CN110610882A - Automatic sheet arranging machine for packaging sheet materials - Google Patents
Automatic sheet arranging machine for packaging sheet materials Download PDFInfo
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- CN110610882A CN110610882A CN201911000375.7A CN201911000375A CN110610882A CN 110610882 A CN110610882 A CN 110610882A CN 201911000375 A CN201911000375 A CN 201911000375A CN 110610882 A CN110610882 A CN 110610882A
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- sheet materials
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- 239000000463 material Substances 0.000 title claims abstract description 151
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 128
- 230000007246 mechanism Effects 0.000 claims abstract description 58
- 230000000903 blocking effect Effects 0.000 claims abstract description 20
- 238000007599 discharging Methods 0.000 claims abstract description 13
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 11
- 230000007306 turnover Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 17
- 238000012545 processing Methods 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 4
- 230000006872 improvement Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000003111 delayed effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
The invention relates to the field of semiconductor processing equipment, in particular to an automatic sheet arranging machine for packaging sheet materials, which comprises a controller, a workbench, a clamping bottom frame, a clamping top frame, a material moving device and a conveying device, wherein the controller is connected with the workbench through a connecting rod; the conveying device comprises a fixed support, a conveying belt, a material supporting belt, a blocking mechanism, a first photoelectric switch and a second photoelectric switch. The conveying device of the automatic chip arranging machine is matched with the controller through the conveying belt, the material supporting belt and the controller, so that the packaging sheet material of the previous process can be moved to the feeding area of the material moving device in place of manual work, and the manual participation rate is reduced; meanwhile, under the action of the blocking cylinder, the first photoelectric switch and the second photoelectric switch, the packaging sheet stock which enters subsequently is prevented from entering a feeding area of the conveying device and being mutually extruded with the packaging sheet stock of the previous piece, and smooth discharging of the automatic sheet discharging machine is ensured.
Description
Technical Field
The invention relates to the field of semiconductor processing equipment, in particular to an automatic sheet arranging machine for packaging sheet materials.
Background
With the development of microelectronic technology, the processing equipment of semiconductor electrical components gradually develops towards automation, in an automatic chip arranging machine for packaging chip materials, a material moving device sends the packaging chip materials to corresponding positions on a clamping bottom frame of a workbench, and then a clamping top frame is matched with the clamping bottom frame to clamp the packaging chip materials and move the packaging chip materials to a plastic packaging machine for plastic packaging.
However, in the conventional automatic sheet arranging machine, the packaging sheet is manually moved from the previous process to the sheet arranging machine for arranging the packaging sheet, so that the degree of automation is not high, and the processing efficiency of the semiconductor electric appliance element is limited. Even if a conveying device in the previous process is arranged, the conveying device is also a simple conveying belt, and the packaging sheet materials are easily extruded on the conveying belt in the conveying process, so that the discharging of the automatic sheet discharging machine is influenced.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an automatic sheet arranging machine for packaging sheet materials, which can replace the manual work to move the packaging sheet materials of the previous process to the feeding area of a material moving device, thereby reducing the manual participation rate; meanwhile, the packaging sheet materials entering subsequently can be prevented from entering a feeding area of the conveying device and being mutually extruded with the packaging sheet materials in the previous block, and smooth discharging of the automatic sheet discharging machine is ensured.
The invention discloses an automatic chip arranging machine for packaging sheet materials, which comprises a controller, a workbench, a clamping bottom frame, a clamping top frame, a material moving device and a conveying device, wherein the clamping bottom frame is placed on the workbench, the clamping top frame is used for being matched with the clamping bottom frame to clamp the packaging sheet materials, the material moving device is used for moving the packaging sheet materials to corresponding positions of the clamping bottom frame one by one, and the conveying device is used for moving the packaging sheet materials to a material feeding area of the material moving device;
the conveying device comprises a fixed support, a conveying belt, a material supporting belt, a blocking mechanism, a first photoelectric switch and a second photoelectric switch, the conveying belt and the material supporting belt are sequentially arranged on a fixed support, the fixed support is provided with a feed inlet for the encapsulation sheet material to enter, the feed inlet is positioned at one end of the conveyer belt far away from the material supporting belt, the blocking mechanism comprises a baffle plate arranged between the feeding end and the discharging end of the conveyer belt and a blocking cylinder driving the baffle plate to move up and down, the first photoelectric switch is arranged at the feed inlet and used for detecting whether the packaging sheet stock enters the feed inlet, the second photoelectric switch is arranged below the material supporting belt and used for detecting whether the material supporting belt supports the packaging sheet materials or not, move material device, conveyer belt, hold in the palm the material area, block that cylinder, first photoelectric switch and second photoelectric switch all are connected with controller electric connection.
As an improvement of the above scheme, the automatic sheet arranging machine of the present invention further includes a staggering bin for collecting and placing the packaging sheet material in a turnover manner, the staggering bin is disposed between the conveying device and the workbench, the conveying device further includes a camera for detecting whether the packaging sheet material entering from the feeding port is placed in a turnover manner, and the camera is electrically connected with the controller; when the camera detects that the packaging sheet materials entering from the feeding hole are placed in an overturning mode, the controller controls the material moving device to move the packaging sheet materials placed in the overturning mode into the staggering bin.
As an improvement of the above scheme, the automatic wafer arranging machine of the present invention further comprises a swing direction detection device for detecting whether the swing direction of the packaging sheet material is correct, the packaging sheet material comprises a frame with a rectangular outer contour and a semiconductor chip fixed on the frame, and two long sides of the frame are correspondingly provided with a narrow horizontal bar and a wide horizontal bar; the swing direction detection device comprises an air pressure sensor, a first vacuum sucker for sucking the narrow cross bar, a second vacuum sucker for sucking the wide cross bar and a vacuum pump for providing suction force for the first vacuum sucker and the second vacuum sucker, and the air pressure sensor and the vacuum pump are electrically connected with the controller; the air pressure sensor is used for detecting the output air pressure of the vacuum pump and sending the detected air pressure value to the controller, the outer diameter of the suction port of the second vacuum sucker is larger than the width of the narrow cross bar, and the first vacuum sucker and the second vacuum sucker are both arranged on the material moving device; when the material moving device clamps the packaging sheet materials and the air pressure value detected by the air pressure sensor is larger than a set value, the controller controls the material moving device to drive the clamped packaging sheet materials to rotate 180 degrees around the center and then place the packaging sheet materials on the clamping bottom frame.
As an improvement of the above scheme, the narrow horizontal bar is provided with first positioning holes, the wide horizontal bar is provided with second positioning holes, the diameter of the circumscribed circle of each first positioning hole is larger than that of the circumscribed circle of each first positioning hole, the first vacuum chucks are arranged between two adjacent first positioning holes corresponding to the frames placed in the forward direction, and the second vacuum chucks are arranged between two adjacent second positioning holes corresponding to the frames placed in the forward direction.
As an improvement of the above scheme, the narrow horizontal bar is provided with a first positioning hole, the wide horizontal bar is provided with a second positioning hole, the diameter of the circumscribed circle of the second positioning hole is larger than that of the circumscribed circle of the first positioning hole, the first vacuum chuck and the second vacuum chuck are both provided with annular adsorption ports, the diameter of the circumscribed circle of the first positioning hole is smaller than the inner diameter of the adsorption port of the first vacuum chuck, and the diameter of the circumscribed circle of the second positioning hole is smaller than the inner diameter of the adsorption port of the second vacuum chuck and larger than the outer diameter of the adsorption port of the first vacuum chuck; the first vacuum chuck is arranged corresponding to the first positioning hole in the forward-placed frame, and the second vacuum chuck is arranged corresponding to the second positioning hole in the forward-placed frame.
As an improvement of the scheme, the material moving device comprises a taking and placing mechanism for clamping and placing the packaging sheet material, a rotating mechanism for driving the taking and placing mechanism to rotate, a longitudinal moving mechanism for driving the taking and placing mechanism to move up and down and an XY moving mechanism for driving the taking and placing mechanism to move.
As an improvement of the above scheme, the pick-and-place mechanism comprises a pick-and-place manipulator for clamping and loosening the packaged sheet material, a pick-and-place cylinder for driving the pick-and-place manipulator to open and close, and a support plate for supporting the pick-and-place manipulator and the pick-and-place cylinder, wherein the support plate is mounted at an output end of the longitudinal movement mechanism.
As an improvement of the above scheme, the pick-and-place mechanism further comprises a third photoelectric switch for detecting whether the pick-and-place manipulator clamps the packaging sheet, and the third photoelectric switch is arranged at the support plate.
The implementation of the invention has the following beneficial effects:
1. the conveying device of the automatic chip arranging machine is matched with the controller through the conveying belt, the material supporting belt and the controller, so that the packaging sheet material of the previous process can be moved to the feeding area of the material moving device in place of manual work, and the manual participation rate is reduced; meanwhile, under the action of the blocking cylinder, the first photoelectric switch and the second photoelectric switch, the packaging sheet stock which enters subsequently is prevented from entering a feeding area of the conveying device and being mutually extruded with the packaging sheet stock of the previous piece, and smooth discharging of the automatic sheet discharging machine is ensured.
2. The automatic chip arranging machine is mutually combined with the swinging direction detection device through the controller, swinging direction detection of the packaging chip is completed in the material moving process of the material moving device, if the swinging direction of the packaging chip is detected to be wrong in the material moving process, the controller controls the material moving device to drive the clamped packaging chip to rotate 180 degrees around the center and then place the clamped packaging chip on the clamping bottom frame, the swinging direction of the packaging chip is corrected, the fact that the packaging chip placed on the clamping bottom frame swings to be correct is guaranteed, and the plastic packaging quality of the packaging chip is guaranteed.
Drawings
FIG. 1 is a schematic structural diagram of an automatic sheet arranging machine according to an embodiment of the present invention;
FIG. 2 is a left side view of FIG. 1;
FIG. 3 is a schematic structural diagram of a conveying apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a package sheet to be processed by an automatic sheet arranging machine according to an embodiment of the present invention;
FIG. 5 is a schematic view of the gas path connection of the swing direction detecting device in the embodiment of the present invention;
FIG. 6 is a circuit diagram of a controller, an air pressure sensor, and a vacuum pump according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a pick and place mechanism according to an embodiment of the invention.
In the figure: 1. packaging the sheet material; 11. a frame; 12. a semiconductor chip; 111. a narrow horizontal bar; 112. wide horizontal bars; 113. a first positioning hole; 114. a second positioning hole; 2. a controller; 3. a work table; 4. clamping the chassis; 5. clamping the top frame; 6. a material moving device; 7. a conveying device; 71. fixing a bracket; 72. a conveyor belt; 73. supporting the material belt; 74. a blocking mechanism; 75. a first photoelectric switch; 76. a second photoelectric switch; 711. a feed inlet; 741. a baffle plate; 742. a blocking cylinder; 8. a material staggering bin; 77. a camera; 91. an air pressure sensor; 92. a first vacuum chuck; 93. a second vacuum chuck; 94. a vacuum pump; 61. a pick and place mechanism; 62. a rotation mechanism; 63. a longitudinal moving mechanism; 64. an XY moving mechanism; 611. a picking and placing manipulator; 612. a picking and placing cylinder; 613. a support plate; 614. and a third photoelectric switch.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific embodiments so as to more clearly understand the technical idea of the invention claimed. It is only noted that the invention is intended to be limited to the specific forms set forth herein, including any reference to the drawings, as well as any other specific forms of embodiments of the invention.
As shown in fig. 1 to 3, an automatic sheet arranging machine for packaging sheets 1 according to an embodiment of the present invention includes a table 3, a holding base frame 4 placed on the table 3, a holding top frame 5 for holding the packaging sheets 1 in cooperation with the holding base frame 4, and a transfer device 6 for transferring the packaging sheets 1 one by one to a corresponding position of the holding base frame 4. When the automatic sheet arranging machine needs to arrange sheets, the clamping bottom frame 4 is placed on the workbench 3, the material moving device 6 moves the packaging sheet materials 1 to the corresponding positions on the clamping bottom frame 4, after the sheet arrangement of the material moving device 6 is finished, the clamping top frame 5 is placed on the clamping bottom frame 4, the packaging sheet materials 1 which are subjected to sheet arrangement are clamped through the matching of the clamping bottom frame 4 and the clamping bottom frame 4, and the packaging sheet materials are moved together into the plastic packaging machine for plastic packaging.
The automatic chip arranging machine for the packaging chips in the embodiment of the invention further comprises a controller 2 and a conveying device 7 for conveying the packaging chips 1 to a feeding area of the material moving device 6, wherein the conveying device 7 comprises a fixed support 71, a conveying belt 72, a material supporting belt 73, a blocking mechanism 74, a first photoelectric switch 75 and a second photoelectric switch 76, the conveying belt 72 and the material supporting belt 73 are sequentially arranged on the fixed support 71, the fixed support 71 is provided with a feeding hole 711 for the packaging chips 1 to enter, and the feeding hole 711 is positioned at one end, far away from the material supporting belt 73, of the conveying belt 72. The conveying belt 72 and the material supporting belt 73 are matched to replace manual work to move the packaging sheet materials 1 of the previous process to the feeding area of the material moving device 6, so that the manual participation rate is reduced, and the material moving device 6 moves the packaging sheet materials 1 on the material supporting belt 73 to the clamping bottom frame 4 to be discharged.
The blocking mechanism 74 includes a baffle 741 disposed between the feeding end and the discharging end of the conveyor 72, and a blocking cylinder 742 for driving the baffle 741 to move up and down. The first photoelectric switch 75 is disposed at the feeding hole 711 and is used for detecting whether the packaging sheet 1 enters the feeding hole 711, and the second photoelectric switch 76 is disposed below the carrier tape 73 and is used for detecting whether the carrier tape 73 carries the packaging sheet 1. The conveyor belt 72 and the carrier belt 73 of the present invention each include a plurality of rotating rollers, two elastic rings wound around the rotating rollers, and a motor for driving one of the rotating rollers to rotate (the specific structure of the conveyor belt 72 and the carrier belt 73 is omitted in the figure). The blocking mechanism 74 is arranged between two elastic rings of the conveying belt 72, the baffle 741 does not interfere with the two elastic rings of the conveying belt 72 when moving up and down, when the blocking cylinder 742 drives the baffle 741 to move up to a high position, the baffle 741 can be higher than the upper surface of the conveying belt 72, and when the blocking cylinder 742 drives the baffle 741 to move down to a low position, the baffle 741 can be lower than the upper surface of the conveying belt 72; the second photoelectric switch 76 is disposed between the two elastic rings of the carrier tape 73, and can detect whether the packaging material 1 is placed on the carrier tape 73. The material moving device 6, the conveying belt 72, the material supporting belt 73, the blocking cylinder 74, the first photoelectric switch 75 and the second photoelectric switch 76 are all electrically connected with the controller 2. The controller 2 adopts a PLC (programmable logic controller), can execute logic operation, sequence control, timing and counting, and controls the work of each part by changing the connection mode of an input end and an output end, so that the automatic film arranging machine can automatically operate.
The specific working flow of the conveying device 7 in the automatic sheet arranging machine of the invention is as follows: when the first photoelectric switch 75 detects that the packaging sheet 1 enters the feeding hole 711, a signal is sent to the controller 2, and the controller 2 controls the conveyor belt 72 and the carrier belt 73 to start; when the second photoelectric switch 76 detects that the carrier tape 73 has the packaging sheet 1, a signal is sent to the controller 2, the controller 2 controls the blocking cylinder 742 to drive the baffle 741 to move upwards, so as to prevent the packaging sheet 1 entering subsequently from entering the feeding area of the conveying device 7 and affecting the feeding of the packaging sheet 1 in the previous block, and at the same time, the controller 2 controls the conveying belt 72 and the carrier tape 73 to be closed in a delayed manner (the time for closing in the delayed manner is equal to the length of the packaging sheet 1 divided by the conveying speed of the carrier tape 73).
The conveying device 7 of the invention is matched with the controller 2 through the conveying belt 72, the material supporting belt 73, and can replace the manual work to move the packaging sheet material 1 of the previous process to the feeding area of the material moving device 6, thereby reducing the manual participation rate; meanwhile, under the action of the blocking cylinder 74, the first photoelectric switch 75 and the second photoelectric switch 76, the packaging sheet 1 entering subsequently is prevented from entering the feeding area of the conveying device 7 and being pressed with the packaging sheet 1 in the previous block, and smooth discharging of the automatic sheet discharging machine is ensured.
In order to avoid the material transferring device 6 from transferring the packaging sheet 1 placed in an overturning way to the clamping chassis 4 for arranging pieces, the automatic sheet arranging machine of the invention further comprises a staggering bin 8 for collecting the packaging sheet 1 placed in an overturning way, the staggering bin 8 is arranged between the conveying device 7 and the workbench 3, the conveying device 7 further comprises a camera 77 for detecting whether the packaging sheet 1 entering from the feeding hole 711 is placed in an overturning way, the camera 77 preferably adopts a CCD industrial camera, the camera 77 detects the upper surface of the packaging sheet 1, when the camera 77 detects that the upper surface of the packaging sheet 1 has the semiconductor chip 12, the packaging sheet 1 is not placed in an overturning way, and the material transferring device 6 moves the packaging sheet 1 to the clamping chassis 4 for arranging pieces; when the camera 77 detects that the semiconductor chip 12 is not present on the upper surface of the encapsulating sheet 1, it is determined that the encapsulating sheet 1 is placed upside down and a signal is sent to the controller 2, and the controller 2 controls the transferring device 6 to transfer the upside-down encapsulating sheet 1 into the staggering bin 8.
As shown in fig. 4, the packaging sheet 1 to be processed by the automatic sheet arranging machine in the embodiment of the present invention includes a frame 11 with a rectangular outer contour and a semiconductor chip 12 fixed on the frame 11, in order to distinguish the direction of the semiconductor chip 12, narrow bars 111 and wide bars 112 are correspondingly disposed at two long sides of the frame 11, and the width of the wide bars 112 is greater than the width of the narrow bars 111. The direction of the packaging sheet 1 can be determined by the directions of the narrow cross bars 111 and the wide cross bars 112, and in order to prevent the packaging sheet with the wrong direction from entering the automatic sheet arranging machine for processing, the automatic sheet arranging machine for the packaging sheet in the embodiment of the invention further comprises a direction swinging detection device for detecting whether the direction of the packaging sheet 1 is correct or not.
As shown in fig. 5 to 6, the swing direction detecting device includes an air pressure sensor 91, a first vacuum chuck 92 for sucking the narrow horizontal bar 111, a second vacuum chuck 93 for sucking the wide horizontal bar 112, and a vacuum pump 94 for providing suction to the first vacuum chuck 92 and the second vacuum chuck 93, wherein the air pressure sensor 91 and the vacuum pump 94 are electrically connected to the controller 2. In order to enable the first vacuum chuck 92 and the second vacuum chuck 93 to perform an adsorption test in the material transferring process of the material transferring device 6, the first vacuum chuck 92 and the second vacuum chuck 93 are both arranged on the material transferring device 6, and when the material transferring device 6 clamps the packaging sheet 1 which swings correctly, the first vacuum chuck 92 can adsorb the narrow cross bar 111, and the second vacuum chuck 93 can adsorb the wide cross bar 112.
The air pressure sensor 91 is used for detecting the output air pressure of the vacuum pump 94 and sending the detected air pressure value to the air pressure sensor 91 in the controller 2, and the outer diameter of the suction opening of the second vacuum chuck 93 is larger than the width of the narrow cross bar 111. The vacuum pump 94 in this embodiment is operated to set the pressure at its output to a predetermined value (for testing, the predetermined value is one of 0.9-0.95 atm), and then to cut off the supply of negative pressure to the first vacuum cup 92 and the second vacuum cup 93. If the packaging sheet 1 clamped on the material moving device 6 is correctly swung, the narrow horizontal bar 111 can completely cover the adsorption port of the first vacuum chuck 92, and the wide horizontal bar 112 can completely cover the adsorption port of the second vacuum chuck 93, so that a cavity formed by the adsorption port of the first vacuum chuck 92 and the adsorption port of the second vacuum chuck 93 to the output end of the vacuum pump 94 is a closed cavity, and the pressure value detected by the air pressure sensor 91 is the negative pressure value generated when the vacuum pump 94 starts; if the packaging sheet 1 is in a wrong swing direction, that is, the horizontally placed packaging sheet 1 rotates 180 degrees in the horizontal plane, the positions of the narrow cross bar 111 and the wide cross bar 112 are interchanged, the narrow cross bar 111 cannot completely cover the second vacuum chuck 93, so that a cavity formed by the suction ports of the first vacuum chuck 92 and the second vacuum chuck 93 to the output end of the vacuum pump 94 cannot form a closed cavity, and the pressure value detected by the air pressure sensor 91 is higher than a set value.
The detection process of the swing direction detection device is completed after the material moving device 6 clamps the packaging sheet material 1 and before the packaging sheet material 1 is put down, and the specific detection process is as follows: after clamping the packaging sheet 1, the material moving device 6 drives the packaging sheet 1 to move to a corresponding position of the clamping chassis 4, the controller 2 controls the output end of the vacuum pump 94 to be communicated with the first vacuum chuck 92 and the second vacuum chuck 93 and generates negative pressure according to a set value, and the controller 2 controls the vacuum pump 94 to be disconnected with the output end of the vacuum pump 94; after a period of time (0.2-0.5 seconds), the controller 2 acquires the data of the air pressure sensor 91, and the material moving device 6 clamps the packaging sheet material 1. When the air pressure value detected by the air pressure sensor 91 is a set value, the controller 2 controls the material moving device 6 to move the packaging sheet material 1 to the corresponding position of the clamping bottom frame 4; when the air pressure value detected by the air pressure sensor 91 is higher than a set value, the controller 2 controls the material moving device 6 to drive the clamped packaging sheet material 1 to rotate 180 degrees around the center and then to be placed on the clamping bottom frame 4, so that the packaging sheet material 1 placed on the clamping bottom frame 4 swings to the right direction.
The automatic chip arranging machine is mutually combined with the swinging direction detection device through the controller 2, the swinging direction detection of the packaging sheet materials 1 is completed in the material moving process of the material moving device 6, if the swinging direction error of the packaging sheet materials 1 is detected in the material moving process, the controller 2 controls the material moving device 6 to drive the clamped packaging sheet materials 1 to rotate 180 degrees around the center and then place the clamping bottom frame 4, the swinging direction of the packaging sheet materials 1 is corrected, the correct swinging direction of the packaging sheet materials 1 placed on the clamping bottom frame 4 is ensured, and the plastic packaging quality of the packaging sheet materials 1 is ensured.
The narrow horizontal bar 111 is provided with a first positioning hole 113, the wide horizontal bar 112 is provided with a second positioning hole 114 with a circumscribed circle diameter larger than that of the first positioning hole 113, the first positioning hole 113 and the second positioning hole 114 can be circular or square, the smallest circle capable of completely covering the square cross section is a square circumscribed circle, and the round circumscribed circle is a round self. Regarding the arrangement of the first positioning hole 113 and the second positioning hole 114, the following two arrangement modes are preferably adopted for the first vacuum chuck 92 and the second vacuum chuck 93 in the embodiment of the present invention.
The first setting mode is as follows: the first vacuum chuck 92 is disposed between two adjacent first positioning holes 113 corresponding to the frame 11 being placed in the forward direction, and the second vacuum chuck 93 is disposed between two adjacent second positioning holes 114 corresponding to the frame 11 being placed in the forward direction. In this arrangement, when the packaging sheet 1 is correctly swung, the first vacuum chuck 92 is staggered with the first positioning hole 113, and the second vacuum chuck 93 is staggered with the second positioning hole 114, so that the first vacuum chuck 92 and the second vacuum chuck 93 can be effectively adsorbed; when the packaging sheet 1 is in a wrong direction, the vacuum state at the output end of the vacuum pump 94 can be destroyed no matter whether the first vacuum chuck 92 is staggered with the second positioning hole 114 or not and whether the second vacuum chuck 93 is staggered with the first positioning hole 113 or not.
The second setting mode is as follows: the first vacuum chuck 92 and the second vacuum chuck 93 are both provided with annular adsorption ports, the diameter of the circumcircle of the first positioning hole 113 is smaller than the inner diameter of the adsorption port of the first vacuum chuck 92, and the diameter of the circumcircle of the second positioning hole 114 is smaller than the inner diameter of the adsorption port of the second vacuum chuck 93 and larger than the outer diameter of the adsorption port of the first vacuum chuck 92; the first vacuum chuck 92 is disposed corresponding to the first positioning hole 113 on the frame 11 placed in the forward direction, and the second vacuum chuck 93 is disposed corresponding to the second positioning hole 114 on the frame 11 placed in the forward direction. In this arrangement, when the packaging sheet 1 is correctly swung, the first vacuum chuck 92 is opposite to the first positioning hole 113, and the second vacuum chuck 93 is opposite to the second positioning hole 114, so that the first vacuum chuck 92 and the second vacuum chuck 93 can effectively adsorb; when the packaging sheet 1 is swung in a wrong direction, the vacuum state at the output end of the vacuum pump 94 can be destroyed no matter whether the first vacuum chuck 92 is opposite to the second positioning hole 114 or not and whether the second vacuum chuck 93 is opposite to the first positioning hole 113 or not.
Both of the above-described modes ensure the reliability of the swing direction detection device.
As shown in fig. 7, the material moving device 6 preferably includes a pick-and-place mechanism 61 for clamping the packaging sheet 1, a rotating mechanism 62 for driving the pick-and-place mechanism 61 to rotate, a longitudinal moving mechanism 63 for driving the pick-and-place mechanism 61 to move up and down, and an XY moving mechanism 64 for driving the pick-and-place mechanism 61 to move. The rotating mechanism 62 adopts a direct-drive angle motor, so that the rotating angle is accurate and the action is quick; the longitudinal moving mechanism 63 adopts an air cylinder, and response is quick; the XY moving mechanism 64 uses an XY slide table, and can drive the target object to move in a plane according to a set path.
It should be noted that the pick-and-place mechanism 61 preferably includes a pick-and-place manipulator 611 for clamping and releasing the packaged sheet 1, a pick-and-place cylinder 612 for driving the pick-and-place manipulator 611 to open and close, and a support plate 613 for supporting the pick-and-place manipulator 611 and the pick-and-place cylinder 612, wherein the support plate 613 is installed at an output end of the longitudinal moving mechanism 63.
The specific material moving process of the material moving device 6 is as follows: the XY moving mechanism 64 drives the picking and placing mechanism 61 to move above the packaging sheet materials 1 to be subjected to sheet arrangement, and the longitudinal moving mechanism 63 drives the picking and placing mechanism 61 to move downwards; the pick-and-place cylinder 612 drives the pick-and-place manipulator 611 to close, and the pick-and-place manipulator 611 picks up one packaging sheet material 1; the longitudinal moving mechanism 63 drives the taking and placing mechanism 61 to move upwards, and the XY moving mechanism 64 drives the material moving mechanism to move to the set position of the clamping chassis 4; the vertical moving mechanism 63 drives the pick-and-place mechanism 61 to move downwards, the pick-and-place mechanism 61 drives the pick-and-place manipulator 611 to open, and the pick-and-place manipulator 611 places the packaging sheet 1 on the clamping chassis 4.
Further, the pick and place mechanism 61 further includes a third photoelectric switch 614 for detecting whether the pick and place manipulator 611 holds the packaging sheet 1, and the third photoelectric switch 614 is disposed at the supporting plate 613 and is capable of detecting whether the material moving device 6 successfully takes the material.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. An automatic chip arranging machine for packaging chips is characterized in that: the automatic packaging machine comprises a controller, a workbench, a clamping bottom frame, a clamping top frame, a material moving device and a conveying device, wherein the clamping bottom frame is placed on the workbench, the clamping top frame is used for being matched with the clamping bottom frame to clamp packaging sheet materials, the material moving device is used for moving the packaging sheet materials to corresponding positions of the clamping bottom frame one by one, and the conveying device is used for conveying the packaging sheet materials to a material feeding area of the material moving device;
the conveying device comprises a fixed support, a conveying belt, a material supporting belt, a blocking mechanism, a first photoelectric switch and a second photoelectric switch, the conveying belt and the material supporting belt are sequentially arranged on a fixed support, the fixed support is provided with a feed inlet for the encapsulation sheet material to enter, the feed inlet is positioned at one end of the conveyer belt far away from the material supporting belt, the blocking mechanism comprises a baffle plate arranged between the feeding end and the discharging end of the conveyer belt and a blocking cylinder driving the baffle plate to move up and down, the first photoelectric switch is arranged at the feed inlet and used for detecting whether the packaging sheet stock enters the feed inlet, the second photoelectric switch is arranged below the material supporting belt and used for detecting whether the material supporting belt supports the packaging sheet materials or not, move material device, conveyer belt, hold in the palm the material area, block that cylinder, first photoelectric switch and second photoelectric switch all are connected with controller electric connection.
2. An automatic die bonder for encapsulating sheets as claimed in claim 1, wherein: the device comprises a conveying device, a controller and a staggered bin, wherein the staggered bin is used for collecting and placing the packaging sheet materials in a turnover mode, is arranged between the conveying device and a workbench, and also comprises a camera which is used for detecting whether the packaging sheet materials entering from a feeding hole are placed in a turnover mode or not, and is electrically connected with the controller; when the camera detects that the packaging sheet materials entering from the feeding hole are placed in an overturning mode, the controller controls the material moving device to move the packaging sheet materials placed in the overturning mode into the staggering bin.
3. An automatic die bonder for encapsulating sheets as claimed in claim 1, wherein: the packaging material comprises a frame with a rectangular outer contour and a semiconductor chip fixed on the frame, and narrow transverse strips and wide transverse strips are correspondingly arranged at two long edges of the frame; the swing direction detection device comprises an air pressure sensor, a first vacuum sucker for sucking the narrow cross bar, a second vacuum sucker for sucking the wide cross bar and a vacuum pump for providing suction force for the first vacuum sucker and the second vacuum sucker, and the air pressure sensor and the vacuum pump are electrically connected with the controller; the air pressure sensor is used for detecting the output air pressure of the vacuum pump and sending the detected air pressure value to the controller, the outer diameter of the suction port of the second vacuum sucker is larger than the width of the narrow cross bar, and the first vacuum sucker and the second vacuum sucker are both arranged on the material moving device; when the material moving device clamps the packaging sheet materials and the air pressure value detected by the air pressure sensor is larger than a set value, the controller controls the material moving device to drive the clamped packaging sheet materials to rotate 180 degrees around the center and then place the packaging sheet materials on the clamping bottom frame.
4. An automatic die bonder for encapsulating sheets as claimed in claim 3, wherein: the narrow horizontal bar is provided with first positioning holes, the wide horizontal bar is provided with second positioning holes with the diameter of the circumscribed circle larger than that of the circumscribed circle of the first positioning holes, the first vacuum chuck is arranged between two adjacent first positioning holes corresponding to the frame placed in the forward direction, and the second vacuum chuck is arranged between two adjacent second positioning holes corresponding to the frame placed in the forward direction.
5. An automatic die bonder for encapsulating sheets as claimed in claim 3, wherein: the narrow cross bar is provided with a first positioning hole, the wide cross bar is provided with a second positioning hole, the diameter of the circumscribed circle of the second positioning hole is larger than that of the circumscribed circle of the first positioning hole, the first vacuum chuck and the second vacuum chuck are both provided with annular adsorption ports, the diameter of the circumscribed circle of the first positioning hole is smaller than the inner diameter of the adsorption port of the first vacuum chuck, and the diameter of the circumscribed circle of the second positioning hole is smaller than the inner diameter of the adsorption port of the second vacuum chuck and larger than the outer diameter of the adsorption port of the first vacuum chuck; the first vacuum chuck is arranged corresponding to the first positioning hole in the forward-placed frame, and the second vacuum chuck is arranged corresponding to the second positioning hole in the forward-placed frame.
6. An automatic die bonder for encapsulating sheets as claimed in any one of claims 1 to 5, characterized in that: the material moving device comprises a taking and placing mechanism for clamping and placing the packaging sheet material, a rotating mechanism for driving the taking and placing mechanism to rotate, a longitudinal moving mechanism for driving the taking and placing mechanism to move up and down and an XY moving mechanism for driving the taking and placing mechanism to move.
7. An automatic die bonder for encapsulating sheets as claimed in claim 6, wherein: the picking and placing mechanism comprises a picking and placing mechanical arm used for clamping and loosening the packaged sheet material, a picking and placing cylinder used for driving the picking and placing mechanical arm to open and close, and a supporting plate used for supporting the picking and placing mechanical arm and the picking and placing cylinder, wherein the supporting plate is arranged at the output end of the longitudinal moving mechanism.
8. An automatic die bonder for encapsulating sheets as claimed in claim 7, wherein: the picking and placing mechanism further comprises a third photoelectric switch used for detecting whether the picking and placing mechanical arm clamps the packaging sheet materials, and the third photoelectric switch is arranged on the supporting plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911000375.7A CN110610882A (en) | 2019-10-21 | 2019-10-21 | Automatic sheet arranging machine for packaging sheet materials |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911000375.7A CN110610882A (en) | 2019-10-21 | 2019-10-21 | Automatic sheet arranging machine for packaging sheet materials |
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| CN110610882A true CN110610882A (en) | 2019-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911000375.7A Pending CN110610882A (en) | 2019-10-21 | 2019-10-21 | Automatic sheet arranging machine for packaging sheet materials |
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| CN111354651A (en) * | 2020-02-24 | 2020-06-30 | 佛山市蓝箭电子股份有限公司 | Semiconductor plastic package automatic feeding system and control method thereof |
| CN113471124A (en) * | 2021-09-03 | 2021-10-01 | 南通国为半导体科技有限公司 | Automatic wafer arranging machine based on semiconductor packaging |
| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
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