CN113396309A - 均温板及其制造方法 - Google Patents
均温板及其制造方法 Download PDFInfo
- Publication number
- CN113396309A CN113396309A CN201980033524.1A CN201980033524A CN113396309A CN 113396309 A CN113396309 A CN 113396309A CN 201980033524 A CN201980033524 A CN 201980033524A CN 113396309 A CN113396309 A CN 113396309A
- Authority
- CN
- China
- Prior art keywords
- copper
- copper foil
- main body
- foil layer
- body part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 101
- 239000011889 copper foil Substances 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 61
- 239000000543 intermediate Substances 0.000 claims abstract description 38
- 239000012530 fluid Substances 0.000 claims abstract description 35
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 23
- 238000009713 electroplating Methods 0.000 claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 238000003860 storage Methods 0.000 description 14
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本申请提出一种均温板的制造方法,包括:提供一具有铜箔层的覆铜基板,压合一光阻层,曝光,显影以形成一外侧开口及多个内侧开口;在多个内侧开口进行电镀形成多个导热凸块,在外侧开口进行电镀形成一连接凸块,所述连接凸块包围多个所述导热凸块,移除光阻层以获得一个中间体;将两个中间体层叠,使得其中一中间体的连接凸块与另一中间体的连接凸块对应,然后焊接两个相对应的连接凸块以在两个中间体之间产生封闭腔室,抽真空,向封闭腔室注入工作流体,即得到所述均温板。本发明提供通过电镀的方式在铜箔层上形成导电凸块可以明显增强铜箔层与导电凸块之间的导热效率,降低热阻。本申请还提供一种均温板。
Description
PCT国内申请,说明书已公开。
Claims (10)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2019/120971 WO2021102686A1 (zh) | 2019-11-26 | 2019-11-26 | 均温板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN113396309A true CN113396309A (zh) | 2021-09-14 |
CN113396309B CN113396309B (zh) | 2023-08-18 |
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CN201980033524.1A Active CN113396309B (zh) | 2019-11-26 | 2019-11-26 | 均温板及其制造方法 |
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US (2) | US11672100B2 (zh) |
CN (1) | CN113396309B (zh) |
WO (1) | WO2021102686A1 (zh) |
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CN113464871B (zh) * | 2021-06-30 | 2023-08-15 | 江西新菲新材料有限公司 | 灯膜及其制备方法、电子设备 |
WO2024041095A1 (zh) * | 2022-08-22 | 2024-02-29 | 深圳市电通材料技术有限公司 | 具有微结构腔室的封装基板及其制备方法 |
Citations (7)
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US20040190252A1 (en) * | 2003-03-31 | 2004-09-30 | Ravi Prasher | Micro-channel heat exchangers and spreaders |
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US20070263356A1 (en) * | 2006-05-02 | 2007-11-15 | Raytheon Company | Method and Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure |
CN104754926A (zh) * | 2015-04-14 | 2015-07-01 | 厦门烯成科技有限公司 | 一种导热薄片及其底板的制作方法 |
CN105758240A (zh) * | 2014-12-19 | 2016-07-13 | 富葵精密组件(深圳)有限公司 | 均温板及其制作方法 |
CN107809880A (zh) * | 2017-06-13 | 2018-03-16 | 奇鋐科技股份有限公司 | 散热单元的制造方法 |
CN208047152U (zh) * | 2018-05-07 | 2018-11-02 | 广东智科精创科技股份有限公司 | 一种均温散热器 |
Family Cites Families (11)
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US4878990A (en) * | 1988-05-23 | 1989-11-07 | General Dynamics Corp., Pomona Division | Electroformed and chemical milled bumped tape process |
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US11672100B2 (en) | 2023-06-06 |
US20230240045A1 (en) | 2023-07-27 |
US20210161028A1 (en) | 2021-05-27 |
WO2021102686A1 (zh) | 2021-06-03 |
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