CN111477670B

CN111477670B - Display device

Info

Publication number: CN111477670B
Application number: CN202010398161.6A
Authority: CN
Inventors: 谷朋浩; 高彪
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-05-12
Filing date: 2020-05-12
Publication date: 2023-09-01
Anticipated expiration: 2040-05-12
Also published as: CN111477670A

Abstract

The present application provides a display device including: the display panel comprises a flat plate part, a bending part and a fixing part, wherein the bending part is positioned between the flat plate part and the fixing part, and the fixing part is bent to the back surface of the flat plate part through the bending part; the support structure is arranged on the back surface of the flat plate part and comprises a first glue layer, a second glue layer and a support part, wherein the first glue layer is contacted with the flat plate part, the second glue layer is contacted with the fixed part, and the support part is positioned between the first glue layer and the second glue layer; along the direction perpendicular to the flat plate part, the supporting part comprises a supporting layer and a buffer layer solidified on one side of the supporting layer facing the first glue material layer. The display device is used for realizing the light and thin design and the narrow frame design of the display device.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

The organic light emitting diode display device (Organic Light Emitting Display, OLED) gradually becomes the first choice of the screen, and has advantages of self-luminescence, high luminous efficiency, short response time, high definition and contrast, and the like, and meanwhile, the screen can be ensured to have certain flexibility and adaptability. With the development of flexible display screens, there is an increasing desire for foldable and curved display products.

At present, the flexible display screen film layer generally comprises a cover plate, a module functional film layer, a luminous film layer, a back plate film layer, a flexible substrate, a back support film and other film layer structures. In the prior art, the substrate portion connecting the flexible circuit board (Flexible Circuit Board, FPC) and the driving chip (Integrated Circuit, IC) can be directly bent to the back of the display panel, thereby realizing a narrow bezel design of the flexible display device. In addition, the back support film mainly plays a role in supporting and protecting a film layer and realizing corresponding mechanical properties under the display panel, and plays a vital role in the process of preparing the flexible display screen.

As shown in fig. 1, which is a schematic structural diagram of stacking a back film and a supporting structure together in a conventional flexible display device, wherein the back film 01 includes a first substrate 2 and a first adhesive 1 coated on the first substrate 2, the first substrate 2 is usually made of a polymer material, the supporting structure 02 includes a supporting member 4 and a second adhesive 3 coated on the supporting member 4, in order to facilitate transportation and storage of related structures, release films are respectively disposed on opposite sides of the back film 01, release films are respectively disposed on opposite sides of the supporting structure 02, and in the process of preparing the flexible display device, when the first substrate 2 of the back film 01 and the second adhesive 3 of the supporting structure 02 are adhered, the release films at the adhering positions are often required to be peeled off, and then adhered together, so as to form a stacked structure of the back film 01 and the supporting structure 02 shown in fig. 1, wherein a mark "5" in fig. 1 is the first release film adhered on one side of the first adhesive 1 facing away from the first substrate 2, and a mark "6" is the second release film adhered on one side of the supporting member 4 facing away from the second adhesive 3. When the flexible display device is manufactured later, the first release film 5 and the second release film 6 can be directly peeled off, and then the relevant modules are attached to each other to manufacture the flexible display device. Wherein the thickness of the first substrate 2 is generally 20 μm to 100 μm, the thicknesses of the first adhesive material 1 and the second adhesive material 3 are generally 10 μm to 50 μm, and when the supporting member 4 is metal, the thickness of the supporting member 4 is generally 15 μm to 50 μm, and the whole stacking structure is thicker. In this way, after the flexible display device is formed by attaching the flexible display device to the back of the panel and bending the flexible display device, the whole thickness of the flexible display device is thicker, and the whole frame is wider.

Therefore, the light and thin design and the narrow frame design of the display device cannot be guaranteed in the prior art.

Disclosure of Invention

The application provides a display device which is used for realizing the light and thin design and the narrow frame design of the display device.

An embodiment of the present application provides a display device including:

the display panel comprises a flat plate part, a bending part and a fixing part, wherein the bending part is positioned between the flat plate part and the fixing part, and the fixing part is bent to the back surface of the flat plate part through the bending part;

the support structure is arranged on the back surface of the flat plate part and comprises a first glue layer, a second glue layer and a support part, wherein the first glue layer is contacted with the flat plate part, the second glue layer is contacted with the fixed part, and the support part is positioned between the first glue layer and the second glue layer;

along the direction perpendicular to the flat plate part, the supporting part comprises a supporting layer and a buffer layer solidified on one side of the supporting layer facing the first glue material layer.

In one possible implementation, a base layer in contact with the second glue layer and a third glue layer in contact with the fixing portion are provided between the second glue layer and the fixing portion.

In one possible implementation, the flat plate portion includes a bendable region and a non-bendable region other than the bendable region;

the thickness of the buffer layer in the non-bending area is a first thickness along the direction perpendicular to the bending axis of the flat plate part, and the thickness of the buffer layer in the bendable area is a second thickness smaller than the first thickness.

In one possible implementation, the thickness of the buffer layer in the non-bending region is the first thickness, and the thickness of the buffer layer in the bendable region is a third thickness smaller than the first thickness along a direction parallel to the bending axis.

In one possible implementation manner, the bendable region includes a central region, and a first edge region and a second edge region that are symmetrically disposed with respect to the central region, and along a direction parallel to the bending axis, a thickness of the buffer layer in the non-bending region is the first thickness, a thickness of the buffer layer in the central region is the second thickness, and a thickness of the buffer layer in the first edge region and the second edge region is the third thickness that is smaller than the second thickness.

In one possible implementation, the third thickness decreases according to a decrease in distance from the edge of the flat plate portion at a position corresponding to the bending axis.

In one possible implementation, the material of the buffer layer is at least one of thermoplastic polyimide, thermoplastic polyurethane elastomer rubber, polyimide, and polyethylene terephthalate.

In one possible implementation, the support portion is formed by hot pressing the thermoplastic polyimide or the thermoplastic polyurethane elastomer rubber at a temperature of 300 to 350 ℃ and a pressure of 0.8 to 1.0N for 10 to 15s on the support layer.

In one possible implementation, the support is formed by coating the polyimide or the polyethylene terephthalate on the support layer and curing at a high temperature.

In one possible implementation, the modulus of the support layer is 100Gpa to 400Gpa, the modulus of the thermoplastic polyimide is 1Gpa to 8Gpa, and the modulus of the thermoplastic polyurethane elastomer rubber is 1Mpa to 500Mpa.

In one possible implementation, the thickness of the support layer ranges from 15 μm to 50 μm.

In one possible implementation, the buffer layer has a thickness of 10 μm to 50 μm.

The beneficial effects of the application are as follows:

the embodiment of the application provides a display device, which comprises a display panel, wherein the display panel comprises a flat plate part, a fixing part and a bending part positioned between the flat plate part and the fixing part, the fixing part is bent to the back surface of the flat plate part through the bending part, the display device also comprises a support structure arranged on the back surface of the flat plate part, the support structure comprises a first adhesive layer contacted with the flat plate part, a second adhesive layer contacted with the fixing part, and a support part positioned between the first adhesive layer and the second adhesive layer, and the support part comprises a support layer and a buffer layer solidified on one side of the support layer facing the first adhesive layer along the direction vertical to the flat plate part. In this way, the whole supporting layer and the buffer layer solidified on the supporting layer can be used as a substrate, so that the supporting structure capable of protecting the display panel can be formed by respectively coating the first adhesive layer and the second adhesive layer on the opposite surfaces of the whole supporting layer.

Drawings

FIG. 1 is a schematic illustration of one of the structures of a conventional flexible display device in which a back film and a support structure are stacked together;

FIG. 2 is a schematic view of a structure in which the stacked structure shown in FIG. 1 is attached to the back of a panel;

FIG. 3 is a schematic diagram illustrating one of the display panels shown in FIG. 2 after being bent;

fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present application;

FIG. 5 is a schematic view of one of the stacked structures forming the support structure of FIG. 4;

FIG. 6 is a schematic diagram of one of the structures of the display panel before bending in the embodiment of the application;

fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present application;

fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present application;

FIG. 9 is a schematic diagram of one of the structures of the display panel before bending in the embodiment of the application;

fig. 10 is a schematic structural diagram of a display device according to an embodiment of the present application;

FIG. 11 is a schematic view illustrating a region division of a flat plate portion according to an embodiment of the present application;

fig. 12 is a schematic view of one area division of a flat plate portion according to an embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of one of the support portions along the direction shown by MM' in FIG. 12;

FIG. 14 is a schematic cross-sectional view of one of the support portions along the direction indicated by NN' in FIG. 11;

fig. 15 is a schematic cross-sectional view of one of the supporting parts along the direction indicated by MM' in fig. 12;

fig. 16 is a schematic structural diagram of a display device according to an embodiment of the application.

Reference numerals illustrate: 01-a backing film; 1-a first adhesive material; 2-a first substrate; 02-a support structure; 3-a second adhesive material; 4-a support; 5-a first release film; 6-a second release film; 7-panels; 8-a third adhesive material; 81-fourth adhesive material; 9-a second substrate; 10-a display panel; 101-a plate portion; 102-a bending part; 103-a fixing part; 20-a support structure; 201-a first glue layer; 202-a second glue layer; 203-a support; 2031-a support layer; 2032-a buffer layer; 30-a third release film; 40-fourth release film; 204-a substrate layer; 205-a third glue layer; 50-a protective adhesive layer; a-a bendable region; b-non-inflection region; a C-center region; d1—a first edge region; d2—a second edge region; 60-a functional module layer; 70-an optical adhesive layer; 80-cover plate.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, embodiments of the application. And embodiments of the application and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present application fall within the protection scope of the present application.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. As used in this specification, the word "comprising" or "comprises", and the like, means that the element or article preceding the word is meant to encompass the element or article listed thereafter and equivalents thereof without excluding other elements or articles.

It should be noted that the dimensions and shapes of the figures in the drawings do not reflect true proportions, and are intended to illustrate the present application only. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

In the prior art, the stacked structure shown in fig. 1 is attached to the back of the panel 7 to form a structure as shown in fig. 2, in order to ensure the supporting performance of the stacked structure on the panel 7, a layer of third adhesive material 8 is coated on one side of the supporting member 4 away from the panel 7, the third adhesive material 8 may be a three-layer structure with adhesive layers respectively disposed on two opposite sides of the substrate layer, and then the part of the panel 7 for binding the driving chip, the fourth adhesive material 81 attached to the back of the part, and the second substrate 9 are bent to attach to the third adhesive material 8 on the back of the Active Area (AA) of the panel 7 to form a structural schematic diagram as shown in fig. 3. In the support structure of the display device after bending, besides the support member 4, there are two layers of substrates and multiple layers of adhesive materials, so that the overall thickness is thicker, and in this way, the bending radius of the bendable portion of the panel 7 is also larger, which results in a larger frame.

In view of this, the embodiment of the application provides a display device for realizing a light and thin design and a narrow frame design of the display device.

Fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present application, where the display device includes:

the display panel 10, the display panel 10 includes a flat plate portion 101, a bending portion 102, and a fixing portion 103, wherein the bending portion 102 is located between the flat plate portion 101 and the fixing portion 103, and the fixing portion 103 is bent to the back surface of the flat plate portion 101 through the bending portion 102;

in the embodiment of the present application, at least part of the flat plate portion 101 is used for display, and the fixing portion 103 can be used for IC binding.

A support structure 20 disposed on the back surface of the flat plate portion 101, the support structure 20 including a first glue layer 201 contacting the flat plate portion 101, a second glue layer 202 contacting the fixing portion 103, and a support portion 203 between the first glue layer 201 and the second glue layer 202;

in the embodiment of the present application, the first adhesive layer 201 may be a Pressure Sensitive Adhesive (PSA), or may be an optical adhesive (Optically Clear Adhensive, OCA), the second adhesive layer 202 may be a double-sided adhesive, or may be a three-layer structure with adhesive layers respectively disposed on two opposite sides of the substrate layer, and of course, a person skilled in the art may select materials of the first adhesive layer 201 and the second adhesive layer 202 according to practical application needs, which is not limited herein.

The support portion 203 includes a support layer 2031 and a buffer layer 2032 cured on a side of the support layer 2031 facing the first adhesive layer 201 in a direction perpendicular to the flat plate portion 101.

In the embodiment of the present application, the supporting portion 203 includes a supporting layer 2031 and a buffer layer 2032 cured on the supporting layer 2031 facing the first adhesive layer 201. In this way, the supporting layer 2031 and the buffer layer 2032 cured thereon form the integrated supporting portion 203, so that the first adhesive layer 201 and the second adhesive layer 202 can be coated on the opposite surfaces of the supporting portion 203 to form the supporting structure 20 capable of protecting the display panel 10, and the supporting structure 20 does not need to be attached to other substrates by the supporting portion 203, so that the whole thickness can be made thin, and accordingly, the bending radius of the bending portion 102 can be reduced, thereby realizing the light and thin design and the narrow frame design of the display device.

In addition, in the embodiment of the present application, since the rigidity of the supporting layer 2031 may bring a larger stress to the display panel 10, by curing the buffer layer 2032 on the side of the supporting layer 2031 facing the first adhesive layer 201, the stress of the supporting layer 2031 on the display panel 10 can be weakened by the buffer layer 2032, thereby further improving the service life of the display device.

In the embodiment of the present application, the present inventors found that, in the bending performance test of the supporting layer 2031 made of various materials, when the supporting layer 2031 is respectively made of polyethylene terephthalate (Polyethylene Terephthalate, PET), polyimide (PI) or stainless steel sheet, the non-recovery angle of the supporting layer 2031 made of PET is 120 ° to 140 ° and the non-recovery angle of the supporting layer 2031 made of PI is 60 ° to 100 ° and the non-recovery angle of the supporting layer 2031 made of stainless steel is 10 ° or less when each supporting layer 2031 is statically bent at a temperature of 60 ℃ and a humidity of 90% rh, compared with the case where the metal material is selected as the supporting layer 2031, the rebound resilience of the structure is better and the crease is smaller. In this way, in the embodiment of the present application, a metal material may be selected to prepare the supporting layer 2031, so that the supporting layer 2031 has better rebound resilience, smaller folds, and better usability and better user experience of the finally prepared display device. In practical applications, a person skilled in the art may select the corresponding material of the supporting layer 2031 according to actual needs, which is not limited herein.

Material	Static bending (60 ℃/90%RH)	Angle of no return
			PET	120h	120°～140°
PI	120h	60°～100°
			Stainless steel sheet	120h	10 DEG or less

TABLE 1

In the embodiment of the present application, when the support structure 20 of the display device is manufactured, the substrate made of the polymer material may be removed, for example, the first substrate 2 in fig. 1 is removed, and the metal material is used to manufacture the support layer 2031 of the support structure 20, so that the metal material has better rebound resilience and smaller folds compared with the polymer material, thereby improving the usability of the display device. In addition, the buffer layer 2032 cured on the support layer 2031 effectively weakens the rigidity stress of the support layer 2031 on the display panel 10, thereby effectively protecting the display panel 10 and improving the service life of the display device.

In the embodiment of the present application, when the supporting layer 2031 is made of a metal material, the thickness of the supporting layer 2031 may be in the range of 15 μm to 50 μm, and in practical application, the thickness of the supporting layer 2031 may be set to 40 μm, so that the supporting layer 2031 can effectively ensure effective supporting of the relevant film layers of the display panel 10, and simultaneously, avoid that the excessive thickness of the supporting layer 2031 generates larger rigid stress on the display panel 10. In addition, the thickness of the buffer layer 2032 is in the range of 10 μm to 50 μm, and in practical applications, the thickness of the buffer layer 2032 may be set to 25 μm, so that the buffer layer 2032 can weaken the rigidity stress of the support layer 2031 against the display panel 10, and at the same time, the film layer is not peeled off due to the too thick buffer layer 2032, and too thin stress buffer is not obvious, thereby ensuring the service performance of the display device. In practical application, compared with the prior art, the display device provided by the embodiment of the application can be thinned by 50-60 mu m, so that the light and thin design and the narrow frame design of the display device are realized.

In an embodiment of the present application, as shown in fig. 5, which is a schematic diagram of one of the stacked structures used to form the support structure 20 of fig. 4 in the embodiment of the present application, specifically, the stacked structure includes a support portion 203, the support portion 203 includes a support layer 2031 and a buffer layer 2032 cured on a surface of the support layer 2031, the stacked structure further includes a first adhesive layer 201 coated on the buffer layer 2032, in addition, for convenience of transportation and storage, a third release film 30 is attached to a side of the first adhesive layer 201 facing away from the support layer 2031, a fourth release film 40 is attached to a side of the support layer 2031 facing away from the first adhesive layer 201, and during use, the third release film 30 and the fourth release film 40 in fig. 5 may be peeled off directly, and then attached to a back surface of the flat plate portion 101 in fig. 4, and then, a second adhesive layer 202 is coated on a side of the support layer 2031 facing away from the first adhesive layer 201 to form the support structure 20.

In an embodiment of the present application, as shown in fig. 6, which is a schematic structural diagram of the display panel 10 before being bent, specifically, after the stacking structure shown in fig. 1 is used to perform the binding process of the related modules of the display device, since the back film 01 may be used as a process film, in a specific implementation process, the back film 01 located on the back of the display panel 10 may be peeled off, the stacking structure shown in fig. 5 is peeled off and attached to the back of the flat plate portion 101, and the second adhesive layer 202 is coated on the side of the supporting layer 2031 facing away from the first adhesive layer 201 to form the supporting structure 20, and then the fixing portion 103 is bent to the back of the flat plate portion 101, thereby forming the display device shown in fig. 4. Because the whole process is directly based on the procedural of the back film 01, the bonding of the required supporting structure 20 and the display panel 10 can be realized, the whole manufacturing process is simplified, and the manufacturing efficiency of the display device is improved. In addition, compared with fig. 2, when the supporting layer 2031 with the same thickness is used, the display device has a thinner design because there are fewer two substrates and fewer two glue layers on the back of the flat plate portion 101, and the overall thickness is relatively thinner.

In an embodiment of the present application, as shown in fig. 7, a schematic structure of a display device is shown, specifically, a base layer 204 contacting the second adhesive layer 202 and a third adhesive layer 205 contacting the fixing portion 103 are disposed between the second adhesive layer 202 and the fixing portion 103. In a specific implementation process, the material of the base layer 204 may be PET, or may be a polymer material such as PI. The third adhesive layer 205 may be PSA adhesive or OCA adhesive. By additionally arranging the substrate layer 204 and the third adhesive layer 205, stability of the relevant stacked film layers of the display device is further improved, and service performance of the display device is further improved.

The supporting structure 20 of the display device shown in fig. 7 on the back of the flat plate portion 101 has a smaller substrate than that of fig. 2, and therefore, the display device is thinned to a certain extent, and the bending radius of the display panel 10 is further reduced, so that the light and thin design and the narrow frame design of the display device are realized.

In an embodiment of the present application, as shown in fig. 8, which is a schematic structural diagram of a display device provided in an embodiment of the present application, in particular, the display device further includes a protective adhesive layer 50 covering the bending portion 102, where the protective adhesive layer 50 may be an MCL adhesive layer, so that the bending portion 102 is not broken during bending, and the subsequent process can be effectively prevented from damaging the circuit wiring, thereby improving the service life of the display device.

In an embodiment of the present application, as shown in fig. 9, which is a schematic structural diagram of the display panel 10 before being bent, specifically, after the binding process of the related modules of the display device is performed by adopting the stacked structure shown in fig. 1, only the whole back film located at the back of the flat plate portion 101 may be torn off, the back film at the back of the fixing portion 103 is remained, which includes the base layer 204 and the third adhesive layer 205, then the stacked structure shown in fig. 5 is peeled off to form a release film and then is attached to the back of the flat plate portion 101, and then the fixing portion 103 is bent to the back of the flat plate portion 101, so as to form the display device shown in fig. 7.

In the embodiment of the present application, since the supporting portion 203 includes the supporting layer 2031 and the buffer layer 2032 cured on the side of the supporting layer 2031 facing the first adhesive layer 201, replacement of the stacked structure on the back surface of the display panel 10 can be achieved by peeling and bonding, and thus diversified designs of the display device are achieved. And the whole process can be realized by direct stripping and bonding, the process cost is lower, and the manufacturing efficiency is higher.

In the embodiment of the present application, fig. 10 and 11 are combined, wherein fig. 10 is a schematic diagram of one structure of the display device, and fig. 11 is a schematic diagram of one area division of the flat plate portion 101. Specifically, the flat plate portion 101 includes a bendable region a and a non-bendable region B other than the bendable region a;

the thickness of the buffer layer 2032 in the non-bending region B is a first thickness d1 along a direction perpendicular to the bending axis of the flat plate portion 101, and the thickness of the buffer layer 2032 in the bendable region a is a second thickness d2 smaller than the first thickness d 1.

In the embodiment, the direction perpendicular to the bending axis of the flat plate portion 101 may be the direction indicated by the arrow X in fig. 11, and the direction parallel to the bending axis of the flat plate portion 101 may be the direction indicated by the arrow Y in fig. 11. Since the second thickness d2 of the buffer layer 2032 in the bendable region a is smaller than the first thickness d1 of the buffer layer 2032 in the non-bendable region B along the direction perpendicular to the bending axis of the flat plate portion 101, the thickness of the first adhesive layer 201 coated on the buffer layer 2032 in the bendable region a will be greater than that in the non-bendable region B, so that the occurrence of cracks in the bendable region can be effectively avoided.

In the embodiment of the present application, the thickness of the buffer layer 2032 in the non-bending region B is a first thickness d1 along the direction parallel to the bending axis, and the thickness of the buffer layer 2032 in the bendable region a is a third thickness d3 smaller than the first thickness d 1. In a specific implementation, the third thickness d3 may be equal to the second thickness d2. The thickness of the buffer layer 2032 in the non-bending region B is the first thickness d1, that is, the thickness of the buffer layer 2032 in the non-bending region is the same, and the thickness of the buffer layer 2032 in the bendable region a is the third thickness d3, that is, the thickness of the buffer layer 2032 in the non-bending region is the same. In the specific implementation process, the patterning treatment of the buffer layer 2032 can be directly realized through hot pressing film or casting, and the whole process is simpler.

In an embodiment of the present application, as shown in fig. 12, which illustrates one of the area division diagrams of the flat plate portion 101, specifically, the bendable region a includes a central region C and a first edge region D1 and a second edge region D2 symmetrically disposed with respect to the central region C, the thickness of the buffer layer 2032 in the non-bending region B is a first thickness D1, the thickness of the buffer layer 2032 in the central region C is a second thickness D2, and the thickness of the buffer layer 2032 in the first edge region D1 and the second edge region D2 is a third thickness D3 smaller than the second thickness D2 along a direction parallel to the bending axis. Fig. 13 is a schematic cross-sectional view of one of the supporting portions 203 along the direction indicated by MM' in fig. 12. In the implementation process, the first edge area D1 and the second edge area D2 are closer to the edge perpendicular to the bending axis of the flat plate portion 101 than the central area C, and in practical application, the first edge area D1 and the second edge area D2 are more prone to generate cracks than the central area C, and the third thickness D3 of the buffer layer 2032 in the first edge area D1 and the second edge area D2 is smaller than the second thickness D2 in the central area C, so that the generation of cracks in the first edge area D1 and the second edge area D2 can be effectively avoided. And the second thickness d2 of the buffer layer 2032 in the central area C is smaller than the first thickness d1 of the buffer layer 2032 in the bendable area a, so that cracks are prevented from being generated in the central area C, and the service performance of the display device is improved.

In the embodiment of the present application, the third thickness d3 decreases as the distance from the edge of the flat plate portion 101 at the position corresponding to the bending axis becomes smaller. Fig. 14 is a schematic cross-sectional view of one of the supporting portions 203 along the direction indicated by NN' in fig. 11. Fig. 15 is a schematic cross-sectional view of one of the supporting portions 203 along the direction indicated by MM' in fig. 12. In a specific implementation process, since the edge of the flat plate portion 101 is more prone to generate cracks, the closer the third thickness d3 is to the edge of the flat plate portion 101 along the direction parallel to the bending axis, and accordingly, the thinner the thickness of the buffer layer 2032 is, the thicker the thickness of the first adhesive layer 201 is, which is closer to the edge of the flat plate portion 101, thereby effectively avoiding the occurrence of cracks on the edge of the flat plate portion 101 and further improving the service life of the display device.

In practical applications, the person skilled in the art may divide the area of the flat plate portion 101 according to the actual needs, which is not limited herein, and may set the shape of the area of the bendable region a according to the actual needs, for example, may be rectangular, circular, or triangular, which is not limited herein.

In an embodiment of the present application, the material of the buffer layer 2032 is at least one of thermoplastic polyimide, thermoplastic polyurethane elastomer rubber, polyimide, and polyethylene terephthalate. In a specific implementation process, the rigid stress of the supporting layer 2031 to the display panel 10 can be weakened through the buffer layer 2032, thereby improving the service life of the display device.

In the embodiment of the present application, the buffer layer 2032 may be cured on the support layer 2031 in the following two ways, but is not limited to the following two ways.

First mode

The first mode is specifically that the supporting portion 203 is formed by hot-pressing thermoplastic polyimide or thermoplastic polyurethane elastomer rubber at a temperature of 300 to 350 ℃ and a pressure of 0.8 to 1.0N for 10 to 15s on the supporting layer 2031. In this way, the supporting layer 2031 and the buffer layer 2032 made of thermoplastic polyimide or thermoplastic polyurethane elastomer rubber can form the integrated supporting portion 203, and the peel strength is about 17N/Inch, thereby simplifying the manufacturing process.

In addition, the buffer layer 2032 made of thermoplastic polyimide or thermoplastic polyurethane elastomer rubber weakens the reflective ability of the support layer 2031 to external ambient light or internal light to some extent, thereby improving the display effect of the display device.

Second mode

The second mode is specifically that the supporting portion 203 is formed by coating polyimide or polyethylene terephthalate on the supporting layer 2031 and curing at a high temperature. In a specific implementation process, the buffer layer 2032 formed of polyimide or polyethylene terephthalate is cured on the support layer 2031 by high-temperature curing, thereby forming the integrated support 203, and further simplifying the manufacturing process.

In the embodiment of the present application, the modulus of the supporting layer 2031 is 100Gpa to 400Gpa, the modulus of the thermoplastic polyimide is 1Gpa to 8Gpa, and the modulus of the thermoplastic polyurethane elastomer rubber is 1Mpa to 500Mpa. In practical applications, the buffer layer 2032 may be made of thermoplastic polyimide with a modulus of 2Gpa, and thus, the prepared buffer layer 2032 is softer than the support layer 2031 made of metal material, so that the rigidity stress of the support layer 2031 to the display panel 10 can be effectively weakened, thereby improving the service life of the display device.

In an embodiment of the present application, as shown in fig. 16, a schematic structural diagram of a display device, specifically, along a light emitting direction of the flat plate portion 101, the display device further includes a functional module layer 60, such as a touch panel, a polarizer, etc., disposed on the flat plate portion 101, an optical adhesive layer 70 disposed on the functional module layer 60, and a cover plate 80 disposed on the optical adhesive layer 70. The flat plate portion 101 includes a back plate structure, a light emitting film layer, and a packaging film layer, and the related film layers are the same as those in the prior art, which are not described in detail in the present application. Of course, in practical applications, a person skilled in the art may set the relevant film layer on the support structure 20 according to need, which is not limited herein.

In a specific implementation process, the display device provided by the embodiment of the present application may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are those of ordinary skill in the art and will not be described in detail herein, nor should they be considered as limiting the present disclosure. The implementation of the display device can be referred to the above embodiments, and the repetition is not repeated.

While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims

1. A display device, comprising:

along the direction perpendicular to the flat plate part, the supporting part comprises a supporting layer and a buffer layer solidified on one side surface of the supporting layer facing the first glue layer, wherein the supporting part is an integrated structure formed by hot-press forming the buffer layer on the supporting layer by adopting a hot-press process.

2. The display device according to claim 1, wherein a base layer in contact with the second adhesive layer and a third adhesive layer in contact with the fixing portion are provided between the second adhesive layer and the fixing portion.

3. The display device according to claim 1 or 2, wherein the flat plate portion includes a bendable region and a non-bendable region other than the bendable region;

4. A display device as claimed in claim 3, characterized in that the thickness of the buffer layer in the non-bending region is the first thickness and the thickness of the buffer layer in the bendable region is a third thickness smaller than the first thickness in a direction parallel to the bending axis.

5. The display device according to claim 4, wherein the bendable region includes a central region and first and second edge regions disposed symmetrically with respect to the central region, the thickness of the buffer layer in the non-bending region is the first thickness, the thickness of the buffer layer in the central region is the second thickness, and the thickness of the buffer layer in the first and second edge regions is the third thickness smaller than the second thickness in a direction parallel to the bending axis.

6. The display device according to claim 5, wherein the third thickness decreases as a distance from an edge of the flat plate portion at a position corresponding to the bending axis becomes smaller.

7. The display device according to claim 1, wherein the supporting portion is formed by hot-pressing thermoplastic polyimide or thermoplastic polyurethane elastomer rubber at a temperature of 300 ℃ to 350 ℃ and a pressure of 0.8n to 1.0n for 10s to 15s on the supporting layer.

8. The display device according to claim 1, wherein the supporting portion is formed by coating polyimide or polyethylene terephthalate on the supporting layer and curing at a high temperature.

9. The display device according to claim 7, wherein the modulus of the support layer is 100gpa to 400gpa, the modulus of the thermoplastic polyimide is 1gpa to 8gpa, and the modulus of the thermoplastic polyurethane elastomer rubber is 1mpa to 500mpa.