CN111501031A - 镍钯金与化镍金并用设备及其控制方法 - Google Patents
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- 239000010931 gold Substances 0.000 title claims abstract description 58
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000002844 melting Methods 0.000 title claims abstract description 10
- 230000008018 melting Effects 0.000 title claims abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 38
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000012546 transfer Methods 0.000 claims abstract description 22
- 238000002791 soaking Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 13
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 12
- 230000004913 activation Effects 0.000 claims abstract description 11
- 238000010309 melting process Methods 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 23
- 238000005406 washing Methods 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000005238 degreasing Methods 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 238000011084 recovery Methods 0.000 claims description 4
- 239000003814 drug Substances 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000004065 wastewater treatment Methods 0.000 abstract description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1632—Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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Abstract
本发明属于线路板制造技术领域,涉及一种镍钯金与化镍金并用设备及其控制方法,设备包括线形的线路板挂架的转运装置,以及在转运装置下方沿着运输方向依次设置的预浸槽、活化槽、第一水洗槽、后浸槽、第二水洗槽、化镍槽、第三水洗槽、钯槽、第四水洗槽和第一金槽,所述转运装置可被控制进入各个槽的顺序;控制方法为转运装置以镍钯金和化镍金两种制程为区分,分别按序浸入所需的槽内。本设备让镍钯金和化镍金制程的大多数槽体共用,并且能切换两种工作状态,节省了设备投入,提高了设备稼动率,并大幅度减少公司药水、清洁用水、电、人工、废水处理等成本支出。
Description
技术领域
本发明涉及线路板制造技术领域,特别涉及一种镍钯金与化镍金并用设备及其控制方法。
背景技术
化学镍金(Electroless Nickel/Immersion Gold,简写为ENIG,又称化镍金、沉镍金或者无电镍金)是通过化学反应在铜的表面置换钯再在钯核的基础上化学镀上一层镍磷合金层,然后再通过置换反应在镍的表面镀上一层金。
镍钯金(Electroless Nickel Immersion Palladium Immersion Gold,简写为ENIPIG)则是在镍层和金层之间沉上一层钯,能防止镍和金之间的相互迁移,不会出现黑PAD,具有打线结合能力,焊点可靠度好,能耐多次回流焊和有优良耐储存时间等,能对应和满足多种不同组装要求。
以上两种制程以往在设备上无法通用,虽镍钯金线通过程序变更也可生产化镍金板,但镍钯金线金槽药水成本与化镍金线所需金槽药水成本差异巨大,比较如下:
目前市场上镍钯金均为单一独立生产,镍钯金线主要生产摄像模块系列料号,产能暂无满载,设备稼动率约30%左右,造成生产力的浪费。
因此,有必要提供一种新结构的设备来解决上述问题。
发明内容
本发明的主要目的在于提供一种镍钯金与化镍金并用设备及其控制方法,能够切换镍钯金与化镍金两种制程制程,节省了设备投入。
本发明通过如下技术方案实现上述目的:一种镍钯金与化镍金并用设备,包括线形的线路板挂架的转运装置,以及在转运装置下方沿着运输方向依次设置的预浸槽、活化槽、第一水洗槽、后浸槽、第二水洗槽、化镍槽、第三水洗槽、钯槽、第四水洗槽、第一金槽和第二金槽,所述转运装置可被控制进入各个槽的顺序。
具体的,所述第二金槽后还设有金回收槽和第五水洗槽。
具体的,所述预浸槽的前端还设有依次连接的微蚀槽、第七水洗槽、酸洗槽和第八水洗槽。
进一步的,所述微蚀槽的前端还设有依次连接的脱脂槽、热水洗槽和第六水洗槽。
一种镍钯金与化镍金并用设备的控制方法:当本设备进行镍钯金制程时,转运装置携带线路板挂架依次浸入预浸槽、活化槽、第一水洗槽、后浸槽、第二水洗槽、化镍槽、第三水洗槽、钯槽、第四水洗槽和第一金槽;当本设备进行化镍金制程时,转运装置携带线路板挂架依次浸入预浸槽、活化槽、第一水洗槽、化镍槽、第三水洗槽和第二金槽。
采用上述技术方案有益效果是:
本设备让镍钯金和化镍金制程的大多数槽体共用,并且能切换两种工作状态,节省了设备投入,并大幅度减少公司药水、清洁用水、电、人工、废水处理等成本支出。
附图说明
图1为镍钯金与化镍金并用设备的管路图;
图2为镍钯金与化镍金并用设备两种工作模式的流程示意图。
图中数字表示:
1-转运装置;2-预浸槽;3-活化槽;4a-第一水洗槽,4b-第二水洗槽,4c-第三水洗槽,4d-第四水洗槽,4e-第五水洗槽,4f-第六水洗槽,4g-第七水洗槽,4h-第八水洗槽;5-后浸槽;6-化镍槽;7-钯槽;8a-第一金槽,8b-第二金槽;9-金回收槽;10-脱脂槽;11-热水洗槽;12-微蚀槽;13-酸洗槽。
具体实施方式
下面结合具体实施例对本发明作进一步详细说明。
实施例:
如图1和图2所示,本发明为一种镍钯金与化镍金并用设备,包括线形的线路板挂架的转运装置1,以及在转运装置1下方沿着运输方向依次设置的预浸槽2、活化槽3、第一水洗槽4a、后浸槽5、第二水洗槽4b、化镍槽6、第三水洗槽4c、钯槽7、第四水洗槽4d、第一金槽8a和第二金槽8b,转运装置1可被控制进入各个槽的顺序。转运装置1携带装有线路板板材的线路板挂架沿着一个方向运行。因为镍钯金制程与化镍金制程都会用到预浸槽2、活化槽3、第一水洗槽4a、化镍槽6和第三水洗槽4c,所以可进行并用,以减少设备投入。当本设备进行镍钯金制程时,转运装置1携带线路板挂架依次浸入预浸槽2、活化槽3、第一水洗槽4a、后浸槽5、第二水洗槽4b、化镍槽6、第三水洗槽4c、钯槽7、第四水洗槽4d和第一金槽8a,如图2中的粗箭头所示;当本设备进行化镍金制程时,转运装置1携带线路板挂架依次浸入预浸槽2、活化槽3、第一水洗槽4a、化镍槽6、第三水洗槽4c和第二金槽8b,相比上一制程的区别如图2中的细箭头所示。这使得一个设备能切换两种工作状态,节省了设备投入。转运装置1本身就有程序控制,本设备只是对程序做相应修改,以符合镍钯金制程与化镍金制程的工作顺序,不存在实现难点。新流程的周期时间上面可进行有效优化,从镍钯金周期21.5min/挂,缩短至化镍金10min/挂,将设备稼动率提升至100%,大幅度减少公司药水、清洁用水、电、人工、废水处理等成本支出。
如图1和图2所示,第二金槽8b后还设有金回收槽9和第五水洗槽4e。这样不管化镍金制程还是镍钯金制程,最后都可以直接将多余的金回收,减少金的浪费和排放的污染。
如图1和图2所示,预浸槽2的前端还设有依次连接的微蚀槽12、第七水洗槽4g、酸洗槽13和第八水洗槽4h。以上部分是对板面进行表面处理,使板材表面更容易反应。
如图1和图2所示,微蚀槽12的前端还设有依次连接的脱脂槽10、热水洗槽11和第六水洗槽4f。以上部分是对板面进行清洁,以免脏污影响产品质量。
以上所述的仅是本发明的一些实施方式。对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。
Claims (5)
1.一种镍钯金与化镍金并用设备,其特征在于:包括线形的线路板挂架的转运装置,以及在转运装置下方沿着运输方向依次设置的预浸槽、活化槽、第一水洗槽、后浸槽、第二水洗槽、化镍槽、第三水洗槽、钯槽、第四水洗槽、第一金槽和第二金槽,所述转运装置可被控制进入各个槽的顺序。
2.根据权利要求1所述的镍钯金与化镍金并用设备,其特征在于:所述第二金槽后还设有金回收槽和第五水洗槽。
3.根据权利要求1所述的镍钯金与化镍金并用设备,其特征在于:所述预浸槽的前端还设有依次连接的微蚀槽、第七水洗槽、酸洗槽和第八水洗槽。
4.根据权利要求3所述的镍钯金与化镍金并用设备,其特征在于:所述微蚀槽的前端还设有依次连接的脱脂槽、热水洗槽和第六水洗槽。
5.一种关于权利要求1~4任一所述镍钯金与化镍金并用设备的控制方法,其特征在于:当本设备进行镍钯金制程时,转运装置携带线路板挂架依次浸入预浸槽、活化槽、第一水洗槽、后浸槽、第二水洗槽、化镍槽、第三水洗槽、钯槽、第四水洗槽和第一金槽;当本设备进行化镍金制程时,转运装置携带线路板挂架依次浸入预浸槽、活化槽、第一水洗槽、化镍槽、第三水洗槽和第二金槽。
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CN110318042A (zh) * | 2019-06-18 | 2019-10-11 | 深圳市松柏实业发展有限公司 | 水平化镍金流水线及化镍金方法 |
CN212610896U (zh) * | 2020-04-26 | 2021-02-26 | 柏承科技(昆山)股份有限公司 | 镍钯金与化镍金并用设备 |
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CN115404467A (zh) * | 2022-09-02 | 2022-11-29 | 江苏芯梦半导体设备有限公司 | 全自动化学镀系统及化学镀方法 |
CN115404467B (zh) * | 2022-09-02 | 2024-01-09 | 江苏芯梦半导体设备有限公司 | 全自动化学镀系统及化学镀方法 |
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