CN116232467B - 200G optical module circuit, control method and interface - Google Patents

200G optical module circuit, control method and interface Download PDF

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Publication number
CN116232467B
CN116232467B CN202310495272.2A CN202310495272A CN116232467B CN 116232467 B CN116232467 B CN 116232467B CN 202310495272 A CN202310495272 A CN 202310495272A CN 116232467 B CN116232467 B CN 116232467B
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driving
optical
signal
chip
information
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CN116232467A (en
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杨德瑞
鲁光辉
鲁伟帆
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Shenzhen Fibertop Technology Co ltd
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Shenzhen Fibertop Technology Co ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Abstract

The application relates to the technical field of optical modules and discloses a 200G optical module circuit, a control method and an interface, wherein the 200G optical module circuit comprises a golden finger interface, an optical module controller, a driving unit, an optical transmitting/receiving assembly and a rate control circuit, wherein the optical module controller, the driving unit, the optical transmitting/receiving assembly and the rate control circuit are connected with a power supply circuit; the golden finger interface, the speed control circuit and the driving unit are sequentially connected; the optical module controller is connected with the golden finger interface, the optical receiving assembly, the driving unit and the speed control circuit, and the driving unit is connected with the optical transmitting/receiving assembly; the golden finger interface receives/outputs the electro-optical conversion signal/outputs the electric signal, the optical module controller determines the input/output driving information of the electro-optical/photoelectric conversion signal based on a preset modulation table, the speed control circuit drives the driving unit, the driving unit obtains the input/output optical/electric signal for the electro-optical/photoelectric conversion signal according to the input/output driving information, and the optical transmitting/receiving assembly outputs/receives the signal. The functionality of the optical module is improved.

Description

200G optical module circuit, control method and interface
Technical Field
The present invention relates to the field of optical modules, and in particular, to a 200G optical module circuit, a control method, and an interface.
Background
With the development of optical modules, the use of optical modules in various fields is also more and more frequent, but with the pursuit of higher parameter rates.
The traditional optical module circuit is designed in an optical module interface through a Digital Signal Processor (DSP) chip, and realizes optical module application with different speed requirements through a DSP chip integrated design speed transmission line.
Disclosure of Invention
The invention mainly aims to provide a 200G optical module circuit, a control method and an interface, and aims to solve the technical problem of improving the functionality of an optical module.
In order to achieve the above purpose, the invention provides a 200G optical module circuit, which comprises a golden finger interface, a power supply circuit, an optical module controller, a driving unit, an optical interface unit and a rate control circuit, wherein the optical interface unit comprises an optical emission component and an optical receiving component;
The power supply circuit is respectively connected with the optical module controller, the driving unit, the light emitting assembly, the light receiving assembly and the speed control circuit, the golden finger interface, the speed control circuit and the driving unit are sequentially connected, the optical module controller is respectively connected with the golden finger interface, the light receiving assembly, the driving unit and the speed control circuit, and the driving unit is respectively connected with the light emitting assembly and the light receiving assembly;
the golden finger interface is used for receiving an electric-optical conversion signal, the optical module controller is used for determining an input speed control instruction based on the electric-optical conversion signal, selecting input driving information corresponding to the input speed control instruction from a preset modulation table, the speed control circuit is used for driving the driving unit based on the input driving information, the driving unit after driving is used for carrying out speed processing on the electric-optical conversion signal to obtain an input optical signal, and the optical emission component is used for outputting the input optical signal;
the optical receiving assembly is used for receiving photoelectric conversion signals, the optical module controller is used for determining output speed control instructions based on the photoelectric conversion signals, output driving information corresponding to the output speed control instructions is selected in the modulation table, the speed control circuit is used for driving the driving unit based on the output driving information, the driving unit after driving is used for carrying out speed processing on the photoelectric conversion signals to obtain output electric signals, and the golden finger interface is used for outputting the output electric signals.
Optionally, the driving unit includes a first driving chip, a second driving chip, a third driving chip and a fourth driving chip;
the first end of the first driving chip, the first end of the second driving chip, the first end of the third driving chip and the first end of the fourth driving chip are respectively connected with the speed control circuit, the second end of the first driving chip, the second end of the second driving chip, the second end of the third driving chip and the second end of the fourth driving chip are respectively connected with the light emitting component and the light receiving component, the control end of the first driving chip, the control end of the second driving chip, the control end of the third driving chip and the control end of the fourth driving chip are respectively connected with the optical module controller, and the power end of the first driving chip, the power end of the second driving chip, the power end of the third driving chip and the power end of the fourth driving chip are respectively connected with the power supply circuit.
Optionally, the first driving chip, the second driving chip, the third driving chip and the fourth driving chip include modulation conversion chips, the modulation conversion chips include a medium access control unit, a second physical medium attachment sublayer and a physical medium related sublayer, the medium access control unit includes a physical coding sublayer and a first physical medium attachment sublayer, and the rate control circuit, the physical coding sublayer, the first physical medium attachment sublayer, the second physical medium attachment sublayer, the physical medium related sublayer and the optical interface unit are sequentially connected.
Optionally, the modulation conversion chip further includes a first return-to-zero modulation line group, a first pulse modulation line, a selection circuit and a second return-to-zero modulation line group, the selection circuit includes a modulation selector, the first return-to-zero modulation line group is connected to the first physical medium adhesion sublayer and the second physical medium adhesion sublayer, the second physical medium adhesion sublayer is connected to an input end of the modulation selector, a first output end of the modulation selector is connected to an input end of the first pulse modulation line, a second output end of the modulation selector is connected to an input end of the second return-to-zero modulation line group, a control end of the modulation selector is connected to the optical module controller, an output end of the first pulse modulation line and an output end of the second return-to-zero modulation line group are connected to the physical medium correlation sublayer, wherein the first return-to-zero modulation line group and the second single-channel return-to-zero modulation line group include two return-to-zero modulation lines, the first pulse modulation line includes a single-channel modulation line, and the first pulse modulation line includes a selector.
Optionally, the rate control circuit includes a rate selector, a control end of the rate selector is connected with the optical module controller, an input end of the rate selector is connected with the golden finger interface, and an output end of the rate selector is respectively connected with the first end of the first driving chip, the first end of the second driving chip, the first end of the third driving chip and the first end of the fourth driving chip, wherein the rate selector includes a multichannel selector.
Optionally, the light emitting component comprises a laser and a first optical device, wherein an input end of the laser is connected with an external laser controller, an output end of the laser is connected with an input end of the first optical device, and an output end of the first optical device is connected with a second end of a first driving chip, a second end of a second driving chip, a second end of a third driving chip and a second end of a fourth driving chip in the driving unit;
the optical receiving assembly comprises an optical detector and a second optical device, wherein the second end of the first driving chip, the second end of the second driving chip, the second end of the third driving chip and the second end of the fourth driving chip are connected with the input end of the second optical device, the output end of the second optical device is connected with the input end of the optical detector, and the output end of the optical detector is connected with an external laser receiver, wherein the first optical device comprises a four-way demultiplexer, and the second optical device comprises a four-way multiplexer.
In addition, in order to achieve the above object, the present invention further provides a 200G optical module control method, where the 200G optical module control method is applied to the 200G optical module circuit, and the steps of the 200G optical module control method include:
If a conversion signal is received, determining target driving information according to the conversion signal, wherein when the conversion signal is an electric-optical conversion signal, the target driving information is input driving information; when the conversion signal is a photoelectric conversion signal, the target driving information is output driving information;
and carrying out rate processing on the conversion signal according to the target driving information to obtain a target signal and outputting the target signal, wherein the target signal is an input optical signal when the target driving information is input driving information, and the target signal is an output electrical signal when the target driving information is output driving information.
Optionally, the step of determining the target driving information according to the switching signal includes:
determining signal characteristics of the converted signals, and searching matching characteristics matched with the signal characteristics in a preset modulation table;
determining a chip selection instruction and a modulation selection instruction corresponding to the matching characteristics, and summarizing the chip selection instruction and the modulation selection instruction to be used as a rate control instruction;
and determining target driving information corresponding to the rate control instruction in the modulation table.
Optionally, the step of performing rate processing on the converted signal according to the target driving information to obtain a target signal includes:
determining chip conduction information in the target driving information, and if the chip conduction information is matched with preset first conduction information, determining a first quasi signal based on rate processing of a first driving chip in a first conduction information conduction driving unit;
if the chip conduction information is matched with preset second conduction information, performing rate processing on a first driving chip and a second driving chip in the second conduction information conduction driving unit to determine a second quasi-signal;
if the chip conduction information is matched with preset third conduction information, performing rate processing on a first driving chip, a second driving chip and a third driving chip in the third conduction information conduction driving unit to determine a third quasi signal;
if the chip conduction information is matched with preset fourth conduction information, carrying out rate processing on a first driving chip, a second driving chip, a third driving chip and a fourth driving chip in a conduction driving unit based on the fourth conduction information to determine a fourth quasi signal;
And determining modulation selection information in the target driving information, conducting a modulation circuit based on the modulation selection information and the chip conducting information, and modulating the first analog signal, the second analog signal, the third analog signal or the fourth analog signal based on the conducted modulation circuit to obtain an output signal.
In addition, in order to achieve the above purpose, the present invention further provides a 200G optical module interface, where the 200G optical module interface is used for loading the 200G optical module circuit, and the 200G optical module interface includes a built-in circuit board and a housing, where the built-in circuit board is provided with the 200G optical module circuit, and the built-in circuit board is encapsulated in the housing.
The invention provides a 200G optical module circuit, which comprises a golden finger interface, a power supply circuit, an optical module controller, a driving unit, an optical interface unit and a rate control circuit, wherein the optical interface unit comprises an optical emission component and an optical receiving component; the power supply circuit is respectively connected with the optical module controller, the driving unit, the light emitting assembly, the light receiving assembly and the speed control circuit, the golden finger interface, the speed control circuit and the driving unit are sequentially connected, the optical module controller is respectively connected with the golden finger interface, the light receiving assembly, the driving unit and the speed control circuit, and the driving unit is respectively connected with the light emitting assembly and the light receiving assembly; the golden finger interface is used for receiving an electric-optical conversion signal, the optical module controller is used for determining an input speed control instruction based on the electric-optical conversion signal, selecting input driving information corresponding to the input speed control instruction from a preset modulation table, the speed control circuit is used for driving the driving unit based on the input driving information, the driving unit after driving is used for carrying out speed processing on the electric-optical conversion signal to obtain an input optical signal, and the optical emission component is used for outputting the input optical signal; the optical receiving assembly is used for receiving photoelectric conversion signals, the optical module controller is used for determining output speed control instructions based on the photoelectric conversion signals, output driving information corresponding to the output speed control instructions is selected in the modulation table, the speed control circuit is used for driving the driving unit based on the output driving information, the driving unit after driving is used for carrying out speed processing on the photoelectric conversion signals to obtain output electric signals, and the golden finger interface is used for outputting the output electric signals. And determining an input/output rate control instruction through the electro-optical conversion signal, further determining input/output driving information according to the input/output rate control instruction, finally performing rate processing on the conversion signal based on the input/output driving information in the driving unit, and inputting or outputting the signal. Therefore, the phenomenon that the requirements of different speeds of the optical module can be met only by specially designing the DSP chip in the prior art is avoided, the converted signals are subjected to speed processing based on the input/output driving information in the driving unit, and the signals are input or output, so that the function of the optical module can be realized without using the DSP chip, and the functionality of the optical module is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a 200G optical module circuit according to the present invention;
FIG. 2 is a schematic diagram showing the internal connection of a driving unit in a 200G optical module circuit according to the present invention;
FIG. 3 is a schematic diagram showing the connection between a modulation conversion chip and a rate control circuit in the 200G optical module circuit according to the present invention;
FIG. 4 is a schematic diagram showing the connection of a light emitting module and a light receiving module in a 200G optical module circuit according to the present invention;
FIG. 5 is a flowchart illustrating a control method of a 200G optical module according to a first embodiment of the present invention;
FIG. 6 is a schematic diagram of a clock circuit according to an embodiment of the 200G optical module circuit of the present invention;
fig. 7 is a schematic circuit connection diagram of a power-on slow start circuit of a power supply circuit in the 200G optical module circuit of the present invention.
Reference numerals illustrate:
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
For clarity and brevity of description of the following embodiments, a brief description of a 200G optical module circuit is first given:
the traditional 200G optical module circuit generally needs to use a DSP chip to realize the 200G, 400G or other speed requirements, and the use cost of the DSP is high, so that the use cost of the DSP is not high in matching degree with the function of the optical module realized by the DSP (the basic function of the optical module is not in accordance with the design concept in pursuing the high cost), the optical modules with different speeds designed by the DSP can only be processed by using a single modulation mode, the selectivity of the speed is not high because of channel determination, and the functionality of the optical module is greatly reduced on the side face. Based on the common problems of the existing 200G optical module, the technical scheme of the application is provided.
The scheme provides a 200G optical module circuit, which comprises a golden finger interface, a power supply circuit, an optical module controller, a driving unit, an optical interface unit and a rate control circuit, wherein the optical interface unit comprises an optical emission component and an optical receiving component; the power supply circuit is respectively connected with the optical module controller, the driving unit, the light emitting assembly, the light receiving assembly and the speed control circuit, the golden finger interface, the speed control circuit and the driving unit are sequentially connected, the optical module controller is respectively connected with the golden finger interface, the light receiving assembly, the driving unit and the speed control circuit, and the driving unit is respectively connected with the light emitting assembly and the light receiving assembly; the golden finger interface is used for receiving an electric-optical conversion signal, the optical module controller is used for determining an input speed control instruction based on the electric-optical conversion signal, selecting input driving information corresponding to the input speed control instruction from a preset modulation table, the speed control circuit is used for driving the driving unit based on the input driving information, the driving unit after driving is used for carrying out speed processing on the electric-optical conversion signal to obtain an input optical signal, and the optical emission component is used for outputting the input optical signal; the optical receiving assembly is used for receiving photoelectric conversion signals, the optical module controller is used for determining output speed control instructions based on the photoelectric conversion signals, output driving information corresponding to the output speed control instructions is selected in the modulation table, the speed control circuit is used for driving the driving unit based on the output driving information, the driving unit after driving is used for carrying out speed processing on the photoelectric conversion signals to obtain output electric signals, and the golden finger interface is used for outputting the output electric signals. And determining an input/output rate control instruction through the electro-optical conversion signal, further determining input/output driving information according to the input/output rate control instruction, finally performing rate processing on the conversion signal based on the input/output driving information in the driving unit, and inputting or outputting the signal. Therefore, the phenomenon that the requirements of different speeds of the optical module can be met only by specially designing the DSP chip in the prior art is avoided, the converted signals are subjected to speed processing based on the input/output driving information in the driving unit, and the signals are input or output, so that the function of the optical module can be realized without using the DSP chip, and the functionality of the optical module is improved.
The invention provides a 200G optical module circuit.
In an embodiment of the present invention, as shown in fig. 1, fig. 1 is a schematic structural diagram of a 200G optical module circuit, where the 200G optical module circuit includes a golden finger interface 10, a power supply circuit 40, an optical module controller 50, a driving unit 30, an optical interface unit 60, and a rate control circuit 20, and the optical interface unit 60 includes an optical emission component 62 and an optical receiving component 61;
the power supply circuit 40 is respectively connected with the optical module controller 50, the driving unit 30, the light emitting component 62, the light receiving component 61 and the speed control circuit 20, the golden finger interface 10, the speed control circuit 20 and the driving unit 30 are sequentially connected, the optical module controller 50 is respectively connected with the golden finger interface 10, the light receiving component 61, the driving unit 30 and the speed control circuit 20, and the driving unit 30 is respectively connected with the light emitting component 62 and the light receiving component 61;
in this embodiment, the 200G optical module circuit, the control method and the interface may refer to an optical module circuit, a control method and an interface golden finger, and refer to a contact portion of a socket, where an arranged golden yellow metal interface exists in the contact portion, and the contact portion is generally made of copper alloy or gold alloy to obtain the golden yellow metal interface, so that the golden yellow metal interface greatly improves the conductivity, and is called a golden finger. The golden finger interface is an interface formed by golden fingers. The golden finger interface module 10 is a golden yellow metal interface on the 200G optical module circuit, and the golden yellow metal interface is used for connecting the golden finger interface module 10 with an upper computer or other external devices. The golden finger interface module 10 receives the ethernet electrical signals with different rates issued by the host computer, and sends the ethernet electrical signals to the optical module controller 50 and the driving unit 30, where the ethernet electrical signals with different rates may include 10M, 100M, 1000M, 10G, 25G, and ethernet newly added rate standards 2.5GBASE-T, 5GBASE-T, and 25GBASE-T. Through the design of the optical module controller 50, the driving unit 30 and the rate control circuit 20 in the 200G optical module circuit, the rate control circuit 20 can be controlled by the optical module controller 50 to select different optical modules, the function of the 200G optical module is realized at the highest, and the driving unit 30 can be controlled by the optical module controller 50 to realize the selection of different modulation modes, so that the use of communication wires can be greatly reduced when the zeroing modulation is converted into the pulse modulation, the realization cost of the whole optical module can be reduced, and the functionality of the optical module is improved. The optical module controller 50 may be a single chip or other system level control chip.
Further, in still another embodiment of the optical module circuit of the present application 200G, referring to fig. 7, fig. 7 is a schematic circuit connection diagram of a power-on slow-start circuit of a power supply circuit in the optical module circuit of 200G, where the power supply circuit 40 includes at least an input interface and a power-on slow-start circuit 1031, the input interface (not shown in the drawing) is connected to an external power supply device and the power-on slow-start circuit, an output end of the power-on slow-start circuit that performs slow-start processing via a MOS transistor Q1 is used as an output end of the power supply circuit 40 to be connected to an internal module and a chip, the input interface includes at least a power device such as a voltage regulator, and the like, so as to output a stable voltage through the input interface to supply power to each circuit or chip of the optical module circuit of 200G, and the power-on slow-start circuit 1031 is connected to the golden finger interface 10, and the power-on slow-start circuit 1031 is connected to the modulation conversion chip 1030; the power-on slow start circuit 1031 is configured to prevent the 200G optical module circuit from being damaged by a surge when the golden finger interface is hot plugged.
The golden finger interface 10 is configured to receive an electrical-optical conversion signal, the optical module controller 50 is configured to determine an input rate control instruction based on the electrical-optical conversion signal, and select input driving information corresponding to the input rate control instruction in a preset modulation table, the rate control circuit 20 is configured to drive the driving unit 30 based on the input driving information, the driving unit 30 after driving is configured to perform rate processing on the electrical-optical conversion signal to obtain an input optical signal, and the optical emission component 62 is configured to output the input optical signal;
The light receiving component 61 is configured to receive a photoelectric conversion signal, the light module controller 50 is configured to determine an output rate control instruction based on the photoelectric conversion signal, and select output driving information corresponding to the output rate control instruction in the modulation table, the rate control circuit 20 is configured to drive the driving unit 30 based on the output driving information, the driving unit 30 after driving is configured to perform rate processing on the photoelectric conversion signal to obtain an output electrical signal, and the golden finger interface 10 is configured to output the output electrical signal.
In this embodiment, the 200G optical module circuit is described as being divided into two cases of receiving an optical signal and transmitting an optical signal. When the optical module controller 50 is used as a transmitting end to transmit an optical signal, the golden finger interface 10 receives the optical conversion signal, determines an input rate control instruction corresponding to the optical conversion signal, determines input driving information in a preset modulation table based on the input rate control instruction, and finally drives the driving unit 30 to perform rate processing on the optical conversion signal to obtain an output optical signal, so that the output optical signal can be output at the optical transmitting component 62. The preset modulation table refers to a control table corresponding to modulation, and can be set according to the condition of an input signal, or can detect the number of signal lines or the number of transmitted signals received by a user through an interface, the electro-optical conversion signal refers to an electric signal received by the golden finger interface 10, that is, an electric signal to be converted into an optical signal, the input rate control instruction refers to an instruction for controlling the conduction of the rate control circuit 20, the input driving information refers to an instruction for selecting the driving unit 30, and finally, the rate processing of the electro-optical conversion signal is realized based on the conduction of the rate control circuit and the selection of the driving unit 30, the rate processing refers to the output processing of the rate and the modulation mode, and the output optical signal is the optical signal after the electric signal conversion obtained after the rate processing of the driving unit 30. Realizing optical signal output of the optical module based on the paths; when the optical receiving module 61 receives the optical signal as the receiving end, the optical receiving module 61 receives the photoelectric conversion signal, determines an output rate control instruction corresponding to the photoelectric conversion signal in the optical module controller 50, determines output driving information in a preset modulation table based on the output rate control instruction, and finally, the driving unit 30 performs rate processing on the photoelectric conversion signal to obtain an output electric signal, so that the output electric signal can be output at the golden finger interface 10. The photoelectric conversion signal refers to an optical signal received by the optical receiving component 61, that is, an optical signal to be converted into an electrical signal, the output rate control instruction refers to an instruction for controlling the rate control circuit 20 to be turned on, the output driving information refers to an instruction for selecting the driving unit 30, and finally, the rate processing of the photoelectric conversion signal is realized based on the turning on of the rate control circuit and the selection of the driving unit 30, the rate processing refers to the output processing of the rate and the modulation mode, and the electrical signal after the conversion of the optical signal obtained after the rate processing of the electrical signal by the driving unit 30 is output. And realizing optical signal input of the optical module based on the paths. The conversion signals are processed at different speeds (in the selection driving information of the modulation table) in the driving unit based on the input/output driving information, and the signals are input or output, so that the function of the optical module can be realized without using a DSP chip, and the functionality of the optical module is improved.
Further, in still another embodiment of the optical module circuit of the present application 200G, referring to fig. 2, fig. 2 is a schematic diagram illustrating internal connection of a driving unit in the optical module circuit of 200G, and the driving unit 30 includes a first driving chip 31, a second driving chip 32, a third driving chip 33 and a fourth driving chip 34;
the first end 3A of the first driving chip, the first end of the second driving chip 32, the first end of the third driving chip 33 and the first end of the fourth driving chip 34 are respectively connected with the rate control circuit 20, the second end 3B of the first driving chip, the second end of the second driving chip 32, the second end of the third driving chip 33 and the second end of the fourth driving chip 34 are respectively connected with the light emitting component 62 and the light receiving component 61, the control end 3D of the first driving chip, the control end of the second driving chip 32, the control end of the third driving chip 33 and the control end of the fourth driving chip 34 are respectively connected with the light module controller 50, and the power end 3C of the first driving chip, the power end of the second driving chip 32, the power end of the third driving chip 33 and the power end of the fourth driving chip 34 are respectively connected with the power supply circuit 40.
Specifically, the first driving chip 31, the second driving chip 32, the third driving chip 33 and the fourth driving chip 34 include a modulation conversion chip 1030, the modulation conversion chip 1030 includes a medium access control unit 3E, a second physical medium attaching sub-layer 3F and a physical medium related sub-layer 3G, the medium access control unit 3E includes a physical coding sub-layer 3a and a first physical medium attaching sub-layer 3b, and the rate control circuit 20, the physical coding sub-layer 3a, the first physical medium attaching sub-layer 3b, the second physical medium attaching sub-layer 3F, the physical medium related sub-layer 3G and the optical interface unit 60 are sequentially connected.
In this embodiment, the driving unit 30 includes a first driving chip 31, a second driving chip 32, a third driving chip 33 and a fourth driving chip 34, and the connection modes of the four driving chips are as shown in fig. 2 (the second driving chip 32, the third driving chip 33 and the fourth driving chip 34 do not correspond to any detailed reference numerals), and the composition and connection modes of the second driving chip 32, the third driving chip 33 and the fourth driving chip 34 are the same as those of the first driving chip 31. The power supply ends of the four driving chips are ports (not shown in the figure and positioned at the positions of the chips) of the power supply ends of the chips, which are connected with a power supply. The first driving chip 31, the second driving chip 32, the third driving chip 33 and the fourth driving chip 34 include a modulation conversion chip 1030, and the modulation conversion chip 1030 is composed of a medium access control unit 3E, a second physical medium attachment sublayer 3F and a physical medium related sublayer 3G, and the specific connection manner is shown in fig. 2. The driving unit 30 may also adopt a MAX24033 chip, and the inside of the MAX24033 chip mainly comprises a transmitting end equalizer, a transmitting end CDR laser driver, an LOS detection circuit, a limiting amplifier, a receiving end equalizer and a receiving end CDR circuit. The light emitting element 62 is constituted by TOSA (Transmitter Optical Subassembly, light emitting sub-module), and the light receiving element 61 is constituted by ROSA (Receiver Optical Subassembly, light receiving sub-module). The driving unit 30 is connected with the optical interface unit 60, and the driving unit 30 provides bias current and modulation current for the optical emission component 62; the optical transmitting assembly 62 converts the input electrical signal into an optical signal and outputs the optical signal to an optical network system. The driving unit 30 is used for adjusting the processing of the electric signal input to or output from the light receiving element 61. The light receiving component 61 converts the received optical signal into an electrical signal, and the electrical signal is processed by the driving unit 30 and then transmitted to the golden finger interface 10 for output.
Referring to fig. 6, fig. 6 is a schematic diagram of a clock circuit structure of an embodiment of a 200G optical module circuit, where a clock circuit 202 includes a crystal oscillator X, a first capacitor C1 and a second capacitor C2; the first end of the first capacitor C1 is connected to the modulation conversion chip 1030, the second end of the first capacitor C1 is grounded, the first end of the second capacitor C2 is connected to the modulation conversion chip 1030, the second end of the second capacitor C2 is grounded, the first end of the crystal oscillator X is connected to the first end of the first capacitor C1, and the second end of the crystal oscillator X is connected to the first end of the second capacitor C2. It should be noted that, the crystal oscillator X, the first capacitor C1, and the second capacitor C2 form a clock circuit, and provide an external synchronous clock frequency for the modulation conversion chip 1030, so as to ensure that the modulation conversion chip 1030 works normally. The modulation conversion chip 1030 may further include a physical layer peripheral circuit, where the physical layer peripheral circuit includes a physical layer coding sub-layer, a physical layer medium connection device, a twisted pair physical medium related sub-layer, and a twisted pair medium access unit; the physical layer coding sub-layer is connected with the modulation conversion chip 1030, the physical layer medium connection device is connected with the physical layer coding sub-layer, the twisted pair physical medium related sub-layer is connected with the modulation conversion chip 1030, and the twisted pair medium access unit is connected with the twisted pair physical medium related sub-layer. It is readily understood that modulation conversion chip 1030 further includes a physical layer peripheral circuit, which is a peripheral circuit of modulation conversion chip 1030.
Further, in still another embodiment of the optical module circuit of the present application 200G, referring to fig. 3, fig. 3 is a schematic connection diagram of a modulation conversion chip and a rate control circuit in the optical module circuit of 200G, the modulation conversion chip 1030 further includes a first zeroing modulation line set 3H, a first pulse modulation line 3J, a selection circuit 3I, and a second zeroing modulation line set 3K, the selection circuit 3I includes a modulation selector 3c, the first zeroing modulation line set 3H is connected to the first physical medium attaching sublayer 3b and the second physical medium attaching sublayer 3F, the second physical medium attaching sublayer 3F is connected to an input end of the modulation selector 3c, a first output end of the modulation selector 3c is connected to an input end of the first pulse modulation line 3J, a second output end of the modulation selector 3c is connected to an input end of the second zeroing modulation line set 3K, a control end of the modulation selector 3c is connected to the first zeroing modulation line set 50, and the second zeroing modulation line set 3K includes a second pulse modulation line set 3J, and the second zeroing modulation line set 3J is connected to an output end of the second zeroing modulation line set 3J.
Specifically, the rate control circuit 20 includes a rate selector 21, where a control end 2F of the rate selector is connected to the optical module controller 50, an input end 2A of the rate selector is connected to the golden finger interface 10, and output ends 2B-2E of the rate selector (a first output end of the rate selector—a fourth output end of the rate selector) are respectively connected to the first end 3A of the first driving chip, the first end 3A1 of the second driving chip (not shown in the figure), the first end 3A2 of the third driving chip (not shown in the figure), and the first end 3A3 of the fourth driving chip (not shown in the figure), where the rate selector 21 includes a multi-channel selector.
In this embodiment, the first return-to-zero modulation line group 3H and the second return-to-zero modulation line group 3K implement NRZ modulation, the first pulse modulation line 3J implements PWM4 modulation, and the above connection manner is implemented by the first return-to-zero modulation line group 3H, the first pulse modulation line 3J, the selection circuit 3I, and the second return-to-zero modulation line group 3K, the second physical medium adhesion sub-layer 3F, and the physical medium related sub-layer 3G. Or the first return-to-zero modulation line set 3H is directly connected with the second return-to-zero modulation line set 3K through the modulation selector 3c, and the connection of the first physical medium adhesion sublayer 3b is skipped, and the first return-to-zero modulation line set 3H, the first pulse modulation line set 3J are connected in the above manner. The first return-to-zero modulation line set 3H includes 2 (two return-to-zero modulation lines, each with a rate of 26.5625 Gbps) 26.5625Gbps lines (implementing a 50G optical module, and further implementing a 200G optical module at the highest via four modulation conversion chips 1030) sent to a 50G optical module (currently being a QSFP28 package), and further subjected to rate and code pattern conversion via the second physical medium adhesion sublayer 3F, from 2 first return-to-zero modulation lines to 1 pulse modulation line, and the modulation code pattern is converted into PAM4, with a rate of 26.5625G baud rate. Rate and pattern conversion is completed through the second physical medium attachment sublayer 3F, and enters the physical medium dependent sublayer 3G. The physical medium related sub-layer 3G performs electro-optic and photoelectric conversion, which is respectively completed by a transmitter and a receiver. The 50G rate optical module is realized only with one channel, and the transmitter performs electro-optical conversion and sends the electro-optical conversion to an optical fiber. Modulation conversion chip 1030 adopts a single channel, and the rate after KP4FEC coding is adopted, so that the rate is consistent with that of a 200G8 channel/200G 4 channel. The four modulation conversion chips 1030 are selectively operated through the rate selector 21, so that the function of the optical module of 50/100/150/200G can be least realized, the output can be selected to be in a PAM4 mode or an NRZ mode, and the functionality of the optical module can be greatly improved.
Further, in still another embodiment of the optical module circuit of the present application 200G, referring to fig. 4, fig. 4 is a schematic connection diagram of an optical transmitting component and an optical receiving component in the optical module circuit of 200G, the optical transmitting component 62 includes a laser 6D and a first optical device 6C, an input end of the laser 6D is connected to an external laser controller 80, an output end of the laser 6D is connected to an input end of the first optical device 6C, and an output end of the first optical device 6C is connected to a second end 3B of a first driving chip, a second end 3B1 of a second driving chip, a second end 3B2 of a third driving chip, and a second end 3B3 of a fourth driving chip in the driving unit 30;
the light receiving assembly 61 comprises a light detector 6B and a second optical device 6A, the second end 3B of the first driving chip, the second end 3B1 of the second driving chip, the second end 3B2 of the third driving chip and the second end 3B3 of the fourth driving chip are connected with the input end of the second optical device 6A, the output end of the second optical device 6A is connected with the input end of the light detector 6B, the output end of the light detector 6B is connected with an external laser receiver 70, wherein the first optical device 6C comprises a four-way demultiplexer, and the second optical device 6A comprises a four-way multiplexer.
In the present embodiment, the optical emitting component 62 includes the laser 6D and the first optical device 6C, and the optical receiving component 61 includes the optical detector 6B and the second optical device 6A, and since the optical emitting component 62 and the optical receiving component 61 are connected to four driving chips, the second optical device 6A is required to be connected to the first optical device 6C, thereby realizing functions of a four-way demultiplexer and a four-way multiplexer. And four driving chips can be output together or input optical signals can be decomposed and output so as to realize multiplexing and decomposing functions of the optical transmitting assembly 62 and the optical receiving assembly 61, and only a single signal line is needed for outputting or inputting so as to improve the functions of the optical module.
Further, referring to fig. 5, a flowchart of a first embodiment of the 200G optical module control method according to the present invention is provided based on the above embodiment of the 200G optical module circuit, where the steps of the 200G optical module control method include:
step S10, if a conversion signal is received, determining target driving information according to the conversion signal, wherein when the conversion signal is an electric-optical conversion signal, the target driving information is input driving information; when the conversion signal is a photoelectric conversion signal, the target driving information is output driving information;
In this embodiment, before the received conversion signal is obtained based on the optical module controller, the electrical-to-optical conversion signal from the golden finger interface may be received or the optical-to-electrical conversion signal from the optical receiving component may be received as the conversion signal, where the optical-to-electrical conversion signal refers to an optical signal to be converted into an electrical signal, and the electrical-to-optical conversion signal refers to an electrical signal to be converted into an optical signal. Determining a rate control instruction according to the conversion signal in the optical module controller, wherein the rate control instruction comprises an output rate control instruction and an input rate control instruction, and finally determining target driving information based on the rate control instruction, wherein the target driving information refers to output driving information or input driving information, namely, when the conversion signal is an electro-optical conversion signal, the target driving information is input driving information; when the conversion signal is a photoelectric conversion signal, the target drive information is output drive information. The rate control instruction refers to an instruction for controlling the transmission rate of the optical module, which may refer to an instruction for controlling the conduction between the rate control circuit and the internal selection circuit, and the conduction control mode of the rate control circuit may be as follows: 1000 is input, a first driving chip is selected to work, and the function of the 50G-rate optical module is realized; input 1100, selecting the first and second driving chips to work, and implementing the 100G rate optical module function; input 1110, selecting the first, second and third driving chips to work, so as to realize the function of the optical module with 150G rate; the input 1111 selects the first to fourth driving chips to operate, so as to implement the optical module function with 200G rate, and the control flow and the manner of controlling the high and low levels may be other manners, which are not limited herein. The conduction control method for the internal selection circuit may be: the input 10 selects a first return-to-zero modulation line group to be connected with a first pulse modulation line, so that the function of an optical module for driving the output of a chip PWM4 modulation mode is realized; the input 11 selects the first return-to-zero modulation line group to connect the second return-to-zero modulation line group, and realizes the optical module function of the output of the NRZ modulation system of the driving chip, and the control flow and the control method of the high and low levels may be other methods, which are not limited herein. Wherein, the step of determining the target driving information according to the conversion signal comprises the following steps:
Step C11, determining signal characteristics of the converted signals, and searching matching characteristics matched with the signal characteristics in a preset modulation table;
step C12, determining a chip selection instruction and a modulation selection instruction corresponding to the matching feature, and summarizing the chip selection instruction and the modulation selection instruction as a rate control instruction;
and step C13, determining target driving information corresponding to the rate control instruction in the modulation table.
In this embodiment, by determining the signal characteristics of the converted signal, the matching characteristics matching the signal characteristics in the preset modulation table are searched for. The signal features refer to features of converted signals, the matched features refer to features matched with the signal features in a preset modulation table, the preset modulation table refers to a table pre-stored in advance for signals with different features, and the table mainly corresponds to different signal features to specify speed control instructions. And determining a chip selection instruction and a modulation selection instruction corresponding to the matching characteristic when the matching characteristic is determined, and finally summarizing the chip selection instruction and the modulation selection instruction to be used as a rate control instruction. The chip selection instruction refers to an instruction for selecting the connection of the selection chip, and the modulation selection instruction refers to an instruction for selecting the input or output connection of the modulation mode. The feature matching method may be to determine the quality or distortion of the signal, and when the signal is poor or the distortion reaches a certain threshold, select the modulation selection instruction to be PWM4 modulation, otherwise select NRZ modulation, or other judgment conditions, which are not limited herein, so as to further improve the selectivity of the optical module and improve the functionality. The size of the signal input or the rate requirement can also be determined to select 50G/100G/150G/200G for transmission, for example, the rate of the signal reaching AV (electrical signal)/BJ (optical signal) to select 50G for transmission; the manner in which the signal reaches CV (electric signal)/DJ (optical signal) is transmitted at a rate of 100G or other control manner is not limited herein. Through the selection of the chip and the modulation mode, the whole optical module can work at different speeds and modulation modes, and the single speed function can be realized without using a DSP chip, so that the function of the optical module can be improved. And finally, determining target driving information corresponding to the rate control instruction in the modulation table, wherein the target driving information refers to the information of the corresponding driving chip and the information of modulation mode selection under the determined rate control instruction.
And step S20, performing rate processing on the conversion signal according to the target driving information to obtain a target signal, and outputting the target signal, wherein the target signal is an input optical signal when the target driving information is input driving information, and the target signal is an output electrical signal when the target driving information is output driving information.
In this embodiment, after determining the target driving information, the driving unit performs rate processing on the driving unit based on the target driving information to obtain a target output signal, where the target driving information refers to information of what kind of work is performed by the driving unit, and the target output signal refers to an electrical signal or an optical signal obtained after photoelectric conversion, and the rate and the modulation mode of the target output signal may be adaptively selected. The step of performing rate processing on the converted signal according to the target driving information to obtain a target signal includes:
step C21, determining chip conduction information in the target driving information, and if the chip conduction information is matched with preset first conduction information, performing rate processing on a first driving chip in a first conduction information conduction driving unit to determine a first quasi-signal;
In this embodiment, after the target driving information is obtained, the chip conduction information in the target driving information is determined, and then whether the chip conduction information is matched with the preset chip conduction information is determined, and when the chip conduction information is matched with the preset first conduction information, the first analog signal is determined based on the rate processing of the first driving chip in the first conduction information matched conduction driving unit. The chip conduction information refers to information of chip conduction, the preset first conduction information refers to information of single chip conduction, and the first analog signal refers to a signal obtained after rate processing of single chip conduction, and can be an optical signal or an electrical signal. The first conducting information refers to information conducted by a single chip, and a second or other chips can be used, but are not limited herein, so that the rate selection functionality of the optical module can be improved through the determination of the conducting information of the chip.
Step C22, if the chip conduction information is matched with the preset second conduction information, performing rate processing on a first driving chip and a second driving chip in the second conduction information conduction driving unit to determine a second quasi signal;
Step C23, if the chip conduction information is matched with preset third conduction information, performing rate processing on a first driving chip, a second driving chip and a third driving chip in the third conduction information conduction driving unit to determine a third quasi-signal;
step C24, if the chip conduction information is matched with preset fourth conduction information, performing rate processing on the first driving chip, the second driving chip, the third driving chip and the fourth driving chip in the fourth conduction information conduction driving unit to determine a fourth quasi signal;
in this embodiment, when the chip on information matches with the preset second on information, the first and second driving chips in the on driving unit perform rate processing to determine the second analog signal based on the second on information matching. The preset second conduction information refers to information of conduction of the two chips, and the second analog signal refers to a signal obtained after rate processing of conduction of the two chips, and can be an optical signal or an electrical signal. The second conducting information refers to the information when two chips are conducted, and the third or other combinations of chips can be used, which is not limited herein; when the chip conduction information is matched with preset third conduction information, the first, second and third driving chips in the conduction driving unit are subjected to rate processing based on the third conduction information matching to determine a third analog signal. The preset third conducting information refers to conducting information of three chips, and the third analog signal refers to a signal obtained after conducting rate processing of the three chips, and can be an optical signal or an electrical signal. The third conducting information refers to the information when three chips are conducted, and the fourth or other combinations of chips can be used, which is not limited herein; when the chip conduction information is matched with the preset fourth conduction information, all driving chips in the fourth conduction information matched conduction driving unit perform rate processing to determine a fourth analog signal. The preset fourth conduction information refers to information of four chips conducted, and the fourth analog signal refers to a signal obtained after rate processing is performed on the four chips conducted, and the signal can be an optical signal or an electrical signal. Through the judgment of the on-state information of the chip and the design based on a hardware circuit, the selection of the optical module rate of the optical module 50G/100G/150G/200G can be realized, the selection of the optical module rate can be realized on the premise of not using a DSP chip, and the function of the optical module can be greatly improved.
And C25, determining modulation selection information in the target driving information, conducting a modulation circuit based on the modulation selection information and the chip conducting information, and modulating the first analog signal, the second analog signal, the third analog signal or the fourth analog signal based on the conducted modulation circuit to obtain an output signal.
In this embodiment, after the rate selection of the signal is determined, modulation selection information in the target driving information is determined, and then the modulation line is turned on based on the modulation selection information and the chip on information, and finally the obtained analog signal is modulated based on the turned-on modulation line to obtain the output signal. The modulation selection information refers to a mode of driving a modulation output selected in the chip, and may be PWM4 or NRZ output modulation signals, and the modulation line refers to a modulation line for outputting the selection. For example, the chip conduction information selects the first driving chip to conduct, and the modulation circuit based on the modulation selection information and the chip conduction information means that the first driving chip selects PWM4 or NRZ modulation output, so that the accuracy of output can be ensured, and meanwhile, the functionality of the optical module is improved.
And finally, outputting an output electric signal based on the golden finger interface or outputting the output optical signal based on the optical emission component.
In this embodiment, when the optical module is used as the output end, the output electrical signal is obtained based on the output of the golden finger interface, or the output optical signal is output based on the optical emission component so as to further realize the photoelectric conversion or the electro-optical conversion of the optical module, thereby further realizing the function of the 200G optical module.
The invention also provides a 200G optical module control device.
The device of the invention comprises: the system comprises a memory, a processor, a 200G optical module control system in the 200G optical module control method and a 200G optical module control program which is stored in the memory and can run on the processor, wherein the 200G optical module control program realizes the steps of the 200G optical module control method when being executed by the processor.
The invention also provides a storage medium.
The storage medium of the present invention stores a 200G optical module control program, which when executed by a processor, implements the steps of the 200G optical module control method described above.
The method implemented when the 200G optical module control program running on the processor is executed may refer to various embodiments of the 200G optical module control method of the present invention, which are not described herein again.
The invention also provides a 200G optical module interface.
The 200G optical module interface is used for loading 200G optical module circuits, and the 200G optical module interface at least comprises a built-in circuit board and a shell, wherein the built-in circuit board is provided with the 200G optical module circuits, and the built-in circuit board is packaged in the shell.
In an embodiment of the invention, the housing is provided as means for encapsulating and securing the internal circuit board and providing an external interface, the 200G optical module circuit in the built-in circuit board being connected to the outside through the interface on the housing to realize the 200G optical module function.
In one embodiment of the present invention, all or part of the 200G optical module circuit is disposed on the housing and/or the built-in circuit board, and the following embodiments are provided:
in a first embodiment, all or part of the 200G optical module circuit is disposed on the built-in circuit board. The built-in circuit board is provided with a power supply circuit, an optical module controller, a driving unit and a speed control circuit in the 200G optical module circuit, the shell is provided with a golden finger interface and an optical interface unit in the 200G optical module circuit, and the built-in circuit board is packaged in the shell;
in a second embodiment, a power supply circuit, an optical module controller, a driving unit, an optical interface unit and a rate control circuit in the 200G optical module circuit are arranged on the built-in circuit board, and a golden finger interface in the 200G optical module circuit is arranged on the shell and is packaged in the shell;
In a third embodiment, all 200G optical module circuits are disposed on the built-in circuit board, a first interface, a second interface, a third interface and a fourth interface are disposed on the housing, the first interface is connected with a golden finger interface in the 200G optical module circuit, the second interface is connected with a power supply circuit in the 200G optical module circuit, the third interface is connected with a light emitting component in the 200G optical module circuit, and the fourth interface is connected with a light receiving component in the 200G optical module circuit and encapsulates the built-in circuit board in the housing;
in a fourth embodiment, all the 200G optical module circuits are disposed on the built-in circuit board, a first interface, a second interface and a third interface are disposed on the housing, the first interface is connected with the golden finger interface and the power supply circuit in the 200G optical module circuit, the second interface is connected with the light emitting component in the 200G optical module circuit, and the third interface is connected with the light receiving component in the 200G optical module circuit and encapsulates the built-in circuit board in the housing.
The built-in circuit board may be packaged transversely with the housing or longitudinally, and is not limited herein. The above arrangement manner of the 200G optical module interface may be set according to practical situations, or more or fewer devices may be used to encapsulate the 200G optical module in a housing or other devices, which is not limited herein.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the invention, and all the equivalent structural changes made by the description of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the invention.

Claims (8)

1. The 200G optical module circuit is characterized by comprising a golden finger interface, a power supply circuit, an optical module controller, a driving unit, an optical interface unit and a rate control circuit, wherein the optical interface unit comprises an optical emission component and an optical receiving component;
The power supply circuit is respectively connected with the optical module controller, the driving unit, the light emitting assembly, the light receiving assembly and the speed control circuit, the golden finger interface, the speed control circuit and the driving unit are sequentially connected, the optical module controller is respectively connected with the golden finger interface, the light receiving assembly, the driving unit and the speed control circuit, and the driving unit is respectively connected with the light emitting assembly and the light receiving assembly;
the driving unit comprises a first driving chip, a second driving chip, a third driving chip and a fourth driving chip; the first end of the first driving chip, the first end of the second driving chip, the first end of the third driving chip and the first end of the fourth driving chip are respectively connected with the speed control circuit, the second end of the first driving chip, the second end of the second driving chip, the second end of the third driving chip and the second end of the fourth driving chip are respectively connected with the light emitting component and the light receiving component, the control end of the first driving chip, the control end of the second driving chip, the control end of the third driving chip and the control end of the fourth driving chip are respectively connected with the light module controller, the power supply end of the first driving chip, the power supply end of the second driving chip, the power supply end of the third driving chip and the power supply end of the fourth driving chip are respectively connected with a power supply circuit, the first driving chip, the second driving chip, the third driving chip and the fourth driving chip comprise modulation conversion chips, the modulation conversion chips comprise a medium access control unit, a second physical medium attachment sublayer and a physical medium related sublayer, and the medium access control unit comprises a physical coding sublayer and a first physical medium attachment sublayer; the rate control circuit, the physical coding sublayer, the first physical medium attachment sublayer, the second physical medium attachment sublayer, the physical medium related sublayer and the optical interface unit are sequentially connected;
The golden finger interface is used for receiving an electric-optical conversion signal, the optical module controller is used for determining an input speed control instruction based on the electric-optical conversion signal, selecting input driving information corresponding to the input speed control instruction from a preset modulation table, the speed control circuit is used for driving the driving unit based on the input driving information, the driving unit after driving is used for carrying out speed processing on the electric-optical conversion signal to obtain an input optical signal, and the optical emission component is used for outputting the input optical signal;
the optical receiving assembly is used for receiving photoelectric conversion signals, the optical module controller is used for determining output speed control instructions based on the photoelectric conversion signals, output driving information corresponding to the output speed control instructions is selected in the modulation table, the speed control circuit is used for driving the driving unit based on the output driving information, the driving unit after driving is used for performing speed processing on the photoelectric conversion signals to obtain output electric signals, and the golden finger interface is used for outputting the output electric signals; the rate processing refers to output processing of a rate and a modulation mode.
2. The 200G optical module circuit of claim 1, wherein the modulation conversion chip further comprises a first return-to-zero modulation line set, a first pulse modulation line, a selection circuit, and a second return-to-zero modulation line set, the selection circuit comprising a modulation selector;
the first return-to-zero modulation line group is connected with the first physical medium adhesion sublayer and the second physical medium adhesion sublayer, the second physical medium adhesion sublayer is connected with the input end of the modulation selector, the first output end of the modulation selector is connected with the input end of the first pulse modulation line, the second output end of the modulation selector is connected with the input end of the second return-to-zero modulation line group, the control end of the modulation selector is connected with the optical module controller, the output end of the first pulse modulation line and the output end of the second return-to-zero modulation line group are connected with the physical medium related sublayer, wherein the first return-to-zero modulation line group and the second return-to-zero modulation line group comprise two return-to-zero modulation lines, the first pulse modulation line comprises a pulse modulation line, and the modulation selector comprises a single-channel selector.
3. The 200G optical module circuit of claim 2, wherein the rate control circuit comprises a rate selector, a control end of the rate selector is connected with the optical module controller, an input end of the rate selector is connected with the golden finger interface, and an output end of the rate selector is respectively connected with the first end of the first driving chip, the first end of the second driving chip, the first end of the third driving chip and the first end of the fourth driving chip, wherein the rate selector comprises a multi-channel selector.
4. The 200G optical module circuit of claim 3, wherein the optical emission assembly comprises a laser and a first optical device, an input end of the laser is connected with an external laser controller, an output end of the laser is connected with an input end of the first optical device, and an output end of the first optical device is connected with a second end of a first driving chip, a second end of a second driving chip, a second end of a third driving chip and a second end of a fourth driving chip in the driving unit;
the optical receiving assembly comprises an optical detector and a second optical device, wherein the second end of the first driving chip, the second end of the second driving chip, the second end of the third driving chip and the second end of the fourth driving chip are connected with the input end of the second optical device, the output end of the second optical device is connected with the input end of the optical detector, and the output end of the optical detector is connected with an external laser receiver, wherein the first optical device comprises a four-way demultiplexer, and the second optical device comprises a four-way multiplexer.
5. A 200G optical module control method, wherein the 200G optical module control method is applied to the 200G optical module circuit of any one of claims 1 to 4, the steps of the 200G optical module control method comprising:
If a conversion signal is received, determining target driving information according to the conversion signal, wherein when the conversion signal is an electric-optical conversion signal, the target driving information is input driving information; when the conversion signal is a photoelectric conversion signal, the target driving information is output driving information;
and carrying out rate processing on the conversion signal according to the target driving information to obtain a target signal and outputting the target signal, wherein the target signal is an input optical signal when the target driving information is input driving information, and the target signal is an output electrical signal when the target driving information is output driving information.
6. The 200G optical module control method of claim 5, wherein the step of determining target driving information according to the switching signal comprises:
determining signal characteristics of the converted signals, and searching matching characteristics matched with the signal characteristics in a preset modulation table;
determining a chip selection instruction and a modulation selection instruction corresponding to the matching characteristics, and summarizing the chip selection instruction and the modulation selection instruction to be used as a rate control instruction;
And determining target driving information corresponding to the rate control instruction in the modulation table.
7. The method of claim 6, wherein the step of rate-processing the converted signal according to the target driving information to obtain a target signal comprises:
determining chip conduction information in the target driving information, and if the chip conduction information is matched with preset first conduction information, determining a first quasi signal based on rate processing of a first driving chip in a first conduction information conduction driving unit;
if the chip conduction information is matched with preset second conduction information, performing rate processing on a first driving chip and a second driving chip in the second conduction information conduction driving unit to determine a second quasi-signal;
if the chip conduction information is matched with preset third conduction information, performing rate processing on a first driving chip, a second driving chip and a third driving chip in the third conduction information conduction driving unit to determine a third quasi signal;
if the chip conduction information is matched with preset fourth conduction information, carrying out rate processing on a first driving chip, a second driving chip, a third driving chip and a fourth driving chip in a conduction driving unit based on the fourth conduction information to determine a fourth quasi signal;
And determining modulation selection information in the target driving information, conducting a modulation circuit based on the modulation selection information and the chip conducting information, and modulating the first analog signal, the second analog signal, the third analog signal or the fourth analog signal based on the conducted modulation circuit to obtain an output signal.
8. A 200G optical module interface, wherein the 200G optical module interface is configured to carry the 200G optical module circuit of any one of claims 1 to 4, the 200G optical module interface includes a built-in circuit board and a housing, the built-in circuit board is provided with the 200G optical module circuit, and the built-in circuit board is encapsulated in the housing.
CN202310495272.2A 2023-05-05 2023-05-05 200G optical module circuit, control method and interface Active CN116232467B (en)

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