CN113358751A - Workpiece defect detection method, device and system - Google Patents
Workpiece defect detection method, device and system Download PDFInfo
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- CN113358751A CN113358751A CN202110609363.5A CN202110609363A CN113358751A CN 113358751 A CN113358751 A CN 113358751A CN 202110609363 A CN202110609363 A CN 202110609363A CN 113358751 A CN113358751 A CN 113358751A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
Abstract
The invention discloses a method, a device and a system for detecting workpiece defects. Wherein, the method comprises the following steps: controlling the phased array probe to be located at the initial detection position of the workpiece; performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; judging whether the workpiece in the detection range has defects or not according to the scanning result; and if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and performing depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece. The invention solves the technical problems of large detection workload and low efficiency because the workpieces with larger thickness can be completely detected by repeatedly scanning for several times in the related technology.
Description
Technical Field
The invention relates to the technical field of ultrasonic detection, in particular to a method, a device and a system for detecting workpiece defects.
Background
In the prior art, when phased array ultrasound is used for detecting defects of a workpiece, a linear scanning mode is generally adopted, focused acoustic beams are linearly arranged during scanning, phased array probes excite each array element one by one from left to right and from right to left, all detection areas at the same position can be scanned and completely covered once by adjusting a focusing rule, the height of a focal column is large, and the phased array ultrasound scanning device is suitable for low-precision rapid scanning. Or, the dynamic depth focusing of the ultrasonic phased array is adopted, the array element delay rule of the probe is properly converted, the probe is focused at different depth positions, the resolution is improved, but the defect located in the depth range of the focal region is easy to detect during detection due to the fact that the focal point has a certain length, and the defect outside the focal region range needs to be scanned by readjusting the focusing rule. In addition, in the actual detection, the detected workpiece with a large thickness needs to be scanned repeatedly for several times to complete the detection, so that the detection workload is large and the efficiency is low.
Aiming at the problems that in the related art, the workpieces with large thickness need to be scanned repeatedly for several times to complete the whole detection, so that the detection workload is large and the efficiency is low, an effective solution is not provided at present.
Disclosure of Invention
The embodiment of the invention provides a method, a device and a system for detecting defects of workpieces, which are used for at least solving the technical problems that in the related art, the workpieces with larger thicknesses can be completely detected only by repeatedly scanning for several times, so that the detection workload is large and the efficiency is low.
According to an aspect of an embodiment of the present invention, there is provided a method for detecting a defect of a workpiece, including: controlling the phased array probe to be located at the initial detection position of the workpiece; performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; judging whether the workpiece in the detection range has defects or not according to the scanning result; if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and then carrying out depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
Optionally, the method further comprises: if the workpiece has no defect, or after a detection image of the defect position of the workpiece is obtained, controlling the phased array probe to translate to the next detection position of the workpiece, and performing one-dimensional linear scanning on the next detection position in the detection range by the phased array probe until the whole detection of the workpiece is completed, wherein each translation step of the phased array probe is less than or equal to half of the width of a focal column of a focusing sound field formed by the last dynamic depth focusing scanning.
Optionally, depth focusing the defect locations of the workpiece by dynamic depth focus scanning, comprising: and controlling the focusing depth and/or deflection angle of the sound beam by adjusting the excitation time of the array element combination of the phased array probe, and forming two continuous focusing sound fields at the position of the defect, wherein the two continuous focusing sound fields have preset focal column height and width so that the target defect is in the range of the focal column.
Optionally, the array element combination of the phased array probe at least includes: the array comprises a first array element and a second array element, wherein the number of the first array element and the second array element is 16, and the excitation delay of the first array element and the second array element is 500 ns.
Optionally, the two successive focused sound fields have a focusing pitch of 0.1 mm.
According to another aspect of the embodiments of the present invention, there is also provided an apparatus for detecting a defect of a workpiece, including: the control unit is used for controlling the phased array probe to be positioned at the initial detection position of the workpiece; the first scanning unit is used for performing one-dimensional linear scanning on the initial detection position of the workpiece in the detection range to obtain a scanning result; the judging unit is used for judging whether the workpiece in the detection range has defects or not according to the scanning result; and the second scanning unit is used for determining the defect position of the workpiece according to the scanning result if the workpiece has defects, and then carrying out depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
According to another aspect of the embodiments of the present invention, there is also provided a computer-readable storage medium, where the computer-readable storage medium includes a stored program, and when the program runs, the apparatus where the computer-readable storage medium is located is controlled to execute the method for detecting a workpiece defect described in any one of the above.
According to another aspect of the embodiments of the present invention, there is also provided a processor, configured to execute a program, where the program is executed to perform the method for detecting workpiece defects described in any one of the above.
According to another aspect of the embodiments of the present invention, there is also provided a detection system, including: the system comprises a control center, a phased array probe and a teaching center; the control center is used for executing the workpiece defect detection method; the phased array probe is used for detecting internal defects of the workpiece; and the teaching center is used for displaying the defect detection result.
According to another aspect of the embodiment of the invention, a rail vehicle is further provided, and the rail vehicle adopts the detection system.
In the embodiment of the invention, the phased array probe is controlled to be positioned at the initial detection position of the workpiece; performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; judging whether the workpiece in the detection range has defects or not according to the scanning result; if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, then carrying out depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece, preliminarily obtaining the position of the defect through one-dimensional linear scanning of a phased array probe, then carrying out dynamic depth focusing scanning to realize depth focusing of a target position, and obtaining a corresponding detection image.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a flow chart of a method of detecting defects in a workpiece according to an embodiment of the invention;
FIG. 2 is a flow chart of a method of detecting defects in a workpiece according to an alternative embodiment of the invention;
FIG. 3 is a schematic diagram of a one-dimensional linear scan of a phased array probe in accordance with an alternative embodiment of the present invention;
FIG. 4 is a schematic diagram of a phased array probe performing a dynamic depth focus scan in accordance with an alternative embodiment of the present invention;
FIG. 5 is a schematic diagram of an ultrasonic sound field control based on an array element focusing rule according to an alternative embodiment of the present invention;
FIG. 6 is a schematic view of an apparatus for detecting defects in a workpiece according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a detection system according to an alternative embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
In accordance with an embodiment of the present invention, there is provided an embodiment of a method for detecting defects in a workpiece, it being noted that the steps illustrated in the flowchart of the drawings may be performed in a computer system such as a set of computer-executable instructions and that, although a logical order is illustrated in the flowchart, in some cases the steps illustrated or described may be performed in an order different than that presented herein.
FIG. 1 is a flow chart of a method for detecting defects in a workpiece according to an embodiment of the present invention, as shown in FIG. 1, the method comprising the steps of:
s102, controlling a phased array probe to be located at an initial detection position of a workpiece;
before controlling the phased array probe to be located at the initial detection position of the workpiece, the method further comprises the following steps: and adjusting ultrasonic detection parameters of the phased array probe, wherein the ultrasonic detection parameters include, but are not limited to, array element number, frequency, bandwidth, width, scanning field of view and other parameters. For example, phased array probes employ a combination of array elements, where an array element is the smallest unit in which a piezoelectric crystal located at the head of the probe is evenly divided into several parts, each of which can independently transmit and receive ultrasound. It should be noted that, the larger the number of array elements is, the better the corresponding image quality is; the frequency is the central frequency of ultrasonic waves emitted by the probe and is in megahertz; the bandwidth is the bandwidth of the echo signal which can be received by the probe, wherein the wider the bandwidth is, the more the signal can be received, and the more the information can be provided; the width is the length of the array elements which are arranged in a straight line, wherein the wider the width is, the larger the maximum range scanned by the probe is, and the smaller the maximum range scanned by the probe is otherwise.
The initial detection position of the workpiece may be set according to actual application requirements, for example, the initial detection position may be an edge position of any side of the workpiece, or a middle position of the workpiece, and is not described herein any more.
S104, performing one-dimensional linear scanning on the initial detection position of the workpiece in the detection range to obtain a scanning result;
optionally, the phased array probe starts to work, and the one-dimensional linear scanning can be performed on the initial detection position of the workpiece in the detection range to obtain a scanning result, wherein whether the workpiece in the detection range has a defect or not and the position of the defect can be known from the scanning result. The defect position can be preliminarily determined by a one-dimensional linear scanning mode.
Step S106, judging whether the workpiece in the detection range has defects or not according to the scanning result;
and S108, if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and performing depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
In an optional implementation manner, whether the workpiece has a defect is judged based on a scanning result of one-dimensional linear scanning of the phased array probe, if the workpiece has a defect, the defect position of the workpiece can be determined according to the scanning result, and then the defect position of the workpiece is subjected to depth focusing through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece. It should be noted that the detection image is specifically an image of a high-resolution small-size defect.
It should be noted that the ultrasonic detection is controlled by the sound field based on the array element focusing rule, the acquisition of three-dimensional dynamic data is completed by matching with a mechanical drive scanning device or a space positioning device, and the high-precision rapid detection of a workpiece containing more than two small-size defects can be realized.
Through the steps, the positions of the defects can be preliminarily obtained through one-dimensional linear scanning of the phased array probe, then dynamic depth focusing scanning is carried out to realize target position depth focusing, corresponding detection images are obtained, the purpose of high-precision rapid detection of workpieces containing more than two small-size defects is achieved, accordingly, the detection workload is reduced, the technical effect of detection efficiency is improved, the technical problems that in the related technology, the workpieces with large thickness need to be scanned repeatedly for several times to complete all detection, the detection workload is large, and the efficiency is low are solved.
Optionally, the method further includes: and if the workpiece has no defect or after a detection image of the defect position of the workpiece is obtained, controlling the phased array probe to translate to the next detection position of the workpiece, and performing one-dimensional linear scanning on the next detection position in the detection range by the phased array probe until the whole detection of the workpiece is completed, wherein each translation step of the phased array probe is less than or equal to half of the width of a focal column of a focusing sound field formed by the last dynamic depth focusing scanning.
In an optional implementation manner, whether the workpiece has a defect is judged based on a scanning result of one-dimensional linear scanning of the phased array probe, if the workpiece has no defect, the phased array probe is directly controlled to translate to the next detection position of the workpiece, the phased array probe is subjected to one-dimensional linear scanning on the next detection position in the detection range, and the next execution step is further determined according to the scanning result. In addition, after the detection image of the defect position of the workpiece is obtained, the phased array probe can be controlled to translate to the next detection position of the workpiece, the phased array probe can carry out one-dimensional linear scanning on the next detection position in the detection range, and the next execution step can be further determined according to the scanning result. The method can be repeatedly executed until the overall detection of the workpiece is completed.
In order to ensure that no leakage area exists between two adjacent defect detections, each translational stepping of the phased array probe can be smaller than or equal to half of the width of a focal column of a focusing sound field formed by the last dynamic depth focusing scanning.
Optionally, depth focusing the defect locations of the workpiece by dynamic depth focus scanning, comprising: and controlling the focusing depth and/or deflection angle of the sound beam by adjusting the excitation time of the array element combination of the phased array probe, and forming two continuous focusing sound fields at the defect position, wherein the two continuous focusing sound fields have preset focal column height and width so that the target defect is in the focal column range.
In an optional implementation mode, the focusing depth and the deflection angle of the sound beam are controlled by adjusting the phased array probe and staggering the excitation time of the array element combination, and two continuous focusing sound fields are formed at the position of the defect; the two continuous focused sound fields formed have certain focal column height and width and meet the target defect within the focal column range.
According to the embodiment, the ultrasonic sound field control can be realized based on the array element focusing rule, the excitation time of array element combination is staggered, two continuous focusing sound fields are formed at the target depth, the layered focusing sound field distortion caused by superposition of array element sound beams is effectively avoided, the focusing focal region energy of the target depth is ensured, meanwhile, the focusing range of the focusing sound field is expanded, the focal position in the formed focusing sound field is accurate, the focal region energy is concentrated, the sound field is uniformly distributed, the sound pressure leakage is less, and the ultrasonic sound field control method has good detection sensitivity and resolution.
In addition, the focusing sound field has certain focal column height and width, and for small-size defects, the target defects are ensured to be in the range of the formed focal column, the longitudinal information of the defects is prevented from being detected by continuously changing the focusing depth, the probes are ensured to complete the whole acquisition of the longitudinal information of the defects only by carrying out a group of detection at one position, meanwhile, the moving step of the probes is improved by the certain focal column width, the moving step number for completing the integral detection of workpieces is reduced, and the defect detection efficiency is improved on the premise of ensuring the defect detection sensitivity and resolution.
Optionally, the array element combination of the phased array probe at least includes: the array comprises a first array element and a second array element, wherein the number of the first array element and the second array element is 16, and the excitation delay of the first array element and the second array element is 500 ns.
In a specific implementation process, the number of the array elements includes, but is not limited to, 16, for example, the number of the array elements may also be 32, 64, and the like. Of course, the excitation delay of the array element combination can be adjusted according to a specific application scenario.
Optionally, the focusing pitch of two successive focused sound fields is 0.1 mm.
An alternative embodiment of the invention is described in detail below.
Fig. 2 is a flowchart of a method for detecting defects of a workpiece according to an alternative embodiment of the present invention, as shown in fig. 2, the method can be used to detect defects of a stainless steel thick plate by first performing a one-dimensional linear scanning by a phased array probe, fig. 3 is a schematic diagram of the phased array probe according to the alternative embodiment of the present invention performing the one-dimensional linear scanning, as shown in fig. 3, the positions of the defects can be preliminarily obtained based on the scanning result of the one-dimensional linear scanning; and then, performing dynamic depth focusing scanning by using the phased array probe, wherein fig. 4 is a schematic diagram of performing dynamic depth focusing scanning by using the phased array probe according to the optional embodiment of the invention, and as shown in fig. 4, the depth focusing of a target position can be realized based on the dynamic depth focusing scanning, so that a high-resolution small-size defect detection image is obtained. In fig. 3 and 4, the letter L indicates each translational step of the phased array probe. The specific implementation process is as follows:
(1) position X is detected to stainless steel thick plate through phased array probe1Performing one-dimensional linear scanning at the detection position X of the stainless steel thick plate1At the preliminary position Y where the defect 1 is detected1At a position Y1Two continuous focusing sound fields are formed to precisely detect the defect 1；
(2) Then moving the phased array probe to the detection position X of the stainless steel thick plate2The preliminary position Y of the defect 1 is detected2At a position Y2Two continuous focusing sound fields are formed, and the defect 1 is precisely detected;
(3) moving the phased array probe to the detection position X of the stainless steel thick plate3No defect was detected;
(4) directly translating the phased array probe to the detection position X of the stainless steel thick plate4Performing one-dimensional linear scanning by a phased array probe to detect the position X at the stainless steel thick plate4At the preliminary position Y where the defect 2 is detected4At a position Y4Two continuous focusing sound fields are formed, and the defect 2 is precisely detected;
(5) then moving the phased array probe to the detection position X of the stainless steel thick plate5The preliminary position Y of the defect 2 is detected5At a position Y5Two continuous focusing sound fields are formed, and the defect 2 is precisely detected;
……
and detecting the whole defects of the stainless steel thick plate.
In the foregoing embodiment, the ultrasonic sound field control may be implemented based on an array element focusing rule, fig. 5 is a schematic diagram of implementing the ultrasonic sound field control based on the array element focusing rule according to an alternative embodiment of the present invention, as shown in fig. 5(a), two continuous focusing sound fields F are formed at a target depth by using 32 array elements in one-dimensional linear arrangement and staggering excitation time of array element combination1And F2And the focusing distance d is 0.1mm (as shown in fig. 5 (b)), so that the layered focusing sound field distortion caused by the superposition of the sound beams of each array element is effectively avoided, the excitation delay of two groups of array elements is 500ns, the formed focusing sound field has accurate focal position, concentrated focal region energy, uniform sound field distribution and less sound pressure leakage, and has good detection sensitivity and resolution, and the focusing range of the focusing sound field is expanded while the focal region energy of the focusing sound field with the target depth is ensured.
In the above embodiment, the two continuous focusing sound fields formed have a certain focal column height b and width a, as shown in fig. 5(b), for small-size defects, it is ensured that the target defect is within the range of the formed focal column, longitudinal information of the defect is detected by continuously changing the focusing depth is avoided, it is ensured that the phased array probe performs only one set of detection at one position to complete all acquisition of the longitudinal information of the defect, meanwhile, the certain focal column width improves the moving step of the phased array probe, reduces the number of moving steps for completing the overall detection of the workpiece, improves the defect detection efficiency on the premise of ensuring the defect detection sensitivity and resolution, and in order to ensure that there is no missing region between two adjacent defect detections, each time of the moving steps L of the phased array probe satisfies L ≤ a/2.
It should be noted that, in the above-described acoustic field control ultrasonic detection method based on the array element focusing rule in the embodiment, the mechanical drive scanning device is used to complete the acquisition of three-dimensional dynamic data, so that the high-precision rapid detection of a workpiece including two or more small-sized defects can be realized.
Example 2
According to another aspect of the embodiments of the present invention, there is also provided an apparatus for detecting defects of a workpiece, fig. 6 is a schematic view of the apparatus for detecting defects of a workpiece according to the embodiments of the present invention, as shown in fig. 6, the apparatus for detecting defects of a workpiece includes: a control unit 62, a first scanning unit 64, a judgment unit 66 and a second scanning unit 68. The apparatus for detecting a defect in a workpiece will be described in detail below.
The control unit 62 is used for controlling the phased array probe to be positioned at the initial detection position of the workpiece; the first scanning unit 64 is connected to the control unit 62 and is used for performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; a determining unit 66, connected to the first scanning unit 64, for determining whether the workpiece within the detection range has a defect according to the scanning result; and a second scanning unit 68, connected to the judging unit 66, for determining a defect position of the workpiece according to the scanning result if the workpiece has a defect, and performing depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
It should be noted that the above units can be implemented by software or hardware, for example, for the latter, the following manner can be implemented: the units may be located in the same processor; and/or the units may be located in different processors in any combination.
In the above embodiment, the device for detecting defects of a workpiece can preliminarily obtain the positions of the defects through one-dimensional linear scanning of the phased array probe, then perform dynamic depth focusing scanning to realize depth focusing of the target position, obtain corresponding detection images, and achieve the purpose of realizing high-precision rapid detection of workpieces with more than two small-size defects, thereby achieving the technical effects of reducing detection workload and improving detection efficiency, further solving the technical problems that in the related art, the workpieces with larger thickness need to be scanned repeatedly for several times to complete detection, so that the detection workload is large, and the efficiency is low
It should be noted here that the control unit 62, the first scanning unit 64, the judging unit 66, and the second scanning unit 68 correspond to steps S102 to S108 in embodiment 1, and the modules are the same as the corresponding steps in the implementation example and application scenario, but are not limited to the disclosure in embodiment 1.
Optionally, the apparatus further comprises: and the processing unit is used for controlling the phased array probe to translate to the next detection position of the workpiece if the workpiece has no defects or after a detection image of the defect position of the workpiece is obtained, and performing one-dimensional linear scanning on the next detection position in the detection range by the phased array probe until the whole detection of the workpiece is completed, wherein each translation step of the phased array probe is less than or equal to half of the width of a focal column of a focusing sound field formed by the last dynamic depth focusing scanning.
Optionally, the second scanning unit 68 includes: and the focusing subunit is used for controlling the focusing depth and/or the deflection angle of the sound beam by adjusting the excitation time of the array element combination of the phased array probe, and forming two continuous focusing sound fields at the defect position, wherein the two continuous focusing sound fields have preset focal column height and width so as to enable the target defect to be in the focal column range.
Optionally, the array element combination of the phased array probe at least comprises: the array comprises a first array element and a second array element, wherein the number of the first array element and the second array element is 16, and the excitation delay of the first array element and the second array element is 500 ns.
Optionally, the focusing pitch of two successive focused sound fields is 0.1 mm.
Example 3
According to another aspect of the embodiments of the present invention, there is also provided a computer-readable storage medium, which includes a stored program, wherein when the program runs, the apparatus where the computer-readable storage medium is located is controlled to execute the method for detecting the workpiece defect in any one of the above.
Optionally, in this embodiment, the computer-readable storage medium may be located in any one of a group of computer terminals in a computer network and/or in any one of a group of mobile terminals, and the computer-readable storage medium includes a stored program.
Optionally, the program when executed controls an apparatus in which the computer-readable storage medium is located to perform the following functions: controlling the phased array probe to be located at the initial detection position of the workpiece; performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; judging whether the workpiece in the detection range has defects or not according to the scanning result; and if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and performing depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
Example 4
According to another aspect of the embodiments of the present invention, there is also provided a processor for executing a program, wherein the program executes the method for detecting the workpiece defect of any one of the above.
The embodiment of the invention provides equipment, which comprises a processor, a memory and a program which is stored on the memory and can run on the processor, wherein the processor executes the program and realizes the following steps: controlling the phased array probe to be located at the initial detection position of the workpiece; performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; judging whether the workpiece in the detection range has defects or not according to the scanning result; and if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and performing depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
The invention also provides a computer program product adapted to perform a program for initializing the following method steps when executed on a data processing device: controlling the phased array probe to be located at the initial detection position of the workpiece; performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result; judging whether the workpiece in the detection range has defects or not according to the scanning result; and if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and performing depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
Example 5
According to another aspect of the embodiments of the present invention, there is also provided a detection system, including: the system comprises a control center, a phased array probe and a teaching center, wherein the control center is in communication connection with the phased array probe and the teaching center respectively, and the phased array probe is also in communication connection with the teaching center; a control center for executing the method for detecting the workpiece defect; the phased array probe is used for detecting internal defects of the workpiece; and the teaching center is used for displaying the defect detection result.
FIG. 7 is a schematic diagram of an inspection system according to an alternative embodiment of the present invention, which may include a control center, a phased array probe, and a teaching center, as shown in FIG. 7. In a specific implementation process, the control center can further comprise a delay control module, a signal receiving module and a detection control module, wherein the delay control module is used for controlling a chip in the phased array probe through array element delay excitation based on an array element focusing rule to complete one-dimensional linear scanning and adjustment of the focusing depth and the deflection angle of the acoustic beam; the signal receiving module is used for receiving a one-dimensional linear scanning result; the detection control module is used for controlling the ultrasonic emission and the ultrasonic receiving in the detection process. The phased array probe is used for detecting internal defects of the workpiece. The teaching center is used for displaying a defect detection result and is combined with the phased array probe to finish the high-precision rapid detection of small-size defects of the workpiece.
Example 6
According to another aspect of the embodiment of the invention, a rail vehicle is further provided, and the rail vehicle adopts the detection system.
In an alternative embodiment, the inspection system can be used for defect inspection of a plurality of different types of workpieces of a rail vehicle, for example, workpieces such as body steel plates, running gear parts, etc. of a rail vehicle.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
In the above embodiments of the present invention, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the embodiments provided in the present application, it should be understood that the disclosed technology can be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units may be a logical division, and in actual implementation, there may be another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, units or modules, and may be in an electrical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A method of detecting defects in a workpiece, comprising:
controlling the phased array probe to be located at the initial detection position of the workpiece;
performing one-dimensional linear scanning on the initial detection position of the workpiece within the detection range to obtain a scanning result;
judging whether the workpiece in the detection range has defects or not according to the scanning result;
if the workpiece has defects, determining the defect position of the workpiece according to the scanning result, and then carrying out depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
2. The method of claim 1, further comprising:
if the workpiece has no defect, or after a detection image of the defect position of the workpiece is obtained, controlling the phased array probe to translate to the next detection position of the workpiece, and performing one-dimensional linear scanning on the next detection position in the detection range by the phased array probe until the whole detection of the workpiece is completed, wherein each translation step of the phased array probe is less than or equal to half of the width of a focal column of a focusing sound field formed by the last dynamic depth focusing scanning.
3. The method of claim 1, wherein depth focusing the defect location of the workpiece by dynamic depth focus scanning comprises:
and controlling the focusing depth and/or deflection angle of the sound beam by adjusting the excitation time of the array element combination of the phased array probe, and forming two continuous focusing sound fields at the position of the defect, wherein the two continuous focusing sound fields have preset focal column height and width so that the target defect is in the range of the focal column.
4. The method of claim 3, wherein the array element combination of the phased array probe comprises at least: the array comprises a first array element and a second array element, wherein the number of the first array element and the second array element is 16, and the excitation delay of the first array element and the second array element is 500 ns.
5. A method according to claim 3, wherein the two successive focused sound fields have a focusing pitch of 0.1 mm.
6. An apparatus for detecting defects in a workpiece, comprising:
the control unit is used for controlling the phased array probe to be positioned at the initial detection position of the workpiece;
the first scanning unit is used for performing one-dimensional linear scanning on the initial detection position of the workpiece in the detection range to obtain a scanning result;
the judging unit is used for judging whether the workpiece in the detection range has defects or not according to the scanning result;
and the second scanning unit is used for determining the defect position of the workpiece according to the scanning result if the workpiece has defects, and then carrying out depth focusing on the defect position of the workpiece through dynamic depth focusing scanning to obtain a detection image of the defect position of the workpiece.
7. A computer-readable storage medium, comprising a stored program, wherein the program, when executed, controls an apparatus in which the computer-readable storage medium is located to perform the method for detecting workpiece defects according to any one of claims 1 to 5.
8. A processor, characterized in that the processor is configured to run a program, wherein the program is configured to execute the method of workpiece defect detection according to any one of claims 1 to 5 when running.
9. A detection system, characterized in that the system comprises: the system comprises a control center, a phased array probe and a teaching center;
the control center is used for executing the workpiece defect detection method of any one of claims 1 to 5;
the phased array probe is used for detecting internal defects of the workpiece;
and the teaching center is used for displaying the defect detection result.
10. A rail vehicle, characterized in that it employs a detection system as claimed in claim 9.
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