CN113498554A - 发光板、线路板以及显示装置 - Google Patents

发光板、线路板以及显示装置 Download PDF

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Publication number
CN113498554A
CN113498554A CN202080000063.0A CN202080000063A CN113498554A CN 113498554 A CN113498554 A CN 113498554A CN 202080000063 A CN202080000063 A CN 202080000063A CN 113498554 A CN113498554 A CN 113498554A
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electrode
sub
trace
light
units
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CN202080000063.0A
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English (en)
Inventor
杨明
谷其兵
胡国锋
时凌云
玄明花
张粲
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Publication of CN113498554A publication Critical patent/CN113498554A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种发光板、线路板以及显示装置。发光板包括：衬底基板(100)以及位于衬底基板(100)上的发光单元(200)。发光单元(200)包括发光子单元(201)，发光子单元(201)包括连接线路单元(210)以及与连接线路单元(210)连接的一个发光二极管芯片(220)。连接线路单元(210)包括至少两个电接触点对(211)，每个电接触点对(211)包括第一电极接触点(2112)和第二电极接触点(2111)，每个连接线路单元(210)中，各第二电极接触点(2111)彼此电连接，各第二电极接触点(2112)彼此电连接，且每个连接线路单元(210)中仅一个电接触点对(211)与发光二极管芯片(220)连接。发光板既可以通过提供备用电接触点对提高产品的绑定良率，还可以降低负极走线的功耗。

Description

PCT国内申请，说明书已公开。

Claims (18)

  1. PCT国内申请，权利要求书已公开。
CN202080000063.0A 2020-01-21 2020-01-21 发光板、线路板以及显示装置 Pending CN113498554A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/073558 WO2021146931A1 (zh) 2020-01-21 2020-01-21 发光板、线路板以及显示装置

Publications (1)

Publication Number Publication Date
CN113498554A true CN113498554A (zh) 2021-10-12

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US (2) US11869921B2 (zh)
EP (1) EP4095918A4 (zh)
JP (1) JP2023520088A (zh)
CN (1) CN113498554A (zh)
TW (1) TWI764471B (zh)
WO (1) WO2021146931A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115327815A (zh) * 2020-01-21 2022-11-11 京东方科技集团股份有限公司 发光板、线路板以及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014149864A1 (en) * 2013-03-15 2014-09-25 LuxVue Technology Corporation Light emitting diode display with redundancy scheme and method of fabricating a light emitting diode display with integrated defect detection test
US20150371585A1 (en) * 2014-06-18 2015-12-24 X-Celeprint Limited Micro assembled led displays and lighting elements
KR20170049117A (ko) * 2015-10-28 2017-05-10 엘지디스플레이 주식회사 발광 다이오드 표시 장치 및 이의 제조 방법과 리페어 방법
US20180211582A1 (en) * 2015-06-10 2018-07-26 Apple Inc. Display panel redundancy schemes
CN208014703U (zh) * 2018-03-29 2018-10-26 昆山工研院新型平板显示技术中心有限公司 驱动背板、微发光二极管显示面板及显示器
CN110211987A (zh) * 2018-12-12 2019-09-06 友达光电股份有限公司 发光二极管面板

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Publication number Priority date Publication date Assignee Title
US20130001546A1 (en) 2010-03-26 2013-01-03 Tsuyoshi Kamada Display device and method for producing array substrate for display device
CN106663734B (zh) 2014-06-10 2019-06-14 世迈克琉明有限公司 半导体发光元件
US9930277B2 (en) 2015-12-23 2018-03-27 X-Celeprint Limited Serial row-select matrix-addressed system
CN107256871B (zh) * 2017-06-27 2019-09-27 上海天马微电子有限公司 微发光二极管显示面板和显示装置
CN107657900A (zh) 2017-09-25 2018-02-02 上海九山电子科技有限公司 一种阵列基板、显示面板及显示装置
TWI649738B (zh) 2017-11-17 2019-02-01 英屬開曼群島商錼創科技股份有限公司 顯示面板及其修復方法
CN209015627U (zh) 2018-08-10 2019-06-21 佛山市国星光电股份有限公司 一种led显示单元组及显示面板
CN110190176A (zh) 2019-04-23 2019-08-30 深圳康佳电子科技有限公司 一种Micro-LED透明显示模块及系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014149864A1 (en) * 2013-03-15 2014-09-25 LuxVue Technology Corporation Light emitting diode display with redundancy scheme and method of fabricating a light emitting diode display with integrated defect detection test
US20150371585A1 (en) * 2014-06-18 2015-12-24 X-Celeprint Limited Micro assembled led displays and lighting elements
US20180211582A1 (en) * 2015-06-10 2018-07-26 Apple Inc. Display panel redundancy schemes
KR20170049117A (ko) * 2015-10-28 2017-05-10 엘지디스플레이 주식회사 발광 다이오드 표시 장치 및 이의 제조 방법과 리페어 방법
CN208014703U (zh) * 2018-03-29 2018-10-26 昆山工研院新型平板显示技术中心有限公司 驱动背板、微发光二极管显示面板及显示器
CN110211987A (zh) * 2018-12-12 2019-09-06 友达光电股份有限公司 发光二极管面板

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Publication number Publication date
US20240079443A1 (en) 2024-03-07
TWI764471B (zh) 2022-05-11
JP2023520088A (ja) 2023-05-16
EP4095918A4 (en) 2023-11-01
US20220123044A1 (en) 2022-04-21
WO2021146931A1 (zh) 2021-07-29
US11869921B2 (en) 2024-01-09
TW202129958A (zh) 2021-08-01
EP4095918A1 (en) 2022-11-30

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Inventor after: Gu Qibing

Inventor after: Hu Guofeng

Inventor after: Shi Lingyun

Inventor after: Xuanminghua

Inventor after: Zhang Can

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Inventor after: Shi Lingyun

Inventor after: Xuanminghua

Inventor after: Zhang Can

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