CN113267657A - Ic测试探针结构及其制作方法 - Google Patents
Ic测试探针结构及其制作方法 Download PDFInfo
- Publication number
- CN113267657A CN113267657A CN202110822191.XA CN202110822191A CN113267657A CN 113267657 A CN113267657 A CN 113267657A CN 202110822191 A CN202110822191 A CN 202110822191A CN 113267657 A CN113267657 A CN 113267657A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- semi
- copper foil
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 49
- 238000012360 testing method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 19
- 239000010703 silicon Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 93
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 26
- 239000011889 copper foil Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims description 3
- 239000010956 nickel silver Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 230000008602 contraction Effects 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 3
- 238000012858 packaging process Methods 0.000 abstract description 3
- 238000010998 test method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110822191.XA CN113267657B (zh) | 2021-07-21 | 2021-07-21 | Ic测试探针结构及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110822191.XA CN113267657B (zh) | 2021-07-21 | 2021-07-21 | Ic测试探针结构及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113267657A true CN113267657A (zh) | 2021-08-17 |
CN113267657B CN113267657B (zh) | 2021-10-22 |
Family
ID=77236994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202110822191.XA Active CN113267657B (zh) | 2021-07-21 | 2021-07-21 | Ic测试探针结构及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN113267657B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112730927A (zh) * | 2020-12-29 | 2021-04-30 | 北京纬百科技有限公司 | 一种测试装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW520543B (en) * | 1999-07-08 | 2003-02-11 | Nec Corp | Method for manufacturing a test probe having a sheet body |
CN1431694A (zh) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | 晶圆级测试卡的探针构造及其制造方法 |
JPWO2007017956A1 (ja) * | 2005-08-09 | 2009-02-19 | 株式会社日本マイクロニクス | プローブ組立体 |
CN101680913A (zh) * | 2007-05-30 | 2010-03-24 | M2N公司 | 制作探针针尖的方法 |
CN102749570A (zh) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | 探针台晶圆测试设备以及晶圆测试方法 |
CN103376341A (zh) * | 2012-04-18 | 2013-10-30 | 南茂科技股份有限公司 | 垂直式探针卡及应用其的检测模块 |
CN104459508A (zh) * | 2014-08-13 | 2015-03-25 | 华进半导体封装先导技术研发中心有限公司 | 一种晶圆测试系统和晶圆测试方法 |
-
2021
- 2021-07-21 CN CN202110822191.XA patent/CN113267657B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW520543B (en) * | 1999-07-08 | 2003-02-11 | Nec Corp | Method for manufacturing a test probe having a sheet body |
CN1431694A (zh) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | 晶圆级测试卡的探针构造及其制造方法 |
JPWO2007017956A1 (ja) * | 2005-08-09 | 2009-02-19 | 株式会社日本マイクロニクス | プローブ組立体 |
CN101680913A (zh) * | 2007-05-30 | 2010-03-24 | M2N公司 | 制作探针针尖的方法 |
CN103376341A (zh) * | 2012-04-18 | 2013-10-30 | 南茂科技股份有限公司 | 垂直式探针卡及应用其的检测模块 |
CN102749570A (zh) * | 2012-07-26 | 2012-10-24 | 上海宏力半导体制造有限公司 | 探针台晶圆测试设备以及晶圆测试方法 |
CN104459508A (zh) * | 2014-08-13 | 2015-03-25 | 华进半导体封装先导技术研发中心有限公司 | 一种晶圆测试系统和晶圆测试方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112730927A (zh) * | 2020-12-29 | 2021-04-30 | 北京纬百科技有限公司 | 一种测试装置 |
Also Published As
Publication number | Publication date |
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CN113267657B (zh) | 2021-10-22 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Structure and Fabrication Method of IC Test Probe Effective date of registration: 20221214 Granted publication date: 20211022 Pledgee: CITIC Bank Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN ZHIJIN ELECTRONICS Co.,Ltd. Registration number: Y2022980027461 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20240102 Granted publication date: 20211022 Pledgee: CITIC Bank Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN ZHIJIN ELECTRONICS Co.,Ltd. Registration number: Y2022980027461 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Structure and fabrication method of IC testing probe Granted publication date: 20211022 Pledgee: CITIC Bank Limited by Share Ltd. Shenzhen branch Pledgor: SHENZHEN ZHIJIN ELECTRONICS Co.,Ltd. Registration number: Y2024980000367 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |