip and the light of the green LED chip generate white light, but the light attenuation problem is generated after each LED chip is lightened for a period of time, and the light attenuation amplitude of each LED chip is different, so that the white light generated in a mixed light mode has a color cast phenomenon.

The LED chips in the existing LED lamp panel are controlled to emit light by writing a set of fixed color temperature compensation curves in the LED lamp panel before leaving a factory through a driving chip, and because of the influence of the slope difference of the color temperature compensation curves, the light color difference can be generated on the same lamp panel, and simultaneously, because the amplitude of the light attenuation of each LED chip on the lamp panel after being lighted for a period of time is different, the uniformity of the light emitting picture of the LED lamp panel is difficult to be effectively controlled under the action of the set of fixed color temperature compensation curves.

Disclosure of Invention

An object of the application is to provide a light emitting module and a light emitting device to solve the technical problem that the LED light emitting display uniformity is poor in the prior art.

To achieve the above object, in a first aspect, the present application provides a light emitting module, including: the substrate is provided with a first surface and a second surface which are positioned on two opposite sides, the first surface is provided with the light emitting chip and the first optical sensor, the light transmitting protective layer is arranged on the first surface and covers the light emitting chip and the first optical sensor, the light transmitting protective layer is used for guiding part of light emitted by the light emitting chip to the first optical sensor, the first optical sensor is used for detecting the light emitted by the light emitting chip, and the light emitting chip is used for being adjusted to emit light according to a result detected by the first optical sensor.

Optionally, the at least one light emitting chip includes a blue light chip, a red light chip, and a green light chip, and the first optical sensor is a color sensor or an illumination sensor.

Optionally, the optical sensor further includes a reflective layer, the reflective layer covers the light-transmitting protective layer, the reflective layer is provided with a light exit hole, the light exit hole exposes a light exit region on the upper surface of the light-transmitting protective layer, the upper surface of the light-transmitting protective layer is far away from the first surface, the light exit region exposes the light-emitting chip, and the reflective layer shields the first optical sensor.

Optionally, the light-emitting chip further comprises a second optical sensor, the second optical sensor is arranged on the first surface and covered by the light-transmitting protection layer, the reflection layer is arranged between the second optical sensor and the first optical sensor, the second optical sensor is used for detecting the light intensity of the external environment, the light-emitting chip is used for being adjusted to emit light according to the result detected by the second optical sensor, and the thickness of the reflection layer is greater than or equal to 0.15mm.

Optionally, a distance from a sensing surface of the first optical sensor far away from the first surface to an upper surface of the light-transmitting protection layer far away from the first surface is greater than or equal to 0.15mm.

Optionally, a light exit surface of the light emitting chip with the highest height, which is far away from the first surface, of the at least one light emitting chip is not higher than a sensing surface of the first optical sensor, which is far away from the first surface.

Optionally, the light emitting chips are vertical structure light emitting diode chips or horizontal structure light emitting diode chips, and a height difference between the light exit surface of the light emitting chip with the highest height among the at least one light emitting chip and the sensing surface of the first optical sensor is greater than or equal to 0.05mm.

Optionally, the first surface is concavely provided with a groove, and the at least one light emitting chip is arranged in the groove.

Optionally, a distance from the light emitting chip closest to the first optical sensor in the at least one light emitting chip is greater than or equal to 0.15mm.

In a second aspect, the present application further provides a light emitting device, where the light emitting device includes the light emitting module and a driving chip provided in the first aspect of the present application, the driving chip is electrically connected to the first optical sensor and the light emitting chip, and the driving chip is configured to adjust light emission of the light emitting chip according to a result detected by the first optical sensor; or the driving chip is electrically connected with the first optical sensor, the second optical sensor and the light-emitting chip, and the driving chip is used for adjusting the light emission of the light-emitting chip according to the result detected by the first optical sensor and the result detected by the second optical sensor.

Compared with the prior art, the light emitting module that this application first aspect provided is through setting up the light that each luminescence chip of first optical sensor real-time supervision sent, and each luminescence chip will carry out differentiation adjustment in real time according to the light detection result to guarantee the homogeneity of luminous demonstration.

The light emitting device that this application second aspect provided is owing to adopted the light emitting module that this application first aspect provided, and this light emitting module sets up the light that first optical sensor real-time supervision luminescence chip sent, and driver chip carries out differentiation according to the light detection result in real time to the giving off light of luminescence chip and adjusts for light emitting device's luminous demonstration homogeneity is better.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic top view illustrating a light emitting module according to an embodiment of the present disclosure;

FIG. 2 isbase:Sub>A schematic view of the cross-sectional structure taken along the line A-A in FIG. 1;

fig. 3 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the present disclosure;

fig. 4 is a schematic cross-sectional view illustrating a light emitting module according to another embodiment of the present disclosure;

fig. 5 is a schematic cross-sectional view illustrating a light emitting module according to still another embodiment of the present disclosure;

fig. 6 is a schematic top view illustrating a light emitting module according to still another embodiment of the present disclosure.

Wherein, in the figures, the various reference numbers:

1-a substrate; 11-a groove; 2-a light emitting chip; 2 a-a light exit surface; 21-a blue light chip; 22-red light chip; 23-green chip; 3-a first optical sensor; 3 a-a sensing surface; 4-a light-transmitting protective layer; 41-light outlet area; 42-light entering area; 43-a boss; 5-a light-shielding layer; 51-light-emitting holes; 52-light entrance hole, 6-second optical sensor.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be constructed in operation as a limitation of the application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to fig. 6, a light emitting module and a light emitting device provided by the first aspect of the embodiment of the present application will be described.

The first aspect of the embodiment of the present application provides a light emitting module, including: the light-emitting device comprises a substrate 1, at least one light-emitting chip 2, a first optical sensor 3 and a light-transmitting protective layer 4. The substrate 1 has a first surface and a second surface, the first surface and the second surface are respectively located on two opposite sides of the substrate 1, wherein the first surface is provided with a light emitting chip 2 and a first optical sensor 3, and a light-transmitting protection layer 4 is also arranged on the first surface and covers the light emitting chip 2 and the first optical sensor 3. The light emitting chip 2 is used for emitting light after being electrified, the light-transmitting protective layer 4 is used for guiding part of the light emitted by the light emitting chip 2 to the first optical sensor 3, the first optical sensor 3 is used for detecting the light emitted by the light emitting chip 2, and the light emitting chip 2 is used for being adjusted to emit light according to the result detected by the first optical sensor 3.

Compared with the prior art, the light emitting module that this application first aspect provided, through setting up the light that first optical sensor 3 real-time supervision luminescence chip 2 sent to carry out differentiation regulation to luminescence chip 2 in real time according to the light detection result, thereby guarantee the homogeneity that the light emitting module light-emitting shows.

In an embodiment of the present application, please refer to fig. 2, two opposite sides of the substrate are an upper side and a lower side, and the first surface and the second surface correspond to the upper surface and the lower surface of the substrate 1, respectively. The substrate 1 is a PCB (Printed Circuit Board) Board; it is understood that the substrate 1 may be a ceramic substrate, a PLCC (Plastic Leaded Chip Carrier) substrate, or an EMC (Epoxy Molding Compound) package substrate in other embodiments.

In an embodiment of the present application, referring to fig. 1 and fig. 2, the at least one light emitting chip 2 includes a blue light emitting chip 21, a red light emitting chip 22, and a green light emitting chip 23, i.e., the blue light emitting chip 21 is a light emitting chip emitting blue light, the red light emitting chip 22 is a light emitting chip emitting red light, and the green light emitting chip 23 is a light emitting chip emitting green light. The blue light chip 21, the red light chip 22 and the green light chip 23 constitute a light emitting unit to realize mixing of three primary colors into white light. It is understood that there may be only one light emitting chip in other embodiments. Optionally, the light emitting chip 2 is a Light Emitting Diode (LED) which uses a solid semiconductor as a light emitting material, and has the characteristics of energy saving, environmental protection, and good color rendering and response speed. Optionally, the blue light chip 21, the red light chip 22 and the green light chip 23 are arranged in parallel in a linear manner. Referring to fig. 6, in other embodiments, the blue chips 21, the red chips 22 and the green chips 23 may be distributed in a delta shape, which is not limited herein.

In an embodiment of the present application, please refer to fig. 2, the first optical sensor 3 is disposed close to the light emitting chip 2, so that the first optical sensor 3 can receive as much light as possible from the light emitting chip 2 and reduce the volume of the light emitting module. The first optical sensor 3 is a color sensor. The color sensor is used for detecting the proportion and the actual light intensity of color light in the light emitted by each light-emitting chip 2, and when the color sensor detects that the proportion and the intensity of the color light emitted by at least one light-emitting chip 2 do not accord with preset values, the driving chip used for controlling the light-emitting of the light-emitting chip 2 adjusts the light-emitting of the light-emitting chip 2 according to the result detected by the first optical sensor 3. It is understood that, in other embodiments, the first optical sensor may also be another optical sensor, such as an illumination sensor, for detecting the illumination intensity, and when the illumination sensor detects that the intensity of the light emitted from the light emitting chip 2 does not meet the preset value, the driving chip will adjust the light emission of the light emitting chip 2 according to the result detected by the first optical sensor 3.

In an embodiment of the present application, please refer to fig. 2, the light-transmitting protection layer 4 is a potting silica gel layer. The light-emitting module is characterized in that the outer surfaces of the light-emitting chip 2 and the first optical sensor 3 are coated with a light-transmitting protective layer 4, and the light-transmitting protective layer 4 can guide part of light emitted by the light-emitting chip 2 to the first optical sensor 3 and can also carry out sealing and waterproof protection on the light-emitting chip 2 and the first optical sensor 3. The encapsulation silica gel layer has good waterproof, moistureproof and ageing resistance, and is a good transparent protective layer. In other embodiments, the light-transmitting protective layer 4 may also be made of materials with high transparency, such as epoxy resin, polyurethane, etc., which are not described herein again.

In an embodiment of the present application, referring to fig. 2, the light emitting module further includes a reflective layer 5, the reflective layer 5 covers the light-transmissive protection layer 4, and the reflective layer 5 is used for reflecting light emitted from the light emitting chip 2 to the first optical sensor 3 and preventing light leakage of the light emitting module. The reflective layer 5 is provided with a light exit hole 51, a light exit area 41 is formed on the upper surface of the light-transmitting protective layer 4 corresponding to the light exit hole 51, that is, the light exit hole 51 exposes the light exit area 41 on the upper surface of the light-transmitting protective layer 4, the upper surface of the light-transmitting protective layer 4 is a side surface of the light-transmitting protective layer 4 far away from the first surface, the light exit area 41 exposes the light-emitting chip 2, and the reflective layer 5 shields the first optical sensor 3. Alternatively, the light exiting region 41 is disposed corresponding to the light emitting chip 2, and the light exiting hole 51 is disposed such that the light exiting region 41 remains bare, i.e. the surface of the light exiting region 41 is not provided with other light blocking components for the light emitted by the light emitting chip 2 to exit to the external environment. Different from the light emergent area 41, the reflective layer 5 shields the first optical sensor 3, that is, the upper surface of the light-transmitting protective layer 4 above the first optical sensor 3 is covered by the reflective layer 5, and the reflective layer 5 can reflect the light emitted by the light-emitting chip 2 to the first optical sensor 3, and can also be used for blocking the light of the external environment from irradiating the first optical sensor 3, so as to avoid the interference caused by the light of the external environment entering the first optical sensor 3. In the present embodiment, the upper side of the first optical sensor 3 is covered by the reflective layer 5. Through experimental tests, when the reflective layer 5 shields the first optical sensor 3, when the incident luminous flux of the external environment light is 200% of the luminous flux of the light-emitting chip 2, the total reflection luminous flux of the light-emitting chip 2 received by the first optical sensor 3 is close to the incident luminous flux of the external environment light received by the first optical sensor 3; when the reflective layer 5 is not covered above the first optical sensor 3, when the incident luminous flux of the external environmental light is 35% of the luminous flux of the light emitting chip 2, the total reflected luminous flux of the light emitting chip 2 received by the first optical sensor 3 may be close to the incident luminous flux of the external environmental light received by the first optical sensor 3. In addition, the surface of the light-transmitting protection layer 4 is covered with the reflection layer 5, and the reflection layer 5 is further provided with the light-emitting hole 51, the arrangement of the light-emitting hole 51 can effectively limit the range of the light-emitting area 41, namely the range of the light-emitting surface of the light-emitting module, and the size of the light-emitting surface is positively correlated with the size of a secondary optical element, such as a secondary lens, so that the design of a smaller secondary optical element on a terminal can be realized. Test tests show that when the surface of the light-transmitting protective layer 4 is exposed and not covered with the reflecting layer 5, the light-emitting amount corresponding to the center of the light-emitting chip 2 is only 90%, and 10% of stray light exists at other positions, so that the whole light-emitting area of the light-emitting module is large; when the surface of the light-transmitting protective layer 4 is covered with the reflective layer 5, the light output amount corresponding to the center of the light-emitting chip 2 can approach 100%, and the light output area of the light-emitting module is only half of the light output area without the reflective layer 5. It is understood that, in other embodiments, the reflective layer 5 may also be configured to partially shield the first optical sensor 3, that is, a part of the upper side of the first optical sensor 3 is shielded by the reflective layer 5, and another part is exposed, and in comparison, the partially shielding manner is not completely shielded, so that the interference resistance is good.

In an embodiment of the present application, please refer to fig. 3 to 5, in consideration of that when the light emitting module is applied outdoors, the light emitting chip 2 cannot effectively develop color due to high outdoor light intensity, the light emitting module in this embodiment further includes a second optical sensor 6, the second optical sensor 6 is also disposed on the first surface of the substrate 1, and the second optical sensor 6 is also covered by the light-transmitting protection layer 4 to form protection. Optionally, the surface of the portion of the light-transmitting protective layer 4 covering the second optical sensor 6 is also covered by the reflective layer 5, the reflective layer 5 is further provided with a light inlet 52, a light inlet region 42 is formed on the upper surface of the light-transmitting protective layer 4 corresponding to the light inlet 52, that is, the light inlet 52 exposes the light inlet region 42 on the upper surface of the light-transmitting protective layer 4, the light inlet region 42 exposes the second optical sensor 6, the second optical sensor 6 is used for detecting the intensity of external environment light, for example, an ambient light sensor, and the light-emitting chip 2 is used for being adjusted to emit light according to the result detected by the second optical sensor 6. In this embodiment, the second optical sensor 6 is used to sense the external ambient light intensity, so as to adjust the light emitting chip 2, thereby achieving the function of color development under a certain light. Specifically, the light incident region 42 is disposed corresponding to the second optical sensor 6, and the light incident hole 52 is disposed such that the surface of the light incident region 42 remains bare, i.e., the surface of the light incident region 42 is not provided with other light blocking components, so that light of the external environment, such as sunlight, passes through the light-transmitting protection layer 4 and is received by the second optical sensor 6. Specifically, the light emitting chip 2, the first optical sensor 3, and the second optical sensor 6 are disposed side by side on the first surface of the substrate 1. Optionally, the light emitting chip 2, the first optical sensor 3 and the second optical sensor 6 are sequentially arranged side by side, the first optical sensor 3 is arranged close to the light emitting chip 2, and the second optical sensor 6 is arranged close to the first optical sensor 3, so as to reduce the overall size of the light emitting module. It is understood that in other embodiments, the second optical sensor 6, the light emitting chip 2 and the first optical sensor 3 may be arranged side by side in sequence, that is, the second optical sensor 6 and the first optical sensor 3 are respectively located at two sides of the light emitting chip 2. In order to avoid interference caused by the light emitted from the light emitting chip 2 being received by the second optical sensor 6, the reflective layer 5 further extends between the first optical sensor 3 and the second optical sensor 6 to space the first optical sensor 3 and the second optical sensor 6 apart, and at the same time, the reflective layer 5 also passes through the light transmissive protective layer 4 and divides the light transmissive protective layer 4. Generally, the larger the thickness of the reflective layer 5 is, the better the reflective effect and the effect of shielding ambient light are, optionally, to avoid light leakage of the light emitting module, the thickness of the reflective layer 5 is greater than or equal to 0.15mm, for example, 0.15mm, 0.2mm, 0.25mm, or 0.3mm.

In an embodiment of the present application, referring to fig. 4, a protrusion 43 is further disposed on a surface of the light incident region 42 of the light-transmissive protection layer 4, the protrusion 43 is formed by protruding the light-transmissive protection layer 4 to a side away from the first surface, and the formed protrusion 43 extends into the light incident hole 52. The convex portion 43 is used for receiving external ambient light. Optionally, the boss 43 is hemispherical.

In an embodiment of the present application, referring to fig. 2, a distance between the sensing surface 3a of the first optical sensor 3 and the upper surface of the light-transmitting protection layer 4 is greater than or equal to 0.15mm, the sensing surface 3a of the first optical sensor 3 is a side surface of the first optical sensor 3 away from the first surface, and the upper surface of the light-transmitting protection layer 4 also refers to a side surface of the first optical sensor 3 away from the first surface, for example, the side surface may be 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.4mm, or 0.5mm, so as to ensure sufficient light channel, so that a part of the light energy of the light-emitting chip 2 is smoothly reflected by the reflection layer 5 or totally reflected by the light-transmitting protection layer 4 to the sensing surface 3a of the first optical sensor 3. By setting the distance from the sensing surface of the first optical sensor 3 to the upper surface of the light-transmitting protective layer 4 to be greater than or equal to 0.15mm, it is advantageous to ensure that the light-transmitting protective layer 4 effectively guides part of the light emitted from the light-emitting chip 2 to the sensing surface of the first optical sensor 3.

In an embodiment of the present application, please refer to fig. 2, in consideration that a part of light of the light emitting chip 2 is emitted from the light emitting area 41 to the external environment, and a part of light is reflected and totally reflected to the first optical sensor 3 under the guidance of the light transmissive protective layer 4 for identification and detection, so that the light emitting surface 2a of the light emitting chip 2 with the highest height in at least one of the light emitting chips 2 is not higher than the sensing surface 3a of the first optical sensor 3, that is, in a vertical direction when the light emitting module is stably placed, the light emitting surface 2a of the light emitting chip 2 is lower than the sensing surface 3a of the first optical sensor 3 or the light emitting surface 2a of the light emitting chip 2 is flush with the sensing surface 3a of the first optical sensor 3. Here, the light exit surface 2a of the light emitting chip 2 is a side surface of the light emitting chip 2 away from the first surface. It is foreseen that when the light emitting chip 2 and the first optical sensor 3 are located on the same plane, the thickness of the light emitting chip 2 may not be higher than the thickness of the first optical sensor 3, for example, the thickness of the light emitting chip 2 is equal to the thickness of the first optical sensor 3 or the thickness of the light emitting chip 2 is smaller than the thickness of the first optical sensor 3. Optionally, the at least one light emitting chip 2 includes a blue light chip 21, a red light chip 22, and a green light chip 23, wherein the thicknesses of the blue light chip 21, the red light chip 22, and the green light chip 23 are equal and are all smaller than the thickness of the first optical sensor 3. Of course, in other embodiments, the thicknesses of the blue chip 21, the red chip 22 and the green chip 23 may be different, for example, the thickness of the red chip 22 is greater than that of the blue chip 21 and greater than that of the green chip 23, but the thickness of the red chip 22 is less than or equal to that of the first optical sensor 3. When the light emitting surface 2a of the light emitting chip 2 with the highest height in the at least one light emitting chip is lower than the sensing surface 3a of the first optical sensor 3, optionally, the light emitting chip 2 is a horizontal structure light emitting diode chip or a vertical structure light emitting diode chip, and a height difference between the light emitting surface 2a of the light emitting chip 2 with the highest height in the at least one light emitting chip and the sensing surface 3a of the first optical sensor 3 is greater than or equal to 0.05mm, so that part of the light energy of the light emitting chip 2 is smoothly reflected by the reflective layer 5 or totally reflected to the sensing surface 3a of the first optical sensor 3 by the light transmissive protective layer 4. Compared with the horizontal structure light emitting diode chip, the vertical structure light emitting diode chip has the advantages of high brightness, fast heat dissipation, small light decay and small light color drift.

In an embodiment of the present application, referring to fig. 5, a groove 11 is formed on a substrate 1, the groove 11 is formed by recessing a first surface of the substrate 1, and at least one light emitting chip 2 is disposed in the groove 11. By providing the groove 11, the light emitting chip 2 is disposed on the bottom wall of the groove 11, the first optical sensor 3 is disposed on the first surface, and the height difference between the light emitting surface 2a of the light emitting chip 2 and the sensing surface 3a of the first optical sensor 3 is further increased. Meanwhile, the arrangement of the groove 11 has the advantage that the limitation on the size of the light emitting chip 2 is reduced; for example, the thickness of the light emitting chip 2 may be smaller than the thickness of the first optical sensor 3, or the thickness of the light emitting chip 2 may be equal to the thickness of the first optical sensor 3, or even the thickness of the light emitting chip 2 is larger than the thickness of the first optical sensor 3, as long as the light emitting surface 2a of the light emitting chip 2 is not higher than the sensing surface 3a of the first optical sensor 3 by adjusting the depth of the groove 11. Therefore, the arrangement of the groove 11 can expand the range of the selection of the light emitting chip 2.

In an embodiment of the present application, a distance from the light emitting chip 2, which is closest to the first optical sensor 3, of the at least one light emitting chip 2 to the first optical sensor 3 is greater than or equal to 0.15mm, and may be, for example, 0.15mm, 0.2mm, 0.25mm, or 0.3mm. Referring to fig. 2, at least one light emitting chip 2 includes a blue chip 21, a red chip 22 and a green chip 23, wherein the green chip 23 is closest to the first optical sensor 3, that is, a distance from the green chip 23 to the first optical sensor 3 is greater than or equal to 0.15mm, so that a part of light energy of the light emitting chip 2 is smoothly reflected by the reflective layer 5 or totally reflected by the light-transmitting protective layer 4 to the sensing surface 3a of the first optical sensor 3.

In a second aspect, an embodiment of the present application further provides a light emitting device, where the light emitting device includes the light emitting module and a driving chip (not shown in the drawings) provided in the first aspect of the embodiment of the present application. The driving chip is electrically connected with the first optical sensor 3 and the light emitting chip 2, and the driving chip is used for adjusting the light emission of the light emitting chip 2 according to the result detected by the first optical sensor 3.

The light emitting device that this application embodiment second aspect provided owing to adopted the light emitting module that this application first aspect provided, this light emitting module sets up the light that 3 real-time supervision luminescence chip 2 of first optical sensor sent, and drive chip carries out differentiation according to the light detection result in real time to luminescence of luminescence chip 2 and adjusts for light emitting device's luminous display homogeneity is better.

In an embodiment of the present application, the driving chip is located on the substrate 1. Specifically, the driving chip is located on the first surface of the substrate 1. When the driving chip is located on the first surface, the light-transmitting protective layer 4 is coated on the outer surface of the driving chip at the same time. It is understood that in other embodiments, the driving chip may be located on the second surface of the substrate 1.

In an embodiment of the present application, when the light emitting module further includes the second optical sensor 6, the driving chip is electrically connected to the first optical sensor 3, the second optical sensor 6 and the light emitting chip 2, and the driving chip is configured to adjust light emission of the light emitting chip 2 according to a result detected by the first optical sensor 3 and a result detected by the second optical sensor 6, so that the light emitting chip 2 can also adjust light emission according to light intensity of an external environment.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A light emitting module, comprising: the substrate is provided with a first surface and a second surface which are positioned on two opposite sides, the first surface is provided with the light emitting chip and the first optical sensor, the light transmitting protective layer is arranged on the first surface and covers the light emitting chip and the first optical sensor, the light transmitting protective layer is used for guiding part of light emitted by the light emitting chip to the first optical sensor, the first optical sensor is used for detecting the light emitted by the light emitting chip, and the light emitting chip is used for being adjusted to emit light according to a result detected by the first optical sensor.

2. The lighting module of claim 1, wherein: the at least one light emitting chip comprises a blue light chip, a red light chip and a green light chip, and the first optical sensor is a color sensor or an illumination sensor.

3. The lighting module of claim 1, wherein: the light-emitting chip further comprises a reflecting layer, the reflecting layer covers the light-transmitting protective layer, the reflecting layer is provided with a light outlet, the light outlet exposes a light outlet area of the upper surface, far away from the first surface, of the light-transmitting protective layer, the light outlet area exposes the light-emitting chip, and the reflecting layer shields the first optical sensor.

4. The lighting module of claim 3, wherein: the light-emitting chip is characterized by further comprising a second optical sensor, the second optical sensor is arranged on the first surface and covered by the light-transmitting protective layer, the reflecting layer is arranged between the second optical sensor and the first optical sensor in an interval mode, the second optical sensor is used for detecting the light intensity of the external environment, the light-emitting chip is used for being adjusted to emit light according to the result detected by the second optical sensor, and the thickness of the reflecting layer is larger than or equal to 0.15mm.

5. The lighting module of claim 1, wherein: the distance from the sensing surface, far away from the first surface, of the first optical sensor to the upper surface, far away from the first surface, of the light-transmitting protection layer is greater than or equal to 0.15mm.

6. The lighting module of claim 1, wherein: the light emitting surface, far away from the first surface, of the light emitting chip with the highest height in the at least one light emitting chip is not higher than the sensing surface, far away from the first surface, of the first optical sensor.

7. The lighting module of claim 6, wherein: the light emitting chips are vertical structure light emitting diode chips or horizontal structure light emitting diode chips, and the height difference between the light emitting surface of the light emitting chip with the highest height in the at least one light emitting chip and the sensing surface of the first optical sensor is greater than or equal to 0.05mm.

8. The lighting module of claim 7, wherein: the first surface is concavely provided with a groove, and the at least one light-emitting chip is arranged in the groove.

9. The lighting module of claim 1, wherein: the distance from the light-emitting chip, which is closest to the first optical sensor, of the at least one light-emitting chip to the first optical sensor is greater than or equal to 0.15mm.

10. A light emitting device, characterized in that: the optical module comprises the light-emitting module and a driving chip according to any one of claims 1 to 9, wherein the driving chip is electrically connected with the first optical sensor and the light-emitting chip, and the driving chip is used for adjusting the light emission of the light-emitting chip according to the result detected by the first optical sensor; or the driving chip is electrically connected with the first optical sensor, the second optical sensor and the light-emitting chip, and the driving chip is used for adjusting the light emission of the light-emitting chip according to the result detected by the first optical sensor and the result detected by the second optical sensor.

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