CN113330134B - 蒸镀掩模和蒸镀掩模的制造方法 - Google Patents

蒸镀掩模和蒸镀掩模的制造方法 Download PDF

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Publication number
CN113330134B
CN113330134B CN201980089786.XA CN201980089786A CN113330134B CN 113330134 B CN113330134 B CN 113330134B CN 201980089786 A CN201980089786 A CN 201980089786A CN 113330134 B CN113330134 B CN 113330134B
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China
Prior art keywords
vapor deposition
mask
holding frame
deposition mask
mask body
Prior art date
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Active
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CN201980089786.XA
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English (en)
Chinese (zh)
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CN113330134A (zh
Inventor
松本优子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Magno Haote Co ltd
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Japan Display Inc
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Publication of CN113330134A publication Critical patent/CN113330134A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201980089786.XA 2019-01-31 2019-10-31 蒸镀掩模和蒸镀掩模的制造方法 Active CN113330134B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019016362A JP7332301B2 (ja) 2019-01-31 2019-01-31 蒸着マスク及び蒸着マスクの製造方法
JP2019-016362 2019-01-31
PCT/JP2019/042845 WO2020158082A1 (ja) 2019-01-31 2019-10-31 蒸着マスク及び蒸着マスクの製造方法

Publications (2)

Publication Number Publication Date
CN113330134A CN113330134A (zh) 2021-08-31
CN113330134B true CN113330134B (zh) 2024-01-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980089786.XA Active CN113330134B (zh) 2019-01-31 2019-10-31 蒸镀掩模和蒸镀掩模的制造方法

Country Status (3)

Country Link
JP (1) JP7332301B2 (enrdf_load_stackoverflow)
CN (1) CN113330134B (enrdf_load_stackoverflow)
WO (1) WO2020158082A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102796671B1 (ko) * 2021-06-30 2025-04-18 가부시키가이샤 재팬 디스프레이 증착 마스크

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349086A (ja) * 2003-05-21 2004-12-09 Kyushu Hitachi Maxell Ltd 有機ｅｌ素子用の蒸着マスクとその製造方法
CN109072411A (zh) * 2016-02-10 2018-12-21 鸿海精密工业股份有限公司 蒸镀掩模的制造方法、蒸镀掩模及有机半导体元件的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196243A (ja) * 1998-12-28 2000-07-14 Fujitsu Ltd フレキシブル多層回路基板の製造方法
JP2003107723A (ja) * 2001-09-25 2003-04-09 Eastman Kodak Co メタルマスクの製造方法およびメタルマスク
US8698303B2 (en) * 2010-11-23 2014-04-15 Ibiden Co., Ltd. Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
JP6330377B2 (ja) * 2014-03-06 2018-05-30 大日本印刷株式会社 基板付蒸着マスク装置の製造方法、基板付蒸着マスクおよびレジストパターン付基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004349086A (ja) * 2003-05-21 2004-12-09 Kyushu Hitachi Maxell Ltd 有機ｅｌ素子用の蒸着マスクとその製造方法
CN109072411A (zh) * 2016-02-10 2018-12-21 鸿海精密工业股份有限公司 蒸镀掩模的制造方法、蒸镀掩模及有机半导体元件的制造方法

Also Published As

Publication number Publication date
JP2020122208A (ja) 2020-08-13
CN113330134A (zh) 2021-08-31
JP7332301B2 (ja) 2023-08-23
WO2020158082A1 (ja) 2020-08-06

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Effective date of registration: 20250725

Address after: Tokyo, Japan

Patentee after: Magno Haote Co.,Ltd.

Country or region after: Japan

Address before: Tokyo, Japan

Patentee before: JAPAN DISPLAY Inc.

Country or region before: Japan