Disclosure of Invention
In order to solve the technical problem, the invention provides the power generation equipment which has high power generation efficiency and utilizes ocean temperature difference energy.
The power generation equipment using ocean thermal energy provided by the invention comprises: installing a shell; the semiconductor temperature difference power generation mechanism is connected with the mounting shell; the hot end of the semiconductor temperature difference power generation mechanism is connected with a hot end heat-conducting plate, and the cold end of the semiconductor temperature difference power generation mechanism is connected with a cold end heat-conducting plate; and the heating mechanism is connected with the hot end heat-conducting plate.
Preferably, the heating mechanism comprises a heating bin, and one end of the hot-end heat-conducting plate penetrates through the mounting shell and extends to the outside of the mounting shell; the hot end heat-conducting plate is fixedly connected with a heating bin at one end of the mounting shell, a heat-conducting seat is fixedly connected with the inner bottom wall of the heating bin, the outer surface of the heat-conducting seat is detachably connected with a plurality of connecting blocks, the connecting blocks are elastically connected with one end of an L-shaped connecting rod, and the other end of the L-shaped connecting rod penetrates through the side wall of the heating bin to be provided with an internal thread through hole and is fixedly connected with a stress ball; the outer diameter of the L-shaped connecting rod is far smaller than the inner diameter of an internal thread through hole formed in the side wall of the heating bin; the horizontal section of the L-shaped connecting rod is fixedly connected with a disc, the disc is positioned outside the heating bin and fixedly connected with one end of a corrugated heat-insulating cover, the other end of the corrugated heat-insulating cover is fixedly connected with an external thread connecting sleeve, and the external thread connecting sleeve is in threaded sealing connection in a threaded through hole; oil liquid for heat conduction is injected into the heating bin, the stress ball is inserted into seawater, the stress ball is impacted and moves due to the fluctuation of seawater, and the L-shaped connecting rod can freely move due to the fact that the outer diameter of the L-shaped connecting rod is far smaller than the inner diameter of an internal thread through hole formed in the side wall of the heating bin and the corrugated heat insulation cover is flexible; thereby under the effect of L type connecting rod for the spring activity, turn into internal energy through plastic deformation through the partly kinetic energy of spring and generate heat, thereby can heat the fluid in the storehouse, increase the temperature of fluid, and the conduction through the storehouse of heating, increase the temperature of hot end heat-conducting plate, thereby increase the temperature of semiconductor thermoelectric generation mechanism hot junction, make the difference in temperature increase of semiconductor thermoelectric generation mechanism hot junction and cold junction, thereby increase semiconductor thermoelectric generation mechanism power generation efficiency.
Preferably, the connecting block is elastically connected with one end of the L-shaped connecting rod, specifically, the connecting block is connected with one end of the spring, and the other end of the spring is connected with the L-shaped connecting rod through the connecting plate; make L type connecting rod and connecting block elastic connection through the spring.
Preferably, the outer surface of the heat conduction seat is detachably connected with a plurality of connecting blocks, specifically, the outer surface of the heat conduction seat is provided with a plurality of mounting grooves, magnets are fixedly connected in the mounting grooves, the connecting blocks are fixedly connected with iron sheets, and when the connecting blocks are inserted into the mounting grooves, the iron sheets and the magnets are in contact with each other and attract each other; the iron sheet and the magnet are mutually contacted and mutually attracted, so that the connecting block is stably inserted into the mounting groove, the connecting block is stably connected with the heat conducting seat, and the use reliability of the device is improved; when assemblies such as stress ball need to be changed, L type connecting rod, springs, through rotating the external thread connecting sleeve, make the internal thread through-hole roll-off that the external thread connecting sleeve can be seted up from the storehouse lateral wall that generates heat in, and through external force pulling L type connecting rod, make the iron sheet can separate with magnet, thereby make connecting block and heat conduction seat separation, and the external diameter of connecting block is less than the internal diameter of internal thread through-hole, make the internal thread through-hole roll-off can be followed to the connecting block, thereby be favorable to the stress ball, L type connecting rod, the change and the maintenance of assemblies such as springs, reduce the use degree of difficulty of device.
Preferably, the outer surface of the heating bin is connected with an auxiliary heating mechanism; the auxiliary heating mechanism can also heat and can be matched with the heating mechanism for use, so that the temperature of the hot end of the semiconductor temperature difference power generation mechanism is further increased, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism is further increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism is further increased.
Preferably, the auxiliary heating mechanism comprises a heat conducting plate, the outer surface of the heating bin is fixedly connected with the heat conducting plate, the heat conducting plate is fixedly connected with a fixing sleeve with two open ends, a piston ring is elastically connected in the fixing sleeve, and a friction disc is rotationally connected in the piston ring; the heat conducting plate is fixedly connected with a plurality of heat conducting columns, one ends of the heat conducting columns extend into the heating bin, and the other ends of the heat conducting columns are in contact connection with the friction disc; the upper surface of the friction disc is fixedly connected with an upright post which coaxially rotates, and the outer surface of the upright post is fixedly connected with a blade; the blade is positioned on the sea surface, and can rotate under the action of sea wind, so that the upright post and the friction disc are driven to synchronously rotate, the friction disc is in friction with the heat-conducting post, and the heat of the heat-conducting post is increased through friction heating; because the heat conduction post inserts the storehouse of generating heat for in the heat of heat conduction post can transmit the fluid in the storehouse of generating heat, thereby further increase the temperature of hot end heat-conducting plate and semiconductor thermoelectric generation mechanism hot end, further make the difference in temperature increase of semiconductor thermoelectric generation mechanism hot end and cold junction, thereby further increase semiconductor thermoelectric generation mechanism generating efficiency.
Preferably, the semiconductor thermoelectric generation mechanism comprises a first semiconductor block and a second semiconductor block; the mounting shell is internally and fixedly connected with a first semiconductor block and a second semiconductor block, and the first semiconductor block is electrically connected with the second semiconductor block through a flexible conductive assembly; one end of the first semiconductor block, which is far away from the second semiconductor block, is fixedly connected with the hot-end heat-conducting plate; one end, far away from the first semiconductor block, of the second semiconductor block is connected with the cold-end heat-conducting plate; the first semiconductor block is made of a P-type semiconductor material, the second semiconductor block is made of an N-type semiconductor material, and one end of the first semiconductor block is connected with one end of the second semiconductor block to form a PN junction; the end that first semiconductor piece and hot junction heat-conducting plate are connected is located the surface of water, and the one end of second semiconductor piece and cold junction heat-conducting plate is located the surface of water below for the both ends of PN junction produce the temperature difference, utilize the seebeck principle, PN junction high temperature end carrier concentration is higher than the low temperature end, forms the concentration difference, and the carrier just begins to spread to the low temperature end, thereby forms the potential difference at low temperature open circuit end, thereby can utilize the difference in temperature to generate electricity.
Preferably, the first semiconductor block is electrically connected to the second semiconductor block through the flexible conductive member, specifically, the first semiconductor block is integrally formed with a first connecting plate, and the second semiconductor block is integrally formed with a second connecting plate; the second connecting plate is electrically connected with the first connecting plate through a plurality of flexible conducting strips; the first connecting plate is flexibly and electrically connected with the second connecting plate through the flexible conducting strip, a gap is reserved between the first semiconductor block and the second semiconductor block, the first semiconductor block and the second semiconductor block are different in material, when the first semiconductor block and the second semiconductor block expand with heat and contract with cold, the volume change amount is different, the gap between the first semiconductor block and the second semiconductor block can play a role of avoiding, the phenomenon that the first semiconductor block and the second semiconductor block generate larger mechanical stress at the connection position of the first semiconductor block and the second semiconductor block due to the effect of expansion with heat and contract with cold is avoided, the probability that the connection position of the first semiconductor block and the second semiconductor block breaks due to the mechanical stress is avoided, and the use safety and reliability of the device are improved.
Preferably, the cold-end heat-conducting plate is connected with a heat dissipation mechanism for dissipating heat for the cold-end heat-conducting plate; can carry out effectual heat dissipation to the cold junction heat-conducting plate through heat dissipation mechanism to reduce the temperature of semiconductor thermoelectric generation mechanism's cold junction, further increase the temperature difference of semiconductor thermoelectric generation mechanism's hot junction and cold junction, increase semiconductor thermoelectric generation mechanism's generating efficiency.
Preferably, the heat dissipation mechanism comprises a mounting plate, one end of the cold-end heat conduction plate penetrates through the outside of the mounting shell, one end of the cold-end heat conduction plate, which is positioned outside the mounting shell, is fixedly connected with the mounting plate through a plurality of heat dissipation fins, the lower surface of the mounting plate is fixedly connected with a plurality of heat conduction sleeves, and the heat conduction sleeves are slidably connected with a plurality of heat conduction slide bars with upper and lower openings; the mounting plate, the heat-radiating fin heat-conducting sleeve and the heat-conducting slide rod can increase the contact area of the cold-end heat-conducting plate and seawater, and are favorable for radiating the cold-end heat-conducting plate, so that the temperature of the cold end of the semiconductor temperature difference power generation mechanism is reduced, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism is increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism is improved; the heat conduction sleeve and the heat conduction slide bar can be inserted into the deep position of sea water, and the temperature of the sea water of deep position is lower, thereby carry out thermal transmission through mounting panel, radiating fin, heat conduction sleeve, heat conduction slide bar, further be favorable to the heat dissipation to the cold junction heat-conducting plate, thereby reduce the temperature of the cold junction of semiconductor thermoelectric generation mechanism, increase the temperature difference of the hot junction of semiconductor thermoelectric generation mechanism and cold junction, improve the generating efficiency of semiconductor thermoelectric generation mechanism.
Compared with the related art, the power generation equipment utilizing ocean thermal energy provided by the invention has the following beneficial effects:
1. when the semiconductor temperature difference power generation mechanism is used, the stress ball is impacted and enabled to move due to the fluctuation of a seawater body, the spring is enabled to move under the action of the L-shaped connecting rod, part of kinetic energy of the spring is converted into internal energy through plastic deformation to generate heat, so that oil in the heating bin can be heated, the temperature of the oil is increased, the temperature of the heat-conducting plate at the hot end is increased through the conduction of the heating bin, the temperature of the hot end of the semiconductor temperature difference power generation mechanism is increased, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism is increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism is increased;
2. the movement of the spring is driven by the fluctuation of the water body of the ocean, and other driving equipment is not required to be connected externally, so that the device is more energy-saving and environment-friendly;
3. when the heat-conducting column is used, the blades can rotate under the action of sea wind, so that the upright columns and the friction discs are driven to rotate synchronously, the friction discs and the heat-conducting columns are in friction, and heat of the heat-conducting columns is increased through friction heating; the heat conducting column is inserted into the heating bin, so that the heat of the heat conducting column can be transferred into the oil in the heating bin, the temperature of the oil in the heating bin is further increased, the temperatures of the heat end heat conducting plate and the heat end of the semiconductor temperature difference power generation mechanism are further increased, the temperature difference between the heat end and the cold end of the semiconductor temperature difference power generation mechanism is further increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism is further increased;
4. according to the invention, the first connecting plate and the second connecting plate are flexibly and electrically connected through the flexible conducting strip, so that the situation that a larger mechanical stress is generated at the joint of the first semiconductor block and the second semiconductor block due to the thermal expansion and cold contraction effect of the first semiconductor block and the second semiconductor block is avoided, the probability that the joint of the first semiconductor block and the second semiconductor block is broken due to the mechanical stress is avoided, and the use safety and reliability of the device are improved.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 1 to 9, a power generation apparatus using ocean thermal energy includes: a mounting case 3; the semiconductor temperature difference power generation mechanism 5 is connected with the mounting shell 3; the hot end of the semiconductor temperature difference power generation mechanism 5 is connected with a hot end heat-conducting plate 7, and the cold end of the semiconductor temperature difference power generation mechanism 5 is connected with a cold end heat-conducting plate 6; and the heating mechanism 2 is connected with the hot end heat-conducting plate 7.
Need to explain: when the device is used, the semiconductor temperature difference power generation mechanism 5 and the cold end are inserted into seawater, the hot end of the semiconductor temperature difference power generation mechanism 5 is positioned on the sea surface, and a temperature difference is formed between the hot end heat-conducting plate 7 and the cold end heat-conducting plate 6, so that the hot end and the cold end of the semiconductor temperature difference power generation mechanism 5 generate a temperature difference, and power is generated through the semiconductor temperature difference power generation mechanism 5 by utilizing the Seebeck principle;
it is also stated that: can generate heat through mechanism 2 that generates heat, increase the temperature of hot end heat-conducting plate 7 to increase the difference in temperature between hot end heat-conducting plate 7 and the cold junction heat-conducting plate 6 and increase, thereby make the difference in temperature between the hot junction of semiconductor thermoelectric generation mechanism 5 and the cold junction increase, improve semiconductor thermoelectric generation mechanism 5's generating efficiency.
Referring to fig. 1, 5, 6 and 7, the heating mechanism 2 includes a heating chamber 24, and one end of the hot-end heat-conducting plate 7 penetrates through the mounting housing 3 and extends to the outside of the mounting housing 3; the hot end heat conduction plate 7 is fixedly connected with a heating bin 24 at one end of the mounting shell 3, a heat conduction seat 27 is fixedly connected with the inner bottom wall of the heating bin 24, the outer surface of the heat conduction seat 27 is detachably connected with a plurality of connection blocks 29a, the connection blocks 29a are elastically connected with one end of an L-shaped connecting rod 22, and the other end of the L-shaped connecting rod 22 penetrates through the side wall of the heating bin 24 to be provided with an internal thread through hole and is fixedly connected with a stress ball 23; the outer diameter of the L-shaped connecting rod 22 is far smaller than the inner diameter of an internal thread through hole formed in the side wall of the heating bin 24; the horizontal segment fixedly connected with and the disc of L type connecting rod 22, the disc is located the outside in heating chamber 24, and disc fixed connection ripple separates the one end of heat exchanger 21, and the other end fixedly connected with external screw thread adapter sleeve 26 of ripple separates heat exchanger 21, and external screw thread adapter sleeve 26 thread sealing connects in the screw thread through-hole.
Need to explain: when the device is used, oil liquid for heat conduction is injected into the heating bin 24, the stress ball 23 is inserted into seawater, the stress ball 23 is impacted and the stress ball 23 moves due to the fluctuation of seawater, and the L-shaped connecting rod 22 can freely move due to the fact that the outer diameter of the L-shaped connecting rod 22 is far smaller than the inner diameter of an internal thread through hole formed in the side wall of the heating bin 24 and the corrugated heat insulation cover 21 is flexible; therefore, under the action of the L-shaped connecting rod 22, the spring 29 moves, part of kinetic energy of the spring 29 is converted into internal energy through plastic deformation to generate heat, so that oil in the heating bin 24 can be heated, the temperature of the oil is increased, and the temperature of the heat-end heat-conducting plate 7 is increased through conduction of the heating bin 24, so that the temperature of the hot end of the semiconductor temperature difference power generation mechanism 5 is increased, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism 5 is increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism 5 is increased;
it is also stated that: the movement of the spring 29 is driven by the fluctuation of the water body of the ocean, and other driving equipment is not required to be connected externally, so that the device is more energy-saving and environment-friendly;
it is also stated that: through the movement of the L-shaped connecting rod 22 and the stressed ball 23 and the elastic deformation of the spring 29, the impact energy generated by the fluctuation of the seawater can be buffered and converted, so that the impact force applied to the whole installation shell 3 is reduced, the wave resistance of the device is improved, and the service life of the device is prolonged; meanwhile, the L-shaped connecting rod 22 and the stress ball 23 are arranged around the mounting shell 3, so that the mounting shell 3 can be protected; when colliding with the installation shell 3, the sundries in the seawater firstly contact with the L-shaped connecting rod 22 and the stress ball 23, and through the elastic deformation of the spring 29, impact energy can be absorbed, buffered and released, so that the impact force on the installation shell 3 is reduced, the service life of the device is further prolonged, meanwhile, the sundries in the seawater firstly contact with the L-shaped connecting rod 22 and the stress ball 23, the sundries can be prevented from directly impacting the installation shell 3, and the service life of the device is further prolonged;
it is also stated that: when the spring 29 moves, the oil in the heating bin 24 can be disturbed, so that the flowing of the oil is facilitated, the temperature of the oil in the heating bin 24 is more uniform, the heating of the hot-end heat-conducting plate 7 is facilitated, and the practicability of the device is improved.
Referring to fig. 5, the outer surface of the heating chamber 24 is wrapped by a heat insulation cover 25, and the corrugated heat insulation cover 21 is disposed through a through hole formed in the heat insulation cover 25.
Need to explain: the heat exchange efficiency inside and outside the heating bin 24 can be reduced through the heat-insulating cover 25, so that the heat insulation of the heating bin 24 is facilitated, the heat dissipation of heat in the heating bin 24 is reduced, and the temperature of the heat-conducting plate 7 at the heating end is increased.
Referring to fig. 6 and 7, the connecting block 29a is elastically connected to one end of the L-shaped connecting rod 22, and specifically, the connecting block 29a is connected to one end of the spring 29, and the other end of the spring 29 is connected to the L-shaped connecting rod 22 through a connecting plate.
Need to explain: the L-shaped connecting rod 22 is elastically connected to the connecting block 29a by a spring 29.
Referring to fig. 6 and 7, a plurality of connection blocks 29a are detachably connected to the outer surface of the heat conducting base 27, specifically, a plurality of mounting grooves are formed in the outer surface of the heat conducting base 27, a magnet is fixedly connected to the inside of the mounting groove, and an iron sheet is fixedly connected to the connection blocks 29a, and when the connection blocks 29a are inserted into the mounting grooves, the iron sheet and the magnet contact with each other and attract each other.
Need to explain: the iron sheet and the magnet are mutually contacted and mutually attracted, so that the connecting block 29a is stably inserted into the mounting groove, the connecting block 29a is stably connected with the heat conducting seat 27, and the use reliability of the device is improved;
it is also stated that: when assemblies such as stress ball 23 need to be changed, L type connecting rod 22, spring 29, through rotating external thread connecting sleeve 26, make external thread connecting sleeve 26 can follow the interior screw thread through-hole roll-off that 24 lateral walls in the storehouse of generating heat seted up, and through external force pulling L type connecting rod 22, make the iron sheet can separate with magnet, thereby make connecting block 29a and heat-conducting seat 27 separate, and connecting block 29 a's external diameter is less than the internal diameter of internal thread through-hole, make connecting block 29a can follow interior screw thread through-hole roll-off, thereby be favorable to stress ball 23, L type connecting rod 22, the change and the maintenance of assemblies such as spring 29, reduce the use degree of difficulty of device.
Referring to fig. 7 and 8, the reinforcing member 28 is attached to the connecting block 29 a; the reinforcing assembly 28 includes a side plate 281 and a latch 282, the side surface of the connecting block 29a is fixedly connected with the side plate 281, the side plate 281 is fixedly connected with the latch 282, and the outer surface of the heat conducting seat 27 is provided with a latch groove matched with the latch 282, and when the connecting block 29a is inserted into the mounting groove, the latch 282 is latched into the latch groove.
Need to explain: when the fixture block 282 is clamped into the clamping groove, a large friction force exists between the fixture block 282 and the clamping groove, so that the fixture block 282 cannot easily slip out of the clamping groove, the connecting block 29a cannot easily move, a reinforcing effect is achieved, the connecting block 29a and the heat conducting base 27 are more stably and firmly connected, and the use reliability of the device is improved.
Referring to fig. 1 and 2, an auxiliary heating mechanism 1 is connected to an outer surface of the heating chamber 24.
Need to explain: supplementary mechanism 1 that generates heat also can generate heat, with the mechanism that generates heat just can cooperate use 2 to further increase the temperature of 5 hot junctions of semiconductor thermoelectric generation mechanism, further make the difference in temperature increase of 5 hot junctions of semiconductor thermoelectric generation mechanism and cold junction, thereby further increase 5 generating efficiency of semiconductor thermoelectric generation mechanism.
Referring to fig. 2 and 3, the auxiliary heating mechanism 1 includes a heat conducting plate 14, the heat conducting plate 14 is fixedly connected to the outer surface of the heating chamber 24, the heat conducting plate 14 is fixedly connected to a fixing sleeve 12 with openings at two ends, a piston ring 17 is elastically connected to the inside of the fixing sleeve 12, and a friction disc 13 is rotatably connected to the piston ring 17; the heat conducting plate 14 is fixedly connected with a plurality of heat conducting columns 15, one ends of the heat conducting columns 15 extend into the heating bin 24, and the other ends of the heat conducting columns 15 are in contact connection with the friction disc 13; the upper surface of the friction disc 13 is fixedly connected with a column 16 which coaxially rotates, and the outer surface of the column 16 is fixedly connected with a blade 11.
Need to explain: the blade 11 is positioned on the sea surface, and under the action of sea wind, the blade 11 can rotate, so that the upright post 16 and the friction disc 13 are driven to synchronously rotate, the friction disc 13 is in friction with the heat conduction post 15, and the heat of the heat conduction post 15 is increased through friction heating; the heat-conducting column 15 is inserted into the heating bin 24, so that the heat of the heat-conducting column 15 can be transferred into the oil in the heating bin 24, the temperature of the oil in the heating bin 24 is further increased, the temperatures of the hot end heat-conducting plate 7 and the hot end of the semiconductor temperature difference power generation mechanism 5 are further increased, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism 5 is further increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism 5 is further increased;
it is also stated that: because the piston ring 17 is elastically connected with the fixed sleeve 12, the piston ring 17 always has a downward movement trend, the friction disc 13 and the heat conduction column 15 can be always tightly attached, namely, the pressure between the friction disc 13 and the heat conduction column 15 is ensured, and the friction force between the friction disc 13 and the heat conduction column 15 is further increased, so that the heat of the heat conduction column 15 is increased;
it is also stated that: the piston ring 17 is elastically connected with the fixed sleeve 12, so that the piston ring 17 always tends to move downwards, when the length of the heat conduction column 15 is reduced due to abrasion, the friction disc 13 and the piston ring 17 can move downwards, so that the friction disc 13 can be always in contact with the heat conduction column 15, and the friction disc 13 can not be in contact with the heat conduction column 15 any more when the friction disc 13 and the heat conduction column 15 are prevented from being abraded, so that the use reliability of the device is improved;
it is also stated that: because the heat-conducting column 15 is inserted into the heating bin 24, when the spring 29 moves, oil in the heating bin 24 can be disturbed, heat exchange between the oil in the heating bin 24 and the heat-conducting column 15 is facilitated, heat of the heat-conducting column 15 is transferred into the oil in the heating bin 24, and therefore the heat-conducting plate 7 at the hot end is facilitated to be heated, heating of the hot end of the semiconductor temperature difference power generation mechanism 5 is facilitated, and the power generation efficiency of the semiconductor temperature difference power generation mechanism 5 is further improved.
Referring to fig. 3, a piston ring 17 is elastically connected in the fixing sleeve 12, specifically, a tension spring 18 is fixedly connected to an inner bottom wall of the fixing sleeve 12, and an upper end of the tension spring 18 is connected to a lower surface of the piston ring 17.
The following description is required: when the friction disc 13 and the heat conduction column 15 are initially contacted, the tension spring 18 is in a stretching state, and under the action of the elastic restoring force of the tension spring 18, the friction disc 13 and the heat conduction column 15 are tightly contacted, so that the friction force is improved, and the heat of the heat conduction column 15 is increased;
it is also necessary to state: under the action of the elastic restoring force of the tension spring 18, the friction disc 13 can be always in contact with the heat conduction column 15, and when the friction disc 13 and the heat conduction column 15 are prevented from being abraded, the friction disc 13 can not be in contact with the heat conduction column 15 any more, so that the use reliability of the device is improved.
Referring to fig. 2 and 4, the semiconductor thermoelectric generation mechanism 5 includes a first semiconductor block 51 and a second semiconductor block 55; a first semiconductor block 51 and a second semiconductor block 55 are fixedly connected in the mounting shell 3, and the first semiconductor block 51 is electrically connected with the second semiconductor block 55 through a flexible conductive assembly; one end of the first semiconductor block 51, which is far away from the second semiconductor block 55, is fixedly connected with the hot-end heat-conducting plate 7; the end of the second semiconductor block 55 remote from the first semiconductor block 51 is connected to the cold-side heat-conducting plate 6.
Need to explain: the first semiconductor block 51 is made of a P-type semiconductor material, the second semiconductor block 55 is made of an N-type semiconductor material, and one ends of the first semiconductor block 51 and one end of the second semiconductor block 55 are connected to form a PN junction; the end of the first semiconductor block 51 connected with the hot end heat-conducting plate 7 is located on the water surface, and the end of the second semiconductor block 55 connected with the cold end heat-conducting plate 6 is located below the water surface, so that temperature difference is generated at two ends of a PN junction, the carrier concentration at the high-temperature end of the PN junction is higher than that at the low-temperature end by utilizing the Seebeck principle to form concentration difference, and the carrier begins to diffuse to the low-temperature end, so that potential difference is formed at the low-temperature open end, and power generation can be realized by utilizing the temperature difference.
Referring to fig. 4, the first semiconductor block 51 is electrically connected to the second semiconductor block 55 through a flexible conductive member, specifically, the first semiconductor block 51 is integrally formed with a first connecting plate 52, and the second semiconductor block 55 is integrally formed with a second connecting plate 53; the second connecting plate 53 is electrically connected to the first connecting plate 52 through a plurality of flexible conductive sheets 54.
Need to explain: the first connecting plate 52 is flexibly and electrically connected with the second connecting plate 53 through the flexible conducting strip 54, a gap is reserved between the first semiconductor block 51 and the second semiconductor block 55, the materials of the first semiconductor block 51 and the second semiconductor block 55 are different, the volume change amount is different when the first semiconductor block 51 and the second semiconductor block 55 expand with heat and contract with cold, the gap between the first semiconductor block 51 and the second semiconductor block 55 can play a role of avoiding, large mechanical stress is prevented from being generated at the connection part of the first semiconductor block 51 and the second semiconductor block 55 due to the expansion with heat and contraction with cold, the probability that the connection part of the first semiconductor block 51 and the second semiconductor block 55 is broken due to the mechanical stress is avoided, and the use safety and reliability of the device are improved.
Referring to fig. 1 and 9, the cold-end heat-conducting plate 6 is connected with a heat-dissipating mechanism 4 for dissipating heat therefrom.
Need to explain: can carry out effectual heat dissipation to cold junction heat-conducting plate 6 through heat dissipation mechanism 4 to reduce the temperature of the cold junction of semiconductor thermoelectric generation mechanism 5, further increase the temperature difference of the hot junction of semiconductor thermoelectric generation mechanism 5 and cold junction, increase semiconductor thermoelectric generation mechanism 5's generating efficiency.
Referring to fig. 9, heat dissipation mechanism 4 includes mounting panel 41, the outside of installation casing 3 is run through to the one end of cold junction heat-conducting plate 6, and cold junction heat-conducting plate 6 is located the outside one end of installation casing 3 and passes through a plurality of radiating fin 42 fixedly connected with mounting panel 41, and a plurality of heat conduction sleeve 43 of fixedly connected with in the lower surface of mounting panel 41, the heat conduction slide bar 44 that the opening set up about a plurality of sliding connection has in the heat conduction sleeve 43.
Need to explain: the mounting plate 41, the heat-conducting sleeve 43 of the heat-radiating fin 42 and the heat-conducting slide bar 44 can increase the contact area between the cold-end heat-conducting plate 6 and seawater, and are beneficial to heat radiation of the cold-end heat-conducting plate 6, so that the temperature of the cold end of the semiconductor temperature difference power generation mechanism 5 is reduced, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism 5 is increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism 5 is improved;
it is also stated that: the heat-conducting sleeve 43 and the heat-conducting slide bar 44 can be inserted into a deep part of seawater, and the temperature of the seawater at the deep part is lower, so that heat is transferred through the mounting plate 41, the heat-radiating fins 42, the heat-conducting sleeve 43 and the heat-conducting slide bar 44, and the heat radiation of the cold-end heat-conducting plate 6 is further facilitated, so that the temperature of the cold end of the semiconductor thermoelectric generation mechanism 5 is reduced, the temperature difference between the hot end and the cold end of the semiconductor thermoelectric generation mechanism 5 is increased, and the power generation efficiency of the semiconductor thermoelectric generation mechanism 5 is improved;
it is also stated that: the heat conduction sleeve 43 extends to the outside of the cold-end heat conduction plate 6, the cold-end heat conduction plate 6 can be protected through the heat conduction sleeve 43, the probability that the cold-end heat conduction plate 6 directly collides with sundries in seawater is reduced, and the service life of the cold-end heat conduction plate 6 is prolonged;
it is also stated that: the heat-conducting sliding rod 44 can slide into the heat-conducting sleeve 43, so that the space occupied by the station during the transfer of the device is reduced, and the carrying and the transfer of the device are facilitated; meanwhile, when the whole device is in transit, the heat-conducting sleeve 43 is vertically placed and is in contact with the ground, so that the whole device is stably placed on the ground; avoid cold junction heat-conducting plate 6 and ground contact to reduce the probability that cold junction heat-conducting plate 6 takes place to collide with, further improve the security that the device transported.
The working principle of the power generation equipment utilizing ocean temperature difference energy provided by the invention is as follows:
when the invention is used, oil liquid for heat conduction is injected into the heating bin 24, the stress ball 23 is inserted into seawater, the stress ball 23 is impacted and the stress ball 23 moves due to the fluctuation of seawater water, and the L-shaped connecting rod 22 can freely move due to the fact that the outer diameter of the L-shaped connecting rod 22 is far smaller than the inner diameter of the internal thread through hole formed in the side wall of the heating bin 24 and the corrugated heat insulation cover 21 is flexible; therefore, under the action of the L-shaped connecting rod 22, the spring 29 moves, part of kinetic energy of the spring 29 is converted into internal energy through plastic deformation to generate heat, so that oil in the heating bin 24 can be heated, the temperature of the oil is increased, and the temperature of the heat-end heat-conducting plate 7 is increased through conduction of the heating bin 24, so that the temperature of the hot end of the semiconductor temperature difference power generation mechanism 5 is increased, the temperature difference between the hot end and the cold end of the semiconductor temperature difference power generation mechanism 5 is increased, and the power generation efficiency of the semiconductor temperature difference power generation mechanism 5 is increased; the movement of the spring 29 is driven by the fluctuation of the water body of the ocean, and other driving equipment is not required to be connected externally, so that the device is more energy-saving and environment-friendly; when the spring 29 moves, the oil in the heating bin 24 can be disturbed, so that the flowing of the oil is facilitated, the temperature of the oil in the heating bin 24 is more uniform, the heating of the hot-end heat-conducting plate 7 is facilitated, and the practicability of the device is improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.