WO2021197410A1

WO2021197410A1 - Power unit assembly

Info

Publication number: WO2021197410A1
Application number: PCT/CN2021/084893
Authority: WO
Inventors: Wenjie XI; Jiawei Xu
Original assignee: Atlas Copco (Wuxi) Compressor Co., Ltd.
Priority date: 2020-04-01
Filing date: 2021-04-01
Publication date: 2021-10-07
Also published as: EP4128500A1; EP4128500A4

Abstract

A power unit assembly (1000) including a power unit (100) is disclosed. The power unit (100) includes: a power structure (32) having a plurality of pins (331,332,333); and a plurality of bus bars (201,202,203), arranged to be stacked. At least one of the pins (331,332,333) is connected, in a form of penetrating only one layer of the bus bars (201,202,203), to the penetrated bus bar (201,202,203), and the at least one of the pins (331,332,333) is staggered and electrically insulated from the remaining bus bars (201,202,203). For the power unit assembly (1000), the pin (331,332,333) is connected, in the form of penetrating only one layer of the bus bars (201,202,203), to the penetrated bus bar (201,202,203) and is staggered from the other bus bars (201,202,203), such that the number of holes punched on the other bus bars (201,202,203) can be reduced, thereby simplifying a manufacturing process of the bus bar (201,202,203) and achieving the better electrical insulation performance.

Description

POWER UNIT ASSEMBLY

CROSS-REFERENCE TO RELATED APPLICATION

The present applicationclaims priority to Chinese patent application No. 202010252302.3, titled “POWER UNIT ASSEMBLY” , filed by ATLAS COPCO (WUXI) COMPRESSOR CO., LTD., onApril01, 2020, and Chinese Patent Application No. 202120366611.3, titled “Heat Sink” , filed by ATLAS COPCO (WUXI) COMPRESSOR CO., LTD., on February 09, 2021, both of which are hereby incorporated by reference in their entireties.

TECHNICAL FIELD

The present disclosure relates to the technical field of inverters and, moreparticularly, to apower unit assembly.

BACKGROUND

In existing inverters, a power structure is mountedon a substrate and adapted to be connected to a driving circuit board and a plurality of busbars, and pins of the power structure penetrate multiple layers of positive and negative busbars at the same time to be connected to the multiple layers of the busbars at the same time. In this case, it is easy to have short-circuit between adjacent ones of the busbars, which will affect normal use of the inverter. In addition, for an existing inverter power unit assembly, the pins of the power structure pass through the multiple layers of the busbars at the same time through via holes, andtraditional welding processes (such as wave soldering, etc. ) cannot be used. This is because the via holes are inside metal busbarsand a heat dissipation area is large, then when using the traditional welding processes, heat at welding points is quickly lost due to a large area of the busbar, making itdifficult to reach a required temperature for welding. Therefore, only spot-welding techniques such as electron beam welding and laser welding can be used to concentrate welding energy in a very small range to achieve a purpose of welding, leading to a complicated process.

SUMMARY

This present disclosure aims to solve one of the above technical problems in the related art at least to a certain extent. In view ofthis, the present disclosure proposes a power unit assembly, which can avoid an electrical connection between pins and other busbars.

A power unit assembly according to an embodiment of the present disclosure includesa power unit. The power unit includes: a power structure having a plurality of pins; and a plurality of busbars arranged to bestacked. At least one of the pins is connected, in a form of penetrating only one layer of the busbar, to the penetrated busbar, and the at least one of the pinsis staggered and electrically insulated from the remaining busbars.

For the power unit assembly according to the present disclosure, the pin is connected, in the form of penetrating only one layer of the busbar, to the penetrated busbar, and is staggered from the other busbars, such that the number of holes punched on the other busbars can be reduced, thereby simplifying a manufacturing process of the busbar and achieving the better electrical insulation performance between the pin and the other busbars.

According to some embodiments of the present disclosure, each of the plurality of busbarscomprisesbusbar connecting portions, at least one of the pins of the power unit penetrates only one layer of the busbar connecting portions to be connected to the busbar, and each of the busbar connecting portions is constructed into a sheet shape.

Alternatively, the plurality of busbars and the corresponding busbar connecting portion are on a same plane.

Alternatively, the plurality of busbars and the corresponding busbar connecting portion are formed by a blanking process.

According to some embodiments of the present disclosure, each of the busbar connecting portions protrudes from at least one side edge of thecorresponding busbar, and is directly connected to the corresponding busbar.

According to some embodiments of the present disclosure, each of the busbar connecting portions is provided with a busbar connecting portion through hole allowing the pin to pass through.

According to some embodiments of the present disclosure, in the two busbar connecting portions corresponding to two adjacent ones of the plurality of pins, abusbar connecting portion through hole of one of the twobusbar connecting portions is located outside a contour of the other one of the two busbar connecting portions.

According to some embodiments of the present disclosure, two of the plurality of pins ofa same power structure are respectively connected to the busbar connecting portions of the two corresponding busbars, and the plurality of pins only penetratesand then is connected to the corresponding busbar connecting portion.

Further, any one of the two pins is connected to the corresponding busbar connecting portion and adjacent to or spaced apartside by side from the other busbar connecting portion.

According to some embodiments of the present disclosure, any one of the two pins is connected to the corresponding busbar connecting portion, and abusbar connecting portion through hole of one of the busbar connecting portions is located outside a contour of the remaining ones of thebusbar connecting portions.

According to some embodiments of the present disclosure, a remaining one pin in the same power structure is adapted to be connectedtoa driving circuit board, and is directly connected to the driving circuit board in a form without being blocked by the busbar connecting portion.

According to some embodiments of the present disclosure, the same power structure includesa first pin, a second pin, and a third pin, the third pin is located between the first pin and the second pin and outside the first pin and the second pin with respect to the power structure, and a gap between the first pin and the second pin allows one of the busbar connecting portions to be inserted in such a manner that the third pin penetrates and then is connected to the third pin.

Further, the busbar connecting portion through which the first pin penetrates and the busbar connecting portion through which the third pin penetrates are partially stackedor staggered in a stacking direction of the plurality of the busbars, and the second pin is adapted to be directly connectedtothe driving circuit board.

According to some embodiments of the present disclosure, the busbars include a first busbar, a second busbar, and a third busbar, the busbar connecting portions include: a first busbar connecting portion connected tothe first busbar, a second busbar connecting portion connected to the second busbar, and a third busbar connecting portion connected to the third busbar. The first busbar connecting portion is located atone side of the first busbar, the second busbar connecting portion is located atthe otherside of the second busbar opposite to the first busbar connecting portion, and the third busbar connecting portions are respectively located attwo sides of the third busbar.

Specifically, one of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.

Further, the power unit assembly further includes a busbar clamp for clamping the first busbar and the second busbar.

According to some embodiments of the present disclosure, the first busbar, the second busbar, and the third busbar each includesa rectangular shape and are stacked in a thickness direction of the busbar, and the busbar connecting portion is formed ata longitudinal long side of the corresponding busbar.

According to some embodiments of the present disclosure, the power structure includes a first power structure and a second power structure. The pin of the first power structure and the pin of the second power structure are respectively located at opposite outer sides of the first power structure and the second power structure, the pin of the first power structure, the first busbar connecting portion and the third busbar connecting portion on the third busbar located at a first side of the busbar are at the first side, and the pin of the second power structure, the second busbar connecting portion and the third busbar connecting portion on the third busbar located ata second side of the busbar are atthe second side.

According to some embodiments of the present disclosure, an end of the first busbar is provided with a first busbar adapter end plate, an end of the second busbar is provided with a second busbar adapter end plate, the first busbar adapter end plate and the second busbar adapter end plate are located at the same end and arranged side by side, andanother end of the third busbar opposite to the first busbar adapter end plate is provided with a third busbar adapter end plate.

According to some embodiments of the present disclosure, the first busbar, the second busbar, and the third busbar are flat busbars.

According to some embodiments of the present disclosure, the busbar connecting portion is provided with a through groove that allows the pin to pass through, and the through groove extends in a direction facing away from the busbar and penetrates an outer edge of the busbar connecting portion facing away from the busbar.

According to some embodiments of the present disclosure, a surface of the busbar is covered with an insulating thin film.

The additional aspects and advantages of the present disclosure will be partly given in the following description, and some will become obvious from the following description or be learned through practice of the present disclosure.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is aperspective assembled schematic view of a power unitwhen holding structures include a second holding structure;

FIG. 2 is anassembled side view of a power unitwhen holding structures include a second holding structure;

FIG. 3 is a perspective exploded schematic view of a power unitwhen holding structures include a second holding structure;

FIG. 4 is an exploded side view of a power unitwhen holding structures include a second holding structure;

FIG. 5 is a perspective assembled schematic view of a power unit when a ridge is provided on a substrate and holding structures include a second holding structure;

FIG. 6 is a perspective exploded schematic view of a power unit when a recess is provided on a substrate and holding structures include a second holding structure;

FIG. 7 is a perspective assembled schematic view of a power unit when a recess is provided on a substrate and holding structures include a second holding structure;

FIG. 8 is an assembled side view of a power unit when a recess is provided on a substrate and holding structures include a second holding structure;

FIG. 9 is a perspective schematic view of a tablet structure;

FIG. 10 is a perspective assembled schematic view of a power unit when holding structures include a third holding structure;

FIG. 11 is an assembled side view of a power unit when holding structures include a third holding structure;

FIG. 12 is a perspective assembled schematic view of a power unit having a positioning sheet when holding structures include a fourth holding structure;

FIG. 13 is an assembled side view of a power unit having a positioning sheet when holding structures include a fourth holding structure;

FIG. 14 is a perspective assembled schematic view of a power unit without a positioning sheet when holding structures includea fourth holding structure;

FIG. 15 is an assembled side view of a power unit without a positioning sheet when holding structures includea fourth holding structure;

FIG. 16 is a perspective exploded schematic view of a power unit assembly;

FIG. 17 is a perspective assembled schematic view of a power unit assembly;

FIG. 18 is an assembled side view of a power unit assembly;

FIG. 19 is a schematic view of connection between a power structure and three layers of busbars;

FIG. 20 is a perspective exploded schematic view of a power unit, a second busbar and a third busbar;

FIG. 21 is a perspective assembled schematic view of a power unit, a second busbar and a third busbar;

FIG. 22 is a perspective exploded schematic view of a power unit and a third busbar;

FIG. 23 is a perspective assembled schematic view of a power unit and a third busbar;

FIG. 24 is a perspective exploded schematic view of a power unit assembly and a driving circuit board;

FIG. 25 is a perspective assembled schematic view of a power unit assembly and a driving circuit board; and

FIG. 26 is an assembled side view of a power unit assembly and a driving circuit board.

Reference signs:

power module 10000, power unit assembly 1000, power unit 100, substrate 10, ridge 11, recess 12, tablet structure 20, tablet body 21, tablet body positioning hole 211, tablet arm 22, first tablet arm 221, second tablet arm 222, tablet connecting portion 23, bending section 24, power structure 30, first power structure 31, first connecting leg 311, second power structure 32, second connecting leg 321, first pin 331, second pin 332, third pin 333, holding structure 45, first holding structure 40, second holding structure 50, positioning sheet 60, positioning opening 61, annular positioning rib 62, positioning sheet through hole 63, heat-insulation structure 60’ , third holding structure 70, small-diameter end 71, large-diameter end 72, fourth holding structure 80, fastener 81, first busbar 201, first busbar connecting portion 2011, first busbar adapter end plate 2012, first busbar body 2013, first busbar connecting portion through hole 2014, second busbar 202, second busbar connecting portion 2021, second busbar adapter end plate 2022, second busbar body 2023, second busbar connecting portion through hole 2024, third busbar 203, first busbar connecting portion 2031, third busbar adapter end plate 2032, third busbar body 2033, third busbar connecting portion through hole 2034, driving circuit board 2000.

DESCRIPTION OF EMBODIMENTS

The embodiments of the present disclosure will be described in detail below, examples of the embodiments are shown in the accompanying drawings, and same or similar reference numerals indicate same or similar elements or elements having same or similar functions all the way. The embodiments described below with reference to the accompanying drawings are exemplary, and intended to explain the present disclosure, but should not be understood as a limitation to the present disclosure.

In the description of the present disclosure, it should be understood that orientations or positional relationships indicated by the terms “longitudinal” , “lateral” , “length” , “width” , “thickness” , “upper” , “lower” , “front” , “rear” , “left” , “right” , “vertical” , “horizontal” , “top” , “bottom” , “inner” , “outer” and the like are based on orientationsor positional relationshipsshown in the drawings and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation and be constructed and operated in a specific orientation, and therefore it cannot be understood as a limitation of the present disclosure.

In the present disclosure, unless otherwise clearly stipulated and limited, terms such as terms “installation” , “in communication with” , “connected” , “fixed” should be understood in a broad sense, for example, it can be fixed connection, detachable connection, or integrated into one piece; it can be mechanical connection, an electrical connection, or it can be communication with each other; it can be direct connection or indirect connection through an intermediate medium, and it can be communication of interiors oftwo components or an interaction relationship between two components. For those of ordinary skill in the art, the specific meaning of the above terms in the present disclosure can be understood according to specific circumstances.

Referring to FIGS. 24to 26, a power module 10000 may include: a power unit assembly 1000 and a driving circuit board 2000. Alternatively, the driving circuit board 2000 is located above the power unit assembly 1000. The power module 10000 according to an embodiment of the present disclosure is described in detail below with reference to FIGS. 1 to 26.

With reference to FIGS. 16 to 26, the power unit assembly 1000 according to the embodiment of the present disclosure may include: a power unit 100, and a plurality of busbars arranged to be stacked.

The power unit 100 may include: a substrate 10, a tablet structure 20 and a power structure 30. A first side (i.e., an upper side in FIG. 2) of the substrate 10 has a first side surface, the tablet structure 20 is located at the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the tablet structure 20.

By pressing the power structure 30 against the first side surface of the substrate 10 using the tablet structure 20, the power structure 30 can be firmly and reliably mounted on the substrate 10.

Referring to FIGS. 1 to 9, the power unit 100 further includes a holding structure 45, and the holding structure 45 includesa first holding structure 40. The first holding structure 40 penetrates the tablet structure 20, in such a manner that the tablet structure 20 is held at the first side of the substrate 10, and thus the power structure 30 is held at the first side of the substrate 10 by the tablet structure 20 pressing the power structure 30. Further, referring to FIGS. 2 and 8, the first holding structure 40 penetrates the tablet structure 20 from bottom to top, and the tablet structure 20 is held at the first side of the substrate 10 by the first holding structure 40. That is, when the first holding structure 40 penetrates the tablet structure 20, a relative position between the tablet structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role in positioning the tablet structure 20.

In some unshown embodiments, the first holding structure 40 penetrates the tablet structure 20 from top to bottom, in such a manner that the tablet structure 20 is held at the first side of the substrate 10 via the first holding structure 40.

In some unshown embodiments, the tablet structure 20 can also be directly fixed, such as welded, on the substrate 10, while the holding structure 45 is eliminated, thereby facilitating reducing the number of connecting components and thus reducing a weight of the power unit 100.

Further, referring to FIGS. 1 to 8, the holding structure 45 further includes a second holding structure 50. The second holding structure 50, through beingfitted and connected to the first holding structure 40, makes the tablet structure 20 be held at the first side of the substrate 10. The second holding structure 50 is connected to the first holding structure 40 at a side of the tablet structure 20 facing away from the substrate 10. As shown in FIG. 2, the second holding structure 50 is connected to the first holding structure 40 at an upper side of the tablet structure 20, and there is a wide space at an upper side of the tablet structure 20, leaving an operation space for installation and disassembly of the second holding structure 50. The tablet structure 20 is sandwiched between the second holding structure 50 and the substrate 10, and the power structure 30 is sandwiched between the tablet structure 20 and the substrate 10.

In the description of the present disclosure, terms “first” and “second” are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined with the “first” and “second” may explicitly or implicitly include one or more of these features. In addition, unless otherwise specifically defined, “plurality” means at least two, such as two, three, etc.

In the embodiment shown in FIGS. 1 to 8, the first holding structure 40 is configured as a columnar structure, the second holding structure 50 is configured as a ring structure, with which the columnar structure is sleeved, and the tablet structure 20 is sandwiched between the second holding structure 50 and the substrate 10, to prevent the tablet structure 20 from being separated from the substrate 10.

Specifically, the first holding structure 40 is perpendicular to the first side surface of the substrate 10, and the first holding structure 40 has a free end far away from the substrate 10, and the first holding structure 40 is sleeved with the second holding structure 50 in a rotatable manner from the side of the tablet structure 20 facing away from the substrate 10, thereby facilitating a quick connection or detachment between the second holding structure 50 and the first holding structure 40.

In some alternative embodiments, the first holding structure 40 is configured as a screw rod having external threads, the second holding structure 50 is configured as a nut having internal threads, and the nut is fitted to the screw rod by screwing, to facilitate installation and disassembly of the tablet structure 20.

Referring to FIGS. 1 to 8, the second holding structure 50 is pressed against the side of the tablet structure 20 facing away from the substrate 10, and the second holding structure 50 can exert on the tablet structure 20a pressing force towards the substrate 10, to prevent the tablet structure 20 from shaking, thereby leading to the more reliable connection between the tablet structure 20 and the substrate 10.

Referring to FIGS. 1 to 9, the tablet structure 20 includes a tablet body 21 formed as a recessed groove structure recessed towards the first side surface. An opening of the tablet body 21 faces away from the first side surface. Referring to FIGS. 2 and 4, the tablet body 21 is formed as a recessed groove structure that is recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the second holding structure 50 is located in the recessed groove of the tablet body 21, and an end surface ofthe free end of the first holding structure 40 facing away from the substrate 10 (that is, an upper end surface of the first holding structure 40) is also located in the recessed groove, such that a distance between the end surface of the free end of the first holding structure 40 facing away from the substrate 10 and the substrate 10 can be shortened, and a distance between the second holding structure 50 and the substrate 10 can be shortened. Thus, the holding structure 45 is located in the recessed groove of the tablet body 21 as much as possible, which can reduce a dimension of the power unit 100 in a height direction and form relatively large usable space above the tablet structure 20, thereby facilitating leaving an installation space for other components and thus preventing mutual interference during the installation.

In an embodiment shown in FIG. 2, an entirety of the second holding structure 50 is located in the recessed groove, and the upper end surface of the first holding structure 40 is also located in the recessed groove, so that the dimension of the power unit 100 in the height direction can be further reduced.

Referring to FIG. 2, an overlapping dimension of the second holding structure 50 and the power structure 30 in a thickness direction of the power structure 30 exceeds half of a thickness of the second holding structure 50, such that the second holding structure 50 can be located in the recessed groove of the tablet body 21 as much as possible, thereby further reducing the distance between the second holding structure 50 and the substrate 10.

Referring to FIGS. 1 to 3, 5 and 7 to 9, the second holding structure 50 is pressed against a tablet body bottom wall of the tablet body 21, the first holding structure 40 penetrates the tablet body bottom wall, and a tablet body positioning hole 211 fitted to the first holding structure 40 is formed in the tablet body bottom wall, so that after the first holding structure 40 penetrates the tablet body positioning hole 211 on the tablet body bottom wall, the tablet structure 20 can be preliminarily positioned, to facilitate subsequently using the second holding structure 50 to fix the tablet structure 20.

Referring to FIG. 9, the tablet structure 20 includes a tablet body 21 and a tablet arm 22. The tablet arm 22 is connected to the tablet body 21. Referring to FIGS. 1, 2 and 5, the tablet arm 22 is used to press the power structure 30, and the power structure 30 is sandwichedbetween the tablet structure 20 and the substrate 10.

Referring to FIGS. 1 to 8, the power structure 30 may include a first power structure 31 and a second power structure 32 that are spaced apart from each other. The tablet arm 22 includes a first tablet arm 221 and a second tablet arm 222. The first tablet arm 221 is used to press the first power structure 31, the second tablet arm 222 is used to press the second power structure 32, the tablet body 21 is located between the first power structure 31 and the second power structure 32, and the holding structure 45 is also located between the first power structure 31 and the second power structure 32.

Further, the first power structure 31 has a first connecting leg 311, the second power structure 32 has a second connecting leg 321, the first connecting leg 311 and the second connecting leg 321 are respectively located on opposite outer sides of the first power structure 31 and the second power structure 32, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.

Alternatively, an angle between a direction along which the first connecting leg 311 protrudes from the first power structure 31 and a direction along which the second connecting leg 321 protrudes from the second power structure 32 is 180 degrees. That is, pins of the first connecting leg 311 and the second connecting leg 321 are both provided outwards, leaving a middle space between the first power structure 31 and the second power structure 32, which allows the holding structure 45 to fix the tablet structure 20 on the substrate 10 from the middle space.

The pins of the first connecting leg 311 and the second connecting leg 321 each include: a first pin 331, a second pin 332 and a third pin 333. Each of the pins is adapted to be electrically connected to the driving circuit board 2000 or a corresponding busbar.

Referring to FIGS. 2 and 4, the first connecting leg 311 protrudes from the first power structure 31 towards left, and the second connecting leg 321 protrudes from the second power structure 32 towards right, and an angle between the two directions is 180 degrees, such that it is possible to prevent an interference between the first power structure 31 and the second power structure 32 due to a relatively close distance between the first connecting leg 311 and the second connecting leg 321 when the first connecting leg 311 and the second connecting leg 321 face towards each other. Moreover, when the first power structure 31 and the second power structure 32 are connected to the corresponding busbar or driving circuit board 2000, the first connecting leg 311 and the second connecting leg 321 both face outward, and there is plenty of space to facilitate corresponding operations.

Referring to FIGS. 1, 3 and 5 to 7, the first power structure 31 and the second power structure 32 that face towards each otherin a first direction of the substrate 10. There is a plurality of the first power structures 31 arranged on the substrate 10 in a second direction of the substrate 10, a plurality of the second power structures 32 arrangedon the substrate 10 in the second direction, and a plurality of tablet structures 20 arranged along the second direction. The first direction and the second direction are perpendicular to each other. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10 and the second direction may be a length direction of the substrate 10.

Further, the plurality of the first power structures 31, the plurality of the tablet structures 20, and the plurality of the second power structures 32 are in one-to-one correspondence in the first direction. A pair of oppositely arranged first power structure 31 and second power structure 32 can be pressed against the substrate 10 by the same tablet structure 20.

In some embodiments, the plurality of the tablet structures 20 may be mutually independent.

In the embodiments shown in FIGS. 1, 3 and 9, the plurality of the tablet structures 20 is connected into one piece by a tablet connecting portion 23, such that an assembly process of the plurality of the tablet structures 20 is saved, thereby facilitating improving an assembly efficiency of the power unit 100. Moreover, the tablet structures 20 connected into one piece can press a plurality of the power structures 30 concurrently, leading to a high crimping efficiency. The one-piece tablet structure 20 is pressed against the substrate 10 by two or more of the holding structures 45.

Further, the tablet connecting portion 23 is connected between the tablet bodies 21 of two adjacent tablet structures 20, and a width of the tablet connecting portion 23 may be equal to a width of the tablet body 21.

In the embodiment shown in FIGS. 1, 3 and 9, the tablet structure 20 includes a tablet body 21 and a tablet arm 22. The first holding structure 40 penetrates the tablet body 21, the tablet arm 22 is connected side by side with the tablet body 21 in the first direction of the substrate 10, and the tablet arm 22 is used to press the power structure 30. There is a plurality of the tablet structures 20 connected to each other in the second direction of the substrate 10, and the first direction and the second direction are perpendicular to each other.

Further, the tablet arm 22 may include: a first tablet arm 221 and a second tablet arm 222 that are symmetrically connected to both sides of the tablet body 21. In addition, the tablet bodies 21 of two adjacent ones of the tablet structures 20 are connected to each other through the tablet connecting portion 23.

Referring to FIGS. 2, 4, and 9, the tablet body 21 is formed as a recessed groove structure recessed towards the first side surface, the opening of the tablet body 21 faces away from the first side surface, the first tablet arm 221 and the second tablet arm 222 are respectively connected to two ends of the opening of the tablet body 21, and the first tablet arm 221 and the second tablet arm 222 extend in directions facing away from each other. Referring to FIGS. 2 and 4, the tablet body 21 is formed as a recessed groove structure that is recessed downward, the opening of the tablet body 21 faces upward, the first tablet arm 221 extends to the left, and the second tablet arm 222 extends to the right.

In some alternative embodiments, the power unit 100 may further include: a positioning portion for positioning the power structure 30 on the substrate 10, to ensure that a position of the power structure 30 on the substrate 10 is accurate, to prevent the power structure 30 from shaking randomly on the substrate 10.

In the embodiments shown in FIGS. 1 to 4, the positioning portion includes: a positioning sheet 60. The positioning sheet 60 is provided with a through positioning opening 61matching the power structure 30. For example, an outer peripheral surface of the power structure 30 and the positioning opening 61 are both rectangular, the power structure 30 is positioned in the positioning opening 61, and a bottom of the power structure 30 is directly attached to the substrate 10. The substrate 10 can be a metal substrate 10, heat of the power structure 30 can be transferred to the substrate 10, and a cooling device or a heating device may be provided under the substrate 10 to cool or heat the power structure 30.

Alternatively, as shown in FIGS. 3-4, the positioning sheet 60 is also provided with an annular positioning rib 62 surrounding the positioning opening 61, and the annular positioning rib 62 matches the outer peripheral surface of the power structure 30. The annular positioning rib 62 protrudes from a surface of the positioning sheet 60, so that positioning firmness of the power structure 30 can be increased, thereby leading to the better positioning effect.

In the embodiments shown in FIGS. 1 to 4, the positioning sheet 60 is an insulating positioning sheet, and the positioning sheet 60 is adhesively fixed to the first side surface of the substrate 10.

Referring to FIGS. 1 and 3, the positioning sheet 60 is provided with a positioning sheet through hole 63 for matching the first holding structure 40 and allowing the first holding structure 40 to pass through to form positioning fitting, and after the first holding structure 40 passes through the positioning sheet through hole 63, the positioning sheet 60 can be initially positioned. The first holding structure 40 passes through the positioning sheet through hole 63 on the positioning sheet 60 and the tablet body positioning hole 211 on the tablet body 21 to be connected to the second holding structure 50, so as to fix the positioning sheet 60 and the tablet structure 20 between the second holding structure 50 and the substrate 10.

In the embodiment shown in FIG. 5, the positioning portion includes a ridge 11 provided on the first side surface of the substrate 10, thereby saving the positioning sheet 60, which facilities reducing the number of components while savingassembly man-hours.

Alternatively, the ridge 11 is a continuous annular ridge 11, and the ridge 11 matches the outer peripheral surface of the power structure 30.

Alternatively, the ridge 11 corresponding to each power structure 30 is divided into four sections, and the four sections are respectively located on four side surfaces of the rectangular power structure 30, thereby limiting the power structure 30 all around, so that the power structure 30 is better positioned on the substrate 10.

In the embodiment shown in FIGS. 6-8, the positioning portion includes a recess 12 formed on the first side surface of the substrate 10, and a circumferential wall of the recess 12 is adapted to match the outer periphery surface of the power structure 30. Preferably, the recess 12 is a blind recess. As shown in FIG. 8, a bottom wall of the recess 12 is adapted to be attached to a bottom surface of the power structure 30, in order to support the power structure 30. This embodiment also saves the positioning sheet 60, which facilitates reducing the number of the components and saving assembly man-hours. Moreover, the recess 12 is directly provided on the first side surface of the substrate 10, leading tosimple process and strong operability. Referring to FIG. 8, the bottom surface of the power structure 30 is lower than the first side surface of the substrate 10, such that a total height of the power structure 30 and the substrate 10 after assembly can be shortened, and a volume of the power unit 100 can be reduced.

In some alternative embodiments, the power unit 100 may further include a heat-insulation structure 60’ provided on the first side surface of the substrate 10 in a form of surrounding the power structure 30. The heat-insulation structure 60’ is located between the power structure 30 and the substrate 10, and the heat-insulation structure 60’ can separate the power structure 30 from the substrate 10, to prevent the heat of the power structure 30 from affecting the components under the substrate 10 while preventing heat under the substrate 10 from being transferred upward to the power structure 30.

In some alternative embodiments, the first side surface of the substrate 10 faces towards the busbar.

Referring to FIGS. 2, 4, and 9, the tablet structure 20 is constructed as a seagull wing shape, and the tablet structure 20 may include a tablet body 21, a first tablet arm 221, and a second tablet arm 222. The first tablet arm 221 and the second tablet arm 222 are symmetrically connected to both sides of the tablet body 21, and free ends of the first tablet arm 221 and the second tablet arm 222 each have a bending section 24 bending towards the substrate 10. The bending section 24 is adapted to press the power structure 30 so that the power structure 30 is pressed against the substrate 10.

A relatively large planar space is formed above the tablet structure 20, leaving an installation space for other components (taking the busbar as an example) while significantly reducing dimensions of the power unit 100 and the busbar assembly in the height direction.

In some embodiments, referring to FIGS. 10-11, the holding structures 45 may include a first holding structure 40 and a third holding structure 70 provided at a free end of the first holding structure 40 facing away from the substrate 10. As shown in FIG. 11, the first holding structure 40 is provided on the substrate 10, and the third holding structure 70 is provided at an upper end of the first holding structure 40. The third holding structure 70 may be configured as a buckle adapted to be buckled with the tablet structure 20, and the buckle fixes the tablet structure 20 to the substrate 10 by means of buckling connection, leading to the faster and more convenient mounting and disassembly of the tablet structure 20, thereby saving operation man-hours.

Specifically, a cross section of the buckle gradually changes and has a small-diameter end 71 and a large-diameter end 72. Referring to FIG. 11, an upper end of the buckle is the small-diameter end 71, and a lower end thereof is the large-diameter end 72. The buckle forms, from the small-diameter end 71 to the large-diameter end 72, a guiding cone surface adapted to guide the buckle to pass through the tablet structure 20. A buckle hole adapted for the buckle to pass through is provided on the tablet structure 20. An outer diameter of the small-diameter end 71 is smaller than a diameter of the buckle hole. In a free state, an outer diameter of the large-diameter end 72 is greater than the diameter of the buckle hole, and the large-diameter end 72 is formed as a buckling surface adapted to be pressed against the tablet structure 20.

Further, the large-diameter end 72 is located at a side of the small-diameter end 71 close to the substrate 10, the small-diameter end 71 is adapted to be fixed to the first holding structure 40, and the large-diameter end 72 is adapted to be separated from the first holding structure 40, such that the large-diameter end 72 can be elastically deformed so as to approach or move away from the first holding structure 40 in a circumferential direction. When the tablet structure 20 crosses the buckle from top to bottom, the small-diameter end 71 first protrudes from the buckle hole, the large-diameter end 72 gathers towards the first holding structure 40 under position-limiting of a hole wall of the buckle hole, to ensure that the large-diameter end 72 can smoothly pass through the buckle hole to reach above the tablet structure 20, so that the buckling surface of the large-diameter end 72 is pressed against an upper surface of the tablet structure 20, that is, the tablet structure 20 is sandwiched between the third holding structure 70 and the substrate 10.

The tablet body 21 is formed as a recessed groove structure recessed towards the substrate 10, and the opening of the tablet body 21 faces away from the substrate 10. Referring to FIG. 11, the tablet body 21 is formed as a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

At least a part of the third holding structure 70 is located in a recessed groove of the tablet body 21, and an end surface of the free end of the first holding structure 40 facing away from the substrate 10 (that is, an upper end surface of the first holding structure 40) is also located in the recessed groove, such that a distance between the end surface of the free end of the first holding structure 40 facing away from the substrate 10 and the substrate 10 can be shortened, and a distance between the third holding structure 70 and the substrate 10 can be shortened. Thus, the holding structure 45 is located in the recessed groove of the tablet body 21 as much as possible, which can reduce a dimension of the power unit 100 in a height direction and form relatively large usable space above the tablet structure 20, thereby facilitating leaving an installation space for other components and thus preventing mutual interference during the installation.

In an embodiment shown in FIG. 11, an entirety of the third holding structure 70 is located in the recessed groove, and the upper end surface of the first holding structure 40 is also located in the recessed groove, so that the dimension of the power unit 100 in the height direction can be further reduced.

Referring to FIG. 11, an overlapping dimension of the third holding structure 70 and the power structure 30 in a thickness direction of the power structure 30 exceeds half of a thickness of the third holding structure 70, such that the second holding structure 50 can be located in the recessed groove of the tablet body 21 as much as possible, thereby further reducing the distance between the third holding structure 70 and the substrate 10.

After the third holding structure 70 and the first holding structure 40 pass through the tablet body bottom wall, the third holding structure 70 is pressed against the tablet body bottom wall of the tablet body 21, to achieve positioning and fixing of the tablet structure 20.

In some embodiments, referring to FIGS. 12-15, the holding structures 45 may include a fourth holding structure 80 pressed against the plurality of the tablet bodies 21 and fixed to the substrate 10.

Specifically, referring to FIG. 12 and FIG. 14, the fourth holding structure 80 spans a plurality of the tablet bodies 21, and two longitudinal ends of the fourth holding structure 80 respectively exceed outermost two of the plurality of the tablet structures 20 with excessing portions fixed to the substrate 10, such that the fourth holding structure 80 can firmly hold the plurality of the tablet bodies 21 at the first side of the substrate 10. When the power structure 30 is installed in the installation space of the power structure, the tablet structure 20 exerts a pressing force on the power structure 30 towards the substrate 10, thereby effectively preventing the power structure 30 from falling.

Further, the excessing portions are fixed to the substrate 10 by screwing or buckling. Referring to FIGS. 11-15, fasteners 81 are fixed to the substrate 10 after penetrating the excessing portions, thereby achieving fixing of the fourth holding structure 80. The fastener 81 may be a bolt. By installing or removing the fasteners 81 at both ends, the fourth holding structure 80 can be installed and removed, leading to fast and convenientoperations.

Alternatively, the fourth holding structure 80 is configured as a pressing rod, and a surface of the pressing rod facing the tablet body 21 is a pressing planar surface. By changing a length of the fourth holding structure 80, a different number of the power structures 30 can be firmly pressed.

The tablet body 21 is formed as a recessed groove structure recessed towards the substrate 10, and the opening of the tablet body 21 faces away from the substrate 10. Referring to FIGS. 13 and 15, the tablet body 21 is formed as a recessed groove structure that is recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the fourth holding structure 80 is located in the recessed groove of the tablet body 21, so that a distance between the fourth holding structure 80 and the substrate 10 can be shortened. In this way, the holding structure 45 is located in the recessed groove of the tablet body 21 as much as possible, which can reduce a dimension of the power unit 100 in a height direction and form a relatively large usable space above the tablet structure 20, thereby facilitating leaving an installation space for other components and thus preventing mutual interference during the installation.

In the embodiment shown in FIG. 13, an entirety of the fourth holding structure 80 is located in the recessed groove.

Referring to FIGS. 16-26, the power structure 30 has a plurality of pins, for example, the first pin 331, the second pin 332, and the third pin 333 of the first connecting leg 311 and the second connecting leg 321, and at least one of the pins is connected, in a form of penetrating only one layer of the busbar, to the penetrated busbar, and the at least one pin is staggered from and electrically insulated from the other busbars. In other words, the at least one pin does not need to penetrate other busbars, and it is only needed to punch holes in the penetrated busbar, so that the at least one pin penetrates this hole, thereby reducing the number of the holes punched on the other busbars and simplifying a production process of the power unit assembly 1000. Moreover, the at least one pin is staggered from the other busbars, and a good insulation performance between the at least one pin and the other busbars can be ensured.

For the power unit assembly 1000 according to the embodiments of the present disclosure, the pin is connected, in the form of penetrating only one layer of the busbar, to the penetrated busbar, and this pin is staggered from the other busbars, such that the number of the holes punched on the other busbars can be reduced, to simplify a manufacturing process of the busbar and facilitate achieving the better electrical insulation performance between the pin and the other busbars.

In some alternative embodiments, the busbar comprisesa busbar connecting portion, at least one pin of the power unit 100 is connected to the busbar in a form of penetrating only one layer of the busbar connecting portion, and the busbar connecting portion is configured in a sheet shape. In other words, for the busbar, the busbar connecting portion is only provided at a position that needsto be connected to the pin, while no physical structure may be provided at a position staggered from the pin, thereby facilitating saving a material of the busbar and thus saving cost.

Alternatively, the busbar and the corresponding busbar connecting portion are on the same plane, thereby facilitating simplification of the structure of the busbar and processing and manufacturing of the busbar.

Alternatively, the busbar and the corresponding busbar connecting portion are formed by a blanking process, which is simple and efficient, thereby facilitating shortening processing time of the busbarwhile reducing stray inductance.

In some alternative embodiments, the busbar connecting portion protrudes from at least one side edge of the corresponding busbar, and the busbar connecting portion is directly connected to the corresponding busbar. In other words, the busbar connecting portion is connected to the corresponding busbar without other connectors, so that the busbar structure is simple, thereby facilitating simplifying the processing process of the busbar while reducing the stray inductance.

In some alternative embodiments, the busbar connecting portion is provided with a busbar connecting portion through hole that allows the pin to pass through. The pin of the power structure 30 extends into a corresponding busbar connecting portion through hole and is electrically connected to the busbar where the busbar connecting portion is located.

In some alternative embodiments, in two busbar connecting portions corresponding to two adjacent pins, the busbar connecting portion through hole on one of the busbar connecting portions is located outside a contour of the other one of the busbar connecting portions, so that it can be ensured that each of the pins is only connected to the busbar connecting portion through hole on the corresponding busbar connecting portion without being connected to the busbar connecting portion through hole on other busbar connecting portions. It should be noted that the “two adjacent pins” mentioned here can be two adjacent pins of the same power structure 30 or two adjacent pins of different power structures 30.

In some alternative embodiments, referring to FIGS. 16-23, two of the pins of the same power structure 30 are respectively connected to the busbar connecting portions of the two corresponding busbars, and each of the pins is only connected toand penetrate the corresponding busbar connecting portion. Referring to FIGS. 24-26, the remaining one pin in the same power structure 30 is adapted to be connected to the driving circuit board 2000.

Referring to FIGS. 16-19, the busbar includes: a first busbar 201, a second busbar 202 and a third busbar 203. The first busbar 201 includes a first busbar body 2013, the second busbar 202 includes a second busbar body 2023, and the third busbar 203 includes a third busbar body 2033. Thebusbar connecting portion includes: a first busbar connecting portion 2011, a second busbar connecting portion 2021 and a third busbar connecting portion 2031. The first busbar connecting portion 2011 is connected to the first busbar body 2013 of the first busbar 201, the second busbar connecting portion 2021 is connected to the second busbar body 2023 of the second busbar 202, and the third busbar connecting portion 2031 is connected to the third busbar body 2033 of the third busbar 203.

The first busbar connecting portion 2011 is located at one side of the first busbar 201, the second busbar connecting portion 2021 is located at the other side of the second busbar 202 opposite to the first busbar connecting portion 2011, and the third busbar connecting portions 2031 are respectively located at both sides of the third busbar 203.

In some alternative embodiments, referring to FIG. 16, the power structure 30 includes a first power structure 31 and a second power structure 32. Thepin of the first power structure 31 and the pin of the second power structure 32 are respectively located at opposite outer sides of the first power structure 31 and the second power structure 32, the pin of the first power structure 31 is the first connecting leg 311, the pin of the second power structure 32 is the second connecting leg 321, and each of the first connecting leg 311 and the second connecting leg 321 includes a first pin 331, a second pin 332, and a third pin 333.

The pin 311 of the first power structure 31, and the first busbar connecting portion 2011 and the third busbar connecting portion 2031 of the third busbar 203 at a first side of the busbar are at the first side (for example, a left side in FIG. 16) , and the pin 321 of the second power structure 32, and the second busbar connecting portion 2021 and the third busbar connecting portion 2031 of the third busbar 203 at a second side of the busbar are at the second side (for example, a right side in FIG. 16) .

The first busbar connecting portion 2011 is provided with a first busbar connecting portion through hole 2014, the second busbar connecting portion 2021 is provided with a second busbar connecting portion through hole 2024, and the third busbar connecting portion 2031 is provided with a third busbar connecting portion through hole 2034.

Specifically, referring to FIGS. 16-19 and 23-26, the first pin 331 of the first connecting leg 311 is adapted to pass through the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031, to achieve a connection with the third busbar 203; the second pin 332 of the first connecting leg 311 is adapted to penetrate the driving circuit board 2000, to achieve a connection with the driving circuit board 2000; and the third pin 333 of the first connecting leg 311 is adapted to pass through the first busbar connecting portion through hole 2014 on the first busbar connecting portion 2011, to achieve a connection with the first busbar 201.

Similarly, referring to FIGS. 20-26, the first pin 331 of the second connecting leg 321 is adapted to pass through the second busbar connecting portion through hole 2024 on the second busbar connecting portion 2021, in order to achieve the connection with the second busbar 202; the second pin 332 of the second connecting leg 321 is adapted to penetrate the driving circuit board 2000, in order to achieve the connection with the driving circuit board 2000; and the third pin 333 of the second connecting leg 321 is adapted to pass through the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031, in order to achieve the connection with the third busbar 203. The third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 on the third busbar 203 located at the first side of the busbar is staggered from the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 on the third busbar 203 located on the second side of the busbar. Referring to FIG. 20 in conjunction, a line connecting thethird busbar connecting portion through holes 2034 of both sides of the third busbar 203 is not parallel to a short side of the third busbar 203.

A stacking arrangement of the first busbar 201, the second busbar 202 and the third busbar 203 can be changed according to actual needs. For example, the third busbar 203 may be located above the first busbar 201 and the second busbar 202 or between the first busbar 201 and the second busbar 202.

Further, any one of the two pins in the same power structure 30 is connected to the corresponding busbar connecting portion and adjacent to or spaced from the other busbar connecting portion side by side.

As shown in FIGS. 16-17, the first pin 331 of the first connecting leg 311 is connected to the third busbar connecting portion 2031 and spaced apart from the first busbar connecting portion 2011, and the third pin 333 of the first connecting leg 311 is connected to the first busbar connecting portion 2011 and spaced apart from the third busbar connecting portion 2031; the first pin 331 of the second connecting leg 321 is connected to the second busbar connecting portion 2021 and spaced apart from the third busbar connecting portion 2031, and the third pin 333 of the second connecting leg 321 is connected to the third busbar connecting portion 2031 and spaced apart from the second busbar connecting portion 2021.

In some alternative embodiments, any one of the two pins in the same power structure 30 is connected to the corresponding busbar connecting portion, and the busbar connecting portion through hole on one of the busbar connecting portions is located outside a contour of the other one of the busbar connecting portions. As shown in FIGS. 16-17, the first pin 331 of the first connecting leg 311 is connected to the third busbar connecting portion 2031, and the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 is located outside a contour of the first busbar connecting portion 2011; the third pin 333 of the first connecting leg 311 is connected to the first busbar connecting portion 2011, and the first busbar connecting portion through hole 2014 on the first busbar connecting portion 2011 is located outside a contour of the third busbar connecting portion 2031; the first pin 331 of the second connecting leg 321 is connected to the second busbar connecting portion 2021, and the second busbar connecting portion through hole 2024 on the second busbar connecting portion 2021 is located outside the contour of the third busbar connecting portion 2031; the third pin 333 of the second connecting leg 321 is connected to the third busbar connecting portion 2031, and the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 is located outside the contour of the second busbar connecting portion 2021.

Referring to FIGS. 24-26, the remaining one pin in the same power structure 30 is adapted to be connected to the driving circuit board 2000, and this remaining one pin is directly connected to the driving circuit board 2000 without being blocked by the busbar connecting portion. For example, the second pin 332 of the first power structure 31 is connected to the driving circuit board 2000, and there is no busbar connecting portion between the second pin 332 of the first power structure 31 and the driving circuit board 2000 for blocking; the second pin 332 of the second power structure 32 is connected to the driving circuit board 2000, and there is no busbar connecting portion between the second pin 332 of the second power structure 32 and the driving circuit board 2000 for blocking.

In some alternative embodiments, referring to FIGS. 1, 3, 16-17, 19-21 and 25, the same power structure 30 includes a first pin 331, a second pin 332 and a third pin 333, and the third pin 333 is located between the first pin 331 and the second pin 332. Referring to FIG. 2, FIG. 4, FIG. 8, FIG. 18, and FIG. 26, the third pin 333 is located outside the first pin 331 and the second pin 332 relative to the power structure 30, and the pins are staggered, which facilitates a rational arrangement of connecting points of the power structures 30 to the corresponding busbars. A gap between the first pin 331 and the second pin 332 allows one busbar connecting portion to be inserted, and the third pin 333 is connected to and penetrates this busbar connecting portion.

For example, a gap between the first pin 331 and the second pin 332 of the first power structure 31 allows the first busbar connecting portion 2011 to be inserted, and the third pin 333 of the first power structure 31is connected toand penetratesthe first busbar connecting portion 2011. The gap between the first pin 331 and the second pin 332 of the second power structure 32 allows the third busbar connecting portion 2031 to be inserted, and the third pin 333 of the second power structure 32is connected toand penetrates the third busbar connecting portion 2031.

Further, the busbar connecting portion penetrated by the first pin 331 and the busbar connecting portion penetrated by the third pin 333 are partially stacked or staggered in a stacking direction of the plurality of the busbars. For example, as shown in FIGS. 16-17, the third busbar connecting portion 2031 penetrated by the first pin 331 of the first power structure 31 and the first busbar connecting portion 2011 penetrated bythe third pin 333 are partially stacked or staggered in the stacking direction of the plurality of the busbars; the second busbar connecting portion 2021 penetrated bythe first pin 331 of the second power structure 32 and the third busbar connecting portion 2031 penetrated bythe third pin 333 are partially stacked or staggered in the stacking direction of the plurality of the busbars. Such design allows welding points between the power structure and the metal busbars to be located at positions where an edge of the busbar protrudes, and when using a traditional welding process, welding heat can be well maintained at the welding points, and a production process threshold is lower, so that the traditional process can be used for mass production.

Referring to FIGS. 24-26, the second pin 332 of the first power structure 31 and the second pin 332 of the second power structure 32 are both adapted to be directly connected to the driving circuit board 2000.

Specifically, one of the first busbar 201 and the second busbar 202 is a positive busbar and the other is a negative busbar. The third busbar 203 is a phase bar. For example, the first busbar 201 is a positive busbar and the second busbar 202 is a negative busbar, or the first busbar 201 is a negative busbar and the second busbar 202 is a positive busbar.

Further, the power unit assembly 1000 may further include a busbar clamp (not shown in the drawing) for clamping the first busbar 201 and the second busbar 202, which facilitates bonding of the first busbar 201 and the second busbar 202 and can shorten a distance between the first busbar 201 and the second busbar 202, thereby further reducing a height dimension of the power unit assembly 1000.

In the embodiments shown in FIGS. 16-26, each of the first busbar 201, the second busbar 202, and the third busbar 203 includesa rectangular shape, and the first busbar 201, the second busbar 202, and the third busbar 203 are stacked in a thickness direction of the busbar, and the busbar connecting portion is formed on a longitudinal long side of a corresponding busbar. Specifically, the first busbar connecting portion 2011 is formed on a longitudinal long side at a first side of the first busbar 201, the second busbar connecting portion 2021 is formed on a longitudinal long side on a second side of the second busbar 202, and the third busbar connecting portion 2031 is formed on longitudinal long sides on both sides of the third busbar 203.

Referring to FIGS. 16-17 and FIGS. 19-23, an end of the first busbar 201 is provided with a first busbar adapter end plate 2012, an end of the second busbar 202 is provided with a second busbar adapter end plate 2022, the first busbar adapter end plate 2012 and the second busbar adapter end plate 2022 are located at the same end and arranged side by side, and the other end of the third busbar 203 opposite to the first busbar adapter end plate 2012 is provided with a third busbar adapter end plate 2032, thereby facilitating a rational arrangement of the adapter end plates of each of the busbars.

In some alternative embodiments, the first busbar 201, the second busbar 202, and the third busbar 203 are flat busbars, which is beneficial to further reduce the dimension of the power unit assembly 1000 in the height direction.

In some unshown embodiments, the busbar connecting portion is provided with a through groove that allows the pin to pass through, and the through groove extends in a direction facing away from the busbar and penetrates an outer edge of the busbar connecting portion facing away from the busbar. For example, the through groove may be a “U” -shaped groove with an opening facing outward, thereby allowing the pin to pass through the through groove or be taken out of the through groove.

In some alternative embodiments, a surface of the busbar is covered with an insulating thin film. The insulating thin film can prevent the busbar from being electrically connected to other pins, and an insulation performance between two adjacent busbars is better.

In the description of this specification, the description with reference to terms “an embodiment” , “some embodiments” , “examples” , “specific examples” or “some examples” etc. means that specific features, structures, materials or characteristics described in conjunction with the embodiments or the examples are included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials, or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can join and combine different embodiments or examples described in this specification.

Although the embodiments of the present disclosure have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be construed as limiting the present disclosure, and those of ordinary skill in the art can make variations, modifications, substitutions, and modifications to the above embodiments within the scope of the present disclosure.

Claims

A power unit assembly, comprising:

a power unit comprising a power structure, the power structure having a plurality of pins; and

a plurality of busbars arranged to bestacked, wherein at least one of the plurality of the pins is connected, in a form of penetrating only one layer of the plurality of busbars, tothe penetrated busbar, and the at least one of theplurality ofpinsis staggered and electrically insulated from remaining ones of the plurality of busbars.
The power unit assembly according to claim 1, whereineach of the plurality of busbarscomprisesbusbar connecting portions, at least one of the pins of the power unit penetrates only one layer of the busbar connecting portions to be connected to the busbar, and each of the busbar connecting portions is constructed into a sheet shape.
The power unit assembly according to claim 2, whereinthe plurality of busbars and the corresponding busbar connecting portion are on a same plane.
The power unit assembly according to claim 3, whereinthe plurality of busbars and the corresponding busbar connecting portion are formed by a blanking process.
The power unit assembly according to claim 2, whereineach of the busbar connecting portions protrudes from at least one side edge of thecorresponding busbar, and is directly connected to the corresponding busbar.
The power unit assembly according to claim 2, whereineach of the busbar connecting portions is provided with a busbar connecting portion through hole allowing the pin to pass through.
The power unit assembly according to claim 2 or 6, wherein the two busbar connecting portions corresponding to two adjacent ones of the plurality of pins, abusbar connecting portion through hole of one of the twobusbar connecting portions is located outside a contour of the other one of the two busbar connecting portions.
The power unit assembly according to claim 2 or 6, whereintwo of the plurality ofpins ofasame power structure are respectively connected to the busbar connecting portions of the two corresponding busbars, and the plurality ofpins onlypenetratesand then is connected to the corresponding busbar connecting portion.
The power unit assembly according to claim 8, whereinany one of the two pins is connected to the corresponding busbar connecting portion and adjacent to or spaced apartside by side from the other busbar connecting portion.
The power unit assembly according to claim 8, whereinany one of the two pins is connected to the corresponding busbar connecting portion, and abusbar connecting portion through hole of one of the busbar connecting portions is located outside a contour of the remaining ones of thebusbar connecting portions.
The power unit assembly according to claim 8, wherein a remaining one pin in the same power structure is adapted to be connected to a driving circuit board, and is directly connected to the driving circuit board in a form without being blocked by the busbar connecting portion.
The power unit assembly according to claim 8, whereinthe same power structure comprises a first pin, a second pin, and a third pin, the third pin is located between the first pin and the second pin and outside the first pin and the second pin with respect to the power structure, and a gap between the first pin and the second pin allows one of the busbar connecting portions to be inserted in such a manner that the third pin penetrates and then is connected to the third pin.
The power unit assembly according to claim12, whereinthe busbar connecting portion through which the first pin penetrates and the busbar connecting portion through which the third pin penetrates are partially stacked or staggered in a stacking direction of the plurality of the busbars, and the second pin is adapted to be directly connected to the driving circuit board.
The power unit assembly according to claim 8, wherein

the busbars comprise a first busbar, a second busbar, and a third busbar; and

the busbar connecting portions comprise: a first busbar connecting portion connected to the first busbar, a second busbar connecting portion connected to the second busbar, a third busbar connecting portion connected to the third busbar, the first busbar connecting portion is located at one side of the first busbar, the second busbar connecting portion is located at the other side of the second busbar opposite to the first busbar connecting portion, and the third busbar connecting portions are respectively located at two sides of the third busbar.
The power unit assembly according to claim14, whereinone of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.
The power unit assembly according to claim15, whereinthe power unit assembly further comprises a busbar clamp for clamping the first busbar and the second busbar.
The power unit assembly according to claim 14, whereinthe first busbar, the second busbar, and the third busbar each comprises a rectangular shape and are stacked in a thickness direction of the busbar, and the busbar connecting portion is formed at a longitudinal long side of the corresponding busbar.
The power unit assembly according to claim14, whereinthe power structure comprises a first power structure and a second power structure, the pin of the first power structure and the pin of the second power structure are respectively located at opposite outer sides of the first power structure and the second power structure, the pin of the first power structure, the first busbar connecting portion and the third busbar connecting portion on the third busbar located at a first side of the busbar are at the first side, and the pin of the second power structure, the second busbar connecting portion and the third busbar connecting portion on the third busbar located at a second side of the busbar are at the second side.
The power unit assembly according to claim14, whereinan end of the first busbar is provided with a first busbar adapter end plate, an end of the second busbar is provided with a second busbar adapter end plate, the first busbar adapter end plate and the second busbar adapter end plate are located at the same end and arranged side by side, and another end of the third busbar opposite to the first busbar adapter end plate is provided with a third busbar adapter end plate.
The power unit assembly according to claim14, whereinthe first busbar, the second busbar, and the third busbar are flat busbars.
The power unit assembly according to claim2, whereinthe busbar connecting portion is provided with a through groove that allows the pin to pass through, and the through groove extends in a direction facing away from the busbar and penetrates an outer edge of the busbar connecting portion facing away from the busbar.
The power unit assembly according to claim 1 or 2, whereina surface of the busbar is covered with an insulating thin film.