JP2017017167A - Electromagnetic wave shielding film, and electronic component mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding film capable of shielding up to the electromagnetic wave of high frequency band, while down-sizing and thinning, and to provide an electronic component mounting board where an electronic component mounted on a board is coated with an electromagnetic wave shielding layer, by using such an electromagnetic wave shielding film.SOLUTION: An electromagnetic wave shielding film 10 is constituted to include an electromagnetic wave shielding layer 3 having a first conductor layer 31 containing a conductive material, and a laminate 32 laminating a second conductor layer 36 containing a conductive material, and a dielectric layer 35 containing a dielectric material. The laminate 32 is laminated so that the dielectric layer 35 is located on the first conductor layer 31 side.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electromagnetic wave shielding film and an electronic component mounting substrate.

  Conventionally, electronic components that are easily affected by electromagnetic waves, such as mobile phones and medical devices, exothermic electronic components such as semiconductor elements, various electronic components such as capacitors and coils, or these electronic components are mounted on a circuit board. In order to reduce the influence of noise caused by electromagnetic waves, an electromagnetic shielding film has been attached to the surface of the electronic devices.

  As such an electromagnetic wave shielding film, for example, a film having a protective layer (base material layer) made of an insulating material and a metal layer laminated on one or both surfaces of the protective layer has been developed (for example, , See Patent Document 1).

  However, as described in Patent Document 1, when the electromagnetic wave shielding film has a configuration having a metal layer, there is a problem that it is not possible to cope with the reduction in weight and thickness that has been increasingly demanded in recent years.

  In addition, as described above, the electronic equipment to which the electromagnetic wave shielding film is attached has been diversified, and the frequency of electromagnetic waves, which is noise to be blocked, has also been diversified accordingly. However, the function of blocking such electromagnetic waves is demonstrated. Examples of the electromagnetic wave blocking layer that can be used include a reflective layer and an absorbing layer.

  Here, in the reflection layer, the electromagnetic wave incident on the electromagnetic wave blocking layer is blocked (shielded), and in the absorbing layer, the electromagnetic wave incident on the electromagnetic wave blocking layer is absorbed and converted into thermal energy, thereby converting the electromagnetic wave. Disappear and block. Among these, the reflective layer has a drawback that the reflected electromagnetic waves have an adverse effect such as malfunction on other members not covered with the electromagnetic wave shielding layer. Therefore, in recent years, research has been conducted on an electromagnetic wave shielding layer composed of an absorbing layer, and in particular, an electromagnetic shielding film including an electromagnetic wave shielding layer (absorbing layer) capable of effectively blocking even a high frequency band has been developed. ing.

JP 2006-156946 A

  An object of the present invention is to reduce the weight and thickness of the electromagnetic wave shielding film capable of blocking even electromagnetic waves in a high frequency band by absorption, and an electron mounted on a substrate using the electromagnetic wave shielding film. An object of the present invention is to provide an electronic component mounting substrate in which the component is covered with an electromagnetic wave shielding layer.

Such an object is achieved by the present invention described in the following (1) to (11).
(1) a first conductor layer containing a conductive material;
An electromagnetic wave shielding layer having a second conductor layer containing the conductive material and a laminate in which a dielectric layer containing a dielectric material is laminated;
The electromagnetic wave shielding film, wherein the laminate is laminated with the dielectric layer facing the first conductor layer.

  (2) The electromagnetic wave shielding layer according to (1), wherein the electromagnetic wave shielding layer includes a plurality of the laminated bodies.

  (3) The electromagnetic shielding film according to (1) or (2), wherein the conductive material contains a conductive polymer.

  (4) The electromagnetic shielding film according to (3), wherein the conductive polymer is at least one of polyaniline, PEDOT / PSS, polypyrrole, and polythiophene.

  (5) The electromagnetic wave shielding film according to any one of (1) to (4), wherein the dielectric material contains a ceramic material.

  (6) The electromagnetic wave according to (5), wherein the ceramic material is at least one of barium titanate, perovskite-type barium calcium zirconate titanate crystal particles, titania, alumina, zirconia, silicon carbide, and aluminum nitride. Shield film.

  (7) The electromagnetic wave shield according to any one of (1) to (6), wherein the first conductor layer and the second conductor layer each have an average layer thickness of 0.5 μm or more and 30 μm or less. Film.

  (8) The electromagnetic wave shielding film according to any one of (1) to (7), wherein the dielectric layer has an average layer thickness of 0.5 μm or more and 30 μm or less.

  (9) The electromagnetic wave shielding film according to any one of (1) to (8), further including a protective sheet laminated on one surface side of the electromagnetic wave shielding layer.

  (10) Any of the above (1) to (9), wherein the insulating layer is provided in contact with the other surface side of the electromagnetic wave shielding layer, and is laminated in the order of the electromagnetic wave shielding layer and the insulating layer from the protective sheet side. The film for electromagnetic wave shielding as described in crab.

(11) An electronic component mounting substrate having a substrate, an electronic component mounted on the substrate, and an electromagnetic wave shielding layer that covers the substrate and the electronic component from the side of the substrate on which the electronic component is mounted. There,
The electromagnetic wave shielding layer has a first conductor layer containing a conductive material, and a laminate in which a second conductor layer containing the conductive material and a dielectric layer containing a dielectric material are laminated. And
The electronic component mounting board, wherein the laminate is laminated with the dielectric layer facing the first conductor layer.

  According to the present invention, the electromagnetic wave shielding film includes a first conductor layer containing a conductive material, a second conductor layer containing a conductive material, and a dielectric layer containing a dielectric material. A laminate, and the laminate includes an electromagnetic wave shielding layer laminated on the first conductor layer with the dielectric layer facing the first conductor layer. The weight and thickness can be reduced, and even electromagnetic waves in the high frequency band can be blocked by absorption.

It is a longitudinal cross-sectional view which shows 1st Embodiment of the film for electromagnetic wave shields of this invention. It is a longitudinal cross-sectional view which shows the electromagnetic wave shielding layer with which the film for electromagnetic wave shields shown in FIG. 1 is provided. It is a longitudinal cross-sectional view which shows the electromagnetic wave shielding layer with which 2nd Embodiment of the film for electromagnetic wave shields of this invention is provided. It is a longitudinal cross-sectional view for demonstrating the 1st coating method of the coating method of the electronic component using the film for electromagnetic wave shielding shown in FIG. It is a longitudinal cross-sectional view for demonstrating the 2nd coating method of the coating method of the electronic component using the electromagnetic wave shielding film shown in FIG. It is a longitudinal cross-sectional view for demonstrating the 3rd coating method of the coating method of the electronic component using the film for electromagnetic wave shielding shown in FIG.

  Hereinafter, an electromagnetic wave shielding film and an electronic component mounting substrate of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

  In the electromagnetic wave shielding film 10 of the present invention, a first conductor layer 31 containing a conductive material, a second conductor layer 36 containing a conductive material, and a dielectric layer 35 containing a dielectric material are laminated. The electromagnetic wave shielding layer 3 having the laminated body 32 is provided, and the laminated body 32 is laminated on the first conductor layer 31 with the dielectric layer 35 facing the first conductor layer 31. It is characterized by.

  According to the electromagnetic wave shielding film 10 as described above, the electromagnetic wave shielding layer 3 can be reduced in weight and thickness, and electromagnetic waves in a high frequency band can be blocked by absorption.

Hereinafter, the electromagnetic wave shielding film will be described.
<Electromagnetic wave shielding film>
<First Embodiment>
FIG. 1 is a longitudinal sectional view showing a first embodiment of an electromagnetic wave shielding film of the present invention, and FIG. 2 is a longitudinal sectional view showing an electromagnetic wave shielding layer provided in the electromagnetic shielding film shown in FIG. In the following description, for convenience of explanation, the upper side in FIGS. 1 and 2 is referred to as “upper” and the lower side is referred to as “lower”.

  The electromagnetic wave shielding film is an electromagnetic wave shielding film used for covering the unevenness 6 on the substrate 5.

  As shown in FIG. 1, in the present embodiment, the electromagnetic wave shielding film 10 includes a protective layer (protective sheet) 1, an electromagnetic wave blocking layer 3, and an insulating layer 2. The layer 2 is laminated in this order with the electromagnetic wave shielding layer 3 coming into contact with the protective layer 1 from the lower surface (one surface) side of the protective layer 1.

  In the following description, the electronic component 4 is mounted (placed) on the substrate 5, and the unevenness 6 including the convex portions 65 and the concave portions 66 is formed on the substrate 5 by mounting the electronic component 4. The case where 6 is covered with the electromagnetic wave shielding film 10 will be described. That is, the case where the electronic component 4 mounted on the substrate 5 is covered with the electromagnetic wave shielding film 10 will be described. Examples of the electronic component 4 mounted on the substrate 5 include an LCD driver IC mounted on a flexible circuit board (FPC), an IC + capacitor around the touch panel, or an electronic circuit board (motherboard).

Hereinafter, each layer 1, 2, and 3 with which the electromagnetic wave shielding film 10 is provided will be described.
<Protective layer 1>
First, the protective layer 1 will be described.

  The protective layer (protective sheet) 1 has a function of preventing deterioration of the electromagnetic wave shielding layer 3 due to oxidation. Further, the protective layer 1 has flexibility, and the insulating layer 2 and the electromagnetic wave shielding layer 3 are formed on the unevenness 6 on the substrate 5 by using the electromagnetic wave shielding film 10 in the attaching step of the electronic component coating method described later. By pressing, the insulating layer 2 and the electromagnetic wave shielding layer 3 that have been pressed function as a protective (buffer) material that prevents breakage when the unevenness 6 is covered.

  The constituent material of the protective layer 1 is not particularly limited. For example, syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polyethylene terephthalate, polypropylene such as non-axially oriented polypropylene and biaxially oriented polypropylene, cyclic olefin polymers, Examples thereof include resin materials such as silicone, styrene elastomer resin, and styrene butadiene rubber. Among these, it is preferable to use non-axially stretched polypropylene. Thereby, the protection with respect to the insulating layer 2 and the electromagnetic wave shielding layer 3 of the protective layer 1 and further the heat resistance can be improved.

  The storage elastic modulus of the protective layer 1 at normal temperature (25 ° C.) is preferably 2.0E + 02 to 5.0E + 10 Pa, more preferably 2.0E + 03 to 5.0E + 09 Pa, and 2.0E + 04 to 3. More preferably, it is 0E + 09 Pa. Thus, by setting the storage elastic modulus at normal temperature (25 ° C.) of the protective layer 1 within the above range, it can be said that the protective layer 1 has flexibility, and an electromagnetic shielding film. 10 is used to cover the irregularities 6 on the substrate 5 without causing the insulating layer 2 and the electromagnetic wave shielding layer 3 to break, so that the insulating layer 2 and the electromagnetic wave shielding layer 3 correspond to the shapes of the irregularities 6. Can be pushed in. As a result, the substrate 5 provided with the unevenness 6 is covered with the electromagnetic wave blocking layer 3 in which the occurrence of breakage is prevented, following the shape of the unevenness 6. The electromagnetic wave shielding (blocking) property to the substrate 5 provided with the unevenness 6 is improved.

  Although the thickness of the protective layer 1 is not specifically limited, It is preferable that they are 3 micrometers or more and 20 micrometers or less, It is more preferable that they are 5 micrometers or more and 15 micrometers or less, More preferably, they are 7 micrometers or more and 12 micrometers or less. When the thickness of the protective layer 1 is less than the lower limit, the protective layer 1 and thus the insulating layer 2 and the electromagnetic wave shielding layer 3 may be broken, and the electromagnetic shielding properties thereof may be reduced. Further, when the thickness of the protective layer 1 exceeds the upper limit, depending on the design of the substrate 5 covered with the electromagnetic wave shielding film 10, the weight and thickness of the laminate in which the substrate 5 is covered with the electromagnetic wave shielding film 10 can be reduced. May not be realized.

  Furthermore, the protective layer 1 may include a pressure-sensitive adhesive layer on the surface on the electromagnetic wave shielding layer 3 side. That is, the electromagnetic wave shielding layer 3 may be bonded to the protective layer 1 via the pressure-sensitive adhesive layer. Thereby, the adhesiveness (adhesiveness) of the protective layer 1 and the electromagnetic wave shielding layer 3 is improved.

  This pressure-sensitive adhesive layer is mainly composed of, for example, a pressure-sensitive adhesive made of at least one of an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, and a rubber-based pressure-sensitive adhesive.

  Examples of the acrylic pressure-sensitive adhesive include resins composed of (meth) acrylic acid and esters thereof, (meth) acrylic acid and esters thereof, and unsaturated monomers copolymerizable therewith (for example, vinyl acetate). , Styrene, acrylonitrile and the like) and the like. Moreover, what mixed 2 or more types of these resin is mentioned.

  Among these, one or more selected from the group consisting of methyl (meth) acrylate, ethylhexyl (meth) acrylate and butyl (meth) acrylate, and hydroxyethyl (meth) acrylate and vinyl acetate A copolymer with one or more selected is preferred. Thereby, control of adhesiveness and adhesiveness with the electromagnetic wave shielding layer 3 to which the adhesive layer adheres becomes easy.

  In this case, the pressure-sensitive adhesive layer has a urethane acrylate, an acrylate monomer, a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate), etc. in order to control adhesiveness (adhesiveness). Monomers and oligomers such as isocyanate compounds may be included.

  Examples of rubber-based adhesives include natural rubber-based, isoprene rubber-based, styrene-butadiene-based, recycled rubber-based, and polyisobutylene-based rubbers, and rubbers such as styrene-isoprene-styrene and styrene-butadiene-styrene. The thing etc. which mainly have the block copolymer containing are mentioned.

  Furthermore, examples of the silicone-based pressure-sensitive adhesive include dimethylsiloxane-based and diphenylsiloxane-based ones.

  The pressure-sensitive adhesive contained in the pressure-sensitive adhesive layer may be either a curable type or a non-curable type, but in the case of a curable type, a crosslinking agent may be added to the pressure-sensitive adhesive layer. Examples of the crosslinking agent include epoxy compounds, isocyanate compounds, metal chelate compounds, metal alkoxides, metal salts, amine compounds, hydrazine compounds, aldehyde compounds, and the like.

  In the case of the curable type, a photopolymerization initiator that cures the pressure-sensitive adhesive layer by irradiation with light such as ultraviolet rays may be added to the pressure-sensitive adhesive layer. Examples of the photopolymerization initiator include methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl]- Acetophenone compounds such as 2-morpholinopropane-1, benzophenone compounds, benzoin compounds, benzoin isobutyl ether compounds, benzoin methyl benzoate compounds, benzoin benzoic acid compounds, benzoin methyl ether compounds, benzyl phenyl sulfide compounds Benzyl compounds, dibenzyl compounds, diacetyl compounds and the like.

  Furthermore, the adhesive layer has a rosin resin, terpene resin, coumarone resin, phenol resin, styrene resin, aliphatic petroleum resin, aromatic petroleum resin, aliphatic aromatic for the purpose of increasing its adhesive strength and shear strength. A tackifier such as a petroleum petroleum resin may be added.

  In addition, various additives such as a plasticizer, a tackifier, a thickener, a filler, an anti-aging agent, an antiseptic, an antifungal agent, a dye, and a pigment are added to the adhesive layer as necessary. May be.

<Electromagnetic wave blocking layer 3>
Next, the electromagnetic wave blocking layer (blocking layer) 3 will be described.

  The electromagnetic wave shielding layer 3 includes an electronic component 4 provided on the substrate 5, and other electronic components located on the opposite side of the substrate 5 (electronic component 4) via the electromagnetic wave shielding layer 3. It has a function of shielding (shielding) electromagnetic waves generated from one side.

  Here, as described above, in order for the electromagnetic wave blocking layer (blocking layer) 3 to exhibit the function of blocking electromagnetic waves, the reflective layer that blocks (shields) the electromagnetic wave incident on the electromagnetic wave blocking layer by reflecting the electromagnetic wave, and the electromagnetic wave blocking An absorption layer that is shielded (shielded) by absorbing electromagnetic waves incident on the layer is known.

  In such a reflection layer and an absorption layer, assuming that they have almost the same electromagnetic shielding properties, the absorption layer absorbs electromagnetic waves incident on the absorption layer and converts them into thermal energy. The electromagnetic wave is extinguished by this absorption. Therefore, from the standpoint that it is possible to reliably prevent the reflected electromagnetic wave, such as the reflective layer, from adversely affecting the other members that are not covered with the electromagnetic wave blocking layer. The layer is preferably composed of an absorbent layer.

  Therefore, as a result of intensive studies on an electromagnetic wave blocking layer (absorbing layer) that can be blocked by absorption, the inventor has determined that the electromagnetic wave blocking layer 3 includes the first conductor layer 31 containing a conductive material and the conductive material. A second conductor layer 36 containing a dielectric layer 35 and a dielectric layer 35 containing a dielectric material are laminated, and the laminate 32 has the dielectric layer 35 on the first conductor layer 31 side. As a result of being laminated, the electromagnetic wave blocking layer 3 was found to be an absorption layer that effectively blocks electromagnetic waves by absorption up to the high frequency band, and the present invention has been completed.

  In the present embodiment, as shown in FIG. 2, the electromagnetic wave shielding layer 3 includes the first conductor layer 31, the dielectric layer 35, and the second conductor layer 36 in this order from the upper side (the protective layer 1 side). In this configuration, one dielectric layer 35 is sandwiched between two conductor layers 31 and 36. In other words, one stacked body 32 is stacked on the first conductive layer 31 with the dielectric layer 35 facing the first conductive layer 31. By adopting such a configuration, the electromagnetic wave shielding layer 3 has a structure similar to that of a capacitor, and the electromagnetic wave shielding layer 3 is effective even in a high frequency band due to the capacitor effect that the electromagnetic wave shielding layer 3 functions as a capacitor. It is assumed that it functions as an absorption layer that blocks electromagnetic waves by absorption.

Hereinafter, the layers 31, 35, and 36 constituting the electromagnetic wave shielding layer 3 will be described.
(First conductor layer and second conductor layer)
Both the first conductor layer 31 and the second conductor layer 36 contain a conductive material, and thereby a dielectric layer 35 containing a dielectric material (dielectric material) is interposed therebetween. In this way, the electromagnetic wave blocking layer 3 can function as a capacitor.

  Such conductor layers 31 and 36 may contain any conductive material. Examples of the conductive material include at least one of a conductive polymer, a metal, and a metal oxide. Among these, metal particles containing carbon and carbon-based materials can be used, and one or more of these can be used in combination. Among them, a conductive polymer is preferably included. Thereby, even if the film thickness (thickness) of the conductor layers 31 and 36 containing the conductive polymer is set to be relatively thin, the electromagnetic wave blocking layer 3 can exhibit particularly excellent absorbability. Accordingly, it is possible to reduce the thickness and weight of the electromagnetic wave shielding layer 3 while exhibiting the function as the absorbing layer.

  Examples of the conductive polymer include polyacetylene, polypyrrole, PEDOT (poly-ethylenedioxythiophene), PEDOT / PSS, polythiophene, polyaniline, poly (p-phenylene), polyfluorene, polycarbazole, polysilane, and derivatives thereof. These can be used alone or in combination of two or more. Among these, polyaniline, PEDOT / PSS, polypyrrole and polythiophene are preferable. According to these, the effect acquired by using the conductive polymer mentioned above can be exhibited more notably.

Examples of the metal-based particles include gold, silver, copper, iron, nickel and aluminum, or a metal such as an alloy containing these, and AFe ₂ O ₄ (where A is Mn, Co, Ni Or a metal oxide such as ITO, ATO, or FTO.

  The average particle diameter of the metal-based particles is preferably 1.0 μm or more and 10.0 μm or less, and more preferably 4.5 μm or more and 7.5 μm or less. As a result, the metal particles can be uniformly dispersed in the conductor layers 31 and 36. Therefore, the conductor layers 31 and 36 can exhibit the characteristic as this conductor layer uniformly over the whole.

  Examples of carbon-based materials include carbon nanotubes such as single-walled carbon nanotubes and multi-walled carbon nanotubes, carbon nanofibers, CN nanotubes, CN nanofibers, BCN nanotubes, BCN nanofibers, graphene, carbon microcoils, carbon Examples thereof include carbon such as nanocoil, carbon nanohorn, carbon nanowall, and carbon black.

  Furthermore, it is preferable that the conductor layers 31 and 36 contain a binder resin as a constituent material in addition to the conductive material. As a result, the conductive material can be more uniformly dispersed in the conductor layers 31 and 36, so that the conductor layers 31 and 36 can exhibit the above-described characteristics uniformly. In addition, each of the conductive materials can be easily set to a desired content, so that the electromagnetic wave shielding layer 3 can reliably function as a capacitor.

  Various resin materials can be used as the binder resin, and are not particularly limited. For example, thermosetting resins such as epoxy resins, phenol resins, amino resins, unsaturated polyester resins, thermosetting elastomers, acrylic resins, Examples include thermoplastic resins such as polyester resins, vinyl chloride resins, styrene resins, styrene thermoplastic elastomers, thermoplastic elastomers such as olefin thermoplastic elastomers, and one or more of these are used in combination. be able to.

  The average layer thickness T of the conductor layers 31 and 36 is not particularly limited, but is preferably 0.5 μm or more and 30 μm or less, and more preferably 1 μm or more and 20 μm or less. When the thickness of the conductor layers 31 and 36 is less than the lower limit, depending on the constituent material of the conductor layers 31 and 36, there is a possibility of breaking at the end of the board mounted component. Moreover, when the thickness of the conductor layers 31 and 36 exceeds the said upper limit, depending on the constituent material etc. of the conductor layers 31 and 36, there exists a possibility that shape followability may be insufficient. Moreover, since the excellent electromagnetic wave shielding property can be exhibited even with the thickness T within such a range, it is possible to reduce the thickness T of the conductor layers 31 and 36, and consequently, the insulating layer 2 on the substrate 5. And the weight reduction of the electronic component mounting board | substrate with which the electronic component 4 coat | covered with the electromagnetic wave shielding layer 3 was mounted is realizable.

  The conductive material contained in the first conductor layer 31 and the second conductor layer 36 may be the same (same type) in the first conductor layer 31 and the second conductor layer 36. May be different. Furthermore, the average layer thickness T of the first conductor layer 31 and the second conductor layer 36 may be the same or different.

(Dielectric layer)
The dielectric layer 35 contains a dielectric material, and by holding this with the conductor layers 31 and 36 containing a conductive material, the electromagnetic wave blocking layer 3 functions as a capacitor. Is for.

  Such a dielectric layer 35 may contain any dielectric material, and examples of the dielectric material include ceramic materials, glass materials, resin materials, and the like. Although it can be used in combination of seeds or two or more, it is preferable to include a ceramic material. Thereby, even if the film thickness (thickness) of the dielectric layer 35 containing the ceramic material is set to be relatively thin, the electromagnetic wave blocking layer 3 can exhibit particularly excellent absorbability. Accordingly, it is possible to reduce the thickness and weight of the electromagnetic wave shielding layer 3 while exhibiting the function as the absorbing layer.

Examples of the ceramic material include alumina, zirconia, magnesia, silica, titania, aluminum nitride, silicon nitride, silicon carbide, barium titanate, perovskite-type barium calcium zirconate titanate crystal particles (BCTZ-type crystal particles), and the like. These can be used alone or in combination of two or more. Among these, barium titanate (BaTiO ₃ ), perovskite-type barium calcium zirconate titanate crystal particles (BCTZ-type crystal particles), titania (TiO ₂ ), alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), carbonized Silicon (SiC) and aluminum nitride (AlN) are preferred. According to these, the effect acquired by using the conductive polymer mentioned above can be exhibited more notably.
Examples of the glass material include quartz glass and borosilicate glass.

  Examples of the resin material include polyethylene, polypropylene, polytetrafluoroethylene, polyethylene terephthalate, polyvinylidene fluoride, polyphenylene sulfide, phenol resin, melamine resin, unsaturated polyester resin, and epoxy resin.

  Furthermore, when the dielectric layer 35 includes a ceramic material and / or a glass material as a dielectric material, the dielectric layer 35 may be entirely composed of a dielectric material. In addition, it is preferable to contain a binder resin. As a result, the dielectric material can be more uniformly dispersed in the dielectric layer 35, so that the dielectric layer 35 can exhibit the above-described characteristics uniformly. In addition, each of the dielectric materials can be easily set to a target content, so that the electromagnetic wave shielding layer 3 can reliably function as a capacitor.

  In addition, as a binder resin, the thing similar to having demonstrated as binder resin contained in the conductor layers 31 and 36 can be used.

  The average layer thickness T of the dielectric layer 35 is not particularly limited, but is preferably 0.5 μm or more and 30 μm or less, and more preferably 1 μm or more and 20 μm or less. When the thickness of the dielectric layer 35 is less than the lower limit, depending on the constituent material of the dielectric layer 35, there is a risk of breakage at the end of the board-mounted component. Further, when the thickness of the dielectric layer 35 exceeds the upper limit value, the shape following property may be insufficient depending on the constituent material of the dielectric layer 35 and the like. Moreover, since the excellent electromagnetic wave shielding property can be exhibited even when the thickness T is within such a range, it is possible to reduce the thickness T of the dielectric layer 35, and consequently, the insulating layer 2 and the electromagnetic wave on the substrate 5. The weight reduction of the electronic component mounting board on which the electronic component 4 covered with the blocking layer 3 is mounted can be realized.

  In addition, as for the electromagnetic wave shielding layer 3, it is preferable that the storage elastic modulus in 150 degreeC is 1.0E + 05-1.0E + 09Pa, and it is more preferable that it is 5.0E + 05-5.0E + 08Pa. By setting the storage elastic modulus within such a range, in the pasting process, after heating the electromagnetic shielding film 10, the insulating layer 2 and the electromagnetic wave shielding are formed on the irregularities 6 on the substrate 5 by pressing force from the protective layer 1. By pressing the layer 3, the electromagnetic wave shielding layer 3 can be deformed corresponding to the shape of the unevenness 6 according to the pressing force from the protective layer 1 when the unevenness 6 is covered. That is, the shape followability of the electromagnetic wave shielding layer 3 with respect to the unevenness 6 can be improved.

<Insulating layer 2>
Next, the insulating layer 2 will be described.

  The insulating layer 2 is provided in contact with the electromagnetic wave shielding layer 3, and the electromagnetic wave shielding layer 3 and the insulating layer 2 are laminated in this order from the protective layer 1 side. The insulating layer 2 is in contact with the substrate 5 and the electronic component 4 by covering the unevenness 6 on the substrate 5 using the electromagnetic wave shielding film 10 including the insulating layer 2 and the electromagnetic wave shielding layer 3 laminated in this manner, The insulating layer 2 and the electromagnetic wave shielding layer 3 are coated in this order from the substrate 5 side.

  Thus, in the present embodiment, the insulating layer 2 covers the substrate 5 and the electronic component 4, thereby insulating the adjacent electronic components 4 on the substrate 5, and the substrate 5 and the electronic component 4. It insulates from the electromagnetic wave shielding layer 3 and other members (electronic parts etc.) located on the opposite side to the substrate 5 through the insulating layer 2.

  Examples of the insulating layer 2 include a thermosetting insulating resin or a thermoplastic insulating resin (insulating film). Among these, it is preferable to use an insulating resin having thermoplasticity. Since the insulating resin having thermoplasticity is a film having excellent flexibility, when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the unevenness 6 on the substrate 5 in the pasting step described later, the insulating layer 2 Can be easily followed in accordance with the shape of the irregularities 6. In addition, an insulating resin having thermoplasticity is particularly useful when repairing a substrate because it can be re-peeled from the substrate to be bonded when heated to its softening point temperature.

  Examples of the insulating resin having thermoplasticity include thermoplastic polyesters such as polyethylene terephthalate, α-olefin, vinyl acetate, polyvinyl acetal, ethylene vinyl acetate, vinyl chloride, acrylic, polyamide, and cellulose. Among these, it is preferable to use thermoplastic polyesters and α-olefins because they are excellent in adhesion to the substrate, flexibility and chemical resistance.

  Furthermore, the insulating resin having thermoplasticity is a phenolic resin, a silicone resin, a urea resin, an acrylic resin, a polyester resin, a polyamide resin, as long as the performance such as heat resistance and flex resistance is not impaired. A polyimide resin or the like can be contained. In addition, in the insulating resin having thermoplasticity, as in the case of the conductive adhesive layer described later, a silane coupling agent, an antioxidant, a pigment, a dye, as long as the adhesiveness and solder reflow resistance are not deteriorated. You may add tackifying resin, a plasticizer, a ultraviolet absorber, an antifoamer, a leveling regulator, a filler, a flame retardant, etc.

  The thickness T (D) of the insulating layer 2 is not particularly limited, but is preferably 3 μm or more and 50 μm or less, more preferably 4 μm or more and 30 μm or less, and further preferably 5 μm or more and 20 μm or less. When the thickness of the insulating layer 2 is less than the lower limit value, the resistance to goby folds is insufficient, cracks occur at the bent portion after thermocompression bonding to the irregularities 6, the film strength decreases, and the electromagnetic wave shielding layer 3 It is difficult to play a role as an insulating support. If the upper limit is exceeded, shape followability may be insufficient. That is, by setting the thickness T (D) of the insulating layer 2 within the above range, the insulating layer 2 can be reliably provided with flexibility, and in the pasting process, the insulating layer 2 is insulated against the unevenness 6 on the substrate 5. When the layer 2 and the electromagnetic wave shielding layer 3 are pushed in, the insulating layer 2 can easily follow the shape of the irregularities 6. In addition, the thickness T (D) of the insulating layer 2 can be reduced, and the substrate 5 on which the electronic component 4 covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 is mounted can be reduced in weight and thickness. can do.

  Moreover, it is preferable that the average linear expansion coefficient in 25-150 degreeC of the insulating layer 2 is 50-1000 [ppm / degrees C], and it is more preferable that it is 100-700 [ppm / degrees C]. By setting the average linear expansion coefficient of the insulating layer 2 within such a range, the insulating layer 2 has excellent stretchability when the electromagnetic wave shielding film 10 is heated. The shape followability with respect to the unevenness 6 of the electromagnetic wave shielding layer 3 is improved.

  In addition, as shown in FIG. 1, this insulating layer 2 may be a laminated body of two or more layers in which different ones of the above-described insulating films are laminated, in addition to those constituted by one layer.

  Furthermore, the insulating layer 2 may be provided with a pressure-sensitive adhesive layer on both or any one of the surface on the electromagnetic wave shielding layer 3 side and the surface opposite to the electromagnetic wave shielding layer 3. Thereby, the adhesiveness (adhesiveness) between the electromagnetic wave shielding layer 3 and the insulating layer 2 and / or the adhesiveness (adhesiveness) between the substrate 5 covered with the electromagnetic wave shielding film 10 and the insulating layer 2 is improved.

  As this adhesive layer, the thing similar to the adhesive layer described by description of the protective layer 1 mentioned above is mentioned.

  In the present embodiment, the electromagnetic wave shielding film 10 includes the insulating layer 2 to cover the substrate 5 and the electronic component 4, thereby insulating the adjacent electronic components 4 on the substrate 5. However, when it is not necessary to insulate the electronic components 4 by the insulating layer 2, the insulating layer 2 can be omitted.

  By providing the electromagnetic wave shielding film 10 with the protective layer 1, the electromagnetic wave shielding layer 3, and the insulating layer 2 having the above-described configuration, the electromagnetic wave shielding film 10 can be reduced in weight and thickness.

The electromagnetic wave shielding film 10 preferably has a light transmittance of 0.01% or more and 30% or less at a wavelength of 300 nm or more and 800 nm or less, more preferably 0.01% or more and 10% or less. . As a result, it is possible to absorb and block light and to hide the inside covered with the electromagnetic wave shielding layer 3, that is, the electronic component 4, so that, for example, at the time of distribution of the electronic component mounting substrate coated with the electromagnetic wave shielding layer 3 The advantage that the secrecy of the electronic component 4 can be secured is obtained.
In addition, the said light transmittance can be calculated | required with an ultraviolet visible spectrophotometer, for example.

Second Embodiment
Next, a second embodiment of the electromagnetic wave shielding film will be described.

  FIG. 3 is a longitudinal sectional view showing an electromagnetic wave shielding layer provided in the second embodiment of the electromagnetic wave shielding film of the present invention.

  Hereinafter, the electromagnetic wave shielding film 10 of the second embodiment will be described with a focus on differences from the electromagnetic wave shielding film 10 of the first embodiment, and the description of the same matters will be omitted.

  The electromagnetic wave shielding film 10 of the present embodiment is the same as the electromagnetic wave shielding film 10 of the first embodiment except that the electromagnetic wave shielding layer 3 having a different configuration is provided.

  That is, in the electromagnetic wave shielding film 10 of the second embodiment, the electromagnetic wave shielding layer 3 includes the first conductor layer 31, the dielectric layer 35, and the second layer from the upper side (the protective layer 1 side) as shown in FIG. The conductor layer 36, the dielectric layer 35, and the second conductor layer 36 are laminated in this order. The upper dielectric layer 35 is held between the two conductor layers 31, 36, and the lower dielectric layer is formed. 35 is held by two conductor layers 36. That is, two laminated bodies 32 are laminated on the first conductor layer 31 side as a repetitive body with the dielectric layer 35 on the first conductor layer 31 side. Thus, by providing a plurality (two in the present embodiment) of the laminates 32 as repeating bodies, the electromagnetic wave shielding layer 3 includes a plurality of (two in the present embodiment) capacitors in parallel along the thickness direction. It can be said that the configuration is provided, and the function as a capacitor can be more reliably imparted to the electromagnetic wave shielding layer 3. Therefore, the electromagnetic wave shielding layer 3 can more effectively absorb electromagnetic waves due to the capacitor effect.

  Note that the number of the stacked bodies 32 included in the electromagnetic wave shielding layer 3 is not limited to two as in the present embodiment, but may be three or more, but is preferably set to 5 or more and 25 or less. .

  The effect similar to the said 1st Embodiment is acquired also by the electromagnetic wave shielding film 10 of such 2nd Embodiment.

<Method of coating electronic parts>
Using the electromagnetic wave shielding film 10 having the above configuration, for example, the electronic component 4 mounted on the substrate 5 is covered as follows.

  FIG. 4 is a longitudinal sectional view for explaining a first coating method of the electronic component coating method using the electromagnetic wave shielding film shown in FIG.

  The following first coating method for electronic components has a pasting step of pasting the electromagnetic shielding film 10 on the substrate 5 so that the insulating layer 2 and the electronic component 4 are adhered.

(Attaching process)
As shown in FIG. 4 (a), the pasting step is such that, in this embodiment, the electromagnetic wave shielding film 10 follows the unevenness 6 provided by mounting the electronic component 4 on the substrate 5. It is a process of sticking.

  Although it does not specifically limit as a method of sticking following the unevenness | corrugation 6, For example, the following methods are mentioned.

  That is, first, the substrate 5 and the electromagnetic wave shielding film 10 are overlapped so that the surface of the substrate 5 where the irregularities 6 are formed faces the surface of the electromagnetic wave shielding film 10 on the insulating layer 2 side. Then, these are carried out by applying pressure so that the electromagnetic wave shielding film 10 and the substrate 5 approach each other uniformly from the electromagnetic wave shielding film 10 side at room temperature.

  Thus, by uniformly pressing from the electromagnetic shielding film 10 side, the protective layer 1 follows the shape of the projections and depressions 6, and in addition to this, the insulating layer is located closer to the substrate 5 than the protective layer 1. 2 and the electromagnetic wave shielding layer 3 also follow the shape of the irregularities 6. Accordingly, the unevenness 6 is covered with the protective layer 1, the insulating layer 2, and the electromagnetic wave blocking layer 3 in a state where the protective layer 1, the insulating layer 2, and the electromagnetic wave blocking layer 3 follow the shape of the unevenness 6.

  In such a pasting step, the temperature to be pasted is normal temperature, specifically, preferably 5 ° C. or higher and 35 ° C. or lower, more preferably 20 ° C. or higher and 30 ° C. or lower, more preferably 25 ° C. More preferably.

  The pressure to be applied is not particularly limited, but is preferably 0.05 MPa or more and 0.5 MPa or less, more preferably 0.1 MPa or more and 0.3 MPa or less.

  Furthermore, the sticking time is not particularly limited, but is preferably 1 second or longer and 60 seconds or shorter, more preferably 5 seconds or longer and 30 seconds or shorter.

  By setting the conditions in the affixing step within the above range, the insulating layer 2 and the electromagnetic wave shielding against the unevenness 6 on the substrate 5 without causing damage to the electronic component 4 due to pressurization from the electromagnetic wave shielding film 10 side. The unevenness 6 can be reliably covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in a state in which the layer 3 follows.

  By passing through the above processes, it can coat | cover so that the unevenness | corrugation 6 may follow by the protective layer 1, the insulating layer 2, and the electromagnetic wave shielding layer 3. FIG. In the covering method in which the protective layer 1 remains on the coated unevenness 6 as in the present embodiment, insulation that insulates the electromagnetic wave blocking layer 3 from other members (such as electronic components) located on the opposite side of the substrate 5. The protective layer 1 exhibits the function as a layer.

  Further, the electronic component 4 may be coated so as to cover the electronic component 4 without following the unevenness 6 in addition to the above-described method of covering the unevenness 6 with the electromagnetic wave shielding film 10.

  FIG. 5 is a longitudinal sectional view for explaining a second coating method of the electronic component coating method using the electromagnetic wave shielding film shown in FIG.

  The second electronic component covering method described below includes an attaching step of attaching the electromagnetic wave shielding film 10 on the substrate 5 so that the insulating layer 2 and the electronic component 4 are adhered, as in the first covering method. .

(Attaching process)
In this pasting step, as shown in FIG. 5A, in this embodiment, the electromagnetic wave shielding film 10 is pasted on the unevenness 6 provided by mounting the electronic component 4 on the substrate 5. To do.

  In order to attach without following the irregularities 6, for example, from the electromagnetic wave shielding film 10 side so that the electromagnetic wave shielding film 10 and the substrate 5 come close to each other in the attaching step described in the first covering method. This can be realized by setting the pressurizing condition when pressurizing uniformly. That is, by setting the pressurizing condition lower than the pressure when following the unevenness 6 and setting the pressure condition shorter than the time when following the unevenness 6, the electromagnetic wave shield without following the unevenness 6. The film 10 for use can be affixed.

  By such a coating method, the unevenness 6 is covered by the protective layer 1, the insulating layer 2 and the electromagnetic wave shielding layer 3 in a state where the protective layer 1, the insulating layer 2 and the electromagnetic wave shielding layer 3 do not follow the shape of the unevenness 6. The

  In addition, when the electromagnetic wave shielding film 10 does not follow the shape of the unevenness 6 as described above, the formation of the protective layer 1 that functions as a protective (buffer) material that prevents the insulating layer 2 and the electromagnetic wave shielding layer 3 from breaking. It can be omitted.

  Further, the electronic component 4 is coated with the electromagnetic shielding film 10, that is, the above-described method of coating with the protective layer 1, the insulating layer 2 and the electromagnetic wave shielding layer 3 (the first coating method and the second coating). In addition to the method, the protective layer 1 may be peeled from the electromagnetic wave shielding film 10 and the electronic component 4 may be covered with the insulating layer 2 and the electromagnetic wave shielding layer 3.

  FIG. 6 is a longitudinal sectional view for explaining a third coating method of the electronic component coating method using the electromagnetic wave shielding film shown in FIG.

  The following third method for coating an electronic component includes a step of applying an electromagnetic shielding film 10 on a substrate 5 so that the insulating layer 2 and the electronic component 4 are adhered, and a protective layer 1 after the application step. And a peeling step for peeling off.

(Attaching process)
In the pasting step, as in the electronic component covering method described with reference to FIG. 4, as shown in FIG. 6A, the unevenness 6 provided by mounting the electronic component 4 on the substrate 5 is used for electromagnetic wave shielding. It sticks so that the film 10 may follow.

(Peeling process)
In the peeling step, for example, as shown in FIG. 6B, the protective layer 1 is peeled from the electromagnetic shielding film 10 after the pasting step.

  By this peeling process, in this embodiment, peeling arises in the interface of the protective layer 1 and the electromagnetic wave shielding layer 3 in the electromagnetic wave shielding film 10, and as a result, the protective layer 1 is peeled from the electromagnetic wave shielding layer 3. Thus, the unevenness 6 is covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in a state where the protective layer 1 is peeled from the electromagnetic wave shielding layer 3.

  In addition, although it does not specifically limit as a method of peeling the protective layer 1, For example, peeling by manual work is mentioned.

  In this manual peeling, first, one end portion of the protective layer 1 is gripped, the protective layer 1 is peeled off from the electromagnetic wave shielding layer 3 from the gripped end portion, and then further from the end portion to the central portion. The protective layer 1 is peeled from the electromagnetic wave shielding layer 3 by sequentially peeling the protective layer 1 to the other end.

  By passing through the above processes, the unevenness | corrugation 6 can be coat | covered with the insulating layer 2 and the electromagnetic wave shielding layer 3 in the state which peeled the protective layer 1 from the electromagnetic wave shielding layer 3. FIG. According to such a coating method, it is possible to further reduce the weight and thickness when the electromagnetic wave blocking layer 3 blocks the electromagnetic wave.

  Further, the second coating method and the third coating method may be combined. That is, after affixing the electromagnetic wave shielding film 10 to the irregularities 6 without following, the protective layer 1 is peeled off from the electromagnetic wave shielding film 10, and the insulating layer 2 and the electromagnetic wave blocking layer 3 not following the irregularities 6. The electronic component 4 may be covered.

  In addition, in the said embodiment, as shown in FIG. 1, although the case where the protective layer 1 with which the film 10 for electromagnetic wave shielding was comprised was comprised by 1 layer, it is not limited to the thing of this structure, For example, protection The layer 1 may be a two-layer stack in which the first layer and the second layer are stacked in this order, or the first layer, the second layer, and the third layer in this order. It may be a laminated body of three layers.

  When it is set as the structure of a 2 layer laminated body, the thing of the structure similar to the protective layer 1 demonstrated in the said embodiment can be used as a 1st layer.

  The second layer is located between the first layer and the electromagnetic wave shielding layer 3, and in the first step of the method for producing the electromagnetic wave shielding film, the protective layer (protective sheet) 1 is applied to the electromagnetic wave shielding layer 3. When pasting, the first layer functions as an adhesive layer that adheres (sticks) to the electromagnetic wave shielding layer 3.

  Although this 2nd layer is not specifically limited, For example, it forms using various adhesive agents, such as an epoxy adhesive, an acrylic adhesive, a polyimide adhesive, and a cyanate adhesive.

  The thickness T (C) of the second layer is not particularly limited, but is preferably 1 μm or more and 10 μm or less, and more preferably 3 μm or more and 8 μm or less. When the thickness of the second layer is less than the lower limit, depending on the type of the constituent material of the second layer, there is a possibility that the adhesiveness due to the second layer is not sufficiently exhibited. When the thickness of the second layer exceeds the upper limit, depending on the design of the substrate 5 covered with the electromagnetic wave shielding film 10, the weight of the laminate in which the substrate 5 is covered with the electromagnetic wave shielding film 10 can be reduced. Thinning may not be realized.

  Furthermore, when it is set as the structure of a 3 layer laminated body, the thing of the structure similar to the protective layer 1 demonstrated in the said embodiment can be used as a 1st layer and a 3rd layer.

  The second layer is formed when the insulating layer 2 and the electromagnetic wave shielding layer 3 are pushed into the unevenness 6 on the substrate 5 using the protective layer 1 as a push protection in the attaching step of the electronic component covering method. 3 has a cushion function for pushing (embedding) the layer 3 into the irregularities 6. Further, the second layer has a function of causing the pushing force to uniformly act on the third layer, and further on the insulating layer 2 and the electromagnetic wave shielding layer 3 via the third layer. Thereby, the insulating layer 2 and the electromagnetic wave blocking layer 3 can be pushed into the unevenness 6 with excellent sealing properties without generating a void between the electromagnetic wave blocking layer 3 and the unevenness 6.

  As a constituent material of this second layer (cushion layer), for example, an α-olefin polymer such as polyethylene or polypropylene, an α having an ethylene, propylene, butene, pentene, hexene, methylpentene or the like as a copolymer component. Engineering plastics resins such as olefin copolymers, polyethersulfone, polyphenylene sulfide and the like may be used, and these may be used alone or in combination. Among these, it is preferable to use an α-olefin copolymer. Specifically, a copolymer of α-olefin such as ethylene and (meth) acrylic acid ester, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and (meth) acrylic acid (EMMA), And a partial ion cross-linked product thereof. Since the α-olefin copolymer is excellent in shape followability and further excellent in flexibility as compared with the constituent material of the third layer, the third layer is formed in the second layer composed of the constituent material. A cushion function for pushing (embedding) the layer into the unevenness 6 can be surely imparted.

  The thickness T (C) of the second layer is not particularly limited, but is preferably 10 μm or more and 100 μm or less, more preferably 20 μm or more and 80 μm or less, and further preferably 30 μm or more and 60 μm or less. . When the thickness of the second layer is less than the lower limit value, the shape followability of the second layer is insufficient, and the followability to the unevenness 6 may be insufficient in the thermocompression bonding step. In addition, when the thickness of the second layer exceeds the upper limit, in the thermocompression bonding process, the resin is more likely to be smeared out from the second layer, and adheres to the hot platen of the crimping apparatus, thereby reducing workability. There is a fear.

  The average linear expansion coefficient of the second layer at 25 to 150 ° C. is preferably 500 or more [ppm / ° C.], more preferably 1000 or more [ppm / ° C.]. By setting the average linear expansion coefficient of the second layer within such a range, the second layer has more excellent stretchability than the third layer when the electromagnetic wave shielding film 10 is heated. Can be made easy with stuff. Therefore, the shape followability of the second layer, and further the electromagnetic wave shielding layer 3 and the insulating layer 2 with respect to the irregularities 6 can be improved more reliably.

  Further, in the above-described embodiment, the unevenness is formed on the substrate by mounting the electronic component on the substrate, and the case where the unevenness is covered with the electromagnetic wave shielding film has been described. The coating is not limited to such unevenness, and for example, it may be applied to a flat region provided in a housing or the like.

  The electromagnetic shielding film and the electronic component mounting substrate of the present invention have been described above, but the present invention is not limited to these.

  For example, an arbitrary layer capable of exhibiting the same function may be added to the electromagnetic wave shielding film of the present invention and the electronic component mounting substrate of the present invention.

DESCRIPTION OF SYMBOLS 10 Electromagnetic wave shielding film 1 Protective layer 2 Insulating layer 3 Electromagnetic wave shielding layer 31 1st conductor layer 32 Laminate 35 Dielectric layer 36 2nd conductor layer 4 Electronic component 5 Substrate 6 Concavity and convexity 65 Convex part 66 Concave part

Claims (11)

A first conductor layer containing a conductive material;
An electromagnetic wave shielding layer having a second conductor layer containing the conductive material and a laminate in which a dielectric layer containing a dielectric material is laminated;
The electromagnetic wave shielding film, wherein the laminate is laminated with the dielectric layer facing the first conductor layer.   The electromagnetic wave shielding film according to claim 1, wherein the electromagnetic wave shielding layer includes a plurality of the laminated bodies.   The electromagnetic wave shielding film according to claim 1, wherein the conductive material contains a conductive polymer.   The electromagnetic conductive film according to claim 3, wherein the conductive polymer is at least one of polyaniline, PEDOT / PSS, polypyrrole, and polythiophene.   The electromagnetic dielectric shielding film according to claim 1, wherein the dielectric material contains a ceramic material.   The electromagnetic shielding film according to claim 5, wherein the ceramic material is at least one of barium titanate, perovskite-type barium calcium zirconate titanate crystal particles, titania, alumina, zirconia, silicon carbide, and aluminum nitride.   7. The electromagnetic wave shielding film according to claim 1, wherein each of the first conductor layer and the second conductor layer has an average layer thickness of 0.5 μm or more and 30 μm or less.   8. The electromagnetic wave shielding film according to claim 1, wherein the dielectric layer has an average layer thickness of 0.5 μm or more and 30 μm or less.   The electromagnetic wave shielding film according to any one of claims 1 to 8, wherein the electromagnetic wave shielding film further includes a protective sheet laminated on one surface side of the electromagnetic wave shielding layer.   10. The insulating layer according to claim 1, wherein the insulating layer is provided in contact with the other surface side of the electromagnetic wave shielding layer, and is laminated in order of the electromagnetic wave shielding layer and the insulating layer from the protective sheet side. Film for electromagnetic wave shielding. An electronic component mounting substrate having a substrate, an electronic component mounted on the substrate, and an electromagnetic wave shielding layer that covers the substrate and the electronic component from a surface side of the substrate on which the electronic component is mounted,
The electromagnetic wave shielding layer has a first conductor layer containing a conductive material, and a laminate in which a second conductor layer containing the conductive material and a dielectric layer containing a dielectric material are laminated. And
The electronic component mounting board, wherein the laminate is laminated with the dielectric layer facing the first conductor layer.

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