CN113225855A - 一种高温复合材料铝基加热器及其制作工艺 - Google Patents
一种高温复合材料铝基加热器及其制作工艺 Download PDFInfo
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Abstract
本发明公开了一种高温复合材料铝基加热器,属于电加热器件技术领域,包括高温复合材料铝基加热器,所述高温复合材料铝基加热器包括铝合金基板,所述铝合金基板上印刷有内绝缘涂层,所述内绝缘涂层远离铝合金基板的壁面印刷有电阻涂层;本发明还公开了一种高温复合材料铝基加热器的制作工艺;本发明由内绝缘涂层、电阻涂层、导体涂层和外绝缘涂层制成的复合材料加热器具有可长期工作温度大于200度,绝缘涂层的击穿电压大于1500VAC,电阻涂层的发热功率大于20W/cm2的功能,同时由于是铝基加热器,因此基体具有热容低、导热优良、热转化效率优于钢板加热器、更优于传统的电阻丝加热器和陶瓷加热器的功能。
Description
技术领域
本发明属于电加热器件技术领域,具体涉及一种高温复合材料铝基加热器及其制作工艺。
背景技术
加热器在给水加热时,需要加热部件长期工作温度大于200度,用于这个领域的主流加热器分别为电阻丝加热器,陶瓷加热器和厚膜钢板加热器。电阻丝加热是最传统的加热方式,但加热缓慢,能效低;陶瓷加热器由于陶瓷耐热冲击弱,强度低,有水渗透的缺陷,且封装困难,成本高;钢板加热器是新一代加热器,它的加热速度快,热转化效率高,基体抗热冲击强度大,被越来越多的采用。
然而,钢板加热器由于钢基体热容高,导热慢,在一些对加热速度以及轻量化要求极为苛刻的应用中,例如HNB电子烟的加热体和新能源电池包的加热体,钢板加热器也不能完全胜任。
发明内容
为解决上述背景技术中提出的问题。本发明提供了一种高温复合材料铝基加热器及其制作工艺,具有耐高温、高导热、低热容、重量轻、加热速度快以及热转化效率高的特点。
本发明的另一目的是提供一种高温复合材料铝基加热器的制作工艺。
为实现上述目的,本发明提供如下技术方案:一种高温复合材料铝基加热器,包括高温复合材料铝基加热器,所述高温复合材料铝基加热器包括铝合金基板,所述铝合金基板上印刷有内绝缘涂层,所述内绝缘涂层远离铝合金基板的壁面印刷有电阻涂层,所述电阻涂层远离内绝缘涂层的壁面印刷有导体涂层,所述电阻涂层远离内绝缘涂层的壁面以及导体涂层远离电阻涂层的壁面均印刷有外绝缘涂层。
一种高温复合材料铝基加热器的制作工艺,其特征在于,包括以下步骤:
S1:在高分子树脂体系溶液内分别加入1%-90%的高分子材料或者无机材料以及1%-10%的无机类和有机类添加剂,制得内绝缘涂层以及外绝缘涂层的浆料;
S2:在高分子树脂体系溶液内分别加入1-90%的导电材料以及1-10%的无机类和有机类的添加剂,制得电阻涂层的浆料;
S3:在高分子树脂体系溶液内分别加入1-90%的导电材料以及1-10%的无机类和有机类的添加剂,制得导体涂层的浆料;
S4:分别将内绝缘涂层的浆料、电阻涂层的浆料、导体涂层的浆料以及外绝缘涂层的浆料按照顺序丝网印刷在铝合金基板上;
S5:铝合金基板经过高温烘烤,最终制得高温复合材料铝基加热器。
本发明中进一步的,所述步骤S1、S2和S3内,高分子树脂体系可以是环氧树脂、酚醛树脂、有机硅树脂、聚酰胺酸树脂或丙烯酸树脂任一种体系。
本发明中进一步的,所述步骤S1内,高分子材料可以是聚酰亚胺粉末或聚四氟乙烯粉末任一种材料。
本发明中进一步的,所述步骤S1内,无机材料可以是玻璃粉体、氧化锆粉末、氮化铝粉末或氧化铝粉末任一种材料。
本发明中进一步的,所述步骤S2内,导电材料可以是石墨粉、碳粉、碳纳米管、石墨烯、银粉、铜粉、金粉、钯粉、银钯合金粉、银镍合金粉、镍铬合金粉或镍铜合金粉任一种材料。
本发明中进一步的,所述步骤S3内,导电材料可以是银粉、铜粉、金粉或钯粉任一种材料。
本发明中进一步的,所述步骤S4内,浆料还可以通过喷涂工艺或点胶工艺进行涂覆。
与现有技术相比,本发明的有益效果是:
本发明内绝缘涂层以及外绝缘涂层通过高分子树脂体系溶液内分别加入高分子材料或者无机材料以及无机类和有机类添加剂的浆料制成,电阻涂层通过高分子树脂体系溶液内分别加入导电材料以及无机类和有机类的添加剂的浆料制成,导体涂层通过高分子树脂体系溶液内分别加入导电材料以及无机类和有机类的添加剂的浆料制成,由内绝缘涂层、电阻涂层、导体涂层和外绝缘涂层制成的复合材料加热器具有可长期工作温度大于200度,绝缘涂层的击穿电压大于1500VAC,电阻涂层的发热功率大于20W/cm2的功能,同时由于是铝基加热器,因此基体具有热容低、导热优良、热转化效率优于钢板加热器、更优于传统的电阻丝加热器和陶瓷加热器的功能。
附图说明
图1为本发明高温复合材料铝基加热器的结构示意图;
图2为本发明图1的剖视图;
图3为本发明高温复合材料铝基加热器另一实施例的结构示意图;
图4为本发明图3的剖视图;
图中:1、高温复合材料铝基加热器;101、铝合金基板;102、内绝缘涂层;103、电阻涂层;104、导体涂层;105、外绝缘涂层。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
请参阅图1-4,本发明提供以下技术方案:一种高温复合材料铝基加热器,包括高温复合材料铝基加热器1,高温复合材料铝基加热器1包括铝合金基板101,铝合金基板101上印刷有内绝缘涂层102,内绝缘涂层102远离铝合金基板101的壁面印刷有电阻涂层103,电阻涂层103远离内绝缘涂层102的壁面印刷有导体涂层104,电阻涂层103远离内绝缘涂层102的壁面以及导体涂层104远离电阻涂层103的壁面均印刷有外绝缘涂层105。
一种高温复合材料铝基加热器的制作工艺,包括以下步骤:
S1:在高分子树脂体系溶液内分别加入50%的高分子材料以及10%的无机类和有机类添加剂,制得内绝缘涂层102以及外绝缘涂层105的浆料;
S2:在高分子树脂体系溶液内分别加入50%的导电材料以及10%的无机类和有机类的添加剂,制得电阻涂层103的浆料;
S3:在高分子树脂体系溶液内分别加入50%的导电材料以及10%的无机类和有机类的添加剂,制得导体涂层104的浆料;
S4:分别将内绝缘涂层102的浆料、电阻涂层103的浆料、导体涂层104的浆料以及外绝缘涂层105的浆料按照顺序丝网印刷在铝合金基板101上;
S5:铝合金基板101经过高温烘烤,最终制得高温复合材料铝基加热器1。
具体的,步骤S1、S2和S3内,高分子树脂体系可以是环氧树脂体系。
具体的,步骤S1内,高分子材料可以是聚酰亚胺粉末。
具体的,步骤S2内,导电材料可以是石墨粉材料。
具体的,步骤S3内,导电材料可以是银粉材料。
具体的,步骤S4内,浆料还可以通过喷涂工艺进行涂覆。
实施例2
请参阅图1-4,本发明提供以下技术方案:一种高温复合材料铝基加热器,包括高温复合材料铝基加热器1,高温复合材料铝基加热器1包括铝合金基板101,铝合金基板101上印刷有内绝缘涂层102,内绝缘涂层102远离铝合金基板101的壁面印刷有电阻涂层103,电阻涂层103远离内绝缘涂层102的壁面印刷有导体涂层104,电阻涂层103远离内绝缘涂层102的壁面以及导体涂层104远离电阻涂层103的壁面均印刷有外绝缘涂层105。
一种高温复合材料铝基加热器的制作工艺,包括以下步骤:
S1:在高分子树脂体系溶液内分别加入50%的无机材料以及10%的无机类和有机类添加剂,制得内绝缘涂层102以及外绝缘涂层105的浆料;
S2:在高分子树脂体系溶液内分别加入50%的导电材料以及10%的无机类和有机类的添加剂,制得电阻涂层103的浆料;
S3:在高分子树脂体系溶液内分别加入50%的导电材料以及10%的无机类和有机类的添加剂,制得导体涂层104的浆料;
S4:分别将内绝缘涂层102的浆料、电阻涂层103的浆料、导体涂层104的浆料以及外绝缘涂层105的浆料按照顺序丝网印刷在铝合金基板101上;
S5:铝合金基板101经过高温烘烤,最终制得高温复合材料铝基加热器1。
具体的,步骤S1、S2和S3内,高分子树脂体系可以是聚酰胺酸树脂体系。
具体的,步骤S1内,无机材料可以是氧化锆粉末材料。
具体的,步骤S2内,导电材料可以是碳纳米管材料。
具体的,步骤S3内,导电材料可以是金粉材料。
具体的,步骤S4内,浆料还可以通过点胶工艺进行涂覆。
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。
Claims (8)
1.一种高温复合材料铝基加热器,包括高温复合材料铝基加热器(1),其特征在于:所述高温复合材料铝基加热器(1)包括铝合金基板(101),所述铝合金基板(101)上印刷有内绝缘涂层(102),所述内绝缘涂层(102)远离铝合金基板(101)的壁面印刷有电阻涂层(103),所述电阻涂层(103)远离内绝缘涂层(102)的壁面印刷有导体涂层(104),所述电阻涂层(103)远离内绝缘涂层(102)的壁面以及导体涂层(104)远离电阻涂层(103)的壁面均印刷有外绝缘涂层(105)。
2.一种高温复合材料铝基加热器的制作工艺,其特征在于,包括以下步骤:
S1:在高分子树脂体系溶液内分别加入1%-90%的高分子材料或者无机材料以及1%-10%的无机类和有机类添加剂,制得内绝缘涂层(102)以及外绝缘涂层(105)的浆料;
S2:在高分子树脂体系溶液内分别加入1-90%的导电材料以及1-10%的无机类和有机类的添加剂,制得电阻涂层(103)的浆料;
S3:在高分子树脂体系溶液内分别加入1-90%的导电材料以及1-10%的无机类和有机类的添加剂,制得导体涂层(104)的浆料;
S4:分别将内绝缘涂层(102)的浆料、电阻涂层(103)的浆料、导体涂层(104)的浆料以及外绝缘涂层(105)的浆料按照顺序丝网印刷在铝合金基板(101)上;
S5:铝合金基板(101)经过高温烘烤,最终制得高温复合材料铝基加热器(1)。
3.根据权利要求2所述的一种高温复合材料铝基加热器的制作工艺,其特征在于:所述步骤S1、S2和S3内,高分子树脂体系可以是环氧树脂、酚醛树脂、有机硅树脂、聚酰胺酸树脂或丙烯酸树脂任一种体系。
4.根据权利要求2所述的一种高温复合材料铝基加热器的制作工艺,其特征在于:所述步骤S1内,高分子材料可以是聚酰亚胺粉末或聚四氟乙烯粉末任一种材料。
5.根据权利要求2所述的一种高温复合材料铝基加热器的制作工艺,其特征在于:所述步骤S1内,无机材料可以是玻璃粉体、氧化锆粉末、氮化铝粉末或氧化铝粉末任一种材料。
6.根据权利要求2所述的一种高温复合材料铝基加热器的制作工艺,其特征在于:所述步骤S2内,导电材料可以是石墨粉、碳粉、碳纳米管、石墨烯、银粉、铜粉、金粉、钯粉、银钯合金粉、银镍合金粉、镍铬合金粉或镍铜合金粉任一种材料。
7.根据权利要求2所述的一种高温复合材料铝基加热器的制作工艺,其特征在于:所述步骤S3内,导电材料可以是银粉、铜粉、金粉或钯粉任一种材料。
8.根据权利要求2所述的一种高温复合材料铝基加热器的制作工艺,其特征在于:所述步骤S4内,浆料还可以通过喷涂工艺或点胶工艺进行涂覆。
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