CN113228270A - 安全芯片、安全芯片的制备方法和电子设备 - Google Patents

安全芯片、安全芯片的制备方法和电子设备 Download PDF

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Publication number
CN113228270A
CN113228270A CN201980001602.XA CN201980001602A CN113228270A CN 113228270 A CN113228270 A CN 113228270A CN 201980001602 A CN201980001602 A CN 201980001602A CN 113228270 A CN113228270 A CN 113228270A
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dielectric layer
layer
security chip
medium
spike
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Pending
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CN201980001602.XA
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English (en)
Inventor
陆斌
沈健
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Goodix Technology Co Ltd
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Publication of CN113228270A publication Critical patent/CN113228270A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/002—Countermeasures against attacks on cryptographic mechanisms
    • H04L9/004—Countermeasures against attacks on cryptographic mechanisms for fault attacks
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/0806—Details of the card
    • G07F7/0813—Specific details related to card security
    • G07F7/082—Features insuring the integrity of the data on or in the card
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/0806—Details of the card
    • G07F7/0833—Card having specific functional components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09C—CIPHERING OR DECIPHERING APPARATUS FOR CRYPTOGRAPHIC OR OTHER PURPOSES INVOLVING THE NEED FOR SECRECY
    • G09C1/00—Apparatus or methods whereby a given sequence of signs, e.g. an intelligible text, is transformed into an unintelligible sequence of signs by transposing the signs or groups of signs or by replacing them by others according to a predetermined system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves

Abstract

提供了一种安全芯片、安全芯片的制备方法和电子设备，所述安全芯片包括第一介质层；第二介质层，所述第二介质层设置在所述第一介质层的上方，其中所述第一介质层相对所述第二介质层为光密介质，且所述第一介质层的上表面的粗糙度大于或等于预设阈值，使得从所述第一介质层进入所述第二介质层的光线能够发生全反射和/或散射；半导体芯片，所述半导体芯片设置在所述第二介质层的上方。基于以上技术方案，通过所述第一介质层的上表面能够对从所述第一介质层的下表面入射的光线进行全反射和/或散射，进而使得绝大部分光线无法到达安全芯片正面的逻辑或存储区域，从而达到抗激光攻击的目的。

Description

PCT国内申请，说明书已公开。

Claims (23)

  1. PCT国内申请，权利要求书已公开。
CN201980001602.XA 2019-08-08 2019-08-08 安全芯片、安全芯片的制备方法和电子设备 Pending CN113228270A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/099855 WO2021022566A1 (zh) 2019-08-08 2019-08-08 安全芯片、安全芯片的制备方法和电子设备

Publications (1)

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CN113228270A true CN113228270A (zh) 2021-08-06

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Country Link
US (1) US11462490B2 (zh)
EP (1) EP3800662B1 (zh)
CN (1) CN113228270A (zh)
WO (1) WO2021022566A1 (zh)

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US20220320015A1 (en) * 2021-04-06 2022-10-06 Globalfoundries U.S. Inc. Backside structure for optical attack mitigation
US20220399394A1 (en) * 2021-06-11 2022-12-15 Raytheon Company Thin film obscurant for microelectronics

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US6060773A (en) * 1997-05-15 2000-05-09 Nippon Telegraph And Telephone Corporation Semiconductor chip and method of manufacturing the same
CN1323448A (zh) * 1998-10-16 2001-11-21 施蓝姆伯格系统公司 具有防止电磁辐射作用的集成电路芯片
US20010053573A1 (en) * 1999-12-29 2001-12-20 Lee Sung Kwon Semiconductor device manufacturing method for preventing electrical shorts between lower and upper interconnection layers
JP2007194566A (ja) * 2006-01-23 2007-08-02 Renesas Technology Corp 半導体装置およびその製造方法
US20100129746A1 (en) * 2008-11-25 2010-05-27 Samsung Electronics Co., Ltd. Electrophotographic recording medium
US20110254124A1 (en) * 2010-04-16 2011-10-20 Nalla Ravi K Forming functionalized carrier structures with coreless packages
CN102458819A (zh) * 2009-04-15 2012-05-16 3M创新有限公司 回射光学构造
JP2017062299A (ja) * 2015-09-24 2017-03-30 セイコーエプソン株式会社 電気光学装置および電子機器
CN109863509A (zh) * 2019-01-23 2019-06-07 深圳市汇顶科技股份有限公司 光电传感器及其制备方法

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US20100195201A1 (en) 2007-09-25 2010-08-05 Kiyoshi Minoura Screen
US9291752B2 (en) 2013-08-19 2016-03-22 3M Innovative Properties Company Retroreflecting optical construction
CN103837915A (zh) * 2014-03-19 2014-06-04 张家港康得新光电材料有限公司 一种逆反射膜
CN104376357A (zh) * 2014-08-27 2015-02-25 北京中电华大电子设计有限责任公司 一种智能卡抗光攻击方法
JP2016062031A (ja) * 2014-09-19 2016-04-25 大日本印刷株式会社 反射型スクリーン、映像表示システム
CN106326053B (zh) 2016-08-25 2022-02-01 深圳先进技术研究院 基于故障注入的芯片安全测试方法及系统

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US6060773A (en) * 1997-05-15 2000-05-09 Nippon Telegraph And Telephone Corporation Semiconductor chip and method of manufacturing the same
CN1323448A (zh) * 1998-10-16 2001-11-21 施蓝姆伯格系统公司 具有防止电磁辐射作用的集成电路芯片
US20010053573A1 (en) * 1999-12-29 2001-12-20 Lee Sung Kwon Semiconductor device manufacturing method for preventing electrical shorts between lower and upper interconnection layers
JP2007194566A (ja) * 2006-01-23 2007-08-02 Renesas Technology Corp 半導体装置およびその製造方法
US20100129746A1 (en) * 2008-11-25 2010-05-27 Samsung Electronics Co., Ltd. Electrophotographic recording medium
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JP2017062299A (ja) * 2015-09-24 2017-03-30 セイコーエプソン株式会社 電気光学装置および電子機器
CN109863509A (zh) * 2019-01-23 2019-06-07 深圳市汇顶科技股份有限公司 光电传感器及其制备方法

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WO2021022566A1 (zh) 2021-02-11
EP3800662A4 (en) 2021-05-19
US20210043587A1 (en) 2021-02-11
EP3800662A1 (en) 2021-04-07
EP3800662B1 (en) 2022-03-02
US11462490B2 (en) 2022-10-04

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