WO2024087201A1 - 电路板组件及其制造方法、封装结构 - Google Patents

电路板组件及其制造方法、封装结构 Download PDF

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Publication number
WO2024087201A1
WO2024087201A1 PCT/CN2022/128372 CN2022128372W WO2024087201A1 WO 2024087201 A1 WO2024087201 A1 WO 2024087201A1 CN 2022128372 W CN2022128372 W CN 2022128372W WO 2024087201 A1 WO2024087201 A1 WO 2024087201A1
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WO
WIPO (PCT)
Prior art keywords
conductive column
layer
hollow conductive
hollow
heating element
Prior art date
Application number
PCT/CN2022/128372
Other languages
English (en)
French (fr)
Inventor
祝长赫
李洋
王建
刘立坤
李艳禄
Original Assignee
宏启胜精密电子(秦皇岛)有限公司
鹏鼎控股(深圳)股份有限公司
鹏鼎科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏启胜精密电子(秦皇岛)有限公司, 鹏鼎控股(深圳)股份有限公司, 鹏鼎科技股份有限公司 filed Critical 宏启胜精密电子(秦皇岛)有限公司
Priority to PCT/CN2022/128372 priority Critical patent/WO2024087201A1/zh
Priority to US18/385,707 priority patent/US20240147629A1/en
Publication of WO2024087201A1 publication Critical patent/WO2024087201A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Definitions

  • the present application relates to heat dissipation and packaging of a circuit board, and more particularly to a circuit board assembly and a manufacturing method and packaging structure thereof.
  • packaging substrates mostly use copper pillar interconnection to achieve electrical connection, which is not only conducive to the miniaturization of the packaging structure, but also helps to reduce the distance between pads and increase the setting density of various components and circuits.
  • a method for manufacturing a circuit board assembly comprising the steps of:
  • a packaging substrate comprising a base material layer, a circuit layer, and a hollow conductive column, the circuit layer is disposed on the base material layer, and one end of the hollow conductive column is disposed on the circuit layer;
  • a heating element is arranged in the hollow conductive column, and the heating element is electrically connected to the circuit layer;
  • a conductive cover is disposed at the other end of the hollow conductive column, and the conductive cover seals the hollow conductive column to obtain the circuit board assembly.
  • the method for manufacturing the packaging substrate comprises the steps of:
  • a copper-clad substrate comprises the substrate layer and a copper foil layer disposed on the substrate layer;
  • the copper foil layer is etched to form the circuit layer, thereby obtaining the packaging substrate.
  • the method for manufacturing the packaging substrate comprises the steps of:
  • a copper-clad substrate comprises the substrate layer and a copper foil layer disposed on the substrate layer;
  • the solid conductive column is hollowed out to form the hollow conductive column, thereby obtaining the packaging substrate.
  • the step of “arranging a conductive cover at the other end of the hollow conductive column” includes:
  • the conductive cover is formed by electroplating the conductive film.
  • the method further comprises the steps of:
  • a protective layer is provided on the adhesive layer.
  • a circuit board assembly comprising:
  • a packaging substrate comprising a base material layer, a circuit layer, and a hollow conductive column, the circuit layer is arranged on the base material layer, and one end of the hollow conductive column is arranged on the circuit layer;
  • a heating element the heating element is disposed in the hollow conductive column, and the heating element is electrically connected to the circuit layer;
  • a heat-conducting medium fills the hollow conductive column, and the heat-conducting medium immerses the heating element;
  • a conductive cover is disposed at the other end of the hollow conductive column, and the conductive cover seals the hollow conductive column.
  • the circuit layer includes a plurality of conductive pads, the conductive pads are exposed at the bottom of the hollow conductive column, the heating element includes an element body and element pins, and the element pins are connected to the conductive pads.
  • the conductive cover includes a first part and a second part, the first part is inserted into the hollow conductive column, the second part protrudes from the hollow conductive column, and the height of the second part is not less than 10 microns.
  • the circuit board assembly also includes a conductor, which is disposed on the packaging substrate, one end of the conductor is connected to the conductive pad, and the other end is exposed from the base material layer.
  • a packaging structure comprising:
  • a packaging cover plate comprising an insulator and an inner circuit layer disposed in the insulator, the packaging cover plate being provided with a groove, and a portion of the inner circuit layer being exposed at the bottom of the groove;
  • a circuit board assembly comprising a packaging substrate, a heating element, a heat-conducting medium, and a conductive cover
  • the packaging substrate comprising a base material layer, a circuit layer, and a hollow conductive column
  • the circuit layer is arranged on the base material layer
  • one end of the hollow conductive column is arranged on the circuit layer
  • the heating element is arranged in the hollow conductive column
  • the heating element is electrically connected to the circuit layer
  • the heat-conducting medium fills the hollow conductive column
  • the heat-conducting medium immerses the heating element
  • the conductive cover is arranged on the other end of the hollow conductive column, and the conductive cover closes the hollow conductive column;
  • the packaging substrate is arranged corresponding to the insulator, a part of the hollow conductive column is accommodated in the slot, and the conductive cover is electrically connected to the inner circuit layer.
  • the manufacturing method of the circuit board assembly has the following advantages: (a) By arranging a conductive cover on the hollow conductive column, the conductive cover can not only seal the heat-conducting medium in the hollow conductive column, but also serve as an electrical connection pad to connect other circuit boards, which is beneficial to improving the space utilization inside the circuit board assembly and increasing the setting density of the heating element and the conductor (first conductor, second conductor). (b) By filling the hollow conductive column with a heat-conducting medium, the heat-conducting medium can immerse the heating element, thereby improving the heat dissipation efficiency of the heating element and reducing the risk of rapid temperature increase due to heat accumulation.
  • An electromagnetic shielding cover is formed by the conductive cover, the hollow conductive column, and the first circuit layer.
  • the heating element is arranged in the electromagnetic shielding cover, thereby achieving electromagnetic shielding of the heating element in the electromagnetic shielding cover, reducing magnetic interference between adjacent heating elements, and thereby improving the quality of signal transmission.
  • FIG. 1 is a schematic cross-sectional view of a copper clad substrate provided in one embodiment of the present application.
  • FIG. 2 is a cross-sectional schematic diagram of the copper-clad substrate shown in FIG. 1 after solid conductive columns are provided.
  • FIG. 3 is a schematic cross-sectional view of the first copper foil layer and the second copper foil layer shown in FIG. 2 after etching.
  • FIG. 4 is a schematic cross-sectional view of the solid conductive column shown in FIG. 3 after being hollowed out.
  • FIG. 5 is a schematic cross-sectional view of the hollow conductive column shown in FIG. 4 after a heating element is arranged in the column.
  • FIG. 6 is a schematic cross-sectional view of the hollow conductive column shown in FIG. 5 after being filled with a heat-conducting medium.
  • FIG. 7 is a schematic cross-sectional view of a hollow conductive column shown in FIG. 6 after a conductive cover is provided at the end thereof.
  • FIG8 is a cross-sectional schematic diagram of another embodiment of the present application showing a hollow conductive column with a conductive cover disposed at the end thereof.
  • FIG. 9 is a cross-sectional schematic diagram of a circuit board assembly provided in accordance with an embodiment of the present application.
  • FIG. 10 is a schematic cross-sectional view of a packaging cover provided in an embodiment of the present application.
  • FIG. 11 is a cross-sectional schematic diagram of a packaging structure provided in an embodiment of the present application.
  • Second protective layer 192 Second protective layer 192
  • a component when considered to be “disposed on” another component, it may be directly disposed on the other component or there may be a centered component at the same time.
  • An embodiment of the present application provides a method for manufacturing a circuit board assembly 100, comprising the steps of:
  • a copper clad substrate 10 is provided, and the copper clad substrate 10 is a double-sided copper clad substrate.
  • the copper clad substrate 10 includes a base material layer 11, a first copper foil layer 12, a second copper foil layer 13, a first conductor 14, and a second conductor 15.
  • the first copper foil layer 12 and the second copper foil layer 13 are respectively disposed on two opposite side surfaces of the substrate layer 11 .
  • the first conductive body 14 passes through the first copper foil layer 12 and the base material layer 11 .
  • the first conductive body 14 is substantially T-shaped. One end of the first conductive body 14 is connected to the second copper foil layer 13 , and the other end covers a portion of the first copper foil layer 12 .
  • the second conductive body 15 passes through the second copper foil layer 13 and the base material layer 11 .
  • the second conductive body 15 is substantially cylindrical. One end of the second conductive body 15 is connected to the first copper foil layer 12 , and the other end covers a portion of the second copper foil layer 13 .
  • a solid conductive column 20 is provided on the first copper foil layer 12, and the solid conductive column 20 is provided corresponding to the second conductive body 15.
  • the solid conductive column 20 can be provided on the first copper foil layer 12 by welding, bonding, electroplating, chemical copper deposition, and other methods.
  • the shape of the solid conductive column 20 is cylindrical.
  • the solid conductive column 20 can also be a polygonal column, a truncated cone, and the like.
  • the solid conductive column 20 is hollowed out by etching to form a hollow conductive column 21, the hollow conductive column 21 has a receiving cavity 211, and the first copper foil layer 12 exposed at the bottom of the receiving cavity 211 is etched to form a plurality of connection pads 162, thereby obtaining a package substrate 22.
  • the plurality of first circuits 161 and the plurality of connection pads 162 constitute a first circuit layer 16, the connection pads 162 are connected to the second conductive body 15, the second conductive body 15 can be used for heat conduction or electrical conduction, and the hollow conductive column 21 has a cross-sectional width W2.
  • the hollow conductive column 21 can also be directly formed on the first circuit layer 16 by selective electroplating.
  • the process includes: firstly, providing a dry film (not shown) on the first circuit layer 16, then, exposing and developing the dry film to form a photosensitive pattern (not shown), wherein the photosensitive pattern forms an annular groove (not shown) at a predetermined position; and finally, electroplating the hollow conductive column 21 in the annular groove.
  • At least one heating element 30 is arranged in the accommodating cavity 211, the heating element 30 comprises a component body 31 and a component pin 32 connected to the component body 31, the component pin 32 is connected to the connection pad 162, and the overall height D1 of the heating element 30 is less than the depth H1 of the accommodating cavity 211. Specifically, the depth H1 is about 20 microns greater than the height D1.
  • the heating element 30 comprises a chip, and the component pin 32 can be connected to the connection pad 162 by welding.
  • a heat-conducting medium 33 is filled into the accommodating cavity 211, the heat-conducting medium 33 immerses the heating element 30, and part of the heat-conducting medium 33 is filled into the gaps between the plurality of connecting pads 162, the heat-conducting medium 33 is an insulating liquid substance with high specific heat capacity, such as fluorinated liquid, which needs to absorb more heat to increase by 1°C.
  • the filling amount of the heat-conducting medium 33 can ensure that the interface of the heat-conducting medium 33 is at least 10 microns higher than the end face of the heating element 30, thereby ensuring that the heating element 30 is completely wrapped by the heat-conducting medium 33, which is conducive to improving the heat dissipation effect.
  • a conductive cover 40 is provided at the other end of the hollow conductive column 21, and the conductive cover 40 closes the accommodating cavity 211.
  • the conductive cover 40 includes a first portion 41 and a second portion 42 connected to the first portion 41.
  • the first portion 41 is inserted into the accommodating cavity 211, thereby blocking the heat-conducting medium 33 and preventing the heat-conducting medium 33 from flowing out.
  • the second portion 42 protrudes from the accommodating cavity 211 and is provided on the outside of the hollow conductive column 21.
  • the second portion 42 is used to electrically connect other components, and the thickness D2 of the second portion 42 is at least 10 microns, thereby ensuring good electrical connection performance.
  • the conductive cover 40 , the hollow conductive column 21 , and a portion of the first circuit layer 16 together form an electromagnetic shielding cover 50 , thereby achieving electromagnetic shielding of the heating element 30 in the electromagnetic shielding cover 50 .
  • the conductive cover 40 is solder paste, and the conductive cover 40 is formed on the other end of the hollow conductive column 21 by printing.
  • the conductive cover 40 can also be a conductive metal such as copper or tin, and the conductive cover 40 can be formed on the other end of the hollow conductive column 21 by electroplating or chemical deposition.
  • the conductive cover 40 is specifically provided as follows: first, a conductive film (not shown) is provided at the interface of the heat-conducting medium 33, and the conductive film is electrically connected to the inner wall of the hollow conductive column 21; then, the conductive cover 40 is formed by electroplating on the conductive film.
  • the manufacturing method of the circuit board assembly 100 further includes the steps of:
  • a first protective film 18 is provided on the first circuit layer 16, and a second protective film 19 is provided on the second circuit layer 17 to obtain the circuit board assembly 100.
  • Both the first protective film 18 and the second protective film 19 can play the role of insulation protection.
  • the first protective film 18 includes a first adhesive layer 181 and a first protective layer 182, and the first adhesive layer 181 is provided between the first protective layer 182 and the first circuit layer 16.
  • the second protective film 19 includes a second adhesive layer 191 and a second protective layer 192, and the second adhesive layer 191 is provided between the second protective layer 192 and the second circuit layer 17. It can be understood that in other embodiments of the present application, the first protective layer 181 and/or the second protective layer 191 may not be provided.
  • the manufacturing method of the circuit board assembly 100 provided in the present application has the following advantages:
  • the conductive cover 40 can not only seal the heat-conducting medium 33 in the hollow conductive column 21, but also serve as an electrical connection pad to connect other circuit boards, which is beneficial to improving the space utilization inside the circuit board assembly 100 and increasing the setting density of the heating element 30 and the conductor (the first conductor 14, the second conductor 15).
  • the heat-conducting medium 33 can immerse the heating element 30, thereby improving the heat dissipation efficiency of the heating element 30 and reducing the risk of rapid temperature increase due to heat accumulation.
  • An embodiment of the present application further provides a circuit board assembly 100, the circuit board assembly 100 includes a packaging substrate 22, a heating element 30, a heat-conducting medium 33, and a conductive cover 40.
  • the packaging substrate includes a base material layer 11, a circuit layer (a first circuit layer 16, a second circuit layer 17), and a hollow conductive column 21.
  • the first circuit layer 16 is disposed on the base material layer 11, and one end of the hollow conductive column 21 is disposed on the first circuit layer 16.
  • the heating element 30 is disposed in the hollow conductive column 21, and the heating element 30 is electrically connected to the first circuit layer 16.
  • the heat-conducting medium 33 fills the hollow conductive column 21, and the heat-conducting medium 33 immerses the heating element 30.
  • the conductive cover 40 is disposed at the other end of the hollow conductive column 21, and the conductive cover 40 closes the hollow conductive column 21.
  • the circuit board assembly 100 further includes a first protective film 18 , which is disposed on the first circuit layer 16 .
  • a window 183 is formed through the first protective film 18 , and the hollow conductive column 21 can pass through the window 183 .
  • the embodiment of the present application also provides a method for manufacturing a packaging structure 200, which specifically includes the following steps:
  • a package cover plate 60 is provided, the package cover plate 60 comprises an insulator 61 and a plurality of inner circuit layers 62, wherein the plurality of inner circuit layers 62 are arranged at intervals in the insulator 61.
  • the package cover plate 60 is provided with a slot 63, a portion of the inner circuit layer 62 is exposed at the bottom of the slot 63, and the slot 63 has a cross-sectional width W1.
  • step S10 the cross-sectional width W1 of the slot 63 is greater than the cross-sectional width W2 of the hollow conductive column 21, so that a gap S is formed between the inner wall of the slot 63 and the outer wall of the hollow conductive column 21, and the width of the gap S is greater than 50 microns.
  • part of the insulator 61 is filled in the gap S, thereby strengthening the bonding force between the package cover plate 60 and the circuit board assembly 100.
  • the present embodiment further provides a packaging structure 200, which includes the packaging cover plate 60 and the circuit board assembly 100.
  • the packaging cover plate 60 includes an insulator 61 and an inner circuit layer 62 disposed in the insulator 61.
  • the packaging cover plate 60 is provided with a slot 63, and a portion of the inner circuit layer 62 is exposed at the bottom of the slot 63.
  • the circuit board assembly 100 includes a packaging substrate 22, a heating element 30, a heat-conducting medium 33, and a conductive cover 40.
  • the packaging substrate 22 includes a base material layer 11, a first circuit layer 16, and a hollow conductive column 21.
  • the first circuit layer 16 is disposed on the side of the base material layer 11, one end of the hollow conductive column 21 is disposed on the first circuit layer 16, the heating element 30 is disposed in the hollow conductive column 21, the heating element 30 is electrically connected to the first circuit layer 16, the heat-conducting medium 33 fills the hollow conductive column 21, and the heat-conducting medium 33 immerses the heating element 30.
  • the conductive cover 40 is disposed at the other end of the hollow conductive column 21, and the conductive cover 40 closes the hollow conductive column 21.
  • the packaging substrate 22 is disposed corresponding to the insulator 61, a portion of the hollow conductive column 21 is accommodated in the slot 63, and the conductive cover 40 is electrically connected to the inner circuit layer 62.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

提供了一种电路板组件（100）的制造方法，包括步骤：提供一封装基板（22），封装基板（22）包括基材层（11）、线路层、以及中空导电柱（21），线路层设置于基材层（11），中空导电柱（21）的一端设置于线路层。于中空导电柱（21）内设置发热元件（30），发热元件（30）电性连接线路层。于中空导电柱（21）内填入导热介质（33），导热介质（33）浸没发热元件（30）。于中空导电柱（21）的另一端设置导电盖体（40），导电盖体（40）封闭中空导电柱（21），获得电路板组件（100）。另外，还提供一种封装结构（200）。

Description

电路板组件及其制造方法、封装结构 技术领域
本申请涉及一种电路板的散热和封装，尤其涉及一种电路板组件及其制造方法、封装结构。
背景技术
在封装领域中，封装基板多采用铜柱互连的方式实现电性连接，该连接方式不仅有利于封装结构的小型化，而且还有利于减少焊盘间的距离并提高各类元件和线路的设置密度。
然而，由于各类元件设置的越来越紧凑，其产生的大量废热难以快速散发，导致温度快速升高，不但会影响各类元件的工作效率和质量，而且还可能发生爆炸；同时，由于各类元件设置的越来越紧凑，导致相邻元件之间存在电磁干扰的风险大大增加，进而影响信号传输的质量。
发明内容
有鉴于此，有必要提供一种电路板组件，提高散热效率并改善电磁屏蔽。
另外，还有必要提供一种电路板组件的制造方法。
另外，还有必要提供一种电路板组件。
一种电路板组件的制造方法，包括步骤：
提供一封装基板，所述封装基板包括基材层、线路层、以及中空导电柱，所述线路层设置于所述基材层，所述中空导电柱的一端设置于所述线路层；
于所述中空导电柱内设置发热元件，所述发热元件电性连接所述线路 层；
于所述中空导电柱内填入导热介质，所述导热介质浸没所述发热元件；
于所述中空导电柱的另一端设置导电盖体，所述导电盖体封闭所述中空导电柱，获得所述电路板组件。
进一步地，所述封装基板的制造方法包括步骤：
提供一覆铜基板，所述覆铜基板包括所述基材层及设置于所述基材层的铜箔层；
于所述铜箔层电镀形成所述中空导电柱；以及
蚀刻所述铜箔层以形成所述线路层，获得所述封装基板。
进一步地，所述封装基板的制造方法包括步骤：
提供一覆铜基板，所述覆铜基板包括所述基材层及设置于所述基材层的铜箔层；
于所述铜箔层电镀形成实心导电柱；
蚀刻所述铜箔层以形成所述线路层；以及
掏空所述实心导电柱以形成所述中空导电柱，获得所述封装基板。
进一步地，步骤“于所述中空导电柱的另一端设置导电盖体”包括：
于所述导热介质的界面设置导电薄膜，所述导电薄膜电性连接所述中空导电柱的内壁；以及
于所述导电薄膜电镀形成所述导电盖体。
进一步地，还包括步骤：
于所述线路层设置粘接层；以及
于所述粘接层设置保护层。
一种电路板组件，包括：
封装基板，所述封装基板包括基材层、线路层、以及中空导电柱，所述线路层设置于所述基材层，所述中空导电柱的一端设置于所述线路层；
发热元件，所述发热元件设置于所述中空导电柱内，所述发热元件电性 连接所述线路层；
导热介质，所述导热介质填充所述中空导电柱，所述导热介质浸没所述发热元件；以及
导电盖体，所述导电盖体设置于所述中空导电柱的另一端，所述导电盖体封闭所述中空导电柱。
进一步地，所述线路层包括多个导电垫，所述导电垫于所述中空导电柱的底部露出，所述发热元件包括元件本体及元件引脚，所述元件引脚连接所述导电垫。
进一步地，所述导电盖体包括第一部分和第二部分，所述第一部分插入所述中空导电柱，所述第二部分凸出所述中空导电柱，所述第二部分的高度不小于10微米。
进一步地，所述电路板组件还包括导通体，所述导通体设置于所述封装基板，所述导通体一端连接所述导电垫，另一端露出于所述基材层。
一种封装结构，包括：
封装盖板，所述封装盖板包括绝缘体及设置于所述绝缘体内的内侧线路层，所述封装盖板设有开槽，部分所述内侧线路层于所述开槽的底部露出；
电路板组件，所述电路板组件包括封装基板、发热元件、导热介质、以及导电盖体，所述封装基板包括基材层、线路层、以及中空导电柱，所述线路层设置于所述基材层，所述中空导电柱的一端设置于所述线路层，所述发热元件设置于所述中空导电柱内，所述发热元件电性连接所述线路层，所述导热介质填充所述中空导电柱，所述导热介质浸没所述发热元件，所述导电盖体设置于所述中空导电柱的另一端，所述导电盖体封闭所述中空导电柱；
所述封装基板对应所述绝缘体设置，部分所述中空导电柱容置于所述开槽，所述导电盖体电性连接所述内侧线路层。
相比于现有技术，本申请提供的电路板组件的制造方法具有以下优点：(一)通过在中空导电柱上设置导电盖体，该导电盖体既可以封塞中空导电 柱内的导热介质，还可以作为电连接垫连接其他电路板，有利于提高电路板组件内部的空间利用率，提高发热元件及导通体(第一导通体、第二导通体)的设置密度。(二)通过在中空导电柱内填入导热介质，该导热介质可以浸没发热元件，从而提高发热元件的散热效率，减少因热量聚集而导致的温度快速升高的风险。(三)通过导电盖体、所述中空导电柱、以及所述第一线路层共同形成电磁屏蔽罩，该发热元件设于所述电磁屏蔽罩内，从而实现对电磁屏蔽罩内的发热元件的电磁屏蔽，减少相邻发热元件之间的磁干扰，进而提高信号传输的质量。
附图说明
图1为本申请一实施例提供的覆铜基板的截面示意图。
图2为图1所示的覆铜基板设置实心导电柱后的截面示意图。
图3为蚀刻图2所示的第一铜箔层和第二铜箔层后的截面示意图。
图4为掏空图3所示的实心导电柱后的截面示意图。
图5为图4所示的中空导电柱内设置发热元件后的截面示意图。
图6为图5所示的中空导电柱内填充导热介质后的截面示意图。
图7为图6所示的中空导电柱的端部设置导电盖体后的截面示意图。
图8为本申请另一实施例提供的中空导电柱的端部设置导电盖体后的截面示意图。
图9为本申请一实施例提供的电路板组件的截面示意图。
图10为本申请一实施例提供的封装盖板的截面示意图。
图11为本申请一实施例提供的封装结构的截面示意图。
主要元件符号说明
电路板组件         100
覆铜基板           10
基材层             11
第一铜箔层         12
第二铜箔层         13
第一导通体         14
第二导通体         15
第一线路层         16
第一线路           161
连接垫             162
第二线路层         17
第二保护膜         19
第二粘接层         191
第二保护层         192
第一保护膜         18
第一粘接层         181
第一保护层         182
开窗               183
实心导电柱         20
中空导电柱         21
封装基板           22
容置腔             211
发热元件           30
元件本体           31
元件引脚           32
导热介质           33
导电盖体           40
第一部分           41
第二部分           42
电磁屏蔽罩         50
封装盖板           60
绝缘体             61
内侧线路层         62
开槽               63
封装结构           200
高度               D1
深度               H1
厚度               D2
截面宽度           W1、W2
间隙               S
如下具体实施方式将结合上述附图进一步说明本申请。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
需要说明的是，当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。
本申请一实施例提供一种电路板组件100的制造方法，包括步骤：
S1:请参见图1，提供一覆铜基板10，所述覆铜基板10为双面覆铜基板，所述覆铜基板10包括基材层11、第一铜箔层12、第二铜箔层13、第一导通体14、以及第二导通体15。
所述第一铜箔层12与所述第二铜箔层13分别设置于所述基材层11的相对两侧面。
所述第一导通体14穿过所述第一铜箔层12和所述基材层11，所述第一导通体14大致呈“T”形，所述第一导通体14的一端连接所述第二铜箔层13，另一端覆盖部分所述第一铜箔层12。
所述第二导通体15穿过所述第二铜箔层13和所述基材层11，所述第二导通体15大致呈圆柱体状，所述第二导通体15的一端连接所述第一铜箔层12，另一端覆盖部分所述第二铜箔层13。
S2:请参见图2，于所述第一铜箔层12设置实心导电柱20，所述实心导电柱20对应所述第二导通体15设置。其中，所述实心导电柱20可以通过焊接、粘接、电镀、化学沉铜等多种方式设置于所述第一铜箔层12。在本实施例中，所述实心导电柱20的形状为圆柱形，在申请的其他实施例中，所述实心导电柱20也可以是多棱柱形、圆台形等。
S3:请参见图3，蚀刻未被实心导电柱20覆盖的部分所述第一铜箔层12以形成多个第一线路161，以及蚀刻所述第二铜箔层13以形成第二线路层17。
S4:请参见图4，通过蚀刻的方式掏空所述实心导电柱20以形成中空导电柱21，所述中空导电柱21具有容置腔211，同时蚀刻于所述容置腔211底部露出的另外部分的所述第一铜箔层12以形成多个连接垫162，获得封装基板22。其中，多个所述第一线路161和多个所述连接垫162构成第一线路层16，所述连接垫162连接所述第二导通体15，所述第二导通体15可以用于导热或者导电，所述中空导电柱21具有截面宽度W2。
在本申请的另一实施例中，所述中空导电柱21也可以通过选择性电镀的方式直接形成于所述第一线路层16。具体包括：首先，于所述第一线路层16设置干膜(未标示)，然后，曝光显影所述干膜以形成感光图样(未标示)，所述感光图样于预定位置形成有环形凹槽(未标示)；最后，于所述环形凹槽内电镀形成所述中空导电柱21。
S5:请参见图5，于所述容置腔211内设置至少一个发热元件30，所述 发热元件30包括元件本体31及连接所述元件本体31的元件引脚32，所述元件引脚32连接所述连接垫162，所述发热元件30的整体高度D1小于所述容置腔211的深度H1。具体地，所述深度H1比所述高度D1大约20微米。所述发热元件30包括芯片，所述元件引脚32可以通过焊接的方式连接所述连接垫162。
S6:请参见图6，于所述容置腔211内填入导热介质33，所述导热介质33浸没所述发热元件30，且部分所述导热介质33填入多个所述连接垫162之间的间隙中，所述导热介质33为高比热容的绝缘液态物质，例如氟化液，该氟化液需要吸收较多的热量以升高1℃。具体地，所述导热介质33填入量可以保证所述导热介质33的界面高出所述发热元件30的端面至少为10微米，从而保证发热元件30完全被导热介质33所包裹，有利于提高散热效果。
S7:请参见图7，于所述中空导电柱21的另一端设置导电盖体40，所述导电盖体40封闭所述容置腔211。具体地，所述导电盖体40包括第一部分41与连接所述第一部分41的第二部分42。所述第一部分41插入所述容置腔211内，从而堵塞所述导热介质33，防止所述导热介质33流出。所述第二部分42凸出于所述容置腔211并设置于所述中空导电柱21之外侧，所述第二部分42用于电性连接其他部件，所述第二部分42的厚度D2至少为10微米，从而保证良好的电连接性能。
在本实施例中，所述导电盖体40、所述中空导电柱21、以及部分所述第一线路层16共同形成电磁屏蔽罩50，从而实现对电磁屏蔽罩50内的发热元件30的电磁屏蔽。
在本实施例中，所述导电盖体40为锡膏，所述导电盖体40通过印刷的方式形成于所述中空导电柱21的另一端。在本申请的另一实施例中，请参见图8，所述导电盖体40也可以为铜、锡等导电金属，所述导电盖体40可以通过电镀、化学沉积的方式形成于所述中空导电柱21的另一端。设置所 述导电盖体40具体包括：首先，于所述导热介质33的界面设置导电薄膜(未标示)，所述导电薄膜电性连接所述中空导电柱21的内壁；然后，于所述导电薄膜电镀形成所述导电盖体40。
在本实施例中，所述电路板组件100的制造方法还包括步骤：
S8:请参见图9，于所述第一线路层16设置第一保护膜18，以及于所述第二线路层17设置第二保护膜19，获得所述电路板组件100。所述第一保护膜18及所述第二保护膜19均可以起到绝缘保护的作用。其中，所述第一保护膜18包括第一粘接层181和第一保护层182，所述第一粘接层181设置于所述第一保护层182和所述第一线路层16之间。所述第二保护膜19包括第二粘接层191和第二保护层192，所述第二粘接层191设置于所述第二保护层192和所述第二线路层17之间。可以理解的，在本申请的其他实施例中，所述第一保护层181和/或所述第二保护层191也可以不用设置。
相比于现有技术，本申请提供的电路板组件100的制造方法具有以下优点：
(一)通过在中空导电柱21上设置导电盖体40，该导电盖体40既可以封塞中空导电柱21内的导热介质33，还可以作为电连接垫连接其他电路板，有利于提高电路板组件100内部的空间利用率，提高发热元件30及导通体(第一导通体14、第二导通体15)的设置密度。
(二)通过在中空导电柱21内填入导热介质33，该导热介质33可以浸没发热元件30，从而提高发热元件30的散热效率，减少因热量聚集而导致的温度快速升高的风险。
(三)通过设置所述导电盖体40、所述中空导电柱21、以及所述第一线路层16，且所述导电盖体40、所述中空导电柱21、以及所述第一线路层16相互电性连接，从而围成形成电磁屏蔽罩50，该发热元件30设于所述电磁屏蔽罩50内，从而实现对电磁屏蔽罩50内的发热元件30的电磁屏蔽，减少相邻的所述发热元件30之间的磁干扰，进而提高信号传输的质量。
本申请一实施例还提供一种电路板组件100，所述电路板组件100包括封装基板22、发热元件30、导热介质33、以及导电盖体40。所述封装基板包括基材层11、线路层(第一线路层16、第二线路层17)、以及中空导电柱21。所述第一线路层16设置于所述基材层11，所述中空导电柱21的一端设置于所述第一线路层16。所述发热元件30设置于所述中空导电柱21内，所述发热元件30电性连接所述第一线路层16。所述导热介质33填充所述中空导电柱21，所述导热介质33浸没所述发热元件30。所述导电盖体40设置于所述中空导电柱21的另一端，所述导电盖体40封闭所述中空导电柱21。
在本实施例中，所述电路板组件100还包括第一保护膜18，所述第一保护膜18设置于所述第一线路层16，所述第一保护膜18贯穿设有开窗183，所述开窗183可以供所述中空导电柱21穿过。
本申请实施例还提供一种封装结构200的制造方法，具体包括步骤：
S9:请参见图10，提供一个封装盖板60，所述封装盖板60包括绝缘体61及多个内侧线路层62，多个所述内侧线路层62间隔设置于所述绝缘体61内。所述封装盖板60设有开槽63，部分所述内侧线路层62于所述开槽63的底部露出，所述开槽63具有截面宽度W1。
S10:请参见图11，将所述封装盖板60和所述电路板组件100进行压合，使得所述中空导电柱21进入所述开槽63内，且所述导电盖体40与所述内侧线路层62相连接，获得所述封装结构200。
在本实施例中，步骤S10中，所述开槽63的截面宽度W1大于中空导电柱21的截面宽度W2，使得所述开槽63的内壁与所述中空导电柱21的外壁之间形成有间隙S，所述间隙S的宽度大于50微米。步骤压合所述封装盖板60和所述电路板组件100的过程中，部分所述绝缘体61填入所述间隙S中，从而加强所述封装盖板60和所述电路板组件100的结合力。
请参见图11，本申请实施例还提供一种封装结构200，所述封装结构 200包括所述封装盖板60以及所述电路板组件100。所述封装盖板60包括绝缘体61及设置于所述绝缘体61内的内侧线路层62，所述封装盖板60设有开槽63，部分所述内侧线路层62于所述开槽63的底部露出。所述电路板组件100包括封装基板22、发热元件30、导热介质33、以及导电盖体40，所述封装基板22包括基材层11、第一线路层16、以及中空导电柱21。所述第一线路层16设置于所述基材层11的侧面，所述中空导电柱21的一端设置于所述第一线路层16，所述发热元件30设置于所述中空导电柱21内，所述发热元件30电性连接所述第一线路层16，所述导热介质33填充所述中空导电柱21，所述导热介质33浸没所述发热元件30。所述导电盖体40设置于所述中空导电柱21的另一端，所述导电盖体40封闭所述中空导电柱21。所述封装基板22对应所述绝缘体61设置，部分所述中空导电柱21容置于所述开槽63，所述导电盖体40电性连接所述内侧线路层62。
本技术领域的普通技术人员应当认识到，以上的实施例仅是用来说明本申请，而并非用作为对本申请的限定，只要在本申请的实质精神范围内，对以上实施例所作的适当改变和变化都落在本申请公开的范围内。

Claims (10)

  1. 一种电路板组件的制造方法，其特征在于，包括步骤：
    提供一封装基板，所述封装基板包括基材层、线路层、以及中空导电柱，所述线路层设置于所述基材层，所述中空导电柱的一端设置于所述线路层；
    于所述中空导电柱内设置发热元件，所述发热元件电性连接所述线路层；
    于所述中空导电柱内填入导热介质，所述导热介质浸没所述发热元件；
    于所述中空导电柱的另一端设置导电盖体，所述导电盖体封闭所述中空导电柱，获得所述电路板组件。
  2. 如权利要求1所述的制造方法，其特征在于，所述封装基板的制造方法包括步骤：
    提供一覆铜基板，所述覆铜基板包括所述基材层及设置于所述基材层的铜箔层；
    于所述铜箔层电镀形成所述中空导电柱；以及
    蚀刻所述铜箔层以形成所述线路层，获得所述封装基板。
  3. 如权利要求1所述的制造方法，其特征在于，所述封装基板的制造方法包括步骤：
    提供一覆铜基板，所述覆铜基板包括所述基材层及设置于所述基材层的铜箔层；
    于所述铜箔层电镀形成实心导电柱；
    蚀刻所述铜箔层以形成所述线路层；以及
    掏空所述实心导电柱以形成所述中空导电柱，获得所述封装基板。
  4. 如权利要求1所述的制造方法，其特征在于，步骤“于所述中空导电柱的另一端设置导电盖体”包括：
    于所述导热介质的界面设置导电薄膜，所述导电薄膜电性连接所述中空导电柱的内壁；以及
    于所述导电薄膜电镀形成所述导电盖体。
  5. 如权利要求1所述的制造方法，其特征在于，还包括步骤：
    于所述线路层设置粘接层；以及
    于所述粘接层设置保护层。
  6. 一种电路板组件，其特征在于，包括：
    封装基板，所述封装基板包括基材层、线路层、以及中空导电柱，所述线路层设置于所述基材层，所述中空导电柱的一端设置于所述线路层；
    发热元件，所述发热元件设置于所述中空导电柱内，所述发热元件电性连接所述线路层；
    导热介质，所述导热介质填充所述中空导电柱，所述导热介质浸没所述发热元件；以及
    导电盖体，所述导电盖体设置于所述中空导电柱的另一端，所述导电盖体封闭所述中空导电柱。
  7. 如权利要求6所述的电路板组件，其特征在于，所述线路层包括多个导电垫，所述导电垫于所述中空导电柱的底部露出，所述发热元件包括元件本体及元件引脚，所述元件引脚连接所述导电垫。
  8. 如权利要求6所述的电路板组件，其特征在于，所述导电盖体包括第一部分和第二部分，所述第一部分插入所述中空导电柱，所述第二部分凸出所述中空导电柱，所述第二部分的高度不小于10微米。
  9. 如权利要求7所述的电路板组件，其特征在于，所述电路板组件还包括导通体，所述导通体设置于所述封装基板，所述导通体一端连接所述导电垫，另一端露出于所述基材层。
  10. 一种封装结构，其特征在于，包括：
    封装盖板，所述封装盖板包括绝缘体及设置于所述绝缘体内的内侧线路 层，所述封装盖板设有开槽，部分所述内侧线路层于所述开槽的底部露出；
    电路板组件，所述电路板组件包括封装基板、发热元件、导热介质、以及导电盖体，所述封装基板包括基材层、线路层、以及中空导电柱，所述线路层设置于所述基材层，所述中空导电柱的一端设置于所述线路层，所述发热元件设置于所述中空导电柱内，所述发热元件电性连接所述线路层，所述导热介质填充所述中空导电柱，所述导热介质浸没所述发热元件，所述导电盖体设置于所述中空导电柱的另一端，所述导电盖体封闭所述中空导电柱；
    所述封装基板对应所述绝缘体设置，部分所述中空导电柱容置于所述开槽，所述导电盖体电性连接所述内侧线路层。
PCT/CN2022/128372 2022-10-28 2022-10-28 电路板组件及其制造方法、封装结构 WO2024087201A1 (zh)

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