JP2015154031A - Chip arrangement table and chip arrangement method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip arrangement table capable of arranging chips with high accuracy.SOLUTION: A chip arrangement table for arranging a plurality of chips (11) is constituted to include a table body (4) having a holding surface for holding chips, a plurality of porous portion (6) formed at predetermined intervals, from each other, on the holding surface side, and having substantially same size as the chips, a liquid supply path having one end communicating with the porous portion and the other end connected with a liquid supply source (8), and a liquid discharge path having one end communicating with the porous portion and the other end connected with a suction source (14).

Description

  The present invention relates to a chip alignment table and a chip alignment method for aligning a plurality of chips.

  In recent years, manufacture of a package called FOWLP (Fan-Out Wafer Level Package) in which a rewiring layer is formed outside a device chip (chip) using a wafer level rewiring technique has been started (for example, see Patent Document 1). ). FOWLP is advantageous in miniaturization as compared with a conventional package using wire bonding or the like because the chip and the package substrate are connected by a thin wiring layer.

  For manufacturing FOWLP, for example, a process called a chip-first method is employed. In the chip first method, first, chips arranged at arbitrary intervals are sealed with a resin to form a pseudo wafer, and a wiring layer is provided on the pseudo wafer. Then, a plurality of packages can be obtained by dividing the pseudo wafer along the planned dividing line between the chips.

  Further, a process called RDL first (Redistribution Layer-first) method is adopted in which chips are arranged on a support wafer provided with a wiring layer and sealed with resin, and then the support wafer is removed and divided into a plurality of packages. Sometimes. In this RDL first method, for example, chips can be arranged while avoiding defective portions of the wiring layer, which is advantageous in improving the yield as compared with the chip first method.

JP2013-58520A

  By the way, in the above-described chip first method and RDL first method, it is necessary to arrange the chips with high accuracy in order to reliably connect the wiring layers formed at high density. However, a transfer apparatus that transfers and rearranges the chips determines the post-transfer position based on the position of each chip before the transfer, for example, so that the chips before the transfer are sufficiently aligned. Otherwise, there will be a shift in the arrangement of the chips after the transfer.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a chip alignment table and a chip alignment method capable of aligning chips with high accuracy.

  According to the present invention, a table body having a holding surface for holding a chip, a plurality of porous portions having substantially the same size as the chip formed at a predetermined interval from each other on the holding surface side, and one end of the table body A liquid supply path that communicates with the porous part and has the other end connected to the liquid supply source, and a liquid discharge path that has one end communicated with the porous part and the other end connected to the suction source. A chip alignment table is provided.

  Further, according to the present invention, there is provided a chip alignment method for aligning a plurality of chips using the chip alignment table, wherein a chip mounting step of mounting a plurality of chips on the chip alignment table; Before or after performing the chip placement step, the liquid supply source is operated to allow the liquid to flow from the porous part to the holding surface, so that each chip is positioned on the porous part by the surface tension of the liquid. And a liquid removing step of operating the suction source and removing the liquid from the holding surface to align the plurality of chips on the holding surface after performing the liquid supplying step. A chip alignment method is provided.

  The chip alignment table according to the present invention includes a plurality of porous parts having substantially the same size as the chip on the holding surface side of the table body holding the chips, and each porous part is connected to a liquid supply source through a liquid supply path. At the same time, it is connected to the suction source through the liquid discharge path.

  Therefore, the liquid can flow out from the porous portion, and the chip can be positioned on the porous portion by the surface tension of the liquid. Further, the liquid that has flowed out of the porous portion can be removed with a suction source. Thus, according to the chip alignment table and the chip alignment method according to the present invention, the chips can be aligned with high accuracy.

It is a perspective view which shows typically the external appearance of the table for chip | tip alignment which concerns on this Embodiment. It is a figure which shows typically the cross section etc. of the table for chip | tip alignment which concerns on this Embodiment. It is a figure which shows typically the chip | tip mounting step which concerns on this Embodiment. It is a figure which shows typically the liquid supply step which concerns on this Embodiment. It is a figure which shows typically the liquid removal step which concerns on this Embodiment.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing the external appearance of a chip alignment table according to the present embodiment, and FIG. 2 is a view schematically showing a cross section of the chip alignment table according to the present embodiment. is there.

  As shown in FIGS. 1 and 2, the chip alignment table 2 of the present embodiment includes a disk-shaped table body 4 formed of a material such as stainless steel. The upper surface 4a of the table body 4 is provided with a plurality of recesses 4c corresponding to the shape and size of the chip 11 to be aligned (see FIG. 3 and the like). The upper surface 4a of the table body 4 is substantially flat except for the recess 4c.

  The plurality of recesses 4 c are arranged at arbitrary intervals corresponding to the alignment mode of the chips 11. For example, in FIG. 1 and FIG. 2, a plurality of recesses 4c are arranged at equal intervals in order to align the chips 11 at equal intervals. On the other hand, when the chips 11 are arranged at different intervals, the plurality of recesses 4c may be arranged at different intervals.

  The shape of the recess 4c in plan view is typically a rectangle. However, the shape of the recess 4c in the plan view is appropriately changed according to the shape of the chip 11 in the plan view. For example, if the chip 11 has a polygonal plan view, the recess 4c also has a polygonal view. If the chip 11 has a circular plan view, the recess 4c also has a plan view.

  The size (area) of the recess 4c in plan view is approximately the same as the size (area) of the chip 11 in plan view. However, the size of the recess 4c in plan view can be arbitrarily changed within a range in which the chips 11 can be properly aligned. For example, the size of the recess 4c in plan view may be slightly smaller than the size of the chip 11 in plan view, or may be slightly larger than the size of the chip 11 in plan view.

  1 and 2, the table body 4 is provided with a plurality of recesses 4c having the same shape and size, but the shape and size of the recesses 4c may not be one type. For example, when different types of chips 11 are aligned, a plurality of recesses 4 c having different shapes and sizes may be provided according to the types of chips 11.

  A porous member (porous portion) 6 that matches the shape of the recess 4c is fitted in the recess 4c. Specifically, the shape and size of the upper surface 6 a of the porous member 6 correspond to the shape and size of the chip 11. Further, the upper surface 6 a of the porous member 6 is positioned at the same height as the upper surface 4 a of the table main body 4 and functions as a holding surface for holding the chip 11 together with the upper surface 4 a of the table main body 4.

  The porous member 6 is formed of a porous material, for example, and allows liquid such as water to pass therethrough. Therefore, for example, when a liquid is supplied to the lower surface 6 b side of the porous member 6, the liquid flows out to the upper surface 6 a side through the inside of the porous member 6.

  As shown in FIG. 2, a liquid supply source 8 that supplies a liquid such as water to the table body 4 is provided outside the table body 4. The liquid supply source 8 is connected to the table body 4 through a supply pipe 10 and the like. A supply side valve 12 for controlling the supply of liquid is disposed in the supply pipe 10.

  A suction source 14 for removing liquid from the table body 4 is provided outside the table body 4. The suction source 14 is connected to the table body 4 through the discharge pipe 16 and the like. The discharge pipe 16 is provided with a discharge side valve 18 for controlling the removal of the liquid.

  The supply pipe 10 is connected to a supply port 4 d formed on the lower surface 4 b side of the table body 4. On the other hand, the discharge pipe 16 is connected to a discharge port 4 e formed on the lower surface 4 b side of the table body 4. The supply port 4d and the discharge port 4e communicate with a mesh-like flow path 4f extending in the horizontal direction.

  At a position corresponding to each recess 4c, a thin flow path 4g branches upward from the mesh-shaped flow path 4f. The tip of this flow path 4g is opened at the bottom surface of each recess 4c. Thereby, the liquid from the liquid supply source 8 is supplied to the recessed part 4c through the supply pipe 10, the supply port 4d, the flow path 4f, and the flow path 4g. The liquid in the recess 4 c is sucked into the suction source 14 through the flow path 4 g, the flow path 4 f, the discharge port 4 e, and the discharge pipe 16.

  As described above, the porous member 6 is fitted in the recess 4c. Therefore, the liquid supplied from the liquid supply source 8 flows out to the upper surface 6 a side of the porous member 6. Further, the liquid flowing out to the upper surface 6 a side of the porous member 6 can be removed by the suction source 14.

  That is, the supply pipe 10, the supply port 4d, the flow path 4f, and the flow path 4g function as a liquid supply path that connects the porous member 6 and the liquid supply source 8, and the flow path 4g, the flow path 4f, the discharge port 4e, The discharge pipe 16 functions as a liquid discharge path that connects the porous member 6 and the suction source 14.

  Next, a chip alignment method performed using the above-described chip alignment table 2 will be described. In the chip alignment method according to the present embodiment, first, a chip mounting step of mounting a plurality of chips to be aligned on the chip alignment table 2 is performed. FIG. 3 is a diagram schematically showing the chip placement step.

  As shown in FIG. 3, in the chip placement step, a plurality of chips 11 are placed on the upper surface 4 a of the table body 4 and the upper surface 6 a of the porous member 6 that function as a holding surface. Specifically, the plurality of chips 11 are placed so that at least a part of each chip 11 overlaps the corresponding porous member 6. In this chip placement step, the supply side valve 12 and the discharge side valve 18 are closed.

  After the chip placement step, a liquid supply step for supplying liquid to the porous member 6 is performed. FIG. 4 is a diagram schematically illustrating the liquid supply step. As shown in FIG. 4, in the liquid supply step, first, the supply side valve 12 provided in the supply pipe 10 is opened.

  Thereby, the liquid is supplied from the liquid supply source 8 to the porous member 6 through the liquid supply path (that is, the supply pipe 10, the supply port 4d, the flow path 4f, and the flow path 4g). Water (pure water) can be used as this liquid. The supply side valve 12 is closed after the liquid 13 slightly flows out from the upper surface 6 a of the porous member 6.

  That is, the amount of the liquid supplied from the liquid supply source 8 is set such that the liquid 13 slightly flows out from the upper surface 6 a of the porous member 6. As described above, since each chip 11 is placed so that a part thereof overlaps the corresponding porous member 6, the liquid 13 flowing out from the upper surface 6 a of the porous member 6 comes into contact with the chip 11.

  As a result, the tip 11 is moved by the action of the surface tension (and buoyancy) of the liquid 13, and is positioned at a position that substantially overlaps the porous member 6, as shown in FIG. The porous member 6 is fitted in the recesses 4c arranged at an arbitrary interval. Therefore, the chips 11 are aligned in a manner corresponding to the arrangement of the recesses 4c.

  After the liquid supply step, a liquid removal step for removing the liquid 13 that has flowed out to the upper surface 6a of the porous member 6 is performed. FIG. 5 is a diagram schematically showing the liquid removal step according to the present embodiment. As shown in FIG. 5, in the liquid removal step, first, the discharge side valve 18 provided in the discharge pipe 16 is opened.

  Thereby, the liquid 13 on the upper surface 6a is sucked into the suction source 14 through the liquid discharge path (that is, the flow path 4g, the flow path 4f, the discharge port 4e, and the discharge pipe 16). As shown in FIG. 5, when the liquid 13 is completely removed from the upper surface 6a of the porous member 6, the discharge side valve 18 is closed.

  As described above, the chip alignment table according to the present embodiment includes a plurality of porous members (porous portions) 6 having substantially the same size as the chips 11 on the holding surface side of the table body 4 that holds the chips 11. The porous member 6 is connected to the liquid supply source 8 through the liquid supply path, and is connected to the suction source 14 through the liquid discharge path.

  Therefore, the liquid 13 can flow out from the porous member 6, and the chip 11 can be positioned at a position where it overlaps the porous member 6 due to the surface tension of the liquid 13. Further, the liquid 13 that has flowed out of the porous member 6 can be removed by the suction source 14. Thus, according to the chip alignment table and the chip alignment method according to the present embodiment, the chips 11 can be aligned with high accuracy.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, water (pure water) is used as the liquid, but another liquid that can obtain a certain degree of surface tension may be used.

  Further, the upper surface 4a of the table body 4 may be processed (water repellent) with a fluororesin or the like. In this case, since the liquid 13 is difficult to spread above the upper surface 4a, the chips 11 can be aligned with higher accuracy.

  Moreover, in the said embodiment, although the liquid supply step is implemented after the chip | tip mounting step, you may implement a chip | tip mounting step after implementing a liquid supply step. In this case, first, a liquid supply step is performed to allow the liquid 13 to flow out to the upper surface 6 a of the porous member 6.

  Next, a chip placement step is performed to place each chip 11 so as to overlap the porous member 6. Thereby, the chip 11 can be self-aligned by the action of the surface tension (and buoyancy) of the liquid 13.

  In addition, the configurations, methods, and the like according to the above-described embodiments can be changed as appropriate without departing from the scope of the object of the present invention.

2 Table for chip alignment 4 Table body 4a Upper surface 4b Lower surface 4c Recess 4d Supply port 4e Discharge port 4f Channel 4g Channel 6 Porous member (porous part)
6a upper surface 6b lower surface 8 liquid supply source 10 supply pipe 12 supply side valve 14 suction source 16 discharge pipe 18 discharge side valve 11 chip 13 liquid

Claims (2)

A chip alignment table for aligning a plurality of chips,
A table body having a holding surface for holding a chip;
A plurality of porous portions having substantially the same size as the chips formed at predetermined intervals on the holding surface side;
A liquid supply path having one end communicating with the porous portion and the other end connected to a liquid supply source;
A chip alignment table comprising: a liquid discharge path having one end communicating with the porous portion and the other end connected to a suction source. A chip alignment method for aligning a plurality of chips using the chip alignment table according to claim 1,
A chip mounting step of mounting a plurality of chips on the chip alignment table;
Before or after performing the chip placement step, the liquid supply source is operated to allow the liquid to flow out from the porous part to the holding surface, thereby positioning each chip on the porous part with the surface tension of the liquid. A liquid supply step;
And a liquid removing step of aligning a plurality of chips on the holding surface by operating the suction source after removing the liquid and removing the liquid from the holding surface. Chip alignment method.

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