KR20210116253A - Positioning method and positioning device - Google Patents

Abstract

A position determining method determines a position of a flake body (CP) at a predetermined position by using a surface tensile force of a liquid. The position determining method performs a supporting step of supporting a flaky body (CP) in a hydrophilic portion (12F) of a supporting surface (12A) on which the hydrophilic portion (12F) having hydrophilicity is formed, a liquid supply step of supplying a liquid to the hydrophilic portion (12F), and a liquid recovery step of recovering the liquid from the hydrophilic portion (12F).

Description

Positioning method and positioning device

The present invention relates to a positioning method and a positioning device.

A positioning method of positioning a plurality of flakes at a predetermined position using the surface tension of a liquid is known (for example, see Document 1: Japanese Patent Application Laid-Open No. 2010-245452).

In the positioning method described in Document 1, water (liquid) is applied on the hydrophilic film 31a (hydrophilic part) formed on the upper surface (support surface) of the support substrate 31 (support member), and the chip ( 20) By arranging (flaky body), after positioning the patchy body at a predetermined position with the surface tension of the liquid in the hydrophilic part, it is necessary to wait for the liquid of the hydrophilic part to evaporate until the patchy body is supported on the support surface. , there is a problem in that the processing capacity per unit time is lowered.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a positioning method and a positioning device capable of preventing a decrease in processing capacity per unit time.

The present invention employs the configuration described in the claims.

According to the present invention, since the liquid is recovered from the hydrophilic part on the support surface, there is no need to wait for the liquid of the hydrophilic part to evaporate until the flakes are supported on the support surface, preventing a decrease in processing capacity per unit time can do.

In addition, if the liquid is supplied to the hydrophilic part through the flow path formed inside the support member having the support surface, the liquid can be reliably supplied to the hydrophilic part.

In addition, if the liquid recovered from the hydrophilic part is re-supplied to the hydrophilic part, the consumption of the liquid can be suppressed.

1A is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention.
Fig. 1B is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention.
Fig. 1C is an explanatory diagram of a positioning device for implementing a positioning method according to an embodiment of the present invention.
Fig. 1D is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention.
Fig. 1E is an explanatory diagram of a positioning device that implements a positioning method according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, one embodiment of the present invention will be described with reference to Figs. 1A to 1E.

Further, in the present embodiment, the X axis, Y axis, and Z axis are in a relationship orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. . In addition, in this embodiment, on the basis of the case of seeing from the front direction of FIGS. 1A to 1E parallel to the Y axis, when the direction is indicated, "up" is the arrow direction of the Z axis, and "down" is the reverse direction, " 1A to 1E, in which "left" is the arrow direction of the X axis, "right" is the reverse direction, "front" is the forward direction in FIGS. 1A to 1E parallel to the Y axis, and "rear" is the reverse direction.

The positioning device EA of the present invention uses the surface tension of a liquid LQ such as water or an alcohol solution to position a semiconductor chip (hereinafter simply referred to as a “chip”) CP as a flake body at a predetermined position. A positioning device, comprising: a support means 10 for supporting the chip CP in the hydrophilic portion 12F of the support surface 12A on which the hydrophilic portion 12F having hydrophilicity is formed, and a liquid ( An adhesive sheet AS comprising a liquid supplying means 20 for supplying LQ), and a liquid recovery means 30 for recovering the liquid LQ from the hydrophilic portion 12F, to which a plurality of chips CP are adhered. It is arrange|positioned in the vicinity of the separation means 40 which applies tension|tensile_strength to these and widens the mutual space|interval of the chip|tip CP, and the peeling means 50 which peels the adhesive sheet AS from the chip|tip CP.

The support means 10 is supported by the linear motor 11 as a drive device, and the output shaft 11A of the linear motor 11, The support which can be adsorbed and held by the pressure reducing means 23, such as a pressure reduction pump and a vacuum ejector. A table 12 as a support member having a face 12A is provided. In the case of the present embodiment, the pressure reducing means 23 is configured to be shared by the support means 10 and the liquid recovery means 30 .

The table 12 is disposed in a recess 12B formed on the upper surface, a flow path 12C formed inside the table 12 and communicating with the recess 12B, and the recess 12B, A porous member 12D, such as a porous resin, whose upper surface serves as the support surface 12A is provided.

In the support surface 12A, as shown in the figure to which AA is given in FIG. 1A, the hydrophobic part 12E which has hydrophobicity is formed in the grid|lattice form, and the hydrophilic part 12F is partitioned by the said hydrophobic part 12E.

In the present embodiment, the hydrophobic portion 12E has a configuration in which a water-repellent material 12G such as an adhesive or resin is applied to the inner surface of the grooves formed in a grid shape on the support surface 12A, and the hydrophilic portion 12F includes: It has the structure to which the roughening process used as a rough surface was given by the rough-surface forming means which performs a rough-surface process, a blast process, etc.

The liquid supply means 20 includes a tank 21 accommodating the liquid LQ, a pressurization means 22 such as a pressurization pump or a turbine, a decompression means 23 , and a pressurization means for the tank 21 ( 22) and a switching valve 24 for switching the communication state of the pressure reducing means 23, connected to the flow path 12C via a pipe 25A, and the communication position of the flow path 12C with the tank 21 Liquid (LQ) to the hydrophilic part 12F by the flow path 12C formed inside the table 12 which is provided with the switching valve 25 which switches to the upper part and the bottom part of the tank 21, and has the support surface 12A It is structured to provide Moreover, the tank 21 communicates with the switching valve 25 via the pressure side piping 21A and the pressure reduction side piping 21B.

The liquid recovery means 30 is configured to serve both as the liquid supply means 20, and flows from the hydrophilic part 12F to the liquid ( LQ) is recovered.

The separation means 40 is supported by a plurality of linear motors 41 as a driving device, and an output shaft 41A of each linear motor 41, and is a holding means having a pair of gripping claws 42A as a driving device as a driving device. A chuck cylinder 42 is provided.

The peeling means 50 is a linear motor 51 as a driving device, and a chuck cylinder as a driving device as holding means supported by a slider 51A of the linear motor 51 and having a pair of gripping claws 52A. 52) is provided.

The operation of the above positioning device EA will be described. In addition, the following processes implemented by positioning device EA are implemented by the manufacturing method of the semiconductor device provided with the chip CP.

First, with respect to the positioning device EA in which each member is disposed at the initial position shown in Fig. 1A, a user of the positioning device EA (hereinafter simply referred to as "user"), or an articulated robot or a belt When a conveyance means (not shown) such as a conveyor conveys the plurality of chips CP stuck on the adhesive sheet AS to a predetermined position above the table 12 , the separation means 40 is a linear motor 41 and a chuck The cylinder 42 is driven and the adhesive sheet AS is gripped by a pair of gripping claws 42A, as shown by the dashed-dotted line in FIG. 1A. Next, the spacer means 40 drives the linear motor 41, and, as shown in FIG. 1B, tension|tensile_strength is applied to adhesive sheet AS, and the mutual space|interval of several chip|tips CP is widened (separation process). At this time, the mutual spacing between the chips CP is widened so as to face each of the hydrophilic portions 12F of the support surface 12A, respectively.

Then, after the support means 10 drives the linear motor 11 and raises the table 12 as shown in FIG. (23) is driven to start adsorption holding of the chip CP on the support surface 12A (support step). Next, after the separation means 40 drives the chuck cylinder 42 and releases the gripping of the adhesive sheet AS by the gripping claw 42A, the support means 10 drives the linear motor 11 . Thus, the table 12 is lowered until the adhesive sheet AS reaches a predetermined height position on the left side of the chuck cylinder 52 .

And the peeling means 50 drives the linear motor 51 and the chuck cylinder 52, and grips the right end of the adhesive sheet AS with the pair of gripping claws 52A. Next, the peeling means 50 drives the linear motor 51, and the peeling means 50 drives the linear motor 51, while the support means 10 drives the linear motor 11, lowers the table 12, and returns to an initial position, Similarly, the chuck cylinder 52 is moved to the left to peel the adhesive sheet AS from the chip CP (peeling step).

When the adhesive sheet AS is peeled off from all the chips CP, the peeling means 50 stops the driving of the linear motor 51, then drives the chuck cylinder 52, and adhesion by the gripping claw 52A The gripping of the sheet AS is released, and it is made to fall into collection|recovery means (not shown), such as a collection box or collection bag located below the peeled adhesive sheet AS. After that, when the support means 10 stops the driving of the pressure reducing means 23 to release the adsorption holding of the chip CP on the support surface 12A, the liquid supply means 20 activates the switching valve 24 , 25) and, as shown in Fig. 1D, the concave portion 12B and the pressurizing means 22 are communicated via the pressurizing side pipe 21A, and then the pressurizing means 22 is driven to drive the tank ( 21) Increase the internal pressure. Thereby, the liquid LQ is transferred to the hydrophilic part 12F of the support surface 12A via the pressure side pipe 21A, the switching valve 25, the pipe 25A, the flow path 12C, and the porous member 12D. supplied (liquid supply process). When the liquid LQ is supplied to the hydrophilic part 12F, the liquid LQ rises up in the hydrophilic part 12F and pushes up the chip CP as shown in FIG. 1D . When the chip CP is pushed up by the liquid LQ, the chip CP is positioned at a predetermined position by the surface tension of the liquid LQ as indicated by the dashed-dotted line in FIG. 1D.

Next, when the liquid supply means 20 stops the driving of the pressurization means 22, the liquid recovery means 30 drives the switching valves 24 and 25, and as shown in Fig. 1E, the pressure reduction side pipe ( After the concave portion 12B and the pressure reducing means 23 are communicated via 21B), the pressure reducing means 23 is driven to lower the pressure in the tank 21 . Thereby, the liquid LQ on the hydrophilic part 12F of the support surface 12A via the porous member 12D, the flow path 12C, the pipe 25A, the switching valve 25, and the pressure-reduction side pipe 21B. ) is recovered in the tank 21 (liquid recovery step). When the liquid LQ existing on the hydrophilic part 12F is recovered, the chip CP is brought into contact with the support surface 12A, and suction and holding of the chip CP on the support surface 12A is started. At this time, each chip CP is positioned at a predetermined position and a predetermined angle, and is supported by the support surface 12A in a state positioned at a predetermined position. Further, the liquid LQ recovered from the hydrophilic unit 12F in the liquid recovery step is re-supplied to the hydrophilic unit 12F in the next liquid supply step.

And after the support means 10 stops the driving of the pressure reducing means 23 and cancels the adsorption|suction holding of the chip|tip CP on the support surface 12A, a conveying means (not shown) moves from the support surface 12A. The chip CP is conveyed and laminated on a lead frame, a substrate, or the like (lamination step). Then, when all the chips CP are conveyed from the support surface 12A, each means drives each drive device to return each member to the initial position, and then the same process as above is repeated.

According to the above embodiment, since the liquid LQ is recovered from the hydrophilic part 12F in the support surface 12A, the hydrophilic part 12F until the chip CP is supported by the support surface 12A. ), there is no need to wait for the liquid LQ to evaporate, so that the processing capacity per unit time can be prevented from being lowered.

As mentioned above, although the best structure, method, etc. for implementing this invention are disclosed by the said description, this invention is not limited to this. That is, the present invention is mainly shown and described in particular with respect to specific embodiments, but without departing from the scope of the technical spirit and object of the present invention, the shape, material, quantity, and other information of the above-described embodiment In the detailed configuration, various modifications can be made by those skilled in the art. In addition, the descriptions in which the shape, material, etc. disclosed above are limited are exemplarily described in order to facilitate the understanding of the present invention, and do not limit the present invention. Or description in the name of the member excluding all limitations is included in this invention.

For example, the support means 10 may adsorb and hold the chips CP on the support surface 12A by a pressure reducing means independent from the liquid recovery means 30 , or the chips on the support surface 12A after the liquid recovery step. (CP) does not need to be adsorbed and held.

The hydrophobic portion 12E may be formed by affixing a hydrophobic sheet, film, tape, or the like to the supporting surface 12A, or applying a hydrophobic surface treatment or coating to the supporting surface 12A.

The hydrophilic portion 12F may be configured by affixing a sheet, film, tape, or the like having hydrophilicity to the support surface 12A, or applying a surface treatment or coating to exhibit hydrophilicity to the support surface 12A.

The liquid supply means 20 may supply the liquid LQ onto the support surface 12A from the outside of the table 12 with a nozzle, a hose, or the like, and the liquid recovered from the hydrophilic unit 12F in the liquid recovery step ( LQ) may be configured not to be re-supplied to the hydrophilic part 12F.

The liquid recovery means 30 may be formed separately from the liquid supply means 20, and in this case, the flow passage 12C of the table 12 is shared with the liquid supply means 20, and the liquid is discharged from the flow passage 12C. (LQ) may be collect|recovered, and the flow path for collection|recovery different from the flow path 12C may be provided in the table 12, and the liquid LQ may be collect|recovered from the said flow path for recovery.

The separation means 40 applies tension to the adhesive sheet AS in the vertical direction, for example, or in four directions of right, left, front and rear, two directions of right and left, front left, rear left and Tension may be applied in three or more right and left directions or in five or more directions including components in the forward, backward, left and right directions to widen the distance between the chips CP, and the chip CP may be integrated with the chip CP through the adhesive sheet AS. When a frame member such as a ring frame is used, by supporting the frame member and applying tension to the adhesive sheet AS, the mutual spacing between the chips CP may be widened, and the laser irradiation device, chemical solution applying device, etc. are weakened A semiconductor wafer (hereinafter simply referred to as a “wafer”) in a state capable of being divided into a plurality of chips CP by means of a weak layer physically or chemically formed by means or a concave groove or notch formed by a cutting means such as a cutter blade. ) by applying tension to the adhesive sheet AS affixed thereto, the wafer may be divided into a plurality of chips CP and the mutual spacing between the chips CP may be widened.

The separation means 40 may or may not be provided in the positioning device EA of the present invention. may be widened.

The peeling means 50 may or may not be provided with the positioning device EA of this invention, and when the peeling means 50 is not provided, it peels the adhesive sheet AS with another apparatus. Alternatively, the adhesive sheet AS is cut along the gaps between the plurality of chips CP by gas injection by a cutting means such as a cutting blade or gas injection means such as a nozzle, and the cut adhesive sheet AS It is good also as a state affixed to the provisional chip CP.

The positioning device EA may be provided with a affixing means for affixing the adhesive sheet AS to the chip CP or the wafer with a pressing member such as a pressing roller, and cut the wafer into pieces into a plurality of chips CP A cutting means such as a laser irradiation device or a cutting blade may be provided, or an integration means for integrating the chip CP or wafer and the frame member through an adhesive sheet AS may be provided, and the adhesive sheet AS ), the plurality of chips CP not affixed to the surface may be transported by a transport means (not shown) and placed on the hydrophilic portion 12F of the support surface 12A.

The liquid LQ used in the positioning device EA will not be particularly limited as long as it has a constant surface tension, and for example, an alcohol solution containing ethanol, propanol, glycerin, or the like may be used.

In the said embodiment, although positioning of the some chip|tip CP was illustrated as a flake body, one chip CP may be sufficient as a flake body.

Either of the support step and the liquid supply step may be performed first, the liquid supply step may be performed after the support step is performed, or the support step may be performed after the liquid supply step is performed. In the case of carrying out the supporting process after performing the liquid supply process, the chips CP are peeled from the adhesive sheet AS while maintaining the mutual distance therebetween, and the peeled chips CP are subjected to the liquid supply process. You may make it transcribe|transfer and support to the support surface 12A later.

A lamination process and a collection|recovery process may be implemented, and it is not necessary to implement it.

A frame member other than a ring frame may be a thing which is not annular (the outer periphery is not connected), or a circular, elliptical, polygonal, or other shape may be sufficient as it.

The means and processes in the present invention are not limited at all as long as they can perform the operations, functions or processes described with respect to those means and processes, and furthermore, the structures and processes of a simple embodiment shown in the above embodiments are not at all involved. not limited For example, the support process may be any process as long as it supports the flakes in the hydrophilic part of the support surface on which a plurality of hydrophilic parts having hydrophilicity are formed, and it is not limited at all as long as it is within the technical scope at the time of filing in contrast to the technical common sense at the beginning of the application (Other means and processes are the same).

The material, type, shape, etc. of the adhesive sheet AS and the flakes are not particularly limited. For example, the adhesive sheet AS and the flakes may have a circular shape, an elliptical shape, a polygonal shape, or other shapes, and the adhesive sheet AS may have an adhesive form such as pressure-sensitive adhesive property or heat-sensitive adhesive property. In addition, such an adhesive sheet AS is, for example, a single layer of only the adhesive layer, an intermediate layer between the substrate and the adhesive layer, a cover layer on the upper surface of the substrate, etc. It may be a so-called double-sided adhesive sheet capable of peeling the base material from the adhesive layer, and the double-sided adhesive sheet may have a single or multi-layered intermediate layer, or may be a single-layer or multi-layered one without an intermediate layer. In addition, as the flaky body, for example, food, a resin container, a semiconductor chip such as a silicon semiconductor chip or a compound semiconductor chip, a circuit board, an information recording substrate such as an optical disk, a glass plate, a steel plate, ceramics, a wood plate or a resin It may be a single object, or a composite formed of two or more of them may be used, and members, articles, etc. of any shape can be used as objects. In addition, the adhesive sheet AS is, instead of a functional and usage analysis, for example, an information substrate label, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer formation resin sheet. Any sheet, film, tape, etc. may be sufficient.

The drive device in the above embodiment includes an electric device such as a rotary motor, a linear motor, a linear motor, a single-axis robot, a multi-joint robot having two or more joints, an air cylinder, a hydraulic cylinder, a rodless cylinder, and An actuator, such as a rotary cylinder, etc. can be employ|adopted, and what combined them directly or indirectly can also be employ|adopted.

In the above embodiment, when pressurizing means such as a pressure roller or a pressure head or pressurizing an object such as a pressure member is employed, instead of or in combination with those exemplified above, a roller, a round bar, a blade material, A member such as rubber, resin, or sponge may be employed, or a configuration may be employed for pressurization by injection of gas such as air or gas, and the pressurization may be composed of a deformable member such as rubber or resin, or a member that does not deform In the case where supporting (holding) a support member (member to be held) such as a support (holding) means or a support (holding) member is employed, a gripping means such as a mechanical chuck or a chuck cylinder, the Coulomb force , Adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, a structure in which the supported member is supported (holding) with a driving device, etc. may be adopted, cutting means or cutting When cutting a member to be cut, such as a member, or forming a cut or cut line in a member to be cut is employed, a cutter blade, laser cutter, ion beam, thermal power, or heat , cutting by water pressure, a heating wire, spraying of gas or liquid, etc. may be employed, or by combining an appropriate driving device, the cutting may be moved and cut.

Claims (4)

A positioning method for positioning a flake body at a predetermined position using the surface tension of a liquid, comprising:
A supporting step of supporting the flaky body in the hydrophilic part of the support surface on which the hydrophilic part having hydrophilicity is formed;
a liquid supply process of supplying a liquid to the hydrophilic part;
and performing a liquid recovery step of recovering the liquid from the hydrophilic part. The method of claim 1,
In the liquid supply step, the liquid is supplied to the hydrophilic part through a flow path formed inside the support member having the support surface. 3. The method according to claim 1 or 2,
In the liquid supply step, the liquid recovered from the hydrophilic section in the liquid recovery step is re-supplied to the hydrophilic section. A positioning device for positioning a flake body at a predetermined position using the surface tension of a liquid, comprising:
Supporting means for supporting the flat body in the hydrophilic part of the support surface having a hydrophilic part formed with hydrophilicity;
a liquid supply means for supplying a liquid to the hydrophilic part;
and liquid recovery means for recovering the liquid from the hydrophilic part.

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