CN113480191A - Glass surface treating agent, substrate, preparation method of substrate and display panel - Google Patents
Glass surface treating agent, substrate, preparation method of substrate and display panel Download PDFInfo
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- CN113480191A CN113480191A CN202110675340.4A CN202110675340A CN113480191A CN 113480191 A CN113480191 A CN 113480191A CN 202110675340 A CN202110675340 A CN 202110675340A CN 113480191 A CN113480191 A CN 113480191A
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- substrate
- glass
- glass substrate
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- adhesive layer
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- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 239000011521 glass Substances 0.000 title claims abstract description 100
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims abstract description 44
- 230000008878 coupling Effects 0.000 claims abstract description 34
- 238000010168 coupling process Methods 0.000 claims abstract description 34
- 238000005859 coupling reaction Methods 0.000 claims abstract description 34
- 239000012790 adhesive layer Substances 0.000 claims abstract description 32
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 17
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 13
- 239000004094 surface-active agent Substances 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000008367 deionised water Substances 0.000 claims abstract description 11
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 11
- 230000002378 acidificating effect Effects 0.000 claims abstract description 7
- 239000007822 coupling agent Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000012756 surface treatment agent Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 7
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- -1 polyoxyethylene Polymers 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 3
- 235000019387 fatty acid methyl ester Nutrition 0.000 claims description 3
- 239000002736 nonionic surfactant Substances 0.000 claims description 3
- 150000002191 fatty alcohols Chemical class 0.000 claims description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 229920000056 polyoxyethylene ether Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229940051841 polyoxyethylene ether Drugs 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical group CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention provides a glass surface treating agent, a substrate, a preparation method of the substrate and a display panel. The glass surface treating agent comprises a silane coupling agent, a surfactant and acidic deionized water. The silane coupling agent is a mercapto coupling agent. The substrate is prepared by the preparation method of the substrate. The substrate comprises a glass substrate, a coupling adhesive layer and a metal layer, wherein the coupling adhesive layer is prepared by using the glass surface treating agent.
Description
Technical Field
The invention relates to the glass substrate manufacturing industry, in particular to a glass surface treating agent, a substrate, a preparation method of the substrate and a display panel.
Background
The metal electrode is used as a conduction path of all signals in a TFT (Thin Film Transistor) panel, and the performance of the metal electrode also has a crucial influence on the final display effect of the display panel.
Early display panel fabrication metal wiring techniques generally employed aluminum, or multi-layer metals based on aluminum (e.g., molybdenum/aluminum/molybdenum tri-layer structures). However, since the resistivity of aluminum is high (2.658 Ω · m), when the display panel is moving toward large size, high resolution and high driving frequency, the problems of signal delay and insufficient charging, which are exhibited by aluminum wires, become bottlenecks that restrict the further development of the panel display technology.
Since 2014, panel manufacturers at home and abroad began to introduce a copper process in the production process, i.e., a process technology using a copper wire instead of an aluminum wire. Copper has relatively low resistivity (1.678 omega. m) and low price, and the panel applying the copper process can greatly improve the signal addressing speed, has more dense scanning lines and clearer display effect, and promotes the further development of the display technology.
In practical production, due to the weaknesses of the copper wire such as easy oxidation, easy diffusion, and poor adhesion with glass, other metal buffer layers are usually introduced below or above and below the copper wire to form a multi-layer metal structure, such as a copper/molybdenum structure. However, the multi-layer metal structure not only increases the difficulty of the manufacturing process and prolongs the production time, but also puts higher requirements on the etching of the metal wire. When the multilayer metal is immersed in the etching solution, the galvanic cell is generated, and the etching rate of the corresponding metal film layer is changed, so that a plurality of substances are required to be added into the etching solution to carefully adjust the chemical reaction generated in the metal patterning process, and the edge of the metal wiring is enabled to form a structure with a certain gradient angle. The large-area, uniform and fine etching has high requirements on the etching solution, and the corresponding product price is high, which results in the increase of the panel manufacturing cost.
Disclosure of Invention
The invention aims to provide a glass surface treating agent, a substrate, a preparation method of the substrate and a display panel, and aims to solve the technical problems of poor adhesion between a copper wire and glass, high processing difficulty of a copper wire substrate, long production time, high etching difficulty, high production cost and the like in the prior art.
In order to achieve the purpose, the invention provides a glass surface treating agent, which comprises 0.1-30% of silane coupling agent, 0.1-30% of surfactant and the balance of acidic deionized water by mass percent. Wherein the silane coupling agent is a mercapto coupling agent.
Furthermore, the silane coupling agent contains hydroxyl groups, and the surfactant is a nonionic surfactant.
Further, the silane coupling agent is at least one of 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyltriethoxysilane.
Further, the surfactant is at least one of alkylphenol ethoxylate, fatty alcohol ethoxylate and fatty acid methyl ester ethoxylate.
Further, the pH value of the acidic deionized water is 4-6.
The invention also provides a preparation method of the substrate, which comprises the following steps:
forming a coupling adhesive layer on one surface of the glass substrate using the glass surface treatment agent as described above; and forming a metal layer on one surface of the coupling adhesive layer far away from the glass substrate.
Further, the step of forming a coupling adhesive layer on one surface of the glass substrate includes the steps of:
cleaning the glass substrate; moving the glass substrate into a treatment tank, and spraying the glass surface treatment agent towards the glass substrate for 1-600 seconds, and/or soaking the glass substrate in the glass surface treatment agent for 1-600 seconds; cleaning the glass surface treating agent left on the surface of the glass substrate; and carrying out drying treatment and drying treatment on the glass substrate.
Further, the metal layer is made of copper.
The embodiment of the invention also provides a substrate which is prepared by adopting the preparation method of the substrate. The substrate comprises a glass substrate, a coupling adhesive layer and a metal layer. The coupling adhesive layer is arranged on one surface of the glass substrate and contains a mercapto group. The metal layer is arranged on one surface of the coupling adhesive layer, which is far away from the glass substrate.
The invention also provides a display panel, which comprises the substrate.
The invention has the advantages that:
the glass surface treating agent provided by the invention comprises a mercapto group and a hydroxyl group, wherein the hydroxyl group can enable a formed coupling bonding layer to be tightly combined with a glass substrate, and the mercapto group can enable the coupling bonding layer to be tightly combined with a metal layer, so that the bonding force between the glass substrate and the metal layer is increased, the problem of poor adhesion between the glass substrate and the metal layer is solved, the stability of the substrate and the conductivity of metal wiring are improved, and the display effect of a display panel is further improved.
According to the substrate preparation method provided by the invention, the coupling adhesive layer is formed by using the glass surface treating agent, so that the adhesive force between the glass substrate and the metal layer can be increased, the substrate preparation steps can be simplified, other metal buffer layers (such as molybdenum, titanium and the like) are not required to be introduced to form a plurality of metal layers, the metal layer preparation difficulty is reduced, the production time is shortened, the production efficiency is further improved, and the production cost is reduced. In addition, electrochemical effect is not required to be considered when the metal layer is patterned, and only simple etching solution is used for etching, so that the production cost can be further reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of a layered structure of a substrate according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a substrate preparation method according to an embodiment of the invention.
The components in the figures are represented as follows:
a substrate 1; a glass substrate 11;
a coupling adhesive layer 12; a metal layer 13.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms used in the description of the present invention are only used to describe specific embodiments, and are not intended to show the concept of the present invention. Unless the context clearly dictates otherwise, expressions used in the singular form encompass expressions in the plural form. In the present specification, it is to be understood that terms such as "comprising," "having," and "containing" are intended to specify the presence of stated features, integers, steps, acts, or combinations thereof, as taught in the present specification, and are not intended to preclude the presence or addition of one or more other features, integers, steps, acts, or combinations thereof. Like reference symbols in the various drawings indicate like elements.
The context clearly dictates otherwise that all of the method steps described herein may be performed in any suitable order. The present invention is not limited to the order of steps described. The use of any and all examples, or exemplary language (e.g., "such as") provided herein, is intended merely to better illuminate the inventive concept and does not pose a limitation on the scope of the inventive concept unless otherwise claimed. Various modifications and adaptations will be apparent to those skilled in the art without departing from the spirit and scope.
The embodiment of the invention provides a glass surface treating agent, which comprises 0.1-30% of silane coupling agent, 0.1-30% of surfactant and the balance of deionized water by mass percent.
Preferably, the glass surface treatment agent comprises 0.1-3% of silane coupling agent and 0.1-3% of surfactant.
The silane coupling agent is a mercapto coupling agent, and further comprises a hydroxyl group. Specifically, the silane coupling agent can be KH-580 (3-mercaptopropyltrimethoxysilane) or KH-590 (3-mercaptopropyltriethoxysilane). Preferably, the silane coupling agent is KH-590 (3-mercaptopropyltriethoxysilane).
The hydroxyl group in the silane coupling agent is capable of forming a ceramic bond on the surface of the glass, thereby being tightly bonded to the surface of the glass. The reactive group-mercapto group in the silane coupling agent is exposed, so that the adhesive force between the glass surface and the metal can be increased.
The surfactant is a nonionic surfactant. Specifically, the surfactant may be at least one of alkylphenol ethoxylates, fatty alcohol-polyoxyethylene ethers, and fatty acid methyl ester ethoxylates. Wherein, the alkylphenol polyoxyethylene ether can be nonylphenol polyoxyethylene ether or octylphenol polyoxyethylene ether. The surfactant can improve the uniformity of a film layer on the surface of glass, so that the problems that the surface of the glass after treatment is not smooth and metal wiring short circuit is easy to occur are solved.
The deionized water is acidic deionized water, and the pH value of the deionized water can be adjusted to 4-6 by adding acetic acid to form the acidic deionized water.
In the embodiment of the present invention, a substrate 1 is provided, as shown in fig. 1, the substrate 1 includes a glass substrate 11, a coupling adhesive layer 12, and a metal layer 13.
The coupling adhesive layer 12 covers one surface of the glass substrate 11, and the metal layer 13 is disposed on one surface of the coupling adhesive layer 12 away from the glass substrate 11. The metal material adopted by the metal layer 13 is elemental metal copper, and the coupling adhesive layer 12 is prepared by the glass surface treating agent.
Since the coupling adhesive layer 12 is prepared by using the glass surface treatment agent, the coupling adhesive layer 12 also has a hydroxyl group and a thiol group. The hydroxyl group can enable the coupling adhesive layer 12 to be tightly combined with the surface of the glass substrate 11, and the sulfhydryl group can enable the coupling adhesive layer 12 to be tightly attached to the surface of the copper metal layer 13, so that the coupling adhesive layer 12 can increase the adhesive force between the metal copper in the metal layer 13 and the glass substrate 11.
The glass substrate 11 provided in the embodiment of the present invention may be applied to a display panel, for example, an array substrate in the display panel, the glass substrate 11 may be used as a substrate layer in the array substrate, and the metal layer 13 may be used as a conductive trace in the array substrate.
The embodiment of the present invention further provides a method for preparing the substrate 1, which is used for preparing the substrate 1, and the preparation flow is shown in fig. 2, and the method for preparing the substrate 1 specifically includes the following implementation steps:
step S10) cleaning the glass substrate 11:
spraying a large amount of clear water onto the glass substrate 11 to clean dust and impurities on the glass substrate 11.
Step S20) forming the coupling adhesive layer 12:
moving the cleaned glass substrate 11 into a treatment tank having the glass surface treatment agent as described above; soaking the glass substrate 11 in the glass surface treatment agent for 1-600 seconds, preferably for 5-30 seconds; alternatively, the glass surface treatment agent may be sprayed onto the surface of the glass substrate 11 by spraying for 1 to 600 seconds, preferably for 5 to 30 seconds; or, the surface of the glass substrate 11 may be treated twice by spraying the glass surface treating agent and soaking in the glass surface treating agent in sequence.
Moving the glass substrate 11 soaked or sprayed with the glass surface treating agent into a cleaning tank, and spraying deionized water to clean the glass substrate 11 so as to remove the residual glass surface treating agent on the surface of the glass substrate 11.
After the cleaning, the glass substrate 11 is subjected to air knife machine to remove the residual liquid on the surface.
And drying the glass substrate 11 dried by the air knife machine to form the coupling adhesive layer 12. Wherein the drying temperature in the drying treatment is 100-. Preferably, the drying temperature is 110-160 ℃, and the drying time is 60-180 seconds.
Step S30) forms the metal layer 13:
depositing or evaporating a layer of elemental metal copper on one surface of the coupling adhesive layer 12 away from the glass substrate 11, and etching the layer of elemental metal copper to pattern the elemental metal copper to form a metal layer 13 with a lead pattern, thereby completing the preparation of the substrate 1 shown in fig. 1.
The glass surface treatment agent provided by the embodiment of the invention can form a coupling adhesive layer 12 capable of increasing the adhesive force between metal copper and the glass substrate 11 on the surface of the glass substrate 11. The glass surface treatment agent contains a mercapto group and a hydroxyl group, and thus, the coupling adhesive layer 12 contains a mercapto group and a hydroxyl group. The hydroxyl group can enable the coupling adhesive layer 12 to be tightly combined with the glass substrate 11, and the mercapto group can enable the coupling adhesive layer 12 to be tightly combined with elemental metal copper, so that the adhesive force between the glass substrate 11 and the elemental metal copper is increased, the problem of poor adhesion between the glass substrate 11 and the elemental metal copper is solved, the stability of the substrate 1 and the metal wiring conductivity are improved, and the display effect of the display panel is further improved.
In the preparation method of the substrate 1 provided by the embodiment of the invention, the coupling adhesive layer 12 is formed by using the glass surface treating agent, so that the adhesive force between the glass substrate 11 and the metal layer 13 can be increased, the preparation steps of the substrate 1 can be simplified, other metal buffer layers (such as molybdenum, titanium and the like) are not required to be introduced to be combined with the copper metal layer 13 to form the multi-layer metal layer 13, the process difficulty of the metal layer 13 is reduced, the production time is shortened, the production efficiency is further improved, and the production cost is reduced. Moreover, the metal layer 13 is patterned without considering the electrochemical effect, and only a simple etching solution is used for etching, so that the production cost can be further reduced.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (9)
1. The glass surface treating agent is characterized by comprising the following components in percentage by mass:
0.1 to 30 percent of silane coupling agent;
0.1 to 30 percent of surfactant;
the balance of acidic deionized water;
wherein the silane coupling agent is a mercapto coupling agent;
the surfactant is at least one of alkylphenol polyoxyethylene, fatty alcohol polyoxyethylene and fatty acid methyl ester polyoxyethylene.
2. The glass surface treatment agent according to claim 1,
the silane coupling agent contains hydroxyl groups;
the surfactant is a nonionic surfactant.
3. The glass surface treatment agent according to claim 1, wherein the silane coupling agent is at least one of 3-mercaptopropyltrimethoxysilane and 3-mercaptopropyltriethoxysilane.
4. The glass surface treatment agent according to claim 1, wherein the acidic deionized water has a pH of 4 to 6.
5. A method for preparing a substrate is characterized by comprising the following steps:
forming a coupling adhesive layer on a surface of the glass substrate using the glass surface treatment agent according to any one of claims 1 to 4;
and forming a metal layer on one surface of the coupling adhesive layer far away from the glass substrate.
6. The method of manufacturing a substrate according to claim 5, wherein the step of forming a coupling adhesive layer on one surface of the glass substrate comprises the steps of:
cleaning the glass substrate;
moving the glass substrate into a treatment tank, and spraying the glass surface treatment agent towards the glass substrate for 1-600 seconds, and/or soaking the glass substrate in the glass surface treatment agent for 1-600 seconds;
cleaning the glass surface treating agent left on the surface of the glass substrate;
and carrying out drying treatment and drying treatment on the glass substrate.
7. The method according to claim 5, wherein a material of the metal layer is copper.
8. A substrate prepared by the method for preparing a substrate according to any one of claims 5 to 7;
the substrate includes:
a glass substrate;
the coupling adhesive layer is arranged on one surface of the glass substrate and contains a mercapto group;
and the metal layer is arranged on one surface of the coupling adhesive layer, which is far away from the glass substrate.
9. A display panel comprising the substrate according to claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110675340.4A CN113480191A (en) | 2021-06-18 | 2021-06-18 | Glass surface treating agent, substrate, preparation method of substrate and display panel |
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| CN202110675340.4A CN113480191A (en) | 2021-06-18 | 2021-06-18 | Glass surface treating agent, substrate, preparation method of substrate and display panel |
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| CN112928029A (en) * | 2021-01-25 | 2021-06-08 | 佛山睿科微电子科技中心(有限合伙) | Method for improving binding force between glass substrate and metal circuit |
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2021
- 2021-06-18 CN CN202110675340.4A patent/CN113480191A/en active Pending
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| CN101218311A (en) * | 2005-06-20 | 2008-07-09 | 陶氏环球技术公司 | Protective coating for window glass |
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| CN112928029A (en) * | 2021-01-25 | 2021-06-08 | 佛山睿科微电子科技中心(有限合伙) | Method for improving binding force between glass substrate and metal circuit |
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