CN111354651A - Semiconductor plastic package automatic feeding system and control method thereof - Google Patents
Semiconductor plastic package automatic feeding system and control method thereof Download PDFInfo
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- CN111354651A CN111354651A CN202010112263.7A CN202010112263A CN111354651A CN 111354651 A CN111354651 A CN 111354651A CN 202010112263 A CN202010112263 A CN 202010112263A CN 111354651 A CN111354651 A CN 111354651A
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- feeding
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- frame
- glue removing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Abstract
The invention discloses an automatic feeding system for semiconductor plastic packaging and a control method thereof.
Description
Technical Field
The invention relates to the field of semiconductor production and manufacturing, in particular to a semiconductor plastic packaging feeding system.
Background
With the vigorous development of the electronic industry, in the post-process plastic package of semiconductors, for example, the shape of the highly dense electronic semiconductor package such as SOT23-X, in the conventional plastic package process, a lead frame needs to be arranged on a material loading frame, the material loading frame is covered with a material loading cover after the arrangement, the material loading frame is manually placed into a plastic packaging machine for plastic package curing, the material loading frame is taken out after the plastic package is completed and placed into a glue removing machine for gluing, and finally, after the gluing is completed, the semiconductor parts on the material loading frame are manually discharged and moved to the inspection process. The traditional plastic package production method needs a plurality of workers to complete the plastic package production, the efficiency is low, and due to the fact that the labor intensity of operators is high, particularly under a long-term operation state, the operators are prone to fatigue, and products are prone to being scrapped due to misoperation, and even production accidents occur.
It is seen that improvements and enhancements to the prior art are needed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide an automatic semiconductor plastic packaging feeding system and a control method thereof, and aims to improve the production efficiency of semiconductor plastic packaging and reduce the labor intensity of workers.
In order to achieve the purpose, the invention adopts the following technical scheme:
a control method of a semiconductor plastic package automatic feeding system comprises the following steps: A01. when the manipulator detects that the film arranging device is in an idle state, the manipulator identifies and grabs an idle feeding frame and puts the idle feeding frame to the film arranging device, and the film arranging device arranges the film on the idle feeding frame; A02. when the manipulator detects that the chip arranging device finishes chip arranging, the manipulator grabs a loading frame which finishes chip arranging from the chip arranging device and puts the loading frame into a first plastic packaging device, and the first plastic packaging device feeds back a first signal to the manipulator; A03. when the manipulator detects that the feeding device is in an empty state, the manipulator identifies and grabs an empty feeding rack and puts the empty feeding rack to the feeding device, and the feeding device puts the empty feeding rack; A04. when the manipulator detects that the feeding device finishes feeding, the manipulator picks a feeding frame which finishes feeding from the feeding device and sends the feeding frame into the first plastic packaging device for feeding, after the manipulator finishes feeding, the feeding frame is put back to the feeding device and enters a standby state, the feeding device carries out feeding of the next round on the feeding frame, and the first plastic packaging device carries out plastic packaging on products on a feeding frame; A05. when the manipulator detects that the first plastic packaging device completes plastic packaging, the manipulator picks a material loading frame which completes plastic packaging from the first plastic packaging device, puts the material loading frame to a glue removing device and enters a standby state, and the glue removing device removes glue from products on the material loading frame; A06. when the manipulator detects that the glue removing device finishes glue removing, the manipulator grabs the feeding frame which finishes glue removing from the glue removing device and transfers the feeding frame to the workbench; if the production task is completed, the process is ended, otherwise, the steps A01 to A06 are repeatedly executed.
In the control method of the automatic semiconductor plastic package feeding system, when the manipulator is in a standby state in the process of executing the steps A01 to A06, the following steps are executed: B01. if the manipulator detects that the film arranging device is in an empty state, the manipulator identifies and grabs an empty film feeding frame and puts the empty film feeding frame to the film arranging device, and the film arranging device arranges the film on the empty film feeding frame; B02. if the manipulator detects that the chip arranging device finishes chip arranging and the second plastic packaging device is in an empty state, the manipulator grabs a loading frame which finishes chip arranging from the chip arranging device and puts the loading frame into the second plastic packaging device, and the second plastic packaging device feeds back a second signal to the manipulator; B03. if the manipulator detects that the feeding device finishes feeding and receives a second signal, the manipulator grabs a feeding rack for feeding from the feeding device and sends the feeding rack into a second plastic packaging device for feeding, the manipulator returns the feeding rack to the feeding device after feeding, and the feeding device carries out the next round of feeding on the feeding rack; B04. if the manipulator detects that the second plastic packaging device completes plastic packaging and the glue removing device is in an empty state, the manipulator grabs the feeding frame which completes plastic packaging from the second plastic packaging device and puts the feeding frame into the glue removing device, the glue removing device removes glue from products on the feeding frame, and when the glue removing device detects that the glue removing device completes glue removing, the manipulator returns to execute the step A06; when the manipulator exits the standby state, the manipulator returns to continue to execute the steps A01 to A06 after completing any one of the steps B01 to B04 which is currently executed, and the manipulator continues to execute the steps B01 to B04 until entering the standby state again.
The control method of the semiconductor plastic package automatic feeding system, wherein the step S06 further includes: when the manipulator finishes the transferring of the feeding frame, the manipulator identifies and grabs a cleaning tool to clean the glue removing device.
An automatic feeding system for semiconductor plastic packaging comprises a PLC control device, a manipulator, a chip arranging device, a feeding device, a first plastic packaging device, a glue removing device and a workbench, wherein the chip arranging device, the feeding device, the first plastic packaging device, the glue removing device and the workbench are arranged around the manipulator; the manipulator is respectively in communication connection with the chip arranging device, the feeding device, the first plastic packaging device and the glue removing device through the PLC control device; the semiconductor plastic packaging automatic feeding system can be used for executing the control method of the semiconductor plastic packaging automatic feeding system.
The automatic semiconductor plastic package feeding system further comprises a second plastic package device arranged around the manipulator, and the manipulator is in communication connection with the second plastic package device through a PLC control device.
The automatic semiconductor plastic package feeding system is characterized in that a cleaning tool capable of being grabbed by a mechanical arm is arranged on the glue removing device, and the cleaning tool is used for cleaning waste materials on the glue removing device.
The automatic semiconductor plastic package feeding system is characterized in that the cleaning tool is an air blow gun.
Has the advantages that:
compared with the prior art, the automatic feeding system for semiconductor plastic packaging and the control method thereof have the advantages that the chip arranging device, the feeding device, the first plastic packaging device, the glue removing device and the workbench are arranged around the manipulator, the manipulator operates a plurality of production devices through the control method, the production automation is realized, the production efficiency is greatly improved, the working strength of workers is reduced, meanwhile, the labor cost is reduced, and one person can monitor and operate the plastic packaging process.
Drawings
Fig. 1 is a schematic step diagram of a control method of an automatic semiconductor plastic packaging feeding system according to the present invention.
Fig. 2 is a schematic structural diagram of an automatic semiconductor plastic packaging feeding system according to the present invention.
Description of the main element symbols: 10-mechanical arm, 20-chip arranging device, 30-feeding device, 40-first plastic packaging device, 50-second plastic packaging device, 60-glue removing device, 70-workbench, 80-feeding frame and 90-feeding frame.
Detailed Description
The invention provides an automatic feeding system for semiconductor plastic package and a control method thereof, and in order to make the purpose, technical scheme and effect of the invention clearer and clearer, the invention is further described in detail below by referring to the attached drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the scope of the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other suitable relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-2, the present invention provides a method for controlling an automatic feeding system for semiconductor plastic packaging, comprising the following steps:
A01. when the manipulator 10 detects that the sheet discharging device 20 is in an idle state, the manipulator 10 recognizes and grasps the empty sheet feeding frame 80 and places the empty sheet feeding frame 80 to the sheet discharging device 20, the sheet discharging device 20 discharges the empty sheet feeding frame 80, and the sheet discharging device 20 is used for discharging the lead frames on the sheet feeding frame 80 with the fixing function.
A02. When the manipulator 10 detects that the chip arranging device 20 finishes chip arranging, the manipulator 10 picks the loading frame 80 which finishes chip arranging from the chip arranging device 20 and puts the loading frame into the first plastic packaging device 40, and the first plastic packaging device 40 feeds back a first signal to the manipulator 10; the feedback first signal is used to indicate that the loading frame 80 is placed in the first plastic packaging device 40.
A03. When the manipulator 10 detects that the feeding device 30 is in an empty state, the manipulator 10 recognizes and grasps the empty feeding rack 90 and puts the empty feeding rack 30, the feeding device 30 puts the empty feeding rack 90, and the feeding device 30 is used for putting plastic package particles into the feeding rack 90.
A04. When the manipulator 10 detects that the feeding device 30 finishes feeding, the manipulator 10 grabs the feeding frame 90 which finishes feeding from the feeding device 30 and sends the feeding frame 90 into the first plastic packaging device 40 for feeding, and the manipulator 10 controls the feeding frame 90 to feed plastic packaging particles into the die holes corresponding to the lead frames on the feeding frame 80; after the manipulator 10 finishes feeding, the feeding frame 90 is placed back to the feeding device 30 and enters a standby state, the feeding device 30 carries out the next round of feeding on the feeding frame 90, the first plastic packaging device 40 carries out plastic packaging on products on the feeding frame 80, and the semiconductor devices on the feeding frame 80 are subjected to die assembly.
A05. The manipulator 10 waits until detecting that the first plastic packaging device 40 finishes plastic packaging, the first plastic packaging device 40 opens the die, the manipulator 10 grabs the feeding frame 80 which finishes plastic packaging from the first plastic packaging device 40, puts to the glue removing device 60 and enters the standby state again to wait for the glue removing device 60 to finish glue removing, and the glue removing device 60 removes glue from the product on the feeding frame 80 for removing waste rim charge on the semiconductor product.
A06. When the manipulator 10 detects that the glue removing device 60 finishes removing glue, the manipulator 10 grabs the feeding frame 80 which finishes removing glue from the glue removing device 60 and transfers the feeding frame to the workbench 70, and semiconductor devices of the feeding frame 80 are fed on the workbench 70 manually or by equipment; if the production task is completed, the process is ended, otherwise, the steps A01 to A06 are repeatedly executed.
Through the arrangement, automatic production is realized, the production efficiency of the plastic packaging process is greatly improved, the labor intensity of workers is reduced, misoperation caused by manual work is avoided, meanwhile, the labor cost is reduced, and one person can complete monitoring and operation of the plastic packaging process. The above-mentioned chip arranging device 20, the feeding device 30, the first plastic sealing device 40, and the glue removing device 60 are preferably a chip arranging machine, a plastic sealing material feeding machine, a plastic sealing machine, and a glue removing machine, respectively, for semiconductor production.
Referring to fig. 1-2, in order to further improve the production efficiency, in some embodiments, when the manipulator 10 is in the standby state during the steps a01 to a06, the following steps are performed:
B01. if the manipulator 10 detects that the film arranging device 20 is in an empty state, the manipulator 10 identifies and grabs an empty film feeding frame 80 and puts the empty film feeding frame 80 to the film arranging device 20, and the film arranging device 20 carries out film arrangement on the empty film feeding frame 80; B02. if the manipulator 10 detects that the chip arranging device 20 finishes chip arranging and the second plastic packaging device 50 is in an empty state, the manipulator 10 grabs the loading frame 80 which finishes chip arranging from the chip arranging device 20 and puts the loading frame into the second plastic packaging device 50, and the second plastic packaging device 50 feeds back a second signal to the manipulator 10; B03. if the manipulator 10 detects that the feeding device 30 finishes discharging and receives a second signal, the manipulator 10 grabs the feeding frame 90 which finishes discharging from the feeding device 30 and sends the feeding frame into the second plastic packaging device 50 for feeding, the manipulator 10 returns the feeding frame 90 to the feeding device 30 after feeding is finished, and the feeding device 30 carries out next round of discharging on the feeding frame 90; B04. if the manipulator 10 detects that the second plastic packaging device 50 completes plastic packaging and the glue removing device 60 is in an empty state, the manipulator 10 grabs the feeding frame 80 which completes plastic packaging from the second plastic packaging device 50 and puts the feeding frame into the glue removing device 60, the glue removing device 60 removes glue from products on the feeding frame 80, and when the glue removing device 60 is detected to complete glue removal, the step A06 is executed in a returning mode.
In the process of executing the above steps B01 to B04, when the manipulator 10 exits the standby state, the manipulator 10 returns to continue executing the steps a01 to a06 after completing any one of the steps B01 to B04 that is currently being executed, without affecting the execution of the steps a01 to a06, and continues executing the steps B01 to B04 until the manipulator 10 enters the standby state again. By the control method, the standby time period of the manipulator 10 is effectively utilized, the time period mainly comprises the plastic packaging time and the glue removing time, and a next round of products are produced in the process of producing one round of products, so that the production efficiency is greatly improved.
Preferably, the step S06 further includes: when the manipulator 10 finishes the transferring of the feeding frame 80, the manipulator 10 recognizes and grabs a cleaning tool to clean the glue removing device 60, so that the plastic packaging waste remained on the glue removing device 60 is clear, the neatness of the glue removing device 60 after glue removing is kept, and the production environment is optimized.
Referring to fig. 1-2, the present invention further provides an automatic semiconductor plastic packaging feeding system, which includes a PLC control device, a manipulator 10, a sheet arrangement device 20, a feeding device 30, a first plastic packaging device 40, a glue removal device 60 and a workbench 70, which are arranged around the manipulator 10, wherein the workbench 70 is provided with a plurality of feeding frames 80 and feeding frames 90 which can be grasped by the manipulator 10; the manipulator 10 is in communication connection with the chip arranging device 20, the feeding device 30, the first plastic packaging device 40 and the glue removing device 60 through a PLC control device, so that information interaction among the devices is realized.
In some embodiments, the device further comprises a second plastic packaging device 50 arranged around the manipulator 10, wherein the manipulator 10 is in communication connection with the second plastic packaging device 50 through a PLC control device; by arranging the second plastic packaging device 50, the manipulator 10 starts the next round of production of semiconductor devices within the plastic packaging time or the glue removing time, and the production efficiency is further improved.
Preferably, the glue removing device 60 is provided with a cleaning tool which can be grabbed by the manipulator 10, so that the manipulator 10 can clean production waste on the glue removing device 60 after each production; the cleaning tool is used for cleaning waste materials on the glue removing device 60, and the cleaning tool is preferably an air blowing gun
Through the arrangement, the automatic semiconductor plastic packaging feeding system can realize the automatic control of one manipulator 10 on a plurality of production devices, so that the labor cost is effectively reduced, and the production efficiency is improved; in addition, the above semiconductor plastic packaging automatic feeding system can be used for executing the control method of the semiconductor plastic packaging automatic feeding system, and since the control method of the semiconductor plastic packaging automatic feeding system is described in detail above, no further description is given here.
It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the protective scope of the present invention.
Claims (7)
1. A control method of a semiconductor plastic package automatic feeding system is characterized by comprising the following steps:
A01. when the manipulator detects that the film arranging device is in an idle state, the manipulator identifies and grabs an idle feeding frame and puts the idle feeding frame to the film arranging device, and the film arranging device arranges the film on the idle feeding frame;
A02. when the manipulator detects that the chip arranging device finishes chip arranging, the manipulator grabs a loading frame which finishes chip arranging from the chip arranging device and puts the loading frame into a first plastic packaging device, and the first plastic packaging device feeds back a first signal to the manipulator;
A03. when the manipulator detects that the feeding device is in an empty state, the manipulator identifies and grabs an empty feeding rack and puts the empty feeding rack to the feeding device, and the feeding device puts the empty feeding rack;
A04. when the manipulator detects that the feeding device finishes feeding, the manipulator picks a feeding frame which finishes feeding from the feeding device and sends the feeding frame into the first plastic packaging device for feeding, after the manipulator finishes feeding, the feeding frame is put back to the feeding device and enters a standby state, the feeding device carries out feeding of the next round on the feeding frame, and the first plastic packaging device carries out plastic packaging on products on a feeding frame;
A05. when the manipulator detects that the first plastic packaging device completes plastic packaging, the manipulator picks a material loading frame which completes plastic packaging from the first plastic packaging device, puts the material loading frame to a glue removing device and enters a standby state, and the glue removing device removes glue from products on the material loading frame;
A06. when the manipulator detects that the glue removing device finishes glue removing, the manipulator grabs the feeding frame which finishes glue removing from the glue removing device and transfers the feeding frame to the workbench;
if the production task is completed, the process is ended, otherwise, the steps A01 to A06 are repeatedly executed.
2. The method for controlling the automatic feeding system for semiconductor plastic packages according to claim 1, wherein in the process of performing the steps a01 to a06, when the manipulator is in a standby state, the following steps are performed:
B01. if the manipulator detects that the film arranging device is in an empty state, the manipulator identifies and grabs an empty film feeding frame and puts the empty film feeding frame to the film arranging device, and the film arranging device arranges the film on the empty film feeding frame;
B02. if the manipulator detects that the chip arranging device finishes chip arranging and the second plastic packaging device is in an empty state, the manipulator grabs a loading frame which finishes chip arranging from the chip arranging device and puts the loading frame into the second plastic packaging device, and the second plastic packaging device feeds back a second signal to the manipulator;
B03. if the manipulator detects that the feeding device finishes feeding and receives a second signal, the manipulator grabs a feeding rack for feeding from the feeding device and sends the feeding rack into a second plastic packaging device for feeding, the manipulator returns the feeding rack to the feeding device after feeding, and the feeding device carries out the next round of feeding on the feeding rack;
B04. if the manipulator detects that the second plastic packaging device completes plastic packaging and the glue removing device is in an empty state, the manipulator grabs the feeding frame which completes plastic packaging from the second plastic packaging device and puts the feeding frame into the glue removing device, the glue removing device removes glue from products on the feeding frame, and when the glue removing device detects that the glue removing device completes glue removing, the manipulator returns to execute the step A06;
when the manipulator exits the standby state, the manipulator returns to continue to execute the steps A01 to A06 after completing any one of the steps B01 to B04 which is currently executed, and the manipulator continues to execute the steps B01 to B04 until entering the standby state again.
3. The method for controlling the automatic semiconductor plastic package feeding system according to claim 2, wherein the step S06 further comprises: when the manipulator finishes the transferring of the feeding frame, the manipulator identifies and grabs a cleaning tool to clean the glue removing device.
4. The automatic semiconductor plastic package feeding system is characterized by comprising a PLC (programmable logic controller) control device, a manipulator, a chip arranging device, a feeding device, a first plastic package device, a glue removing device and a workbench, wherein the chip arranging device, the feeding device, the first plastic package device, the glue removing device and the workbench are arranged around the manipulator; the manipulator is in communication connection with the sheet discharging device, the feeding device, the first plastic packaging device and the glue removing device through the PLC control device.
5. The automatic semiconductor plastic package feeding system according to claim 4, further comprising a second plastic package device disposed around the manipulator, wherein the manipulator is in communication connection with the second plastic package device through a PLC control device.
6. The automatic semiconductor plastic package feeding system according to claim 5, wherein a cleaning tool capable of being grasped by a manipulator is arranged on the glue removing device, and the cleaning tool is used for cleaning waste materials on the glue removing device.
7. The automatic semiconductor plastic package feeding system according to claim 6, wherein the cleaning tool is configured as an air blow gun.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010112263.7A CN111354651A (en) | 2020-02-24 | 2020-02-24 | Semiconductor plastic package automatic feeding system and control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010112263.7A CN111354651A (en) | 2020-02-24 | 2020-02-24 | Semiconductor plastic package automatic feeding system and control method thereof |
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Cited By (1)
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| WO2023123198A1 (en) * | 2021-12-30 | 2023-07-06 | 佛山市蓝箭电子股份有限公司 | Semiconductor plastic packaging automatic loading system and control method therefor |
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Application publication date: 20200630 |