CN113273588B - Adjustable wafer crispy cone die device - Google Patents
Adjustable wafer crispy cone die device Download PDFInfo
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- CN113273588B CN113273588B CN202110611612.4A CN202110611612A CN113273588B CN 113273588 B CN113273588 B CN 113273588B CN 202110611612 A CN202110611612 A CN 202110611612A CN 113273588 B CN113273588 B CN 113273588B
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- groove
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- 238000000926 separation method Methods 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 claims description 12
- 230000003028 elevating effect Effects 0.000 claims description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 2
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 2
- 241001330002 Bambuseae Species 0.000 claims description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 2
- 239000011425 bamboo Substances 0.000 claims description 2
- 235000013305 food Nutrition 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 235000012773 waffles Nutrition 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- A—HUMAN NECESSITIES
- A21—BAKING; EDIBLE DOUGHS
- A21C—MACHINES OR EQUIPMENT FOR MAKING OR PROCESSING DOUGHS; HANDLING BAKED ARTICLES MADE FROM DOUGH
- A21C11/00—Other machines for forming the dough into its final shape before cooking or baking
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The invention relates to a food processing device, in particular to an adjustable wafer crispy barrel die device which comprises a main frame mechanism, an adjusting swing arm, an adjustable lifting mechanism and a die mechanism, wherein the adjustable lifting mechanism is fixedly arranged on the main frame mechanism and is in threaded connection with the die mechanism, the die mechanism is fixedly connected with the main frame mechanism, the adjusting swing arm is slidably arranged in a groove arranged on the main frame mechanism, and the adjusting swing arm is hinged with the die mechanism; the device can produce two types of wafer crisp cylinders with different specifications and sizes, thereby meeting the production requirements of different foods.
Description
Technical Field
The invention relates to a food processing device, in particular to an adjustable wafer crispy cone die device.
Background
The present inventors have found that prior art wafer cone molds can only produce wafer cones of one size, but not other sizes according to actual needs.
Disclosure of Invention
The invention mainly solves the technical problem of providing an adjustable wafer crispy cone die device which can produce two wafer crispy cones with different specifications and sizes so as to meet the production requirements of different foods.
The aim of the invention is achieved by the following technical scheme:
the utility model provides an adjustable wafer section of thick bamboo mould device, includes main frame mechanism, adjusts swing arm, adjustable elevating system and mould mechanism, adjustable elevating system fixed mounting on main frame mechanism, adjustable elevating system and mould mechanism threaded connection, mould mechanism and main frame mechanism fixed connection, adjust swing arm slidable mounting in the recess that sets up on main frame mechanism, adjust the swing arm and articulated mutually with mould mechanism.
As a further optimization of the technical scheme, the main frame mechanism of the adjustable wafer crispy cylinder die device comprises a frame plate, a hydraulic cylinder, an extrusion plate, a separation threaded rod, a connecting block, a back motor, a back sprocket and a back chain, wherein the hydraulic cylinder is fixedly arranged on the frame plate, the extrusion plate is fixedly arranged at the output end of the hydraulic cylinder, the extrusion plate is slidably arranged in a groove arranged on the frame plate, the back motor is fixedly arranged on the frame plate, the back sprocket is fixedly arranged at the output end of the back motor, the back sprocket is meshed with the back chain, the back sprocket is fixedly arranged on the separation threaded rod, the separation threaded rod is rotatably arranged in the groove arranged on the frame plate, and the separation threaded rod is in threaded connection with the connecting block.
As a further optimization of the technical scheme, the adjustable wafer crispy cone die device comprises an adjusting swing arm, a frame plate and a frame plate, wherein the adjusting swing arm comprises a track plate and a Zhang Gebei, the opening and closing arm is slidably arranged in a groove arranged on the track plate, and the track plate is slidably arranged in the groove arranged on the frame plate;
the opening and closing arm comprises a sliding block, a first hinge plate, a middle rod, a second hinge plate, a first internal spring and a second internal spring, wherein the sliding block is slidably installed in a groove formed in the track plate, the sliding block is hinged with the first hinge plate, the first internal spring is fixedly installed in the groove of the first hinge plate, the other end of the first internal spring is fixedly installed on the middle rod, the middle rod is slidably installed in the groove formed in the first hinge plate, the second internal spring is fixedly installed in the groove of the second hinge plate, the other end of the second internal spring is fixedly installed on the middle rod, and the middle rod is slidably installed in the groove formed in the second hinge plate.
As a further optimization of the technical scheme, the adjustable lifting mechanism comprises a motor base, a lifting motor, a lifting sprocket, a lifting chain, a first threaded rod, an adjusting sprocket, a second threaded rod, a track groove shell, a tensioning spring, a tensioning slider and a tensioning sprocket, wherein the motor base is fixedly arranged on a frame plate, the track groove shell is fixedly arranged on the frame plate, the lifting motor is fixedly arranged on the motor base, the lifting sprocket is fixedly arranged at the output end of the lifting motor, the lifting sprocket is fixedly arranged on the first threaded rod, the lifting sprocket is meshed with the lifting chain, the lifting chain is meshed with the adjusting sprocket, the adjusting sprocket is fixedly arranged on the second threaded rod, the lifting chain is meshed with the tensioning sprocket, the tensioning sprocket is rotatably arranged in a groove formed in the tensioning slider, the tensioning slider is slidably arranged in the groove formed in the track groove shell, the tensioning spring is fixedly arranged on the tensioning slider, and the other end of the tensioning spring is fixedly arranged on the track groove shell.
As a further optimization of the technical scheme, the die mechanism of the adjustable wafer crispy cylinder die device comprises a top plate, a T-shaped sliding plate, a half-shaped die plate, a first base die plate, a second base die plate, side rail strips and a conical body piece, wherein the T-shaped sliding plate is slidably arranged in a groove formed in the top plate, the T-shaped sliding plate is slidably arranged in a groove formed in the side rail strips, the side rail strips are fixedly arranged on the second base die plate, the conical body piece is fixedly arranged on the top plate, the half-shaped die plate is in contact connection with the conical body piece, the second base die plate is in contact connection with the first base die plate, the first base die plate is fixedly arranged on a frame plate, the top plate is in threaded connection with a first threaded rod, the second threaded rod is in threaded connection with the T-shaped sliding plate, the first threaded rod is rotatably arranged in a groove formed in the first base die plate, the half-shaped die plate is hinged with the second hinge plate, the second base die plate is hinged with the second base die plate, the second base die plate is hinged with the second hinge plate, the second threaded rod is fixedly arranged on the second base die plate, and the connecting block is in the groove formed in the top plate.
The adjustable wafer crispy cone die device has the beneficial effects that:
1. starting a lifting motor, driving a lifting chain wheel to rotate by the lifting chain wheel, driving a first threaded rod to rotate and driving an adjusting chain wheel and a second threaded rod to rotate through a lifting chain, enabling a top plate to be in threaded connection with the first threaded rod, enabling a T-shaped sliding plate to be in threaded connection with the second threaded rod, enabling the top plate and the T-shaped sliding plate to move downwards, driving two half-model plates in a closed state to move downwards, simultaneously extruding an opening and closing arm, enabling a middle rod to stretch out and draw back so as to adapt to extrusion force, enabling the half-model plates to be in first and second base templates, forming a die of the wafer crispy cylinder, enabling the top plate and the T-shaped sliding plate to rise in position after the wafer crispy cylinder is injection molded, starting a back motor, enabling the back motor to drive a back chain wheel to rotate, enabling the back chain wheel to drive a separation threaded rod to rotate, enabling the separation threaded rod to be in threaded connection with a connecting block to be fixedly arranged on the second base template, and enabling the second base template to move to be separated from the first base template at the moment.
2. When another wafer crisp cylinder with the same size is processed, a hydraulic cylinder is started, an extrusion plate is extruded by the hydraulic cylinder to move downwards, an opening and closing arm is extruded to enable Zhang Gebei to be closed, an intermediate rod extrudes an internal spring I and an internal spring II, a half-model plate descends along with the closing of the opening and closing arm and is closed with a model formed by closing a basic template I and a basic template II, at the moment, the half-model plate is a wafer crisp cylinder processing mould, a lifting motor is started to enable a top plate and a T-shaped sliding plate to descend, a cone piece descends, the cone piece and the half-model plate form a mould with the new size, after the wafer crisp cylinder is injection molded, a back motor is started to enable the basic template II to be separated from the basic template I, and the opening and closing arm on the basic template II drives the other half-model plate to synchronously move when the basic template II moves, so that the two closed half-model plates are separated, and the wafer crisp cylinder is separated.
3. When the second basic template moves, the second threaded rod is driven to move, the lifting chain is stretched at the moment, and the tensioning chain wheel drives the tensioning sliding block to extrude the tensioning spring, so that the lifting chain is always in a tensioning state, the lifting chain wheel is ensured to drive the adjusting chain wheel to rotate through the lifting chain, and the adjustable lifting mechanism ensures that the device can be opened and closed without influencing the lifting of the top plate and the T-shaped sliding plate.
Drawings
The invention will be described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is a schematic perspective view of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 2 is a schematic view of a partial perspective view of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 3 is a schematic perspective view of a main frame mechanism 1 of an adjustable wafer crispy cone mold apparatus according to the present invention.
Fig. 4 is a schematic perspective view of a main frame mechanism 1 of an adjustable wafer crispy cone mold apparatus according to the present invention.
Fig. 5 is a schematic perspective view of an adjustable oscillating arm 2 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 6 is a schematic perspective view of the opening and closing arm 2-2 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 7 is a schematic perspective view of the opening and closing arm 2-2 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 8 is a schematic perspective view of an adjustable lifting mechanism 3 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 9 is a schematic perspective view of an adjustable lifting mechanism 3 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 10 is a schematic partial perspective view of an adjustable lifting mechanism 3 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 11 is a schematic perspective view of a mold mechanism 4 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 12 is a schematic partial perspective view of a mold mechanism 4 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 13 is a schematic perspective view of a mold half plate 4-3 of an adjustable wafer cone mold apparatus according to the present invention.
Fig. 14 is a schematic perspective view of the top plate 4-1 and cone member 4-7 of an adjustable wafer cone mold apparatus of the present invention.
Fig. 15 is a schematic view showing a partial perspective view of a mold mechanism 4 of an adjustable wafer cone mold apparatus according to the present invention.
In the figure: a main frame mechanism 1; a frame plate 1-1; 1-2 of a hydraulic cylinder; 1-3 of extrusion plates; separating the threaded rods 1-4; 1-5 connecting blocks; back motor 1-6; back sprocket 1-7; back chain 1-8; adjusting the swing arm 2; track slabs 2-1; an opening and closing arm 2-2; sliding block 2-2-1; 2-2-2 parts of hinged plate; 2-2-3 of intermediate rod; 2-2-4 of hinge plates; 2-2-5 of internal spring; 2-2-6 parts of an internal spring II; an adjustable lifting mechanism 3; a motor base 3-1; a lifting motor 3-2; 3-3 of lifting chain wheels; 3-4 of lifting chains; a first threaded rod 3-5; 3-6 of a sprocket for adjustment; a second threaded rod 3-7; 3-8 of a track groove shell; tensioning springs 3-9; tensioning sliding blocks 3-10; tensioning chain wheels 3-11; a die mechanism 4; a top plate 4-1; a T-shaped slide plate 4-2; 4-3 parts of a half-mould plate; 4-4 of a basic template; 4-5 of a second basic template; side rail strips 4-6; cone member 4-7.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings.
The first embodiment is as follows:
the following describes the embodiment with reference to fig. 1 to 15, an adjustable wafer crispy cone mold device includes a main frame mechanism 1, an adjusting swing arm 2, an adjustable lifting mechanism 3 and a mold mechanism 4, wherein the adjustable lifting mechanism 3 is fixedly installed on the main frame mechanism 1, the adjustable lifting mechanism 3 is in threaded connection with the mold mechanism 4, the mold mechanism 4 is fixedly connected with the main frame mechanism 1, the adjusting swing arm 2 is slidably installed in a groove provided on the main frame mechanism 1, and the adjusting swing arm 2 is hinged with the mold mechanism 4.
The second embodiment is as follows:
in the following description of the present embodiment with reference to fig. 1-15, the first embodiment is further described, where the main frame mechanism 1 includes a frame plate 1-1, a hydraulic cylinder 1-2, a squeeze plate 1-3, a separation threaded rod 1-4, a connection block 1-5, a back motor 1-6, a back sprocket 1-7, and a back chain 1-8, the hydraulic cylinder 1-2 is fixedly installed on the frame plate 1-1, the squeeze plate 1-3 is fixedly installed at the output end of the hydraulic cylinder 1-2, the squeeze plate 1-3 is slidably installed in a groove provided on the frame plate 1-1, the back motor 1-6 is fixedly installed on the frame plate 1-1, the output end of the back motor 1-6 is fixedly installed with a back sprocket 1-7, the back sprocket 1-7 is meshed with the back chain 1-8, the back sprocket 1-7 is fixedly installed on the separation threaded rod 1-4, the separation threaded rod 1-4 is rotatably installed in the groove provided on the frame plate 1-1.
And a third specific embodiment:
in the following, referring to fig. 1-15, a second embodiment is further described, where the adjusting swing arm 2 includes a track plate 2-1 and an opening and closing arm 2-2, the opening and closing arm 2-2 is slidably mounted in a groove provided on the track plate 2-1, and the track plate 2-1 is slidably mounted in a groove provided on the frame plate 1-1;
the opening and closing arm 2-2 comprises a sliding block 2-2-1, a hinge plate I2-2-2, a middle rod 2-2-3, a hinge plate II 2-2-4, an internal spring I2-2-5 and an internal spring II 2-2-6, wherein the sliding block 2-2-1 is slidably arranged in a groove arranged on the track plate 2-1, the sliding block 2-2-1 is hinged with the hinge plate I2-2, the internal spring I2-2-5 is fixedly arranged in a groove of the hinge plate I2-2, the other end of the internal spring I2-5 is fixedly arranged on the middle rod 2-2-3, the middle rod 2-2-3 is slidably arranged in a groove arranged on the hinge plate I2-2-2, the internal spring II 2-2-6 is fixedly arranged in a groove of the II 2-2-4, the other end of the internal spring II 2-2-6 is fixedly arranged on the middle rod 2-3, and the middle rod 2-3 is slidably arranged in a groove arranged on the hinge plate arranged on the II 2-2-4.
The specific embodiment IV is as follows:
in the following description of the second embodiment with reference to fig. 1-15, the second embodiment is further described, where the adjustable lifting mechanism 3 includes a motor base 3-1, a lifting motor 3-2, a lifting sprocket 3-3, a lifting chain 3-4, a first threaded rod 3-5, a lifting chain wheel 3-6, a second threaded rod 3-7, a track groove shell 3-8, a tensioning spring 3-9, a tensioning slider 3-10, and a tensioning sprocket 3-11, the motor base 3-1 is fixedly mounted on the frame plate 1-1, the track groove shell 3-8 is fixedly mounted on the frame plate 1-1, the lifting motor 3-2 is fixedly mounted on the motor base 3-1, the output end of the lifting motor 3-2 is fixedly mounted with the lifting sprocket 3-3, the lifting sprocket 3-3 is fixedly mounted with a first threaded rod 3-5, the lifting sprocket 3-3 is meshed with the lifting chain 3-4, the lifting chain 3-4 is meshed with the adjusting sprocket 3-6, the adjusting sprocket 3-6 is fixedly mounted on the second lifting chain wheel 3-7, the tensioning slider 3-4 is fixedly mounted on the tensioning groove 3-10, the tensioning slider 3-10 is fixedly mounted on the tensioning groove 3-10, and the tensioning slider 3-10 is fixedly mounted on the tensioning groove 3-10.
Fifth embodiment:
in the following description of the third or fourth embodiment with reference to fig. 1-15, the mold mechanism 4 includes a top plate 4-1, a T-shaped slide plate 4-2, a half-mold plate 4-3, a base mold plate one 4-4, a base mold plate two 4-5, side rail strips 4-6, a conical member 4-7, a T-shaped slide plate 4-2 slidably mounted in grooves provided on the top plate 4-1, a T-shaped slide plate 4-2 slidably mounted in grooves provided on the side rail strips 4-6, a side rail strip 4-6 fixedly mounted on the base mold plate two 4-5, a conical member 4-7 fixedly mounted on the top plate 4-1, a half-mold plate 4-3 in contact with the conical member 4-7, a base mold plate two 4-5 in contact with the base mold plate one 4-4, a base mold plate one 4-4 fixedly mounted on the frame plate 1-1, a threaded rod 3-5 threaded the top plate 4-1 in threaded connection with the first threaded rod 3-5, a threaded rod 3-7 in the base 4-2 rotatably mounted on the base mold plate 2-4-5, a threaded rod 4-5 hinged to the base mold plate 2-4-5 hinged to the base mold plate 2, a threaded rod 2-5 hinged to the base mold plate 2-4-5, a threaded rod 2-5 hinged to the base plate 2-4-5, the second threaded rod 3-7 is slidably mounted in a recess provided in the top plate 4-1.
The invention relates to an adjustable wafer crispy cone die device, which has the following working principle:
starting a lifting motor 3-2, driving a lifting chain wheel 3-3 to rotate by the lifting chain wheel 3-2, driving a first threaded rod 3-5 to rotate and driving an adjusting chain wheel 3-6 and a second threaded rod 3-7 to rotate by a lifting chain 3-4, enabling a top plate 4-1 to be in threaded connection with the first threaded rod 3-5, enabling a T-shaped sliding plate 4-2 to be in threaded connection with the second threaded rod 3-7, enabling the top plate 4-1 and the T-shaped sliding plate 4-2 to move downwards at the moment, driving two half-model plates 4-3 in a closed state to move downwards, simultaneously extruding an opening and closing arm 2-2, enabling a middle rod 2-2-3 to stretch out and draw back so as to adapt to extrusion force, enabling the half-model plates 4-3 to be in contact with a first base template 4-4 and a second base template 4-5 to form a die of a waffle cone, enabling a back motor 1-6 to drive a back sprocket 1-7 to rotate after the waffle cone is subjected to be subjected to injection molding, enabling the positions of the top plate 4-1 and the T-shaped sliding plate 4-2 to rise, enabling the back motor 1-6 to drive the back sprocket 1-7 to rotate, enabling the back sprocket 1-4 to be in contact with the threaded rod 1-5 to be in contact with the first base template and the second template 4-5, and the second template is fixedly connected with the second base template 4-5, and the second base template is separated and the first template is fixedly separated and the second template.
When the wafer crisp cylinder with the other specification is processed, the hydraulic cylinder 1-2 is started, the hydraulic cylinder 1-2 extrudes the extrusion plate 1-3 to move downwards, the extrusion opening and closing arm 2-2 is extruded to enable the opening and closing arm 2-2 to be closed, the middle rod 2-2-3 extrudes the first internal spring 2-2-5 and the second internal spring 2-2-6 at the moment, the half-model plate 4-3 descends along with the closing of the opening and closing arm 2-2 and is closed with a model formed by closing the first base template 4-4 and the second base template 4-5, the half-model plate 4-3 is a die for processing the wafer crisp cylinder, the lifting motor 3-2 is started, the top plate 4-1 and the T-shaped sliding plate 4-2 descend, the conical body 4-7 descends, the conical body 4-7 and the half-model plate 4-3 form a die with the new specification, the second base template 4-4 is separated from the first base template, and the second base template 4-5 moves through the upper arm 2-2 when the wafer crisp cylinder is molded, and the half-model plate 4-3 is driven to move to separate the two half-model plates, and the half-model plate 4-3 is synchronously separated.
When the second base template 4-5 moves, the second threaded rod 3-7 is driven to move, and at the moment, the lifting chain 3-4 is stretched, so that the tensioning chain wheel 3-11 drives the tensioning sliding block 3-10 to extrude the tensioning spring 3-9, the lifting chain 3-4 is always in a tensioning state, the lifting chain wheel 3-3 is ensured to drive the adjusting chain wheel 3-6 to rotate through the lifting chain 3-4, and the adjustable lifting mechanism 3 ensures that the device can be opened and closed without influencing the lifting of the top plate 4-1 and the T-shaped sliding plate 4-2.
Of course, the above description is not intended to limit the invention, but rather the invention is not limited to the above examples, and variations, modifications, additions or substitutions within the spirit and scope of the invention will be within the scope of the invention.
Claims (1)
1. An adjustable wafer section of thick bamboo mould device, includes main frame mechanism (1), adjusts swing arm (2), adjustable elevating system (3) and mould mechanism (4), its characterized in that: the adjustable lifting mechanism (3) is fixedly arranged on the main frame mechanism (1), the adjustable lifting mechanism (3) is in threaded connection with the die mechanism (4), the die mechanism (4) is fixedly connected with the main frame mechanism (1), the adjustable swing arm (2) is slidably arranged in a groove arranged on the main frame mechanism (1), and the adjustable swing arm (2) is hinged with the die mechanism (4);
the main frame mechanism (1) comprises a frame plate (1-1), a hydraulic cylinder (1-2), an extrusion plate (1-3), a separation threaded rod (1-4), a connecting block (1-5), a back motor (1-6), a back chain wheel (1-7) and a back chain (1-8), wherein the hydraulic cylinder (1-2) is fixedly arranged on the frame plate (1-1), the extrusion plate (1-3) is fixedly arranged at the output end of the hydraulic cylinder (1-2), the extrusion plate (1-3) is slidably arranged in a groove arranged on the frame plate (1-1), the back motor (1-6) is fixedly arranged on the frame plate (1-1), the output end of the back motor (1-6) is fixedly provided with the back chain wheel (1-7), the back chain wheel (1-7) is meshed with the back chain (1-8), the back chain wheel (1-7) is fixedly arranged on the separation threaded rod (1-4), the separation threaded rod (1-4) is rotatably arranged in the groove arranged on the frame plate (1-1), and the separation threaded rod (1-4) is in threaded connection with the connecting block (1-5);
the adjusting swing arm (2) comprises rail plates (2-1) and Zhang Gebei (2-2), zhang Gebei (2-2) are slidably arranged in grooves formed in the rail plates (2-1), and the rail plates (2-1) are slidably arranged in grooves formed in the frame plates (1-1);
zhang Gebei (2-2) comprises a sliding block (2-2-1), a first hinge plate (2-2-2), a middle rod (2-2-3), a second hinge plate (2-2-4), a first internal spring (2-2-5) and a second internal spring (2-2-6), wherein the sliding block (2-2-1) is slidingly arranged in a groove arranged on the track plate (2-1), the sliding block (2-2-1) is hinged with the first hinge plate (2-2-2), the first internal spring (2-2-5) is fixedly arranged in the groove of the first hinge plate (2-2-2), the other end of the first internal spring (2-2-5) is fixedly arranged on the middle rod (2-2-3), the middle rod (2-2-3) is slidingly arranged in the groove arranged on the first hinge plate (2-2), the second internal spring (2-6) is fixedly arranged in the groove of the second hinge plate (2-2-4), the other end of the second internal spring (2-2-6) is fixedly arranged on the middle rod (2-3), the middle rod (2-2-3) is slidably arranged in a groove arranged on the hinge plate II (2-2-4);
the adjustable lifting mechanism (3) comprises a motor base (3-1), a lifting motor (3-2), a lifting chain wheel (3-3), a lifting chain wheel (3-4), a first threaded rod (3-5), a chain wheel (3-6) for adjustment, a second threaded rod (3-7), a track groove shell (3-8), a tensioning spring (3-9), a tensioning sliding block (3-10) and a tensioning chain wheel (3-11), wherein the motor base (3-1) is fixedly arranged on a frame plate (1-1), the track groove shell (3-8) is fixedly arranged on the frame plate (1), the lifting motor (3-2) is fixedly arranged on the motor base (3-1), the lifting chain wheel (3-3) is fixedly arranged at the output end of the lifting motor (3-2), the first threaded rod (3-5) is fixedly arranged on the lifting chain wheel (3-3), the lifting chain wheel (3-3) is meshed with the lifting chain wheel (3-4), the lifting chain wheel (3-4) is meshed with the chain wheel (3-6) for adjustment, the chain wheel (3-6) for adjustment is fixedly arranged on the second threaded rod (3-6), the lifting chain (3-4) is meshed with the tensioning chain wheel (3-11), the tensioning chain wheel (3-11) is rotatably arranged in a groove formed in the tensioning sliding block (3-10), the tensioning sliding block (3-10) is slidably arranged in a groove formed in the track groove shell (3-8), the tensioning sliding block (3-10) is fixedly provided with a tensioning spring (3-9), and the other end of the tensioning spring (3-9) is fixedly arranged on the track groove shell (3-8);
the die mechanism (4) comprises a top plate (4-1), a T-shaped sliding plate (4-2), a half-model plate (4-3), a first base template (4-4), a second base template (4-5), side rail laths (4-6) and a conical body piece (4-7), wherein the T-shaped sliding plate (4-2) is slidably arranged in a groove arranged on the top plate (4-1), the T-shaped sliding plate (4-2) is slidably arranged in a groove arranged on the side rail lath (4-6), the side rail lath (4-6) is fixedly arranged on the second base template (4-5), the conical body piece (4-7) is fixedly arranged on the top plate (4-1), the half-model plate (4-3) is in contact connection with the conical body piece (4-7), the first base template (4-5) is in contact connection with the first base template (4-4), the top plate (4-1) is fixedly arranged on the frame plate (1-1), the top plate (4-1) is in threaded connection with the first threaded rod (3-5), the second base template (4-7) is in threaded connection with the first threaded rod (4-5) and the first threaded rod (4-5) is arranged on the first threaded rod (4-5), the second threaded rod (3-7) is rotatably arranged in a groove formed in the second base template (4-5), the half-mould plate (4-3) is hinged with the second hinge plate (2-2-4), the second hinge plate (2-2-4) is hinged with the first base template (4-4), the second base template (4-5) is hinged with the second hinge plate (2-2-4), the connecting block (1-5) is fixedly arranged on the second base template (4-5), and the second threaded rod (3-7) is slidably arranged in the groove formed in the top plate (4-1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110611612.4A CN113273588B (en) | 2021-06-02 | 2021-06-02 | Adjustable wafer crispy cone die device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110611612.4A CN113273588B (en) | 2021-06-02 | 2021-06-02 | Adjustable wafer crispy cone die device |
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| CN113273588A CN113273588A (en) | 2021-08-20 |
| CN113273588B true CN113273588B (en) | 2023-04-28 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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