CN113497543B - Frequency converter power assembly - Google Patents

Frequency converter power assembly Download PDF

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Publication number
CN113497543B
CN113497543B CN202010252290.4A CN202010252290A CN113497543B CN 113497543 B CN113497543 B CN 113497543B CN 202010252290 A CN202010252290 A CN 202010252290A CN 113497543 B CN113497543 B CN 113497543B
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CN
China
Prior art keywords
plate
busbar
power
capacitor
terminal
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CN202010252290.4A
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Chinese (zh)
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CN113497543A (en
Inventor
席文杰
徐佳巍
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Atlas Copco Wuxi Compressor Co Ltd
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Atlas Copco Wuxi Compressor Co Ltd
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Priority to CN202010252290.4A priority Critical patent/CN113497543B/en
Publication of CN113497543A publication Critical patent/CN113497543A/en
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters

Abstract

The invention discloses a frequency converter power assembly. The frequency converter power assembly includes: a mounting bracket having a plurality of mounting surfaces arranged in a ring shape; the power modules are arranged on the corresponding mounting surfaces; and the capacitor is electrically connected with the power module. According to the frequency converter power assembly, the plurality of power modules are arranged on the plurality of mounting surfaces of the annular mounting frame, and the capacitor is electrically connected with the power modules, so that the whole frequency converter power assembly is simple, compact and reasonable in arrangement.

Description

Frequency converter power assembly
Technical Field
The invention relates to the technical field of frequency converters, in particular to a frequency converter power assembly.
Background
The frequency converter power assembly comprises a power module and a capacitor, the capacitor is electrically connected with the power module, but in the existing frequency converter power assembly, the arrangement mode of the power module and the capacitor is often unreasonable, so that the capacitor cannot be selected to have larger specification, and when the capacitor is electrically connected with the power module, the number of connecting parts is large, so that the whole frequency converter power assembly is complex in structure and huge in volume.
Disclosure of Invention
The present invention aims to solve, at least to some extent, one of the above technical problems in the prior art. Therefore, the invention provides a frequency converter power assembly which is simple and compact in structure.
The frequency converter power assembly according to the embodiment of the invention comprises: a mounting bracket having a plurality of mounting surfaces arranged in a ring shape; the power modules are arranged on the corresponding mounting surfaces; and the capacitor is electrically connected with the power module.
According to the frequency converter power assembly provided by the embodiment of the invention, the plurality of power modules are arranged on the plurality of mounting surfaces of the annular mounting frame, and the capacitor is electrically connected with the power modules, so that the whole frequency converter power assembly is simple, compact and reasonable in arrangement.
According to some embodiments of the invention, the mounting frame is a polygonal column structure, each side surface of the polygonal column is configured as the mounting surface, and the power modules are in one-to-one correspondence with the mounting surface.
According to some embodiments of the invention, the capacitor is mounted to an end of the mounting bracket.
Further, a first polar plate and a second polar plate are arranged between the mounting frame and the capacitor, and the power module and the capacitor are electrically connected with the first polar plate and the second polar plate.
In particular, the capacitor has a first terminal adapted to be electrically connected to the first plate and a second terminal adapted to be electrically connected to the second plate.
Further, the outer surfaces of the first polar plate and the second polar plate are integrally coated with an insulating film.
According to some embodiments of the invention, a first capacitance connecting portion is disposed on the first polar plate, and the first terminal is electrically connected with the first capacitance connecting portion; the second polar plate is provided with a second capacitance connecting part, and the second terminal is electrically connected with the second capacitance connecting part.
Specifically, the first capacitance connecting part is a first capacitance connecting hole formed on the first polar plate, and the first terminal is electrically connected with the hole wall of the first capacitance connecting hole; the second capacitor connecting part is a second capacitor connecting hole formed on the second polar plate, and the second terminal is electrically connected with the hole wall of the second capacitor connecting hole.
Optionally, the first polar plate is located the second polar plate towards one side of mounting bracket, be equipped with on the first polar plate and be suitable for dodging the first via hole of second terminal, be equipped with on the second polar plate and be suitable for dodging the second via hole of first terminal, first via hole with the pore wall cladding of second via hole has the insulating film.
According to some embodiments of the invention, an end of the mounting frame facing the capacitor is a first end plate, and the capacitor is mounted on the first end plate.
Further, the frequency converter power assembly further comprises: the capacitor fixing plate is arranged on one side, deviating from the first end plate, of the capacitor, a mounting column is arranged on the first end plate, and the mounting column penetrates through the capacitor fixing plate and then is fastened and connected with the mounting column fastening nut.
Specifically, one end of the capacitor, which faces the capacitor fixing plate, is provided with a capacitor fastening protrusion, the capacitor fixing plate is provided with a protrusion penetrating hole, and the capacitor fastening protrusion is suitable for penetrating the protrusion penetrating hole and is fastened and connected with a capacitor fastening nut.
According to some embodiments of the invention, the capacitor is mounted to one side of the mounting frame.
Optionally, the capacitor is mounted to the top side of the mounting frame.
According to some embodiments of the invention, the end of the mounting frame is provided with a first pole plate and a second pole plate, and the power module and the capacitor are electrically connected with the first pole plate and the second pole plate.
Further, the frequency converter power assembly further comprises: the capacitor has a first terminal electrically connected to the first terminal plate and a second terminal electrically connected to the second terminal plate.
Further, the first electrode plate is electrically connected with the first terminal plate, and the second electrode plate is electrically connected with the second terminal plate.
Further, a first capacitor connecting part is arranged on the first polar plate, and the first terminal plate is electrically connected with the first capacitor connecting part; the second polar plate is provided with a second capacitance connecting part, and the second terminal plate is electrically connected with the second capacitance connecting part.
Specifically, the first terminal board is provided with a first terminal piece, and the first terminal piece is fixedly connected with the first capacitance connecting part through a first capacitance fastening piece; the second terminal plate is provided with a second terminal plate, and the second terminal plate is fixedly connected with the second capacitance connecting part through a second capacitance fastening piece.
According to some embodiments of the invention, the mounting frame has a first end plate at one end and a second end plate at the other end, the capacitor is supported on the first terminal plate and the second terminal plate, the first terminal plate and the second terminal plate are supported on the first end plate by a first supporting element, and the capacitor is supported on the second end plate by a second supporting element.
According to some embodiments of the invention, the power module has a first busbar electrically connected to the first plate and a second busbar electrically connected to the second plate.
Further, a first pole piece is arranged on the first pole plate, extends towards the power module and is suitable for being electrically connected with the first busbar; the second polar plate is provided with a second polar plate, and the second polar plate extends towards the power module and is suitable for being electrically connected with the second busbar.
Specifically, the first busbar is provided with a first busbar switching end plate, and the first pole piece is fixedly connected with the first busbar switching end plate through a first bolt; the second busbar is provided with a second busbar switching end plate, and the second pole piece is fixedly connected with the second busbar switching end plate through a second bolt.
According to some embodiments of the invention, the capacitor is a plurality of capacitors, and the plurality of capacitors are annularly arranged around the outer periphery of the power module.
Further, the capacitors are arranged in one-to-one correspondence with the power modules.
According to some embodiments of the invention, the mounting frame has a first end plate at one end and a second end plate at the other end, fluid medium grooves are formed in the first end plate and the second end plate, and a fluid medium channel is formed between each power module and the mounting frame, and is communicated with the fluid medium grooves.
Optionally, the fluid medium groove of the first end plate, the fluid medium groove of the second end plate are in series communication with a plurality of the fluid medium channels.
Optionally, the fluid medium groove of the first end plate and the fluid medium groove of the second end plate are communicated in parallel with a plurality of the fluid medium channels.
According to some embodiments of the invention, the power module comprises: a base plate having a first side, the base plate mounted on the mounting bracket; a tabletting structure located on the first side of the substrate; a plurality of bus bars arranged in a stacked manner; and the power structure is pressed against the first side surface by the pressing structure and is provided with a plurality of pins, and the pins are connected with the corresponding busbar and are electrically insulated from other busbars.
Further, the inverter power assembly further comprises a retaining structure arranged for retaining the tabletting structure on the first side of the substrate.
According to some embodiments of the invention, the power structure comprises: a first power structure and a second power structure, the first power structure and the second power structure being spaced apart; the tabletting structure comprises: the preforming body and preforming arm, the preforming arm connect in the preforming body and be used for pressing to the power structure, the preforming arm includes: the first tabletting arm is used for pressing against the first power structure, the second tabletting arm is used for pressing against the second power structure, and the tabletting body is located between the first power structure and the second power structure.
Specifically, the first power structure has a first connection foot, the second power structure has a second connection foot, the first connection foot and the second connection foot are respectively located at opposite outer sides of the first power structure and the second power structure, and the tablet body is located between opposite inner sides of the first power structure and the second power structure.
Optionally, the tablet body is formed into a concave groove body structure that is concave toward the first side, the opening of the tablet body faces away from the first side, the first tablet arm and the second tablet arm are respectively connected to two ends of the opening of the tablet body, and the first tablet arm and the second tablet arm extend toward directions away from each other.
According to some embodiments of the invention, the busbar comprises: first female row, second are female to be arranged and the female row of third, the one end of first female row is provided with first female row switching end plate, the one end of second female row is provided with the female row switching end plate of second, first female row switching end plate with the female row switching end plate of second is located same one end and sets up side by side, the other end of third female row with first female row switching end plate is relative is provided with the female row switching end plate of third.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic perspective assembly of a power unit;
FIG. 2 is an assembled side view of a power unit;
FIG. 3 is an exploded perspective view of a power unit;
FIG. 4 is an exploded side view of the power unit;
FIG. 5 is a schematic perspective view of a tabletting structure;
FIG. 6 is an exploded perspective view of the power cell assembly;
FIG. 7 is a schematic perspective assembly view of a power cell assembly;
FIG. 8 is an assembled side view of the power cell assembly;
FIG. 9 is a schematic diagram of the connection of a power structure to a tri-layer busbar;
FIG. 10 is an exploded perspective view of a power cell and a second busbar, a third busbar;
FIG. 11 is a schematic perspective view of a power unit and a second busbar and a third busbar;
FIG. 12 is an exploded perspective view of a power cell and a third busbar;
FIG. 13 is a schematic perspective view of a power unit and a third busbar;
FIG. 14 is an exploded perspective view of the power cell assembly and the drive circuit board;
FIG. 15 is a schematic perspective view of a power unit assembly and a drive circuit board;
FIG. 16 is an assembled side view of the power cell assembly and the drive circuit board;
FIG. 17 is an exploded view of the inverter power assembly of the first embodiment;
fig. 18 is an assembled schematic diagram of the inverter power assembly of the first embodiment;
FIG. 19 is an exploded view of the inverter power assembly of the second embodiment;
fig. 20 is an assembled schematic diagram of a second embodiment of a frequency converter power assembly.
Reference numerals:
power module 10000, power unit assembly 1000, power unit 100, substrate 10, tabletting structure 20, tabletting body 21, tabletting body positioning hole 211, tabletting arm 22, first tabletting arm 221, second tabletting arm 222, tabletting connection 23, bent section 24, power structure 30, first power structure 31, first connection leg 311, second power structure 32, second connection leg 321, first pin 331, second pin 332, third pin 333, holding structure 45, first holding structure 40, second holding structure 50, positioning tab 60, positioning port 61, annular positioning rib 62, positioning tab through hole 63, thermal insulation structure 60', first busbar 201, first busbar connection 2011, first busbar transfer end plate 2012, first busbar body 2013, first busbar connection through hole 2014, second busbar 202, second busbar connection 2021, second busbar transfer end plate 2022, second busbar body 2023, second busbar connection through hole 2024, third busbar 203, first busbar connection end plate 2031, third busbar connection 2032, third busbar connection 2033, third busbar connection 2034;
The frequency converter power assembly 20000, the mounting bracket 3000, the first end plate 3001, the second end plate 3002, the capacitor 3003, the first terminal 30031, the second terminal 30032, the capacitor fixing plate 3004, the boss through hole 30041, the mounting post 3005, the first plate 3006, the first pole piece 30061, the first bolt 30062, the first capacitor connection 30063, the first via 30064, the second plate 3007, the second pole piece 30071, the second bolt 30072, the second capacitor connection 30073, the second via 30074, the fluid medium slot 3009, the mounting post fastening nut 3010, the capacitor fastening boss 3011, the capacitor fastening nut 3012, the first support element 3013, the second support element 3014, the first capacitor fastening piece 3015, the second capacitor fastening piece 3016, the first terminal plate 3017, the first terminal piece 30171, the second terminal plate 3018, and the second terminal piece 30181.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may communicate with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The power module 10000 according to an embodiment of the present invention is described in detail below with reference to fig. 1 to 16.
Referring to fig. 1 to 4 and fig. 6 to 16, a power module 10000 according to an embodiment of the present invention may include: the power unit assembly 1000 and the driving circuit board 2000, optionally, the driving circuit board 2000 is located above the power unit assembly 1000.
Wherein the power cell assembly 1000 may include: the power unit 100, a plurality of stacks of stacked arrangement, the power unit 100 may include: the substrate 10, the presser structure 20, and the power structure 30, wherein a first side (i.e., an upper side in fig. 2) of the substrate 10 has a first side surface, the presser structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the presser structure 20.
The use of the presser structure 20 to press the power structure 30 against the first side of the substrate 10 ensures a secure and reliable mounting of the power structure 30 on the substrate 10.
The power structure 30 has a plurality of pins, which are connected to the corresponding busbar and electrically insulated from other busbars, so that good insulation between the pins and other busbars can be ensured. The pins and the corresponding busbar can be connected through punching, and can also be directly connected.
According to the power module 10000 of the embodiment of the present invention, the power structure 30 is pressed against the substrate 10 by the pressing structure 20, and the pins of the power structure 30 are connected with the corresponding busbar and are electrically insulated from other busbars, so that the whole power module 10000 has a compact structure and high integration level.
Referring to fig. 1 to 5, the power unit 100 further includes: a holding structure 45, the holding structure 45 being arranged for holding the tabletting structure 20 on a first side of the base plate 10.
Referring to fig. 1 to 5, the holding structure 45 includes: the first holding structure 40, the first holding structure 40 extends from the substrate 10 towards a direction away from the first side, and the first holding structure 40 is penetrated through the pressing structure 20, the pressing structure 20 is held on the first side of the substrate 10 by the first holding structure 40, and the pressing structure 20 presses the power structure 30 to hold the power structure 30 on the first side of the substrate 10. In other words, referring to fig. 2, the first holding structure 40 is threaded through the tablet structure 20 from bottom to top, and the tablet structure 20 is held on the first side of the substrate 10 by the first holding structure 40, that is, when the first holding structure 40 is threaded through the tablet structure 20, the relative position of the tablet structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role of positioning the tablet structure 20.
In some embodiments, not shown, the clip structure 20 may also be directly secured, such as welded, to the base plate 10, eliminating the retaining structure 45, thereby facilitating a reduction in the number of connected components and thus the weight of the power unit 100.
Further, referring to fig. 1-4, the retaining structure 45 further includes: and a second holding structure 50, the second holding structure 50 being adapted to be connected to the first holding structure 40, such that the tabletting structure 20 is held on the first side of the base plate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the tabletting structure 20 facing away from the base plate 10. As shown in fig. 2, the second holding structure 50 is connected to the first holding structure 40 at the upper side of the tabletting structure 20, and the upper side space of the tabletting structure 20 is wide, thus providing an operation space for mounting and dismounting the second holding structure 50. The wafer structure 20 is clamped between the second holding structure 50 and the substrate 10, while the power structure 30 is clamped between the wafer structure 20 and the substrate 10.
In the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. Furthermore, the meaning of "a plurality of" means at least two, such as two, three, etc., unless specifically defined otherwise.
In the embodiment shown in fig. 1 to 4, the first holding structure 40 is configured as a columnar structure, the second holding structure 50 is configured as an annular structure that is sleeved with the columnar structure, and the tabletting structure 20 is clamped between the second holding structure 50 and the substrate 10 to prevent the tabletting structure 20 from being separated from the substrate 10.
Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10, and the first retaining structure 40 has a free end far away from the substrate 10, and the second retaining structure 50 is screwed on the first retaining structure 40 from the side of the tabletting structure 20 far away from the substrate 10, so as to facilitate quick connection or disconnection between the second retaining structure 50 and the first retaining structure 40.
In some alternative embodiments, the first retaining structure 40 is configured as an externally threaded screw and the second retaining structure 50 is configured as an internally threaded nut that threadably engages the screw to facilitate installation and removal of the wafer structure 20.
Referring to fig. 1-4, the second retaining structure 50 presses against the side of the tabletting structure 20 facing away from the substrate 10, and the second retaining structure 50 can apply a pressing force to the tabletting structure 20 toward the substrate 10 to prevent the tabletting structure 20 from shaking, so that the connection between the tabletting structure 20 and the substrate 10 is more reliable.
Referring to fig. 1-5, the tabletting structure 20 comprises: the tablet body 21, the tablet body 21 is formed into a concave groove body structure concave towards the first side, and the opening of the tablet body 21 faces away from the first side. Referring to fig. 2 and 4, the tablet body 21 is formed in a concave groove structure recessed downward, and the opening of the tablet body 21 is directed upward.
Further, at least a portion of the second holding structure 50 is located in the concave groove of the tablet body 21, and the end face of the first holding structure 40 away from the free end of the substrate 10 (i.e., the upper end face of the first holding structure 40) is also located in the concave groove, whereby the distance between the end face of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, while the distance between the second holding structure 50 and the substrate 10 is shortened, so that the holding structure 45 is located in the concave groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger usable space can be formed above the tablet structure 20, so that an installation space is left for other parts, preventing mutual interference from occurring at the time of installation.
In the embodiment shown in fig. 2, the second holding structure 50 is entirely located in the recessed groove, and the upper end surface of the first holding structure 40 is also located in the recessed groove, whereby the size of the power unit 100 in the height direction can be further reduced.
Referring to fig. 2, the overlapping dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located as much as possible in the concave groove of the tablet body 21, and further the distance between the second holding structure 50 and the substrate 10 can be further reduced.
Referring to fig. 1-3 and 5, the second holding structure 50 is pressed against the bottom wall of the tablet body 21, the first holding structure 40 penetrates through the bottom wall of the tablet body, and the tablet body positioning hole 211 adapted to the first holding structure 40 is formed in the bottom wall of the tablet body, and after the first holding structure 40 penetrates through the tablet body positioning hole 211 in the bottom wall of the tablet body, the tablet structure 20 can be initially positioned, so that the tablet structure 20 can be fixed by using the second holding structure 50 later.
Referring to fig. 5, the tabletting structure 20 comprises: the presser body 21 and the presser arm 22, the presser arm 22 is connected to the presser body 21, and referring to fig. 1-2, the presser arm 22 is used to press against the power structure 30, the power structure 30 being clamped between the presser structure 20 and the substrate 10.
Referring to fig. 1-4, the power structure 30 may include: a first power structure 31 and a second power structure 32, the first power structure 31 and the second power structure 32 being spaced apart. The tabletting arm 22 comprises: a first presser arm 221 and a second presser arm 222, the first presser arm 221 being adapted to press against the first power structure 31, the second presser arm 222 being adapted to press against the second power structure 32, the presser body 21 being located between the first power structure 31 and the second power structure 32, the retaining structure 45 also being located between the first power structure 31 and the second power structure 32.
Further, the first power structure 31 has a first connection leg 311, the second power structure 32 has a second connection leg 321, the first connection leg 311 and the second connection leg 321 are located on opposite outer sides of the first power structure 31 and the second power structure 32, respectively, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.
Optionally, an angle between the extending direction of the first connection leg 311 from the first power structure 31 and the extending direction of the second connection leg 321 from the second power structure 32 is 180 degrees. That is, the pins of the first connection leg 311 and the second connection leg 321 are disposed outwards, leaving a central space between the first power structure 31 and the second power structure 32, from which the holding structure 45 is convenient to fix the tabletting structure 20 on the substrate 10.
The pins of the first connection leg 311 and the second connection leg 321 each include: a first pin 331, a second pin 332, a third pin 333, each adapted to electrically connect with a drive circuit board 2000 or a corresponding busbar.
Referring to fig. 2 and 4, the extending direction of the first connection leg 311 from the first power structure 31 is leftward, the extending direction of the second connection leg 321 from the second power structure 32 is rightward, and the included angle between the two is 180 degrees, so that the first connection leg 311 and the second connection leg 321 can be prevented from interfering with the first power structure 31 and the second power structure 32 due to the closer distance between the first connection leg 311 and the second connection leg 321 when facing each other. Meanwhile, when the first power structure 31 and the second power structure 32 are connected with the corresponding busbar or the driving circuit board 2000, the first connection leg 311 and the second connection leg 321 face outward, which is convenient for corresponding operation.
Referring to fig. 1 and 3, the first power structures 31 and the second power structures 32 are spaced apart, for example, oppositely arranged, in a first direction of the substrate 10, the first power structures 31 are plural, and the plurality of first power structures 31 are arranged on the substrate 10 in a second direction of the substrate 10, the second power structures 32 are plural, and the plurality of second power structures 32 are arranged on the substrate 10 in the second direction, the tabletting structures 20 are plural, and the plurality of tabletting structures 20 are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other. The retaining structure 45 is provided for retaining the plurality of tabletting structures 20 on the first side of the base plate 10. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.
Further, the plurality of first power structures 31, the plurality of tabletting structures 20 and the plurality of second power structures 32 are in one-to-one correspondence in the first direction. A pair of first and second power structures 31, 32 disposed opposite each other may be pressed against the substrate 10 by the same press structure 20.
In some embodiments, not shown, the plurality of tabletting structures 20 may be separate individuals.
In the embodiment shown in fig. 1, 3 and 5, the plurality of tabletting structures 20 are integrally connected through the tabletting connection part 23, so that the assembling process of the plurality of tabletting structures 20 is saved, and the assembling efficiency of the power unit 100 is improved. Meanwhile, the integrated tabletting structure 20 can simultaneously press a plurality of power structures 30, and the crimping efficiency is high. The integrated tabletting structure 20 is pressed against the base plate 10 by two or more holding structures 45.
Further, the pad connecting portion 23 is connected between the pad bodies 21 of the adjacent two pad structures 20, and the width of the pad connecting portion 23 may be equal to the width of the pad bodies 21.
In the embodiment shown in fig. 1, 3, 5, the tabletting structure 20 comprises: the tablet body 21 and the tablet arm 22, the first holding structure 40 is threaded through the tablet body 21, the tablet arm 22 is connected with the tablet body 21 side by side in the first direction of the substrate 10, and the tablet arm 22 is used for pressing against the power structure 30; the plurality of the pressing structures 20 are plural, and the plurality of pressing structures 20 are connected to each other in the second direction of the substrate 10, and the first direction and the second direction are perpendicular to each other.
Further, the tabletting arm 22 may comprise: a first presser arm 221 and a second presser arm 222, the first presser arm 221 and the second presser arm 222 being symmetrically connected to both sides of the presser body 21; and, the tablet bodies 21 of the adjacent two tablet structures 20 are connected to each other by the tablet connecting part 23.
Referring to fig. 2, 4 and 5, the tablet body 21 is formed in a concave groove structure recessed toward the first side, the opening of the tablet body 21 faces away from the first side, the first tablet arm 221 and the second tablet arm 222 are connected to both ends of the opening of the tablet body 21, respectively, and the first tablet arm 221 and the second tablet arm 222 extend in a direction away from each other. Referring to fig. 2 and 4, the tablet body 21 is formed in a concave groove structure recessed downward, the opening of the tablet body 21 is directed upward, the first tablet arm 221 extends leftward, and the second tablet arm 222 extends rightward.
In some alternative embodiments, the power unit 100 of the power module 10000 may further include: for positioning the power structure 30 at the positioning portion of the substrate 10, thereby ensuring that the position of the power structure 30 on the substrate 10 is accurate and preventing the power structure 30 from arbitrarily shaking on the substrate 10.
In the embodiment shown in fig. 1-4, the positioning portion includes a positioning plate 60, and a positioning opening 61 is provided on the positioning plate 60, where the positioning opening 61 matches the power structure 30. For example, the outer peripheral surface of the power structure 30 and the positioning opening 61 are both rectangular, the power structure 30 is positioned in the positioning opening 61, the bottom of the power structure 30 is directly attached to the substrate 10, the substrate 10 may be a metal substrate 10, the heat of the power structure 30 may be transferred to the substrate 10, and a cooling device or a heating device may be disposed below the substrate 10 to cool or heat the power structure 30.
Optionally, as shown in fig. 3-4, the positioning plate 60 is further provided with an annular positioning rib 62 surrounding the positioning opening 61, and the annular positioning rib 62 is matched with the outer peripheral surface of the power structure 30. The annular positioning ribs 62 protrude from the surface of the positioning sheet 60, so that the positioning firmness of the power structure 30 can be increased, and the positioning effect is good.
In the embodiment shown in fig. 1-4, the spacer 60 is an insulating spacer, and the spacer 60 is adhesively fixed to the first side of the substrate 10.
Referring to fig. 1 and 3, the positioning sheet 60 is provided with a positioning sheet through hole 63 for matching with the first holding structure 40 and allowing the first holding structure 40 to pass through the positioning sheet through hole 63, and the positioning sheet 60 can be initially positioned after the first holding structure 40 passes through the positioning sheet through hole 63. The first holding structure 40 is connected to the second holding structure 50 after passing through the spacer through hole 63 on the spacer 60 and the spacer body positioning hole 211 on the spacer body 21, so as to fix the spacer 60 and the spacer structure 20 between the second holding structure 50 and the substrate 10.
In some alternative embodiments, the power unit 100 may further include: the heat insulating structure 60', the heat insulating structure 60' is arranged on the first side of the substrate 10 in a form surrounding the power structure 30. The heat insulation structure 60 'is located between the power structure 30 and the substrate 10, and the heat insulation structure 60' can separate the power structure 30 from the substrate 10, so as to prevent heat of the power structure 30 from affecting components below the substrate 10, and prevent heat below the substrate 10 from being transferred upwards to the power structure 30.
In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.
Referring to fig. 2, 4 and 5, the tabletting structure 20 is configured as a gull wing shape, and the tabletting structure 20 may include a tabletting body 21 and first and second tabletting arms 221 and 222, the first and second tabletting arms 221 and 222 are symmetrically connected at both sides of the tabletting body 21, and free ends of the first and second tabletting arms 221 and 222 each have a bending section 24 bent toward the substrate 10. The bending section 24 is adapted to press against the power structure 30 such that the power structure 30 presses against the substrate 10.
The upper side of the tabletting structure 20 forms a larger planar space, which provides a mounting space for other components (for example, a busbar), and the dimension of the power unit 100 and the busbar assembly in the height direction can be significantly shortened.
The presser arm 22 and the base plate 10 form a power structure mounting space therebetween, and the power structure 30 is adapted to be mounted in the power structure mounting space. The method comprises the steps of carrying out a first treatment on the surface of the
Referring to fig. 6-16, the power structure 30 has a plurality of pins, such as a first pin 331, a second pin 332, and a third pin 333 of the first connection leg 311 and the second connection leg 321, at least one pin is connected with a mother board that is penetrated in a manner of penetrating only one layer of mother board, and the at least one pin is misplaced and electrically insulated from other mother boards. That is, the at least one pin does not need to pass through other busbar, and only needs to be perforated on the perforated busbar, so that the at least one pin passes through the hole, thereby reducing the number of perforation on other busbar and simplifying the production process of the power unit assembly 1000. Meanwhile, the at least one pin is staggered with other busbar, so that good insulation performance between the at least one pin and other busbar can be ensured.
The pins are connected with the worn busbar in a penetrating mode, and staggered with other busbars, so that the number of holes in other busbars can be reduced, the production and manufacturing procedures of the busbars are simplified, and the electric insulation performance between the pins and other busbars is guaranteed to be good.
In some alternative embodiments, the busbar has busbar connection portions, at least one pin of the power unit 100 is connected to the busbar in a form of penetrating only one layer of busbar connection portions, and the busbar connection portions are configured in a sheet shape. That is, for the busbar, the busbar connection part is only arranged at the position where the busbar is required to be connected with the pins, and the physical structure is not arranged at the position which is staggered with the pins, so that the material of the busbar is saved, and the cost is saved.
Optionally, the busbar and the corresponding busbar connection part are located on the same plane, so that the busbar structure is simplified, the busbar is convenient to process and manufacture, and stray inductance is reduced.
Optionally, the busbar and the corresponding busbar connecting part are formed through a blanking process, the blanking process is simple and high in efficiency, and the processing time of the busbar is shortened.
In some alternative embodiments, the busbar connection portion protrudes from at least one side edge of the corresponding busbar, and the busbar connection portion is directly connected with the corresponding busbar, in other words, the busbar connection portion is connected with the corresponding busbar in a form of not passing through other connection pieces, so that the busbar structure can be ensured to be simple, the processing procedure of the busbar can be simplified, and stray inductance can be reduced.
In some alternative embodiments, the busbar connection portion is provided with a busbar connection portion through hole for allowing the pin to pass through. Pins of the power structure 30 extend into corresponding busbar connecting portion through holes and are electrically connected with the busbar where the busbar connecting portion is located.
In some alternative embodiments, in two busbar connection portions corresponding to two adjacent pins, the busbar connection portion through hole on one busbar connection portion is located outside the outline of the other busbar connection portion, thereby ensuring that each pin is connected only with the busbar connection portion through hole on the corresponding busbar connection portion, and not with the busbar connection portion through hole on the other busbar connection portion. It should be noted that, as used herein, two adjacent pins may be two adjacent pins of the same power structure 30, or two adjacent pins of different power structures 30.
In some alternative embodiments, referring to fig. 6-13, two pins in the same power structure 30 are respectively connected to the busbar connection portions of the corresponding two busbars, and each pin is only connected through the corresponding busbar connection portion. Referring to fig. 14-16, the remaining one pin in the same power structure 30 is adapted to be connected to a driver circuit board 2000.
Referring to fig. 6 to 9, the busbar includes: a first busbar 201, a second busbar 202 and a third busbar 203, wherein the first busbar 201 comprises a first busbar body 2013, the second busbar 202 comprises a second busbar body 2023, and the third busbar 203 comprises a third busbar body 2033; the busbar connection part comprises: the first busbar connection 2011, the second busbar connection 2021, and the third busbar connection 2031, the first busbar connection 2011 is connected to the first busbar body 2013 of the first busbar 201, the second busbar connection 2021 is connected to the second busbar body 2023 of the second busbar 202, and the third busbar connection 2031 is connected to the third busbar body 2033 of the third busbar 203.
The first busbar connection 2011 is located on one side of the first busbar 201, the second busbar connection 2021 is located on the other side of the second busbar 202 opposite to the first busbar connection 2011, and the third busbar connection 2031 is located on both sides of the third busbar 203.
In some alternative embodiments, referring to fig. 6, the power architecture 30 includes: the first power structure 31 and the second power structure 32, the pin of the first power structure 31 and the pin of the second power structure 32 are respectively located at opposite outer sides of the first power structure 31 and the second power structure 32, the pin of the first power structure 31 is a first connection foot 311, the pin of the second power structure 32 is a second connection foot 321, and the first connection foot 311 and the second connection foot 321 comprise a first pin 331, a second pin 332 and a third pin 333.
The pins 311 of the first power structure 31 are on the same side as the first busbar connection 2011 and the third busbar connection 2031 on the third busbar 203 on the first side of the busbar (e.g., the left side in fig. 6), and the pins 321 of the second power structure 32 are on the same side as the second busbar connection 2021 and the third busbar connection 2031 on the third busbar 203 on the second side of the busbar (e.g., the right side in fig. 6).
The first busbar connection 2011 has a first busbar connection through hole 2014, the second busbar connection 2021 has a second busbar connection through hole 2024, and the third busbar connection 2031 has a third busbar connection through hole 2034.
Specifically, referring to fig. 6-9 and 13-16, the first pins 331 of the first connection portion 311 are adapted to penetrate through the third busbar connection portion through holes 2034 on the third busbar connection portion 2031 to realize connection with the third busbar 203; the second pins 332 of the first connection portion 311 are adapted to penetrate the driving circuit board 2000 to realize connection with the driving circuit board 2000; the third pins 333 of the first connection portion 311 are adapted to be inserted through the first busbar connection portion through holes 2014 on the first busbar connection portion 2011 to achieve connection with the first busbar 201.
Similarly, referring to fig. 10-16, the first pin 331 of the second connection leg 321 is adapted to be inserted through the second busbar connection portion through hole 2024 on the second busbar connection portion 2021 to achieve connection with the second busbar 202; the second pins 332 of the second connection pins 321 are adapted to penetrate the driving circuit board 2000 to realize connection with the driving circuit board 2000; the third pins 333 of the second connection leg 321 are adapted to penetrate through the third busbar connection portion through holes 2034 on the third busbar connection portion 2031 to achieve connection with the third busbar 203. The third busbar connection through holes 2034 on the third busbar connection 2031 on the first side of the busbar on the third busbar 203 are offset from the third busbar connection through holes 2034 on the third busbar connection 2031 on the second side of the busbar on the third busbar 203. As shown in fig. 10, the third busbar connection portion through holes 2034 on both sides of the third busbar 203 are not parallel to the short sides of the third busbar 203.
The stacking positions of the first busbar 201, the second busbar 202 and the third busbar 203 may be changed according to actual requirements. For example, the third busbar 203 may be located above the first busbar 201 and the second busbar 202, or may be located between the first busbar 201 and the second busbar 202.
Further, any one of the two pins in the same power structure 30 is connected to the corresponding busbar connection portion and is adjacent to or spaced apart from the other busbar connection portion side by side.
As shown in fig. 6-7, the first pin 331 of the first connection foot 311 is connected with the third busbar connection portion 2031 and is spaced apart from the first busbar connection portion 2011, and the third pin 333 of the first connection foot 311 is connected with the first busbar connection portion 2011 and is spaced apart from the third busbar connection portion 2031; the first pins 331 of the second connection feet 321 are connected with the second busbar connection portion 2021 and spaced apart from the third busbar connection portion 2031, and the third pins 333 of the second connection feet 321 are connected with the third busbar connection portion 2031 and spaced apart from the second busbar connection portion 2021.
In some alternative embodiments, any one of the two pins in the same power structure 30 is connected to a corresponding busbar connection, and the busbar connection through hole on one busbar connection is located outside the outline of the other busbar connection. As shown in fig. 6-7, the first pin 331 of the first connection portion 311 is connected to the third busbar connection portion 2031, and the third busbar connection portion through hole 2034 on the third busbar connection portion 2031 is located outside the outline of the first busbar connection portion 2011; the third pins 333 of the first connection portion 311 are connected to the first busbar connection portion 2011, and the first busbar connection portion through hole 2014 on the first busbar connection portion 2011 is located outside the outline of the third busbar connection portion 2031; the first pins 331 of the second connection feet 321 are connected with the second busbar connection portion 2021, and the second busbar connection portion through holes 2024 on the second busbar connection portion 2021 are located outside the outline of the third busbar connection portion 2031; the third pins 333 of the second connection leg 321 are connected to the third busbar connection portion 2031, and the third busbar connection portion through hole 2034 on the third busbar connection portion 2031 is located outside the outline of the second busbar connection portion 2021.
Referring to fig. 14-16, the remaining one pin of the same power structure 30 is adapted to be connected to the driving circuit board 2000, and the remaining one pin is directly connected to the driving circuit board 2000 in a form without shielding of a busbar connection portion. For example, the second pin 332 of the first power structure 31 is connected to the driving circuit board 2000, and no busbar connection portion is blocked between the second pin 332 of the first power structure 31 and the driving circuit board 2000; the second pins 332 of the second power structure 32 are connected with the driving circuit board 2000, and no busbar connection portion is blocked between the second pins 332 of the second power structure 32 and the driving circuit board 2000.
In some alternative embodiments, referring to fig. 1, 3, 6-7, 9-11, and 15, the same power structure 30 has a first pin 331, a second pin 332, and a third pin 333, where the third pin 333 is located between the first pin 331 and the second pin 332, and referring to fig. 2, 4, 8, and 16, the third pin 333 is located outside the first pin 331 and the second pin 332 with respect to the power structure 30, and the pins are staggered, so as to facilitate reasonably arranging connection points of the power structure 30 corresponding to the busbar. The gap between the first pin 331 and the second pin 332 allows one busbar connection to be inserted, and the busbar connection is penetratingly connected with the third pin 333.
For example, the gap between the first pin 331 and the second pin 332 of the first power structure 31 allows the first busbar connection 2011 to be inserted, and the first busbar connection 2011 is penetratingly connected with the third pin 333 of the first power structure 31. The gap between the first pin 331 and the second pin 332 of the second power structure 32 allows the third busbar connection 2031 to be inserted, and the third busbar connection 2031 is penetratingly connected with the third pin 333 of the second power structure 32.
Further, the busbar connection portion penetrating the first pin 331 and the busbar connection portion penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of busbars, for example, as shown in fig. 6 to 7, the third busbar connection portion 2031 penetrating the first pin 331 of the first power structure 31 and the first busbar connection portion 2011 penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of busbars; the second busbar connection portion 2021 penetrating the first pin 331 of the second power structure 32 and the third busbar connection portion 2031 penetrating the third pin 333 are partially laminated or staggered in the lamination direction of the plurality of busbars. The design ensures that the welding spots of the power structure and the metal busbar are positioned at the convex positions of the edges of the busbar, and when the traditional welding process is used, the welding heat can be well kept at the welding spots, and the threshold of the production process is lower, so that the traditional process can be used for mass production.
Referring to fig. 14-16, the second pins 332 of the first power structure 31 and the second pins 332 of the second power structure 32 are adapted to be directly connected to the driving circuit board 2000.
Specifically, one of the first busbar 201 and the second busbar 202 is a positive busbar and the other is a negative busbar. The third busbar 203 is a phase row. For example, the first busbar 201 is a positive busbar, the second busbar 202 is a negative busbar, or the first busbar 201 is a negative busbar and the second busbar 202 is a positive busbar.
Further, the power unit assembly 1000 may further include: a busbar clamp (not shown) for clamping the first busbar 201 and the second busbar 202, thereby facilitating the fitting of the first busbar 201 and the second busbar 202, and shortening the distance between the first busbar 201 and the second busbar 202, thereby further shortening the height dimension of the power unit assembly 1000.
In the embodiment shown in fig. 6 to 16, each of the first, second, and third bus bars 201, 202, and 203 is rectangular in shape, and the first, second, and third bus bars 201, 202, and 203 are arranged in a stack in the thickness direction of the bus bars, with bus bar connecting portions formed on the longitudinal long sides of the corresponding bus bars. Specifically, the first busbar connection 2011 is formed on a first side longitudinal long edge of the first busbar 201, the second busbar connection 2021 is formed on a second side longitudinal long edge of the second busbar 202, and the third busbar connection 2031 is formed on both side longitudinal long edges of the third busbar 203.
Referring to fig. 6-7 and 9-13, a first busbar transfer end plate 2012 is disposed at one end of the first busbar 201, a second busbar transfer end plate 2022 is disposed at one end of the second busbar 202, the first busbar transfer end plate 2012 and the second busbar transfer end plate 2022 are disposed at the same end and side by side, and a third busbar transfer end plate 2032 is disposed at the other end of the third busbar 203 opposite to the first busbar transfer end plate 2012, thereby facilitating a rational arrangement of the transfer end plates of the respective busbars.
In some alternative embodiments, the first busbar 201, the second busbar 202, and the third busbar 203 are each flat-plate busbars, thereby facilitating further reduction in the dimensions of the power cell assembly 1000 in the height direction.
In some embodiments, which may not be shown, the busbar connection portion is provided with a through slot allowing the pins to pass through, and the through slot extends in a direction away from the busbar and penetrates an outer edge of the busbar connection portion away from the busbar. For example, the through slot may be a "U" shaped slot with an opening facing outward, thereby facilitating threading or removal of the pins from the through slot.
In some alternative embodiments, the busbar surface is entirely covered with an insulating film.
In other alternative embodiments, the busbar includes: the busbar body and the busbar connecting portion, the busbar connecting portion protrusion corresponds at least one side edge of the busbar and the busbar connecting portion is directly connected with the corresponding busbar, the outer surface of the busbar connecting portion is coated with an insulating film, and the busbar bodies of two adjacent busbars are separated from each other. That is, the outer surface of the busbar connection portion may be coated with the insulating film, and the outer surface of the busbar body may not be coated with the insulating film, so that the busbar bodies of two adjacent busbars are only required to be separated from each other, thereby being beneficial to saving the material of the insulating film.
In yet other alternative embodiments, a busbar includes: the bus bar body, the whole cladding of surface of bus bar body has the insulating film, like this, when a plurality of bus bars range upon range of arrangement, insulating properties between two adjacent bus bars are good.
Further, the busbar further includes: the busbar connecting portion, the busbar connecting portion protrusion corresponds at least one side edge of busbar body and busbar connecting portion and corresponds busbar body direct link to each other, and the whole cladding of surface of busbar body and busbar connecting portion has the insulating film, and insulating film can prevent that busbar and other pins of power structure 30 from producing the electricity and being connected to insulating properties between two adjacent busbar is better.
Referring to fig. 6-16, the busbar bodies of two adjacent busbars are at least partially stacked, thereby facilitating a reduction in the volume of the power module 10000.
A converter power assembly 20000 according to an embodiment of the present invention is described in detail below in conjunction with fig. 17-20.
Referring to fig. 17-20, a frequency converter power assembly 20000 according to an embodiment of the present invention may include: the power module comprises a mounting frame 3000, a capacitor 3003 and a plurality of power modules 10000, wherein the mounting frame 3000 is provided with a plurality of mounting surfaces which are annularly arranged, the plurality of power modules 10000 are mounted on the corresponding mounting surfaces, and the capacitor 3003 is electrically connected with the power modules 10000. That is, the power modules 10000 are annularly arranged on the annular mounting frame 3000, so that the power modules 10000 are reasonably arranged, and meanwhile, a plurality of power modules 10000 can be installed on the same mounting frame 3000, so that the whole frequency converter power assembly 20000 is more compact in structure.
According to the frequency converter power assembly 20000 of the embodiment of the invention, the plurality of power modules 10000 are arranged on the plurality of mounting surfaces of the annular mounting frame 3000, and the capacitor 3003 is electrically connected with the power modules 10000, so that the whole frequency converter power assembly 20000 has a simple, compact and reasonable arrangement structure.
In some embodiments, the mounting frame 3000 is a polygonal column structure, and each side of the polygonal column is configured as a mounting surface, and the power modules 10000 are in one-to-one correspondence with the mounting surface, so that each side of the polygonal column is not coplanar, and thus each power module 10000 can be separated from each other and not interfere with each other, so that the power modules 10000 are reasonably arranged. In the embodiment shown in fig. 17 to 20, the mounting frame 3000 has a hexagonal prism structure, six sides of the hexagonal prism are all configured as mounting surfaces, the number of the power modules 10000 is six, and the six power modules 10000 are in one-to-one correspondence with the six mounting surfaces.
In the embodiment shown in fig. 17-18, the capacitor 3003 is mounted at the end of the mounting frame 3000, so that the length of the capacitor 3003 can be conveniently expanded to expand the specification of the capacitor 3003, and the length of the capacitor 3003 can be conveniently shortened to reduce the specification of the capacitor 3003, so that capacitors 3003 with different lengths can be selected according to the requirements of users.
Further, as shown in fig. 17-18, a first electrode plate 3006 and a second electrode plate 3007 are disposed between the mounting frame 3000 and the capacitor 3003, and the power module 10000 and the capacitor 3003 are electrically connected to the first electrode plate 3006 and the second electrode plate 3007. In other words, the first electrode plate 3006 and the second electrode plate 3007 are components for electrically connecting the power module 10000 and the capacitor 3003, and by providing the first electrode plate 3006 and the second electrode plate 3007, indirect electrical connection between the power module 10000 and the capacitor 3003 is achieved.
Specifically, the capacitor 3003 has a first terminal 30031 and a second terminal 30032, the first terminal 30031 being adapted to be electrically connected to the first plate 3006, the second terminal 30032 being adapted to be electrically connected to the second plate 3007. The first terminal 30031 and the second terminal 30032 of the capacitor 3003 are conductive portions, and other portions of the capacitor 3003 have insulating surfaces to enhance the safety of the capacitor 3003.
Further, the outer surfaces of the first electrode plate 3006 and the second electrode plate 3007 are entirely covered with an insulating film. When the insulating film can ensure that the first pole plate 3006 and the second pole plate 3007 are attached, the first pole plate 3006 and the second pole plate 3007 can be mutually insulated, so that the normal use of the frequency converter power assembly 20000 is prevented from being influenced due to short circuit between the first pole plate 3006 and the second pole plate 3007.
The first electrode plate 3006 is provided with a first capacitance connection portion 30063, and the first terminal 30031 is electrically connected to the first capacitance connection portion 30063; the second plate 3007 is provided with a second capacitance connection portion 30073, and the second terminal 30032 is electrically connected to the second capacitance connection portion 30073. That is, the first capacitance connection portion 30063 of the first electrode plate 3006 and the second capacitance connection portion 30073 of the second electrode plate 3007 are conductive portions, and other portions have insulating surfaces to enhance the use safety of the first electrode plate 3006 and the second electrode plate 3007.
Specifically, the first capacitor connection portion 30063 is a first capacitor connection hole formed on the first electrode plate 3006, the first terminal 30031 is configured to be convex, the first terminal 30031 is adapted to extend into the first capacitor connection hole, and the first terminal 30031 is adapted to be electrically connected to a wall of the first capacitor connection hole; the second capacitor connection portion 30073 is a second capacitor connection hole formed on the second plate 3007, the second terminal 30032 is configured to be convex, the second terminal 30032 is adapted to extend into the second capacitor connection hole, and the second terminal 30032 is adapted to be electrically connected to a wall of the second capacitor connection hole.
Optionally, the first electrode plate 3006 is located on a side of the second electrode plate 3007 facing the mounting frame 3000, as shown in fig. 17-18, the first electrode plate 3006 is located on a left side of the second electrode plate 3007, a first via hole 30064 adapted to avoid the second terminal 30032 is formed in the first electrode plate 3006, a second via hole 30074 adapted to avoid the first terminal 30031 is formed in the second electrode plate 3007, the first terminal 30031 is electrically connected to the first capacitor connecting hole after passing through the second via hole 30074, and the second terminal 30032 is electrically connected to the second capacitor connecting hole and then passes through the first via hole 30064. The walls of the first via hole 30064 and the second via hole 30074 are covered with an insulating film, so that the first terminal 30031 can be prevented from being electrically connected with the second via hole 30074 when passing through the second via hole 30074, and the second terminal 30032 can be prevented from being electrically connected with the first via hole 30064 when passing through the first via hole 30064, thereby improving the connection reliability of the capacitor 3003 and the first electrode plate 3006 and the second electrode plate 3007.
Referring to fig. 17 to 18, the end of the mounting frame 3000 facing the capacitor 3003 is a first end plate 3001, that is, the right end of the mounting frame 3000 is a first end plate 3001, and the capacitor 3003 is mounted on the first end plate 3001, thereby realizing mounting of the capacitor 3003 on the end of the mounting frame 3000.
In some embodiments, not shown, the first terminal plate 3001 is provided with a recess adapted to receive the first terminal 30031 and the second terminal 30032, and the first terminal 30031 and the second terminal 30032 may extend into the recess when the frequency converter power assembly 20000 is assembled, so that the first terminal 30031 and the second terminal 30032 may be prevented from interfering with the first terminal plate 3001.
Further, the frequency converter power assembly 20000 may further include: the capacitor fixing plate 3004, the capacitor fixing plate 3004 is disposed on a side, away from the first end plate 3001, of the capacitor 3003, as shown in fig. 17-18, the capacitor fixing plate 3004 is disposed on the right side of the capacitor 3003, the first end plate 3001 is provided with a mounting post 3005, and the mounting post 3005 is fastened and connected with the mounting post fastening nut 3010 after penetrating through the capacitor fixing plate 3004. The mounting posts 3005 indirectly connect the capacitor fixing plate 3004 to the first end plate 3001.
Referring to fig. 18, one or more capacitors 3003 may be provided. One end of the capacitor 3003 facing the capacitor fixing plate 3004 is provided with a capacitor fastening protrusion 3011, the capacitor fixing plate 3004 is provided with a protrusion penetrating hole 30041, the capacitor fastening protrusion 3011 is suitable for penetrating the protrusion penetrating hole 30041, and the outer circumferential surface of the capacitor fastening protrusion 3011 is provided with external threads so as to be fastened and connected with the capacitor fastening nut 3012, thereby realizing the fixation of the capacitor 3003 on the capacitor fixing plate 3004.
In the embodiment shown in fig. 19-20, capacitor 3003 is mounted to one side of mounting frame 3000. And the capacitor 3003 may be one or more.
Optionally, the capacitor 3003 is mounted to the top side of the mounting frame 3000, thereby ensuring that the mounting frame 3000 can support the capacitor 3003. Of course, in some embodiments not shown, capacitor 3003 may also be mounted to the bottom side of mount 3000.
Referring to fig. 19 to 20, the end of the mounting frame 3000 is provided with a first plate 3006 and a second plate 3007, and the power module 10000 and the capacitor 3003 are electrically connected to the first plate 3006 and the second plate 3007. The first plate 3006 may be disposed on a side of the second plate 3007 facing the mount 3000.
Further, the frequency converter power assembly 20000 may further include: the capacitor 3003 has a first terminal 30031 and a second terminal 30032, the first terminal 30031 is electrically connected to the first terminal 3017, and the second terminal 30032 is electrically connected to the second terminal 3018. The first terminal 30031 and the second terminal 30032 of the capacitor 3003 are conductive portions, and other portions of the capacitor 3003 have insulating surfaces to enhance the safety of the capacitor 3003. When the terminal is electrically connected with the corresponding terminal board, in some alternative embodiments, the end part of the terminal can be directly attached to the conductive part on the surface of the terminal board, so as to realize the electrical connection of the terminal and the corresponding terminal board; in other alternative embodiments, the terminal plate may be provided with a terminal hole, and the terminal may be inserted through the terminal hole and electrically connected to the hole wall of the terminal hole, so as to electrically connect the terminal with the terminal plate. Of course, the terminals and the corresponding terminal plates may be connected by wires.
Further, the first electrode plate 3006 is electrically connected to the first terminal plate 3017; the second electrode plate 3007 is electrically connected to the second terminal plate 3018.
Further, the first electrode plate 3006 is provided with a first capacitor connecting portion 30063, the first capacitor connecting portion 30063 is configured as a sheet structure protruding from the first electrode plate 3006, and the first terminal plate 3017 is electrically connected to the first capacitor connecting portion 30063; the second plate 3007 is provided with a second capacitance connection portion 30073, the second capacitance connection portion 30073 is configured as a sheet structure protruding from the second plate 3007, and the second terminal plate 3018 is electrically connected to the second capacitance connection portion 30073.
Specifically, the first terminal plate 3017 has a first terminal plate 30171, and the first terminal plate 30171 and the first capacitive connection portion 30063 are fixedly connected by a first capacitive fastener 3015 to achieve electrical connection of the first terminal plate 3017 to the first electrode plate 3006; the second terminal plate 3018 has a second terminal plate 30181, and the second terminal plate 30181 and the second capacitance connection portion 30073 are fixedly connected by a second capacitance fastener 3016 to achieve electrical connection of the second terminal plate 3018 and the second electrode plate 3007.
Referring to fig. 19, the mounting frame 3000 has one end being a first terminal plate 3001 and the other end being a second terminal plate 3002, the capacitor 3003 is supported on the first terminal plate 3017 and the second terminal plate 3018, one ends of the first terminal plate 3017 and the second terminal plate 3018 are supported on the first terminal plate 3001 by the first supporting element 3013, and the other ends of the first terminal plate 3017 and the second terminal plate 3018 are supported on the second terminal plate 3002 by the second supporting element 3014, thereby ensuring reliable positions of the capacitor 3003.
Referring to fig. 6, 17, and 19, the power module 10000 includes a first busbar 201 and a second busbar 202, the first busbar 201 is electrically connected to the first electrode plate 3006, and the second busbar 202 is electrically connected to the second electrode plate 3007.
Further, the first pole plate 3006 is provided with a first pole piece 30061, the first pole piece 30061 extends towards the power module 10000, and the first pole piece 30061 is adapted to be electrically connected to the first busbar 201; the second plate 3007 is provided with a second pole piece 30071, the second pole piece 30071 protrudes towards the power module 10000, and the second pole piece 30071 is adapted to be electrically connected to the second busbar 202.
Specifically, the first busbar 201 has a first busbar transfer end plate 2012, and the first pole piece 30061 is fixedly connected to the first busbar transfer end plate 2012 by a first bolt 30062 to electrically connect the first pole piece 30061 to the first busbar transfer end plate 2012. The second busbar 202 has a second busbar transfer end plate 2022, and the second pole piece 30071 is fixedly connected to the second busbar transfer end plate 2022 by a second bolt 30072 to electrically connect the second pole piece 30071 to the second busbar transfer end plate 2022.
The number of the power modules 10000, the first pole pieces 30061 and the second pole pieces 30071 is the same.
In some embodiments, not shown, the plurality of capacitors 3003 is a plurality, and the plurality of capacitors 3003 are annularly disposed about the outer periphery of the power module 10000.
Further, the plurality of capacitors 3003 are disposed in one-to-one opposition to the plurality of power modules 10000.
In the embodiment shown in fig. 17 and 19, the mounting frame 3000 has a first end plate 3001 at one end and a second end plate 3002 at the other end, fluid medium grooves 3009 are formed in the first end plate 3001 and the second end plate 3002, a fluid medium channel is formed between each power module 10000 and the mounting frame 3000, the fluid medium channel is in communication with the fluid medium grooves 3009, and a cooling medium can flow in the fluid medium channel and the fluid medium grooves 3009 to remove heat generated during operation of the power module 10000. Alternatively, the cooling medium may be a cooling liquid or a cooling gas. Under some cold conditions, the fluid medium channels and the fluid medium grooves 3009 can be filled with medium with higher temperature, so that the power module 10000 can be heated conveniently, the power module 10000 is in a proper temperature environment, and the service life of the power module 10000 can be prolonged.
In some alternative embodiments, the fluid medium grooves 3009 of the first end plate 3001, the fluid medium grooves 3009 of the second end plate 3002 are in series communication with a plurality of fluid medium channels. When the mounting frame 3000 is a hexagonal prism, the number of the fluid medium grooves 3009 of the first end plate 3001 and the number of the fluid medium grooves 3009 of the second end plate 3002 are six, and the flow direction of the cooling medium may be: the fluid medium channel 3009 of the second end plate 3002- & gt the fluid medium channel is formed between one power module 10000 and the mounting frame 3000- & gt the fluid medium channel 3009 of the first end plate 3001- & gt the fluid medium channel is formed between the adjacent one power module 10000 and the mounting frame 3000- & gt the fluid medium channel 3009 of the second end plate 3002- & gt the fluid medium channel is formed between the adjacent other power module 10000 and the mounting frame 3000- & gt the fluid medium channel 3009 of the first end plate 3001, until the fluid medium channel is formed between the six power modules 10000 and the mounting frame 3000 sequentially, and finally the fluid medium flows out of the fluid medium channel 3009 of the second end plate 3002.
In other alternative embodiments, the fluid medium grooves 3009 of the first end plate 3001, the fluid medium grooves 3009 of the second end plate 3002 are in parallel communication with a plurality of fluid medium channels.
The substrate 10 of the power module 10000 may be mounted on the mounting frame 3000, or the substrate 10 may be a part of the mounting frame 3000.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.

Claims (31)

1. A frequency converter power assembly, comprising:
a mounting bracket having a plurality of mounting surfaces arranged in a ring shape;
the power modules are arranged on the corresponding mounting surfaces;
the capacitor is electrically connected with the power module;
the mounting frame is of a polygonal column structure, each side face of the polygonal column is configured as the mounting face, and the power modules are in one-to-one correspondence with the mounting faces and extend along the axial direction of the polygonal column structure;
a first polar plate and a second polar plate are arranged between the mounting frame and the capacitor, and the power module and the capacitor are electrically connected with the first polar plate and the second polar plate;
wherein, the power module includes:
a base plate having a first side, the base plate mounted on the mounting bracket;
a tabletting structure located on the first side of the substrate;
a plurality of bus bars arranged in a stacked manner;
and the power structure is pressed against the first side surface by the pressing structure and is provided with a plurality of pins, and the pins are connected with the corresponding busbar and are electrically insulated from other busbars.
2. The transducer power assembly of claim 1, wherein the capacitor is mounted to an end of the mounting bracket.
3. The inverter power assembly of claim 1 wherein the capacitor has a first terminal and a second terminal, the first terminal adapted to be electrically connected to the first pole plate and the second terminal adapted to be electrically connected to the second pole plate.
4. The transducer power assembly of claim 3, wherein the outer surfaces of the first plate and the second plate are each integrally coated with an insulating film.
5. The frequency converter power assembly according to claim 3 or 4, wherein a first capacitive connection is provided on the first plate, the first terminal being electrically connected to the first capacitive connection; the second polar plate is provided with a second capacitance connecting part, and the second terminal is electrically connected with the second capacitance connecting part.
6. The transducer power assembly of claim 5, wherein the first capacitive connection is a first capacitive connection hole formed in the first plate, the first terminal being electrically connected to a wall of the first capacitive connection hole; the second capacitor connecting part is a second capacitor connecting hole formed on the second polar plate, and the second terminal is electrically connected with the hole wall of the second capacitor connecting hole.
7. The frequency converter power assembly according to claim 4, wherein the first electrode plate is located on a side, facing the mounting frame, of the second electrode plate, a first through hole adapted to avoid the second terminal is formed in the first electrode plate, a second through hole adapted to avoid the first terminal is formed in the second electrode plate, and the insulating film is coated on the walls of the first through hole and the second through hole.
8. The transducer power assembly of claim 2, wherein an end of the mounting bracket facing the capacitor is a first end plate, the capacitor being mounted on the first end plate.
9. The frequency converter power assembly of claim 8, further comprising: the capacitor fixing plate is arranged on one side, deviating from the first end plate, of the capacitor, a mounting column is arranged on the first end plate, and the mounting column penetrates through the capacitor fixing plate and then is fastened and connected with the mounting column fastening nut.
10. The frequency converter power assembly according to claim 9, wherein a capacitor fastening protrusion is arranged at one end of the capacitor facing the capacitor fixing plate, a protrusion penetrating hole is formed in the capacitor fixing plate, and the capacitor fastening protrusion is suitable for penetrating the protrusion penetrating hole and is fastened and connected with a capacitor fastening nut.
11. The transducer power assembly of claim 1, wherein the capacitor is mounted to one side of the mounting frame.
12. The transducer power assembly of claim 11, wherein the capacitor is mounted to a top side of the mounting frame.
13. The transducer power assembly of claim 11, wherein the end of the mounting bracket is provided with a first pole plate and a second pole plate, and the power module and the capacitor are electrically connected to the first pole plate and the second pole plate.
14. The frequency converter power assembly of claim 13, further comprising: the capacitor has a first terminal electrically connected to the first terminal plate and a second terminal electrically connected to the second terminal plate.
15. The inverter power assembly of claim 14 wherein the first plate is electrically connected to the first terminal plate and the second plate is electrically connected to the second terminal plate.
16. The frequency converter power assembly of claim 15, wherein a first capacitive connection is provided on the first plate, the first terminal plate being electrically connected to the first capacitive connection; the second polar plate is provided with a second capacitance connecting part, and the second terminal plate is electrically connected with the second capacitance connecting part.
17. The inverter power assembly of claim 16 wherein the first terminal plate has a first terminal plate fixedly connected to the first capacitive connection portion by a first capacitive fastener; the second terminal plate is provided with a second terminal plate, and the second terminal plate is fixedly connected with the second capacitance connecting part through a second capacitance fastening piece.
18. The inverter power assembly of claim 14 wherein the mounting bracket has a first end plate and a second end plate at one end, the capacitor being supported on the first and second terminal plates, the first and second terminal plates being supported on the first end plate by a first support element and on the second end plate by a second support element.
19. The frequency converter power assembly of claim 1 or 13, wherein the power module has a first busbar electrically connected to the first pole plate and a second busbar electrically connected to the second pole plate.
20. The frequency converter power assembly of claim 19, wherein a first pole piece is disposed on the first pole plate, the first pole piece extending toward the power module and adapted to be electrically connected to the first busbar; the second polar plate is provided with a second polar plate, and the second polar plate extends towards the power module and is suitable for being electrically connected with the second busbar.
21. The converter power assembly of claim 20, wherein the first busbar has a first busbar transfer end plate, the first pole piece being fixedly connected to the first busbar transfer end plate by a first bolt; the second busbar is provided with a second busbar switching end plate, and the second pole piece is fixedly connected with the second busbar switching end plate through a second bolt.
22. The frequency converter power assembly of claim 1, wherein the plurality of capacitors is arranged in a ring around the outer periphery of the power module.
23. The inverter power assembly of claim 22 wherein a plurality of said capacitors are disposed in one-to-one opposition to a plurality of said power modules.
24. The frequency converter power assembly of claim 1, wherein the mounting bracket has a first end plate at one end and a second end plate at the other end, the first and second end plates having fluid medium channels therein, each of the power modules and the mounting bracket defining a fluid medium channel therebetween, the fluid medium channel in communication with the fluid medium channel.
25. The transducer power assembly of claim 24, wherein the fluid medium slot of the first end plate and the fluid medium slot of the second end plate are in series communication with a plurality of the fluid medium channels.
26. The transducer power assembly of claim 24, wherein the fluid medium slot of the first end plate and the fluid medium slot of the second end plate are in parallel communication with a plurality of the fluid medium channels.
27. The inverter power assembly of claim 1 further comprising a retaining structure configured to retain the tabletting structure on the first side of the substrate.
28. The frequency converter power assembly of claim 1, wherein,
the power structure comprises: a first power structure and a second power structure, the first power structure and the second power structure being spaced apart;
the tabletting structure comprises: the preforming body and preforming arm, the preforming arm connect in the preforming body and be used for pressing to the power structure, the preforming arm includes: the first tabletting arm is used for pressing against the first power structure, the second tabletting arm is used for pressing against the second power structure, and the tabletting body is located between the first power structure and the second power structure.
29. The frequency converter power assembly of claim 28, wherein the first power structure has a first connection leg and the second power structure has a second connection leg, the first and second connection legs being located on opposite outer sides of the first and second power structures, respectively, and the compression body being located between opposite inner sides of the first and second power structures.
30. The inverter power assembly of claim 28 wherein the blade body is formed as a concave channel structure concave toward the first side, the opening of the blade body faces away from the first side, the first and second blade arms are connected at opposite ends of the opening of the blade body, and the first and second blade arms extend away from each other.
31. The frequency converter power assembly of claim 1, wherein the busbar comprises: first female row, second are female to be arranged and the female row of third, the one end of first female row is provided with first female row switching end plate, the one end of second female row is provided with the female row switching end plate of second, first female row switching end plate with the female row switching end plate of second is located same one end and sets up side by side, the other end of third female row with first female row switching end plate is relative is provided with the female row switching end plate of third.
CN202010252290.4A 2020-04-01 2020-04-01 Frequency converter power assembly Active CN113497543B (en)

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CN103872924A (en) * 2014-02-21 2014-06-18 航天科工海鹰集团有限公司 Variable frequency controller and anti-explosion variable frequency motor with same
WO2015128571A1 (en) * 2014-02-25 2015-09-03 Valeo Equipements Electriques Moteur Bank of capacitors for an automotive vehicle electronic power module
CN208386458U (en) * 2018-07-06 2019-01-15 苏州汇川联合动力系统有限公司 Drive motor controller and electric car
CN109548367A (en) * 2018-11-13 2019-03-29 杭州富特科技股份有限公司 Heat conductive insulating structure for multiple heating elements
CN209731002U (en) * 2018-11-26 2019-12-03 中国科学院电工研究所 A kind of integrated system of motor and controller
CN209806324U (en) * 2019-03-06 2019-12-17 珠海英搏尔电气股份有限公司 Motor controller and electric vehicle

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US10027251B2 (en) * 2016-01-05 2018-07-17 Atse, Llc Power converter

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103872924A (en) * 2014-02-21 2014-06-18 航天科工海鹰集团有限公司 Variable frequency controller and anti-explosion variable frequency motor with same
WO2015128571A1 (en) * 2014-02-25 2015-09-03 Valeo Equipements Electriques Moteur Bank of capacitors for an automotive vehicle electronic power module
CN208386458U (en) * 2018-07-06 2019-01-15 苏州汇川联合动力系统有限公司 Drive motor controller and electric car
CN109548367A (en) * 2018-11-13 2019-03-29 杭州富特科技股份有限公司 Heat conductive insulating structure for multiple heating elements
CN209731002U (en) * 2018-11-26 2019-12-03 中国科学院电工研究所 A kind of integrated system of motor and controller
CN209806324U (en) * 2019-03-06 2019-12-17 珠海英搏尔电气股份有限公司 Motor controller and electric vehicle

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