CN113424249A - 背板、显示基板和显示装置 - Google Patents

背板、显示基板和显示装置 Download PDF

Info

Publication number
CN113424249A
CN113424249A CN201980002397.9A CN201980002397A CN113424249A CN 113424249 A CN113424249 A CN 113424249A CN 201980002397 A CN201980002397 A CN 201980002397A CN 113424249 A CN113424249 A CN 113424249A
Authority
CN
China
Prior art keywords
micro
transparent substrate
light
display
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201980002397.9A
Other languages
English (en)
Other versions
CN113424249B (zh
Inventor
李健
王子健
林家强
翟明
李沛
王志远
李金鹏
曹鹏军
张腾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Display Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN113424249A publication Critical patent/CN113424249A/zh
Application granted granted Critical
Publication of CN113424249B publication Critical patent/CN113424249B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本公开提供了一种背板，包括：透明基底(1)；电极层(3)，设置在所述透明基底(1)的一侧，包括多条信号传输线；多个微显示发光器件，设置在所述电极层(3)背向所述透明基底(1)的一侧，所述微显示发光器件与所述信号传输线电连接，所述微显示发光器件能够朝向所述透明基底(1)一侧发光；保护层(6)，设置在所述微显示发光器件背向所述透明基底(1)的一侧；驱动模块，设置在所述保护层(6)背向所述透明基底(1)的一侧，与所述信号传输线电连接。本公开还提供一种显示基板和显示装置。

Description

PCT国内申请，说明书已公开。

Claims (20)

  1. PCT国内申请，权利要求书已公开。
CN201980002397.9A 2019-11-12 2019-11-12 背板、显示基板和显示装置 Active CN113424249B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/117510 WO2021092757A1 (zh) 2019-11-12 2019-11-12 背板、显示基板和显示装置

Publications (2)

Publication Number Publication Date
CN113424249A true CN113424249A (zh) 2021-09-21
CN113424249B CN113424249B (zh) 2024-01-23

Family

ID=75911623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980002397.9A Active CN113424249B (zh) 2019-11-12 2019-11-12 背板、显示基板和显示装置

Country Status (3)

Country Link
US (1) US20230095594A1 (zh)
CN (1) CN113424249B (zh)
WO (1) WO2021092757A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113658518B (zh) * 2021-08-24 2023-07-04 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN114488616B (zh) * 2022-02-14 2023-12-22 深圳市华星光电半导体显示技术有限公司 拼接显示面板及移动终端

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094143A1 (en) * 2004-10-21 2006-05-04 Haluzak Charles C Micro-displays and their manufacture
CN101866910A (zh) * 2009-04-15 2010-10-20 宇威光电股份有限公司 发光装置
CN105742307A (zh) * 2016-04-26 2016-07-06 张希娟 一种彩色微显示器件及制备方法
CN107195654A (zh) * 2017-06-02 2017-09-22 南京迈智芯微光电科技有限公司 一种全彩半导体发光微显示器及其制造工艺
US20180358340A1 (en) * 2017-06-09 2018-12-13 Syndiant Inc. Micro LED Display Module Having Light Transmissive Substrate and Manufacturing Method Thereof
CN109920814A (zh) * 2019-03-12 2019-06-21 京东方科技集团股份有限公司 显示基板及制造方法、显示装置
CN111028697A (zh) * 2018-10-09 2020-04-17 财团法人工业技术研究院 拼接显示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9082936B2 (en) * 2013-01-29 2015-07-14 Nthdegree Technologies Worldwide Inc. Transparent LED lamp for bidirectional lighting
KR101476686B1 (ko) * 2013-04-01 2014-12-26 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
US9755110B1 (en) * 2016-07-27 2017-09-05 Sharp Laboratories Of America, Inc. Substrate with topological features for steering fluidic assembly LED disks
WO2017014564A1 (ko) * 2015-07-23 2017-01-26 서울반도체 주식회사 디스플레이 장치 및 그의 제조 방법
KR20170051004A (ko) * 2015-11-02 2017-05-11 삼성전자주식회사 발광 소자 패키지 및 그 제조 방법
US10445048B2 (en) * 2016-12-30 2019-10-15 Shaoher Pan Larger displays formed by multiple integrated LED array micro-displays
CN107393905B (zh) * 2017-07-28 2019-07-09 天马微电子股份有限公司 柔性显示面板及柔性显示装置
CN108054286B (zh) * 2017-12-13 2020-03-06 合肥鑫晟光电科技有限公司 一种电致发光器件、显示装置及其制作方法
CN109410775A (zh) * 2018-10-24 2019-03-01 京东方科技集团股份有限公司 一种微led显示面板、其制作方法及显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060094143A1 (en) * 2004-10-21 2006-05-04 Haluzak Charles C Micro-displays and their manufacture
CN101866910A (zh) * 2009-04-15 2010-10-20 宇威光电股份有限公司 发光装置
CN105742307A (zh) * 2016-04-26 2016-07-06 张希娟 一种彩色微显示器件及制备方法
CN107195654A (zh) * 2017-06-02 2017-09-22 南京迈智芯微光电科技有限公司 一种全彩半导体发光微显示器及其制造工艺
US20180358340A1 (en) * 2017-06-09 2018-12-13 Syndiant Inc. Micro LED Display Module Having Light Transmissive Substrate and Manufacturing Method Thereof
CN111028697A (zh) * 2018-10-09 2020-04-17 财团法人工业技术研究院 拼接显示装置
CN109920814A (zh) * 2019-03-12 2019-06-21 京东方科技集团股份有限公司 显示基板及制造方法、显示装置

Also Published As

Publication number Publication date
CN113424249B (zh) 2024-01-23
WO2021092757A1 (zh) 2021-05-20
US20230095594A1 (en) 2023-03-30

Similar Documents

Publication Publication Date Title
JP7178466B2 (ja) 表示装置
US10193025B2 (en) Inorganic LED pixel structure
EP3076442B1 (en) Display device using semiconductor light emitting device
CN113167458B (zh) 显示模块、包括显示模块的显示装置和制造显示模块的方法
EP3332404B1 (en) Display device and fabricating method
CN109691231B (zh) 使用半导体发光元件的显示器件
CN111048544A (zh) 发光装置的制造方法及发光装置
EP3544386B1 (en) Display apparatus using semiconductor light emitting device, and manufacturing method therefor
CN108022940A (zh) 显示装置
CN113064294A (zh) 显示装置和多屏幕显示装置
CN110024484A (zh) 使用半导体发光器件的显示装置及其制造方法
CN108267901A (zh) 显示装置和使用该显示装置的多屏显示装置
KR20180081378A (ko) 반도체 발광소자를 이용한 디스플레이 장치
KR20180063687A (ko) 반도체 발광소자를 이용한 디스플레이 장치
US11362075B2 (en) Micro light emitting diode display substrate, device and fabrication method thereof
KR20180086003A (ko) 반도체 발광소자를 이용한 디스플레이 장치
CN112885823B (zh) 显示面板及其制备方法、显示装置
CN212934647U (zh) 显示用发光元件及具有该显示用发光元件的显示装置
CN113725249A (zh) 一种芯片结构、制作方法和显示装置
CN113424249B (zh) 背板、显示基板和显示装置
CN115832119A (zh) 一种显示装置的制作方法及显示装置
KR20180127846A (ko) 반도체 발광 소자를 이용한 디스플레이 장치
US12020630B1 (en) Stacked structure, display screen, and display apparatus
CN116190364A (zh) 一种显示装置及其制作方法
CN116190365A (zh) 一种显示装置和红光芯片的制作方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant