CN113498313A - 供料器以及部件安装装置 - Google Patents

供料器以及部件安装装置 Download PDF

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Publication number
CN113498313A
CN113498313A CN202110286523.7A CN202110286523A CN113498313A CN 113498313 A CN113498313 A CN 113498313A CN 202110286523 A CN202110286523 A CN 202110286523A CN 113498313 A CN113498313 A CN 113498313A
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CN
China
Prior art keywords
feeder
data processing
sprocket
data
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110286523.7A
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English (en)
Chinese (zh)
Inventor
小原悟见
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Publication of CN113498313A publication Critical patent/CN113498313A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/086Supply management, e.g. supply of components or of substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/0882Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202110286523.7A 2020-03-18 2021-03-17 供料器以及部件安装装置 Pending CN113498313A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020047516A JP7454973B2 (ja) 2020-03-18 2020-03-18 フィーダ及び部品実装装置
JP2020-047516 2020-03-18

Publications (1)

Publication Number Publication Date
CN113498313A true CN113498313A (zh) 2021-10-12

Family

ID=77849367

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110286523.7A Pending CN113498313A (zh) 2020-03-18 2021-03-17 供料器以及部件安装装置

Country Status (2)

Country Link
JP (1) JP7454973B2 (ja)
CN (1) CN113498313A (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008283A (ja) * 2001-06-22 2003-01-10 Nagata Seiki Co Ltd 電子部品供給装置
JP4145524B2 (ja) * 2001-12-19 2008-09-03 オータックス株式会社 パチンコ台の運転装置
JP2004257126A (ja) * 2003-02-26 2004-09-16 Aisin Seiki Co Ltd 車両用ドア開閉装置
JP2011023501A (ja) * 2009-07-15 2011-02-03 Panasonic Corp パーツフィーダ
JP6906282B2 (ja) * 2016-09-09 2021-07-21 株式会社Fuji フィーダ
JP6884533B2 (ja) * 2016-09-14 2021-06-09 Juki株式会社 電子部品実装装置及び電子部品実装方法

Also Published As

Publication number Publication date
JP2021150430A (ja) 2021-09-27
JP7454973B2 (ja) 2024-03-25

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