CN101686027A - Temperature-difference generation device formed by connecting ultra heat pipe connected and semiconductor refrigeration piece - Google Patents
Temperature-difference generation device formed by connecting ultra heat pipe connected and semiconductor refrigeration piece Download PDFInfo
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- CN101686027A CN101686027A CN200810168457A CN200810168457A CN101686027A CN 101686027 A CN101686027 A CN 101686027A CN 200810168457 A CN200810168457 A CN 200810168457A CN 200810168457 A CN200810168457 A CN 200810168457A CN 101686027 A CN101686027 A CN 101686027A
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Abstract
The invention relates to a temperature-difference generation device formed by connecting an ultra heat pipe connected and a semiconductor refrigeration sheet, which comprises the ultra heat pipe, thesemiconductor refrigeration sheet, an accumulator, an ultra heat pipe metal high effective heat collector, a heat preservation box body, a heat preservation heat source tank and a metal high effectiveheat collector heat source tank. Power can be generated when the semiconductor refrigeration sheet is made factitiously made to have one cold surface and one hot surface. The invention has the following characteristics: firstly, non-renewable energy resources, such as electricity, coal or gas, can not be utilized; secondly, the forever enduring temperature difference effect can be utilized to generate a renewable energy; thirdly, power can be generated without sunlight and in chilling and extremely hot weather, power can also be generated day and night; fourthly, compared with the cost of solar photoelectric cells, the cost of the invention can be reduced by above 60 percent. The invention has the unique advantage of now use of any non renewable energy resources, no pollution and emissionand best environmental social effect and economic efficiency. The invention preserves non renewable energy resources for the children and the future generations, conforms to irresistible trend of thepresent and the future development and has great values.
Description
Technical field
Energy field " semiconductor temperature differential generating ".
Background technology
Current heliotechnics has been widely used in various fields, just not bringing into play it should not have effect there being the solar time but exist, with high this problem of cost, for this reason, the inventor has researched and developed the temperature difference electricity generation device that connecting ultra heat pipe connected and semiconductor refrigeration piece of the present invention is formed according to the altitude temperature difference effect generation technology, can under any circumstance generate electricity, and it is with low cost, easy to utilize.
Summary of the invention
More and more higher along with the cry of protection environment, energy savings, to utilize thermo-electric generation may be the development general orientation, from the miniature device to the large-scale power station, be applied to the practice from the laboratory theory more and more and go.
Two sides at " semiconductor chilling plate " makes the temperature difference reach 60 degree Celsius with " super heat-conductive pipe heat transfer element ", then generating voltage can reach 3.5V, electric current can reach 3～5A, and the temperature difference cold/heat source of selecting for use " super heat-conductive pipe heat transfer element " conduct " semiconductor chilling plate " two ends to connect has just constituted the temperature difference electricity generation device that connecting ultra heat pipe connected and semiconductor refrigeration piece of the present invention is formed.
The technical solution adopted for the present invention to solve the technical problems:
Adopted gravity super heat-conductive pipe technology among the present invention: heat conduction of the present invention and thermal diffusion mainly are to adopt " gravity super heat-conductive pipe " element.China's comprehensive utilization of energy level is lower always, and " super heat-conductive pipe " element, has characteristics such as be easy to apply in industry simple in structure, cheap, easily manufactured.
The source of heat pipe: heat pipe is invented at the Ge Lufoshi by my Mo Si research institute of Lars of California, USA university in 1963.As the term suggests it is a kind of pipe with high duty heat transfer performance, it is constantly to study and seek product under the high efficient heat device heat transmission scholar.
The structure of heat pipe: heat pipe is the metal pipe of elongated a, hollow, two sealings in general.It has 15 centimeters long, also there are 15 meters long, its external shape is regardless of, in theory almost the design of Any shape all is fine, tube inner wall is adhered to one deck capillary object (not having the capillary object in the gravity assisted heat pipe), soaking liquid in the capillary object, this liquid is referred to as the working solution of heat pipe, has been common heat pipe so.Yet so not simple when manufacturing actually, its structure is different according to the difference of heat conduction amount and temperature.The useful brass of present Manufactured heat pipe, nickel, stainless steel, tungsten and other alloy are done shell.
The kind of heat pipe working solution is more, and it comprises potassium, sodium, indium, caesium, lithium, bismuth, mercury, water, wood alcohol, acetone, the liquid nitrogen of refrigerant, liquid oxygen and some other inorganic salts etc.In fact, the selection of the shell of heat pipe and working solution thereof is all decided on the applicable cases of heat pipe.For example when the above high temperature of 1,000 degree Celsius, inside heat pipe is used liquid metals such as potassium, sodium more, but heat pipe is used for subzero 190 when spending, then inner more than with liquid nitrogen etc.
The basic functional principle of heat pipe: when an end of heat pipe places the higher temperatures place and when allowing the other end at the lower temperature place, the heat transfer phenomenon just begins to produce.Heat is at first passed metal pipe-wall by the high temperature place and is entered in the capillary object, the start vaporizer that is heated of the working solution in the capillary object.The part of heat pipe at the high temperature place just is referred to as evaporation partly.Gas after the evaporation accumulates in the evaporation hollow tube partly, and the other end to heat pipe flows simultaneously.Because the other end of heat pipe touches the lower temperature place, when arriving the colder other end, gas just begins condensation, and heat just passes the capillary object by gas at this moment, working solution and metal pipe-wall and import the lower temperature part into.Therefore heat pipe just is referred to as condensation partly in the part of lower temperature.The gas that was originally partly evaporated by evaporation in condensation has partly condensed into liquid again, these condensed liquid have partly flowed back to evaporation again partly because of the effect autocondensation of capillarity, so circulation of fluid does not stop, and heat has just passed to the low temperature place by the high temperature place, and this is the Heat Transfer of Heat Pipe on Heat Pipe principle.Because evaporation and condensation carry out under vapour pressure much at one, the temperature difference in the pipe is very little.As for the temperature difference of heat pipe two end housings, then mainly due to heat conduction by the tube wall outer rim through the capillary object, working solution is due to the gas.Referring to (Fig. 1).
As placing under the same temperature difference heat pipe with two ends of volume metal bar, the heat conduction amount of heat pipe can reach more than thousand times of metal bar.In other words, when same heat during by heat pipe with the metal bar of volume, the temperature difference of heat pipe two ends is little more a lot of than metal bar.Because this specific character, heat pipe often are called as " near isothermal heat conduction " device.System, heat pipe is the most outstanding on structure and principle a bit to be the application of capillary object and capillarity.
" general heat pipe " is because the effect of capillarity, can not need the effect of external force and flow back to evaporation partly at condensation liquid partly, this makes heat pipe become a heat-transfer device that does not fully independently have movable members, acting on of capillarity simultaneously also make heat pipe become the unique apparatus of conducting heat in the space, because still can make fluid flow under the weightlessness of space state.
It also is to utilize the evaporation of working medium and condensation to transmit heat for " gravity assisted heat pipe ", and being does not need additionaling power and working medium circulates voluntarily.The difference of it and general heat pipe (capillarity) is there is not wick in the pipe (capillary object and capillarity), and it is not by the capillary force that wick produced that condensate liquid returns evaporation section from cold doubtful section, but by self and gravity of condensate liquid.Therefore gravity assisted heat pipe is that directivity is arranged, and evaporation section must place the below of condensation segment.Because gravity assisted heat pipe does not have wick, thus not only simple in structure, with low cost, and also heat transfer property is good, reliable operation.Referring to (Fig. 1).
Because the advantage of heat pipe is so many, its range of application is very extensive; It can be used for also can be used in the liquid reactant metal stove up to 1,500 degree Celsius in the cryogenic equipment of subzero 230 degree Celsius.It not only is used for the general device on ground, also is used among the space.Except heat pipe as in the previous paragraph can be used as the heat transfer unit (HTU), its application scenarios branch is outlined in down:
Heat radiation: heat pipe is extended outside electro-heat equipment, to increase the area of dissipation of electro-heat equipment.Because the heat conduction amount of heat pipe is greater than the metal bar with volume, it can replace the sheet metal of general heat radiating fin and increase its heat dissipation capacity.From the application of above heat pipe, as can be known, from the heat pipe invention so far, within the short several years, adopted widely.Yet heat pipe is in the potentiality of application facet, and the research of going back the dependency theory aspect could its effect of more effective performance.
The characteristics of hot pipe technique: 1, high-speed thermal conduction effect; 2, in light weight and simple structure; 3, Temperature Distribution is average, can do the action of samming or isothermal; 4, big, the hot transmitting range of heat transfer amount is long; 5, there is not driving component, not power consumption itself; 6, can under the environment in the agravic field of force, use; 7, do not have heat to pass the restriction of direction, evaporation ends and condenser can be exchanged; 8, process easily to change the heat transfer direction; 9, durable, life-span length, reliable, keeping easy to store; 10, cheap.
" heat pipe " has bigger heat-transfer capability, and heat pipe has been organized the less boiling of thermal resistance and the two kinds of phase transition process that condense cleverly, the conductive coefficient that makes it up to the several times of red copper conductive coefficient so that thousands of times." heat pipe " do not need delivery pump and seal lubrication, movement-less part simple in structure and noise.As: a heavy 0.34kg of long 0.6m diameter 13mm " heat pipe " carries the 200W energy under 100 ℃ of working temperatures, 0.5 ℃ of its temperature drop is 22.7kg and carry with the same long solid copper bar weight of homenergic, and the temperature difference is up to 70 ℃.The cold and hot fluid of " heat exchange of heat pipe " fully separately flows, and can be relatively easy to realize the complete countercurrent flow of cold and hot fluid; Simultaneously cold fluid and hot fluid all flows in that pipe is outer, because the outer heat exchange coefficient that flows of pipe is far above heat exchange coefficient mobile in the pipe, and the both sides heating surface all can adopt extended surface, and the recovery that is used for the lower heat energy of grade is very economical.
" heat pipe " claims " super heat-conductive pipe " or " medium heat conduction pipe " again, is a kind of novel heat-conduction component that developed recently gets up.It has broken traditional is the heat transfer type of medium with water, a large amount of heats can be realized that by minimum sectional area remote transmission fast need not additionaling power, thereby realize purpose efficient, energy-conservation, low consumption.After tested, its heat transfer rate can reach 80～100 cels, is thousands of times of good conductors such as silver, copper, aluminium; Transmission course almost is an isothermal heat transfer, and thermal losses can be ignored substantially; And useful life was up to extremely tens thousand of hours up to ten thousand.
Adopted the semiconductor thermoelectric generation technology among the present invention:
1821, the roentgen Seebeck found, in the closed-loop path that two kinds of different metals are formed, when the temperature of two contact positions not simultaneously, can produce an electromotive force in the loop, this what is called " Seebeck effect ", the principle of Here it is thermo-electric generation.
1834, French experimental science man Pa Er card was found its adverse effect: two kinds of different metals constitute the closed-loop path, when having direct current in the loop, will produce the temperature difference between two joints, this so-called Peltier effect, the foundation of thermoelectric cooling that Here it is.
1837, the distracted inferior discovery again of the physicist of Russia, sense of current has determined to absorb and has still produced heat, and how much what heating (refrigeration) was measured is directly proportional with the size of electric current.
Semi-conducting material has higher thermoelectric potential can successfully be used for making the mini thermoelectric heat refrigerator.The thermocouple refrigeration element that N type semiconductor and P type semiconductor shown in Fig. 2～Fig. 3 and Fig. 4-1 constitute.With copper coin and copper conductor N type semiconductor and P type semiconductor are connected into a loop, copper coin and copper conductor only play conduction.At this moment, a contact heating, a contact turns cold.If the sense of current is reverse, the cold and hot effect reciprocity at node place so.
The theoretical foundation of thermoelectric cooling is the thermoelectric effect of solid, and when no external magnetic field existed, it comprised five effects, heat conduction, Joule heat loss, Xi Baike (Seebeck) effect, Pa Er card (Peltire) effect and Thomson (Thomson) effect.
1856, the thermodynamic principles that Thomson utilizes him to found were carried out multianalysis to Seebeck effect and peltier effect, and will set up contact between original mutual incoherent Seebeck coefficient and the Pa Er card coefficient.Thomson is thought, when absolute zero, has simple multiple relation between Pa Er card coefficient and the Seebeck coefficient.On this basis, he has foretold a kind of new thermoelectric effect again theoretically, promptly when electric current flow through in the uneven temperature conductor, conductor also will absorb or emit the foundation of certain heat (being called Thomsons heat) thermoelectric cooling that Here it is except that producing irreversible Joule heat.Perhaps conversely, when the two ends of metal bar temperature not simultaneously, the metal bar two ends can form electrical potential difference.Be Thomson effect (Thomson effect) after this phenomenon, become the 3rd thermoelectric effect (thermoelectric effect) after Seebeck effect and peltier effect.Thomson effect is the phenomenon that the conductor two ends produce electromotive force when the temperature difference is arranged, and peltier effect is the phenomenon that the two ends of energized conductor produce the temperature difference (end wherein produces heat, and the other end absorbs heat), and both combine and have just constituted Seebeck effect.The principle of Here it is thermo-electric generation.
The physics of Thomson effect is explained: during non-uniform temperature, the free electron of temperature eminence is bigger than the free electron kinetic energy of temperature lower in the metal.As gas, when non-uniform temperature, can produce thermal diffusion, so free electron piles up in low-temperature end, thereby form electric field in conductor to temperature low side diffusion from temperature is high-end, just draw into an electrical potential difference at the metal bar two ends.The diffusion of this free electron is performed until till the thermal diffusion balance of electric field force to the effect of electronics and electronics.
Thermoelectric cooling: make direct current pass through semiconductor thermoelectric module, can at one end produce cold effect, produce thermal effect at the other end.
Thermoelectric cooling is called thermoelectric cooling again, or semiconductor refrigerating, and it is a kind of refrigerating method that utilizes thermoelectric effect (being the Pamir effect).
Thermo-electric generation is a kind of novel generation mode, utilizes the Sai Beier effect that heat energy directly is converted to electric energy.
Semiconductor thermoelectric generation technology, its operation principle are at two semiconductor of different nature two ends a temperature difference to be set, so just produced direct voltage on semiconductor.Semiconductor generator so that semi-conductor thermo-electric generation module is made can generate electricity as long as there is the temperature difference to exist.See shown in (Fig. 4-2).
Semiconductor thermoelectric generates electricity that its internal resistance is little, high temperature resistant, when work noiselessness, pollution-free, characteristics such as non-maintaining, life-span length, stable performance, thereby be a kind of widely used portable power supplies.Can in subzero 40 degrees centigrade cold environment, start rapidly, therefore obtain application more and more widely in practice.
This electricity-generating method is that cold/heat energy directly is transformed into electric energy, and it is not only relevant with two junction temperatures, and relevant with used property of conductor.The advantage of this power generating method is the mechanical part that does not have rotation, does not have wear phenomenon, so can use for a long time, needs the very high thermal source of temperature but desire to reach high efficiency, and stacked (cascade or the staging) that utilize several layers of pyroelectric sometimes is to reach high efficiency effect.If the two sides thermal gradient energy reaches 60 degree Celsius, then generating voltage can reach 3.5V, and electric current can reach 3～5A.
Semiconductor temperature difference generator is mainly used in fields such as oil field, field, military affairs at present.
More and more higher along with the cry of protection environment, energy savings, to utilize thermo-electric generation be exactly the general orientation of development, from the miniature device to the large-scale power station, be applied to the practice from the laboratory theory more and more and go.
Innovative point of the present invention is:
Technology path one: the present invention has selected " super heat-conductive pipe heat transfer element efficiently " its characteristics for use:
1, high-speed thermal conduction effect;
2, in light weight and simple structure;
3, Temperature Distribution is average, can do the action of samming or isothermal;
4, big, the hot transmitting range of heat transfer amount is long;
5, there is not driving component, not power consumption itself;
6, can under the environment in the agravic field of force, use;
7, do not have heat to pass the restriction of direction, evaporation ends and condenser can be exchanged;
8, process easily to change the heat transfer direction;
9, durable, life-span length, reliable, keeping easy to store;
10, cheap;
11, being convenient to penetration and promotion uses.
Technology path two: the present invention has adopted " semiconductor thermoelectric generation technology " its characteristics:
But 1 continuous operation does not have pollutant sources not have rotating parts, and not having slide unit is a kind of solid piece part, does not have vibrations, noise, life-span long during work, and non-environmental-pollution is installed easily.
2, the semiconductor chip thermal inertia is very little, as long as the two sides exists the temperature difference just can generate electricity.
3, the reverse use of semiconductor chilling plate is exactly a thermo-electric generation, low-temperature space generating during semiconductor chilling plate generally is applicable to.
4, the right power of the single cooling module of semiconductor chilling plate is very little, but be combined into pile, method with pile series and parallel of the same type is combined into refrigerating system, and it is very big that power just can be done, and therefore the power of generating can be accomplished the scope of several milliwatts to last myriawatt.
5, the temperature range of semiconductor chilling plate, 90 ℃ to realizing generating from negative temperature-130 ℃ to positive temperature.
6, cheap.
Technology path three: the temperature difference cold/heat source that the present invention has selected for use " super heat-conductive pipe heat transfer element " conduct " semiconductor chilling plate " two ends to connect has constituted " semiconductor thermoelectric generator ".Possess above-mentioned effect of characteristic synthesis separately and advantage are arranged.
Beneficial effect of the present invention:
The present invention one is can not electricity consumption, the non-renewable energy resources of coal or gas; The 2nd, can utilize the altitude temperature difference effect of eternal existence to produce regenerative resource; The 3rd, can generate electricity under the situation of sunlight not having, day and night all can generate electricity; The 4th, can reduce more than 60% with its cost of solar photocell comparison.Have distinct advantages, can not produce the environmental protection social effect and the economic benefit of any disposal of pollutants the best without non-renewable energy resources.For the our children and our children's children has kept the energy, be the inexorable trend that develops at present and in the future, it is significant.
Description of drawings
Fig. 1: gravity super heat-conductive pipe principle and profile schematic diagram;
Fig. 1-1: gravity super heat-conductive pipe principle schematic;
Fig. 1-2: gravity super heat-conductive pipe profile schematic diagram.
Fig. 2: semiconductor cooler principle schematic;
Fig. 2-1: semiconductor cooler principle schematic;
Fig. 2-2: semiconductor cooler generalized section.
Fig. 3: the conductor refrigeration sheet profile schematic diagram of monolithic and pile string in parallel;
Fig. 3-1: monolithic semiconductor refrigerating sheet profile schematic diagram;
Fig. 3-2: monolithic semiconductor refrigerating sheet generalized section;
Fig. 3-3: the conductor refrigeration sheet generalized section of pile string in parallel.
Fig. 4: the generalized section of the Blast Furnace Top Gas Recovery Turbine Unit (TRT) that semiconductor cooler is made;
Fig. 4-1: semiconductor cooler generalized section;
Fig. 4-2: the generalized section of semiconductor cooler Blast Furnace Top Gas Recovery Turbine Unit (TRT);
Fig. 5: the generalized section of single heat pipe in ground and semi-conductor electricity sub-element temperature difference electricity generation device;
Fig. 6: the place an order generalized section of heat pipe and semi-conductor electricity sub-element temperature difference electricity generation device of ground;
Fig. 7: the generalized section of two heat pipes and semi-conductor electricity sub-element temperature difference electricity generation device;
Fig. 8: the generalized section of underground heat pipe and semi-conductor electricity sub-element and superconducting fluid temperature difference electricity generation device.
Among the figure: (AA) super heat-conductive pipe, (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section, (A1-3) evaporation section, (AA2) super heat-conductive pipe, (A2-1) condensation segment, (A2-2) linkage section, (A2-3) evaporation section, (A) bringing-up section, (B) span line or linkage section, (C) endotherm section, (J) gravity reflux, (F) steam, (TE) conductor refrigeration sheet, (QC) heat absorption, (TC) (T2) cold junction, (QH) heat release, (T1) (TH) hot junction, (T1-0) add the low-temperature receiver end, (T2-0) heating source end, (DC) storage battery, (I) transducer, (DC-1) power supply input, (DC-2) generating output, (P) P type semiconductor, (N) N type semiconductor, (Q1) hot junction substrate, (Q2) hot junction flow guide bar, (Q3) element, (Q4) cold junction flow guide bar, (Q5) cold junction substrate, (Q0) generating out-put supply line, (S0) connect consuming device, (W) metal efficient heat-collecting device, (M) super heat-conductive pipe metal efficient heat-collecting device, (L) framework, (K) insulation casing, (U) heat preservation hot carrying shield, (U0) metal efficient heat-collecting device thermal source jar, (H1) thermal source jar heat-preservation cylinder, (H-0) the conductor refrigeration sheet connects barrel, (H2) heat pipe heat-preservation cylinder, (H2-1) insulation division board, (H3) connect cover plate, (H4) heat pipe outer tube, (H5) thermal source jar heat-preservation cylinder connection cover, (R) superconducting fluid, (X) ground, (Z) underground.
Embodiment
In Fig. 1: (AA) super heat-conductive pipe, (R) superconducting fluid, (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section, (A1-3) evaporation section, (A) bringing-up section, (B) span line or linkage section, (C) endotherm section, (J) gravity reflux, (F) steam.
In the drawings: in metal (AA) super heat-conductive pipe of sealing, poured into (R) superconducting fluid, its lower end is (A) (A1-3) evaporation section or title bringing-up section, the centre is (B) (A1-2) span line or title linkage section, the upper end is (C) (A1-1) condensation segment or title endotherm section, (R) superconducting fluid is at (A) (A1-3) evaporation section or claim to become (F) steam after the bringing-up section heating, (C) that is sublimate into the upper end (A1-1) condensation segment or claim endotherm section after become liquid (J) gravity reflux downwards after the condensation and go round and begin again.
In Fig. 2: (TE) conductor refrigeration sheet, (QC) heat absorption, (TC) (T2) cold junction, (QH) heat release, (T1) (TH) hot junction, (T1-0) add low-temperature receiver end, (T2-0) heating source end, (DC) storage battery, (DC-1) power supply input, (DC-2) generating output, (P) P type semiconductor, (N) N type semiconductor, (Q1) hot junction substrate, (Q2) hot junction flow guide bar, (Q3) element, (Q4) cold junction flow guide bar, (Q5) cold junction substrate.
In the drawings: (TE) the conductor refrigeration sheet comprises by (Q1) hot junction substrate of lower end and (Q2) hot junction flow guide bar that is being connected in turn and by (P) P type semiconductor and (N) N type semiconductor and forms (Q4) cold junction flow guide bar that (Q3) element is connected with the upper end and (Q5) cold junction substrate formation; The upper end be (QC) heat absorption or (T2) cold junction of title (TC), and the lower end is (TH) hot junction of (QH) heat release or title (T1); After connecting (DC) storage battery, (Q2) hot junction flow guide bar just constituted (TE) conductor refrigeration sheet.
In Fig. 3: (TE) conductor refrigeration sheet, (TE-X) conductor refrigeration pile string in parallel, (DC) storage battery.
In the drawings: connecting (DC-1) power supply input power cord at (Q2) hot junction of (TE) conductor refrigeration sheet flow guide bar, inserting (DC) storage battery and just formed the not conductor refrigeration apparatus of power of monolithic; Also pile string by just having formed the parallel connection of (TE-X) conductor refrigeration after connecting after the parallel connection of a plurality of monolithics (TE) conductor refrigeration sheet, just can constitute required large-power semiconductor refrigerator device behind access (DC) storage battery again.
In Fig. 4: (TE) conductor refrigeration sheet, (T2) cold junction, (T1) hot junction, (T1-0) add low-temperature receiver end, (T2-0) heating source end, (DC) storage battery, (DC-1) power supply input, (DC-2) output of generating electricity.(DC-2) generating output,
In the drawings: (DC) storage battery has just constituted the conductor refrigeration apparatus through (DC-1) power supply input power cord connection (TE) conductor refrigeration sheet, and the upper end is that (T2) cold junction lower end is (T1) hot junction; Add the low-temperature receiver end in the lower end (T1-0) of (TE) conductor refrigeration sheet and supply with low-temperature receiver, supply with thermal source (DC-2) generating out-put supply line output current and just constituted the temperature difference electricity generation device of (TE) conductor refrigeration sheet for (DC) charge in batteries with advancing in the upper end (T2-0) heating source end.
Embodiment one:
In Fig. 5: (TE) conductor refrigeration sheet, (Q1) hot junction substrate, (Q5) cold junction substrate, (Q0) generating out-put supply line, (DC) storage battery, (I) transducer, (S0) connect consuming device, (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section, (A1-3) evaporation section, (U) heat preservation hot carrying shield, (W) metal efficient heat-collecting device, (M) super heat-conductive pipe metal efficient heat-collecting device, (L) framework.
In the drawings: connecting (W) metal efficient heat-collecting device at (Q1) hot junction of (TE) conductor refrigeration sheet substrate; (Q5) cold junction substrate at (TE) conductor refrigeration sheet is connecting (U) heat preservation hot carrying shield and (M) super heat-conductive pipe metal efficient heat-collecting device that is connected; In (M) super heat-conductive pipe metal efficient heat-collecting device, connecting (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section and (A1-3) evaporation section in turn; Connecting (Q0) generating out-put supply line and connect consuming device connection institute electrical appliance through (I) transducer connection (DC) storage battery by (S0) on (TE) conductor refrigeration sheet, above-mentioned each parts are connected and have constituted single heat pipe in ground and semi-conductor electricity sub-element temperature difference electricity generation device on (L) framework.
(W) metal efficient heat-collecting device has been declared patent with (M) the structure inventor of super heat-conductive pipe metal efficient heat-collecting device.
Embodiment two:
In Fig. 6: it is underground that (TE) conductor refrigeration sheet, (Q1) hot junction substrate, (Q5) cold junction substrate, (Q0) generating out-put supply line, (DC) storage battery, (I) transducer, (S0) connect consuming device, (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section, (A1-3) evaporation section, (K) insulation casing, (W) metal efficient heat-collecting device, (X) ground, (Z).
In the drawings: on (X) ground, placing (TE) conductor refrigeration sheet; It is underground that (A1-3) evaporation section that (A1-1) condensation segment that is connecting (AA1) super heat-conductive pipe on the substrate of (Q1) hot junction of (TE) conductor refrigeration sheet connects through (A1-2) linkage section is connected to (Z); Connecting (K) insulation casing in the outside of (A1-1) of (AA1) super heat-conductive pipe condensation segment; On (Q5) cold junction substrate of (TE) conductor refrigeration sheet, connecting (W) metal efficient heat-collecting device; Connecting (Q0) generating out-put supply line on (TE) conductor refrigeration sheet connects (DC) storage battery through (I) transducer and connects consuming device by (S0) and connect institute's electrical appliance and constituted ground place an order heat pipe and semi-conductor electricity sub-element temperature difference electricity generation device.
Embodiment three: two heat pipes and semi-conductor electricity sub-element temperature difference electricity generation device
In Fig. 7: (TE) conductor refrigeration sheet, (Q1) hot junction substrate, (Q5) cold junction substrate, (Q0) generating out-put supply line, (DC) storage battery, (I) transducer, (S0) connect consuming device, (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section, (A1-3) evaporation section, (K) insulation casing, (U) heat preservation hot carrying shield, (M) super heat-conductive pipe metal efficient heat-collecting device, (AA2) super heat-conductive pipe, (A2-1) condensation segment, (A2-2) linkage section, (A2-3) evaporation section, (X) ground, (Z) underground.
In the drawings: on (X) ground, placing (TE) conductor refrigeration sheet; It is underground that (A1-3) evaporation section that (A1-1) condensation segment that is connecting (AA1) super heat-conductive pipe on the substrate of (Q1) hot junction of (TE) conductor refrigeration sheet connects through (A1-2) linkage section is connected to (Z); Connecting (K) insulation casing in the outside of (A1-1) of (AA1) super heat-conductive pipe condensation segment; On (Q5) cold junction substrate of (TE) conductor refrigeration sheet, connecting (U) heat preservation hot carrying shield; (A2-1) condensation segment that is connecting (AA2) super heat-conductive pipe in (U) heat preservation hot carrying shield is connecting (M) super heat-conductive pipe metal efficient heat-collecting device and (AA2) (A2-3) evaporation section of super heat-conductive pipe through (A2-2) linkage section; Connecting (Q0) generating out-put supply line on (TE) conductor refrigeration sheet connects (DC) storage battery through (I) transducer and connects consuming device by (S0) and connect institute's electrical appliance and constituted two heat pipes and semi-conductor electricity sub-element temperature difference electricity generation device.
Embodiment four:
In Fig. 8: (TE) conductor refrigeration sheet, (Q1) hot junction substrate, (Q5) cold junction substrate, (Q0) generating out-put supply line, (DC) storage battery, (I) transducer, (S0) connect consuming device, (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section, (A1-3) evaporation section, (U0) metal efficient heat-collecting device thermal source jar, (H1) thermal source jar heat-preservation cylinder, (H-0) the conductor refrigeration sheet connects barrel, (H2) heat pipe heat-preservation cylinder, (H2-1) insulation division board, (H3) connect cover plate, (H4) heat pipe outer tube, (H5) thermal source jar heat-preservation cylinder connection cover, (R) superconducting fluid, (X) ground, (Z) underground.
In the drawings: placing (TE) conductor refrigeration sheet in that (Z) is underground; (H4) heat pipe outer tube that (A1-3) evaporation section that (A1-1) condensation segment that is connecting (AA1) super heat-conductive pipe on the substrate of (Q1) hot junction of (TE) conductor refrigeration sheet connects through (A1-2) linkage section is connected with the outside; Connecting (H2) heat pipe heat-preservation cylinder in the outside of (A1-1) of (AA1) super heat-conductive pipe condensation segment; On (Q5) cold junction substrate of (TE) conductor refrigeration sheet, connecting (U0) metal efficient heat-collecting device thermal source jar and be connected the cover plate connection with (H3) with (H1) thermal source jar heat-preservation cylinder that (H5) thermal source jar heat-preservation cylinder connection cover is connected with (Z) underground outside; In (U0) metal efficient heat-collecting device thermal source jar, be perfused with (R) superconducting fluid and connect (Q5) cold junction substrate that barrel connects (TE) conductor refrigeration sheet through (H-0) conductor refrigeration sheet; (TE) the conductor refrigeration sheet connects (H2-1) insulation division board and (AA1) super heat-conductive pipe end isolation; Connecting (Q0) generating out-put supply line on (TE) conductor refrigeration sheet connects (DC) storage battery through (I) transducer and connects consuming device by (S0) and connect institute's electrical appliance and constituted underground heat pipe and semi-conductor electricity sub-element and superconducting fluid temperature difference electricity generation device.
Claims (5)
1, the temperature difference electricity generation device that connecting ultra heat pipe connected and semiconductor refrigeration piece is formed, comprise super heat-conductive pipe by (AA), (TE) conductor refrigeration sheet, (DC) storage battery, (DC-1) power supply input, (DC-2) generating output, (Q0) generating out-put supply line, (S0) connect consuming device, (W) metal efficient heat-collecting device, (M) super heat-conductive pipe metal efficient heat-collecting device, (L) framework, (K) insulation casing, (U) heat preservation hot carrying shield, (U0) metal efficient heat-collecting device thermal source jar, (H1) thermal source jar heat-preservation cylinder, (H-0) the conductor refrigeration sheet connects barrel, (H2) heat pipe heat-preservation cylinder, (H2-1) insulation division board, (H3) connect cover plate, (H4) heat pipe outer tube, (H5) thermal source jar heat-preservation cylinder connection cover, (R) superconducting fluid, (X) ground, (Z) underground composition is characterized in that; It is underground that (A1-3) evaporation section that (A1-1) condensation segment that is connecting (AA1) super heat-conductive pipe on the substrate of (Q1) hot junction of (TE) conductor refrigeration sheet connects through (A1-2) linkage section is connected to (Z); Connecting (K) insulation casing in the outside of (A1-1) of (AA1) super heat-conductive pipe condensation segment; On (Q5) cold junction substrate of (TE) conductor refrigeration sheet, connecting (U) heat preservation hot carrying shield; (A2-1) condensation segment that is connecting (AA2) super heat-conductive pipe in (U) heat preservation hot carrying shield is connecting (M) super heat-conductive pipe metal efficient heat-collecting device and (AA2) (A2-3) evaporation section of super heat-conductive pipe through (A2-2) linkage section; Connecting (Q0) generating out-put supply line on (TE) conductor refrigeration sheet connects (DC) storage battery through (I) transducer and connects consuming device by (S0) and connect institute's electrical appliance and constituted two heat pipes and semi-conductor electricity sub-element temperature difference electricity generation device.
2, the temperature difference electricity generation device of connecting ultra heat pipe connected and semiconductor refrigeration piece composition according to claim 1 is characterized in that; Connecting (W) metal efficient heat-collecting device at (Q1) hot junction of (TE) conductor refrigeration sheet substrate; (Q5) cold junction substrate at (TE) conductor refrigeration sheet is connecting (U) heat preservation hot carrying shield and (M) super heat-conductive pipe metal efficient heat-collecting device that is connected; In (M) super heat-conductive pipe metal efficient heat-collecting device, connecting (AA1) super heat-conductive pipe, (A1-1) condensation segment, (A1-2) linkage section and (A1-3) evaporation section in turn; Connecting (Q0) generating out-put supply line and connect consuming device connection institute electrical appliance through (I) transducer connection (DC) storage battery by (S0) on (TE) conductor refrigeration sheet, above-mentioned each parts are connected and have constituted single heat pipe in ground and semi-conductor electricity sub-element temperature difference electricity generation device on (L) framework.
3, the temperature difference electricity generation device of connecting ultra heat pipe connected and semiconductor refrigeration piece composition according to claim 1 is characterized in that; On (X) ground, placing (TE) conductor refrigeration sheet; It is underground that (A1-3) evaporation section that (A1-1) condensation segment that is connecting (AA1) super heat-conductive pipe on the substrate of (Q1) hot junction of (TE) conductor refrigeration sheet connects through (A1-2) linkage section is connected to (Z); Connecting (K) insulation casing in the outside of (A1-1) of (AA1) super heat-conductive pipe condensation segment; On (Q5) cold junction substrate of (TE) conductor refrigeration sheet, connecting (W) metal efficient heat-collecting device; Connecting (Q0) generating out-put supply line on (TE) conductor refrigeration sheet connects (DC) storage battery through (I) transducer and connects consuming device by (S0) and connect institute's electrical appliance and constituted ground place an order heat pipe and semi-conductor electricity sub-element temperature difference electricity generation device.
4, the temperature difference electricity generation device of connecting ultra heat pipe connected and semiconductor refrigeration piece composition according to claim 1 is characterized in that; Placing (TE) conductor refrigeration sheet in that (Z) is underground; (H4) heat pipe outer tube that (A1-3) evaporation section that (A1-1) condensation segment that is connecting (AA1) super heat-conductive pipe on the substrate of (Q1) hot junction of (TE) conductor refrigeration sheet connects through (A1-2) linkage section is connected with the outside; Connecting (H2) heat pipe heat-preservation cylinder in the outside of (A1-1) of (AA1) super heat-conductive pipe condensation segment; On (Q5) cold junction substrate of (TE) conductor refrigeration sheet, connecting (U0) metal efficient heat-collecting device thermal source jar and be connected the cover plate connection with (H3) with (H1) thermal source jar heat-preservation cylinder that (H5) thermal source jar heat-preservation cylinder connection cover is connected with (Z) underground outside; In (U0) metal efficient heat-collecting device thermal source jar, be perfused with (R) superconducting fluid and connect (Q5) cold junction substrate that barrel connects (TE) conductor refrigeration sheet through (H-0) conductor refrigeration sheet; (TE) the conductor refrigeration sheet connects (H2-1) insulation division board and (AA1) super heat-conductive pipe end isolation; Connecting (Q0) generating out-put supply line on (TE) conductor refrigeration sheet connects (DC) storage battery through (I) transducer and connects consuming device by (S0) and connect institute's electrical appliance and constituted underground heat pipe and semi-conductor electricity sub-element and superconducting fluid temperature difference electricity generation device.
5, the temperature difference electricity generation device of connecting ultra heat pipe connected and semiconductor refrigeration piece composition according to claim 1 is characterized in that; (TE) (Q1) hot junction substrate on conductor refrigeration sheet two sides, (Q5) cold junction substrate can be selected heat-conducting glue for use with being connected of cold/heat source device.
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| CN200810168457A CN101686027A (en) | 2008-09-25 | 2008-09-25 | Temperature-difference generation device formed by connecting ultra heat pipe connected and semiconductor refrigeration piece |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102759142A (en) * | 2011-04-29 | 2012-10-31 | 姚福来 | Heat-pipe heating and heat-pipe power generation method for cold regions |
| CN105897061A (en) * | 2016-05-31 | 2016-08-24 | 安徽省冠盛纺织科技有限公司 | Heat energy collection and application device of two-for-one twister |
| CN106055048A (en) * | 2016-05-19 | 2016-10-26 | 唐坤剑 | Computer heat-dissipation device |
| CN108390592A (en) * | 2018-02-22 | 2018-08-10 | 北京林业大学 | A kind of power generator of with acquiring light energy mix |
| CN111609720A (en) * | 2020-05-20 | 2020-09-01 | 江苏日研精工智能制造有限公司 | Filter casing processing is with concentrating dissolving stove exhaust treatment system |
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2008
- 2008-09-25 CN CN200810168457A patent/CN101686027A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102759142A (en) * | 2011-04-29 | 2012-10-31 | 姚福来 | Heat-pipe heating and heat-pipe power generation method for cold regions |
| CN106055048A (en) * | 2016-05-19 | 2016-10-26 | 唐坤剑 | Computer heat-dissipation device |
| CN105897061A (en) * | 2016-05-31 | 2016-08-24 | 安徽省冠盛纺织科技有限公司 | Heat energy collection and application device of two-for-one twister |
| CN108390592A (en) * | 2018-02-22 | 2018-08-10 | 北京林业大学 | A kind of power generator of with acquiring light energy mix |
| CN111609720A (en) * | 2020-05-20 | 2020-09-01 | 江苏日研精工智能制造有限公司 | Filter casing processing is with concentrating dissolving stove exhaust treatment system |
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