WO2020178680A1 - Micro led light emission inspection device, inspection device for optical filter used in said device, and micro led light emission inspection method using said device incorporated in manufacturing process - Google Patents

Micro led light emission inspection device, inspection device for optical filter used in said device, and micro led light emission inspection method using said device incorporated in manufacturing process Download PDF

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Publication number
WO2020178680A1
WO2020178680A1 PCT/IB2020/051681 IB2020051681W WO2020178680A1 WO 2020178680 A1 WO2020178680 A1 WO 2020178680A1 IB 2020051681 W IB2020051681 W IB 2020051681W WO 2020178680 A1 WO2020178680 A1 WO 2020178680A1
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Prior art keywords
micro led
light
filter
image processing
unit
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PCT/IB2020/051681
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French (fr)
Japanese (ja)
Inventor
山本茂
番場佳彦
安田雅宏
濱野俊之
田畑譲
得居道久
顔頡
上原雅史
Original Assignee
オルボテック リミテッド
山本茂
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Application filed by オルボテック リミテッド, 山本茂 filed Critical オルボテック リミテッド
Priority to CN202080018056.3A priority Critical patent/CN113508454B/en
Priority to JP2021503231A priority patent/JP7394828B2/en
Priority to KR1020217031780A priority patent/KR102607139B1/en
Publication of WO2020178680A1 publication Critical patent/WO2020178680A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention is incorporated into a micro LED light emission inspection apparatus for inspecting a large number of LED chips formed on a wafer in a manufacturing process of a display device using a micro LED, an optical filter inspection apparatus used in the apparatus, and a manufacturing process.
  • the present invention relates to a micro LED light emission inspection method using the device.
  • a display device which is a display device by arranging minute LED chips formed by solid-state semiconductor technology on a circuit board, has been studied.
  • adjacent LED chips mounted on the substrate are cut out from different wafers, or cut out from different positions with a distance even on the same wafer. For example, chips with different process conditions are mixed and mounted.
  • a TFT liquid crystal display or an organic LED display device elements such as a switch transistor and a color filter that affect the display quality of the pixel such as brightness and emission wavelength are directly generated on the display substrate, so that the adjacent pixels on the display device have a temperature difference.
  • the process conditions such as solvent concentration and solvent were almost the same, and the boundaries such as brightness and emission color were inconspicuous.
  • chips generated under different process conditions as described above may be mounted as adjacent pixels, and in particular, a plurality of chips are collectively packaged as, for example, a rectangular group. In the mounting method, when groups having different emission brightness and emission wavelength are adjacent to each other, there is a problem that the group boundary is visually recognized as unevenness.
  • a method called binning in which the light emission luminance and the light emission wavelength are measured for a chip completed in a form capable of emitting light, and the chips are sorted according to a standard, and the chip mounted on a specific display device is different.
  • the device is designed so that bottles do not coexist.
  • Patent Document 1 Conventionally, an optical spectrometer using a diffraction grating has been mainly used for measuring the emission wavelength used for binning, and there are Patent Documents 1 and 2. Of these, Patent Document 2 uses a spectrometer that also uses a CCD linear sensor. However, in these methods using an optical spectrometer, the wavelength measurement speed is considered to be, for example, about 1 mS per measurement.
  • the number of LED chips mounted on the micro LED display device is 3,860x2,140 in the display device with a resolution of 4K, which exceeds 8 million for each RGB color, and the dot pitch is 0 in the 13.3 inch display device. It becomes 0.077 mm. Assuming that more than 1.5 million micro LEDs satisfying a dot pitch of about 0.1 mm can be formed on a 6-inch wafer. When the emission wavelength of these chips is measured by the above-mentioned measuring method using a spectrometer, there is a problem that an enormous amount of time of 1500 seconds is required. Further, if the resolution is 8K, the dot pitch is 0.038 mm on a 13.3 inch display device. In this case, more than 10 million LED chips are formed on a 6-inch wafer, and if the emission wavelength of these chips is measured by the above-mentioned measuring method using a spectrometer, a further huge time of 10,000 seconds is required.
  • chips generated under different process conditions may be mounted as adjacent pixels, and it is necessary to further suppress variations that fluctuate due to manufacturing conditions and quickly grasp manufacturing fluctuation factors. No means and method for promptly grasping the manufacturing variation variation factor in such a micro LED manufacturing process are provided.
  • the present invention can address such a problem, and achieves an order of magnitude less than one-tenth of the inspection time of the prior art for micro LEDs formed in large numbers with a dot pitch of 0.1 mm or less on a wafer. It is an object to provide a micro LED light emission inspection device.
  • the present invention provides a higher speed micro LED light emission inspection device that solves the above problems. This will be described below.
  • Micro LEDs which occupy rectangular areas of 100 ⁇ m square or less to be individually separated, are arranged in an array and arranged above a semiconductor substrate formed on the surface, A power supply mechanism for emitting light from the micro LED, An image pickup apparatus having an image sensor for measuring the light intensity of the emitted light, in which an optical lens is arranged facing the substrate, A digital image processing device that receives a video signal of the imaging device; An optical filter having a predetermined light wavelength band, which is disposed in the optical path between the micro LED and the optical lens, A filter driving mechanism that supports the optical filter and includes a control signal receiving unit, and A control device including a control signal transmission unit of the filter drive mechanism, and a control unit for generating the control signal and for performing system flow start and flow control, It is a micro LED light emission inspection device including The optical filter is an optical filter whose filter transmitted light intensity monotonically increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to design conditions, and, The control device is a control device capable of selectively controlling the
  • a micro LED identifying unit for generating a micro LED mapping data for specifying a plurality of the micro LEDs arranged in the array from the unit image body and mapping the micro LEDs on the pixel map.
  • the optical energy intensity of the micro LED is determined from the optical intensity on the optical intensity map of the above by a predetermined optical energy intensity calculation formula, and the optical energy intensity value of at least the optical energy intensity of the micro LED in the arrangement without the optical filter.
  • Can be stored in the memory, and the emission wavelength of a predetermined micro LED is calculated by the optical energy intensity value of the micro LED in the arrangement with the optical filter and the optical energy intensity value of the arrangement without the optical filter.
  • the digital image processing apparatus including a micro LED inspection unit for determining the emission wavelength of the micro LED according to an equation.
  • the present invention provides a micro LED light emission inspection device characterized by the above.
  • the digital image processing device automatically discovers and identifies the individual micro LEDs to be measured from the captured image, and the light intensity of the micro LEDs generated from the screen frame image is measured collectively, so the conventional CCD Provided is a micro LED emission inspection device capable of measuring the emission wavelength of a micro LED at a higher speed than individual measurement by a line sensor. For measurement, it is possible to capture the image of the wafer to be inspected without an optical filter and with an optical filter at once by a digital image processing device with high-speed signal processing for each imaging screen, and the entire wafer.
  • the image frame data can be acquired in about 50 seconds without the optical filter and about 50 seconds with the optical filter, for a total of about 100 seconds.
  • automatic image processing after acquisition of image frame data enables higher-speed inspection of the emission wavelength measurement of the micro LED of the entire wafer by batch processing.
  • the invention provides According to the predetermined criteria, a pixel exhibiting a peak light energy intensity value with respect to the surroundings is specified as a central portion of the unit image body, and a center between the adjacent central portions of the unit image body is defined as a rectangular boundary of the unit image body.
  • the invention provides The predetermined criteria specifies a pixel exhibiting a peak light energy intensity value with respect to the surroundings as a central portion of the unit image body, and a rectangular boundary of the unit image body is determined by a space LED design value of micro LEDs arranged in an array.
  • a micro LED light emission inspection device for determining.
  • the invention provides The predetermined light energy intensity calculation formula provides a micro LED emission inspection device which is the sum of the stepwise light intensities of the pixels included in the micro LED on the light intensity pixel map.
  • the sum of the stepwise light intensities of the pixels contained in the micro LED is taken and the light intensity observed in all the pixels related to the micro LED is used to smooth the disturbance associated with the measurement of each pixel.
  • the invention provides The optical filter has its filter characteristics calibrated by a light source having a known light wavelength, and the ratio of the light energy intensity value in the arrangement without the optical filter to the light energy intensity value in the arrangement with the optical filter and the light emission.
  • a micro LED light emission inspection device in which a look-up table created based on the calibration with respect to a wavelength is stored.
  • the invention provides The predetermined emission wavelength calculation formula of the micro LED, the emission wavelength corresponding to the light energy intensity ratio measurement value is referred to in the look-up table, and the emission wavelength is determined by adding proportional division interpolation for an intermediate value.
  • the emission wavelength can be determined with appropriate accuracy even for intermediate values other than discrete values.
  • the invention provides The design conditions of the micro LED array to be inspected to be arranged in an array and the substrate in which approximately the same number and arrangement of reflectors are formed on the surface in an array at least in a predetermined area, and A light projection mechanism for the reflected light of the reflector, A light guide mechanism to the light projection mechanism, A light source of known wavelength of the light projection light;
  • An image pickup apparatus having an image sensor for measuring the light intensity of the emitted light, in which an optical lens is arranged facing the substrate, A digital image processing device that receives a video signal of the imaging device;
  • An optical filter used in a micro LED emission inspection device having a predetermined optical wavelength band, which is arranged between the optical lens and the reflector on the reflected light path of the reflector.
  • a filter drive mechanism that supports the optical filter and includes a control signal receiver, a control signal transmitter of the filter drive mechanism, and for generating the control signal and for starting and controlling the system flow.
  • a controller including a controller,
  • An optical filter inspection device used for a micro LED emission inspection device including: The optical filter is an optical filter whose filter transmitted light intensity monotonously increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition, and the control device causes the filter to drive the optical filter.
  • the digital image processing device includes a memory for storing an image data frame generated by receiving the video signal
  • the reflected light of the reflector is regarded as the light emission of the micro LED
  • the unit image body of the light emission is specified based on a predetermined criterion from the light intensity pixel map for each pixel on the image data frame
  • the reflected light A unit image body is regarded as a unit image body by light emission of a micro LED, and a unit image body identification unit for generating unit image body mapping data to the pixel map
  • a micro LED identification for identifying the micro LEDs regarded as the plurality of the reflectors arranged in the array from the unit image body and generating micro LED mapping data for mapping the micro LEDs on the pixel map.
  • a digital image processing apparatus including a micro LED inspection unit for determining a light emission wavelength of the micro LED regarded as a light source of the reflected light according to a predetermined light emission wavelength calculation formula of the micro LED.
  • an optical filter inspection device used for a micro LED light emission inspection device.
  • the invention provides The light projection mechanism for the reflected light of the reflector described in the previous stage is a micro LED light emission inspection device including a half mirror arranged between the optical lens and the reflector on the reflected light path of the reflector.
  • a micro LED light emission inspection device including a half mirror arranged between the optical lens and the reflector on the reflected light path of the reflector.
  • an optical filter inspection device used for. This configuration has the effect of providing a more space-saving device.
  • the invention provides The optical guiding mechanism provides the optical filter inspection device according to the preceding paragraph, which is used in the micro LED emission inspection device according to the preceding paragraph, which includes an optical fiber cable.
  • the invention provides The optical filter is a look based on the calibration with respect to a relationship between a ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter and the emission wavelength.
  • an optical filter inspection device used for the micro LED light emission inspection device described up to the stage before the uptable is created. With this configuration, it is possible to obtain the effect that the target value that is not represented by one function by the lookup table can be determined by the sampling value.
  • the invention provides The predetermined emission wavelength calculation formula of the micro LED is a relationship between the emission wavelength and the ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter.
  • a lookup table created by calibration is included in the digital image processing apparatus, the emission wavelength corresponding to the light energy intensity ratio measurement value is referred to the lookup table, and proportional distribution interpolation is added for an intermediate value.
  • an optical filter inspection device used in a micro LED emission inspection device in which the emission wavelength is determined.
  • the invention provides Provided is a micro LED emission inspection device including an optical filter inspection device used in the micro LED emission inspection device described in the preceding paragraph.
  • the optical filter inspection device used for the micro LED light emission inspection device described up to the previous stage can be operated integrally with the micro LED light emission inspection device described up to the previous stage. The advantage that it is convenient for manufacturing control scheduling is obtained.
  • the invention provides The digital image processing device further includes a connection interface to a persistent storage, the filter characteristic and the look-up table are receivable from the persistent storage as master data and stored in the memory in the digital image processing device.
  • a connection interface to a persistent storage
  • the filter characteristic and the look-up table are receivable from the persistent storage as master data and stored in the memory in the digital image processing device.
  • a micro LED light emission inspection device Provided is a micro LED light emission inspection device. With this configuration, the look-up table can be provided externally and can be shared by a plurality of devices.
  • the invention provides The digital image processing device provides a micro LED light emission inspection device in which light having a known emission wavelength for calibrating the filter characteristic can be arranged as reference light in an optical field of view of the imaging device.
  • the invention provides The micro LED light emission inspection device further comprises an optical sensor for monitoring the light intensity of the reference light emitter, the image processing device accepts a signal output of the optical sensor, and normalizes according to a light intensity monitor value of the optical sensor.
  • a micro LED light emission inspection device which is an image processing device configured so that the calibration can be corrected by using the stepwise light intensity of the reference light emitting body.
  • the invention provides The control device of the micro LED light emission inspection device further includes a receiving unit of a status signal generated by the filter driving mechanism, the control unit of the control device for the filter driving mechanism to select without the filter.
  • a control signal for instructing can be generated and transmitted to the filter driving mechanism, and the control device instructs the image processing device to start measurement of the light energy intensity value in the arrangement without the optical filter. It is possible to generate a control signal and transmit the control signal to the image processing apparatus via a control signal transmission unit.
  • the control unit of the control device receives the status signal from the filter driving mechanism or accepts an instruction to start the inspection, the image processing device subsequently measures the light energy intensity value in the arrangement without the optical filter.
  • a control signal for instructing start is transmitted, and this is transmitted to the image processing device via a control signal transmission unit, and the image processing device indicates that the micro LED indicating an abnormal value on the micro LED mapping data is a micro LED defective product.
  • a micro LED light emission inspection device having a micro LED defective product determination unit which holds defective product flag data for identification and exclusion from a micro LED product.
  • the invention provides The digital image processing device of the micro LED light emission inspection device includes an external connection path and a data input part for inputting array design data of the micro LED, and the array form is provided from the data input part via the external connection path.
  • a micro LED light emission inspection device including a micro LED map boundary determination unit that collates with LED array design data, recognizes an end portion of a normal micro LED array, and updates the micro LED map accordingly.
  • the invention provides Provided is a micro LED emission inspection apparatus, characterized in that the micro LED is assigned to a predetermined category defined by a predetermined light energy intensity characteristic and a predetermined emission wavelength characteristic.
  • the advantage of the micro LED light emission inspection apparatus according to the present invention is that the data of each image data frame can be effectively utilized.
  • the invention provides The micro LED light emission inspection device according to the present invention further includes a filter optical axis tilt angle drive mechanism including a receiving portion of a tilt angle control signal for controlling the tilt of the optical filter with respect to the optical axis of the optical path, and the predetermined one.
  • a filter optical axis tilt angle drive mechanism including a receiving portion of a tilt angle control signal for controlling the tilt of the optical filter with respect to the optical axis of the optical path, and the predetermined one.
  • the optical filter having an optical wavelength band a dielectric thin film optical filter created with a wavelength longer than the center value of a predetermined wavelength range as a half value of the filter transmittance is used, and the optical filter of the optical filter is used in the optical axis direction.
  • a micro LED light emission inspection device characterized in that a half value of a filter transmittance can be adjusted so that an inclination angle is a center value of the predetermined wavelength range. With this configuration, the tilt of the dielectric thin film optical filter can be automatically operated, and the
  • the invention provides The control unit of the control device of the micro LED light emission inspection device according to the present invention instructs the filter driving mechanism to select the thin film optical filter created with the wavelength longer than the center value of the predetermined wavelength range as the half value of the filter transmittance.
  • Generating a control signal for controlling the filter drive mechanism, the filter optical axis tilt angle drive mechanism, and the control device to be capable of bidirectional communication via a first communication network
  • the control device and the image processing device are configured to enable bidirectional communication via a second communication network.
  • the control device is configured to be able to acquire the light intensity of a predetermined unit image body from the image processing device via a second communication network, and the control unit of the control device can generate the tilt angle control signal.
  • the filter optical axis tilt angle drive mechanism via the first communication network, and the tilt angle of the optical filter with respect to the optical axis direction is the predetermined wavelength range.
  • the micro LED light emission inspection device according to the preceding stage, wherein the inclination angle is configured such that the difference between the center value of the filter and the half value of the filter transmittance falls within a predetermined threshold value.
  • the invention provides The light intensity pixel map provides a micro LED light emission inspection apparatus in which the stepwise smoothing of the light intensity is performed by a moving average between adjacent pixels. With this configuration, it is possible to obtain the effect of mitigating the effects of various disturbances and noises that appear between pixels during inspection.
  • the invention provides The emission wavelength of the micro LED superimposed on the micro LED provides a micro LED emission inspection device in which the light wavelength is smoothed by a moving average between adjacent micro LEDs.
  • a micro LED light emission inspection apparatus includes an image sensor tilt angle drive mechanism including an image sensor tilt angle control signal receiving unit for controlling the image sensor tilt angle with respect to an optical axis of an optical path, and an actuator for focusing.
  • the image pickup unit is further provided, and the control device and the image processing device are configured to be communicable via respective communication units, and the control unit of the control device can generate the image sensor tilt angle control signal.
  • the control device adjusts the light intensity of the light intensity pixel map with a predetermined contrast in the light intensity pixel map acquired from the image processing device via the communication unit, and adjusts the light intensity pixel map according to the adjusted stepwise light intensity.
  • a micro LED light emission inspection device characterized by driving the image sensor optical axis tilt angle drive mechanism and the actuator so as to focus.
  • the invention provides The image processing device of the micro LED emission inspection device according to the present invention further includes an image display device, generates a two-dimensional map of the light intensity characteristics of a plurality of micro LEDs and the emission wavelength, and displays the two-dimensional map on the image display device.
  • a micro LED light emission inspection device characterized by the above. With this configuration, an important parameter is selected for the optical characteristics of the micro LED, and the two-dimensional map of the intensity and light intensity characteristics and the emission wavelength can be visually confirmed. Depending on the embodiment, it is possible to obtain an effect that the display is superimposed on the wafer in place of or together with the visual observation with the microscope.
  • the invention provides in the micro LED light emission inspection device according to the present invention, the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection device, and a transmission path is provided between the filter drive mechanism and the control device. Is configured to be communicable via a communication path, and the control device and the image processing device are configured to be capable of bidirectional communication via a communication path.
  • the micro LED lighting step of lighting the micro LED by the power feeding mechanism with the start of the processing of the control section, and subsequently, the control section generates a signal for selecting a status in which the optical filter does not exist in the optical path, and further the transmission.
  • the control unit After transmitting the signal to the filter drive mechanism via a path, the control unit immediately includes a first filter movement instruction step that waits for a start instruction notification of the first imaging, and the control unit includes a module that executes:
  • the filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path.
  • the filter drive mechanism includes a module for performing When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received.
  • a first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path.
  • the control unit further includes a module for When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device.
  • the unit image body identifying unit the unit image body of the light emission is specified from the light intensity pixel map based on the predetermined criteria, and further unit image body mapping data to the pixel map is generated.
  • the micro LED identification unit Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map.
  • the micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining an intensity and measuring the unfiltered light intensity of storing the light energy intensity value in the memory of the image processing device in the arrangement without the optical filter of the micro LED; Including processing equipment, When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path.
  • the control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
  • the filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter.
  • the drive mechanism further includes When the control unit accepts the second imaging start instruction notification while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the second imaging start instruction signal.
  • control unit further includes a module that executes a second image capture start instruction step of transmitting the second image capture start instruction signal to the image processing apparatus via the communication path,
  • the image processing device receives the second imaging start instruction signal via the communication path
  • the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel.
  • the unit image body identifying unit the unit image body of the light emission is specified from the light intensity pixel map based on the predetermined criteria, and further unit image body mapping data to the pixel map is generated.
  • micro LED identification unit Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map.
  • the micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map.
  • the micro LED inspection unit Determining the intensity, and measuring the filtered light intensity to be stored in the memory in the image processing device as the light energy intensity value in the arrangement of the micro LED with the optical filter; Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter.
  • a data output unit via the memory in the digital image processing device, the micro LED emission wavelength data output step of outputting to the external connection path from the data output unit, a module for performing.
  • the image processing device further provides a micro LED light emission inspection device.
  • the invention provides The light source of the micro LED light emission inspection device according to the present invention is a wavelength light source of a known light wavelength including a light wavelength variable mechanism, and the micro LED light emission inspection device further includes the control unit of the micro LED light emission inspection device.
  • a control CPU and a memory are provided, and the filter drive mechanism and the control device are configured to be communicable via a transmission path, and a communication path is provided between the control device and the image processing device.
  • Bidirectional communication is possible via, and the control unit updates the set value of the light wavelength of the light source to the initial value by the variable mechanism at the start of the process, the light wavelength initialization step, A calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the wavelength light source of the known light wavelength after being updated by the power feeding mechanism, and a status in which the optical filter is not present in the optical path.
  • the control unit includes a module that executes an instructing step,
  • the filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path.
  • the filter drive mechanism includes a module for performing When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received.
  • a first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path.
  • the control unit further includes a module for When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device.
  • the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria,
  • unit image body mapping data to the pixel map store it in the memory in the image processing apparatus, further consider the calibration light source mapping as the micro LED mapping, in the micro LED identification unit,
  • the micro LED mapping data regarded as the calibration light source mapping is generated from a unit image body, stored in the memory, and the predetermined light energy is obtained from the light intensity on the light intensity map on the micro LED map.
  • the light energy intensity of the micro LED is determined by an intensity calculation formula, and the memory in the image processing device as the light energy intensity value in the arrangement without the optical filter of the calibration light source regarded as the light emission of the micro LED. Measuring the unfiltered light intensity stored in the image processing device, and When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path.
  • the control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
  • the control unit waiting for the notification of the start instruction of the second imaging receives the start instruction of the second imaging
  • the control unit generates a signal for arranging the optical filter in the optical path based on the start instruction.
  • a second filter movement instruction step of transmitting to the filter driving mechanism via the transmission path and waiting for other processing later The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter.
  • the drive mechanism further includes When the control unit accepts the second imaging start instruction notification while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the second imaging start instruction signal.
  • control unit further includes a module that executes a second image capture start instruction step of transmitting the second image capture start instruction signal to the image processing apparatus via the communication path,
  • the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel.
  • a second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further, it generates unit image body mapping data to the pixel map, stores it in the memory in the image processing device, and further, in the micro LED identification unit, it is regarded as the calibration light source mapping from the unit image body.
  • the generated micro LED mapping data is stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining the intensity and measuring the filtered light intensity to be stored in the memory in the image processing device as the light energy intensity value in the arrangement with the optical filter of the calibration light source regarded as the emission of the micro LED. When, Following this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory in the image processing device, and corresponds to the micro LED.
  • the optical energy intensity value in the arrangement without the optical filter is read from the memory in the image processing apparatus, the optical energy intensity value of the calibration light source in the arrangement with the optical filter, and the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity and the filtered light intensity according to the light energy intensity value of Subsequently, in the micro LED inspection unit, a step of storing the ratio of the known light source wavelength and the light intensity in the memory, A light source wavelength updating step of updating the set value of the light wavelength of the light source with a predetermined increment value, It is checked whether the light wavelength of the light source after the update exceeds a predetermined boundary value. If NO, the process returns to the calibration light source lighting step, and if YES, the process proceeds to the lookup table creating step.
  • a lookup table can be created automatically or semi-automatically, the lookup table can be updated more frequently, and more accurate inspection can be performed. The effect that line downtime due to maintenance can be shortened can be obtained.
  • the invention provides An optical filter inspection device for an optical filter used in a micro LED emission inspection device according to the present invention further comprises a CPU and a memory for controlling the optical filter inspection device in the control unit, and the filter drive mechanism and the It is configured to be capable of communicating with a control device via a transmission path, and is configured to be capable of bidirectional communication between the control device and the image processing device via a communication path, and the control unit
  • the optical wavelength initialization step of updating the set value of the optical wavelength of the light source to the initial value by the variable mechanism
  • a calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the wavelength light source of the known light wavelength after being updated by the power feeding mechanism, and a status in which the optical filter is not present in the optical path.
  • the control unit includes a module that executes an instructing step,
  • the filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path.
  • the filter drive mechanism includes a module for performing When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received.
  • a first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path.
  • the control unit further includes a module for When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device.
  • the image processing apparatus includes a module that executes a step of measuring unfiltered light intensity stored in the memory in the image processing apparatus as an intensity value.
  • the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path.
  • the control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later. Subsequent to this, when the control unit waiting for the notification of the start instruction of the second imaging receives the start instruction of the second imaging, the control unit generates a signal for arranging the optical filter in the optical path based on the start instruction. Then, a second filter movement instruction step of transmitting to the filter driving mechanism via the transmission path and waiting for other processing later, The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter.
  • the drive mechanism further includes When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus; Subsequent to this, in the unit image body identification unit, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body of the reflected light (hereinafter referred to as reflected light body, in this paragraph).
  • unit image object mapping data to the pixel map is further generated, stored in the memory in the image processing device, and reflected light object mapping is performed on the micro LED.
  • mapping in the micro LED identification unit, to generate the micro LED mapping data regarded as the reflected light body mapping from the unit image body, store it in the memory, the light on the micro LED map
  • the light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the intensity map, and the light energy of the reflected light regarded as the light emission of the micro LED in the arrangement with the optical filter is determined.
  • a step of calculating the ratio of the light intensity without a filter and the light intensity with a filter based on the light energy intensity value of the no arrangement and Subsequently, in the micro LED inspection unit, a step of storing the ratio of the known light source wavelength and the light intensity in the memory, A light source wavelength updating step of updating the set value of the light wavelength of the light source with a predetermined increment value, It is checked whether the light wavelength of the light source after the update exceeds a predetermined boundary value. If NO, the process returns to the calibration light source lighting step, and if YES, the process proceeds to the lookup table creating step.
  • a filter inspection device is provided.
  • the invention provides in the micro LED light emission inspection device described up to the previous stage, the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection device, and transmits between the filter drive mechanism and the control device. It is configured to be communicable via a road, and bidirectional communication is possible between the control device and the image processing device via a communication path.
  • the micro LED lighting step of lighting the micro LED by the power feeding mechanism with the start of the processing of the control section, and subsequently, the control section generates a signal for selecting a status in which the optical filter does not exist in the optical path, and further the transmission.
  • the control unit After transmitting the signal to the filter drive mechanism via a path, the control unit immediately includes a first filter movement instruction step that waits for a start instruction notification of the first imaging, and the control unit includes a module that executes:
  • the filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path.
  • the filter drive mechanism includes a module for performing When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received.
  • a first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path.
  • the control unit further includes a module for When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device.
  • the unit image body identification unit identifies the unit image body of the light emission from the light intensity pixel map based on the predetermined criteria, and further generates unit image body mapping data to the pixel map, which is used.
  • the micro LED identification unit identifies a plurality of micro LEDs arranged in an array from the unit image body and displays the corresponding micro LEDs on the pixel map.
  • the micro LED mapping data is mapped, stored in the memory, and the optical energy of the micro LED is calculated from the light intensity on the light intensity map on the micro LED map by the predetermined optical energy intensity calculation formula.
  • the image is a module that executes a step of determining the intensity and measuring the unfiltered light intensity in which the optical energy intensity value in the arrangement of the micro LED without the optical filter is stored in the memory in the image processing apparatus. Including processing equipment, When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path.
  • the control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
  • the filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter.
  • the drive mechanism further includes When the control unit receives the notification of the start instruction of the second imaging while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the start instruction signal of the second imaging.
  • the control unit further includes a module that executes the second imaging start instruction step after transmitting the second imaging start instruction signal to the image processing device via the communication path.
  • the image processing device When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus; Following this, the unit image body identification unit identifies the unit image body of the light emission from the light intensity pixel map based on the predetermined criteria, and further generates unit image body mapping data to the pixel map, which is used.
  • the micro LED identification unit identifies a plurality of micro LEDs arranged in an array from the unit image body and displays the corresponding micro LEDs on the pixel map.
  • the micro LED mapping data is mapped, stored in the memory, and the optical energy of the micro LED is calculated by the predetermined optical energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map.
  • a step of determining the intensity and measuring the light intensity with a filter in which the optical energy intensity value in the arrangement of the micro LED with the optical filter is stored in the memory in the image processing apparatus.
  • the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided.
  • the light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity, Subsequently, in the micro LED inspection unit, the emission wavelength determination step of the lookup table reference method for determining the emission wavelength of the micro LED by reference to the lookup table, and the external for the array design data output of the micro LED.
  • a micro LED emission wavelength data output step that includes a connection path and a data output unit and outputs the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus.
  • a micro LED light emission inspection device including a module for executing With this configuration, the emission wavelength determination of the lookup table reference method can be executed by automatic operation or main automatic operation, faster processing is realized, and the light wavelength data is output to an external device, so it is more integrated with the production line. The effect that it can be operated is obtained.
  • the invention provides The light source of the micro LED light emission inspection device is a wavelength light source of a known light wavelength including a variable mechanism of the light wavelength of the light source, the micro LED light emission inspection device further includes a CPU and a memory in the control unit, The control unit updates the setting value of the light wavelength of the light source to the center wavelength of the bandwidth by the variable mechanism at the start of the process, the center wavelength setting step of the light wavelength, A center wavelength light source lighting step of updating the light wavelength of the light source to the center wavelength by the variable mechanism and turning on the wavelength light source of the light wavelength by the power feeding mechanism, and a status in which the optical filter is not present in the optical path.
  • the control unit After the control unit generates the signal to be selected and further transmits the signal to the filter driving mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification and then the first filter movement instruction.
  • the control unit includes a step and a module for executing.
  • the filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path.
  • the filter drive mechanism includes a module for performing When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received.
  • a first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path.
  • the control unit further includes a module for When the image processing device receives the start instruction signal of the first imaging via the communication path, the image processing device accepts the video signal from the imaging device, and the pixel on the image data frame stored in the image processing device.
  • the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED
  • the unit image body of the calibration light source light is specified based on the predetermined criteria
  • the light energy intensity of the micro LED is determined by an energy intensity calculation formula, and the light energy intensity value in the arrangement without the optical filter of the calibration light source luminous body regarded as a micro LED is used as the light energy intensity value in the image processing
  • the image processing apparatus includes a module that executes a step of measuring an unfiltered light intensity stored in a memory, When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path.
  • the control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a subsequent imaging start instruction later.
  • the filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter.
  • the drive mechanism further includes When the control unit accepts the subsequent imaging start instruction notification while waiting for the subsequent imaging start instruction, the control unit generates the subsequent imaging start instruction signal and sends the subsequent imaging start instruction signal to the image processing apparatus via the communication path.
  • the control unit further includes a module that executes a subsequent imaging start instruction step after transmitting an imaging start instruction signal, When the image processing device receives the subsequent imaging start instruction signal via the communication path, the image processing device receives the video signal from the imaging device, and the pixel map on the image data frame is measured at each pixel.
  • a subsequent imaging step of generating the light intensity pixel map in which the target light intensity is superimposed and storing the light intensity pixel map in the memory in the image processing apparatus Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on a predetermined criterion, and further, Generate the unit image body mapping data to the pixel map, store it in the memory in the image processing device, further, in the micro LED identification unit, the calibration light source light regarded as light emission of the micro LED Is generated from the unit image body as a micro LED to generate the micro LED mapping data to be mapped on the pixel map, which is stored in the memory in the image processing device, and the light intensity on the micro LED map.
  • the micro LED inspection unit From the light intensity on the map to determine the light energy intensity of the calibration light source luminous body regarded as the micro LED by the predetermined light energy intensity calculation formula, in the arrangement with the optical filter of the calibration light source. Measuring a filtered light intensity stored in the memory in the image processing device as the light energy intensity value; Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter.
  • Calculating the ratio of the unfiltered light intensity to the filtered light intensity Determine whether the ratio of the light intensity is near 0.5 within a predetermined determination width according to a predetermined determination condition, If the determination condition is NO, a signal for driving the step of changing the angle of the filter is generated for the filter optical axis tilt angle drive mechanism, and the signal is transmitted to the filter optical axis tilt angle drive mechanism.
  • the control is branched to the module that executes the angle variation step, and then the start instruction notification of the subsequent imaging is transmitted to the control unit via the communication unit to the control device, and the subsequent imaging step of the control unit is performed.
  • the filter optical axis tilt angle drive mechanism provides a micro LED light emission inspection device including a module that performs the filter angle changing step of changing the filter angle within a predetermined width.
  • the invention provides A micro LED further including a communication path with a manufacturing process management computer and a manufacturing data input unit, and further including a module for executing a manufacturing instruction receiving step of receiving a manufacturing instruction including manufacturing conditions from the manufacturing process management computer via the communication path.
  • a luminescence inspection device is provided.
  • the invention provides A manufacturing data output step that further includes a communication path to a manufacturing process management computer and a manufacturing data output unit, and outputs manufacturing process data including calibration data and other progress data to the manufacturing process management computer via the communication path.
  • a micro LED light emission inspection device further including a module for executing the above.
  • the control device further includes a CPU and a memory for controlling the micro LED light emission inspection device, and a transmission path is provided between the filter drive mechanism and the control device.
  • a transmission path is provided between the filter drive mechanism and the control device.
  • the control device and the image processing device are configured to be capable of bidirectional communication via a communication path, and the control unit of the control device is as follows: A module that performs a micro LED lighting step of lighting the micro LED by the power feeding mechanism, The optical filter generates a signal selecting a status not existing in the optical path, and further drives the filter driving mechanism to select a status not existing in the optical path by the optical filter via the transmission path.
  • a module that performs the filter movement step The first imaging start instruction signal is accepted, the first imaging start instruction signal is generated, and immediately after the first imaging start instruction signal is transmitted to the image processing apparatus via the communication path, the first imaging start instruction signal is transmitted.
  • a module that executes a second filter moving step that drives the mechanism, and a second imaging start instruction notification are received, and a second imaging start instruction signal is generated, and the image is transmitted via the communication path.
  • the control unit includes a module that transmits the second imaging start instruction signal to the processing device, and executes a second imaging start instruction step,
  • the image processing device receives the start instruction signal for the first imaging via the communication path
  • the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device.
  • the unit image body identification unit the unit image body of the light emission based on the predetermined criteria is specified from the light intensity pixel map, and further unit image body mapping data to the pixel map is generated.
  • micro LED identification unit Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map.
  • the micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining an intensity, and measuring an unfiltered light intensity for storing the light energy intensity value in the optical filter-less arrangement of the micro LED in the memory in the image processing apparatus, When the second imaging start instruction signal is received via the communication path, the video signal is received from the imaging device, and the stepwise light intensity measured at each pixel is superimposed on the pixel map on the image data frame.
  • a second imaging step of generating the stored light intensity pixel map and storing the generated light intensity pixel map in the memory in the image processing apparatus Continuing to this, in the unit image body identifying unit, the unit image body identifying unit identifies the unit image body of the light emission based on the predetermined criteria from the light intensity pixel map, and further, the unit to the pixel map.
  • Image body mapping data is generated and stored in the memory in the image processing apparatus, and further, in the micro LED identification section, the unit image bodies are used to identify the plurality of micro LEDs arranged in the array.
  • the micro LED mapping data to be mapped on the pixel map is generated, stored in the memory in the image processing device, and the predetermined light energy is calculated from the light intensity on the light intensity map on the micro LED map.
  • the light energy intensity of the micro LED is determined by an intensity calculation formula, and the light intensity with the filter stored in the memory as the light energy intensity value in the arrangement of the micro LED with the optical filter is measured. Steps to Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter.
  • a micro LED emission wavelength data output step that includes a connection path and a data output section, and outputs the emission wavelength data from the data output section to an external connection path via the memory in the digital image processing device.
  • the software may be application software that runs on an operating system that runs on a CPU and memory, the software may be system software that is embedded in an operating system that runs on memory, and the operating system is CPU-controlled, or the software may be hardware. It may be firmware built into the ROM of the hardware, or it may be logic-controlled that is configured in the ASIC built into the hardware. With these, more flexible and detailed automatic operation can be realized, and version upgrade maintenance is also possible. There is an effect.
  • the image processing device of the micro LED light emission inspection device further comprises a manufacturing condition data output unit, wherein the whole substrate image, one or a plurality of unit image object mapping data and the light intensity characteristics corresponding thereto are provided. And converting at least one of the micro LED mapping data including at least one of the emission wavelength characteristic and the category or the light intensity characteristic of the micro LED into a predetermined data format as manufacturing condition data.
  • a micro LED manufacturing apparatus including a micro LED light emission inspection apparatus according to the present invention, which is characterized by generating and outputting. With this configuration, it is possible to obtain an effect that it is possible to cooperate with a closer manufacturing process.
  • the image processing device of the micro LED light emission inspection device according to the present invention is a micro LED manufacturing device including the micro LED light emission inspection device according to the present invention described in the previous stage, which further outputs a two-dimensional map of the light emission wavelength. I will provide a. With this configuration, the following effect can be obtained.
  • the large number of reflectors arranged on the substrate which is a component of the optical filter inspection device used in the micro LED emission inspection device according to the present invention, may be formed of a metal film containing chromium as a main component. With this construction, a durable and well-reflected reflector is constructed, the inspection quality is further improved, and it is more economical than the precious metal film.
  • the invention provides The micro LED light emission inspection method incorporated in the fully automated manufacturing process uses the micro LED light emission inspection device according to the present invention and the following steps:
  • the product information acquisition stage that accepts sub-strate geomeoli information including alignment mark information, micro LED geometry information, and micro LED array geometry information, and continues to be executed.
  • a manufacturing control area setting step of setting a manufacturing control area for recognizing and managing local product quality variability and / or anomalies on the substrate from one or more of the geometry information, followed by execution.
  • An inspection acceptability notifying step of notifying the production line control computer connected by the network means of the inspection acceptability state via the network means, and subsequently executed.
  • a micro LED mapping step of mapping the micro LEDs disposed on the substrate by the image processing apparatus onto an image frame generated in the image processing apparatus is subsequently performed.
  • the image processing device a micro LED characteristic measuring step of lighting the micro LED chip and measuring the emission intensity and the emission wavelength, and subsequently executed.
  • the image processing apparatus attaches category information including anomalous classification classified by a matrix of the emission intensity and the emission wavelength according to a predetermined classification condition based on the micro LED characteristics to the micro LED map information, and all micro LEDs.
  • Micro LED sorting stage to sort and sort chips, and continue to run,
  • the image processing apparatus overlays the microLED with the category information on the manufacturing control area map, and continues to execute a manufacturing process state determination step of recognizing the microLED manufacturing process state with respect to the manufacturing control area.
  • the image processing apparatus continues to execute the inspection result transmission step of transmitting the sorting information and the manufacturing process state to the manufacturing line control computer via the network means.
  • An inspection end notification step of transmitting an inspection end notification to the manufacturing line control computer via the network means provides a method of using a micro LED light emission inspection device incorporated into a fully automated manufacturing process, including: With this configuration, it is possible to obtain the effect of further suppressing the variation that fluctuates depending on the manufacturing conditions and providing the effect of providing prompt feedback of the manufacturing variation variation factor to the manufacturing process in a timely manner.
  • the present invention provides a higher speed micro LED emission inspection device, and when integrated with the micro LED manufacturing process, it is possible to further raise the manufacturing control level.
  • FIG. 1 is a physical configuration diagram of a micro LED light emission inspection device 1 according to an embodiment of the present invention.
  • FIG. 2 is a functional configuration diagram of a micro LED light emission inspection device 1 according to an embodiment of the present invention.
  • FIG. 3 is a schematic view of a micro LED light emission inspection device 1 according to an embodiment of the present invention.
  • FIG. 4 is a graph for explaining the determination of the light intensity ratio of the micro LED light emission inspection device according to the embodiment of the present invention.
  • FIG. 5 is a functional block diagram of a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 6 is a schematic flowchart diagram illustrating a control system flowchart of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 7 is a physical configuration diagram of a modified embodiment of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 8 is a control system flowchart for determining a light wavelength by a lookup table reference method during micro LED light emission inspection and inspection in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention. It is a flow chart schematic diagram explaining.
  • FIG. 9 is a physical configuration diagram of a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 10 illustrates a control system flowchart at the time of calibration for creating a look-up table at the micro LED light emission inspection inspection in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention. It is a flow chart schematic diagram.
  • FIG. 11 is a physical configuration diagram of an optical filter inspection device 101 according to an embodiment of an optical filter inspection device used in the micro LED light emission inspection device 1, which is another aspect of the present invention.
  • FIG. 12 is a functional configuration diagram of an optical filter inspection device 101 according to an embodiment of an optical filter inspection device used in the micro LED emission inspection device 1, which is another aspect of the present invention.
  • FIG. 13 is a schematic flow chart explaining a control system flow chart in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 14 is a physical configuration diagram including a reference illuminant in a modified embodiment of the micro LED luminescence inspection device 1 according to the embodiment of the present invention.
  • FIG. 15 is a physical configuration diagram including an optical sensor in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 16 is a functional configuration diagram including a defective product determination unit in a digital image processing device in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 17 is a functional configuration diagram including a data input unit in a digital image processing device in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 18 is a physical configuration diagram including a screen display device in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 19 is a graph showing the category of a two-dimensional map of the light emission wavelength and the light intensity ratio depending on the presence or absence of an optical filter in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
  • FIG. 20 is a physical configuration diagram of an aspect of a micro LED light emission inspection device 500 according to the second embodiment of the present invention.
  • FIG. 21 is a functional configuration diagram of one aspect of the micro LED light emission inspection device 500 according to the second embodiment of the present invention.
  • FIG. 22 is a schematic flow chart explaining a control system flow chart in one mode of the micro LED light emission inspection device 500 according to the second embodiment of the present invention.
  • FIG. 23 is a front schematic view showing an emission wavelength inspection device 600, which is a modified embodiment of the emission wavelength inspection device according to the first embodiment of the present invention.
  • FIG. 24 is a schematic front view showing an emission wavelength inspection device 600 for explanation showing a case where a filter in the device is inserted into an optical path.
  • FIG. 25 is a graph showing transmittance characteristics of the color filter 50 in the same device.
  • FIG. 26 is a front schematic view of an emission wavelength inspection device 700, which is a modified embodiment of the second embodiment of the present invention.
  • FIG. 27 is a graph for showing the influence of a change in the inclination angle of the transmittance characteristic of the color filter 56 in the same apparatus.
  • FIG. 28 is a flowchart of a micro LED light emission test using the same device.
  • FIG. 29 is a schematic perspective view of an emission wavelength inspection device 800 that is a modified embodiment of the first embodiment of the present invention.
  • the micro LED light emission inspection device 1 includes a power feeding mechanism 10, an optical lens 20, an imaging device 30, a digital image processing device 40, an optical filter 50, a filter driving mechanism 60, And a micro LED light emission inspection device including a physical structure such as the control device 70 in a part thereof.
  • micro LEDs 2 occupying a rectangular area of 100 ⁇ m square or less to be individually separated are arranged in an array on the surface.
  • the formed semiconductor substrate 3 can be mounted, and the light of the micro LED 2 turned on by the power feeding mechanism 10 is guided to the image pickup device 30 having the image sensor 31 via the optical path passing through the optical filter 50 and the optical lens 20. It is arranged.
  • the optical filter 50 having a predetermined light wavelength band so as to include red is disposed in the optical path 21 between the micro LED 2 and the optical lens 20, and the light of the predetermined light wavelength band selectively transmitted by the optical filter 50 is transmitted.
  • the image sensor 30 is configured to generate a video signal in the image pickup apparatus 30 via the image sensor 31.
  • the digital image processing device 40 includes a memory 41, and is configured to receive the video signal from the imaging device 30 via the video signal line 18, generate an image data frame 42 from the video signal, and store the image data frame 42 in the memory 41. Has been done.
  • the area occupied by the micro LED 2 formed on the entire semiconductor substrate 3 may be divided and stored by a plurality of image data frames 42.
  • the optical filter 50 is supported by a filter driving mechanism 60, and the filter driving mechanism 60 includes a receiving unit 62 for receiving a control signal from the control device 70 via a control signal line 88.
  • the control device 70 includes a control unit 71 for generating a control signal for the filter drive mechanism 60 of the control device 70, which is configured so that the presence or absence of the optical filter 50 can be selectively controlled by the filter drive mechanism 60.
  • the 71 is configured to be able to start the system flow and control the flow
  • the control unit 71 includes a transmission unit 72 for transmitting the control signal of the filter drive mechanism 60, and the control signal is a control signal provided in the filter drive mechanism 60.
  • the filter drive mechanism receiver 62 is configured to be able to transmit.
  • the digital light intensity generated from the video signal has a stepwise light intensity for each pixel on the image data frame 42, and the plurality of image data frames 42 are bundled and held in the memory 41.
  • the light intensity function for each x-th and y-th pixel in the Cartesian coordinate system pasted on the image data frame 42 in which the entire semiconductor substrate 3 is imaged is I(x, y), and the light intensity is
  • the digital image processing device 40 is configured to be recorded as a pixel map I (x, y) 45.
  • the stepwise light intensity smoothing process may be performed by a moving average between adjacent pixels of the light intensity pixel map I (x, y) 45.
  • the unit image body identifying unit 81 is configured in the digital image processing device 40, and the unit image body identifying unit 81 is formed in the screen frame of the digital image processing device 40 based on a predetermined criterion from the light intensity pixel map 45 for each pixel on the image data frame 42.
  • the unit image body 80 of the light emitter to be displayed is specified, and the unit image body identification unit 81 digitally identifies the unit image body 80 so as to generate the unit image body mapping data 46 to the pixel map 43.
  • the image processing device 40 is configured.
  • the i-th and j-th unit image bodies 80 in the coordinate system on the image data frame 42 are specified as the unit image body 80 of the coordinates (I, J) in the unit image body mapping data 46 coordinate system.
  • the digital image processing device 40 includes a micro LED identification unit 90, and the individual micro LEDs 2 arranged in an array on the semiconductor substrate 3 are identified by using the unit image body 80 as a clue.
  • the micro LEDs 2 arranged relatively, for example, in a grid pattern on the semiconductor substrate 3, have pixels that exhibit a peak optical energy intensity value with respect to the surroundings on a predetermined criterion, for example, an image frame 42, as a unit image body 80.
  • the center between the centers of two adjacent unit image bodies 80 is assumed to be the rectangular boundary of the unit image body 80 existing between the two (indicated by reference numeral B in FIG.
  • each unit image body 80 corresponds to, for example, 9 pixels of x1 to x3 and y1 to y3. , (I (x1,y1),I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1),
  • the unit video image identifying unit 81 determines that the pixel element of I(x3,y2), I(x3,y3) ⁇ is included as a constituent element.
  • the micro LED identification unit 90 is configured to generate After all, the (I, J) th micro LED 2 corresponds to the unit image body 80 (I, J), and the pixel values (I (x1, y1), I (x1, y2), I (x1, y3), It is composed of I (x2, y1), I (x2, y2), I (x2, y3), I (x3, y1), I (x3, y2), I (x3, y3).
  • the digital image processing device 40 is configured to operate a predetermined optical energy intensity calculation formula as an arithmetic logic for calculating the light intensity of each micro LED 2. For example, a unit image body is displayed on the light intensity pixel map 45.
  • the sum of the graded light intensity of the pixels on the image frame 42 corresponding to the micro LED 2 corresponding to 80, in the above example, ⁇ (x1,y1),I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1), I(x3,y2),I(x3,y3) ⁇ May be adopted as the light intensity.
  • the light energy intensity of each micro LED 2 corresponding to the unit image body 80 determined in this way is the light energy measured by the filter drive mechanism 60 in the arrangement without the optical filter 50 by accepting the control signal from the control device 70.
  • the digital image processing device 40 is configured so as to be stored in the memory 41 as the intensity value.
  • each micro LED 2 corresponding to the unit image body 80 is measured even after being changed to the arrangement with the optical filter 50 by the filter driving mechanism 60, and corresponds to the same unit image body 80.
  • the digital image processing device 40 is configured so that the light energy intensity value of the micro LED 2 is also measured as the light energy intensity value of the micro LED 2 in the arrangement with the optical filter 50.
  • a micro LED inspection unit 100 is configured in the digital image processing device 40, and a module configured in the micro LED inspection unit 100 is configured to operate a predetermined emission wavelength calculation formula of the micro LED 2 as an arithmetic logic.
  • a predetermined emission wavelength calculation formula of the micro LED 2 as an arithmetic logic.
  • the look-up table 109 that is pre-configured and stored in the memory 41, if an argument is specified, the look-up table 109 is searched by this, and the emission wavelength of the micro LED 2 that is the target data value corresponding to the argument is referred to.
  • the lookup table 109 is configured as possible.
  • the optical energy intensity value ratio with / without the optical filter 50 may be used.
  • the lookup table 109 has the optical energy intensity value in the arrangement without the optical filter 50 and the arrangement with the optical filter 50. It is preferable that the relationship between the ratio to the light energy intensity value in the above and the emission wavelength is created as array data.
  • the look-up table 109 uses an optical filter whose filter characteristics are calibrated by a light source having a known light wavelength, and uses the optical energy intensity value in the arrangement without the optical filter and the optical energy in the arrangement with the optical filter.
  • the look-up table 109 created based on the calibration is preferable for the relationship between the ratio of the intensity and the emission wavelength.
  • the formula for calculating the emission wavelength of the micro LED 2 is such that, when the emission wavelength corresponding to the measured value of the light energy intensity ratio is referred to, for the intermediate value, the two most recent arguments across the intermediate value are used.
  • the look-up table 109 may be configured so that the two reference wavelengths given by can be adjusted by proportional division interpolation to determine the emission wavelength.
  • the proportional complementation may be linear complementation or approximated complementation using a quadratic regression line, as long as it fits an appropriate straight line or curve.
  • Micro LEDs 2 are formed in an array on a semiconductor substrate 3 mounted and fixed on a stage 4 of the micro LED light emission inspection apparatus 1 shown in FIG. 3 (hereinafter, in the present embodiment, the micro LED array 2 is also referred to as “micro LED array 2”). Say).
  • the micro LED 2 is carried out to measure the performance as an LED such as the light intensity and the emission wavelength of the micro LED after the production progresses to the stage where the micro LED can emit light during the micro LED manufacturing process.
  • the screen panel of the display device is often larger than the semiconductor substrate 3, and the utilization efficiency of the LED is taken into consideration in the micro device on the semiconductor substrate 3.
  • the LED chips are once individually cut out from the semiconductor substrate 3 and then joined at the time of assembling the display device binding.
  • the micro LED 2 is cut out from once and then the adjacent micro LED chip is cut out from another semiconductor substrate 3 or the same semiconductor substrate 3 is cut out. Chips having different manufacturing process conditions such as those cut from the straight 3 but also cut from non-adjacent, separated parts are assembled into a display device (not shown) product.
  • the micro LED light emission inspection device 1 of the present embodiment has a predetermined performance range with respect to the micro LED 2 manufactured on the semiconductor substrate 3 in which the micro LEDs 2 to be individually separated are arranged in an array and are formed on the surface.
  • the micro LED light emission inspection device 1 of the present embodiment enables the digital image processing device 40 to measure the light intensity, the light emission wavelength, etc. of the micro LED 2 at high speed. The details will be described below.
  • the micro LED light emission inspection device 1 shown in FIG. 3 when the micro LED 2 on the semiconductor substrate 3 mounted and fixed on the stage 4 is made to emit light by the power feeding mechanism 10, the light emission is arranged in the imaging device 30.
  • a video signal is generated in the existing image sensor 31, and is taken into the digital image processing apparatus 40 via the control line.
  • an optical filter 50 that can be arranged on the optical path between the image pickup device 30 and the micro LED 2 to selectively distribute the video signal of the transmitted light of each color of RGB, each color of each color can be selected. It is possible to measure the performance of the micro LED2 as an LED such as the light intensity and the emission wavelength.
  • the optical filter 50 when measuring the red light emission performance, is designed to measure a wavelength range of 610 nm to 650 nm with a wavelength range of 610 nm to 650 nm centered around the wavelength of 630 nm corresponding to the design condition. It is a band pass filter.
  • the transmission filter of one embodiment is a color absorption filter in which a glass material serving as a substrate is mixed with a light absorbing material.
  • the optical filter 50 can be moved in and out of the optical path by the filter driving mechanism 60, and in the first measurement of the light intensity and the emission wavelength, the filter driving mechanism 60 is controlled by the control signal from the control unit 71 of the control device 70.
  • the light emission of the micro LED 2 is measured without 50.
  • the light intensity measurement and the emission wavelength measurement of the micro LED 2 of the micro LED emission inspection device 1 shown in FIG. 3 are as described below.
  • the digital image processing device 40 corresponds to the part in which the light intensity of the image data frame 42 corresponds to the two-dimensional screen data frame arrangement in units of image data frames 42, so-called screen units.
  • the light intensity value for each pixel of the screen is stored in the memory mechanism 41 provided in the digital image processing device 40.
  • the light intensity pixel map 45 as map data suitable for the purpose of displaying the light intensity value as a whole as corresponding to the two-dimensional map of the screen, and the pixel map simply as representing the coordinate system on the image data frame 42. 43 herein.
  • the light intensity pixel map 45 is automatically generated like a video image recorder when the image signal is taken into the digital image processing device 40.
  • the light intensity pixel map 45 taken into the digital image processing device 40 is not directly associated with each micro LED 2 on the semiconductor substrate 3.
  • more than 1.5 million micro LEDs 2 are formed on the 6-inch semiconductor substrate 3 on the wafer with a dot pitch of 0.1 mm or less, and 1.5 million micro LEDs 2 can be instantly specified.
  • one pixel of the two-dimensional screen data frame array does not necessarily correspond to one micro LED, and it is preferable that a plurality of pixels correspond to one micro LED 2.
  • the concept of the micro LED image unit 81 is based on the prediction that the light emitters of almost the same form will be recognizable in the image on the image data frame 42. Introduce the above object. Such a concept is particularly suitable for simultaneous measurement of a large number of micro LEDs formed on the wafer in the same repeating unit with a dot pitch of 0.1 mm or less.
  • the image unit 81 of the micro LED is specified from the light intensity of the light intensity pixel map 45 and the geometry information of each pixel based on a predetermined criterion.
  • the predetermined criteria specifies pixels having a peak light energy intensity value with respect to the surroundings as each central portion of the unit image body 80, and when a certain unit image body 80 is selected, each of the adjacent unit image bodies 80 is selected.
  • the center between the centers of the above is defined as a rectangular boundary with the adjacent unit image body 80.
  • the interval should correspond to the dot pitch of 0.1 mm, for example, and the tolerance may be taken into consideration.
  • the image unit 81 of the micro LED can be identified at high speed, and the area to be occupied by the focused micro LED can be identified more quickly.
  • the introduction of the concept of the image unit 81 of the micro LED and the predetermined criteria suitable for identifying the image unit 81 from the screen frame information require that more than 1.5 million measurement targets be collectively processed. It contributes to the provision of a micro LED light emission inspection apparatus suitable for inspection of semiconductor substrate units formed on the surface by arranging micro LEDs 2 occupying a rectangular region having a size of 100 ⁇ m square or less in an array.
  • each unit image object 80 of the light emitter is specified in the image data frame 42, and all the micro LEDs 2 to be observed in the image data frame 42 are the pixels in the image data frame 42.
  • the concept of the present invention defines that a pixel map 43 for the micro LED 2, that is, a micro LED map 44, has been generated when it is mapped to. With such a concept, each micro LED 2 on the semiconductor substrate 3 which originally has its own individuality is comprehensively conceptualized as a micro LED map 44, which has an effect of facilitating the treatment suitable for batch processing.
  • a more efficient memory consumption means can be provided.
  • a pixel on the light intensity pixel map 45 corresponding to the specified rectangular area is regarded as belonging to the micro LED, and the light intensity provided by the pixel is determined. It is characterized in that the light energy intensity emitted from the micro LED is calculated by a predetermined light energy intensity calculation formula.
  • the predetermined light energy intensity calculation formula is a sum of stepwise light intensities of pixels included in one specific micro LED on the light intensity pixel map 45.
  • the gradual intensity is a numerical value of the light intensity in which the light intensity is digitally evaluated as a stepwise value by a predetermined contrast, and the stepwise shape may be a linear stepwise shape.
  • the part may be steep in beta function, and the observation points in the area may not necessarily be evaluated as contributing equally, for example, the numerical value in the central part may be weighted, but in this way, the micro LED Taking the sum of the stepwise light intensities of the included pixels and using the light intensities observed in all the pixels associated with the micro LED has the advantage of smoothing out the disturbances associated with measuring each and every pixel. Even if the light emission from the adjacent micro LED is mixed, the evaluation means also provides the offsetting effect that the light emission from the micro LED is regarded as that of the adjacent micro LED, and as a whole, it is more accurate. It has an excellent effect of being useful for evaluating the light emitting performance of one micro LED.
  • the optical filter 50 is an optical filter whose filter transmitted light intensity monotonically increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition. Is characterized as.
  • An example of an optical filter in which the light intensity transmitted through the filter monotonically increases or decreases in a predetermined light wavelength band is an optical filter 50 representing a graph adjacent to the optical filter 50 in FIG. The horizontal axis of this graph is the light wavelength, and the vertical axis is the ratio of the light intensity when the optical filter 50 is not present and when the optical filter 50 is present.
  • optical filter 50 With such an optical filter 50, a spectrometer is not required for determining the emission wavelength of the micro LED, without the optical filter 50 of the light intensity given by each pixel map 43, with the optical filter 50 (hereinafter, "optical It is possible to determine the emission wavelength of the micro LED only by measuring the light intensity in two ways (with filter/without optical filter) or with/without optical filter).
  • the micro LED light emission inspection device 1 of the present invention provides a remarkable effect that can realize an order of magnitude higher speed processing than the conventional technology requires 1500 seconds.
  • means for using the optical filter 50 in which the filter transmitted light intensity monotonously increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to the design condition is a method of using two types of light: no optical filter 50/with optical filter 50. It will be described that the emission wavelength of the micro LED is determined only by measuring the intensity.
  • FIG. 4 shows a case where an optical filter 50 whose filter transmitted light intensity monotonically increases is used.
  • the filter transmitted light intensity in the predetermined light wavelength band from 605 nm to 655 nm shown in FIG. 4 is 655 nm in the light wavelength band, and the transparent light intensity ratio is 1.0.
  • the optical filter 50 having the characteristic of increasing monotonically with the curve shown as the light intensity ratio two types of measurement of the light intensity ratio with and without the optical filter are 0.83 as shown in FIG. At this time, it can be seen that the curve corresponding to the vertical axis of 0.83 in the curve shown in FIG.
  • the emission wavelength of the micro LED 2 could be determined to be 640 nm only by measuring the two types of light intensities with and without the optical filter 50. Then, the emission wavelength determined in this way may be smoothed by moving average between adjacent micro LEDs. The smoothing process has an advantage of reducing the influence of noise.
  • the emission wavelength can be uniquely determined by the association based on the two measurement ratios of the light intensity with/without the optical filter.
  • FIG. 4 is associated with the emission wavelength by a monotonically increasing curve, it is not a monotonically increasing curve but a monotonically decreasing curve, and the emission wavelength and the measurement ratio of two types of light intensity with and without an optical filter are shown. May be associated with.
  • the micro LED light emission inspection device 1 configured as described above has a functional configuration of a modified embodiment.
  • the control device 70 further controls the components of the micro LED light emission inspection device 1. It is provided with a CPU 86 and a memory 87 used for control flow management.
  • the control unit 71 can transmit a control signal to the filter drive device via the transmission unit 72 and the transmission line 88.
  • a communication path 89 is provided between the control device 70 and the digital image processing device, and two-way communication is possible via the transmission unit 72.
  • the control device 70 configured to integrally control the digital image processing device 40 and the filter driving device 60 is configured to enable the automatic operation of the micro LED light emission inspection device 1.
  • ⁇ Micro LED lighting step S1> With the start of the processing of the control unit 71 of the control device 70 of the micro LED light emission inspection device 1, the control moves to the micro LED lighting step, and the control unit 71 is configured so that the micro LED is turned on by the power feeding mechanism 30. .. When the micro LED lighting step is executed at the same time as the processing of the control unit 71 is started, the control continues, and the module module of the filter movement instruction step configured in the control unit 71 is activated.
  • ⁇ First filter movement instruction step S2> control is passed to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting the status in which the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control unit 71 is modularized so as to immediately wait for the notification instruction of the start instruction of the first imaging. Transition to the start instruction notification waiting state.
  • First imaging start instruction step S4 When the control unit 71 of the control device 70 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit 71 immediately receives the first imaging start instruction notification. An imaging start instruction signal is generated.
  • the notification of the start instruction of the first imaging may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 71 receives the status signal after the completion of the first filter moving step, for example.
  • the timer may be configured to be driven in the control unit 71 so that the first imaging start instruction notification is generated when the time elapses.
  • a timer event is generated after a lapse of a predetermined time, and the control unit 71 is notified of the start instruction notification of the first imaging.
  • the control unit 71 transmits a first image capture start instruction signal to the digital image processing apparatus 40 via the communication path 89, and then waits for the second filter movement instruction. Has been done. After the execution of the module that activates the first imaging start instruction step, the processing of the module transits to the second filter movement instruction waiting state.
  • ⁇ First imaging step S5> When the digital image processing apparatus receives the first image capturing start instruction signal from the control unit 71 via the communication path 89, the digital image processing apparatus receives the video signal from the image capturing apparatus 30 and stores the image data frame stored in the digital image processing apparatus 40. And a pixel map 43 on 42 to generate a light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed, and the light intensity pixel map is stored in the memory in the digital image processing apparatus. After the operation of the module, control is subsequently transferred to the processing of the unit image body identification unit 81.
  • the unit image body identification unit 81 identifies the unit image body 80 of light emission from the light intensity pixel map based on a predetermined criterion, further generates unit image body mapping data to the pixel map 43, and digitally processes this.
  • the digital image processing device 40 is configured as a module so as to be stored in the memory 41 in the device 40.
  • the micro LED identification unit 90 further identifies the micro LEDs 2 arranged in a plurality of arrays from the unit image body 80 and maps the corresponding micro LEDs 2 on the pixel map 43.
  • the digital image processing device 40 is modularly configured to generate the micro LED mapping data 44 and store the micro LED mapping data 44 in the memory 41. Subsequently, the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the micro LED map, and the light energy intensity value in the arrangement without the optical filter of the micro LED is digitally imaged.
  • the digital image processing device 40 is configured as a module so as to be stored in the memory 41 in the processing device 40.
  • the control device 70 is configured to be subsequently controlled to execute the process for measuring the unfiltered light intensity.
  • ⁇ Second filter movement instruction step S7> When the control unit 71, which has been waiting for the second filter movement instruction, receives the second filter movement instruction, it generates a signal for disposing the optical filter 50 in the optical path 21 based on the instruction, and transmits the signal via the transmission path 88.
  • the module is configured to transmit the signal to the filter drive mechanism 60. After execution of the module, the module is configured to wait for the second imaging start instruction, and the control unit remains in the waiting state.
  • ⁇ Second filter moving step S8> The filter driving mechanism 60 receives a signal for arranging the optical filter 50 in the optical path 21 from the control unit 71 via the transmission path 88, and the filter driving mechanism 60 is modularly configured so as to arrange the optical filter 50 in the optical path 21.
  • ⁇ Second imaging start instruction step S9> When the control unit 71 accepts the second imaging start instruction notification in the second imaging start instruction waiting state which is the final process of the second filter movement instruction step, it generates a second imaging start instruction signal and communicates.
  • the module is configured to transmit a second imaging start instruction signal to the digital image processing apparatus 40 via the path 89.
  • the filter driving mechanism 60 may transmit the status signal after the second filter moving step is completed, and the control unit 71 may receive the status signal.
  • the timer may be configured to be driven in the control unit 71 so that the second imaging start instruction notification is generated when a predetermined time has elapsed.
  • the processing of the control unit 71 becomes idle and waits for the next task.
  • the digital image processing apparatus 40 receives the second imaging start instruction signal via the communication path 89
  • the digital image processing apparatus 40 receives the video signal from the imaging apparatus 30 and measures each pixel in the pixel map 43 on the image data frame 42.
  • the module is configured to generate a light intensity pixel map on which stepwise light intensities are superimposed and store this in the memory 41 in the digital image processing device 40.
  • the unit image body identifying unit 81 Pass control to the processing of.
  • the unit image body 80 of the light emission is specified from the light intensity pixel map based on a predetermined criterion, and further, the unit image body mapping to the pixel map 43 is performed.
  • Data is generated and stored in the memory 41 in the digital image processing device 40.
  • the micro LED identification section 90 a plurality of micro LEDs arranged in the array is specified from the unit image body 80 and the corresponding micro LED is identified.
  • the digital image processing device 40 is modularly configured to map LEDs on the pixel map 43 to generate the micro LED mapping data 44 and store the micro LED mapping data 44 in the memory.
  • the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and the light energy intensity in the arrangement with the optical filter 50 of the micro LED is determined.
  • the digital image processing device 40 is modularly configured so as to be stored as a value in the memory 41 in the digital image processing device 40. After the module processing, the control is passed to the processing in the micro LED inspection unit in the digital image processing device 40.
  • Step S12 of calculating ratio of light intensity without filter and light intensity with filter> the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory 41 in the digital image processing device 40, and the light in the arrangement without the optical filter 50 corresponding to the micro LED is read.
  • the energy intensity value is read from the memory 41 in the digital image processing device 40, and the unfiltered light is obtained by the light energy intensity value of the micro LED in the arrangement with the optical filter 50 and the light energy intensity value in the arrangement without the optical filter 50.
  • the digital image processing device 40 is modularly configured to calculate the ratio of the intensity and the filtered light intensity.
  • the digital image processing device 40 is modularly configured so that in the micro LED inspection unit, the emission wavelength of the micro LED is determined by a predetermined emission wavelength calculation formula of the micro LED.
  • ⁇ Emission wavelength data output step S14> After the above processing is completed and the micro LED emission wavelength data is obtained, the micro LED inspection data is configured to be output, and the emission wavelength data is output from the digital image processing device 40 including the external connection path and the data output unit.
  • the digital image processing device 40 is modularly configured to output from the data output unit 120 to the external connection path via the memory 41 in the digital image processing device 40.
  • the external connection path may be via a direct transmission path to the computer, or may be stored in the permanent storage 76 connected to the computer 200 connected via the network 75 via the LAN connection via the communication unit 110. It may be output to the outside.
  • the relationship between the plurality of emission wavelengths, the unfiltered light intensity and the filtered light intensity ratio may be configured, for example, in a lookup table 109 (not shown in FIG. 5). Good.
  • the filter characteristics are calibrated by a light source (not shown) having a known light wavelength for associating the light intensity with and without the light filter with the light emission wavelength. And a look-up of the emission wavelength created based on the calibration regarding the relationship between the ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter and the emission wavelength. It is realized by the table 109.
  • the lookup table 109 stores (light wavelength, light energy intensity value ratio) indicated by black dots on the curve in FIG. In this way, one embodiment of the micro LED light emission inspection device 1 according to the present invention has a monotonically increasing curve as shown in FIG.
  • the two measurement ratios of the light intensity with and without the optical filter are measured.
  • the emission wavelength can be uniquely determined by the measurement values of the two types of light intensity with and without the optical filter.
  • the advantageous effect that the emission wavelength of the micro LED can be determined only by measuring the light intensity of, and, for example, the measurement with or without the optical filter of 1.5 million measurement objects can be collectively processed by the digital image processing device.
  • discrete points see black circles on the curve in FIG. 4
  • the emission wavelength corresponding to the intensity ratio closest to the measurement ratio of the light intensity is the micro LED to be observed. It may be the emission wavelength.
  • the intermediate value of the registered values of the look-up table 109 (refer to the relationship between the variable range between the adjacent black circles on the curve of FIG. 4 and the range thereof).
  • the emission wavelength calculation formula of the micro LED refers to the emission wavelength corresponding to the registered value of the optical energy intensity ratio in the vicinity of the measured value of the optical energy intensity ratio in the lookup table 109, and the optical energy is referred to.
  • the emission wavelength may be determined by adding proportional division interpolation to the intermediate value of the intensity ratio measurement values based on the registered values of two points that cross the optical energy intensity ratio measurement values.
  • This complementation may be suitably determined from the relationship between the curve shape and the registration value interval, whether linear complementation or quadratic curve complementation.
  • the lookup table 109 is viewed from the digital image processing apparatus 40 via a connection interface to the permanent stress 74 or 76 or 79, as shown in the physical configuration diagram of the modified embodiment of FIG.
  • the filter characteristics and look-up table 109 may be accepted as master data from persistent storage.
  • the connection interface may be the USB 74.
  • the look-up table 109 recorded in the USB compatible memory device 74 is read into the memory of the digital image processing apparatus 40.
  • the persistent storage may be a device 76 connected to a server connected to a LAN, in which case the connection interface may be a wired LAN connection interface 75 or a wireless LAN connection interface (not shown), in this case connecting to a network.
  • the lookup table 109 stored in the other device 76 is read into the memory of the digital image processing apparatus 40.
  • the storage source of the lookup table 109 may be stored in a persistent storage device 79 connected to a server device 78 provided by a cloud computing service 77 connected to the network.
  • FIG. 8 is a control flow in which the emission wavelength calculation step S13 of FIG. 6 is replaced by the lookup table lookup method emission wavelength determination step S15.
  • the lookup table 109 is persistent as master data via a connection interface to persistent storage 74 or 76 or 79, as described in the previous paragraph.
  • the connection interface may be USB 74, and the look-up table 109 recorded in the USB-compatible memory device 74 may be read into the memory 41 of the digital image processing device 40.
  • the emission wavelength determining step S15 of the lookup table lookup method which is an alternative to the control flow of FIG. 8, will be described below.
  • ⁇ Emission wavelength determination step S15 of lookup table reference method> After execution of the step S12 of calculating the ratio of the light intensity without filter and the light intensity with filter, the execution process flow control is passed to the micro LED inspection unit 100.
  • the digital/digital image processing apparatus 40 is module-configured to determine the emission wavelength of the micro LED by referring to the memory 41 of the look-up table 109 in the micro LED inspection unit 100.
  • the processing control is performed. Is passed to the light emission data output step. Since the other step processing is the same as the step processing described in paragraph 0046, the description will be limited to the description referring to paragraph 0046 from this paragraph, and duplicate description will be omitted.
  • the modified embodiment of the micro LED light emission inspection device 1 according to the present invention further includes a light source having a light wavelength variable mechanism.
  • the control device 70 includes a CPU 86 and a memory 87 used for control flow management for controlling the components of the micro LED light emission inspection device 1, and the control unit 71 includes a transmission unit 72 and a transmission unit 72.
  • a control signal can be transmitted to the filter driving device via a path 88, a communication path 89 is provided between the control device 70 and the digital image processing device, and bidirectional communication can be performed via a transmission unit 72.
  • the LED light emission inspection device 1 includes a light wavelength variable mechanism 116 as a light source, and a wavelength light source 106 of a known light wavelength, which is communicable via the control unit 71 and the transmission unit 72, for irradiating the reference light 6. ..
  • the purpose of providing a light source having a variable mechanism of light wavelength is to make it possible to select a desired light wavelength, and when creating a look-up table, select a light emission wavelength at a desired sampling interval, with no filter light intensity and with a filter.
  • the control device 70 manages the control flow for controlling the components of the micro LED light emission inspection device 1. It includes a CPU 86 and a memory 87 to be used, the control unit 71 can transmit a control signal to a filter driving device via a transmission unit 72 and a transmission line 88, and a communication path is provided between the control device 70 and the digital image processing device.
  • the micro LED light emission inspection apparatus 1 is provided with the control unit 70 which is provided with 89 and is configured to be capable of bidirectional communication via the transmission unit 72 and thus integrally controllable with the digital image processing apparatus 40 and the filter driving apparatus 60. It is configured to enable automatic operation of.
  • the configuration and operation of one embodiment will be described with reference to a schematic diagram 10 in which a flowchart S200 of a control flow is drawn across the components.
  • ⁇ Optical wavelength initialization step S21> With the start of the processing of the control unit 71 of the control device 70, the control proceeds to the optical wavelength initialization step so that the variable mechanism 116 updates the set value of the optical wavelength of the light source 106 to the initial value and the transmission unit 72 and the transmission line.
  • the control unit 71 is modularized so that a control signal can be transmitted to the variable mechanism 116 via 88. After transmission, control moves to the calibration light source lighting step.
  • ⁇ Calibration light source lighting step S22> The micro LED light emission inspection device 1 is modularly configured so that the calibration light source 106 is remotely turned on. When the calibration light source lighting step is executed, the control continues, and the module module of the filter movement instruction step, which is configured in the control unit 71, is activated. The control and the operation to the filter driving mechanism 60 after this are the same as the control and the operation described in the paragraph 0046.
  • ⁇ First filter movement instruction step S23> control is passed to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting the status in which the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control unit 71 is modularized so as to immediately wait for the start instruction notification of the first imaging. Transition to the start instruction notification waiting state.
  • ⁇ First filter moving step S24> The filter driving mechanism 60 receives the optical filter 50 from the optical path 21 as soon as it receives a signal via the transmission path 88 between the filter driving mechanism 60 and the control device 70 for selecting the status that the optical filter 50 does not exist in the optical path 21.
  • First imaging start instruction step S25 When the control unit 71 of the control device 70 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit 71 immediately receives the first imaging start instruction notification. An imaging start instruction signal is generated.
  • the notification of the start instruction of the first imaging may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 71 receives the status signal after the completion of the first filter moving step, for example.
  • the timer may be configured to be driven in the control unit 71 so that the first imaging start instruction notification is generated when the time elapses.
  • a timer event is generated after a lapse of a predetermined time, and the control unit 71 is notified of the start instruction notification of the first imaging.
  • the control unit 71 transmits a first image capture start instruction signal to the digital image processing apparatus 40 via the communication path 89, and then waits for the second filter movement instruction. Has been done. After the execution of the module that activates the first imaging start instruction step, the processing of the module transits to the second filter movement instruction waiting state.
  • ⁇ First imaging step S26> When the digital image processing apparatus receives the first image capturing start instruction signal from the control unit 71 via the communication path 89, the digital image processing apparatus receives the video signal from the image capturing apparatus 30 and stores the image data frame stored in the digital image processing apparatus 40. And a pixel map 43 on 42 to generate a light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed, and the light intensity pixel map is stored in the memory in the digital image processing apparatus. After the operation of the module, control is subsequently transferred to the processing of the unit image body identification unit 81.
  • the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map
  • the unit image body 80 of the calibration light source light is specified based on a predetermined criterion
  • the pixel map 43 The digital image processing device 40 is modularly configured so as to generate unit video object mapping data to and store it in the memory 41 in the digital image processing device 40.
  • the calibration light source mapping is regarded as micro LED mapping
  • the micro LED identifying unit 90 the micro LED regarded as the calibration light source mapping from the unit image body 80 is pixel-mapped.
  • the digital image processing apparatus 40 is modularly configured so that the micro LED mapping data 44 is generated by mapping on the memory 43 and is stored in the memory 41. Next, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula, and the calibration light source regarded as the light emission of the micro LED is arranged without an optical filter.
  • the digital image processing device 40 is modularly configured to store the light energy intensity value in the memory 41 in the digital image processing device 40.
  • the control device 70 is configured to be subsequently controlled to execute the process for measuring the unfiltered light intensity.
  • ⁇ Second filter movement instruction step S28> When the control unit 71, which has been waiting for the second filter movement instruction, receives the second filter movement instruction, it generates a signal for disposing the optical filter 50 in the optical path 21 based on the instruction, and transmits the signal via the transmission path 88.
  • the module is configured to transmit the signal to the filter drive mechanism 60. After the execution of the module, the module is configured to wait for the second imaging start instruction, and enters the control unit waiting state.
  • ⁇ Second filter moving step S29> The filter driving mechanism 60 receives a signal for arranging the optical filter 50 in the optical path 21 from the control unit 71 via the transmission path 88, and the filter driving mechanism 60 is modularly configured so as to arrange the optical filter 50 in the optical path 21.
  • ⁇ Second imaging start instruction step S30> When the control unit 71 accepts the second imaging start instruction notification in the second imaging start instruction waiting state which is the final process of the second filter movement instruction step, it generates a second imaging start instruction signal and communicates.
  • the module is configured to transmit a second imaging start instruction signal to the digital image processing apparatus 40 via the path 89.
  • the filter driving mechanism 60 may transmit the status signal after the second filter moving step is completed, and the control unit 71 may receive the status signal.
  • the timer may be configured to be driven in the control unit 71 so that the second imaging start instruction notification is generated when a predetermined time has elapsed.
  • the processing of the control unit 71 becomes idle and waits for the next task.
  • the digital image processing apparatus 40 receives the second imaging start instruction signal via the communication path 89
  • the digital image processing apparatus 40 receives the video signal from the imaging apparatus 30 and measures each pixel in the pixel map 43 on the image data frame 42.
  • the module is configured to generate a light intensity pixel map on which stepwise light intensities are superimposed and store this in the memory 41 in the digital image processing device 40.
  • the unit image body identifying unit 81 Pass control to the processing of.
  • the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the calibration light source light is determined according to the predetermined criteria.
  • the unit image body mapping data to the pixel map 43 is generated, and the unit image body mapping data is stored in the memory 41 in the digital image processing device 40.
  • the digital image processing device 40 is modularly configured to generate the micro LED mapping data 44 regarded as mapping and store the micro LED mapping data 44 in the memory 41.
  • the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula from the light intensity on the micro LED map.
  • the digital image processing device 40 is modularized so as to be stored in the memory 41 in the digital image processing device 40 as the light energy intensity value in the arrangement with the filter 50.
  • the control is passed to the processing in the micro LED inspection unit in the digital image processing device 40. ⁇ Ratio calculation step S33 of light intensity without filter and light intensity with filter>
  • the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 40, and the calibration in the arrangement with the optical filter 50 is performed.
  • the digital image processing device 40 is modularly configured to calculate the ratio of the unfiltered light intensity to the filtered light intensity based on the light energy intensity value of the light source and the light energy intensity value of the arrangement without the optical filter 50. There is. When this module is executed, the process goes to the emission wavelength calculation step. ⁇ Emission wavelength calculation step S34> Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 40 is module-configured so that the emission wavelength of the micro LED is determined by a predetermined emission wavelength calculation formula of the micro LED. When this module is executed, the process goes to the light source wavelength and light intensity ratio recording step.
  • ⁇ Light source wavelength and light intensity ratio recording step S35> the digital image processing device 40 is module-configured so as to store a known light source wavelength/light intensity ratio in the memory 41.
  • the process proceeds to the light source wavelength update step.
  • ⁇ Light source wavelength updating step S36> the digital image processing apparatus 40 is modularized so as to update the set value of the light wavelength of the source with a predetermined increment value.
  • this module is executed, the process proceeds to a determination step of determining a look-up table completion condition.
  • the digital image processing device 40 is modularly configured so as to check whether the light wavelength of the light source after updating exceeds a predetermined boundary value and branch the light. When this module is executed, the process proceeds to the look-up table creation step when it exceeds, and branches to the wavelength initialization step when it does not exceed and initializes with the updated optical wavelength.
  • ⁇ Lookup table creation step S38> Following this, the micro LED inspection unit 100 creates a look-up table 109 from a set of a plurality of wavelength and light intensity ratios stored in the memory 37, and the digital image processing device 40 so as to store the lookup table 109 in the memory 41. Is modular. When this module is executed, the lookup table 109 is completed and the processing ends.
  • the look-up table can be output, and the digital image processing device 40 having an external connection path and a data output unit is provided.
  • the digital image processing device 40 is preferably configured as a module so that the emission wavelength data is output from the data output unit 120 to the external connection path via the memory 41 in the digital image processing device 40.
  • the external connection path may be via a direct transmission path to the computer, or may be stored in the permanent storage 76 connected to the computer 200 connected via the network 75 via the LAN connection via the communication unit 110. It may be output to the outside. After being stored in the persistent storage 76, it may be configured to be distributed to a plurality of digital image processing devices 40.
  • Embodiment of Optical Filter Inspection Device 101 Used in Micro LED Emission Inspection Device 1 The present invention provides an optical filter inspection device used in the micro LED emission inspection device 1 in another aspect.
  • the semiconductor substrates formed on the surface of the micro LEDs 2 are arrayed in an array and occupy a rectangular area of 100 ⁇ m square or less to be individually separated for the calibration of the characteristics of the optical filter 50.
  • the same number of reflectors 102 (hereinafter also referred to as reflector array 102) are formed on the surface at least in a predetermined region with the design conditions of the micro LEDs to be inspected to be arranged in an array.
  • the substrate 103 is mounted at a position corresponding to the semiconductor substrate 3 of the micro LED light emission inspection device 1, a light projection mechanism 104 for reflected light of the reflector 102, a light guide mechanism 105 to the light projection mechanism, And a variable wavelength light source 106 having a known wavelength of the light projection light.
  • Other configurations are the same as those of the micro LED light emission inspection device 1 according to the embodiment, and the same reference numerals indicate the same configurations.
  • the optical filter inspection device 101 used in the micro LED emission inspection device 1 includes a light projection mechanism 104, a light guide mechanism 105, a variable wavelength light source 106, an optical lens 20, and an imaging device. 30.
  • the optical filter inspection device 101 used for the micro LED light emission inspection device 1 including a physical structure such as a digital image processing device 140, an optical filter 50, a filter drive mechanism 60, and a control device 170.
  • the same components as those of the micro LED light emission inspection device 1 are denoted by the same reference numerals, and duplicate description may be omitted.
  • one embodiment of the optical filter inspection device 101 used in the micro LED emission inspection device 1 is as follows. As shown in the functional configuration diagram of FIG. 12, in the optical filter inspection device 101 used in the micro LED emission inspection device 1, the inspection target micro LEDs to be arranged in an array as wafers to be inspected. Substrate 103 having substantially the same number of reflectors 102 (hereinafter also referred to as reflector array 102) formed on the surface thereof in at least a predetermined area with the design conditions of 1 is mounted. The light emission of the variable wavelength light source 106 is adjusted to a predetermined wavelength, and the reflected light of the reflector 102 illuminated by the light projecting mechanism 104 via the optical path relayed via the light guiding mechanism 105 is again the light projecting mechanism.
  • the arrangement is such that the light is transmitted through 104 and is guided to the imaging device 30 having the image sensor 31 via the optical path passing through the optical filter 50 and the optical lens 20.
  • the optical filter 50 having a predetermined light wavelength band is arranged in the reflected light optical path 121 between the reflector 102 and the optical lens 20, and the light in the predetermined light wavelength band selectively transmitted by the optical filter 50 passes through the image sensor 31.
  • the image signal is generated in the imaging device 30 via the image pickup device 30.
  • the digital image processing device 140 includes a memory 41, is configured to receive a video signal from the imaging device 30, generate an image data frame 42 from the video signal, and store the image data frame 42 in the memory 41. Although not shown in the figure, a plurality of image frames 42 cover the area occupied by the reflector 102 formed on the entire substrate 103.
  • optical filter 50 is supported by a filter driving mechanism 60, and the filter driving mechanism 60 includes a receiving unit 62 for receiving a control signal from the control device 170.
  • the control device 170 includes a control unit 171 for generating a control signal of the control device 170 filter drive mechanism 60, which is configured to be selectively controllable by the filter drive mechanism 60 as to whether or not the optical filter 50 is present.
  • 171 is configured to be capable of system flow start and flow control
  • the control unit 171 includes a transmission unit 172 for transmitting the control signal of the filter drive mechanism 60, and the control signal of the control signal of the filter drive mechanism 60.
  • the filter drive mechanism receiver 62 is configured to be able to transmit.
  • the digital light intensity generated from the video signal has a stepwise light intensity for each pixel on the image data frame 42, and the plurality of image data frames 42 are bundled and held in the memory 41.
  • the light intensity for each pixel is configured as a light intensity pixel map 45 on the image data frame over the entire semiconductor substrate 3.
  • a unit image body identifying section 81 is configured, and within the screen frame of the digital image processing device 40 based on predetermined criteria from the light intensity pixel map 45 for each pixel on the image data frame 42.
  • the unit image object 80 of the light emitter that appears in FIG. 2 is specified, and the unit image object mapping data 46 to the pixel map 43 is generated.
  • the digital image processing device 140 is provided with a micro LED identification section 90, and the reflected light of the reflector 102 is regarded as the light emission of the micro LED 2, and the reflectors 102 arranged in an array on the substrate 103 are Similar to the case of the micro LED 2 in the LED light emission inspection device 1, the unit image body 80 is specified as a clue.
  • the reflector 102 which is relatively arranged on the substrate 103, specifies, for example, a pixel having a light energy intensity value of a peak value with respect to the surroundings on the image frame 42 as the central portion of the unit image body 80, Assuming that the center between the center portions of two adjacent unit image bodies 80 is a rectangular boundary between the two unit image bodies 80, the unit image bodies 80 are arranged in a plurality of arrays according to predetermined criteria for determining the form of the unit image body 80.
  • the micro LED identifying unit 90 is configured to generate the data of the micro LED mapping 48 that identifies the micro LED 2 regarded as the reflector 102 and maps the micro LED 2 on the pixel map 43 corresponding to the micro LED 2. The same as in the micro LED light emission inspection device 1.
  • the digital image processing device 140 is configured to operate a predetermined light energy intensity calculation formula as an arithmetic logic, and is regarded as the reflector 102 corresponding to the unit image object 80 on the light intensity pixel map 45, for example.
  • the sum of the stepwise light intensities of the pixels on the image frame 42 included in the micro LED 2 may be adopted as the light intensity.
  • the light energy intensity of each micro LED 2 corresponding to the unit image object 80 determined in this way is measured by the filter driving mechanism 60 in the arrangement without the optical filter upon receiving the control signal from the control device 70.
  • the digital image processing device 140 is configured so as to be stored in the memory 41.
  • each micro LED 2 regarded as the reflector 102 corresponding to the unit image body 80 is measured by the filter driving mechanism 60 in the arrangement with the optical filter 50, and corresponds to the unit image body 80.
  • the digital image processing apparatus 140 is configured such that the light energy intensity value is stored and held in the memory 41 as the light energy intensity value of the micro LED 2 regarded as the reflector 102 in the arrangement with the optical filter 50. ing.
  • the digital image processing device 140 is configured with a micro LED inspection unit 100, which is configured to operate a predetermined emission wavelength calculation formula of the micro LED regarded as the reflector 102 as an arithmetic logic.
  • the look-up table 109 is configured in advance and is configured on the memory 41. If an argument is specified, the look-up table 109 is searched by this and referred to as the emission wavelength of the micro LED 2 which is the target data value corresponding to the argument.
  • the lookup table 109 is configured as possible.
  • the argument may be, for example, a ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter, and the lookup table 109 does not include the optical filter 50.
  • the look-up table 109 uses the optical filter 50 whose filter characteristics are calibrated by the wavelength variable light source 106 that provides a predetermined light wavelength, and uses the optical energy intensity value and the optical filter without the optical filter in the arrangement with the optical filter.
  • the lookup table 109 created based on the calibration regarding the relationship between the ratio to the light energy intensity value and the emission wavelength in the arrangement of the light energy may be used.
  • the emission wavelength calculation formula of the micro LED 2 is referred to the emission wavelength corresponding to the measured value of the light energy intensity ratio, and the intermediate value is the latest two values that cross the intermediate value.
  • the look-up table 109 may be configured so that the emission wavelength is determined by adjusting the two reference wavelengths given by one argument by proportional division interpolation.
  • the optical filter inspection device 101 used in the micro LED emission inspection device 1 is provided with a variable wavelength light source 106 having a known optical wavelength, which is capable of communicating via the control unit 71 and the transmission unit 72, as a light source. It is provided to irradiate the reflector 102.
  • the optical filter inspection device 101 used in the micro LED emission inspection device 1 configured here has a control device 170 for managing the control flow for controlling the components of the optical filter inspection device 101.
  • the control unit 171 is provided with a CPU 86 and a memory 87 to be used, and the control unit 171 can transmit a control signal to the filter driving device and the optical wavelength variable mechanism 116 via the transmission unit 172 and the transmission path 88.
  • a communication path 89 is provided between the control device 170 and the digital image processing device 140 and the filter driving device 60 so that the communication device 89 and the filter driving device 60 can be integrally controlled.
  • the optical filter inspection apparatus 101 is configured to be capable of automatic operation. The following is a detailed description of a mechanism for performing an optical filter inspection by batch processing using a large number of reflector light sources modeled on a micro LED by automatic operation.
  • ⁇ Light wavelength initialization step S321> With the start of the processing of the control unit 171 of the control device 170, the control proceeds to the optical wavelength initialization step so that the variable mechanism 116 updates the set value of the optical wavelength of the light source 106 to the initial value and the transmission unit 172 and the transmission line.
  • the control unit 171 is modularized so that a control signal can be transmitted to the variable mechanism 116 via 88. After transmission, control moves to the calibration light source lighting step.
  • ⁇ Calibration light source lighting step S322> The optical filter inspection device 101 is modularized so that the calibration light source 106 is remotely turned on. When the calibration light source lighting step is executed, the control continues, and the module module of the filter movement instruction step, which is configured in the control unit 171, is activated.
  • First filter movement instruction step S323 control is passed to the first filter movement instruction step, and in this step, the control unit 171 generates a signal for selecting the status where the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter drive mechanism 60 via the transmission path 88, and then the control unit 171 is modularized so as to immediately wait for the start instruction notification of the first imaging, and the module processing is immediately performed for the first imaging. Transition to the start instruction notification waiting state.
  • ⁇ First filter moving step S324> As soon as the filter driving mechanism 60 receives a signal for selecting a status that the optical filter 50 does not exist in the optical path 21 via the transmission path 88 between the filter driving mechanism 60 and the control device 170, the optical filter 50 is removed from the optical path 21. It is configured to perform the first filter movement step of removing.
  • ⁇ First imaging start instruction step S325> When the control unit 171 of the control device 170 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification, which is the final process of the first filter movement instruction step, the control unit 171 immediately causes the first imaging start instruction notification to be received. An imaging start instruction signal is generated.
  • the notification of the start instruction of the first image capturing may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 171 receives the status signal after the first filter moving step is completed, for example.
  • the timer may be configured to be driven in the control unit 171 so that the first imaging start instruction notification is generated when the time elapses. In this case, a timer event is generated after the lapse of a predetermined time, and the control unit 171 is notified of the notification instruction to start the first imaging.
  • the control unit 171 is configured to wait for the second filter movement instruction after transmitting the first imaging start instruction signal to the image processing apparatus 140 via the communication path 89. ing.
  • the processing of the module transits to the second filter movement instruction waiting state.
  • First imaging step S326> When the digital image processing apparatus receives the first image capturing start instruction signal from the control unit 171 via the communication path 89, the digital image processing apparatus receives the video signal from the image capturing apparatus 30 and stores the image data frame stored in the digital image processing apparatus 140. It is modularized to generate a light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map on 42, and to store this in the memory 41 in the digital image processing device 140. After the operation of the module, control is subsequently passed to the processing of the unit image body identifying unit 81.
  • the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map
  • the unit image body 80 of the reflected light of the calibration light source is specified based on a predetermined criterion.
  • the digital image processing device 140 is modularly configured so as to generate unit image body mapping data to a pixel map and store the data in the memory 41 in the digital image processing device 140.
  • the reflector mapping is regarded as the micro LED mapping data 4444, and the micro LED identification unit 90 pixel map the micro LED regarded as the reflector mapping from the unit image body 80.
  • the digital image processing device 140 is modularly configured so as to generate the micro LED mapping data 44 by performing the above mapping and store the micro LED mapping data 44 in the memory 41. Then, the light energy intensity of the micro LED 2 is determined from the light intensity on the light intensity map 45 on the micro LED map 44 by a predetermined light energy intensity calculation formula, and the reflected light of the reflector 102 regarded as the light emission of the micro LED is determined.
  • the digital image processing device 140 is modularly configured to store the light energy intensity value in the arrangement without the optical filter in the memory 41 in the digital image processing device 140. When the module for measuring the unfiltered light intensity is executed, the control device 170 is subsequently configured to be controlled to execute the process for measuring the filtered light intensity.
  • ⁇ Second filter movement instruction step S328> When the control unit 171 waiting for the second filter movement instruction receives the second filter movement instruction, the control unit 171 generates a signal for disposing the optical filter 50 in the optical path 21 based on the instruction, and transmits the signal via the transmission path 88. It is modularly configured to send the signal to the filter drive mechanism 60. After execution of the module, the module is configured so as to wait for the second imaging start instruction, and the module enters the control unit waiting state.
  • ⁇ Second filter moving step S329> The filter driving mechanism 60 receives a signal for arranging the optical filter 50 in the optical path 21 from the control unit 171 via the transmission path 88, and the filter driving mechanism 60 is modularly configured so as to arrange the optical filter 50 in the optical path 21.
  • ⁇ Second imaging start instruction step S330> The control unit 171 generates a second image capturing start instruction signal when accepting the second image capturing start instruction notification in the second image capturing start instruction waiting state, which is the final process of the second filter movement instruction step, and then performs communication.
  • the module is configured to transmit a second imaging start instruction signal to the digital image processing apparatus 140 via the path 89.
  • the filter driving mechanism 60 may transmit the status signal after the second filter moving step ends, and the control unit 171 may receive the status signal.
  • the timer may be configured to be driven in the control unit 171 so that the second imaging start instruction notification is generated when a predetermined time has elapsed. After the module operates, the processing of the control unit 171 becomes idle and waits for the next task.
  • the module is configured to generate a light intensity pixel map in which the target light intensity is superimposed and store the pixel map in the memory 41 in the digital image processing device 140.
  • the unit image body identifying unit 81 The digital image processing device 140 is configured to proceed to the processing.
  • ⁇ Measurement Step S332 of Light Intensity with Filter> In the digital image processing device 40, subsequently, in the unit image body identifying unit 81, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the calibration light source light is predetermined.
  • the unit image body mapping data to the pixel map is generated, stored in the memory 41 in the digital image processing device 140, and further reflected from the unit image body 80 in the micro LED identification unit 90.
  • the digital image processing apparatus 140 is modularly configured to generate the micro LED mapping data 44 regarded as body mapping and store the micro LED mapping data 44 in the memory 41. After this module processing, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula from the light intensity on the map.
  • the digital image processing device 140 is modularized so as to be stored in the memory 41 in the digital image processing device 140 as the light energy intensity value in the arrangement with the optical filter 50. After the module processing, control is passed to processing in the micro LED inspection unit in the digital image processing device 140.
  • the micro LED inspection unit the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 140, and the calibration in the arrangement with the optical filter 50 is performed.
  • the digital image processing apparatus 140 has a module configuration so as to calculate the ratio of the light intensity without a filter and the light intensity with a filter based on the light energy intensity value of the light reflected from the light source and the light energy intensity value of the arrangement without the optical filter 50. Has been done. When this module is executed, the process goes to the emission wavelength calculation step.
  • the digital image processing device 40 is module-configured so that the emission wavelength of the micro LED is determined by a predetermined emission wavelength calculation formula of the micro LED.
  • the process goes to the light source wavelength and light intensity ratio recording step.
  • the digital image processing device 140 is configured as a module so as to store the known ratio of the light source wavelength and the light intensity in the memory 41.
  • the process proceeds to the light source wavelength update step.
  • the digital image processing device 140 is modularly configured to update the set value of the light wavelength of the light source with a predetermined increment value.
  • the process proceeds to a determination step of determining a look-up table completion condition.
  • ⁇ Completion determination step S337> The digital image processing device 140 is modularly configured to check whether the light wavelength of the light source after updating exceeds a predetermined boundary value and branch the light.
  • the process proceeds to the look-up table creation step when it exceeds, and branches to the wavelength initialization step when it does not exceed and initializes with the updated optical wavelength.
  • a lookup table 109 is created from a set of a plurality of wavelength-light intensity ratios stored in the memory 41, and the digital image processing device 140 is configured to store the lookup table 109 in the memory 41.
  • the lookup table 109 is completed and the processing ends.
  • the optical filter inspection device 101 used in the micro LED emission inspection device 1 that can automatically generate the lookup table 109 even if there are many reflectors arranged in the same geometry as the micro LED. Provided.
  • the optical filter inspection device 101 used in the micro LED light emission inspection device 1 described in the above-described one embodiment and its modification is a micro LED light emission inspection device in any of the embodiments and its modifications described herein. Since the calibration operation having a high affinity with 1 can be performed integrally with the inspection by the micro LED light emission inspection device 1, the optical filter inspection device 101 may be incorporated into the micro LED light emission inspection device 1. By such integration, overlapping arrangement of parts can be avoided, lower-cost device arrangement can be performed, calibration can be performed at any time as necessary, and lookup table 109 can be created and updated. There is an advantage that the measurement can be performed relatively frequently, and the calibration can be performed in the same environment as the measurement of the micro LED 2, and the improvement of the inspection accuracy can be expected.
  • the optical filter inspection device 101 used in the micro LED emission inspection device 1 occupies a rectangular area having a size of 100 ⁇ m square or less that should be individually separated for calibration of the characteristics of the optical filter 50.
  • the semiconductor substrate 3 formed on the surface by arranging the micro LEDs 2 in an array the design conditions of the micro LEDs to be inspected to be arrayed are almost equal to the number of reflections in at least a predetermined area.
  • a substrate 103 having a body 102 (hereinafter also referred to as a reflector array 102) formed on the surface thereof is attached to a position corresponding to the semiconductor substrate 3 of the micro LED light emission inspection device 1, and the objects arranged in an array are It provides the advantage that various light interference can be calibrated under almost the same conditions, and more accurate measurement can be expected. There is an advantage that calibration can be performed in the same environment as micro LED2 measurement, and improvement of inspection accuracy can be expected.
  • the reflector 102 is preferably made of a metal film, and is preferably made of a metal containing chromium as a main component.
  • the light projection mechanism 104 is preferably provided with a half mirror between the optical lens 20 and the reflector 102 on the reflected light optical path of the reflector 102. Since the projected light path and the reflected light path of the reflector 102 can be overlapped with each other, there is an effect that a more compact device configuration can be realized.
  • An optical fiber may be used for the light guiding mechanism 105. The degree of freedom in arranging the wavelength tunable light source 106 is increased, and a more compact device configuration can be realized.
  • the movement control of the filter is performed by the control device 70, but may be performed by the control independent of the control device 70, not necessarily by the control device 70.
  • the image processing device 40 may be the control device 47 integrally configured, but it is preferable that the control can be coordinated as described above.
  • the micro LED light emission inspection device 1 moves the reference light emitter 6 into the visual field of the optical lens 20 as shown in the physical configuration diagram of FIG. 14. It suffices that light having a known emission wavelength for calibrating the filter characteristics can be arranged as the reference light.
  • the digital image processing apparatus 40 can be calibrated by the light intensity provided by the reference illuminant, and the filter characteristics can be obtained at any time without removing the filter from the filter drive mechanism 60 in a closed form by the micro LED emission inspection apparatus 9. The advantage is that calibration is possible.
  • the calibration of the optical filter inspection device 101 used in the micro LED emission inspection device 1 is performed in a further modified embodiment so that the optical filter inspection device 101 brings the reference light emitter 6 into the field of view of the optical lens 20 as in FIG. It suffices that light having a known emission wavelength for calibrating the filter characteristics can be arranged as the reference light.
  • the digital image processing device 40 can be calibrated by the light intensity provided by the reference light emitter, and the filter characteristics can be changed at any time without removing the filter from the filter driving mechanism 60 in the closed form by the optical filter inspection device 101. It has the advantage that it can be calibrated.
  • the micro LED light emission inspection device 1 as shown in the physical configuration diagram of FIG.
  • the digital image processing device 40 of the micro LED light emission inspection device 1 is for monitoring the light intensity of the reference light emitter. Further, the digital image processing device 40 receives the signal output of the optical sensor, and performs calibration using the stepwise light intensity of the reference light emitter normalized by the light intensity monitor value of the optical sensor 7. It can be corrected. With this configuration, there is an advantage that the measurement of the plurality of micro LED light emission inspection devices 1 can be uniformly operated, or an absolute measurement standard such as the measurement of luminance can be introduced by normalization.
  • the digital image processing device 40 of the optical filter inspection device 101 is the same as in FIG. 15 for monitoring the light intensity of the reference light emitter.
  • the digital image processing apparatus 40 further includes the optical sensor 7 of the above, receives the signal output of the optical sensor, and corrects the calibration using the stepwise optical intensity of the reference illuminant normalized by the optical intensity monitor value of the optical sensor 7. It is possible. With this configuration, there is an advantage that the measurement of the plurality of optical filter inspection apparatuses 101 can be unified, or an absolute measurement standard such as the measurement of luminance can be introduced by normalization.
  • the control device 70 is configured to further include a receiving unit 73 of the status signal generated by the filter driving mechanism 60. Has been done.
  • the control device 70 receives a status signal, which is generated by the filter driving mechanism 60 and is capable of monitoring the progress of the arrangement change of the optical filter 50, via the receiving unit 73, and instructs the filter driving mechanism 60 at a suitable timing. It is configured to be able to generate a control signal instructing the selection without the optical filter 50, and to be able to transmit this to the filter driving mechanism 60.
  • control device 70 is configured to be capable of generating a control signal for instructing the digital image processing device 40 to start measurement of the light energy intensity value in the arrangement without the optical filter 50, which is transmitted via the control signal transmission section 72. It is configured to be transmittable to the digital image processing device. Further, the digital image processing device 40 identifies the micro LED 2 indicating an abnormal value on the micro LED mapping data 44 as a micro LED 2 defective product, and holds a defective product flag data for excluding it from the micro LED 2 product.
  • the determination unit 1300 is configured. The effects of the micro LED light emission inspection device 1 configured as described above are as follows.
  • control unit 71 of the control device 70 When the control unit 71 of the control device 70 receives the status signal from the filter drive mechanism 60 or receives an instruction to start the inspection, the control unit 71 subsequently starts measuring the optical energy intensity value in the digital image processing device 40 in the arrangement without the optical filter 50.
  • a control signal for instructing is generated and transmitted to the digital image processing apparatus 40 via the control signal transmission unit 72.
  • the digital image processing device 40 receives the image data signal upon receiving the control signal instructing to start the measurement of the light energy intensity value in the arrangement without the optical filter 50, the digital image processing device 40 receives the micro LED mapping data 44 in the same manner as above. To generate.
  • the digital image processing device 40 further identifies the micro LED showing an abnormal value on the micro LED mapping data 44 as a micro LED defective product, and sets a flag on the micro LED mapping data 44 to exclude it from the micro LED product. Identify and store flag data.
  • the upper limit and the lower limit of the micro LED showing a predetermined lower limit luminous intensity value or less or the micro LED showing a predetermined upper limit luminous intensity or more are threshold values for the abnormality determination.
  • the upper limit luminous intensity and the lower limit luminous intensity may be determined from the stepwise positioning of the luminous intensity of a group of micro LEDs, and it is possible to determine an abnormal value by relative evaluation by batch processing from the image data frame 42. The advantageous effects of the present invention can be found.
  • the digital image processing device includes an external connection path and a data input section for inputting array design data of the micro LED. It is possible to receive the array design data of the micro LEDs arranged in the array from the data input unit via the external connection path including 140, and to the memory in the digital image processing apparatus in the array.
  • the array design data of the arrayed micro LED is stored, the micro LED defective product data is collated with the micro LED array design data, and the end of the array array of the normal micro LED is recognized and this is used as a product.
  • the micro LED map boundary determination unit 130 capable of updating the suitable micro LED map range exerts an advantageous effect in improving the accuracy of the subsequent processing.
  • the digital image processing device 40 of the micro LED light emission inspection device 1 further includes an image display device 92 as shown in FIG. As shown in the category graph, a two-dimensional map 93 of the light intensity characteristics and emission wavelengths of a plurality of micro LEDs is generated and displayed on the image display device 92.
  • the two-dimensional map of the light intensity characteristic and the emission wavelength is a suitable means for performing multidimensional analysis of the micro LED, which enables the emission characteristic of the micro LED to be grasped in more detail.
  • FIG. 20 shows a physical configuration diagram of the second embodiment of the micro LED light emission inspection device 500 according to the present invention.
  • the micro LED light emission inspection device 500 further includes a filter optical axis tilt angle drive mechanism 65.
  • the filter optical axis tilt angle drive mechanism 65 includes a receiving unit of a tilt angle control signal for controlling the tilt of the optical filter with respect to the optical axis of the optical path 21.
  • the optical filter 51 having a predetermined optical wavelength band is a dielectric thin-film optical filter 51 created with a wavelength longer than the center value of a predetermined wavelength range as a half value of the filter transmittance.
  • the filter optical axis tilt angle drive mechanism 65 is configured to be able to adjust the tilt angle of the optical filter with respect to the optical axis direction.
  • the control unit 71 of the control device 70 of the micro LED light emission inspection device 500 filters the wavelengths longer than the center value of the predetermined light transmission wavelength band with respect to the filter driving mechanism 60. It is configured to be able to generate a control signal for instructing selection of a thin film optical filter created as a half value of transmittance.
  • the wavelength tunable light source 106 enables bidirectional communication through the wavelength tunable mechanism 116, and the filter driving mechanism 60 and the filter optical axis tilt angle driving mechanism 65 perform bidirectional communication with the control device 70 through the receiving unit and the first communication network 501. It is configured.
  • the control device 70 and the digital image processing device 40 are configured to be capable of bidirectional communication via the second communication network 502.
  • the control device 70 is configured to be able to acquire the light intensity of a predetermined unit image body 80 from the digital image processing device 40 via the second communication network 502.
  • the control unit 71 of the control device 70 can generate an inclination angle control signal, and is configured to be able to transmit this to the filter optical axis inclination angle drive mechanism 65 via the first communication network 501.
  • the tilt angle of the dielectric thin film optical filter 51 with respect to the optical axis direction can be configured so that the difference between the center value of the predetermined wavelength range and the half value of the filter transmittance falls within a predetermined threshold value.
  • FIG. 16 shows a functional configuration diagram of the micro LED light emission inspection device 500 configured in this way.
  • the cutoff wavelength of a dielectric thin film optical filter changes by tilting the angle with respect to the optical path.
  • the state perpendicular to the optical path is 0°, and the cutoff wavelength moves in the direction of shortening as the angle increases.
  • the filter half-value can be controlled by tilting the filter appropriately with respect to the optical path, and the half value can be set in the middle of the target wavelength measurement range, providing highly accurate and linear wavelength measurement.
  • FIG. 27 shows an example in which the half value moves to the right when the filter optical axis tilt angle is tilted by 20 ° from a right angle to the optical axis. If the tilt angle is set between a right angle and 20°, the wavelength giving a half value moves proportionally, and the tilt angle and the wavelength giving a half value have a continuous relationship. Therefore, if the tilt angle is controlled, the filter half-value wavelength can be controlled in the range of 630 nm to 650 nm.
  • control unit 71 of the control device 70 With the start of the process of the control unit 71 of the control device 70, the control is updated to the central wavelength of the optical wavelength by the wavelength variable mechanism 116 over the central wavelength setting step of the optical wavelength.
  • the control unit 71 is modularly configured to be able to transmit a control signal to the wavelength tunable mechanism 116 via the communication unit 74 and the first communication network 501. After transmission, control moves to the calibration light source lighting step.
  • the micro LED light emission inspection device 500 is configured as a module so that the variable wavelength light source 106 is remotely turned on.
  • the control continues, and the module module of the filter movement instruction step, which is configured in the control unit 71, is activated.
  • ⁇ First filter movement instruction step S523> control is passed to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting the status in which the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control unit 71 is modularized so as to immediately wait for the start instruction notification of the first imaging.
  • ⁇ First filter moving step S524> As soon as the filter driving mechanism 60 receives a signal via the first communication network 501 between the filter driving mechanism 60 and the controller 70 for selecting the status that the optical filter 50 does not exist in the optical path 21, the optical filter 50 is switched on. It is arranged to perform the first filter movement step out of the optical path 21.
  • ⁇ First imaging start instruction step S525> When the control unit 71 of the control device 70 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit 71 immediately receives the first imaging start instruction notification. An imaging start instruction signal is generated.
  • the notification of the start instruction of the first imaging may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 71 receives the status signal after the completion of the first filter moving step, for example.
  • the timer may be configured to be driven in the control unit 71 so that the first imaging start instruction notification is generated when the time elapses. In this case, a timer event is generated after a lapse of a predetermined time, and the control unit 71 is notified of the start instruction notification of the first imaging.
  • the control unit 71 waits for the second filter movement instruction after transmitting the first image capturing start instruction signal to the digital image processing apparatus 40 via the second communication network 502. It is configured as follows.
  • First imaging step S526 When the digital image processing apparatus receives the first imaging start instruction signal from the control unit 71 via the second communication network 502, the digital image processing apparatus receives the video signal from the imaging apparatus 30 and stores it in the digital image processing apparatus 40. Modularly configured to generate a light intensity pixel map in which a stepwise light intensity measured at each pixel is superimposed on the pixel map on the image data frame 42 and store the pixel map in the memory in the digital image processing device. Therefore, after the operation of the module, control is passed to the process of the unit image body identifying unit 81.
  • the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map
  • the unit image body 80 of the calibration light source light is specified based on a predetermined criterion, and further, to the pixel map.
  • the digital image processing device 40 is modularly configured so that the unit image body mapping data of (1) is generated and stored in the memory 41 in the digital image processing device 40.
  • the calibration light source mapping is regarded as micro LED mapping
  • the micro LED regarded as the calibration light source mapping from the unit image body 80 is pixel-mapped.
  • the digital image processing device 40 is modularly configured so as to generate the micro LED mapping data 44 by mapping the above data and store the micro LED mapping data 44 in the memory 41. Next, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula, and the calibration light source regarded as the light emission of the micro LED is arranged without an optical filter.
  • the digital image processing device 40 is modularly configured to store the light energy intensity value in the memory 41 in the digital image processing device 40.
  • the control device 70 is configured to be subsequently controlled to execute the process for measuring the unfiltered light intensity.
  • ⁇ Second filter movement instruction step S528> When the control unit 71, which has been waiting for the second filter movement instruction, receives the second filter movement instruction, a wavelength longer than the center value of the predetermined wavelength range is created as a half value of the filter transmittance based on the instruction.
  • the module is configured to generate a signal for disposing the thin film optical filter 51 in the optical path 21 so as to instruct the selection of the thin film optical filter, and to transmit the signal to the filter driving mechanism 60 via the first communication network 501. ing. After the execution of the module, the module is configured to wait for the second imaging start instruction, and enters the control unit waiting state.
  • the filter driving mechanism 60 receives a signal for arranging the optical filter 50 on the optical path 21 from the control unit 71 via the first communication network 501, and the filter driving mechanism 60 arranges the thin film optical filter 51 on the optical path 21. It is composed of modules.
  • ⁇ Subsequent imaging start instruction step S530> The control unit 71 generates a start instruction signal for subsequent imaging when it receives a start instruction notification for subsequent imaging in the second imaging start instruction waiting state, which is the final process of the second filter movement instruction step, and generates a second imaging start instruction signal.
  • the module is configured to transmit a start instruction signal for subsequent imaging to the digital image processing apparatus 40 via the communication network 502.
  • the filter driving mechanism 60 may transmit the status signal after the end of the second filter moving step, and the control unit 71 may receive the status signal.
  • the timer may be configured to be driven in the control unit 71 so as to generate the second imaging start instruction notification when a predetermined time has elapsed, and if a loop of repeated imaging is entered, An instruction to start imaging is received from the step of changing the filter angle. After the module operates, the processing of this module becomes idle and waits for notification of a start instruction for the next imaging.
  • ⁇ Subsequent imaging step S531> When the digital image processing device 40 receives the start instruction signal for the subsequent imaging via the second communication network 502, the digital image processing device 40 receives the video signal from the imaging device 30 and measures each pixel into the pixel map on the image data frame 42.
  • the module configuration is configured to generate a light intensity pixel map in which the stepwise light intensity is superimposed and store the pixel map in the memory 41 in the digital image processing device 40. After the module operation, the unit image body identifying unit 81 is generated. Pass control to the processing in.
  • the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the calibration light source light is determined according to the predetermined criteria.
  • the unit image body mapping data to the pixel map is further generated, stored in the memory 41 in the digital image processing device 40, and further, in the micro LED identification unit 90, the unit image body is calibrated to the calibration light source mapping data.
  • the digital image processing apparatus 40 is modularly configured so as to generate the micro LED mapping data 44 regarded as and store the micro LED mapping data 44 in the memory 41.
  • the light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the micro LED map, and the thin film of the calibration light source regarded as the light emission of the micro LED.
  • the digital image processing device 40 is modularly configured so as to be stored in the memory 41 in the digital image processing device 40 as the light energy intensity value in the arrangement with the optical filter 51. After the module processing, the control is passed to the processing in the micro LED inspection unit in the digital image processing device 40.
  • ⁇ Ratio calculation step S33 of light intensity without filter and light intensity with filter> the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 40, and the calibration in the arrangement with the thin film optical filter 51 is performed.
  • the digital image processing device 40 is modularly configured to calculate the ratio of the unfiltered light intensity and the filtered light intensity based on the light energy intensity value of the optical source and the light energy intensity value of the arrangement without the optical filter. There is. When this module is executed, the process goes to the emission wavelength calculation step.
  • the digital image processing device 40 is modularized so as to determine whether or not the ratio of light intensities is near 0.5 within a predetermined determination width according to a predetermined determination condition.
  • the control branches to the filter angle instruction step.
  • the control branches to the step of recording the filter angle.
  • ⁇ Filter angle instruction step S535> An instruction to increase the filter angle in a predetermined fluctuation range, for example, in increments of 1° is notified to the filter optical axis tilt angle drive mechanism 65 via the communication unit 74 of the control device 70 via the second communication network 502.
  • the digital image processing device 40 and the control device 70 are configured. When this module is executed, the process goes to the filter angle variation step.
  • ⁇ Filter angle fluctuation step S536> A signal is generated for the filter optical axis tilt angle drive mechanism 65 to drive the filter angle variation step, and the filter optical axis tilt angle drive mechanism 65 is driven. After the change of the angle is completed, the start instruction notification signal for the subsequent imaging is generated and transmitted to the digital image processing apparatus 40.
  • the micro LED inspection unit 100 stores the filter angle in the memory 41, and the process ends.
  • the difference between the tilt angle of the thin film optical filter 51 and the half value of the filter transmittance at the center value of the predetermined wavelength range with respect to the optical axis direction for achieving the desired filter performance is the predetermined threshold. It is acquired as a desired tilt angle with a configuration that falls within the value, stored, and can be reused.
  • the filter optical axis tilt angle drive mechanism 65 may have, for example, a micro step control configuration by direct drive by a step motor, or a step motor step control configuration via a reduction gear mechanism. Is preferably controlled with an angular resolution of about 1°.
  • FIG. 23 is a schematic front view showing an emission wavelength inspection device 600 which is a modified embodiment of the emission wavelength inspection device according to the first embodiment of the present invention.
  • a substrate 3 to be inspected which is a light emitter, is mounted on a horizontally movable stage and receives a current supply from a power supply device 10 to illuminate a chip on the surface.
  • the state of the surface of the inspection target substrate 3 is imaged by the camera 30 through the lens 20.
  • the captured image information is input to the image processing and control device 47 (hereinafter, simply referred to as the control device 47) that is integrally configured.
  • the control device 47 controls the filter driving device 60.
  • the color filter 50 is fixed to the filter holder 56, and the filter driving device 60 moves the filter holder 56 and the color filter 50 inside the optical path 21 and outside the optical path 21.
  • FIG. 23 shows that the filter position in this device is outside the optical path.
  • FIG. 24 shows a case where the filter in this device is inserted into the optical path.
  • FIG. 25 shows the transmittance characteristics of the color filter 50.
  • the filter 50 is designed to measure a wavelength range of 610 nanometers to 650 nanometers centering on a wavelength of 630 nanometers.
  • the ratio is 0.74, and From the filter characteristics, it was calculated that the measured wavelength of the illuminant was 620 nanometers.
  • FIG. 26 is a schematic front view of an emission wavelength inspection device 700 which is a modified embodiment of the second embodiment of the present invention.
  • the color filter used in this embodiment is a dielectric thin film optical filter 56.
  • the dielectric thin film optical filter 56 is configured to have a tilt angle with respect to the optical axis of the optical path 21 by a filter optical axis tilt angle drive mechanism 65.
  • the tilt can be controlled by the step motor M of the microstep drive.
  • the cutoff wavelength of the dielectric thin film optical filter 56 changes by tilting the angle with respect to the optical path. With respect to the wavelength change, the state perpendicular to the optical path is 0°, and the cutoff wavelength moves in the direction of shortening as the angle increases.
  • the optical filter 56 is designed so that the transmittance is halved near 650 nanometers.
  • This filter can be used as a short-pass optical filter with a half value at 630 nanometers by tilting about 20°.
  • the half angle wavelength is accurately increased by further increasing the tilt angle. It can be adjusted to 630 nanometers.
  • the half-value wavelength is short and is close to 640 nanometers, it can be used as a filter whose FWHM is 630 nanometers by adjusting the tilt angle to a small value.
  • FIG. 29 shows a schematic perspective view of the micro LED light emission inspection device 800, which is a modification of the micro LED light emission inspection device 1 according to the present invention.
  • the micro LED light emission inspection device 800 is characterized by the arrangement of the variable wavelength light source 106, the control device 70, and the digital image processing device 40. Since the micro LED light emission inspection device according to the present invention requires the digital image processing device 40, the required total floor area of the device is larger than that of the conventional light emission inspection device. It is preferable that the electronic device is arranged so that heat is not collected as much as possible because of the need for cooling.
  • the micro LED light emission inspection device 800 supports the optical filter from the left and right pillars with high rigidity at the top, and one of four selection filters supported by the rotary optical filter holder 56 hanging from the beam bridge straddling the pillars.
  • One of the pillars is a base member 14 made of granite, and the two pillars 12 are arranged in the vertical direction and are offset from the center line.
  • a digital image processing device 40 for storing a large-capacity image data frame is arranged below the base member 14 in parallel with the beam-shaped bridge 13 straddling the pillar 12 and having a width substantially the same as the beam width.
  • control device 70 is disposed below the base member 14 on the side of the base member 14 which is biased from the center line to the pillar 12 with a gap from the digital image processing device 40.
  • the variable wavelength light source 106 is arranged at a position sandwiched between the control device 70 and the digital image processing device 40 so as to project an optical fiber that outputs light, facing the lower longitudinal side surface of the base member 14. .
  • the LED lighting power source is disposed at a side corner, which is opposite to the protruding surface of the optical fiber of the variable wavelength light source 106, not on the lower side of the base member 14, with its longitudinal direction substantially parallel to the base member side surface.
  • the image processing device 40 of the micro LED light emission inspection device 1 shown in FIG. 7 includes a communication unit (not shown in FIG. 7),
  • the remote server 97 or the USB memory 74 can receive or store the manufacturing conditions from the micro LED light emitting inspection device 1, and the image processing device 40 of the micro LED light emitting inspection device 1 is configured to further include a manufacturing condition data output unit.
  • the micro LED mapping data 44 including the entire image of the micro LED semiconductor substrate 3 and one or more unit image body mapping data 46 and the corresponding light intensity characteristics and emission wavelength characteristics and at least one of these categories.
  • predetermined data is converted into a predetermined data format from at least one of the light intensity characteristics of the micro LED, and can be generated and output as manufacturing condition data.
  • the image processing apparatus is configured to be able to further output and output a two-dimensional map of the light emission wavelength and the light intensity ratio with and without the optical filter.
  • the micro LED light emission inspection device configured as described above is configured to enable real-time information cooperation from the remote server 97 to the manufacturing process management server, or the USB memory 74 is configured to enable timely information cooperation to the manufacturing process management server. Therefore, it is possible to obtain an effect that an abnormality in the manufacturing process can be recognized at an early stage.
  • a typical micro LED display manufacturing process is as follows. 0) Start of manufacturing process 1) Step of producing micro LED chip on wafer 2) Step of measuring illuminance and emission wavelength of each chip by lighting inspection Step 3) Dicing and sorting Step 4) Mounting chip on display substrate Step 5) Display lighting inspection Step 6) End of manufacturing process
  • the micro LED light emission inspection apparatus 1 is configured such that the digital image processing apparatus 40 includes the communication unit 110.
  • the micro LED light emission inspection device 1 is, for example, a module configured to have a communication path with the manufacturing process management computer 97 and configured to input manufacturing data, and to execute a manufacturing instruction receiving step of receiving a manufacturing instruction. Is configured.
  • the micro LED light emission inspection device 1 includes a communication unit 110 and a data output unit 120, and the micro LED light emission inspection device 1 is manufactured. It is configured to further include a communication path to a process management computer (for example, the servers 200 and 91 may correspond to these, or a network connection server (not shown) may correspond to these) and a manufacturing data output unit. , A module configured to execute a manufacturing data output step of outputting manufacturing process data including calibration data and other inspection progress data to the manufacturing process management computer via a communication path.
  • micro LED light emission inspection device that contributes to display manufacturing cost and quality creation, such as dynamically changing the level and two-dimensional map category.
  • the present invention provides a micro LED luminescence inspection method incorporated into a fully automated manufacturing process.
  • a micro LED light emission inspection method incorporated in a fully automated manufacturing process uses the micro LED light emission inspection apparatus of the above embodiment and includes the following steps. 0) Start inspection 1) Product information acquisition step S1001 At this stage, common information of products such as sub-strate geometry information including alignment mark information, micro LED geometry information, and micro LED array geometry information is received, and preparations for individual product inspections are made.
  • Manufacturing control area setting step S1002 At this stage, a manufacturing control area for recognizing and managing local product quality variations and/or abnormalities on the semiconductor substrate on which the micro LED is formed is set from one or more pieces of the geometry information.
  • the manufacturing control area may be set based on a geometrical geometry, an area to be controlled based on past inspection conditions, various manufacturing information such as temperature and wind direction in the previous manufacturing stage, manufacturing It may be set from the instruction information.
  • Notification step S1003 of acceptance of inspection At this stage, the production line control computer is notified of the inspection acceptable state via the network means. This allows it to be incorporated into a fully automated manufacturing process.
  • Manufacturing information acceptance step S1004 At this stage, micro LED wafer manufacturing information is received from the manufacturing line control computer.
  • the manufacturing information includes substrate geometry information and a mark (tag) for positioning.
  • Substrate mounting stage S1005 At this stage, the substrate is mounted on the inspection bed and fixed to the inspection bed by means such as vacuum suction. When mounting the substrate, the substrate is mounted on the inspection bed by adding information identifying the manufacturing lot and manufacturing.
  • Manufacturing control area mapping step S1006 At this stage, in addition to the method of using the micro LED light emission inspection apparatus of the above-mentioned embodiment, the entire image of the substrate is captured by the image processing apparatus, which is a feature of this method, and the production control area is mapped on the substrate. The method provides an additional mapping layer. Manufacturing control area division information, substrate geometry information, and marks (tags) for positioning are used for mapping.
  • Micro LED mapping step S1007 At this stage, the same inspection as in the first embodiment is performed. A micro LED disposed on the substrate by the image processing device is mapped on an image frame generated in the image processing device. 8) Micro LED characteristic measurement step 1008 At this stage, the same inspection as in the first embodiment is performed. The image processing device turns on the micro LED chip and measures the emission intensity and emission wavelength. 9) Micro LED sorting step S1009 At this stage, the image processing apparatus attaches the category information including the abnormality classification classified by the matrix of the emission intensity and the emission wavelength to the micro LED map information according to the predetermined classification condition based on the inspected micro LED characteristics, and adds the whole category information to the micro LED map information.
  • Manufacturing process status determination step S1010 At this stage, the image processing apparatus overlays the micro LED with the inspection result category information on the manufacturing control area map to recognize the micro LED manufacturing process state linked to the manufacturing control area.
  • 11) Inspection result transmission step S1011 At this stage, the image processing apparatus transmits the sorting information based on the inspection result and the manufacturing process state for each manufacturing management area to the manufacturing line control computer via the network means.
  • 12) Inspection end notification step S1012 At this stage, the inspection end notification is transmitted to the production line control computer. 13) End of inspection
  • the present invention can be used in a semiconductor manufacturing industry that manufactures a micro LED using a micro LED light emission inspection device that inspects a large number of LED chips formed on a wafer in a manufacturing process of a display device using the micro LED. ..
  • micro LED light emission inspection device 1 micro LED light emission inspection device 2 micro LED 3 Semiconductor Substrate 10 Power Supply Mechanism 15 Microscope 18 Video Signal Line 20 Optical Lens 21 Optical Path 30 Imaging Device 31 Image Sensor 40 Digital Image Processing Device 41 Memory 42 Image Data Frame 43 Pixel Map 44 Micro LED Mapping (Micro LED Mapping Data) 45 Light intensity pixel map 46 Unit image body mapping (unit image body mapping data) 47 Mechanism control/digital image processing integrated control device 50 Optical filter 51 Thin film optical filter 56 Other thin film optical filter 60 Filter driving mechanism (filter driving device) 62 filter driving mechanism receiving unit 65 filter inclination angle variation control mechanism 70 control unit 71 control unit 72 transmission unit 76 network connection storage 80 unit image body 81 unit image body identification unit 88 control signal line between control device and filter drive mechanism 90 micro LED identification unit 92 Screen display device 93 Two-dimensional map 97 Remote connection server 100 Micro LED inspection unit 101 Optical filter inspection device used for micro LED light emission inspection device 110 Communication unit 120 Data output unit 130 Micro LED map boundary determination unit 140 Data input unit 500 Micro LED light emission

Abstract

This micro LED light emission inspection device, which inspects the quality of a plurality of micro LEDs formed with a dot pitch of 0.1 mm or less on a wafer, partially comprises a structure such as a power feeding mechanism, an optical lens, an imaging device, a digital image processing device, an optical filter, a filter driving mechanism, and a control device. An individual micro LED to be measured is automatically found and identified by the digital image processing device from a captured image, the light intensities of the micro LEDs generated from screen frame images are collectively measured, and the light emission wavelengths of the micro LEDs are also determined rapidly in a significantly different inspection time by controlling the measurement of two types of light intensities including the absence of an optical filter and the presence of the optical filter by using the optical filter in which the intensity of filter-transmitted light monotonically increases or decreases in a predetermined optical wavelength band.

Description

マイクロLED発光検査装置及びその装置に用いる光学フィルタの検査装置及び製造プロセスに組み込まれたその装置を用いるマイクロLED発光検査方法Micro LED emission inspection device, optical filter inspection device used in the device, and micro LED emission inspection method using the device incorporated in manufacturing process
　本発明は、マイクロＬＥＤを用いた表示デバイスの製造過程において、ウェハー上に生成された多数のＬＥＤチップの検査を行うマイクロLED発光検査装置及びその装置に用いる光学フィルタの検査装置及び製造プロセスに組み込まれたその装置を用いるマイクロLED発光検査方法に関する。INDUSTRIAL APPLICABILITY The present invention is incorporated into a micro LED light emission inspection apparatus for inspecting a large number of LED chips formed on a wafer in a manufacturing process of a display device using a micro LED, an optical filter inspection apparatus used in the apparatus, and a manufacturing process. The present invention relates to a micro LED light emission inspection method using the device.
　高解像度の平面表示装置においては、ＴＦＴ液晶や有機ＬＥＤの技術を用いた表示装置が実用化されているが、これらの表示デバイスに加えて、近年では有機ＬＥＤ表示装置より更に発光効率の高い自発光表示装置として、固体半導体技術で作成された微少なＬＥＤチップを回路基板上に並べることによって表示装置とした、マイクロＬＥＤと呼称される表示デバイスが研究されている。In high-resolution flat panel display devices, display devices using the technology of TFT liquid crystal or organic LED have been put into practical use. In addition to these display devices, in recent years, self-luminous devices having higher luminous efficiency than organic LED display devices have been realized. As a light emitting display device, a display device called a micro LED, which is a display device by arranging minute LED chips formed by solid-state semiconductor technology on a circuit board, has been studied.
　このマイクロＬＥＤ表示装置においては、基板上に搭載される隣接するＬＥＤチップが異なるウェハーから切り出されたものであったり、同一ウェハー上であっても距離の離れた異なる位置から切り出されたものであるなど、プロセス条件の異なるチップが混在して搭載されるという特徴がある。In this micro LED display device, adjacent LED chips mounted on the substrate are cut out from different wafers, or cut out from different positions with a distance even on the same wafer. For example, chips with different process conditions are mixed and mounted.
　ＴＦＴ液晶や有機ＬＥＤ表示装置においては、スイッチトランジスタやカラーフィルターなど、輝度や発光波長という画素の表示品質を左右する要素が表示基板上に直接生成されるため、表示デバイス上の隣接する画素は温度や溶剤濃度などのプロセス条件がほぼ同一となり、輝度や発光色などの境界が目立ちにくい性質を持っていた。それと異なり、マイクロＬＥＤ表示デバイスにおいては、上記に述べたように異なるプロセス条件において生成されたチップが隣接する画素として搭載される可能性があり、特に複数のチップをたとえば矩形のグループとして一括して搭載する方式においては、発光輝度や発光波長の異なるグループを隣接させた場合、そのグループ境界がムラとして視認される不具合が起こる。In a TFT liquid crystal display or an organic LED display device, elements such as a switch transistor and a color filter that affect the display quality of the pixel such as brightness and emission wavelength are directly generated on the display substrate, so that the adjacent pixels on the display device have a temperature difference. The process conditions such as solvent concentration and solvent were almost the same, and the boundaries such as brightness and emission color were inconspicuous. On the other hand, in a micro LED display device, chips generated under different process conditions as described above may be mounted as adjacent pixels, and in particular, a plurality of chips are collectively packaged as, for example, a rectangular group. In the mounting method, when groups having different emission brightness and emission wavelength are adjacent to each other, there is a problem that the group boundary is visually recognized as unevenness.

　このような不具合を回避するために、発光できる形に完成したチップについて発光輝度や発光波長を測定し、基準ごとに仕分けするビニングという手法が用いられ、特定の表示デバイスに搭載されるチップに異なるビンが混在しないようにするという工夫がなされている。
In order to avoid such inconvenience, a method called binning is used in which the light emission luminance and the light emission wavelength are measured for a chip completed in a form capable of emitting light, and the chips are sorted according to a standard, and the chip mounted on a specific display device is different. The device is designed so that bottles do not coexist.
　従来、ビニングに使用される発光波長測定には、主に回折格子を用いた光スペクトロメータが用いられこれには、特許文献１、２がある。このうち、特許文献２は、ＣＣＤリニアセンサーも用いたスペクトロメータが用いられている。しかしながら、光スペクトロメータを用いるこれらの方式では波長測定速度は、例えば、１測定回数につき１ｍＳ程度かかるものと考えられている。Conventionally, an optical spectrometer using a diffraction grating has been mainly used for measuring the emission wavelength used for binning, and there are Patent Documents 1 and 2. Of these, Patent Document 2 uses a spectrometer that also uses a CCD linear sensor. However, in these methods using an optical spectrometer, the wavelength measurement speed is considered to be, for example, about 1 mS per measurement.
　しかしながら、マイクロＬＥＤ表示装置に搭載されるＬＥＤチップの数は、解像度４Kの表示装置でピクセル数は３，８６０x２，１４０となりＲＧＢ各色８００万個を超え、１３．３インチの表示装置でドットピッチ０．０７７mmとなる。仮に、ドットピッチ０．１ｍｍ程度を満たすマイクロLEDは、６インチウェハ上には１５０万個余り形成可能である。これらのチップについて発光波長を上記のスペクトロメータによる測定方法で測定すると、１５００秒という膨大な時間が必要となる問題点があった。さらに、解像度８Kであれば１３．３インチの表示装置において、ドットピッチは０．０３８mmである。この場合には６インチウェハ上にはＬＥＤチップが１０００万個余り形成され、これらのチップについて発光波長を上記のスペクトロメータによる測定方法で測定すると、１００００秒というさらに膨大な時間が必要となる。However, the number of LED chips mounted on the micro LED display device is 3,860x2,140 in the display device with a resolution of 4K, which exceeds 8 million for each RGB color, and the dot pitch is 0 in the 13.3 inch display device. It becomes 0.077 mm. Assuming that more than 1.5 million micro LEDs satisfying a dot pitch of about 0.1 mm can be formed on a 6-inch wafer. When the emission wavelength of these chips is measured by the above-mentioned measuring method using a spectrometer, there is a problem that an enormous amount of time of 1500 seconds is required. Further, if the resolution is 8K, the dot pitch is 0.038 mm on a 13.3 inch display device. In this case, more than 10 million LED chips are formed on a 6-inch wafer, and if the emission wavelength of these chips is measured by the above-mentioned measuring method using a spectrometer, a further huge time of 10,000 seconds is required.
　さらに、マイクロＬＥＤでは異なるプロセス条件において生成されたチップが隣接する画素として搭載される可能性があり、製造条件によって変動するばらつきをより抑え、製造ばらつき変動因子を迅速に把握する必要があるが、そのようなマイクロＬＥＤ製造プロセスにおいて製造ばらつき変動因子を迅速に把握する手段及び方法は提供されていない。
Further, in a micro LED, chips generated under different process conditions may be mounted as adjacent pixels, and it is necessary to further suppress variations that fluctuate due to manufacturing conditions and quickly grasp manufacturing fluctuation factors. No means and method for promptly grasping the manufacturing variation variation factor in such a micro LED manufacturing process are provided.
特開昭６３―２４８１４１号公報JP-A-63-248141
特開昭６３―２９７５８号公報JP-A-63-29758
　本発明は、係る課題に対応可能であり、ウェハ上にドットピッチ０．１ｍｍ以下で多数形成されたマイクロLEDを、従来技術による検査時間の１０分の１以下の桁違いの測定時間を達成するマイクロLED発光検査装置を提供することを課題とする。The present invention can address such a problem, and achieves an order of magnitude less than one-tenth of the inspection time of the prior art for micro LEDs formed in large numbers with a dot pitch of 0.1 mm or less on a wafer. It is an object to provide a micro LED light emission inspection device.
　本発明は、上記課題を解決する、より高速のマイクロLED発光検査装置を提供する。以下に説明する。The present invention provides a higher speed micro LED light emission inspection device that solves the above problems. This will be described below.
　個別に分離されるべき１００μm角以下の大きさの矩形領域内を占めるマイクロLEDがアレイ状に配列されて表面に形成された半導体サブストレートの上方に配置された、
前記マイクロLEDの発光のための給電機構と、
前記サブストレートに対向して光学レンズが配設されて前記発光の光強度を測定するためのイメージセンサを有する撮像装置と、
前記撮像装置の映像信号を受け入れるデジタル画像処理装置と、
前記マイクロLEDと前記光学レンズとの光路に配設される、所定の光波長帯域を有する光学フィルタと、
前記光学フィルタを支持し、制御信号の受信部を含むフィルタ駆動機構と、及び、
前記フィルタ駆動機構の制御信号の送信部及び、前記制御信号の生成のため及びシステムフロー開始とフロー制御をするための制御部を含む制御装置と、
を含むマイクロLED発光検査装置であって、
　前記光学フィルターは、設計条件に相当する色波長を含む所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルターであり、かつ、
　前記制御装置は、前記フィルタ駆動機構によって前記光学フィルターの有無を選択制御可能である制御装置であり、かつ、
　前記デジタル画像処理装置は前記映像信号を受入れて生成された画像データフレームを格納するためのメモリを備え、
　　前記画像データフレーム上のピクセル毎の光強度ピクセルマップから所定のクライテリアに基づく前記発光の単位映像体を特定し、前記ピクセルマップへの単位映像体マッピングデータを生成するための単位映像体識別部と、
　　前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し前記マイクロLEDを前記ピクセルマップ上にマッピングするマイクロLEDマッピングデータを生成するためのマイクロLED識別部と、及び
　マイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によって前記マイクロLEDの光エネルギ強度を決定し、前記マイクロLEDの光エネルギ強度のうち少なくとも前記光学フィルター無の配置における前記光エネルギ強度値を前記メモリに格納可能であり、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、所定のマイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定するためのマイクロLED検査部とを、含む前記デジタル画像処理装置である、
ことを特徴とするマイクロLED発光検査装置が本発明で提供される。この構成では、デジタル画像処理装置によって自動的に測定対象の個々のマイクロLEDが撮像画像から発見、特定され画面フレーム画像から生成されたマイクロLEDの光強度が、一括で測定されるから従来のCCDラインセンサによる個別測定に比し、より高速にマイクロLEDの発光波長測定できるマイクロLED発光検査装置が提供される。測定には、検査対象のウェハを装着後光フィルタ無しの場合及び光ファルタ有りの場合の画像を信号処理が高速であるデジタル画像処理装置によって撮像画面単位で一気に取り込むことが可能であり、ウェハ全体でも光フィルタ無しの場合５０秒程度、光フィルタ有りの場合も５０秒程度、合計１００秒程度で画像フレームデータの取得が可能である。このように、画像フレームデータの取得後の自動画像処理によってウェハ全体のマイクロLEDの発光波長測定を一括処理でより高速の検査が可能である。Micro LEDs, which occupy rectangular areas of 100 μm square or less to be individually separated, are arranged in an array and arranged above a semiconductor substrate formed on the surface,
A power supply mechanism for emitting light from the micro LED,
An image pickup apparatus having an image sensor for measuring the light intensity of the emitted light, in which an optical lens is arranged facing the substrate,
A digital image processing device that receives a video signal of the imaging device;
An optical filter having a predetermined light wavelength band, which is disposed in the optical path between the micro LED and the optical lens,
A filter driving mechanism that supports the optical filter and includes a control signal receiving unit, and
A control device including a control signal transmission unit of the filter drive mechanism, and a control unit for generating the control signal and for performing system flow start and flow control,
It is a micro LED light emission inspection device including
The optical filter is an optical filter whose filter transmitted light intensity monotonically increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to design conditions, and,
The control device is a control device capable of selectively controlling the presence or absence of the optical filter by the filter driving mechanism, and
The digital image processing device includes a memory for receiving an image data frame generated by receiving the video signal,
A unit image body identification unit for specifying the unit image body of the light emission based on a predetermined criterion from a light intensity pixel map for each pixel on the image data frame, and generating unit image body mapping data on the pixel map. ,
On the micro LED map, a micro LED identifying unit for generating a micro LED mapping data for specifying a plurality of the micro LEDs arranged in the array from the unit image body and mapping the micro LEDs on the pixel map. The optical energy intensity of the micro LED is determined from the optical intensity on the optical intensity map of the above by a predetermined optical energy intensity calculation formula, and the optical energy intensity value of at least the optical energy intensity of the micro LED in the arrangement without the optical filter. Can be stored in the memory, and the emission wavelength of a predetermined micro LED is calculated by the optical energy intensity value of the micro LED in the arrangement with the optical filter and the optical energy intensity value of the arrangement without the optical filter. The digital image processing apparatus including a micro LED inspection unit for determining the emission wavelength of the micro LED according to an equation.
The present invention provides a micro LED light emission inspection device characterized by the above. In this configuration, the digital image processing device automatically discovers and identifies the individual micro LEDs to be measured from the captured image, and the light intensity of the micro LEDs generated from the screen frame image is measured collectively, so the conventional CCD Provided is a micro LED emission inspection device capable of measuring the emission wavelength of a micro LED at a higher speed than individual measurement by a line sensor. For measurement, it is possible to capture the image of the wafer to be inspected without an optical filter and with an optical filter at once by a digital image processing device with high-speed signal processing for each imaging screen, and the entire wafer. However, the image frame data can be acquired in about 50 seconds without the optical filter and about 50 seconds with the optical filter, for a total of about 100 seconds. In this way, automatic image processing after acquisition of image frame data enables higher-speed inspection of the emission wavelength measurement of the micro LED of the entire wafer by batch processing.
　さらに、追加の態様で本発明は、
　前記所定のクライテリアは周囲に対しピーク光エネルギ強度値を呈するピクセルを前記単位映像体の中心部と特定し、隣接する前記単位映像体中心部間の中央を前記単位映像体の矩形境界とするマイクロLED発光検査装置を提供する。この構成によって、単位映像体に属するピクセルの認定をより簡便迅速に決定できる効果を提供する。Furthermore, in an additional aspect, the invention provides
According to the predetermined criteria, a pixel exhibiting a peak light energy intensity value with respect to the surroundings is specified as a central portion of the unit image body, and a center between the adjacent central portions of the unit image body is defined as a rectangular boundary of the unit image body. Provide an LED light emission inspection device. With this configuration, it is possible to provide an effect that the determination of the pixels belonging to the unit image body can be determined more easily and quickly.
　さらに、追加の態様で本発明は、
　前記所定のクライテリアは周囲に対しピーク光エネルギ強度値を呈するピクセルを前記単位映像体の中心部と特定し、アレイ状に配列されたマイクロLEDの間隔設計値によって、前記単位映像体の矩形境界を決定するマイクロLED発光検査装置を提供する。この構成で、設計データを活用することによって、単位映像体に属するピクセルの認定をより簡便迅速に決定できる効果を提供する。Furthermore, in an additional aspect, the invention provides
The predetermined criteria specifies a pixel exhibiting a peak light energy intensity value with respect to the surroundings as a central portion of the unit image body, and a rectangular boundary of the unit image body is determined by a space LED design value of micro LEDs arranged in an array. Provide a micro LED light emission inspection device for determining. With this configuration, by utilizing the design data, it is possible to provide an effect that the determination of the pixels belonging to the unit image body can be determined more easily and quickly.
　さらに、追加の態様で本発明は、
　前記所定の光エネルギ強度算出式は、前記光強度ピクセルマップ上で前記マイクロLEDに含まれる前記ピクセルの段階的光強度の総和であるマイクロLED発光検査装置を提供する。この構成で、マイクロLEDに含まれるピクセルの段階的光強度の総和をとりマイクロLEDに関連するすべてのピクセルで観察される光強度を利用すると、一つ一つのピクセルの測定に伴う擾乱を平滑化できる利点が提供される。Furthermore, in an additional aspect, the invention provides
The predetermined light energy intensity calculation formula provides a micro LED emission inspection device which is the sum of the stepwise light intensities of the pixels included in the micro LED on the light intensity pixel map. In this configuration, the sum of the stepwise light intensities of the pixels contained in the micro LED is taken and the light intensity observed in all the pixels related to the micro LED is used to smooth the disturbance associated with the measurement of each pixel. The benefits that can be provided are provided.
　さらに、追加の態様で本発明は、
　前記光学フィルターは既知の光波長の光源によって、フィルタ特性がキャリブレーションされ、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係に関して前記キャリブレーションをもとに作成されたルックアップテーブルが格納されているマイクロLED発光検査装置を提供する。この構成で関数で表現されない変数と探索値関係もサンプリング手法によって提供可能とする効果を与える。Furthermore, in an additional aspect, the invention provides
The optical filter has its filter characteristics calibrated by a light source having a known light wavelength, and the ratio of the light energy intensity value in the arrangement without the optical filter to the light energy intensity value in the arrangement with the optical filter and the light emission. Provided is a micro LED light emission inspection device in which a look-up table created based on the calibration with respect to a wavelength is stored. With this configuration, it is possible to provide the relationship between the variable not represented by the function and the search value by the sampling method.
　さらに、追加の態様で本発明は、
　前記所定の前記マイクロLEDの発光波長算出式は、前記光エネルギ強度比測定値に対応する前記発光波長が前記ルックアップテーブルで参照され、中間値について按分補間を加算して前記発光波長が決定されるマイクロLED発光検査装置を提供する。この構成で、離散値以外の中間値に対しても発光波長が適当な精度で決定可能となる効果を与える。Furthermore, in an additional aspect, the invention provides
The predetermined emission wavelength calculation formula of the micro LED, the emission wavelength corresponding to the light energy intensity ratio measurement value is referred to in the look-up table, and the emission wavelength is determined by adding proportional division interpolation for an intermediate value. Provide a micro LED light emission inspection device. With this configuration, the emission wavelength can be determined with appropriate accuracy even for intermediate values other than discrete values.
　さらに、追加の態様で本発明は、
　アレイ状に配列されることとなる検査対象のマイクロLEDアレイの設計条件と少なくとも所定の領域でほぼ同一数及び同一配置の反射体がアレイ状に表面に形成されたサブストレートと、
前記反射体の反射光のための光投射機構と、
前記光投射機構への光誘導機構と、
前記光投射光の既知の波長の光源と、
前記サブストレートに対向して光学レンズが配設されて前記発光の光強度を測定するためのイメージセンサを有する撮像装置と、
前記撮像装置の映像信号を受け入れるデジタル画像処理装置と、
前記反射体の反射光光路上に前記光学レンズと前記反射体との間に配設される、所定の光波長帯域を有するマイクロLED発光検査装置に用いる光学フィルタと、
前記光学フィルタを支持し、制御信号の受信部を含むフィルタ駆動機構と、及び
前記フィルタ駆動機構の制御信号の送信部及び、前記制御信号の生成のため及びシステムフロー開始とフロー制御をするための制御部を含む制御装置と、
を含むマイクロLED発光検査装置に用いる光学フィルタ検査装置であって、
　前記光学フィルターは、設計条件に相当する色波長を含む所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルターであり、かつ
　前記制御装置は、前記フィルタ駆動機構によって前記光学フィルターの有無を選択制御可能である制御装置であり、かつ
　前記デジタル画像処理装置は前記映像信号を受入れて生成された画像データフレームを格納するためのメモリを備え、
　前記反射体の前記反射光を前記マイクロLEDの前記発光とみなし、前記画像データフレーム上のピクセル毎の光強度ピクセルマップから所定のクライテリアに基づき前記発光の単位映像体を特定し、前記反射光の単位映像体をマイクロLEDの発光による単位映像体とみなし、前記ピクセルマップへの単位映像体マッピングデータを生成するための単位映像体識別部と、
　前記単位映像体から複数の前記アレイ状に配列された前記反射体とみなされた前記マイクロLEDを特定し前記マイクロLEDを前記ピクセルマップ上にマッピングするマイクロLEDマッピングデータを生成するためのマイクロLED識別部と、及び
　マイクロLEDマップ上の前記光強度マップ上の光強度から所定の光エネルギ強度算出式によって前記マイクロLEDの光エネルギ強度を決定し、前記マイクロLEDの光エネルギ強度のうち少なくとも前記光学フィルター無の配置における前記光エネルギ強度値を前記メモリに格納可能であり、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、所定の前記マイクロLEDの発光波長算出式によって前記反射光の光源とみなされた前記マイクロLEDの発光波長を決定するためのマイクロLED検査部とを、含む前記デジタル画像処理装置である、
ことを特徴とするマイクロLED発光検査装置に用いる光学フィルタ検査装置を提供する。この構成で、マイクロLEDと同じジオメトリ環境光学フィルタのキャリブレーションが可能となり、かつ未だ設計段階にあるときでも、マイクロLEDに模擬された検査対象光源として検査リハーサルも可能であるという効果を与える。Furthermore, in an additional aspect, the invention provides
The design conditions of the micro LED array to be inspected to be arranged in an array and the substrate in which approximately the same number and arrangement of reflectors are formed on the surface in an array at least in a predetermined area, and
A light projection mechanism for the reflected light of the reflector,
A light guide mechanism to the light projection mechanism,
A light source of known wavelength of the light projection light;
An image pickup apparatus having an image sensor for measuring the light intensity of the emitted light, in which an optical lens is arranged facing the substrate,
A digital image processing device that receives a video signal of the imaging device;
An optical filter used in a micro LED emission inspection device having a predetermined optical wavelength band, which is arranged between the optical lens and the reflector on the reflected light path of the reflector.
A filter drive mechanism that supports the optical filter and includes a control signal receiver, a control signal transmitter of the filter drive mechanism, and for generating the control signal and for starting and controlling the system flow. A controller including a controller,
An optical filter inspection device used for a micro LED emission inspection device including:
The optical filter is an optical filter whose filter transmitted light intensity monotonously increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition, and the control device causes the filter to drive the optical filter. Is a control device capable of selectively controlling presence or absence, and the digital image processing device includes a memory for storing an image data frame generated by receiving the video signal,
The reflected light of the reflector is regarded as the light emission of the micro LED, the unit image body of the light emission is specified based on a predetermined criterion from the light intensity pixel map for each pixel on the image data frame, and the reflected light A unit image body is regarded as a unit image body by light emission of a micro LED, and a unit image body identification unit for generating unit image body mapping data to the pixel map,
A micro LED identification for identifying the micro LEDs regarded as the plurality of the reflectors arranged in the array from the unit image body and generating micro LED mapping data for mapping the micro LEDs on the pixel map. Part, and the light energy intensity of the micro LED by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, at least the optical filter of the light energy intensity of the micro LED It is possible to store the light energy intensity value in a non-arrangement in the memory, and by the light energy intensity value of the micro LED in the arrangement with the optical filter and the light energy intensity value in the arrangement without the optical filter. A digital image processing apparatus including a micro LED inspection unit for determining a light emission wavelength of the micro LED regarded as a light source of the reflected light according to a predetermined light emission wavelength calculation formula of the micro LED.
Provided is an optical filter inspection device used for a micro LED light emission inspection device. With this configuration, it is possible to calibrate the same geometric environment optical filter as the micro LED, and it is possible to perform an inspection rehearsal as a light source to be inspected imitated by the micro LED even at the design stage.
　さらに、追加の態様で本発明は、
　前段に記載の反射体の反射光のための光投射機構は、前記反射体の反射光光路上に前記光学レンズと前記反射体との間に配設されたハーフミラーを含むマイクロLED発光検査装置に用いる光学フィルタ検査装置を提供する。この構成で、より省スペースの装置が提供されるという効果が得られる。Furthermore, in an additional aspect, the invention provides
The light projection mechanism for the reflected light of the reflector described in the previous stage is a micro LED light emission inspection device including a half mirror arranged between the optical lens and the reflector on the reflected light path of the reflector. Provided is an optical filter inspection device used for. This configuration has the effect of providing a more space-saving device.
　さらに、追加の態様で本発明は、
　前記光誘導機構は光ファイバケーブルを含む前段までに記載のマイクロLED発光検査装置に用いる前段までに記載の光学フィルタ検査装置を提供する。この構成で、部品配置に自由度が得られ、光源の廃熱を考慮可能でもあり、より省スペースに貢献するという効果が得られる。Furthermore, in an additional aspect, the invention provides
The optical guiding mechanism provides the optical filter inspection device according to the preceding paragraph, which is used in the micro LED emission inspection device according to the preceding paragraph, which includes an optical fiber cable. With this configuration, the degree of freedom in arranging components can be obtained, waste heat of the light source can be taken into consideration, and the effect of further saving space can be obtained.
　さらに、追加の態様で本発明は、
　前記光学フィルターは前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係に関して前記キャリブレーションをもとにされたルックアップテーブルが作成される前段までに記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置を提供する。この構成で、ルックアップテーブルによって一つの関数で表現されない目的値をサンプリング値によって決定できるという効果が得られる。さらに、追加の態様で本発明は、
　前記所定の前記マイクロLEDの発光波長算出式は、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係を前記キャリブレーションによって作成されたルックアップテーブルを前記デジタル画像処理装置内に含み、前記光エネルギ強度比測定値に対応する前記発光波長が前記ルックアップテーブルが参照され、中間値について按分補間を加算して前記発光波長が決定されるマイクロLED発光検査装置に用いる光学フィルタ検査装置を提供する。この構成で、サンプリング値から外れた変数値でも目的値が適切な精度で決定できるという効果が得られる。Furthermore, in an additional aspect, the invention provides
The optical filter is a look based on the calibration with respect to a relationship between a ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter and the emission wavelength. Provided is an optical filter inspection device used for the micro LED light emission inspection device described up to the stage before the uptable is created. With this configuration, it is possible to obtain the effect that the target value that is not represented by one function by the lookup table can be determined by the sampling value. Furthermore, in an additional aspect, the invention provides
The predetermined emission wavelength calculation formula of the micro LED is a relationship between the emission wavelength and the ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter. A lookup table created by calibration is included in the digital image processing apparatus, the emission wavelength corresponding to the light energy intensity ratio measurement value is referred to the lookup table, and proportional distribution interpolation is added for an intermediate value. Provided is an optical filter inspection device used in a micro LED emission inspection device in which the emission wavelength is determined. With this configuration, it is possible to obtain the effect that the target value can be determined with appropriate accuracy even if the variable value deviates from the sampling value.
　さらに、追加の態様で本発明は、
　前段までに記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置を含むマイクロLED発光検査装置を提供する。この構成で、前段までに記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置は、前段までに記載のマイクロLED発光検査装置と一体運用が可能であるという装置の配置省スペースの効果と装置の製造管理スケジューリングに便宜であるという効果が得られる。Furthermore, in an additional aspect, the invention provides
Provided is a micro LED emission inspection device including an optical filter inspection device used in the micro LED emission inspection device described in the preceding paragraph. With this configuration, the optical filter inspection device used for the micro LED light emission inspection device described up to the previous stage can be operated integrally with the micro LED light emission inspection device described up to the previous stage. The advantage that it is convenient for manufacturing control scheduling is obtained.
　さらに、追加の態様で本発明は、
　前記デジタル画像処理装置は、永続的ストレッジへの接続インターフェースをさらに含み、前記フィルタ特性及び前記ルックアップテーブルはマスターデータとして永続的ストレッジから受入れ可能であり、前記デジタル画像処理装置内の前記メモリに格納されるマイクロLED発光検査装置を提供する。この構成で、ルックアップテーブルが外部から提供可能となり、複数の機器でも共用可能となるという効果も得られる。Furthermore, in an additional aspect, the invention provides
The digital image processing device further includes a connection interface to a persistent storage, the filter characteristic and the look-up table are receivable from the persistent storage as master data and stored in the memory in the digital image processing device. Provided is a micro LED light emission inspection device. With this configuration, the look-up table can be provided externally and can be shared by a plurality of devices.
　さらに、追加の態様で本発明は、
　前記デジタル画像処理装置は、前記撮像装置の光学的視野内に前記フィルタ特性のキャリブレーションのための既知の発光波長の光を参照光として配設可能であるマイクロLED発光検査装置を提供する。この構成で、二つの測定の相対比値のみならず参照光を基準とする測定が可能になり、より検査環境条件から生ずる擾乱を回避可能とするという効果が得られる。Furthermore, in an additional aspect, the invention provides
The digital image processing device provides a micro LED light emission inspection device in which light having a known emission wavelength for calibrating the filter characteristic can be arranged as reference light in an optical field of view of the imaging device. With this configuration, not only the relative ratio value of the two measurements but also the reference light can be used as a reference, and it is possible to avoid the disturbance caused by the inspection environment condition.
　さらに、追加の態様で本発明は、
　前記マイクロLED発光検査装置は、前記参照発光体の光強度モニタリングのための光センサをさらに備え、前記画像処理装置は、前記光センサの信号出力を受入れ、前記光センサの光強度モニタ値によって正規化された前記参照発光体の段階的光強度を用い前記キャリブレーションを補正可能に構成された前記画像処理装置であるマイクロLED発光検査装置を提供する。この構成で、二つの測定の相対比値のならず、より絶対的な測定が可能になり、輝度の把握も可能となるという効果が得られる。Furthermore, in an additional aspect, the invention provides
The micro LED light emission inspection device further comprises an optical sensor for monitoring the light intensity of the reference light emitter, the image processing device accepts a signal output of the optical sensor, and normalizes according to a light intensity monitor value of the optical sensor. Provided is a micro LED light emission inspection device, which is an image processing device configured so that the calibration can be corrected by using the stepwise light intensity of the reference light emitting body. With this configuration, it is possible to obtain a more absolute measurement without the relative ratio value of the two measurements, and it is possible to grasp the brightness.
　さらに、追加の態様で本発明は、
　前記マイクロLED発光検査装置の前記制御装置は、前記フィルタ駆動機構で生成されるステータス信号の受信部をさらに含み、前記制御装置の前記制御部は前記フィルタ駆動機構に対して前記フィルタ無の選択を指示する制御信号を生成し、これを前記フィルタ駆動機構に送信可能であり、かつ前記制御装置は前記画像処理装置に対して前記光学フィルター無の配置における前記光エネルギ強度値の測定開始を指示する制御信号を生成し、これを制御信号送信部を介し前記画像処理装置へ送信可能であり、
前記制御装置の前記制御部は、前記ステータス信号を前記フィルタ駆動機構から受信後又は検査開始の指示を受け入れると、引き続いて前記画像処理装置へ前記光学フィルター無の配置における前記光エネルギ強度値の測定開始を指示する制御信号を生成し、これを制御信号送信部を介し前記画像処理装置へ送信し、前記画像処理装置は、マイクロLEDマッピングデータ上で異常値を示すマイクロLEDをマイクロLED不良品と識別し、マイクロLED製品から除外するための不良品フラグデータを保持するマイクロLED不良品判定部を有するマイクロLED発光検査装置を提供する。この構成で、マイクロLEDのウェハ上の相対的な評価によって異常値を早期に画像データフレームからの一括処理時に判定可能であるし、特にウェハ境界域の把握に便宜であり、画像データフレームからの一括処理に有用であるという効果も得られる。Furthermore, in an additional aspect, the invention provides
The control device of the micro LED light emission inspection device further includes a receiving unit of a status signal generated by the filter driving mechanism, the control unit of the control device for the filter driving mechanism to select without the filter. A control signal for instructing can be generated and transmitted to the filter driving mechanism, and the control device instructs the image processing device to start measurement of the light energy intensity value in the arrangement without the optical filter. It is possible to generate a control signal and transmit the control signal to the image processing apparatus via a control signal transmission unit.
When the control unit of the control device receives the status signal from the filter driving mechanism or accepts an instruction to start the inspection, the image processing device subsequently measures the light energy intensity value in the arrangement without the optical filter. A control signal for instructing start is transmitted, and this is transmitted to the image processing device via a control signal transmission unit, and the image processing device indicates that the micro LED indicating an abnormal value on the micro LED mapping data is a micro LED defective product. Provided is a micro LED light emission inspection device having a micro LED defective product determination unit which holds defective product flag data for identification and exclusion from a micro LED product. With this configuration, it is possible to judge abnormal values early during batch processing from the image data frame by relative evaluation of the micro LED on the wafer, and it is particularly convenient for grasping the wafer boundary area. The effect that it is useful for batch processing is also obtained.
　さらに、追加の態様で本発明は、
　前記マイクロLED発光検査装置の前記デジタル画像処理装置は、前記マイクロLEDの配列設計データ入力のための外部接続路及びデータ入力部を含み、前記外部接続路を介して前記データ入力部から前記アレイ状に配列されたマイクロLEDの配列設計データを受入れ、前記デジタル画像処理装置内の前記メモリへ、前記アレイ状に配列されたマイクロLEDの配列設計データが格納され、前記マイクロLED不良品データと前記マイクロLEDの配列設計データとを照合し、正常マイクロLEDの配列の端部を認識しこれをもって前記マイクロLEDマップを更新するマイクロLEDマップ境界判定部を含むマイクロLED発光検査装置を提供する。この構成で、マイクロLED不良品データがマイクロLEDの配列設計データに有機的に結合され、より検査効率、検査品質の向上に寄与するという効果が得られる。Furthermore, in an additional aspect, the invention provides
The digital image processing device of the micro LED light emission inspection device includes an external connection path and a data input part for inputting array design data of the micro LED, and the array form is provided from the data input part via the external connection path. Receiving the array design data of the micro LEDs arranged in the, the memory in the digital image processing device, the array design data of the micro LEDs arranged in the array is stored, the micro LED defective data and the micro LED Provided is a micro LED light emission inspection device including a micro LED map boundary determination unit that collates with LED array design data, recognizes an end portion of a normal micro LED array, and updates the micro LED map accordingly. With this configuration, the micro LED defective product data is organically combined with the micro LED array design data, and the effect of further contributing to the improvement of inspection efficiency and inspection quality can be obtained.
　さらに、追加の態様で本発明は、
　所定の光エネルギ強度特性及び所定の前記発光波長特性によって定められた所定の範疇に前記マイクロLEDを割り当てることを特徴とするマイクロLED発光検査装置を提供する。画像データフレームの一つ一つのデータを有効に活用できるという本発明に係るマイクロLED発光検査装置の本領が発揮される。Furthermore, in an additional aspect, the invention provides
Provided is a micro LED emission inspection apparatus, characterized in that the micro LED is assigned to a predetermined category defined by a predetermined light energy intensity characteristic and a predetermined emission wavelength characteristic. The advantage of the micro LED light emission inspection apparatus according to the present invention is that the data of each image data frame can be effectively utilized.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置は、前記光路の光軸に対する前記光学フィルタの傾斜を制御するための傾斜角制御信号の受信部を含むフィルタ光軸傾斜角駆動機構をさらに備え、前記所定の光波長帯域を有する光学フィルタは、所定の波長範囲の中心値よりも長い波長をフィルター透過率の半値として作成された誘電体薄膜光学フィルターを用い、前記光軸方向に対して前記光学フィルターの前記傾斜角を前記所定の波長範囲の中心値にフィルター透過率の半値を調整可能と構成されることを特徴とするマイクロLED発光検査装置を提供する。この構成で、誘電体薄膜光学フィルターの傾斜を自動運転可能に構成され、フィルターを所望の透過光特性をもたせて使用できるという効果が得られる。Furthermore, in an additional aspect, the invention provides
The micro LED light emission inspection device according to the present invention further includes a filter optical axis tilt angle drive mechanism including a receiving portion of a tilt angle control signal for controlling the tilt of the optical filter with respect to the optical axis of the optical path, and the predetermined one. As the optical filter having an optical wavelength band, a dielectric thin film optical filter created with a wavelength longer than the center value of a predetermined wavelength range as a half value of the filter transmittance is used, and the optical filter of the optical filter is used in the optical axis direction. There is provided a micro LED light emission inspection device characterized in that a half value of a filter transmittance can be adjusted so that an inclination angle is a center value of the predetermined wavelength range. With this configuration, the tilt of the dielectric thin film optical filter can be automatically operated, and the filter can be used with desired transmitted light characteristics.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置の制御装置の制御部はフィルタ駆動機構に対して所定の波長範囲の中心値よりも長い波長をフィルター透過率の半値として作成された薄膜光学フィルターの選択を指示する制御信号を生成し、前記フィルタ駆動機構及び前記フィルタ光軸傾斜角駆動機構と前記制御装置とは第１の通信ネットワークを介して双方向通信可能に構成され、
前記制御装置と前記画像処理装置との間とは第２の通信ネットワークを介して双方向通信可能に構成され、
前記制御装置は前記画像処理装置から第２の通信ネットワークを介して所定の前記単位映像体の前記光強度を取得可能に構成され、かつ前記制御装置の制御部は前記傾斜角制御信号を生成可能であり前記第１の通信ネットワークを介してこれを前記フィルタ光軸傾斜角駆動機構へ送信可能に構成されており、前記光軸方向に対して前記光学フィルターの前記傾斜角が前記所定の波長範囲の中心値にフィルター透過率の半値との差異が所定のしきい値内に収まるように前記傾斜角が構成されることを特徴とする前段に記載のマイクロLED発光検査装置を提供する。この構成は、より詳細に自動運転の手段を構成しており所望の精度で光フィルタをチューニング可能であり、検査精度の向上に貢献するという効果が得られる。Furthermore, in an additional aspect, the invention provides
The control unit of the control device of the micro LED light emission inspection device according to the present invention instructs the filter driving mechanism to select the thin film optical filter created with the wavelength longer than the center value of the predetermined wavelength range as the half value of the filter transmittance. Generating a control signal for controlling the filter drive mechanism, the filter optical axis tilt angle drive mechanism, and the control device to be capable of bidirectional communication via a first communication network,
The control device and the image processing device are configured to enable bidirectional communication via a second communication network.
The control device is configured to be able to acquire the light intensity of a predetermined unit image body from the image processing device via a second communication network, and the control unit of the control device can generate the tilt angle control signal. It is configured such that it can be transmitted to the filter optical axis tilt angle drive mechanism via the first communication network, and the tilt angle of the optical filter with respect to the optical axis direction is the predetermined wavelength range. The micro LED light emission inspection device according to the preceding stage, wherein the inclination angle is configured such that the difference between the center value of the filter and the half value of the filter transmittance falls within a predetermined threshold value. With this configuration, the automatic operation means is configured in more detail, the optical filter can be tuned with desired accuracy, and an effect of contributing to improvement of inspection accuracy can be obtained.
　さらに、追加の態様で本発明は、
　前記光強度ピクセルマップは、隣接するピクセル間は移動平均によって前記段階的光強度の平滑処理がなされるマイクロLED発光検査装置を提供する。この構成で、ピクセル間に現出される検査時の様々な擾乱、ノイズの影響を緩和するという効果が得られる。Furthermore, in an additional aspect, the invention provides
The light intensity pixel map provides a micro LED light emission inspection apparatus in which the stepwise smoothing of the light intensity is performed by a moving average between adjacent pixels. With this configuration, it is possible to obtain the effect of mitigating the effects of various disturbances and noises that appear between pixels during inspection.
　さらに、追加の態様で本発明は、
　前記マイクロLED上に重畳された前記マイクロLEDの発光波長は、隣接するマイクロLED間について移動平均によって前記光波長の平滑処理がなされるマイクロLED発光検査装置を提供する。この構成で、マイクロLED間に現出される検査時の様々な擾乱、ノイズの影響を緩和可能であるという効果が得られる。Furthermore, in an additional aspect, the invention provides
The emission wavelength of the micro LED superimposed on the micro LED provides a micro LED emission inspection device in which the light wavelength is smoothed by a moving average between adjacent micro LEDs. With this configuration, the effect of being able to mitigate the effects of various disturbances and noises that appear between the micro LEDs during inspection can be obtained.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置は、光路の光軸に対する前記イメージセンサ傾斜角を制御するためのイメージセンサ傾斜角制御信号の受信部を含むイメージセンサ傾斜角駆動機構及び合焦のためのアクチュエータを前記撮像部はさらに備え、かつ前記制御装置と前記画像処理装置とは各々の通信部を介して通信可能に構成され、かつ前記制御装置の制御部は前記イメージセンサ傾斜角制御信号を生成可能であり前記通信部を介してこれを前記イメージセンサ傾斜角駆動機構へ送信可能に構成されており、
　前記制御装置は前記通信部を介して前記画像処理装置から取得された前記光強度ピクセルマップにおいて、所定のコントラストで前記光強度ピクセルマップの光強度を調整し、調整後の段階的光強度によって合焦するように前記イメージセンサ光軸傾斜角駆動機構及び前記アクチュエータを駆動することを特徴とするマイクロLED発光検査装置を提供する。Furthermore, in an additional aspect, the invention provides
A micro LED light emission inspection apparatus according to the present invention includes an image sensor tilt angle drive mechanism including an image sensor tilt angle control signal receiving unit for controlling the image sensor tilt angle with respect to an optical axis of an optical path, and an actuator for focusing. The image pickup unit is further provided, and the control device and the image processing device are configured to be communicable via respective communication units, and the control unit of the control device can generate the image sensor tilt angle control signal. It is configured to be able to transmit this to the image sensor tilt angle drive mechanism via the communication unit,
The control device adjusts the light intensity of the light intensity pixel map with a predetermined contrast in the light intensity pixel map acquired from the image processing device via the communication unit, and adjusts the light intensity pixel map according to the adjusted stepwise light intensity. Provided is a micro LED light emission inspection device characterized by driving the image sensor optical axis tilt angle drive mechanism and the actuator so as to focus.
　 この構成で、合焦のためのアクチュエータによって焦点を合わせるのみならず、イメージセンサ傾斜によっても焦点の精度をより精度よく調整可能となるという効果が得られる。With this configuration, it is possible to obtain the effect that not only the focus is adjusted by the actuator for focusing, but also the focus accuracy can be adjusted more accurately by the tilt of the image sensor.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置の画像処理装置は、映像表示装置をさらに備え、複数のマイクロLEDの前記光強度特性と前記発光波長の二次元マップを生成し、前記映像表示装置に表示することを特徴とするマイクロLED発光検査装置を提供する。この構成で、マイクロLEDの光特性で重要なパラメータを選び、強度光強度特性と前記発光波長の二次元マップを視認可能とする。実施形態によっては顕微鏡での視認に代えて、又はこれと合わせてウェハと重畳表示させられるという効果も得られる。Furthermore, in an additional aspect, the invention provides
The image processing device of the micro LED emission inspection device according to the present invention further includes an image display device, generates a two-dimensional map of the light intensity characteristics of a plurality of micro LEDs and the emission wavelength, and displays the two-dimensional map on the image display device. A micro LED light emission inspection device characterized by the above. With this configuration, an important parameter is selected for the optical characteristics of the micro LED, and the two-dimensional map of the intensity and light intensity characteristics and the emission wavelength can be visually confirmed. Depending on the embodiment, it is possible to obtain an effect that the display is superimposed on the wafer in place of or together with the visual observation with the microscope.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置は、さらに、前記制御部は、当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間は伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間は通信路を介して双方向通信可能と構成され、
前記制御部の処理の開始とともに前記給電機構によってマイクロLEDを点灯するマイクロLED点灯ステップと、及び
引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター無の配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタ無し光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
前記制御部は、前記第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ちで前記第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信する、第２の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
これに引き続き、前記マイクロLED検査部において、所定の前記マイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定する発光波長計算ステップと、及び
前記マイクロLED検査データ出力のための外部接続路及びデータ出力部を含み、前記発光波長データを前記デジタル画像処理装置内の前記メモリを介して、前記データ出力部から外部接続路に出力するマイクロLED発光波長データ出力ステップと、を実行するモジュールを前記画像処理装置はさらに含むマイクロLED発光検査装置を提供する。この構成で、マイクロLED発光検査装置の自動又は半自動の検査制御を実現可能となり、より高速に検査を実行できるという効果が得られる。Furthermore, in an additional aspect, the invention provides
In the micro LED light emission inspection device according to the present invention, the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection device, and a transmission path is provided between the filter drive mechanism and the control device. Is configured to be communicable via a communication path, and the control device and the image processing device are configured to be capable of bidirectional communication via a communication path.
The micro LED lighting step of lighting the micro LED by the power feeding mechanism with the start of the processing of the control section, and subsequently, the control section generates a signal for selecting a status in which the optical filter does not exist in the optical path, and further the transmission. After transmitting the signal to the filter drive mechanism via a path, the control unit immediately includes a first filter movement instruction step that waits for a start instruction notification of the first imaging, and the control unit includes a module that executes:
The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
Following this, in the unit image body identifying unit, the unit image body of the light emission is specified from the light intensity pixel map based on the predetermined criteria, and further unit image body mapping data to the pixel map is generated. Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map. The micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining an intensity and measuring the unfiltered light intensity of storing the light energy intensity value in the memory of the image processing device in the arrangement without the optical filter of the micro LED; Including processing equipment,
When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
When the control unit accepts the second imaging start instruction notification while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the second imaging start instruction signal. However, the control unit further includes a module that executes a second image capture start instruction step of transmitting the second image capture start instruction signal to the image processing apparatus via the communication path,
When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
Following this, in the unit image body identifying unit, the unit image body of the light emission is specified from the light intensity pixel map based on the predetermined criteria, and further unit image body mapping data to the pixel map is generated. Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map. The micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining the intensity, and measuring the filtered light intensity to be stored in the memory in the image processing device as the light energy intensity value in the arrangement of the micro LED with the optical filter;
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
Subsequent to this, in the micro LED inspection unit, an emission wavelength calculation step of determining the emission wavelength of the micro LED according to a predetermined emission wavelength calculation formula of the micro LED, and an external connection path for outputting the micro LED inspection data. And a data output unit, via the memory in the digital image processing device, the micro LED emission wavelength data output step of outputting to the external connection path from the data output unit, a module for performing. The image processing device further provides a micro LED light emission inspection device. With this configuration, automatic or semi-automatic inspection control of the micro LED light emission inspection device can be realized, and the effect that the inspection can be executed at higher speed can be obtained.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置の光源は、光波長の可変機構を備える既知の光波長の波長光源であり、前記マイクロLED発光検査装置は、さらに前記制御部に当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間で伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間で通信路を介して双方向通信可能と構成され、かつ
前記制御部が処理の開始とともに前記可変機構によって前記光源の光波長の設定値を初期値に更新する、光波長初期化ステップと、
前記可変機構によって前記光源の光波長を更新し、前記給電機構によって更新後の前記既知の光波長の波長光源を点灯するキャリブレーション光源点灯ステップと、及び
引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにキャリブレーション光源マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記キャリブレーション光源マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされたキャリブレーション光源の前記光学フィルター無の配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタなし光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
これに引き続き、第２の撮像の開始指示通知待ちとなっている前記制御部は、第２の撮像の開始指示を受け入れると、前記開始指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ送信し、後に他の処理待ちとなる第２のフィルタ移動指示ステップと、
前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
前記制御部は、前記第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ちで前記第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信する、第２の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに、前記マイクロLED識別部において、前記単位映像体から前記キャリブレーション光源マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされたキャリブレーション光源の前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
これに引き続き、前記マイクロLED検査部において、前記キャリブレーション光源としての前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記キャリブレーション光源の前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
引き続き、前記マイクロLED検査部において、前記既知の光源波長と前記光強度の比を前記メモリに格納するステップと、
前記光源の光波長の設定値を所定の増分値で更新する光源波長更新ステップと、
前記更新後の前記光源の光波長が所定の境界値を超えるか否かをチェックし、NOの場合には、キャリブレーション光源点灯ステップへ戻り、YESの場合には、ルックアップテーブル作成ステップへ進む、繰り返し判定ステップと、及び、
前記繰り返しで前記メモリに格納された複数の前記波長と前記光強度の比の組からルックアップテーブルを作成し、これを前記メモリに格納するルックアップテーブル作成ステップと、を実行するモジュールを含むマイクロLED発光検査装置を提供する。この構成で、ルックアップテーブルの自動又は半自動の作成が可能であり、ルックアップテーブル更新頻度を高めより正確な検査が可能であるいう効果や製造ラインに本装置が組み込まれた場合にルックアップテーブルの保守によるラインのダウンタイムをより短くすることが可能であるいう効果が得られる。Furthermore, in an additional aspect, the invention provides
The light source of the micro LED light emission inspection device according to the present invention is a wavelength light source of a known light wavelength including a light wavelength variable mechanism, and the micro LED light emission inspection device further includes the control unit of the micro LED light emission inspection device. A control CPU and a memory are provided, and the filter drive mechanism and the control device are configured to be communicable via a transmission path, and a communication path is provided between the control device and the image processing device. Bidirectional communication is possible via, and the control unit updates the set value of the light wavelength of the light source to the initial value by the variable mechanism at the start of the process, the light wavelength initialization step,
A calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the wavelength light source of the known light wavelength after being updated by the power feeding mechanism, and a status in which the optical filter is not present in the optical path. After the control unit generates a signal for selecting, and further transmits the signal to the filter drive mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification The control unit includes a module that executes an instructing step,
The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further generate unit image body mapping data to the pixel map, store it in the memory in the image processing apparatus, further consider the calibration light source mapping as the micro LED mapping, in the micro LED identification unit, The micro LED mapping data regarded as the calibration light source mapping is generated from a unit image body, stored in the memory, and the predetermined light energy is obtained from the light intensity on the light intensity map on the micro LED map. The light energy intensity of the micro LED is determined by an intensity calculation formula, and the memory in the image processing device as the light energy intensity value in the arrangement without the optical filter of the calibration light source regarded as the light emission of the micro LED. Measuring the unfiltered light intensity stored in the image processing device, and
When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
Subsequent to this, when the control unit waiting for the notification of the start instruction of the second imaging receives the start instruction of the second imaging, the control unit generates a signal for arranging the optical filter in the optical path based on the start instruction. Then, a second filter movement instruction step of transmitting to the filter driving mechanism via the transmission path and waiting for other processing later,
The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
When the control unit accepts the second imaging start instruction notification while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the second imaging start instruction signal. However, the control unit further includes a module that executes a second image capture start instruction step of transmitting the second image capture start instruction signal to the image processing apparatus via the communication path,
When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further, it generates unit image body mapping data to the pixel map, stores it in the memory in the image processing device, and further, in the micro LED identification unit, it is regarded as the calibration light source mapping from the unit image body. The generated micro LED mapping data is stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining the intensity and measuring the filtered light intensity to be stored in the memory in the image processing device as the light energy intensity value in the arrangement with the optical filter of the calibration light source regarded as the emission of the micro LED. When,
Following this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory in the image processing device, and corresponds to the micro LED. The optical energy intensity value in the arrangement without the optical filter is read from the memory in the image processing apparatus, the optical energy intensity value of the calibration light source in the arrangement with the optical filter, and the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity and the filtered light intensity according to the light energy intensity value of
Subsequently, in the micro LED inspection unit, a step of storing the ratio of the known light source wavelength and the light intensity in the memory,
A light source wavelength updating step of updating the set value of the light wavelength of the light source with a predetermined increment value,
It is checked whether the light wavelength of the light source after the update exceeds a predetermined boundary value. If NO, the process returns to the calibration light source lighting step, and if YES, the process proceeds to the lookup table creating step. , A repeat determination step, and
A lookup table creating step of creating a lookup table from a set of a plurality of ratios of the wavelength and the light intensity stored in the memory by the repetition, and storing the lookup table in the memory; Provide an LED light emission inspection device. With this configuration, a lookup table can be created automatically or semi-automatically, the lookup table can be updated more frequently, and more accurate inspection can be performed. The effect that line downtime due to maintenance can be shortened can be obtained.
　さらに、追加の態様で本発明は、
　本発明に係るマイクロLED発光検査装置に用いる光学フィルタのための光学フィルタ検査装置は、さらに前記制御部に当該光学フィルタ検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間で伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間で通信路を介して双方向通信可能と構成され、かつ
前記制御部が処理の開始とともに前記可変機構によって前記光源の光波長の設定値を初期値に更新する、光波長初期化ステップと、
前記可変機構によって前記光源の光波長を更新し、前記給電機構によって更新後の前記既知の光波長の波長光源を点灯するキャリブレーション光源点灯ステップと、及び
引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源の反射光をマイクロLEDの発光とみなし、前記反射光の単位映像体（反射光体という、本段落で以下同様）を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに反射光体マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記反射光体マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされた反射光の前記光学フィルター無の配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ無し光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
これに引き続き、第２の撮像の開始指示通知待ちとなっている前記制御部は、第２の撮像の開始指示を受け入れると、前記開始指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ送信し、後に他の処理待ちとなる第２のフィルタ移動指示ステップと、
前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源の反射光をマイクロLEDの発光とみなし、前記反射光の単位映像体（反射光体という、本段落で以下同様）を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに反射光体マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記反射光体マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされた反射光の前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
これに引き続き、前記マイクロLED検査部において、前記キャリブレーション光源の反射光としての前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記キャリブレーション光源の前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
引き続き、前記マイクロLED検査部において、前記既知の光源波長と前記光強度の比を前記メモリに格納するステップと、
前記光源の光波長の設定値を所定の増分値で更新する光源波長更新ステップと、
前記更新後の前記光源の光波長が所定の境界値を超えるか否かをチェックし、NOの場合には、キャリブレーション光源点灯ステップへ戻り、YESの場合には、ルックアップテーブル作成ステップへ進む、繰り返し判定ステップと、及び、
前記繰り返しで前記メモリに格納された複数の前記波長と前記光強度の比の組からルックアップテーブルを作成し、これを前記メモリに格納するルックアップテーブル作成ステップと、を実行するモジュールを含む光学フィルタ検査装置を提供する。この構成で、マイクロLEDアレイを模したサブストレートを用いる場合にも、主要な構成モジュールはマイクロLEDアレイのサブストレートを検査を同様の動作で処理可能であり、より本番に近いキャリブレーションやリハーサルが可能であるという効果が得られる。Furthermore, in an additional aspect, the invention provides
An optical filter inspection device for an optical filter used in a micro LED emission inspection device according to the present invention further comprises a CPU and a memory for controlling the optical filter inspection device in the control unit, and the filter drive mechanism and the It is configured to be capable of communicating with a control device via a transmission path, and is configured to be capable of bidirectional communication between the control device and the image processing device via a communication path, and the control unit At the start, the optical wavelength initialization step of updating the set value of the optical wavelength of the light source to the initial value by the variable mechanism, and
A calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the wavelength light source of the known light wavelength after being updated by the power feeding mechanism, and a status in which the optical filter is not present in the optical path. After the control unit generates a signal for selecting, and further transmits the signal to the filter drive mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification The control unit includes a module that executes an instructing step,
The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
Subsequent to this, in the unit image body identification unit, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body of the reflected light (hereinafter referred to as reflected light body, in this paragraph). Same) is specified based on the predetermined criteria, unit image object mapping data to the pixel map is further generated, stored in the memory in the image processing device, and reflected light object mapping is performed on the micro LED. Considered as mapping, in the micro LED identification unit, to generate the micro LED mapping data regarded as the reflected light body mapping from the unit image body, store it in the memory, the light on the micro LED map The light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the intensity map, and the light energy of the reflected light regarded as the light emission of the micro LED in the arrangement without the optical filter is determined. The image processing apparatus includes a module that executes a step of measuring unfiltered light intensity stored in the memory in the image processing apparatus as an intensity value.
When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
Subsequent to this, when the control unit waiting for the notification of the start instruction of the second imaging receives the start instruction of the second imaging, the control unit generates a signal for arranging the optical filter in the optical path based on the start instruction. Then, a second filter movement instruction step of transmitting to the filter driving mechanism via the transmission path and waiting for other processing later,
The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
Subsequent to this, in the unit image body identification unit, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body of the reflected light (hereinafter referred to as reflected light body, in this paragraph). Same) is specified based on the predetermined criteria, unit image object mapping data to the pixel map is further generated, stored in the memory in the image processing device, and reflected light object mapping is performed on the micro LED. Considered as mapping, in the micro LED identification unit, to generate the micro LED mapping data regarded as the reflected light body mapping from the unit image body, store it in the memory, the light on the micro LED map The light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the intensity map, and the light energy of the reflected light regarded as the light emission of the micro LED in the arrangement with the optical filter is determined. A step of measuring the light intensity with a filter stored in the memory in the image processing device as an intensity value, and
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the reflected light of the calibration light source is read from the memory in the image processing apparatus, The light energy intensity value in the arrangement without the optical filter corresponding to the LED is read from the memory in the image processing apparatus, the light energy intensity value of the calibration light source in the arrangement with the optical filter, and the optical filter. A step of calculating the ratio of the light intensity without a filter and the light intensity with a filter based on the light energy intensity value of the no arrangement, and
Subsequently, in the micro LED inspection unit, a step of storing the ratio of the known light source wavelength and the light intensity in the memory,
A light source wavelength updating step of updating the set value of the light wavelength of the light source with a predetermined increment value,
It is checked whether the light wavelength of the light source after the update exceeds a predetermined boundary value. If NO, the process returns to the calibration light source lighting step, and if YES, the process proceeds to the lookup table creating step. , A repeat determination step, and
A lookup table creating step of creating a lookup table from a set of a plurality of ratios of the wavelength and the light intensity stored in the memory by the repetition, and storing the lookup table in the memory; A filter inspection device is provided. With this configuration, even when a substrate simulating a micro LED array is used, the main constituent modules can process the inspection of the substrate of the micro LED array with the same operation, and calibration and rehearsal closer to the actual production can be performed. The effect of being possible is obtained.
　さらに、追加の態様で本発明は、
　前段までに記載のマイクロLED発光検査装置は、さらに、前記制御部は、当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間は伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間は通信路を介して双方向通信可能と構成され、
前記制御部の処理の開始とともに前記給電機構によってマイクロLEDを点灯するマイクロLED点灯ステップと、及び
引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター無の配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタなし光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
前記制御部は、前記第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ちで前記第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信した後に、第２の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
引き続き、前記マイクロLED検査部において、前記ルックアップテーブルの参照によって前記マイクロLEDの発光波長を決定するルックアップテーブル参照方式の発光波長決定ステップと、及び
前記マイクロLEDの配列設計データ出力のための外部接続路及びデータ出力部を含み、前記発光波長データを前記デジタル画像処理装置内の前記メモリを介して、前記データ出力部から外部接続路に前記発光波長データを出力するマイクロLED発光波長データ出力ステップと、を実行するモジュールを含むマイクロLED発光検査装置を提供する。この構成で、ルックアップテーブル参照方式の発光波長決定が自動運転又は本自動運転で実行でき、より高速の処理が実現され、また、外部機器へ光波長データを出力するのでより製造ラインと一体の運用が可能であるという効果が得られる。Furthermore, in an additional aspect, the invention provides
In the micro LED light emission inspection device described up to the previous stage, the control unit further includes a CPU and a memory for controlling the micro LED light emission inspection device, and transmits between the filter drive mechanism and the control device. It is configured to be communicable via a road, and bidirectional communication is possible between the control device and the image processing device via a communication path.
The micro LED lighting step of lighting the micro LED by the power feeding mechanism with the start of the processing of the control section, and subsequently, the control section generates a signal for selecting a status in which the optical filter does not exist in the optical path, and further the transmission. After transmitting the signal to the filter drive mechanism via a path, the control unit immediately includes a first filter movement instruction step that waits for a start instruction notification of the first imaging, and the control unit includes a module that executes:
The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
Following this, the unit image body identification unit identifies the unit image body of the light emission from the light intensity pixel map based on the predetermined criteria, and further generates unit image body mapping data to the pixel map, which is used. Is stored in the memory in the image processing apparatus, and further, the micro LED identification unit identifies a plurality of micro LEDs arranged in an array from the unit image body and displays the corresponding micro LEDs on the pixel map. The micro LED mapping data is mapped, stored in the memory, and the optical energy of the micro LED is calculated from the light intensity on the light intensity map on the micro LED map by the predetermined optical energy intensity calculation formula. The image is a module that executes a step of determining the intensity and measuring the unfiltered light intensity in which the optical energy intensity value in the arrangement of the micro LED without the optical filter is stored in the memory in the image processing apparatus. Including processing equipment,
When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
When the control unit receives the notification of the start instruction of the second imaging while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the start instruction signal of the second imaging. The control unit further includes a module that executes the second imaging start instruction step after transmitting the second imaging start instruction signal to the image processing device via the communication path.
When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
Following this, the unit image body identification unit identifies the unit image body of the light emission from the light intensity pixel map based on the predetermined criteria, and further generates unit image body mapping data to the pixel map, which is used. Is stored in the memory in the image processing apparatus, and further, the micro LED identification unit identifies a plurality of micro LEDs arranged in an array from the unit image body and displays the corresponding micro LEDs on the pixel map. The micro LED mapping data is mapped, stored in the memory, and the optical energy of the micro LED is calculated by the predetermined optical energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. A step of determining the intensity and measuring the light intensity with a filter in which the optical energy intensity value in the arrangement of the micro LED with the optical filter is stored in the memory in the image processing apparatus.
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
Subsequently, in the micro LED inspection unit, the emission wavelength determination step of the lookup table reference method for determining the emission wavelength of the micro LED by reference to the lookup table, and the external for the array design data output of the micro LED. A micro LED emission wavelength data output step that includes a connection path and a data output unit and outputs the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus. Provided is a micro LED light emission inspection device including a module for executing With this configuration, the emission wavelength determination of the lookup table reference method can be executed by automatic operation or main automatic operation, faster processing is realized, and the light wavelength data is output to an external device, so it is more integrated with the production line. The effect that it can be operated is obtained.
　さらに、追加の態様で本発明は、
　マイクロLED発光検査装置の光源は、前記光源の光波長の可変機構を備える既知の光波長の波長光源であり、前記マイクロLED発光検査装置は、さらに前記制御部にCPU及びメモリを備え、
前記制御部が処理の開始とともに前記可変機構によって前記光源の光波長の設定値を前記帯域幅の中心波長に更新する、光波長の中心波長設定ステップと、
前記可変機構によって前記光源の光波長を前記中心波長へ更新し、前記給電機構によって前記光波長の波長光源を点灯する中心波長光源点灯ステップと、及び
引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
　前記画像処理装置は前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに前記キャリブレーション光源マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記キャリブレーション光源マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、マイクロLEDとみなされた前記キャリブレーション光源発光体の前記光学フィルター無の配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ無し光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に後続の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
前記制御部は、後続の撮像開始指示待ちで前記後続の撮像の開始指示通知を受け入れると、前記後続の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記後続の撮像の開始指示信号を送信した後に、後続の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
前記画像処理装置は、前記通信路を介して前記後続の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する後続の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの前記単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに前記マイクロLED識別部において、マイクロLEDの発光とみなされた前記キャリブレーション光源光を前記単位映像体からマイクロLEDとして特定し前記ピクセルマップ上にマッピングする前記マイクロLEDマッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDとみなされた前記キャリブレーション光源発光体のの前記光エネルギ強度を決定し、前記キャリブレーション光源の前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
光強度の比が所定の判定幅内で0.5の近傍か否かを所定の判定条件によって判定し、
前記判定条件がNOであれば、前記フィルタ光軸傾斜角駆動機構のためにフィルタの角の変動ステップを駆動する信号を生成し、当該信号を前記フィルタ光軸傾斜角駆動機構へ送信し、フィルタ角の変動ステップを実行するモジュールへ制御を分岐し、その後、前記後続の撮像の開始指示通知を前記制御部へ前記通信部を介し前記制御装置へ送信し、前記制御部の後続の撮像ステップを実行するモジュールへ制御を戻し、以降の処理をループさせ、
前記前記判定条件がYESであれば、フィルタ角を前記メモリに格納する、フィルタ角を記録するステップへ分岐しループ処理を終了する、適正フィルタ角判定ステップと、を実行するモジュールを前記画像処理装置は含み、
ここで、前記フィルタ光軸傾斜角駆動機構は、所定の幅で前記フィルタ角を変動させる前記フィルタ角の変動ステップを実行するモジュールを含むマイクロLED発光検査装置を提供する。この構成で、フィルタ光軸傾斜角駆動機構の自動運転によって、より精密なフィルタ角の変動制御が可能となり、より精度の高い、より短時間のフィルタ透過波長の把握及び調整が可能であるという効果が得られる。Furthermore, in an additional aspect, the invention provides
The light source of the micro LED light emission inspection device is a wavelength light source of a known light wavelength including a variable mechanism of the light wavelength of the light source, the micro LED light emission inspection device further includes a CPU and a memory in the control unit,
The control unit updates the setting value of the light wavelength of the light source to the center wavelength of the bandwidth by the variable mechanism at the start of the process, the center wavelength setting step of the light wavelength,
A center wavelength light source lighting step of updating the light wavelength of the light source to the center wavelength by the variable mechanism and turning on the wavelength light source of the light wavelength by the power feeding mechanism, and a status in which the optical filter is not present in the optical path. After the control unit generates the signal to be selected and further transmits the signal to the filter driving mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification and then the first filter movement instruction. The control unit includes a step and a module for executing.
The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
When the image processing device receives the start instruction signal of the first imaging via the communication path, the image processing device accepts the video signal from the imaging device, and the pixel on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the map, and storing the light intensity pixel map in the memory in the image processing apparatus;
Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further generate unit image body mapping data to the pixel map, store it in the memory in the image processing apparatus, further considered the calibration light source mapping as the micro LED mapping, in the micro LED identification unit, Generate the micro LED mapping data regarded as the calibration light source mapping from the unit image body, store it in the memory, the predetermined light from the light intensity on the light intensity map on the micro LED map The light energy intensity of the micro LED is determined by an energy intensity calculation formula, and the light energy intensity value in the arrangement without the optical filter of the calibration light source luminous body regarded as a micro LED is used as the light energy intensity value in the image processing apparatus. The image processing apparatus includes a module that executes a step of measuring an unfiltered light intensity stored in a memory,
When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a subsequent imaging start instruction later.
The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
When the control unit accepts the subsequent imaging start instruction notification while waiting for the subsequent imaging start instruction, the control unit generates the subsequent imaging start instruction signal and sends the subsequent imaging start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module that executes a subsequent imaging start instruction step after transmitting an imaging start instruction signal,
When the image processing device receives the subsequent imaging start instruction signal via the communication path, the image processing device receives the video signal from the imaging device, and the pixel map on the image data frame is measured at each pixel. A subsequent imaging step of generating the light intensity pixel map in which the target light intensity is superimposed and storing the light intensity pixel map in the memory in the image processing apparatus;
Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on a predetermined criterion, and further, Generate the unit image body mapping data to the pixel map, store it in the memory in the image processing device, further, in the micro LED identification unit, the calibration light source light regarded as light emission of the micro LED Is generated from the unit image body as a micro LED to generate the micro LED mapping data to be mapped on the pixel map, which is stored in the memory in the image processing device, and the light intensity on the micro LED map. From the light intensity on the map to determine the light energy intensity of the calibration light source luminous body regarded as the micro LED by the predetermined light energy intensity calculation formula, in the arrangement with the optical filter of the calibration light source. Measuring a filtered light intensity stored in the memory in the image processing device as the light energy intensity value;
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
Determine whether the ratio of the light intensity is near 0.5 within a predetermined determination width according to a predetermined determination condition,
If the determination condition is NO, a signal for driving the step of changing the angle of the filter is generated for the filter optical axis tilt angle drive mechanism, and the signal is transmitted to the filter optical axis tilt angle drive mechanism. The control is branched to the module that executes the angle variation step, and then the start instruction notification of the subsequent imaging is transmitted to the control unit via the communication unit to the control device, and the subsequent imaging step of the control unit is performed. Return control to the module to be executed, loop the subsequent processing,
If the determination condition is YES, a module that executes a proper filter angle determination step of storing a filter angle in the memory, branching to a step of recording the filter angle and ending the loop processing, is provided as the image processing apparatus. Includes,
Here, the filter optical axis tilt angle drive mechanism provides a micro LED light emission inspection device including a module that performs the filter angle changing step of changing the filter angle within a predetermined width. With this configuration, the automatic operation of the filter optical axis tilt angle drive mechanism enables more precise control of the filter angle fluctuation, which makes it possible to grasp and adjust the filter transmission wavelength with higher accuracy and in a shorter time. Is obtained.
　さらに、追加の態様で本発明は、
　製造プロセス管理コンピュータとの通信路及び製造データ入力部をさらに備え、前記通信路を介して前記製造プロセス管理コンピュータから製造条件を含む製造指示を受入れる製造指示受入れステップを実行するモジュールをさらに含むマイクロLED発光検査装置を提供する。この構成で、製造プロセス管理コンピュータによって製造プロセス上流との一体運用が可能となるという効果が得られる。Furthermore, in an additional aspect, the invention provides
A micro LED further including a communication path with a manufacturing process management computer and a manufacturing data input unit, and further including a module for executing a manufacturing instruction receiving step of receiving a manufacturing instruction including manufacturing conditions from the manufacturing process management computer via the communication path. A luminescence inspection device is provided. With this configuration, it is possible to obtain an effect that the manufacturing process management computer enables integrated operation with the upstream of the manufacturing process.
　さらに、追加の態様で本発明は、
　製造プロセス管理コンピュータへの通信路及び製造データ出力部をさらに備え、前記通信路を介して前記製造プロセス管理コンピュータへ前記キャリブレーションのデータその他の進捗データを含む製造プロセスデータを出力する製造データ出力ステップを実行するモジュールをさらに含むマイクロLED発光検査装置を提供する。この構成で製造プロセス管理コンピュータによって製造プロセス下流との一体運用が可能となるという効果が得られる。Furthermore, in an additional aspect, the invention provides
A manufacturing data output step that further includes a communication path to a manufacturing process management computer and a manufacturing data output unit, and outputs manufacturing process data including calibration data and other progress data to the manufacturing process management computer via the communication path. There is provided a micro LED light emission inspection device further including a module for executing the above. With this configuration, it is possible to obtain an effect that the manufacturing process management computer enables integrated operation with the downstream of the manufacturing process.
　さらに、追加の態様で、
　本発明に係るマイクロLED発光検査装置は、さらに、制御装置が当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間は伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間は通信路を介して双方向通信可能と構成され、かつ前記制御装置の前記制御部は以下の、
前記給電機構によってマイクロLEDを点灯するマイクロLED点灯ステップを実行するモジュールと、
前記光フィルタが前記光路に存在しないステータスを選択する信号を生成し、さらに前記伝送路を介して、前記光フィルタが前記光路に存在しないステータスを選択するように前記フィルタ駆動機構を駆動する最初のフィルタ移動ステップを実行するモジュールと、
最初の撮像の開始指示通知を受け入れ、前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールと、
第２のフィルタ移動指示を受け入れ、当該指示に基づき所定の前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介して、前記光学フィルタを光路に配設するように前記フィルタ駆動機構を駆動する第２のフィルタ移動ステップを実行するモジュールと、及び
第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信する、第２の撮像の開始指示ステップを実行するモジュールを前記制御部は含み、
前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記所定のクライテリアに基づく前記発光の単位映像体を特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター無の配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタなし光強度を測定するステップと、
前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
これに引き続き、前記単位映像体識別部において、前記単位映像体識別部において、前記光強度ピクセルマップから前記所定のクライテリアに基づく前記発光の単位映像体を特定し、さらに前記ピクセルマップへの前記単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに前記マイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列された前記マイクロLEDを特定し前記ピクセルマップ上にマッピングする前記マイクロLEDマッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
これに引き続き、前記マイクロLED検査部において、所定の前記マイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定する発光波長計算ステップと、及び
前記マイクロLEDの配列製品データ出力のための外部接続路及びデータ出力部を含み、前記発光波長データを前記デジタル画像処理装置内の前記メモリを介して、前記データ出力部から外部接続路に前記発光波長データを出力するマイクロLED発光波長データ出力ステップと、を実行するモジュールを前記画像処理装置は含むマイクロLED発光検査装置を提供する。この構成で、制御のためのCPU及びメモリを備え、ソフトウェアによって本発明の構成が実現できるという効果が得られる。ソフトウェアはCPU及びメモリで稼働されるオペレーティングシステム上で稼働するアプリケーションソフトウェアでもよいし、ソフトウェアはメモリ上で稼働するオペレーティングシステムに組み込まれ、オペレーティングシステムがCPU制御されるシステムソフトウェアでもよいし、ソフトウェアはハードウェアのROMに組み込まれるファームウェアでもよいし、ハードウェアに組み込まれるASICに構成されたロジックコントロールされるものでもよく、これらによって、より柔軟できめ細かい自動運転が実現可能となったり、バージョンアップ保守も可能となる効果がある。Further, in an additional aspect,
In the micro LED light emission inspection device according to the present invention, the control device further includes a CPU and a memory for controlling the micro LED light emission inspection device, and a transmission path is provided between the filter drive mechanism and the control device. Is configured to be communicable, and the control device and the image processing device are configured to be capable of bidirectional communication via a communication path, and the control unit of the control device is as follows:
A module that performs a micro LED lighting step of lighting the micro LED by the power feeding mechanism,
The optical filter generates a signal selecting a status not existing in the optical path, and further drives the filter driving mechanism to select a status not existing in the optical path by the optical filter via the transmission path. A module that performs the filter movement step,
The first imaging start instruction signal is accepted, the first imaging start instruction signal is generated, and immediately after the first imaging start instruction signal is transmitted to the image processing apparatus via the communication path, the first imaging start instruction signal is transmitted. A module that executes a first imaging start instruction step waiting for a second filter movement instruction;
The second filter movement instruction is received, a signal for arranging a predetermined optical filter in the optical path is generated based on the instruction, and the filter is driven so that the optical filter is arranged in the optical path via the transmission path. A module that executes a second filter moving step that drives the mechanism, and a second imaging start instruction notification are received, and a second imaging start instruction signal is generated, and the image is transmitted via the communication path. The control unit includes a module that transmits the second imaging start instruction signal to the processing device, and executes a second imaging start instruction step,
When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
Continuing on from this, in the unit image body identification unit, the unit image body of the light emission based on the predetermined criteria is specified from the light intensity pixel map, and further unit image body mapping data to the pixel map is generated. Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map. The micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining an intensity, and measuring an unfiltered light intensity for storing the light energy intensity value in the optical filter-less arrangement of the micro LED in the memory in the image processing apparatus,
When the second imaging start instruction signal is received via the communication path, the video signal is received from the imaging device, and the stepwise light intensity measured at each pixel is superimposed on the pixel map on the image data frame. A second imaging step of generating the stored light intensity pixel map and storing the generated light intensity pixel map in the memory in the image processing apparatus;
Continuing to this, in the unit image body identifying unit, the unit image body identifying unit identifies the unit image body of the light emission based on the predetermined criteria from the light intensity pixel map, and further, the unit to the pixel map. Image body mapping data is generated and stored in the memory in the image processing apparatus, and further, in the micro LED identification section, the unit image bodies are used to identify the plurality of micro LEDs arranged in the array. The micro LED mapping data to be mapped on the pixel map is generated, stored in the memory in the image processing device, and the predetermined light energy is calculated from the light intensity on the light intensity map on the micro LED map. The light energy intensity of the micro LED is determined by an intensity calculation formula, and the light intensity with the filter stored in the memory as the light energy intensity value in the arrangement of the micro LED with the optical filter is measured. Steps to
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
Following this, in the micro LED inspection unit, an emission wavelength calculation step of determining the emission wavelength of the micro LED according to a predetermined emission wavelength calculation formula of the micro LED, and an external device for outputting the array product data of the micro LED. A micro LED emission wavelength data output step that includes a connection path and a data output section, and outputs the emission wavelength data from the data output section to an external connection path via the memory in the digital image processing device. There is provided a micro LED light emission inspection device in which the image processing device includes a module for executing the following. With this configuration, the CPU and the memory for control are provided, and the configuration of the present invention can be realized by software. The software may be application software that runs on an operating system that runs on a CPU and memory, the software may be system software that is embedded in an operating system that runs on memory, and the operating system is CPU-controlled, or the software may be hardware. It may be firmware built into the ROM of the hardware, or it may be logic-controlled that is configured in the ASIC built into the hardware. With these, more flexible and detailed automatic operation can be realized, and version upgrade maintenance is also possible. There is an effect.
　さらに、追加の態様で、
　本発明に係るマイクロLED発光検査装置の前記画像処理装置は、製造条件データ出力部をさらに備え、前記サブストレート全体映像、１又は複数の前記単位映像体マッピングデータ及びこれに対応する前記光強度特性及び前記発光波長特性及び前記範疇のうち少なくとも一つを含む前記マイクロLEDマッピングデータ又はマイクロLEDの前記光強度特性の少なくともいずれか１つから所定のデータを所定のデータ形式に変換し製造条件データとして生成及び出力することを特徴とする本発明に係るマイクロLED発光検査装置を含むマイクロLED製造装置を提供する。この構成で、より密接な製造プロセスとの連携が可能となるという効果が得られる。Further, in an additional aspect,
The image processing device of the micro LED light emission inspection device according to the present invention further comprises a manufacturing condition data output unit, wherein the whole substrate image, one or a plurality of unit image object mapping data and the light intensity characteristics corresponding thereto are provided. And converting at least one of the micro LED mapping data including at least one of the emission wavelength characteristic and the category or the light intensity characteristic of the micro LED into a predetermined data format as manufacturing condition data. Provided is a micro LED manufacturing apparatus including a micro LED light emission inspection apparatus according to the present invention, which is characterized by generating and outputting. With this configuration, it is possible to obtain an effect that it is possible to cooperate with a closer manufacturing process.
　さらに、追加の態様で、
　本発明に係るマイクロLED発光検査装置の画像処理装置は、前記発光波長の二次元マップをさらに出力することを特徴とする前段に記載の本発明に係るマイクロLED発光検査装置を含むマイクロLED製造装置を提供する。この構成で、　という効果が得られる。Further, in an additional aspect,
The image processing device of the micro LED light emission inspection device according to the present invention is a micro LED manufacturing device including the micro LED light emission inspection device according to the present invention described in the previous stage, which further outputs a two-dimensional map of the light emission wavelength. I will provide a. With this configuration, the following effect can be obtained.
　さらに、追加の態様で、
　本発明に係るマイクロLED発光検査装置に用いる光学フィルタ検査装置の構成要素であるサブストレートに配列される多数の反射体は、クロムを主成分とする金属膜から成るとよい。この構成で、耐久性で実績のある光沢のよい反射体が構成され、より検査品質が高まり、貴金属膜に比してより経済的であるという効果が得られる。Further, in an additional aspect,
The large number of reflectors arranged on the substrate, which is a component of the optical filter inspection device used in the micro LED emission inspection device according to the present invention, may be formed of a metal film containing chromium as a main component. With this construction, a durable and well-reflected reflector is constructed, the inspection quality is further improved, and it is more economical than the precious metal film.
　さらに、追加の態様で本発明は、
　全自動化された製造プロセスに組み込まれたマイクロLED発光検査方法は、本発明に係るマイクロLED発光検査装置を用い、以下の段階、
アライメントマーク情報を含むサブストーレートのジオメオリ情報、マイクロLEDのジオメトリ情報及びマイクロLEDアレイのジオメトリ情報を受け入れる製品情報取得段階と、引き続き実行される、
１又は複数の前記ジオメトリ情報から前記サブストレート上で局所的な製品品質のばらつき及び/又は異常を認識及び管理するための製造管理区域を設定する製造管理区域設定段階と、引き続き実行される、
ネットワーク手段によって接続された製造ライン制御コンピュータに検査受け入れ可能状態を前記ネットワーク手段を介して通知する検査受け入れ可能通知段階と、引き続き実行される、
前記製造ライン制御コンピュータからマイクロLEDウェハ製造情報を受信する製造情報受け入れ段階と、引き続き実行される、
検査ベッド上に前記ウェハを搭載するウェハ搭載段階と、引き続き実行される、
画像処理装置によって前記サブストレートの全体像を撮像し、前記サブストレートに前記製造管理区域をマッピングする製造管理区域マッピング段階と、
画像処理装置によって前記サブストレート上に配設された前記マイクロLEDを前記画像処理装置内に生成された画像フレーム上にマッピングするマイクロLEDマッピング段階と、引き続き実行される、
前記画像処理装置によって、マイクロLEDチップを点灯し発光強度と発光波長を測定するマイクロLED特性測定段階と、引き続き実行される、
前記画像処理装置によって、前記マイクロLED特性を元に所定の分類条件によって前記発光強度と前記発光波長のマトリックスで分類された異常分類を含むカテゴリ情報を前記マイクロLEDマップ情報に付し、全マイクロLEDチップを分類仕分けするマイクロLED仕分け段階と、引き続き実行される、
前記画像処理装置によって、前記カテゴリ情報の付された前記マイクロLEDを前記製造管理区域マップにオーバーレイし、前記製造管理区域に関しマイクロLED製造プロセス状態を認識する製造プロセス状態判定段階と、引き続き実行される、
前記画像処理装置によって、前記ネットワーク手段を介して前記製造ライン制御コンピュータへ前記仕分け情報と前記製造プロセス状態を送信する検査結果送信段階と、引き続き実行される、
検査終了状態を前記ネットワーク手段を介して前記製造ライン制御コンピュータへ検査終了通知を送信する検査終了通知段階と、
を含む、全自動化された製造プロセスに組み込まれたマイクロLED発光検査装置の使用方法を提供する。この構成で、製造条件によって変動するばらつきをより抑え、製造ばらつき変動因子の迅速なフィードバックをタイムリーに製造プロセスへ提供する効果を提供するという効果が得られる。Furthermore, in an additional aspect, the invention provides
The micro LED light emission inspection method incorporated in the fully automated manufacturing process uses the micro LED light emission inspection device according to the present invention and the following steps:
The product information acquisition stage that accepts sub-strate geomeoli information including alignment mark information, micro LED geometry information, and micro LED array geometry information, and continues to be executed.
A manufacturing control area setting step of setting a manufacturing control area for recognizing and managing local product quality variability and / or anomalies on the substrate from one or more of the geometry information, followed by execution.
An inspection acceptability notifying step of notifying the production line control computer connected by the network means of the inspection acceptability state via the network means, and subsequently executed.
A manufacturing information receiving step of receiving micro LED wafer manufacturing information from the manufacturing line control computer, and subsequently executed;
A wafer mounting step of mounting the wafer on the inspection bed, and subsequently executed,
A manufacturing control area mapping step of capturing an overall image of the substrate by an image processing device and mapping the manufacturing control area on the substrate,
A micro LED mapping step of mapping the micro LEDs disposed on the substrate by the image processing apparatus onto an image frame generated in the image processing apparatus is subsequently performed.
By the image processing device, a micro LED characteristic measuring step of lighting the micro LED chip and measuring the emission intensity and the emission wavelength, and subsequently executed.
The image processing apparatus attaches category information including anomalous classification classified by a matrix of the emission intensity and the emission wavelength according to a predetermined classification condition based on the micro LED characteristics to the micro LED map information, and all micro LEDs. Micro LED sorting stage to sort and sort chips, and continue to run,
The image processing apparatus overlays the microLED with the category information on the manufacturing control area map, and continues to execute a manufacturing process state determination step of recognizing the microLED manufacturing process state with respect to the manufacturing control area. ,
The image processing apparatus continues to execute the inspection result transmission step of transmitting the sorting information and the manufacturing process state to the manufacturing line control computer via the network means.
An inspection end notification step of transmitting an inspection end notification to the manufacturing line control computer via the network means,
The present invention provides a method of using a micro LED light emission inspection device incorporated into a fully automated manufacturing process, including: With this configuration, it is possible to obtain the effect of further suppressing the variation that fluctuates depending on the manufacturing conditions and providing the effect of providing prompt feedback of the manufacturing variation variation factor to the manufacturing process in a timely manner.
　以上に示されるように本発明は、より高速のマイクロLED発光検査装置を提供し、マイクロLED製造プロセスと一体化される場合には、製造管理水準をより高めることを可能とする。As shown above, the present invention provides a higher speed micro LED emission inspection device, and when integrated with the micro LED manufacturing process, it is possible to further raise the manufacturing control level.
図１は、本発明の一実施形態に係るマイクロLED発光検査装置１の物理構成図である。 FIG. 1 is a physical configuration diagram of a micro LED light emission inspection device 1 according to an embodiment of the present invention.
[図２]図２は、本発明の一実施形態に係るマイクロLED発光検査装置１の機能構成図である。FIG. 2 is a functional configuration diagram of a micro LED light emission inspection device 1 according to an embodiment of the present invention.
[図３]図３は、本発明の一実施形態に係るマイクロLED発光検査装置１の概観模式図である。FIG. 3 is a schematic view of a micro LED light emission inspection device 1 according to an embodiment of the present invention.
[図４]図４は、本発明の一実施形態に係るマイクロLED発光検査装置の光強度比の決定を説明するためのグラフである。FIG. 4 is a graph for explaining the determination of the light intensity ratio of the micro LED light emission inspection device according to the embodiment of the present invention.
[図５]図５は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における機能構成図である。FIG. 5 is a functional block diagram of a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図６]図６は、本発明の一実施形態に係るマイクロLED発光検査装置１の制御システムフローチャートを説明する模式フローチャート図である。FIG. 6 is a schematic flowchart diagram illustrating a control system flowchart of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図７]図７は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における物理構成図である。FIG. 7 is a physical configuration diagram of a modified embodiment of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図８]図８は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例におけるマイクロLED発光検査検査時のルックアップテーブル参照方式による光波長決定の場合の制御システムフローチャートを説明するフローチャート模式図である。FIG. 8 is a control system flowchart for determining a light wavelength by a lookup table reference method during micro LED light emission inspection and inspection in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention. It is a flow chart schematic diagram explaining.
[図９]図９は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における物理構成図である。FIG. 9 is a physical configuration diagram of a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図１０]図１０は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例におけるマイクロLED発光検査検査時のルックアップテーブル作成のためキャリブレーション時の制御システムフローチャートを説明するフローチャート模式図である。FIG. 10 illustrates a control system flowchart at the time of calibration for creating a look-up table at the micro LED light emission inspection inspection in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention. It is a flow chart schematic diagram.
[図１１]図１１は、本発明の他の態様である、マイクロLED発光検査装置１に用いる光学フィルタ検査装置の一実施形態に係る光学フィルタ検査装置１０１の物理構成図である。FIG. 11 is a physical configuration diagram of an optical filter inspection device 101 according to an embodiment of an optical filter inspection device used in the micro LED light emission inspection device 1, which is another aspect of the present invention.
[図１２]図１２は、本発明の他の態様である、マイクロLED発光検査装置１に用いる光学フィルタ検査装置の一実施形態に係る光学フィルタ検査装置１０１の機能構成図である。FIG. 12 is a functional configuration diagram of an optical filter inspection device 101 according to an embodiment of an optical filter inspection device used in the micro LED emission inspection device 1, which is another aspect of the present invention.
[図１３]図１３は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における制御システムフローチャートを説明するフローチャート模式図である。FIG. 13 is a schematic flow chart explaining a control system flow chart in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図１４]図１４は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における参照発光体を含む物理構成図である。FIG. 14 is a physical configuration diagram including a reference illuminant in a modified embodiment of the micro LED luminescence inspection device 1 according to the embodiment of the present invention.
[図１５]図１５は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における光センサを含む物理構成図である。FIG. 15 is a physical configuration diagram including an optical sensor in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図１６]図１６は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例におけるデジタル画像処理装置に不良品判定部を含む機能構成図である。FIG. 16 is a functional configuration diagram including a defective product determination unit in a digital image processing device in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図１７]図１７は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例におけるデジタル画像処理装置にデータ入力部を含む機能構成図である。FIG. 17 is a functional configuration diagram including a data input unit in a digital image processing device in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
［図１８］図１８は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における画面表示装置を含む物理構成図である。FIG. 18 is a physical configuration diagram including a screen display device in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図１９]図１９は、本発明の一実施形態に係るマイクロLED発光検査装置１の変形実施例における発光波長と光フィルタ有無による光強度比の二次元マップの範疇を示すグラフ図である。FIG. 19 is a graph showing the category of a two-dimensional map of the light emission wavelength and the light intensity ratio depending on the presence or absence of an optical filter in a modified example of the micro LED light emission inspection device 1 according to the embodiment of the present invention.
[図２０]図２０は、本発明の２実施形態に係るマイクロLED発光検査装置５００の一態様の物理構成図である。FIG. 20 is a physical configuration diagram of an aspect of a micro LED light emission inspection device 500 according to the second embodiment of the present invention.
[図２１]図２１は、本発明の第２実施形態に係るマイクロLED発光検査装置５００の一態様の機能構成図である。FIG. 21 is a functional configuration diagram of one aspect of the micro LED light emission inspection device 500 according to the second embodiment of the present invention.
[図２２]図２２は、本発明の第２実施形態に係るマイクロLED発光検査装置５００の一態様における制御システムフローチャートを説明するフローチャート模式図である。FIG. 22 is a schematic flow chart explaining a control system flow chart in one mode of the micro LED light emission inspection device 500 according to the second embodiment of the present invention.
[図２３]図２３は、本発明の第１実施形態に係る発光波長検査装置の変形実施態様である発光波長検査装置６００を示す正面概略図である。FIG. 23 is a front schematic view showing an emission wavelength inspection device 600, which is a modified embodiment of the emission wavelength inspection device according to the first embodiment of the present invention.
[図２４]図２４は、同装置におけるフィルターが光路に挿入された場合を示す説明のための発光波長検査装置６００を示す正面概略図である。FIG. 24 is a schematic front view showing an emission wavelength inspection device 600 for explanation showing a case where a filter in the device is inserted into an optical path.
[図２５]図２５は、同装置における色フィルター５０の透過率特性を示すグラフ図である。FIG. 25 is a graph showing transmittance characteristics of the color filter 50 in the same device.
[図２６]図２６は、本発明の第２実施形態の変形実施形態である発光波長検査装置７００の正面模式図である。FIG. 26 is a front schematic view of an emission wavelength inspection device 700, which is a modified embodiment of the second embodiment of the present invention.
[図２７]図２７は、同装置における色フィルター５６の透過率特性の傾斜角の変化の影響を示すためのグラフ図である。FIG. 27 is a graph for showing the influence of a change in the inclination angle of the transmittance characteristic of the color filter 56 in the same apparatus.
[図２８]図２８は、同装置を用いるマイクロLED発光検査のフローチャートである。FIG. 28 is a flowchart of a micro LED light emission test using the same device.
[図２９]図２９は、本発明の第１実施形態の変形実施形態である発光波長検査装置８００の斜視模式図である。FIG. 29 is a schematic perspective view of an emission wavelength inspection device 800 that is a modified embodiment of the first embodiment of the present invention.
<第１実施形態>
　本発明に係るマイクロLED発光検査装置１の一実施形態は以下である。図１に示される物理構成ブロック図に示されるように、マイクロLED発光検査装置１は、給電機構１０、光学レンズ２０、撮像装置３０、デジタル画像処理装置４０、光学フィルタ５０、フィルタ駆動機構６０、及び制御装置７０等の物理構造を部分に含むマイクロLED発光検査装置である。<First embodiment>
An embodiment of the micro LED light emission inspection device 1 according to the present invention is as follows. As shown in the physical configuration block diagram shown in FIG. 1, the micro LED light emission inspection device 1 includes a power feeding mechanism 10, an optical lens 20, an imaging device 30, a digital image processing device 40, an optical filter 50, a filter driving mechanism 60, And a micro LED light emission inspection device including a physical structure such as the control device 70 in a part thereof.
　より詳細には、マイクロLED発光検査装置１の一実施形態は。図２に掲げる機能構成図に示されているように、検査対象のウェハとして、個別に分離されるべき１００μm角以下の大きさの矩形領域内を占めるマイクロLED２がアレイ状に配列されて表面に形成された半導体サブストレート３が装着可能であり、給電機構１０によって点灯されたマイクロLED２の光は、光学フィルタ５０、光学レンズ２０を通る光路を介してイメージセンサ３１を有する撮像装置３０へ導かれる配置構成となっている。例えば赤色を含むように所定の光波長帯域を有する光学フィルタ５０は、マイクロLED２と前記光学レンズ２０との光路２１に配設され、光学フィルタ５０によって選択透過された所定の光波長帯域の光がイメージセンサ３１を介し、撮像装置３０において映像信号を生成させる構成となっている。前記デジタル画像処理装置４０はメモリ４１を備え、前記映像信号を映像信号線１８を介して撮像装置３０から受入れ、映像信号から画像データフレーム４２を生成し、これをメモリ４１へ格納するように構成されている。半導体サブストレート３全体に形成されているマイクロLED２の占める領域は、複数の画像データフレーム４２によって分割格納されてもよい。More specifically, one embodiment of the micro LED light emission inspection device 1. As shown in the functional configuration diagram shown in FIG. 2, as a wafer to be inspected, micro LEDs 2 occupying a rectangular area of 100 μm square or less to be individually separated are arranged in an array on the surface. The formed semiconductor substrate 3 can be mounted, and the light of the micro LED 2 turned on by the power feeding mechanism 10 is guided to the image pickup device 30 having the image sensor 31 via the optical path passing through the optical filter 50 and the optical lens 20. It is arranged. For example, the optical filter 50 having a predetermined light wavelength band so as to include red is disposed in the optical path 21 between the micro LED 2 and the optical lens 20, and the light of the predetermined light wavelength band selectively transmitted by the optical filter 50 is transmitted. The image sensor 30 is configured to generate a video signal in the image pickup apparatus 30 via the image sensor 31. The digital image processing device 40 includes a memory 41, and is configured to receive the video signal from the imaging device 30 via the video signal line 18, generate an image data frame 42 from the video signal, and store the image data frame 42 in the memory 41. Has been done. The area occupied by the micro LED 2 formed on the entire semiconductor substrate 3 may be divided and stored by a plurality of image data frames 42.
　前期光学フィルタ５０は、フィルタ駆動機構６０によって支持されており、フィルタ駆動機構６０は制御装置７０からの制御信号を制御信号線８８を経由し受け入れるための受信部６２を備える。前記制御装置７０は、フィルタ駆動機構６０によって光学フィルター５０の有無を選択制御可能に構成されている、制御装置７０フィルタ駆動機構６０の制御信号の生成のための制御部７１を含み、当該制御部７１は、システムフロー開始とフロー制御可能に構成され、制御部７１は、フィルタ駆動機構６０の前記制御信号を送信するための送信部７２を備え、制御信号をフィルタ駆動機構６０に備わる制御信号のフィルタ駆動機構受信部６２に送信可能に構成されている。The optical filter 50 is supported by a filter driving mechanism 60, and the filter driving mechanism 60 includes a receiving unit 62 for receiving a control signal from the control device 70 via a control signal line 88. The control device 70 includes a control unit 71 for generating a control signal for the filter drive mechanism 60 of the control device 70, which is configured so that the presence or absence of the optical filter 50 can be selectively controlled by the filter drive mechanism 60. The 71 is configured to be able to start the system flow and control the flow, and the control unit 71 includes a transmission unit 72 for transmitting the control signal of the filter drive mechanism 60, and the control signal is a control signal provided in the filter drive mechanism 60. The filter drive mechanism receiver 62 is configured to be able to transmit.
　デジタル画像処理装置４０において、映像信号から生成されたデジタル光強度は、画像データフレーム４２上のピクセル毎に段階的光強度を持ち、複数の画像データフレーム４２は束ねられメモリ４１上に保持されてもよいが、半導体サブストレート３全体が撮像された画像データフレーム４２上に貼られた直交座標系で各々x番目、y番目のピクセル毎の光強度関数をＩ（x，y）として、光強度ピクセルマップＩ（ｘ，ｙ）４５として記録されるようにデジタル画像処理装置４０は構成されている。光強度ピクセルマップＩ（ｘ，ｙ）４５の隣接するピクセル間は移動平均によって前記段階的光強度の平滑処理がなされてもよい。デジタル画像処理装置４０には、単位映像体識別部８１が構成されており、画像データフレーム４２上のピクセル毎の光強度ピクセルマップ４５から所定のクライテリアに基づきデジタル画像処理装置４０の画面フレーム内に現出される発光体の単位映像体８０が特定され、前記ピクセルマップ４３への単位映像体マッピングデータ４６を生成するように単位映像体識別部８１において単位映像体８０が特定されるようにデジタル画像処理装置４０は構成されている。画像データフレーム４２上座標系でｉ番目、j番目の単位映像体８０は単位映像体マッピングデータ４６座標システムで座標（Ｉ，Ｊ）の単位映像体８０として特定される。In the digital image processing device 40, the digital light intensity generated from the video signal has a stepwise light intensity for each pixel on the image data frame 42, and the plurality of image data frames 42 are bundled and held in the memory 41. However, the light intensity function for each x-th and y-th pixel in the Cartesian coordinate system pasted on the image data frame 42 in which the entire semiconductor substrate 3 is imaged is I(x, y), and the light intensity is The digital image processing device 40 is configured to be recorded as a pixel map I (x, y) 45. The stepwise light intensity smoothing process may be performed by a moving average between adjacent pixels of the light intensity pixel map I (x, y) 45. The unit image body identifying unit 81 is configured in the digital image processing device 40, and the unit image body identifying unit 81 is formed in the screen frame of the digital image processing device 40 based on a predetermined criterion from the light intensity pixel map 45 for each pixel on the image data frame 42. The unit image body 80 of the light emitter to be displayed is specified, and the unit image body identification unit 81 digitally identifies the unit image body 80 so as to generate the unit image body mapping data 46 to the pixel map 43. The image processing device 40 is configured. The i-th and j-th unit image bodies 80 in the coordinate system on the image data frame 42 are specified as the unit image body 80 of the coordinates (I, J) in the unit image body mapping data 46 coordinate system.
　デジタル画像処理装置４０には、マイクロLED識別部９０が構成されており、半導体サブストレート３上にアレイ状に配列された個々のマイクロLED２は、単位映像体８０を手がかりに特定される。半導体サブストレート３上に相対的に例えば格子状に配列配置されているマイクロLED２は、所定のクライテリア例えば、画像フレーム４２上で周囲に対しピーク値の光エネルギ強度値を呈するピクセルを単位映像体８０の中心部と特定し、隣接する二つの単位映像体８０の中心部間の中央をその二つの間に存在する単位映像体８０の矩形境界（図３では符号Bで示す）と仮定し、単位映像体８０の形態を判定する所定のクライテリアによって、画像データフレーム４２上の座標系で、各々の単位映像体８０を例えばx1〜x3番目、y1〜y3番目の９個のピクセルに対応するものと、
{I（x1,y1）,I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1),I(x3,y2),I(x3,y3)}のピクセル要素を構成要素として持つものと単位映像体識別部８１において判定される。半導体サブストレート３上に相対的に例えば格子状に（Ｉ，Ｊ）マトリックスに配列配置されているマイクロLED２（Ｉ，Ｊ）に対応させて前記ピクセルマップ４３上にマッピングするマイクロLEDマッピング４４のデータを生成するようにマイクロLED識別部９０は構成されている。結局、（Ｉ，Ｊ）番目のマイクロLED２は、単位映像体８０（Ｉ，Ｊ）に対応し、ピクセル値（I（x1,y1）,I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1),I(x3,y2),I(x3,y3)から構成される。The digital image processing device 40 includes a micro LED identification unit 90, and the individual micro LEDs 2 arranged in an array on the semiconductor substrate 3 are identified by using the unit image body 80 as a clue. The micro LEDs 2 arranged relatively, for example, in a grid pattern on the semiconductor substrate 3, have pixels that exhibit a peak optical energy intensity value with respect to the surroundings on a predetermined criterion, for example, an image frame 42, as a unit image body 80. The center between the centers of two adjacent unit image bodies 80 is assumed to be the rectangular boundary of the unit image body 80 existing between the two (indicated by reference numeral B in FIG. 3), and the unit is According to a predetermined criterion for determining the form of the image body 80, in the coordinate system on the image data frame 42, each unit image body 80 corresponds to, for example, 9 pixels of x1 to x3 and y1 to y3. ,
(I (x1,y1),I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1), The unit video image identifying unit 81 determines that the pixel element of I(x3,y2), I(x3,y3)} is included as a constituent element. Data of micro LED mapping 44 to be mapped on the pixel map 43 corresponding to micro LEDs 2 (I, J) arranged in a matrix (I, J) relatively in a grid pattern on the semiconductor substrate 3. The micro LED identification unit 90 is configured to generate After all, the (I, J) th micro LED 2 corresponds to the unit image body 80 (I, J), and the pixel values (I (x1, y1), I (x1, y2), I (x1, y3), It is composed of I (x2, y1), I (x2, y2), I (x2, y3), I (x3, y1), I (x3, y2), I (x3, y3).
　デジタル画像処理装置４０には、個々のマイクロLED２の光強度を算出する演算ロジックとして所定の光エネルギ強度算出式が動作するように構成されており、例えば、光強度ピクセルマップ４５上で単位映像体８０に対応するマイクロLED２に対応する画像フレーム４２上のピクセルの段階的光強度の総和、上記の例では，
Σ｛（x1,y1）,I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1),I(x3,y2),I(x3,y3)｝
を光強度として採用してもよい。このように決定された単位映像体８０に対応する各々のマイクロLED２の光エネルギ強度は、制御装置７０からの制御信号を受け入れてフィルタ駆動機構６０によって光学フィルター５０無の配置において測定された光エネルギ強度値として、メモリ４１に格納されるようにデジタル画像処理装置４０は構成されている。The digital image processing device 40 is configured to operate a predetermined optical energy intensity calculation formula as an arithmetic logic for calculating the light intensity of each micro LED 2. For example, a unit image body is displayed on the light intensity pixel map 45. The sum of the graded light intensity of the pixels on the image frame 42 corresponding to the micro LED 2 corresponding to 80, in the above example,
Σ{(x1,y1),I(x1,y2),I(x1,y3),I(x2,y1),I(x2,y2),I(x2,y3),I(x3,y1), I(x3,y2),I(x3,y3)}
May be adopted as the light intensity. The light energy intensity of each micro LED 2 corresponding to the unit image body 80 determined in this way is the light energy measured by the filter drive mechanism 60 in the arrangement without the optical filter 50 by accepting the control signal from the control device 70. The digital image processing device 40 is configured so as to be stored in the memory 41 as the intensity value.
　同様に、単位映像体８０に対応する各々のマイクロLED２の光エネルギ強度は、フィルタ駆動機構６０によって光学フィルター５０有りの配置に変更された後においても測定され、同一の単位映像体８０に対応するマイクロLED２のの光エネルギ強度値は、光学フィルター５０有の配置における前記マイクロLED２の前記光エネルギ強度値としても測定されるようにデジタル画像処理装置４０は構成されている。Similarly, the light energy intensity of each micro LED 2 corresponding to the unit image body 80 is measured even after being changed to the arrangement with the optical filter 50 by the filter driving mechanism 60, and corresponds to the same unit image body 80. The digital image processing device 40 is configured so that the light energy intensity value of the micro LED 2 is also measured as the light energy intensity value of the micro LED 2 in the arrangement with the optical filter 50.
　デジタル画像処理装置４０には、マイクロLED検査部１００が構成されており、マイクロLED検査部１００に構成されるモジュールは演算ロジックとして所定のマイクロLED２の発光波長算出式が動作するように構成され、例えば、予め構成されメモリ４１上に保持されたルックアップテーブル１０９において、引数を指定すればこれによって当該ルックアップテーブル１０９を検索し、引数に対応する目的データ値であるマイクロLED２の発光波長を参照可能にルックアップテーブル１０９が構成されている。前記引数は、例えば、前記光学フィルター５０無の配置における前記光エネルギ強度値と前記光学フィルター５０有の配置における前記光エネルギ強度値との関係を表現されたものであれば、例えば、一実施形態では、光学フィルター５０有り／無しの光エネルギ強度値比であってもよく、その場合には、ルックアップテーブル１０９は光学フィルター５０無の配置における前記光エネルギ強度値と前記光学フィルター５０有の配置における前記光エネルギ強度値との比と、発光波長との関係を配列データとして作成されたものであるとよい。A micro LED inspection unit 100 is configured in the digital image processing device 40, and a module configured in the micro LED inspection unit 100 is configured to operate a predetermined emission wavelength calculation formula of the micro LED 2 as an arithmetic logic. For example, in the look-up table 109 that is pre-configured and stored in the memory 41, if an argument is specified, the look-up table 109 is searched by this, and the emission wavelength of the micro LED 2 that is the target data value corresponding to the argument is referred to. The lookup table 109 is configured as possible. If the argument is, for example, a relation between the light energy intensity value in the arrangement without the optical filter 50 and the light energy intensity value in the arrangement with the optical filter 50, for example, one embodiment Then, the optical energy intensity value ratio with / without the optical filter 50 may be used. In that case, the lookup table 109 has the optical energy intensity value in the arrangement without the optical filter 50 and the arrangement with the optical filter 50. It is preferable that the relationship between the ratio to the light energy intensity value in the above and the emission wavelength is created as array data.
　ルックアップテーブル１０９は、既知の光波長の光源によって、フィルタ特性がキャリブレーションされた光学フィルターを用いて、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係に関して前記キャリブレーションをもとに作成されたルックアップテーブル１０９が好適である。The look-up table 109 uses an optical filter whose filter characteristics are calibrated by a light source having a known light wavelength, and uses the optical energy intensity value in the arrangement without the optical filter and the optical energy in the arrangement with the optical filter. The look-up table 109 created based on the calibration is preferable for the relationship between the ratio of the intensity and the emission wavelength.
　さらに、追加の変形実施形態では、マイクロLED２の発光波長算出式は、光エネルギ強度比測定値に対応する発光波長が参照されたときに中間値については、その中間値を跨ぐ直近の二つの引数が与える二つの参照波長を按分補間によって調整し発光波長が決定されるようにルックアップテーブル１０９が構成されていてもよい。按分による補完は線形補完でも、二次回帰線による近似補完でも、適当な直線又はカーブにフィットするものであればよい。Further, in an additional modified embodiment, the formula for calculating the emission wavelength of the micro LED 2 is such that, when the emission wavelength corresponding to the measured value of the light energy intensity ratio is referred to, for the intermediate value, the two most recent arguments across the intermediate value are used. The look-up table 109 may be configured so that the two reference wavelengths given by can be adjusted by proportional division interpolation to determine the emission wavelength. The proportional complementation may be linear complementation or approximated complementation using a quadratic regression line, as long as it fits an appropriate straight line or curve.
［第１実施形態の作用効果］
　以上の構成の一実施形態に係る本発明の作用効果を図３に示される本発明の一実施形態の概観模式図を参照しながら説明する。[Operation and effect of the first embodiment]
The operation and effect of the present invention according to one embodiment of the above configuration will be described with reference to an overview schematic diagram of one embodiment of the present invention shown in FIG.
　図３に示されるマイクロLED発光検査装置１のステージ４上に搭載固定された半導体サブストレート３上には、マイクロLED２がアレイ状に形成されている（以下、本実施形態でマイクロLEDアレイ２ともいう）。マイクロLED２はマイクロLED製造行程中にマイクロLEDが発光可能な段階まで製造が進展した後に、マイクロLEDの光強度、発光波長等のLEDとしての性能を測定するために実施する。 Micro LEDs 2 are formed in an array on a semiconductor substrate 3 mounted and fixed on a stage 4 of the micro LED light emission inspection apparatus 1 shown in FIG. 3 (hereinafter, in the present embodiment, the micro LED array 2 is also referred to as “micro LED array 2”). Say). The micro LED 2 is carried out to measure the performance as an LED such as the light intensity and the emission wavelength of the micro LED after the production progresses to the stage where the micro LED can emit light during the micro LED manufacturing process.
　マイクロＬＥＤ２が使用される表示装置製品（図示しない）においては、表示装置の画面パネルが半導体サブストレート３よりも大きな場合が多々あること、ＬＥＤの利用効率が勘案されて半導体サブストレート３上のマイクロＬＥＤチップは一旦半導体サブストレート３から個々に切り出され、その後、表示装置製本の組み立て時に接合される。このような表示装置に組み込まれるマイクロＬＥＤ２であれば、そのマイクロＬＥＤ２は、一旦から切り出された後に隣接するマイクロLEDチップは、別の半導体サブストレート３から切り出されたものであったり、同一半導体サブストレート３から切り出されたものであっても隣接しない離隔した部位から切り出されたものであるなど、製造プロセス条件の異なるチップが混在して表示装置（図示しない）製品に組立てられることとなる。In a display device product (not shown) in which the micro LED 2 is used, the screen panel of the display device is often larger than the semiconductor substrate 3, and the utilization efficiency of the LED is taken into consideration in the micro device on the semiconductor substrate 3. The LED chips are once individually cut out from the semiconductor substrate 3 and then joined at the time of assembling the display device binding. In the case of the micro LED 2 incorporated in such a display device, the micro LED 2 is cut out from once and then the adjacent micro LED chip is cut out from another semiconductor substrate 3 or the same semiconductor substrate 3 is cut out. Chips having different manufacturing process conditions such as those cut from the straight 3 but also cut from non-adjacent, separated parts are assembled into a display device (not shown) product.
　本実施形態のマイクロLED発光検査装置１は、個別に分離されるべきマイクロLED２がアレイ状に配列されて表面に形成されて半導体サブストレート３上に製造されたマイクロLED２について、所定の性能範囲に収まるものを表示装置に組み上げる際、隣接配置することを可能とするため、マイクロLED２の光強度、発光波長等のLEDとしての性能を測定する。この場合において、本実施形態のマイクロLED発光検査装置１はデジタル画像処理装置４０によって高速にマイクロLED２の光強度、発光波長等のLEDとしての性能を測定することを可能とする。以下、詳細に説明する。The micro LED light emission inspection device 1 of the present embodiment has a predetermined performance range with respect to the micro LED 2 manufactured on the semiconductor substrate 3 in which the micro LEDs 2 to be individually separated are arranged in an array and are formed on the surface. When assembling what fits into a display device, it is possible to place them next to each other, so the performance of the micro LED 2 such as light intensity and emission wavelength is measured. In this case, the micro LED light emission inspection device 1 of the present embodiment enables the digital image processing device 40 to measure the light intensity, the light emission wavelength, etc. of the micro LED 2 at high speed. The details will be described below.
　図３に示されるマイクロLED発光検査装置１はステージ４上に搭載固定された半導体サブストレート３上のマイクロLED２は、給電機構１０によって発光させられると、その発光は撮像装置３０に配設されているイメージセンサ３１において映像信号を生成し、制御ラインを介して、デジタル画像処理装置４０に取り込まれる。この場合において、撮像装置３０とマイクロLED２との間の光路上に配設可能である光学フィルタ５０をRGBの各色別の透過光の映像信号を選択配信するものを選択することによって、各色別のマイクロLED２の光強度、発光波長等のLEDとしての性能を測定することを可能とする。例えば、赤色の発光性能を測定するとき、光学フィルタ５０は、設計条件に相当する波長６３０nmを中心に、波長範囲６１０nmから６５０nmまでを測定できるように設計されている色波長６１０nmから６５０nmの光波長帯域の透過フィルタである。一実施例の透過フィルタは基板となるガラス材料に光吸収材を混ぜる色吸収型フィルタである。In the micro LED light emission inspection device 1 shown in FIG. 3, when the micro LED 2 on the semiconductor substrate 3 mounted and fixed on the stage 4 is made to emit light by the power feeding mechanism 10, the light emission is arranged in the imaging device 30. A video signal is generated in the existing image sensor 31, and is taken into the digital image processing apparatus 40 via the control line. In this case, by selecting an optical filter 50 that can be arranged on the optical path between the image pickup device 30 and the micro LED 2 to selectively distribute the video signal of the transmitted light of each color of RGB, each color of each color can be selected. It is possible to measure the performance of the micro LED2 as an LED such as the light intensity and the emission wavelength. For example, when measuring the red light emission performance, the optical filter 50 is designed to measure a wavelength range of 610 nm to 650 nm with a wavelength range of 610 nm to 650 nm centered around the wavelength of 630 nm corresponding to the design condition. It is a band pass filter. The transmission filter of one embodiment is a color absorption filter in which a glass material serving as a substrate is mixed with a light absorbing material.
　光学フィルタ５０はフィルタ駆動機構６０によって、光路に出し入れ可能でり、最初の光強度、発光波長測定では、制御装置７０の制御部７１からの制御信号によって、フィルタ駆動機構６０が制御されて光学フィルタ５０無しの状態でマイクロLED２の発光を測定する。The optical filter 50 can be moved in and out of the optical path by the filter driving mechanism 60, and in the first measurement of the light intensity and the emission wavelength, the filter driving mechanism 60 is controlled by the control signal from the control unit 71 of the control device 70. The light emission of the micro LED 2 is measured without 50.
　図３に示されるマイクロLED発光検査装置１のマイクロLED２の光強度測定、及び発光波長測定は、以下に記載の通りである。The light intensity measurement and the emission wavelength measurement of the micro LED 2 of the micro LED emission inspection device 1 shown in FIG. 3 are as described below.
　映像信号がデジタル画像処理装置４０に取り込まれると、デジタル画像処理装置４０は画像データフレーム４２単位に、所謂画面単位に画像データフレーム４２の光強度を二次元画面データフレーム配列に対応させる部位に応じ、画面のピクセル毎に光強度値はデジタル画像処理装置４０に備えられたメモリ機構４１に格納される。画面の二次元マップに応ずるものとして、これを全体として光強度値を表示する目的に適するマップデータとしての光強度ピクセルマップ４５、画像データフレーム４２上での座標系を表すものとしては単にピクセルマップ４３と本明細書で呼称する。When the video signal is taken into the digital image processing device 40, the digital image processing device 40 corresponds to the part in which the light intensity of the image data frame 42 corresponds to the two-dimensional screen data frame arrangement in units of image data frames 42, so-called screen units. The light intensity value for each pixel of the screen is stored in the memory mechanism 41 provided in the digital image processing device 40. The light intensity pixel map 45 as map data suitable for the purpose of displaying the light intensity value as a whole as corresponding to the two-dimensional map of the screen, and the pixel map simply as representing the coordinate system on the image data frame 42. 43 herein.
　光強度ピクセルマップ４５は映像信号がデジタル画像処理装置４０に取り込まれるとビデオ映像レコーダにように自動的に生成される。The light intensity pixel map 45 is automatically generated like a video image recorder when the image signal is taken into the digital image processing device 40.
　一方、デジタル画像処理装置４０に取り込まれた光強度ピクセルマップ４５は、そのままでは半導体サブストレート３上の個々のマイクロLED２とは対応づけられてはいない。ウェハ上にドットピッチ０．１ｍｍ以下で多数形成されるマイクロLED２は、例えば、６インチの半導体サブストレート３上には１５０万個余り形成されており、１５０万個のマイクロLED２を瞬時に特定する必要がある。勿論、必ずしも二次元画面データフレーム配列の１ピクセルが１マイクロLEDに対応しているわけでなく、１つのマイクロLED２に対して複数のピクセルが対応させるのがよい。On the other hand, the light intensity pixel map 45 taken into the digital image processing device 40 is not directly associated with each micro LED 2 on the semiconductor substrate 3. For example, more than 1.5 million micro LEDs 2 are formed on the 6-inch semiconductor substrate 3 on the wafer with a dot pitch of 0.1 mm or less, and 1.5 million micro LEDs 2 can be instantly specified. There is a need. Of course, one pixel of the two-dimensional screen data frame array does not necessarily correspond to one micro LED, and it is preferable that a plurality of pixels correspond to one micro LED 2.
　一実施形態に係るマイクロLED発光検査装置１では、画像データフレーム４２上に、ほぼ同一の形態の発光体が画像上で認識可能であろうという予測に基づき、マイクロLEDの映像単位体８１という概念上のオブジェクトを導入する。このような概念は、特に、ウェハ上にドットピッチ０．１ｍｍ以下で同一の繰り返し単位で形成されたマイクロLEDの多数、同時計測に好適である。In the micro LED light emission inspection device 1 according to the embodiment, the concept of the micro LED image unit 81 is based on the prediction that the light emitters of almost the same form will be recognizable in the image on the image data frame 42. Introduce the above object. Such a concept is particularly suitable for simultaneous measurement of a large number of micro LEDs formed on the wafer in the same repeating unit with a dot pitch of 0.1 mm or less.
　マイクロLED発光検査装置１ではこのマイクロLEDの映像単位体８１は、所定のクライテリアに基づき光強度ピクセルマップ４５の光強度及び各ピクセルのジオメトリ情報から特定されるものとされる。例えば、一実施形態では以下のように特定される。所定のクライテリアは周囲に対しピーク光エネルギ強度値を呈するピクセルを単位映像体８０の一つ一つの中心部と特定し、ある単位映像体８０を選んだとき、その隣接する単位映像体８０のそれぞれの中心部間の中央を隣接する単位映像体８０との矩形境界とする。マイクロLED発光検査装置外から提供される設計情報によればその間隔は例えば、ドットピッチ０．１ｍｍに対応するはずのものであり、公差を勘案してもよい。このような所定のクライテリアに基づく単位映像体８０の特定手段によって、高速にマイクロLEDの映像単位体８１が特定され、着目されたマイクロLEDの占有すべき領域が、より素早く特定されるという効果を与える。このように、マイクロLEDの映像単位体８１概念の導入と、画面フレーム情報から映像単位体８１の特定に適する所定のクライテリアは、特に１５０万個以上の測定対象を一括で処理する必要のある、１００μm角以下の大きさの矩形領域内を占めるマイクロLED２がアレイ状に配列されて表面に形成された半導体サブストレート単位の検査に用いるに好適なマイクロLED発光検査装置の提供に貢献する。In the micro LED emission inspection device 1, the image unit 81 of the micro LED is specified from the light intensity of the light intensity pixel map 45 and the geometry information of each pixel based on a predetermined criterion. For example, in one embodiment, it is specified as follows. The predetermined criteria specifies pixels having a peak light energy intensity value with respect to the surroundings as each central portion of the unit image body 80, and when a certain unit image body 80 is selected, each of the adjacent unit image bodies 80 is selected. The center between the centers of the above is defined as a rectangular boundary with the adjacent unit image body 80. According to the design information provided from outside the micro LED light emission inspection device, the interval should correspond to the dot pitch of 0.1 mm, for example, and the tolerance may be taken into consideration. By the specifying means of the unit image body 80 based on such predetermined criteria, the image unit 81 of the micro LED can be identified at high speed, and the area to be occupied by the focused micro LED can be identified more quickly. give. As described above, the introduction of the concept of the image unit 81 of the micro LED and the predetermined criteria suitable for identifying the image unit 81 from the screen frame information require that more than 1.5 million measurement targets be collectively processed. It contributes to the provision of a micro LED light emission inspection apparatus suitable for inspection of semiconductor substrate units formed on the surface by arranging micro LEDs 2 occupying a rectangular region having a size of 100 μm square or less in an array.
　上記のように、画像データフレーム４２内で発光体の一つ一つの単位映像体８０が特定され、全体として画像データフレーム４２内で観察されるべきすべてのマイクロLED２が画像データフレーム４２内のピクセルに対応付けされるとき、マイクロLED２へのピクセルマップ４３、すなわちマイクロLEDマップ４４が生成されたと本発明概念は定義する。このような概念によって本来は一つ一つの個性がある半導体サブストレート３上の個々のマイクロLED２をマイクロLEDマップ４４として包括概念化し、一括処理に適する扱いを施すのを容易とする効果を与えるし、個々のマイクロLED２に対応するピクセル値をメモリ４１に格納するとき、より効率的なメモリ消費手段が提供可能とされる。As described above, each unit image object 80 of the light emitter is specified in the image data frame 42, and all the micro LEDs 2 to be observed in the image data frame 42 are the pixels in the image data frame 42. The concept of the present invention defines that a pixel map 43 for the micro LED 2, that is, a micro LED map 44, has been generated when it is mapped to. With such a concept, each micro LED 2 on the semiconductor substrate 3 which originally has its own individuality is comprehensively conceptualized as a micro LED map 44, which has an effect of facilitating the treatment suitable for batch processing. When storing the pixel value corresponding to each micro LED 2 in the memory 41, a more efficient memory consumption means can be provided.
　本発明に係るマイクロLED発光検査装置１の一実施形態は、上記特定された矩形領域に対応する光強度ピクセルマップ４５上のピクセルは当該マイクロLEDに属するものとして、そのピクセルが提供する光強度を元に当該マイクロLEDが発する光エネルギ強度を所定の光エネルギ強度算出式によって算出することを特徴とする。例えば、より詳細には、所定の光エネルギ強度算出式は、前記光強度ピクセルマップ４５上で特定の一つのマイクロLEDに含まれるピクセルの段階的光強度の総和である。ここで段階的強度とは、所定のコントラスによって、光強度がデジタル的に階段状の値として評価された光強度数値のことであり、その階段状は線形的な階段状であってもよいし、ベータ関数的に部分が急勾配であってもよく、領域内の観察点は必ずしも等しく貢献評価されなくても、例えば、中心部の数値が重み付けされてもよいが、このようにマイクロLEDに含まれるピクセルの段階的光強度の総和をとりマイクロLEDに関連するすべてのピクセルで観察される光強度を利用すると、一つ一つのピクセルの測定に伴う擾乱を平滑化できる利点があり、さらにこの評価手段は、仮に隣のマイクロLEDからの発光が混在するものとしても、当該マイクロLEDからの発光が隣のマイクロLEDのものとみなされることの相殺効果も提供し、全体としてより正確な一つ一つのマイクロLEDの発光性能の評価に役立つという優れた効果を与える。In one embodiment of the micro LED light emission inspection device 1 according to the present invention, a pixel on the light intensity pixel map 45 corresponding to the specified rectangular area is regarded as belonging to the micro LED, and the light intensity provided by the pixel is determined. It is characterized in that the light energy intensity emitted from the micro LED is calculated by a predetermined light energy intensity calculation formula. For example, in more detail, the predetermined light energy intensity calculation formula is a sum of stepwise light intensities of pixels included in one specific micro LED on the light intensity pixel map 45. Here, the gradual intensity is a numerical value of the light intensity in which the light intensity is digitally evaluated as a stepwise value by a predetermined contrast, and the stepwise shape may be a linear stepwise shape. , The part may be steep in beta function, and the observation points in the area may not necessarily be evaluated as contributing equally, for example, the numerical value in the central part may be weighted, but in this way, the micro LED Taking the sum of the stepwise light intensities of the included pixels and using the light intensities observed in all the pixels associated with the micro LED has the advantage of smoothing out the disturbances associated with measuring each and every pixel. Even if the light emission from the adjacent micro LED is mixed, the evaluation means also provides the offsetting effect that the light emission from the micro LED is regarded as that of the adjacent micro LED, and as a whole, it is more accurate. It has an excellent effect of being useful for evaluating the light emitting performance of one micro LED.
　マイクロLEDの発光性能が上記のように、各ピクセルマップ４３が与える光強度の関数によって提供されるとしても、直接的には、マイクロLEDの発光波長を決定することにはならない。そこで従来は、スペクトロメータが個々のマイクロLEDの発光波長測定に用いられていた。スペクトロメータを用いる従来の発行波長測定方式では、仮にリニアセンサが用いられるとしても、なお、１００００秒という膨大な時間が必要となる場合があることは、本願明細書の背景技術に記載したとおりである。Even if the light emission performance of the micro LED is provided by the function of the light intensity given by each pixel map 43 as described above, it does not directly determine the light emission wavelength of the micro LED. Therefore, conventionally, a spectrometer has been used to measure the emission wavelength of each micro LED. As described in the background art of the present specification, in the conventional emission wavelength measurement method using a spectrometer, even if a linear sensor is used, a huge time of 10,000 seconds may still be required. is there.
　本発明に係るマイクロLED発光検査装置１の一実施形態は、光学フィルター５０を設計条件に相当する色波長を含む所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルターとされるように特徴づけられている。所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルタの例は、図３の光学フィルタ５０に隣接するグラフを表現する光学フィルタ５０である。このグラフの横軸は光波長であり、縦軸は光フィルタ５０無しの場合、光フィルタ５０有りの場合の光強度の比である。このような光フィルタ５０によって、マイクロLEDの発光波長の決定にスペクトロメータを不要とし、各ピクセルマップ４３が与える光強度の光フィルタ５０無しの場合、光フィルタ５０有りの場合（以下で、「光フィルタ有り／光フィルタ無し」、又は「光フィルタ有り／無し」、と記載する）の二通りの光強度の測定のみによって、マイクロLEDの発光波長の決定を可能とする。これによって、光フィルタ有り／無し配置の切り替えに時間を要するとしても、例えば、１５０万個の測定対象の光フィルタ無し／有りの測定はデジタル画像処理装置によって一括処理も可能とし、１５０万個の１パスのラインセンサ又はCCDセンサによるデジタル画像処理装置メモリへの映像信号取り込みは高々５０秒もあれば十分であるから、１５０万個の二回の一括データ処理自体は１００秒もあれば可能で有り、上記程度の光強度評価は瞬時に完了し得て、ここで仮に光フィルタ無し／有り配置の切り替えに３０秒要するとしても、結局、１５０万個処理には１５０秒もかからない。したがって、従来技術では１５００秒は要するところを桁違いの高速処理を実現可能とする顕著な効果を本発明のマイクロLED発光検査装置１は提供する。In one embodiment of the micro LED light emission inspection device 1 according to the present invention, the optical filter 50 is an optical filter whose filter transmitted light intensity monotonically increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition. Is characterized as. An example of an optical filter in which the light intensity transmitted through the filter monotonically increases or decreases in a predetermined light wavelength band is an optical filter 50 representing a graph adjacent to the optical filter 50 in FIG. The horizontal axis of this graph is the light wavelength, and the vertical axis is the ratio of the light intensity when the optical filter 50 is not present and when the optical filter 50 is present. With such an optical filter 50, a spectrometer is not required for determining the emission wavelength of the micro LED, without the optical filter 50 of the light intensity given by each pixel map 43, with the optical filter 50 (hereinafter, "optical It is possible to determine the emission wavelength of the micro LED only by measuring the light intensity in two ways (with filter/without optical filter) or with/without optical filter). As a result, even if it takes time to switch the arrangement with/without the optical filter, for example, it is possible to collectively process 1.5 million measurement targets without/with the optical filter by the digital image processing device, and It is sufficient for the video signal to be taken into the memory of the digital image processing device by the one-pass line sensor or CCD sensor for at most 50 seconds, so that the batch data processing of 1.5 million pieces twice can be performed for 100 seconds. Yes, the light intensity evaluation to the above degree can be completed instantly, and even if it takes 30 seconds to switch between the absence/presence of the optical filter, the processing of 1.5 million pieces does not take 150 seconds. Therefore, the micro LED light emission inspection device 1 of the present invention provides a remarkable effect that can realize an order of magnitude higher speed processing than the conventional technology requires 1500 seconds.
　以下、設計条件に相当する色波長を含む所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルター５０を用いる手段は、光フィルタ５０無し／光フィルタ５０有りの二通りの光強度の測定のみによって、マイクロLEDの発光波長の決定することを説明する。Hereinafter, means for using the optical filter 50 in which the filter transmitted light intensity monotonously increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to the design condition, is a method of using two types of light: no optical filter 50/with optical filter 50. It will be described that the emission wavelength of the micro LED is determined only by measuring the intensity.
　図４には、先の例とは異なり、フィルタ透過光強度が単調増加する光学フィルター５０を用いる場合を示す。図４に示される６０５ｎｍから６５５ｎｍにかけての所定の光波長帯域でフィルタ透過光強度が図４に示されるカーブで光波長帯域で６５５ｎｍで透明状態の光強度比１．０，そして６０５ｎｍで遮光状態の光強度比０のように示されるカーブで単調増加する特性を持つ光フィルタ５０の場合において、光フィルタ有り／光フィルタ無しの二通りの光強度比の測定が図４に示される通り０．８３のとき、図４に示されるカーブで縦軸０．８３に対応するのは波長６４０ｎｍが中央波長値であることがわかる。したがって、光フィルタ５０無し／光フィルタ５０有りの二通りの光強度の測定のみによって当該マイクロLED２の発光波長は６４０ｎｍと決定できた。そして、このように決定された発光波長は、隣接するマイクロLED間について移動平均によって前記光波長の平滑処理がなされてもよい。平滑処理によってノイズの影響が緩和される利点がある。Different from the previous example, FIG. 4 shows a case where an optical filter 50 whose filter transmitted light intensity monotonically increases is used. In the curve shown in FIG. 4, the filter transmitted light intensity in the predetermined light wavelength band from 605 nm to 655 nm shown in FIG. 4 is 655 nm in the light wavelength band, and the transparent light intensity ratio is 1.0. In the case of the optical filter 50 having the characteristic of increasing monotonically with the curve shown as the light intensity ratio 0, two types of measurement of the light intensity ratio with and without the optical filter are 0.83 as shown in FIG. At this time, it can be seen that the curve corresponding to the vertical axis of 0.83 in the curve shown in FIG. Therefore, the emission wavelength of the micro LED 2 could be determined to be 640 nm only by measuring the two types of light intensities with and without the optical filter 50. Then, the emission wavelength determined in this way may be smoothed by moving average between adjacent micro LEDs. The smoothing process has an advantage of reducing the influence of noise.
　このように、予め様々な発光波長を用いて、光フィルタ有り／光フィルタ無しの二通りの光強度の測定比を図４に示されるような単調増加するカーブで発光波長と関連づけられていれば、光フィルタ有り／光フィルタ無しの二通りの光強度の測定比から当該関連付けによって、発光波長は一意に決定可能とされることを本発明者は創案した。ここで、図４は単調増加するカーブで発光波長と関連づけられているが、単調増加でなく、単調減少するカーブで、発光波長と光フィルタ有り／光フィルタ無しの二通りの光強度の測定比とが関連づけられていてもよい。In this way, if various emission wavelengths are used in advance and the measurement ratios of the two types of light intensity with and without the optical filter are associated with the emission wavelength by a monotonically increasing curve as shown in FIG. The present inventor has invented that the emission wavelength can be uniquely determined by the association based on the two measurement ratios of the light intensity with/without the optical filter. Here, although FIG. 4 is associated with the emission wavelength by a monotonically increasing curve, it is not a monotonically increasing curve but a monotonically decreasing curve, and the emission wavelength and the measurement ratio of two types of light intensity with and without an optical filter are shown. May be associated with.
　上記のように構成された本発明に係るマイクロLED発光検査装置１は、変形実施形態の機能構成図５に示されるように、制御装置７０は、さらにマイクロLED発光検査装置１の構成要素を制御するための制御フロー管理に使用されるCPU８6、メモリ８７を備える。制御部７１は送信部７２と伝送路８８を介してフィルタ駆動装置へ制御信号を送信可能である。制御装置７０とデジタル画像処理装置との間には通信路８９が備わり、送信部７２を介して双方向通信可能に構成されている。このようにデジタル画像処理装置４０及びフィルタ駆動装置６０と一体制御可能に構成された制御装置７０によって、マイクロLED発光検査装置１の自動運転を可能とするように構成される。一実施形態の構成と動作を制御フローのフローチャートＳ０を構成要素を跨って描かれた模式図６を参照しながら説明する。
＜マイクロLED点灯ステップＳ１＞
　マイクロLED発光検査装置１の制御装置７０の制御部７１の処理の開始とともに、制御は、マイクロLED点灯ステップに移り、給電機構３０によってマイクロLEDが点灯されるように制御部７１は構成されている。マイクロLED点灯ステップが制御部７１の処理の開始とともに実行されると、制御は引き続いて、制御部７１内に構成されているフィルタ移動指示ステップの構成モジュールが起動される。
＜第１のフィルタ移動指示ステップＳ２＞
　引続き最初のフィルタ移動指示ステップへ制御が渡され、このステップでは光フィルタ５０が光路２１に存在しないステータスを選択する信号が制御部７１によって生成される。さらに伝送路８８を介して信号はフィルタ駆動機構６０へ送信され、その後制御部７１は直ちに最初の撮像の開始指示通知待ちとなるようにモジュール構成され、このまま、当該モジュール処理は、最初の撮像の開始指示通知待ち状態に遷移する。
＜第１のフィルタ移動ステップＳ３＞
　フィルタ駆動機構６０はフィルタ駆動機構６０と制御装置７０の間の伝送路８８を介して光フィルタ５０が光路２１に存在しないステータスを選択するための信号を受入れると、光学フィルタ５０を光路２１から外す最初のフィルタ移動ステップを実行するように構成されている。
＜第１の撮像の開始指示ステップＳ４＞
　制御装置７０の制御部７１は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、直ちに制御部７１は第１の撮像の開始指示信号を生成する。最初の撮像の開始指示通知は、例えば、最初のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部７１が受信するように構成されてもよいが、その他、所定の時間が経過すれば最初の撮像の開始指示通知を生成するように、制御部７１内でタイマーを駆動するように構成されていてもよい。この場合には、所定の時間経過後にタイマーイベントが生成され最初の撮像の開始指示通知が制御部７１に通知される。制御部７１に制御が戻ると、制御部７１は通信路８９を介してデジタル画像処理装置４０へ第１の撮像の開始指示信号を送信した後に、第２のフィルタ移動指示待ちとなるように構成されている。第１の撮像の開始指示ステップを起動するモジュールの実行後、当該モジュールの処理は第２のフィルタ移動指示待ち状態へ遷移する。
＜第１の撮像ステップＳ５＞
　デジタル画像処理装置は、通信路８９を介して第１の撮像の開始指示信号を制御部７１から受信すると、撮像装置３０から映像信号を受け入れ、デジタル画像処理装置４０内に格納される画像データフレーム４２上のピクセルマップ４３へ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置内の前記メモリに格納するようにモジュール構成されており、当該モジュールの動作後には、引き続いて単位映像体識別部８１の処理に制御が渡る。
＜フィルタ無し光強度測定ステップＳ６＞
　引き続き、単位映像体識別部８１において、光強度ピクセルマップから発光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップ４３への単位映像体マッピングデータを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納するように、デジタル画像処理装置４０はモジュール構成されている。単位映像体識別部８１のモジュール処理に引き続いて、さらにマイクロLED識別部９０において、単位映像体８０から複数のアレイ状に配列されたマイクロLED２を特定し対応するマイクロLED２をピクセルマップ４３上にマッピングしマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。続いてマイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの光学フィルター無の配置における前記光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。フィルタ無し光強度を測定するモジュールが実行されると、引き続き、制御装置７０は、フィルタ無し光強度を測定する処理を実行制御されるように構成されている。
＜第２のフィルタ移動指示ステップＳ７＞
　第２のフィルタ移動指示待ちとなっていた制御部７１は、第２のフィルタ移動指示を受け入れると、当該指示に基づき光学フィルタ５０を光路２１に配設する信号を生成し、伝送路８８を介しフィルタ駆動機構６０へ当該信号を送信するようにモジュール構成されている。当該モジュール実行後には、当該モジュールは第２の撮像開始指示待ちとなるようにモジュール構成されており、制御部は、そのまま待ち状態となる。
＜第２のフィルタ移動ステップＳ８＞
　フィルタ駆動機構６０は伝送路８８を介して光学フィルタ５０を光路２１に配設する信号を制御部７１から受入れ、光学フィルタ５０を光路２１に配設するようにフィルタ駆動機構６０はモジュール構成されている。
＜第２の撮像の開始指示ステップＳ９＞
　制御部７１は、第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ち状態で第２の撮像の開始指示通知を受け入れると第２の撮像の開始指示信号を生成し、通信路８９を介してデジタル画像処理装置４０へ第２の撮像の開始指示信号を送信するようにモジュール構成されている。第２の撮像の開始指示通知について、例えば、第２のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部７１が受信するように構成されてもよいし、その他、所定の時間が経過すれば第２の撮像の開始指示通知を生成するように、制御部７１内でタイマーを駆動するように構成されていてもよい。当該モジュールが動作後に、制御部７１の処理はアイドルとなり、次のタスク待ちとなる。
＜第２の撮像ステップＳ１０＞
　デジタル画像処理装置４０は、通信路８９を介して第２の撮像の開始指示信号を受信すると、撮像装置３０から映像信号を受け入れ、画像データフレーム４２上のピクセルマップ４３へ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納するようにモジュール構成されており、このモジュール動作後には単位映像体識別部８１での処理に制御を渡す。
＜フィルタ有り光強度の測定ステップＳ１１＞
　デジタル画像処理装置４０内では、これに引き続き、単位映像体識別部８１において、光強度ピクセルマップから発光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップ４３への単位映像体マッピングデータを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納し、さらにマイクロLED識別部９０において、単位映像体８０から複数の前記アレイ状に配列されたマイクロLEDを特定し対応するマイクロLEDを前記ピクセルマップ４３上にマッピングし前記マイクロLEDマッピングデータ４４を生成し、これを前記メモリに格納するようにデジタル画像処理装置４０はモジュール構成されている。このモジュール処理の後に、マイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの光学フィルター５０有りの配置における光エネルギ強度値としてデジタル画像処理装置４０内のメモリ４１に格納するように、デジタル画像処理装置４０はモジュール構成されている。当該モジュール処理後に、制御は、デジタル画像処理装置４０内でマイクロLED検査部での処理に渡される。
＜フィルタ無し光強度とフィルタ有り光強度の比計算ステップＳ１２＞
　これに引き続き、マイクロLED検査部において、マイクロLEDの光学フィルター有りの配置における光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１から読み出し、当該マイクロLEDに対応する光学フィルター５０無しの配置における光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１から読み出し、光学フィルター５０有の配置における前記マイクロLEDの光エネルギ強度値と、光学フィルター５０無の配置の光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するようにデジタル画像処理装置４０はモジュール構成されている。
＜発光波長計算ステップＳ１３＞
　これに引き続き、前記マイクロLED検査部において、所定の前記マイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定するようにデジタル画像処理装置４０はモジュール構成されている。
＜発光波長データ出力ステップＳ１４＞
　以上の処理を終え、マイクロLED発光波長データが得られた後に、マイクロLED検査データ出力可能であるように構成され、外部接続路及びデータ出力部を備えたデジタル画像処理装置４０から発光波長データはデジタル画像処理装置４０内のメモリ４１を介して、データ出力部１２０から外部接続路に出力するようにデジタル画像処理装置４０はモジュール構成されている。外部接続路は、コンピュータへの直接の伝送路を介するのでもよいし、通信部１１０を介してLAN接続によるネットワーク７５を介して接続されたコンピュータ２００へ接続された永続的ストレージ７６へ格納されている外部へ出力されてもよい。永続的ストレージ７６へ格納された後、複数の発光波長とフィルタ無し光強度とフィルタ有り光強度の比との関係は、例えば、ルックアップテーブル１０９（図５には図示しない）に構成されてもよい。The micro LED light emission inspection device 1 according to the present invention configured as described above has a functional configuration of a modified embodiment. As shown in FIG. 5, the control device 70 further controls the components of the micro LED light emission inspection device 1. It is provided with a CPU 86 and a memory 87 used for control flow management. The control unit 71 can transmit a control signal to the filter drive device via the transmission unit 72 and the transmission line 88. A communication path 89 is provided between the control device 70 and the digital image processing device, and two-way communication is possible via the transmission unit 72. As described above, the control device 70 configured to integrally control the digital image processing device 40 and the filter driving device 60 is configured to enable the automatic operation of the micro LED light emission inspection device 1. The configuration and operation of one embodiment will be described with reference to a schematic diagram 6 in which a flowchart S0 of a control flow is drawn across the components.
<Micro LED lighting step S1>
With the start of the processing of the control unit 71 of the control device 70 of the micro LED light emission inspection device 1, the control moves to the micro LED lighting step, and the control unit 71 is configured so that the micro LED is turned on by the power feeding mechanism 30. .. When the micro LED lighting step is executed at the same time as the processing of the control unit 71 is started, the control continues, and the module module of the filter movement instruction step configured in the control unit 71 is activated.
<First filter movement instruction step S2>
Then, control is passed to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting the status in which the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control unit 71 is modularized so as to immediately wait for the notification instruction of the start instruction of the first imaging. Transition to the start instruction notification waiting state.
<First filter moving step S3>
When the filter drive mechanism 60 receives a signal for selecting a status in which the optical filter 50 does not exist in the optical path 21 via the transmission line 88 between the filter drive mechanism 60 and the control device 70, the filter drive mechanism 60 removes the optical filter 50 from the optical path 21. It is configured to perform the first filter move step.
<First imaging start instruction step S4>
When the control unit 71 of the control device 70 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit 71 immediately receives the first imaging start instruction notification. An imaging start instruction signal is generated. The notification of the start instruction of the first imaging may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 71 receives the status signal after the completion of the first filter moving step, for example. The timer may be configured to be driven in the control unit 71 so that the first imaging start instruction notification is generated when the time elapses. In this case, a timer event is generated after a lapse of a predetermined time, and the control unit 71 is notified of the start instruction notification of the first imaging. When control is returned to the control unit 71, the control unit 71 transmits a first image capture start instruction signal to the digital image processing apparatus 40 via the communication path 89, and then waits for the second filter movement instruction. Has been done. After the execution of the module that activates the first imaging start instruction step, the processing of the module transits to the second filter movement instruction waiting state.
<First imaging step S5>
When the digital image processing apparatus receives the first image capturing start instruction signal from the control unit 71 via the communication path 89, the digital image processing apparatus receives the video signal from the image capturing apparatus 30 and stores the image data frame stored in the digital image processing apparatus 40. And a pixel map 43 on 42 to generate a light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed, and the light intensity pixel map is stored in the memory in the digital image processing apparatus. After the operation of the module, control is subsequently transferred to the processing of the unit image body identification unit 81.
<Step S6 of measuring light intensity without filter>
Subsequently, the unit image body identification unit 81 identifies the unit image body 80 of light emission from the light intensity pixel map based on a predetermined criterion, further generates unit image body mapping data to the pixel map 43, and digitally processes this. The digital image processing device 40 is configured as a module so as to be stored in the memory 41 in the device 40. Following the module processing of the unit image body identification unit 81, the micro LED identification unit 90 further identifies the micro LEDs 2 arranged in a plurality of arrays from the unit image body 80 and maps the corresponding micro LEDs 2 on the pixel map 43. Then, the digital image processing device 40 is modularly configured to generate the micro LED mapping data 44 and store the micro LED mapping data 44 in the memory 41. Subsequently, the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the micro LED map, and the light energy intensity value in the arrangement without the optical filter of the micro LED is digitally imaged. The digital image processing device 40 is configured as a module so as to be stored in the memory 41 in the processing device 40. When the module for measuring the unfiltered light intensity is executed, the control device 70 is configured to be subsequently controlled to execute the process for measuring the unfiltered light intensity.
<Second filter movement instruction step S7>
When the control unit 71, which has been waiting for the second filter movement instruction, receives the second filter movement instruction, it generates a signal for disposing the optical filter 50 in the optical path 21 based on the instruction, and transmits the signal via the transmission path 88. The module is configured to transmit the signal to the filter drive mechanism 60. After execution of the module, the module is configured to wait for the second imaging start instruction, and the control unit remains in the waiting state.
<Second filter moving step S8>
The filter driving mechanism 60 receives a signal for arranging the optical filter 50 in the optical path 21 from the control unit 71 via the transmission path 88, and the filter driving mechanism 60 is modularly configured so as to arrange the optical filter 50 in the optical path 21. There is.
<Second imaging start instruction step S9>
When the control unit 71 accepts the second imaging start instruction notification in the second imaging start instruction waiting state which is the final process of the second filter movement instruction step, it generates a second imaging start instruction signal and communicates. The module is configured to transmit a second imaging start instruction signal to the digital image processing apparatus 40 via the path 89. Regarding the notification of the start instruction of the second imaging, for example, the filter driving mechanism 60 may transmit the status signal after the second filter moving step is completed, and the control unit 71 may receive the status signal. The timer may be configured to be driven in the control unit 71 so that the second imaging start instruction notification is generated when a predetermined time has elapsed. After the module operates, the processing of the control unit 71 becomes idle and waits for the next task.
<Second imaging step S10>
When the digital image processing apparatus 40 receives the second imaging start instruction signal via the communication path 89, the digital image processing apparatus 40 receives the video signal from the imaging apparatus 30 and measures each pixel in the pixel map 43 on the image data frame 42. The module is configured to generate a light intensity pixel map on which stepwise light intensities are superimposed and store this in the memory 41 in the digital image processing device 40. After the module operation, the unit image body identifying unit 81 Pass control to the processing of.
<Measurement step S11 of light intensity with filter>
In the digital image processing device 40, subsequently, in the unit image body identifying section 81, the unit image body 80 of the light emission is specified from the light intensity pixel map based on a predetermined criterion, and further, the unit image body mapping to the pixel map 43 is performed. Data is generated and stored in the memory 41 in the digital image processing device 40. Further, in the micro LED identification section 90, a plurality of micro LEDs arranged in the array is specified from the unit image body 80 and the corresponding micro LED is identified. The digital image processing device 40 is modularly configured to map LEDs on the pixel map 43 to generate the micro LED mapping data 44 and store the micro LED mapping data 44 in the memory. After this module processing, the light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and the light energy intensity in the arrangement with the optical filter 50 of the micro LED is determined. The digital image processing device 40 is modularly configured so as to be stored as a value in the memory 41 in the digital image processing device 40. After the module processing, the control is passed to the processing in the micro LED inspection unit in the digital image processing device 40.
<Step S12 of calculating ratio of light intensity without filter and light intensity with filter>
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory 41 in the digital image processing device 40, and the light in the arrangement without the optical filter 50 corresponding to the micro LED is read. The energy intensity value is read from the memory 41 in the digital image processing device 40, and the unfiltered light is obtained by the light energy intensity value of the micro LED in the arrangement with the optical filter 50 and the light energy intensity value in the arrangement without the optical filter 50. The digital image processing device 40 is modularly configured to calculate the ratio of the intensity and the filtered light intensity.
<Emission wavelength calculation step S13>
Subsequent to this, the digital image processing device 40 is modularly configured so that in the micro LED inspection unit, the emission wavelength of the micro LED is determined by a predetermined emission wavelength calculation formula of the micro LED.
<Emission wavelength data output step S14>
After the above processing is completed and the micro LED emission wavelength data is obtained, the micro LED inspection data is configured to be output, and the emission wavelength data is output from the digital image processing device 40 including the external connection path and the data output unit. The digital image processing device 40 is modularly configured to output from the data output unit 120 to the external connection path via the memory 41 in the digital image processing device 40. The external connection path may be via a direct transmission path to the computer, or may be stored in the permanent storage 76 connected to the computer 200 connected via the network 75 via the LAN connection via the communication unit 110. It may be output to the outside. After being stored in the persistent storage 76, the relationship between the plurality of emission wavelengths, the unfiltered light intensity and the filtered light intensity ratio may be configured, for example, in a lookup table 109 (not shown in FIG. 5). Good.
　本発明に係るマイクロLED発光検査装置１の一実施形態は、光フィルタ有り／光フィルタ無しの光強度と発光波長との関連付けを既知の光波長の光源（図示しない）によって、フィルタ特性がキャリブレーションされ、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における光エネルギ強度値の比と前記発光波長との関係に関してキャリブレーションをもとに作成された発光波長のルックアップテーブル１０９によって実現する。一実施例では、ルックアップテーブル１０９には図４ではカーブ上の黒丸点で示されている（光波長，光エネルギ強度値比）が格納されている。このようにして、本発明に係るマイクロLED発光検査装置１の一実施形態は、光フィルタ有り／光フィルタ無しの二通りの光強度の測定比を図４に示されるような単調増加するカーブ上の離散点で発光波長と離散的に関連づけ、光フィルタ有り／光フィルタ無しの二通りの光強度の測定値によって、発光波長は一意に決定可能とされ、光フィルタ無し／光フィルタ有りの二通りの光強度の測定のみによって、マイクロLEDの発光波長の決定を可能とし、例えば、１５０万個の測定対象の光フィルタ無し／有りの測定はデジタル画像処理装置によって一括処理も可能とする有利な効果を発揮する。ルックアップテーブル１０９には離散点（図４のカーブ上の黒丸参照）が格納されているから、例えば、光強度の測定比に最も近傍の強度の比に対応する発光波長を観察対象のマイクロLED発光波長としてもよい。In one embodiment of the micro LED light emission inspection device 1 according to the present invention, the filter characteristics are calibrated by a light source (not shown) having a known light wavelength for associating the light intensity with and without the light filter with the light emission wavelength. And a look-up of the emission wavelength created based on the calibration regarding the relationship between the ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter and the emission wavelength. It is realized by the table 109. In one embodiment, the lookup table 109 stores (light wavelength, light energy intensity value ratio) indicated by black dots on the curve in FIG. In this way, one embodiment of the micro LED light emission inspection device 1 according to the present invention has a monotonically increasing curve as shown in FIG. 4 in which the two measurement ratios of the light intensity with and without the optical filter are measured. Is discretely associated with the emission wavelength at discrete points, and the emission wavelength can be uniquely determined by the measurement values of the two types of light intensity with and without the optical filter. The advantageous effect that the emission wavelength of the micro LED can be determined only by measuring the light intensity of, and, for example, the measurement with or without the optical filter of 1.5 million measurement objects can be collectively processed by the digital image processing device. Exert. Since discrete points (see black circles on the curve in FIG. 4) are stored in the look-up table 109, for example, the emission wavelength corresponding to the intensity ratio closest to the measurement ratio of the light intensity is the micro LED to be observed. It may be the emission wavelength.
　本発明に係るマイクロLED発光検査装置１の一実施形態では、ルックアップテーブル１０９の登録値の中間値（図４のカーブ上の隣接する黒丸間の変域域とその間の値域の関係を参照のこと）が観察測定された場合、マイクロLEDの発光波長算出式は、光エネルギ強度比測定値を跨ぐ近傍の光エネルギ強度比登録値に対応する発光波長がルックアップテーブル１０９で参照され、光エネルギ強度比測定値の中間値について光エネルギ強度比測定値を跨ぐ二点の登録値を基礎に按分補間を加算して発光波長が決定されてもよい。この構成では、光エネルギ強度比測定値が登録されていなくても所望の推定精度で光エネルギ強度比測定値に対応する発光波長を可能とする効果を与える。この補完は、線形補完でも二次曲線補完でもカーブ形状と登録値の間隔の関係から好適に決定されてよい。In one embodiment of the micro LED light emission inspection device 1 according to the present invention, the intermediate value of the registered values of the look-up table 109 (refer to the relationship between the variable range between the adjacent black circles on the curve of FIG. 4 and the range thereof). When observed and measured, the emission wavelength calculation formula of the micro LED refers to the emission wavelength corresponding to the registered value of the optical energy intensity ratio in the vicinity of the measured value of the optical energy intensity ratio in the lookup table 109, and the optical energy is referred to. The emission wavelength may be determined by adding proportional division interpolation to the intermediate value of the intensity ratio measurement values based on the registered values of two points that cross the optical energy intensity ratio measurement values. With this configuration, even if the measured value of the light energy intensity ratio is not registered, it is possible to obtain the emission wavelength corresponding to the measured value of the light energy intensity ratio with desired estimation accuracy. This complementation may be suitably determined from the relationship between the curve shape and the registration value interval, whether linear complementation or quadratic curve complementation.
　さらに、変形実施形態では、ルックアップテーブル１０９は、図７の変形実施形態の物理構成図に示されるように、デジタル画像処理装置４０から永続的ストレッジ７４又は７６又は７９への接続インターフェースを介してフィルタ特性及びルックアップテーブル１０９をマスターデータとして永続的ストレッジから受入れてもよい。接続インターフェースはUSB７４でもよい、このばあいには、USB対応メモリデバイス７４に記録されたルックアップテーブル１０９がデジタル画像処理装置４０のメモリに読み込まれる。永続的ストレッジはLANに接続されたサーバに接続されたデバイス７６でもよく、この場合接続インターフェースは、有線LAN接続インターフェース７５でも無線LAN接続インターフェース（図示しない）でもよく、この場合には、ネットワークに接続された他のデバイス７６に保管されたルックアップテーブル１０９がデジタル画像処理装置４０のメモリに読み込まれる。ルックアップテーブル１０９の保管元はネットワークに接続されたクラウドコンピューティングサービス７７が提供するサーバデバイス７８に接続された永続的ストレッジデバイス７９に保管されているものでもよい。このように構成することで、複数のマイクロLED発光検査装置１を使用する場合に効率的な運用を可能とする利点が得られるし、キャリブレーションとプロダクションシステムでの利用を分離できる利点もある。さらに、バックアップサイトからのルックアップテーブル１０９の復旧も容易であり、可用性の向上に繋がる利点もある。Further, in the modified embodiment, the lookup table 109 is viewed from the digital image processing apparatus 40 via a connection interface to the permanent stress 74 or 76 or 79, as shown in the physical configuration diagram of the modified embodiment of FIG. The filter characteristics and look-up table 109 may be accepted as master data from persistent storage. The connection interface may be the USB 74. In this case, the look-up table 109 recorded in the USB compatible memory device 74 is read into the memory of the digital image processing apparatus 40. The persistent storage may be a device 76 connected to a server connected to a LAN, in which case the connection interface may be a wired LAN connection interface 75 or a wireless LAN connection interface (not shown), in this case connecting to a network. The lookup table 109 stored in the other device 76 is read into the memory of the digital image processing apparatus 40. The storage source of the lookup table 109 may be stored in a persistent storage device 79 connected to a server device 78 provided by a cloud computing service 77 connected to the network. With this configuration, there is an advantage that efficient operation is possible when using a plurality of micro LED light emission inspection devices 1, and there is an advantage that calibration and use in the production system can be separated. Furthermore, the lookup table 109 can be easily restored from the backup site, which has the advantage of improving availability.
　本発明に係るマイクロLED発光検査装置１の一実施形態における、ルックアップテーブル１０９への参照の仕組みをマイクロLED発光検査装置１の検査実施時の制御フローを説明するフローチャートＳ１００を構成要素を跨って描かれたフローチャート模式図８を用い説明する。図８は、図６の発光波長計算ステップ S13がルックアップテーブル参照方式の発光波長決定ステップ S15で代替された制御フローである。図８に示されるルックアップテーブル１０９への参照の実施形態では、前段落で記載のように、永続的ストレッジ７４又は７６又は７９への接続インターフェースを介してルックアップテーブル１０９をマスターデータとして永続的ストレッジから受入れてもよいし、接続インターフェースはUSB７４でもよく、USB対応メモリデバイス７４に記録されたルックアップテーブル１０９がデジタル画像処理装置４０のメモリ４１に読み込まれてもよい。図８の制御フローで代替されたルックアップテーブル参照方式の発光波長決定ステップ S15を以下に説明する。
＜ルックアップテーブル参照方式の発光波長決定ステップ S15＞
　フィルタ無し光強度とフィルタ有り光強度の比計算ステップＳ１２の実行後、実行処理フロー制御は、マイクロLED検査部１００へ渡される。デジタルデジタル画像処理装置４０は、マイクロLED検査部１００において、ルックアップテーブル１０９のメモリ４１への参照によってマイクロLEDの発光波長を決定するようにモジュール構成されており、当該モジュール実行後、処理の制御は、発光データ出力ステップへ渡される。
この他のステップ処理は、段落００４６記載のステップ処理と同一であるから本段落からは段落００４６を参照するとおりとの記載に止め、重複の記載は省略する。In the embodiment of the micro LED light emission inspection device 1 according to the present invention, a mechanism for referring to the lookup table 109 is described with reference to a flowchart S100 for explaining a control flow at the time of performing the inspection of the micro LED light emission inspection device 1 This will be described with reference to the schematic diagram 8 of the drawn flowchart. FIG. 8 is a control flow in which the emission wavelength calculation step S13 of FIG. 6 is replaced by the lookup table lookup method emission wavelength determination step S15. In the embodiment of the lookup table 109 reference shown in FIG. 8, the lookup table 109 is persistent as master data via a connection interface to persistent storage 74 or 76 or 79, as described in the previous paragraph. It may be accepted from the storage, the connection interface may be USB 74, and the look-up table 109 recorded in the USB-compatible memory device 74 may be read into the memory 41 of the digital image processing device 40. The emission wavelength determining step S15 of the lookup table lookup method, which is an alternative to the control flow of FIG. 8, will be described below.
<Emission wavelength determination step S15 of lookup table reference method>
After execution of the step S12 of calculating the ratio of the light intensity without filter and the light intensity with filter, the execution process flow control is passed to the micro LED inspection unit 100. The digital/digital image processing apparatus 40 is module-configured to determine the emission wavelength of the micro LED by referring to the memory 41 of the look-up table 109 in the micro LED inspection unit 100. After executing the module, the processing control is performed. Is passed to the light emission data output step.
Since the other step processing is the same as the step processing described in paragraph 0046, the description will be limited to the description referring to paragraph 0046 from this paragraph, and duplicate description will be omitted.
　本発明に係るマイクロLED発光検査装置１の変形実施形態では、さらに光波長の可変機構を有する光源を備える。図９に示されるように、制御装置７０は、マイクロLED発光検査装置１の構成要素を制御するための制御フロー管理に使用されるCPU８6、メモリ８７を備え、制御部７１は送信部７２と伝送路８８を介してフィルタ駆動装置へ制御信号を送信可能に、制御装置７０とデジタル画像処理装置との間には通信路８９が備わり、送信部７２を介して双方向通信可能に構成され、このようにデジタル画像処理装置４０及びフィルタ駆動装置６０と一体制御可能に構成された制御装置７０によって、マイクロLED発光検査装置１の自動運転を可能とするように構成されているのに加え、さらにマイクロLED発光検査装置１は光源として、光波長の可変機構１１６を備え、制御部７１と送信部７２を介して通信可能である既知の光波長の波長光源１０６を参照光６を照射するために備える。光波長の可変機構を有する光源を備える目的は、所望の光波長を選択可能とし、ルックアップテーブルの作成をする場合に、所望のサンプリング間隔の発光波長を選択し、フィルタ無し光強度とフィルタ有り光強度の比が発光波長の関数として急峻に変化するときも適宜所望サンプリング間隔でルックアップテーブルの作成の離散値を選択可能とし、あるいは、適当な等分でサンプリング間隔を選択可能にすることにあり、既知の光波長の波長光源とするのは、キャリブレーションのためである。
　上記のように構成された本発明に係るマイクロLED発光検査装置１は、図９に示されるように、制御装置７０は、マイクロLED発光検査装置１の構成要素を制御するための制御フロー管理に使用されるCPU８6、メモリ８７を備え、制御部７１は送信部７２と伝送路８８を介してフィルタ駆動装置へ制御信号を送信可能に、制御装置７０とデジタル画像処理装置との間には通信路８９が備わり、送信部７２を介して双方向通信可能に構成され、このようにデジタル画像処理装置４０及びフィルタ駆動装置６０と一体制御可能に構成された制御装置７０によって、マイクロLED発光検査装置１の自動運転を可能とするように構成される。一実施形態の構成と動作を制御フローのフローチャートＳ２００を構成要素を跨って描かれた模式図１０を参照しながら説明する。
＜光波長初期化ステップＳ２１＞
　制御装置７０の制御部７１の処理の開始とともに、制御は、光波長初期化ステップに渡り、可変機構１１６によって光源１０６の光波長の設定値を初期値に更新するように送信部７２と伝送路８８を介して可変機構１１６へ制御信号を送信可能に、制御部７１はモジュール構成されている。送信後、制御はキャリブレーション光源点灯ステップへ移る。
＜キャリブレーション光源点灯ステップＳ２２＞
　マイクロLED発光検査装置１は、キャリブレーション光源１０６が遠隔点灯されるようにモジュール構成されている。キャリブレーション光源点灯ステップが実行されると制御は続いて、制御部７１内に構成されているフィルタ移動指示ステップの構成モジュールが起動される。この後のフィルタ駆動機構６０への制御及び動作は、段落００４６に記載されている制御及び動作と同様である。
＜第１のフィルタ移動指示ステップＳ２３＞
　引続き最初のフィルタ移動指示ステップへ制御が渡され、このステップでは光フィルタ５０が光路２１に存在しないステータスを選択する信号が制御部７１によって生成される。さらに伝送路８８を介して信号はフィルタ駆動機構６０へ送信され、その後制御部７１は直ちに最初の撮像の開始指示通知待ちとなるようにモジュール構成され、このまま、当該モジュール処理は直ちに最初の撮像の開始指示通知待ち状態に遷移する。
＜第１のフィルタ移動ステップＳ２４＞
　フィルタ駆動機構６０はフィルタ駆動機構６０と制御装置７０の間の伝送路８８を介して光フィルタ５０が光路２１に存在しないステータスを選択するための信号を受入れると直ちに、光学フィルタ５０を光路２１から外す最初のフィルタ移動ステップを実行するように構成されている。
＜第１の撮像の開始指示ステップＳ２５＞
　制御装置７０の制御部７１は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、直ちに制御部７１は第１の撮像の開始指示信号を生成する。最初の撮像の開始指示通知は、例えば、最初のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部７１が受信するように構成されてもよいが、その他、所定の時間が経過すれば最初の撮像の開始指示通知を生成するように、制御部７１内でタイマーを駆動するように構成されていてもよい。この場合には、所定の時間経過後にタイマーイベントが生成され最初の撮像の開始指示通知が制御部７１に通知される。制御部７１に制御が戻ると、制御部７１は通信路８９を介してデジタル画像処理装置４０へ第１の撮像の開始指示信号を送信した後に、第２のフィルタ移動指示待ちとなるように構成されている。第１の撮像の開始指示ステップを起動するモジュールの実行後、当該モジュールの処理は第２のフィルタ移動指示待ち状態へ遷移する。
＜第１の撮像ステップＳ２６＞
　デジタル画像処理装置は、通信路８９を介して第１の撮像の開始指示信号を制御部７１から受信すると、撮像装置３０から映像信号を受け入れ、デジタル画像処理装置４０内に格納される画像データフレーム４２上のピクセルマップ４３へ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置内の前記メモリに格納するようにモジュール構成されており、当該モジュールの動作後には、引き続いて単位映像体識別部８１の処理に制御が渡る。
＜フィルタ無し光強度測定ステップＳ２７＞
　引き続き、単位映像体識別部８１において、光強度ピクセルマップからキャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップ４３への単位映像体マッピングデータを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納するように、デジタル画像処理装置４０はモジュール構成されている。単位映像体識別部８１のモジュール処理に引き続いて、キャリブレーション光源マッピングをマイクロLEDマッピングとみなし、マイクロLED識別部９０において、単位映像体８０から前記キャリブレーション光源マッピングとみなされたマイクロLEDをピクセルマップ４３上にマッピングしマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。続いてマイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの発光とみなされたキャリブレーション光源の光学フィルター無の配置における前記光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。フィルタ無し光強度を測定するモジュールが実行されると、引き続き、制御装置７０は、フィルタ無し光強度を測定する処理を実行制御されるように構成されている。
＜第２のフィルタ移動指示ステップＳ２８＞
　第２のフィルタ移動指示待ちとなっていた制御部７１は、第２のフィルタ移動指示を受け入れると、当該指示に基づき光学フィルタ５０を光路２１に配設する信号を生成し、伝送路８８を介しフィルタ駆動機構６０へ当該信号を送信するようにモジュール構成されている。当該モジュール実行後には、当該モジュールは第２の撮像開始指示待ちとなるようにモジュール構成されており、制御部待ち状態となる。
＜第２のフィルタ移動ステップＳ２９＞
　フィルタ駆動機構６０は伝送路８８を介して光学フィルタ５０を光路２１に配設する信号を制御部７１から受入れ、光学フィルタ５０を光路２１に配設するようにフィルタ駆動機構６０はモジュール構成されている。
＜第２の撮像の開始指示ステップＳ３０＞
　制御部７１は、第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ち状態で第２の撮像の開始指示通知を受け入れると第２の撮像の開始指示信号を生成し、通信路８９を介してデジタル画像処理装置４０へ第２の撮像の開始指示信号を送信するようにモジュール構成されている。第２の撮像の開始指示通知について、例えば、第２のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部７１が受信するように構成されてもよいし、その他、所定の時間が経過すれば第２の撮像の開始指示通知を生成するように、制御部７１内でタイマーを駆動するように構成されていてもよい。当該モジュールが動作後に、制御部７１の処理はアイドルとなり、次のタスク待ちとなる。
＜第２の撮像ステップＳ３１＞
　デジタル画像処理装置４０は、通信路８９を介して第２の撮像の開始指示信号を受信すると、撮像装置３０から映像信号を受け入れ、画像データフレーム４２上のピクセルマップ４３へ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納するようにモジュール構成されており、このモジュール動作後には単位映像体識別部８１での処理に制御を渡す。
＜フィルタ有り光強度の測定ステップＳ３２＞
　デジタル画像処理装置４０内では、これに引き続き、単位映像体識別部８１において、光強度ピクセルマップからキャリブレーション光源光をマイクロLEDの発光とみなし、キャリブレーション光源光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップ４３への単位映像体マッピングデータを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納し、さらにマイクロLED識別部９０において、単位映像体からキャリブレーション光源マッピングとみなされたマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。このモジュール処理の後に、マイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの発光とみなされたキャリブレーション光源の光学フィルター５０有りの配置における光エネルギ強度値としてデジタル画像処理装置４０内のメモリ４１に格納するように、デジタル画像処理装置４０はモジュール構成されている。当該モジュール処理後に、制御は、デジタル画像処理装置４０内でマイクロLED検査部での処理に渡される。
＜フィルタ無し光強度とフィルタ有り光強度の比計算ステップＳ３３＞
　これに引き続き、マイクロLED検査部において、キャリブレーション光源としてのマイクロLEDの光学フィルター有りの配置における光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１から読み出し、光学フィルター５０有の配置におけるキャリブレーション光源の前記光エネルギ強度値と、光学フィルター５０無の配置の光エネルギ強度値とによって、、フィルタ無し光強度とフィルタ有り光強度の比を計算するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は、発光波長計算ステップへ渡る。
＜発光波長計算ステップＳ３４＞
　これに引き続き、マイクロLED検査部１００において、所定の前記マイクロLEDの発光波長算出式によってマイクロLEDの発光波長を決定するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は、光源波長及び光強度比記録ステップへ渡る。
＜光源波長及び光強度比記録ステップＳ３５＞
　これに引き続き、マイクロLED検査部１００において、既知の光源波長と光強度の比をメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は、光源波長更新ステップへ進む。
＜光源波長更新ステップＳ３６＞
　これに引き続き、マイクロLED検査部１００において、源の光波長の設定値を所定の増分値で更新するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は、ルックアップテーブル完了条件を判定する、判定ステップへ進む。
＜完了判定ステップＳ３７＞
　更新後の前記光源の光波長が所定の境界値を超えるか否かをチェックし分岐するするようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は越えるときルックアップテーブル作成ステップへ進み、超えないとき波長初期化ステップ へ分岐し更新後の光波長で初期化する。
＜ルックアップテーブル作成ステップＳ３８＞
　　これに引き続き、マイクロLED検査部１００において、メモリ３７に格納された複数の波長と光強度の比の組からルックアップテーブル１０９を作成し、これをメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されるとルックアップテーブル１０９が完成し処理は終了する。The modified embodiment of the micro LED light emission inspection device 1 according to the present invention further includes a light source having a light wavelength variable mechanism. As shown in FIG. 9, the control device 70 includes a CPU 86 and a memory 87 used for control flow management for controlling the components of the micro LED light emission inspection device 1, and the control unit 71 includes a transmission unit 72 and a transmission unit 72. A control signal can be transmitted to the filter driving device via a path 88, a communication path 89 is provided between the control device 70 and the digital image processing device, and bidirectional communication can be performed via a transmission unit 72. In addition to being configured to enable automatic operation of the micro LED light emission inspection device 1 by the control device 70 that is integrally controllable with the digital image processing device 40 and the filter driving device 60, The LED light emission inspection device 1 includes a light wavelength variable mechanism 116 as a light source, and a wavelength light source 106 of a known light wavelength, which is communicable via the control unit 71 and the transmission unit 72, for irradiating the reference light 6. .. The purpose of providing a light source having a variable mechanism of light wavelength is to make it possible to select a desired light wavelength, and when creating a look-up table, select a light emission wavelength at a desired sampling interval, with no filter light intensity and with a filter. Even when the ratio of the light intensity sharply changes as a function of the emission wavelength, it is possible to select a discrete value for creating a lookup table at a desired sampling interval, or to select a sampling interval at an appropriate equal interval. Yes, the wavelength light source of the known light wavelength is used for calibration.
In the micro LED light emission inspection device 1 according to the present invention configured as described above, as shown in FIG. 9, the control device 70 manages the control flow for controlling the components of the micro LED light emission inspection device 1. It includes a CPU 86 and a memory 87 to be used, the control unit 71 can transmit a control signal to a filter driving device via a transmission unit 72 and a transmission line 88, and a communication path is provided between the control device 70 and the digital image processing device. The micro LED light emission inspection apparatus 1 is provided with the control unit 70 which is provided with 89 and is configured to be capable of bidirectional communication via the transmission unit 72 and thus integrally controllable with the digital image processing apparatus 40 and the filter driving apparatus 60. It is configured to enable automatic operation of. The configuration and operation of one embodiment will be described with reference to a schematic diagram 10 in which a flowchart S200 of a control flow is drawn across the components.
<Optical wavelength initialization step S21>
With the start of the processing of the control unit 71 of the control device 70, the control proceeds to the optical wavelength initialization step so that the variable mechanism 116 updates the set value of the optical wavelength of the light source 106 to the initial value and the transmission unit 72 and the transmission line. The control unit 71 is modularized so that a control signal can be transmitted to the variable mechanism 116 via 88. After transmission, control moves to the calibration light source lighting step.
<Calibration light source lighting step S22>
The micro LED light emission inspection device 1 is modularly configured so that the calibration light source 106 is remotely turned on. When the calibration light source lighting step is executed, the control continues, and the module module of the filter movement instruction step, which is configured in the control unit 71, is activated. The control and the operation to the filter driving mechanism 60 after this are the same as the control and the operation described in the paragraph 0046.
<First filter movement instruction step S23>
Then, control is passed to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting the status in which the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control unit 71 is modularized so as to immediately wait for the start instruction notification of the first imaging. Transition to the start instruction notification waiting state.
<First filter moving step S24>
The filter driving mechanism 60 receives the optical filter 50 from the optical path 21 as soon as it receives a signal via the transmission path 88 between the filter driving mechanism 60 and the control device 70 for selecting the status that the optical filter 50 does not exist in the optical path 21. It is configured to perform the first filter move step to remove.
<First imaging start instruction step S25>
When the control unit 71 of the control device 70 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit 71 immediately receives the first imaging start instruction notification. An imaging start instruction signal is generated. The notification of the start instruction of the first imaging may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 71 receives the status signal after the completion of the first filter moving step, for example. The timer may be configured to be driven in the control unit 71 so that the first imaging start instruction notification is generated when the time elapses. In this case, a timer event is generated after a lapse of a predetermined time, and the control unit 71 is notified of the start instruction notification of the first imaging. When control is returned to the control unit 71, the control unit 71 transmits a first image capture start instruction signal to the digital image processing apparatus 40 via the communication path 89, and then waits for the second filter movement instruction. Has been done. After the execution of the module that activates the first imaging start instruction step, the processing of the module transits to the second filter movement instruction waiting state.
<First imaging step S26>
When the digital image processing apparatus receives the first image capturing start instruction signal from the control unit 71 via the communication path 89, the digital image processing apparatus receives the video signal from the image capturing apparatus 30 and stores the image data frame stored in the digital image processing apparatus 40. And a pixel map 43 on 42 to generate a light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed, and the light intensity pixel map is stored in the memory in the digital image processing apparatus. After the operation of the module, control is subsequently transferred to the processing of the unit image body identification unit 81.
<Light intensity measurement step S27 without filter>
Subsequently, in the unit image body identifying unit 81, the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map, the unit image body 80 of the calibration light source light is specified based on a predetermined criterion, and the pixel map 43 The digital image processing device 40 is modularly configured so as to generate unit video object mapping data to and store it in the memory 41 in the digital image processing device 40. Subsequent to the module processing of the unit image body identifying unit 81, the calibration light source mapping is regarded as micro LED mapping, and in the micro LED identifying unit 90, the micro LED regarded as the calibration light source mapping from the unit image body 80 is pixel-mapped. The digital image processing apparatus 40 is modularly configured so that the micro LED mapping data 44 is generated by mapping on the memory 43 and is stored in the memory 41. Next, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula, and the calibration light source regarded as the light emission of the micro LED is arranged without an optical filter. The digital image processing device 40 is modularly configured to store the light energy intensity value in the memory 41 in the digital image processing device 40. When the module for measuring the unfiltered light intensity is executed, the control device 70 is configured to be subsequently controlled to execute the process for measuring the unfiltered light intensity.
<Second filter movement instruction step S28>
When the control unit 71, which has been waiting for the second filter movement instruction, receives the second filter movement instruction, it generates a signal for disposing the optical filter 50 in the optical path 21 based on the instruction, and transmits the signal via the transmission path 88. The module is configured to transmit the signal to the filter drive mechanism 60. After the execution of the module, the module is configured to wait for the second imaging start instruction, and enters the control unit waiting state.
<Second filter moving step S29>
The filter driving mechanism 60 receives a signal for arranging the optical filter 50 in the optical path 21 from the control unit 71 via the transmission path 88, and the filter driving mechanism 60 is modularly configured so as to arrange the optical filter 50 in the optical path 21. There is.
<Second imaging start instruction step S30>
When the control unit 71 accepts the second imaging start instruction notification in the second imaging start instruction waiting state which is the final process of the second filter movement instruction step, it generates a second imaging start instruction signal and communicates. The module is configured to transmit a second imaging start instruction signal to the digital image processing apparatus 40 via the path 89. Regarding the notification of the start instruction of the second imaging, for example, the filter driving mechanism 60 may transmit the status signal after the second filter moving step is completed, and the control unit 71 may receive the status signal. The timer may be configured to be driven in the control unit 71 so that the second imaging start instruction notification is generated when a predetermined time has elapsed. After the module operates, the processing of the control unit 71 becomes idle and waits for the next task.
<Second imaging step S31>
When the digital image processing apparatus 40 receives the second imaging start instruction signal via the communication path 89, the digital image processing apparatus 40 receives the video signal from the imaging apparatus 30 and measures each pixel in the pixel map 43 on the image data frame 42. The module is configured to generate a light intensity pixel map on which stepwise light intensities are superimposed and store this in the memory 41 in the digital image processing device 40. After the module operation, the unit image body identifying unit 81 Pass control to the processing of.
<Step S32 of measuring light intensity with filter>
In the digital image processing device 40, subsequently, in the unit image body identification unit 81, the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the calibration light source light is determined according to the predetermined criteria. Based on the calibration light source, the unit image body mapping data to the pixel map 43 is generated, and the unit image body mapping data is stored in the memory 41 in the digital image processing device 40. The digital image processing device 40 is modularly configured to generate the micro LED mapping data 44 regarded as mapping and store the micro LED mapping data 44 in the memory 41. After this module processing, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula from the light intensity on the micro LED map. The digital image processing device 40 is modularized so as to be stored in the memory 41 in the digital image processing device 40 as the light energy intensity value in the arrangement with the filter 50. After the module processing, the control is passed to the processing in the micro LED inspection unit in the digital image processing device 40.
<Ratio calculation step S33 of light intensity without filter and light intensity with filter>
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 40, and the calibration in the arrangement with the optical filter 50 is performed. The digital image processing device 40 is modularly configured to calculate the ratio of the unfiltered light intensity to the filtered light intensity based on the light energy intensity value of the light source and the light energy intensity value of the arrangement without the optical filter 50. There is. When this module is executed, the process goes to the emission wavelength calculation step.
<Emission wavelength calculation step S34>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 40 is module-configured so that the emission wavelength of the micro LED is determined by a predetermined emission wavelength calculation formula of the micro LED. When this module is executed, the process goes to the light source wavelength and light intensity ratio recording step.
<Light source wavelength and light intensity ratio recording step S35>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 40 is module-configured so as to store a known light source wavelength/light intensity ratio in the memory 41. When this module is executed, the process proceeds to the light source wavelength update step.
<Light source wavelength updating step S36>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing apparatus 40 is modularized so as to update the set value of the light wavelength of the source with a predetermined increment value. When this module is executed, the process proceeds to a determination step of determining a look-up table completion condition.
<Completion determination step S37>
The digital image processing device 40 is modularly configured so as to check whether the light wavelength of the light source after updating exceeds a predetermined boundary value and branch the light. When this module is executed, the process proceeds to the look-up table creation step when it exceeds, and branches to the wavelength initialization step when it does not exceed and initializes with the updated optical wavelength.
<Lookup table creation step S38>
Following this, the micro LED inspection unit 100 creates a look-up table 109 from a set of a plurality of wavelength and light intensity ratios stored in the memory 37, and the digital image processing device 40 so as to store the lookup table 109 in the memory 41. Is modular. When this module is executed, the lookup table 109 is completed and the processing ends.
　　以上の処理を終え、マイクロLED発光波長決定用のルックアップテーブルが得られた後に、好ましくはルックアップテーブル出力可能であるように構成され外部接続路及びデータ出力部を備えたデジタル画像処理装置４０から発光波長データはデジタル画像処理装置４０内のメモリ４１を介して、データ出力部１２０から外部接続路に出力するようにデジタル画像処理装置４０はモジュール構成されのがよい。外部接続路は、コンピュータへの直接の伝送路を介するのでもよいし、通信部１１０を介してLAN接続によるネットワーク７５を介して接続されたコンピュータ２００へ接続された永続的ストレージ７６へ格納されている外部へ出力されてもよい。永続的ストレージ７６へ格納された後、複数のデジタル画像処理装置４０へ配布されるように構成されてもよい。After the above processing is completed and a look-up table for determining the emission wavelength of the micro LED is obtained, preferably the look-up table can be output, and the digital image processing device 40 having an external connection path and a data output unit is provided. The digital image processing device 40 is preferably configured as a module so that the emission wavelength data is output from the data output unit 120 to the external connection path via the memory 41 in the digital image processing device 40. The external connection path may be via a direct transmission path to the computer, or may be stored in the permanent storage 76 connected to the computer 200 connected via the network 75 via the LAN connection via the communication unit 110. It may be output to the outside. After being stored in the persistent storage 76, it may be configured to be distributed to a plurality of digital image processing devices 40.
＜他の態様：マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の実施形態＞
　本発明は、他の態様でマイクロLED発光検査装置１に用いる光学フィルタ検査装置を提供する。この態様では、光フィルタ５０の特性のキャリブレーションのために個別に分離されるべき１００μm角以下の大きさの矩形領域内を占めるマイクロLED２がアレイ状に配列されて表面に形成された半導体サブストレート３の代わりに、アレイ状に配列されることとなる検査対象のマイクロLEDの設計条件と少なくとも所定の領域でほぼ同一数の反射体１０２（以下で反射体アレイ１０２ともいう）が表面に形成されたサブストレート１０３がマイクロLED発光検査装置１の半導体サブストレート３に相当する位置に装着され、反射体１０２の反射光のための光投射機構１０４と、光投射機構への光誘導機構１０５と、光投射光の既知の波長の波長可変光源１０６と、を備えることを特徴とする。その他の構成はマイクロLED発光検査装置１の一実施形態と同様であり、同じ符号は同一の構成であることを示す。<Other Embodiments: Embodiment of Optical Filter Inspection Device 101 Used in Micro LED Emission Inspection Device 1>
The present invention provides an optical filter inspection device used in the micro LED emission inspection device 1 in another aspect. In this embodiment, the semiconductor substrates formed on the surface of the micro LEDs 2 are arrayed in an array and occupy a rectangular area of 100 μm square or less to be individually separated for the calibration of the characteristics of the optical filter 50. Instead of 3, the same number of reflectors 102 (hereinafter also referred to as reflector array 102) are formed on the surface at least in a predetermined region with the design conditions of the micro LEDs to be inspected to be arranged in an array. The substrate 103 is mounted at a position corresponding to the semiconductor substrate 3 of the micro LED light emission inspection device 1, a light projection mechanism 104 for reflected light of the reflector 102, a light guide mechanism 105 to the light projection mechanism, And a variable wavelength light source 106 having a known wavelength of the light projection light. Other configurations are the same as those of the micro LED light emission inspection device 1 according to the embodiment, and the same reference numerals indicate the same configurations.
　以下、マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の物理構成図１１を参照しながら、マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の一実施形態を詳細に説明する。図５に示される物理構成ブロック図に示されるように、マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１は光投射機構１０４、光誘導機構１０５、波長可変光源１０６、光学レンズ２０、撮像装置３０、デジタル画像処理装置１４０、光学フィルタ５０、フィルタ駆動機構６０、及び制御装置１７０等の物理構造を部分に含むマイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１である。ここで、マイクロLED発光検査装置１と同じ構成は同じ番号を付し、重複の説明は省略する場合がある。A physical configuration of the optical filter inspection device 101 used in the micro LED emission inspection device 1 will be described in detail below with reference to FIG. As shown in the block diagram of the physical configuration shown in FIG. 5, the optical filter inspection device 101 used in the micro LED emission inspection device 1 includes a light projection mechanism 104, a light guide mechanism 105, a variable wavelength light source 106, an optical lens 20, and an imaging device. 30. The optical filter inspection device 101 used for the micro LED light emission inspection device 1 including a physical structure such as a digital image processing device 140, an optical filter 50, a filter drive mechanism 60, and a control device 170. Here, the same components as those of the micro LED light emission inspection device 1 are denoted by the same reference numerals, and duplicate description may be omitted.
　より詳細には、マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の一実施形態は以下である。図１２に示されている機能構成図のように、マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１には、検査対象のウェハとして、アレイ状に配列されることとなる検査対象のマイクロLEDの設計条件と少なくとも所定の領域でほぼ同一数の反射体１０２（以下で反射体アレイ１０２ともいう）が表面に形成されたサブストレート１０３が装着されている。波長可変光源１０６の発光は所定の波長に調整されており、光誘導機構１０５を介して中継された光路を経て、光投射機構１０４によって照らされた反射体１０２の反射光は、再び光投射機構１０４を透過し、光学フィルタ５０、光学レンズ２０を通じる光路を介してイメージセンサ３１を有する撮像装置３０へ導かれる配置構成となっている。所定の光波長帯域を有する光学フィルタ５０は、反射体１０２と光学レンズ２０との反射光光路１２１に配設され、光学フィルタ５０によって選択透過された所定の光波長帯域の光がイメージセンサ３１を介し、撮像装置３０において映像信号を生成させる構成となっている。デジタル画像処理装置１４０はメモリ４１を備え、映像信号を撮像装置３０から受入れ、映像信号から画像データフレーム４２を生成し、これをメモリ４１へ格納するように構成されている。図には示されていないが複数の画像フレーム４２によってサブストレート１０３全体に形成されている反射体１０２の占める領域がカバーされている。More specifically, one embodiment of the optical filter inspection device 101 used in the micro LED emission inspection device 1 is as follows. As shown in the functional configuration diagram of FIG. 12, in the optical filter inspection device 101 used in the micro LED emission inspection device 1, the inspection target micro LEDs to be arranged in an array as wafers to be inspected. Substrate 103 having substantially the same number of reflectors 102 (hereinafter also referred to as reflector array 102) formed on the surface thereof in at least a predetermined area with the design conditions of 1 is mounted. The light emission of the variable wavelength light source 106 is adjusted to a predetermined wavelength, and the reflected light of the reflector 102 illuminated by the light projecting mechanism 104 via the optical path relayed via the light guiding mechanism 105 is again the light projecting mechanism. The arrangement is such that the light is transmitted through 104 and is guided to the imaging device 30 having the image sensor 31 via the optical path passing through the optical filter 50 and the optical lens 20. The optical filter 50 having a predetermined light wavelength band is arranged in the reflected light optical path 121 between the reflector 102 and the optical lens 20, and the light in the predetermined light wavelength band selectively transmitted by the optical filter 50 passes through the image sensor 31. The image signal is generated in the imaging device 30 via the image pickup device 30. The digital image processing device 140 includes a memory 41, is configured to receive a video signal from the imaging device 30, generate an image data frame 42 from the video signal, and store the image data frame 42 in the memory 41. Although not shown in the figure, a plurality of image frames 42 cover the area occupied by the reflector 102 formed on the entire substrate 103.
　前期光学フィルタ５０は、フィルタ駆動機構６０によって支持されており、フィルタ駆動機構６０は制御装置１７０からの制御信号を受け入れるための受信部６２を備える。前記制御装置１７０は、フィルタ駆動機構６０によって光学フィルター５０の有無を選択制御可能に構成されている、制御装置１７０フィルタ駆動機構６０の制御信号の生成のための制御部１７１を含み、当該制御部１７１は、システムフロー開始とフロー制御可能に構成され、制御部１７１は、フィルタ駆動機構６０の前記制御信号を送信するための送信部１７２を備え、制御信号をフィルタ駆動機構６０に備わる制御信号のフィルタ駆動機構受信部６２に送信可能に構成されている。The previous term optical filter 50 is supported by a filter driving mechanism 60, and the filter driving mechanism 60 includes a receiving unit 62 for receiving a control signal from the control device 170. The control device 170 includes a control unit 171 for generating a control signal of the control device 170 filter drive mechanism 60, which is configured to be selectively controllable by the filter drive mechanism 60 as to whether or not the optical filter 50 is present. 171 is configured to be capable of system flow start and flow control, and the control unit 171 includes a transmission unit 172 for transmitting the control signal of the filter drive mechanism 60, and the control signal of the control signal of the filter drive mechanism 60. The filter drive mechanism receiver 62 is configured to be able to transmit.
　デジタル画像処理装置１４０において、映像信号から生成されたデジタル光強度は、画像データフレーム４２上のピクセル毎に段階的光強度を持ち、複数の画像データフレーム４２は束ねられメモリ４１上に保持されて半導体サブストレート３全体にわたる画像データフレーム上にピクセル毎の光強度が光強度ピクセルマップ４５として構成されている。In the digital image processing device 140, the digital light intensity generated from the video signal has a stepwise light intensity for each pixel on the image data frame 42, and the plurality of image data frames 42 are bundled and held in the memory 41. The light intensity for each pixel is configured as a light intensity pixel map 45 on the image data frame over the entire semiconductor substrate 3.
　デジタル画像処理装置１４０には、単位映像体識別部８１が構成されており、前記画像データフレーム４２上のピクセル毎の光強度ピクセルマップ４５から所定のクライテリアに基づきデジタル画像処理装置４０の画面フレーム内に現出される発光体の単位映像体８０が特定され、前記ピクセルマップ４３への単位映像体マッピングデータ４６を生成するように構成されている。In the digital image processing device 140, a unit image body identifying section 81 is configured, and within the screen frame of the digital image processing device 40 based on predetermined criteria from the light intensity pixel map 45 for each pixel on the image data frame 42. The unit image object 80 of the light emitter that appears in FIG. 2 is specified, and the unit image object mapping data 46 to the pixel map 43 is generated.

　デジタル画像処理装置１４０には、マイクロLED識別部９０が構成されており、反射体１０２の反射光を前記マイクロLED２の発光とみなしサブストレート１０３上にアレイ状に配列された反射体１０２は、マイクロLED発光検査装置１におけるマイクロLED２の場合と同様に単位映像体８０を手がかりに特定される。サブストレート１０３上に相対的に配列配置されている反射体１０２は、例えば、画像フレーム４２上で周囲に対しピーク値の光エネルギ強度値を呈するピクセルを単位映像体８０の中心部と特定し、隣接する二つの単位映像体８０の中心部間の中央をその二つの単位映像体８０の矩形境界と仮定し、単位映像体８０の形態を判定する所定のクライテリアによって複数のアレイ状に配列された反射体１０２とみなされたマイクロLED２を特定しマイクロLED２に対応させて前記ピクセルマップ４３上にマッピングするマイクロLEDマッピング４８のデータを生成するようにマイクロLED識別部９０は構成されているのは、マイクロLED発光検査装置１におけるのと同様である。
The digital image processing device 140 is provided with a micro LED identification section 90, and the reflected light of the reflector 102 is regarded as the light emission of the micro LED 2, and the reflectors 102 arranged in an array on the substrate 103 are Similar to the case of the micro LED 2 in the LED light emission inspection device 1, the unit image body 80 is specified as a clue. The reflector 102, which is relatively arranged on the substrate 103, specifies, for example, a pixel having a light energy intensity value of a peak value with respect to the surroundings on the image frame 42 as the central portion of the unit image body 80, Assuming that the center between the center portions of two adjacent unit image bodies 80 is a rectangular boundary between the two unit image bodies 80, the unit image bodies 80 are arranged in a plurality of arrays according to predetermined criteria for determining the form of the unit image body 80. The micro LED identifying unit 90 is configured to generate the data of the micro LED mapping 48 that identifies the micro LED 2 regarded as the reflector 102 and maps the micro LED 2 on the pixel map 43 corresponding to the micro LED 2. The same as in the micro LED light emission inspection device 1.
　デジタル画像処理装置１４０には、演算ロジックとして所定の光エネルギ強度算出式が動作するように構成されており、例えば、光強度ピクセルマップ４５上で単位映像体８０に対応する反射体１０２とみなされたマイクロLED２に含まれる画像フレーム４２上のピクセルの段階的光強度の総和を光強度として採用してもよい。このように決定された単位映像体８０に対応する各々のマイクロLED２の光エネルギ強度は、制御装置７０からの制御信号を受け入れてフィルタ駆動機構６０によって光学フィルター無の配置において測定された光エネルギ強度値として、メモリ４１に格納されるようにデジタル画像処理装置１４０は構成されている。The digital image processing device 140 is configured to operate a predetermined light energy intensity calculation formula as an arithmetic logic, and is regarded as the reflector 102 corresponding to the unit image object 80 on the light intensity pixel map 45, for example. Alternatively, the sum of the stepwise light intensities of the pixels on the image frame 42 included in the micro LED 2 may be adopted as the light intensity. The light energy intensity of each micro LED 2 corresponding to the unit image object 80 determined in this way is measured by the filter driving mechanism 60 in the arrangement without the optical filter upon receiving the control signal from the control device 70. As a value, the digital image processing device 140 is configured so as to be stored in the memory 41.
　同様に、単位映像体８０に対応する反射体１０２とみなされた各々のマイクロLED２の光エネルギ強度は、フィルタ駆動機構６０によって光学フィルター５０有りの配置において測定され、単位映像体８０に対応するこの光エネルギ強度値は、前記光学フィルター５０有の配置における反射体１０２とみなされたマイクロLED２の前記光エネルギ強度値として、メモリ４１に格納され、保持されるようにデジタル画像処理装置１４０は構成されている。Similarly, the light energy intensity of each micro LED 2 regarded as the reflector 102 corresponding to the unit image body 80 is measured by the filter driving mechanism 60 in the arrangement with the optical filter 50, and corresponds to the unit image body 80. The digital image processing apparatus 140 is configured such that the light energy intensity value is stored and held in the memory 41 as the light energy intensity value of the micro LED 2 regarded as the reflector 102 in the arrangement with the optical filter 50. ing.
　デジタル画像処理装置１４０には、マイクロLED検査部１００が構成されており、ここには演算ロジックとして反射体１０２とみなされたマイクロLEDの所定の発光波長算出式が動作するように構成され、例えば、予め構成されメモリ４１上にルックアップテーブル１０９が構成されており、引数を指定すればこれによって当該ルックアップテーブル１０９を検索し、引数に対応する目的データ値であるマイクロLED２の発光波長として参照可能にルックアップテーブル１０９が構成されている。前記引数は、例えば、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比であってもよく、ルックアップテーブル１０９は光学フィルター５０無の配置における前記光エネルギ強度値と前記光学フィルター５０有の配置における前記光エネルギ強度値との比と、発光波長との関係を配列データとして作成されたものであるとよい。ルックアップテーブル１０９は、所定の光波長を提供する波長可変光源１０６によって、フィルタ特性がキャリブレーションされた光学フィルター５０を用いて、前記光学フィルター有りの配置における前記光エネルギ強度値と前記光学フィルター無しの配置における前記光エネルギ強度値との比と発光波長との関係に関してキャリブレーションをもとに作成されたルックアップテーブル１０９でもよい。The digital image processing device 140 is configured with a micro LED inspection unit 100, which is configured to operate a predetermined emission wavelength calculation formula of the micro LED regarded as the reflector 102 as an arithmetic logic. , The look-up table 109 is configured in advance and is configured on the memory 41. If an argument is specified, the look-up table 109 is searched by this and referred to as the emission wavelength of the micro LED 2 which is the target data value corresponding to the argument. The lookup table 109 is configured as possible. The argument may be, for example, a ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter, and the lookup table 109 does not include the optical filter 50. It is preferable that the relationship between the ratio of the light energy intensity value in the arrangement to the light energy intensity value in the arrangement with the optical filter 50 and the emission wavelength is created as array data. The look-up table 109 uses the optical filter 50 whose filter characteristics are calibrated by the wavelength variable light source 106 that provides a predetermined light wavelength, and uses the optical energy intensity value and the optical filter without the optical filter in the arrangement with the optical filter. The lookup table 109 created based on the calibration regarding the relationship between the ratio to the light energy intensity value and the emission wavelength in the arrangement of the light energy may be used.
　さらに、デジタル画像処理装置１４０の変形実施形態では、マイクロLED２の発光波長算出式は、光エネルギ強度比測定値に対応する発光波長が参照され、中間値については、その中間値を跨ぐ直近の二つの引数が与える二つの参照波長を按分補間によって調整し発光波長が決定されるようにルックアップテーブル１０９が構成されていてもよい。Further, in the modified embodiment of the digital image processing apparatus 140, the emission wavelength calculation formula of the micro LED 2 is referred to the emission wavelength corresponding to the measured value of the light energy intensity ratio, and the intermediate value is the latest two values that cross the intermediate value. The look-up table 109 may be configured so that the emission wavelength is determined by adjusting the two reference wavelengths given by one argument by proportional division interpolation.
　このように構成されたマイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の一実施形態でルックアップテーブル１０９が構成される仕組みに関し、制御フローのフローチャートＳ３００を構成要素を跨って描かれた模式図１３を参照しながら説明する。マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１は光源として、光波長の可変機構１１６を備え、制御部７１と送信部７２を介して通信可能である既知の光波長の可変波長光源１０６を反射体１０２へ照射するために備える。ここに構成されたマイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１は、図１２に示されるように、制御装置１７０は、光学フィルタ検査装置１０１の構成要素を制御するための制御フロー管理に使用されるCPU８6、メモリ８７を備え、制御部１７１は送信部１７２と伝送路８８を介してフィルタ駆動装置及び光波長の可変機構１１６へ制御信号を送信可能に、制御装置７０とデジタル画像処理装置１４０との間には通信路８９が備わり、送信部７２を介して双方向通信可能に構成され、このようにデジタル画像処理装置１４０及びフィルタ駆動装置６０と一体制御可能に構成された制御装置１７０によって、光学フィルタ検査装置１０１の自動運転を可能とするように構成される。自動運転によって、マイクロLEDをモデルとする多数の反射体の光源を用い、一括処理によって光学フィルタ検査をする仕組みを以下に詳説する。
＜光波長初期化ステップＳ３２１＞
　制御装置１７０の制御部１７１の処理の開始とともに、制御は、光波長初期化ステップに渡り、可変機構１１６によって光源１０６の光波長の設定値を初期値に更新するように送信部１７２と伝送路８８を介して可変機構１１６へ制御信号を送信可能に、制御部１７１はモジュール構成されている。送信後、制御はキャリブレーション光源点灯ステップへ移る。
＜キャリブレーション光源点灯ステップＳ３２２＞
　光学フィルタ検査装置１０１は、キャリブレーション光源１０６が遠隔点灯されるようにモジュール構成されている。キャリブレーション光源点灯ステップが実行されると制御は続いて、制御部１７１内に構成されているフィルタ移動指示ステップの構成モジュールが起動される。当該モジュールが実行された後、処理は第１のフィルタ移動指示ステップへ進む。
＜第１のフィルタ移動指示ステップＳ３２３＞
　引続き最初のフィルタ移動指示ステップへ制御が渡され、このステップでは光フィルタ５０が光路２１に存在しないステータスを選択する信号が制御部１７１によって生成される。さらに伝送路８８を介して信号はフィルタ駆動機構６０へ送信され、その後制御部１７１は直ちに最初の撮像の開始指示通知待ちとなるようにモジュール構成され、このまま、当該モジュール処理は直ちに最初の撮像の開始指示通知待ち状態に遷移する。
＜第１のフィルタ移動ステップＳ３２４＞
　フィルタ駆動機構６０はフィルタ駆動機構６０と制御装置１７０の間の伝送路８８を介して光フィルタ５０が光路２１に存在しないステータスを選択するための信号を受入れると直ちに、光学フィルタ５０を光路２１から外す最初のフィルタ移動ステップを実行するように構成されている。
＜第１の撮像の開始指示ステップＳ３２５＞
　制御装置１７０の制御部１７１は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、直ちに制御部１７１は第１の撮像の開始指示信号を生成する。最初の撮像の開始指示通知は、例えば、最初のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部１７１が受信するように構成されてもよいが、その他、所定の時間が経過すれば最初の撮像の開始指示通知を生成するように、制御部１７１内でタイマーを駆動するように構成されていてもよい。この場合には、所定の時間経過後にタイマーイベントが生成され最初の撮像の開始指示通知が制御部１７１に通知される。制御部１７１に制御が戻ると、制御部１７１は通信路８９を介して画像処理装置１４０へ第１の撮像の開始指示信号を送信した後に、第２のフィルタ移動指示待ちとなるように構成されている。第１の撮像の開始指示ステップを起動するモジュールの実行後、当該モジュールの処理は第２のフィルタ移動指示待ち状態へ遷移する。
＜第１の撮像ステップＳ３２６＞
　デジタル画像処理装置は、通信路８９を介して第１の撮像の開始指示信号を制御部１７１から受信すると、撮像装置３０から映像信号を受け入れ、デジタル画像処理装置１４０内に格納される画像データフレーム４２上のピクセルマップへ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置１４０内のメモリ４１に格納するようにモジュール構成されており、当該モジュールの動作後には、引き続いて単位映像体識別部８１の処理に制御が渡る。
＜フィルタ無し光強度測定ステップＳ３２７＞
　引き続き、単位映像体識別部８１において、光強度ピクセルマップから前記キャリブレーション光源の反射光をマイクロLEDの発光とみなし、前記キャリブレーション光源の反射光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップへの単位映像体マッピングデータを生成し、これをデジタル画像処理装置１４０内のメモリ４１に格納するように、デジタル画像処理装置１４０はモジュール構成されている。単位映像体識別部８１のモジュール処理に引き続いて、反射体マッピングをマイクロLEDマッピングデータ４４４４とみなし、マイクロLED識別部９０において、単位映像体８０から前記反射体マッピングとみなされたマイクロLEDをピクセルマップ上にマッピングしマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置１４０はモジュール構成されている。続いてマイクロLEDマップ４４上の光強度マップ４５上の光強度から所定の光エネルギ強度算出式によってマイクロLED２の光エネルギ強度を決定し、マイクロLEDの発光とみなされた反射体１０２の反射光の光学フィルター無の配置における前記光エネルギ強度値をデジタル画像処理装置１４０内のメモリ４１に格納するようにデジタル画像処理装置１４０はモジュール構成されている。フィルタ無し光強度を測定するモジュールが実行されると、引き続き、制御装置１７０は、フィルタ有り光強度を測定する処理を実行制御されるように構成されている。
＜第２のフィルタ移動指示ステップＳ３２８＞
　第２のフィルタ移動指示待ちとなっていた制御部１７１は、第２のフィルタ移動指示を受け入れると、当該指示に基づき光学フィルタ５０を光路２１に配設する信号を生成し、伝送路８８を介しフィルタ駆動機構６０へ当該信号を送信するようにモジュール構成されている。当該モジュール実行後には、当該モジュールは第２の撮像開始指示待ちとなるようにモジュール構成されており、当該モジュールは制御部待ち状態となる。
＜第２のフィルタ移動ステップＳ３２９＞
　フィルタ駆動機構６０は伝送路８８を介して光学フィルタ５０を光路２１に配設する信号を制御部１７１から受入れ、光学フィルタ５０を光路２１に配設するようにフィルタ駆動機構６０はモジュール構成されている。
＜第２の撮像の開始指示ステップＳ３３０＞
　制御部１７１は、第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ち状態で第２の撮像の開始指示通知を受け入れると第２の撮像の開始指示信号を生成し、通信路８９を介してデジタル画像処理装置１４０へ第２の撮像の開始指示信号を送信するようにモジュール構成されている。第２の撮像の開始指示通知について、例えば、第２のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部１７１が受信するように構成されてもよいし、その他、所定の時間が経過すれば第２の撮像の開始指示通知を生成するように、制御部１７１内でタイマーを駆動するように構成されていてもよい。当該モジュールが動作後に、制御部１７１の処理はアイドルとなり、次のタスク待ちとなる。
＜第２の撮像ステップＳ３３１＞
　デジタル画像処理装置１４０は、通信路８９を介して第２の撮像の開始指示信号を受信すると、撮像装置３０から映像信号を受け入れ、画像データフレーム４２上のピクセルマップへ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置１４０内のメモリ４１に格納するようにモジュール構成されており、このモジュール動作後には単位映像体識別部８１での処理に進むようにデジタル画像処理装置１４０は構成されている。
＜フィルタ有り光強度の測定ステップＳ３３２＞
　デジタル画像処理装置４０内では、これに引き続き、単位映像体識別部８１において、光強度ピクセルマップからキャリブレーション光源の反射光をマイクロLEDの発光とみなし、キャリブレーション光源光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップへの単位映像体マッピングデータを生成し、これをデジタル画像処理装置１４０内のメモリ４１に格納し、さらにマイクロLED識別部９０において、単位映像体８０から反射体マッピングとみなされたマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置１４０はモジュール構成されている。このモジュール処理の後に、マイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの発光とみなされたキャリブレーション光源反射光の光学フィルター５０有りの配置における光エネルギ強度値としてデジタル画像処理装置１４０内のメモリ４１に格納するように、デジタル画像処理装置１４０はモジュール構成されている。当該モジュール処理後に、制御は、デジタル画像処理装置１４０内でマイクロLED検査部での処理に渡される。
＜フィルタ無し光強度とフィルタ有り光強度の比計算ステップＳ３３３＞
　これに引き続き、マイクロLED検査部において、キャリブレーション光源としてのマイクロLEDの光学フィルター有りの配置における光エネルギ強度値をデジタル画像処理装置１４０内のメモリ４１から読み出し、光学フィルター５０有の配置におけるキャリブレーション光源反射光の前記光エネルギ強度値と、光学フィルター５０無の配置の光エネルギ強度値とによって、、フィルタ無し光強度とフィルタ有り光強度の比を計算するようにデジタル画像処理装置１４０はモジュール構成されている。このモジュールが実行されると処理は、発光波長計算ステップへ渡る。
＜発光波長計算ステップＳ３３４＞
　これに引き続き、マイクロLED検査部１００において、所定の前記マイクロLEDの発光波長算出式によってマイクロLEDの発光波長を決定するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は、光源波長及び光強度比記録ステップへ渡る。
＜光源波長及び光強度比記録ステップＳ３３５＞
　これに引き続き、マイクロLED検査部１００において、既知の光源波長と光強度の比をメモリ４１に格納するようにデジタル画像処理装置１４０はモジュール構成されている。このモジュールが実行されると処理は、光源波長更新ステップへ進む。
＜光源波長更新ステップＳ３３６＞
　これに引き続き、マイクロLED検査部１００において、光源の光波長の設定値を所定の増分値で更新するようにデジタル画像処理装置１４０はモジュール構成されている。このモジュールが実行されると処理は、ルックアップテーブル完了条件を判定する、判定ステップへ進む。
＜完了判定ステップＳ３３７＞
　更新後の前記光源の光波長が所定の境界値を超えるか否かをチェックし分岐するするようにデジタル画像処理装置１４０はモジュール構成されている。このモジュールが実行されると処理は越えるときルックアップテーブル作成ステップへ進み、超えないとき波長初期化ステップ へ分岐し更新後の光波長で初期化する。
＜ルックアップテーブル作成ステップＳ３３８＞
　　これに引き続き、マイクロLED検査部１００において、メモリ４１に格納された複数の波長と光強度の比の組からルックアップテーブル１０９を作成し、これをメモリ４１に格納するようにデジタル画像処理装置１４０はモジュール構成されている。このモジュールが実行されるとルックアップテーブル１０９が完成し処理は終了する。そして、上記の通り、マイクロLEDと同一のジオメトリで配設されている反射体が多数存在してもルックアップテーブル１０９を自動生成可能なマイクロLED発光検査装置１に用いる光学フィルタの検査装置１０１が提供される。Regarding the mechanism in which the lookup table 109 is configured in one embodiment of the optical filter inspection device 101 used in the micro LED emission inspection device 1 configured in this way, a schematic drawing of the flowchart S300 of the control flow across the components. This will be described with reference to FIG. The optical filter inspection device 101 used in the micro LED emission inspection device 1 is provided with a variable wavelength light source 106 having a known optical wavelength, which is capable of communicating via the control unit 71 and the transmission unit 72, as a light source. It is provided to irradiate the reflector 102. As shown in FIG. 12, the optical filter inspection device 101 used in the micro LED emission inspection device 1 configured here has a control device 170 for managing the control flow for controlling the components of the optical filter inspection device 101. The control unit 171 is provided with a CPU 86 and a memory 87 to be used, and the control unit 171 can transmit a control signal to the filter driving device and the optical wavelength variable mechanism 116 via the transmission unit 172 and the transmission path 88. A communication path 89 is provided between the control device 170 and the digital image processing device 140 and the filter driving device 60 so that the communication device 89 and the filter driving device 60 can be integrally controlled. The optical filter inspection apparatus 101 is configured to be capable of automatic operation. The following is a detailed description of a mechanism for performing an optical filter inspection by batch processing using a large number of reflector light sources modeled on a micro LED by automatic operation.
<Light wavelength initialization step S321>
With the start of the processing of the control unit 171 of the control device 170, the control proceeds to the optical wavelength initialization step so that the variable mechanism 116 updates the set value of the optical wavelength of the light source 106 to the initial value and the transmission unit 172 and the transmission line. The control unit 171 is modularized so that a control signal can be transmitted to the variable mechanism 116 via 88. After transmission, control moves to the calibration light source lighting step.
<Calibration light source lighting step S322>
The optical filter inspection device 101 is modularized so that the calibration light source 106 is remotely turned on. When the calibration light source lighting step is executed, the control continues, and the module module of the filter movement instruction step, which is configured in the control unit 171, is activated. After the module is executed, the process proceeds to the first filter movement instruction step.
<First filter movement instruction step S323>
Then, control is passed to the first filter movement instruction step, and in this step, the control unit 171 generates a signal for selecting the status where the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter drive mechanism 60 via the transmission path 88, and then the control unit 171 is modularized so as to immediately wait for the start instruction notification of the first imaging, and the module processing is immediately performed for the first imaging. Transition to the start instruction notification waiting state.
<First filter moving step S324>
As soon as the filter driving mechanism 60 receives a signal for selecting a status that the optical filter 50 does not exist in the optical path 21 via the transmission path 88 between the filter driving mechanism 60 and the control device 170, the optical filter 50 is removed from the optical path 21. It is configured to perform the first filter movement step of removing.
<First imaging start instruction step S325>
When the control unit 171 of the control device 170 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification, which is the final process of the first filter movement instruction step, the control unit 171 immediately causes the first imaging start instruction notification to be received. An imaging start instruction signal is generated. The notification of the start instruction of the first image capturing may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 171 receives the status signal after the first filter moving step is completed, for example. The timer may be configured to be driven in the control unit 171 so that the first imaging start instruction notification is generated when the time elapses. In this case, a timer event is generated after the lapse of a predetermined time, and the control unit 171 is notified of the notification instruction to start the first imaging. When the control is returned to the control unit 171, the control unit 171 is configured to wait for the second filter movement instruction after transmitting the first imaging start instruction signal to the image processing apparatus 140 via the communication path 89. ing. After the execution of the module that activates the first imaging start instruction step, the processing of the module transits to the second filter movement instruction waiting state.
<First imaging step S326>
When the digital image processing apparatus receives the first image capturing start instruction signal from the control unit 171 via the communication path 89, the digital image processing apparatus receives the video signal from the image capturing apparatus 30 and stores the image data frame stored in the digital image processing apparatus 140. It is modularized to generate a light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map on 42, and to store this in the memory 41 in the digital image processing device 140. After the operation of the module, control is subsequently passed to the processing of the unit image body identifying unit 81.
<Light intensity measurement step without filter S327>
Subsequently, in the unit image body identifying unit 81, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the reflected light of the calibration light source is specified based on a predetermined criterion. Further, the digital image processing device 140 is modularly configured so as to generate unit image body mapping data to a pixel map and store the data in the memory 41 in the digital image processing device 140. Subsequent to the module processing of the unit image body identification unit 81, the reflector mapping is regarded as the micro LED mapping data 4444, and the micro LED identification unit 90 pixel map the micro LED regarded as the reflector mapping from the unit image body 80. The digital image processing device 140 is modularly configured so as to generate the micro LED mapping data 44 by performing the above mapping and store the micro LED mapping data 44 in the memory 41. Then, the light energy intensity of the micro LED 2 is determined from the light intensity on the light intensity map 45 on the micro LED map 44 by a predetermined light energy intensity calculation formula, and the reflected light of the reflector 102 regarded as the light emission of the micro LED is determined. The digital image processing device 140 is modularly configured to store the light energy intensity value in the arrangement without the optical filter in the memory 41 in the digital image processing device 140. When the module for measuring the unfiltered light intensity is executed, the control device 170 is subsequently configured to be controlled to execute the process for measuring the filtered light intensity.
<Second filter movement instruction step S328>
When the control unit 171 waiting for the second filter movement instruction receives the second filter movement instruction, the control unit 171 generates a signal for disposing the optical filter 50 in the optical path 21 based on the instruction, and transmits the signal via the transmission path 88. It is modularly configured to send the signal to the filter drive mechanism 60. After execution of the module, the module is configured so as to wait for the second imaging start instruction, and the module enters the control unit waiting state.
<Second filter moving step S329>
The filter driving mechanism 60 receives a signal for arranging the optical filter 50 in the optical path 21 from the control unit 171 via the transmission path 88, and the filter driving mechanism 60 is modularly configured so as to arrange the optical filter 50 in the optical path 21. There is.
<Second imaging start instruction step S330>
The control unit 171 generates a second image capturing start instruction signal when accepting the second image capturing start instruction notification in the second image capturing start instruction waiting state, which is the final process of the second filter movement instruction step, and then performs communication. The module is configured to transmit a second imaging start instruction signal to the digital image processing apparatus 140 via the path 89. Regarding the notification of the start instruction of the second image capturing, for example, the filter driving mechanism 60 may transmit the status signal after the second filter moving step ends, and the control unit 171 may receive the status signal. The timer may be configured to be driven in the control unit 171 so that the second imaging start instruction notification is generated when a predetermined time has elapsed. After the module operates, the processing of the control unit 171 becomes idle and waits for the next task.
<Second imaging step S331>
When the digital image processing device 140 receives the second imaging start instruction signal via the communication path 89, the digital image processing device 140 receives the video signal from the imaging device 30, and measures the pixel map on the image data frame 42 at each pixel. The module is configured to generate a light intensity pixel map in which the target light intensity is superimposed and store the pixel map in the memory 41 in the digital image processing device 140. After the module operation, the unit image body identifying unit 81 The digital image processing device 140 is configured to proceed to the processing.
<Measurement Step S332 of Light Intensity with Filter>
In the digital image processing device 40, subsequently, in the unit image body identifying unit 81, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the calibration light source light is predetermined. Based on the criteria of, the unit image body mapping data to the pixel map is generated, stored in the memory 41 in the digital image processing device 140, and further reflected from the unit image body 80 in the micro LED identification unit 90. The digital image processing apparatus 140 is modularly configured to generate the micro LED mapping data 44 regarded as body mapping and store the micro LED mapping data 44 in the memory 41. After this module processing, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula from the light intensity on the map. The digital image processing device 140 is modularized so as to be stored in the memory 41 in the digital image processing device 140 as the light energy intensity value in the arrangement with the optical filter 50. After the module processing, control is passed to processing in the micro LED inspection unit in the digital image processing device 140.
<Ratio calculation of light intensity without filter and light intensity with filter S333>
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 140, and the calibration in the arrangement with the optical filter 50 is performed. The digital image processing apparatus 140 has a module configuration so as to calculate the ratio of the light intensity without a filter and the light intensity with a filter based on the light energy intensity value of the light reflected from the light source and the light energy intensity value of the arrangement without the optical filter 50. Has been done. When this module is executed, the process goes to the emission wavelength calculation step.
<Emission wavelength calculation step S334>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 40 is module-configured so that the emission wavelength of the micro LED is determined by a predetermined emission wavelength calculation formula of the micro LED. When this module is executed, the process goes to the light source wavelength and light intensity ratio recording step.
<Light source wavelength and light intensity ratio recording step S335>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 140 is configured as a module so as to store the known ratio of the light source wavelength and the light intensity in the memory 41. When this module is executed, the process proceeds to the light source wavelength update step.
<Light source wavelength updating step S336>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 140 is modularly configured to update the set value of the light wavelength of the light source with a predetermined increment value. When this module is executed, the process proceeds to a determination step of determining a look-up table completion condition.
<Completion determination step S337>
The digital image processing device 140 is modularly configured to check whether the light wavelength of the light source after updating exceeds a predetermined boundary value and branch the light. When this module is executed, the process proceeds to the look-up table creation step when it exceeds, and branches to the wavelength initialization step when it does not exceed and initializes with the updated optical wavelength.
<Lookup table creation step S338>
Subsequent to this, in the micro LED inspection unit 100, a lookup table 109 is created from a set of a plurality of wavelength-light intensity ratios stored in the memory 41, and the digital image processing device 140 is configured to store the lookup table 109 in the memory 41. Is modular. When this module is executed, the lookup table 109 is completed and the processing ends. Then, as described above, the optical filter inspection device 101 used in the micro LED emission inspection device 1 that can automatically generate the lookup table 109 even if there are many reflectors arranged in the same geometry as the micro LED. Provided.
　以上の一実施形態及びその変形形態に記載されたマイクロLED発光検査装置１に用いる光学フィルタの検査装置１０１は、ここに記載されたいずれの実施形態及びその変形形態のいずれもマイクロLED発光検査装置１と親和性の高いキャリブレーション操作がマイクロLED発光検査装置１による検査と一体に実施できる利点があるので、光学フィルタ検査装置１０１は、マイクロLED発光検査装置１に組み込むとよい。このような一体化によって、部品の重複配置を避けることができ、より低コストの装置配置が可能となるし、必要に応じ、随時キャリブレーションを実施可能であり、ルックアップテーブル１０９の作成更新も比較的頻繁に行うことが可能であり、かつ、マイクロLED２測定と同一の環境でのキャリブレーションを実施可能とし、検査精度の向上が期待できる利点がある。The optical filter inspection device 101 used in the micro LED light emission inspection device 1 described in the above-described one embodiment and its modification is a micro LED light emission inspection device in any of the embodiments and its modifications described herein. Since the calibration operation having a high affinity with 1 can be performed integrally with the inspection by the micro LED light emission inspection device 1, the optical filter inspection device 101 may be incorporated into the micro LED light emission inspection device 1. By such integration, overlapping arrangement of parts can be avoided, lower-cost device arrangement can be performed, calibration can be performed at any time as necessary, and lookup table 109 can be created and updated. There is an advantage that the measurement can be performed relatively frequently, and the calibration can be performed in the same environment as the measurement of the micro LED 2, and the improvement of the inspection accuracy can be expected.
　加えて、マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の一態様では、光フィルタ５０の特性のキャリブレーションのために個別に分離されるべき１００μm角以下の大きさの矩形領域内を占めるマイクロLED２がアレイ状に配列されて表面に形成された半導体サブストレート３の代わりに、アレイ状に配列されることとなる検査対象のマイクロLEDの設計条件と少なくとも所定の領域でほぼ同一数の反射体１０２（以下で反射体アレイ１０２ともいう）が表面に形成されたサブストレート１０３がマイクロLED発光検査装置１の半導体サブストレート３に相当する位置に装着され、アレイ状に配列された物同士の様々な光度干渉もほぼ同様の条件でキャリブレーションできるという利点が提供され、さらに、精度の高い測定が期待できる。
マイクロLED２測定と同一の環境でのキャリブレーションを実施可能とし、検査精度の向上が期待できる利点がある。In addition, in one mode of the optical filter inspection device 101 used in the micro LED emission inspection device 1, it occupies a rectangular area having a size of 100 μm square or less that should be individually separated for calibration of the characteristics of the optical filter 50. Instead of the semiconductor substrate 3 formed on the surface by arranging the micro LEDs 2 in an array, the design conditions of the micro LEDs to be inspected to be arrayed are almost equal to the number of reflections in at least a predetermined area. A substrate 103 having a body 102 (hereinafter also referred to as a reflector array 102) formed on the surface thereof is attached to a position corresponding to the semiconductor substrate 3 of the micro LED light emission inspection device 1, and the objects arranged in an array are It provides the advantage that various light interference can be calibrated under almost the same conditions, and more accurate measurement can be expected.
There is an advantage that calibration can be performed in the same environment as micro LED2 measurement, and improvement of inspection accuracy can be expected.
　反射体１０２は、好ましく金属膜なら成り、クロムを主成分とする金属からなる反射体であるとよい。The reflector 102 is preferably made of a metal film, and is preferably made of a metal containing chromium as a main component.
　光投射機構１０４は、反射体１０２の反射光光路上に光学レンズ２０と反射体１０２との間にハーフミラーを配設するとよい。投射光光路と反射体１０２の反射光光路とをオーバラップできるため、よりコンパクトな装置構成が実現可能とされる効果がある。光誘導機構１０５には、光ファイバーを用いるとよい。波長可変光源１０６の配置の自由度が増し、よりコンパクトな装置構成が実現可能となる効果がある。The light projection mechanism 104 is preferably provided with a half mirror between the optical lens 20 and the reflector 102 on the reflected light optical path of the reflector 102. Since the projected light path and the reflected light path of the reflector 102 can be overlapped with each other, there is an effect that a more compact device configuration can be realized. An optical fiber may be used for the light guiding mechanism 105. The degree of freedom in arranging the wavelength tunable light source 106 is increased, and a more compact device configuration can be realized.
　＜マイクロLED発光検査装置１の他の実施形態＞
　上記の実施態様で、フィルタの移動制御は、制御装置７０によって行なったが、必ずしも制御装置７０によらずとも、制御装置７０から独立した制御によって実行されてもよく、また、制御装置７０とデジタル画像処理装置４０は、一体に構成された制御装置４７であってもよいが、上記のように制御に連携が取れるのが好ましい。<Other Embodiments of Micro LED Luminous Inspection Device 1>
In the above-described embodiment, the movement control of the filter is performed by the control device 70, but may be performed by the control independent of the control device 70, not necessarily by the control device 70. The image processing device 40 may be the control device 47 integrally configured, but it is preferable that the control can be coordinated as described above.
　マイクロLED発光検査装置１のキャリブレーションに関し、さらなる変形実施形態で、マイクロLED発光検査装置１は、図１４の物理構成図に示されるように参照発光体６を光学レンズ２０の視野内に入るように配置し、フィルタ特性のキャリブレーションのための既知の発光波長の光を参照光として配設可能であればよい。この実施形態では、デジタル画像処理装置４０は参照発光体が提供する光強度によってキャリブレーション可能となり、マイクロLED発光検査装置９で閉じた形でフィルタをフィルタ駆動機構６０から取り外さなくても随時フィルタ特性のキャリブレーション可能という利点がある。Regarding the calibration of the micro LED light emission inspection device 1, in a further modified embodiment, the micro LED light emission inspection device 1 moves the reference light emitter 6 into the visual field of the optical lens 20 as shown in the physical configuration diagram of FIG. 14. It suffices that light having a known emission wavelength for calibrating the filter characteristics can be arranged as the reference light. In this embodiment, the digital image processing apparatus 40 can be calibrated by the light intensity provided by the reference illuminant, and the filter characteristics can be obtained at any time without removing the filter from the filter drive mechanism 60 in a closed form by the micro LED emission inspection apparatus 9. The advantage is that calibration is possible.
　マイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１のキャリブレーションは、さらなる変形実施形態では、光学フィルタ検査装置１０１は、図１４と同様に参照発光体６を光学レンズ２０の視野内に入るように配置し、フィルタ特性のキャリブレーションのための既知の発光波長の光を参照光として配設可能であればよい。この実施形態では、デジタル画像処理装置４０は参照発光体が提供する光強度によってキャリブレーション可能となり、光学フィルタ検査装置１０１で閉じた形でフィルタをフィルタ駆動機構６０から取り外さなくても随時フィルタ特性のキャリブレーション可能という利点がある。
　同様に、追加のマイクロLED発光検査装置１の変形実施態様では、図１５の物理構成図に示されるようにマイクロLED発光検査装置１のデジタル画像処理装置４０は、参照発光体の光強度モニタリングのための光センサ７をさらに備え、デジタル画像処理装置４０は、光センサの信号出力を受入れ、光センサ７の光強度モニタ値によって正規化された参照発光体の段階的光強度を用いキャリブレーションを補正可能とされている。この構成では、複数のマイクロLED発光検査装置１の測定の統一的な運用を可能とし、あるいは、正規化によって輝度の測定等絶対的な測定基準を導入可能となる利点がある。The calibration of the optical filter inspection device 101 used in the micro LED emission inspection device 1 is performed in a further modified embodiment so that the optical filter inspection device 101 brings the reference light emitter 6 into the field of view of the optical lens 20 as in FIG. It suffices that light having a known emission wavelength for calibrating the filter characteristics can be arranged as the reference light. In this embodiment, the digital image processing device 40 can be calibrated by the light intensity provided by the reference light emitter, and the filter characteristics can be changed at any time without removing the filter from the filter driving mechanism 60 in the closed form by the optical filter inspection device 101. It has the advantage that it can be calibrated.
Similarly, in an additional modified embodiment of the micro LED light emission inspection device 1, as shown in the physical configuration diagram of FIG. 15, the digital image processing device 40 of the micro LED light emission inspection device 1 is for monitoring the light intensity of the reference light emitter. Further, the digital image processing device 40 receives the signal output of the optical sensor, and performs calibration using the stepwise light intensity of the reference light emitter normalized by the light intensity monitor value of the optical sensor 7. It can be corrected. With this configuration, there is an advantage that the measurement of the plurality of micro LED light emission inspection devices 1 can be uniformly operated, or an absolute measurement standard such as the measurement of luminance can be introduced by normalization.
　さらに、追加のマイクロLED発光検査装置１に用いる光学フィルタ検査装置１０１の変形実施態様では、図１５と同様に光学フィルタ検査装置１０１のデジタル画像処理装置４０は、参照発光体の光強度モニタリングのための光センサ７をさらに備え、デジタル画像処理装置４０は、光センサの信号出力を受入れ、光センサ７の光強度モニタ値によって正規化された参照発光体の段階的光強度を用いキャリブレーションを補正可能とされている。この構成では、複数の光学フィルタ検査装置１０１の測定の統一的な運用を可能とし、あるいは、正規化によって輝度の測定等絶対的な測定基準を導入可能となる利点がある。Furthermore, in a modified embodiment of the optical filter inspection device 101 used for the additional micro LED emission inspection device 1, the digital image processing device 40 of the optical filter inspection device 101 is the same as in FIG. 15 for monitoring the light intensity of the reference light emitter. The digital image processing apparatus 40 further includes the optical sensor 7 of the above, receives the signal output of the optical sensor, and corrects the calibration using the stepwise optical intensity of the reference illuminant normalized by the optical intensity monitor value of the optical sensor 7. It is possible. With this configuration, there is an advantage that the measurement of the plurality of optical filter inspection apparatuses 101 can be unified, or an absolute measurement standard such as the measurement of luminance can be introduced by normalization.
　さらなるマイクロLED発光検査装置１の変形実施形態では、図１６の物理構成図に示されるように、制御装置７０は、フィルタ駆動機構６０で生成されるステータス信号の受信部７３をさらに含むように構成されている。制御装置７０は、フィルタ駆動機構６０で生成される光学フィルタ５０の配置変更の進行状態をモニタリング可能とされるステータス信号を受信部７３を介して受信し、好適なタイミングでフィルタ駆動機構６０に対して光学フィルタ５０無しの選択を指示する制御信号を生成可能に構成され、これをフィルタ駆動機構６０に送信可能に構成されている。一方、制御装置７０は、デジタル画像処理装置４０に対して光学フィルター５０無の配置における光エネルギ強度値の測定開始を指示する制御信号を生成可能に構成され、これを制御信号送信部７２を介し前記デジタル画像処理装置へ送信可能に構成されている。さらに、デジタル画像処理装置４０は、マイクロLEDマッピングデータ４４上で異常値を示すマイクロLED２をマイクロLED２不良品と識別し、マイクロLED２製品から除外するための不良品フラグデータを保持するマイクロLED不良品判定部１３００が構成されている。上記のように構成されたマイクロLED発光検査装置１の作用効果は以下である。制御装置７０の制御部７１は、ステータス信号をフィルタ駆動機構６０から受信後又は検査開始の指示を受け入れると、引き続いてデジタル画像処理装置４０へ光学フィルター５０無しの配置における光エネルギ強度値の測定開始を指示する制御信号を生成し、これを制御信号送信部７２を介しデジタル画像処理装置４０へ送信する。光学フィルター５０無しの配置における光エネルギ強度値の測定開始を指示する制御信号を受け入れるとデジタル画像処理装置４０は、画像データ信号を受け入れ、デジタル画像処理装置４０は上記同様に、マイクロLEDマッピングデータ４４を生成する。デジタル画像処理装置４０は、さらに、マイクロLEDマッピングデータ４４上で異常値を示すマイクロLEDをマイクロLED不良品と識別し、マイクロLEDマッピングデータ４４上でマイクロLED製品から除外するようにフラグを立てこのフラグデータを識別し保管する。異常判定は、所定の下限光度値以下を示すマイクロLED又は所定の上限光度以上を示すマイクロLEDの上限及下限値をしきい値とする判定上限がよい。これらの上限光度、下限光度は一群のマイクロLEDの光度の段階的位置づけから決定されてもよく、相対的な評価によって異常値を判定することが、画像データフレーム４２からの一括処理によって実現できるところに本発明の有利な効果が見出される。In a further modified embodiment of the micro LED light emission inspection device 1, as shown in the physical configuration diagram of FIG. 16, the control device 70 is configured to further include a receiving unit 73 of the status signal generated by the filter driving mechanism 60. Has been done. The control device 70 receives a status signal, which is generated by the filter driving mechanism 60 and is capable of monitoring the progress of the arrangement change of the optical filter 50, via the receiving unit 73, and instructs the filter driving mechanism 60 at a suitable timing. It is configured to be able to generate a control signal instructing the selection without the optical filter 50, and to be able to transmit this to the filter driving mechanism 60. On the other hand, the control device 70 is configured to be capable of generating a control signal for instructing the digital image processing device 40 to start measurement of the light energy intensity value in the arrangement without the optical filter 50, which is transmitted via the control signal transmission section 72. It is configured to be transmittable to the digital image processing device. Further, the digital image processing device 40 identifies the micro LED 2 indicating an abnormal value on the micro LED mapping data 44 as a micro LED 2 defective product, and holds a defective product flag data for excluding it from the micro LED 2 product. The determination unit 1300 is configured. The effects of the micro LED light emission inspection device 1 configured as described above are as follows. When the control unit 71 of the control device 70 receives the status signal from the filter drive mechanism 60 or receives an instruction to start the inspection, the control unit 71 subsequently starts measuring the optical energy intensity value in the digital image processing device 40 in the arrangement without the optical filter 50. A control signal for instructing is generated and transmitted to the digital image processing apparatus 40 via the control signal transmission unit 72. When the digital image processing device 40 receives the image data signal upon receiving the control signal instructing to start the measurement of the light energy intensity value in the arrangement without the optical filter 50, the digital image processing device 40 receives the micro LED mapping data 44 in the same manner as above. To generate. The digital image processing device 40 further identifies the micro LED showing an abnormal value on the micro LED mapping data 44 as a micro LED defective product, and sets a flag on the micro LED mapping data 44 to exclude it from the micro LED product. Identify and store flag data. The upper limit and the lower limit of the micro LED showing a predetermined lower limit luminous intensity value or less or the micro LED showing a predetermined upper limit luminous intensity or more are threshold values for the abnormality determination. The upper limit luminous intensity and the lower limit luminous intensity may be determined from the stepwise positioning of the luminous intensity of a group of micro LEDs, and it is possible to determine an abnormal value by relative evaluation by batch processing from the image data frame 42. The advantageous effects of the present invention can be found.
　前記マイクロLED発光検査装置１のさらなる変形実施態様では、図１７の物理構成図に示されるように前記デジタル画像処理装置は、前記マイクロLEDの配列設計データ入力のための外部接続路及びデータ入力部１４０を含み、前記外部接続路を介して前記データ入力部から前記アレイ状に配列されたマイクロLEDの配列設計データを受入れ可能であり、前記デジタル画像処理装置内の前記メモリへ、前記アレイ状に配列されたマイクロLEDの配列設計データが格納され、前記マイクロLED不良品データと前記マイクロLEDの配列設計データとを照合し、正常マイクロLEDのアレイ状の配列の端部を認識しこれをもって製品に適合なマイクロLEDマップ範囲を更新可能であるマイクロLEDマップ境界判定部１３０は、その後の処理の正確性の向上に有利な効果を発揮する。In a further modified embodiment of the micro LED light emission inspection device 1, as shown in the physical configuration diagram of FIG. 17, the digital image processing device includes an external connection path and a data input section for inputting array design data of the micro LED. It is possible to receive the array design data of the micro LEDs arranged in the array from the data input unit via the external connection path including 140, and to the memory in the digital image processing apparatus in the array. The array design data of the arrayed micro LED is stored, the micro LED defective product data is collated with the micro LED array design data, and the end of the array array of the normal micro LED is recognized and this is used as a product. The micro LED map boundary determination unit 130 capable of updating the suitable micro LED map range exerts an advantageous effect in improving the accuracy of the subsequent processing.
　さらに、追加のマイクロLED発光検査装置１の変形実施態様では、マイクロLED発光検査装置１のデジタル画像処理装置４０は、図１８に示されているように映像表示装置９２をさらに備え、図１９の範疇グラフに示されるように複数のマイクロLEDの光強度特性と発光波長の二次元マップ９３を生成し、前記映像表示装置９２に表示するように構成されている。光強度特性と発光波長の二次元マップは、マイクロLEDを多次元分析にするに適する手段であり、これによってより詳細にマイクロLEDの発光特性を把握可能となる。Furthermore, in an additional modified embodiment of the micro LED light emission inspection device 1, the digital image processing device 40 of the micro LED light emission inspection device 1 further includes an image display device 92 as shown in FIG. As shown in the category graph, a two-dimensional map 93 of the light intensity characteristics and emission wavelengths of a plurality of micro LEDs is generated and displayed on the image display device 92. The two-dimensional map of the light intensity characteristic and the emission wavelength is a suitable means for performing multidimensional analysis of the micro LED, which enables the emission characteristic of the micro LED to be grasped in more detail.
　[第２実施形態]
　図２０には、本発明に係るマイクロLED発光検査装置５００の第２の実施形態の物理構成図を示す。マイクロLED発光検査装置５００はフィルタ光軸傾斜角駆動機構６５をさらに備える。フィルタ光軸傾斜角駆動機構６５は、光路２１の光軸に対する前記光学フィルタの傾斜を制御するための傾斜角制御信号の受信部を含む。所定の光波長帯域を有する光学フィルタ５１は、所定の波長範囲の中心値よりも長い波長をフィルター透過率の半値として作成された誘電体薄膜光学フィルター５１である。フィルタ光軸傾斜角駆動機構６５は、光軸方向に対して光学フィルターの傾斜角を調整可能とするように構成されている。[Second Embodiment]
FIG. 20 shows a physical configuration diagram of the second embodiment of the micro LED light emission inspection device 500 according to the present invention. The micro LED light emission inspection device 500 further includes a filter optical axis tilt angle drive mechanism 65. The filter optical axis tilt angle drive mechanism 65 includes a receiving unit of a tilt angle control signal for controlling the tilt of the optical filter with respect to the optical axis of the optical path 21. The optical filter 51 having a predetermined optical wavelength band is a dielectric thin-film optical filter 51 created with a wavelength longer than the center value of a predetermined wavelength range as a half value of the filter transmittance. The filter optical axis tilt angle drive mechanism 65 is configured to be able to adjust the tilt angle of the optical filter with respect to the optical axis direction.
　さらに、第２の実施形態の変形実施形態では、マイクロLED発光検査装置５００の制御装置７０の制御部７１はフィルタ駆動機構６０に対して所定の光透過波長帯域の中心値よりも長い波長をフィルター透過率の半値として作成された薄膜光学フィルターの選択を指示する制御信号を生成可能に構成されている。波長可変光源１０６は波長可変機構１１６を介し、フィルタ駆動機構６０及びフィルタ光軸傾斜角駆動機構６５は受信部を介して制御装置７０と第１の通信ネットワーク５０１を経由して双方向通信可能に構成されている。制御装置７０とデジタル画像処理装置４０との間とは第２の通信ネットワーク５０２を介して双方向通信可能に構成されている。制御装置７０はデジタル画像処理装置４０から第２の通信ネットワーク５０２を介して所定の単位映像体８０の光強度を取得可能に構成されている。制御装置７０の制御部７１は傾斜角制御信号を生成可能であり、第１の通信ネットワーク５０１を介してこれをフィルタ光軸傾斜角駆動機構６５へ送信可能に構成されている。光軸方向に対して誘電体薄膜光学フィルタ５１の前記傾斜角が前記所定の波長範囲の中心値にフィルター透過率の半値との差異が所定のしきい値内に収まるように傾斜角が構成可能である。このように構成されたマイクロLED発光検査装置５００の機能構成図を図１６に示す。Further, in the modified embodiment of the second embodiment, the control unit 71 of the control device 70 of the micro LED light emission inspection device 500 filters the wavelengths longer than the center value of the predetermined light transmission wavelength band with respect to the filter driving mechanism 60. It is configured to be able to generate a control signal for instructing selection of a thin film optical filter created as a half value of transmittance. The wavelength tunable light source 106 enables bidirectional communication through the wavelength tunable mechanism 116, and the filter driving mechanism 60 and the filter optical axis tilt angle driving mechanism 65 perform bidirectional communication with the control device 70 through the receiving unit and the first communication network 501. It is configured. The control device 70 and the digital image processing device 40 are configured to be capable of bidirectional communication via the second communication network 502. The control device 70 is configured to be able to acquire the light intensity of a predetermined unit image body 80 from the digital image processing device 40 via the second communication network 502. The control unit 71 of the control device 70 can generate an inclination angle control signal, and is configured to be able to transmit this to the filter optical axis inclination angle drive mechanism 65 via the first communication network 501. The tilt angle of the dielectric thin film optical filter 51 with respect to the optical axis direction can be configured so that the difference between the center value of the predetermined wavelength range and the half value of the filter transmittance falls within a predetermined threshold value. Is. FIG. 16 shows a functional configuration diagram of the micro LED light emission inspection device 500 configured in this way.
　誘電体薄膜光学フィルターは、光路に対して角度を傾けることで遮断波長が変化することが知られている。その波長変化は、光路に垂直な状態を０°として、角度が増加すると遮断波長は短くなる方向へ移動する。この性質を利用し、上記構成のマイクロLED発光検査装置５００おいて、フィルタ光軸傾斜角駆動機構６５によって、膜光学フィルターを傾けると、薄膜光学フィルターの急峻な波長透過特性を利用してフィルターの特性のばらつきを補正するために、フィルターを光路に対して適宜傾けることによってフィルターの半減値を制御し、目的の波長計測範囲の中間に半値設定が可能となり、精度が高く直線性の良い波長計測を可能とする有利な効果が提供される。後に掲げる図２７は、フィルタ光軸傾斜角を光軸に直角から２０°傾けると半値が右方向へ移動する例を示す。傾き角を直角から２０°の間に設定すれば、半値を与える波長も按分されて移動するという傾き角と半値を与える波長は連続的な関係にある。したがって、傾き角を制御すれば、６３０ｎｍから６５０ｎｍの範囲でフィルタ半値波長の制御が可能である。It is known that the cutoff wavelength of a dielectric thin film optical filter changes by tilting the angle with respect to the optical path. With respect to the wavelength change, the state perpendicular to the optical path is 0°, and the cutoff wavelength moves in the direction of shortening as the angle increases. Taking advantage of this property, in the micro LED light emission inspection device 500 having the above configuration, when the film optical filter is tilted by the filter optical axis tilt angle drive mechanism 65, the steep wavelength transmission characteristic of the thin film optical filter is used to filter the film. In order to correct the characteristic variation, the filter half-value can be controlled by tilting the filter appropriately with respect to the optical path, and the half value can be set in the middle of the target wavelength measurement range, providing highly accurate and linear wavelength measurement. An advantageous effect is provided that enables FIG. 27, which will be shown later, shows an example in which the half value moves to the right when the filter optical axis tilt angle is tilted by 20 ° from a right angle to the optical axis. If the tilt angle is set between a right angle and 20°, the wavelength giving a half value moves proportionally, and the tilt angle and the wavelength giving a half value have a continuous relationship. Therefore, if the tilt angle is controlled, the filter half-value wavelength can be controlled in the range of 630 nm to 650 nm.
　図２０に示されたマイクロLED発光検査装置５００の動作を制御フローのフローチャートＳ５００を構成要素を跨って描かれたフローチャートＳ５００の模式図２２を参照しながら説明する。
＜光波長の中心波長設定ステップ Ｓ５２１＞
　制御装置７０の制御部７１の処理の開始とともに、制御は、光波長の中心波長設定ステップ に渡り、波長可変機構１１６によって波長可変光源１０６の光波長の設定値を光波長の中心波長に更新するように通信部７４と第１の通信ネットワーク５０１を介して波長可変機構１１６へ制御信号を送信可能に、制御部７１はモジュール構成されている。送信後、制御はキャリブレーション光源点灯ステップへ移る。
＜中心波長光源点灯ステップ Ｓ５２２＞
　マイクロLED発光検査装置５００は波長可変光源１０６が遠隔点灯されるようにモジュール構成されている。中心波長光源点灯点灯ステップが実行されると制御は続いて、制御部７１内に構成されているフィルタ移動指示ステップの構成モジュールが起動される。
＜第１のフィルタ移動指示ステップＳ５２３＞
　引続き最初のフィルタ移動指示ステップへ制御が渡され、このステップでは光フィルタ５０が光路２１に存在しないステータスを選択する信号が制御部７１によって生成される。さらに伝送路８８を介して信号はフィルタ駆動機構６０へ送信され、その後制御部７１は直ちに最初の撮像の開始指示通知待ちとなるようにモジュール構成され、このまま、当該モジュール処理は直ちに最初の撮像の開始指示通知待ち状態に遷移する。
＜第１のフィルタ移動ステップＳ５２４＞
　フィルタ駆動機構６０はフィルタ駆動機構６０と制御装置７０の間の第１の通信ネットワーク５０１を介して光フィルタ５０が光路２１に存在しないステータスを選択するための信号を受入れると直ちに、光学フィルタ５０を光路２１から外す最初のフィルタ移動ステップを実行するように構成されている。
＜第１の撮像の開始指示ステップＳ５２５＞
　制御装置７０の制御部７１は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、直ちに制御部７１は第１の撮像の開始指示信号を生成する。最初の撮像の開始指示通知は、例えば、最初のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部７１が受信するように構成されてもよいが、その他、所定の時間が経過すれば最初の撮像の開始指示通知を生成するように、制御部７１内でタイマーを駆動するように構成されていてもよい。この場合には、所定の時間経過後にタイマーイベントが生成され最初の撮像の開始指示通知が制御部７１に通知される。制御部７１に制御が戻ると、制御部７１は第２の通信ネットワーク５０２を介してデジタル画像処理装置４０へ第１の撮像の開始指示信号を送信した後に、第２のフィルタ移動指示待ちとなるように構成されている。第１の撮像の開始指示ステップを起動するモジュールの実行後、当該モジュールの処理は第２のフィルタ移動指示待ち状態へ遷移する。
＜第１の撮像ステップＳ５２６＞
　デジタル画像処理装置は、第２の通信ネットワーク５０２を介して第１の撮像の開始指示信号を制御部７１から受信すると、撮像装置３０から映像信号を受け入れ、デジタル画像処理装置４０内に格納される画像データフレーム４２上のピクセルマップへ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置内の前記メモリに格納するようにモジュール構成されており、当該モジュールの動作後には、引き続いて単位映像体識別部８１の処理に制御が渡る。
＜フィルタ無し光強度測定ステップＳ５２７＞
　引き続き、単位映像体識別部８１において、光強度ピクセルマップからキャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップへの単位映像体マッピングデータを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納するように、デジタル画像処理装置４０はモジュール構成されている。単位映像体識別部８１のモジュール処理に引き続いて、キャリブレーション光源マッピングをマイクロLEDマッピングとみなし、マイクロLED識別部９０において、単位映像体８０から前記キャリブレーション光源マッピングとみなされたマイクロLEDをピクセルマップ上にマッピングしマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。続いてマイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの発光とみなされたキャリブレーション光源の光学フィルター無の配置における前記光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。フィルタ無し光強度を測定するモジュールが実行されると、引き続き、制御装置７０は、フィルタ無し光強度を測定する処理を実行制御されるように構成されている。
＜第２のフィルタ移動指示ステップＳ５２８＞
　第２のフィルタ移動指示待ちとなっていた制御部７１は、第２のフィルタ移動指示を受け入れると、当該指示に基づき所定の波長範囲の中心値よりも長い波長をフィルター透過率の半値として作成された薄膜光学フィルターの選択を指示するように薄膜光学フィルタ５１を光路２１に配設する信号を生成し、第１の通信ネットワーク５０１を介しフィルタ駆動機構６０へ当該信号を送信するようにモジュール構成されている。当該モジュール実行後には、当該モジュールは第２の撮像開始指示待ちとなるようにモジュール構成されており、制御部待ち状態となる。
＜第２のフィルタ移動ステップＳ５２９＞
　フィルタ駆動機構６０は第１の通信ネットワーク５０１を介して光学フィルタ５０を光路２１に配設する信号を制御部７１から受入れ、薄膜光学フィルタ５１を光路２１に配設するようにフィルタ駆動機構６０はモジュール構成されている。
＜後続の撮像の開始指示ステップＳ５３０＞
　制御部７１は、第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ち状態で後続の撮像の開始指示通知を受け入れると後続の撮像の開始指示信号を生成し、第２の通信ネットワーク５０２を介してデジタル画像処理装置４０へ後続の撮像の開始指示信号を送信するようにモジュール構成されている。最初の後続の撮像の開始指示通知について、例えば、第２のフィルタ移動ステップ終了後にフィルタ駆動機構６０がそのステータス信号を送信し、それを制御部７１が受信するように構成されてもよいし、その他、所定の時間が経過すれば第２番目の撮像の開始指示通知を生成するように、制御部７１内でタイマーを駆動するように構成されていてもよく、繰り返し撮像のループに入れば、フィルタ角の変動ステップから撮像の開始指示通知を受け取る。当該モジュールが動作後に、本モジュール処理はアイドルとなり、次の撮像の開始指示通知待ちとなる。
＜後続の撮像ステップＳ５３１＞
　デジタル画像処理装置４０は、第２の通信ネットワーク５０２を介して後続の撮像の開始指示信号を受信すると、撮像装置３０から映像信号を受け入れ、画像データフレーム４２上のピクセルマップへ各ピクセルで測定された段階的光強度が重畳された光強度ピクセルマップを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納するようにモジュール構成されており、このモジュール動作後には単位映像体識別部８１での処理に制御を渡す。
＜フィルタ有り光強度の測定ステップＳ５３２＞
　デジタル画像処理装置４０内では、これに引き続き、単位映像体識別部８１において、光強度ピクセルマップからキャリブレーション光源光をマイクロLEDの発光とみなし、キャリブレーション光源光の単位映像体８０を所定のクライテリアに基づき特定し、さらにピクセルマップへの単位映像体マッピングデータを生成し、これをデジタル画像処理装置４０内のメモリ４１に格納し、さらにマイクロLED識別部９０において、単位映像体からキャリブレーション光源マッピングとみなされたマイクロLEDマッピングデータ４４を生成し、これをメモリ４１に格納するようにデジタル画像処理装置４０はモジュール構成されている。このモジュール処理の後に、マイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によってマイクロLEDの光エネルギ強度を決定し、マイクロLEDの発光とみなされたキャリブレーション光源の薄膜光学フィルタ５１有りの配置における光エネルギ強度値としてデジタル画像処理装置４０内のメモリ４１に格納するように、デジタル画像処理装置４０はモジュール構成されている。当該モジュール処理後に、制御は、デジタル画像処理装置４０内でマイクロLED検査部での処理に渡される。
＜フィルタ無し光強度とフィルタ有り光強度の比計算ステップＳ３３＞
　これに引き続き、マイクロLED検査部において、キャリブレーション光源としてのマイクロLEDの光学フィルター有りの配置における光エネルギ強度値をデジタル画像処理装置４０内のメモリ４１から読み出し、薄膜光学フィルタ５１有の配置におけるキャリブレーション光源の前記光エネルギ強度値と、光学フィルター無の配置の光エネルギ強度値とによって、、フィルタ無し光強度とフィルタ有り光強度の比を計算するようにデジタル画像処理装置４０はモジュール構成されている。このモジュールが実行されると処理は、発光波長計算ステップへ渡る。
＜適正フィルタ角判定ステップ　Ｓ５３４＞
　これに引き続き、マイクロLED検査部１００において、光強度の比が所定の判定幅内で0.5の近傍か否かを所定の判定条件によって判定するようにデジタル画像処理装置４０はモジュール構成されている。光強度の比が所定の判定幅内で0.5の近傍でないとき、フィルタ角の指示ステップへ制御は分岐する。光強度の比が所定の判定幅内で0.5の近傍であるとき、フィルタ角を記録するステップ へ制御は分岐する。
＜フィルタ角の指示ステップ　Ｓ５３５＞
　フィルタ角について、所定の変動幅、例えば１°単位に増加させる指示を第２の通信ネットワーク５０２を介して制御装置７０の通信部７４を介してフィルタ光軸傾斜角駆動機構６５へ通知するようにデジタル画像処理装置４０及び制御装置７０は構成されている。このモジュールが実行されると処理は、フィルタ角の変動ステップへ渡る。
＜フィルタ角の変動ステップ　Ｓ５３６＞
フィルタ光軸傾斜角駆動機構６５のためにフィルタの角の変動ステップを駆動する信号を生成し、前記フィルタ光軸傾斜角駆動機構６５を駆動する。角度の変更完了後、後続の撮像の開始指示通知信号を生成し、デジタル画像処理装置４０へ送信する。このモジュールが実行されると処理は、デジタル画像処理装置４０の後続の撮像ステップへ進む。以後、撮像処理以降が繰り返される。
＜フィルタ角を記録するステップ　Ｓ５３７＞
　これに引き続き、マイクロLED検査部１００において、フィルタ角を前記メモリ４１に格納し、処理は終了する。
以上の構成と処理によって、所望のフィルタ性能を有するための光軸方向に対して薄膜光学フィルタ５１の傾斜角が所定の波長範囲の中心値にフィルター透過率の半値との差異が所定のしきい値内に収まる構成となる所望の傾斜角として取得され、保存され、再利用可能となる。フィルタ光軸傾斜角駆動機構６５は、例えば、ステップモータによるダイレクト駆動によるマイクロステップ制御構成であってもよいし、減速歯車機構を介してステップモータのステップ制御構成であってもよいが、変動幅は、１°程度の角度分解能で制御されるのが好ましい。The operation of the micro LED light emission inspection apparatus 500 shown in FIG. 20 will be described with reference to the flow chart S500 of the control flow with reference to the schematic diagram 22 of the flow chart S500 drawn across the components.
<Step of setting center wavelength of light wavelength S521>
With the start of the process of the control unit 71 of the control device 70, the control is updated to the central wavelength of the optical wavelength by the wavelength variable mechanism 116 over the central wavelength setting step of the optical wavelength. As described above, the control unit 71 is modularly configured to be able to transmit a control signal to the wavelength tunable mechanism 116 via the communication unit 74 and the first communication network 501. After transmission, control moves to the calibration light source lighting step.
<Center wavelength light source lighting step S522>
The micro LED light emission inspection device 500 is configured as a module so that the variable wavelength light source 106 is remotely turned on. When the central wavelength light source lighting and lighting step is executed, the control continues, and the module module of the filter movement instruction step, which is configured in the control unit 71, is activated.
<First filter movement instruction step S523>
Then, control is passed to the first filter movement instruction step, and in this step, the control unit 71 generates a signal for selecting the status in which the optical filter 50 does not exist in the optical path 21. Further, a signal is transmitted to the filter driving mechanism 60 via the transmission path 88, and then the control unit 71 is modularized so as to immediately wait for the start instruction notification of the first imaging. Transition to the start instruction notification waiting state.
<First filter moving step S524>
As soon as the filter driving mechanism 60 receives a signal via the first communication network 501 between the filter driving mechanism 60 and the controller 70 for selecting the status that the optical filter 50 does not exist in the optical path 21, the optical filter 50 is switched on. It is arranged to perform the first filter movement step out of the optical path 21.
<First imaging start instruction step S525>
When the control unit 71 of the control device 70 accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit 71 immediately receives the first imaging start instruction notification. An imaging start instruction signal is generated. The notification of the start instruction of the first imaging may be configured such that the filter driving mechanism 60 transmits the status signal and the control unit 71 receives the status signal after the completion of the first filter moving step, for example. The timer may be configured to be driven in the control unit 71 so that the first imaging start instruction notification is generated when the time elapses. In this case, a timer event is generated after a lapse of a predetermined time, and the control unit 71 is notified of the start instruction notification of the first imaging. When the control is returned to the control unit 71, the control unit 71 waits for the second filter movement instruction after transmitting the first image capturing start instruction signal to the digital image processing apparatus 40 via the second communication network 502. It is configured as follows. After the execution of the module that activates the first imaging start instruction step, the processing of the module transits to the second filter movement instruction waiting state.
<First imaging step S526>
When the digital image processing apparatus receives the first imaging start instruction signal from the control unit 71 via the second communication network 502, the digital image processing apparatus receives the video signal from the imaging apparatus 30 and stores it in the digital image processing apparatus 40. Modularly configured to generate a light intensity pixel map in which a stepwise light intensity measured at each pixel is superimposed on the pixel map on the image data frame 42 and store the pixel map in the memory in the digital image processing device. Therefore, after the operation of the module, control is passed to the process of the unit image body identifying unit 81.
<Light intensity measurement step S527 without filter>
Subsequently, in the unit image body identifying unit 81, the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map, the unit image body 80 of the calibration light source light is specified based on a predetermined criterion, and further, to the pixel map. The digital image processing device 40 is modularly configured so that the unit image body mapping data of (1) is generated and stored in the memory 41 in the digital image processing device 40. Subsequent to the module processing of the unit image body identifying unit 81, the calibration light source mapping is regarded as micro LED mapping, and in the micro LED identifying unit 90, the micro LED regarded as the calibration light source mapping from the unit image body 80 is pixel-mapped. The digital image processing device 40 is modularly configured so as to generate the micro LED mapping data 44 by mapping the above data and store the micro LED mapping data 44 in the memory 41. Next, the light energy intensity of the micro LED is determined from the light intensity on the micro LED map by the predetermined light energy intensity calculation formula, and the calibration light source regarded as the light emission of the micro LED is arranged without an optical filter. The digital image processing device 40 is modularly configured to store the light energy intensity value in the memory 41 in the digital image processing device 40. When the module for measuring the unfiltered light intensity is executed, the control device 70 is configured to be subsequently controlled to execute the process for measuring the unfiltered light intensity.
<Second filter movement instruction step S528>
When the control unit 71, which has been waiting for the second filter movement instruction, receives the second filter movement instruction, a wavelength longer than the center value of the predetermined wavelength range is created as a half value of the filter transmittance based on the instruction. The module is configured to generate a signal for disposing the thin film optical filter 51 in the optical path 21 so as to instruct the selection of the thin film optical filter, and to transmit the signal to the filter driving mechanism 60 via the first communication network 501. ing. After the execution of the module, the module is configured to wait for the second imaging start instruction, and enters the control unit waiting state.
<Second filter moving step S529>
The filter driving mechanism 60 receives a signal for arranging the optical filter 50 on the optical path 21 from the control unit 71 via the first communication network 501, and the filter driving mechanism 60 arranges the thin film optical filter 51 on the optical path 21. It is composed of modules.
<Subsequent imaging start instruction step S530>
The control unit 71 generates a start instruction signal for subsequent imaging when it receives a start instruction notification for subsequent imaging in the second imaging start instruction waiting state, which is the final process of the second filter movement instruction step, and generates a second imaging start instruction signal. The module is configured to transmit a start instruction signal for subsequent imaging to the digital image processing apparatus 40 via the communication network 502. With respect to the notification of the start instruction of the first and subsequent imaging, for example, the filter driving mechanism 60 may transmit the status signal after the end of the second filter moving step, and the control unit 71 may receive the status signal. In addition, the timer may be configured to be driven in the control unit 71 so as to generate the second imaging start instruction notification when a predetermined time has elapsed, and if a loop of repeated imaging is entered, An instruction to start imaging is received from the step of changing the filter angle. After the module operates, the processing of this module becomes idle and waits for notification of a start instruction for the next imaging.
<Subsequent imaging step S531>
When the digital image processing device 40 receives the start instruction signal for the subsequent imaging via the second communication network 502, the digital image processing device 40 receives the video signal from the imaging device 30 and measures each pixel into the pixel map on the image data frame 42. The module configuration is configured to generate a light intensity pixel map in which the stepwise light intensity is superimposed and store the pixel map in the memory 41 in the digital image processing device 40. After the module operation, the unit image body identifying unit 81 is generated. Pass control to the processing in.
<Measurement Step S532 of Light Intensity with Filter>
In the digital image processing device 40, subsequently, in the unit image body identification unit 81, the calibration light source light is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body 80 of the calibration light source light is determined according to the predetermined criteria. Based on the above, the unit image body mapping data to the pixel map is further generated, stored in the memory 41 in the digital image processing device 40, and further, in the micro LED identification unit 90, the unit image body is calibrated to the calibration light source mapping data. The digital image processing apparatus 40 is modularly configured so as to generate the micro LED mapping data 44 regarded as and store the micro LED mapping data 44 in the memory 41. After this module processing, the light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the micro LED map, and the thin film of the calibration light source regarded as the light emission of the micro LED. The digital image processing device 40 is modularly configured so as to be stored in the memory 41 in the digital image processing device 40 as the light energy intensity value in the arrangement with the optical filter 51. After the module processing, the control is passed to the processing in the micro LED inspection unit in the digital image processing device 40.
<Ratio calculation step S33 of light intensity without filter and light intensity with filter>
Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory 41 in the digital image processing device 40, and the calibration in the arrangement with the thin film optical filter 51 is performed. The digital image processing device 40 is modularly configured to calculate the ratio of the unfiltered light intensity and the filtered light intensity based on the light energy intensity value of the optical source and the light energy intensity value of the arrangement without the optical filter. There is. When this module is executed, the process goes to the emission wavelength calculation step.
<Appropriate filter angle determination step S534>
Subsequent to this, in the micro LED inspection unit 100, the digital image processing device 40 is modularized so as to determine whether or not the ratio of light intensities is near 0.5 within a predetermined determination width according to a predetermined determination condition. When the ratio of the light intensities is not near 0.5 within the predetermined judgment width, the control branches to the filter angle instruction step. When the light intensity ratio is near 0.5 within the predetermined judgment width, the control branches to the step of recording the filter angle.
<Filter angle instruction step S535>
An instruction to increase the filter angle in a predetermined fluctuation range, for example, in increments of 1° is notified to the filter optical axis tilt angle drive mechanism 65 via the communication unit 74 of the control device 70 via the second communication network 502. The digital image processing device 40 and the control device 70 are configured. When this module is executed, the process goes to the filter angle variation step.
<Filter angle fluctuation step S536>
A signal is generated for the filter optical axis tilt angle drive mechanism 65 to drive the filter angle variation step, and the filter optical axis tilt angle drive mechanism 65 is driven. After the change of the angle is completed, the start instruction notification signal for the subsequent imaging is generated and transmitted to the digital image processing apparatus 40. When this module is executed, the process proceeds to the subsequent imaging step of the digital image processing device 40. After that, the imaging process and subsequent steps are repeated.
<Step S537 of Recording Filter Angle>
Subsequent to this, the micro LED inspection unit 100 stores the filter angle in the memory 41, and the process ends.
With the above configuration and processing, the difference between the tilt angle of the thin film optical filter 51 and the half value of the filter transmittance at the center value of the predetermined wavelength range with respect to the optical axis direction for achieving the desired filter performance is the predetermined threshold. It is acquired as a desired tilt angle with a configuration that falls within the value, stored, and can be reused. The filter optical axis tilt angle drive mechanism 65 may have, for example, a micro step control configuration by direct drive by a step motor, or a step motor step control configuration via a reduction gear mechanism. Is preferably controlled with an angular resolution of about 1°.
　次に、図２３は、本発明の第１実施形態に係る発光波長検査装置の変形実施態様である発光波長検査装置６００を示す正面概略図である。同図において、発光体である検査対象基板３は、水平可動に構成されたステージ上に搭載されて電源装置１０からの電流供給を受け、表面のチップを光らせる。この検査対象基板３の表面の状態は、レンズ２０を通してカメラ３０にて撮像される。撮像された画像情報は、一体に構成された画像処理及び制御装置４７（以下で単に制御装置４７という）に入力される。制御装置４７は、フィルター駆動装置６０を制御している。色フィルター５０はフィルターホルダー５６に固定され、フィルター駆動装置６０はフィルターホルダー５６及び色フィルター５０を光路２１内と光路２１外とを移動させる。
図２３は、本装置におけるフィルター位置が光路外にあることを示している。
図２４は、本装置におけるフィルターが光路に挿入された場合を示している。
図２５は、色フィルター５０の透過率特性を示す。フィルター５０は、波長６３０ナノメートルを中心に、波長範囲６１０ナノメートルから６５０ナノメートルまでを測定できるように設計されている。たとえば、測定対象物をフィルターなしで測定したときの照度測定値を１００とし、色フィルター５０を挿入したときの照度測定値が７４であった場合には、比が０．７４となり、図２５のフィルター特性から、測定した発光体の波長は６２０ナノメートルであったと計算された。Next, FIG. 23 is a schematic front view showing an emission wavelength inspection device 600 which is a modified embodiment of the emission wavelength inspection device according to the first embodiment of the present invention. In the figure, a substrate 3 to be inspected, which is a light emitter, is mounted on a horizontally movable stage and receives a current supply from a power supply device 10 to illuminate a chip on the surface. The state of the surface of the inspection target substrate 3 is imaged by the camera 30 through the lens 20. The captured image information is input to the image processing and control device 47 (hereinafter, simply referred to as the control device 47) that is integrally configured. The control device 47 controls the filter driving device 60. The color filter 50 is fixed to the filter holder 56, and the filter driving device 60 moves the filter holder 56 and the color filter 50 inside the optical path 21 and outside the optical path 21.
FIG. 23 shows that the filter position in this device is outside the optical path.
FIG. 24 shows a case where the filter in this device is inserted into the optical path.
FIG. 25 shows the transmittance characteristics of the color filter 50. The filter 50 is designed to measure a wavelength range of 610 nanometers to 650 nanometers centering on a wavelength of 630 nanometers. For example, if the illuminance measurement value when the measurement target is measured without a filter is 100 and the illuminance measurement value when the color filter 50 is inserted is 74, the ratio is 0.74, and From the filter characteristics, it was calculated that the measured wavelength of the illuminant was 620 nanometers.
　次に、図２６は、本発明の第２実施形態の変形実施形態である発光波長検査装置７００の正面模式図である。本実施形態で使用する色フィルターは、誘電体薄膜光学フィルター５６である。誘電体薄膜光学フィルター５６は、フィルタ光軸傾斜角駆動機構６５によって、光路２１の光軸に対して傾斜角を持たせることができる構成となっている。傾きはマイクロステップ駆動のステップモータMによって制御可能である。ここで、誘電体薄膜光学フィルター５６は光路に対して角度を傾けることで遮断波長が変化することが知られている。その波長変化は、光路に垂直な状態を０°として、角度が増加すると遮断波長は短くなる方向へ移動する。図２７は光フィルター５６の特性を示す。光フィルター５６は、透過率が６５０ナノメートル近辺で半値になるように設計されている。このフィルターは、約２０°傾けることによって、６３０ナノメートルで半値となるショートパス光学フィルターとして使用することができる。もし光フィルター５６の特性として、透過率が半値になる波長が正確に６５０ナノメートルではなく、たとえば６６０ナノメートル付近であったとしても、傾き角度をさらに増加させることによって、半値の波長を正確に６３０ナノメートルに調整することができる。また逆に、半値の波長が短く出来上がって６４０ナノメートル付近になったとしても、傾き角度を少なく調整することによって、同様に６３０ナノメートルが半値となるフィルターとして使用することができる。以上のように、本実施形態においては、透過率が高く、また透過率の変化が半値付近で急峻である誘電体薄膜光学フィルターを採用することができ、また、製造が難しく半値を正確に制御することができない誘電体薄膜光学フィルターであっても、半値設定の許容幅を大きくすることができるので、フィルター製造が容易に行うことができる。Next, FIG. 26 is a schematic front view of an emission wavelength inspection device 700 which is a modified embodiment of the second embodiment of the present invention. The color filter used in this embodiment is a dielectric thin film optical filter 56. The dielectric thin film optical filter 56 is configured to have a tilt angle with respect to the optical axis of the optical path 21 by a filter optical axis tilt angle drive mechanism 65. The tilt can be controlled by the step motor M of the microstep drive. Here, it is known that the cutoff wavelength of the dielectric thin film optical filter 56 changes by tilting the angle with respect to the optical path. With respect to the wavelength change, the state perpendicular to the optical path is 0°, and the cutoff wavelength moves in the direction of shortening as the angle increases. FIG. 27 shows the characteristics of the optical filter 56. The optical filter 56 is designed so that the transmittance is halved near 650 nanometers. This filter can be used as a short-pass optical filter with a half value at 630 nanometers by tilting about 20°. As a characteristic of the optical filter 56, even if the wavelength at which the half value of the transmittance is half is not exactly 650 nanometers but is, for example, around 660 nanometers, the half angle wavelength is accurately increased by further increasing the tilt angle. It can be adjusted to 630 nanometers. On the other hand, even if the half-value wavelength is short and is close to 640 nanometers, it can be used as a filter whose FWHM is 630 nanometers by adjusting the tilt angle to a small value. As described above, in the present embodiment, it is possible to employ a dielectric thin film optical filter having a high transmittance and a steep change in the transmittance near a half value, and it is difficult to manufacture, and the half value is accurately controlled. Even in the case of a dielectric thin film optical filter that cannot be used, the allowable range of half-value setting can be increased, so that the filter can be easily manufactured.
　図２９には、本発明に係るマイクロLED発光検査装置１の変形態様であるマイクロLED発光検査装置８００の模式斜視図を示す。マイクロLED発光検査装置８００は、波長可変光源１０６、制御装置７０、デジタル画像処理装置４０配置に特徴がある。本発明に係るマイクロLED発光検査装置は、デジタル画像処理装置４０を要するため、従来の発光検査装置に比して装置の所要延べ床面積が大きくなる。電子機器は冷却の必要のためなるべく熱が籠らない配設が好ましい。マイクロLED発光検査装置８００は、上方で光フィルタを高い剛性で左右からピラー支持し、ピラーを跨るビーム艦橋から垂下される回転式の光フィルタホルダー５６に支持される４つの選択フィルタのうち、一つが光フィルタ５０モードに対応する構成となっているが、ピラー１２は花崗岩から成るベース部材１４において、中央線から偏りピラー１２が２本鉛直方向に向かい配置され、その偏りの反対側側面に沿って、ピラー１２を跨るビーム状のブリッジ１３と平行にほぼビーム幅と同じ幅長に、大容量の画像データフレームを格納するデジタル画像処理装置４０がベース部材１４の下方に配設されている。一方、制御装置７０は、デジタル画像処理装置４０から空隙をおいてベース部材１４において中央線からピラー１２に偏った側のベース部材１４の下方に配設されている。可変波長光源１０６は、制御装置７０とデジタル画像処理装置４０に挟まれる位置に、ベース部材１４の下方の長手方向側面に面して光を出力する光ファイバを突出させるように配設されている．LED点灯用電源は、可変波長光源１０６の光ファイバの突出面と反対側のベース部材１４下方でない側方コーナーに長手方向をほぼベース部材側面平行に面して配設されている。この構成によって、排熱に配慮しつつ主要部材をベース部材１４下方に配設させデジタル画像処理装置４０をベース部材１４下方に収容し、省スペースを実現する効果を得ている。FIG. 29 shows a schematic perspective view of the micro LED light emission inspection device 800, which is a modification of the micro LED light emission inspection device 1 according to the present invention. The micro LED light emission inspection device 800 is characterized by the arrangement of the variable wavelength light source 106, the control device 70, and the digital image processing device 40. Since the micro LED light emission inspection device according to the present invention requires the digital image processing device 40, the required total floor area of the device is larger than that of the conventional light emission inspection device. It is preferable that the electronic device is arranged so that heat is not collected as much as possible because of the need for cooling. The micro LED light emission inspection device 800 supports the optical filter from the left and right pillars with high rigidity at the top, and one of four selection filters supported by the rotary optical filter holder 56 hanging from the beam bridge straddling the pillars. One of the pillars is a base member 14 made of granite, and the two pillars 12 are arranged in the vertical direction and are offset from the center line. A digital image processing device 40 for storing a large-capacity image data frame is arranged below the base member 14 in parallel with the beam-shaped bridge 13 straddling the pillar 12 and having a width substantially the same as the beam width. On the other hand, the control device 70 is disposed below the base member 14 on the side of the base member 14 which is biased from the center line to the pillar 12 with a gap from the digital image processing device 40. The variable wavelength light source 106 is arranged at a position sandwiched between the control device 70 and the digital image processing device 40 so as to project an optical fiber that outputs light, facing the lower longitudinal side surface of the base member 14. ． The LED lighting power source is disposed at a side corner, which is opposite to the protruding surface of the optical fiber of the variable wavelength light source 106, not on the lower side of the base member 14, with its longitudinal direction substantially parallel to the base member side surface. With this configuration, the main member is arranged below the base member 14 while considering the exhaust heat, and the digital image processing device 40 is housed below the base member 14, thereby achieving the effect of saving space.
　さらに、追加のマイクロLED発光検査装置１の変形実施態様では、図７に示されているマイクロLED発光検査装置１の画像処理装置４０は通信部（図７には図示されていない）を備え、リモートサーバ９７又はUSBメモリ７４は、マイクロLED発光検査装置１から製造条件を受信又は格納可能であり、マイクロLED発光検査装置１の画像処理装置４０は、製造条件データ出力部をさらに備えるように構成され、マイクロLED半導体サブストレート３の全体映像、１又は複数の単位映像体マッピングデータ４６及びこれに対応する光強度特性及び発光波長特性及びこれらの範疇のうち少なくとも一つを含むマイクロLEDマッピングデータ４４又はマイクロLEDの光強度特性の少なくともいずれか１つから所定のデータを所定のデータ形式に変換し製造条件データとして生成及び出力可能に構成されている。あるいは、他の変形実施態様では、画像処理装置は、発光波長と光フィルタ有無の場合の光強度比の二次元マップをさらに出力出力可能に構成されている。このように構成されたマイクロLED発光検査装置は、リモートサーバ９７から製造プロセス管理サーバへリアルタイムで情報連携可能に構成されるから又はUSBメモリ７４は製造プロセス管理サーバへ適時情報連携可能に構成されるから、製造プロセスの異常を早期に認識可能であるという効果を得られる。Furthermore, in an additional modified embodiment of the micro LED light emission inspection device 1, the image processing device 40 of the micro LED light emission inspection device 1 shown in FIG. 7 includes a communication unit (not shown in FIG. 7), The remote server 97 or the USB memory 74 can receive or store the manufacturing conditions from the micro LED light emitting inspection device 1, and the image processing device 40 of the micro LED light emitting inspection device 1 is configured to further include a manufacturing condition data output unit. The micro LED mapping data 44 including the entire image of the micro LED semiconductor substrate 3 and one or more unit image body mapping data 46 and the corresponding light intensity characteristics and emission wavelength characteristics and at least one of these categories. Alternatively, it is configured such that predetermined data is converted into a predetermined data format from at least one of the light intensity characteristics of the micro LED, and can be generated and output as manufacturing condition data. Alternatively, in another modified embodiment, the image processing apparatus is configured to be able to further output and output a two-dimensional map of the light emission wavelength and the light intensity ratio with and without the optical filter. The micro LED light emission inspection device configured as described above is configured to enable real-time information cooperation from the remote server 97 to the manufacturing process management server, or the USB memory 74 is configured to enable timely information cooperation to the manufacturing process management server. Therefore, it is possible to obtain an effect that an abnormality in the manufacturing process can be recognized at an early stage.
　マイクロLEDディスプレイ製造プロセスの代表的なものは、以下である。
０）製造工程開始
１）ウェハー上にマイクロLEDチップを生成する段階
２）点灯検査で各チップの照度と発光波長の測定をする段階
３）ダイシングと仕分け段階
４）ディスプレイ基板上にチップを搭載する段階
５）ディスプレイ点灯検査段階
６）製造工程終了
　図５に示される変形実施態様で、本発明に係るマイクロLED発光検査装置１は、デジタル画像処理装置４０は、通信部１１０を備えるように構成されており、マイクロLED発光検査装置１は、例えば、製造プロセス管理コンピュータ９７との通信路を備えるように構成され、及び製造データ入力可能に構成され、製造指示を受入れる製造指示受入れステップを実行するモジュールが構成されている。　又、追加のマイクロLED発光検査装置１の図５に示されているマイクロLED発光検査装置１の画像処理装置４０は通信部１１０及びデータ出力部１２０を備え、マイクロLED発光検査装置１は、製造プロセス管理コンピュータ（例えば、サーバ２００、９１がこれらに該当する場合もあるし、図示されないネットワーク接続サーバがこれらに該当する場合もある）への通信路及び製造データ出力部をさらに備えるように構成され、通信路を介して製造プロセス管理コンピュータへキャリブレーションのデータその他の検査進捗データを含む製造プロセスデータを出力する製造データ出力ステップを実行するモジュールが構成されている。これらの構成によって、マイクロLEDへの点灯検査において、適時に製品に求められる検査水準、検査条件を把握できるし、検査に際してフォーカスすべき事項の連携が可能である。例えば、ディスプレイ基板上に必要とされるチップの二次元マップ範疇毎の必要量、過不足状況、製品不具合情報の共有が随時可能となり、場合によっては、製造ばらつき変動因子を迅速に把握して検査水準、二次元マップ範疇の変更もダイナミックに可能となるなど、ディスプレイ製造コスト及び品質作りに貢献するマイクロLED発光検査装置が提供される。A typical micro LED display manufacturing process is as follows.
0) Start of manufacturing process 1) Step of producing micro LED chip on wafer 2) Step of measuring illuminance and emission wavelength of each chip by lighting inspection Step 3) Dicing and sorting Step 4) Mounting chip on display substrate Step 5) Display lighting inspection Step 6) End of manufacturing process In a modified embodiment shown in FIG. 5, the micro LED light emission inspection apparatus 1 according to the present invention is configured such that the digital image processing apparatus 40 includes the communication unit 110. The micro LED light emission inspection device 1 is, for example, a module configured to have a communication path with the manufacturing process management computer 97 and configured to input manufacturing data, and to execute a manufacturing instruction receiving step of receiving a manufacturing instruction. Is configured. The image processing device 40 of the additional micro LED light emission inspection device 1 shown in FIG. 5 includes a communication unit 110 and a data output unit 120, and the micro LED light emission inspection device 1 is manufactured. It is configured to further include a communication path to a process management computer (for example, the servers 200 and 91 may correspond to these, or a network connection server (not shown) may correspond to these) and a manufacturing data output unit. , A module configured to execute a manufacturing data output step of outputting manufacturing process data including calibration data and other inspection progress data to the manufacturing process management computer via a communication path. With these configurations, in the lighting inspection of the micro LED, the inspection level and the inspection condition required for the product can be grasped in a timely manner, and the items to be focused on in the inspection can be linked. For example, it is possible to share the required amount, excess/deficiency status, and product defect information for each 2D map category of the chip required on the display substrate at any time. Provided is a micro LED light emission inspection device that contributes to display manufacturing cost and quality creation, such as dynamically changing the level and two-dimensional map category.
　さらに、他の態様で本発明は、全自動化された製造プロセスに組み込まれたマイクロLED発光検査方法を提供する。図２８に示される方法のフローチャートS1000図を参照しつつ説明する。全自動化された製造プロセスに組み込まれたマイクロLED発光検査方法は、上記実施態様のマイクロLED発光検査装置を用い、以下の段階を含む。
０）検査開始
１）製品情報取得段階Ｓ１００１
　この段階では、アライメントマーク情報を含むサブストーレートのジオメオリ情報、マイクロLEDのジオメトリ情報及びマイクロLEDアレイのジオメトリ情報等製品の共通情報を受け入れ、個々の製造品検査の準備をする段階である。
２）製造管理区域設定段階Ｓ１００２
　この段階では、１又は複数の前記ジオメトリ情報からマイクロLEDが形成された半導体サブストレート上で局所的な製品品質のばらつき及び/又は異常を認識及び管理するための製造管理区域を設定する。製造管理区域は幾何学的なジオメトリーから設定されてもよいし、過去の検査状況から管理すべき区域を設定してもよいし、前製造段階での温度、風向き等の様々な製造情報、製造指示情報から設定されてもよい。
３）検査受け入れ可能通知段階Ｓ１００３
　この段階では、製造ライン制御コンピュータに検査受け入れ可能状態をネットワーク手段を介して製造ライン制御コンピュータに通知する。これによって、全自動化された製造プロセスに組み込み可能とされる。
４）製造情報受け入れ段階Ｓ１００４
　この段階では、製造ライン制御コンピュータからマイクロLEDウェハ製造情報を受信する。製造情報には、サブストレートジオメトリ情報、位置決めのためのマーク（タグ）を含む。
５）サブストレート搭載段階Ｓ１００５
　この段階では、検査ベッド上にサブストレートを搭載し、真空吸引等の手段によって検査ベッドに固定する。サブストレートを搭載するときに、製造ロットや製造を特定する情報を付加して検査ベッド上にサブストレートを搭載する。
６）製造管理区域マッピング段階Ｓ１００６
　この段階では、上記実施態様のマイクロLED発光検査装置に使用方法に加えて、本方法の特徴である、画像処理装置によってサブストレートの全体像を撮像し、前記サブストレートに製造管理区域をマッピングする、追加のマッピングレイヤーを本方法は提供する。マッピングには、製造管理区域区割り情報、サブストレートジオメトリ情報、位置決めのためのマーク（タグ）が利用される。
７）マイクロLEDマッピング段階Ｓ１００７
　この段階では、実施形態１と同様の検査が行われる。画像処理装置によってサブストレート上に配設されたマイクロLEDを画像処理装置内に生成された画像フレーム上にマッピングする。
８）マイクロLED特性測定段階１００８
　この段階では、実施形態１と同様の検査が行われる。画像処理装置によって、マイクロLEDチップを点灯し発光強度と発光波長を測定する。
９）マイクロLED仕分け段階Ｓ１００９
　この段階では、画像処理装置によって、検査されたマイクロLED特性を元に所定の分類条件によって発光強度と前記発光波長のマトリックスで分類された異常分類を含む範疇情報をマイクロLEDマップ情報に付し全マイクロLEDチップを分類仕分けする
１０）製造プロセス状態判定段階Ｓ１０１０
　この段階では、画像処理装置によって、検査結果範疇情報の付されたマイクロLEDを製造管理区域マップにオーバーレイし、製造管理区域に紐づけられたマイクロLED製造プロセス状態を認識する。
１１）検査結果送信段階Ｓ１０１１
　この段階では、画像処理装置によって、前記ネットワーク手段を介して製造ライン制御コンピュータへ検査結果を踏まえた仕分け情報と製造管理区域毎の製造プロセス状態を送信する。
１２）検査終了通知段階Ｓ１０１２
　　この段階では、製造ライン制御コンピュータへ検査終了通知を送信する。
１３）検査終了
以上の方法によって、製造条件によって変動するばらつきをより抑え、製造ばらつき変動因子の迅速なフィードバックをタイムリーに製造プロセスへ提供する効果を提供する。Furthermore, in another aspect, the present invention provides a micro LED luminescence inspection method incorporated into a fully automated manufacturing process. This will be described with reference to the flowchart S1000 of the method shown in FIG. A micro LED light emission inspection method incorporated in a fully automated manufacturing process uses the micro LED light emission inspection apparatus of the above embodiment and includes the following steps.
0) Start inspection 1) Product information acquisition step S1001
At this stage, common information of products such as sub-strate geometry information including alignment mark information, micro LED geometry information, and micro LED array geometry information is received, and preparations for individual product inspections are made.
2) Manufacturing control area setting step S1002
At this stage, a manufacturing control area for recognizing and managing local product quality variations and/or abnormalities on the semiconductor substrate on which the micro LED is formed is set from one or more pieces of the geometry information. The manufacturing control area may be set based on a geometrical geometry, an area to be controlled based on past inspection conditions, various manufacturing information such as temperature and wind direction in the previous manufacturing stage, manufacturing It may be set from the instruction information.
3) Notification step S1003 of acceptance of inspection
At this stage, the production line control computer is notified of the inspection acceptable state via the network means. This allows it to be incorporated into a fully automated manufacturing process.
4) Manufacturing information acceptance step S1004
At this stage, micro LED wafer manufacturing information is received from the manufacturing line control computer. The manufacturing information includes substrate geometry information and a mark (tag) for positioning.
5) Substrate mounting stage S1005
At this stage, the substrate is mounted on the inspection bed and fixed to the inspection bed by means such as vacuum suction. When mounting the substrate, the substrate is mounted on the inspection bed by adding information identifying the manufacturing lot and manufacturing.
6) Manufacturing control area mapping step S1006
At this stage, in addition to the method of using the micro LED light emission inspection apparatus of the above-mentioned embodiment, the entire image of the substrate is captured by the image processing apparatus, which is a feature of this method, and the production control area is mapped on the substrate. The method provides an additional mapping layer. Manufacturing control area division information, substrate geometry information, and marks (tags) for positioning are used for mapping.
7) Micro LED mapping step S1007
At this stage, the same inspection as in the first embodiment is performed. A micro LED disposed on the substrate by the image processing device is mapped on an image frame generated in the image processing device.
8) Micro LED characteristic measurement step 1008
At this stage, the same inspection as in the first embodiment is performed. The image processing device turns on the micro LED chip and measures the emission intensity and emission wavelength.
9) Micro LED sorting step S1009
At this stage, the image processing apparatus attaches the category information including the abnormality classification classified by the matrix of the emission intensity and the emission wavelength to the micro LED map information according to the predetermined classification condition based on the inspected micro LED characteristics, and adds the whole category information to the micro LED map information. Classification of micro LED chips 10) Manufacturing process status determination step S1010
At this stage, the image processing apparatus overlays the micro LED with the inspection result category information on the manufacturing control area map to recognize the micro LED manufacturing process state linked to the manufacturing control area.
11) Inspection result transmission step S1011
At this stage, the image processing apparatus transmits the sorting information based on the inspection result and the manufacturing process state for each manufacturing management area to the manufacturing line control computer via the network means.
12) Inspection end notification step S1012
At this stage, the inspection end notification is transmitted to the production line control computer.
13) End of inspection By the above-mentioned method, it is possible to further suppress variations that fluctuate due to manufacturing conditions, and to provide an effect of promptly feeding back manufacturing variation fluctuation factors to the manufacturing process.
　以上、本発明に係る実施の形態を説明したが、本発明は係る実施の形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲で種々変形して実施することができる。本発明が、ここに記載された実施形態に描かれ、実施形態は、かなり詳細に記載されているが、出願人は、この記載によって添付する特許請求の範囲をいかようにも制限、限定する意図はない。追加の利点や修正は、当業者に理解され、一つの実施形態に記載された要素は、他の実施形態にも採用可能である。したがって、発明は、広い面で、特定の詳細事項に限定されず、各々の機器と実施例が示され、記載されている。したがって、出願人の一般的発明概念の精神とスコープから乖離せず、これらの詳細に記載された事項から離れることもあり得る。Although the embodiment of the present invention has been described above, the present invention is not limited to the embodiment, and various modifications can be made without departing from the spirit of the present invention. While the invention is illustrated in the embodiments described herein and the embodiments have been described in considerable detail, the applicant in no way limits or restricts the scope of the claims appended hereto. I have no intention. Additional advantages and modifications will be understood by those skilled in the art and the elements described in one embodiment may be incorporated into other embodiments. Accordingly, the invention, in its broadest aspects, is not limited to the specific details and each device and example is shown and described. Therefore, it is possible that the spirit and scope of the applicant's general invention concept will not deviate from those described in detail.
　本発明は、マイクロＬＥＤを用いた表示デバイスの製造過程において、ウェハー上に生成された多数のＬＥＤチップの検査を行うマイクロLED発光検査装置を用いマイクロLEDを製造する半導体製造業に利用可能である。INDUSTRIAL APPLICABILITY The present invention can be used in a semiconductor manufacturing industry that manufactures a micro LED using a micro LED light emission inspection device that inspects a large number of LED chips formed on a wafer in a manufacturing process of a display device using the micro LED. ..
　 　１　マイクロLED発光検査装置
　　 ２　マイクロLED
　　 ３　半導体サブストレート
　 １０　給電機構
　 １５　顕微鏡
　 １８　映像信号線
　 ２０　光学レンズ
　 ２１　光路
　 ３０　撮像装置
　 ３１　イメージセンサ
　 ４０　デジタル画像処理装置
　 ４１　メモリ
　 ４２　画像データフレーム
　 ４３　ピクセルマップ
　 ４４　マイクロLEDマッピング（マイクロLEDマッピングデータ）
　 ４５　光強度ピクセルマップ
　 ４６　単位映像体マッピング（単位映像体マッピングデータ）
　 ４７　機構制御・デジタル画像処理一体型制御装置
　 ５０　光学フィルタ
　 ５１　薄膜光学フィルタ
　 ５６　他の薄膜光学フィルタ
　 ６０　フィルタ駆動機構（フィルタ駆動装置）
　 ６２　フィルタ駆動機構受信部
　 ６５　フィルタ傾斜角変動制御機構
　 ７０　制御装置
　 ７１　制御部
　 ７２　送信部
　 ７６　ネットワーク接続ストレージ
　 ８０　単位映像体
　 ８１　単位映像体識別部
　 ８８　制御装置とフィルタ駆動機構間の制御信号線
　 ９０　マイクロLED識別部
　 ９２　画面表示装置
　 ９３　二次元マップ
　 ９７　リモート接続サーバ
１００　マイクロLED検査部
１０１　マイクロLED発光検査装置に用いる光学フィルタ検査装置
１１０　通信部
１２０　データ出力部
１３０　マイクロLEDマップ境界判定部
１４０　データ入力部
５００ マイクロLED発光検査装置
６００ チップ発光検査装置
７００ チップ発光検査装置
　 Ａ　　ピッチ
　 Ｂ　　単位映像体境界線
　 Ｍ　　ステップモータ
Ｓ０　　　　制御フローチャート
Ｓ１００　　制御フローチャート
Ｓ２００　　制御フローチャート
Ｓ３００　　制御フローチャート
Ｓ５００　　制御フローチャート
Ｓ１０００　マイクロLED発光検査方法フローチャート1 micro LED light emission inspection device 2 micro LED
3 Semiconductor Substrate 10 Power Supply Mechanism 15 Microscope 18 Video Signal Line 20 Optical Lens 21 Optical Path 30 Imaging Device 31 Image Sensor 40 Digital Image Processing Device 41 Memory 42 Image Data Frame 43 Pixel Map 44 Micro LED Mapping (Micro LED Mapping Data)
45 Light intensity pixel map 46 Unit image body mapping (unit image body mapping data)
47 Mechanism control/digital image processing integrated control device 50 Optical filter 51 Thin film optical filter 56 Other thin film optical filter 60 Filter driving mechanism (filter driving device)
62 filter driving mechanism receiving unit 65 filter inclination angle variation control mechanism 70 control unit 71 control unit 72 transmission unit 76 network connection storage 80 unit image body 81 unit image body identification unit 88 control signal line between control device and filter drive mechanism 90 micro LED identification unit 92 Screen display device 93 Two-dimensional map 97 Remote connection server 100 Micro LED inspection unit 101 Optical filter inspection device used for micro LED light emission inspection device 110 Communication unit 120 Data output unit 130 Micro LED map boundary determination unit 140 Data input unit 500 Micro LED light emission inspection device 600 Chip light emission inspection device 700 Chip light emission inspection device A pitch B Unit image body boundary line M Step motor S0 Control flowchart S100 Control flowchart
S200 control flow chart S300 control flow chart
S500 control flow chart S1000 micro LED emission inspection method flow chart

Claims (36)

  1. 　個別に分離されるべき１００μm角以下の大きさの矩形領域内を占めるマイクロLEDがアレイ状に配列されて表面に形成された半導体サブストレートが装着可能であり、
    前記マイクロLEDの発光のための給電機構と、
    前記サブストレートに対向して光学レンズが配設されて前記発光の光強度を測定するためのイメージセンサを有する撮像装置と、
    前記撮像装置の映像信号を受け入れるデジタル画像処理装置と、
    前記マイクロLEDと前記光学レンズとの光路に配設される、所定の光波長帯域を有する光学フィルタと、
    前記光学フィルタを支持し、制御信号の受信部を含むフィルタ駆動機構と、及び、
    前記フィルタ駆動機構の制御信号の送信部及び、前記制御信号の生成のため及びシステムフロー開始とフロー制御をするための制御部を含む制御装置と、
    を含むマイクロLED発光検査装置であって、
    　前記光学フィルターは、設計条件に相当する色波長を含む所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルターであり、かつ
    　前記制御装置は、前記フィルタ駆動機構によって前記光学フィルターの有無を選択制御可能である制御装置であり、かつ
    　前記デジタル画像処理装置は前記映像信号を受入れて生成された画像データフレームを格納するためのメモリを備え、前記画像データフレーム上のピクセル毎の光強度ピクセルマップから所定のクライテリアに基づく前記発光の単位映像体を特定し、前記ピクセルマップへの単位映像体マッピングデータを生成するための単位映像体識別部と、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し前記マイクロLEDを前記ピクセルマップ上にマッピングするマイクロLEDマッピングデータを生成するためのマイクロLED識別部と、及び
    　マイクロLEDマップ上の光強度マップ上の光強度から所定の光エネルギ強度算出式によって前記マイクロLEDの光エネルギ強度を決定し、前記マイクロLEDの光エネルギ強度のうち少なくとも前記光学フィルター無の配置における前記光エネルギ強度値を前記メモリに格納可能であり、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、所定のマイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定するためのマイクロLED検査部とを、含む前記デジタル画像処理装置である、
    ことを特徴とするマイクロLED発光検査装置。    A semiconductor substrate formed on the surface by arranging micro LEDs occupying a rectangular area with a size of 100 μm square or less to be individually arranged in an array can be mounted.
    A power supply mechanism for emitting light from the micro LED,
    An image pickup apparatus having an image sensor for measuring the light intensity of the emitted light, in which an optical lens is arranged facing the substrate,
    A digital image processing device that receives a video signal of the imaging device;
    An optical filter having a predetermined light wavelength band, which is disposed in the optical path between the micro LED and the optical lens,
    A filter driving mechanism that supports the optical filter and includes a control signal receiving unit, and
    A control device including a control signal transmission unit of the filter drive mechanism, and a control unit for generating the control signal and for performing system flow start and flow control,
    It is a micro LED light emission inspection device including
    The optical filter is an optical filter whose filter transmitted light intensity monotonically increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition, and the control device causes the filter to drive the optical filter. Is a control device capable of selectively controlling the presence or absence, and the digital image processing device includes a memory for storing an image data frame generated by receiving the video signal, for each pixel on the image data frame A unit image body identification unit for identifying the unit image body of the light emission based on a predetermined criterion from a light intensity pixel map and generating unit image body mapping data to the pixel map, and a plurality of the unit image bodies from the unit image body. A micro LED identification unit for identifying micro LEDs arranged in an array and generating micro LED mapping data for mapping the micro LEDs on the pixel map, and
    The light energy intensity of the micro LED is determined by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, and at least the optical energy intensity of the micro LED in the arrangement without the optical filter is determined. A light energy intensity value can be stored in the memory, and a predetermined micro LED is obtained by the light energy intensity value of the micro LED in the arrangement with the optical filter and the light energy intensity value of the arrangement without the optical filter. The digital image processing apparatus including a micro LED inspection unit for determining the emission wavelength of the micro LED by the emission wavelength calculation formula of the above.
    A micro LED light emission inspection device characterized in that
  2. 　前記所定のクライテリアは周囲に対しピーク光エネルギ強度値を呈するピクセルを前記単位映像体の中心部と特定し、隣接する前記単位映像体中心部間の中央を前記単位映像体の矩形境界とする請求項１記載のマイクロLED発光検査装置。The predetermined criterion specifies a pixel exhibiting a peak light energy intensity value with respect to the surroundings as a central portion of the unit image body, and defines a center between adjacent unit image body center portions as a rectangular boundary of the unit image body. Item 1. The micro LED light emission inspection device according to Item 1.
  3. 　前記所定のクライテリアは周囲に対しピーク光エネルギ強度値を呈するピクセルを前記単位映像体の中心部と特定し、アレイ状に配列されたマイクロLEDの間隔設計値によって、前記単位映像体の矩形境界を決定する請求項１又は２記載のマイクロLED発光検査装置。The predetermined criteria specifies a pixel exhibiting a peak light energy intensity value with respect to the surroundings as the central portion of the unit image body, and a rectangular boundary of the unit image body is determined by the design value of the intervals of the micro LEDs arranged in an array. The micro LED light emission inspection device according to claim 1 or 2, which is determined.
  4. 　前記所定の光エネルギ強度算出式は、前記光強度ピクセルマップ上で前記マイクロLEDに含まれる前記ピクセルの段階的光強度の総和である請求項１記載のマイクロLED発光検査装置。The micro LED light emission inspection device according to claim 1, wherein the predetermined light energy intensity calculation formula is a sum of stepwise light intensities of the pixels included in the micro LED on the light intensity pixel map.
  5. 　前記光学フィルターは既知の光波長の光源によって、フィルタ特性がキャリブレーションされ、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係に関して前記キャリブレーションをもとに作成されたルックアップテーブルが格納されている請求項１記載のマイクロLED発光検査装置。The optical filter has its filter characteristics calibrated by a light source having a known light wavelength, and the ratio of the light energy intensity value in the arrangement without the optical filter to the light energy intensity value in the arrangement with the optical filter and the light emission. The micro LED light emission inspection device according to claim 1, wherein a lookup table created based on the calibration with respect to the wavelength is stored.
  6. 　前記所定の前記マイクロLEDの発光波長算出式は、前記光エネルギ強度比測定値に対応する前記発光波長が前記ルックアップテーブルで参照され、中間値について按分補間を加算して前記発光波長が決定される請求項５記載のマイクロLED発光検査装置。In the emission wavelength calculation formula of the predetermined micro LED, the emission wavelength corresponding to the photoenergy intensity ratio measurement value is referred to in the lookup table, and the emission wavelength is determined by adding proportional division interpolation to the intermediate value. The micro LED light emission inspection device according to claim 5.
  7. 　アレイ状に配列されることとなる検査対象のマイクロLEDアレイの設計条件と少なくとも所定の領域でほぼ同一数及び同一配置の反射体がアレイ状に表面に形成されたサブストレートと、
    前記反射体の反射光のための光投射機構と、
    前記光投射機構への光誘導機構と、
    前記光投射光の既知の波長の光源と、
    前記サブストレートに対向して光学レンズが配設されて前記発光の光強度を測定するためのイメージセンサを有する撮像装置と、
    前記撮像装置の映像信号を受け入れるデジタル画像処理装置と、
    前記反射体の反射光光路上に前記光学レンズと前記反射体との間に配設される、所定の光波長帯域を有するマイクロLED発光検査装置に用いる光学フィルタと、
    前記光学フィルタを支持し、制御信号の受信部を含むフィルタ駆動機構と、及び
    前記フィルタ駆動機構の制御信号の送信部及び、前記制御信号の生成のため及びシステムフロー開始とフロー制御をするための制御部を含む制御装置と、
    を含むマイクロLED発光検査装置に用いる光学フィルタ検査装置であって、
    　前記光学フィルターは、設計条件に相当する色波長を含む所定の光波長帯域でフィルタ透過光強度が単調増加又は単調減少する光学フィルターであり、かつ
    　前記制御装置は、前記フィルタ駆動機構によって前記光学フィルターの有無を選択制御可能である制御装置であり、かつ
    　前記デジタル画像処理装置は前記映像信号を受入れて生成された画像データフレームを格納するためのメモリを備え、
    　前記反射体の前記反射光を前記マイクロLEDの前記発光とみなし、前記画像データフレーム上のピクセル毎の光強度ピクセルマップから所定のクライテリアに基づき前記発光の単位映像体を特定し、前記反射光の単位映像体をマイクロLEDの発光による単位映像体とみなし、前記ピクセルマップへの単位映像体マッピングデータを生成するための単位映像体識別部と、
    　前記単位映像体から複数の前記アレイ状に配列された前記反射体とみなされた前記マイクロLEDを特定し前記マイクロLEDを前記ピクセルマップ上にマッピングするマイクロLEDマッピングデータを生成するためのマイクロLED識別部と、及び
    　マイクロLEDマップ上の前記光強度マップ上の光強度から所定の光エネルギ強度算出式によって前記マイクロLEDの光エネルギ強度を決定し、前記マイクロLEDの光エネルギ強度のうち少なくとも前記光学フィルター無の配置における前記光エネルギ強度値を前記メモリに格納可能であり、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、所定の前記マイクロLEDの発光波長算出式によって前記反射光の光源とみなされた前記マイクロLEDの発光波長を決定するためのマイクロLED検査部とを、含む前記デジタル画像処理装置である、
    ことを特徴とするマイクロLED発光検査装置に用いる光学フィルタ検査装置。    The design conditions of the micro LED array to be inspected to be arranged in an array and the substrate in which approximately the same number and arrangement of reflectors are formed on the surface in an array at least in a predetermined area, and
    A light projection mechanism for the reflected light of the reflector,
    A light guide mechanism to the light projection mechanism,
    A light source of known wavelength of the light projection light;
    An image pickup apparatus having an image sensor for measuring the light intensity of the emitted light, in which an optical lens is arranged facing the substrate,
    A digital image processing device that receives a video signal of the imaging device;
    An optical filter used in a micro LED emission inspection device having a predetermined optical wavelength band, which is arranged between the optical lens and the reflector on the reflected light path of the reflector.
    A filter drive mechanism that supports the optical filter and includes a control signal receiver, a control signal transmitter of the filter drive mechanism, and for generating the control signal and for starting and controlling the system flow. A controller including a controller,
    An optical filter inspection device used for a micro LED emission inspection device including:
    The optical filter is an optical filter whose filter transmitted light intensity monotonously increases or monotonically decreases in a predetermined light wavelength band including a color wavelength corresponding to a design condition, and the control device causes the filter to drive the optical filter. Is a control device capable of selectively controlling presence or absence, and the digital image processing device includes a memory for storing an image data frame generated by receiving the video signal,
    The reflected light of the reflector is regarded as the light emission of the micro LED, the unit image body of the light emission is specified based on a predetermined criterion from the light intensity pixel map for each pixel on the image data frame, and the reflected light A unit image body is regarded as a unit image body by light emission of a micro LED, and a unit image body identification unit for generating unit image body mapping data to the pixel map,
    A micro LED identification for identifying the micro LEDs regarded as the plurality of the reflectors arranged in the array from the unit image body and generating micro LED mapping data for mapping the micro LEDs on the pixel map. Part, and the light energy intensity of the micro LED by a predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map, at least the optical filter of the light energy intensity of the micro LED It is possible to store the light energy intensity value in a non-arrangement in the memory, and by the light energy intensity value of the micro LED in the arrangement with the optical filter and the light energy intensity value in the arrangement without the optical filter. A digital image processing apparatus including a micro LED inspection unit for determining a light emission wavelength of the micro LED regarded as a light source of the reflected light according to a predetermined light emission wavelength calculation formula of the micro LED.
    An optical filter inspection device used in a micro LED emission inspection device, which is characterized in that
  8. 　前記反射体の反射光のための光投射機構は、前記反射体の反射光光路上に前記光学レンズと前記反射体との間に配設されたハーフミラーを含む請求項７記載の光学フィルタ検査装置。8. The optical filter inspection according to claim 7, wherein the light projection mechanism for the reflected light of the reflector includes a half mirror arranged between the optical lens and the reflector on the reflected light optical path of the reflector. apparatus.
  9. 　前記光誘導機構は光ファイバケーブルを含む請求項７又は８記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置。The optical filter inspection device used in the micro LED emission inspection device according to claim 7 or 8, wherein the light guide mechanism includes an optical fiber cable.
  10. 　前記光学フィルターは前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係に関して前記キャリブレーションをもとにされたルックアップテーブルが作成される請求項７又は８記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置。The optical filter is a look based on the calibration with respect to a relationship between a ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter and the emission wavelength. The optical filter inspection device used for the micro LED light emission inspection device according to claim 7 or 8, wherein an uptable is created.
  11. 　前記所定の前記マイクロLEDの発光波長算出式は、前記光学フィルター無の配置における前記光エネルギ強度値と前記光学フィルター有の配置における前記光エネルギ強度値との比と前記発光波長との関係を前記キャリブレーションによって作成されたルックアップテーブルを前記デジタル画像処理装置内に含み、前記光エネルギ強度比測定値に対応する前記発光波長が前記ルックアップテーブルが参照され、中間値について按分補間を加算して前記発光波長が決定される請求項１０記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置。The predetermined emission wavelength calculation formula of the micro LED is the relationship between the emission wavelength and the ratio of the light energy intensity value in the arrangement without the optical filter and the light energy intensity value in the arrangement with the optical filter. A lookup table created by calibration is included in the digital image processing apparatus, the emission wavelength corresponding to the light energy intensity ratio measurement value is referred to the lookup table, and proportional distribution interpolation is added for an intermediate value. The optical filter inspection apparatus used for the micro LED emission inspection apparatus according to claim 10, wherein the emission wavelength is determined.
  12. 　請求項７から１１いずれか１項に記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置を含む請求項１から６いずれか１項目に記載のマイクロLED発光検査装置。The micro LED light emission inspection device according to any one of claims 1 to 6, which includes an optical filter inspection device used for the micro LED light emission inspection device according to any one of claims 7 to 11.
  13. 　前記デジタル画像処理装置は、永続的ストレッジへの接続インターフェースをさらに含み、前記フィルタ特性及び前記ルックアップテーブルはマスターデータとして永続的ストレッジから受入れ可能であり、前記デジタル画像処理装置内の前記メモリに格納される請求項１又は６に記載のマイクロLED発光検査装置。The digital image processing device further includes a connection interface to a persistent storage, the filter characteristic and the look-up table are receivable from the persistent storage as master data and stored in the memory in the digital image processing device. The micro LED light emission inspection device according to claim 1 or 6.
  14. 　前記デジタル画像処理装置は、前記撮像装置の光学的視野内に前記フィルタ特性のキャリブレーションのための既知の発光波長の光を参照光として配設可能である請求項６又は１２又は１３記載のマイクロLED発光検査装置。14. The micro according to claim 6, wherein the digital image processing device is capable of disposing light having a known emission wavelength for calibrating the filter characteristic as a reference light within an optical field of view of the imaging device. LED light emission inspection device.
  15. 　前記マイクロLED発光検査装置は、前記参照発光体の光強度モニタリングのための光センサをさらに備え、前記画像処理装置は、前記光センサの信号出力を受入れ、前記光センサの光強度モニタ値によって正規化された前記参照発光体の段階的光強度を用い前記キャリブレーションを補正可能に構成された前記画像処理装置である請求項１４に記載のマイクロLED発光検査装置。The micro LED light emission inspection device further comprises an optical sensor for monitoring the light intensity of the reference light emitter, the image processing device accepts a signal output of the optical sensor, and normalizes according to a light intensity monitor value of the optical sensor. 15. The micro LED light emission inspection device according to claim 14, wherein the image processing device is configured to be able to correct the calibration by using a stepwise light intensity of the converted reference light emitter.
  16. 　前記マイクロLED発光検査装置の前記制御装置は、前記フィルタ駆動機構で生成されるステータス信号の受信部をさらに含み、前記制御装置の前記制御部は前記フィルタ駆動機構に対して前記フィルタ無の選択を指示する制御信号を生成し、これを前記フィルタ駆動機構に送信可能であり、かつ前記制御装置は前記画像処理装置に対して前記光学フィルター無の配置における前記光エネルギ強度値の測定開始を指示する制御信号を生成し、これを制御信号送信部を介し前記画像処理装置へ送信可能であり、
    前記制御装置の前記制御部は、前記ステータス信号を前記フィルタ駆動機構から受信後又は検査開始の指示を受け入れると、引き続いて前記画像処理装置へ前記光学フィルター無の配置における前記光エネルギ強度値の測定開始を指示する制御信号を生成し、これを制御信号送信部を介し前記画像処理装置へ送信し、前記画像処理装置は、マイクロLEDマッピングデータ上で異常値を示すマイクロLEDをマイクロLED不良品と識別し、マイクロLED製品から除外するための不良品フラグデータを保持するマイクロLED不良品判定部を有する請求項１記載のマイクロLED発光検査装置。    The control device of the micro LED light emission inspection device further includes a receiving unit of a status signal generated by the filter driving mechanism, the control unit of the control device for the filter driving mechanism to select without the filter. A control signal for instructing can be generated and transmitted to the filter driving mechanism, and the control device instructs the image processing device to start measurement of the light energy intensity value in the arrangement without the optical filter. It is possible to generate a control signal and transmit the control signal to the image processing apparatus via a control signal transmission unit.
    When the control unit of the control device receives the status signal from the filter driving mechanism or receives an instruction to start an inspection, the image processing device subsequently measures the light energy intensity value in the arrangement without the optical filter. A control signal for instructing start is generated, and this is transmitted to the image processing device via a control signal transmission unit, and the image processing device indicates that the micro LED indicating an abnormal value on the micro LED mapping data is a micro LED defective product. The micro LED light emission inspection device according to claim 1, further comprising a micro LED defective product determination unit that holds defective product flag data for identifying and excluding it from the micro LED product.
  17. 　前記マイクロLED発光検査装置の前記デジタル画像処理装置は、前記マイクロLEDの配列設計データ入力のための外部接続路及びデータ入力部を含み、前記外部接続路を介して前記データ入力部から前記アレイ状に配列されたマイクロLEDの配列設計データを受入れ、前記デジタル画像処理装置内の前記メモリへ、前記アレイ状に配列されたマイクロLEDの配列設計データが格納され、前記マイクロLED不良品データと前記マイクロLEDの配列設計データとを照合し、正常マイクロLEDの配列の端部を認識しこれをもって前記マイクロLEDマップを更新するマイクロLEDマップ境界判定部を含む請求項１６記載のマイクロLED発光検査装置。The digital image processing device of the micro LED light emission inspection device includes an external connection path and a data input part for inputting array design data of the micro LED, and the array form from the data input part via the external connection path. The micro LED array design data arranged in the array is received, and the micro LED array design data arranged in the array is stored in the memory in the digital image processing apparatus, and the micro LED defective product data and the micro are stored. 17. The micro LED light emission inspection apparatus according to claim 16, further comprising a micro LED map boundary determination unit that collates with LED array design data, recognizes an end portion of a normal micro LED array, and updates the micro LED map accordingly.
  18. 　所定の光エネルギ強度特性及び所定の前記発光波長特性によって定められた所定の範疇に前記マイクロLEDを割り当てることを特徴とする請求項１記載のマイクロLED発光検査装置。The micro LED emission inspection device according to claim 1, wherein the micro LED is assigned to a predetermined category defined by a predetermined light energy intensity characteristic and a predetermined emission wavelength characteristic.
  19. 　請求項１記載の前記マイクロLED発光検査装置は前記光路の光軸に対する前記光学フィルタの傾斜を制御するための傾斜角制御信号の受信部を含むフィルタ光軸傾斜角駆動機構をさらに備え、前記所定の光波長帯域を有する光学フィルタは、所定の波長範囲の中心値よりも長い波長をフィルター透過率の半値として作成された誘電体薄膜光学フィルターを用い、前記光軸方向に対して前記光学フィルターの前記傾斜角を前記所定の波長範囲の中心値にフィルター透過率の半値を調整可能と構成されることを特徴とする請求項１記載のマイクロLED発光検査装置。2. The micro LED light emission inspection device according to claim 1, further comprising a filter optical axis tilt angle drive mechanism including a tilt angle control signal receiving unit for controlling the tilt of the optical filter with respect to the optical axis of the optical path. The optical filter having an optical wavelength band of, using a dielectric thin film optical filter created with a wavelength longer than the central value of a predetermined wavelength range as a half value of the filter transmittance, the optical filter of the optical filter with respect to the optical axis direction. 2. The micro LED light emission inspection device according to claim 1, wherein a half value of the filter transmittance can be adjusted such that the inclination angle is a center value of the predetermined wavelength range.
  20. 　請求項１記載の前記マイクロLED発光検査装置の前記制御装置の前記制御部は前記フィルタ駆動機構に対して所定の波長範囲の中心値よりも長い波長をフィルター透過率の半値として作成された薄膜光学フィルターの選択を指示する制御信号を生成し、前記フィルタ駆動機構及び前記フィルタ光軸傾斜角駆動機構と前記制御装置とは第１の通信ネットワークを介して双方向通信可能に構成され、
    前記制御装置と前記画像処理装置との間とは第２の通信ネットワークを介して双方向通信可能に構成され、
    前記制御装置は前記画像処理装置から第２の通信ネットワークを介して所定の前記単位映像体の前記光強度を取得可能に構成され、かつ前記制御装置の制御部は前記傾斜角制御信号を生成可能であり前記第１の通信ネットワークを介してこれを前記フィルタ光軸傾斜角駆動機構へ送信可能に構成されており、前記光軸方向に対して前記光学フィルターの前記傾斜角が前記所定の波長範囲の中心値にフィルター透過率の半値との差異が所定のしきい値内に収まるように前記傾斜角が構成されることを特徴とする請求項１９に記載のマイクロLED発光検査装置。    The control unit of the control device of the micro LED light emission inspection device according to claim 1 is a thin film optics created with a wavelength longer than the center value of a predetermined wavelength range as a half value of the filter transmittance with respect to the filter drive mechanism. A control signal for instructing selection of a filter is generated, and the filter drive mechanism, the filter optical axis tilt angle drive mechanism, and the control device are configured to be capable of bidirectional communication via a first communication network.
    The control device and the image processing device are configured to enable bidirectional communication via a second communication network.
    The control device is configured to be able to acquire the light intensity of a predetermined unit image body from the image processing device via a second communication network, and the control unit of the control device can generate the tilt angle control signal. It is configured so that it can be transmitted to the filter optical axis tilt angle drive mechanism via the first communication network, and the tilt angle of the optical filter is in the predetermined wavelength range with respect to the optical axis direction. 20. The micro LED light emission inspection apparatus according to claim 19, wherein the inclination angle is configured such that a difference between the center value of the filter and the half value of the filter transmittance falls within a predetermined threshold value.
  21. 　前記光強度ピクセルマップは、隣接するピクセル間は移動平均によって前記段階的光強度の平滑処理がなされる請求項１に記載のマイクロLED発光検査装置。The micro LED light emission inspection device according to claim 1, wherein the light intensity pixel map is subjected to a smoothing process of the stepwise light intensity by a moving average between adjacent pixels.
  22. 　前記マイクロLED上に重畳された前記マイクロLEDの発光波長は、隣接するマイクロLED間について移動平均によって前記光波長の平滑処理がなされる請求項１に記載のマイクロLED発光検査装置。The micro LED light emission inspection device according to claim 1, wherein the light emission wavelengths of the micro LEDs superposed on the micro LEDs are subjected to smoothing processing of the light wavelengths by a moving average between adjacent micro LEDs.
  23. 　請求項１記載の前記マイクロLED発光検査装置は前記光路の光軸に対する前記イメージセンサ傾斜角を制御するためのイメージセンサ傾斜角制御信号の受信部を含むイメージセンサ傾斜角駆動機構及び合焦のためのアクチュエータを前記撮像部はさらに備え、かつ前記制御装置と前記画像処理装置とは各々の通信部を介して通信可能に構成され、かつ前記制御装置の制御部は前記イメージセンサ傾斜角制御信号を生成可能であり前記通信部を介してこれを前記イメージセンサ傾斜角駆動機構へ送信可能に構成されており、
    　前記制御装置は前記通信部を介して前記画像処理装置から取得された前記光強度ピクセルマップにおいて、所定のコントラストで前記光強度ピクセルマップの光強度を調整し、調整後の段階的光強度によって合焦するように前記イメージセンサ光軸傾斜角駆動機構及び前記アクチュエータを駆動することを特徴とする請求項１記載のマイクロLED発光検査装置。    The micro LED light emission inspection device according to claim 1, further comprising: an image sensor tilt angle drive mechanism including an image sensor tilt angle control signal receiving unit for controlling the image sensor tilt angle with respect to the optical axis of the optical path, and for focusing. The image pickup unit further includes an actuator of, and the control device and the image processing device are configured to be communicable via respective communication units, and the control unit of the control device outputs the image sensor tilt angle control signal. It is possible to generate and transmit it to the image sensor tilt angle drive mechanism via the communication unit,
    The control device adjusts the light intensity of the light intensity pixel map with a predetermined contrast in the light intensity pixel map acquired from the image processing device via the communication unit, and adjusts the light intensity pixel map according to the adjusted stepwise light intensity. 2. The micro LED light emission inspection apparatus according to claim 1, wherein the image sensor optical axis tilt angle drive mechanism and the actuator are driven so as to focus.
  24. 　前記画像処理装置は、映像表示装置をさらに備え、複数のマイクロLEDの前記光強度特性と前記発光波長の二次元マップを生成し、前記映像表示装置に表示することを特徴とする請求項１に記載のマイクロLED発光検査装置。The image processing device further comprises a video display device, generates a two-dimensional map of the light intensity characteristics of the plurality of micro LEDs and the emission wavelength, and displays the two-dimensional map on the video display device. The described micro LED light emission inspection device.
  25. 　請求項１記載の前記マイクロLED発光検査装置は、さらに、前記制御部は、当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間は伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間は通信路を介して双方向通信可能と構成され、
    前記制御部の処理の開始とともに前記給電機構によってマイクロLEDを点灯するマイクロLED点灯ステップと、及び
    引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
    前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
    前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター無の配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタ無し光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
    前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
    前記制御部は、前記第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ちで前記第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信する、第２の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
    これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
    これに引き続き、前記マイクロLED検査部において、所定の前記マイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定する発光波長計算ステップと、及び
    前記マイクロLED検査データ出力のための外部接続路及びデータ出力部を含み、前記発光波長データを前記デジタル画像処理装置内の前記メモリを介して、前記データ出力部から外部接続路に出力するマイクロLED発光波長データ出力ステップと、を実行するモジュールを前記画像処理装置はさらに含む請求項１に記載のマイクロLED発光検査装置。    The micro LED light emission inspection device according to claim 1, further, the control unit includes a CPU and a memory for controlling the micro LED light emission inspection device, and between the filter drive mechanism and the control device. Configured to be communicable via a transmission line, and bidirectionally communicable between the control device and the image processing device via a communication line,
    The micro LED lighting step of lighting the micro LED by the power feeding mechanism with the start of the processing of the control section, and subsequently, the control section generates a signal for selecting a status in which the optical filter does not exist in the optical path, and further the transmission. After transmitting the signal to the filter drive mechanism via a path, the control unit immediately includes a first filter movement instruction step that waits for a start instruction notification of the first imaging, and the control unit includes a module that executes:
    The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
    When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
    When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
    Following this, in the unit image body identifying unit, the unit image body of the light emission is specified from the light intensity pixel map based on the predetermined criteria, and further unit image body mapping data to the pixel map is generated. Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map. The micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining an intensity and measuring the unfiltered light intensity of storing the light energy intensity value in the memory of the image processing device in the arrangement without the optical filter of the micro LED; Including processing equipment,
    When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
    The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
    When the control unit accepts the second imaging start instruction notification while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the second imaging start instruction signal. However, the control unit further includes a module that executes a second image capture start instruction step of transmitting the second image capture start instruction signal to the image processing apparatus via the communication path,
    When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
    Following this, in the unit image body identifying unit, the unit image body of the light emission is specified from the light intensity pixel map based on the predetermined criteria, and further unit image body mapping data to the pixel map is generated. Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map. The micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining the intensity, and measuring the filtered light intensity to be stored in the memory in the image processing device as the light energy intensity value in the arrangement of the micro LED with the optical filter;
    Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
    Subsequent to this, in the micro LED inspection unit, an emission wavelength calculation step of determining the emission wavelength of the micro LED according to a predetermined emission wavelength calculation formula of the micro LED, and an external connection path for outputting the micro LED inspection data. And a data output unit, via the memory in the digital image processing device via the memory, the micro LED emission wavelength data output step of outputting from the data output unit to an external connection path, a module for performing. The micro LED light emission inspection device according to claim 1, further comprising the image processing device.
  26. 　前記マイクロLED発光検査装置の光源は、前記光源の光波長の可変機構を備える既知の光波長の波長光源であり、前記マイクロLED発光検査装置は、さらに前記制御部に当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間で伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間で通信路を介して双方向通信可能と構成され、かつ
    前記制御部が処理の開始とともに前記可変機構によって前記光源の光波長の設定値を初期値に更新する、光波長初期化ステップと、
    前記可変機構によって前記光源の光波長を更新し、前記給電機構によって更新後の前記既知の光波長の波長光源を点灯するキャリブレーション光源点灯ステップと、及び
    引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
    前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
    前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにキャリブレーション光源マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記キャリブレーション光源マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされたキャリブレーション光源の前記光学フィルター無の配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタなし光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
    前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
    これに引き続き、第２の撮像の開始指示通知待ちとなっている前記制御部は、第２の撮像の開始指示を受け入れると、前記開始指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ送信し、後に他の処理待ちとなる第２のフィルタ移動指示ステップと、
    前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
    前記制御部は、前記第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ちで前記第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信する、第２の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに、前記マイクロLED識別部において、前記単位映像体から前記キャリブレーション光源マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされたキャリブレーション光源の前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
    これに引き続き、前記マイクロLED検査部において、前記キャリブレーション光源としての前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記キャリブレーション光源の前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
    引き続き、前記マイクロLED検査部において、前記既知の光源波長と前記光強度の比を前記メモリに格納するステップと、
    前記光源の光波長の設定値を所定の増分値で更新する光源波長更新ステップと、
    前記更新後の前記光源の光波長が所定の境界値を超えるか否かをチェックし、NOの場合には、キャリブレーション光源点灯ステップへ戻り、YESの場合には、ルックアップテーブル作成ステップへ進む、繰り返し判定ステップと、及び、
    前記繰り返しで前記メモリに格納された複数の前記波長と前記光強度の比の組からルックアップテーブルを作成し、これを前記メモリに格納するルックアップテーブル作成ステップと、を実行するモジュールを含む請求項５又は６に記載のマイクロLED発光検査装置。    The light source of the micro LED light emission inspection device is a wavelength light source having a known light wavelength including a variable mechanism of the light wavelength of the light source, and the micro LED light emission inspection device further includes the control unit of the micro LED light emission inspection device. A control CPU and a memory are provided, and the filter drive mechanism and the control device are configured to be communicable via a transmission path, and a communication path is provided between the control device and the image processing device. Configured to be capable of bidirectional communication via, and the control unit updates the set value of the light wavelength of the light source to the initial value by the variable mechanism at the start of processing, the light wavelength initialization step,
    A calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the wavelength light source of the known light wavelength after being updated by the power feeding mechanism, and a status in which the optical filter is not present in the optical path. After the control unit generates a signal for selecting, and further transmits the signal to the filter drive mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification The control unit includes a module that executes an instructing step,
    The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
    When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
    When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
    Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further generate unit image body mapping data to the pixel map, store it in the memory in the image processing apparatus, further consider the calibration light source mapping as the micro LED mapping, in the micro LED identification unit, The micro LED mapping data regarded as the calibration light source mapping is generated from a unit image body, stored in the memory, and the predetermined light energy is obtained from the light intensity on the light intensity map on the micro LED map. The light energy intensity of the micro LED is determined by an intensity calculation formula, and the memory in the image processing device as the light energy intensity value in the arrangement without the optical filter of the calibration light source regarded as the light emission of the micro LED. Measuring the unfiltered light intensity stored in the image processing device, and
    When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
    Subsequent to this, when the control unit waiting for the notification of the start instruction of the second imaging receives the start instruction of the second imaging, the control unit generates a signal for arranging the optical filter in the optical path based on the start instruction. Then, a second filter movement instruction step of transmitting to the filter driving mechanism via the transmission path and waiting for other processing later,
    The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
    When the control unit accepts the second imaging start instruction notification while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the second imaging start instruction signal. However, the control unit further includes a module that executes a second image capture start instruction step of transmitting the second image capture start instruction signal to the image processing apparatus via the communication path,
    When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
    Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further, it generates unit image body mapping data to the pixel map, stores it in the memory in the image processing device, and further, in the micro LED identification unit, it is regarded as the calibration light source mapping from the unit image body. The generated micro LED mapping data is stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining the intensity and measuring the filtered light intensity to be stored in the memory in the image processing device as the light energy intensity value in the arrangement with the optical filter of the calibration light source regarded as the emission of the micro LED. When,
    Following this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the calibration light source is read from the memory in the image processing device, and corresponds to the micro LED. The optical energy intensity value in the arrangement without the optical filter is read from the memory in the image processing apparatus, the optical energy intensity value of the calibration light source in the arrangement with the optical filter, and the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity and the filtered light intensity according to the light energy intensity value of
    Subsequently, in the micro LED inspection unit, a step of storing the ratio of the known light source wavelength and the light intensity in the memory,
    A light source wavelength updating step of updating the set value of the light wavelength of the light source with a predetermined increment value,
    It is checked whether the light wavelength of the light source after the update exceeds a predetermined boundary value. If NO, the process returns to the calibration light source lighting step, and if YES, the process proceeds to the lookup table creating step. , A repeat determination step, and
    A lookup table creation step of creating a lookup table from the plurality of sets of the ratio of the wavelength and the light intensity stored in the memory in the repetition, and storing the lookup table in the memory. Item 7. A micro LED light emission inspection device according to item 5 or 6.
  27. 　マイクロLED発光検査装置に用いる光学フィルタのための光学フィルタ検査装置は、さらに前記制御部に当該光学フィルタ検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間で伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間で通信路を介して双方向通信可能と構成され、かつ
    前記制御部が処理の開始とともに前記可変機構によって前記光源の光波長の設定値を初期値に更新する、光波長初期化ステップと、
    前記可変機構によって前記光源の光波長を更新し、前記給電機構によって更新後の前記既知の光波長の波長光源を点灯するキャリブレーション光源点灯ステップと、及び
    引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
    前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
    前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源の反射光をマイクロLEDの発光とみなし、前記反射光の単位映像体（反射光体という、本段落で以下同様）を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに反射光体マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記反射光体マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされた反射光の前記光学フィルター無の配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ無し光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
    前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
    これに引き続き、第２の撮像の開始指示通知待ちとなっている前記制御部は、第２の撮像の開始指示を受け入れると、前記開始指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ送信し、後に他の処理待ちとなる第２のフィルタ移動指示ステップと、
    前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源の反射光をマイクロLEDの発光とみなし、前記反射光の単位映像体（反射光体という、本段落で以下同様）を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに反射光体マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記反射光体マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの発光とみなされた反射光の前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
    これに引き続き、前記マイクロLED検査部において、前記キャリブレーション光源の反射光としての前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記キャリブレーション光源の前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
    引き続き、前記マイクロLED検査部において、前記既知の光源波長と前記光強度の比を前記メモリに格納するステップと、
    前記光源の光波長の設定値を所定の増分値で更新する光源波長更新ステップと、
    前記更新後の前記光源の光波長が所定の境界値を超えるか否かをチェックし、NOの場合には、キャリブレーション光源点灯ステップへ戻り、YESの場合には、ルックアップテーブル作成ステップへ進む、繰り返し判定ステップと、及び、
    前記繰り返しで前記メモリに格納された複数の前記波長と前記光強度の比の組からルックアップテーブルを作成し、これを前記メモリに格納するルックアップテーブル作成ステップと、を実行するモジュールを含む請求項１０又は１１に記載の光学フィルタ検査装置。    The optical filter inspection device for an optical filter used in the micro LED light emission inspection device further includes a CPU and a memory for controlling the optical filter inspection device in the control unit, and the filter drive mechanism and the control device. It is configured to be able to communicate with each other via a transmission path, and is configured to be capable of bidirectional communication between the control device and the image processing device via a communication path, and the control unit is configured to be variable upon the start of processing. Updating the set value of the light wavelength of the light source to an initial value by a mechanism, a light wavelength initialization step,
    A calibration light source lighting step of updating the light wavelength of the light source by the variable mechanism and lighting the wavelength light source of the known light wavelength after being updated by the power feeding mechanism, and a status in which the optical filter is not present in the optical path. After the control unit generates a signal for selecting, and further transmits the signal to the filter drive mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification The control unit includes a module that executes an instructing step,
    The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
    When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
    When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
    Subsequent to this, in the unit image body identification unit, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body of the reflected light (hereinafter referred to as reflected light body, in this paragraph). Same) is specified based on the predetermined criteria, unit image object mapping data to the pixel map is further generated, stored in the memory in the image processing device, and reflected light object mapping is performed on the micro LED. Considered as mapping, in the micro LED identification unit, to generate the micro LED mapping data regarded as the reflected light body mapping from the unit image body, store it in the memory, the light on the micro LED map The light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the intensity map, and the light energy of the reflected light regarded as the light emission of the micro LED in the arrangement without the optical filter is determined. The image processing apparatus includes a module that executes a step of measuring unfiltered light intensity stored in the memory in the image processing apparatus as an intensity value.
    When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
    Subsequent to this, when the control unit waiting for the notification of the start instruction of the second imaging receives the start instruction of the second imaging, the control unit generates a signal for arranging the optical filter in the optical path based on the start instruction. Then, a second filter movement instruction step of transmitting to the filter driving mechanism via the transmission path and waiting for other processing later,
    The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
    When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
    Subsequent to this, in the unit image body identification unit, the reflected light of the calibration light source is regarded as the light emission of the micro LED from the light intensity pixel map, and the unit image body of the reflected light (hereinafter referred to as reflected light body, in this paragraph). Same) is specified based on the predetermined criteria, unit image object mapping data to the pixel map is further generated, stored in the memory in the image processing device, and reflected light object mapping is performed on the micro LED. Considered as mapping, in the micro LED identification unit, to generate the micro LED mapping data regarded as the reflected light body mapping from the unit image body, store it in the memory, the light on the micro LED map The light energy intensity of the micro LED is determined by the predetermined light energy intensity calculation formula from the light intensity on the intensity map, and the light energy of the reflected light regarded as the light emission of the micro LED in the arrangement with the optical filter is determined. A step of measuring the light intensity with a filter stored in the memory in the image processing device as an intensity value, and
    Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement with the optical filter of the micro LED as the reflected light of the calibration light source is read from the memory in the image processing apparatus, The light energy intensity value in the arrangement without the optical filter corresponding to the LED is read from the memory in the image processing apparatus, the light energy intensity value of the calibration light source in the arrangement with the optical filter, and the optical filter. A step of calculating the ratio of the light intensity without a filter and the light intensity with a filter based on the light energy intensity value of the no arrangement, and
    Subsequently, in the micro LED inspection unit, a step of storing the ratio of the known light source wavelength and the light intensity in the memory,
    A light source wavelength updating step of updating the set value of the light wavelength of the light source with a predetermined increment value,
    It is checked whether the light wavelength of the light source after the update exceeds a predetermined boundary value. If NO, the process returns to the calibration light source lighting step, and if YES, the process proceeds to the lookup table creating step. , A repeat determination step, and
    A claim including a module that creates a look-up table from a plurality of pairs of the wavelength and light intensity ratios stored in the memory by the repetition, and stores the look-up table in the memory. Item 10. The optical filter inspection device according to item 10 or 11.
  28. 　請求項５又は６又は１２に準用される請求項５又は６に記載の前記マイクロLED発光検査装置は、さらに、前記制御部は、当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間は伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間は通信路を介して双方向通信可能と構成され、
    前記制御部の処理の開始とともに前記給電機構によってマイクロLEDを点灯するマイクロLED点灯ステップと、及び
    引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
    前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
    前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター無の配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタなし光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
    前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に第２の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
    前記制御部は、前記第２のフィルタ移動指示ステップの最終処理である第２の撮像開始指示待ちで前記第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信した後に、第２の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記発光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
    これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
    引き続き、前記マイクロLED検査部において、前記ルックアップテーブルの参照によって前記マイクロLEDの発光波長を決定するルックアップテーブル参照方式の発光波長決定ステップと、及び
    前記マイクロLEDの配列設計データ出力のための外部接続路及びデータ出力部を含み、前記発光波長データを前記デジタル画像処理装置内の前記メモリを介して、前記データ出力部から外部接続路に前記発光波長データを出力するマイクロLED発光波長データ出力ステップと、を実行するモジュールを含む請求項５又は６又は１２に記載のマイクロLED発光検査装置。    The micro LED light emission inspection device according to claim 5 or 6, which is applied mutatis mutandis to claim 5 or 6 or 12, further, the control unit includes a CPU and a memory for controlling the micro LED light emission inspection device. In addition, the filter drive mechanism and the control device are configured to be able to communicate via a transmission line, and the control device and the image processing device are configured to be capable of bidirectional communication via a communication path. ,
    The micro LED lighting step of lighting the micro LED by the power feeding mechanism with the start of the processing of the control section, and subsequently, the control section generates a signal for selecting a status in which the optical filter does not exist in the optical path, and further the transmission. After transmitting the signal to the filter drive mechanism via a path, the control unit immediately includes a first filter movement instruction step that waits for a start instruction notification of the first imaging, and the control unit includes a module that executes:
    The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
    When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
    When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
    Following this, the unit image body identification unit identifies the unit image body of the light emission from the light intensity pixel map based on the predetermined criteria, and further generates unit image body mapping data to the pixel map, which is used. Is stored in the memory in the image processing apparatus, and further, the micro LED identification unit identifies a plurality of micro LEDs arranged in an array from the unit image body and displays the corresponding micro LEDs on the pixel map. The micro LED mapping data is mapped, stored in the memory, and the optical energy of the micro LED is calculated from the light intensity on the light intensity map on the micro LED map by the predetermined optical energy intensity calculation formula. The image is a module that executes a step of determining the intensity and measuring the unfiltered light intensity in which the optical energy intensity value in the arrangement of the micro LED without the optical filter is stored in the memory in the image processing apparatus. Including processing equipment,
    When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a second imaging start instruction later.
    The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
    When the control unit receives the notification of the start instruction of the second imaging while waiting for the second imaging start instruction which is the final process of the second filter movement instruction step, the control unit generates the start instruction signal of the second imaging. The control unit further includes a module that executes the second imaging start instruction step after transmitting the second imaging start instruction signal to the image processing device via the communication path.
    When the image processing device receives the second imaging start instruction signal via the communication path, the image processing device accepts the video signal from the imaging device, and measures the pixel map on the image data frame at each pixel. A second imaging step of generating the light intensity pixel map on which the stepwise light intensity is superimposed and storing the pixel map in the memory in the image processing apparatus;
    Following this, the unit image body identification unit identifies the unit image body of the light emission from the light intensity pixel map based on the predetermined criteria, and further generates unit image body mapping data to the pixel map, which is used. Is stored in the memory in the image processing apparatus, and further, the micro LED identification unit identifies a plurality of micro LEDs arranged in an array from the unit image body and displays the corresponding micro LEDs on the pixel map. The micro LED mapping data is mapped, stored in the memory, and the optical energy of the micro LED is calculated by the predetermined optical energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. A step of determining the intensity and measuring the light intensity with a filter in which the optical energy intensity value in the arrangement of the micro LED with the optical filter is stored in the memory in the image processing apparatus.
    Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
    Subsequently, in the micro LED inspection unit, the emission wavelength determination step of the lookup table reference method for determining the emission wavelength of the micro LED by reference to the lookup table, and the external for the array design data output of the micro LED. A micro LED emission wavelength data output step that includes a connection path and a data output unit and outputs the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus. The micro LED light emission inspection device according to claim 5, 6 or 12, including a module for executing the following.
  29. 　前記マイクロLED発光検査装置の光源は、前記光源の光波長の可変機構を備える既知の光波長の波長光源であり、前記マイクロLED発光検査装置は、さらに前記制御部にCPU及びメモリを備え、
    前記制御部が処理の開始とともに前記可変機構によって前記光源の光波長の設定値を前記帯域幅の中心波長に更新する、光波長の中心波長設定ステップと、
    前記可変機構によって前記光源の光波長を前記中心波長へ更新し、前記給電機構によって前記光波長の波長光源を点灯する中心波長光源点灯ステップと、及び
    引続き前記光フィルタが前記光路に存在しないステータスを選択する信号を前記制御部が生成し、さらに前記伝送路を介して前記信号を前記フィルタ駆動機構へ送信した後に、前記制御部は直ちに最初の撮像の開始指示通知待ちとなる最初のフィルタ移動指示ステップと、を実行するモジュールを前記制御部は含み、
    前記フィルタ駆動機構は前記フィルタ駆動機構と前記制御装置の間の伝送路を介して前記光フィルタが前記光路に存在しないステータスを選択する信号を受入れ、前記光学フィルタを光路から外す最初のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構は含み、
    前記制御部は、第１の前記フィルタ移動指示ステップの最終処理である最初の撮像の開始指示通知待ちで最初の撮像の開始指示通知を受け入れると、前記制御部は前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    　前記画像処理装置は前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を前記所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに前記キャリブレーション光源マッピングを前記マイクロLEDマッピングとみなし、前記マイクロLED識別部において、前記単位映像体から前記キャリブレーション光源マッピングとみなされた前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、マイクロLEDとみなされた前記キャリブレーション光源発光体の前記光学フィルター無の配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ無し光強度を測定するステップと、を実行するモジュールを前記画像処理装置は含み、
    前記第２のフィルタ移動指示待ちとなっている前記制御部は、第２のフィルタ移動指示を受け入れると、当該指示に基づき前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介し前記フィルタ駆動機構へ当該信号を送信し、後に後続の撮像開始指示待ちとなる第２のフィルタ移動指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記フィルタ駆動機構は前記伝送路を介して前記光学フィルタを光路に配設する信号を前記制御部から受入れ、前記光学フィルタを光路に配設する第２のフィルタ移動ステップを実行するモジュールを前記フィルタ駆動機構はさらに含み、
    前記制御部は、後続の撮像開始指示待ちで前記後続の撮像の開始指示通知を受け入れると、前記後続の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記後続の撮像の開始指示信号を送信した後に、後続の撮像の開始指示ステップを実行するモジュールを前記制御部はさらに含み、
    前記画像処理装置は、前記通信路を介して前記後続の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する後続の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記キャリブレーション光源光をマイクロLEDの発光とみなし、前記キャリブレーション光源光の単位映像体を所定のクライテリアに基づき特定し、さらに前記ピクセルマップへの前記単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに前記マイクロLED識別部において、マイクロLEDの発光とみなされた前記キャリブレーション光源光を前記単位映像体からマイクロLEDとして特定し前記ピクセルマップ上にマッピングする前記マイクロLEDマッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDとみなされた前記キャリブレーション光源発光体のの前記光エネルギ強度を決定し、前記キャリブレーション光源の前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
    これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
    光強度の比が所定の判定幅内で0.5の近傍か否かを所定の判定条件によって判定し、
    前記判定条件がNOであれば、前記フィルタ光軸傾斜角駆動機構のためにフィルタの角の変動ステップを駆動する信号を生成し、当該信号を前記フィルタ光軸傾斜角駆動機構へ送信し、フィルタ角の変動ステップを実行するモジュールへ制御を分岐し、その後、前記後続の撮像の開始指示通知を前記制御部へ前記通信部を介し前記制御装置へ送信し、前記制御部の後続の撮像ステップを実行するモジュールへ制御を戻し、以降の処理をループさせ、
    前記前記判定条件がYESであれば、フィルタ角を前記メモリに格納する、フィルタ角を記録するステップへ分岐しループ処理を終了する、適正フィルタ角判定ステップと、を実行するモジュールを前記画像処理装置は含み、
    ここで、前記フィルタ光軸傾斜角駆動機構は、所定の幅で前記フィルタ角を変動させる前記フィルタ角の変動ステップを実行するモジュールを含む請求項２０に記載のマイクロLED発光検査装置。    The light source of the micro LED light emission inspection device is a wavelength light source having a known light wavelength including a variable mechanism of the light wavelength of the light source, and the micro LED light emission inspection device further includes a CPU and a memory in the control unit.
    The control unit updates the setting value of the light wavelength of the light source to the center wavelength of the bandwidth by the variable mechanism at the start of the process, the center wavelength setting step of the light wavelength,
    A center wavelength light source lighting step of updating the light wavelength of the light source to the center wavelength by the variable mechanism and turning on the wavelength light source of the light wavelength by the power feeding mechanism, and a status in which the optical filter is not present in the optical path. After the control unit generates the signal to be selected and further transmits the signal to the filter driving mechanism via the transmission path, the control unit immediately waits for the first imaging start instruction notification and then the first filter movement instruction. The control unit includes a step and a module for executing.
    The filter driving mechanism receives a signal for selecting a status in which the optical filter does not exist in the optical path via a transmission path between the filter driving mechanism and the control device, and a first filter moving step of removing the optical filter from the optical path. The filter drive mechanism includes a module for performing
    When the control unit accepts the first imaging start instruction notification while waiting for the first imaging start instruction notification that is the final process of the first filter movement instruction step, the control unit instructs the first imaging start instruction to be received. A first image capture start instruction step that waits for a second filter movement instruction is executed immediately after generating a signal and transmitting the first image capture start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module for
    When the image processing device receives the start instruction signal of the first imaging via the communication path, the image processing device accepts the video signal from the imaging device, and the pixel on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the map, and storing the light intensity pixel map in the memory in the image processing apparatus;
    Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on the predetermined criteria, Further generate unit image body mapping data to the pixel map, store it in the memory in the image processing apparatus, further considered the calibration light source mapping as the micro LED mapping, in the micro LED identification unit, Generate the micro LED mapping data regarded as the calibration light source mapping from the unit image body, store it in the memory, the predetermined light from the light intensity on the light intensity map on the micro LED map The light energy intensity of the micro LED is determined by an energy intensity calculation formula, and the light energy intensity value in the arrangement without the optical filter of the calibration light source luminous body regarded as a micro LED is used as the light energy intensity value in the image processing apparatus. The image processing apparatus includes a module that executes a step of measuring an unfiltered light intensity stored in a memory,
    When the controller waiting for the second filter movement instruction receives the second filter movement instruction, it generates a signal for arranging the optical filter in the optical path based on the instruction, and transmits the signal via the transmission path. The control unit further includes a module that transmits the signal to the filter driving mechanism, and executes a second filter movement instruction step that waits for a subsequent imaging start instruction later.
    The filter driving mechanism receives a signal for arranging the optical filter in the optical path from the control unit via the transmission path, and executes a second filter moving step of arranging the optical filter in the optical path with the module as the filter. The drive mechanism further includes
    When the control unit accepts the subsequent imaging start instruction notification while waiting for the subsequent imaging start instruction, the control unit generates the subsequent imaging start instruction signal and sends the subsequent imaging start instruction signal to the image processing apparatus via the communication path. The control unit further includes a module that executes a subsequent imaging start instruction step after transmitting an imaging start instruction signal,
    When the image processing device receives the subsequent imaging start instruction signal via the communication path, the image processing device receives the video signal from the imaging device, and the pixel map on the image data frame is measured at each pixel. A subsequent imaging step of generating the light intensity pixel map in which the target light intensity is superimposed and storing the light intensity pixel map in the memory in the image processing apparatus;
    Continuing on from this, in the unit image body identification unit, the calibration light source light from the light intensity pixel map is regarded as the light emission of the micro LED, and the unit image body of the calibration light source light is specified based on a predetermined criterion, and further, Generate the unit image body mapping data to the pixel map, store it in the memory in the image processing device, further, in the micro LED identification unit, the calibration light source light regarded as light emission of the micro LED Is generated from the unit image body as a micro LED to generate the micro LED mapping data to be mapped on the pixel map, which is stored in the memory in the image processing device, and the light intensity on the micro LED map. From the light intensity on the map to determine the light energy intensity of the calibration light source luminous body regarded as the micro LED by the predetermined light energy intensity calculation formula, in the arrangement with the optical filter of the calibration light source. Measuring a filtered light intensity stored in the memory in the image processing device as the light energy intensity value;
    Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
    Determine whether the ratio of the light intensity is near 0.5 within a predetermined determination width according to a predetermined determination condition,
    If the determination condition is NO, a signal for driving the step of changing the angle of the filter is generated for the filter optical axis tilt angle drive mechanism, and the signal is transmitted to the filter optical axis tilt angle drive mechanism. The control is branched to the module that executes the angle variation step, and then the start instruction notification of the subsequent imaging is transmitted to the control unit via the communication unit to the control device, and the subsequent imaging step of the control unit is performed. Return control to the module to be executed, loop the subsequent processing,
    If the determination condition is YES, a module that executes a proper filter angle determination step of storing a filter angle in the memory, branching to a step of recording the filter angle and ending the loop processing, is provided as the image processing apparatus. Includes,
    The micro LED light emission inspection device according to claim 20, wherein the filter optical axis tilt angle driving mechanism includes a module that executes a variable step of the filter angle that changes the filter angle by a predetermined width.
  30. 　製造プロセス管理コンピュータとの通信路及び製造データ入力部をさらに備え、前記通信路を介して前記製造プロセス管理コンピュータから製造条件を含む製造指示を受入れる製造指示受入れステップを実行するモジュールをさらに含む請求項２５又は２６又は２８又は２９に記載のマイクロLED発光検査装置。And a module for executing a manufacturing instruction receiving step of receiving a manufacturing instruction including manufacturing conditions from the manufacturing process management computer via the communication path. 25. The micro LED light emission inspection device according to 25, 26, 28 or 29.
  31. 　製造プロセス管理コンピュータへの通信路及び製造データ出力部をさらに備え、前記通信路を介して前記製造プロセス管理コンピュータへ前記キャリブレーションのデータその他の進捗データを含む製造プロセスデータを出力する製造データ出力ステップを実行するモジュールをさらに含む請求項２５又は２６又は２８から３０のいずれか１項に記載のマイクロLED発光検査装置。A manufacturing data output step further comprising a communication path to a manufacturing process management computer and a manufacturing data output unit, and outputting manufacturing process data including the calibration data and other progress data to the manufacturing process management computer via the communication path. 31. The micro LED light emission inspection apparatus according to claim 25, further comprising a module for executing the above.
  32. 　請求項１記載の前記マイクロLED発光検査装置は、さらに、前記制御装置が当該マイクロLED発光検査装置の制御のためのCPU及びメモリを備え、かつ前記フィルタ駆動機構と前記制御装置との間は伝送路を介して通信可能と構成され、かつ前記制御装置と前記画像処理装置との間は通信路を介して双方向通信可能と構成され、かつ前記制御装置の前記制御部は以下の、
    前記給電機構によってマイクロLEDを点灯するマイクロLED点灯ステップを実行するモジュールと、
    前記光フィルタが前記光路に存在しないステータスを選択する信号を生成し、さらに前記伝送路を介して、前記光フィルタが前記光路に存在しないステータスを選択するように前記フィルタ駆動機構を駆動する最初のフィルタ移動ステップを実行するモジュールと、
    最初の撮像の開始指示通知を受け入れ、前記第１の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第１の撮像の開始指示信号を送信した後に、直ちに第２のフィルタ移動指示待ちとなる第１の撮像の開始指示ステップを実行するモジュールと、
    第２のフィルタ移動指示を受け入れ、当該指示に基づき所定の前記光学フィルタを光路に配設する信号を生成し、前記伝送路を介して、前記光学フィルタを光路に配設するように前記フィルタ駆動機構を駆動する第２のフィルタ移動ステップを実行するモジュールと、及び
    第２の撮像の開始指示通知を受け入れると、前記第２の撮像の開始指示信号を生成し、前記通信路を介して前記画像処理装置へ前記第２の撮像の開始指示信号を送信する、第２の撮像の開始指示ステップを実行するモジュールを前記制御部は含み、
    前記画像処理装置は、前記通信路を介して前記第１の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、前記画像処理装置内に格納される画像データフレーム上の前記ピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第１の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記光強度ピクセルマップから前記所定のクライテリアに基づく前記発光の単位映像体を特定し、さらに前記ピクセルマップへの単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらにマイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列されたマイクロLEDを特定し対応する前記マイクロLEDを前記ピクセルマップ上にマッピングし前記マイクロLEDマッピングデータを生成し、これを前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター無の配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリに格納するフィルタなし光強度を測定するステップと、
    前記通信路を介して前記第２の撮像の開始指示信号を受信すると、前記撮像装置から前記映像信号を受け入れ、画像データフレーム上のピクセルマップへ各ピクセルで測定された前記段階的光強度が重畳された前記光強度ピクセルマップを生成し、これを前記画像処理装置内の前記メモリに格納する第２の撮像ステップと、
    これに引き続き、前記単位映像体識別部において、前記単位映像体識別部において、前記光強度ピクセルマップから前記所定のクライテリアに基づく前記発光の単位映像体を特定し、さらに前記ピクセルマップへの前記単位映像体マッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、さらに前記マイクロLED識別部において、前記単位映像体から複数の前記アレイ状に配列された前記マイクロLEDを特定し前記ピクセルマップ上にマッピングする前記マイクロLEDマッピングデータを生成し、これを前記画像処理装置内の前記メモリに格納し、前記マイクロLEDマップ上の前記光強度マップ上の光強度から前記所定の光エネルギ強度算出式によって前記マイクロLEDの前記光エネルギ強度を決定し、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値として前記画像処理装置内の前記メモリに格納するフィルタ有り光強度を測定するステップと、
    これに引き続き、前記マイクロLED検査部において、前記マイクロLEDの前記光学フィルター有りの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、当該マイクロLEDに対応する前記光学フィルター無しの配置における前記光エネルギ強度値を前記画像処理装置内の前記メモリから読み出し、前記光学フィルター有の配置における前記マイクロLEDの前記光エネルギ強度値と、前記光学フィルター無の配置の前記光エネルギ強度値とによって、フィルタ無し光強度とフィルタ有り光強度の比を計算するステップと、
    これに引き続き、前記マイクロLED検査部において、所定の前記マイクロLEDの発光波長算出式によって前記マイクロLEDの発光波長を決定する発光波長計算ステップと、及び
    前記マイクロLEDの配列製品データ出力のための外部接続路及びデータ出力部を含み、前記発光波長データを前記デジタル画像処理装置内の前記メモリを介して、前記データ出力部から外部接続路に前記発光波長データを出力するマイクロLED発光波長データ出力ステップと、を実行するモジュールを前記画像処理装置は含む請求項１に記載のマイクロLED発光検査装置。    The micro LED light emission inspection device according to claim 1 further includes a CPU and a memory for controlling the micro LED light emission inspection device, and transmission between the filter drive mechanism and the control device. It is configured to be communicable via a road, and bidirectional communication is possible between the control device and the image processing device via a communication path, and the control unit of the control device is described below.
    A module that performs a micro LED lighting step of lighting the micro LED by the power feeding mechanism,
    The optical filter generates a signal selecting a status not existing in the optical path, and further drives the filter driving mechanism to select a status not existing in the optical path by the optical filter via the transmission path. A module that performs the filter movement step,
    The first imaging start instruction signal is accepted, the first imaging start instruction signal is generated, and immediately after the first imaging start instruction signal is transmitted to the image processing apparatus via the communication path, the first imaging start instruction signal is transmitted. A module that executes a first imaging start instruction step waiting for a second filter movement instruction;
    The second filter movement instruction is received, a signal for arranging a predetermined optical filter in the optical path is generated based on the instruction, and the filter is driven so that the optical filter is arranged in the optical path via the transmission path. A module that executes a second filter moving step that drives the mechanism, and a second imaging start instruction notification are received, and a second imaging start instruction signal is generated, and the image is transmitted via the communication path. The control unit includes a module that transmits the second imaging start instruction signal to the processing device, and executes a second imaging start instruction step,
    When the image processing device receives the start instruction signal for the first imaging via the communication path, the image processing device accepts the video signal from the imaging device and stores the image signal on the image data frame stored in the image processing device. A first imaging step of generating the light intensity pixel map in which the stepwise light intensity measured at each pixel is superimposed on the pixel map, and storing the light intensity pixel map in the memory in the image processing apparatus;
    Continuing on from this, in the unit image body identification unit, the unit image body of the light emission based on the predetermined criteria is specified from the light intensity pixel map, and further unit image body mapping data to the pixel map is generated. Stored in the memory in the image processing device, further, in the micro LED identification unit, to identify the micro LED arranged in a plurality of the array from the unit image body and the corresponding micro LED on the pixel map. The micro LED mapping data is generated by mapping and stored in the memory, and the light energy of the micro LED is calculated by the predetermined light energy intensity calculation formula from the light intensity on the light intensity map on the micro LED map. Determining an intensity, and measuring an unfiltered light intensity for storing the light energy intensity value in the optical filter-less arrangement of the micro LED in the memory in the image processing apparatus,
    When the second imaging start instruction signal is received via the communication path, the video signal is received from the imaging device, and the stepwise light intensity measured at each pixel is superimposed on the pixel map on the image data frame. A second imaging step of generating the stored light intensity pixel map and storing the generated light intensity pixel map in the memory in the image processing apparatus;
    Continuing to this, in the unit image body identifying unit, the unit image body identifying unit identifies the unit image body of the light emission based on the predetermined criteria from the light intensity pixel map, and further, the unit to the pixel map. Image body mapping data is generated and stored in the memory in the image processing apparatus, and further, in the micro LED identification section, the unit image bodies are used to identify the plurality of micro LEDs arranged in the array. The micro LED mapping data to be mapped on the pixel map is generated, stored in the memory in the image processing device, and the predetermined light energy is calculated from the light intensity on the light intensity map on the micro LED map. The light energy intensity of the micro LED is determined by an intensity calculation formula, and the light intensity with the filter stored in the memory as the light energy intensity value in the arrangement of the micro LED with the optical filter is measured. Steps to
    Subsequent to this, in the micro LED inspection unit, the light energy intensity value in the arrangement of the micro LED with the optical filter is read from the memory in the image processing apparatus, and the optical filter corresponding to the micro LED is not provided. The light energy intensity value in the arrangement is read from the memory in the image processing apparatus, the light energy intensity value of the micro LED in the arrangement with the optical filter, and the light energy intensity value in the arrangement without the optical filter. Calculating the ratio of the unfiltered light intensity to the filtered light intensity,
    Following this, in the micro LED inspection unit, an emission wavelength calculation step of determining the emission wavelength of the micro LED by a predetermined emission wavelength calculation formula of the micro LED, and an external for outputting the array product data of the micro LED. A micro LED emission wavelength data output step that includes a connection path and a data output unit and outputs the emission wavelength data from the data output unit to an external connection path via the memory in the digital image processing apparatus. The micro LED light emission inspection device according to claim 1, wherein the image processing device includes a module for executing the following.
  33. 　前記マイクロLED発光検査装置の前記画像処理装置は、製造条件データ出力部をさらに備え、前記サブストレート全体映像、１又は複数の前記単位映像体マッピングデータ及びこれに対応する前記光強度特性及び前記発光波長特性及び前記範疇のうち少なくとも一つを含む前記マイクロLEDマッピングデータ又はマイクロLEDの前記光強度特性の少なくともいずれか１つから所定のデータを所定のデータ形式に変換し製造条件データとして生成及び出力することを特徴とする請求項１又は２５又は３２に記載のマイクロLED発光検査装置を含むマイクロLED製造装置。The image processing device of the micro LED light emission inspection device further includes a manufacturing condition data output unit, and the whole substrate image, one or a plurality of the unit image body mapping data, and the light intensity characteristic and the light emission corresponding thereto. Converts predetermined data from at least one of the micro LED mapping data including at least one of the wavelength characteristics and the above category or the light intensity characteristics of the micro LED into a predetermined data format, and generates and outputs it as manufacturing condition data. 33. A micro LED manufacturing apparatus including the micro LED light emission inspection apparatus according to claim 1, 25, or 32.
  34. 　前記マイクロLED発光検査装置の前記画像処理装置は、前記発光波長の二次元マップをさらに出力することを特徴とする請求項３３に記載のマイクロLED発光検査装置を含むマイクロLED製造装置。34. The micro LED manufacturing apparatus including the micro LED light emission inspection apparatus according to claim 33, wherein the image processing device of the micro LED light emission inspection apparatus further outputs a two-dimensional map of the light emission wavelength.
  35. 　前記反射体は、クロムを主成分とする金属膜から成る請求項７に記載のマイクロLED発光検査装置に用いる光学フィルタ検査装置。The reflector is an optical filter inspection device used in the micro LED light emission inspection device according to claim 7, which is made of a metal film containing chromium as a main component.
  36. 　全自動化された製造プロセスに組み込まれたマイクロLED発光検査方法は、請求項１記載の前記マイクロLED発光検査装置を用い、以下の段階、
    アライメントマーク情報を含むサブストーレートのジオメオリ情報、マイクロLEDのジオメトリ情報及びマイクロLEDアレイのジオメトリ情報を受け入れる製品情報取得段階と、引き続き実行される、
    １又は複数の前記ジオメトリ情報から前記サブストレート上で局所的な製品品質のばらつき及び/又は異常を認識及び管理するための製造管理区域を設定する製造管理区域設定段階と、引き続き実行される、
    ネットワーク手段によって接続された製造ライン制御コンピュータに検査受け入れ可能状態を前記ネットワーク手段を介して通知する検査受け入れ可能通知段階と、引き続き実行される、
    前記製造ライン制御コンピュータからマイクロLEDウェハ製造情報を受信する製造情報受け入れ段階と、引き続き実行される、
    検査ベッド上に前記ウェハを搭載するウェハ搭載段階と、引き続き実行される、
    画像処理装置によって前記サブストレートの全体像を撮像し、前記サブストレートに前記製造管理区域をマッピングする製造管理区域マッピング段階と、
    画像処理装置によって前記サブストレート上に配設された前記マイクロLEDを前記画像処理装置内に生成された画像フレーム上にマッピングするマイクロLEDマッピング段階と、引き続き実行される、
    前記画像処理装置によって、マイクロLEDチップを点灯し発光強度と発光波長を測定するマイクロLED特性測定段階と、引き続き実行される、
    前記画像処理装置によって、前記マイクロLED特性を元に所定の分類条件によって前記発光強度と前記発光波長のマトリックスで分類された異常分類を含むカテゴリ情報を前記マイクロLEDマップ情報に付し、全マイクロLEDチップを分類仕分けするマイクロLED仕分け段階と、引き続き実行される、
    前記画像処理装置によって、前記カテゴリ情報の付された前記マイクロLEDを前記製造管理区域マップにオーバーレイし、前記製造管理区域に関しマイクロLED製造プロセス状態を認識する製造プロセス状態判定段階と、引き続き実行される、
    前記画像処理装置によって、前記ネットワーク手段を介して前記製造ライン制御コンピュータへ前記仕分け情報と前記製造プロセス状態を送信する検査結果送信段階と、引き続き実行される、
    検査終了状態を前記ネットワーク手段を介して前記製造ライン制御コンピュータへ検査終了通知を送信する検査終了通知段階と、
    を含む、全自動化された製造プロセスに組み込まれたマイクロLED発光検査装置の使用方法。    A micro LED light emission inspection method incorporated in a fully automated manufacturing process uses the micro LED light emission inspection device according to claim 1, the following steps:
    The product information acquisition stage that accepts sub-strate geomeoli information including alignment mark information, micro LED geometry information, and micro LED array geometry information, and continues to be executed.
    A manufacturing control area setting step of setting a manufacturing control area for recognizing and managing local product quality variability and / or anomalies on the substrate from one or more of the geometry information, followed by execution.
    An inspection acceptability notifying step of notifying the production line control computer connected by the network means of the inspection acceptability state via the network means, and subsequently executed.
    A manufacturing information receiving step of receiving micro LED wafer manufacturing information from the manufacturing line control computer, and subsequently executed;
    A wafer mounting step of mounting the wafer on the inspection bed, and subsequently executed,
    A manufacturing control area mapping step of capturing an overall image of the substrate by an image processing device and mapping the manufacturing control area on the substrate,
    A micro LED mapping step of mapping the micro LEDs disposed on the substrate by the image processing apparatus onto an image frame generated in the image processing apparatus is subsequently performed.
    By the image processing device, a micro LED characteristic measuring step of lighting the micro LED chip and measuring the emission intensity and the emission wavelength, and subsequently executed.
    The image processing apparatus attaches category information including anomalous classification classified by a matrix of the emission intensity and the emission wavelength according to a predetermined classification condition based on the micro LED characteristics to the micro LED map information, and all micro LEDs. Micro LED sorting stage to sort and sort chips, and continue to run,
    The image processing apparatus overlays the microLED with the category information on the manufacturing control area map, and continues to execute a manufacturing process state determination step of recognizing the microLED manufacturing process state with respect to the manufacturing control area. ,
    The image processing apparatus continues to execute the inspection result transmission step of transmitting the sorting information and the manufacturing process state to the manufacturing line control computer via the network means.
    An inspection end notification step of transmitting an inspection end notification to the manufacturing line control computer via the network means,
    A method of using a micro LED emission inspection device incorporated into a fully automated manufacturing process, including:
PCT/IB2020/051681 2019-03-02 2020-02-27 Micro led light emission inspection device, inspection device for optical filter used in said device, and micro led light emission inspection method using said device incorporated in manufacturing process WO2020178680A1 (en)

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KR1020217031780A KR102607139B1 (en) 2019-03-02 2020-02-27 A micro LED luminescence inspection device, an inspection device for an optical filter used in the device, and a micro LED luminescence inspection method using the device inserted into the manufacturing process.

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