CN113458995A - Flip-chip polytetrafluoroethylene semiconductor wafer anchor clamps - Google Patents
Flip-chip polytetrafluoroethylene semiconductor wafer anchor clamps Download PDFInfo
- Publication number
- CN113458995A CN113458995A CN202110674881.5A CN202110674881A CN113458995A CN 113458995 A CN113458995 A CN 113458995A CN 202110674881 A CN202110674881 A CN 202110674881A CN 113458995 A CN113458995 A CN 113458995A
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- China
- Prior art keywords
- clamp
- semiconductor wafer
- bottom plate
- hole
- fixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 title claims abstract description 9
- -1 polytetrafluoroethylene Polymers 0.000 title claims abstract description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 3
- 238000007667 floating Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明公开了一种倒装式聚四氟乙烯半导体晶片夹具，可将半导体晶片以倒置的方式夹持，包含夹具主体、夹具底板、螺母和螺杆四个结构。所述夹具主体的中心设计了一个凹腔，用于放置半导体晶片。为了防止倒置后的晶片脱落，设计了一个夹具底板。夹具底板中心有一个中心通孔，且该中心通孔直径小于半导体晶片直径。夹具主体和夹具底板通过四个螺杆连接。另外，螺杆长度的长度远大于夹具主体固定通孔和夹具底板固定通孔长度之和，螺杆顶端突出于夹具底板，起到一个支撑腿的作用，这种设计有利于溶液通过夹具底板中心通孔进行溶液交换，提高溶液反应效率。
The invention discloses a flip-chip polytetrafluoroethylene semiconductor wafer clamp, which can clamp the semiconductor wafer in an upside-down manner, comprising four structures of a clamp main body, a clamp bottom plate, a nut and a screw rod. A cavity is designed in the center of the main body of the fixture for placing the semiconductor wafer. In order to prevent the inverted wafer from falling off, a jig bottom plate is designed. There is a central through hole in the center of the fixture bottom plate, and the diameter of the central through hole is smaller than the diameter of the semiconductor wafer. The main body of the fixture and the bottom plate of the fixture are connected by four screws. In addition, the length of the screw is much greater than the sum of the length of the fixing through hole of the fixture body and the fixing through hole of the fixture bottom plate. The top of the screw protrudes from the fixture bottom plate and acts as a support leg. This design is beneficial for the solution to pass through the central through hole of the fixture bottom plate. Carry out solution exchange to improve the efficiency of solution reaction.
Description
Technical Field
The invention relates to a semiconductor photoelectric detector manufacturing technology, in particular to a clamp applied to wafer surface treatment.
Background
The photoelectric detector is manufactured by a semiconductor wafer through processes of multi-step photoetching, film growing, etching, cleaning, polishing, scribing and the like. In the wafer manufacturing process, cleaning or floating after each step of photoetching is an important process. The process involves clamping the wafer. Researches show that compared with a mode that the wafer is vertically arranged or the front side of the wafer is upwards clamped, the inverted clamping mode can reduce the surface defects of the wafer and improve the yield of the detector.
Conventional wafer chucks use a vertical or right side up orientation to position the wafer in a vertical or horizontal slot. The clamping mode of the clamp cannot solve the problem that after the photoresist is removed, a small amount of pollutants such as particles, fibers, organic matters or metal films and the like on the photoresist are adhered to the surface of the wafer, and the pollutants are difficult to remove from the surface of the semiconductor wafer under the action of electrostatic adsorption, so that various defects are generated on the surface of the wafer, and the yield of the manufactured detector is reduced.
Disclosure of Invention
The purpose of the invention is as follows: the problem that pollutants are possibly brought to the surface of a wafer by a clamping mode of a conventional clamp in the process of photoresist floating or wafer cleaning is solved. Therefore, the inverted polytetrafluoroethylene semiconductor wafer clamp is designed. The clamp only contacts a 1 mm-2 mm circular ring area at the edge of the semiconductor wafer, and other effective areas on the surface of the wafer are not damaged at all. The central through hole of the clamp bottom plate and the longer support screw design also facilitate the solution exchange on the wafer surface. In addition, the cleaning or glue floating effect of the wafer can be greatly improved by matching ultrasonic or megasonic cleaning.
The technical scheme of the invention is as follows:
the clamp comprises a clamp main body, a clamp bottom plate, a nut and a screw rod, wherein the clamp main body and the clamp bottom plate are fixed together through the nut and the screw rod. The clamp body comprises a clamp body fixing through hole for mounting the screw rod and a cavity for placing the wafer. The clamp bottom plate comprises a clamp bottom plate fixing through hole and a central through hole, wherein the clamp bottom plate fixing through hole is provided with a screw rod. The inner diameter of the concave cavity on the clamp body is determined according to the diameter of the clamped wafer and can be 0.5 mm-1.0 mm larger than the diameter of the semiconductor wafer. The depth of the cavity is determined according to the thickness of the clamped wafer and can be 5.0-10.0 μm larger than the thickness of the semiconductor wafer. The diameter of the central through hole on the bottom plate of the clamp is 1.0 mm-2.0 mm smaller than the diameter of the semiconductor wafer.
The semiconductor wafer is arranged in a concave cavity in the center of the clamp main body, the inner diameter of the concave cavity is 0.5-1.0 mm larger than the diameter of the wafer, and the depth of the concave cavity is 5.0-10.0 mu m larger than the thickness of the wafer. A certain number of main body fixing through holes are uniformly distributed on the periphery of the concave cavity of the clamp main body, and positioning grooves are formed in the edge positions of the front side of the clamp main body.
To hold the inverted semiconductor wafer in the pocket, a chuck base plate is designed. The clamp bottom plate is connected with the clamp main body through four screws, and simultaneously clamps the wafer in the concave cavity. The diameter of the clamp bottom plate is the same as that of the clamp main body, a central through hole is formed in the center of the clamp bottom plate, and the diameter of the central through hole is smaller than the diameter of the wafer by 1.0-2.0 mm. Bottom plate fixing through holes are uniformly distributed around the through holes of the clamp bottom plate, and the bottom plate fixing through holes correspond to the clamp main body fixing through holes in number, diameter and direction one by one. The edge of the bottom plate of the clamp is provided with positioning bosses which correspond to the positioning grooves on the side of the main body of the clamp one by one, and the positioning bosses can be completely embedded into the positioning grooves.
Furthermore, a square concave cavity is formed in the circular edge of the concave cavity of the clamp main body, so that the tweezers can conveniently clamp the wafer.
Furthermore, the screw rod is connected with the clamp main body and the clamp bottom plate, so that the clamp main body and the clamp bottom plate are connected, and the screw rod also has the purpose of a positioning pin.
Furthermore, the central through hole of the bottom plate of the clamp and the longer screw rod can support the clamp at a certain height, so that the exchange between the surface of the wafer and the solution is improved.
Further, the diameter of the clamp main body is the same as that of the clamp bottom plate, and the circle centers of the clamp main body and the clamp bottom plate correspond to each other. The concave cavity of the clamp main body corresponds to the center of the center through hole of the clamp bottom plate.
Drawings
The drawings that are required to be used in the description of the embodiments will now be briefly described. The drawings described below are only embodiments of the invention, and other drawings can be derived from them without inventive effort.
FIG. 1 is a cross-sectional view of a flip-chip PTFE semiconductor wafer holder of the present invention;
wherein: 1 is a clamp main body, 2 is a clamp bottom plate, 3-position nuts, 4 is a screw, 1-1 is a clamp main body fixing through hole, 2-1 is a clamp bottom plate fixing through hole, 1-2 is a clamp main body concave cavity, and 2-2 is a clamp bottom plate central through hole.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
First, the examples described herein are specific embodiments of the present invention, are intended to illustrate the concept of the present invention, are illustrative and exemplary, and should not be construed as limiting the embodiments of the present invention and the scope of the present invention. In addition, other technical solutions which are obvious for a person skilled in the relevant art based on the disclosure of the present claims and the specification can be adopted, and the technical solutions comprise the solutions adopting any obvious replacement or modification of the embodiments described herein.
Next, the drawings of the present specification are only for illustrating a schematic view of the inventive concept, and are only for illustrating the interrelationship between the respective components. The above schematic diagrams are merely examples, which should not limit the scope of the present invention herein.
FIG. 1 is a schematic view of a flip-chip type PTFE semiconductor wafer chuck according to the present invention, which comprises a chuck body, a chuck base plate, a nut, and a screw. The semiconductor wafer is positioned between the fixture body cavity 1-2 and the fixture bottom plate central through hole 2-2.
The fixture main body 1 is of a disc structure as a whole and comprises a concave cavity 1-2 and a main body fixing through hole 1-1. The concave cavity 1-2 is a circular shallow pit, and the circle center of the concave cavity is overlapped with that of the clamp main body. If the semiconductor wafer has a diameter of 50mm and a thickness of 350 μm, the diameter of the cavity 1-2 is designed to be 50.5mm to 51.0mm, and the depth of the cavity 1-2 is designed to be 355 μm to 360 μm. And main body fixing through holes 1-1 are formed around the concave cavity 1-2. The clamp bottom plate 2 is of a hollow cylindrical structure and comprises a fixing through hole 2-1 and a central through hole 2-2. The circle center of the central through hole 2-2 coincides with the circle center of the clamp bottom plate. The fixture bottom plate fixing through holes 2-1 and the fixture main body 1 fixing through holes 1-1 are in one-to-one correspondence, and the number and the positions of the fixing through holes need to be kept consistent. The diameter of the central through hole 2-2 of the clamp bottom plate 2 is designed to be 48 mm-49 mm.
The semiconductor wafer holder is typically a teflon material.
The specific implementation mode of the clamp is as follows:
the semiconductor wafer is firstly placed on the cavity 1-2, the back of the wafer is opposite to the cavity 1-2, then the clamp bottom plate 2 is covered on the clamp main body 1, the clamp main body 1 and the clamp bottom plate 2 are screwed together by the nut 3 and the screw rod 4, and then the clamp can be placed in a solution for subsequent process treatment.
It should be noted that the present invention is not limited to the above-mentioned embodiments, and the above-mentioned specific embodiment is only one possible operation example, and any other products in various forms can be designed according to the teaching of the present invention, but any changes in the shape or structure thereof, which have the same or similar technical solutions as the present application, fall within the protection scope of the present invention.
Claims (3)
1. The utility model provides a flip-chip polytetrafluoroethylene semiconductor wafer anchor clamps, includes anchor clamps main part (1), anchor clamps bottom plate (2), nut (3) and screw rod (4), its characterized in that, flip-chip semiconductor wafer anchor clamps main part (1) and anchor clamps bottom plate (2) are fixed together through nut (3) and screw rod (4).
2. The clamp for the flip-chip polytetrafluoroethylene semiconductor wafer according to claim 1, wherein said clamp body (1) is a circular disk having four body fixing through holes (1-1) formed around the periphery thereof, a cavity (1-2) for holding the semiconductor wafer is formed in the center of the clamp body (1), the inner diameter of the cavity (1-2) is 0.5mm to 1.0mm larger than the diameter of the semiconductor wafer to be cleaned, and the depth of the cavity (1-2) is 5.0 μm to 10.0 μm larger than the thickness of the semiconductor wafer to be cleaned.
3. The clamp for a semiconductor wafer of inverted polytetrafluoroethylene according to claim 1, wherein said clamp base plate (2) is a circular disk having four base plate fixing through holes (2-1) formed around the periphery thereof, and a center through hole (2-2) for passing a cleaning solution is formed in the center of the clamp base plate (2), and the diameter of said center through hole (2-2) is smaller than the diameter of the semiconductor wafer by 1.0mm to 2.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110674881.5A CN113458995A (en) | 2021-06-18 | 2021-06-18 | Flip-chip polytetrafluoroethylene semiconductor wafer anchor clamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110674881.5A CN113458995A (en) | 2021-06-18 | 2021-06-18 | Flip-chip polytetrafluoroethylene semiconductor wafer anchor clamps |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113458995A true CN113458995A (en) | 2021-10-01 |
Family
ID=77870363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110674881.5A Pending CN113458995A (en) | 2021-06-18 | 2021-06-18 | Flip-chip polytetrafluoroethylene semiconductor wafer anchor clamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113458995A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3976288A (en) * | 1975-11-24 | 1976-08-24 | Ibm Corporation | Semiconductor wafer dicing fixture |
| US20120145204A1 (en) * | 2010-12-09 | 2012-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spin Chuck for Thin Wafer Cleaning |
| CN104124192A (en) * | 2014-07-29 | 2014-10-29 | 无锡赛晶太阳能有限公司 | Plasma etching silicon wafer clamp |
| US20150187626A1 (en) * | 2013-12-31 | 2015-07-02 | Vijay D. Parkhe | Electrostatic chuck with internal flow adjustments for improved temperature distribution |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN206219703U (en) * | 2016-10-25 | 2017-06-06 | 宁波工程学院 | A kind of Electropolating hangers for wafer |
| CN109457284A (en) * | 2018-12-27 | 2019-03-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor crystal wafer electroplating clamp |
| CN112071800A (en) * | 2020-07-22 | 2020-12-11 | 浙江工业大学 | Handheld clamp for single-sided wet etching |
-
2021
- 2021-06-18 CN CN202110674881.5A patent/CN113458995A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3976288A (en) * | 1975-11-24 | 1976-08-24 | Ibm Corporation | Semiconductor wafer dicing fixture |
| US20120145204A1 (en) * | 2010-12-09 | 2012-06-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Spin Chuck for Thin Wafer Cleaning |
| US20150187626A1 (en) * | 2013-12-31 | 2015-07-02 | Vijay D. Parkhe | Electrostatic chuck with internal flow adjustments for improved temperature distribution |
| CN104124192A (en) * | 2014-07-29 | 2014-10-29 | 无锡赛晶太阳能有限公司 | Plasma etching silicon wafer clamp |
| CN206219703U (en) * | 2016-10-25 | 2017-06-06 | 宁波工程学院 | A kind of Electropolating hangers for wafer |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN109457284A (en) * | 2018-12-27 | 2019-03-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor crystal wafer electroplating clamp |
| CN112071800A (en) * | 2020-07-22 | 2020-12-11 | 浙江工业大学 | Handheld clamp for single-sided wet etching |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20211001 |