CN113497542A - Power unit - Google Patents

Abstract

The invention discloses a power unit. The power unit includes: a substrate, a first side of the substrate having a first side; a tab structure located on the first side of the substrate; a power structure pressed against the first side by the tab structure. According to the power unit, the pressing sheet structure is used for pressing the power structure against the first side face of the substrate, so that the power structure can be firmly and reliably mounted on the substrate.

Description

Power unit

Technical Field

The invention relates to the technical field of frequency converters, in particular to a power unit.

Background

In the existing frequency converter, the power structure needs to be installed on the substrate and is suitable for being connected with the driving circuit board and the multilayer busbar, but the power structure is installed on the substrate insecurely and is easy to fall off from the substrate, so that a fixing structure is added in some schemes and is fixed on the substrate. However, in the prior art, after the power structure is connected with the driving circuit board and the multilayer busbar through the fixing structure, a long pin is needed to pass through the busbar and the driving circuit board, which results in a large volume of the whole device. In addition, the pins of the power structures are prone to interfere with each other, and failure is prone to occur. And when the power structure is installed on the substrate by using the fixing structure in the existing product, the process is complex and the installation efficiency is low.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the above-mentioned problems in the prior art. Therefore, the invention provides a power unit which is beneficial to improving the firmness of the installation of a power structure on a substrate.

The power unit according to an embodiment of the present invention includes: a substrate, a first side of the substrate having a first side; a tab structure located on the first side of the substrate; a power structure pressed against the first side by the tab structure.

According to the power unit provided by the embodiment of the invention, the pressing sheet structure is utilized to press the power structure against the first side surface of the substrate, so that firm and reliable installation of the power structure on the substrate can be ensured.

According to some embodiments of the invention, the power unit further comprises: the first holding structure extends from the substrate towards the direction far away from the first side surface and penetrates through the tabletting structure, so that the tabletting structure is held on the first side of the substrate.

Further, the power unit further includes: a second retaining structure that retains the wafer structure on the first side of the substrate by mating with the first retaining structure.

Optionally, the first retaining structure is configured as a columnar structure, and the second retaining structure is configured as an annular structure that is sleeved on the columnar structure.

Specifically, the first holding structure is perpendicular to the first side surface and has a free end far away from the substrate, and the second holding structure is rotatably sleeved on the first holding structure from the side of the tabletting structure far away from the substrate.

According to some embodiments of the invention, the first retaining structure is configured as a threaded rod having an external thread and the second retaining structure is configured as a nut having an internal thread.

According to some embodiments of the invention, the second retaining structure presses against a side of the sheeting structure facing away from the base plate.

According to some embodiments of the invention, the preform structure comprises: the pressing sheet body is formed into a concave groove body structure which is concave towards the first side face, and the opening of the pressing sheet body deviates from the first side face.

Further, at least a portion of the second retaining structure is located within the recessed pocket of the wafer body, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

Specifically, the second holding structure presses against the bottom wall of the tablet pressing body, the first holding structure penetrates through the bottom wall of the tablet pressing body, and a tablet pressing body positioning hole matched with the first holding structure is formed in the bottom wall of the tablet pressing body.

According to some embodiments of the invention, the preform structure comprises: the pressing piece comprises a pressing piece body and a pressing piece arm, wherein the pressing piece arm is connected to the pressing piece body and is used for pressing the power structure.

Specifically, the power structure includes: a first power structure and a second power structure, the first and second power structures spaced apart; the tablet arm includes: the first pressing plate arm is used for pressing the first power structure, the second pressing plate arm is used for pressing the second power structure, and the pressing plate body is located between the first power structure and the second power structure.

Further, the first power structure has a first connection foot, the second power structure has a second connection foot, the first connection foot and the second connection foot are respectively located on opposite outer sides of the first power structure and the second power structure, and the wafer body is located between opposite inner sides of the first power structure and the second power structure.

Optionally, an included angle between the extending direction of the first connecting foot portion from the first power structure and the extending direction of the second connecting foot portion from the second power structure is 180 degrees.

According to some embodiments of the present invention, the first power structures and the second power structures are oppositely arranged in a first direction of the substrate, the first power structures are plural and arranged on the substrate in a second direction of the substrate, the second power structures are plural and arranged on the substrate along the second direction, and the wafer structures are plural and arranged along the second direction, wherein the first direction and the second direction are perpendicular to each other.

Further, the plurality of first power structures, the plurality of pad structures, and the plurality of second power structures correspond to one another in the first direction.

According to some embodiments of the invention, a plurality of the wafer structures are connected as a single body by a wafer connecting portion.

Further, the tabletting connecting part is connected between the tabletting bodies of two adjacent tabletting structures.

According to some embodiments of the invention, the preform structure comprises: the first holding structure penetrates through the pressing sheet body, and the pressing sheet arm is connected with the pressing sheet body in parallel in the first direction of the substrate and is used for pressing the power structure; the pressing structure is a plurality of pressing structures, the pressing structures are connected with each other in a second direction of the substrate, and the first direction and the second direction are perpendicular to each other.

Further, the sheeting arm comprises: the first pressing arm and the second pressing arm are symmetrically connected to two sides of the pressing body; and the tabletting bodies of two adjacent tabletting structures are connected with each other through a tabletting connecting part.

Specifically, the tablet body is formed into a concave groove structure which is concave towards the first side surface, the opening of the tablet body is away from the first side surface, the first tablet arm and the second tablet arm are respectively connected to two ends of the opening of the tablet body, and the first tablet arm and the second tablet arm extend towards directions away from each other.

According to some embodiments of the invention, the power unit further comprises: and the positioning part is used for positioning the power structure on the substrate.

According to some embodiments of the invention, the positioning part comprises a positioning sheet, and a through positioning hole is formed in the positioning sheet and matched with the power structure.

Optionally, an annular positioning rib surrounding the positioning opening is further arranged on the positioning sheet, and the annular positioning rib is matched with the outer peripheral surface of the power structure.

According to some embodiments of the invention, the spacer is an insulating spacer and is adhesively secured to the first side of the substrate.

According to some embodiments of the invention, the spacer is provided with a spacer through hole for mating with the first retaining structure and allowing the first retaining structure to pass through to form a locating fit.

According to some embodiments of the invention, the positioning portion comprises a groove formed on the first side of the substrate, the groove matching an outer circumferential surface of the power structure.

According to some embodiments of the invention, the power unit further comprises: a thermal isolation structure disposed on the first side of the substrate in a manner surrounding the power structure.

According to some embodiments of the invention, the first side of the substrate is a side facing a busbar.

According to some embodiments of the invention, the wafer structure is configured as a gull wing type and comprises a wafer body and first and second wafer arms symmetrically connected on both sides of the wafer body, and free ends of the first and second wafer arms each have a bent section bent toward the base plate.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a perspective assembly view of a power unit;

FIG. 2 is an assembled side view of the power unit;

FIG. 3 is a perspective exploded schematic view of the power unit;

FIG. 4 is an exploded side view of the power unit;

FIG. 5 is a schematic perspective view of the power unit assembled when the substrate is provided with a protruding strip;

FIG. 6 is an exploded view of the power unit with a recess formed in the substrate;

FIG. 7 is a schematic perspective view of the power unit with a groove formed in the substrate;

FIG. 8 is an assembled side view of the power cell with a recess provided in the substrate;

fig. 9 is a perspective view of a tablet configuration.

Reference numerals:

the power unit 100, the substrate 10, the protruding strip 11, the groove 12, the tablet structure 20, the tablet body 21, the tablet body positioning hole 211, the tablet arm 22, the first tablet arm 221, the second tablet arm 222, the tablet connecting portion 23, the bending section 24, the power structure 30, the first power structure 31, the first connecting leg 311, the second power structure 32, the second connecting leg 321, the first leg 331, the second leg 332, the third leg 333, the retaining structure 45, the first retaining structure 40, the second retaining structure 50, the positioning sheet 60, the positioning hole 61, the annular positioning rib 62, the positioning sheet through hole 63, and the heat insulation structure 60'.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The power cell 100 according to an embodiment of the present invention is described in detail below with reference to fig. 1-9.

Referring to fig. 1 to 8, a power unit 100 according to an embodiment of the present invention may include: a substrate 10, a wafer structure 20, and a power structure 30, wherein a first side (i.e. the upper side in fig. 2) of the substrate 10 has a first side surface, the wafer structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the wafer structure 20.

According to the power unit 100 of the embodiment of the invention, the pressing structure 20 is used for pressing the power structure 30 against the first side of the substrate 10, so that the power structure 30 can be firmly and reliably mounted on the substrate 10.

Referring to fig. 1-9, the power unit 100 further includes: a retaining structure 45, the retaining structure 45 comprising: the first holding structure 40, the first holding structure 40 extends from the substrate 10 to a direction away from the first side surface, and the first holding structure 40 penetrates the wafer structure 20, so that the wafer structure 20 is held on the first side of the substrate 10, and the power structure 30 is held on the first side of the substrate 10 by pressing the wafer structure 20 against the power structure 30. In other words, referring to fig. 2 and 8, the first holding structure 40 penetrates the wafer structure 20 from bottom to top, and the wafer structure 20 is held on the first side of the substrate 10 by the first holding structure 40, that is, when the first holding structure 40 penetrates the wafer structure 20, the relative position between the wafer structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role in positioning the wafer structure 20.

In some embodiments, not shown, the wafer structure 20 may also be directly attached, e.g., soldered, to the substrate 10, while the retaining structure 45 is eliminated, thereby advantageously reducing the number of connecting components and thus the weight of the power unit 100.

Further, referring to fig. 1-8, the retaining structure 45 further comprises: a second retaining structure 50, the second retaining structure 50 being adapted to engage the first retaining structure 40 to retain the wafer structure 20 on the first side of the substrate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the wafer structure 20 facing away from the substrate 10. As shown in fig. 2, the second holding structure 50 is connected to the first holding structure 40 at the upper side of the tablet structure 20, and the upper side of the tablet structure 20 is open to leave an operation space for mounting and dismounting the second holding structure 50. The wafer structure 20 is clamped between the second holding structure 50 and the substrate 10, while the power structure 30 is clamped between the wafer structure 20 and the substrate 10.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Further, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the embodiment shown in fig. 1-8, the first retaining structure 40 is configured as a cylindrical structure, the second retaining structure 50 is configured as a ring structure that is sleeved on the cylindrical structure, and the wafer structure 20 is clamped between the second retaining structure 50 and the substrate 10 to prevent the wafer structure 20 from being separated from the substrate 10.

Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10, and the first retaining structure 40 has a free end away from the substrate 10, and the second retaining structure 50 is rotatably sleeved on the first retaining structure 40 from the side of the tabletting structure 20 away from the substrate 10, thereby facilitating quick connection or disconnection between the second retaining structure 50 and the first retaining structure 40.

In some alternative embodiments, the first retaining structure 40 is configured as a threaded rod having external threads, and the second retaining structure 50 is configured as a nut having internal threads, the nut being threadably engaged with the threaded rod to facilitate installation and removal of the wafer structure 20.

Referring to fig. 1 to 8, the second holding structure 50 is pressed against a side of the tablet structure 20 away from the substrate 10, and the second holding structure 50 can apply a pressing force to the tablet structure 20 toward the substrate 10, so as to prevent the tablet structure 20 from shaking, and thus, the connection between the tablet structure 20 and the substrate 10 is more reliable.

Referring to fig. 1 to 9, the tablet structure 20 includes: preforming body 21, preforming body 21 form towards the sunken groove body structure of first side, and the opening of preforming body 21 deviates from first side. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the second holding structure 50 is located in the recessed groove of the tablet body 21, and an end surface of the first holding structure 40 away from the free end of the substrate 10 (i.e., an upper end surface of the first holding structure 40) is also located in the recessed groove, so that a distance between the end surface of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, and a distance between the second holding structure 50 and the substrate 10 can be shortened, so that the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for reserving an installation space for other components, and preventing mutual interference during installation.

In the embodiment shown in fig. 2, the second holding structure 50 is entirely located in the concave groove, and the upper end surface of the first holding structure 40 is also located in the concave groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 2, the overlapping dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, and further reducing the distance between the second holding structure 50 and the substrate 10.

Referring to fig. 1-3, 5, and 7-9, the second holding structure 50 is pressed against the bottom wall of the tablet body 21, the first holding structure 40 penetrates the bottom wall of the tablet body, and a tablet body positioning hole 211 adapted to the first holding structure 40 is formed on the bottom wall of the tablet body, after the first holding structure 40 penetrates the tablet body positioning hole 211 on the bottom wall of the tablet body, the tablet structure 20 can be preliminarily positioned, so that the second holding structure 50 can be used to fix the tablet structure 20 subsequently.

Referring to fig. 9, the tablet structure 20 includes: a tablet body 21 and a tablet arm 22, wherein the tablet arm 22 is connected to the tablet body 21, and as shown in fig. 1-2 and 5, the tablet arm 22 is used for pressing against the power structure 30, and the power structure 30 is clamped between the tablet structure 20 and the substrate 10.

Referring to fig. 1-8, the power structure 30 may include: a first power structure 31 and a second power structure 32, the first power structure 31 and the second power structure 32 being spaced apart. The presser arm 22 includes: a first pressing arm 221 and a second pressing arm 222, wherein the first pressing arm 221 is used for pressing against the first power structure 31, the second pressing arm 222 is used for pressing against the second power structure 32, the pressing body 21 is located between the first power structure 31 and the second power structure 32, and the retaining structure 45 is also located between the first power structure 31 and the second power structure 32.

Further, the first power structure 31 has a first connection leg 311, the second power structure 32 has a second connection leg 321, the first connection leg 311 and the second connection leg 321 are respectively located at opposite outer sides of the first power structure 31 and the second power structure 32, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.

Alternatively, the angle between the extending direction of the first connecting leg portion 311 from the first power structure 31 and the extending direction of the second connecting leg portion 321 from the second power structure 32 is 180 degrees. That is to say, the pins of the first connecting leg portion 311 and the second connecting leg portion 321 are disposed outward, so as to leave a middle space between the first power structure 31 and the second power structure 32, and facilitate the holding structure 45 to fix the wafer structure 20 on the substrate 10 from the middle space.

The pins of the first and second connection leg portions 311 and 321 each include: the first pin 331, the second pin 332, and the third pin 333, each of which is adapted to be electrically connected to a driving circuit board or a corresponding bus bar.

Referring to fig. 2 and 4, the extending direction of the first connecting leg 311 from the first power structure 31 is leftward, the extending direction of the second connecting leg 321 from the second power structure 32 is rightward, and an included angle therebetween is 180 degrees, so that it is avoided that the first connecting leg 311 and the second connecting leg 321 are closer to each other when the first connecting leg 311 and the second connecting leg 321 face each other, and the first power structure 31 and the second power structure 32 are interfered with each other. Meanwhile, when the first power structure 31 and the second power structure 32 are connected to the corresponding bus bar or the driving circuit board, the first connecting leg 311 and the second connecting leg 321 both face outward, and the space is sufficient, so that the corresponding operation is facilitated.

Referring to fig. 1, 3, 5-7, the first power structures 31 and the second power structures 32 are oppositely arranged in a first direction of the substrate 10, the first power structures 31 are plural, the plurality of first power structures 31 are arranged on the substrate 10 in a second direction of the substrate 10, the plurality of second power structures 32 are plural, the plurality of second power structures 32 are arranged on the substrate 10 in the second direction, the plurality of wafer structures 20 are plural, and the plurality of wafer structures 20 are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.

Further, the plurality of first power structures 31, the plurality of pad structures 20, and the plurality of second power structures 32 correspond one-to-one in the first direction. A pair of first power structures 31 and second power structures 32, which are oppositely disposed, can be pressed against the substrate 10 by the same wafer structure 20.

In some embodiments, not shown, the plurality of sheeting structures 20 may be separate entities.

In the embodiment shown in fig. 1, 3, and 9, the plurality of wafer structures 20 are connected into a whole through the wafer connecting portion 23, so that the assembly process of the plurality of wafer structures 20 is saved, which is beneficial to improving the assembly efficiency of the power unit 100. Meanwhile, the tabletting structures 20 connected into a whole can simultaneously press a plurality of power structures 30, and the pressing efficiency is high. The integrated wafer structure 20 is pressed against the base plate 10 by two or more retaining structures 45.

Further, the tablet connecting portion 23 is connected between the tablet bodies 21 of two adjacent tablet structures 20, and the width of the tablet connecting portion 23 may be equal to the width of the tablet body 21.

In the embodiment shown in fig. 1, 3, 9, the wafer structure 20 comprises: the first holding structure 40 penetrates through the pressing body 21, the pressing arm 22 is connected with the pressing body 21 in parallel in the first direction of the substrate 10, and the pressing arm 22 is used for pressing against the power structure 30; the tablet structures 20 are plural, and the plurality of tablet structures 20 are connected to each other in a second direction of the substrate 10, the first direction and the second direction being perpendicular to each other.

Further, the arm 22 may include: the first pressing arm 221 and the second pressing arm 222 are symmetrically connected to two sides of the pressing body 21; the tablet bodies 21 of two adjacent tablet structures 20 are connected to each other by a tablet connecting portion 23.

Referring to fig. 2, 4 and 9, the tablet body 21 is formed in a concave groove structure that is concave toward the first side surface, the opening of the tablet body 21 faces away from the first side surface, the first and second tablet arms 221 and 222 are respectively connected to both ends of the opening of the tablet body 21, and the first and second tablet arms 221 and 222 extend in directions away from each other. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, the opening of the tablet body 21 faces upward, the first tablet arm 221 extends leftward, and the second tablet arm 222 extends rightward.

In some optional embodiments, the power unit 100 may further include: the positioning part is used for positioning the power structure 30 on the substrate 10, thereby ensuring the accurate position of the power structure 30 on the substrate 10 and preventing the power structure 30 from shaking arbitrarily on the substrate 10.

In the embodiment shown in fig. 1-4, the positioning portion includes a positioning plate 60, and a through positioning hole 61 is formed on the positioning plate 60, and the positioning hole 61 is matched with the power structure 30. For example, the outer peripheral surface of the power structure 30 and the positioning opening 61 are rectangular, the power structure 30 is positioned in the positioning opening 61, the bottom of the power structure 30 is directly attached to the substrate 10, the substrate 10 may be a metal substrate 10, the heat of the power structure 30 may be transferred to the substrate 10, and a cooling device or a heating device may be disposed below the substrate 10 to cool or heat the power structure 30.

Optionally, as shown in fig. 3-4, the positioning plate 60 is further provided with an annular positioning rib 62 surrounding the positioning hole 61, and the annular positioning rib 62 is matched with the outer peripheral surface of the power structure 30. The annular positioning rib 62 protrudes out of the surface of the positioning plate 60, so that the positioning firmness of the power structure 30 can be increased, and the positioning effect is good.

In the embodiment shown in fig. 1-4, the positioning sheet 60 is an insulating positioning sheet, and the positioning sheet 60 is adhesively fixed to the first side of the substrate 10.

Referring to fig. 1 and 3, the splines 60 are provided with splines through holes 63 for mating with the first retaining structures 40 and allowing the first retaining structures 40 to pass through to form a locating fit, and after the first retaining structures 40 pass through the splines through holes 63, the splines 60 may be initially located. The first holding structure 40 is connected to the second holding structure 50 after passing through the positioning piece through hole 63 of the positioning piece 60 and the pressing piece positioning hole 211 of the pressing piece body 21, thereby fixing the positioning piece 60 and the pressing piece structure 20 between the second holding structure 50 and the substrate 10.

In the embodiment shown in fig. 5, the positioning portion includes the convex strip 11 provided on the first side surface of the base plate 10, thereby saving the positioning piece 60, contributing to a reduction in the number of parts, and contributing to a reduction in assembly man-hours.

Alternatively, the rib 11 is a continuous annular rib 11, and the annular rib 11 is matched with the outer peripheral surface of the power structure 30.

Alternatively, the protruding strip 11 corresponding to each power structure 30 is divided into four sections, and the four sections are respectively located on four sides of the rectangular power structure 30, so that the power structure 30 is limited in all directions, and the power structure 30 is better positioned on the substrate 10.

In the embodiment shown in fig. 6-8, the positioning portion comprises a groove 12 formed on the first side of the substrate 10, the peripheral wall of the groove 12 is adapted to match the outer peripheral surface of the power structure 30, preferably, the groove 12 is a blind groove, and as shown in fig. 8, the bottom wall of the groove 12 is adapted to fit the bottom surface of the power structure 30 to support the power structure 30. This embodiment also saves the spacer 60, which is advantageous in reducing the number of parts and saving the assembling man-hour. Meanwhile, the groove 12 is directly formed on the first side surface of the substrate 10, the process is simple, the operability is strong, and as shown in fig. 8, the bottom surface of the power structure 30 is lower than the first side surface of the substrate 10, so that the total height of the power structure 30 and the substrate 10 after assembly can be shortened, and the volume of the power unit 100 can be reduced.

In some optional embodiments, the power unit 100 may further include: the heat insulation structure 60' is disposed on the first side of the substrate 10 in a manner of surrounding the power structure 30. The heat insulation structure 60 'is located between the power structure 30 and the substrate 10, and the heat insulation structure 60' can separate the power structure 30 from the substrate 10, so as to prevent the heat of the power structure 30 from affecting the components below the substrate 10, and at the same time, prevent the heat below the substrate 10 from being upwardly transferred to the power structure 30.

In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.

Referring to fig. 2, 4 and 9, the wafer structure 20 is configured as a gull wing type, and the wafer structure 20 may include a wafer body 21, a first wafer arm 221 and a second wafer arm 222, the first wafer arm 221 and the second wafer arm 222 are symmetrically connected to both sides of the wafer body 21, and free ends of the first wafer arm 221 and the second wafer arm 222 are provided with a bent section 24 bent toward the substrate 10. The bending section 24 is adapted to press against the power structure 30, so that the power structure 30 is pressed against the substrate 10.

A larger planar space is formed above the wafer structure 20, so as to leave an installation space for other components (for example, the busbar), and the dimensions of the power unit 100 and the busbar assembly in the height direction can be significantly reduced.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (10)

1. A power cell, comprising:

a substrate, a first side of the substrate having a first side;

a tab structure located on the first side of the substrate;

a power structure pressed against the first side by the tab structure.

2. The power cell of claim 1, further comprising: the first holding structure extends from the substrate towards the direction far away from the first side surface and penetrates through the tabletting structure, so that the tabletting structure is held on the first side of the substrate.

3. The power cell of claim 2, further comprising: a second retaining structure that retains the wafer structure on the first side of the substrate by mating with the first retaining structure.

4. The power cell of claim 3, wherein the first retaining structure is configured as a cylindrical structure and the second retaining structure is configured as an annular structure that fits over the cylindrical structure.

5. The power unit as recited in claim 4 wherein the first retaining structure is perpendicular to the first side and has a free end distal from the substrate, and the second retaining structure is rotatably nested with the first retaining structure from a side of the wafer structure that faces away from the substrate.

6. The power unit as recited in claim 4, wherein the first retaining structure is configured as a threaded rod having external threads and the second retaining structure is configured as a nut having internal threads.

7. The power cell of claim 3, wherein the second retaining structure presses against a side of the wafer structure facing away from the substrate.

8. The power cell of claim 3, wherein the wafer structure comprises: the pressing sheet body is formed into a concave groove body structure which is concave towards the first side face, and the opening of the pressing sheet body deviates from the first side face.

9. The power unit of claim 8, wherein at least a portion of the second retaining structure is located within a recessed pocket of the wafer body and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

10. The power unit of claim 8, wherein the second retaining structure presses against the wafer bottom wall of the wafer body, the first retaining structure penetrates the wafer bottom wall, and a wafer positioning hole adapted to the first retaining structure is formed in the wafer bottom wall.

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