CN113220157B - Touch panel, preparation method and display device - Google Patents
Touch panel, preparation method and display device Download PDFInfo
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- CN113220157B CN113220157B CN202110482782.7A CN202110482782A CN113220157B CN 113220157 B CN113220157 B CN 113220157B CN 202110482782 A CN202110482782 A CN 202110482782A CN 113220157 B CN113220157 B CN 113220157B
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 39
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- 238000004544 sputter deposition Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- HKBLLJHFVVWMTK-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti].[Ti] HKBLLJHFVVWMTK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention discloses a touch panel, a preparation method and a display device, wherein the preparation method of the touch panel comprises the following steps: forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structure layer and the second structure layer are formed with a first channel opening, a middle channel and a second channel opening which are communicated in sequence; the first structural layer is formed with an intermediate channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-shaped structure is formed between the first channel opening and the second channel opening; and depositing a conductive layer on the second structural layer to form a first electrode and a second electrode which are mutually insulated on the conductive layer, and enabling the conductive layer positioned on one side of the bridge-shaped structure, which is far away from the substrate, to form a first connecting part, wherein adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer permeated in the middle channel. The technical scheme provided by the invention can realize the touch panel with simple process and high production efficiency.
Description
Technical Field
The invention relates to the technical field of display, in particular to a touch panel, a manufacturing method and a display device.
Background
In recent years, touch technology is increasingly applied to display devices with various sizes, and a touch display panel is used as a display panel of a novel man-machine interaction input mode, so that compared with the traditional modes of display, keyboard and mouse input, the touch screen input is simpler, more direct and more convenient.
In order to realize the touch function of the display device, touch electrodes are usually required to be introduced into the display device, different touch electrodes are mutually insulated, and adjacent touch electrodes are required to be connected by setting a bridge, so that the touch device is limited by a process, and the touch device can be realized only by carrying out metal deposition, photoetching and etching for many times in the actual preparation process, and has the advantages of long production period, complex process flow and low production efficiency.
Therefore, a new touch panel manufacturing method, a touch panel and a display device are needed.
Disclosure of Invention
The embodiment of the invention provides a touch panel, a preparation method and a display device, which are used for realizing the touch panel with simple process and high production efficiency.
In a first aspect, an embodiment of the present invention provides a method for manufacturing a touch panel, including:
providing a substrate;
forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structure layer and the second structure layer form an underground passage structure; the underground passage structure comprises a first passage opening, a middle passage and a second passage opening which are communicated in sequence; the first structural layer is formed with an intermediate channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-shaped structure is formed between the first channel opening and the second channel opening;
depositing a conductive layer on the second structural layer; the conductive layer penetrating into the intermediate channel through the first and second channel openings;
patterning the conductive layer to form a first electrode and a second electrode which are insulated from each other, and enabling the conductive layer positioned on one side of the bridge-shaped structure, which is far away from the substrate, to form a first connecting part, wherein adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer in the middle channel.
In a second aspect, an embodiment of the present invention further provides a touch panel, where the touch panel is a touch panel manufactured by using the touch panel manufacturing method provided by any embodiment of the present invention.
In a third aspect, an embodiment of the present invention further provides a display apparatus, including: the touch panel is provided by any embodiment of the invention.
According to the preparation method of the touch panel, the first structure layer and the second structure layer which are sequentially far away from the substrate are arranged on the substrate, the first structure layer and the second structure layer form an underground passage structure, the first structure layer forms an intermediate passage in the underground passage structure, the second structure layer forms a first passage opening and a second passage opening in the underground passage structure, a bridge structure between the first passage opening and the second passage opening is formed, the first passage opening, the intermediate passage and the second passage opening are communicated, the bridge structure is formed on the intermediate passage, and then when the conductive layer is deposited on the second structure layer to form the insulated first electrode and the second electrode, the conductive layer can be deposited on the bridge structure and in the intermediate passage at the same time, insulation of the upper conductive layer and the lower conductive layer of the passage is realized, a first connecting part can be formed on the bridge structure, a second connecting part is formed in the intermediate passage, the adjacent first electrode is connected through the first connecting part, and the adjacent second electrode is connected through the second connecting part. In the preparation process of the touch panel, only one conductive layer deposition and patterning process is needed, so that a cross-longitudinal mutual capacitance touch electrode structure can be formed, the times of conductive layer deposition forming and patterning processing needed by the mutual capacitance touch electrode structure are reduced, the structure is simple, the process is simplified, the material consumption is saved, and the production efficiency of the touch panel is effectively improved.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a touch panel according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a first structural layer and a second structural layer formed on a substrate according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of FIG. 2 along line a-a';
FIG. 4 is a schematic view of the first structural layer of FIG. 2;
FIG. 5 is a schematic cross-sectional view of a conductive layer deposited on a second structural layer according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a touch panel according to an embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of the touch panel of FIG. 6 along line b-b';
fig. 8 is a schematic structural diagram of another touch panel according to an embodiment of the present invention;
FIG. 9 is a schematic cross-sectional view of the touch panel of FIG. 8 along the line c-c';
fig. 10 is a schematic structural diagram of another touch panel according to an embodiment of the present invention;
fig. 11 is a schematic flow chart of another method for manufacturing a touch panel according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of a structure for forming a first layer of a first photoresist on a substrate according to an embodiment of the present invention;
FIG. 13 is a schematic diagram of a structure for forming a second layer of a first photoresist on a substrate according to an embodiment of the present invention;
FIG. 14 is a schematic diagram of a structure of forming a second photoresist on a conductive layer according to an embodiment of the present invention;
FIG. 15 is a schematic diagram of a structure of patterning a conductive layer according to an embodiment of the present invention;
FIG. 16 is a schematic diagram of a structure for forming a planarization layer on a second photoresist according to an embodiment of the present invention;
FIG. 17 is a schematic view of another cross-sectional structure of the touch panel of FIG. 6 along line b-b';
fig. 18 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
An embodiment of the present invention provides a method for manufacturing a touch panel, and fig. 1 is a schematic flow chart of the method for manufacturing a touch panel provided by the embodiment of the present invention, as shown in fig. 1, the method for manufacturing a touch panel of the present invention includes the following steps:
s101, providing a substrate.
S102, forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structure layer and the second structure layer are formed with an underground passage structure; the underground passage structure comprises a first passage opening, a middle passage and a second passage opening which are communicated in sequence; the first structural layer is formed with an intermediate channel; the second structural layer forms a first channel opening and a second channel opening, and a bridge structure is formed between the first channel opening and the second channel opening.
Fig. 2 is a schematic structural view of forming a first structural layer and a second structural layer on a substrate according to an embodiment of the present invention, fig. 3 is a schematic sectional structural view of fig. 2 along a line a-a', and referring to fig. 2 and 3, a substrate 11 is first provided, and a subterranean channel structure 14 is formed on the substrate 11 through the first structural layer 12 and the second structural layer 13. The underground passageway 14 includes a first passageway opening 131, an intermediate passageway 121, and a second passageway opening 132 that communicate in sequence. As shown in fig. 4, fig. 4 is a schematic structural diagram of the first structural layer in fig. 2, in this embodiment, the middle channel 121 is disposed on the first structural layer 12, as shown in fig. 2, the first channel opening 131 and the second channel opening 132 are disposed on the second structural layer 13, and then a bridge structure 133 is formed between the first channel opening 131 and the second channel opening 132 of the second structural layer 13, and as shown in fig. 2, in a plane parallel to the substrate 11, the bridge structure 133 is located above the middle channel 121 and spans across both sides of the width direction of the middle channel 121.
S103, depositing a conductive layer on the second structural layer; the conductive layer penetrates into the intermediate channel through the first channel opening and the second channel opening.
Depositing a conductive layer on the first structural layer 12 and the second structural layer 13 shown in fig. 2 and 3, as shown in fig. 5, fig. 5 is a schematic cross-sectional structure of depositing a conductive layer on the second structural layer according to an embodiment of the present invention. The conductive layer 15 is prepared on the substrate 11, the first structural layer 12 and the second structural layer 13 in a full area, and the conductive layer 15 may be metal such as aluminum, titanium aluminum titanium, or conductive oxide such as Indium Tin Oxide (ITO), so long as the conductive performance meets the touch requirement. In this embodiment, the conductive layer 15 may be formed by sputtering, and for the underground passage structure 14 formed by the first structure layer 12 and the second structure layer 13, sputtered atoms of the conductive target material forming the conductive layer 15 may be deposited on the upper surface of the bridge structure 133 and the lower side of the underground passage structure 14. The principle of depositing the conductive layer 15 in the subterranean channel structure 14 is the shadow effect and there are various ways in which sputtered atoms reach the subterranean channel structure 14. For example, the first: collisions between sputtered atoms or magnetic field induced ion collisions result in some sputtered atoms obliquely incident to the intermediate channel 121 under the bridge structure 133 and depositing; second kind: the sputtered atoms impinging on the sidewalls 13a of the first channel opening 131 or the second channel opening 132 and the sidewalls 12a of the intermediate channel 121 may rebound into the intermediate channel 121 below the bridge structure 133.
And S104, conducting layer patterning treatment is conducted on the conducting layer to form a first electrode and a second electrode which are insulated from each other, the conducting layer on one side of the bridge-shaped structure, which is far away from the substrate, forms a first connecting part, the adjacent first electrodes are electrically connected through the first connecting part, and the adjacent second electrodes are electrically connected through a second connecting part formed by the conducting layer in the middle channel.
Fig. 6 is a schematic structural diagram of a touch panel according to an embodiment of the present invention, and fig. 7 is a schematic sectional structural diagram of the touch panel along a line b-b' in fig. 6. The conductive layer 15 is patterned to form a first electrode 151 and a second electrode 152 which are insulated from each other, one of the first electrode 151 and the second electrode 152 is a touch driving electrode, the other is a touch sensing electrode, and the two electrodes are matched to realize mutual capacitance touch of the touch panel, so as to determine a touch position.
The conductive layer on the side of the bridge structure 133 facing away from the substrate 11 may be etched to form a first connection portion 153, the conductive layer penetrating into the middle channel 121 forms a second connection portion 154, adjacent first electrodes 151 may be connected through the first connection portion 153 on the bridge structure 133, and adjacent second electrodes 152 may be connected through the second connection portion 154 in the middle channel 121. The first connection portion 153 and the second connection portion 154 are respectively disposed on two opposite sides of the bridge structure 133, and are electrically insulated from each other so as not to interfere with each other, thereby effectively avoiding the problems of short circuit or signal interference between the first electrode 151 and the second electrode 152. In this embodiment, the first electrode 151, the second electrode 152, the first connection portion 153 and the second connection portion 154 are formed by performing deposition molding and patterning on the first conductive layer 15, namely, a touch panel using a mutual capacitance touch electrode is formed, while the touch panel using a mutual capacitance touch electrode in the prior art needs to perform deposition and patterning on the second conductive layer, wherein the deposition and patterning on the first conductive layer is used for forming the touch electrode, and the deposition and patterning on the second conductive layer is used for forming the cross-line layer connecting the touch electrodes.
Optionally, the extending direction of the second connection portion 154 intersects with the extending direction of the bridge structure 133, and specifically, the extending direction of the second connection portion 154 is perpendicular to the extending direction of the bridge structure 133, so as to be connected to the adjacent second electrode 152, so as to avoid interference with the first electrode 151.
According to the preparation method of the touch panel, the first structure layer and the second structure layer which are sequentially far away from the substrate are arranged on the substrate, the first structure layer and the second structure layer form an underground passage structure, the first structure layer forms an intermediate passage in the underground passage structure, the second structure layer forms a first passage opening and a second passage opening in the underground passage structure, a bridge structure between the first passage opening and the second passage opening is formed, the first passage opening, the intermediate passage and the second passage opening are communicated, the bridge structure is formed on the intermediate passage, and then when the conductive layer is deposited on the second structure layer to form the insulated first electrode and the second electrode, the conductive layer can be deposited on the bridge structure and in the intermediate passage at the same time, insulation of the upper conductive layer and the lower conductive layer of the passage is realized, a first connecting part can be formed on the bridge structure, a second connecting part is formed in the intermediate passage, the adjacent first electrode is connected through the first connecting part, and the adjacent second electrode is connected through the second connecting part. In the preparation process of the touch panel, only one conductive layer deposition and patterning process is needed, so that a cross-longitudinal mutual capacitance touch electrode structure can be formed, the times of conductive layer deposition forming and patterning processing needed by the mutual capacitance touch electrode structure are reduced, the structure is simple, the process is simplified, the material consumption is saved, and the production efficiency of the touch panel is effectively improved.
The foregoing is the core idea of the present invention, and the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without making any inventive effort are intended to fall within the scope of the present invention.
Fig. 8 is a schematic structural diagram of another touch panel according to an embodiment of the present invention, and fig. 9 is a schematic sectional structural diagram of the touch panel along a line c-c' in fig. 8. Alternatively, in the extending direction X of the intermediate passage 121, a plurality of bridge structures 133 may be sequentially disposed; the second structural layer 13 is formed with a third channel opening 134 between two adjacent bridge structures 133; the third passage opening 134 communicates with the intermediate passage 121 so that the conductive layer 15 penetrates into the intermediate passage 121 through the third passage opening 134.
In this embodiment, the intermediate channels 121 are disposed along the extending direction X, and when the second structural layer 13 is formed, a plurality of bridge structures 133 may be sequentially formed between the first channel openings 131 and the second channel openings 132 along the extending direction X of the intermediate channels 121, and the extending direction Y of the bridge structures 133 intersects with the extending direction X of the intermediate channels 121, and the bridge structures 133 cross the intermediate channels 121 along the extending direction Y. Meanwhile, a third channel opening 134 is formed between two adjacent bridge structures 133, as shown in fig. 8, in a plane parallel to the substrate 11, the deposition area of the conductive material is increased by the arrangement of the third channel opening 134 in the middle channel 121, so that the conductive layer 15 can conveniently permeate into the middle channel 121 through the third channel opening 134, the problem that the conductive layer deposited in the middle channel 121 is thinner or even broken is effectively avoided, the conductivity of the finally formed second connection part 154 is good, the connection yield of the second electrode 152 is improved, the breaking of the second electrode 152 is effectively avoided, the touch performance of the touch panel is improved, and the quality of the touch panel is improved.
With continued reference to fig. 8 and 9, optionally, the conductive layer 15 on the side of each bridge structure 133 facing away from the substrate 11 may form a first connection 153; the adjacent first electrodes 151 are electrically connected by a plurality of first connection portions 153.
In the process of patterning the conductive layer 15, the conductive layer 15 on one side of each bridge structure 133 far from the substrate 11 may be etched to form the first connection portion 153, and then a plurality of first connection portions 153 are disposed across the middle channel 121, and adjacent first electrodes 151 may be electrically connected through the plurality of first connection portions 153, which is equivalent to increasing the disposition width of the first connection portions 153 between the adjacent first electrodes 151, reducing the resistance of the first connection portions 153, and increasing the connection yield of the adjacent first electrodes 151. In addition, when one first connection portion 153 is broken in the plurality of first connection portions 153 connected to the adjacent first electrodes 151, the adjacent first electrodes 151 may be further communicated through other first connection portions 153, so as to complete transmission of touch signals, effectively enhance reliability of the touch panel, and improve production yield of the touch panel.
It should be noted that the first connection portions 153 on each bridge structure 133 may be used to connect adjacent first electrodes 151, as shown in fig. 8, when two bridge structures 133 are provided, the first connection portions 153 on the two bridge structures 133 may be used as connection lines between the adjacent first electrodes 151, and of course, a plurality of first connection portions 153 in all the first connection portions 153 on the intermediate channel 121 may be selected to achieve electrical connection between the adjacent first electrodes 151. As shown in fig. 10, fig. 10 is a schematic structural diagram of another touch panel according to the embodiment of the present invention, when three bridge structures 133 are provided, a first connection portion 153 is formed on each bridge structure 133, two first connection portions 153 may be selected to connect adjacent first electrodes 151, the remaining first connection portions 153 may be suspended, and the number of the adjacent first electrodes 151 connected to the first connection portions 153 is not limited in particular in this embodiment.
In this embodiment, the first structural layer 12 and the second structural layer 13 provided with the plurality of underground passage structures 14 may be formed by various methods, and in some alternative embodiments, as shown in fig. 11, fig. 11 is a schematic flow chart of another method for manufacturing a touch panel according to an embodiment of the present invention, where the method for manufacturing a touch panel may include the following steps:
s201, providing a substrate.
Optionally, before forming the first structural layer and the second structural layer sequentially away from the substrate on the substrate, the method may further include: forming a buffer layer on a substrate; the material of the buffer layer is an organic material. In the prior art, the buffer layer is generally made of inorganic materials, and the buffer layer formed by organic materials is formed on the substrate in the embodiment, so that the buffer layer is not easy to break when being applied to flexible products, and the reliability is higher.
S202, coating a first layer of first photoresist on the substrate, and exposing the middle channel region.
In this embodiment, the underground passage structure is formed by two exposures and one development, the materials of the first structural layer and the second structural layer may be photoresist, specifically, as shown in fig. 12, fig. 12 is a schematic structural diagram of forming a first layer of first photoresist on a substrate, and the substrate 11 may be coated with the first layer of first photoresist 122 and the middle passage region 121a is exposed.
S203, coating a second layer of first photoresist on the substrate, and exposing the first channel opening area and the second channel opening area.
After the first photoresist 122 is exposed, as shown in fig. 13, fig. 13 is a schematic structural diagram of forming a second layer of first photoresist on a substrate according to an embodiment of the present invention, forming a second layer of first photoresist 135 on a side of the first layer of first photoresist 122 facing away from the substrate 11, and exposing the second layer of first photoresist 135 to expose a first channel opening area 131a and a second channel opening area 132a.
S204, developing the two layers of first photoresist simultaneously; the middle channel region forms a middle channel, and the first photoresist layer forms a first structural layer; the second channel opening region forms a second channel opening, the first channel opening region forms a first channel opening, and the second layer of the first photoresist forms a second structural layer.
Developing the first layer of first photoresist 122 and the second layer of first photoresist 135 simultaneously removes photoresist material from the middle channel region 121a of the first layer of first photoresist 122 to form the middle channel 121, removes photoresist material from the first channel opening region 131a of the second layer of first photoresist 135 to form the first channel opening region 131, and similarly, the second channel opening region 132a forms the second channel opening 132, and the first channel opening region 131, the middle channel 121 and the second channel opening 132 are sequentially connected to form the underground channel structure 14 shown in fig. 3. Referring to fig. 3, the developed first layer of first photoresist 122 forms the first structural layer 12, and the developed second layer of first photoresist 135 forms the second structural layer 13. In this embodiment, the photoresist is directly used to form the upper and lower isolation channels bounded by the bridge structure 133, and the residual photoresist is used as the film layer of the touch panel, so that the photoresist is not required to be removed, and the manufacturing material of the touch panel is saved, and meanwhile, the manufacturing process of the touch panel is greatly saved.
The steps S202 to S204 are "step S102: one implementation of a first structural layer and a second structural layer that are sequentially remote from a substrate are formed on the substrate. The above-mentioned manner of forming the first structural layer and the second structural layer by two layers of the first photoresist is a preferred manner of realizing the underground passage structure, and in another example of this embodiment, with continued reference to fig. 3, the present implementation may further form the first structural layer 12 and the second structural layer 13 by other organic or inorganic materials, form the first passage opening 131 and the second passage opening 132 in the second structural layer 13 by dry etching, and then wet etch the first structural layer 12 through the first passage opening 131 and the second passage opening 132 to form the intermediate passage 121. In addition, the first structural layer 12 and the second structural layer 13 may be formed by other dry etching or wet etching processes, and the specific forming process of the underground passage structure is not particularly limited in this embodiment.
S205, depositing a conductive layer on the second structural layer; the conductive layer penetrates into the intermediate channel through the first channel opening and the second channel opening.
S206, coating a patterned second photoresist on the side, away from the substrate, of the conductive layer.
And S207, etching the conductive layer which is not covered by the second photoresist to form a first electrode, a second electrode, a first connection part and a second connection part.
The steps S206 to S207 are "step S104: one implementation of patterning the conductive layer. As shown in fig. 14, fig. 14 is a schematic diagram of a structure for forming a second photoresist on a conductive layer according to an embodiment of the present invention, a whole layer of the second photoresist 16 is coated on a side of the conductive layer 15 away from the substrate 11, a portion 161 to be patterned is exposed, the portion 161 to be patterned is removed after development, the conductive layer 15 is etched according to the patterned second photoresist 16 to form the structure shown in fig. 15, fig. 15 is a schematic diagram of a structure for patterning a conductive layer according to an embodiment of the present invention, and a first connection portion 153, a first electrode 151, a second electrode 152 and a second connection portion 154 shown in fig. 6 are formed.
It is understood that photoresist, also known as photoresist, refers to a resist that etches a thin film material by irradiation or radiation of ultraviolet light, electron beam, ion beam, X-ray, etc., whose solubility is changed. The photosensitive liquid consists of photosensitive resin, sensitizer and solvent. Used as a corrosion resistant coating material during a photolithography process. In this embodiment, the second photoresist 16 can protect the conductive layer 15 from being etched, so that the pattern shape of the second photoresist 16 coated on the conductive layer 15 corresponds to the shapes of the first electrode 151, the second electrode 152 and the first connection portion 153, after etching the conductive layer 15 not covered by the second photoresist 16, the remaining second photoresist 16 can be stripped off to reduce the thickness of the touch panel, and the remaining second photoresist 16 can also be retained to protect the first electrode 151, the second electrode 152 and the first connection portion 153.
As shown in fig. 14 and 15, optionally, etching the conductive layer 15 not covered by the second photoresist 16 may include: the conductive layer 16 deposited on the sidewalls of the bridge structure 133 is etched. After exposing and developing the second photoresist 16 on the side wall of the bridge structure 133, exposing the conductive layer 16 deposited on the side wall of the bridge structure 133, etching the conductive layer 16 on the side wall of the bridge structure 133 to form a first connection portion 153 shown in fig. 15, where the embodiment etches the conductive layer 16 deposited on the side wall of the bridge structure 133, so as to be beneficial to further increasing the space between the first connection portion 153 and the second connection portion 154, avoiding adhesion between the first connection portion 153 and the second connection portion 154, effectively avoiding interference of touch signals between the first connection portion 153 and the second connection portion 154, and improving touch performance of the touch panel.
Optionally, when the second photoresist 16 is formed, the coating direction of the second photoresist 16 is parallel to the extending direction of the bridge structure 133, so that the second photoresist 16 can flow into the underground passage structure 14 conveniently, the second photoresist 16 can enter the underground passage structure 14 conveniently, and particularly, the gap region between the bridge structure 133 and the conductive layer 15 can be entered, so that the situation that the second photoresist 16 breaks a film in the coating process is prevented, the accurate etching of the subsequent conductive layer can be realized conveniently, and the quality of the touch panel is improved.
And S208, forming a planarization layer on the side of the second photoresist away from the substrate.
Fig. 16 is a schematic structural diagram of forming a planarization layer on a second photoresist according to an embodiment of the present invention, and optionally, after patterning the conductive layer 15, the method may further include: a planarization layer 17 is formed on the side of the second photoresist 16 remote from the substrate 11. In this embodiment, the second photoresist 16 is used as a part of the touch panel, so that not only can the consumable cost of the touch panel be effectively saved and the patterned conductive layer 15 is protected, but also a process for removing the second photoresist 16 can be saved, and the manufacturing process of the touch panel can be accelerated. Alternatively, the material of the second photoresist 16 in this embodiment may be the same as or different from that of the first photoresist, which is not particularly limited in this embodiment.
According to the preparation method of the touch panel, the double-layer first photoresist is adopted to form the underground channel structure, the upper layer isolation channel and the lower layer isolation channel can be formed only through a double-exposure one-time developing process, the manufacturing process is simplified, and the first photoresist is used as a film structure of the touch panel, so that the consumable cost of the touch panel is effectively saved. In addition, the second photoresist used for patterning the conductive layer can also be used as a film layer structure of the touch panel, so that the consumable of the touch panel is further saved.
The foregoing embodiment shows a manufacturing scheme of reserving the remaining second photoresist to save consumables and manufacturing process, in another specific example of this embodiment, the second photoresist may also be removed, specifically referring to fig. 14, 15 and 7, and the patterning process is performed on the conductive layer 15, which may further include: as shown in fig. 14, a patterned second photoresist 16 is coated on the side of the conductive layer 15 remote from the substrate 11; as shown in fig. 15, the conductive layer 15 not covered with the second photoresist 16 is etched to form a first electrode, a second electrode, a first connection portion 153, and a second connection portion; the second photoresist 16 is stripped by the stripping solution to form the structure shown in fig. 7, so as to reduce the overall thickness of the touch panel. Thereafter, a planarization layer or the like may be formed on a side of the conductive layer 15 away from the substrate 11, thereby forming a touch panel. It should be noted that, when the patterned conductive layer 15 exposes a partial area of the second layer of the first photoresist 135, it is required to ensure that the second layer of the first photoresist 135 is not removed when the second photoresist 16 is removed, and this embodiment may define that the first photoresist is a negative photoresist and the second photoresist 16 is a positive photoresist, and the stripping solution for stripping the second photoresist 16 cannot strip the first photoresist, so as to protect the second layer of the first photoresist 135, prevent the second layer of the first photoresist 135 from being damaged, and further protect the underground channel structure 14.
With continued reference to fig. 7, optionally, the extension direction X of the intermediate channel is set to be the first direction; in the first direction X, a boundary L1 of a side of the first passage opening 131 away from the second passage opening 132 is marked, and a distance between the boundary L2 of the side of the second passage opening 132 away from the first passage opening 131 is a first distance d1; the distance between the boundaries (boundary L3 and boundary L4) of the mark intermediate passage 121 in the first direction X is the second pitch d2; the first spacing d1 is greater than the second spacing d2.
The boundary L1 of the first channel opening 131 in this embodiment refers to a position on the sidewall 13a of the first channel opening 131 farthest from the second channel opening 132, and similarly, the boundary L2 of the second channel opening 132 refers to a position on the sidewall 13a of the second channel opening 132 farthest from the first channel opening 131, where the distance between the boundary L1 of the first channel opening 131 and the boundary L2 of the second channel opening 132 is the first interval d1, and the first interval d1 is the total width spanned between the first channel opening 131 and the second channel opening 132. The second distance d2 between the boundary L3 and the boundary L4 of the intermediate channel 121 is the maximum distance between the side walls 12a of the intermediate channel 121 in the first direction X, and the second distance d2 is the total width spanned by the intermediate channel 121. In this embodiment, the total width spanned between the first channel opening 131 and the second channel opening 132 is greater than the total width spanned by the middle channel 121, so that sputtered atoms can enter the middle channel 121 through the first channel opening 131 and the second channel opening 132, breakage of the conductive layer 15 deposited on the middle channel 121 is prevented, deposition of the conductive layer 15 on the side wall 13a of the channel opening and the side wall 12a of the middle channel 121 along the gradient between the channel opening and the middle channel 121 is also facilitated, the problem of discontinuous film formation of the conductive layer 15 in the deposition process is avoided, and touch performance and touch panel manufacturing yield are improved.
With continued reference to fig. 4 and 7, the intermediate channel 121 may optionally include a bottom surface 12b parallel to the substrate 11 and side walls 12a disposed about the bottom surface 12 b; the cross-sectional state of the intermediate passage 121 is an inverted trapezoid or an inverted trapezoid-like shape in a direction perpendicular to the plane in which the substrate 11 is located; in the first plane P1 perpendicular to the substrate 11 and parallel to the extending direction X of the intermediate channel 121, the angle θ between the bottom surface 12b and the side wall 12a of the intermediate channel 121 ranges from 110 ° to 180 °.
The middle channel 121 may include a bottom surface 12b parallel to the substrate 11 and a sidewall 12a disposed around the bottom surface 12b, and in a plane perpendicular to the substrate 11, the middle channel 121 may have an inverted trapezoid or an inverted trapezoid-like cross-sectional state, and as illustrated in fig. 7, fig. 7 illustrates a cross-sectional structure of the touch panel in a plane perpendicular to the substrate 11, it is known that the middle channel 121 may have an inverted trapezoid T or an inverted trapezoid-like cross-sectional state in the plane. In addition, fig. 7 is a sectional view of fig. 6 along a line segment a-a ', where the extending direction of the line segment a-a' is parallel to the extending direction X of the middle channel 121, and fig. 7 is a sectional structure of the touch panel in the first plane P1, where the included angle θ between the bottom 12b and the side wall 12a of the middle channel 121 may be 110 ° to 180 °, and a larger gradient angle is provided between the bottom 12b and the side wall 12a, so that sputtered atoms can enter the middle channel 121 through the first channel opening 131 and the second channel opening 132, and the problem of discontinuous film formation of the conductive layer 15 between the bottom 12b and the side wall 12a is effectively prevented, thereby improving the manufacturing yield of the touch panel. Optionally, the range of the included angle between the side walls 13a of the first channel opening 131 and the second channel opening 132 and the substrate 11 is consistent with θ, so that the gradient of the side wall 13a of the channel opening is consistent with that of the side wall 12a of the middle channel 121, and further continuous film formation of the conductive layer is ensured.
Fig. 17 is a schematic cross-sectional view of the touch panel of fig. 6 along line b-b'. Alternatively, the distance d3 between the surface 133a of the bridge structure 133 on the side close to the substrate 11 and the bottom surface 12b of the intermediate channel 121 on the side close to the substrate 11 may be in the range of 3 μm to 15 μm. In this embodiment, the distance d3 between the surface 133a of the bridge structure 133 adjacent to the substrate 11 and the bottom 12b of the intermediate channel 121 adjacent to the substrate 11 is in the range of 3 μm to 15 μm, that is, the height of the intermediate channel 121 is in the range of 3 μm to 15 μm in the direction perpendicular to the plane of the substrate 11. It should be noted that, the height of the middle channel 121 should not be too large, which affects the structural strength of the bridge structure 133, and the bridge structure 133 is easy to be damaged when being stressed, and the height of the middle channel 121 should not be too small, which may cause the conductive layer 15 in the middle channel 121 to be unable to completely permeate into the middle channel 121 in the subsequent process, resulting in the conductive layer 15 in the middle channel 121 being broken, and the second connection portion 154 being unable to be formed to connect with the adjacent second electrode 152, and optionally, the distance d3 between the surface 133a of the bridge structure 133 near the substrate 11 and the bottom 12b of the middle channel 121 near the substrate 11 may be equal to 15 μm.
With continued reference to fig. 17, alternatively, the thickness d4 of the first connection portion 153 may be greater than the thickness d5 of the second connection portion 154. Referring to fig. 17, specifically, the conductive layer 15 is generally deposited by sputtering, and the sputtered atoms of the material of the conductive layer 15 may reach the underground tunnel 14 in various manners, for example, by making a part of the sputtered atoms obliquely incident to the underground tunnel 14 and deposited due to collision or magnetic field between the sputtered atoms, or by making the sputtered atoms of the material of the conductive layer 15 strike the side wall 12a of the intermediate tunnel 121 and bounce back into the intermediate tunnel 121. Thus, the thickness d5 of the second connection portion 154 will generally be less than the thickness d4 of the first connection portion 153 formed by normal deposition on the bridge structure 133. Note that, in the present embodiment, the thickness d4 of the first connection portion 153 may be an average thickness of the first connection portion 153, and the thickness d5 of the second connection portion 154 may be an average thickness of the second connection portion 154.
With continued reference to fig. 16, alternatively, the thickness d51 of the second connection 154 near the second electrode 151 may be greater than the thickness d52 of the second connection 154 near the center of the second connection.
It should be noted that, due to the limitation of the molding process, the thickness of each portion of the second connection portion 154 may be inconsistent, and the closer to the center of the middle channel 121, the less the material of the conductive layer 15 can be permeated, and the closer to the second electrode 152, the more the material of the conductive layer 15 can be permeated, and the greater the thickness of the portion. That is, the thickness d51 of the second connection portion 154 near the second electrode 152 is greater than the thickness d52 of the second connection portion 154 at the center thereof, so long as the second connection portion 154 is ensured to be capable of effectively connecting with the adjacent second electrode 152.
Based on the same concept, the embodiment of the invention also provides a touch panel, as shown in fig. 6 to 10, fig. 6 to 10 show schematic structural views of several touch panels, where the touch panel is a touch panel manufactured by adopting the manufacturing method of the touch panel provided by any embodiment of the invention.
According to the touch panel, the first structure layer and the second structure layer which are sequentially far away from the substrate are arranged on the substrate, the first structure layer and the second structure layer form an underground passage structure, the first structure layer forms an intermediate passage in the underground passage structure, the second structure layer forms a first passage opening and a second passage opening in the underground passage structure, a bridge structure between the first passage opening and the second passage opening is formed, the first passage opening, the intermediate passage and the second passage opening are communicated, the bridge structure is formed on the intermediate passage, and then when the conductive layer is deposited on the second structure layer to form the insulated first electrode and the insulated second electrode, the conductive layer can be deposited on the bridge structure and in the intermediate passage at the same time, insulation of the upper conductive layer and the lower conductive layer of the passage is realized, a first connecting part is formed on the bridge structure, a second connecting part is formed in the intermediate passage, adjacent first electrodes are connected through the first connecting part, and adjacent second electrodes are connected through the second connecting part. In the preparation process of the touch panel, only one conductive layer deposition and patterning process is needed, so that a cross-longitudinal mutual capacitance touch electrode structure can be formed, the times of conductive layer deposition forming and patterning processing needed by the mutual capacitance touch electrode structure are reduced, the structure is simple, the process is simplified, the material consumption is saved, and the production efficiency of the touch panel is effectively improved.
The embodiment of the invention also provides a display device, as shown in fig. 18, fig. 18 is a schematic structural diagram of the display device provided by the embodiment of the invention, including: touch panel 1, the touch panel 1 is the touch panel in any of the above embodiments. The display device provided in the embodiment of the present invention has the technical effects of the technical solution of the touch panel in any of the above embodiments, and the explanation of the same or corresponding structures and terms as those of the above embodiments is not repeated herein. The display device provided by the embodiment of the invention can be a mobile phone or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the invention.
Note that the above is only a preferred embodiment of the present invention and the technical principle applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, while the invention has been described in connection with the above embodiments, the invention is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the invention, which is set forth in the following claims.
Claims (16)
1. The preparation method of the touch panel is characterized by comprising the following steps of:
providing a substrate;
forming a first structural layer and a second structural layer which are sequentially far away from the substrate on the substrate; the first structure layer and the second structure layer form an underground passage structure; the underground passage structure comprises a first passage opening, a middle passage and a second passage opening which are communicated in sequence; the first structural layer is formed with an intermediate channel; the second structure layer forms a first channel opening and a second channel opening, and a bridge-shaped structure is formed between the first channel opening and the second channel opening;
depositing a conductive layer on the second structural layer; the conductive layer penetrating into the intermediate channel through the first and second channel openings;
patterning the conductive layer to form a first electrode and a second electrode which are insulated from each other, and enabling the conductive layer positioned on one side of the bridge-shaped structure, which is far away from the substrate, to form a first connecting part, wherein adjacent first electrodes are electrically connected through the first connecting part, and adjacent second electrodes are electrically connected through a second connecting part formed by the conductive layer in the middle channel.
2. The method for manufacturing a touch panel according to claim 1, wherein a plurality of bridge structures are sequentially provided in an extending direction of the intermediate channel;
the second structure layer is provided with a third channel opening between two adjacent bridge-shaped structures; the third channel opening communicates with the intermediate channel such that the conductive layer penetrates the intermediate channel through the third channel opening.
3. The method for manufacturing a touch panel according to claim 2, wherein,
the conductive layer on one side of each bridge structure, which faces away from the substrate, forms a first connection part;
adjacent first electrodes are electrically connected through a plurality of first connection portions.
4. The method of manufacturing a touch panel according to claim 1, wherein forming a first structural layer and a second structural layer sequentially apart from the substrate on the substrate comprises:
coating a first layer of first photoresist on the substrate, and exposing an intermediate channel region;
coating a second layer of first photoresist on the substrate, and exposing a first channel opening area and a second channel opening area;
developing the two layers of the first photoresist at the same time; the middle channel region forms the middle channel, and the first layer of first photoresist forms a first structural layer; the second channel opening region forms a second channel opening, the first channel opening region forms a first channel opening, and the second layer of first photoresist forms a second structural layer.
5. The method for manufacturing a touch panel according to claim 4, wherein patterning the conductive layer further comprises:
coating a patterned second photoresist on one side of the conductive layer away from the substrate;
etching the conductive layer uncovered by the second photoresist to form the first electrode, the second electrode, the first connection portion and the second connection portion;
stripping the second photoresist by a stripping solution; the first photoresist is a negative photoresist and the second photoresist is a positive photoresist.
6. The method of manufacturing a touch panel according to claim 1, wherein the intermediate channel extends in a first direction;
marking the boundary of one side of the first channel opening far from the second channel opening along the first direction, wherein the distance between the boundary of one side of the second channel opening far from the first channel opening is a first interval; marking the distance between the boundaries of the intermediate channels along the first direction as a second pitch;
the first pitch is greater than the second pitch.
7. The method of manufacturing a touch panel according to claim 1, wherein the intermediate channel includes a bottom surface parallel to the substrate and a side wall disposed around the bottom surface; in the direction perpendicular to the plane of the substrate, the cross section state of the middle channel is inverted trapezoid or similar inverted trapezoid;
in a first plane perpendicular to the substrate and parallel to the extending direction of the intermediate channel, the included angle between the bottom surface of the intermediate channel and the side wall ranges from 110 degrees to 180 degrees.
8. The method of manufacturing a touch panel according to claim 1, wherein a distance between a surface of the bridge structure on a side close to the substrate and a bottom surface of the intermediate channel on a side close to the substrate is in a range of 3 μm to 15 μm.
9. The method for manufacturing a touch panel according to claim 1, wherein patterning the conductive layer comprises:
coating a patterned second photoresist on one side of the conductive layer away from the substrate;
etching the conductive layer uncovered by the second photoresist to form the first electrode, the second electrode, the first connection portion and the second connection portion.
10. The method for manufacturing a touch panel according to claim 9, further comprising, after patterning the conductive layer:
and forming a planarization layer on one side of the second photoresist away from the substrate.
11. The method of claim 9, wherein the second photoresist is applied in a direction parallel to the extending direction of the bridge structure.
12. The method of manufacturing a touch panel according to claim 9, wherein etching the conductive layer not covered by the second photoresist comprises:
etching the conductive layer deposited on the side wall of the bridge structure.
13. The method of claim 1, wherein the thickness of the first connection portion is greater than the thickness of the second connection portion.
14. The method of claim 1, wherein the thickness of the second connection portion near the second electrode is greater than the thickness of the second connection portion near the center of the second connection portion.
15. A touch panel, characterized in that the touch panel is a touch panel manufactured by the touch panel manufacturing method according to any one of claims 1 to 14.
16. A display device, comprising: a touch panel, the touch panel being the touch panel of claim 15.
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