CN113241359A - Curved surface display panel, preparation method thereof and display device - Google Patents
Curved surface display panel, preparation method thereof and display device Download PDFInfo
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- CN113241359A CN113241359A CN202110505914.3A CN202110505914A CN113241359A CN 113241359 A CN113241359 A CN 113241359A CN 202110505914 A CN202110505914 A CN 202110505914A CN 113241359 A CN113241359 A CN 113241359A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The application discloses curved surface display panel and preparation method, display device thereof, wherein, a preparation method of curved surface display panel includes: providing a device layer and a supporting adhesive tape, and attaching the supporting adhesive tape to a substrate of the device layer to obtain a first assembly; providing a metal layer, attaching the metal layer to a profiling jig, pre-shaping the metal layer, and obtaining a second component consisting of the profiling jig and the metal layer; aligning and attaching the first assembly and the second assembly; stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig, and attaching the end part of the supporting adhesive tape to the metal layer to enable the device layer to reach a preset shape and/or a preset elongation; and carrying out curing and tackifying treatment on the first component. The application provides a curved surface display panel through the structure attenuate to and heat treatment, make support sticky tape self soften and tear bounce-back effort, reduce bounce-back, better maintain the curved surface shape.
Description
Technical Field
The application relates to the technical field of display, in particular to a curved surface display panel, a preparation method thereof and a display device.
Background
Organic Light Emitting Diode (OLED) Display devices are becoming the first choice of screens, and have many advantages of self-luminescence, high Light Emitting efficiency, short response time, high definition and contrast, and the like, and meanwhile, the screens can be ensured to have certain flexibility and adaptability. With the development of flexible display screens, people have higher and higher demands on integrated products.
Four curved surface laminating at present, design corner screen display area need be done tensile processing, because the screen trompil satisfies tensile volume, module membrane material design also need satisfy tensile design simultaneously, adopts flexible tensile properties good material to do notacoria or carrier film at present more, but the problem of flexible material ubiquitous resilience at present.
After the flexible material is molded by adopting a certain tensile stress, the material can recover by itself or generate stress relaxation, so that the deformation change, the wrinkles and other problems are caused. In addition, after the flexible material is used as a back film, the flexible material is always left on a product, and is required not to generate rebound or relaxation or deformation and the like along with the change of time or environmental temperature.
Disclosure of Invention
In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide a curved display panel, a method for manufacturing the same, and a display device, which can prevent the curved display panel from wrinkling or shrinking or stress relaxation.
In a first aspect, the present application provides a method for manufacturing a curved display panel, including:
providing a device layer and a supporting adhesive tape, and attaching the supporting adhesive tape to a substrate of the device layer to obtain a first assembly;
providing a metal layer, attaching the metal layer to a profiling jig, pre-shaping the metal layer, and obtaining a second component consisting of the profiling jig and the metal layer;
aligning and attaching the first assembly and the second assembly;
stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig, and attaching the end part of the supporting adhesive tape to the metal layer to enable the device layer to reach a preset shape or a preset elongation;
and carrying out curing and tackifying treatment on the first component.
In one embodiment, the method further comprises:
and providing a fourth component, and presetting the fourth component, wherein the fourth component comprises a cover plate and/or a polarizer, and the cover plate and the polarizer are fixedly bonded through a first optical adhesive.
In one embodiment, before aligning and attaching the first component and the second component, the method further includes:
and carrying out first initial tackifying treatment on the first assembly.
In one embodiment, the first initial tackifying process comprises:
and carrying out first UV irradiation treatment on the side of the support adhesive tape, which is far away from the substrate.
Further, after the first component is cured and tackified, the method further comprises the following steps:
and adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive.
Further, the curing tackifying process comprises:
gradually heating the supporting adhesive tape until a first set temperature is reached in the process of stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig;
maintaining a first set temperature for a time after the device layer reaches a predetermined shape or a predetermined elongation;
and cooling the support adhesive tape, and carrying out second UV irradiation treatment on one side of the device layer, which is far away from the substrate.
In one embodiment, before the curing and tackifying the first component, the method further comprises:
maintaining the device layer in a predetermined shape or a predetermined amount of elongation;
and adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive.
Further, the curing tackifying process comprises:
heating the supporting adhesive tape until reaching a second set temperature, and maintaining the second set temperature for a certain time;
and cooling the support adhesive tape, and carrying out third UV irradiation treatment on one side of the metal layer departing from the substrate.
Further, the manner of heating the supporting tape includes:
integrally heating the support tape; or heating the bending area of the supporting adhesive tape.
In one embodiment, the first initial tackifying process comprises:
heating the supporting adhesive tape until a third set temperature is reached;
pressurizing the first assembly.
Further, after the first component is cured and tackified, the method further comprises the following steps:
and adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive.
Further, the curing tackifying process comprises: and after the device layer reaches a preset shape or a preset elongation, cooling the support adhesive tape, and performing fourth UV irradiation treatment on the side, away from the substrate, of the device layer.
In one embodiment, before the curing and tackifying the first component, the method further comprises:
maintaining the device layer in a predetermined shape or a predetermined amount of elongation;
and adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive.
Further, the curing tackifying process comprises:
and cooling the support adhesive tape, and carrying out fifth UV irradiation treatment on one side of the metal layer departing from the substrate.
In one embodiment, after aligning and attaching the first component and the second component, the method further includes:
and carrying out second initial tackifying treatment on the first component.
Further, the second initial tackifying process includes:
and carrying out sixth UV irradiation treatment on a partial area of the side, facing away from the substrate, of the device layer, wherein the partial area corresponds to the stretching area of the device layer.
In a second aspect, the present application provides a curved display panel, comprising a planar area and a bending area disposed at an edge of the planar area, wherein the curved display panel is prepared according to any one of the above methods, the curved display panel comprises a device layer, a supporting tape, and a metal layer stacked on top of each other, and the metal layer comprises one or more of a supporting member, a heat dissipation member, and a shielding layer.
Further, the device layer is provided with a fourth component on a side facing away from the substrate, the fourth component comprising a cover plate and/or a polarizer.
In a third aspect, the present application provides a display device comprising the curved display panel as described above.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
according to the preparation method of the curved-surface display panel, the supporting adhesive tape is adopted to complete the attaching and supporting functions, and compared with the prior art, redundant film layers are omitted; the rebound force is removed in the temperature rising process, and meanwhile, the UV cured tackified adhesive is adhered to the metal layer, the metal layer cannot rebound and loosen, so that the adhesive layer is kept in an original shape, the self-recovery capability of the adhesive tape is reduced to the minimum, and the self-elasticity of the adhesive tape can be kept not to be torn.
According to the preparation method of the curved surface display panel, the rubber material is softened and the rebound acting force is removed through structural thinning and heating treatment, the rebound force is reduced, the curved surface shape is better maintained, in addition, the back film and the bearing film material of the curved surface display panel are removed, and the cost is reduced; the joint part of the related bearing film/back film is removed, and the process is simplified; the regional design can be realized, regional deformation degree is adjusted in a flexible way.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a curved display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic cross-sectional view of a curved display panel according to an embodiment of the present application;
fig. 3 is a flowchart of a method for manufacturing a curved display panel according to an embodiment of the present disclosure;
fig. 4 is a flowchart of a method for manufacturing a curved display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of step ST01 in the first embodiment of the present application;
FIG. 6 is a schematic structural diagram illustrating step S04 according to a first embodiment of the present application;
FIG. 7 is a schematic structural diagram illustrating step S06 according to a first embodiment of the present application;
FIG. 8 is a schematic structural diagram illustrating step S08 according to a first embodiment of the present application;
FIG. 9 is a schematic structural diagram of step ST203 in the first embodiment of the present application;
FIG. 10 is a schematic structural diagram of step ST03 in the first embodiment of the present application;
FIG. 11 is a schematic structural diagram of step ST05 in the first embodiment of the present application;
fig. 12 is a flowchart of a method for manufacturing a curved display panel according to a second embodiment of the present application;
fig. 13 is a flowchart of a method for manufacturing a curved display panel according to a third embodiment of the present application;
fig. 14 is a flowchart of a method for manufacturing a curved display panel according to a fourth embodiment of the present application;
fig. 15 is a schematic structural diagram of step ST01 in the fourth embodiment of the present application;
fig. 16 is a schematic structural diagram of step ST241 in the fourth embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1, it can be seen that the positions of four corners, namely the DA area, need to be stretched, the middle of the screen is a normal flattening non-stretching area, and the current screen can be regionalized by an island structure or holes to achieve stretchability, but stretching needs to be achieved under the action of a certain external force.
The back film or the bearing film plays an important role in the four-curved-surface module structure, and 1) curved surface stretching forming is needed when the PNL is attached to the back film, so that a certain stretching amount is achieved; therefore, the stretchability of the backsheet must be good; 2) after the back film is attached, the back film is always left on the product, and the back film is required not to rebound or loose or deform along with the change of time or environmental temperature.
The requirement is that the back film has higher stretchability, and drives the screen to deform together to reach the specified stretching amount; the deformation area is protected, the shape is maintained, and the screen circuit or the brittle film layer is prevented from being damaged by deformation caused by the action of ambient temperature or external force.
Referring to fig. 2 in detail, the present application provides a curved display panel, which includes a planar area D1 and a bending area D2 disposed at an edge of the planar area D1, and the curved display panel includes a device layer 10, a support tape 201, and a metal layer 501 stacked together.
The device Layer 10 is a light emitting device of a display panel, such as an OLED, and the like, and the present application does not limit the light emitting type and the light emitting manner of the display panel, and in some embodiments, the device Layer 10 may further include a related touch Layer, a polarization Layer, and the like, and various devices may be integrated in the device Layer 10 by using technologies such as FMLOC (Flexible Multi-Layer On Cell, multilayer Flexible outer-hanging type) and COE (CF On EL, forming a color film Layer On a thin film packaged organic electroluminescent device). The present application is not described in detail herein.
The support tape 201 is a hot-melt pressure-sensitive adhesive tape sensitive to heat and UV, which is in a film shape (1Mpa to 500Mpa) at normal temperature, and is softened by heat to have enhanced fluidity, so that while the adhesive force (e.g., 1gf/Inch to 100gf/Inch) is enhanced, the material is softened to have enhanced stretchability (100Mpa to 10Mpa), and simultaneously, in the heating process, the material is softened to have enhanced fluidity, thereby removing strong bonding force in a molecular chain, removing restoring force or maintaining force in a softened state, and maintaining a good curved shape without rebounding.
Hot melt pressure sensitive adhesives generally refer to pressure sensitive adhesives consisting essentially of a thermoplastic elastomer, a tackifier, a plasticizer and an activator. The thermoplastic elastomer mainly refers to high molecular copolymers such as SIS, SBS, SIPS, SEBS and the like, the tackifying resin mainly refers to rosin resin, terpene resin, C5 petroleum resin, C9 petroleum resin or C5/C9 copolymerized petroleum resin, and the plasticizer mainly includes naphthenic oil, white oil, low molecular weight polyisobutylene and the like.
In the embodiment of the present application, the material of the supporting tape 201 may be a polymer material such as acrylate, polyurethane, polyethylene, polypropylene, etc. as an elastomer, and its Tg (glass transition temperature) is generally greater than 50 ℃. The interior of the glass contains ultraviolet activator, partial active additive and the like, so that the glass is sensitive to UV and heat.
Illustratively, the present application employs an acrylate hot melt pressure sensitive adhesive having the following properties:
1) the material has heat sensitivity, is in a film shape at normal temperature, has the modulus of 0.5 Mpa-200 Mp, can present a flowing state when being heated (50 ℃ -60 ℃), can reduce the modulus of the material by 0.2 Mpa-50 Mpa, and can realize the increase of the viscosity of an interface due to the exhaust in the vacuum defoaming and exhausting process.
2) A UV curing type or a UV reinforcing type, which contains an ultraviolet light sensitive initiator inside, and when UV is applied, enhances the cross-linking of the material, so that the interfacial adhesion is greatly improved (100gf/Inch to 1000 gf/Inch);
3) after thermal activation, UV curing is carried out to obtain large adhesive force (> 500 gf/Inch);
if no heat is applied, only UV irradiation is applied, and the improvement of the adhesive force is not obvious (< 500 gf/Inch);
4) after UV curing molding, the viscosity does not change much even when the temperature is raised.
In the embodiment of the application, the thickness of the film material of the supporting tape 201 is 25um to 100 um; preferably 25um to 50um, including 25um and 50 um.
The hot melt pressure sensitive adhesive material selected has the following service characteristics:
the metal layer 501 includes one or more of a support member, a heat sink, and a shielding layer, and the material may be a copper foil, a steel sheet, or other materials. In specific application, the materials and the shapes of specific parts can be selected according to different product requirements, and the detailed description is omitted herein.
In addition, the device layer 10 is provided with a fourth assembly 40 on a side facing away from the substrate, and the fourth assembly 40 includes a cover plate and/or a polarizer, and when the fourth assembly 40 is the cover plate and the polarizer, the cover plate and the polarizer are fixed by adhesion of first optical adhesive OCA 1. In a specific setting, the number and the type of the film layers in the fourth assembly 40 are not limited in this application, and the corresponding adjustment and application can be performed according to the light emitting device on the lower layer.
As shown in fig. 3, the present application provides a method for manufacturing a curved display panel, including:
s02, providing a device layer 10 and a support tape 201, and attaching the support tape 201 to a substrate of the device layer 10 to obtain a first assembly;
s04, providing a metal layer 501, attaching the metal layer 501 to a profiling jig 70, pre-shaping the metal layer 501, and obtaining a second assembly consisting of the profiling jig 70 and the metal layer 501;
s06, aligning and attaching the first assembly and the second assembly;
s08, performing stretch profiling on the end of the support tape 201 along the shape of the profiling fixture 70, and attaching the support tape to the metal layer 501, so that the device layer 10 reaches a predetermined shape or a predetermined elongation;
and S10, curing and tackifying the first assembly.
Further, the method further comprises:
ST01, the first component is subjected to a first initial tackifying process. Note that, the ST01 may be provided before the step S06, that is, before the first module and the second module are aligned and attached to each other; alternatively, the ST01 may be provided after the step S06, that is, after the first module and the second module are aligned and attached to each other.
In one embodiment, the first initial tackifying process comprises: the support tape 201 is irradiated. Wherein, the irradiation treatment mode comprises the following steps: irradiating the support tape 201 integrally; or the bending region D2 of the support tape 201 is locally irradiated.
In one embodiment, the first initial tackifying process comprises: the support tape 201 is subjected to a heat treatment. Wherein, the mode of heat treatment includes: the support tape 201 is heated integrally; or heating the bending region D2 of the support tape 201.
Further, the method further comprises:
ST03, providing a fourth assembly 40, and pre-shaping the fourth assembly 40, wherein the fourth assembly 40 comprises a cover plate and/or a polarizer, and the cover plate and the polarizer are fixed by a first optical adhesive.
ST05, attaching the fourth component 40 to the side of the device layer 10 facing away from the substrate by the second optical glue 30.
Note that, the step ST05 may be provided before the step S10, that is, before the first component is subjected to curing and tackifying processing; or after the step S10, that is, after the first component is cured and tackified.
Example one
Referring to fig. 4 in detail, the present application provides a method for manufacturing a curved display panel, including:
s02, providing the device layer 10 and the support adhesive tape 201, and attaching the support adhesive tape 201 to the substrate of the device layer 10 to obtain a first assembly.
The step can be carried out at normal temperature, and the selected supporting adhesive tape 201 is in a film shape at normal temperature, and the modulus is 1-500 Mpa, preferably 100 Mpa; elongation > 100%; adhesion <10gf/Inch, preferably <2 gf/Inch.
The support adhesive tape 201 has low adhesive force at normal temperature, so that the possibility of being not suitable for tearing is met, and the attachment mainly utilizes physical pressure, such as rolling by using a roller, electrostatic adsorption realized by attaching and bubble discharging, air in the support adhesive tape is removed, and close adhesion is realized.
ST01, carrying out the first initial tackifying treatment on the first assembly; as shown in fig. 5.
Wherein the first initial tackifying process comprises: a first UV irradiation treatment is performed on the side of the support tape 201 facing away from the substrate. Process conditions of the first UV irradiation treatment UV 1: energy 1000mj/cm2～3000mj/cm2(ii) a The time is 1-5 s; the wave band is 365-410 nm.
Since the support tape 201 is made of hot-melt pressure-sensitive adhesive, it is sensitive to temperature and also has a certain surface viscosity change when irradiated with UV light, and is irradiated with a small event of low energy, such as 2000mj/cm2The adhesive tape obtains certain adhesion promotion. After the first initial tackification treatment, the performance parameters of the support tape 201 are: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation percentage>100 percent; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
S04, providing a metal layer 501, attaching the metal layer 501 to the profiling jig 70, pre-shaping the metal layer 501, and obtaining a second assembly consisting of the profiling jig 70 and the metal layer 501. As shown in fig. 6.
The profiling jig 70 is provided with an adsorption platform which adsorbs a preset curved surface object for the preset flexible material to be attached, and the profiling jig 70 is also provided with a heating part which heats the material attached. In the embodiment of the present application, the heating part has a plurality of heating units, and in some embodiments, the heating units are uniformly distributed on the profiling surface of the profiling fixture 70, so that the profiling fixture 70 can be integrally heated; in some embodiments, the heating unit is disposed at the bending region D2 of the profiling fixture 70, and can locally heat the bending region D2 of the profiling fixture 70.
And S06, aligning and attaching the first assembly and the second assembly. As shown in fig. 7.
The method specifically comprises the following steps: the side planes of the first member are aligned, and the non-stretching region (plane region D1) of the first member is aligned with the non-stretching region (plane region D1) of the metal layer 501, so that the performance parameters of the support tape 201 are as follows: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100gf/Inch, and the support tape 201 is attached to the metal layer 501 after the first initial tackification to obtain a high tack.
S08, stretch-profiling the end of the support tape 201 along the shape of the profiling fixture 70, and attaching the support tape to the metal layer 501, so that the device layer 10 reaches a predetermined shape or a predetermined elongation. As shown in fig. 8.
It should be noted that in the embodiment of the present application, the stretching direction of the support tape 201 is a direction of a side of the bending region D2 of the support tape 201, in some embodiments, two edges of the display panel are curved surfaces, in some embodiments, the display panel is in a four-curved shape, and in different embodiments, the stretching end of the support tape 201 is determined as required.
In this step, in the process of stretching and profiling the end of the supporting tape 201 along the shape of the profiling fixture 70, the supporting tape 201 is gradually heated until reaching a first set temperature; for example, the first set temperature is 50 to 60 ℃ and the holding time is 20 to 180 seconds. The support tape 201 is heated to be in a flowing state inside, so that the material is softened, the modulus of the support tape 201 can be reduced, and the stretching is facilitated.
In this process, the performance parameters of the support tape 201 are: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesion is 100gf/Inch to 500gf/Inch, preferably 300 gf/Inch.
And S10, curing and tackifying the first assembly.
Wherein the curing tackifying process comprises:
ST201, gradually heating the supporting adhesive tape 201 until the supporting adhesive tape 201 reaches a first set temperature in the process of stretching and profiling the end part of the supporting adhesive tape 201 along the shape of the profiling jig 70; for example, the first set temperature is 50 to 60 ℃.
The support tape 201 is heated to be in a flowing state inside, so that the material is softened, the modulus of the support tape 201 can be reduced, and the stretching is facilitated.
ST202, maintaining a first set temperature for a certain time after the device layer 10 reaches a predetermined shape or a predetermined elongation; for example, the first set temperature is 50 to 60 ℃ and the holding time is 20 to 180 seconds.
After the profiling is finished, the four-corner tension is removed, and as the material is stretched, the cross-linking structure and rigidity in the material tend to restore the material to the original shape, so that the characteristics of the shape and the like cannot be maintained; therefore, the present invention applies a temperature in this state, for example, temperature conditions: 30s at 60 ℃; the support tape 201 is made to internally assume a fluid state, so that the material is softened.
ST203, cooling the support tape 201, and performing a second UV irradiation treatment on the side of the device layer 10 away from the substrate. Process conditions of the second UV irradiation treatment UV 2: energy 2000mj/cm2～6000mj/cm2(ii) a The time is 3-10 s; the wave band is 365-410 nm. As shown in fig. 9.
The UV irradiation treatment increases the adhesive force of the support tape 201 and fixes the molding. Since the support tape 201 is subjected to heat treatment in step ST202 in order to improve tape fluidity, the support tape 201 is cured and thickened by performing temperature reduction treatment simultaneously with UV irradiation in step ST 203.
After the strong capability of the material to restore to the original shape is removed through heating, the adhesive tape is shaped and tackified in a UV curing mode, so that the specific stability of the adhesive tape is not changed easily, the adhesive force is improved, and the permanent high adhesive force is achieved. But the mechanical properties of the material do not change much.
After curing and tackifying treatment, the performance parameters of the support tape 201 are as follows: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesion is more than 500gf/Inch, preferably 1500gf/Inch and above.
ST03, providing a fourth assembly 40, and pre-shaping the fourth assembly 40, wherein the fourth assembly 40 comprises a cover plate and a polarizer, and the cover plate and the polarizer are fixed by a first optical cement. As shown in fig. 10.
ST05, attaching the fourth component 40 to the side of the device layer 10 facing away from the substrate by the second optical glue 30. As shown in fig. 11.
The excess edge supporting film tape may be cut off before the fourth component 40 is attached to the device layer 10. Of course, the fourth component 40 may be attached and then cut to remove the excess adhesive residue. The present application does not limit the cutting order.
In the embodiment of the application, the supporting adhesive tape is adopted to complete the attaching and supporting functions, so that compared with the prior art, redundant film layers are omitted; the rebound force is removed in the temperature rising process, meanwhile, the UV cured tackified adhesive is adhered to the metal layer, the metal layer cannot rebound and loosen, so that the adhesive layer is adhered to the metal layer and kept in the original state, meanwhile, the self-recovery capability of the adhesive tape is weakened to the minimum, and meanwhile, the self-elasticity of the adhesive tape can be kept free from Peeling.
Example two
Referring to fig. 12 in detail, the present application provides a method for manufacturing a curved display panel, including:
and S02, providing a device layer and a supporting adhesive tape, and attaching the supporting adhesive tape to the substrate of the device layer to obtain a first assembly.
The step can be carried out at normal temperature, the selected supporting adhesive tape is in a film shape at normal temperature, and the modulus is 1-500 Mpa, preferably 100 Mpa; elongation > 100%; adhesion <10gf/Inch, preferably <2 gf/Inch.
The support adhesive tape has low adhesive force at normal temperature, so that the possibility of being not suitable for tearing is met, and the adhesion mainly utilizes physical pressure, such as rolling by using a roller, electrostatic adsorption realized by adhering and bubble discharging, air in the support adhesive tape is removed, and close adhesion is realized.
ST01, carrying out second initial tackifying processing on the first assembly;
wherein the second initial tackifying process comprises: and carrying out third UV irradiation treatment on the side of the support adhesive tape, which is far away from the substrate. The process conditions of the third UV irradiation treatment: energy 1000mj/cm2～3000mj/cm2(ii) a The time is 1-5 s; the wave band is 365-410 nm.
Since the support tape is made of hot-melt pressure-sensitive adhesive, the support tape is sensitive to temperature and has certain surface viscosity change under UV irradiation, and the support tape is irradiated by small events with low UV energy, such as 2000mj/cm2The adhesive tape obtains certain adhesion promotion. After the second initial tackification treatment, the performance parameters of the support tape are as follows: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation percentage>100 percent; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
It should be noted that the second initial adhesion-promoting treatment in this step is to initially increase the adhesion of the supporting tape, and in other embodiments, the adhesion may also be increased by means of UV irradiation.
And S04, providing a metal layer, attaching the metal layer to a profiling jig, pre-shaping the metal layer, and obtaining a second assembly consisting of the profiling jig and the metal layer.
The profiling jig is provided with an adsorption platform which adsorbs a preset curved surface object for laminating a preset flexible material, and is also provided with a heating part for heating the material laminated by the profiling jig. In this embodiment, the heating portion has a plurality of heating units, and in this embodiment, the heating unit equipartition is in the profile modeling surface of profile modeling tool, can all carry out the bulk heating to the profile modeling tool.
And S06, aligning and attaching the first assembly and the second assembly.
The method specifically comprises the following steps: the side plane of the first component is aligned, the non-stretching area (plane area) of the first component is aligned with the non-stretching area (plane area) of the metal layer and then is attached, and the performance parameters of the supporting adhesive tape are as follows: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100gf/Inch, and the supporting tape obtains high adhesiveness after the first initial tackification and is attached to the metal layer.
And S08, stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig, and attaching the end part of the supporting adhesive tape to the metal layer to enable the device layer to reach a preset shape or a preset elongation.
It should be noted that, in the embodiment of the present application, the stretching direction of the supporting tape is a direction of a side of the bending region of the supporting tape, in some embodiments, two edges of the display panel are curved surfaces, in some embodiments, the display panel is in a four-curved shape, and in different embodiments, the stretching end of the supporting tape is determined according to requirements.
Because the viscosity of the supporting adhesive tape after the second initial tackifying treatment is increased, the supporting adhesive tape drives the device layer to deform together through the supporting adhesive tape in the stretching process.
In the drawing process, the sheet was in a normal temperature environment and no temperature was applied. Because the normal temperature film material is an elastic material, the modulus is 1 Mpa-500 Mpa, preferably 100Mpa, the normal temperature film material has better tensile deformability, and the elongation is more than 100%, the normal temperature film material can apply tensile force through the expanded supporting adhesive tape corner, and the tensile profiling is carried out along the profiling jig or the profiling metal piece, so that the screen is elongated and reaches the profiled shape and the elongation amount.
In addition, under the condition that the normal temperature membrane material is not applied with temperature, the stretching performance is better, the stretching requirement can be met, but the rebound force is relatively larger when the temperature is not applied.
In this process, the performance parameters of the support tape are: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
ST03, providing a fourth component, and presetting the fourth component, wherein the fourth component comprises a cover plate and a polarizer, and the cover plate and the polarizer are fixedly bonded through a first optical cement.
And ST05, adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive. It is noted that the device layer needs to be maintained in a predetermined shape or a predetermined amount of elongation during the process of performing the attaching.
And S10, curing and tackifying the first assembly.
Wherein the curing tackifying process comprises:
ST211, keeping the device layer to reach a preset shape or a preset elongation, heating the supporting adhesive tape until reaching a second set temperature, and maintaining the second set temperature for a certain time; for example, the second set temperature is 50-60 ℃ and the holding time is 20-180 s.
In the course of the curing and thickening treatment in this step, the support tape needs to be kept in a stretched state. In addition, in this step, the film material is subjected to heat treatment under, for example, temperature conditions: and at the temperature of 60 ℃ for 30s, the interior of the supporting adhesive tape is in a flowing state, so that the material is softened, defoaming treatment can be completed, the fluidity of the supporting adhesive tape is enhanced, restoring force is removed, and the viscosity is slightly improved after the supporting adhesive tape is maintained for a certain time.
In this process, the performance parameters of the support tape are: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesive force is 30 to 200gf/Inch, preferably 300gf/Inch or more.
And ST212, cooling the support adhesive tape, and performing fourth UV irradiation treatment on one side of the metal layer, which is far away from the substrate. The fourth process condition of UV irradiation treatment: energy 1000mj/cm2～6000mj/cm2(ii) a The time is 3-10 s; the wave band is 365-410 nm.
The UV irradiation treatment increases the adhesive force of the support tape and fixes the molding. Since the support tape is subjected to heat treatment in step ST211 in order to improve the tape fluidity, the support tape is cured and thickened by performing temperature reduction treatment simultaneously with UV irradiation in step ST 212.
After the strong capability of the material to restore to the original shape is removed through heating, the adhesive tape is shaped and tackified in a UV curing mode, so that the specific stability of the adhesive tape is not changed easily, the adhesive force is improved, and the permanent high adhesive force is achieved. But the mechanical properties of the material do not change much.
After curing and tackifying treatment, the performance parameters of the supporting adhesive tape are as follows: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesion is more than 500gf/Inch, preferably 1500gf/Inch and above.
In the embodiment of the application, the supporting adhesive tape is adopted to complete the attaching and supporting functions, so that compared with the prior art, redundant film layers are omitted; the rebound force is removed in the temperature rising process, meanwhile, the UV cured tackified adhesive is adhered to the metal layer, the metal layer cannot rebound and loosen, so that the adhesive layer is adhered to the metal layer and kept in the original shape, meanwhile, the self-recovery capability of the adhesive tape is weakened to the minimum, and meanwhile, the self-elasticity of the adhesive tape can be kept without Peling.
EXAMPLE III
Referring to fig. 13 in detail, the present application provides a method for manufacturing a curved display panel, including:
and S02, providing a device layer and a supporting adhesive tape, and attaching the supporting adhesive tape to the substrate of the device layer to obtain a first assembly.
The step can be carried out at normal temperature, the selected supporting adhesive tape is in a film shape at normal temperature, and the modulus is 1-500 Mpa, preferably 100 Mpa; elongation > 100%; adhesion <10gf/Inch, preferably <2 gf/Inch.
The support adhesive tape has low adhesive force at normal temperature, so that the possibility of being not suitable for tearing is met, and the adhesion mainly utilizes physical pressure, such as rolling by using a roller, electrostatic adsorption realized by adhering and bubble discharging, air in the support adhesive tape is removed, and close adhesion is realized.
ST01, carrying out third initial tackifying treatment on the first assembly;
wherein the third initial tackifying process comprises: heating the supporting adhesive tape until a third set temperature is reached; pressurizing the first assembly. Wherein the third set temperature is 50-60 ℃, and the heating time is 1-10 s. The pressing method includes a flat plate type pressing or a roller type pressing.
Because the support adhesive tape adopts hot-melt pressure-sensitive adhesive, certain adhesion promotion can be obtained by heating the adhesive tape for temperature sensitivity. After the third initial tackifying treatment, the performance parameters of the support tape are as follows: modulus 0.5 MPa-100 MPa, preferably 50 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
It should be noted that the third initial tackifying treatment in this step is to initially increase the tackiness of the supporting tape and also to increase the elasticity of the tape; in other embodiments the viscosity may also be increased by means of UV irradiation. By means of pressurization, the support adhesive tape can be more uniformly adhered to the substrate of the device layer.
And S04, providing a metal layer, attaching the metal layer to a profiling jig, pre-shaping the metal layer, and obtaining a second assembly consisting of the profiling jig and the metal layer.
The profiling jig is provided with an adsorption platform which adsorbs a preset curved surface object for laminating a preset flexible material, and is also provided with a heating part for heating the material laminated by the profiling jig. In this embodiment, the heating portion has a plurality of heating units, and in this embodiment, the heating unit equipartition is in the profile modeling surface of profile modeling tool, can all carry out the bulk heating to the profile modeling tool.
And S06, aligning and attaching the first assembly and the second assembly.
The method specifically comprises the following steps: the side plane of the first component is aligned, the non-stretching area (plane area) of the first component is aligned with the non-stretching area (plane area) of the metal layer and then is attached, and the performance parameters of the supporting adhesive tape are as follows: modulus 0.5 MPa-100 MPa, preferably 50 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100gf/Inch, and the supporting tape obtains high adhesiveness after the first initial tackification and is attached to the metal layer.
And S08, stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig, and attaching the end part of the supporting adhesive tape to the metal layer to enable the device layer to reach a preset shape or a preset elongation.
It should be noted that, in the embodiment of the present application, the stretching direction of the supporting tape is a direction of a side of the bending region of the supporting tape, in some embodiments, two edges of the display panel are curved surfaces, in some embodiments, the display panel is in a four-curved shape, and in different embodiments, the stretching end of the supporting tape is determined according to requirements.
Because the viscosity of the supporting adhesive tape after the second initial tackifying treatment is increased, the supporting adhesive tape drives the device layer to deform together through the supporting adhesive tape in the stretching process. Tensile force can be applied through the expanded supporting adhesive tape corners, and stretching profiling is carried out along the profiling jig or the profiling metal piece, so that the screen is stretched and reaches the profiling shape and the elongation.
In this step, in the process of stretching and profiling the end of the supporting adhesive tape along the shape of the profiling jig, the supporting adhesive tape is gradually heated until reaching a fourth set temperature; for example, the fourth set temperature is 50 to 60 ℃ and the holding time is 20 to 180 seconds. The support adhesive tape is heated to enable the interior of the support adhesive tape to be in a flowing state, so that the material is softened, the modulus of the support adhesive tape can be reduced, and the support adhesive tape is convenient to stretch.
In this process, the performance parameters of the support tape are: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
In addition, in this step, the heating may be omitted, and the temperature may be kept at normal temperature. Because the normal temperature film material is an elastic material, the modulus is 1 Mpa-500 Mpa, preferably 100Mpa, the normal temperature film material has better tensile deformability, and the elongation is more than 100%, the normal temperature film material can apply tensile force through the expanded supporting adhesive tape corner, and the tensile profiling is carried out along the profiling jig or the profiling metal piece, so that the screen is elongated and reaches the profiled shape and the elongation amount.
In addition, under the condition of no temperature, the normal temperature film has better stretching performance and can meet the stretching requirement, but the rebound force of the normal temperature film is relatively larger when no temperature exists.
And S10, curing and tackifying the first assembly.
Wherein the curing tackifying process comprises:
ST231, gradually heating the supporting adhesive tape until the supporting adhesive tape reaches a fourth set temperature in the process of stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig; for example, the fourth set temperature is 50 to 60 ℃.
Alternatively, if this step is not performed in S08, heating to the fourth set temperature may also be performed after the device layer reaches the predetermined shape or the predetermined elongation.
ST232, after the device layer reaches the preset shape or the preset elongation, maintaining the fourth set temperature for a certain time; for example, the fourth set temperature is 50 to 60 ℃ and the holding time is 20 to 180 seconds.
After the profiling is finished, the four-corner tension is removed, and as the material is stretched, the cross-linking structure and rigidity in the material tend to restore the material to the original shape, so that the characteristics of the shape and the like cannot be maintained; therefore, the present invention applies a temperature in this state, for example, temperature conditions: 30s at 60 ℃; the inside of the supporting adhesive tape is made to assume a flowing state, so that the material is softened.
And ST233, cooling the support adhesive tape, and carrying out fifth UV irradiation treatment on the side, away from the substrate, of the device layer. The process conditions of the fifth UV irradiation treatment: energy 2000mj/cm2～6000mj/cm2(ii) a The time is 3-10 s; the wave band is 365-410 nm.
The UV irradiation treatment increases the adhesive force of the support tape and fixes the molding. Since the support tape is subjected to heat treatment in step ST232 in order to improve the tape fluidity, the support tape is cured and thickened by performing temperature reduction treatment simultaneously with UV irradiation in step ST 233.
After the strong capability of the material to restore to the original shape is removed through heating, the adhesive tape is shaped and tackified in a UV curing mode, so that the specific stability of the adhesive tape is not changed easily, the adhesive force is improved, and the permanent high adhesive force is achieved. But the mechanical properties of the material do not change much.
After curing and tackifying treatment, the performance parameters of the supporting adhesive tape are as follows: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesion is more than 500gf/Inch, preferably 1500gf/Inch and above.
ST03, providing a fourth component, and presetting the fourth component, wherein the fourth component comprises a cover plate and a polarizer, and the cover plate and the polarizer are fixedly bonded through a first optical cement.
And ST05, adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive.
Before the fourth component is attached to the device layer, the redundant supporting film adhesive tape at the edge can be cut and removed. Of course, the fourth component can be attached and then cut to remove the excess residual glue. The present application does not limit the cutting order.
In the embodiment of the application, the supporting adhesive tape is adopted to complete the attaching and supporting functions, so that compared with the prior art, redundant film layers are omitted; the rebound force is removed in the temperature rising process, meanwhile, the UV cured tackified adhesive is adhered to the metal layer, the metal layer cannot rebound and loosen, so that the adhesive layer is adhered to the metal layer and kept in the original state, meanwhile, the self-recovery capability of the adhesive tape is weakened to the minimum, and meanwhile, the self-elasticity of the adhesive tape can be kept free from Peeling.
Example four
Referring to fig. 14 in detail, the present application provides a method for manufacturing a curved display panel, including:
and S02, providing a device layer and a supporting adhesive tape, and attaching the supporting adhesive tape to the substrate of the device layer to obtain a first assembly.
The step can be carried out at normal temperature, the selected supporting adhesive tape is in a film shape at normal temperature, and the modulus is 1-500 Mpa, preferably 100 Mpa; elongation > 100%; adhesion <10gf/Inch, preferably <2 gf/Inch.
The support adhesive tape has low adhesive force at normal temperature, so that the possibility of being not suitable for tearing is met, and the adhesion mainly utilizes physical pressure, such as rolling by using a roller, electrostatic adsorption realized by adhering and bubble discharging, air in the support adhesive tape is removed, and close adhesion is realized.
And S04, providing a metal layer, attaching the metal layer to a profiling jig, pre-shaping the metal layer, and obtaining a second assembly consisting of the profiling jig and the metal layer.
The profiling jig is provided with an adsorption platform which adsorbs a preset curved surface object for laminating a preset flexible material, and is also provided with a heating part for heating the material laminated by the profiling jig. In this embodiment, the heating portion has a plurality of heating units, and in this embodiment, the heating unit equipartition is in the profile modeling surface of profile modeling tool, can all carry out the bulk heating to the profile modeling tool.
And S06, aligning and attaching the first assembly and the second assembly.
The method specifically comprises the following steps: the side plane of the first component is aligned, the non-stretching area (plane area) of the first component is aligned with the non-stretching area (plane area) of the metal layer and then is attached, and the performance parameters of the supporting adhesive tape are as follows: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; adhesion <10gf/Inch, preferably <2 gf/Inch.
The support adhesive tape has low adhesive force at normal temperature, so that the possibility of being not suitable for tearing is met, and the adhesion mainly utilizes physical pressure, such as rolling by using a roller, electrostatic adsorption realized by adhering and bubble discharging, air in the support adhesive tape is removed, and close adhesion is realized.
ST01, performing fourth initial tackifying treatment on the first assembly; as shown in fig. 15.
Wherein the fourth initial tackifying process comprises: in a partial region of the side of the device layer facing away from the substrateAnd carrying out a sixth UV irradiation treatment, wherein the partial area corresponds to a stretching area of the device layer. Process conditions of the sixth UV irradiation treatment UV 6: energy 1000mj/cm2～3000mj/cm2(ii) a The time is 1-5 s; the wave band is 365-410 nm.
Since the support tape is made of hot-melt pressure-sensitive adhesive, the support tape is sensitive to temperature and has certain surface viscosity change under UV irradiation, and the support tape is irradiated by small events with low UV energy, such as 2000mj/cm2The adhesive tape obtains certain adhesion promotion.
The support tape was subjected to a zoned UV treatment such that the stretch zone (fold zone) tape adhesion was enhanced. After the fourth initial tackifying treatment, the performance parameters of the bending area supporting adhesive tape are as follows: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
Adhesion of the flat areas not treated with UV irradiation to obtain an enhancement, the performance parameters of the support tape are: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; adhesion <10gf/Inch, preferably <2 gf/Inch.
It should be noted that the fourth initial tackifying treatment in this step is to initially increase the viscosity of the support tape in the bending region, so that during subsequent stretching profiling, when the support tape is stretched to deform, deformation of the device layer mainly occurs in the stretching region, and thus the stretching force of the tape is more transmitted to the device layer stretching region.
And S08, stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig, and attaching the end part of the supporting adhesive tape to the metal layer to enable the device layer to reach a preset shape or a preset elongation.
It should be noted that, in the embodiment of the present application, the stretching direction of the supporting tape is a direction of a side of the bending region of the supporting tape, in some embodiments, two edges of the display panel are curved surfaces, in some embodiments, the display panel is in a four-curved shape, and in different embodiments, the stretching end of the supporting tape is determined according to requirements.
Because the viscosity of the stretching area of the support adhesive tape after the fourth initial tackifying treatment is increased, the support adhesive tape drives the device layer to deform together through the support adhesive tape in the stretching process.
In the drawing process, the sheet was in a normal temperature environment and no temperature was applied. Because the normal temperature film material is an elastic material, the modulus is 1 Mpa-500 Mpa, preferably 100Mpa, the normal temperature film material has better tensile deformability, and the elongation is more than 100%, the normal temperature film material can apply tensile force through the expanded supporting adhesive tape corner, and the tensile profiling is carried out along the profiling jig or the profiling metal piece, so that the screen is elongated and reaches the profiled shape and the elongation amount.
In addition, under the condition that the normal temperature membrane material is not applied with temperature, the stretching performance is better, the stretching requirement can be met, but the rebound force is relatively larger when the temperature is not applied.
In this process, the performance parameters of the support tape are: modulus 1 MPa-500 MPa, preferably 100 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100 gf/Inch.
ST03, providing a fourth component, and presetting the fourth component, wherein the fourth component comprises a cover plate and a polarizer, and the cover plate and the polarizer are fixedly bonded through a first optical cement.
And ST05, adhering the fourth component to the side of the device layer, which faces away from the substrate, through a second optical adhesive. It is noted that the device layer needs to be maintained in a predetermined shape or a predetermined amount of elongation during the process of performing the attaching.
And S10, curing and tackifying the first assembly.
Wherein the curing tackifying process comprises:
ST241, keeping the device layer to reach a preset shape or a preset elongation, heating the supporting adhesive tape until reaching a fifth set temperature, and maintaining the fifth set temperature for a certain time; for example, the fifth set temperature is 50 to 60 ℃ and the holding time is 20 to 180 seconds.
Note that, in this step, the heating of the support tape may be zone heating, as shown in fig. 16. The heating area corresponds to a bending area (stretching area) of the supporting adhesive tape, the shape of the stretching area needs to be improved to protect and weaken rebound or relaxation, the bottom material is softer and has stronger viscosity, strong bonding with a metal piece is realized, and the restoring force of the adhesive tape needs to be weak and strong bonding. So that the removal of the restoring force or the material softening process can be concentrated in the four corner stretchable regions.
It should be noted that the support tape needs to be kept in a stretched state during the curing and tackifying treatment in this step.
In this process, the performance parameters of the support tape bending zone: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesive force is 30gf/Inch to 200gf/Inch, preferably 100gf/Inch or more.
ST242, cooling the supporting adhesive tape, and carrying out seventh UV irradiation treatment on one side of the metal layer, which is far away from the substrate. The process conditions of the seventh UV irradiation treatment: energy 1000mj/cm2～6000mj/cm2(ii) a The time is 3-10 s; the wave band is 365-410 nm.
In this step, the seventh UV irradiation treatment is a treatment of irradiating the entire body, and the UV irradiation treatment increases the adhesive force of the support tape and fixes the support tape for molding. After the strong capability of the material to restore to the original shape is removed through heating, the adhesive tape is shaped and tackified in a UV curing mode, so that the specific stability of the adhesive tape is not changed easily, the adhesive force is improved, and the permanent high adhesive force is achieved. But the mechanical properties of the material do not change much.
After curing and tackifying treatment, the performance parameters of the supporting adhesive tape are as follows: modulus 0.2 MPa-50 MPa, preferably 0.5 MPa; elongation > 100%; the adhesion is more than 500gf/Inch, preferably 1500gf/Inch and above.
In the embodiment of the application, the supporting adhesive tape is adopted to complete the attaching and supporting functions, so that compared with the prior art, redundant film layers are omitted; the rebound force is removed in the temperature rising process, meanwhile, the UV cured tackified adhesive is adhered to the metal layer, the metal layer cannot rebound and loosen, so that the adhesive layer is adhered to the metal layer and kept in the original shape, meanwhile, the self-recovery capability of the adhesive tape is weakened to the minimum, and meanwhile, the self-elasticity of the adhesive tape can be kept without Peling.
The present invention has been described in terms of the above embodiments, but it should be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the scope of the described embodiments. It will be appreciated by those skilled in the art that many variations and modifications may be made to the teachings of the invention, which fall within the scope of the invention as claimed.
In a third aspect, the present application provides a display device comprising the curved display panel as described above.
The application of the display device is not particularly limited, and the display device can be any product or component with a display function, such as a television, a notebook computer, a tablet computer, a wearable display device, a mobile phone, a vehicle-mounted display, a navigation, an electronic book, a digital photo frame, an advertising lamp box and the like.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "disposed" and the like, as used herein, may refer to one element being directly attached to another element or one element being attached to another element through intervening elements. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.
Claims (13)
1. A method for manufacturing a curved display panel is characterized by comprising the following steps:
providing a device layer and a supporting adhesive tape, and attaching the supporting adhesive tape to a substrate of the device layer to obtain a first assembly;
providing a metal layer, attaching the metal layer to a profiling jig, pre-shaping the metal layer, and obtaining a second component consisting of the profiling jig and the metal layer;
aligning and attaching the first assembly and the second assembly;
stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig, and attaching the end part of the supporting adhesive tape to the metal layer to enable the device layer to reach a preset shape and/or a preset elongation;
and carrying out curing and tackifying treatment on the first component.
2. The method of claim 1, further comprising, prior to aligning the first component with the second component:
and carrying out first initial tackifying treatment on the first assembly.
3. The method of claim 2, wherein the first initial viscosifying process comprises:
and carrying out first UV irradiation treatment on the side of the support adhesive tape, which is far away from the substrate.
4. The method of claim 3, wherein the curing tackification process comprises:
gradually heating the supporting adhesive tape until a first set temperature is reached in the process of stretching and profiling the end part of the supporting adhesive tape along the shape of the profiling jig;
maintaining a first set temperature for a time after the device layer reaches a predetermined shape or a predetermined elongation;
and cooling the support adhesive tape, and carrying out second UV irradiation treatment on one side of the device layer, which is far away from the substrate.
5. The method of claim 3, wherein the curing tackification process comprises:
heating the supporting adhesive tape until reaching a second set temperature, and maintaining the second set temperature for a certain time;
and cooling the support adhesive tape, and carrying out third UV irradiation treatment on one side of the metal layer departing from the substrate.
6. The method of claim 4 or 5, wherein heating the support tape comprises:
integrally heating the support tape; or heating the bending area of the supporting adhesive tape.
7. The method of claim 2, wherein the first initial viscosifying process comprises:
heating the supporting adhesive tape until a third set temperature is reached;
pressurizing the first assembly.
8. The method of claim 7, wherein the curing tackification process comprises: and after the device layer reaches a preset shape or a preset elongation, cooling the support adhesive tape, and performing fourth UV irradiation treatment on the side, away from the substrate, of the device layer.
9. The method of claim 7, wherein the curing tackification process comprises:
and cooling the support adhesive tape, and carrying out fifth UV irradiation treatment on one side of the metal layer departing from the substrate.
10. The method of claim 1, further comprising, after aligning the first component with the second component:
and carrying out second initial tackifying treatment on the first component.
11. The method of claim 10, wherein the second initial tackifying process comprises:
and carrying out sixth UV irradiation treatment on a partial area of the side, facing away from the substrate, of the device layer, wherein the partial area corresponds to the stretching area of the device layer.
12. A curved display panel comprising a planar area and a bending area disposed at an edge of the planar area, wherein the curved display panel is manufactured according to the method of any one of claims 1 to 11, the curved display panel comprises a device layer, a supporting tape, and a metal layer, the device layer, the supporting tape, and the metal layer are stacked, and the metal layer comprises one or more of a supporting member, a heat sink, and a shielding layer.
13. A display device comprising the curved display panel according to claim 12.
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