WO2020158082A1 - 蒸着マスク及び蒸着マスクの製造方法 - Google Patents
蒸着マスク及び蒸着マスクの製造方法 Download PDFInfo
- Publication number
- WO2020158082A1 WO2020158082A1 PCT/JP2019/042845 JP2019042845W WO2020158082A1 WO 2020158082 A1 WO2020158082 A1 WO 2020158082A1 JP 2019042845 W JP2019042845 W JP 2019042845W WO 2020158082 A1 WO2020158082 A1 WO 2020158082A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- vapor deposition
- deposition mask
- holding frame
- manufacturing
- mask body
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Definitions
- the vapor deposition chamber 100 has a configuration capable of accommodating an object on which a vapor deposition film is formed.
- the vapor deposition source 112 is disposed below the vapor deposition substrate 104.
- the vapor deposition source 112 has a substantially rectangular shape, and is arranged along one side of the vapor deposition substrate 104.
- Such an evaporation source 112 is called a linear source type.
- the vapor deposition chamber 100 has a structure in which the vapor deposition substrate 104 and the vapor deposition source 112 move relative to each other.
- FIG. 1 shows an example in which the vapor deposition source 112 is fixed and the vapor deposition target substrate 104 moves on it.
- the present invention is not limited to this, and for example, when the peeling layer 430 is not formed, a plating layer is formed on the substrate 410 exposed from the first insulating layer 450 and on the first insulating layer 450 by an electroless plating method,
- the mask body 310 may be formed by removing (lifting off) the plating layer formed on the first insulating layer 450 by peeling off the first insulating layer 450.
- the material of the mask body 310 is not particularly limited, but a magnetic material such as nickel (Ni) or nickel alloy can be used, and Invar having a small thermal expansion is particularly preferable.
- the thickness of the mask body 310 is preferably in the range of 5 ⁇ m or more and 10 ⁇ m or less.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980089786.XA CN113330134B (zh) | 2019-01-31 | 2019-10-31 | 蒸镀掩模和蒸镀掩模的制造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019016362A JP7332301B2 (ja) | 2019-01-31 | 2019-01-31 | 蒸着マスク及び蒸着マスクの製造方法 |
JP2019-016362 | 2019-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2020158082A1 true WO2020158082A1 (ja) | 2020-08-06 |
Family
ID=71840042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/042845 WO2020158082A1 (ja) | 2019-01-31 | 2019-10-31 | 蒸着マスク及び蒸着マスクの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7332301B2 (enrdf_load_stackoverflow) |
CN (1) | CN113330134B (enrdf_load_stackoverflow) |
WO (1) | WO2020158082A1 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115537720A (zh) * | 2021-06-30 | 2022-12-30 | 株式会社日本显示器 | 蒸镀掩模 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000196243A (ja) * | 1998-12-28 | 2000-07-14 | Fujitsu Ltd | フレキシブル多層回路基板の製造方法 |
JP2003107723A (ja) * | 2001-09-25 | 2003-04-09 | Eastman Kodak Co | メタルマスクの製造方法およびメタルマスク |
JP2004349086A (ja) * | 2003-05-21 | 2004-12-09 | Kyushu Hitachi Maxell Ltd | 有機el素子用の蒸着マスクとその製造方法 |
JP2012114431A (ja) * | 2010-11-23 | 2012-06-14 | Ibiden Co Ltd | 半導体搭載用基板、半導体装置及び半導体装置の製造方法 |
JP2015168848A (ja) * | 2014-03-06 | 2015-09-28 | 大日本印刷株式会社 | 基板付蒸着マスク装置の製造方法、基板付蒸着マスクおよびレジストパターン付基板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109072411B (zh) * | 2016-02-10 | 2021-04-06 | 鸿海精密工业股份有限公司 | 蒸镀掩模的制造方法、蒸镀掩模及有机半导体元件的制造方法 |
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2019
- 2019-01-31 JP JP2019016362A patent/JP7332301B2/ja active Active
- 2019-10-31 CN CN201980089786.XA patent/CN113330134B/zh active Active
- 2019-10-31 WO PCT/JP2019/042845 patent/WO2020158082A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000196243A (ja) * | 1998-12-28 | 2000-07-14 | Fujitsu Ltd | フレキシブル多層回路基板の製造方法 |
JP2003107723A (ja) * | 2001-09-25 | 2003-04-09 | Eastman Kodak Co | メタルマスクの製造方法およびメタルマスク |
JP2004349086A (ja) * | 2003-05-21 | 2004-12-09 | Kyushu Hitachi Maxell Ltd | 有機el素子用の蒸着マスクとその製造方法 |
JP2012114431A (ja) * | 2010-11-23 | 2012-06-14 | Ibiden Co Ltd | 半導体搭載用基板、半導体装置及び半導体装置の製造方法 |
JP2015168848A (ja) * | 2014-03-06 | 2015-09-28 | 大日本印刷株式会社 | 基板付蒸着マスク装置の製造方法、基板付蒸着マスクおよびレジストパターン付基板 |
Non-Patent Citations (1)
Title |
---|
KIMURA, KAORU: "Inorganic Adhesives", JOURNAL OF THE JAPAN WELDING SOCIETY, vol. 53, no. 2, 5 March 1984 (1984-03-05), pages 86 - 93, XP055726060 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115537720A (zh) * | 2021-06-30 | 2022-12-30 | 株式会社日本显示器 | 蒸镀掩模 |
CN115537720B (zh) * | 2021-06-30 | 2024-07-19 | 株式会社日本显示器 | 蒸镀掩模 |
Also Published As
Publication number | Publication date |
---|---|
JP2020122208A (ja) | 2020-08-13 |
CN113330134B (zh) | 2024-01-09 |
CN113330134A (zh) | 2021-08-31 |
JP7332301B2 (ja) | 2023-08-23 |
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