CN113442313A

CN113442313A - Method for breaking brittle material substrate and substrate processing apparatus

Info

Publication number: CN113442313A
Application number: CN202110260793.0A
Authority: CN
Inventors: 上野勉; 高松生芳
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2020-03-25
Filing date: 2021-03-10
Publication date: 2021-09-28
Also published as: JP2021154502A

Abstract

A method for breaking a brittle material substrate and a substrate processing apparatus. Provided are a breaking method and a breaking device, which are a roller breaking method for pressing and rolling a breaking roller along the side of a scribing line, can eliminate the undesirable propagation and generation of cracks at an intersection point part, and can break a dividing surface with high precision. A method and a device for breaking a brittle material substrate, wherein a brittle material substrate (W) having mutually orthogonal scribe lines (S1, S2) formed on the surface thereof is divided by rolling a breaking roller (4) while pressing the breaking roller along the side of the scribe lines to propagate the cracks of the scribe lines in the thickness direction, wherein the breaking roller (4) passes through the intersection between the traveling direction of the breaking roller and the intersecting scribe lines, and passes the breaking roller at a position near the intersection so as not to apply a pressing force or to reduce the pressing force.

Description

Method for breaking brittle material substrate and substrate processing apparatus

Technical Field

The present invention relates to a breaking method and apparatus for dividing a substrate along a scribe line formed on a brittle material substrate. The brittle material substrate here includes a semiconductor material such as glass, ceramic, or silicone. The form of the divided substrates includes not only a single substrate but also a bonded substrate in which two substrates are bonded together.

Background

In general, in order to cut out the unit substrates from the mother substrate, as shown in fig. 6, first, a scribe line S1 in the X direction and a scribe line S2 in the Y direction are formed on the surface of the mother substrate W so as to be orthogonal to each other using a cutter wheel or a laser, and the unit substrates W1 are cut out by breaking along the scribe lines S1 and S2 in the next step.

As a method of breaking the substrate W along the scribe lines S1 and S2, a breaking method using a breaking bar as shown in

patent documents

1 and 2 and a breaking method using a breaking roller as shown in patent document 3 are generally known.

In the dividing method by the breaking bar, the mother substrate W is placed on a buffer sheet 15 shown in fig. 7 (a) or a pair of left and right receiving

knives

16 and 16 shown in fig. 7 (b) with the surface provided with the scribing line as the lower side, and the breaking bar 17 is pressed against the substrate W from the upper surface which is the surface opposite to the scribing line forming surface to deflect the substrate W, so that the cracks of the scribing line S1 or S2 penetrate in the thickness direction, thereby breaking the mother substrate W.

However, in this method, since the long breaking bar is pressed against the substrate with a large load and is broken at a time, the load applied to the substrate is increased, and thus there is a problem that the divided surface is easily broken and the strength of the end surface is easily deteriorated. Further, if the break rod is too long, deformation, deflection, and the like occur, and therefore the length of the rod is limited, and it is difficult to perform straight adjustment even if a plurality of rods are connected, and it is therefore difficult to break a mother board which is recently increased in size with high accuracy. In addition, there are the following problems: since the surface on which the scribe lines S1 and S2 are provided is the back surface side, the substrate on which the scribe lines have been formed in the previous step must be inverted, which makes the operation troublesome, and the elongated breaking bar and the mechanism for moving it up and down are large and complicated, which leads to an increase in the size of the apparatus.

In the method of dividing the substrate W by the break roller of patent document 3, the substrate W is placed on a table with the surface on which the scribe line is provided as the upper side and with a buffer sheet interposed therebetween, and the substrate W is rolled while being pressed by the break roller to bend the substrate W so that the crack of the scribe line penetrates the entire thickness of the substrate W, thereby breaking the substrate W along the scribe line. In this method, since the portion of the scribe line to be divided is bent so as to be bent at a position apart from the scribe line, the load at the time of the dividing is smaller than that in the case of the dividing lever, and the occurrence of breakage or the like can be suppressed to obtain a dividing surface with good accuracy. In addition, the following advantages are provided: since the breaking is performed by the pressing and rolling of the breaking roller, even a large mother substrate can be broken as in the case of a small substrate within the moving range of the breaking roller, and since the breaking roller is pressed and rolled from the surface on which the scribing line is provided, it is not necessary to turn over the substrate after the scribing line processing step, and the mechanism is simple, so that the structure can be made compact.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2009-101692

Patent document 2: japanese patent laid-open No. 2014-19044

Patent document 3: japanese patent laid-open publication No. 2011-

Disclosure of Invention

Technical problem to be solved by the invention

However, the above-described method of dividing the breaking roller has the following problems when breaking the substrate W.

That is, when one of the scribe lines, for example, the scribe line in the X direction in fig. 6, is first broken, the one scribe line is rolled while being pressed along the vicinity of the scribe line in the X direction, but when the one scribe line passes through the intersection with the scribe line in the Y direction S2, an irregular crack may be generated in a direction different from the direction of the scribe line in the X direction to be divided. This is considered to be because, when the breaking roller rolls while being pressed, the substrate bends to form a bowl-shaped concave portion centered on the pressing point, and the bending causes the crack of the scribe line in the X direction to progress and be sequentially divided, but when the breaking roller passes through the intersection with the scribe line S2 in the Y direction, the stress generated by the bending affects the periphery of the fragile scribe line in the Y direction, and the crack occurs not only in the X direction but also in the Y direction, and further, the irregular crack occurs in the vicinity of the intersection. If cracks occur in such an undesired direction or unexpected irregular cracks occur, the division accuracy is lowered, and a high-quality product cannot be obtained, which may result in a defective product.

In view of the above-described problems, it is an object of the present invention to provide a breaking method that can eliminate an undesirable crack generated at the intersection and can break the cut surface with high accuracy, using a roller breaking method in which a breaking roller is pressed and rolled along the vicinity of a scribe line.

Means for solving the problems

In order to solve the above-described problems, the present invention adopts the following technical means. That is, the present invention is a method for breaking a brittle material substrate, in which a brittle material substrate having a scribe line formed on a surface thereof so as to be orthogonal to each other is divided by rolling a breaking roller while pressing the breaking roller along a side of the scribe line to thereby propagate a crack of the scribe line in a thickness direction, and the breaking roller passes through an intersection point between a traveling direction of the breaking roller and the intersecting scribe line so as to pass through the intersection point, and passes through the intersection point so as not to apply a pressing force or to reduce the pressing force.

Here, the no-load section in which the pressing force is not applied near the intersection of the breaker rollers or the decompression section in which the pressing force is reduced may be within 1mm in the front and rear dimensions around the intersection.

Preferably, the distance between the pressure contact surface of the breaking roller which is pressed and rolled along the side of the scribing line and the scribing line is 0.05 to 1 mm.

In another aspect, the present invention provides a substrate processing apparatus for breaking a brittle material substrate having scribe lines orthogonal to each other formed on a surface thereof along the scribe lines, the substrate processing apparatus including: a table on which the brittle material substrate is placed and held; a breaking roller which is pressed and rolled along the side of the scribing line of the brittle material substrate loaded and held on the worktable; and a control unit for controlling the pressing force of the breaking roller so that the pressing force is not applied or reduced at a position near the intersection point when the breaking roller passes through the intersection point between the traveling direction of the breaking roller and the intersecting scribing line.

Effects of the invention

In the present invention, when the breaking roller passes through the intersection of the scribe lines perpendicular to the cutting roller, the breaking roller passes through the vicinity of the intersection in a state where no pressing force is applied or the pressure is reduced, and therefore, cracks are prevented from being generated in an undesired direction or irregular cracks are generated in the fragile intersection portion, and the breaking roller breaks at a precise dividing surface, and a high-quality product can be obtained.

Drawings

Fig. 1 is a schematic explanatory view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing steps that are an embodiment of the method of the present invention.

FIG. 3 is an explanatory diagram showing steps as an embodiment of the method of the present invention.

Fig. 4 is an explanatory view when the substrate is cut by the cutting roller.

Fig. 5 is an explanatory diagram showing another embodiment of the present invention.

Fig. 6 is a plan view of a substrate on which scribe lines orthogonal to each other are formed.

Fig. 7 is an explanatory diagram illustrating a method of dividing a conventional breaking lever.

Description of reference numerals:

a: a substrate processing device; s1: a scribe line in the X direction; s2: a scribing line in the Y direction; w: a brittle material substrate; l1: disconnecting the unloaded or depressurized zone of the roll; l2: the interval between the scribing line to be divided and the breaking roller; 1: a work table; 4: a breaking roller; 5: a roll head; 7: a lifting mechanism; 12: a control unit.

Detailed Description

The details of the present invention will be described below in detail with reference to the embodiments shown in the drawings.

In this embodiment, an example will be described in which a single brittle material substrate W having a scribe line S1 in the X direction and a scribe line S2 in the Y direction formed on the upper surface thereof so as to be orthogonal to each other is broken along the scribe line. In the scribing step before the breaking step, the scribing lines S1 and S2 are formed by a cutter wheel or a laser. Each of the grids divided by the scribing lines S1, S2 becomes a unit substrate W1 after being broken.

Fig. 1 is a schematic explanatory view of a substrate processing apparatus for carrying out the method of the present invention. The substrate processing apparatus a includes a table 1 on which a substrate Wa to be processed is placed and held, and a scribe head 3 for holding a cutter wheel 2 for processing scribe lines S1 and S2 and a roller head 5 for holding a break roller 4 are arranged above the table 1.

The cutter wheel 2 and the breaking roller 4 are attached to the scribing head 3 and the roller head 5 via

elevating mechanisms

6 and 7, respectively, so as to be able to be elevated freely, and the scribing head 3 and the roller head 5 are assembled so as to be movable in the horizontal X direction by a head moving mechanism (not shown) along a guide 8 provided on a machine frame of the apparatus. The roller head 5 of the breaking roller 4 is provided with a camera 9 for detecting a scribing line on the surface of the substrate. In the embodiment, only one camera 9 is provided, but the camera 9 may be provided on the opposite side with the cutoff roller 4 interposed therebetween.

The table 1 on which the substrate W is placed is supported by a rotation mechanism 10 that rotates about a vertical axis, and the rotation mechanism 10 is configured to be movable in the Y direction by a table moving mechanism 11. The table moving mechanism 11 is a known mechanism that moves along a guide rail by rotating a screw shaft by a motor, for example.

The substrate processing apparatus a includes a control unit 12 that controls the lifting operation or pressing force of the cutter wheel 2 and the breaking roller 4, the movement of the scribing head 3 and the roller head 5, and the rotation and movement of the table 1. The control unit 12 is a computer system having a processor such as a CPU, a storage unit such as a ROM and a RAM, and various interfaces. The control unit 12 executes a program stored in the storage unit to perform various control operations.

Next, the operation will be described.

First, the top surface of the substrate Wa is processed with the cutter wheel 2 into scribe lines S1 and S2 perpendicular to each other. This processing can be performed by: one scribing line is processed by lowering the cutter wheel 2 and rolling it while pressing the surface of the substrate W, and the other scribing line is processed by rotating the table 1 by 90 ° by the rotating mechanism 10 and pressing and rolling the cutter wheel 2 in the same manner as described above.

Next, a cushion material 13 such as a rubber sheet is laid on the lower surface of the substrate W on which the scribe lines S1 and S2 are formed, and is placed and held on the table 1. Then, as shown in fig. 2 and 4, the breaking roller 4 is pressed and rolled along one of the scribe lines, for example, the side of the scribe line S1 in the X direction. Thereby, the portion pressed by the cutoff roller 4 is deflected downward. By this deflection, as shown in fig. 4 (b), the portion of the scribe line S1 is bent downward to propagate the crack in the thickness direction, and is sequentially divided as the break roller advances.

In the dividing, in the present invention, when the breaking roller 4 passes through the intersection with the scribe line S2 in the Y direction, which is a scribe line orthogonal to the traveling direction of the breaking roller, the camera 9 detects the scribe line S2, and the breaking roller 4 is moved away from the substrate to be raised at a position near the intersection to pass through the substrate so that the pressing force is zero. The detection of the scribe line S2 is performed by using a general image processing technique such as referring to an image pattern of a certain scribe line S2 stored in advance.

In the no-load section L1 in the vicinity of the intersection point of the breaker roller 4, the front and rear dimensions around the intersection point are preferably within 1mm (preferably the front and rear dimensions are the same).

Preferably, the distance L2 between the pressure contact surface of the breaking roller rolling along the side of the scribing line and the scribing line is 0.05-1 mm.

In this way, when the breaking roller 4 passes through the intersection of the perpendicular scribe lines, the breaking roller is raised at a position near the intersection, and the breaking roller 4 is passed through so that the pressing force is zero, that is, no load is applied, and therefore, it is possible to prevent the occurrence of cracks in the Y direction, which is not intended, or irregular cracks from occurring at the fragile intersection portion, and to break the divided surface with high accuracy. Further, since the break roller 4 is pressed and rolled from the surface on which the scribing line is provided, it is not necessary to turn over the substrate W after the scribing line processing step.

In the above embodiment, the cutoff roller 4 was raised at the position near the intersection point to set the pressing force to zero, but it was experimentally confirmed that instead of passing the cutoff roller 4 so as to reduce the pressing force only at the position near the intersection point while rolling the cutoff roller 4, it was possible to suppress the occurrence of undesirable cracks at the intersection point portion. In this case, the pressing force at the position near the intersection point is preferably 0 to 50% of the pressing force at the position other than the position near the intersection point at the time of disconnection, for example.

As shown in fig. 5, the present invention can also be applied to 2 bonded substrates W' having scribe lines formed on the upper and lower surfaces thereof so as to be orthogonal to each other. Here, the upper scribe line is denoted by Sa, and the lower scribe line is denoted by Sb.

In the present embodiment, as shown in fig. 5 (a), the other breaking roller 14 having a depressed central portion of its circumferential surface is pressed and rolled against the scribe line Sa provided on the upper surface of the substrate to deflect the substrate W' downward, and the deflection causes the crack of the lower scribe line Sb to propagate in the thickness direction and be divided. Then, in the next step, in the same manner as in the previous embodiment, the breaking roller 4 is pressed and rolled along the side of the upper scribe line Sa, and the pressing force is set to zero or decreased in the vicinity of the intersection of the traveling direction of the breaking roller 4 and the orthogonal scribe line. This eliminates the occurrence of cracks in an irregular, undesired direction or irregular cracks at the intersection point, and thus the scribe line Sa can be accurately divided. As a result, the upper and lower scribe lines Sa and Sb can be divided without turning the bonded substrate W' by using only the break roller from the upper surface (one surface) of the substrate.

While the present invention has been described with reference to the exemplary embodiments, the present invention is not limited to the embodiments. For example, in the above-described embodiment, the scribing line processing means of the cutter wheel is incorporated in the substrate processing apparatus, but the scribing line processing means may be configured by being removed from the apparatus. In this case, the scribe lines S1 and S2 are processed on the substrate by another generally known scribe line processing apparatus. In the above embodiment, the substrate is received by the cushion material 13 at the time of disconnection, but the cushion material 13 may be omitted because sufficient disconnection can be achieved if the substrate is slightly flexed. Instead of the buffer material, a pair of left and right receiving blades that receive the substrate on both sides below the scribe line may be used.

In the above embodiment, the scribe line is detected by the camera 9, but if the scribe line is formed in a lattice shape and is a substrate of a constant shape at a constant interval, the position of the scribe line on the table can be calculated by storing necessary information such as the positional relationship between the table 1 and the substrate when mounted on the table 1, the interval between the scribe lines, and the like in advance. Thus, the head moving mechanism and the table rotating/moving mechanism can be controlled based on the positional relationship obtained by calculation.

In other embodiments of the present invention, modifications and changes can be made as appropriate without departing from the scope of the invention.

Industrial applicability

The present invention can be applied to a roll breaking system in which a breaking roll is pressed and rolled along the vicinity of a scribe line to break a brittle material substrate.

Claims

1. A method for breaking a brittle material substrate, wherein a brittle material substrate having a surface on which scribe lines orthogonal to each other are formed is divided by rolling a breaking roller while pressing the breaking roller along the side of the scribe lines to propagate the cracks of the scribe lines in the thickness direction,

when the breaking roller passes through an intersection of the traveling direction of the breaking roller and the intersecting scribing line, the breaking roller passes through a position near the intersection so as not to apply pressing force or reduce the pressing force.

2. The method for breaking a brittle material substrate according to claim 1, wherein,

the no-load section or the decompression section of the breaker roll near the intersection point is within 1mm in the front and rear dimensions with the intersection point as the center.

3. The method for breaking a brittle material substrate according to claim 1 or 2, wherein,

the distance between the pressure contact surface of the breaking roller which is pressed and rolled along the side of the scribing line and the scribing line is 0.05-1 mm.

4. A substrate processing apparatus for breaking a brittle material substrate, on the surface of which scribe lines orthogonal to each other are formed, along the scribe lines, includes:

a table on which the brittle material substrate is placed and held;

a breaking roller which is pressed and rolled along the side of the scribing line of the brittle material substrate held on the worktable; and

and a control unit for controlling the pressing force of the breaking roller so that the pressing force is zero or reduced at a position near the intersection point when the breaking roller passes through the intersection point of the traveling direction of the breaking roller and the intersecting scribing line.