CN113388761A - Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof - Google Patents
Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof Download PDFInfo
- Publication number
- CN113388761A CN113388761A CN202110630983.7A CN202110630983A CN113388761A CN 113388761 A CN113388761 A CN 113388761A CN 202110630983 A CN202110630983 A CN 202110630983A CN 113388761 A CN113388761 A CN 113388761A
- Authority
- CN
- China
- Prior art keywords
- aluminum
- cover plate
- silicon alloy
- plate material
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/02—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
- B22D11/003—Aluminium alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/026—Alloys based on aluminium
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Metal Rolling (AREA)
Abstract
The invention relates to an aluminum-silicon alloy cover plate material for electronic packaging and a preparation method thereof, belonging to the technical field of metallurgy and calendaring processing. In the aluminum-silicon alloy cover plate material, the content of Si is 7-20 wt%, the content of Mg is 0.01-0.5 wt%, the content of Cu is 0.01-0.1 wt%, the content of Zn is 0.01-0.1 wt%, the content of Ti is 0.01-0.5 wt%, and the balance is Al. The alloy is prepared by adopting the methods of vertical semi-continuous casting, hot extrusion cogging, isothermal cold rolling, surface treatment, later-stage shaping and the like. The aluminum-silicon alloy cover plate disclosed by the invention is uniform in components, accurate in size, excellent in performance and good in consistency. The method can effectively and accurately control the components, avoid the introduction of impurities and improve the purity of the alloy; improves the internal structure of the alloy, reduces the processing difficulty and can prepare the aluminum-silicon alloy cover plate material with excellent performance.
Description
Technical Field
The invention relates to an aluminum-silicon alloy cover plate material for electronic packaging and a preparation method thereof, which are mainly used for airtight packaging of electronic devices and belong to the technical field of metallurgy and calendaring processing.
Background
In recent years, with the rapid development of the electronic industry and the aviation and aerospace industry and the continuous improvement of the performance of electronic complete machines and systems, the requirements of application parties on electronic devices are higher and higher, the devices are required to be small in size and light in weight, the devices are required to have high air tightness, strong impact vibration and irradiation conditions under various severe use environments can be resisted, the stable operation can be realized in a wider temperature range and a vacuum state, and the service life is longer. Therefore, in order to ensure the stability and long-term reliability of electronic devices and components, device manufacturers must hermetically package them. The key factors affecting the quality of the airtight sealing cover are the design of the cover plate of the cavity, the selection of materials, the control of the technological process and the like. The metal cover plate is connected with the metal shell in the modes of laser welding, energy storage welding, parallel welding and the like, so that the overall strength and the air tightness of a welded device are ensured to be good, and the welded device can also endure a harsher environment. Therefore, the metal cover plate used in the microelectronic package plays a very important role in the field of microelectronic metal package, and the reliability of the connection between the cover plate and the shell material is directly determined, so that the welding performance and the strength after welding are good, and the strength requirement of the cover plate is higher.
At present, the metal materials for the airtight packaging of electronic devices include kovar alloy, carbon steel, stainless steel, aluminum alloy, aluminum-silicon alloy, copper alloy and the like. Aluminum and its alloys are the most widely used structural materials in non-ferrous metals, and the product quantity is second only to steel. The aluminum alloy has the advantages of small density, high strength, high conductivity, no magnetism, corrosion resistance, good thermal stability, easy processing and forming, low cost and the like, thereby being widely applied to the aspects of aerospace, aviation, automotive electronics, power batteries and the like. The aluminum-silicon series alloy has the advantages of stable performance, low melting point, high specific strength, good conductivity, low cost and the like. And the alloy has low reflectivity to laser, which is beneficial to improving the utilization rate of the laser. The 4xxx series aluminum alloy has good ductility, does not cause the product to generate brittleness after welding, and can prevent welding cracks and holes. The shell material matched with the alloy is usually 6063 or 6061 aluminum alloy, and the main alloy elements of the alloy are Mg and Si with good welding performance.
With the increase of the demand of the aluminum-silicon alloy cover plate material, the research and the general application of the product are greatly promoted. The quality of products is uneven due to the large differences of equipment allocation, process routes, technical levels, market applications and enterprise standards of each unit, particularly the large differences of multi-pass rolling production and extrusion production processes. The current domestic materials mainly have the following problems in practical application: (1) the material has insufficient strength and deforms when being hermetically sealed; (2) the surface quality of the material is poor, and the packaging is easy to be unstable; (3) the flatness of the cover plate material is poor, and the cover plate material is easy to deform during and after packaging, so that open welding is caused.
Disclosure of Invention
The invention mainly aims to provide an aluminum-silicon alloy cover plate for electronic packaging, which has excellent material performance, can meet the use requirement of component proportion, can realize deep processing and finish machining, and can be popularized and applied to various electronic packaging cover plates, in particular to the application of cover plates with various specifications in electronic airtight packaging.
The invention also aims to provide the preparation method of the aluminum-silicon alloy cover plate material, which is simple and efficient, and is beneficial to batch production and quality guarantee.
In order to achieve the purpose, the invention adopts the following technical scheme:
an aluminum-silicon alloy cover plate material for electronic packaging is prepared by adding trace elements into aluminum-silicon alloy, wherein the content of Si is 7-20 wt%, the content of Mg is 0.01-0.5 wt%, the content of Cu is 0.01-0.1 wt%, the content of Zn is 0.01-0.1 wt%, the content of Ti is 0.01-0.5 wt%, and the balance is Al.
In the aluminum-silicon alloy cover plate material, the preferable chemical components are 9-16 wt% of Si, 0.01-0.3 wt% of Mg, 0.01-0.08 wt% of Cu, 0.01-0.08 wt% of Zn, 0.01-0.3 wt% of Ti and the balance of Al. More preferably, the chemical composition is 10 to 14 wt% of Si, 0.01 to 0.1 wt% of Mg, 0.01 to 0.05 wt% of Cu, 0.01 to 0.05 wt% of Zn, 0.01 to 0.1 wt% of Ti, and the balance of Al.
Preferably, in the aluminum-silicon alloy cover plate material, the purity of the alloy is not lower than 99.5 wt%, that is, except for main elements Al, Si, Mg, Cu, Zn and Ti, impurity elements Fe are not more than 0.2 wt%, Zr is not more than 0.1 wt%, Ni is not more than 0.1 wt%, and the total content of other impurity elements is not more than 0.1 wt%.
Preferably, the microstructure of the aluminum-silicon alloy cover plate is as follows: si exists in a spherical or spheroidal shape in the Al matrix, and the size of the Si does not exceed 20 mu m.
The material of the invention is based on aluminum-silicon eutectic alloy, and trace elements are added into the eutectic alloy to improve the performance of the eutectic alloy. Mg is added to improve the strength and rigidity of the alloy, Cu is added to improve the welding performance of the alloy, Ti is added to refine grains and improve the structure performance, and Zn is added to further improve the strength of the alloy. Partial elements and an aluminum matrix form a mesophase or an intermediate compound, such as Al5Mg6, Mg2Si, Al2Cu, Al2CuMg, AlTi2, AlTi3, Cu2Mg8Si6Al5 and the like, so that the growth of crystal grains is effectively hindered, dislocation is pinned during deformation, the internal structure of the material is improved, and the performance of the material is improved. The content of the impurity elements is controlled, and the problems that the cover plate is cracked and the like in the plastic deformation process and the welding process of the material are solved, so that the material and the device are invalid. Since the addition amount of each element is small, the design component is often small in the design of the conventional alloy, and the strengthening effect is not remarkable. According to the invention, various trace elements are added to form various intermediate phases or intermediate compounds which are dispersed in the matrix, so that on one hand, Si element is beneficial to becoming spherical, and on the other hand, crystal grains can be effectively refined, and the properties such as material strength are improved.
The physical properties of the aluminum-silicon alloy cover plate are as follows: tensile strength Rm250-330MPa, yield strength Rp0.2180-250 MPa, elongation not less than 3%, and Rockwell hardness of 68-85 HR 15T. The thermal conductivity lambda is not less than 170W/m.K, and the thermal expansion coefficient is alpha (20-250 ℃)19.5-21.6 multiplied by 10 < -6 >/DEG C. Preferably, the physical properties of the aluminum-silicon alloy cover plate material are as follows, and the tensile strength Rm270-300MPa, yield strength Rp0.2200 to 250MPa, elongation of not less than 3 percent and Rockwell hardness of 70 to 80HR 15T. The thermal conductivity lambda is not less than 170W/m.K, the thermal expansion coefficient is alpha (20 ℃ -250 ℃) and is 20.0-21.0 multiplied by 10-6/℃。
The invention provides a preparation method of an aluminum-silicon alloy cover plate material, which adopts the process flow of vertical semi-continuous casting, hot extrusion, cold rolling, surface treatment and shaping.
A preparation method of an aluminum-silicon alloy cover plate material for electronic packaging comprises the following steps:
(1) preparing materials: weighing raw materials Al, Si, Mg, Cu, Zn and Ti according to the mass percentage, wherein the content of Si is 7-20 wt%, the content of Mg is 0.01-0.5 wt%, the content of Cu is 0.01-0.1 wt%, the content of Zn is 0.01-0.1 wt%, the content of Ti is 0.01-0.5 wt%, and the balance is Al;
(2) vertical semi-continuous casting: putting the weighed raw materials into a graphite crucible of a semi-continuous casting furnace, adopting medium-frequency induction melting, and semi-continuously casting after metal full melting into a cylindrical ingot blank;
(3) hot extrusion: heating the obtained ingot blank, and extruding the ingot blank into a plate blank with the thickness of 7-12mm by adopting a hydraulic forward extruder;
(4) isothermal cold rolling: carrying out multi-pass rolling on the plate blank, wherein the single-pass rolling deformation rate is 10-25%; after entering the final finish rolling stage of the finished product (the final 10-15 passes), the single-pass processing deformation rate is 2-10% (or 5-10%), and finally the finished product is processed to the size;
(5) surface treatment: and (3) performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth. The abrasive cloth is 400-;
(6) shaping: and leveling the plate by using a leveling machine and a sine leveling method. And setting straightening parameters according to the width and the thickness of the plate. Too small a leveling gap and too large a sine amplitude cannot be set, preventing material property variations.
In the step (1), the raw materials are high-purity aluminum with the purity of 99.999 percent, silicon with the purity of 99.99 percent, high-purity magnesium with the purity of 99.99 percent, TU1 oxygen-free copper, pure zinc with the purity of 99.9 percent and TA1 industrial pure titanium.
In the step (2), the semi-continuous casting adopts medium-frequency induction melting, the metal is refined after being melted completely, then a seeding rod is drawn downwards, the melt is introduced into a graphite mold, water cooling is carried out outside the graphite mold, the melt is solidified into a bar blank in the mold, and then the subsequent melt solidification is drawn. The smelting temperature is 680-750 ℃, and the casting speed is 2-5 mm/s. Finally, casting into a bar blank with the diameter phi of 165.0mm and the length of about 2 m. Sawing the bar blank and peeling for later use.
In the step (3), during hot extrusion, the extrusion temperature is 400-450 ℃, preferably 400-430 ℃ or 430-450 ℃, the extrusion speed is 10-25mm/s, preferably 15-20mm/s, and the extrusion pressure is 18-22 MPa, preferably 19-20 MPa. The size of the slab is not equal to 7-12mm and is 200-220 mm.
In the step (4), in the isothermal cold rolling process of the plate, the temperature of the rolled plate is not higher than 80 ℃ so as to prevent the strength performance of the material from being reduced due to the temperature rise of the plate.
In the step (5), the type of the abrasive cloth is 400-.
The aluminum-silicon alloy cover plate material provided by the invention can be prepared by adopting the method.
The application of the aluminum-silicon alloy cover plate is mainly the application of the aluminum-silicon alloy cover plate as electronic packaging, in particular to the electronic airtight packaging. The aluminum-silicon alloy cover plate can be used as a cover plate material matched with a tube shell in electronic airtight packaging and applied to preparation of various electronic airtight packaging cover plate materials.
The beneficial effects of the invention are as follows:
(1) the aluminum-silicon alloy cover plate of the invention solves some technical defects existing in the prior materials and methods, and mainly shows that: the performance of the existing cover plate material can not meet the requirements of strength and rigidity of electronic packaging, and the problems of deformation, warping, welding failure and the like can occur in the welding and using processes. The surface quality of the plate is poor, which causes difficulty in welding. In addition, the flatness of the plate is low, and the welding process is easy to open. And the existing processing process is complicated in flow and cannot meet the requirement of large-batch supply.
(2) The invention adopts high-purity raw materials, can obtain an ingot blank with higher density, fewer defects and lower impurity content by using a vertical semi-continuous casting method, and has great advantages compared with the traditional non-vacuum casting ingot blank. The aluminum-silicon alloy cover plate material prepared by the invention has the advantages of uniform and accurate components, uniform and fine alloy structure, excellent performance and total impurity content lower than 0.5%.
(3) The invention relates to the component design of materials, which is based on aluminum-silicon eutectic alloy, and trace elements are added into the eutectic alloy to improve the performance of the eutectic alloy. Mg is added to improve the strength and rigidity of the alloy, Cu is added to improve the welding performance of the alloy, Ti is added to refine grains and improve the structure performance, and Zn is added to further improve the strength of the alloy. Part of the elements and the aluminum matrix form an intermediate phase or an intermediate compound, thereby effectively hindering the growth of crystal grains, pinning dislocation during deformation, improving the internal structure of the material and improving the performance of the material. The content of the impurity elements is controlled, and the problems that the cover plate is cracked and the like in the plastic deformation process and the welding process of the material are solved, so that the material and the device are invalid.
(4) In the preparation process of the cover plate material, the problems of poor surface quality and low flatness of the plate shape are thoroughly solved through surface treatment and shaping, and meanwhile, the production and preparation efficiency is effectively improved.
The aluminum-silicon alloy cover plate disclosed by the invention is uniform in components, accurate in size, excellent in performance and good in consistency. The alloy is prepared by adopting a vertical semi-continuous casting method, a hot extrusion cogging method, an isothermal cold rolling method, a surface treatment method and a later-stage shaping method, and the method can effectively and accurately control components, avoid the introduction of impurities and improve the purity of the alloy; improves the internal structure of the alloy, reduces the processing difficulty and can prepare the aluminum-silicon alloy cover plate material with excellent performance.
Detailed Description
The aluminum-silicon alloy cover plate and the method for manufacturing the same according to the present invention will be further described with reference to the following embodiments.
The aluminum-silicon alloy cover plate comprises the following components in percentage by weight: 7-20 wt% of Si, 0.01-0.5 wt% of Mg, 0.01-0.1 wt% of Cu, 0.01-0.1 wt% of Zn, 0.01-0.5 wt% of Ti and the balance of Al. The purity of the alloy is not less than 99.5 percent, namely, the impurity elements Fe are not more than 0.2wt percent, Zr is not more than 0.1wt percent, Ni is not more than 0.1wt percent and the total content of other impurity elements is not more than 0.1wt percent except the main elements Al, Si, Mg, Cu, Zn and Ti.
The physical properties of the aluminum-silicon alloy cover plate are as follows, and the tensile strength Rm250-330MPa, yield strength Rp0.2180-250 MPa, elongation not less than 3%, and Rockwell hardness of 68-85 HR 15T. The thermal conductivity lambda is not less than 170W/m.K, the thermal expansion coefficient is alpha (20 ℃ -250 ℃) and is 19.5-21.6 multiplied by 10-6/℃。
The aluminum-silicon alloy cover plate in the embodiment of the invention is prepared by the following method, and specifically comprises the following steps:
step (1): selection of raw materials
High-purity aluminum with the purity of 99.999 percent, silicon with the purity of 99.99 percent, high-purity magnesium with the purity of 99.99 percent, TU1 oxygen-free copper, pure zinc with the purity of 99.9 percent and TA1 industrial pure titanium.
Step (2): ingredients
The raw materials are weighed according to the mass percentage of each component, and the total weight is 100 kg-120 kg.
And step 3: vertical semi-continuous casting
1) Equipment: 100kg of a vertical semi-continuous casting machine;
2) a mould: graphite mold, mold cavity size: phi 165 mm;
3) the operation is as follows: the weighed raw materials are put into a graphite crucible of a vertical semi-continuous casting machine, medium-frequency induction melting is adopted, degassing and refining are carried out after metal is completely melted, then a seeding rod is drawn downwards, the melt is introduced into a graphite mold, water cooling is carried out outside the graphite mold, the melt is solidified into a bar blank in the mold, and then the subsequent melt is drawn to be solidified. The smelting temperature is 680-750 ℃, and the casting speed is 2-5 mm/s. Finally, casting into a bar blank with the diameter phi of 165.0mm and the length of about 2 m. Sawing the bar blank and peeling for later use.
And 4, step 4: hot extrusion
1) Equipment: 1250 ton forward extruder;
2) a mould: hard alloy die, die cavity size: not equal to 7-12mm multiplied by 200-220 mm;
3) the operation is as follows: homogenizing and heat-treating the bar blank, wherein the preheating temperature is as follows: 430-450 ℃. Extruding the bar blank into a plate blank with the thickness of not equal to 7-12mm multiplied by 200 and 220mm by using a 1250-ton forward extruder, wherein the extrusion temperature is 430-450 ℃, the extrusion speed is 15-25mm/s, and the extrusion pressure is as follows: 19MPa to 22 MPa;
and 5: isothermal cold rolling
1) Equipment: an aluminum-based alloy plate rolling mill;
2) the operation is as follows: carrying out multi-pass rolling on the plate blank, wherein the single-pass rolling deformation rate is 10-25%; after the final finish rolling stage (the final 10-15 passes), the single-pass processing deformation rate is 2-10%, the temperature of the plate after rolling is not higher than 80 ℃, and the plate is finally processed to the size of the finished product.
Step 6: surface treatment
And (3) performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth. The abrasive cloth is 400-plus-1000 #, and the polishing cloth is made of non-woven fabrics.
And 7: shaping machine
And leveling the plate by using a leveling machine and a sine leveling method. And setting straightening parameters according to the width and the thickness of the plate. Too small a leveling gap and too large a sine amplitude cannot be set, preventing material property variations.
Example 1
The amount of the furnace in the case of semi-continuous casting was 100 kg.
Weighing 10kg of Si, 0.01kg of Mg, 0.01kg of Cu, 0.01kg of Zn, 0.01kg of Ti and 89.96kg of Al, putting the materials into a graphite crucible of a semi-continuous casting machine, adopting medium-frequency induction smelting, refining and degassing after the metals are completely molten, starting a casting device, introducing the melt into a graphite die by using a crystal drawing rod, wherein the smelting temperature is 700 ℃, and the casting speed is 3 mm/s. Casting to obtain a bar blank with the diameter phi of 165.0mm and the length of about 2 m.
And sawing the prepared bar blank into bar ingots with the length of 200mm, peeling off the bar ingots, and extruding.
And (3) placing the bar ingot into a heat treatment furnace, heating to 440 ℃, homogenizing, carrying out heat treatment and preserving heat for 12 hours. The bar was extruded using a 1250 ton forward extruder into slabs ≠ 10mm × 200mm, extrusion temperature 450 ℃, extrusion speed 15mm/s, extrusion pressure: 19 MPa;
rolling the plate blank for 10 passes until the thickness is not equal to 2.15mm, wherein the pass rolling deformation rate is 10-20%; and then, a finished product finish rolling stage is carried out, 12 passes are carried out, the single-pass processing deformation rate is 2-10%, and finally the finished product is processed until the thickness dimension is not equal to 1 mm. The temperature of the rolled plate is 50-56 ℃.
And (3) performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth. The abrasive cloth is 800#, and the polishing cloth is made of non-woven fabric. And leveling the plate by using a leveling machine and a sine leveling method.
Example 2
The amount of the furnace in the case of semi-continuous casting was 100 kg.
Weighing 12kg of Si, 0.05kg of Mg, 0.05kg of Cu, 0.05kg of Zn, 0.05kg of Ti and 87.8kg of Al, putting the materials into a graphite crucible of a semi-continuous casting machine, adopting medium-frequency induction smelting, refining and degassing after the metals are completely molten, starting a casting device, introducing a melt into a graphite die by using a crystal drawing rod, wherein the smelting temperature is 720 ℃, and the casting speed is 4 mm/s. Casting to obtain a bar blank with the diameter phi of 165.0mm and the length of about 2 m.
And sawing the prepared bar blank into bar ingots with the length of 200mm, peeling off the bar ingots, and extruding.
And (3) placing the bar ingot in a heat treatment furnace, heating to 430 ℃, homogenizing, carrying out heat treatment and preserving heat for 12 hours. The bar was extruded using a 1250 ton forward extruder into slabs ≠ 10mm × 220mm, extrusion temperature 450 ℃, extrusion speed 20mm/s, extrusion pressure: 20 MPa;
rolling the plate blank for 10 passes until the thickness is not equal to 2.50mm, wherein the pass rolling deformation rate is 10-20%; and then, a finished product finish rolling stage is carried out, 10 passes are carried out, the single-pass processing deformation rate is 2-10%, and finally the finished product is processed until the thickness dimension is not equal to 1 mm. The temperature of the rolled plate is 60-64 ℃.
And (3) performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth. The abrasive cloth model is 1000#, and the polishing cloth material is the non-woven fabrics. And leveling the plate by using a leveling machine and a sine leveling method.
Example 3
The amount of the furnace in the case of semi-continuous casting was 100 kg.
Weighing 15kg of Si, 0.03kg of Cu, 0.03kg of Zn, 0.03kg of Ti, 0.03kg of Mg and 84.88kg of Al, putting the materials into a graphite crucible of a semi-continuous casting machine, adopting medium-frequency induction smelting, refining and degassing after the metals are completely molten, starting a casting device, introducing the melt into a graphite die by using a crystal drawing rod, wherein the smelting temperature is 750 ℃, and the casting speed is 3 mm/s. Casting to obtain a bar blank with the diameter phi of 165.0mm and the length of about 2 m.
And sawing the prepared bar blank into bar ingots with the length of 200mm, peeling off the bar ingots, and extruding.
And (3) placing the bar ingot in a heat treatment furnace, heating to 450 ℃, homogenizing, performing heat treatment and preserving heat for 12 hours. The bar was extruded using a 1250 ton forward extruder into slabs ≠ 7mm × 200mm, extrusion temperature 450 ℃, extrusion speed 15mm/s, extrusion pressure: 22 MPa;
rolling the plate blank for 10 passes until the thickness is not equal to 2.22mm, wherein the pass rolling deformation rate is 10-20%; and then, a finished product finish rolling stage is carried out, 15 passes are carried out, the single-pass processing deformation rate is 2-10%, and finally the finished product is processed until the thickness dimension is not equal to 1 mm. The temperature of the rolled plate is 62-66 ℃.
And (3) performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth. The abrasive cloth is 800#, and the polishing cloth is made of non-woven fabric. And leveling the plate by using a leveling machine and a sine leveling method.
Example 4
The amount of the furnace in the case of semi-continuous casting was 100 kg.
Weighing 20kg of Si, 0.01kg of Cu, 0.01kg of Zn, 0.01kg of Ti, 0.01kg of Mg and 79.96kg of Al, putting the materials into a graphite crucible of a semi-continuous casting machine, adopting medium-frequency induction smelting, refining and degassing after the metals are completely molten, starting a casting device, introducing the melt into a graphite die by using a crystal drawing rod, wherein the smelting temperature is 750 ℃, and the casting speed is 2 mm/s. Casting to obtain a bar blank with the diameter phi of 165.0mm and the length of about 2 m.
And sawing the prepared bar blank into bar ingots with the length of 200mm, peeling off the bar ingots, and extruding.
And (3) placing the bar ingot in a heat treatment furnace, heating to 450 ℃, homogenizing, performing heat treatment and preserving heat for 12 hours. The bar was extruded using a 1250 ton forward extruder into slabs ≠ 12mm × 220mm, extrusion temperature 450 ℃, extrusion speed 15mm/s, extrusion pressure: 22 MPa;
rolling the plate blank for 15 passes until the thickness is not equal to 2.55mm, wherein the pass rolling deformation rate is 10-20%; and then, a finished product finish rolling stage is carried out, 20 passes are carried out, the single-pass processing deformation rate is 2-10%, and finally the finished product is processed until the thickness dimension is not equal to 1 mm. The temperature of the rolled plate is 67-77 ℃.
And (3) performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth. The abrasive cloth is 600#, and the polishing cloth is made of non-woven fabrics. And leveling the plate by using a leveling machine and a sine leveling method.
The boards prepared in examples 1 to 4 were used for physical testing, respectively, and the test data are shown in Table 1.
Table 1 results of testing the composition of the sheets prepared in examples 1-4
The boards prepared in examples 1 to 4 were used for physical testing, respectively, and the test data are shown in Table 2.
Table 2 results of performance tests of the sheets prepared in examples 1 to 4
By adopting the conventional aluminum-silicon alloy plate production process, the cover plate material which can meet the requirement of airtight packaging strength and has uniform and stable quality and performance is difficult to prepare. Compared with the experimental results, the aluminum-silicon alloy cover plate material prepared by the invention has excellent and stable physical properties and can meet the use requirements.
The aluminum-silicon alloy cover plate material consists of Al, Si, Mg, Cu, Zn, Ti and other elements, and the purity of the alloy is not lower than 99.5 wt%. The alloy is prepared by adopting the methods of vertical semi-continuous casting, hot extrusion cogging, isothermal cold rolling, surface treatment, later-stage shaping and the like. The cover plate material is mainly used for electronic packaging, in particular to electronic airtight packaging manufacture matched with a metal tube shell.
In the above embodiments, only some of the embodiments of the aluminum-silicon alloy cover plate material and the method for manufacturing the same according to the present invention are described, and in the technical solution of the present invention: the contents of the elements in the alloy components can be freely selected within the specified ranges, and are not listed, so the technical scheme contained in the above description should be regarded as illustrative and is not used to limit the protection scope of the present invention.
Claims (9)
1. An aluminum-silicon alloy cover plate material for electronic packaging is characterized in that: in the aluminum-silicon alloy cover plate material, the content of Si is 7-20 wt%, the content of Mg is 0.01-0.5 wt%, the content of Cu is 0.01-0.1 wt%, the content of Zn is 0.01-0.1 wt%, the content of Ti is 0.01-0.5 wt%, and the balance is Al.
2. The aluminum-silicon alloy cover plate material for electronic packaging according to claim 1, wherein: the purity of the aluminum-silicon alloy cover plate material is not lower than 99.5 wt%.
3. The aluminum-silicon alloy cover plate material for electronic packaging according to claim 2, wherein: the impurity elements Fe are not more than 0.2 wt%, Zr is not more than 0.1 wt%, Ni is not more than 0.1 wt%, and the sum of the contents of other impurity elements is not more than 0.1 wt%.
4. The aluminum-silicon alloy cover plate material for electronic packaging according to claim 3, wherein: in the aluminum-silicon alloy cover plate material, Si presents a spherical shape or a sphere-like shape in an Al matrix, and the size of the Si does not exceed 20 mu m.
5. A preparation method of an aluminum-silicon alloy cover plate material for electronic packaging comprises the following steps:
(1) preparing materials: weighing raw materials Al, Si, Mg, Cu, Zn and Ti according to the mass percentage, wherein the content of Si is 7-20 wt%, the content of Mg is 0.01-0.5 wt%, the content of Cu is 0.01-0.1 wt%, the content of Zn is 0.01-0.1 wt%, the content of Ti is 0.01-0.5 wt%, and the balance is Al;
(2) vertical semi-continuous casting: putting the weighed raw materials into a graphite crucible of a semi-continuous casting furnace, adopting medium-frequency induction melting, and semi-continuously casting after metal full melting into a cylindrical ingot blank;
(3) hot extrusion: heating the obtained ingot blank, and extruding the ingot blank into a plate blank with the thickness of 7-12mm by adopting a hydraulic forward extruder;
(4) isothermal cold rolling: carrying out multi-pass rolling on the plate blank, wherein the single-pass rolling deformation rate is 10-25%; after entering the final finish rolling stage of the finished product, the single-pass processing deformation rate is 2-10%, and the finished product is processed to the size;
(5) surface treatment: performing surface treatment on the surface of the plate by using polishing equipment, abrasive cloth and polishing cloth;
(6) shaping: and leveling the plate by using a leveling machine and a sine leveling method.
6. The method for preparing the aluminum-silicon alloy cover plate material for electronic packaging according to claim 5, wherein the method comprises the following steps: the smelting temperature is 680-750 ℃, and the casting speed is 2-5 mm/s.
7. The method for preparing the aluminum-silicon alloy cover plate material for electronic packaging according to claim 5, wherein the method comprises the following steps: when in hot extrusion, the extrusion temperature is 400-450 ℃, the extrusion speed is 10-25mm/s, and the extrusion pressure is 18-22 MPa.
8. The method for preparing the aluminum-silicon alloy cover plate material for electronic packaging according to claim 5, wherein the method comprises the following steps: in the isothermal cold rolling process of the plate, the temperature of the rolled plate is not higher than 80 ℃.
9. The method for preparing the aluminum-silicon alloy cover plate material for electronic packaging according to claim 5, wherein the method comprises the following steps: the model of the abrasive cloth is 400-.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110630983.7A CN113388761A (en) | 2021-06-07 | 2021-06-07 | Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110630983.7A CN113388761A (en) | 2021-06-07 | 2021-06-07 | Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113388761A true CN113388761A (en) | 2021-09-14 |
Family
ID=77618331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110630983.7A Pending CN113388761A (en) | 2021-06-07 | 2021-06-07 | Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113388761A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4328342A1 (en) * | 2022-08-25 | 2024-02-28 | Alutec Co., Ltd. | Method of manufacturing aluminum plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102206778A (en) * | 2010-03-30 | 2011-10-05 | 本田技研工业株式会社 | Aluminium die casting alloy used as vehicle material |
| CN103567655A (en) * | 2012-07-26 | 2014-02-12 | 北京有色金属与稀土应用研究所 | Al-Si-Cu-Mg aluminum-base alloy foil solder and preparation method thereof |
| CN108796314A (en) * | 2018-07-16 | 2018-11-13 | 中南大学 | A kind of preparation method of alusil alloy used for electronic packaging |
| CN109988945A (en) * | 2017-12-29 | 2019-07-09 | 华为技术有限公司 | A kind of pack alloy and preparation method thereof and communication product |
| CN110029250A (en) * | 2019-04-03 | 2019-07-19 | 宁波合力模具科技股份有限公司 | High-elongation birmastic and its compression casting preparation method |
| CN110484787A (en) * | 2019-08-20 | 2019-11-22 | 北京有色金属与稀土应用研究所 | A kind of high-purity almag microfilament and its preparation method and application |
-
2021
- 2021-06-07 CN CN202110630983.7A patent/CN113388761A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102206778A (en) * | 2010-03-30 | 2011-10-05 | 本田技研工业株式会社 | Aluminium die casting alloy used as vehicle material |
| CN103567655A (en) * | 2012-07-26 | 2014-02-12 | 北京有色金属与稀土应用研究所 | Al-Si-Cu-Mg aluminum-base alloy foil solder and preparation method thereof |
| CN109988945A (en) * | 2017-12-29 | 2019-07-09 | 华为技术有限公司 | A kind of pack alloy and preparation method thereof and communication product |
| CN108796314A (en) * | 2018-07-16 | 2018-11-13 | 中南大学 | A kind of preparation method of alusil alloy used for electronic packaging |
| CN110029250A (en) * | 2019-04-03 | 2019-07-19 | 宁波合力模具科技股份有限公司 | High-elongation birmastic and its compression casting preparation method |
| CN110484787A (en) * | 2019-08-20 | 2019-11-22 | 北京有色金属与稀土应用研究所 | A kind of high-purity almag microfilament and its preparation method and application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4328342A1 (en) * | 2022-08-25 | 2024-02-28 | Alutec Co., Ltd. | Method of manufacturing aluminum plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11326241B2 (en) | Plastic wrought magnesium alloy and preparation method thereof | |
| CN108425050B (en) | High-strength high-toughness aluminum lithium alloy and preparation method thereof | |
| US20240035123A1 (en) | High-strength al-cu-mg-mn aluminum alloy and preparation method therefor | |
| CN102337435B (en) | Aluminum alloy pipe and manufacture method thereof | |
| CN102330004B (en) | Manufacturing method for aluminum alloy die forgings | |
| CN111101034A (en) | Low-rare-earth high-performance rare earth aluminum alloy and preparation method thereof | |
| CN102433475B (en) | High-strength and high-hardness aluminum alloy and preparation method thereof | |
| CN115558825B (en) | High-heat-conductivity high-strength and high-toughness die-casting aluminum alloy and preparation method thereof | |
| CN102443725A (en) | High-strength aluminum alloy treated by AlH3 and preparation method of high-strength aluminum alloy | |
| CN108642332A (en) | A kind of high-performance beryllium alumin(i)um alloy and preparation method thereof | |
| CN108998710B (en) | A kind of phone housing preparation process of aluminium alloy | |
| CN113388761A (en) | Aluminum-silicon alloy cover plate material for electronic packaging and preparation method thereof | |
| CN112210703B (en) | High-recrystallization-resistance and high-toughness aluminum lithium alloy and preparation method thereof | |
| CN102418009B (en) | Aluminum alloy capable of digesting high-hardness compounds and smelting method of aluminum alloy | |
| CN102534310A (en) | High-strength aluminum alloy doped with Mo2C and MgH2 and preparation method thereof | |
| CN113969362B (en) | Continuous gradient aluminum alloy deformation material and preparation method thereof | |
| CN113897567B (en) | Homogenization thermomechanical treatment method for rapidly refining and homogenizing cast aluminum-lithium alloy | |
| WO2020052129A1 (en) | Rare-earth aluminum alloy material having high ductility and high strength and preparation method therefor | |
| CN110527856B (en) | Preparation method of high-surface-quality and high-strength nickel alloy strip | |
| CN109182810B (en) | Low-cost high-room-temperature plastic deformation magnesium alloy and preparation method thereof | |
| CN112695234A (en) | Corrosion-resistant aluminum alloy and preparation method thereof | |
| CN102418008A (en) | High-strength aluminum alloy obtained by removing inclusion through HfC and preparation method of aluminum alloy | |
| CN113025838A (en) | High-strength die-casting aluminum alloy and preparation method thereof | |
| CN111922313A (en) | Novel magnesium alloy semi-solid forming process | |
| CN109763040A (en) | A kind of aluminum alloy materials and its method of preparation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |