CN113410173A

CN113410173A - Positioning method and positioning device

Info

Publication number: CN113410173A
Application number: CN202110281171.6A
Authority: CN
Inventors: 山田忠知; 毛受利彰
Original assignee: Lintec Corp
Current assignee: Lintec Corp
Priority date: 2020-03-17
Filing date: 2021-03-16
Publication date: 2021-09-17
Also published as: TW202141673A; JP7461183B2; JP2021150368A; KR20210116253A

Abstract

A positioning method for positioning a sheet-like body (CP) at a predetermined position by using the surface tension of a liquid, wherein the following steps are performed: a supporting step of supporting the sheet-like body (CP) by the hydrophilic section (12F) of the supporting surface (12A), wherein the hydrophilic section (12F) having hydrophilicity is provided on the supporting surface (12A); a liquid supply step of supplying a liquid to the hydrophilic section (12F); and a liquid recovery step for recovering the liquid from the hydrophilic section (12F).

Description

Positioning method and positioning device

Technical Field

The invention relates to a positioning method and a positioning device.

Background

A positioning method is known in which a plurality of sheet-like bodies are positioned at predetermined positions by using the surface tension of a liquid (see, for example, japanese patent application laid-open No. 2010-24452).

In the positioning method described in document 1, water (liquid) is applied to a hydrophilic film 31a (hydrophilic portion) formed on the upper surface (support surface) of a support substrate 31 (support member), a chip 20 (sheet-like body) is disposed on the hydrophilic portion, and after the sheet-like body is positioned at a predetermined position by the surface tension of the liquid in the hydrophilic portion, it is necessary to wait until the liquid in the hydrophilic portion evaporates until the sheet-like body is supported on the support surface, which has a disadvantage that the processing capacity per unit time is lowered.

Disclosure of Invention

The invention aims to provide a positioning method and a positioning device which can prevent the processing capacity per unit time from being reduced.

The invention adopts the following technical scheme.

1. A positioning method for positioning a sheet-like body at a predetermined position by using the surface tension of a liquid, characterized by comprising:

a supporting step of supporting the sheet-like body by a hydrophilic portion of a supporting surface, the hydrophilic portion having hydrophilicity being provided on the supporting surface;

a liquid supply step of supplying a liquid to the hydrophilic portion;

a liquid recovery step of recovering the liquid from the hydrophilic portion.

2. The positioning method according to claim 1, wherein,

in the liquid supply step, the liquid is supplied to the hydrophilic portion through a flow path provided inside a support member having the support surface.

3. The positioning method according to 1 or 2, wherein,

in the liquid supply step, the liquid recovered from the hydrophilic portion in the liquid recovery step is supplied to the hydrophilic portion again.

4. A positioning device for positioning a sheet-like body at a predetermined position by using the surface tension of a liquid, comprising:

a support member that is provided with a hydrophilic portion having hydrophilicity on a support surface and supports the sheet-like body by the hydrophilic portion of the support surface;

a liquid supply member that supplies liquid to the hydrophilic portion;

a liquid recovery member that recovers the liquid from the hydrophilic portion.

According to the present invention, since the liquid is collected from the hydrophilic portion of the support surface, there is no need to wait until the liquid in the hydrophilic portion evaporates until the sheet-like body is supported on the support surface, and thus a decrease in the processing capacity per unit time can be prevented.

Further, if the liquid is supplied to the hydrophilic portion through the flow path provided inside the support member having the support surface, the liquid can be reliably supplied to the hydrophilic portion.

Further, if the liquid collected from the hydrophilic portion is supplied to the hydrophilic portion again, the amount of liquid consumed can be suppressed.

Drawings

Fig. 1A is an explanatory diagram of a positioning apparatus for implementing a positioning method according to an embodiment of the present invention.

Fig. 1B is an explanatory diagram of a positioning apparatus for implementing the positioning method according to the embodiment of the present invention.

Fig. 1C is an explanatory diagram of a positioning apparatus for implementing the positioning method according to the embodiment of the present invention.

Fig. 1D is an explanatory diagram of a positioning apparatus for implementing the positioning method according to the embodiment of the present invention.

Fig. 1E is an explanatory diagram of a positioning apparatus for implementing the positioning method according to the embodiment of the present invention.

Detailed Description

An embodiment of the present invention will be described below with reference to fig. 1A to 1E.

In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. In the present embodiment, when directions are expressed based on a case of being viewed from the near front direction in fig. 1A to 1E parallel to the Y axis, "up" is an arrow direction of the Z axis and "down" is the opposite direction, "left" is an arrow direction of the X axis and "right" is the opposite direction, "front" is the near front direction in fig. 1A to 1E parallel to the Y axis and "back" is the opposite direction.

The positioning device EA according to the present invention is a device for positioning a semiconductor chip CP as a sheet-like body (hereinafter, simply referred to as "chip") at a predetermined position by using the surface tension of a liquid LQ such as water or an ethanol solution, and includes: a support member 10 having a hydrophilic portion 12F having hydrophilicity on a support surface 12A, and supporting the chip CP by the hydrophilic portion 12F of the support surface 12A; a liquid supply member 20 that supplies the liquid LQ to the hydrophilic portion 12F; a liquid recovery member 30 that recovers the liquid LQ from the hydrophilic portion 12F; and is disposed in the vicinity of a separating member 40 for applying tension to the adhesive sheet AS to which the plurality of chips CP are attached to expand the mutual spacing of the chips CP and a peeling member 50 for peeling the adhesive sheet AS from the chips CP.

The support member 10 includes a direct-drive motor 11 as a driving device and a table 12 as a support member, and the table 12 is supported by an output shaft 11A of the direct-drive motor 11 and has a support surface 12A capable of being sucked and held by a decompression means 23 such as a decompression pump or a vacuum generator. In the present embodiment, the decompression member 23 is shared by the support member 10 and the liquid recovery member 30.

The table 12 includes a concave portion 12B provided on the upper surface, a flow path 12C provided inside the table 12 and communicating with the concave portion 12B, and a porous member 12D such as a porous resin disposed inside the concave portion 12B and having an upper surface serving as a support surface 12A.

As shown in the drawing labeled with AA in fig. 1A, the hydrophobic portion 12E having hydrophobicity is formed in a lattice shape on the support surface 12A, and the hydrophobic portion 12E defines the hydrophilic portion 12F.

In the present embodiment, the water-repellent section 12E is formed by applying a water-repellent material 12G such as an adhesive or a resin to the inner surface of the grooves formed in a lattice pattern on the support surface 12A, and the hydrophilic section 12F is formed by roughening the inner surface by roughening or spraying to form a rough surface.

The liquid supply member 20 includes a case 21 for storing the liquid LQ, a pressurizing member 22 such as a pressurizing pump or a turbine, a pressure reducing member 23, a switching valve 24 for switching a communication state between the pressurizing member 22 and the pressure reducing member 23 and the case 21, and a switching valve 25 connected to the flow path 12C via a pipe 25A and switching a communication position between the flow path 12C and the case 21 between an upper portion and a bottom portion of the case 21, and is configured to supply the liquid LQ to the hydrophilic portion 12F through the flow path 12C provided inside the stage 12 having the support surface 12A. The tank 21 communicates with the switching valve 25 via a pressure-side pipe 21A and a pressure-side pipe 21B.

The liquid recovery member 30 is configured to be common to the liquid supply member 20, and is configured to recover the liquid LQ from the hydrophilic portion 12F through the flow path 12C provided inside the stage 12 having the support surface 12A.

The separating member 40 includes a plurality of direct-drive motors 41 as driving means and a chuck cylinder 42 as a holding mechanism, i.e., a driving means, and the chuck cylinder 42 is supported by an output shaft 41A of each direct-drive motor 41 and has a pair of holding claws 42A.

The peeling member 50 includes a linear motor 51 as a driving means and a chuck cylinder 52 as a holding mechanism, that is, a driving means, and the chuck cylinder 52 is supported by a slider 51A of the linear motor 51 and has a pair of holding claws 52A.

The operation of the positioning device EA is described above. The following steps performed by the positioning device EA are performed in a method for manufacturing a semiconductor device including the chip CP.

First, a positioning device EA having respective members is disposed at an initial position shown in fig. 1A, a user of the positioning device EA (hereinafter, simply referred to AS "user"), a conveying means (not shown) such AS an articulated robot or a belt conveyor conveys a plurality of chips CP attached to an adhesive sheet AS to a predetermined position above a table 12, and a separating means 40 drives a direct-acting motor 41 and a chuck cylinder 42 to grip the adhesive sheet AS by a pair of holding claws 42A AS shown by a two-dot chain line in fig. 1A. Next, the separating member 40 drives the direct-drive motor 41 to apply tension to the adhesive sheet AS to expand the mutual spacing of the plurality of chips CP AS shown in fig. 1B (separating step). At this time, the chips CP are arranged to face the hydrophilic portions 12F of the support surface 12A with a large distance therebetween.

Thereafter, the support member 10 drives the direct-drive motor 11, and as shown in fig. 1B, after the table 12 is raised to bring the support surface 12A into contact with the chip CP, the decompression member 23 is driven to start suction holding of the chip CP on the support surface 12A (support step). Next, after the separating member 40 drives the chuck cylinder 42 to release the holding of the adhesive sheet AS on the holding claw 42A, the support member 10 drives the direct-drive motor 11 to lower the stage until the adhesive sheet AS reaches a predetermined height position on the left side of the chuck cylinder 52.

Then, the peeling member 50 drives the linear motor 51 and the chuck cylinder 52, and grips the right end portion of the adhesive sheet AS by the pair of holding claws 52A. Next, the support member 10 drives the direct-drive motor 11 to lower the stage 12 to return to the initial position, and the peeling member 50 drives the linear motor 51 to move the chuck cylinder 52 leftward AS shown in fig. 1C to peel the adhesive sheet AS from the chip CP (peeling step).

When the adhesive sheet AS is peeled off from all the chips CP, the peeling member 50 stops the driving of the linear motor 51, drives the chuck cylinder 52, releases the grip of the adhesive sheet AS on the holding claw 52A, and drops the adhesive sheet AS into a not-shown collection member such AS a collection box or a collection bag located below the peeled adhesive sheet AS. Thereafter, the support member 10 stops the driving of the depressurizing means 23, releases the adsorption holding of the chip CP on the support surface 12A, and the liquid supply means 20 drives the switching

valves

24 and 25 to communicate the concave portion 12B with the pressurizing means 22 via the pressurizing-side pipe 21A as shown in fig. 1D, and then drives the pressurizing means 22 to raise the pressure in the tank 21. Thereby, the liquid LQ is supplied to the hydrophilic portion 12F of the support surface 12A through the pressure-side pipe 21A, the switching valve 25, the pipe 25A, the flow path 12C, and the porous member 12D (liquid supply step). After the liquid LQ is supplied to the hydrophilic portion 12F, the liquid LQ rises in the hydrophilic portion 12F, and the chip CP is lifted up as shown in fig. 1D. If the chip CP is lifted up by the liquid LQ, the chip CP is positioned at a predetermined position by the surface tension of the liquid LQ as shown by the two-dot chain line in fig. 1D.

Next, the liquid supply means 20 stops the driving of the pressurizing means 22, the liquid recovery means 30 drives the switching

valves

24 and 25, and as shown in fig. 1E, the pressure reducing means 23 is driven to reduce the pressure in the tank 21 after the recess 12B and the pressure reducing means 23 are communicated through the pressure reducing side pipe 21B. Thereby, the liquid LQ on the hydrophilic portion 12F of the support surface 12A is collected into the tank 21 through the porous member 12D, the flow path 12C, the pipe 25A, the switching valve 25, and the pressure-reducing-side pipe 21B (liquid collection step). After the liquid LQ on the hydrophilic portion 12F is collected, the chip CP comes into contact with the support surface 12A, and suction holding of the chip CP on the support surface 12A is started. At this time, each chip CP is positioned at a predetermined position and at a predetermined angle, and is supported by the support surface 12A in a state of being positioned at the predetermined position. The liquid LQ recovered from the hydrophilic portion 12F in the liquid recovery step is supplied to the hydrophilic portion 12F again in the next liquid supply step.

Next, the support member 10 stops the driving of the decompression member 23, releases the suction holding of the chip CP on the support surface 12A, and thereafter, conveys the chip CP from the support surface 12A by a conveying member (not shown) to be stacked on a lead frame, a substrate, or the like (stacking step). Next, after all the chips CP are conveyed from the support surface 12A, the respective members drive the respective driving devices to return the respective members to the initial positions, and thereafter, the same process as described above is repeated.

According to the above embodiment, since the liquid LQ is collected from the hydrophilic portion 12F in the supporting surface 12A, there is no need to wait until the liquid LQ of the hydrophilic portion 12F evaporates until the chips CP are supported on the supporting surface 12A, and thus a decrease in throughput per unit time can be prevented.

As described above, although the best structure, method, and the like for carrying out the present invention have been disclosed in the foregoing, the present invention is not limited thereto. That is, although the present invention has been particularly shown and described with respect to specific embodiments, it will be apparent to those skilled in the art that various changes in shape, material, number, and other detailed configurations may be made in the above-described embodiments without departing from the scope of the technical spirit and purpose of the present invention. The above description of the limitation of the shape, material, and the like is an exemplary description for easy understanding of the present invention, and is not intended to limit the present invention, and therefore, the description of the name of a part or all of the components exceeding the limitation of the shape, material, and the like is included in the present invention.

For example, the support member 10 may hold the chip CP by suction on the support surface 12A by a decompression member independent of the liquid recovery member 30, or may hold the chip CP by suction without using the support surface 12A after the liquid recovery step.

The water-repellent section 12E may be formed by attaching a sheet, film, tape, or the like having water repellency to the support surface 12A, or by applying a surface treatment or coating layer that exerts water repellency to the support surface 12A.

The hydrophilic portion 12F may be formed by attaching a hydrophilic sheet, film, tape, or the like to the support surface 12A, or by applying a surface treatment or coating that exerts a hydrophilic effect to the support surface 12A.

The liquid supply member 20 may supply the liquid LQ onto the support surface 12A from the outside of the stage 12 by a nozzle, a hose, or the like, or may not supply the liquid LQ recovered from the hydrophilic portion 12F in the liquid recovery step to the hydrophilic portion 12F again.

The liquid recovery member 30 may be provided separately from the liquid supply member 20, and in this case, the flow path 12C of the stage 12 may be shared with the liquid supply member 20 to recover the liquid LQ from the flow path 12C, or a recovery flow path different from the flow path 12C may be provided on the stage 12 to recover the liquid LQ from the recovery flow path.

The separating member 40 may apply tension to the adhesive sheet AS in, for example, the vertical direction, or in four directions of the right, left, front, and rear directions, two directions of the right and left directions, three directions of the left front, left rear, and right directions, or in five or more directions including components in the front, rear, and left and right directions to expand the mutual spacing between the chips CP, or may apply tension to the adhesive sheet AS by supporting the frame member in the case of using a frame member such AS a ring frame integrated with the chips CP via the adhesive sheet AS, to expand the mutual spacing between the chips CP, or may apply tension to the adhesive sheet AS to which a semiconductor wafer (hereinafter simply referred to AS a "wafer") capable of being singulated into a plurality of chips CP is attached by a fragile layer physically or chemically formed by an embrittling member such AS a laser irradiation device or a chemical liquid application device, or a notch or notch CP formed by a cutting member such AS a cutting blade, thereby dividing the wafer into a plurality of chips CP and enlarging the mutual intervals of the chips CP.

The positioning device EA of the present invention may or may not include the separating member 40, and when the separating member 40 is not provided, the mutual spacing between the chips CP may be enlarged by another device.

The positioning device EA of the present invention may be provided with or without the peeling member 50, and in the case where the peeling member 50 is not provided, the adhesive sheet AS may be peeled off by another device, or the adhesive sheet AS may be cut along the gaps between the plurality of chips CP by a cutting member such AS a cutter blade or by blowing gas by a gas blowing member such AS a nozzle, so that the cut adhesive sheet AS is maintained in a state of being attached to the chips CP.

The positioning device EA may include an attaching member for attaching the adhesive sheet AS to the chips CP or the wafer by a pressing member such AS a pressing roller, a cutting member such AS a laser irradiation device or a dicing blade for cutting and singulating the wafer into a plurality of chips CP, an integrating member for integrating the chips CP or the wafer with the frame member via the adhesive sheet AS, or a plurality of chips CP not attached to the adhesive sheet AS may be carried by a carrying member not shown and placed on the hydrophilic portion 12F of the support surface 12A.

The liquid LQ used in the positioning device EA is not particularly limited as long as it has a certain surface tension, and may be an alcohol solution containing ethanol, propanol, glycerol, or the like, for example.

In the above embodiment, the positioning of the plurality of chips CP as the sheet-like body is exemplified, but the sheet-like body may be one chip CP.

Either the supporting step or the liquid supplying step may be performed first, and the liquid supplying step may be performed after the supporting step is performed, or the supporting step may be performed after the liquid supplying step is performed. When the supporting step is performed after the liquid supplying step is performed, the chips CP can be peeled off from the adhesive sheet AS by another device while maintaining the mutual spacing therebetween, and the peeled chips CP can be transferred to and supported on the supporting surface 12A after the liquid supplying step is performed.

The stacking step or the recovery step may or may not be performed.

The frame member may be non-annular (not circumferentially connected) or circular, elliptical, polygonal, or other shapes other than the annular frame.

The members and steps in the present invention are not limited as long as the operations, functions, and steps described in the members and steps can be realized, and are not limited at all to the configurations and steps of the simple embodiments shown in the above embodiments. For example, the supporting step may be any step as long as the sheet-like body is supported by the hydrophilic portion having the supporting surface having the plurality of hydrophilic portions having hydrophilicity, and the content within the technical scope thereof is not limited by reference to the technical common knowledge at the time of application (the same applies to other members and steps).

The material, type, shape, and the like of the adhesive sheet AS or the sheet-like body are not particularly limited. For example, the adhesive sheet AS or the sheet-like body may have a circular, oval, polygonal or other shape, and the adhesive sheet AS may be an adhesive sheet having an adhesive form such AS pressure-sensitive adhesion or heat-sensitive adhesion. The pressure-sensitive adhesive sheet AS may be of a single-layer structure having only a pressure-sensitive adhesive layer, a structure having an intermediate layer between a substrate and a pressure-sensitive adhesive layer, or a three-layer or more structure having a cover layer or the like on the upper surface of a substrate, or may be of a so-called double-sided adhesive sheet in which a substrate is peelable from a pressure-sensitive adhesive layer, or may be of a single-layer or multi-layer structure having a single-layer or multi-layer intermediate layer or a single-layer or multi-layer structure having no intermediate layer. The sheet-like body may be, for example, a food, a resin container, a semiconductor chip such as a silicon semiconductor chip or a semiconductor compound chip, a circuit board, an information recording board such as an optical disk, or a single body such as a glass plate, a steel plate, a pottery, a wood plate, or a resin, or may be a composite body formed of two or more of them, and a member or an article of any form may be targeted. The adhesive sheet AS may be referred to AS a functional or functional label, and may be any sheet, film, or tape such AS an information recording label, a decorative label, a protective sheet, a dicing tape, a die-bonding film, a bonding tape, or a recording layer-forming resin sheet.

The driving device in the above-described embodiment can be an electric device such as a rotary motor, a direct-acting motor, a linear motor, a single-axis robot, a multi-joint robot having joints of two or more axes, or a transmission device such as a cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder, and can be a driving device in which these are directly or indirectly combined.

In the above-described embodiment, in the case of pressing a pressing member such as a pressing roller or a pressing head or a pressed object called a pressing member, a member such as a roller, a round bar, a scraper, rubber, resin, sponge, or the like, or a member that presses by blowing a gaseous substance such as air or gas may be used instead of or together with the above-described exemplary structure, and the pressing member may be configured by a deformable member such as rubber or resin, or may be configured by a non-deformable member; in the case of supporting (holding) a supported member (a held member) such as a supporting (holding) member or a supporting (holding) member, the supported member may be supported (held) by using a holding member such as a cylinder for a jaw and a chuck, coulomb force, an adhesive (an adhesive sheet, an adhesive tape), a magnetic force, bernoulli suction, suction, a driving device, or the like; in the case of cutting a member to be cut such as a cutting member or forming a notch or a cutting line in the member to be cut, cutting may be performed by using a cutting blade, a laser cutter, an ion beam, heat, water pressure, an electric heating wire, cutting by blowing gas or liquid, or the like, or by combining an appropriate driving device and moving a cutting section in place of or together with the above-described exemplary configuration.

Claims

a liquid supply step of supplying a liquid to the hydrophilic portion;

a liquid recovery step of recovering the liquid from the hydrophilic portion.

2. The positioning method according to claim 1,

3. The positioning method according to claim 1 or 2,

a liquid supply member that supplies liquid to the hydrophilic portion;

a liquid recovery member that recovers the liquid from the hydrophilic portion.