CN211580297U - Fastening device for a power structure - Google Patents

Abstract

The utility model discloses a fixing device for power structure. The fixing device includes: a substrate; a plurality of preform structures, the preform structures comprising: the pressing arm is connected with the pressing body in parallel in the first direction of the substrate, and a power structure mounting space is formed between the pressing arm and the substrate; and a retaining structure configured to retain the sheeting structure on the first side of the substrate. According to the utility model discloses a fixing device for power structure through setting up the retaining structure, can make the power structure fix on the base plate well.

Description

Fastening device for a power structure

Technical Field

The utility model relates to a converter technical field particularly, relates to a fixing device for power structure.

Background

In the existing frequency converter, the power structure needs to be installed on the substrate and is suitable for being connected with the driving circuit board and the multilayer busbar, but the power structure is installed on the substrate insecurely and is easy to fall off from the substrate, so that a fixing structure is added in some schemes and is fixed on the substrate. However, in the prior art, after the power structure is connected with the driving circuit board and the multilayer busbar through the fixing structure, a long pin is needed to pass through the busbar and the driving circuit board, which results in a large volume of the whole device. In addition, the pins of the power structures are prone to interfere with each other, and failure is prone to occur. And when the power structure is installed on the substrate by using the fixing structure in the existing product, the process is complex and the installation efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the above-mentioned technical problem among the prior art to a certain extent at least. Therefore, the utility model provides a fixing device for power structure can fix the power structure on the base plate well.

According to the utility model discloses a fixing device for power structure includes: a substrate; a plurality of preform structures, the preform structures comprising: the pressing arm is connected with the pressing body in parallel in the first direction of the substrate, and a power structure mounting space is formed between the pressing arm and the substrate; and a retaining structure configured to retain the sheeting structure on the first side of the substrate.

According to the utility model discloses a fixing device for power structure through setting up the retaining structure, can make the power structure fix on the base plate well.

According to some embodiments of the invention, a plurality of the tabletting structures are connected to each other in a second direction of the base plate, the first direction and the second direction being perpendicular to each other.

According to some embodiments of the invention, the retaining structure comprises: a first retaining structure extending from the base plate toward the wafer body and through the wafer structure, the wafer structure being retained on the first side of the base plate by the first retaining structure.

Further, the holding structure further includes: a second retaining structure that retains the wafer structure on the first side of the substrate by mating with the first retaining structure.

Optionally, the first retaining structure is configured as a columnar structure, and the second retaining structure is configured as an annular structure that is sleeved on the columnar structure.

Further, the first holding structure is perpendicular to the substrate and has a free end far away from the substrate, and the second holding structure is rotatably sleeved on the first holding structure from a side of the pressing structure far away from the substrate.

Optionally, the first retaining structure is configured as a threaded rod having an external thread and the second retaining structure is configured as a nut having an internal thread.

According to some embodiments of the invention, the second retaining structure presses against a side of the sheeting structure that faces away from the base plate.

According to some embodiments of the present invention, the pressing body is formed to a recessed groove structure recessed toward the base plate, and the opening of the pressing body deviates from the base plate.

Further, at least a portion of the second retaining structure is located within the recessed pocket of the wafer body, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

According to some embodiments of the invention, the retaining structure further comprises: a third retaining structure disposed at a free end of the first retaining structure distal from the base plate, the third retaining structure configured as a snap adapted to snap-fit the wafer structure.

Specifically, the cross section of the buckle is gradually changed and is provided with a small-diameter end and a large-diameter end, a guide conical surface suitable for guiding the tabletting structure to penetrate through is formed from the small-diameter end to the large-diameter end of the buckle, and the large-diameter end is formed into a clamping and abutting surface suitable for clamping and abutting the tabletting structure.

Further, the large diameter end is located on one side of the small diameter end close to the substrate, the small diameter end is suitable for being fixed with the first retaining structure, and the large diameter end is suitable for being separated from the first retaining structure.

According to some embodiments of the present invention, the pressing body is formed to a recessed groove structure recessed toward the base plate, and the opening of the pressing body deviates from the base plate.

Specifically, at least a portion of the third retaining structure is located within a recessed pocket of the wafer body, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

According to some embodiments of the invention, the retaining structure comprises: and the fourth holding structure is pressed against the pressing sheet bodies and is fixed with the substrate.

Specifically, the fourth holding structure spans over a plurality of the tablet bodies, and two longitudinal ends of the fourth holding structure respectively exceed two outermost parts of the tablet structures and the exceeding parts are fixed with the substrate.

Further, the excess part and the substrate are fixed through screw connection or clamping connection.

Optionally, the fourth holding structure is configured as a pressing rod, and a surface of the pressing rod facing the tablet body is a pressing plane.

According to some embodiments of the present invention, the pressing body is formed to a recessed groove structure recessed toward the base plate, and the opening of the pressing body deviates from the base plate.

Further, at least a portion of the fourth retaining structure is located within the recessed pocket of the wafer body.

According to some embodiments of the invention, the wafer arm comprises: the first pressing arm and the second pressing arm are symmetrically connected to two sides of the pressing body.

Further, the pressing structure is configured as a gull wing, and the free ends of the first pressing arm and the second pressing arm are respectively provided with a bending section bending towards the base plate.

According to some embodiments of the present invention, two adjacent tabletting bodies of the tabletting structure are connected to each other by a tabletting connecting portion.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a perspective assembly view of a power unit with the retention structure including a second retention structure;

FIG. 2 is an assembled side view of the power cell with the retention structure including a second retention structure;

FIG. 3 is an exploded perspective view of the power cell when the retaining structure includes a second retaining structure;

FIG. 4 is an exploded side view of the power cell when the retaining structure includes a second retaining structure;

FIG. 5 is a schematic perspective view of the power unit when the substrate is provided with ribs and the retaining structure includes a second retaining structure;

FIG. 6 is an exploded view of the power cell with a recess in the substrate and the retaining structure including a second retaining structure;

FIG. 7 is a schematic perspective view of the power cell assembly with a recess disposed in the substrate and the retaining structure including a second retaining structure;

FIG. 8 is an assembled side view of the power cell with a recess disposed in the substrate and the retention structure including a second retention structure;

FIG. 9 is a perspective view of a wafer configuration;

FIG. 10 is a perspective assembly view of the power unit with the retention structure including a third retention structure;

FIG. 11 is an assembled side view of the power unit with the retention structure including a third retention structure;

FIG. 12 is a perspective assembly view of a power unit having splines when the retention structure includes a fourth retention structure;

FIG. 13 is an assembled side view of a power cell having a spacer when the retention structure includes a fourth retention structure;

FIG. 14 is a perspective assembly view of a power unit without a spacer when the retention structure includes a fourth retention structure;

fig. 15 is an assembled side view of a power cell without a spacer when the retention structure includes a fourth retention structure.

Reference numerals:

the power unit 100, the substrate 10, the protruding strip 11, the groove 12, the tablet structure 20, the tablet body 21, the tablet body positioning hole 211, the tablet arm 22, the first tablet arm 221, the second tablet arm 222, the tablet connecting portion 23, the bending section 24, the power structure 30, the first power structure 31, the first connecting leg 311, the second power structure 32, the second connecting leg 321, the first leg 331, the second leg 332, the third leg 333, the retaining structure 45, the first retaining structure 40, the second retaining structure 50, the positioning sheet 60, the positioning hole 61, the annular positioning rib 62, the positioning sheet through hole 63, the heat insulation structure 60', the third retaining structure 70, the small diameter end 71, the large diameter end 72, the fourth retaining structure 80, and the fastening member 81.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1 to 8, the power unit 100 may include: a substrate 10, a wafer structure 20, and a power structure 30, wherein a first side (i.e. the upper side in fig. 2) of the substrate 10 has a first side surface, the wafer structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the wafer structure 20. By pressing the power structure 30 against the first side of the substrate 10 by the pressing structure 20, the power structure 30 can be firmly and reliably mounted on the substrate 10.

A fixing device for a power structure 30 according to an embodiment of the present invention is described in detail below with reference to fig. 1 to 15.

Referring to fig. 1, 3, 5-15, a fixing device for a power structure 30 according to an embodiment of the present invention may include: base plate 10, retaining structure 45 and a plurality of preforming structures 20, preforming structure 20 includes: the pressing piece structure comprises a pressing piece body 21 and a pressing piece arm 22, wherein the pressing piece arm 22 is connected with the pressing piece body 21 in parallel in the first direction of the substrate 10, a power structure installation space is formed between the pressing piece arm 22 and the substrate 10, and a holding structure 45 is arranged for holding the pressing piece structure 20 on the first side of the substrate 10.

Referring to fig. 1-2 and 5, the power structure 30 is suitable for being installed in a power structure installation space, the wafer arm 22 is used for pressing against the power structure 30, the power structure 30 is clamped between the wafer structure 20 and the substrate 10, and the wafer arm 22 of the wafer structure 20 generates a pressing force on the power structure 30 towards the substrate 10, so as to prevent the power structure 30 from falling off the substrate 10.

By varying the number of wafer structures 20, compaction of different numbers of power structures 30 can be achieved.

According to the utility model discloses a fixing device for power structure 30 through setting up retaining structure 45, can make power structure 30 fix well on base plate 10.

The plurality of the tablet structures 20 are connected to each other in the second direction of the base plate 10, thereby saving the assembly process of the plurality of tablet structures 20 and facilitating the improvement of the assembly process of the tablet structures 20. Meanwhile, the connected integrated tabletting structures 20 can simultaneously press against a plurality of power structures 30, which is beneficial to improving the pressing efficiency of the tabletting structures 20 on the power structures 30. The integrated preform structures 20 may be pressed against the base plate 10 by one or more retaining structures 45.

Alternatively, the first and second directions are perpendicular to each other, facilitating proper arrangement of the plurality of power structures 30. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.

In some embodiments, as shown with reference to fig. 1-9, the retaining structure 45 includes: the first holding structure 40 extends from the substrate 10 to the pressing sheet body 21, the first holding structure 40 penetrates through the pressing sheet structure 20, the pressing sheet structure 20 is held on the first side of the substrate 10 through the first holding structure 40, and the pressing sheet structure 20 presses against the power structure 30 to hold the power structure 30 on the first side of the substrate 10. In other words, referring to fig. 2 and 8, the first holding structure 40 penetrates the wafer structure 20 from bottom to top, and the wafer structure 20 is held on the first side of the substrate 10 by the first holding structure 40, that is, when the first holding structure 40 penetrates the wafer structure 20, the relative position between the wafer structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role in positioning the wafer structure 20.

Further, referring to fig. 1-8, the retaining structure 45 further comprises: a second retaining structure 50, the second retaining structure 50 being adapted to engage the first retaining structure 40 to retain the wafer structure 20 on the first side of the substrate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the wafer structure 20 facing away from the substrate 10. As shown in fig. 2, the second holding structure 50 is connected to the first holding structure 40 at the upper side of the tablet structure 20, and the upper side of the tablet structure 20 is open to leave an operation space for mounting and dismounting the second holding structure 50. The wafer structure 20 is clamped between the second holding structure 50 and the substrate 10, while the power structure 30 is clamped between the wafer structure 20 and the substrate 10.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Further, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the embodiment shown in fig. 1-8, the first retaining structure 40 is configured as a cylindrical structure, the second retaining structure 50 is configured as a ring structure that is sleeved on the cylindrical structure, and the wafer structure 20 is clamped between the second retaining structure 50 and the substrate 10 to prevent the wafer structure 20 from being separated from the substrate 10.

Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10, and the first retaining structure 40 has a free end away from the substrate 10, and the second retaining structure 50 is rotatably sleeved on the first retaining structure 40 from the side of the tabletting structure 20 away from the substrate 10, thereby facilitating quick connection or disconnection between the second retaining structure 50 and the first retaining structure 40.

In some alternative embodiments, the first retaining structure 40 is configured as a threaded rod having external threads, and the second retaining structure 50 is configured as a nut having internal threads, the nut being threadably engaged with the threaded rod to facilitate installation and removal of the wafer structure 20.

Referring to fig. 1 to 8, the second holding structure 50 is pressed against a side of the tablet structure 20 away from the substrate 10, and the second holding structure 50 can apply a pressing force to the tablet structure 20 toward the substrate 10, so as to prevent the tablet structure 20 from shaking, and thus, the connection between the tablet structure 20 and the substrate 10 is more reliable.

Referring to fig. 1 to 9, the tablet body 21 is formed in a concave groove structure that is concave toward the first side surface, and the opening of the tablet body 21 faces away from the first side surface. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the second holding structure 50 is located in the recessed groove of the tablet body 21, and an end surface of the first holding structure 40 away from the free end of the substrate 10 (i.e., an upper end surface of the first holding structure 40) is also located in the recessed groove, so that a distance between the end surface of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, and a distance between the second holding structure 50 and the substrate 10 can be shortened, so that the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for reserving an installation space for other components, and preventing mutual interference during installation.

In the embodiment shown in fig. 2, the second holding structure 50 is entirely located in the concave groove, and the upper end surface of the first holding structure 40 is also located in the concave groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 2, the overlapping dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, and further reducing the distance between the second holding structure 50 and the substrate 10.

Referring to fig. 1-3, 5, and 7-9, the second holding structure 50 is pressed against the bottom wall of the tablet body 21, the first holding structure 40 penetrates the bottom wall of the tablet body, and a tablet body positioning hole 211 adapted to the first holding structure 40 is formed on the bottom wall of the tablet body, after the first holding structure 40 penetrates the tablet body positioning hole 211 on the bottom wall of the tablet body, the tablet structure 20 can be preliminarily positioned, so that the second holding structure 50 can be used to fix the tablet structure 20 subsequently.

Referring to fig. 1-8, the power structure 30 may include: a first power structure 31 and a second power structure 32, the first power structure 31 and the second power structure 32 being spaced apart. The presser arm 22 includes: a first pressing arm 221 and a second pressing arm 222, wherein the first pressing arm 221 is used for pressing against the first power structure 31, the second pressing arm 222 is used for pressing against the second power structure 32, the pressing body 21 is located between the first power structure 31 and the second power structure 32, and the retaining structure 45 is also located between the first power structure 31 and the second power structure 32.

Further, the first power structure 31 has a first connection leg 311, the second power structure 32 has a second connection leg 321, the first connection leg 311 and the second connection leg 321 are respectively located at opposite outer sides of the first power structure 31 and the second power structure 32, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.

Alternatively, the angle between the extending direction of the first connecting leg portion 311 from the first power structure 31 and the extending direction of the second connecting leg portion 321 from the second power structure 32 is 180 degrees. That is to say, the pins of the first connecting leg portion 311 and the second connecting leg portion 321 are disposed outward, so as to leave a middle space between the first power structure 31 and the second power structure 32, and facilitate the holding structure 45 to fix the wafer structure 20 on the substrate 10 from the middle space.

The pins of the first and second connection leg portions 311 and 321 each include: the first pin 331, the second pin 332, and the third pin 333, each of which is adapted to be electrically connected to a driving circuit board or a corresponding bus bar.

Referring to fig. 2 and 4, the extending direction of the first connecting leg 311 from the first power structure 31 is leftward, the extending direction of the second connecting leg 321 from the second power structure 32 is rightward, and an included angle therebetween is 180 degrees, so that it is avoided that the first connecting leg 311 and the second connecting leg 321 are closer to each other when the first connecting leg 311 and the second connecting leg 321 face each other, and the first power structure 31 and the second power structure 32 are interfered with each other. Meanwhile, when the first power structure 31 and the second power structure 32 are connected to the corresponding bus bar or the driving circuit board, the first connecting leg 311 and the second connecting leg 321 both face outward, and the space is sufficient, so that the corresponding operation is facilitated.

Referring to fig. 1, 3, 5-7, the first power structures 31 and the second power structures 32 are oppositely arranged in a first direction of the substrate 10, the first power structures 31 are plural, the plurality of first power structures 31 are arranged on the substrate 10 in a second direction of the substrate 10, the plurality of second power structures 32 are plural, the plurality of second power structures 32 are arranged on the substrate 10 in the second direction, the plurality of wafer structures 20 are plural, and the plurality of wafer structures 20 are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.

Further, the plurality of first power structures 31, the plurality of pad structures 20, and the plurality of second power structures 32 correspond one-to-one in the first direction. A pair of first power structures 31 and second power structures 32, which are oppositely disposed, can be pressed against the substrate 10 by the same wafer structure 20.

In some embodiments, not shown, the plurality of sheeting structures 20 may be separate entities.

In the embodiment shown in fig. 1, 3, and 9, the plurality of tablet structures 20 are connected into a whole through the tablet connecting portion 23, and specifically, the tablet bodies 21 of two adjacent tablet structures 20 are connected to each other through the tablet connecting portion 23, so that the assembly process of the plurality of tablet structures 20 is saved, which is beneficial to improving the assembly efficiency of the power unit 100. Meanwhile, the tabletting structures 20 connected into a whole can simultaneously press a plurality of power structures 30, and the pressing efficiency is high. The integrated wafer structure 20 is pressed against the base plate 10 by two or more retaining structures 45.

Further, the tablet connecting portion 23 is connected between the tablet bodies 21 of two adjacent tablet structures 20, and the width of the tablet connecting portion 23 may be equal to the width of the tablet body 21.

In some embodiments, as shown with reference to fig. 10-11, the retaining structure 45 may include: a first holding structure 40 and a third holding structure 70, the third holding structure 70 being arranged at a free end of the first holding structure 40 remote from the substrate 10, as shown in fig. 11, the first holding structure 40 being arranged on the substrate 10, the third holding structure 70 being arranged at an upper end of the first holding structure 40. The third holding structure 70 can be constructed as a buckle suitable for clamping the tablet structure 20, and the buckle fixes the tablet structure 20 to the substrate 10 in a clamping manner, so that the tablet structure 20 can be mounted and dismounted more quickly and conveniently, and the operation time can be saved.

Specifically, the cross section of the buckle gradually changes and has a small diameter end 71 and a large diameter end 72, as shown in fig. 11, the upper end of the buckle is the small diameter end 71, the lower end is the large diameter end 72, the buckle forms a guiding conical surface suitable for guiding the pressing sheet structure 20 to penetrate from the small diameter end 71 to the large diameter end 72, the pressing sheet structure 20 is provided with a buckle hole suitable for the buckle to penetrate, the outer diameter of the small diameter end 71 is smaller than the diameter of the buckle hole, in a free state, the outer diameter of the large diameter end 72 is larger than the diameter of the buckle hole, and the large diameter end 72 is formed into a clamping surface suitable for clamping the pressing sheet structure 20.

Further, the large diameter end 72 is located on one side of the small diameter end 71 close to the substrate 10, the small diameter end 71 is suitable for being fixed to the first retaining structure 40, and the large diameter end 72 is suitable for being separated from the first retaining structure 40, so that the large diameter end 72 can elastically deform to be close to or far away from the first retaining structure 40 in the circumferential direction, when the tablet structure 20 crosses the buckle from top to bottom, the small diameter end 71 firstly extends out of the buckle hole, and the large diameter end 72 gathers towards the first retaining structure 40 under the limiting effect of the hole wall of the buckle hole, so that the large diameter end 72 can smoothly cross the buckle hole to reach above the tablet structure 20, and the abutting surface of the large diameter end 72 abuts against the upper surface of the tablet structure 20, that is, the tablet structure 20 is clamped between the third retaining structure 70 and the substrate 10.

The pressing body 21 is formed into a recessed groove structure recessed toward the base plate 10, and the opening of the pressing body 21 is away from the base plate 10. Referring to fig. 11, the tablet body 21 is formed in a recess groove structure recessed downward, and an opening of the tablet body 21 faces upward.

At least a part of the third holding structure 70 is located in the recessed groove of the tablet body 21, and the end surface of the first holding structure 40 away from the free end of the substrate 10 (i.e., the upper end surface of the first holding structure 40) is also located in the recessed groove, so that the distance between the end surface of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, and the distance between the third holding structure 70 and the substrate 10 can be shortened, so that the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for reserving an installation space for other components and preventing mutual interference during installation.

In the embodiment shown in fig. 11, the third holding structure 70 is entirely located in the concave groove, and the upper end face of the first holding structure 40 is also located in the concave groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 11, the overlapping dimension of the third holding structure 70 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the third holding structure 70, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, and further reducing the distance between the third holding structure 70 and the substrate 10.

After the third retaining structure 70 and the first retaining structure 40 penetrate through the bottom wall of the tablet body, the third retaining structure 70 is pressed against the bottom wall of the tablet body 21, so that the positioning and fixing of the tablet structure 20 can be realized.

In some embodiments, as shown with reference to fig. 12-15, the retention structure 45 may include: a fourth holding structure 80, wherein the fourth holding structure 80 is pressed against the plurality of tablet bodies 21, and the fourth holding structure 80 is fixed with the substrate 10.

Specifically, referring to fig. 12 and 14, the fourth holding structure 80 spans the plurality of tablet bodies 21, and both longitudinal ends of the fourth holding structure 80 respectively exceed two outermost sides of the plurality of tablet structures 20 and the exceeding portions are fixed to the substrate 10, so that the fourth holding structure 80 can firmly hold the plurality of tablet bodies 21 on the first side of the substrate 10, and when the power structure 30 is installed in the power structure installation space, the tablet structures 20 apply a pressing force to the power structure 30 toward the substrate 10, thereby effectively preventing the power structure 30 from falling.

Further, the above-mentioned excess portion and the substrate 10 are fixed by screwing or clipping. Referring to fig. 11 to 15, the fastener 81 is fixed to the base plate 10 after being inserted into the protruding portion, thereby fixing the fourth holding structure 80. The fastener 81 may be a bolt. The fourth holding structure 80 can be mounted and dismounted by mounting or dismounting the fasteners 81 at the two ends, and the operation is quick and convenient.

Alternatively, the fourth holding structure 80 is configured as a pressing rod, and a surface of the pressing rod facing the tablet body 21 is a pressing plane. By varying the length of the fourth holding structure 80, a different number of power structures 30 can be compacted.

The pressing body 21 is formed into a recessed groove structure recessed toward the base plate 10, and the opening of the pressing body 21 is away from the base plate 10. Referring to fig. 13 and 15, the tablet body 21 is formed in a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the fourth holding structure 80 is located in the recessed groove of the tablet body 21, so that the distance between the fourth holding structure 80 and the substrate 10 can be shortened, and thus, the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, so as to leave an installation space for other parts and components, and prevent mutual interference during installation.

In the embodiment shown in fig. 13, the fourth retaining structure 80 is located entirely within the recessed channel.

The first presser arm 221 and the second presser arm 222 are symmetrically connected to both sides of the presser body 21. Referring to fig. 2, 4 and 9, the tablet body 21 is formed in a concave groove structure that is concave toward the first side surface, the opening of the tablet body 21 faces away from the first side surface, the first and second tablet arms 221 and 222 are respectively connected to both ends of the opening of the tablet body 21, and the first and second tablet arms 221 and 222 extend in directions away from each other. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, the opening of the tablet body 21 faces upward, the first tablet arm 221 extends leftward, and the second tablet arm 222 extends rightward.

Referring to fig. 2, 4 and 9, the tabletting structure 20 is configured as a gull wing type, and the free ends of the first and second presser arms 221 and 222 each have a bent section 24 bent toward the base plate 10. The bending section 24 is adapted to press against the power structure 30, so that the power structure 30 is pressed against the substrate 10.

A larger planar space is formed above the wafer structure 20, so as to leave an installation space for other components (for example, the busbar), and the dimensions of the power unit 100 and the busbar assembly in the height direction can be significantly reduced.

In some optional embodiments, the power unit 100 may further include: the positioning part is used for positioning the power structure 30 on the substrate 10, thereby ensuring the accurate position of the power structure 30 on the substrate 10 and preventing the power structure 30 from shaking arbitrarily on the substrate 10.

In the embodiment shown in fig. 1-4 and 10-13, the positioning portion includes a positioning plate 60, a through positioning hole 61 is formed on the positioning plate 60, and the positioning hole 61 is matched with the power structure 30. For example, the outer peripheral surface of the power structure 30 and the positioning opening 61 are rectangular, the power structure 30 is positioned in the positioning opening 61, the bottom of the power structure 30 is directly attached to the substrate 10, the substrate 10 may be a metal substrate 10, the heat of the power structure 30 may be transferred to the substrate 10, and a cooling device or a heating device may be disposed below the substrate 10 to cool or heat the power structure 30.

Optionally, as shown in fig. 3-4, the positioning plate 60 is further provided with an annular positioning rib 62 surrounding the positioning hole 61, and the annular positioning rib 62 is matched with the outer peripheral surface of the power structure 30. The annular positioning rib 62 protrudes out of the surface of the positioning plate 60, so that the positioning firmness of the power structure 30 can be increased, and the positioning effect is good.

In the embodiment shown in fig. 1-4, the positioning sheet 60 is an insulating positioning sheet, and the positioning sheet 60 is adhesively fixed to the first side of the substrate 10.

Referring to fig. 1 and 3, the splines 60 are provided with splines through holes 63 for mating with the first retaining structures 40 and allowing the first retaining structures 40 to pass through to form a locating fit, and after the first retaining structures 40 pass through the splines through holes 63, the splines 60 may be initially located. The first holding structure 40 is connected to the second holding structure 50 after passing through the positioning piece through hole 63 of the positioning piece 60 and the pressing piece positioning hole 211 of the pressing piece body 21, thereby fixing the positioning piece 60 and the pressing piece structure 20 between the second holding structure 50 and the substrate 10.

In the embodiment shown in fig. 5, the positioning portion includes the convex strip 11 provided on the first side surface of the base plate 10, thereby saving the positioning piece 60, contributing to a reduction in the number of parts, and contributing to a reduction in assembly man-hours.

Alternatively, the rib 11 is a continuous annular rib 11, and the annular rib 11 is matched with the outer peripheral surface of the power structure 30.

Alternatively, the protruding strip 11 corresponding to each power structure 30 is divided into four sections, and the four sections are respectively located on four sides of the rectangular power structure 30, so that the power structure 30 is limited in all directions, and the power structure 30 is better positioned on the substrate 10.

In the embodiment shown in fig. 6-8, the positioning portion comprises a groove 12 formed on the first side of the substrate 10, the peripheral wall of the groove 12 is adapted to match the outer peripheral surface of the power structure 30, preferably, the groove 12 is a blind groove, and as shown in fig. 8, the bottom wall of the groove 12 is adapted to fit the bottom surface of the power structure 30 to support the power structure 30. This embodiment also saves the spacer 60, which is advantageous in reducing the number of parts and saving the assembling man-hour. Meanwhile, the groove 12 is directly formed on the first side surface of the substrate 10, the process is simple, the operability is strong, and as shown in fig. 8, the bottom surface of the power structure 30 is lower than the first side surface of the substrate 10, so that the total height of the power structure 30 and the substrate 10 after assembly can be shortened, and the volume of the power unit 100 can be reduced.

In some optional embodiments, the power unit 100 may further include: the heat insulation structure 60' is disposed on the first side of the substrate 10 in a manner of surrounding the power structure 30. The heat insulation structure 60 'is located between the power structure 30 and the substrate 10, and the heat insulation structure 60' can separate the power structure 30 from the substrate 10, so as to prevent the heat of the power structure 30 from affecting the components below the substrate 10, and at the same time, prevent the heat below the substrate 10 from being upwardly transferred to the power structure 30.

In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims (24)

1. A fixture for a power structure, comprising:

a substrate;

a plurality of preform structures, the preform structures comprising: the pressing arm is connected with the pressing body in parallel in the first direction of the substrate, and a power structure mounting space is formed between the pressing arm and the substrate; and

a retaining structure configured to retain the sheeting structure on the first side of the substrate.

2. The fixture for power structures of claim 1, wherein a plurality of the wafer structures are connected to each other in a second direction of the substrate, the first direction and the second direction being perpendicular to each other.

3. A fixture for a power structure according to claim 1 or 2, characterized in that the holding structure comprises: a first retaining structure extending from the base plate toward the wafer body and through the wafer structure, the wafer structure being retained on the first side of the base plate by the first retaining structure.

4. The fixture for a power structure according to claim 3, wherein the holding structure further comprises: a second retaining structure that retains the wafer structure on the first side of the substrate by mating with the first retaining structure.

5. The fixture for a power structure according to claim 4, wherein the first retaining structure is configured as a cylindrical structure and the second retaining structure is configured as an annular structure that fits over the cylindrical structure.

6. The fixture for a power structure of claim 5, wherein the first retaining structure is perpendicular to the base plate and has a free end distal from the base plate, and the second retaining structure is rotatably nested with the first retaining structure from a side of the wafer structure that faces away from the base plate.

7. The fixture for a power structure according to claim 5, wherein the first retaining structure is configured as a threaded rod having an external thread and the second retaining structure is configured as a nut having an internal thread.

8. The fixture for a power structure according to claim 4, wherein the second retaining structure presses against a side of the wafer structure facing away from the base plate.

9. The fixture for a power structure according to claim 4, wherein the pressing plate body is formed as a recessed groove structure recessed toward the base plate, and the opening of the pressing plate body faces away from the base plate.

10. The fixture for a power structure of claim 9, wherein at least a portion of the second retaining structure is located within a recessed pocket of the wafer body, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

11. The fixture for a power structure according to claim 3, wherein the holding structure further comprises: a third retaining structure disposed at a free end of the first retaining structure distal from the base plate, the third retaining structure configured as a snap adapted to snap-fit the wafer structure.

12. The fixture for a power structure of claim 11, wherein the cross section of the clip is tapered and has a small diameter end and a large diameter end, the clip forms a guiding tapered surface adapted to guide through the blade structure from the small diameter end to the large diameter end, and the large diameter end forms an engaging surface adapted to engage the blade structure.

13. The fixture for a power structure according to claim 12, wherein the large diameter end is located on a side of the small diameter end adjacent to the base plate, and the small diameter end is adapted to be fixed with the first retaining structure, and the large diameter end is adapted to be separated from the first retaining structure.

14. The fixture for a power structure of claim 11, wherein the wafer body is formed as a recessed channel structure recessed toward the base plate, the opening of the wafer body facing away from the base plate.

15. The fixture for a power structure of claim 14, wherein at least a portion of the third retaining structure is located within a recessed pocket of the wafer body, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

16. A fixture for a power structure according to claim 1 or 2, characterized in that the holding structure comprises: and the fourth holding structure is pressed against the pressing sheet bodies and is fixed with the substrate.

17. The fixture for a power structure of claim 16, wherein the fourth holding structure spans a plurality of the wafer bodies and longitudinal ends of the fourth holding structure respectively exceed two outermost ones of the plurality of wafer structures and the excess portion is fixed to the base plate.

18. The fixture for a power structure according to claim 17, wherein the protruding portion is fixed to the base plate by screwing or clipping.

19. The fixture for a power structure of claim 16, wherein the fourth retaining structure is configured as a press bar, a face of the press bar facing the press plate body being a pressing plane.

20. The fixture for a power structure of claim 16, wherein the wafer body is formed as a recessed channel structure recessed toward the base plate, the opening of the wafer body facing away from the base plate.

21. The fixture for a power structure of claim 20, wherein at least a portion of the fourth retaining structure is located within a recessed pocket of the wafer body.

22. The fixture for a power structure according to claim 1 or 2, wherein the pressure plate arm comprises: the first pressing arm and the second pressing arm are symmetrically connected to two sides of the pressing body.

23. The fixture for a power structure of claim 22, wherein the wafer structure is configured as a gull wing, and the free ends of the first and second wafer arms each have a bend section that bends toward the base plate.

24. The fixing device for a power structure according to claim 1 or 2, wherein the wafer bodies of two adjacent wafer structures are connected to each other by a wafer connecting part.

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