CN113058874A - Multichannel semiconductor wafer screening installation - Google Patents
Multichannel semiconductor wafer screening installation Download PDFInfo
- Publication number
- CN113058874A CN113058874A CN202110384353.6A CN202110384353A CN113058874A CN 113058874 A CN113058874 A CN 113058874A CN 202110384353 A CN202110384353 A CN 202110384353A CN 113058874 A CN113058874 A CN 113058874A
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- CN
- China
- Prior art keywords
- detection unit
- semiconductor wafer
- carrying device
- manipulator
- detection
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C2301/00—Sorting according to destination
- B07C2301/0008—Electronic Devices, e.g. keyboard, displays
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to the technical field of semiconductor equipment, in particular to multichannel semiconductor wafer screening equipment. The mechanical arm carrying device is arranged at one end of the working platform, the detection unit is arranged at the other end of the working platform, the mechanical arm carrying device and the detection unit are arranged correspondingly, and the material box surrounds the mechanical arm carrying device. The invention has the advantages that: the defects of the wafers are detected optically, the wafers are placed in a classified mode according to detection results, equipment can be automatically fed in a detection and classification mode, manual work is not needed, production efficiency can be improved, and production cost can be reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to multichannel semiconductor wafer screening equipment.
Background
Wafer defect detection is one of important steps for ensuring the product yield, has higher requirements on detection precision and speed, and currently, imported equipment is generally adopted in China, and cannot meet the production rhythm of domestic quick response due to high price and long delivery period of the imported equipment.
The prior art has the following disadvantages:
1) the wafer testing machine is unstable, and the misjudgment rate is high; 2) it is difficult to detect micro defects; 3) the magazine can only store a small amount of wafers, and the magazine needs to be replaced frequently by manpower, so that the detection efficiency is influenced.
Disclosure of Invention
It is an object of the present invention to provide a multi-channel semiconductor wafer screening apparatus to overcome the above-mentioned deficiencies of the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a multichannel semiconductor wafer screening apparatus, characterized by: the automatic detection device comprises an equipment rack, a working platform arranged in the equipment rack, a plurality of material boxes arranged on the equipment platform, a detection unit and a manipulator carrying device, wherein the manipulator carrying device is arranged at one end of the working platform, the detection unit is arranged at the other end of the working platform, the manipulator carrying device and the detection unit are correspondingly arranged, and the material boxes surround the manipulator carrying device;
the detection unit comprises a detection unit fixing mounting seat, a rotating motor arranged on the detection unit fixing mounting seat, a rotating carrier arranged at the end part of the rotating motor, an inductor mounting block arranged at the end part of the detection unit fixing mounting seat, a defect detector arranged on the inductor mounting block and a position corrector arranged on the inductor mounting block, wherein the defect detector is arranged corresponding to the rotating carrier, the position corrector is arranged at the upper position of the rotating carrier, and an adsorption hole is formed in the rotating carrier;
the material boxes are provided with optical fiber sensors;
manipulator handling device is including setting up Z axle control machine on work platform, connecting in the primary shaft on Z axle control machine, connecting in the epaxial secondary shaft of primary shaft, connecting in the epaxial third axle of secondary and connecting in the epaxial mechanical clamping jaw of third, be provided with detection sensor on the mechanical clamping jaw.
Preferably, the equipment rack is provided with a touch screen, a control button and a rotary switch.
Preferably, a vacuum chuck is arranged on the mechanical clamping jaw.
Preferably, the cartridge includes a discharge cartridge and a waste cartridge.
The invention has the beneficial effects that: the optical detection device is simple in structure, defects of the wafers are detected optically, the wafers are placed in a classified mode according to detection results, the classified feeding of the optical detection device can be automatically operated without manpower, the production efficiency can be improved, and the production cost can be reduced; a four-axis manipulator is adopted, the repeated positioning precision of the manipulator can reach 0.1mm, the cleanliness is ISO class 1, a vacuum sucker is arranged on a gripper, the gripper can be quickly moved to the next station after an object is taken, and the four-axis manipulator has the advantages of high precision, high stability, high cleanliness and space saving; the magazine is designed into a multilayer structure, a plurality of wafers can be stored at one time, the structure can greatly save the storage volume of products, the space of the equipment is utilized more sufficiently, and the equipment is more compact.
Drawings
FIG. 1 is a top view of a multi-channel semiconductor wafer screening apparatus of the present invention;
FIG. 2 is a side view of a multi-channel semiconductor wafer screening apparatus of the present invention;
FIG. 3 is a schematic view of a robot handling apparatus of a multi-channel semiconductor wafer screening apparatus according to the present invention;
FIG. 4 is a schematic view of a magazine of a multi-channel semiconductor wafer screening apparatus according to the present invention;
FIG. 5 is a schematic diagram of a detecting unit of the multi-channel semiconductor wafer screening apparatus according to the present invention;
in the figure: 1. an equipment rack; 11; a touch screen; 12. a control button; 13. a rotary switch; 2. a working platform; 3. a magazine; 31. an optical fiber sensor; 4. a detection unit; 41 detection unit fixing mounting seats and 42; a rotating electric machine; 43. rotating the carrying platform; 44. an inductor mounting block; 45. a defect detector; 46. a position corrector; 47. an adsorption hole; 5. a manipulator conveyance device; 51. a Z-axis controller; 52. a first shaft; 53. a second shaft; 54. a third axis; 55. a mechanical jaw; 56. and detecting the sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 to 5, the present embodiment is a multichannel semiconductor wafer screening apparatus, including an apparatus frame 1, a work platform 2 disposed in the apparatus frame 1, a plurality of magazines 3 mounted on the apparatus platform 2, a detection unit 4, and a robot handling device 5, where the robot handling device 5 is disposed at one end of the work platform 2, the detection unit 4 is disposed at the other end of the work platform 2, the robot handling device 5 is disposed corresponding to the detection unit 4, and the magazines 3 are disposed around the robot handling device 5;
the detection unit 4 comprises a detection unit fixing mounting base 41, a rotating motor 42 arranged on the detection unit fixing mounting base 41, a rotating stage 43 arranged at the end part of the rotating motor 42, an inductor mounting block 44 arranged at the end part of the detection unit fixing mounting base 41, a defect detector 45 arranged on the inductor mounting block 44 and a position corrector 46 arranged on the inductor mounting block 44, wherein the defect detector 45 is arranged corresponding to the rotating stage 43, the position corrector 46 is arranged at the upper position of the rotating stage 43, and an adsorption hole 47 is formed in the rotating stage 43; when in detection, the manipulator places the product on a rotary carrying platform, and then the adsorption air on the carrying platform adsorbs the product on the platform. The rotary platform rotates, the defect detection camera detects surface defects of the product, and the position corrector records the position offset of the product. And then sending the detection result and the correction result to a manipulator, adjusting the material taking and placing positions by the manipulator according to the offset, and respectively placing the good products and the defective products into corresponding material boxes.
The material boxes 3 are provided with optical fiber sensors 31; magazine 3 designs into multilayer column structure, once can deposit polylith wafer, and product storage volume can be saved to very big degree to this structure, and is more sufficient with equipment space utilization, and whether the equipment accomplishes compacter optical fiber sensor detectable magazine in the assigned position, and the position precision of magazine is guaranteed to the stopper, makes the manipulator get the blowing more accurate.
The manipulator conveying device 5 includes a Z-axis controller 51 disposed on the work platform 2, a first shaft 52 connected to the Z-axis controller 51, a second shaft 53 connected to the first shaft 52, a third shaft 54 connected to the second shaft 53, and a mechanical gripper 55 connected to the third shaft 54, and the mechanical gripper 55 is provided with a detection sensor 56. The manipulator carrying unit adopts a four-axis robot, wherein the Z axis controls the mechanical arm to move up and down, and the first axis, the second axis, the third axis and the third axis control the arm to rotate. There is the detection sensor in third axle joint department, and this sensor discerns the magazine that will get material and blowing during operation, records product position and the magazine vacancy position that will place. The manipulator can achieve the repeated positioning accuracy of 0.1mm and the cleanliness ISO level of 1, the vacuum chuck is arranged on the gripper, the gripper can rapidly move to the next station after an object is taken, and the manipulator has the advantages of being high in accuracy, stability and cleanliness, saving in space and the like.
Preferably, the equipment rack 1 is provided with a touch screen 11, a control button 12 and a rotary switch 13.
Preferably, a vacuum chuck is arranged on the mechanical clamping jaw 55. Can be quickly moved to the next station after taking the article, and has the characteristics of high precision, high stability, high cleanliness, space saving and the like
Preferably, the cartridge includes a discharge cartridge and a waste cartridge. Waste materials with problems at the detection positions are respectively placed, and products are placed into the material placing box according to different models.
This embodiment is when implementing, grabs the product through mechanical clamping jaw, controls the arm up-and-down motion through the Z axle, and primary shaft, secondary shaft, third axle control arm rotary motion are discerned the magazine that will get material and blowing through detecting sensor to record product position and the magazine vacancy position that will place, detect again, rotatory microscope carrier is placed with the product to mechanical clamping jaw when detecting, then the absorption hole on the microscope carrier is with the product absorption on the platform. The rotary platform rotates, the defect detection camera detects surface defects of the product, and the position corrector records the position offset of the product. And then, the detection result and the correction result are sent to the mechanical clamping jaw, the mechanical clamping jaw is adjusted according to the offset to take and discharge the materials, the good products and the defective products are respectively placed into the corresponding material boxes, whether the material box is at the designated position can be detected by the optical fiber sensor, the position precision of the material box is ensured by the limiting block, the mechanical clamping jaw is matched for use, and the material taking and discharging are more accurate.
The wafer sorting and feeding device has the advantages that the structure is simple, the defects of the wafers are detected by adopting the optics, the wafers are placed in a sorting mode according to the detection result, the device can automatically run in the process of detecting, sorting and feeding, the labor is not needed, the production efficiency can be improved, and the production cost can be reduced; a four-axis manipulator is adopted, the repeated positioning precision of the manipulator can reach 0.1mm, the cleanliness is ISO class 1, a vacuum sucker is arranged on a gripper, the gripper can be quickly moved to the next station after an object is taken, and the four-axis manipulator has the advantages of high precision, high stability, high cleanliness and space saving; the magazine is designed into a multilayer structure, a plurality of wafers can be stored at one time, the structure can greatly save the storage volume of products, the space of the equipment is utilized more sufficiently, and the equipment is more compact.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (4)
1. A multichannel semiconductor wafer screening apparatus, characterized by: the automatic detection device comprises an equipment rack, a working platform arranged in the equipment rack, a plurality of material boxes arranged on the equipment platform, a detection unit and a manipulator carrying device, wherein the manipulator carrying device is arranged at one end of the working platform, the detection unit is arranged at the other end of the working platform, the manipulator carrying device and the detection unit are correspondingly arranged, and the material boxes surround the manipulator carrying device;
the detection unit comprises a detection unit fixing mounting seat, a rotating motor arranged on the detection unit fixing mounting seat, a rotating carrier arranged at the end part of the rotating motor, an inductor mounting block arranged at the end part of the detection unit fixing mounting seat, a defect detector arranged on the inductor mounting block and a position corrector arranged on the inductor mounting block, wherein the defect detector is arranged corresponding to the rotating carrier, the position corrector is arranged at the upper position of the rotating carrier, and an adsorption hole is formed in the rotating carrier;
the material boxes are provided with optical fiber sensors;
manipulator handling device is including setting up Z axle control machine on work platform, connecting in the primary shaft on Z axle control machine, connecting in the epaxial secondary shaft of primary shaft, connecting in the epaxial third axle of secondary and connecting in the epaxial mechanical clamping jaw of third, be provided with detection sensor on the mechanical clamping jaw.
2. A multi-channel semiconductor wafer screening apparatus as claimed in claim 1, wherein: the equipment rack is provided with a touch screen, a control button and a rotary switch.
3. A multi-channel semiconductor wafer screening apparatus as claimed in claim 1, wherein: and a vacuum chuck is arranged on the mechanical clamping jaw.
4. A multi-channel semiconductor wafer screening apparatus as claimed in claim 1, wherein: the material box comprises a material placing box and a waste material box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110384353.6A CN113058874A (en) | 2021-04-09 | 2021-04-09 | Multichannel semiconductor wafer screening installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110384353.6A CN113058874A (en) | 2021-04-09 | 2021-04-09 | Multichannel semiconductor wafer screening installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113058874A true CN113058874A (en) | 2021-07-02 |
Family
ID=76566178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110384353.6A Pending CN113058874A (en) | 2021-04-09 | 2021-04-09 | Multichannel semiconductor wafer screening installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113058874A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112722832A (en) * | 2020-12-11 | 2021-04-30 | 三河建华高科有限责任公司 | Efficient loading and unloading system |
| CN114944351A (en) * | 2022-04-24 | 2022-08-26 | 济南鲁晶半导体有限公司 | Semiconductor wafer chip classification device |
| WO2023134168A1 (en) * | 2022-01-14 | 2023-07-20 | 上海世禹精密机械有限公司 | Automated ball-planting testing system using welding ball array packaging |
| CN116759330A (en) * | 2023-04-07 | 2023-09-15 | 上海感图网络科技有限公司 | Data processing method, device and storage medium |
-
2021
- 2021-04-09 CN CN202110384353.6A patent/CN113058874A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112722832A (en) * | 2020-12-11 | 2021-04-30 | 三河建华高科有限责任公司 | Efficient loading and unloading system |
| WO2023134168A1 (en) * | 2022-01-14 | 2023-07-20 | 上海世禹精密机械有限公司 | Automated ball-planting testing system using welding ball array packaging |
| CN114944351A (en) * | 2022-04-24 | 2022-08-26 | 济南鲁晶半导体有限公司 | Semiconductor wafer chip classification device |
| CN116759330A (en) * | 2023-04-07 | 2023-09-15 | 上海感图网络科技有限公司 | Data processing method, device and storage medium |
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