CN113497015A - Power module - Google Patents

Abstract

The invention discloses a power module. The power module includes: a substrate, a first side of the substrate has a first side surface; a tablet structure, the tablet structure is located on the first side of the substrate; a plurality of stacked busbars; a power structure, The power structure is pressed against the first side surface by the pressing sheet structure, and the power structure has a plurality of pins, and the pins are connected with the corresponding busbars and with the other busbars. Row electrical insulation. According to the power module of the present invention, the power structure is pressed against the substrate by the pressing sheet structure, and the pins of the power structure are connected to the corresponding busbars and are electrically insulated from other busbars, and the entire power module has a compact structure and a high degree of integration. .

Description

Power module

Technical Field

The invention relates to the technical field of frequency converters, in particular to a power module.

Background

In the existing frequency converter, the power structure needs to be installed on the substrate and is suitable for being connected with the driving circuit board and the multilayer busbar, but the power structure is installed on the substrate insecurely and is easy to fall off from the substrate, so that a fixing structure is added in some schemes and is fixed on the substrate. However, in the prior art, after the power structure is connected with the driving circuit board and the multilayer busbar through the fixing structure, a long pin is needed to pass through the busbar and the driving circuit board, so that the size of the whole device is large. And when the power structure is installed on the substrate by using the fixing structure in the existing product, the process is complex and the installation efficiency is low.

The pins of the power structure penetrate through the multilayer positive and negative busbars simultaneously, the pins are connected with the multilayer busbars simultaneously, short circuits are easily generated between adjacent busbars, and the normal use of the frequency converter is influenced. In the conventional frequency converter power unit assembly, the pins of the power structure pass through the multi-layer bus simultaneously through the via holes, so that the conventional welding process (such as wave soldering and the like) cannot be used, because the via holes are arranged in the metal busbar, the heat dissipation area is large, and when the conventional welding process is used, the welding spot is hard to reach the temperature required by welding because the heat is rapidly lost due to the large area of the busbar. Therefore, only a spot welding technique such as electron beam welding laser welding can be used to concentrate the welding energy in a small range to achieve the purpose of welding, and the process is very complicated.

Disclosure of Invention

The present invention is directed to solving, at least to some extent, one of the above-mentioned problems in the prior art. Therefore, the invention provides a power module which is compact in structure.

A power module according to an embodiment of the present invention includes: a substrate, a first side of the substrate having a first side; a tab structure located on the first side of the substrate; a plurality of bus bars arranged in a stacked manner; the power structure is pressed against the first side face by the pressing sheet structure and is provided with a plurality of pins, and the pins are connected with the corresponding busbar and are electrically insulated from other busbars.

According to the power module provided by the embodiment of the invention, the power structure is pressed against the substrate by the pressing sheet structure, and the pins of the power structure are connected with the corresponding bus bar and are electrically insulated from other bus bars, so that the whole power module is compact in structure and high in integration level.

According to some embodiments of the invention, the power module further comprises a retaining structure configured to retain the tab structure on the first side of the base plate.

Further, the holding structure includes: a first retaining structure extending from the substrate in a direction away from the first side and through the wafer structure, the wafer structure being retained on the first side of the substrate by the first retaining structure.

According to some embodiments of the invention, the power module further comprises: a second retaining structure that retains the wafer structure on the first side of the substrate by mating with the first retaining structure.

Further, the second retaining structure is connected to the first retaining structure on a side of the wafer structure facing away from the substrate.

Optionally, the first retaining structure is configured as a columnar structure, and the second retaining structure is configured as an annular structure that is sleeved on the columnar structure.

Specifically, the first holding structure is perpendicular to the first side surface and has a free end far away from the substrate, and the second holding structure is rotatably sleeved on the first holding structure from the side of the tabletting structure far away from the substrate.

According to some embodiments of the invention, the first retaining structure is configured as a threaded rod having an external thread and the second retaining structure is configured as a nut having an internal thread.

According to some embodiments of the invention, the preform structure comprises: the pressing sheet body is formed into a concave groove body structure which is concave towards the first side face, and the opening of the pressing sheet body deviates from the first side face.

According to some embodiments of the invention, at least a portion of the second retaining structure is located within the recessed pocket of the wafer body, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed pocket.

Specifically, the second retaining structure presses against the wafer body bottom wall of the wafer body.

Furthermore, the first holding structure penetrates through the bottom wall of the pressing sheet body, and a pressing sheet body positioning hole matched with the first holding structure is formed in the bottom wall of the pressing sheet body.

According to some embodiments of the invention, the preform structure comprises: the first holding structure penetrates through the pressing sheet body, and the pressing sheet arm is connected with the pressing sheet body and used for pressing the power structure.

Specifically, the power structure includes: a first power structure and a second power structure, the first and second power structures spaced apart; the tablet arm includes: the first pressing plate arm is used for pressing the first power structure, the second pressing plate arm is used for pressing the second power structure, and the pressing plate body is located between the first power structure and the second power structure.

Further, the first power structure has a first connection foot, the second power structure has a second connection foot, the first connection foot and the second connection foot are respectively located on opposite outer sides of the first power structure and the second power structure, and the wafer body is located between opposite inner sides of the first power structure and the second power structure.

Optionally, an included angle between the extending direction of the first connecting foot portion from the first power structure and the extending direction of the second connecting foot portion from the second power structure is 180 degrees.

According to some embodiments of the present invention, the first power structure and the second power structure are spaced apart in a first direction of the substrate, the first power structure is plural and arranged on the substrate in a second direction of the substrate, the second power structure is plural and arranged on the substrate along the second direction, and the pad structure is plural and arranged along the second direction, wherein the first direction and the second direction are perpendicular to each other.

Further, the plurality of first power structures, the plurality of pad structures, and the plurality of second power structures correspond to one another in the first direction.

According to some embodiments of the invention, a plurality of the wafer structures are connected as a single body by a wafer connecting portion.

Further, the tabletting connecting part is connected between the tabletting bodies of two adjacent tabletting structures.

According to some embodiments of the invention, the preform structure comprises: the first holding structure penetrates through the pressing sheet body, and the pressing sheet arm is connected with the pressing sheet body in parallel in the first direction of the substrate and is used for pressing the power structure; the pressing structure is a plurality of pressing structures, the pressing structures are connected with each other in a second direction of the substrate, and the first direction and the second direction are perpendicular to each other.

Further, the sheeting arm comprises: the first pressing arm and the second pressing arm are symmetrically connected to two sides of the pressing body; and the tabletting bodies of two adjacent tabletting structures are connected with each other through a tabletting connecting part.

Specifically, the tablet body is formed into a concave groove structure which is concave towards the first side surface, the opening of the tablet body is away from the first side surface, the first tablet arm and the second tablet arm are respectively connected to two ends of the opening of the tablet body, and the first tablet arm and the second tablet arm extend towards directions away from each other.

According to some embodiments of the invention, the power module further comprises: and the positioning part is used for positioning the power structure on the substrate.

According to some embodiments of the invention, the positioning part comprises a positioning sheet, and a through positioning hole is formed in the positioning sheet and matched with the power structure.

Optionally, the outer peripheral surface of the power structure and the positioning opening are both rectangular, the power structure is directly attached to the substrate, and the substrate is a metal substrate.

Optionally, an annular positioning rib surrounding the positioning opening is further arranged on the positioning sheet, and the annular positioning rib is matched with the outer peripheral surface of the power structure.

According to some embodiments of the invention, the spacer is an insulating spacer and is adhesively secured to the first side of the substrate.

According to some embodiments of the invention, the spacer is provided with a spacer through hole for mating with the first retaining structure and allowing the first retaining structure to pass through to form a locating fit.

According to some embodiments of the invention, the positioning portion comprises a groove formed on the first side of the substrate, the groove matching an outer circumferential surface of the power structure.

According to some embodiments of the invention, the power module further comprises: a thermal isolation structure disposed on the first side of the substrate in a manner surrounding the power structure.

According to some embodiments of the invention, the first side of the substrate is a side facing the busbar.

According to some embodiments of the invention, the wafer structure is configured as a gull wing type and comprises a wafer body and first and second wafer arms symmetrically connected on both sides of the wafer body, and free ends of the first and second wafer arms each have a bent section bent toward the base plate.

According to some embodiments of the present invention, at least one of the pins is connected to the bus bar passing through only one layer of the bus bar, and the at least one of the pins is staggered from and electrically insulated from other bus bar connecting portions.

Specifically, the busbar is provided with a busbar connecting portion, at least one pin of the power unit only penetrates through one layer of the busbar connecting portion and is connected with the busbar, and the busbar connecting portion is sheet-shaped.

Optionally, the busbar and the corresponding busbar connecting portion are on the same plane.

Optionally, the busbar and the corresponding busbar connection portion are formed by a blanking process.

According to some embodiments of the invention, the busbar connection portion protrudes from at least one side edge of the corresponding busbar and is directly connected to the corresponding busbar.

According to some embodiments of the invention, the busbar connecting portion is provided with a busbar connecting portion through hole allowing the pin to penetrate therethrough.

According to some embodiments of the invention, in two busbar connecting portions corresponding to two adjacent pins, a busbar connecting portion through hole on one busbar connecting portion is located outside the outline of the other busbar connecting portion.

According to some embodiments of the present invention, two of the pins in the same power structure are respectively connected to the busbar connection portions of two corresponding busbars, and each of the pins is only connected to the corresponding busbar connection portion in a penetrating manner.

Further, any one of the two pins is connected with the corresponding busbar connecting part and is adjacent to or spaced apart from the other busbar connecting part side by side.

Optionally, any one of the two pins is connected with the corresponding busbar connecting part, and the busbar connecting part through hole on one busbar connecting part is located outside the outline of the other busbar connecting part.

According to some embodiments of the present invention, the remaining one of the pins in the same power structure is adapted to be connected to a driving circuit board, and the remaining one of the pins is directly connected to the driving circuit board without being shielded by the busbar connection portion.

According to some embodiments of the invention, the same power structure has a first pin, a second pin and a third pin, the third pin is located between the first pin and the second pin, the third pin is located outside the first pin and the second pin relative to the power structure, and a gap between the first pin and the second pin allows one busbar connection portion to be inserted into and connected with the third pin in a penetrating manner.

Furthermore, the busbar connecting part penetrating through the first pins and the busbar connecting part penetrating through the third pins are partially stacked or staggered in the stacking direction of the busbars, and the second pins are suitable for being directly connected with a driving circuit board.

According to some embodiments of the invention, the busbar comprises: the bus bar comprises a first bus bar, a second bus bar and a third bus bar; the busbar connecting portion includes: the first busbar connecting portion, the second busbar connecting portion and the third busbar connecting portion are connected, wherein the first busbar connecting portion is connected with the first busbar, the second busbar connecting portion is connected with the second busbar, the third busbar connecting portion is connected with the third busbar, the first busbar connecting portion is located on one side of the first busbar, the second busbar connecting portion is located on the other side, opposite to the first busbar connecting portion, of the second busbar, and the third busbar connecting portion are located on two sides of the third busbar respectively.

Optionally, one of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.

Further, the power module further includes: and the bus bar clamp is used for clamping the first bus bar and the second bus bar.

According to some embodiments of the present invention, each of the first, second, and third bus bars is rectangular and stacked in a thickness direction of the bus bar, and the bus bar connection portions are formed on longitudinal long sides corresponding to the bus bars.

Specifically, the power structure includes: the pin of the first power structure and the pin of the second power structure are respectively positioned at the relative outer sides of the first power structure and the second power structure, the pin of the first power structure is positioned on the first busbar connecting part and the third busbar connecting part positioned at the first side of the busbar, the third busbar connecting part is positioned at the first side, and the pin of the second power structure is positioned on the second busbar connecting part and the third busbar connecting part positioned at the second side of the busbar.

According to some embodiments of the present invention, a first busbar transferring end plate is disposed at one end of the first busbar, a second busbar transferring end plate is disposed at one end of the second busbar, the first busbar transferring end plate and the second busbar transferring end plate are disposed at the same end and are arranged side by side, and a third busbar transferring end plate is disposed at the other end of the third busbar opposite to the first busbar transferring end plate.

Optionally, the first busbar, the second busbar and the third busbar are all flat busbars.

According to some embodiments of the invention, the busbar connecting portion is provided with a through groove allowing the pin to penetrate through, and the through groove extends in a direction away from the busbar and penetrates through an outer edge of the busbar connecting portion away from the busbar.

According to some embodiments of the invention, the preform structure is a plurality of preform structures, the preform structure comprising: a pressing body and a pressing arm connected side by side with the pressing body in a first direction of the substrate, forming a power structure mounting space therebetween, and a plurality of the pressing structures connected to each other in a second direction of the substrate, the first direction and the second direction being perpendicular to each other; the retaining structure is configured to retain a plurality of the sheeting structures on the first side of the base sheet.

According to some embodiments of the invention, the retaining structure comprises: a first retaining structure extending from the base plate toward the wafer body and through the wafer structure, the wafer structure being retained on the first side of the base plate by the first retaining structure.

Further, the holding structure further includes: a third retaining structure disposed at a free end of the first retaining structure distal from the base plate, the third retaining structure configured as a snap adapted to snap-fit the wafer structure.

Specifically, the cross section of the buckle is gradually changed and is provided with a small-diameter end and a large-diameter end, a guide conical surface suitable for guiding the tabletting structure to penetrate through is formed from the small-diameter end to the large-diameter end of the buckle, and the large-diameter end is formed into a clamping and abutting surface suitable for clamping and abutting the tabletting structure.

Further, the large diameter end is located on one side of the small diameter end close to the substrate, the small diameter end is suitable for being fixed with the first retaining structure, and the large diameter end is suitable for being separated from the first retaining structure.

According to some embodiments of the invention, the wafer body is formed as a recessed channel structure that is recessed toward the base plate, the opening of the wafer body facing away from the base plate, and at least a portion of the third retaining structure is located within the recessed channel of the wafer body.

Further, the third retaining structure is located entirely within the recessed channel, and an end face of the first retaining structure distal from the free end of the base plate is also located within the recessed channel.

According to some embodiments of the invention, the retaining structure comprises: and the fourth holding structure is pressed against the pressing sheet bodies and is fixed with the substrate.

Further, the fourth holding structure spans over the plurality of pressing sheet bodies, and two longitudinal ends of the fourth holding structure respectively exceed two outermost sides of the plurality of pressing sheet structures, and the exceeding parts of the fourth holding structure are fixed with the substrate.

Optionally, the protruding portion and the substrate are fixed by screwing or clamping.

Specifically, the fourth holding structure is configured as a pressing rod, and a surface of the pressing rod facing the tablet main body is a pressing plane.

According to some embodiments of the invention, the wafer body is formed as a recessed channel structure that is recessed toward the base plate, the opening of the wafer body facing away from the base plate, and at least a portion of the fourth retaining structure is located within the recessed channel of the wafer body.

According to some embodiments of the invention, the busbar comprises: the bus bar comprises a bus bar body and a bus bar connecting part, wherein the bus bar connecting part protrudes to correspond to at least one side edge of the bus bar, the bus bar connecting part corresponds to the bus bar and is directly connected with the bus bar, an insulating film is coated on the outer surface of the bus bar connecting part, and the adjacent two bus bar bodies of the bus bars are separated from each other.

According to some embodiments of the invention, the busbar comprises: the bus bar comprises a bus bar body, and an insulating film is integrally coated on the outer surface of the bus bar body.

Further, the busbar further comprises: the busbar connecting part protrudes to correspond to at least one side edge of the busbar body, the busbar connecting part is directly connected with the corresponding busbar body, and the busbar body and the outer surface of the busbar connecting part are integrally coated with insulating films.

According to some embodiments of the invention, the busbar bodies of two adjacent busbars are at least partially stacked.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a perspective assembly view of a power unit with the retention structure including a second retention structure;

FIG. 2 is an assembled side view of the power cell with the retention structure including a second retention structure;

FIG. 3 is an exploded perspective view of the power cell when the retaining structure includes a second retaining structure;

FIG. 4 is an exploded side view of the power cell when the retaining structure includes a second retaining structure;

FIG. 5 is a schematic perspective view of the power unit when the substrate is provided with ribs and the retaining structure includes a second retaining structure;

FIG. 6 is an exploded view of the power cell with a recess in the substrate and the retaining structure including a second retaining structure;

FIG. 7 is a schematic perspective view of the power cell assembly with a recess disposed in the substrate and the retaining structure including a second retaining structure;

FIG. 8 is an assembled side view of the power cell with a recess disposed in the substrate and the retention structure including a second retention structure;

FIG. 9 is a perspective view of a wafer configuration;

FIG. 10 is a perspective assembly view of the power unit with the retention structure including a third retention structure;

FIG. 11 is an assembled side view of the power unit with the retention structure including a third retention structure;

FIG. 12 is a perspective assembly view of a power unit having splines when the retention structure includes a fourth retention structure;

FIG. 13 is an assembled side view of a power cell having a spacer when the retention structure includes a fourth retention structure;

FIG. 14 is a perspective assembly view of a power unit without a spacer when the retention structure includes a fourth retention structure;

FIG. 15 is an assembled side view of the power cell without the splines when the retaining structure includes the fourth retaining structure;

FIG. 16 is an exploded isometric view of the power cell assembly;

FIG. 17 is a perspective assembled schematic view of the power cell assembly;

FIG. 18 is an assembled side view of the power cell assembly;

FIG. 19 is a schematic diagram of the connection of the power structure to the tri-layer bus bar;

fig. 20 is a schematic perspective exploded view of the power unit, the second busbar and the third busbar;

fig. 21 is a schematic perspective assembly view of the power unit and the second and third bus bars;

fig. 22 is a schematic perspective exploded view of the power unit and the third busbar;

fig. 23 is a schematic perspective assembly view of the power unit and the third busbar;

fig. 24 is an exploded perspective view of the power unit assembly and the driving circuit board;

fig. 25 is a perspective view of the power unit assembly and the driving circuit board;

fig. 26 is an assembled side view of the power unit assembly and the drive circuit board.

Reference numerals:

power module 10000, power unit assembly 1000, power unit 100, substrate 10, convex strip 11, groove 12, tablet structure 20, tablet body 21, tablet body positioning hole 211, tablet arm 22, first tablet arm 221, second tablet arm 222, tablet connecting portion 23, bending section 24, power structure 30, first power structure 31, first connecting leg 311, second power structure 32, second connecting leg 321, first pin 331, second pin 332, third pin 333, retaining structure 45, first retaining structure 40, second retaining structure 50, positioning sheet 60, positioning opening 61, annular positioning rib 62, positioning sheet through hole 63, heat insulation structure 60', third retaining structure 70, small diameter end 71, large diameter end 72, fourth retaining structure 80, fastening piece 81, first busbar 201, first busbar connecting portion 2011, first busbar adapter end plate 2012, first busbar body 2013, and second busbar body, The first busbar connecting portion through hole 2014, the second busbar 202, the second busbar connecting portion 2021, the second busbar adapter end plate 2022, the second busbar body 2023, the second busbar connecting portion through hole 2024, the third busbar 203, the first busbar connecting portion 2031, the third busbar adapter end plate 2032, the third busbar body 2033, the third busbar connecting portion through hole 2034, and the driving circuit board 2000.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The power module 10000 according to an embodiment of the present invention is described in detail below with reference to fig. 1 to 26.

Referring to fig. 1 to 8 and 16 to 26, a power module 10000 according to an embodiment of the present invention may include: power cell assembly 1000 and driver circuit board 2000, optionally, driver circuit board 2000 is located above power cell assembly 1000.

Wherein, the power unit assembly 1000 may include: power unit 100, a plurality of female arranging that set up in layers, power unit 100 can include: a substrate 10, a wafer structure 20, and a power structure 30, wherein a first side (i.e. the upper side in fig. 2) of the substrate 10 has a first side surface, the wafer structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the wafer structure 20.

By pressing the power structure 30 against the first side of the substrate 10 by the pressing structure 20, the power structure 30 can be firmly and reliably mounted on the substrate 10.

The power structure 30 has a plurality of pins, and the pins are connected to the corresponding bus bars and electrically insulated from the other bus bars, so that the pins and the other bus bars can be ensured to have good insulation performance. The pins and the corresponding busbars can be connected through punching or can be directly connected.

According to the power module 10000 of the embodiment of the invention, the power structure 30 is pressed against the substrate 10 by the pressing sheet structure 20, and the pins of the power structure 30 are connected with the corresponding bus bar and are electrically insulated from other bus bars, so that the whole power module 10000 has a compact structure and high integration level.

Referring to fig. 1 to 15, the power unit 100 further includes: a retaining structure 45, the retaining structure 45 being arranged to retain the wafer structure 20 on the first side of the substrate 10.

Referring to fig. 1-9, the retaining structure 45 includes: the first holding structure 40, the first holding structure 40 extends from the substrate 10 to a direction away from the first side surface, and the first holding structure 40 penetrates through the wafer structure 20, the wafer structure 20 is held on the first side of the substrate 10 by the first holding structure 40, and the power structure 30 is held on the first side of the substrate 10 by the wafer structure 20 pressing against the power structure 30. In other words, referring to fig. 2 and 8, the first holding structure 40 penetrates the wafer structure 20 from bottom to top, and the wafer structure 20 is held on the first side of the substrate 10 by the first holding structure 40, that is, when the first holding structure 40 penetrates the wafer structure 20, the relative position between the wafer structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role in positioning the wafer structure 20.

In some embodiments, not shown, the wafer structure 20 may also be directly attached, e.g., soldered, to the substrate 10, while the retaining structure 45 is eliminated, thereby advantageously reducing the number of connecting components and thus the weight of the power unit 100.

Further, referring to fig. 1-8, the retaining structure 45 further comprises: a second retaining structure 50, the second retaining structure 50 being adapted to engage the first retaining structure 40 to retain the wafer structure 20 on the first side of the substrate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the wafer structure 20 facing away from the substrate 10. As shown in fig. 2, the second holding structure 50 is connected to the first holding structure 40 at the upper side of the tablet structure 20, and the upper side of the tablet structure 20 is open to leave an operation space for mounting and dismounting the second holding structure 50. The wafer structure 20 is clamped between the second holding structure 50 and the substrate 10, while the power structure 30 is clamped between the wafer structure 20 and the substrate 10.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Further, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the embodiment shown in fig. 1-8, the first retaining structure 40 is configured as a cylindrical structure, the second retaining structure 50 is configured as a ring structure that is sleeved on the cylindrical structure, and the wafer structure 20 is clamped between the second retaining structure 50 and the substrate 10 to prevent the wafer structure 20 from being separated from the substrate 10.

Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10, and the first retaining structure 40 has a free end away from the substrate 10, and the second retaining structure 50 is rotatably sleeved on the first retaining structure 40 from the side of the tabletting structure 20 away from the substrate 10, thereby facilitating quick connection or disconnection between the second retaining structure 50 and the first retaining structure 40.

In some alternative embodiments, the first retaining structure 40 is configured as a threaded rod having external threads, and the second retaining structure 50 is configured as a nut having internal threads, the nut being threadably engaged with the threaded rod to facilitate installation and removal of the wafer structure 20.

Referring to fig. 1 to 8, the second holding structure 50 is pressed against a side of the tablet structure 20 away from the substrate 10, and the second holding structure 50 can apply a pressing force to the tablet structure 20 toward the substrate 10, so as to prevent the tablet structure 20 from shaking, and thus, the connection between the tablet structure 20 and the substrate 10 is more reliable.

Referring to fig. 1 to 9, the tablet structure 20 includes: preforming body 21, preforming body 21 form towards the sunken groove body structure of first side, and the opening of preforming body 21 deviates from first side. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the second holding structure 50 is located in the recessed groove of the tablet body 21, and an end surface of the first holding structure 40 away from the free end of the substrate 10 (i.e., an upper end surface of the first holding structure 40) is also located in the recessed groove, so that a distance between the end surface of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, and a distance between the second holding structure 50 and the substrate 10 can be shortened, so that the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for reserving an installation space for other components, and preventing mutual interference during installation.

In the embodiment shown in fig. 2, the second holding structure 50 is entirely located in the concave groove, and the upper end surface of the first holding structure 40 is also located in the concave groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 2, the overlapping dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, and further reducing the distance between the second holding structure 50 and the substrate 10.

Referring to fig. 1-3, 5, and 7-9, the second holding structure 50 is pressed against the bottom wall of the tablet body 21, the first holding structure 40 penetrates the bottom wall of the tablet body, and a tablet body positioning hole 211 adapted to the first holding structure 40 is formed on the bottom wall of the tablet body, after the first holding structure 40 penetrates the tablet body positioning hole 211 on the bottom wall of the tablet body, the tablet structure 20 can be preliminarily positioned, so that the second holding structure 50 can be used to fix the tablet structure 20 subsequently.

Referring to fig. 9, the tablet structure 20 includes: a tablet body 21 and a tablet arm 22, wherein the tablet arm 22 is connected to the tablet body 21, and as shown in fig. 1-2 and 5, the tablet arm 22 is used for pressing against the power structure 30, and the power structure 30 is clamped between the tablet structure 20 and the substrate 10.

Referring to fig. 1-8, the power structure 30 may include: a first power structure 31 and a second power structure 32, the first power structure 31 and the second power structure 32 being spaced apart. The presser arm 22 includes: a first pressing arm 221 and a second pressing arm 222, wherein the first pressing arm 221 is used for pressing against the first power structure 31, the second pressing arm 222 is used for pressing against the second power structure 32, the pressing body 21 is located between the first power structure 31 and the second power structure 32, and the retaining structure 45 is also located between the first power structure 31 and the second power structure 32.

Further, the first power structure 31 has a first connection leg 311, the second power structure 32 has a second connection leg 321, the first connection leg 311 and the second connection leg 321 are respectively located at opposite outer sides of the first power structure 31 and the second power structure 32, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.

Alternatively, the angle between the extending direction of the first connecting leg portion 311 from the first power structure 31 and the extending direction of the second connecting leg portion 321 from the second power structure 32 is 180 degrees. That is to say, the pins of the first connecting leg portion 311 and the second connecting leg portion 321 are disposed outward, so as to leave a middle space between the first power structure 31 and the second power structure 32, and facilitate the holding structure 45 to fix the wafer structure 20 on the substrate 10 from the middle space.

The pins of the first and second connection leg portions 311 and 321 each include: the first pin 331, the second pin 332, and the third pin 333, each of which is adapted to be electrically connected to the driving circuit board 2000 or a corresponding bus bar.

Referring to fig. 2 and 4, the extending direction of the first connecting leg 311 from the first power structure 31 is leftward, the extending direction of the second connecting leg 321 from the second power structure 32 is rightward, and an included angle therebetween is 180 degrees, so that it is avoided that the first connecting leg 311 and the second connecting leg 321 are closer to each other when the first connecting leg 311 and the second connecting leg 321 face each other, and the first power structure 31 and the second power structure 32 are interfered with each other. Meanwhile, when the first power structure 31 and the second power structure 32 are connected to the corresponding bus bar or the driving circuit board 2000, the first connecting leg 311 and the second connecting leg 321 both face outward, so that the space is sufficient, and the corresponding operation is convenient.

Referring to fig. 1, 3, 5-7, the first power structures 31 and the second power structures 32 are spaced apart, e.g., arranged oppositely, in a first direction of the substrate 10, the first power structures 31 are plural, the plurality of first power structures 31 are arranged on the substrate 10 in a second direction of the substrate 10, the plurality of second power structures 32 are plural, the plurality of second power structures 32 are arranged on the substrate 10 in the second direction, the plurality of wafer structures 20 are plural, and the plurality of wafer structures 20 are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.

Further, the plurality of first power structures 31, the plurality of pad structures 20, and the plurality of second power structures 32 correspond one-to-one in the first direction. A pair of first power structures 31 and second power structures 32, which are oppositely disposed, can be pressed against the substrate 10 by the same wafer structure 20.

In some embodiments, not shown, the plurality of sheeting structures 20 may be separate entities.

In the embodiment shown in fig. 1, 3, and 9, the plurality of wafer structures 20 are connected into a whole through the wafer connecting portion 23, so that the assembly process of the plurality of wafer structures 20 is saved, which is beneficial to improving the assembly efficiency of the power unit 100. Meanwhile, the tabletting structures 20 connected into a whole can simultaneously press a plurality of power structures 30, and the pressing efficiency is high. The integrated wafer structure 20 is pressed against the base plate 10 by two or more retaining structures 45.

Further, the tablet connecting portion 23 is connected between the tablet bodies 21 of two adjacent tablet structures 20, and the width of the tablet connecting portion 23 may be equal to the width of the tablet body 21.

In the embodiment shown in fig. 1, 3, 9, the wafer structure 20 comprises: the first holding structure 40 penetrates through the pressing body 21, the pressing arm 22 is connected with the pressing body 21 in parallel in the first direction of the substrate 10, and the pressing arm 22 is used for pressing against the power structure 30; the tablet structures 20 are plural, and the plurality of tablet structures 20 are connected to each other in a second direction of the substrate 10, the first direction and the second direction being perpendicular to each other.

Further, the arm 22 may include: the first pressing arm 221 and the second pressing arm 222 are symmetrically connected to two sides of the pressing body 21; the tablet bodies 21 of two adjacent tablet structures 20 are connected to each other by a tablet connecting portion 23.

Referring to fig. 2, 4 and 9, the tablet body 21 is formed in a concave groove structure that is concave toward the first side surface, the opening of the tablet body 21 faces away from the first side surface, the first and second tablet arms 221 and 222 are respectively connected to both ends of the opening of the tablet body 21, and the first and second tablet arms 221 and 222 extend in directions away from each other. Referring to fig. 2 and 4, the tablet body 21 is formed into a recessed groove structure recessed downward, the opening of the tablet body 21 faces upward, the first tablet arm 221 extends leftward, and the second tablet arm 222 extends rightward.

In some optional embodiments, the power unit 100 of the power module 10000 may further include: the positioning part is used for positioning the power structure 30 on the substrate 10, thereby ensuring the accurate position of the power structure 30 on the substrate 10 and preventing the power structure 30 from shaking arbitrarily on the substrate 10.

In the embodiment shown in fig. 1-4 and 10-13, the positioning portion includes a positioning plate 60, a through positioning hole 61 is formed on the positioning plate 60, and the positioning hole 61 is matched with the power structure 30. For example, the outer peripheral surface of the power structure 30 and the positioning opening 61 are rectangular, the power structure 30 is positioned in the positioning opening 61, the bottom of the power structure 30 is directly attached to the substrate 10, the substrate 10 may be a metal substrate 10, the heat of the power structure 30 may be transferred to the substrate 10, and a cooling device or a heating device may be disposed below the substrate 10 to cool or heat the power structure 30.

Optionally, as shown in fig. 3-4, the positioning plate 60 is further provided with an annular positioning rib 62 surrounding the positioning hole 61, and the annular positioning rib 62 is matched with the outer peripheral surface of the power structure 30. The annular positioning rib 62 protrudes out of the surface of the positioning plate 60, so that the positioning firmness of the power structure 30 can be increased, and the positioning effect is good.

In the embodiment shown in fig. 1-4, the positioning sheet 60 is an insulating positioning sheet, and the positioning sheet 60 is adhesively fixed to the first side of the substrate 10.

Referring to fig. 1 and 3, the splines 60 are provided with splines through holes 63 for mating with the first retaining structures 40 and allowing the first retaining structures 40 to pass through to form a locating fit, and after the first retaining structures 40 pass through the splines through holes 63, the splines 60 may be initially located. The first holding structure 40 is connected to the second holding structure 50 after passing through the positioning piece through hole 63 of the positioning piece 60 and the pressing piece positioning hole 211 of the pressing piece body 21, thereby fixing the positioning piece 60 and the pressing piece structure 20 between the second holding structure 50 and the substrate 10.

In the embodiment shown in fig. 5, the positioning portion includes the convex strip 11 provided on the first side surface of the base plate 10, thereby saving the positioning piece 60, contributing to a reduction in the number of parts, and contributing to a reduction in assembly man-hours.

Alternatively, the rib 11 is a continuous annular rib 11, and the annular rib 11 is matched with the outer peripheral surface of the power structure 30.

Alternatively, the protruding strip 11 corresponding to each power structure 30 is divided into four sections, and the four sections are respectively located on four sides of the rectangular power structure 30, so that the power structure 30 is limited in all directions, and the power structure 30 is better positioned on the substrate 10.

In the embodiment shown in fig. 6-8, the positioning portion comprises a groove 12 formed on the first side of the substrate 10, the peripheral wall of the groove 12 is adapted to match the outer peripheral surface of the power structure 30, preferably, the groove 12 is a blind groove, and as shown in fig. 8, the bottom wall of the groove 12 is adapted to fit the bottom surface of the power structure 30 to support the power structure 30. This embodiment also saves the spacer 60, which is advantageous in reducing the number of parts and saving the assembling man-hour. Meanwhile, the groove 12 is directly formed on the first side surface of the substrate 10, the process is simple, the operability is strong, and as shown in fig. 8, the bottom surface of the power structure 30 is lower than the first side surface of the substrate 10, so that the total height of the power structure 30 and the substrate 10 after assembly can be shortened, and the volume of the power unit 100 can be reduced.

In some optional embodiments, the power unit 100 may further include: the heat insulation structure 60' is disposed on the first side of the substrate 10 in a manner of surrounding the power structure 30. The heat insulation structure 60 'is located between the power structure 30 and the substrate 10, and the heat insulation structure 60' can separate the power structure 30 from the substrate 10, so as to prevent the heat of the power structure 30 from affecting the components below the substrate 10, and at the same time, prevent the heat below the substrate 10 from being upwardly transferred to the power structure 30.

In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.

Referring to fig. 2, 4 and 9, the wafer structure 20 is configured as a gull wing type, and the wafer structure 20 may include a wafer body 21, a first wafer arm 221 and a second wafer arm 222, the first wafer arm 221 and the second wafer arm 222 are symmetrically connected to both sides of the wafer body 21, and free ends of the first wafer arm 221 and the second wafer arm 222 are provided with a bent section 24 bent toward the substrate 10. The bending section 24 is adapted to press against the power structure 30, so that the power structure 30 is pressed against the substrate 10.

A larger planar space is formed above the wafer structure 20, so as to leave an installation space for other components (for example, the busbar), and the dimensions of the power unit 100 and the busbar assembly in the height direction can be significantly reduced.

Referring to fig. 10 to 15, the tablet structure 20 is provided in plurality, and the tablet structure 20 includes: a tablet body 21 and a tablet arm 22, the tablet arm 22 being connected side by side with the tablet body 21 in a first direction of the substrate 10, the tablet arm 22 and the substrate 10 forming a power structure installation space therebetween, the power structure 30 being adapted to be installed in the power structure installation space, and the plurality of tablet structures 20 being connected to each other in a second direction of the substrate 10, the first direction and the second direction being perpendicular to each other; the retaining structure 45 is configured to retain a plurality of sheeting structures 20 on a first side of the base sheet 10.

In some embodiments, as shown with reference to fig. 10-11, the retaining structure 45 may include: the first holding structure 40 extends from the base plate 10 to the tablet body 21 and penetrates through the tablet structure 20, and the tablet structure 20 is held on the first side of the base plate 10 by the first holding structure 40. The third holding structure 70 is disposed at a free end of the first holding structure 40 away from the substrate 10, as shown in fig. 11, the first holding structure 40 is disposed on the substrate 10, and the third holding structure 70 is disposed at an upper end of the first holding structure 40. The third holding structure 70 can be constructed as a buckle suitable for clamping the tablet structure 20, and the buckle fixes the tablet structure 20 to the substrate 10 in a clamping manner, so that the tablet structure 20 can be mounted and dismounted more quickly and conveniently, and the operation time can be saved.

Specifically, the cross section of the buckle gradually changes and has a small diameter end 71 and a large diameter end 72, as shown in fig. 11, the upper end of the buckle is the small diameter end 71, the lower end is the large diameter end 72, the buckle forms a guiding conical surface suitable for guiding the pressing sheet structure 20 to penetrate from the small diameter end 71 to the large diameter end 72, the pressing sheet structure 20 is provided with a buckle hole suitable for the buckle to penetrate, the outer diameter of the small diameter end 71 is smaller than the diameter of the buckle hole, in a free state, the outer diameter of the large diameter end 72 is larger than the diameter of the buckle hole, and the large diameter end 72 is formed into a clamping surface suitable for clamping the pressing sheet structure 20.

Further, the large diameter end 72 is located on one side of the small diameter end 71 close to the substrate 10, the small diameter end 71 is suitable for being fixed to the first retaining structure 40, and the large diameter end 72 is suitable for being separated from the first retaining structure 40, so that the large diameter end 72 can elastically deform to be close to or far away from the first retaining structure 40 in the circumferential direction, when the tablet structure 20 crosses the buckle from top to bottom, the small diameter end 71 firstly extends out of the buckle hole, and the large diameter end 72 gathers towards the first retaining structure 40 under the limiting effect of the hole wall of the buckle hole, so that the large diameter end 72 can smoothly cross the buckle hole to reach above the tablet structure 20, and the abutting surface of the large diameter end 72 abuts against the upper surface of the tablet structure 20, that is, the tablet structure 20 is clamped between the third retaining structure 70 and the substrate 10.

The pressing body 21 is formed into a recessed groove structure recessed toward the base plate 10, and the opening of the pressing body 21 is away from the base plate 10. Referring to fig. 11, the tablet body 21 is formed in a recess groove structure recessed downward, and an opening of the tablet body 21 faces upward.

At least a part of the third holding structure 70 is located in the recessed groove of the tablet body 21, and the end surface of the first holding structure 40 away from the free end of the substrate 10 (i.e., the upper end surface of the first holding structure 40) is also located in the recessed groove, so that the distance between the end surface of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, and the distance between the third holding structure 70 and the substrate 10 can be shortened, so that the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for reserving an installation space for other components and preventing mutual interference during installation.

In the embodiment shown in fig. 11, the third holding structure 70 is entirely located in the concave groove, and the upper end face of the first holding structure 40 is also located in the concave groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 11, the overlapping dimension of the third holding structure 70 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the third holding structure 70, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, and further reducing the distance between the third holding structure 70 and the substrate 10.

After the third retaining structure 70 and the first retaining structure 40 penetrate through the bottom wall of the tablet body, the third retaining structure 70 is pressed against the bottom wall of the tablet body 21, so that the positioning and fixing of the tablet structure 20 can be realized.

In some embodiments, as shown with reference to fig. 12-15, the retention structure 45 may include: a fourth holding structure 80, wherein the fourth holding structure 80 is pressed against the plurality of tablet bodies 21, and the fourth holding structure 80 is fixed with the substrate 10.

Specifically, referring to fig. 12 and 14, the fourth holding structure 80 spans the plurality of tablet bodies 21, and both longitudinal ends of the fourth holding structure 80 respectively exceed two outermost sides of the plurality of tablet structures 20 and the exceeding portions are fixed to the substrate 10, so that the fourth holding structure 80 can firmly hold the plurality of tablet bodies 21 on the first side of the substrate 10, and when the power structure 30 is installed in the power structure installation space, the tablet structures 20 apply a pressing force to the power structure 30 toward the substrate 10, thereby effectively preventing the power structure 30 from falling.

Further, the above-mentioned excess portion and the substrate 10 are fixed by screwing or clipping. Referring to fig. 11 to 15, the fastener 81 is fixed to the base plate 10 after being inserted into the protruding portion, thereby fixing the fourth holding structure 80. The fastener 81 may be a bolt. The fourth holding structure 80 can be mounted and dismounted by mounting or dismounting the fasteners 81 at the two ends, and the operation is quick and convenient.

Alternatively, the fourth holding structure 80 is configured as a pressing rod, and a surface of the pressing rod facing the tablet body 21 is a pressing plane. By varying the length of the fourth holding structure 80, a different number of power structures 30 can be compacted.

The pressing body 21 is formed into a recessed groove structure recessed toward the base plate 10, and the opening of the pressing body 21 is away from the base plate 10. Referring to fig. 13 and 15, the tablet body 21 is formed in a recessed groove structure recessed downward, and the opening of the tablet body 21 faces upward.

Further, at least a part of the fourth holding structure 80 is located in the recessed groove of the tablet body 21, so that the distance between the fourth holding structure 80 and the substrate 10 can be shortened, and thus, the holding structures 45 are located in the recessed groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, so as to leave an installation space for other parts and components, and prevent mutual interference during installation.

In the embodiment shown in fig. 13, the fourth retaining structure 80 is located entirely within the recessed channel.

Referring to fig. 16 to 26, the power structure 30 has a plurality of pins, such as a first pin 331, a second pin 332, and a third pin 333 of the first connection pin 311 and the second connection pin 321, at least one pin is connected to the bus bar passing through only one layer of bus bar, and the at least one pin is staggered from and electrically insulated from other bus bars. That is to say, the at least one pin does not need to pass through other busbars, and only needs to punch on the perforated busbar to enable the at least one pin to penetrate through the hole, so that the number of punched holes on other busbars is reduced, and the production process of the power unit assembly 1000 is simplified. Meanwhile, the at least one pin is staggered with other busbars, so that the good insulation performance between the at least one pin and the other busbars can be ensured.

The pin is connected with the busbar which is penetrated through in a manner of penetrating only one layer of busbar, and the pin is staggered with other busbars, so that the punching quantity of other busbars can be reduced, the production and manufacturing processes of the busbars are simplified, and the pin and other busbars are favorably ensured to have better electrical insulation performance.

In some optional embodiments, the busbar has a busbar connection portion, at least one pin of the power unit 100 is connected to the busbar in a manner of penetrating only one layer of the busbar connection portion, and the busbar connection portion is configured in a sheet shape. That is to say, for the busbar, the busbar connecting part is only arranged at the position required to be connected with the pin, and the solid structure is not arranged at the position staggered with the pin, so that the material of the busbar is saved, and the cost is saved.

Optionally, the busbar and the corresponding busbar connecting part are on the same plane, so that the busbar structure is simplified, the processing and manufacturing of the busbar are facilitated, and the stray inductance is reduced.

Optionally, the busbar and the corresponding busbar connecting part are formed through a blanking process, the blanking process is simple, the efficiency is high, and the processing time of the busbar is favorably shortened.

In some optional embodiments, the busbar connection portion protrudes out of at least one side edge of the corresponding busbar, and the busbar connection portion is directly connected with the corresponding busbar, in other words, the busbar connection portion is connected with the corresponding busbar without other connecting pieces, so that the simple structure of the busbar can be ensured, the simplification of the processing procedure of the busbar is facilitated, and the reduction of stray inductance is facilitated.

In some optional embodiments, the busbar connecting portion is provided with a busbar connecting portion through hole for allowing the pin to pass through. The pins of the power structure 30 extend into the through holes of the corresponding busbar connecting portions and are electrically connected with the busbar in which the busbar connecting portions are located.

In some optional embodiments, in two busbar connecting portions corresponding to two adjacent pins, the busbar connecting portion through hole on one busbar connecting portion is located outside the outline of the other busbar connecting portion, so that each pin is only connected with the busbar connecting portion through hole on the corresponding busbar connecting portion, and is not connected with the busbar connecting portion through holes on the other busbar connecting portions. It should be noted that "two adjacent pins" referred to herein may be two adjacent pins of the same power structure 30, or two adjacent pins of different power structures 30.

In some alternative embodiments, referring to fig. 16-23, two of the pins in the same power structure 30 are respectively connected to the busbar connection portions of two corresponding busbars, and each pin is connected to only the busbar connection portion in a penetrating manner. Referring to fig. 24-26, the remaining one pin in the same power structure 30 is adapted to be connected to a driver circuit board 2000.

Referring to fig. 16 to 19, the bus bar includes: the bus bar comprises a first bus bar 201, a second bus bar 202 and a third bus bar 203, wherein the first bus bar 201 comprises a first bus bar body 2013, the second bus bar 202 comprises a second bus bar body 2023, and the third bus bar 203 comprises a third bus bar body 2033; female connecting portion that arranges includes: the bus bar comprises a first bus bar connecting part 2011, a second bus bar connecting part 2021 and a third bus bar connecting part 2031, wherein the first bus bar connecting part 2011 is connected with a first bus bar body 2013 of the first bus bar 201, the second bus bar connecting part 2021 is connected with a second bus bar body 2023 of the second bus bar 202, and the third bus bar connecting part 2031 is connected with a third bus bar body 2033 of the third bus bar 203.

The first busbar connection portion 2011 is located on one side of the first busbar 201, the second busbar connection portion 2021 is located on the other side of the second busbar 202 opposite to the first busbar connection portion 2011, and the third busbar connection portions 2031 are located on two sides of the third busbar 203 respectively.

In some alternative embodiments, as shown with reference to fig. 16, the power structure 30 includes: the pin of the first power structure 31 and the pin of the second power structure 32 are located on opposite outer sides of the first power structure 31 and the second power structure 32, respectively, the pin of the first power structure 31 is a first connection pin 311, the pin of the second power structure 32 is a second connection pin 321, and the first connection pin 311 and the second connection pin 321 both include a first pin 331, a second pin 332, and a third pin 333.

The pins 311 of the first power structure 31 are located on the first side (for example, the left side in fig. 16) together with the first busbar connection 2011 and the third busbar connection 2031 on the first side of the busbar on the third busbar 203, and the pins 321 of the second power structure 32 are located on the second side (for example, the right side in fig. 16) together with the second busbar connection 2021 and the third busbar connection 2031 on the second side of the busbar on the third busbar 203.

The first busbar connecting portion 2011 is provided with a first busbar connecting portion through hole 2014, the second busbar connecting portion 2021 is provided with a second busbar connecting portion through hole 2024, and the third busbar connecting portion 2031 is provided with a third busbar connecting portion through hole 2034.

Specifically, referring to fig. 16-19 and 23-26, the first pin 331 of the first connecting leg portion 311 is adapted to penetrate through the third busbar connecting through hole 2034 on the third busbar connecting portion 2031 to connect to the third busbar 203; the second pin 332 of the first connection leg 311 is adapted to penetrate through the driving circuit board 2000 to realize connection with the driving circuit board 2000; the third pin 333 of the first connecting leg 311 is adapted to penetrate through the first busbar connecting portion through hole 2014 of the first busbar connecting portion 2011, so as to connect with the first busbar 201.

Similarly, referring to fig. 20 to 26, the first pin 331 of the second connecting leg portion 321 is adapted to penetrate through the second busbar connecting through hole 2024 of the second busbar connecting portion 2021 to connect with the second busbar 202; the second pin 332 of the second connection leg 321 is adapted to penetrate through the driving circuit board 2000 to realize connection with the driving circuit board 2000; the third pin 333 of the second connecting leg 321 is adapted to penetrate through the third busbar connecting through hole 2034 on the third busbar connecting portion 2031, so as to connect with the third busbar 203. The third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 on the first side of the busbar on the third busbar 203 is staggered from the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 on the second side of the busbar on the third busbar 203. Referring to fig. 20, a line of the third busbar connecting through holes 2034 on two sides of the third busbar 203 is not parallel to a short side of the third busbar 203.

The stacking positions of the first busbar 201, the second busbar 202 and the third busbar 203 can be changed according to actual requirements. For example, the third busbar 203 may be located above the first busbar 201 and the second busbar 202, or located between the first busbar 201 and the second busbar 202.

Further, any one of the two pins in the same power structure 30 is connected to the corresponding busbar connection portion and is adjacent to or spaced apart from the other busbar connection portion side by side.

As shown in fig. 16 to 17, the first pin 331 of the first connection leg 311 is connected to the third busbar connection portion 2031 and spaced apart from the first busbar connection portion 2011, and the third pin 333 of the first connection leg 311 is connected to the first busbar connection portion 2011 and spaced apart from the third busbar connection portion 2031; the first pin 331 of the second connecting leg portion 321 is connected to the second busbar connecting portion 2021 and spaced apart from the third busbar connecting portion 2031, and the third pin 333 of the second connecting leg portion 321 is connected to the third busbar connecting portion 2031 and spaced apart from the second busbar connecting portion 2021.

In some optional embodiments, any one of the two pins in the same power structure 30 is connected to a corresponding busbar connection portion, and the busbar connection through hole on one busbar connection portion is located outside the outline of the other busbar connection portion. As shown in fig. 16-17, the first pin 331 of the first connecting leg 311 is connected to the third busbar connection portion 2031, and the third busbar connection through hole 2034 on the third busbar connection portion 2031 is located outside the outline of the first busbar connection portion 2011; the third pin 333 of the first connecting leg 311 is connected to the first busbar connection 2011, and the first busbar connection through-hole 2014 of the first busbar connection 2011 is located outside the contour of the third busbar connection 2031; the first pin 331 of the second connecting leg portion 321 is connected to the second busbar connecting portion 2021, and the second busbar connecting portion through hole 2024 on the second busbar connecting portion 2021 is located outside the contour of the third busbar connecting portion 2031; the third pin 333 of the second connecting leg 321 is connected to the third busbar connecting portion 2031, and the third busbar connecting portion through hole 2034 on the third busbar connecting portion 2031 is located outside the outline of the second busbar connecting portion 2021.

Referring to fig. 24-26, the remaining pin of the same power structure 30 is adapted to be connected to the driving circuit board 2000, and the remaining pin is directly connected to the driving circuit board 2000 without being blocked by a bus bar connecting portion. For example, the second pin 332 of the first power structure 31 is connected to the driving circuit board 2000, and there is no busbar connection portion between the second pin 332 of the first power structure 31 and the driving circuit board 2000; the second pin 332 of the second power structure 32 is connected to the driving circuit board 2000, and there is no shielding of the bus bar connecting portion between the second pin 332 of the second power structure 32 and the driving circuit board 2000.

In some alternative embodiments, referring to fig. 1, 3, 16-17, 19-21, and 25, the same power structure 30 has a first pin 331, a second pin 332, and a third pin 333, where the third pin 333 is located between the first pin 331 and the second pin 332, and referring to fig. 2, 4, 8, 18, and 26, the third pin 333 is located outside the first pin 331 and the second pin 332 relative to the power structure 30, and the pins are arranged in a staggered manner, which is beneficial to reasonably arranging the connection points of the power structure 30 to the corresponding bus bars. A gap between the first pin 331 and the second pin 332 allows a bus bar connecting part to be inserted, and the bus bar connecting part is penetratingly connected with the third pin 333.

For example, a gap between the first pin 331 and the second pin 332 of the first power structure 31 allows the first bus bar connection 2011 to be inserted, and the first bus bar connection 2011 is penetratingly connected with the third pin 333 of the first power structure 31. A gap between the first pin 331 and the second pin 332 of the second power structure 32 allows the third busbar connection portion 2031 to be inserted, and the third busbar connection portion 2031 is penetratingly connected with the third pin 333 of the second power structure 32.

Further, the busbar connection portions penetrating the first pins 331 and the busbar connection portions penetrating the third pins 333 are partially stacked or staggered in the stacking direction of the plurality of busbars, for example, as shown in fig. 16 to 17, the third busbar connection portion 2031 penetrating the first pins 331 of the first power structure 31 and the first busbar connection portion 2011 penetrating the third pins 333 are partially stacked or staggered in the stacking direction of the plurality of busbars; the second bus bar connection portion 2021 penetrating the first pin 331 of the second power structure 32 and the third bus bar connection portion 2031 penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of bus bars. Due to the design, welding points of the power structure and the metal busbar are located at the position where the edge of the busbar protrudes, welding heat can be well kept at the welding points when a traditional welding process is used, and the threshold of the production process is lower, so that the power structure and the metal busbar can be produced in a large scale by using the traditional process.

Referring to fig. 24-26, the second pin 332 of the first power structure 31 and the second pin 332 of the second power structure 32 are both adapted to be directly connected to the driving circuit board 2000.

Specifically, one of the first busbar 201 and the second busbar 202 is a positive busbar and the other is a negative busbar. The third busbar 203 is a phase row. For example, the first busbar 201 is a positive busbar and the second busbar 202 is a negative busbar, or the first busbar 201 is a negative busbar and the second busbar 202 is a positive busbar.

Further, the power unit assembly 1000 may further include: a bus bar clamp (not shown) for clamping the first bus bar 201 and the second bus bar 202 is favorable for the first bus bar 201 and the second bus bar 202 to be attached, and the distance between the first bus bar 201 and the second bus bar 202 can be shortened, so that the height dimension of the power unit assembly 1000 is further shortened.

In the embodiment shown in fig. 16-26, each of the first busbar 201, the second busbar 202 and the third busbar 203 is rectangular, and the first busbar 201, the second busbar 202 and the third busbar 203 are stacked in the thickness direction of the busbars, and busbar connection portions are formed on the longitudinal long sides of the corresponding busbars. Specifically, the first busbar connection portion 2011 is formed on the first side longitudinal long edge of the first busbar 201, the second busbar connection portion 2021 is formed on the second side longitudinal long edge of the second busbar 202, and the third busbar connection portion 2031 is formed on the both side longitudinal long edges of the third busbar 203.

Referring to fig. 16-17 and 19-23, a first busbar adapter end plate 2012 is disposed at one end of the first busbar 201, a second busbar adapter end plate 2022 is disposed at one end of the second busbar 202, the first busbar adapter end plate 2012 and the second busbar adapter end plate 2022 are disposed at the same end and are arranged side by side, and a third busbar adapter end plate 2032 is disposed at the other end of the third busbar 203 opposite to the first busbar adapter end plate 2012, thereby facilitating the rational arrangement of the adapter end plates of the busbars.

In some optional embodiments, the first busbar 201, the second busbar 202, and the third busbar 203 are all flat busbars, thereby facilitating further reduction of the size of the power unit assembly 1000 in the height direction.

In some embodiments, which may not be shown, a through slot allowing the pin to pass through is formed in the busbar connection portion, and the through slot extends in a direction away from the busbar and penetrates through an outer edge of the busbar connection portion away from the busbar. For example, the through slot may be a "U" shaped slot with an outward opening, thereby facilitating the insertion and removal of the pins through and out of the through slot.

In some optional embodiments, the surface of the busbar is entirely covered with an insulating film.

In other optional embodiments, the busbar comprises: the female body of arranging and female connecting portion of arranging, female connecting portion protrusion of arranging corresponds female at least one side edge of arranging and female connecting portion of arranging with correspond female the arranging and directly link to each other, the surface cladding of arranging connecting portion has the insulating film, two adjacent female row's female body separate each other. That is to say, can only be in female the surface cladding of arranging connecting portion have the insulating film, and the surface of arranging the body can not wrap the insulating film, only need guarantee two adjacent female arranging the body separate each other can, be favorable to saving the material of insulating film from this.

In further alternative embodiments, the busbar comprises: the female body of arranging, the whole cladding of surface of female body of arranging has the insulating film, like this, when a plurality of female row range upon range of when arranging, insulating properties is good between two adjacent female arranging.

Further, the busbar also includes: the female connecting portion that arranges, female connecting portion protrusion correspond female at least one side edge of arranging the body and female connecting portion and correspond female the body and directly link to each other of arranging, and the whole cladding of the surface of female arranging the body and female connecting portion has the insulating film, and insulating film can prevent that female arranging from producing the electricity with other pins of power structure 30 and being connected to two adjacent female row between insulating properties better.

Referring to fig. 16 to 26, busbar bodies of two adjacent busbars are at least partially stacked, thereby facilitating reduction in size of the power module 10000.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (10)

1. A power module, characterized in that, comprising: a substrate, the first side of the substrate has a first side surface; a tableting structure, the tableting structure is located on the first side of the substrate; Multiple stacked busbars; A power structure, the power structure is pressed against the first side surface by the sheet pressing structure, and the power structure has a plurality of pins, the pins are connected with the corresponding busbars and with other The busbars are electrically insulated. 2 . The power module of claim 1 , further comprising a holding structure configured to hold the pressing structure on the first side of the substrate. 3 . 3 . The power module of claim 2 , wherein the holding structure comprises: a first holding structure, the first holding structure extending from the substrate in a direction away from the first side surface and passing through 3 . The sheet pressing structure is provided, and the sheet pressing structure is held on the first side of the substrate by the first holding structure. 4 . The power module according to claim 3 , further comprising: a second holding structure, the second holding structure is adapted to be connected with the first holding structure, so that the tablet pressing structure is held in place. 5 . on the first side of the substrate. 5 . The power module of claim 4 , wherein the second holding structure is connected to the first holding structure at a side of the pressing structure that is away from the substrate. 6 . 6 . The power module according to claim 4 , wherein the first holding structure is configured as a columnar structure, and the second holding structure is configured as a ring-shaped structure sleeved on the columnar structure. 7 . 7 . The power module of claim 6 , wherein the first holding structure is perpendicular to the first side surface and has a free end away from the substrate, and the second holding structure extends from the pressing sheet. 8 . The side of the structure facing away from the base plate is screwed to the first holding structure. 8. The power module of claim 6, wherein the first retaining structure is configured as a screw with an external thread, and the second retaining structure is configured as a nut with an internal thread. 9 . The power module according to claim 4 , wherein the tablet pressing structure comprises: a tablet pressing body, the tablet pressing body is formed as a concave groove structure recessed toward the first side surface, and the pressing tablet body is formed as a recessed groove structure. 10 . The opening of the sheet body faces away from the first side. 10 . The power module according to claim 9 , wherein at least a part of the second holding structure is located in the concave groove of the pressing body, and the first holding structure is free from the substrate. 11 . The end faces of the ends are also located within the recessed grooves.

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