CN113258993B - Communication interface circuit and control device of PAM4 optical module - Google Patents
Communication interface circuit and control device of PAM4 optical module Download PDFInfo
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- CN113258993B CN113258993B CN202110792818.1A CN202110792818A CN113258993B CN 113258993 B CN113258993 B CN 113258993B CN 202110792818 A CN202110792818 A CN 202110792818A CN 113258993 B CN113258993 B CN 113258993B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/03—Arrangements for fault recovery
- H04B10/032—Arrangements for fault recovery using working and protection systems
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/03—Arrangements for fault recovery
- H04B10/038—Arrangements for fault recovery using bypasses
Abstract
The invention relates to a communication interface circuit of PAM4 optical module and a control device thereof, wherein, the communication interface circuit also comprises: the IIC channel switching unit is respectively connected with the QSFP-DD golden finger, the MCU control unit and the DSP PAM4 coding unit; the IIC channel switching unit is used for realizing communication between the QSFP-DD golden finger and the MCU control unit or communication between the QSFP-DD golden finger and the DSP PAM4 coding unit according to the switching information of the QSFP-DD golden finger and a preset switching logic. A PAM4 light module control apparatus, the apparatus comprising: such as the communication interface circuit and the user EVB board control unit connected with the communication interface circuit through IIC-4 and/or the DSP EVB board control unit and the GUI connected with the communication interface circuit through IIC-5.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a communication interface circuit and a control device of a PAM4 optical module.
Background
Since IEEE passed through IEEE802.3ae, which is an Ethernet standard with a speed of 10Gbps, in 2002, Ethernet is stepped into a fast lane developing to 10G and higher, particularly cloud computing and large data center transmission are rapidly developed, and a new generation of optical modules with higher speed, smaller volume and lower power consumption are required in the market. PAM4 is one of PAM (Pulse Amplitude modulation) modulation techniques, and a hot-gate signal transmission technique in which a PAM signal is followed by NRZ (Non-Return-to-Zero) is also representative of a multi-order modulation technique. The traditional digital signal adopts NRZ (Non-Return-to-Zero) signal at most, that is, 1, 0 information of digital logic signal is expressed by 2 amplitude levels, and each symbol transmits 1 bit information; the PAM4 signal may take 4 amplitude levels, with each symbol conveying 2 bits of information. The PAM4 technology is a more efficient modulation technology, can effectively improve bandwidth utilization efficiency, is a popular signal transmission technology for high-speed signal interconnection in next-generation data centers, and is widely applied to transmission of electrical signals or optical signals of 50G/200G/400G interfaces.
In a traditional NRZ modulation optical module, CDR chips are selected in a transmitter and a receiver to realize shaping recovery of NRZ modulation signals; for a high-order PAM4 signal, under the same transmitter/receiver amplitude, in order to ensure that 4 levels can be well distinguished, the optimal choice is to distribute the 4 levels at equal intervals to ensure the linearity of the PAM4 signal, so a DSP chip with stronger linear coding needs to be selected for implementation.
Currently, DSP chip manufacturers develop a Demo evaluation board and GUI debugging software matched with DSP chips, so that optical module developers can quickly become familiar with a debugging method of the DSP chips, and the development progress is accelerated; in the traditional communication interface circuit of the PAM4 optical module, if a Demo evaluation board of a DSP manufacturer is used for debugging, the optical module needs to be disassembled again, and an IIC communication interface of the DSP needs to be connected by an electric iron flying wire, so that secondary operation is troublesome, and electronic components on the optical module are easily damaged.
Because the bottom layer algorithm of the DSP is complex and the requirement on the development threshold of the optical module is high, a new, direct and effective communication interface circuit of the PAM4 optical module needs to be found, the Demo evaluation board of a DSP chip manufacturer can be directly connected without re-dismantling the optical module, the algorithm of the DSP chip in the optical module is debugged, and the development cycle of the DSP PAM4 optical module is greatly shortened.
Disclosure of Invention
Technical problem to be solved
In view of the above drawbacks and deficiencies of the prior art, the present invention provides a communication interface circuit and a control device for a PAM4 optical module, which solves the technical problem that the debugging of the optical module with a DSP requires the cover to be removed.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
in a first aspect, an embodiment of the present invention provides a communication interface circuit of a PAM4 optical module, where the communication interface circuit further includes: the IIC channel switching unit is respectively connected with the QSFP-DD golden finger, the MCU control unit and the DSP PAM4 coding unit;
the IIC channel switching unit is used for realizing communication between the QSFP-DD golden finger and the MCU control unit or communication between the QSFP-DD golden finger and the DSP PAM4 coding unit according to the switching information of the QSFP-DD golden finger and a preset switching logic.
Preferably, the first and second liquid crystal materials are,
the IIC channel switching unit comprises a Set control port, an IIC channel first control port, an IIC channel second control port and an IIC channel third control port.
Preferably, the first and second liquid crystal materials are,
the Set control port of the IIC channel switching unit and the first control port of the IIC channel are respectively connected with the QSFP-DD golden finger;
the IIC channel second control port of the IIC channel switching unit is connected with the MCU control unit;
and the third IIC channel control port of the IIC channel switching unit is connected with the DSP PAM4 coding unit.
Preferably, the first and second liquid crystal materials are,
the QSFP-DD golden finger comprises a ModSell pin.
Preferably, the first and second liquid crystal materials are,
and a Set control port of the IIC channel switching unit is connected with a ModSell pin in the QSFP-DD golden finger.
Preferably, the first and second liquid crystal materials are,
the switching information of the QSFP-DD golden finger comprises a level value of a ModSell pin.
Preferably, the first and second liquid crystal materials are,
the preset switching logic comprises:
when the level value of the ModSell pin is a low level, the first control port of the IIC channel in the IIC channel switching unit is communicated with the second control port of the IIC channel, and further the QSFP-DD golden finger is communicated with the MCU control unit through the IIC channel switching unit;
when the level value of the ModSell pin is high, the first control port of the IIC channel in the IIC channel switching unit is communicated with the third control port of the IIC channel, and further communication between the QSFP-DD golden finger and the DSP PAM4 coding unit through the IIC channel switching unit is achieved.
Preferably, the first and second liquid crystal materials are,
the IIC channel switching unit is a high-speed IIC switch integrated with a 1:2 multiplexer and a separator.
Preferably, the first and second liquid crystal materials are,
the IIC channel switching unit is as follows: TS3USB30 switch chip.
In a second aspect, an embodiment of the present invention provides a PAM4 light module control apparatus, where the apparatus includes: the communication interface circuit comprises any one of the communication interface circuit and a user EVB board control unit connected with the communication interface circuit through a first IIC channel and/or a DSP EVB board control unit connected with the communication interface circuit through a second IIC channel.
(III) advantageous effects
The invention has the beneficial effects that: according to the communication interface circuit and the control device of the PAM4 optical module, due to the adoption of the IIC channel switching unit, compared with the prior art, the data channel can be switched through the Set control port, the Set control port can be connected with the golden finger ModSelL pin, at the moment, the user EVB board control unit can perform normal read-write operation with the MCU control unit through the IIC channel switching unit, and the optical module enters a normal working mode and can perform optical module parameter debugging work; the DSP EVB board control unit can be directly loaded and controlled through the IIC channel switching unit and the DSP PAM4 coding unit, the EVB board and the GUI provided by a DSP chip manufacturer are adopted to directly debug the DSP chip, the debugging method is simple and convenient, the debugging algorithm provided by the chip manufacturer can be fully utilized, the optical module does not need to be disassembled, and secondary damage caused by the disassembly of the optical module is reduced.
Drawings
Fig. 1 is a schematic diagram of a communication interface circuit of a PAM4 optical module according to the present invention;
fig. 2 is a schematic structural diagram of a PAM4 optical module control apparatus according to the present invention.
Detailed Description
For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings.
In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Referring to fig. 1, the present embodiment provides a communication interface circuit of a PAM4 optical module, where the communication interface circuit further includes:
the IIC channel switching unit is respectively connected with the QSFP-DD golden finger, the MCU control unit and the DSP PAM4 coding unit;
the IIC channel switching unit is used for realizing communication between the QSFP-DD golden finger and the MCU control unit or communication between the QSFP-DD golden finger and the DSP PAM4 coding unit according to the switching information of the QSFP-DD golden finger and a preset switching logic.
The IIC channel switching in this embodiment distinguishes two application environments, which are:
when the PAM4 optical module is connected with the switch through the QSFP-DD golden finger, the switch interface controls the ModSelL pin through controlling the QSFP-DD optical module golden finger, and when the ModSelL is set to be a low-level value, the HOST side switch responds to communicate with the MCU in the module; and when the ModSelL is set to be a high-level value, the HOST side switch and the MCU in the module do not respond to communication any more, and the requirements are met according to the communication protocol of the optical module. For example, optical module communication protocol: QSFP-DD-Hardware-rev5p 0.
When the PAM4 optical module is produced or researched, the optical module is connected with the test board through a QSFP-DD golden finger, the ModSelL pin on the QSFP-DD golden finger is controlled, the ModSelL pin is artificially controlled, the ModSelL pin is set to be a low level value, the EVB test board of a user responds to and communicates with the MCU in the module, and the MCU indirectly communicates with the DSP; and the ModSelL is set to be a high-level value, and a DSP EVB test board of a chip manufacturer directly responds to and communicates with a DSP in the module to directly debug the DSP.
In this embodiment, the QSFP-DD gold finger: the optical module is a golden finger interface type in multiple packaging types of the optical module and is used for the connection of the communication between the interior of the optical module and a switch.
The MCU controller unit in this embodiment: as a signal processing main control unit, the MCU controller unit is connected with a golden finger of the optical module through an IIC channel switching unit IIC _0 control port; the MCU controller unit is connected with the DSP PAM4 coding unit through an IIC _3 control port or an MDIO control port to realize the read-write operation of the DSP PAM4 coding chip; the MCU controller unit is in communication connection with the EEPROM/Flash unit through the SPI interface, and the read-write operation of the EEPROM/Flash unit is realized.
In this embodiment, the DSP PAM4 encoding unit: the device is used for realizing PAM4 coding, shaping and balance compensation of NRZ/PAM4 modulation signals input by a golden finger end, and loading the signals to a laser through a laser emitting driver for light emitting output; the driver is also used for performing clock recovery, amplification and equalization processing on a four-level PAM4 signal input by the receiving optical component driver, and finally outputting an electric signal through the optical module QSFP-DD golden finger.
In the embodiment, the MCU controller and the DSP PAM4 coding chip are connected with the EEPROM/Flash unit through the SPI control port and are used for storing a bottom firmware program of the DSP PAM4 coding chip, after the module is manufactured, the program of the MCU is burnt firstly, then the DSP bottom firmware is burnt into the EEPROM/Flash chip by the MCU through a control command, the optical module is set to be a high level through controlling RESET when the MCU is electrified and started subsequently every time, and the DSP coding chip can automatically load the firmware in the EEPROM/Flash.
In this embodiment, the IIC channel switching unit includes a Set control port, an IIC channel first control port, an IIC channel second control port, and an IIC channel third control port.
Referring to FIG. 1, in the present embodiment, the first control port of the IIC channel is IIC-0 in FIG. 1, the second control port of the IIC channel is IIC-1 in FIG. 1, and the third control port of the IIC channel is IIC-2 in FIG. 1.
In this embodiment, the Set control port of the IIC channel switching unit and the IIC channel first control port are respectively connected with the QSFP-DD golden finger;
the IIC channel second control port of the IIC channel switching unit is connected with the MCU control unit;
and the third IIC channel control port of the IIC channel switching unit is connected with the DSP PAM4 coding unit.
In this embodiment, the QSFP-DD gold finger includes a ModSell pin.
In this embodiment, a Set control port of the IIC channel switching unit is connected to a ModSell pin in the QSFP-DD golden finger.
In this embodiment, the switching information of the QSFP-DD golden finger includes a level value of a ModSell pin.
In this embodiment, the preset switching logic includes:
when the level value of the ModSell pin is a low level, the first control port of the IIC channel in the IIC channel switching unit is communicated with the second control port of the IIC channel, and further the QSFP-DD golden finger is communicated with the MCU control unit through the IIC channel switching unit;
when the level value of the ModSell pin is high, the first control port of the IIC channel in the IIC channel switching unit is communicated with the third control port of the IIC channel, and further communication between the QSFP-DD golden finger and the DSP PAM4 coding unit through the IIC channel switching unit is achieved.
In this embodiment, the IIC channel switching unit is a high-speed IIC switch integrated with a 1:2 multiplexer and a separator.
In this embodiment, the IIC channel switching unit is: TS3USB30 switch chip in this embodiment TS3USB30 switch chip, it is a high speed 1:2 multiplexer and demultiplexer IIC channel switch chip.
Referring to fig. 2, in another aspect, the present embodiment further provides a PAM4 light module control apparatus, where the apparatus includes:
the device comprises: the communication interface circuit comprises any one of the communication interface circuit and a user EVB board control unit connected with the communication interface circuit through a first IIC channel and/or a DSP EVB board control unit connected with the communication interface circuit through a second IIC channel.
The first IIC channel in this embodiment is IIC-4 in FIG. 2; the second IIC channel is IIC-5 in FIG. 2.
In this embodiment, if the communication interface circuit in the PAM4 optical module control apparatus is connected to the user EVB board control unit through the first IIC channel IIC-4 and the DSP EVB board control unit connected to the communication interface circuit through the second IIC channel IIC-5, respectively.
When the IIC channel switching control pin is Set to be at a low level Set =0, IIC _0 is communicated with IIC _1, at the moment, the user EVB board control unit can perform normal read-write operation with the MCU control unit through the first IIC channel IIC _4 through IIC _0, and the optical module enters a normal working mode and can perform optical module parameter debugging work.
When the IIC channel switching control pin is Set to be high level Set =1, IIC _0 is communicated with IIC _2, at the moment, the DSP EVB board control unit can be directly loaded and controlled through the IIC _2 and the DSP PAM4 coding unit through the second IIC channel IIC _5, the DSP chip is directly debugged by adopting the EVB board and the GUI provided by a DSP chip manufacturer, the debugging method is simple and convenient, the debugging algorithm provided by the chip manufacturer can be fully utilized, the optical module does not need to be disassembled, and secondary damage caused by the disassembly of the optical module is reduced.
In the PAM4 optical module control device in this embodiment, since the IIC channel switching unit is used, compared with the prior art, it is possible to perform data channel switching through a Set control port, where the Set control port may be connected to a gold finger ModSelL pin, at this time, a user EVB board control unit may perform normal read-write operation with an MCU control unit through the IIC channel switching unit, and an optical module enters a normal module, and may perform optical module parameter debugging; the DSP EVB board control unit can be directly loaded and controlled through the IIC channel switching unit and the DSP PAM4 coding unit, the EVB board and the GUI provided by a DSP chip manufacturer are adopted to directly debug the DSP chip, the debugging method is simple and convenient, the debugging algorithm provided by the chip manufacturer can be fully utilized, the optical module does not need to be disassembled, and secondary damage caused by the disassembly of the optical module is reduced.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.
Claims (9)
1. A communication interface circuit of a PAM4 optical module, the communication interface circuit further comprising:
the IIC channel switching unit is respectively connected with the QSFP-DD golden finger, the MCU control unit and the DSP PAM4 coding unit;
the IIC channel switching unit is used for realizing communication between the QSFP-DD golden finger and the MCU control unit or communication between the QSFP-DD golden finger and the DSP PAM4 coding unit according to the switching information of the QSFP-DD golden finger and a preset switching logic.
2. The communication interface circuit of claim 1,
the IIC channel switching unit comprises a Set control port, an IIC channel first control port, an IIC channel second control port and an IIC channel third control port.
3. The communication interface circuit of claim 2,
the Set control port of the IIC channel switching unit and the first control port of the IIC channel are respectively connected with the QSFP-DD golden finger;
the IIC channel second control port of the IIC channel switching unit is connected with the MCU control unit;
and the third IIC channel control port of the IIC channel switching unit is connected with the DSP PAM4 coding unit.
4. The communication interface circuit of claim 3,
the QSFP-DD golden finger comprises a ModSell pin.
5. The communication interface circuit of claim 4,
and a Set control port of the IIC channel switching unit is connected with a ModSell pin in the QSFP-DD golden finger.
6. The communication interface circuit of claim 5,
the switching information of the QSFP-DD golden finger comprises a level value of a ModSell pin.
7. The communication interface circuit of claim 6,
the preset switching logic comprises:
when the level value of the ModSell pin is a low level, the first control port of the IIC channel in the IIC channel switching unit is communicated with the second control port of the IIC channel, and further the QSFP-DD golden finger is communicated with the MCU control unit through the IIC channel switching unit;
when the level value of the ModSell pin is high, the first control port of the IIC channel in the IIC channel switching unit is communicated with the third control port of the IIC channel, and further communication between the QSFP-DD golden finger and the DSP PAM4 coding unit through the IIC channel switching unit is achieved.
8. The communication interface circuit of claim 7,
the IIC channel switching unit is a high-speed IIC switch integrated with a 1:2 multiplexer and a separator.
9. A PAM4 light module control apparatus, characterized in that the apparatus comprises:
the communication interface circuit of any of claims 1-8 and a user EVB board control unit connected to the communication interface circuit via a first IIC channel and/or a DSP EVB board control unit connected to the communication interface circuit via a second IIC channel.
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