CN113355662A - 一种用化学镀方法制备的导电布及其制备方法 - Google Patents
一种用化学镀方法制备的导电布及其制备方法 Download PDFInfo
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- 239000004744 fabric Substances 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000007747 plating Methods 0.000 title claims abstract description 41
- 239000000126 substance Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 107
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 52
- 238000009713 electroplating Methods 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims abstract description 6
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- 238000005406 washing Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 238000001035 drying Methods 0.000 claims abstract description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 11
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 10
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 10
- 239000012286 potassium permanganate Substances 0.000 claims description 10
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 8
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 7
- 206010070834 Sensitisation Diseases 0.000 claims description 7
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 7
- 230000008313 sensitization Effects 0.000 claims description 7
- 239000001119 stannous chloride Substances 0.000 claims description 7
- 235000011150 stannous chloride Nutrition 0.000 claims description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004327 boric acid Substances 0.000 claims description 6
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 6
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 230000003213 activating effect Effects 0.000 claims description 5
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 4
- 235000019270 ammonium chloride Nutrition 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 239000011265 semifinished product Substances 0.000 claims description 4
- 230000001235 sensitizing effect Effects 0.000 claims description 4
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 4
- 239000001509 sodium citrate Substances 0.000 claims description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 4
- 229920004933 Terylene® Polymers 0.000 claims description 2
- 238000007788 roughening Methods 0.000 claims 2
- 238000002791 soaking Methods 0.000 claims 2
- 238000007772 electroless plating Methods 0.000 claims 1
- 239000002351 wastewater Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 230000006870 function Effects 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 230000004913 activation Effects 0.000 description 6
- 230000003197 catalytic effect Effects 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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Abstract
一种用化学镀方法制备的导电布及其制备方法，所述导电布：电阻≤1.5Ω、屏蔽效能≥65db、耐蚀性能≥72h、附着力1‑2级。本发明还包括所述导电布的制备方法，其工艺路线为：将基布用化学镀方法沉积一层金属镍，再将沉积了金属镍的基布电镀镍，电镀结束后，水洗，烘干。本发明具有以下优点：可以实现超高目数和超厚产品的制备；产品镀层均匀，一致性高；产品镀层结合力高；减少电镀铜工艺，完全消除了含铜废水，工艺简单，节约了成本。
Description
技术领域
本发明涉及一种用化学镀方法制备的导电布及其制备方法。
背景技术
现有市场上的导电布一般是采用化学镀镍、电镀铜、电镀镍的工艺路线得以实现，此方法工艺程序复杂，实现路径复杂，产生的重金属废水较多，且因电镀铜的废水里含有大量磷，导致废水处理成本高昂，进而导致整体生产成本高。
发明内容
本发明所要解决的技术问题是，针对现有技术的不足，提供一种制备工艺简便、成本低、废水量少、产品合格率大幅度提升的用化学镀方法制备的导电布及其制备方法。
本发明解决其技术问题所采用的技术方案是：
本发明之用化学镀方法制备的导电布，电阻≤1.5Ω(优选≤1.0Ω，更优选≤0.3Ω)、屏蔽效能≥65db(优选≥70db)、耐蚀性能≥72h、附着力1-2级。
本发明之导电布的制备方法，其工艺路线为：将基布用化学镀方法沉积一层金属镍，再将沉积了金属镍的基布电镀镍，电镀结束后，水洗，烘干。
进一步，所述基布包括聚氨酯、涤纶或PET等基布。将基布裁切至镀膜设备所需的宽度，该宽度范围是500-1500mm。该基布的厚度为0.005-0.5mm，该基布的密度范围为80-500目或120T-500T。
进一步，所述基布用化学镀方法沉积一层金属镍是指将基布经粗化、清洗、敏化、活化、化学镀镍，使其沉积一层金属镍。
进一步，所述粗化是指将基布在高锰酸钾浓度为0.4-1.0g/L、pH为2-3、温度为25-35℃的溶液中经过对辊机挤压后再在溶液中浸泡1-4分钟。粗化的作用是通过高锰酸钾溶液腐蚀基布表面，使其表面粗糙，增加基布表面积，提高基布与化学镀镍层的结合力。
进一步，所述清洗是指将粗化后的基布在草酸浓度10-20g/L、温度为40-50℃的溶液中经过对辊机挤压后再在溶液中浸泡1-3分钟。清洗的作用是除掉在粗化过程残留在基布上的高锰酸钾溶液。
进一步，所述敏化是指将清洗后的基布在氯化亚锡浓度为10-20g/L、pH为1.5-2.0、温度为40-50℃的溶液中经过对辊机挤压后再在溶液中浸泡1-4分钟。敏化的作用是利用氯化亚锡溶液在经过清洗后的基布表面形成一层具有还原作用的还原液体膜。
进一步，所述活化是指将敏化后的基布在氯化钯浓度为20-30g/L、pH为1.6-2.2、温度为40-50℃的溶液中经过对辊机挤压后再在溶液中浸泡1-4分钟。活化的作用是在基布的表面吸附一层具有催化活性的贵金属钯，作为化学镀镍的催化中心，使化学镀的还原反应可以在基布表面迅速均匀的进行。
进一步，所述化学镀镍是指将活化后的基布在硫酸镍浓度为20-30g/L、次磷酸钠浓度为22-30g/L、氯化铵浓度为25-35g/L、柠檬酸钠浓度为55-65g/L、pH为8-9、温度为35-50℃的溶液中反应2-3分钟。
进一步，所述电镀镍是指将上述经过化学镀镍的半成品置于电镀镍槽，进行电镀镍工序。该电镀镍工序包括以下两种工艺方法：
(1)采用氨基磺酸镍溶液体系，该体系的技术参数包括：氨基磺酸镍浓度为200-600g/L、氯化镍浓度为0-50g/L、硼酸浓度为10-60g/L、pH为3-6、温度为30-70℃、电流为50-500A；
(2)采用硫酸镍溶液体系，该体系的技术参数包括：硫酸镍浓度为100-400g/L、氯化镍浓度为10-70g/L、硼酸浓度为10-60g/L、pH为3-6、温度为30-70℃、电流为50-500A。
本发明之导电布，具有以下优点：产品镀层均匀，一致性高；产品镀层结合力高；产品电阻、屏蔽效能、耐腐蚀性能可满足市场要求，成本较低。
本发明之导电布的制备方法，具有以下优点：
1、可以实现超高目数和超厚产品的制备；
2、减少电镀铜工艺，完全消除了含铜废水，工艺简单，节约了成本。
具体实施方式
以下结合实施例对本发明作进一步说明。
实施例1
一种制备导电布的方法，将基布用化学镀方法沉积一层金属镍，再将沉积了金属镍的基布电镀镍，电镀结束后，水洗，烘干。
本实施例中，所述基布包括聚氨酯、涤纶或PET等基布。将基布裁切至镀膜设备所需的宽度，该宽度范围是1050mm。该基布的厚度为0.2mm，该基布的密度范围为300T。
本实施例中，所述基布用化学镀方法沉积一层金属镍是指将基布经粗化、清洗、敏化、活化、化学镀镍，使其沉积一层金属镍。
本实施例中，所述粗化是指将基布在高锰酸钾浓度为0.8g/L、pH为2.6、温度为30℃的溶液中经过对辊机挤压后再在溶液中浸泡3分钟。粗化的作用是通过高锰酸钾溶液腐蚀基布表面，使其表面粗糙，增加基布表面积，提高基布与化学镀镍层的结合力。
本实施例中，所述清洗是指将粗化后的基布在草酸浓度18g/L、温度为42℃的溶液中经过对辊机挤压后再在溶液中浸泡2分钟。清洗的作用是除掉在粗化过程残留在基布上的高锰酸钾溶液。
本实施例中，所述敏化是指将清洗后的基布在氯化亚锡浓度为15g/L、pH为1.8、温度为45℃的溶液中经过对辊机挤压后再在溶液中浸泡3分钟。敏化的作用是利用氯化亚锡溶液在经过清洗后的基布表面形成一层具有还原作用的还原液体膜。
本实施例中，所述活化是指将敏化后的基布在氯化钯浓度为27g/L、pH为1.7、温度为47℃的溶液中经过对辊机挤压后再在溶液中浸泡3分钟。活化的作用是在基布的表面吸附一层具有催化活性的贵金属钯，作为化学镀镍的催化中心，使化学镀的还原反应可以在基布表面迅速均匀的进行。
本实施例中，所述化学镀镍是指将活化后的基布在硫酸镍浓度为28g/L、次磷酸钠浓度为25g/L、氯化铵浓度为30g/L、柠檬酸钠浓度为58g/L、pH为8.8、温度为48℃的溶液中反应3分钟。
本实施例中，所述电镀镍是指将上述经过化学镀镍的半成品置于电镀镍槽，进行电镀镍工序。该电镀镍工序为以下工艺方法：
采用氨基磺酸镍溶液体系，该体系的技术参数包括：氨基磺酸镍浓度为300g/L、氯化镍浓度为30g/L、硼酸浓度为30g/L、pH为4.8、温度为48℃、电流为300A。
本实施例制备的导电布能满足市场要求，成本较低，相关性能参数见表1。
表1
| 电阻 | 屏蔽效能 | 耐蚀性能 | 附着力测试 | |
| 本例导电布 | ≤0.3Ω | ≥70db | ≥72h | 2级 |
实施例2
一种制备导电布的方法，将基布用化学镀方法沉积一层金属镍，再将沉积了金属镍的基布电镀镍，电镀结束后，水洗，烘干。
本实施例中，所述基布包括聚氨酯、涤纶或PET等基布。将基布裁切至镀膜设备所需的宽度，该宽度范围是1060mm。该基布的厚度为0.3mm，该基布的密度范围为230T。
本实施例中，所述基布用化学镀方法沉积一层金属镍是指将基布经粗化、清洗、敏化、活化、化学镀镍，使其沉积一层金属镍。
本实施例中，所述粗化是指将基布在高锰酸钾浓度为0.8g/L、pH为2.5、温度为30℃的溶液中经过对辊机挤压后再在溶液中浸泡2分钟。粗化的作用是通过高锰酸钾溶液腐蚀基布表面，使其表面粗糙，增加基布表面积，提高基布与化学镀镍层的结合力。
本实施例中，所述清洗是指将粗化后的基布在草酸浓度20g/L、温度为45℃的溶液中经过对辊机挤压后再在溶液中浸泡2分钟。清洗的作用是除掉在粗化过程残留在基布上的高锰酸钾溶液。
本实施例中，所述敏化是指将清洗后的基布在氯化亚锡浓度为15g/L、pH为1.8、温度为45℃的溶液中经过对辊机挤压后再在溶液中浸泡3分钟。敏化的作用是利用氯化亚锡溶液在经过清洗后的基布表面形成一层具有还原作用的还原液体膜。
本实施例中，所述活化是指将敏化后的基布在氯化钯浓度为27g/L、pH为1.7、温度为47℃的溶液中经过对辊机挤压后再在溶液中浸泡3分钟。活化的作用是在基布的表面吸附一层具有催化活性的贵金属钯，作为化学镀镍的催化中心，使化学镀的还原反应可以在基布表面迅速均匀的进行。
本实施例中，所述化学镀镍是指将活化后的基布在硫酸镍浓度为28g/L、次磷酸钠浓度为25g/L、氯化铵浓度为30g/L、柠檬酸钠浓度为58g/L、pH为8.8、温度为48℃的溶液中反应3分钟。
本实施例中，所述电镀镍是指将上述经过化学镀镍的半成品置于电镀镍槽，进行电镀镍工序。该镀镍工序为以下工艺方法：
采用硫酸镍溶液体系，该体系的技术参数包括：硫酸镍浓度为300g/L、氯化镍浓度为35g/L、硼酸浓度为30g/L、pH为5.1、温度为50℃、电流为200A。
本实施例制备的导电布能满足市场要求，成本较低，相关性能参数见表2。
表2
| 电阻 | 屏蔽效能 | 耐蚀性能 | 附着力测试 | |
| 本例导电布 | ≤0.4Ω | ≥65db | ≥72h | 1级 |
Claims (10)
1.一种用化学镀方法制备的导电布，其特征在于：电阻≤1.5Ω、屏蔽效能≥65db、耐蚀性能≥72h、附着力1-2级。
2.一种如权利要求1所述的导电布的制备方法，其特征在于，其工艺路线为：将基布用化学镀方法沉积一层金属镍，再将沉积了金属镍的基布电镀镍，电镀结束后，水洗，烘干。
3.根据权利要求2所述的导电布的制备方法，其特征在于，所述基布包括聚氨酯、涤纶或PET基布，将基布裁切至镀膜设备所需的宽度，该宽度范围是500-1500mm，该基布的厚度为0.005-0.5mm，该基布的密度范围为80-500目或120T-500T。
4.根据权利要求2所述的导电布的制备方法，其特征在于，所述基布用化学镀方法沉积一层金属镍是指将基布经粗化、清洗、敏化、活化、化学镀镍，使其沉积一层金属镍。
5.根据权利要求4所述的导电布的制备方法，其特征在于，所述粗化是指将基布在高锰酸钾浓度为0.4-1.0g/L、pH为2-3、温度为25-35℃的溶液中经过对辊机挤压后再在溶液中浸泡1-4分钟。
6.根据权利要求4所述的导电布的制备方法，其特征在于，所述清洗是指将粗化后的基布在草酸浓度10-20g/L、温度为40-50℃的溶液中经过对辊机挤压后再在溶液中浸泡1-3分钟。
7.根据权利要求4所述的导电布的制备方法，其特征在于，所述敏化是指将清洗后的基布在氯化亚锡浓度为10-20g/L、pH为1.5-2.0、温度为40-50℃的溶液中经过对辊机挤压后再在溶液中浸泡1-4分钟。
8.根据权利要求4所述的导电布的制备方法，其特征在于，所述活化是指将敏化后的基布在氯化钯浓度为20-30g/L、pH为1.6-2.2、温度为40-50℃的溶液中经过对辊机挤压后再在溶液中浸泡1-4分钟。
9.根据权利要求4所述的导电布的制备方法，其特征在于，所述化学镀镍是指将活化后的基布在硫酸镍浓度为20-30g/L、次磷酸钠浓度为22-30g/L、氯化铵浓度为25-35g/L、柠檬酸钠浓度为55-65g/L、pH为8-9、温度为35-50℃的溶液中反应2-3分钟。
10.根据权利要求2所述的导电布的制备方法，其特征在于，所述电镀镍是指将上述经过化学镀镍的半成品置于电镀镍槽，进行电镀镍工序，该电镀镍工序包括以下两种工艺方法：
(1)采用氨基磺酸镍溶液体系，该体系的技术参数包括：氨基磺酸镍浓度为200-600g/L、氯化镍浓度为0-50g/L、硼酸浓度为10-60g/L、pH为3-6、温度为30-70℃、电流为50-500A；
(2)采用硫酸镍溶液体系，该体系的技术参数包括：硫酸镍浓度为100-400g/L、氯化镍浓度为10-70g/L、硼酸浓度为10-60g/L、pH为3-6、温度为30-70℃、电流为50-500A。
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