CN108555773A - A kind of ultra-thin part grinding and polishing fixture - Google Patents

A kind of ultra-thin part grinding and polishing fixture Download PDF

Info

Publication number
CN108555773A
CN108555773A CN201810100555.1A CN201810100555A CN108555773A CN 108555773 A CN108555773 A CN 108555773A CN 201810100555 A CN201810100555 A CN 201810100555A CN 108555773 A CN108555773 A CN 108555773A
Authority
CN
China
Prior art keywords
grinding
polishing
fixture
ultra
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810100555.1A
Other languages
Chinese (zh)
Other versions
CN108555773B (en
Inventor
李军
王健杰
明舜
朱永伟
左敦稳
黄俊阳
张羽驰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Research Institute Of Nanjing University Of Aeronautics & Astronautics
Nanjing University of Aeronautics and Astronautics
Original Assignee
Wuxi Research Institute Of Nanjing University Of Aeronautics & Astronautics
Nanjing University of Aeronautics and Astronautics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Research Institute Of Nanjing University Of Aeronautics & Astronautics, Nanjing University of Aeronautics and Astronautics filed Critical Wuxi Research Institute Of Nanjing University Of Aeronautics & Astronautics
Priority to CN201810100555.1A priority Critical patent/CN108555773B/en
Publication of CN108555773A publication Critical patent/CN108555773A/en
Application granted granted Critical
Publication of CN108555773B publication Critical patent/CN108555773B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

The present invention provides a kind of ultra-thin part grinding and polishing fixture:It is provided with multiple holes on the working face of the grinding and polishing fixture and ultra-thin part is clamped by negative-pressure adsorption principle;It is regular that multiple holes are provided on the working face of the grinding and polishing fixture.The ultra-thin part grinding and polishing fixture of the present invention is applied widely to the thickness and size of workpiece, to the material of workpiece without particular/special requirement;Fixture uses air pressure as power in load and unloading piece, and shock loading is small, and workpiece is non-breakable, and workpiece is readily cleaned after processing;Workpiece is adsorbed using the regular hole of multiple dispersions, optimizes the arrangement mode and size for determining that regular hole is optimal, stress distribution is uniform in clamping process, avoids workpiece stress caused by stress concentration and deforms;Fixture clamping in actual processing is reliable, and workpiece is broken caused by film flying in reduction processing, improves the yields of processing;Clamp structure is simple, easy to operate, has good popularizing application prospect.

Description

A kind of ultra-thin part grinding and polishing fixture
Technical field
The present invention relates to a kind of Precision Machining fixture, especially a kind of grinding and polishing part clamp, specifically one The ultra-thin part grinding and polishing fixture of kind.
Background technology
For example ultra-thin quartz wafer of thin part, ultra thin silicon wafers, ultra-thin stainless steel substrate, ultra thin glass substrates, ultra-thin germanium single crystal Piece etc. is widely used in the fields such as integrated circuit, solar cell, Flexible Displays, has the very big market demand.Grinding Main processing technology one of of the polishing technology as ultra-thin part, has high in machining efficiency, and process controllability is good, surface and sub- table The advantages such as surface damage is low.Needed during the grinding and polishing of ultra-thin part to workpiece carry out reliable retention, existing ultra-thin zero Part method of clamping mainly has paraffin bonding, the absorption of the surface tension of water, electrostatic chuck absorption or the absorption of hole ceramic-type vacuum cup The methods of.But since workpiece is relatively thin, above-mentioned method of clamping is susceptible to that workpiece is heated or stress deformation in actual processing, processing Unloading piece is difficult afterwards, has remaining paraffin to be difficult to clean on workpiece, the problems such as unreliable is clamped.
Chinese patent CN201510450081.X discloses a kind of universal optical element polishing vacuum fixture, the invention Vacuum clip specifically include a hollow structure formed by support arm, support arm upper end is contacted with polished optical element, Contact position is sealed by seal protection layer, and the hollow structure is connected to outside by aspirating hole.Chinese patent CN201620215121.2 discloses a kind of novel evacuated sucker, the vacuum cup by ring on sucker bottom plate, sucker, sealing ring, The part such as porous ceramic plate forms, and wherein porous ceramic plate is contacted with workpiece, plays the role of absorption clamping.
Invention content
Present invention aims at for workpiece after frangible, yielding, processing present in current ultra-thin part grinding and polishing The problems such as cleaning is difficult, provides a kind of ultra-thin part grinding and polishing fixture, has to ultra-thin part by negative-pressure adsorption principle Effect clamping, the clamp structure is simple, and reliability is high, is not easy film flying during grinding and polishing, workpiece adds without stress, temperature distortion Unloading piece is convenient after work, is readily cleaned.
The technical solution adopted by the present invention is:A kind of ultra-thin part grinding and polishing fixture, in the grinding and polishing fixture It is provided with multiple holes on working face, ultra-thin part is clamped by negative-pressure adsorption principle.
Further, a kind of ultra-thin part grinding and polishing fixture is provided on the working face of the grinding and polishing fixture more A hole is regular.
Further, a kind of ultra-thin part grinding and polishing fixture is provided on the working face of the grinding and polishing fixture more It arranges for array in a hole.
Further, a kind of ultra-thin part grinding and polishing fixture, the array in the hole are arranged size according to workpiece, material Matter, shape are arranged, including fan-shaped distribution, the distribution of the circular arcs such as concentric circles, rectangular distribution, pentagon distribution, hexagon distribution.
Further, a kind of ultra-thin part grinding and polishing fixture, number and the size in the hole meet formula π f1nd2P=μ f2F and formula d=(0.02~0.06) × D;The distance between adjacent holes meets formula L=(1~2) × d;Wherein:π is circle Frequency, f1Friction coefficient between fixture and workpiece, n are the total quantity in regular hole, and d is the diameter dimension in regular hole, and P is folder The negative pressure pressure of tool, μ are safety coefficient, f2For the friction system during grinding and polishing between grinding pad or polishing pad and workpiece Number, F be grinding and polishing during operating pressure, D be fixture working region full-size, L between adjacent holes away from From.
Further, a kind of ultra-thin part grinding and polishing fixture, the grinding and polishing fixture can drive workpiece throwing together According to the reciprocating swing of certain functional relation on ray machine, functional relation includes SIN function formula, cosine function formula, linear function Formula, quadratic function formula.
Further, a kind of ultra-thin part grinding and polishing fixture, the material of the fixture include:It is ceramics, aluminium alloy, stainless Steel, polytetrafluoro.
The present invention compares existing ultra-thin part grinding and polishing method of clamping and has the advantage that:
1. the ultra-thin part grinding and polishing fixture of the present invention is applied widely to the thickness and size of workpiece, to the material of workpiece Material is without particular/special requirement;2. the fixture of the present invention uses air pressure as power in load and unloading piece, shock loading is small, and workpiece is not easy It is broken, and new pollution will not be introduced in clamping process, workpiece is readily cleaned after processing;3. the fixture of the present invention utilizes multiple points Workpiece is adsorbed in scattered regular hole, optimizes determining regular hole optimal arrangement mode and size, stress in clamping process It is evenly distributed, avoids workpiece stress caused by stress concentration and deform;4. the fixture of present invention clamping in actual processing is reliable, It can effectively reduce in processing that workpiece is broken caused by film flying, improve the yields of processing;5. the clamp structure of the present invention is simple, It is easy to operate, there is good popularizing application prospect.
Description of the drawings
Fig. 1 is regular hole arrangement mode schematic diagram on a kind of ultra-thin part grinding and polishing fixture working face of the present invention;Wherein: A is fan-shaped distribution, and b is the distribution of the circular arcs such as concentric circles, the rectangular distributions of c, the distribution of d pentagons, the distribution of e hexagons.
Specific implementation mode
Technical solution to further understand the present invention is described in detail below in conjunction with the accompanying drawings.
A kind of ultra-thin part grinding and polishing fixture, on the working face of the grinding and polishing fixture being provided with multiple holes passes through Ultra-thin part is clamped in negative-pressure adsorption principle.Using negative-pressure adsorption principle, i.e., with negative pressure come " absorption " workpiece to reach clamping workpiece Purpose.When ultra-thin part and working face contact, the sky on the working face of grinding and polishing fixture is sealing, the sky inside hole Atmospheric pressure is P2, outside atmospheric pressure P1, as P2 < P1, as negative pressure;When P2 is 0, as vacuum is adsorbed as true at this time Suction is attached, and workpiece is firmly inhaled on the working face of grinding and polishing fixture at this time.
In the present embodiment, a kind of ultra-thin part grinding and polishing fixture is more when being provided on the working face of grinding and polishing fixture When a hole is rule, grinding and polishing fixture is evenly distributed to the nip stress of ultra-thin part, and avoiding stress concentration causes Workpiece stress deformation.It is preferred that multiple holes are the rule of array arrangement.
According to the characteristic, including material, size, shape etc. of different ultra-thin parts, the arrangement mode in regular hole is also different, packet Include fan-shaped distribution, the distribution of the circular arcs such as concentric circles, rectangular distribution, pentagon distribution, hexagon distribution.Specifically, the number in hole It should meet formula π f with size1nd2P=μ f2F and formula d=(0.02~0.06) × D;The distance between adjacent holes meets public Formula L=(1~2) × d;Wherein:π is pi, f1Friction coefficient between fixture and workpiece, n are the total quantity in regular hole, D is the diameter dimension in regular hole, and P is the negative pressure pressure of fixture, and μ is safety coefficient, f2For grinding pad during grinding and polishing or Friction coefficient between polishing pad and workpiece, F are the operating pressure during grinding and polishing, and D is the maximum of fixture working region Size, L are the distance between adjacent holes.
A kind of ultra-thin part grinding and polishing fixture, the material of fixture can be in the present invention:Ceramics, stainless steel, gather aluminium alloy Tetrafluoro.
A kind of ultra-thin part grinding and polishing fixture, during grinding and polishing, the grinding and polishing fixture can drive workpiece one It rises on polishing machine according to the reciprocating swing of certain functional relation, functional relation includes SIN function formula, cosine function formula, once Functional expression, quadratic function formula.
It is different reciprocal in four different holes arrangement modes, different fixture materials, different ultra-thin parts, process below The embodiment that formula is swung.
Embodiment 1:A kind of ultra-thin part grinding and polishing fixture, clamp material are ceramics, the regular hole on fixture working face It is distributed in sector, the quartz glass workpiece of clamping thickness 0.6mm, the progress grinding and polishing experiment on glass polishing machine, in grinding and polishing Clamp strap starts building part together on polisher lapper according to the reciprocating swing of SIN function relationship.Thickness of workpiece is less than after processing 0.2mm, and planeness of workpiece is good, stressless deformation and thermal deformation.
Embodiment 2:A kind of ultra-thin part grinding and polishing fixture, clamp material are aluminium alloy, the rule on fixture working face The rectangular distribution in hole, the YAG crystal workpiece of clamping thickness 0.4mm carry out grinding and polishing experiment, in grinding and polishing on glass polishing machine Clamp strap starts building part together on polisher lapper according to the reciprocating swing of linear function relationship.Thickness of workpiece is less than after processing 0.1mm, and planeness of workpiece is good, fixture load and unloading piece process are easy to operate, easy to use.
Embodiment 3:A kind of ultra-thin part grinding and polishing fixture, clamp material are polytetrafluoro, the rule on fixture working face Hole carries out grinding and polishing experiment, grinding in the distribution of the circular arcs such as concentric circles, the silicon slice workpiece of clamping thickness 0.5mm on glass polishing machine Clamp strap starts building part together on polisher lapper according to the reciprocating swing of quadratic function relation in polishing.Thickness of workpiece after processing Less than 0.15mm, and planeness of workpiece is good, and workpiece is not easy film flying in processing, and processing yields is high.
Embodiment 4:A kind of ultra-thin part grinding and polishing fixture, clamp material are stainless steel, the rule on fixture working face Hole is distributed in pentagon, the k9 glass pieces of clamping thickness 0.6mm, and grinding and polishing experiment, grinding and polishing are carried out on glass polishing machine Middle clamp strap starts building part together on polisher lapper according to the reciprocating swing of cosine function relationship.Thickness of workpiece is less than after processing 0.2mm, and planeness of workpiece is good, it is easy to clean.

Claims (7)

1. a kind of ultra-thin part grinding and polishing fixture, it is characterised in that:It is provided on the working face of the grinding and polishing fixture Ultra-thin part is clamped by negative-pressure adsorption principle in multiple holes.
2. a kind of ultra-thin part grinding and polishing fixture according to claim 1, it is characterised in that:The grinding and polishing fixture Working face on be provided with multiple holes be it is regular.
3. a kind of ultra-thin part grinding and polishing fixture according to claim 2, it is characterised in that:The grinding and polishing fixture Working face on be provided with multiple holes for array arrange.
4. a kind of ultra-thin part grinding and polishing fixture according to claim 3, it is characterised in that:The array in the hole is arranged Cloth is arranged according to the material of ultrathin workpieces, size, shape, including fan-shaped distribution, the distribution of the circular arcs such as concentric circles, rectangular distribution, Pentagon is distributed, hexagon distribution.
5. a kind of ultra-thin part grinding and polishing fixture according to claim 4, it is characterised in that:The number and ruler in the hole It is very little to meet formula π f1nd2P=μ f2F and formula d=(0.02~0.06) × D;The distance between adjacent holes meets formula L= (1~2) × d;Wherein:π is pi, f1Friction coefficient between fixture and workpiece, n are the total quantity in regular hole, and d is rule The then diameter dimension in hole, P are the negative pressure pressure of fixture, and μ is safety coefficient, f2For grinding pad during grinding and polishing or polishing pad Friction coefficient between workpiece, F are the operating pressure during grinding and polishing, and D is the full-size of fixture working region, L For the distance between adjacent holes.
6. according to a kind of any ultra-thin part grinding and polishing fixtures of claim 1-5, it is characterised in that:The fixture Material includes:Ceramics, aluminium alloy, stainless steel, polytetrafluoro.
7. a kind of ultra-thin part grinding and polishing fixture according to claim 1, it is characterised in that:The grinding and polishing fixture It can drive workpiece together on polishing machine according to the reciprocating swing of certain functional relation, functional relation includes SIN function formula, remaining String functional expression, linear function formula, quadratic function formula.
CN201810100555.1A 2018-02-01 2018-02-01 Ultra-thin part grinding and polishing clamp Active CN108555773B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810100555.1A CN108555773B (en) 2018-02-01 2018-02-01 Ultra-thin part grinding and polishing clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810100555.1A CN108555773B (en) 2018-02-01 2018-02-01 Ultra-thin part grinding and polishing clamp

Publications (2)

Publication Number Publication Date
CN108555773A true CN108555773A (en) 2018-09-21
CN108555773B CN108555773B (en) 2019-12-10

Family

ID=63530110

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810100555.1A Active CN108555773B (en) 2018-02-01 2018-02-01 Ultra-thin part grinding and polishing clamp

Country Status (1)

Country Link
CN (1) CN108555773B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109304664A (en) * 2018-09-29 2019-02-05 大连理工大学 A kind of substrate uniform polish device and its working method
CN110539212A (en) * 2019-09-28 2019-12-06 长沙埃福思科技有限公司 multi-workpiece ion beam polishing system and method
CN114302563A (en) * 2021-12-28 2022-04-08 龙南骏亚柔性智能科技有限公司 Production method applied to grinding of ultrathin circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103465424A (en) * 2013-08-20 2013-12-25 李建勇 Forming process and special processing device for ultrathin protective cover sleeve
CN103769922A (en) * 2012-10-24 2014-05-07 西安志越机电科技有限公司 Clamp special for thin plate part milling
CN106217087A (en) * 2016-06-30 2016-12-14 山东鲁南机床有限公司 A kind of lossless clamping device for thick gum base sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103769922A (en) * 2012-10-24 2014-05-07 西安志越机电科技有限公司 Clamp special for thin plate part milling
CN103465424A (en) * 2013-08-20 2013-12-25 李建勇 Forming process and special processing device for ultrathin protective cover sleeve
CN106217087A (en) * 2016-06-30 2016-12-14 山东鲁南机床有限公司 A kind of lossless clamping device for thick gum base sheet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109304664A (en) * 2018-09-29 2019-02-05 大连理工大学 A kind of substrate uniform polish device and its working method
CN109304664B (en) * 2018-09-29 2020-12-11 大连理工大学 Substrate uniform polishing device and working method thereof
CN110539212A (en) * 2019-09-28 2019-12-06 长沙埃福思科技有限公司 multi-workpiece ion beam polishing system and method
CN114302563A (en) * 2021-12-28 2022-04-08 龙南骏亚柔性智能科技有限公司 Production method applied to grinding of ultrathin circuit board

Also Published As

Publication number Publication date
CN108555773B (en) 2019-12-10

Similar Documents

Publication Publication Date Title
CN108555773A (en) A kind of ultra-thin part grinding and polishing fixture
JPH09260314A (en) Semiconductor wafer manufacturing method
US20230339064A1 (en) Intergrated machining device for grinding and polishing diamond and method thereof
JP4695145B2 (en) Sample holder, sample adsorption device using the same, sample processing method, and method for manufacturing sample holder
KR20000053507A (en) Polishing method for wafer and holding plate
JP4545536B2 (en) Vacuum suction jig
CN218837087U (en) Integrated wafer thinning equipment
CN111975622A (en) Ceramic hemisphere chemical auxiliary force rheological polishing processing device
CN216389310U (en) Wafer adsorption equipment
CN109940524A (en) A kind of preparation method of ultrathin workpieces planar support device and movable electrostatic chuck
JP2538511B2 (en) Holding plate for polishing semiconductor substrates
CN210402007U (en) Sucker jig of gluing and developing machine
JP2004209633A (en) Apparatus for securing work substrate and method for manufacturing the same
JP2007149884A (en) Semiconductor wafer polishing method
JP2004114184A (en) Chuck
CN220543867U (en) Wafer positioning and feeding device
JPH10249687A (en) Double surface grinding-polishing machine of sheetlike workpiece
JP4546659B2 (en) Polishing tool
TW559580B (en) Polishing device
CN220279131U (en) Polishing device for wafer thinning
EP0607441A4 (en) Abrading device and abrading method employing the same.
CN115056045B (en) Wafer single-sided polishing device and method
CN209774360U (en) Sapphire is polished and is used fixing device
JPH03173129A (en) Polishing apparatus
CN219842974U (en) Silicon wafer jig

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant