CN113451197A - Wafer adsorption force adjusting system and method for conveying manipulator and arm - Google Patents
Wafer adsorption force adjusting system and method for conveying manipulator and arm Download PDFInfo
- Publication number
- CN113451197A CN113451197A CN202110724907.2A CN202110724907A CN113451197A CN 113451197 A CN113451197 A CN 113451197A CN 202110724907 A CN202110724907 A CN 202110724907A CN 113451197 A CN113451197 A CN 113451197A
- Authority
- CN
- China
- Prior art keywords
- adjusting
- wafer
- screw
- pipe
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a wafer adsorption force adjusting system and method for a conveying manipulator, and an arm, and relates to the technical field of semiconductor production, wherein the upper end of a base is fixedly provided with the manipulator, a vacuum adsorption mechanism is fixedly arranged between the base and the manipulator, the bottom of the vacuum adsorption mechanism is fixedly provided with an adjusting component, the wafer is conveyed in a vacuum adsorption mode, the size of an opening in a tube can be adjusted by the arrangement of the adjusting plate, so that the size of air inlet pressure is changed, the adsorption force adjustment is realized, the wafer conveying with different thicknesses can be met, the rotating angle can be clearly determined while the adjustment is carried out, the recording and the checking of working personnel are convenient, in addition, the structure can also realize the adjustment of the distance between sucker groups at two sides, the sucker groups can be adapted to wafers with various diameters, and the suckers adopt a threaded connection mode, not only is convenient for installation and disassembly, but also is convenient for quick replacement when partial damage occurs.
Description
Technical Field
The invention relates to the technical field of semiconductor production, in particular to a wafer adsorption force adjusting system and method for a conveying manipulator and an arm.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape, and a manufacturer usually produces wafers with different thicknesses during production, but the existing conveying manipulator is not only generally uniform in adsorption force and incapable of adapting to wafer transportation with various thicknesses, but also cannot be correspondingly adjusted according to the diameter of the wafer, so that the universality of use is reduced.
Chinese patent CN202011029265.6 discloses a wafer adsorption force adjusting system, method and arm for a transfer robot, the system includes: the system comprises N pressure sensors, N wafer contactors, a controller, a static electricity generation controller and a static electricity generation device; the N pressure sensors are respectively connected with the N wafer contactors and used for acquiring pressure values of the wafers after the wafers are placed on the wafer contactors, wherein the pressure values are the sum of output values of the N pressure sensors; the controller is connected with the output ends of the N pressure sensors and used for determining a corresponding current target voltage value according to the pressure value and a preset static control voltage model, and driving the static electricity generation controller to output a current actual voltage value by using the current target voltage value so that the static electricity generation device generates corresponding static electricity to generate adsorption force with the static electricity induction of the wafer, and the non-sliding transmission of the wafers with different thicknesses under different processes is realized.
However, the above prior art still has the problems of sensor failure, poor stability and high cost. Accordingly, the present invention provides a wafer chucking force adjusting system and method for a transfer robot, and an arm thereof, so as to solve the technical problems in the prior art.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a wafer adsorption force adjusting system, a wafer adsorption force adjusting method and an arm for a conveying manipulator, and solves the problem that the existing conveying manipulator is generally uniform in adsorption force, cannot be suitable for wafer transportation with various thicknesses, cannot be correspondingly adjusted according to the diameter of a wafer, and accordingly reduces the universality of use.
In order to achieve the purpose, the invention is realized by the following technical scheme:
in a first aspect, the invention provides a wafer adsorption force adjusting system for a conveying manipulator, which comprises a base, wherein the upper end of the base is fixedly provided with the manipulator, a vacuum adsorption mechanism is fixedly arranged between the base and the manipulator together, and the bottom of the vacuum adsorption mechanism is fixedly provided with an adjusting component;
the vacuum adsorption mechanism comprises an air storage tank, a first support plate and a second support plate, a vacuum pump is fixedly installed inside the second support plate, a first air inlet pipe is fixedly connected to the air suction end of the vacuum pump, a second air inlet pipe is fixedly connected to the first air inlet pipe through a pressure adjusting assembly, a connecting main pipe is fixedly connected to the free end of the second air inlet pipe, a first air inlet branch pipe and a second air inlet branch pipe are fixedly connected to two ends of the bottom of the connecting main pipe respectively, a first sucking disc and a third sucking disc are fixedly connected to two ends of the bottom of the first air inlet branch pipe and the bottom of the second air inlet branch pipe respectively, a third air inlet branch pipe communicated with each other is fixedly connected to the middle of the first air inlet branch pipe and the bottom of the second air inlet branch pipe, and a second sucking disc is fixedly connected to the bottom of the third air inlet branch pipe;
the pressure regulating assembly comprises a connecting pipe and a micro motor, a shaft rod penetrates through the middle of the inside of the connecting pipe, a regulating plate is sleeved outside the shaft rod and inside the connecting pipe, an angle regulating plate is sleeved at the top of the shaft rod, and a pointer is fixedly connected to the upper end of the shaft rod through a support.
As a further technical scheme of the invention, the adjusting assembly comprises an adjusting seat, a motor is fixedly mounted inside the adjusting seat, a driving wheel is sleeved at a power driving end of the motor, a first support and a second support which are symmetrical are respectively fixedly mounted at two ends of the bottom of the adjusting seat, a first screw rod and a second screw rod which are opposite in thread direction are respectively penetrated through the inside of the first support and the second support, a driven wheel is jointly penetrated through adjacent ends of the first screw rod and the second screw rod, and a belt is jointly sleeved outside the driving wheel and the driven wheel.
As a further technical scheme of the invention, two symmetrical slide rails are respectively and fixedly installed on two sides of the bottom of the adjusting seat, the outer parts of the first screw rod and the second screw rod are respectively in threaded connection with a second screw cylinder seat and a first screw cylinder seat, and two ends of the second screw cylinder seat and two ends of the first screw cylinder seat are respectively in sliding connection with the outer parts of the slide rails.
As a further technical scheme of the present invention, the bottom of the first screw cylinder seat and the bottom of the second screw cylinder seat are respectively provided with a plurality of groups of equidistant screw holes, one side of the inside of the adjusting seat and located on the second screw rod is provided with a first through hole, and the top of the adjusting seat is provided with a second through hole.
According to a further technical scheme of the invention, a through fixed connection structure is formed between the air outlet end of the vacuum pump and the air storage tank through an air outlet pipe, a groove is formed in the second support plate, the vacuum pump is located in the groove, a screw rod is fixedly installed at the tops of the first sucker, the second sucker and the third sucker, and two ends of the air storage tank are respectively sleeved with a fixed seat.
According to a further technical scheme of the invention, scale marks are circumferentially engraved on the top of the angle adjusting plate, a first flange and a second flange are respectively and fixedly mounted at two ends of the connecting pipe, a shell is fixedly mounted at the bottom of the connecting pipe, the micro motor is positioned in the shell, and a power driving end of the micro motor is connected with the shaft rod.
According to a further technical scheme of the invention, the diameter of the adjusting plate is the same as the inner diameter of the connecting pipe, the air outlet pipe and the connecting main pipe are both spring hoses, the screw rod is positioned in the screw hole, the connecting main pipe penetrates through the first through hole, and a third through hole is formed in the bottom of the adjusting seat and corresponds to the belt.
In a second aspect, the present invention further provides a method for adjusting a wafer suction force of a transfer robot, including:
s1, determining the position: determining the position of the wafer, inputting a designated numerical value for the manipulator, and starting the manipulator after the input is finished;
s2, adjusting adsorption distance: the motor is started, and under the action of the first screw rod and the second screw rod, the second screw cylinder seat and the first screw cylinder seat can be driven to rotate, so that the distance between the two groups of suckers can be adjusted;
s3, adjusting adsorption force: the micro motor is started, the angle of the adjusting plate can be rotationally deviated under the action of the shaft rod, and the opening and closing size of the connecting pipe is controlled, so that the effects of controlling pressure and changing adsorption force are achieved.
In a third aspect, the invention further provides an arm, where the arm is the wafer adsorption force adjusting system for the transfer robot.
Advantageous effects
The invention provides a wafer adsorption force adjusting system and method for a conveying manipulator and an arm. Compared with the prior art, the method has the following beneficial effects:
1. in the invention, the wafers are conveyed in a vacuum adsorption mode, the size of an opening in the tube can be adjusted by arranging the adjusting plate in the connecting tube, so that the size of air inlet pressure is changed, the adsorption force is adjusted, meanwhile, the wafers with different thicknesses can be conveyed, in addition, the rotating angle can be clearly determined by arranging the pointer and the scale marks, thus the adsorption accuracy is effectively ensured, the recording and checking of workers are facilitated, and the use convenience and practicability are improved.
2. According to the invention, the second screw cylinder seat and the first screw cylinder seat are respectively in threaded connection with the outer parts of the first screw rod and the second screw rod, two ends of the second screw cylinder seat and two ends of the first screw cylinder seat are respectively in sliding connection with the outer parts of the sliding rail, the driving wheel and the driven wheel are jointly sleeved with the belt, the screw rod is driven by the motor to drive the screw rod to transmit, and the distance between sucker groups on two sides can be adjusted, so that the sucker can be adapted to wafers with various diameters, the flexibility and the universality of use are improved, in addition, the sucker is in a threaded connection mode, the installation and the disassembly are convenient, and when partial damage occurs, the quick replacement can be convenient, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a wafer chucking force adjustment system for a transfer robot;
FIG. 2 is a schematic diagram of a vacuum chuck mechanism of a wafer chuck force adjustment system for a transfer robot;
FIG. 3 is a schematic diagram of a wafer chucking force adjustment system adjustment assembly for a transfer robot;
FIG. 4 is a top view of a wafer chucking force adjustment system adjustment assembly for a transfer robot;
FIG. 5 is a cross-sectional view taken along line B-B of FIG. 4;
FIG. 6 is a schematic diagram of a wafer chucking force adjustment system pressure adjustment assembly for a transfer robot;
FIG. 7 is a top view of a wafer chucking force adjustment system pressure adjustment assembly for a transfer robot;
fig. 8 is a cross-sectional view a-a of fig. 7.
In the figure: 1. a base; 2. a manipulator; 3. a vacuum adsorption mechanism; 31. a gas storage tank; 32. a first support plate; 33. a second support plate; 34. a vacuum pump; 35. an air outlet pipe; 36. a first intake pipe; 37. a pressure regulating assembly; 371. a connecting pipe; 372. a micro motor; 373. a shaft lever; 374. an adjusting plate; 375. an angle adjusting plate; 376. a pillar; 377. a pointer; 378. scale lines; 379. a first flange; 3710. a second flange; 3711. a housing; 38. a second intake pipe; 39. connecting a main pipe; 310. a first intake branch pipe; 311. a second intake branch pipe; 312. a third intake manifold; 313. a first suction cup; 314. a second suction cup; 315. a third suction cup; 316. a screw; 317. a groove; 318. a fixed seat; 4. an adjustment assembly; 41. an adjusting seat; 42. a motor; 43. a driving wheel; 44. a first support; 45. a second support; 46. a first lead screw; 47. a second lead screw; 48. a driven wheel; 49. a belt; 410. a first bobbin base; 411. a second bobbin base; 412. a slide rail; 413. a screw hole; 414. a first through hole; 415. a second through hole; 416. a third via.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1, the embodiment discloses a wafer adsorption force adjusting system of a transfer robot, which includes a base 1, a robot 2 fixedly mounted at an upper end of the base 1, a vacuum adsorption mechanism 3 fixedly mounted between the base 1 and the robot 2, and an adjusting assembly 4 fixedly mounted at a bottom of the vacuum adsorption mechanism 3;
further, referring to fig. 2, the vacuum adsorption mechanism 3 includes an air storage tank 31, a first support plate 32 and a second support plate 33, a vacuum pump 34 is fixedly installed inside the second support plate 33, an air suction end of the vacuum pump 34 is fixedly connected with a first air inlet pipe 36, the first air inlet pipe 36 is fixedly connected with a second air inlet pipe 38 through a pressure adjusting assembly 37, a free end of the second air inlet pipe 38 is fixedly connected with a connecting header pipe 39, two ends of the bottom of the connecting header pipe 39 are respectively fixedly connected with a first air inlet branch pipe 310 and a second air inlet branch pipe 311, the air outlet pipe 35 and the connecting header pipe 39 are both spring hoses, the connecting header pipe 39 penetrates through the inside of the first through hole 414, two ends of the bottom of the first air inlet branch pipe 310 and the bottom of the second air inlet branch pipe 311 are respectively fixedly connected with a first suction cup 313 and a third suction cup 315, and a third air inlet branch pipe 312 communicated with each other is fixedly connected with the middle of the connecting header pipe, the bottom of the third air inlet branch pipe 312 is fixedly connected with a second suction cup 314, the air outlet end of the vacuum pump 34 forms a communicated fixed connection structure with the air storage tank 31 through the air outlet pipe 35, the groove 317 is formed in the second support plate 33, the vacuum pump 34 is located in the groove 317, the tops of the first suction cup 313, the second suction cup 314 and the third suction cup 315 are fixedly provided with a screw rod 316, the two ends of the air storage tank 31 are respectively sleeved with a fixed seat 318, and the structure can realize the transmission of wafers in a vacuum adsorption mode;
further, referring to fig. 6-8, the pressure adjusting assembly 37 includes a connecting tube 371 and a micro motor 372, a shaft 373 penetrates through the middle of the inside of the connecting tube 371, an adjusting plate 374 is sleeved outside the shaft 373 and inside the connecting tube 371, an angle adjusting plate 375 is sleeved on the top of the shaft 373, a pointer 377 is fixedly connected to the upper end of the shaft 373 through a support 376, a scale line 378 is marked on the top of the angle adjusting plate 375 in a circumferential shape, a first flange 379 and a second flange 3710 are fixedly installed at two ends of the connecting tube 371 respectively, a housing 3711 is fixedly installed at the bottom of the connecting tube 371, the micro motor 372 is located inside the housing 3711, and a power driving end thereof is connected to the shaft 373, the diameter of the adjusting plate 374 is the same as the inside diameter of the connecting tube 371, a screw 316 is located inside a screw hole 413, bearings are fixedly installed at the joints of the shaft 373 and the connecting tube 371, and the angle adjusting plate 375 is fixedly installed at the top of the bearings, the setting of the inside regulating plate 374 of connecting pipe 371 can realize adjusting the size of the opening in the geminate transistors, and then change inlet pressure's size, realize that the adsorption affinity is adjusted, make it can satisfy the difference simultaneously and convey the wafer of different thickness, in addition, the setting of pointer 377 and scale mark 378, the rotatory angle of definite that can be clear to effectual absorptive accuracy nature of having ensured, the staff's record and the look over of still being convenient for has improved convenience and the practicality of use.
Further, referring to fig. 3-5, the adjusting assembly 4 includes an adjusting seat 41, a motor 42 is fixedly installed inside the adjusting seat 41, a driving wheel 43 is sleeved on a power driving end of the motor 42, symmetrical first and second supports 44 and 45 are respectively fixedly installed at two ends of the bottom of the adjusting seat 41, a first screw rod 46 and a second screw rod 47 with opposite screw directions are respectively penetrated inside the first and second supports 44 and 45, a driven wheel 48 is commonly penetrated through adjacent ends of the first and second screw rods 46 and 47, a belt 49 is commonly sleeved outside the driving wheel 43 and the driven wheel 48, two symmetrical slide rails 412 are respectively fixedly installed at two sides of the bottom of the adjusting seat 41, a second bobbin seat 411 and a first bobbin seat 410 are respectively connected to the outside of the first and second bobbin seats 411 and 410 by screw threads, and two ends of the second bobbin seat 411 and the first bobbin seat 410 are both slidably connected to the outside of the slide rails 412, screw 413 that a plurality of groups of equidistance have been seted up respectively to the bottom of first silk barrel holder 410 and second silk barrel holder 411, first through-hole 414 has been seted up to the inside of adjusting seat 41 and the one side that is located second lead screw 47, second through-hole 415 has been seted up at the top of adjusting seat 41, third through-hole 416 has been seted up to the bottom of adjusting seat 41 and the corresponding department with belt 49, this structure drives the lead screw transmission through the motor, can realize adjusting the interval of both sides sucking disc group, thereby make the wafer of its multiple diameter size of adaptable, the flexibility and the commonality of use have been improved, the sucking disc adopts threaded connection's mode in addition, not only be convenient for installation and dismantlement, and when the part damage appears, the quick replacement of can being convenient for, and then work efficiency has been improved.
Example 2:
the embodiment discloses a method for adjusting the wafer adsorption force of a transfer manipulator, which comprises the following steps:
s1, determining the position: determining the position of the wafer, inputting a specified numerical value for the manipulator 2, and starting the manipulator after the input is finished;
s2, adjusting adsorption distance: the motor 42 is started, and under the action of the first lead screw 46 and the second lead screw 47, the second lead screw seat 411 and the first lead screw seat 410 can be driven to rotate, so that the distance between the two groups of suckers can be adjusted;
s3, adjusting adsorption force: the micro motor 372 is started, the angle of the adjusting plate 374 can be rotationally deviated under the action of the shaft rod 373, and the size of opening and closing inside the connecting pipe 371 is controlled, so that the effects of controlling pressure and changing adsorption force are achieved.
Example 3:
this embodiment discloses a hand for adjusting the wafer chucking force of the transfer robot as described in embodiment 1 above.
The working principle of the invention is as follows: when using, adjust the size of adsorption affinity according to the thickness correspondence of wafer, only need start micro motor 372, its power drive end can drive axostylus axostyle 373 and regulating plate 374 and rotate, the angle that opens and shuts is big more, its adsorption affinity is big more, otherwise, the angle that opens and shuts is little less, the adsorption affinity is then little less, thereby can change air intake pressure's size, realize the regulation of adsorption affinity size, it can satisfy the difference and conveys the wafer of different thickness to making it, and along with regulating plate 374 rotation, can drive the pointer 377 rotation at top in step, not only can make clear definite rotatory angle of staff, and the effectual adsorbed accuracy nature of having ensured still, be convenient for the staff record and look over.
And first sucking disc 313, second sucking disc 314 and third sucking disc 315 constitute a sucking disc group jointly, at this moment, according to the diameter size of wafer again, the interval between two sets of sucking discs of corresponding regulation, in order to ensure absorbent laminating degree, only need start motor 42, its power drive end can drive action wheel 43 rotatory, under the effect of belt 49 and follow driving wheel 48, can drive first lead screw 46 and second lead screw 47 synchronous inwards or outwards rotatory in step, under the effect of first silk barrel seat 410 and second silk barrel seat 411, can realize the interval adjustment to two sucking disc groups, thereby make its wafer that can adapt multiple diameter size, flexibility and commonality of use have been improved, sucking disc group all adopts threaded connection's fixed mode in addition, not only be convenient for installation and dismantlement, and when partial damage appears, can be convenient for quick replacement, and then work efficiency has been improved.
After the adjustment is finished, a designated numerical value can be input into the manipulator 2 according to the position of the wafer, and finally, the manipulator 2 is started, so that the wafer can be conveyed.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The wafer adsorption force adjusting system for the conveying manipulator comprises a base (1) and is characterized in that the upper end of the base (1) is fixedly provided with a manipulator (2), a vacuum adsorption mechanism (3) is fixedly arranged between the base (1) and the manipulator (2) together, the vacuum adsorption mechanism (3) comprises a pressure adjusting assembly (37), and an adjusting assembly (4) is fixedly arranged at the bottom of the vacuum adsorption mechanism (3); the vacuum adsorption mechanism is used for adsorbing and conveying the wafer, and the adjusting assembly (4) is used for adjusting the distance between the suckers.
2. The wafer adsorption force adjusting system for the transfer robot as claimed in claim 1, wherein the vacuum adsorption mechanism (3) comprises an air storage tank (31), a first support plate (32) and a second support plate (33), a vacuum pump (34) is fixedly installed inside the second support plate (33), a first air inlet pipe (36) is fixedly connected to an air suction end of the vacuum pump (34), a second air inlet pipe (38) is fixedly connected to the first air inlet pipe (36) through a pressure adjusting assembly (37), a connecting header pipe (39) is fixedly connected to a free end of the second air inlet pipe (38), a first air inlet branch pipe (310) and a second air inlet branch pipe (311) are respectively fixedly connected to two ends of the bottom of the connecting header pipe (39), a first suction cup (313) and a third suction cup (315) are respectively fixedly connected to two ends of the bottom of the first air inlet branch pipe (310) and the bottom of the second air inlet branch pipe (311), a third air inlet branch pipe (312) which is communicated with each other is fixedly connected to the middle of each air inlet branch pipe, and the bottom of each third air inlet branch pipe (312) is fixedly connected with a second suction cup (314);
the pressure regulating assembly (37) comprises a connecting pipe (371) and a micro motor (372), a shaft rod (373) penetrates through the middle of the inside of the connecting pipe (371), a regulating plate (374) is sleeved outside the shaft rod (373) and located inside the connecting pipe (371), an angle regulating plate (375) is sleeved on the top of the shaft rod (373), and a pointer (377) is fixedly connected to the upper end of the shaft rod (373) through a support column (376).
3. The wafer adsorption force adjusting system for the transfer robot as claimed in claim 1, wherein the adjusting assembly (4) comprises an adjusting seat (41), a motor (42) is fixedly installed inside the adjusting seat (41), a driving wheel (43) is sleeved at a power driving end of the motor (42), a first support (44) and a second support (45) which are symmetrical are fixedly installed at two ends of the bottom of the adjusting seat (41) respectively, a first lead screw (46) and a second lead screw (47) which have opposite thread directions penetrate through the insides of the first support (44) and the second support (45) respectively, a driven wheel (48) penetrates through adjacent ends of the first lead screw (46) and the second lead screw (47) together, a belt (49) is sleeved outside the driving wheel (43) and the driven wheel (48) together, two sliding rails (412) which are symmetrical are fixedly installed at two sides of the bottom of the adjusting seat (41) respectively, the outer portions of the first screw rod (46) and the second screw rod (47) are respectively in threaded connection with a second screw cylinder seat (411) and a first screw cylinder seat (410), and the two ends of the second screw cylinder seat (411) and the two ends of the first screw cylinder seat (410) are both in sliding connection with the outer portions of the sliding rails (412).
4. The wafer suction force adjusting system for the transfer robot as claimed in claim 3, wherein a plurality of sets of equidistant screw holes (413) are respectively formed at the bottoms of the first screw cylinder seat (410) and the second screw cylinder seat (411), a first through hole (414) is formed inside the adjusting seat (41) and on one side of the second screw (47), and a second through hole (415) is formed at the top of the adjusting seat (41).
5. The wafer adsorption force adjusting system for the transfer robot as claimed in claim 2, wherein a gas outlet end of the vacuum pump (34) forms a through fixed connection structure with the gas storage tank (31) through a gas outlet pipe (35), a groove (317) is formed in the second support plate (33), the vacuum pump (34) is located in the groove (317), a screw (316) is fixedly installed at the tops of the first suction cup (313), the second suction cup (314) and the third suction cup (315), and fixing seats (318) are respectively sleeved at two ends of the gas storage tank (31).
6. The wafer suction force adjustment system for a transfer robot of claim 2, wherein the top of the angle adjustment plate (375) is marked with a scale mark (378) in a circumferential shape, the two ends of the connection tube (371) are respectively fixedly provided with a first flange (379) and a second flange (3710), the bottom of the connection tube (371) is fixedly provided with a housing (3711), the micro motor (372) is located inside the housing (3711), and the power driving end of the micro motor is connected with the shaft (373).
7. The wafer suction force adjusting system for the transfer robot as claimed in claim 5, wherein the adjusting plate (374) has the same diameter as the inner diameter of the connecting pipe (371), the gas outlet pipe (35) and the connecting header pipe (39) are both spring hoses, the screw (316) is located inside the screw hole (413), the connecting header pipe (39) penetrates inside the first through hole (414), and a third through hole (416) is formed at the bottom of the adjusting seat (41) and corresponding to the belt (49).
8. A wafer suction force adjusting method of a transfer robot, applied to the wafer suction force adjusting system for the transfer robot according to any one of claims 1 to 7, comprising the steps of:
s1, determining the position: determining the position of the wafer, inputting a specified numerical value for the manipulator (2), and starting the manipulator after the input is finished;
s2, adjusting adsorption distance: the motor (42) is started, and under the action of the first screw rod (46) and the second screw rod (47), the second screw cylinder seat (411) and the first screw cylinder seat (410) can be driven to rotate, so that the distance between the two groups of suckers can be adjusted;
s3, adjusting adsorption force: the micro motor (372) is started, the angle of the adjusting plate (374) can be rotationally deviated under the action of the shaft rod (373), and the opening and closing size inside the connecting pipe (371) is controlled, so that the effects of controlling pressure and changing adsorption force are achieved.
9. A transfer robot provided with a wafer chucking force adjusting system as recited in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110724907.2A CN113451197A (en) | 2021-06-28 | 2021-06-28 | Wafer adsorption force adjusting system and method for conveying manipulator and arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110724907.2A CN113451197A (en) | 2021-06-28 | 2021-06-28 | Wafer adsorption force adjusting system and method for conveying manipulator and arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113451197A true CN113451197A (en) | 2021-09-28 |
Family
ID=77813951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110724907.2A Withdrawn CN113451197A (en) | 2021-06-28 | 2021-06-28 | Wafer adsorption force adjusting system and method for conveying manipulator and arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113451197A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808983A (en) * | 2021-11-17 | 2021-12-17 | 沈阳芯达半导体设备有限公司 | Multi-arm gas-liquid separation mechanical arm |
| CN114986551A (en) * | 2022-06-28 | 2022-09-02 | 深圳市欧盛创宇电子有限公司 | Clamping robot for integrated circuit production in liquid crystal display |
-
2021
- 2021-06-28 CN CN202110724907.2A patent/CN113451197A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808983A (en) * | 2021-11-17 | 2021-12-17 | 沈阳芯达半导体设备有限公司 | Multi-arm gas-liquid separation mechanical arm |
| CN113808983B (en) * | 2021-11-17 | 2022-01-18 | 沈阳芯达半导体设备有限公司 | Multi-arm gas-liquid separation mechanical arm |
| CN114986551A (en) * | 2022-06-28 | 2022-09-02 | 深圳市欧盛创宇电子有限公司 | Clamping robot for integrated circuit production in liquid crystal display |
| CN114986551B (en) * | 2022-06-28 | 2023-09-29 | 深圳市欧盛创宇电子有限公司 | Clamping robot for integrated circuit production in liquid crystal display |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113451197A (en) | Wafer adsorption force adjusting system and method for conveying manipulator and arm | |
| CN109570721B (en) | Horizontal six-station rotary automatic welding device | |
| CN108127381A (en) | A kind of device for slotting valve cock automatically | |
| CN104647374A (en) | Multi-degree-of-freedom mechanical hand for transferring flexible film | |
| CN206185864U (en) | Can supply to carry automatic robot of article | |
| CN2762970Y (en) | Transferring robot | |
| WO2022105332A1 (en) | Automatic valve plate machining device based on machine vision | |
| CN217361537U (en) | Positioning device for wafer | |
| CN112850133B (en) | Workpiece grabbing deviation adjusting system and method based on CCD correction | |
| CN107486740A (en) | A kind of bump joint processes dedicated positioning device | |
| CN213170297U (en) | A sucker structure for chip test | |
| CN216335182U (en) | Sapphire wafer micro device is with removing structure | |
| CN115502647A (en) | Pipeline welding machine base | |
| CN115582809A (en) | Positioning tool for machining automobile hub | |
| CN112201606B (en) | Wafer centering mechanism with flexible coupling, transmission device and thinning equipment | |
| CN107651442A (en) | A kind of automatic assembling tool hand for LED | |
| CN114633069A (en) | Positioning device and positioning method for tubular workpiece welding | |
| CN220856536U (en) | Automatic positioning device for wafer processing | |
| CN113352234A (en) | Multi-mode switchable clamping device | |
| CN220993188U (en) | Chuck type tool for laser marking | |
| CN112355988A (en) | Processing and positioning device for pulse pleat type filter cylinder | |
| CN216234717U (en) | Multi-station turntable mechanism | |
| CN221019325U (en) | Positioning and detecting device for circumferential welding joint of pressure pipeline | |
| CN115041990B (en) | Multi-station transposition clamp for milling cabin parts | |
| CN117110318B (en) | Visual stable scanning imaging device for batch detection of packaged chips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210928 |
|
| WW01 | Invention patent application withdrawn after publication |