CN113471124B - Automatic wafer arranging machine based on semiconductor packaging - Google Patents
Automatic wafer arranging machine based on semiconductor packaging Download PDFInfo
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- CN113471124B CN113471124B CN202111032341.3A CN202111032341A CN113471124B CN 113471124 B CN113471124 B CN 113471124B CN 202111032341 A CN202111032341 A CN 202111032341A CN 113471124 B CN113471124 B CN 113471124B
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- electric telescopic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
Abstract
The invention discloses an automatic wafer arranging machine for semiconductor packaging, which relates to the technical field of semiconductor packaging and comprises a fixed frame, a feeding mechanism arranged on the left side of the fixed frame and used for conveying lead frame pieces, a transferring mechanism arranged above the right end of the feeding mechanism and a placing box arranged on the right side of the transferring mechanism and used for receiving the lead frame pieces, wherein a receiving mechanism used for placing the placing box is arranged on the right side of the fixed frame. According to the invention, the carrying mechanism firstly clamps the placing box and then drives the placing box to move, so that the placing box carries the lead frame sheets transferred by the transferring mechanism from the feeding mechanism, and the sheet arrangement of the lead frame sheets is realized by replacing manpower, thereby greatly improving the sheet arrangement efficiency of the lead frame sheets.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to an automatic wafer arranging machine based on semiconductor packaging.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip.
When the semiconductor is packaged, the lead frame pieces need to be arranged, and most of the existing arranging pieces are manually arranged, so that the arranging efficiency of the lead frame pieces is low.
Disclosure of Invention
The invention aims to solve the problems of the prior art, and provides an automatic wafer arranging machine for semiconductor packaging.
In order to achieve the purpose, the invention adopts the following technical scheme:
the automatic wafer arranging machine for semiconductor packaging comprises a fixing frame, a feeding mechanism, a transfer mechanism and a placing box, wherein the feeding mechanism is arranged on the left side of the fixing frame and used for conveying lead frame sheets, the transfer mechanism is arranged above the right end of the feeding mechanism, the placing box is arranged on the right side of the transfer mechanism and used for receiving the lead frame sheets, and a receiving mechanism used for placing the placing box is arranged on the right side of the fixing frame;
the left end and the right end of the bottom of the placing box are respectively provided with a convex block;
the supporting mechanism comprises a guide seat and a supporting plate which is arranged in the middle of the guide seat in a sliding mode through a second electric telescopic rod, the guide seat is arranged on the positioning seat in a front-back sliding mode, a first lead screw is arranged in the positioning seat in a rotating mode, a first threaded seat is arranged on the first lead screw, the top of the first threaded seat is connected with the bottom of the guide seat, the first lead screw is driven by a first motor, the positioning seat is arranged in a fixing frame in a rotating mode, a rotating rod at the bottom of the positioning seat is driven by a second motor, and the center of the rotating rod is flush with the middle of the output end of the feeding mechanism;
the utility model discloses a quick-witted, including the guide holder, the guide holder left and right sides rotates respectively and is provided with the diaphragm, second electric telescopic handle is located between two diaphragms, two one side that second electric telescopic handle was kept away from to the diaphragm sliding connection respectively has the riser that is used for pressing from both sides tight lug, the riser rotates with the guide holder to be connected, the diaphragm is close to and is provided with first reset spring between second electric telescopic handle one end lower part and the guide holder, it is provided with the pole of smashing that is close to second electric telescopic handle one end contact with the diaphragm to accept the board bottom, the diaphragm is close to second electric telescopic handle one end top and has seted up the slide rail, it rotates to smash the pole bottom and is provided with the gyro wheel, the riser is close to one side slip of diaphragm and is provided with articulated seat, articulated seat is articulated with the diaphragm.
Further, feeding mechanism is including the conveyer belt that is used for carrying the lead frame piece, evenly be provided with a plurality of T type bosss on the conveyer belt, the right-hand member of conveyer belt is provided with the limiting plate, the embedded pressure sensor that is equipped with of limiting plate, the limiting plate left side slides and is provided with the trigger plate that is used for triggering pressure sensor, be provided with second reset spring between trigger plate and the pressure sensor, the pressure sensor output is connected with treater input electricity, the treater output is connected with controller input electricity, the controller output is connected with the control motor electricity of conveyer belt.
Further, transport mechanism is including rotating the suction disc that sets up in the commentaries on classics board at the mount top, set up in the first electric telescopic handle of commentaries on classics board bottom one side and set up in first electric telescopic handle bottom, the one side of keeping away from first electric telescopic handle at commentaries on classics board top is provided with the pivot, the pivot is passed through third motor drive, the suction disc bottom is provided with a plurality of suction inlets, suction inlet and external air supply device intercommunication, first electric telescopic handle and external air supply device all are connected with the output electricity of controller.
Further, a board feeding area for supplying the placing boxes is arranged on the front side of the bearing mechanism, a board discharging area for transferring out the placing boxes is arranged on the rear side of the bearing mechanism, and conveying mechanisms are arranged between the bearing mechanism and the board feeding area and between the bearing mechanism and the board discharging area.
Further, conveying mechanism specifically is two L type carriage that the symmetry set up, two be provided with even board between the L type carriage top, L type carriage top is provided with second screw thread seat, second screw thread seat middle part is provided with the second lead screw, the second lead screw rotates and sets up in the fixed bolster top, the second lead screw passes through fourth motor drive.
Furthermore, a plurality of placing grooves for placing the lead frame sheets are symmetrically arranged on the left side and the right side of the upper surface of the placing box.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the carrying mechanism firstly clamps the placing box and then drives the placing box to move, so that the placing box carries the lead frame sheets transferred by the transferring mechanism from the feeding mechanism, and the sheet arrangement of the lead frame sheets is realized by replacing manpower, thereby greatly improving the sheet arrangement efficiency of the lead frame sheets.
Drawings
Fig. 1 is a front view of an overall structure of an automatic wafer arranging machine for semiconductor packaging according to the present invention;
FIG. 2 is an extreme position view of a front view of the overall structure of an automatic wafer arranging machine for semiconductor packaging according to the present invention;
FIG. 3 is a schematic diagram of the internal mechanism of a feeding mechanism of an automatic wafer arranging machine for semiconductor packaging according to the present invention;
FIG. 4 is a position diagram of the placing box contacting the receiving plate and not separating from the L-shaped conveying frame in the automatic chip arranging machine for semiconductor packaging according to the present invention;
FIG. 5 is a schematic view of the position of the placing box in contact with the receiving plate and the placing box separated from the L-shaped conveying frame in the automatic sheet arranging machine for semiconductor packaging according to the present invention;
FIG. 6 is a schematic view of the position of the placing box in contact with the receiving plate and not fixed to the guide base in the automatic sheet arranging machine for semiconductor packaging according to the present invention;
FIG. 7 is a schematic view of the interior of the cross board and the riser of the automatic wafer arranging machine for semiconductor packaging according to the present invention;
FIG. 8 is an extreme position view of FIG. 7;
fig. 9 is a position diagram of a placement box for placing lead frame pieces on the left front end of the placement box in the automatic die bonder for semiconductor packaging according to the present invention;
fig. 10 is a view showing a position of a lead frame chip placed on the left rear end of a placing case in an automatic die bonder for semiconductor packages according to the present invention;
fig. 11 is a position diagram of a placement cassette for placing lead frame pieces on the right front end of the placement cassette in the automatic die bonder for semiconductor packages according to the present invention.
In the figure: 1. a fixed mount; 2. a feeding mechanism; 21. a conveyor belt; 22. a T-shaped boss; 23. a limiting plate; 24. a pressure sensor; 25. a trigger plate; 3. a transfer mechanism; 31. sucking a plate; 32. a first electric telescopic rod; 33. rotating the plate; 4. placing the box; 41. a bump; 5. a carrying mechanism; 51. a guide seat; 52. a bearing plate; 53. tamping the press rod; 54. a transverse plate; 55. a vertical plate; 56. positioning seats; 57. a first lead screw; 58. a first threaded seat; 6. a conveying mechanism; 61. an L-shaped conveying frame; 7. a lead frame sheet; 8. a board inlet area; 9. and (4) a plate outlet area.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1-11, the automatic wafer arranging machine for semiconductor packaging comprises a fixed frame 1, a feeding mechanism 2 arranged on the left side of the fixed frame 1 and used for conveying lead frame pieces 7, a transferring mechanism 3 arranged above the right end of the feeding mechanism 2, and a placing box 4 arranged on the right side of the transferring mechanism 3 and used for receiving the lead frame pieces 7, wherein a receiving mechanism 5 used for placing the placing box 4 is arranged on the right side of the fixed frame 1;
the left end and the right end of the bottom of the placing box 4 are respectively provided with a convex block 41;
the receiving mechanism 5 comprises a guide seat 51 and a receiving plate 52 which is arranged in the middle of the guide seat 51 in a sliding manner through a second electric telescopic rod, the guide seat 51 is arranged on a positioning seat 56 in a front-back sliding manner, a first screw rod 57 is arranged in the positioning seat 56 in a rotating manner, a first threaded seat 58 is arranged on the first screw rod 57, the top of the first threaded seat 58 is connected with the bottom of the guide seat 51, the first screw rod 57 is driven by a first motor, the positioning seat 56 is arranged in the fixed frame 1 in a rotating manner, a rotating rod at the bottom of the positioning seat 56 is driven by a second motor, and the center of the rotating rod is flush with the middle of the output end of the feeding mechanism 2;
transverse plates 54 are respectively and rotatably arranged on the left side and the right side of the guide seat 51, the second electric telescopic rod is positioned between the two transverse plates 54, one side of the two transverse plates 54 far away from the second electric telescopic rod is respectively and slidably connected with a vertical plate 55 for clamping the convex block 41, the vertical plate 55 is rotatably connected with the guide seat 51, a first reset spring is arranged between the lower part of one end of the transverse plate 54 close to the second electric telescopic rod and the guide seat 51, a tamping rod 53 which is contacted with one end of the transverse plate 54 close to the second electric telescopic rod is arranged at the bottom of the bearing plate 52, a sliding rail is arranged at the top of one end of the transverse plate 54 close to the second electric telescopic rod, rollers are rotatably arranged at the bottom of the tamping rod 53, a hinge seat is slidably arranged at one side of the vertical plate 55 close to the transverse plate 54, the hinge seat is hinged with the transverse plates 54, the placing box 4 is firstly clamped by the bearing mechanism 5, then the placing box 4 is driven to move, and the placing box 4 is convenient for bearing the lead frame sheets 7 transferred from the feeding mechanism 2 by the transferring mechanism 3, the arrangement of the lead frame sheets 7 is realized by replacing manpower, so that the efficiency of arranging the lead frame sheets 7 is greatly improved.
Further, feeding mechanism 2 is including the conveyer belt 21 that is used for carrying lead frame piece 7, evenly be provided with a plurality of T type bosss 22 on the conveyer belt 21, the right-hand member of conveyer belt 21 is provided with limiting plate 23, the embedded pressure sensor 24 that is equipped with of limiting plate 23, limiting plate 23 left side is slided and is provided with the trigger plate 25 that is used for triggering pressure sensor 24, be provided with second reset spring between trigger plate 25 and the pressure sensor 24, pressure sensor 24 output is connected with the treater input electricity, the treater output is connected with the controller input electricity, the controller output is connected with the control motor electricity of conveyer belt.
Further, transport mechanism 3 sets up in the commentaries on classics board 33 at 1 top of mount including rotating, set up in changeing first electric telescopic handle 32 of board 33 bottom one side and set up in the suction disc 31 of first electric telescopic handle 32 bottom, the one side of changeing board 33 top and keeping away from first electric telescopic handle 32 is provided with the pivot, the pivot is through third motor drive, suction disc 31 bottom is provided with a plurality of suction inlets, suction inlet and external air supply device intercommunication, first electric telescopic handle 32 and external air supply device all are connected with the output electricity of controller.
Further, a plate feeding area 8 for supplying the placing boxes 4 is arranged on the front side of the receiving mechanism 5, a plate discharging area 9 for rotating out the placing boxes 4 is arranged on the rear side of the receiving mechanism 5, and conveying mechanisms 6 are arranged between the receiving mechanism 5 and the plate feeding area 8 and between the receiving mechanism 5 and the plate discharging area 9.
Further, conveying mechanism 6 specifically is two L type carriage 61 that the symmetry set up, is provided with even board between two L type carriage 61 tops, and L type carriage 61 top is provided with second screw thread seat, and second screw thread seat middle part is provided with the second lead screw, and the second lead screw rotates and sets up in mount 1 top, and the second lead screw passes through fourth motor drive.
Further, a plurality of placing grooves for placing the lead frame pieces 7 are symmetrically arranged on the left side and the right side of the upper surface of the placing box 4.
The working principle is as follows: s1: starting a fourth motor between the bearing mechanism 5 and the board inlet area 8 to drive a second screw rod to rotate and further drive a second threaded seat on the second screw rod to move, so that two L-shaped conveying frames 61 at the bottom of the connecting board transport the placing box 4 above the board inlet area 8 to the bearing plate 52, then starting a second electric telescopic rod to move upwards to jack the placing box 4 between the two L-shaped conveying frames 61, so that the placing box 4 is separated from the L-shaped conveying frames 61, reversely driving the fourth motor between the bearing mechanism 5 and the board inlet area 8 to reset the L-shaped conveying frames 61, then starting the second electric telescopic rod to move downwards to drive the placing box 4 on the bearing plate 52 to move downwards, so that the convex block 41 at the bottom of the placing box 4 is positioned in the guide seat 51, wherein when the bearing plate 52 moves downwards, two pressing rods 53 at the bottom of the bearing plate 52 are respectively contacted with the tops of the two transverse plates 54 to rotate the transverse plates 54, when the transverse plate 54 rotates, the vertical plate 55 at the end part is driven to rotate to be close to the convex block 41, and then the placing box 4 is fixed at the top of the guide seat 51 through the two vertical plates 55 and the two convex blocks 41 at the bottom of the placing box 4;
s2: further, the conveyor belt 21 is driven to rotate by controlling the motor, the lead frame sheets 7 on the conveyor belt 21 are driven to move rightwards, after the lead frame sheets 7 are contacted with the trigger plate 25 on the left side of the limit plate 23, the second return spring is extruded, the pressure sensor 24 is further triggered, the pressure sensor 24 sends signals to the processor for processing, the processor sends instructions to the controller, the motor is controlled to stop, the conveyor belt 21 is stopped, the first electric telescopic rod 32 and the external air supply device are controlled to start, the suction plate 31 at the bottom of the first electric telescopic rod 32 is driven to move downwards to suck the lead frame sheets 7, then the first electric telescopic rod 32 moves upwards to reset, further, the rotating plate 33 is driven by the third motor to rotate, the lead frame sheets 7 on the upper portion of the conveyor belt 21 are transferred to the placing box 4, the first electric telescopic rod 32 is driven to move downwards again to place the lead frame sheets 7 in the placing groove, the external air supply device is disconnected, so that the lead frame sheet 7 is separated from the suction plate 31, then the first screw rod 57 is driven to rotate through the first motor, the first threaded seat 58 is driven to move, the middle of the placing groove on the rear side in the placing box 4 is enabled to move forwards and is flush with the middle of the output end of the feeding mechanism 2, and the lead frame sheet 7 is convenient to arrange;
s3: repeating the operation of S2 until one side of the placing box 4 is full, starting the second motor to drive the positioning seats 56 on the rotating rod to rotate, further exchanging the left and right ends of the placing box 4, and repeating the operation of S2 again until the two sides of the placing box 4 are full of the lead frame sheets 7;
s4: the second electric telescopic rod is started to move upwards to move the bearing plate 52 upwards, the tamping rod 53 at the bottom of the bearing plate 52 is separated from the transverse plate 54, at the same time, the transverse plate 54 is driven to reset under the action of the first reset spring, at the same time, the vertical plate 55 is reset to be separated from the convex block 41, the placing box 4 is unlocked, a fourth motor between the bearing mechanism 5 and the plate outlet area 9 is further started, the second screw rod is driven to rotate, thereby driving the second screw seat on the second screw rod to move, so that the two L-shaped conveying frames 61 at the bottom of the connecting plate are positioned at the bottom of the placing box 4, then, starting a second electric telescopic rod to move downwards to separate the bearing plate 52 from the placing box 4, placing the placing box 4 between the two L-shaped conveying frames 61, reversely driving a fourth motor between the bearing mechanism 5 and the plate inlet area 8, and moving the placing box 4 to the plate outlet area 9 to finish the sheet arrangement of the lead frame sheets 7;
for the driving device with the first electric telescopic rod 32, the second electric telescopic rod, the first motor, the second motor, the third motor and the fourth motor running frequently, a plurality of timers corresponding to the driving device can be additionally arranged, the timers are respectively and electrically connected with the processor, and the driving device is electrically connected with the output end of the controller;
the specific operation is as follows: the method comprises the steps that firstly, a timer at the corresponding position of a driving device is timed through a processor, when the timing time of the timer reaches, the timer sends a signal to the processor, the processor sends an instruction to a controller, and the controller controls the corresponding driving device to start.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The automatic wafer arranging machine based on semiconductor packaging is characterized by comprising a fixing frame (1), a feeding mechanism (2) arranged on the left side of the fixing frame (1) and used for conveying lead frame pieces (7), a transferring mechanism (3) arranged above the right end of the feeding mechanism (2) and a placing box (4) arranged on the right side of the transferring mechanism (3) and used for placing the lead frame pieces (7), wherein a receiving mechanism (5) used for placing the placing box (4) is arranged on the right side of the fixing frame (1);
the left end and the right end of the bottom of the placing box (4) are respectively provided with a convex block (41);
the receiving mechanism (5) comprises a guide seat (51) and a receiving plate (52) which is arranged in the middle of the guide seat (51) in a sliding mode through a second electric telescopic rod, the guide seat (51) is arranged on a positioning seat (56) in a front-back sliding mode, a first lead screw (57) is arranged in the positioning seat (56) in a rotating mode, a first threaded seat (58) is arranged on the first lead screw (57), the top of the first threaded seat (58) is connected with the bottom of the guide seat (51), the first lead screw (57) is driven by a first motor, the positioning seat (56) is arranged in a fixing frame (1) in a rotating mode, a rotating rod at the bottom of the positioning seat (56) is driven by a second motor, and the center of the rotating rod is flush with the middle of the output end of the feeding mechanism (2);
the left side and the right side of the guide seat (51) are respectively provided with transverse plates (54) in a rotating mode, the second electric telescopic rod is positioned between the two transverse plates (54), one side, far away from the second electric telescopic rod, of each of the two transverse plates (54) is respectively connected with a vertical plate (55) used for clamping a convex block (41) in a sliding mode, the vertical plate (55) is connected with the guide seat (51) in a rotating mode, a first reset spring is arranged between the lower portion, close to the end of the second electric telescopic rod, of each transverse plate (54) and the guide seat (51), the bottom of the bearing plate (52) is provided with a tamping rod (53) which is in contact with the transverse plate (54) and close to the end of the second electric telescopic rod, the top of one end, close to the second electric telescopic rod, of each transverse plate (54) is provided with a sliding rail, the bottom of each tamping rod (53) is provided with a roller in a rotating mode, one side, close to the transverse plate (54), of each transverse plate (55) is provided with a hinged seat in a sliding mode, the hinge base is hinged with a transverse plate (54).
2. The automatic die bonder for semiconductor packages according to claim 1, the feeding mechanism (2) comprises a conveying belt (21) for conveying lead frame sheets (7), a plurality of T-shaped bosses (22) are uniformly arranged on the conveying belt (21), a limiting plate (23) is arranged at the right end of the conveying belt (21), a pressure sensor (24) is embedded in the limit plate (23), a trigger plate (25) for triggering the pressure sensor (24) is arranged on the left side of the limit plate (23) in a sliding manner, a second return spring is arranged between the trigger plate (25) and the pressure sensor (24), the output end of the pressure sensor (24) is electrically connected with the input end of the processor, the output end of the processor is electrically connected with the input end of the controller, and the output end of the controller is electrically connected with the control motor of the conveyor belt.
3. The automatic chip arranging machine for semiconductor packaging according to claim 1, wherein the transferring mechanism (3) comprises a rotating plate (33) rotatably disposed on the top of the fixed frame (1), a first electric telescopic rod (32) disposed on one side of the bottom of the rotating plate (33), and a suction plate (31) disposed on the bottom of the first electric telescopic rod (32), a rotating shaft is disposed on one side of the top of the rotating plate (33) away from the first electric telescopic rod (32), the rotating shaft is driven by a third motor, a plurality of suction ports are disposed on the bottom of the suction plate (31), the suction ports are communicated with an external air supply device, and the first electric telescopic rod (32) and the external air supply device are electrically connected with an output end of the controller.
4. The automatic wafer discharging machine for semiconductor packaging according to claim 1, wherein a plate feeding area (8) for feeding the placing box (4) is arranged at the front side of the carrying mechanism (5), a plate discharging area (9) for rotating out the placing box (4) is arranged at the rear side of the carrying mechanism (5), and a conveying mechanism (6) is arranged between the carrying mechanism (5) and the plate feeding area (8) and between the carrying mechanism (5) and the plate discharging area (9).
5. The automatic wafer arranging machine for semiconductor packaging according to claim 4, wherein the conveying mechanism (6) is specifically two L-shaped conveying frames (61) symmetrically arranged, a connecting plate is arranged between the tops of the two L-shaped conveying frames (61), a second screw seat is arranged on the top of each L-shaped conveying frame (61), a second screw rod is arranged in the middle of each second screw seat, the second screw rod is rotatably arranged on the top of the fixing frame (1), and the second screw rod is driven by a fourth motor.
6. The automatic die bonder for semiconductor packages according to claim 1, wherein a plurality of placing grooves for placing the lead frame sheets (7) are symmetrically arranged on the left and right sides of the upper surface of the placing box (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111032341.3A CN113471124B (en) | 2021-09-03 | 2021-09-03 | Automatic wafer arranging machine based on semiconductor packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111032341.3A CN113471124B (en) | 2021-09-03 | 2021-09-03 | Automatic wafer arranging machine based on semiconductor packaging |
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| CN113471124A CN113471124A (en) | 2021-10-01 |
| CN113471124B true CN113471124B (en) | 2021-11-05 |
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| CN115188699B (en) * | 2022-09-09 | 2022-12-06 | 宁波德洲精密电子有限公司 | Automatic aligning and leveling table for lead frame feeding |
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| CN102437251A (en) * | 2011-12-31 | 2012-05-02 | 无锡市奥曼特科技有限公司 | Silicon wafer automatic material charging and discharging system for plate-type PECVD (plasma enhanced chemical vapor device) |
| TW201925072A (en) * | 2017-11-30 | 2019-07-01 | 上利新科技股份有限公司 | Auto stacking-separating machine |
| CN109378285A (en) * | 2018-11-09 | 2019-02-22 | 苏州益耐特电子工业有限公司 | A kind of chip package arranging machine |
| CN110610882A (en) * | 2019-10-21 | 2019-12-24 | 广东协铖微电子科技有限公司 | Automatic sheet arranging machine for packaging sheet materials |
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